TWI859498B - Surface protection film - Google Patents

Abstract

The present invention provides a surface protective film that fully suppresses peeling electrostatic voltage and does not damage the optical component or the electronic component during peeling. The surface protective film is typically a surface protective film including an adhesive layer. In the manufacturing steps of the optical component or the electronic component, the surface is adhered to the exposed surface of the optical component or the electronic component in order to prevent the surface of the optical component or the electronic component from being damaged during processing, assembly, inspection, transportation, etc. The surface protection film of the embodiment of the present invention comprises an adhesive layer, and the adhesive constituting the adhesive layer is formed by an adhesive composition, the adhesive composition comprises a base polymer, an ionic compound and a fluorine compound, and the surface free energy of the adhesive layer surface to diiodomethane is 6 mJ/m ² to 30 mJ/m ² .

Description

Surface protection film

The present invention relates to a surface protective film.

In the manufacturing process of optical components or electronic components, a surface protection film is usually attached to the exposed surface of the optical component or the electronic component to prevent the surface of the optical component or the electronic component from being damaged during processing, assembly, inspection, transportation, etc. When the surface protection is no longer needed, the surface protection film is peeled off from the optical component or the electronic component (Patent Document 1).

Generally, the electrical insulation of the surface protection film and the optical or electronic components is high, and static electricity is generated due to friction or peeling. Therefore, static electricity is easily generated when the surface protection film is peeled off from the optical or electronic components. In this case, for example, there are the following concerns: if a voltage is applied to the liquid crystal in the state of residual static electricity, the orientation of the liquid crystal molecules will be lost, or panel defects will occur. In addition, the presence of static electricity can also become a factor that attracts dust or reduces workability.

In order to prevent static electricity, an antistatic treatment is applied to the surface protective film. For example, it is reported that the surface layer (top coating layer and back surface layer) of the surface protective film is provided with an antistatic function by forming an antistatic layer or applying an antistatic coating (Patent Documents 2 and 3).

Furthermore, in order to impart antistatic properties to the adhesive layer itself constituting the surface protective film, the following method is adopted: an alkaline metal salt or an ionic liquid plasma compound that functions as an antistatic agent is contained in the adhesive layer and transferred to the adherend (Patent Document 4). [Prior Technical Document] [Patent Document]

[Patent Document 1] Japanese Patent Publication No. 2016-17109 [Patent Document 2] Japanese Patent Publication No. 2004-223923 [Patent Document 3] Japanese Patent Publication No. 2008-255332 [Patent Document 4] Japanese Patent Publication No. 9-165460

[The problem the invention is trying to solve]

The subject of the present invention is to provide a surface protective film that fully suppresses the peeling electrostatic voltage and does not damage the optical component or the electronic component during peeling. The surface protective film is typically a surface protective film including an adhesive layer, which is attached to the exposed surface of the optical component or the electronic component in order to prevent the surface of the optical component or the electronic component from being damaged during processing, assembly, inspection, transportation, etc. during the manufacturing process of the optical component or the electronic component. [Technical means to solve the problem]

The surface protection film of the embodiment of the present invention comprises an adhesive layer, and the adhesive constituting the adhesive layer is formed by an adhesive composition, the adhesive composition comprises a base polymer, an ionic compound and a fluorine compound, and the surface free energy of the adhesive layer surface to diiodomethane is 6 mJ/m ² to 30 mJ/m ² .

In one embodiment, the content ratio of the ionic compound is 0.2 parts by weight or more relative to 100 parts by weight of the base polymer.

In one embodiment, the content ratio of the fluorine-based compound relative to 100 parts by weight of the base polymer is 0.05 parts by weight or more.

In one embodiment, the base polymer is at least one selected from polyols, urethane prepolymers, acrylic resins, rubber resins, and silicone resins.

In one embodiment, the adhesive layer contained in the surface protection film is attached to a glass plate and placed at a temperature of 23° C. for 30 minutes. Then, the surface protection film is peeled off from the glass plate at a temperature of 23° C. at a peeling angle of 180 degrees and a peeling speed of 300 mm/minute. At this time, the peeling force is 0.005 N/25 mm to 0.1 N/25 mm.

The optical component of the embodiment of the present invention is laminated with the above-mentioned surface protection film.

The electronic component of the embodiment of the present invention is affixed with the above-mentioned surface protection film. [Effect of the invention]

According to the present invention, a surface protective film can be provided that can fully suppress peeling electrostatic voltage and will not damage the optical component or the electronic component during peeling. The surface protective film is typically a surface protective film including an adhesive layer, which is adhered to the exposed surface of the optical component or the electronic component during the manufacturing steps of the optical component or the electronic component in order to prevent the surface of the optical component or the electronic component from being damaged during processing, assembly, inspection, transportation, etc.

≪≪A. Surface protection film≫≫ The surface protection film of the embodiment of the present invention includes an adhesive layer.

The surface protection film only needs to include an adhesive layer, and may also include any other appropriate components within the scope that does not impair the effect of the present invention. Typically, the surface protection film of the present invention includes a substrate layer and an adhesive layer.

Fig. 1 is a schematic cross-sectional view of a surface protection film according to an embodiment of the present invention. In Fig. 1, the surface protection film 10 comprises a base layer 1 and an adhesive layer 2. In Fig. 1, the base layer 1 and the adhesive layer 2 are directly laminated.

In FIG1 , the surface of the adhesive layer 2 opposite to the substrate layer 1 may be provided with any appropriate release liner (sometimes also referred to as a release sheet or a separator) (not shown) for protection before use. Examples of release liner include a release liner obtained by treating the surface of a substrate (liner substrate) such as paper or plastic film with silicone, and a release liner obtained by laminating the surface of a substrate (liner substrate) such as paper or plastic film with a polyolefin resin.

Examples of the plastic film used as the backing substrate include polyethylene film, polypropylene film, polybutylene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polybutylene terephthalate film, polyurethane film, ethylene-vinyl acetate copolymer film, and the like.

The thickness of the peeling pad is preferably 1 μm to 500 μm, more preferably 3 μm to 450 μm, further preferably 5 μm to 400 μm, and particularly preferably 10 μm to 300 μm.

The thickness of the surface protection film is preferably 5 μm to 500 μm, more preferably 10 μm to 450 μm, further preferably 15 μm to 400 μm, and particularly preferably 20 μm to 300 μm.

The surface free energy of the adhesive layer included in the surface protection film to diiodomethane is 6 mJ/m ² to 30 mJ/m ² , more preferably 8 mJ/m ² to 30 mJ/m ² , further preferably 10 mJ/m ² to 30 mJ/m ² , and particularly preferably 12 mJ/m ² to 30 mJ/m ² . If the surface free energy of the adhesive layer included in the surface protection film to diiodomethane is within the above range, a surface protection film can be provided that can sufficiently suppress the peeling electrostatic voltage and will not damage the adherend (representatively, an optical component or an electronic component) during peeling. If the surface free energy of the adhesive layer contained in the surface protection film to diiodomethane deviates from the above range and is too low, there is a risk that the peeling electrostatic voltage cannot be fully suppressed. If the surface free energy of the adhesive layer contained in the surface protection film to diiodomethane deviates from the above range and is too high, there is a risk that the adherend is contaminated.

Furthermore, the surface free energy of the adhesive layer included in the surface protection film with respect to diiodomethane can be easily determined as described below. By designing the adhesive layer in such a way that the surface free energy is within the above-specified range, a surface protection film can be provided that can sufficiently suppress the peeling electrostatic voltage and will not damage the adherend (representatively, an optical component or an electronic component) during peeling. Here, with the above-mentioned adhesive layer as a design point, the present invention typically has the option of using an ionic compound and a fluorine compound in combination, and a fluorine compound. Furthermore, regarding the selection of fluorine compounds, for example, one may select fluorine compounds having the surface free energy within the above-specified range from a specific category of fluorine compounds. Such selection behavior can be implemented even without excessive trial and error by the industry.

Regarding the adhesive layer included in the surface protection film, after being attached to a glass plate, it is placed at a temperature of 23° C. for 30 minutes, and then the surface protection film is peeled off from the glass plate at a temperature of 23° C. at a peeling angle of 180 degrees and a peeling speed of 300 mm/minute. At this time, the peeling force is preferably 0.005 N/25 mm to 0.1 N/25 mm, more preferably 0.007 N/25 mm to 0.08 N/25 mm, further preferably 0.01 N/25 mm to 0.05 N/25 mm, particularly preferably 0.01 N/25 mm to 0.03 N/25 mm, and most preferably 0.01 N/25 mm to 0.02 N/25 mm. If the peeling force is within the above range, a surface protective film that is not easily peeled off from an adherend can be provided. Typically, in the manufacturing process of an optical component or an electronic component, the surface protective film is not easily peeled off after being attached to the exposed surface of the optical component or the electronic component, and can be easily peeled off when peeling is required.

The surface protection film can be manufactured by any appropriate method. As such a manufacturing method, it can be carried out according to any appropriate manufacturing method, such as the following method, namely: (1) A method of applying a solution or hot melt of a material forming an adhesive layer on a substrate layer; (2) A method of transferring an adhesive layer formed by applying a solution or hot melt of a material forming an adhesive layer on a separator to a substrate layer; (3) A method of extruding a material forming an adhesive layer onto a substrate layer and forming the coating; (4) A method of extruding a substrate layer and an adhesive layer in two or more layers; (5) A method of laminating an adhesive layer on a substrate layer in a single layer, or a method of laminating an adhesive layer and a laminating layer in a double layer; and (6) A method of laminating an adhesive layer and a substrate layer forming material such as a film or a laminating layer in a double layer or multiple layers.

As the coating method, for example, a roll coater method, a notch wheel coater method, a die-mouth coater method, a reverse coater method, a screen printing method, a gravure coater method, etc. can be used.

The surface protection film of the embodiment of the present invention is a surface protection film that fully suppresses the peeling electrostatic voltage and does not damage the optical component or the electronic component during peeling. The surface protection film is typically a surface protection film including an adhesive layer, which is adhered to the exposed surface of the optical component or the electronic component during the manufacturing steps of the optical component or the electronic component in order to prevent the surface of the optical component or the electronic component from being damaged during processing, assembly, inspection, transportation, etc.

The peeling electrostatic voltage of the surface protection film of the embodiment of the present invention on glass is preferably 3.0 kV or less, more preferably 2.5 kV or less, further preferably 2.0 kV or less, particularly preferably 1.7 kV or less, and most preferably 1.5 kV or less. The method for measuring the peeling electrostatic voltage on glass will be described below.

The peeling electrostatic voltage of the surface protection film of the embodiment of the present invention on the acrylic resin plate is preferably 4.0 kV or less, more preferably 3.5 kV or less, further preferably 3.0 kV or less, further preferably 2.5 kV or less, particularly preferably 2.0 kV or less, and most preferably 1.5 kV or less. The method for measuring the peeling electrostatic voltage on the acrylic resin plate will be described below.

The haze of the surface protective film of the embodiment of the present invention is preferably 5% or less, more preferably 4% or less, further preferably 3% or less, particularly preferably 2.8% or less, and most preferably 2.5% or less. If the haze of the surface protective film of the embodiment of the present invention is within the above range, it is suitable for use as a surface protective film attached to the exposed surface of an optical component or an electronic component. In particular, if the haze of the surface protective film of the embodiment of the present invention can be reduced to less than 3%, the inspectability of the surface protective film of the embodiment of the present invention is further improved, and thus it is better. The method for measuring the haze will be described below.

The residual adhesion of the surface protection film of the embodiment of the present invention to the glass is preferably 70% or more, more preferably 80% or more, further preferably 85% or more, particularly preferably 88% or more, and most preferably 90% or more. The residual adhesion to the glass is an indicator of the extent to which the components of the adhesive layer of the surface protection film are transferred to the surface of the adherend and whether contamination is caused. The higher the value of the residual adhesion rate to the glass, the lower the possibility that the surface protection film will cause contamination to the adherend, and the lower the value of the residual adhesion rate to the glass, the higher the possibility that the surface protection film will cause contamination to the adherend. The method for measuring the residual adhesion rate to the glass will be described below.

≪A-1. Adhesive layer≫ The adhesive layer is composed of an adhesive. The adhesive is formed by an adhesive composition. That is, the adhesive layer is formed by shaping the adhesive composition into a layer.

Adhesives can be defined as those formed from an adhesive composition. The reason for this is that, since adhesive compositions undergo crosslinking reactions such as heating or ultraviolet irradiation to form adhesives, it is impossible to directly identify adhesives based on their structure, and this is completely impractical (“impossible/impractical”). Therefore, by defining “formed from an adhesive composition”, adhesives are reliably identified as “objects”.

The adhesive layer can be formed by any appropriate method. As such a method, for example, an adhesive composition is applied to any appropriate substrate, and if necessary, heating, drying, and hardening are performed to form an adhesive layer on the substrate. As such a coating method, for example, a gravure roller coater, a reverse roller coater, a contact roller coater, an immersion roller coater, a rod coater, a scraper coater, an air knife coater, a spray coater, a notch wheel coater, a direct coater, a roller brush coater, and the like can be cited.

Regarding the thickness of the adhesive layer, in order to further demonstrate the effect of the present invention, it is preferably 0.5 μm to 150 μm, more preferably 1 μm to 100 μm, further preferably 2 μm to 80 μm, particularly preferably 3 μm to 50 μm, and most preferably 5 μm to 30 μm.

The adhesive composition includes a base polymer, an ionic compound, and a fluorine compound. By making the adhesive composition include a base polymer, an ionic compound, and a fluorine compound, a surface protective film that can fully suppress peeling electrostatic voltage and does not damage the optical component or the electronic component during peeling can be provided. The surface protective film is typically a surface protective film including an adhesive layer, which is attached to the exposed surface of the optical component or the electronic component in order to prevent the surface of the optical component or the electronic component from being damaged during processing, assembly, inspection, transportation, etc. during the manufacturing steps of the optical component or the electronic component.

In the present invention, the effect of the present invention can be exhibited by making the adhesive composition include both an ionic compound and a fluorine compound in addition to the base polymer. In particular, the effect of the present invention can be significantly exhibited by including (using together) both an ionic compound and a fluorine compound (sometimes referred to as a "specific fluorine compound") of the preferred embodiment described below. The reason is presumed to be that by making an ionic compound that can exhibit an antistatic effect coexist with a fluorine compound (preferably a specific fluorine compound) in the adhesive composition, the synergistic effect with the fluorine compound (preferably a specific fluorine compound) is utilized to make the ionic compound concentrate on the surface side of the adhesive layer (the side that is bonded to the adherend).

The content ratio of the base polymer in the adhesive composition is preferably 60% to 99.9% by weight, more preferably 65% to 99.9% by weight, further preferably 70% to 99.9% by weight, particularly preferably 75% to 99.9% by weight, and most preferably 80% to 99.9% by weight, calculated on a solid basis. If the content ratio of the base polymer in the adhesive composition is within the above range, a surface protective film can be provided that can sufficiently suppress peeling electrostatic voltage and does not damage an adherend (representatively, an optical component or an electronic component) during peeling.

The content ratio of the ionic compound relative to 100 parts by weight of the base polymer is preferably 0.2 parts by weight or more, more preferably 0.3 parts by weight to 5.0 parts by weight, further preferably 0.5 parts by weight to 3.0 parts by weight, particularly preferably 0.7 parts by weight to 2.0 parts by weight, and most preferably 0.8 parts by weight to 1.5 parts by weight. If the content ratio of the ionic compound relative to 100 parts by weight of the base polymer is within the above range, a surface protective film can be provided that can sufficiently suppress the stripping electrostatic voltage and does not damage the adherend (representatively, an optical component or an electronic component) during stripping. If the content ratio of the ionic compound relative to 100 parts by weight of the base polymer deviates from the above range and is too low, there is a risk that the stripping electrostatic voltage cannot be sufficiently suppressed. If the content ratio of the ionic compound to 100 parts by weight of the base polymer deviates from the above range and is too high, there is a risk of contaminating the adherend.

The content ratio of the fluorine compound relative to 100 parts by weight of the base polymer is preferably 0.05 parts by weight or more, more preferably 0.1 parts by weight to 5.0 parts by weight, further preferably 0.15 parts by weight to 3.0 parts by weight, particularly preferably 0.2 parts by weight to 2.0 parts by weight, and most preferably 0.23 parts by weight to 1.5 parts by weight. If the content ratio of the fluorine compound relative to 100 parts by weight of the base polymer is within the above range, a surface protective film can be provided that can fully suppress the stripping electrostatic voltage and does not damage the adherend (representatively, an optical component or an electronic component) during stripping. If the content ratio of the fluorine compound relative to 100 parts by weight of the base polymer deviates from the above range and is too low, there is a risk that the stripping electrostatic voltage cannot be fully suppressed. If the content ratio of the fluorine-based compound to 100 parts by weight of the base polymer deviates from the above range and is too high, there is a risk of contaminating the adherend.

<A-1-1. Base polymer> The base polymer is preferably at least one selected from polyols, urethane prepolymers, acrylic resins, rubber resins, and silicone resins. If the base polymer is at least one selected from polyols, urethane prepolymers, acrylic resins, rubber resins, and silicone resins, a surface protective film can be provided that more fully suppresses the peeling electrostatic voltage and makes the adherend (representatively, an optical component or an electronic component) less likely to be damaged during peeling.

[A-1-1-1. Polyol] The polyol is preferably reacted with a polyfunctional isocyanate compound to form a urethane resin. More specifically, it is preferred that a composition containing a polyol and a polyfunctional isocyanate compound is used to form a urethane resin. Specifically, the composition containing a polyol and a polyfunctional isocyanate compound is cured to form a urethane resin. As a method for curing a composition containing a polyol and a polyfunctional isocyanate compound to form a urethane resin, any appropriate method may be used within the scope of not impairing the effects of the present invention, such as a urethane reaction method using block polymerization or solution polymerization.

The polyol may be used alone or in combination of two or more.

The polyol may preferably be at least one selected from polyester polyol, polyether polyol, polycaprolactone polyol, polycarbonate polyol, and castor oil polyol. In terms of being able to better demonstrate the effects of the present invention, the polyol is more preferably polyether polyol.

The polyester polyol can be obtained, for example, by an esterification reaction between a polyol component and an acid component.

Examples of the polyol component include ethylene glycol, diethylene glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, 2-butyl-2-ethyl-1,3-propanediol, 2,4-diethyl-1,5-pentanediol, 1,2-hexanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 2-methyl-1,8-octanediol, 1,8-decanediol, octadecanediol, glycerol, trihydroxymethylpropane, pentaerythritol, hexanetriol, and polypropylene glycol.

Examples of the acid component include succinic acid, methylsuccinic acid, adipic acid, pimelic acid, azelaic acid, sebacic acid, 1,12-dodecane dicarboxylic acid, 1,14-tetradecanedioic acid, dimer acid, 2-methyl-1,4-cyclohexane dicarboxylic acid, 2-ethyl-1,4-cyclohexane dicarboxylic acid, terephthalic acid, isophthalic acid, phthalic acid, isophthalic acid, terephthalic acid, 1,4-naphthalene dicarboxylic acid, 4,4'-biphenyl dicarboxylic acid, and anhydrides thereof.

Examples of polyether polyols include polyether polyols obtained by addition polymerization of ethylene oxide, propylene oxide, butylene oxide, etc., using water, low molecular weight polyols (propylene glycol, ethylene glycol, glycerin, trihydroxymethylpropane, pentaerythritol, etc.), bisphenols (bisphenol A, etc.), dihydroxybenzenes (ophthalic acid diol, resorcinol, hydroquinone, etc.), etc. as initiators. Specific examples include polyethylene glycol, polypropylene glycol, polybutylene glycol, etc.

Examples of the polycaprolactone polyol include caprolactone polyester diols obtained by ring-opening polymerization of cyclic ester monomers such as ε-caprolactone and σ-valerolactone.

Examples of polycarbonate polyols include: polycarbonate polyols obtained by subjecting the above polyol components to a condensation reaction with phosgene; polycarbonate polyols obtained by subjecting the above polyol components to an ester exchange condensation reaction with carbonic acid diesters such as dimethyl carbonate, diethyl carbonate, dipropyl carbonate, diisopropyl carbonate, dibutyl carbonate, ethylbutyl carbonate, ethylene carbonate, propylene carbonate, diphenyl carbonate, and dibenzyl carbonate; copolymer polycarbonate polyols obtained by using two or more of the above polyol components in combination; polycarbonate polyols obtained by subjecting the above various polycarbonate polyols to an esterification reaction with a carboxyl group-containing compound; polycarbonate polyols obtained by subjecting the above-mentioned various polycarbonate polyols to etherification reaction with a hydroxyl-containing compound; polycarbonate polyols obtained by subjecting the above-mentioned various polycarbonate polyols to ester exchange reaction with an ester compound; polycarbonate polyols obtained by subjecting the above-mentioned various polycarbonate polyols to ester exchange reaction with a hydroxyl-containing compound; polyester polycarbonate polyols obtained by subjecting the above-mentioned various polycarbonate polyols to condensation reaction with a dicarboxylic acid compound; copolyether polycarbonate polyols obtained by copolymerizing the above-mentioned various polycarbonate polyols with an alkylene oxide.

Examples of castor oil-based polyols include castor oil-based polyols obtained by reacting castor oil fatty acids with the above-mentioned polyol components. Specifically, examples include castor oil-based polyols obtained by reacting castor oil fatty acids with polypropylene glycol.

The number average molecular weight Mn of the polyol is preferably 300 to 100,000, more preferably 400 to 75,000, further preferably 450 to 50,000, and particularly preferably 500 to 30,000. If the number average molecular weight Mn of the polyol is within the above range, a surface protective film that is less likely to be easily peeled off from an adherend can be provided. Typically, in the manufacturing step of an optical component or an electronic component, the surface protective film is less likely to be peeled off after being attached to the exposed surface of the optical component or the electronic component, and can be more easily peeled off when peeling is required.

The polyol is preferably a polyol (A1) having three OH groups and having a number average molecular weight Mn of 300 to 100000. The polyol (A1) may be one type or two or more types.

The content of the polyol (A1) in the polyol is preferably 5% by weight or more, more preferably 25% by weight to 100% by weight, further preferably 50% by weight to 100% by weight, particularly preferably 70% by weight to 100% by weight, and most preferably 90% by weight to 100% by weight. If the content of the polyol (A1) in the polyol is within the above range, a surface protective film that is less likely to be easily peeled off from an adherend can be provided. Typically, in the manufacturing step of an optical component or an electronic component, the surface protective film is less likely to be peeled off after being attached to the exposed surface of the optical component or the electronic component, and can be more easily peeled off when peeling is required.

As the polyol (A1), a polyol (A1a) having three OH groups and having a number average molecular weight Mn of 8000 to 20000 is preferred. The polyol (A1a) may be one kind or two or more kinds.

The content of the polyol (A1a) in the polyol (A1) is preferably 50% by weight or more, more preferably 60% to 100% by weight, further preferably 70% to 95% by weight, particularly preferably 75% to 93% by weight, and most preferably 80% to 90% by weight. If the content of the polyol (A1a) in the polyol (A1) is within the above range, a surface protective film that is less likely to be easily peeled off from an adherend can be provided. Typically, in the manufacturing step of an optical component or an electronic component, the surface protective film is less likely to be peeled off after being attached to the exposed surface of the optical component or the electronic component, and can be more easily peeled off when peeling is required.

The number average molecular weight Mn of the polyol (A1a) is 8000 to 20000, preferably 8000 to 18000, more preferably 8500 to 17000, further preferably 9000 to 16000, particularly preferably 9500 to 15500, and most preferably 10000 to 15000. If the number average molecular weight Mn of the polyol (A1a) is within the above range, a surface protective film that is less likely to be easily peeled off from an adherend can be provided. Typically, in the manufacturing step of an optical component or an electronic component, the surface protective film is less likely to be peeled off after being attached to the exposed surface of the optical component or the electronic component, and can be more easily peeled off when peeling is required.

The polyol (A1) may contain a polyol (A1b) having three or more OH groups and having a number average molecular weight Mn of not more than 5000. The polyol (A1b) may be one type or two or more types.

The polyol (A1b) is preferably at least one selected from a polyol having 3 OH groups (triol), a polyol having 4 OH groups (tetraol), a polyol having 5 OH groups (pentaol), and a polyol having 6 OH groups (hexaol).

The content of the polyol (A1b) in the polyol (A1) is preferably 50% by weight or less, more preferably 0% to 40% by weight, further preferably 5% to 30% by weight, particularly preferably 7% to 25% by weight, and most preferably 10% to 20% by weight. If the content of the polyol (A1b) in the polyol (A1) is within the above range, a surface protective film that is less likely to be easily peeled off from an adherend can be provided. Typically, in the manufacturing step of an optical component or an electronic component, the surface protective film is less likely to be peeled off after being attached to the exposed surface of the optical component or the electronic component, and can be more easily peeled off when peeling is required.

The number average molecular weight Mn of the polyol (A1b) is preferably 500 to 5000, more preferably 600 to 4500, further preferably 700 to 4000, particularly preferably 800 to 3500, and most preferably 900 to 3300. If the number average molecular weight Mn of the polyol (A1b) is within the above range, a surface protective film that is less likely to be easily peeled off from an adherend can be provided. Typically, in the manufacturing step of an optical component or an electronic component, the surface protective film is less likely to be peeled off after being attached to the exposed surface of the optical component or the electronic component, and can be more easily peeled off when peeling is required. If the number average molecular weight Mn of the polyol (A1b) deviates from the above range, there is a concern that the adhesion may increase with time, and excellent secondary processability may not be exhibited.

When the polyol (A1b) is at least one selected from a polyol having 4 OH groups (tetraol), a polyol having 5 OH groups (pentaol), and a polyol having 6 OH groups (hexaol), the total amount thereof, calculated as the content ratio in the polyol (A1), is preferably 40 wt % or less, more preferably 0 wt % to 30 wt %, further preferably 3 wt % to 20 wt %, particularly preferably 5 wt % to 15 wt %, and most preferably 7 wt % to 10 wt %. If the polyol (A1b) in the polyol (A1) is at least one selected from a polyol having 4 OH groups (tetraol), a polyol having 5 OH groups (pentaol), and a polyol having 6 OH groups (hexaol), and the total amount thereof is within the above range, a surface protective film that is less likely to be easily peeled off from an adherend can be provided. Typically, in the manufacturing step of an optical component or an electronic component, after being attached to the exposed surface of the optical component or the electronic component, it is less likely to be peeled off, and when peeling is required, it can be more easily peeled off. In addition, a surface protective film with excellent transparency can be provided.

The content ratio of at least one selected from a polyol having 4 OH groups (tetraol), a polyol having 5 OH groups (pentaol), and a polyol having 6 OH groups (hexaol) in the polyol (A1b) is preferably less than 10% by weight, more preferably less than 7% by weight, further preferably less than 5% by weight, particularly preferably less than 3% by weight, and most preferably less than 1% by weight, relative to the polyol (A1) as a whole. If the content ratio of at least one of the polyols (A1b) selected from the group consisting of a polyol having 4 OH groups (tetraol), a polyol having 5 OH groups (pentaol), and a polyol having 6 OH groups (hexaol) is within the above range, a surface protective film that is less likely to be peeled off from an adherend can be provided. Typically, in the manufacturing steps of an optical component or an electronic component, the surface protective film is less likely to be peeled off after being attached to the exposed surface of the optical component or the electronic component, and can be more easily peeled off when peeling is required. Furthermore, if the content ratio of at least one selected from polyols having 4 OH groups (tetraol), polyols having 5 OH groups (pentaol), and polyols having 6 OH groups (hexaol) in the polyol (A1b) deviates from the above range, the transparency of the surface protective film may be reduced.

The polyol (A1) may contain a polyol (A1c) having 4 or more OH groups and having a number average molecular weight Mn of 20000 or less. The polyol (A1c) may be one type or two or more types.

The content of the polyol (A1c) having 4 or more OH groups and a number average molecular weight Mn of 20,000 or less in the polyol (A1) is preferably less than 70% by weight, more preferably 60% by weight or less, further preferably 50% by weight or less, particularly preferably 40% by weight or less, and most preferably 30% by weight or less. If the content of the polyol (A1c) having 4 or more OH groups and a number average molecular weight Mn of 20,000 or less in the polyol (A1) is within the above range, a surface protective film that is less likely to be easily peeled off from an adherend can be provided. Typically, in the manufacturing step of an optical component or an electronic component, after being attached to the exposed surface of the optical component or the electronic component, it is less likely to be peeled off and can be more easily peeled off when peeling is required. In addition, it can be used as a surface protective film with excellent transparency.

[A-1-1-2. Urethane prepolymer] Urethane prepolymer is preferably reacted with a polyfunctional isocyanate compound to form a urethane resin. More specifically, it is preferred that the urethane resin is formed from a composition containing a urethane prepolymer and a polyfunctional isocyanate compound. Specifically, the urethane resin is formed by curing the composition containing a urethane prepolymer and a polyfunctional isocyanate compound. As a method for curing a composition containing a polyol and a polyfunctional isocyanate compound to form a urethane resin, any appropriate production method can be adopted as long as the urethane resin is produced using the so-called "urethane prepolymer" as a raw material.

Furthermore, in the description of the present invention, "urethane prepolymer" refers to what is commonly referred to as "urethane prepolymer" by the industry in the production of urethane resin, which is different from the "polyol" described in Item A-1-1-1.

The urethane prepolymer may be used alone or in combination of two or more.

The number average molecular weight Mn of the urethane prepolymer is preferably 3,000 to 1,000,000.

The urethane prepolymer is preferably a polyurethane polyol, and more preferably a polyester polyol (a1) or a polyether polyol (a2) reacted with a polyfunctional isocyanate compound in the presence of a catalyst or in the absence of a catalyst, either alone or as a mixture of (a1) and (a2). The polyester polyol (a1) may be one or more. The polyether polyol (a2) may be one or more.

As the polyester polyol (a1), any appropriate polyester polyol can be used. As such polyester polyol (a1), for example, polyester polyols obtained by reacting an acid component with a diol component can be cited. As the acid component, for example, terephthalic acid, adipic acid, azelaic acid, sebacic acid, phthalic anhydride, isophthalic acid, trimellitic acid, etc. can be cited. As the diol component, for example, ethylene glycol, propylene glycol, diethylene glycol, butanediol, 1,6-hexanediol, 3-methyl-1,5-pentanediol, 3,3'-dihydroxymethylheptane, polyoxyethylene glycol, polyoxypropylene glycol, 1,4-butanediol, neopentyl glycol, butylethylpentanediol can be cited; as the polyol component, for example, glycerol, trihydroxymethylpropane, pentaerythritol, etc. can be cited. Examples of the polyester polyol (a1) include, in addition to the above, polyester polyols obtained by ring-opening polymerization of lactones such as polycaprolactone, poly(β-methyl-γ-valerolactone) and polyvalerolactone.

As the molecular weight of the polyester polyol (a1), both low molecular weight and high molecular weight can be used. As the molecular weight of the polyester polyol (a1), the number average molecular weight Mn is preferably 100 to 100,000. If the number average molecular weight Mn is less than 100, there is a risk that the reactivity becomes high and gelation is easy. If the number average molecular weight Mn exceeds 100,000, there is a risk that the reactivity becomes low and the cohesive force of the polyurethane polyol itself becomes small. Regarding the amount of polyester polyol (a1) used, it is preferably 0 mol% to 90 mol% in the polyol constituting the polyurethane polyol.

As the polyether polyol (a2), any appropriate polyether polyol can be used. Examples of such polyether polyol (a2) include polyols prepared by using low molecular weight polyols such as water, propylene glycol, ethylene glycol, glycerin, and trihydroxymethylpropane as initiators to react with ethylene oxide, propylene oxide, butylene oxide, tetrahydrofuran, and the like. The polyether polyol (a2) is a polyether polyol obtained by polymerizing an oxirane compound. Specifically, polyether polyols having a functional group number of 2 or more, such as polypropylene glycol, polyethylene glycol, and polybutylene glycol, can be cited.

As the molecular weight of the polyether polyol (a2), both low molecular weight and high molecular weight can be used. As the molecular weight of the polyether polyol (a2), the number average molecular weight Mn is preferably 100 to 100,000. If the number average molecular weight Mn is less than 100, there is a risk that the reactivity becomes high and gelation is easy. If the number average molecular weight Mn exceeds 100,000, there is a risk that the reactivity becomes low and the cohesive force of the polyurethane polyol itself becomes small. Regarding the usage amount of the polyether polyol (a2), it is preferably 0 mol% to 90 mol% in the polyol constituting the polyurethane polyol.

The polyether polyol (a2) may be partially replaced with a diol such as ethylene glycol, 1,4-butanediol, neopentyl glycol, butylethylpentanediol, glycerol, trihydroxymethylpropane, pentaerythritol, or a polyamine such as ethylenediamine, N-aminoethylethanolamine, isophoronediamine, xylylenediamine, and the like, as needed, and used in combination.

As the polyether polyol (a2), only a bifunctional polyether polyol may be used, or a polyether polyol having a number average molecular weight Mn of 100 to 100,000 and having at least 3 hydroxyl groups in one molecule may be used in part or in whole. If a polyether polyol having a number average molecular weight Mn of 100 to 100,000 and having at least 3 hydroxyl groups in one molecule is used in part or in whole as the polyether polyol (a2), a good balance between adhesion and re-peelability can be achieved. In such a polyether polyol, if the number average molecular weight Mn is less than 100, there is a risk that the reactivity becomes high and gelation is easy. In addition, in such a polyether polyol, if the number average molecular weight Mn exceeds 100,000, there is a risk that the reactivity becomes low, and the cohesive force of the polyurethane polyol itself becomes small. The number average molecular weight Mn of the polyether polyol is more preferably 100 to 10,000.

Any appropriate catalyst can be used as a catalyst for obtaining polyurethane polyol. Examples of such catalysts include tertiary amine compounds and organic metal compounds.

Examples of the tertiary amine compounds include triethylamine, triethylenediamine, and 1,8-diazabicyclo(5,4,0)-undecene-7 (DBU).

Examples of the organometallic compound include tin-based compounds and non-tin-based compounds.

Examples of tin compounds include dibutyltin dichloride, dibutyltin oxide, dibutyltin dibromide, dibutyltin dimaleate, dibutyltin dilaurate (DBTDL), dibutyltin diacetate, dibutyltin sulfide, tributyltin sulfide, tributyltin oxide, tributyltin acetate, triethyltin ethoxide, tributyltin ethoxide, dioctyltin oxide, tributyltin chloride, tributyltin trichloroacetate, and 2-ethyltin hexanoate.

Examples of non-tin compounds include titanium compounds such as dibutyl titanium dichloride, tetrabutyl titanium, and butoxytitanium trichloride; lead compounds such as lead oleate, lead 2-ethylhexanoate, lead benzoate, and lead cycloalkanoate; iron compounds such as iron 2-ethylhexanoate and iron acetylacetonate; cobalt compounds such as cobalt benzoate and cobalt 2-ethylhexanoate; zinc compounds such as zinc cycloalkanoate and zinc 2-ethylhexanoate; and zirconium compounds such as zirconium cycloalkanoate.

When a catalyst is used to obtain polyurethane polyol, if the system contains two types of polyols, polyester polyol and polyether polyol, the reactivity is different, so gelation or turbidity of the reaction solution is likely to occur in a system with a single catalyst. Therefore, by using two types of catalysts to obtain polyurethane polyol, it is easy to control the reaction rate, selectivity of the catalyst, etc., and these problems can be solved. Examples of such combinations of two types of catalysts include tertiary amine/organic metal system, tin system/non-tin system, tin system/tin system, preferably tin system/tin system, and more preferably a combination of dibutyltin dilaurate and tin 2-ethylhexanoate. Regarding the mixing ratio of the combination of dibutyltin dilaurate and tin 2-ethylhexanoate, the weight ratio of tin 2-ethylhexanoate/dibutyltin dilaurate is preferably less than 1, and more preferably 0.2 to 0.6. If the mixing ratio is greater than 1, there is a risk that gelation may occur due to the balance of catalyst activity.

When a catalyst is used in obtaining the polyurethane polyol, the amount of the catalyst used is preferably 0.01 wt % to 1.0 wt % relative to the total amount of the polyester polyol (a1), the polyether polyol (a2) and the polyfunctional isocyanate compound.

When a catalyst is used to obtain polyurethane polyol, the reaction temperature is preferably less than 100° C., more preferably 85° C. to 95° C. If the temperature is higher than 100° C., it may be difficult to control the reaction rate and crosslinking structure, and it may be difficult to obtain polyurethane polyol having a predetermined molecular weight.

When obtaining polyurethane polyol, a catalyst may not be used. In this case, the reaction temperature is preferably 100° C. or higher, more preferably 110° C. or higher. When obtaining polyurethane polyol without a catalyst, the reaction is preferably allowed to react for 3 hours or more.

As methods for obtaining polyurethane polyol, for example: 1) a method of adding polyester polyol, polyether polyol, catalyst, and polyfunctional isocyanate compound to a full flask; 2) a method of adding polyester polyol, polyether polyol, and catalyst to a flask and then adding polyfunctional isocyanate compound dropwise. As a method for obtaining polyurethane polyol, method 2) is preferred in terms of controlling the reaction.

When obtaining polyurethane polyol, any appropriate solvent may be used. Examples of such solvents include methyl ethyl ketone, ethyl acetate, toluene, xylene, acetone, etc. Among these solvents, toluene is preferred.

[A-1-1-3. Acrylic resin] As the acrylic resin, any appropriate acrylic resin can be used within the range that does not impair the effects of the present invention. The acrylic resin may be only one type or may be two or more types.

The weight average molecular weight of the acrylic resin is preferably 300,000 to 2.5 million, more preferably 350,000 to 2 million, further preferably 400,000 to 1.8 million, and particularly preferably 500,000 to 1.5 million in order to better exhibit the effects of the present invention.

As the acrylic resin, in terms of being able to better demonstrate the effects of the present invention, an acrylic resin formed by polymerizing the composition (B) comprising (component (a)) an alkyl (meth)acrylate having an alkyl group with 4 to 12 carbon atoms in the alkyl ester moiety and (component (b)) at least one selected from the group consisting of (meth)acrylate having an OH group and (meth)acrylic acid. (component (a) and (component (b)) may each be independently one or more.

The (meth)acrylic acid alkyl ester (component a) in which the alkyl group of the alkyl ester part has 4 to 12 carbon atoms includes, for example, n-butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, etc. Among them, n-butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate are preferred, and n-butyl acrylate and 2-ethylhexyl acrylate are more preferred in terms of being able to better express the effects of the present invention.

As at least one (b) component selected from the group consisting of (meth)acrylates and (meth)acrylic acid having an OH group, for example, (meth)acrylates having an OH group such as hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, and hydroxybutyl (meth)acrylate, and (meth)acrylic acid, etc., can be cited. Among them, hydroxyethyl (meth)acrylate and (meth)acrylic acid are preferred, and hydroxyethyl acrylate and acrylic acid are more preferred in terms of being able to better demonstrate the effects of the present invention.

The composition (B) may also contain copolymerizable monomers other than the components (a) and (b). The copolymerizable monomers may be only one or may be two or more. Examples of such copolymerizable monomers include: carboxyl group-containing monomers such as itaconic acid, maleic acid, fumaric acid, crotonic acid, isomethacrylic acid, and anhydrides thereof (e.g., monomers containing anhydride groups such as maleic anhydride and itaconic anhydride) (except (meth)acrylic acid); (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-hydroxymethyl(meth)acrylamide, N-methoxymethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide; Amide, N-hydroxyethyl (meth) acrylamide and other amide-containing monomers; (meth) acrylate aminoethyl, (meth) acrylate dimethylaminoethyl, (meth) acrylate tert-butylaminoethyl and other amine-containing monomers; (meth) acrylate glycidyl, (meth) acrylate methyl glycidyl and other epoxy-containing monomers; acrylonitrile or methacrylonitrile and other cyano-containing monomers; N-vinyl-2-pyrrolidone, (meth) acrylamide, N-vinyl piperidone, N-vinylpiperidinium, N-vinylpyrrole, N-vinylimidazole, vinylpyridine, vinylpyrimidine, vinyloxazole and other vinyl monomers containing heterocyclic rings; sulfonic acid group-containing monomers such as sodium vinylsulfonate; phosphate group-containing monomers such as 2-hydroxyethylacryloyl phosphate; imine group-containing monomers such as cyclohexylmaleimide and isopropylmaleimide; isocyanate group-containing monomers such as 2-methacryloyloxyethyl isocyanate; cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate (Meth)acrylates having alicyclic hydrocarbon groups, such as isobutyl (meth)acrylate; (meth)acrylates having aromatic hydrocarbon groups, such as phenyl (meth)acrylate, phenoxyethyl (meth)acrylate, and benzyl (meth)acrylate; vinyl esters such as vinyl acetate and vinyl propionate; aromatic vinyl compounds such as styrene and vinyl toluene; olefins or dienes such as ethylene, butadiene, isoprene, and isobutylene; vinyl ethers such as vinyl alkyl ether; and vinyl chloride.

As copolymerizable monomers, multifunctional monomers may also be used. Multifunctional monomers refer to monomers having two or more ethylenically unsaturated groups in one molecule. As ethylenically unsaturated groups, any appropriate ethylenically unsaturated groups may be used within the scope that does not impair the effects of the present invention. Examples of such ethylenically unsaturated groups include free radical polymerizable functional groups such as vinyl, propenyl, isopropenyl, vinyl ether (vinyloxy), and allyl ether (allyloxy). Examples of the multifunctional monomer include hexanediol di(meth)acrylate, butanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, trihydroxymethylpropane tri(meth)acrylate, tetrahydroxymethylmethane tri(meth)acrylate, allyl (meth)acrylate, vinyl (meth)acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, urethane acrylate, etc. Such a multifunctional monomer may be only one kind or two or more kinds.

As the copolymerizable monomer, an alkoxyalkyl (meth)acrylate may also be used. Examples of the alkoxyalkyl (meth)acrylate include 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, methoxytriethylene glycol (meth)acrylate, 3-methoxypropyl (meth)acrylate, 3-ethoxypropyl (meth)acrylate, 4-methoxybutyl (meth)acrylate, and 4-ethoxybutyl (meth)acrylate. The alkoxyalkyl (meth)acrylate may be one or more.

The content of the (meth)acrylic acid alkyl ester (component a) in which the alkyl group of the alkyl ester portion has 4 to 12 carbon atoms is preferably 30% by weight or more, more preferably 35% to 99% by weight, further preferably 40% to 98% by weight, and particularly preferably 50% to 95% by weight, relative to the total amount (100% by weight) of the monomer components constituting the acrylic polymer, in order to better exhibit the effects of the present invention.

The content of at least one (component b) selected from the group consisting of (meth)acrylates having an OH group and (meth) acrylic acid is preferably 1% by weight or more, more preferably 1% by weight to 30% by weight, further preferably 2% by weight to 20% by weight, and particularly preferably 3% by weight to 10% by weight, relative to the total amount (100% by weight) of the monomer components constituting the acrylic polymer, in order to better demonstrate the effects of the present invention.

Composition (B) may contain any other appropriate components within the scope that does not impair the effects of the present invention. Examples of such other components include polymerization initiators, chain transfer agents, solvents, etc. The contents of such other components may be any appropriate content within the scope that does not impair the effects of the present invention.

The polymerization initiator may be a thermal polymerization initiator or a photopolymerization initiator (photoinitiator), etc., depending on the type of polymerization reaction. The polymerization initiator may be only one type or may be two or more types.

As for the thermal polymerization initiator, it is preferred to use it when obtaining an acrylic resin by solution polymerization. As such a thermal polymerization initiator, for example, an azo polymerization initiator, a peroxide polymerization initiator (for example, dibenzoyl peroxide, tert-butyl peroxymaleate, etc.), a redox polymerization initiator, etc. can be listed. Among such thermal polymerization initiators, the azo initiator disclosed in Japanese Patent Publication No. 2002-69411 is particularly preferred. Such an azo polymerization initiator is preferred in that the decomposition product of the polymerization initiator is not likely to remain in the acrylic resin as a part of the cause of the generation of gas (outgassing) generated by heating. Examples of azo polymerization initiators include 2,2'-azobisisobutyronitrile (hereinafter, sometimes referred to as AIBN), 2,2'-azobis-2-methylbutyronitrile (hereinafter, sometimes referred to as AMBN), 2,2'-azobis(2-methylpropionic acid) dimethyl ester, and 4,4'-azobis-4-cyanovaleric acid.

The photopolymerization initiator is preferably used when obtaining an acrylic polymer by active energy ray polymerization. Examples of the photopolymerization initiator include benzoin ether photopolymerization initiators, acetophenone photopolymerization initiators, α-ketol photopolymerization initiators, aromatic sulfonyl chloride photopolymerization initiators, photoactive oxime photopolymerization initiators, benzoin photopolymerization initiators, benzyl photopolymerization initiators, benzophenone photopolymerization initiators, ketal photopolymerization initiators, 9-oxysulfide photopolymerization initiators, and the like. System photopolymerization initiator, etc.

Examples of benzoin ether-based photopolymerization initiators include benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2,2-dimethoxy-1,2-diphenylethane-1-one, and anisole methyl ether. Examples of acetophenone-based photopolymerization initiators include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenyl ketone, 4-phenoxydichloroacetophenone, and 4-(tert-butyl)dichloroacetophenone. Examples of α-ketoalcohol-based photopolymerization initiators include 2-methyl-2-hydroxypropiophenone and 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropane-1-one. Examples of aromatic sulfonyl chloride-based photopolymerization initiators include 2-naphthalenesulfonyl chloride. Examples of photoactive oxime-based photopolymerization initiators include 1-phenyl-1,1-propanedione-2-(o-ethoxycarbonyl)-oxime. Examples of benzoin-based photopolymerization initiators include benzoin. Examples of benzoyl-based photopolymerization initiators include benzoyl. Examples of benzophenone-based photopolymerization initiators include benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, and α-hydroxycyclohexylphenylketone. Examples of ketal photopolymerization initiators include benzoyl dimethyl ketal and the like. Photopolymerization initiators, for example: 9-sulfuryl sulfide , 2-chloro-9-oxysulfuron , 2-methyl 9-oxosulfuron , 2,4-dimethyl 9-oxosulfuron 、Isopropyl 9-oxysulfide 、2,4-Diisopropyl 9-oxysulfide , dodecyl 9-oxysulfide wait.

Furthermore, when the base polymer is an acrylic resin, the adhesive composition may contain a crosslinking agent. By using a crosslinking agent, the cohesive force of the adhesive can be increased, and the effect of the present invention can be better demonstrated. The crosslinking agent may be only one kind or may be two or more kinds.

As the crosslinking agent, there can be listed: polyfunctional isocyanate crosslinking agents, epoxy crosslinking agents, melamine crosslinking agents, peroxide crosslinking agents, and also urea crosslinking agents, metal alkoxide crosslinking agents, metal chelate crosslinking agents, metal salt crosslinking agents, carbodiimide crosslinking agents, oxazoline crosslinking agents, aziridine crosslinking agents, amine crosslinking agents, etc. Among them, in terms of being able to better express the effect of the present invention, at least one selected from the group consisting of polyfunctional isocyanate crosslinking agents and epoxy crosslinking agents is preferred.

Examples of the polyfunctional isocyanate crosslinking agent include: low-order aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; alicyclic polyisocyanates such as cyclopentyl diisocyanate, cyclohexyl diisocyanate, isophorone diisocyanate, hydrogenated toluene diisocyanate, and hydrogenated xylene diisocyanate; and aromatic polyisocyanates such as 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylene diisocyanate. Examples of the polyfunctional isocyanate crosslinking agent include commercially available products such as trihydroxymethylpropane/toluene diisocyanate adduct (a product called "Coronate L" manufactured by Nippon Polyurethane Industries, Ltd.), trihydroxymethylpropane/hexamethylene diisocyanate adduct (a product called "Coronate HL" manufactured by Nippon Polyurethane Industries, Ltd.), a product called "Coronate HX" (Nippon Polyurethane Industries, Ltd.), and trihydroxymethylpropane/xylylene diisocyanate adduct (a product called "Takenate 110N" manufactured by Mitsui Chemicals, Inc.).

Examples of epoxy crosslinking agents (polyfunctional epoxy compounds) include: N,N,N',N'-tetraglycidyl meta-xylylenediamine, diglycidylaniline, 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, Glyceryl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trihydroxymethylpropane polyglycidyl ether, adipate diglycidyl, phthalate diglycidyl, triglycidyl-tri(2-hydroxyethyl)isocyanurate, resorcinol diglycidyl ether, bisphenol-S-diglycidyl ether, and epoxy resins having two or more epoxy groups in the molecule can also be listed. As epoxy crosslinking agents, commercial products such as the product named "Tetrad C" (manufactured by Mitsubishi Gas Chemical Co., Ltd.) can also be listed.

The content of the crosslinking agent in the adhesive composition can be any appropriate content within the range that does not impair the effect of the present invention. For example, such content is preferably 0.05 to 20 parts by weight, more preferably 0.1 to 18 parts by weight, further preferably 0.5 to 15 parts by weight, and particularly preferably 0.5 to 10 parts by weight, relative to the solid content (100 parts by weight) of the acrylic resin, in order to better demonstrate the effect of the present invention.

[A-1-1-4. Rubber resin] As the rubber resin, a known rubber adhesive described in Japanese Patent Laid-Open No. 2015-074771 or any suitable rubber resin used in a rubber adhesive may be used within the scope that does not impair the effect of the present invention. The number of the rubber resins may be only one or more.

[A-1-1-5. Silicone resin] As the silicone resin, a silicone resin used in any appropriate silicone adhesive, such as the known silicone adhesive described in Japanese Patent Laid-Open No. 2014-047280, etc., can be used within the scope that does not impair the effect of the present invention. The number of the silicone resins may be only one, or two or more.

<A-1-2. Urethane resin> As described above, the polyol as the base polymer is preferably reacted with a polyfunctional isocyanate compound to form a urethane resin. More specifically, it is preferred that the urethane resin is formed from a composition containing a polyol and a polyfunctional isocyanate compound, and more specifically, the urethane resin is formed by curing the composition containing a polyol and a polyfunctional isocyanate compound. As a method for curing the composition containing a polyol and a polyfunctional isocyanate compound to form a urethane resin, any appropriate method may be adopted within the scope that does not impair the effects of the present invention, such as a urethane reaction method using block polymerization or solution polymerization.

Furthermore, as described above, the urethane prepolymer as the base polymer is preferably reacted with a polyfunctional isocyanate compound to form a urethane resin. More specifically, it is preferred that the urethane resin is formed from a composition containing a urethane prepolymer and a polyfunctional isocyanate compound, and more specifically, the urethane resin is formed by curing the composition containing a urethane prepolymer and a polyfunctional isocyanate compound. As a method for curing a composition containing a polyol and a polyfunctional isocyanate compound to form a urethane resin, any appropriate production method can be adopted as long as the urethane resin is produced using the so-called "urethane prepolymer" as a raw material.

That is, a preferred embodiment of the urethane resin is a urethane resin formed from a composition containing a polyol and a multifunctional isocyanate compound. Another preferred embodiment of the urethane resin is a urethane resin formed from a composition containing a urethane prepolymer and a multifunctional isocyanate compound.

[A-1-2-1. Urethane resin formed from a composition containing a polyol and a polyfunctional isocyanate compound]

The polyfunctional isocyanate compound may be used alone or in combination of two or more.

As the polyfunctional isocyanate compound, any appropriate polyfunctional isocyanate compound that can be used in the urethanization reaction can be used. Examples of such polyfunctional isocyanate compounds include polyfunctional aliphatic isocyanate compounds, polyfunctional alicyclic isocyanates, polyfunctional aromatic isocyanate compounds, and polyfunctional aromatic aliphatic isocyanate compounds.

Examples of the polyfunctional aliphatic isocyanate compound include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 1,3-butylene diisocyanate, 2,3-butylene diisocyanate, dodecamethylene diisocyanate, and 2,4,4-trimethylhexamethylene diisocyanate.

Examples of the polyfunctional alicyclic isocyanate compounds include 3-isocyanatomethyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, isophorone diisocyanate, methyl-2,4-cyclohexane diisocyanate, methyl- 2,6-cyclohexane diisocyanate, 4,4'-methylenebis(cyclohexyl isocyanate), 1,4-bis(isocyanatomethyl)cyclohexane, 1,4-bis(isocyanatomethyl)cyclohexane, hydrogenated diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate, hydrogenated toluene diisocyanate, hydrogenated tetramethylxylylene diisocyanate, and the like.

Examples of the polyfunctional aromatic diisocyanate compound include 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 2,2'-diphenylmethane diisocyanate, 4,4'-diphenylmethane diisocyanate, 4,4'-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, 4,4'-diphenyl ether diisocyanate, 4,4'-biphenyl diisocyanate, 1,5-naphthalene diisocyanate, 4,4',4''-triphenylmethane triisocyanate, dianisidine diisocyanate, and xylylene diisocyanate.

Examples of the polyfunctional aromatic aliphatic isocyanate compound include ω,ω'-diisocyanate-1,3-dimethylbenzene, ω,ω'-diisocyanate-1,4-dimethylbenzene, ω,ω'-diisocyanate-1,4-diethylbenzene, 1,4-tetramethylxylylene diisocyanate, and 1,3-tetramethylxylylene diisocyanate.

Examples of the polyfunctional isocyanate compound include trihydroxymethylpropane adducts of the various polyfunctional isocyanate compounds described above, biuret formed by reaction with water, and trimers having an isocyanurate ring, etc. These may also be used in combination.

The equivalent ratio of NCO group to OH group in the polyol and the polyfunctional isocyanate compound is preferably 5.0 or less, more preferably 0.1 to 3.0, further preferably 0.2 to 2.5, further preferably 0.3 to 2.5, further preferably 0.3 to 2.0, particularly preferably 0.5 to 2.0, and most preferably 0.5 to 1.8, in terms of NCO group/OH group. If the equivalent ratio of NCO group/OH group is within the above range, a surface protective film that is not easily peeled off from an adherend can be provided. Typically, in the manufacturing step of an optical component or an electronic component, after being attached to the exposed surface of the optical component or the electronic component, it is not easily peeled off, and can be easily peeled off when peeling is required. Furthermore, if the equivalent ratio of NCO group/OH group is within the above range, the haze can be reduced. In particular, if the haze can be reduced to 3% or less, the inspectability of the surface protection film of the embodiment of the present invention is further improved.

Regarding the content ratio of the polyfunctional isocyanate compound, relative to the polyol, the polyfunctional isocyanate compound is preferably 1.0 wt % to 30 wt %, more preferably 1.5 wt % to 27 wt %, further preferably 2.0 wt % to 25 wt %, further preferably 2.3 wt % to 23 wt %, further preferably 2.3 wt % to 18 wt %, particularly preferably 2.5 wt % to 18 wt %, and most preferably 2.5 wt % to 16 wt %. If the content ratio of the polyfunctional isocyanate compound is within the above range, a surface protective film that is not easily peeled off from an adherend can be provided. Typically, in the manufacturing step of an optical component or an electronic component, after being attached to the exposed surface of the optical component or the electronic component, it is not easy to peel off, and when peeling is required, it can be easily peeled off. In addition, if the content ratio of the polyfunctional isocyanate compound is within the above range, the haze can be reduced. In particular, if the haze can be reduced to less than 3%, the inspectability of the surface protective film of the embodiment of the present invention is further improved.

In order to cure the composition containing the polyol and the polyfunctional isocyanate compound, it is preferred to use a catalyst. Examples of such catalysts include organometallic compounds and tertiary amine compounds. The catalyst may be only one or more than one.

Examples of the organometallic compounds include iron compounds, tin compounds, titanium compounds, zirconium compounds, lead compounds, cobalt compounds, zinc compounds, etc. Among them, iron compounds and tin compounds are preferred in terms of reaction speed and the useful life of the adhesive layer.

Examples of the iron-based compound include iron acetylacetonate and iron 2-ethylhexanoate.

Examples of the tin compound include dibutyltin dichloride, dibutyltin oxide, dibutyltin dibromide, dibutyltin maleate, dibutyltin dilaurate, dibutyltin diacetate, dibutyltin sulfide, tributyltin methanolate, tributyltin acetate, triethyltin ethoxide, tributyltin ethoxide, dioctyltin oxide, dioctyltin dilaurate, tributyltin chloride, tributyltin trichloroacetate, and 2-ethyltin hexanoate.

Examples of the titanium-based compound include dibutyl titanium dichloride, tetrabutyl titanium, butoxytitanium trichloride, and the like.

Examples of the zirconium compound include zirconium cycloalkaneate and zirconium acetylacetonate.

Examples of the lead compound include lead oleate, lead 2-ethylhexanoate, lead benzoate, and lead cycloalkanoate.

Examples of the cobalt-based compound include cobalt 2-ethylhexanoate and cobalt benzoate.

Examples of the zinc-based compound include zinc cycloalkanoate and zinc 2-ethylhexanoate.

Examples of the tertiary amine compound include triethylamine, triethylenediamine, and 1,8-diazabicyclo-(5,4,0)-undecene-7.

The amount of the catalyst is preferably 0.005 wt% to 1.00 wt%, more preferably 0.01 wt% to 0.75 wt%, further preferably 0.01 wt% to 0.50 wt%, and particularly preferably 0.01 wt% to 0.20 wt% relative to the polyol. If the amount of the catalyst is within the above range, a surface protective film that is not easily peeled off from an adherend can be provided. Typically, in the manufacturing step of an optical component or an electronic component, the surface protective film is not easily peeled off after being attached to the exposed surface of the optical component or the electronic component, and can be easily peeled off when peeling is required.

The composition containing polyol and polyfunctional isocyanate compound may contain any other appropriate components within the scope that does not impair the effect of the present invention. Such other components include, for example, antioxidants, ultraviolet absorbers, light stabilizers, resin components, adhesion agents, crosslinking delay agents, inorganic fillers, organic fillers, metal powders, pigments, foils, softeners, anti-aging agents, conductive agents, surface lubricants, leveling agents, preservatives, heat stabilizers, polymerization inhibitors, lubricants, solvents, etc.

Among the other components, it is a preferred embodiment to include an anti-degradation agent such as an antioxidant, an ultraviolet absorber, and a light stabilizer. By making the adhesive composition include an anti-degradation agent, the adhesive residue resistance can be excellent, for example, even if the formed adhesive layer is attached to the adherend and stored in a heated state, it is not easy for the adhesive to remain on the adherend. The anti-degradation agent may be only one, or may be two or more. As the anti-degradation agent, an antioxidant is particularly preferred.

As antioxidants, for example, free radical chain inhibitors, peroxide decomposers, etc. can be cited.

Examples of free radical chain inhibitors include phenolic antioxidants, amine antioxidants, and the like.

Examples of peroxide decomposition agents include sulfur-based antioxidants and phosphorus-based antioxidants.

Examples of phenolic antioxidants include monophenolic antioxidants, bisphenolic antioxidants, and high molecular weight phenolic antioxidants.

Examples of monophenol antioxidants include 2,6-di-tert-butyl-p-cresol, butylated hydroxyanisole, 2,6-di-tert-butyl-4-ethylphenol, and stearyl-β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate.

Examples of bisphenol antioxidants include 2,2'-methylenebis(4-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-ethyl-6-tert-butylphenol), 4,4'-thiobis(3-methyl-6-tert-butylphenol), 4,4'-butylenebis(3-methyl-6-tert-butylphenol), and 3,9-bis[1,1-dimethyl-2-[β-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy]ethyl]2,4,8,10-tetraoxaspiro[5,5]undecane.

Examples of high molecular weight phenolic antioxidants include 1,1,3-tris(2-methyl-4-hydroxy-5-tert-butylphenyl)butane, 1,3,5-trimethyl-2,4,6-tris(3,5-di-tert-butyl-4-hydroxybenzyl)benzene, tetrakis-[methylene-3-(3',5'-di-tert-butyl-4'-hydroxyphenyl)propionate]methane, bis[3,3'-bis-(4'-hydroxy-3'-tert-butylphenyl)butyric acid]ethylene glycol ester, 1,3,5-tris(3',5'-di-tert-butyl-4'-hydroxybenzyl)-S-triazine-2,4,6-(1H,3H,5H)trione, and tocopherol.

Examples of the sulfur-based antioxidants include dilauryl 3,3'-thiodipropionate, dimyristyl 3,3'-thiodipropionate, and distearyl 3,3'-thiodipropionate.

Examples of phosphorus-based antioxidants include triphenyl phosphite, diphenyl isodecyl phosphite, and phenyl diisodecyl phosphite.

Examples of the ultraviolet absorber include benzophenone ultraviolet absorbers, benzotriazole ultraviolet absorbers, salicylic acid ultraviolet absorbers, oxalylanilide ultraviolet absorbers, cyanoacrylate ultraviolet absorbers, and triazine ultraviolet absorbers.

Examples of the benzophenone-based ultraviolet absorber include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-octyloxybenzophenone, 2-hydroxy-4-dodecyloxybenzophenone, 2,2'-dihydroxy-4-dimethoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2-hydroxy-4-methoxy-5-sulfobenzophenone, and bis(2-methoxy-4-hydroxy-5-benzoylphenyl)methane.

As benzotriazole-based ultraviolet absorbers, for example, 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-(2'-hydroxy-5'-tert-butylphenyl)benzotriazole, 2-(2'-hydroxy-3',5'-di-tert-butylphenyl)benzotriazole, 2-(2'-hydroxy-3'-tert-butyl-5'-methylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3',5'-di-tert-butylphenyl)5-chlorobenzotriazole, 2-(2'-hydroxy-3',5'-di-tert-butylphenyl)5-chlorobenzotriazole, 5'-di-tert-pentylphenyl)benzotriazole, 2-(2'-hydroxy-4'-octyloxyphenyl)benzotriazole, 2-[2'-hydroxy-3'-(3'',4'',5'',6'',-tetrahydrophthaliminomethyl)-5'-methylphenyl]benzotriazole, 2,2'-methylenebis[4-(1,1,3,3-tetramethylbutyl)-6-(2H-benzotriazol-2-yl)phenol], 2-(2'-hydroxy-5'-methylacryloyloxyphenyl)-2H-benzotriazole, etc.

Examples of salicylic acid-based ultraviolet absorbers include phenyl salicylate, p-tert-butylphenyl salicylate, p-octylphenyl salicylate, and the like.

Examples of the cyanoacrylate-based ultraviolet absorber include 2-ethylhexyl 2-cyano-3,3'-diphenylacrylate and ethyl 2-cyano-3,3'-diphenylacrylate.

Examples of light stabilizers include hindered amine light stabilizers and ultraviolet light stabilizers.

Examples of hindered amine light stabilizers include bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate, bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate, and methyl-1,2,2,6,6-pentamethyl-4-piperidinyl sebacate.

As the ultraviolet stabilizer, for example, there can be listed: bis(octylphenyl)nickel sulfide, [2,2'-thiobis(4-tert-octylphenol)]-n-butylamine nickel salt, nickel complex-3,5-di-tert-butyl-4-hydroxybenzyl-phosphoric acid monoethanolate, nickel dibutyl dithiocarbamate, benzoate type quencher, nickel dibutyl dithiocarbamate, and the like.

[A-1-2-2. Urethane resin formed from a composition containing a urethane prepolymer and a polyfunctional isocyanate compound] The polyfunctional isocyanate compound may be only one kind or may be two or more kinds.

As the polyfunctional isocyanate compound, any appropriate polyfunctional isocyanate compound that can be used for urethanization reaction can be used. Examples of such polyfunctional isocyanate compounds include the "polyfunctional isocyanate compounds" described in Section A-1-2.

The composition containing the urethane prepolymer and the multifunctional isocyanate compound may contain any other appropriate components within the scope that does not impair the effect of the present invention. Such other components include, for example, antioxidants, ultraviolet absorbers, light stabilizers, resin components, adhesion agents, crosslinking delay agents, inorganic fillers, organic fillers, metal powders, pigments, foils, softeners, anti-aging agents, conductive agents, surface lubricants, leveling agents, preservatives, heat stabilizers, polymerization inhibitors, lubricants, solvents, etc.

Among these other components, it is a preferred embodiment to include an antioxidant, an ultraviolet absorber, a light stabilizer and other anti-degradation agents. By making the adhesive composition include an anti-degradation agent, the adhesive residue resistance can be excellent, for example, even if the formed adhesive layer is attached to the adherend and stored in a heated state, it is not easy for the adhesive to remain on the adherend. The anti-degradation agent may be only one or more. As the anti-degradation agent, an antioxidant is particularly preferred. For details about the antioxidant, ultraviolet absorber and light stabilizer, the description in item A-1-2-1 can be cited.

Regarding the equivalent ratio of NCO groups to OH groups in the urethane prepolymer and the polyfunctional isocyanate compound, in terms of NCO groups/OH groups, it is preferably 5.0 or less, more preferably 0.01 to 3.0, further preferably 0.02 to 2.0, further preferably 0.03 to 2.0, further preferably 0.03 to 1.9, particularly preferably 0.05 to 1.9, and most preferably 0.05 to 1.8. If the equivalent ratio of NCO group/OH group is within the above range, a surface protective film can be provided that is not easy to be easily peeled off from the adherend. Representatively, in the manufacturing step of an optical component or an electronic component, it is not easy to be peeled off after being attached to the exposed surface of the optical component or the electronic component, and can be easily peeled off when peeling is required. In addition, if the equivalent ratio of NCO group/OH group is within the above range, the haze can be reduced. In particular, if the haze can be reduced to less than 3%, the inspectability of the surface protective film of the embodiment of the present invention is further improved.

Regarding the content ratio of the polyfunctional isocyanate compound, relative to the urethane prepolymer, the polyfunctional isocyanate compound is preferably 0.01% by weight to 30% by weight, more preferably 0.05% by weight to 25% by weight, further preferably 0.1% by weight to 25% by weight, further preferably 0.5% by weight to 25% by weight, further preferably 0.5% by weight to 23% by weight, particularly preferably 1% by weight to 23% by weight, and most preferably 1% by weight to 21% by weight. If the content ratio of the polyfunctional isocyanate compound is within the above range, a surface protective film that is not easily peeled off from an adherend can be provided. Typically, in the manufacturing step of an optical component or an electronic component, after being attached to the exposed surface of the optical component or the electronic component, it is not easy to peel off, and when peeling is required, it can be easily peeled off. In addition, if the content ratio of the polyfunctional isocyanate compound is within the above range, the haze can be reduced. In particular, if the haze can be reduced to less than 3%, the inspectability of the surface protective film of the embodiment of the present invention is further improved.

<A-1-3. Ionic compound> As the ionic compound, any appropriate ionic compound can be used within the scope that does not impair the effect of the present invention. As such an ionic compound, an ionic liquid is preferred, and an ionic liquid containing a fluorine organic anion is more preferred. By making the adhesive composition contain both an ionic compound and a fluorine compound described below in addition to a base polymer, a surface protective film that fully suppresses peeling electrostatic voltage and does not damage the optical component or the electronic component during peeling can be provided. The surface protective film is typically a surface protective film including an adhesive layer, which is attached to the exposed surface of the optical component or the electronic component in order to prevent the surface of the optical component or the electronic component from being damaged during processing, assembly, inspection, transportation, etc. during the manufacturing step of the optical component or the electronic component.

The ionic compound may be only one kind or two or more kinds.

Ionic liquids refer to molten salts (ionic compounds) that are liquid at 25°C.

As the ionic liquid, any appropriate ionic liquid may be used within the scope of not impairing the effect of the present invention. As such an ionic liquid, an ionic liquid containing fluorine organic anions is preferred, and an ionic liquid composed of fluorine organic anions and onium cations is more preferred. By using an ionic liquid composed of fluorine organic anions and onium cations, and by using it in combination with the fluorine-based compound described below, a surface protective film can be provided that more fully suppresses the stripping electrostatic voltage and makes the optical component or the electronic component less likely to be damaged during stripping. The surface protective film is typically a surface protective film including an adhesive layer, which is adhered to the exposed surface of the optical component or the electronic component in the manufacturing steps of the optical component or the electronic component in order to prevent the surface of the optical component or the electronic component from being damaged during processing, assembly, inspection, transportation, etc.

As the onium cation that can constitute the ionic liquid, any appropriate onium cation can be used within the scope that does not impair the effect of the present invention. As such onium cation, it is preferably at least one selected from nitrogen-containing onium cations, sulfur-containing onium cations, and phosphorus-containing onium cations. By selecting such onium cations and using them in combination with the fluorine-based compounds described below, a surface protective film can be provided that more fully suppresses the stripping electrostatic voltage and makes the optical component or the electronic component less likely to be damaged during stripping. The surface protective film is typically a surface protective film comprising an adhesive layer, which is adhered to the exposed surface of the optical component or the electronic component during the manufacturing steps of the optical component or the electronic component in order to prevent the surface of the optical component or the electronic component from being damaged during processing, assembly, inspection, transportation, etc.

As the onium cation that can constitute the ionic liquid, it is preferably at least one selected from the cations having the structures represented by the general formulae (1) to (5).

In the general formula (1), Ra represents a carbonyl group having 4 to 20 carbon atoms, which may contain a heteroatom, and Rb and Rc are the same or different and represent hydrogen or a carbonyl group having 1 to 16 carbon atoms, which may contain a heteroatom. In the case where the nitrogen atom contains a double bond, Rc is absent.

In the general formula (2), Rd represents a carbon group having 2 to 20 carbon atoms, which may contain a heteroatom, and Re, Rf and Rg are the same or different and represent hydrogen or a carbon group having 1 to 16 carbon atoms, which may contain a heteroatom.

In the general formula (3), Rh represents a carbonyl group having 2 to 20 carbon atoms, which may contain a heteroatom, and Ri, Rj and Rk are the same or different and represent hydrogen or a carbonyl group having 1 to 16 carbon atoms, which may contain a heteroatom.

In the general formula (4), Z represents a nitrogen atom, a sulfur atom or a phosphorus atom, and R1, Rm, Rn and Ro are the same or different and represent a alkyl group having 1 to 20 carbon atoms, which may contain a miscellaneous atom. When Z is a sulfur atom, Ro is absent.

In the general formula (5), X represents a Li atom, a Na atom or a K atom.

Examples of the cation represented by the general formula (1) include pyridinium cations, pyrrolidinium cations, piperidinium cations, cations having a pyrroline skeleton, cations having a pyrrole skeleton, and the like.

Specific examples of the cation represented by the general formula (1) include pyridinium cations such as 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1-octyl-4-methylpyridinium cation, 1-butyl-3,4-dimethylpyridinium cation, and 1,1-dimethylpyrrolidinium cation; Ethyl-1-methylpyrrolidinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1-hexylpyrrolidinium cation, 1-methyl-1-heptylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1-ethyl-1-pentylpyrrolidinium cation, 1-ethyl-1-hexylpyrrolidinium cation, 1-ethyl-1-heptylpyrrolidinium cation, Pyrrolidinium cations such as 1,1-dipropylpyrrolidinium cation, 1-propyl-1-butylpyrrolidinium cation, 1,1-dibutylpyrrolidinium cation; 1-propylpiperidinium cation, 1-pentylpiperidinium cation, 1-methyl-1-ethylpiperidinium cation , 1-methyl-1-propylpiperidinium cation, 1-methyl-1-butylpiperidinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1-heptylpiperidinium cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cation, 1-ethyl-1-pentylpiperidinium cation, 1-ethyl-1-hexylpiperidinium cation, 1-ethyl-1-heptylpiperidinium cation, 1-propyl-1-butylpiperidinium cation, 1,1-dimethylpiperidinium cation Piperidinium cations such as pyridinium cation, 1,1-dipropylpiperidinium cation, 1,1-dibutylpiperidinium cation; 2-methyl-1-pyrroline cation; 1-ethyl-2-phenylindole cation; 1,2-dimethylindole cation; 1-ethylcarbazole cation.

Among them, in terms of being able to better express the effects of the present invention, the following are preferred: pyridinium cations such as 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, and 1-octyl-4-methylpyridinium cation; 1-ethyl-1-methyl Pyrrolidinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1-hexylpyrrolidinium cation, 1-methyl-1-heptylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1-ethyl-1-pentylpyrrolidinium cation, 1-ethyl-1-hexylpyrrolidinium cation , 1-ethyl-1-heptylpyrrolidinium cation and the like; 1-methyl-1-ethylpiperidinium cation, 1-methyl-1-propylpiperidinium cation, 1-methyl-1-butylpiperidinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1-heptylpiperidinium cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cation, 1-ethyl-1 The piperidinium cation is preferably a piperidinium cation such as 1-pentylpiperidinium cation, 1-ethyl-1-hexylpiperidinium cation, 1-ethyl-1-heptylpiperidinium cation, 1-propyl-1-butylpiperidinium cation, and more preferably a 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-octyl-4-methylpyridinium cation, 1-methyl-1-propylpyrrolidinium cation, and 1-methyl-1-propylpiperidinium cation.

Examples of the cation represented by the general formula (2) include imidazolium cation, tetrahydropyrimidinium cation, dihydropyrimidinium cation and the like.

Specific examples of the cation represented by the general formula (2) include 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1-butyl-3-methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation, imidazolium cations such as 1-dodecyl-3-methylimidazolium cation, 1-tetradecyl-3-methylimidazolium cation, 1,2-dimethyl-3-propylimidazolium cation, 1-ethyl-2,3-dimethylimidazolium cation, 1-butyl-2,3-dimethylimidazolium cation, 1-hexyl-2,3-dimethylimidazolium cation; 1,3-di Tetrahydropyrimidinium cations such as methyl-1,4,5,6-tetrahydropyrimidinium cation, 1,2,3-trimethyl-1,4,5,6-tetrahydropyrimidinium cation, 1,2,3,4-tetramethyl-1,4,5,6-tetrahydropyrimidinium cation, 1,2,3,5-tetramethyl-1,4,5,6-tetrahydropyrimidinium cation; 1,3-dimethyl-1,4-dihydropyrimidinium dihydropyrimidinium cations such as 1,3-dimethyl-1,6-dihydropyrimidinium cation, 1,2,3-trimethyl-1,4-dihydropyrimidinium cation, 1,2,3-trimethyl-1,6-dihydropyrimidinium cation, 1,2,3,4-tetramethyl-1,4-dihydropyrimidinium cation and 1,2,3,4-tetramethyl-1,6-dihydropyrimidinium cation.

Among them, in terms of being able to better express the effect of the present invention, 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1-butyl-3-methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl- The imidazolium cation may be 3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation, 1-dodecyl-3-methylimidazolium cation, 1-tetradecyl-3-methylimidazolium cation or the like, more preferably 1-ethyl-3-methylimidazolium cation or 1-hexyl-3-methylimidazolium cation.

Examples of the cation represented by the general formula (3) include pyrazolium cation and pyrazolinium cation.

Specific examples of the cation represented by the general formula (3) include the following: 1-methylpyrazolium cation, 3-methylpyrazolium cation, 1-ethyl-2-methylpyrazolinium cation, 1-ethyl-2,3,5-trimethylpyrazolium cation, 1-propyl-2,3,5-trimethylpyrazolium cation, cations, 1-butyl-2,3,5-trimethylpyrazolium cation and the like; 1-ethyl-2,3,5-trimethylpyrazolinium cation, 1-propyl-2,3,5-trimethylpyrazolinium cation, 1-butyl-2,3,5-trimethylpyrazolinium cation and the like pyrazolium cations.

Examples of the cation represented by the general formula (4) include tetraalkylammonium cations, trialkylsiron cations, tetraalkylphosphonium cations, or cations in which a portion of the above alkyl groups is substituted with an alkenyl group or an alkoxy group, or further with an epoxide group.

Specific examples of the cation represented by the general formula (4) include tetramethylammonium cation, tetraethylammonium cation, tetrabutylammonium cation, tetrapentylammonium cation, tetrahexylammonium cation, tetraheptylammonium cation, triethylmethylammonium cation, tributylethylammonium cation, trimethylpropylammonium cation, trimethyldecylammonium cation, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium cation, glycidyltrimethylammonium cation, Ammonium cation, trimethyl zirconia cation, triethyl zirconia cation, tributyl zirconia cation, trihexyl zirconia cation, diethyl methyl zirconia cation, dibutyl ethyl zirconia cation, dimethyl decyl zirconia cation, tetramethyl phosphonium cation, tetraethyl phosphonium cation, tetrabutyl phosphonium cation, tetrahexyl phosphonium cation, tetraoctyl phosphonium cation, triethyl methyl phosphonium cation, tributyl ethyl phosphonium cation, trimethyl decyl phosphonium cation, diallyl dimethyl ammonium cation, etc.

Among them, the following are preferred in terms of being able to better demonstrate the effects of the present invention: triethylmethylammonium cation, tributylethylammonium cation, trimethyldecylammonium cation, diethylmethylzirconium cation, dibutylethylzirconium cation, dimethyldecylzirconium cation, triethylmethylphosphonium cation, tributylphosphonium cation, Asymmetric tetraalkylammonium cations such as ethylphosphonium cation, trimethyldecylphosphonium cation, trialkylsulphurium cation, tetraalkylphosphonium cation; or N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium cation, glycidyltrimethylammonium cation, diallyldimethylammonium cation, N,N -Dimethyl-N-ethyl-N-propylammonium cation, N,N-dimethyl-N-ethyl-n-butylammonium cation, N,N-dimethyl-N-ethyl-N-pentylammonium cation, N,N-dimethyl-N-ethyl-N-hexylammonium cation, N,N-dimethyl-N-ethyl-N-heptylammonium cation, N,N-dimethyl-N-ethyl-N-nonylammonium cation, N,N-dimethyl-N,N-dipropylammonium cation, N,N-diethyl-N-propyl-n-butylammonium cation, N,N-dimethyl-N-propyl-N-pentylammonium cation, N,N-dimethyl-N-propyl-N-hexylammonium cation Ammonium cation, N,N-dimethyl-N-propyl-N-heptylammonium cation, N,N-dimethyl-n-butyl-N-hexylammonium cation, N,N-diethyl-n-butyl-N-heptylammonium cation, N,N-dimethyl-N-pentyl-N-hexylammonium cation, N,N-dimethyl-N,N -Dihexylammonium cation, trimethylheptylammonium cation, N,N-diethyl-N-methyl-N-propylammonium cation, N,N-diethyl-N-methyl-N-pentylammonium cation, N,N-diethyl-N-methyl-N-heptylammonium cation, N,N-diethyl-N-propyl-N-pentylammonium cation Ions, triethylpropylammonium cation, tripentylammonium cation, triethylheptylammonium cation, N,N-dipropyl-N-methyl-N-ethylammonium cation, N,N-dipropyl-N-methyl-N-pentylammonium cation, N,N-dipropyl-n-butyl-N-hexylammonium cation, N,N-dipropyl The cation is preferably N,N-dihexylammonium cation, N,N-dibutyl-N-methyl-N-pentylammonium cation, N,N-dibutyl-N-methyl-N-hexylammonium cation, trioctylmethylammonium cation, N-methyl-N-ethyl-N-propyl-N-pentylammonium cation, and more preferably trimethylpropylammonium cation.

As the fluorine organic anion that can constitute the ionic liquid, any appropriate fluorine organic anion can be used within the scope that does not impair the effect of the present invention. Such fluorine organic anion can be completely fluorinated (perfluorinated) or partially fluorinated.

Examples of such fluorinated organic anions include fluorinated aryl sulfonates, perfluoroalkanesulfonates, bis(fluorosulfonyl)imides, bis(perfluoroalkanesulfonyl)imides, cyanoperfluoroalkanesulfonylamides, bis(cyanoperfluoroalkanesulfonyl methylates, cyano-bis-(perfluoroalkanesulfonyl)methylates, tris(perfluoroalkanesulfonyl)methylates, trifluoroacetates, perfluoroalkylates, tris(perfluoroalkanesulfonyl)methylates, and (perfluoroalkanesulfonyl)trifluoroacetamide.

Among the fluorinated organic anions, perfluoroalkyl sulfonates, bis(fluorosulfonyl)imides, and bis(perfluoroalkylsulfonyl)imides are more preferred, and more specifically, for example, trifluoromethanesulfonates, pentafluoroethanesulfonates, heptafluoropropanesulfonates, nonafluorobutanesulfonates, bis(fluorosulfonyl)imides, and bis(trifluoromethanesulfonyl)imides are preferred.

As specific examples of the ionic liquid, a combination of the above-mentioned cationic component and the above-mentioned anionic component can be appropriately selected and used. As specific examples of such ionic liquids, for example, 1-hexylpyridinium bis(fluorosulfonyl)imide, 1-ethyl-3-methylpyridinium trifluoromethanesulfonate, 1-ethyl-3-methylpyridinium pentafluoroethanesulfonate, 1-ethyl-3-methylpyridinium heptafluoropropanesulfonate, 1-ethyl-3-methylpyridinium nonafluorobutanesulfonate, 1-butane 1-butyl-3-methylpyridinium bis(trifluoromethanesulfonyl)imide, 1-butyl-3-methylpyridinium bis(pentafluoroethanesulfonyl)imide, 1-octyl-4-methylpyridinium bis(fluorosulfonyl)imide, 1,1-dimethylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-methyl- 1-Ethylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-Methyl-1-propylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-Methyl-1-propylpyrrolidinium bis(fluorosulfonyl)imide, 1-Methyl-1-butylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-Methyl-1-pentylpyrrolidinium bis(trifluoromethanesulfonyl)imide bis(trifluoromethanesulfonyl)imide, 1-methyl-1-hexylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-heptylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-propylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-butylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-pentyl 1-ethyl-1-hexylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-heptylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1,1-dipropylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-propyl-1-butylpyrrolidinium bis(trifluoromethanesulfonyl)imide Imine, 1,1-dibutylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-propylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-pentylpiperidinium bis(trifluoromethanesulfonyl)imide, 1,1-dimethylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-ethylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl 1-methyl-1-propylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-propylpiperidinium bis(fluorosulfonyl)imide, 1-methyl-1-butylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-pentylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-hexylpiperidinium bis(trifluoromethanesulfonyl)imide amine, 1-methyl-1-heptylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-propylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-butylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-pentylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-hexylpiperidinium bis(trifluoromethanesulfonyl)imide 1-ethyl-1-heptylpiperidinium bis(trifluoromethanesulfonyl)imide, 1,1-dipropylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-propyl-1-butylpiperidinium bis(trifluoromethanesulfonyl)imide, 1,1-dibutylpiperidinium bis(trifluoromethanesulfonyl)imide, 1,1-dimethylpyrrolidinium bis(trifluoromethanesulfonyl)imide (Pentafluoroethanesulfonyl)imide, 1-methyl-1-ethylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-propylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-butylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-pentylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1- Methyl-1-hexylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-heptylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-propylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-butylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-pentylpyrrolidinium bis(pentafluoroethanesulfonyl)imide 1-Ethyl-1-hexylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-Ethyl-1-heptylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1,1-dipropylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-propyl-1-butylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1,1-dibutyl 1-Pentafluoroethanesulfonyl)imide, 1-Propylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-Pentylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1,1-Dimethylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-Methyl-1-ethylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-Methyl-1-propylpiperidinium bis(pentafluoroethanesulfonyl)imide bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-butylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-pentylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-hexylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-heptylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl -1-propylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-butylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-pentylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-hexylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-heptylpiperidinium bis(pentafluoroethanesulfonyl)imide Imine, 1,1-dipropylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-propyl-1-butylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1,1-dibutylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-3-methylimidazolium trifluoroacetate, 1-ethyl-3-methylimidazolium heptafluorobutyrate, 1-ethyl-3-methylimidazolium 1-ethyl-3-methylimidazolium trifluoromethanesulfonate, 1-ethyl-3-methylimidazolium heptafluoropropanesulfonate, 1-ethyl-3-methylimidazolium nonafluorobutanesulfonate, 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide, 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide, 1-ethyl-3-methylimidazolium bis(pentafluoroethanesulfonyl)imide )imide, 1-ethyl-3-methylimidazolium tris(trifluoromethanesulfonyl) methylate, 1-butyl-3-methylimidazolium trifluoroacetate, 1-butyl-3-methylimidazolium heptafluorobutyrate, 1-butyl-3-methylimidazolium trifluoromethanesulfonate, 1-butyl-3-methylimidazolium perfluorobutanesulfonate, 1-butyl-3-methylimidazolium bis(trifluoromethanesulfonyl) sulfonate (Trifluoromethanesulfonyl)imide, 1-hexyl-3-methylimidazolium trifluoromethanesulfonate, 1-hexyl-3-methylimidazolium bis(fluorosulfonyl)imide, 1,2-dimethyl-3-propylimidazolium bis(trifluoromethanesulfonyl)imide, 1-ethyl-2,3,5-trimethylpyrazolium bis(trifluoromethanesulfonyl)imide, 1-propyl-2 ,3,5-trimethylpyrazolium bis(trifluoromethanesulfonyl)imide, 1-butyl-2,3,5-trimethylpyrazolium bis(trifluoromethanesulfonyl)imide, 1-ethyl-2,3,5-trimethylpyrazolium bis(pentafluoroethanesulfonyl)imide, 1-propyl-2,3,5-trimethylpyrazolium bis(pentafluoroethanesulfonyl)imide, 1-butyl -2,3,5-trimethylpyrazolium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-2,3,5-trimethylpyrazolium (trifluoromethanesulfonyl) trifluoroacetamide, 1-propyl-2,3,5-trimethylpyrazolium (trifluoromethanesulfonyl) trifluoroacetamide, 1-butyl-2,3,5-trimethylpyrazolium (trifluoromethanesulfonyl) trifluoroacetamide Amine, trimethylpropylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-ethyl-N-propylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-ethyl-n-butylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-ethyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-ethyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, Methyl-N-ethyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-ethyl-N-heptylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-ethyl-N-nonylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N,N-dipropylammonium bis(trifluoromethanesulfonyl)imide, N , N-dimethyl-N-propyl-n-butyl ammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-propyl-N-pentyl ammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-propyl-N-hexyl ammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-propyl-N-heptyl ammonium bis(trifluoromethanesulfonyl) Imides, N,N-dimethyl-n-butyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-n-butyl-N-heptylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-pentyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N,N-dihexylammonium bis(trifluoromethanesulfonyl)imide Ammonium bis(trifluoromethanesulfonyl)imide, trimethylheptylammonium bis(trifluoromethanesulfonyl)imide, N,N-diethyl-N-methyl-N-propylammonium bis(trifluoromethanesulfonyl)imide, N,N-diethyl-N-methyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, N,N-diethyl-N-methyl-N,N-heptylammonium bis(trifluoromethanesulfonyl)imide Imine, N,N-diethyl-N-propyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, triethylpropylammonium bis(trifluoromethanesulfonyl)imide, tripentylammonium bis(trifluoromethanesulfonyl)imide, triethylheptylammonium bis(trifluoromethanesulfonyl)imide, N,N-dipropyl-N-methyl-N-ethylammonium bis(trifluoromethanesulfonyl)imide Amine, N,N-dipropyl-N-methyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, N,N-dipropyl-n-butyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide, N,N-dipropyl-N,N-dihexylammonium bis(trifluoromethanesulfonyl)imide, N,N-dibutyl-N-methyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide )imide, N,N-dibutyl-N-methyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide, trioctylmethylammonium bis(trifluoromethanesulfonyl)imide, N-methyl-N-ethyl-N-propyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, 1-butylpyridinium (trifluoromethanesulfonyl) trifluoroacetamide, 1-butyl-3-methyl Pyridinium (trifluoromethanesulfonyl) trifluoroacetamide, 1-ethyl-3-methylimidazolium (trifluoromethanesulfonyl) trifluoroacetamide, tetrahexylammonium bis(trifluoromethanesulfonyl) imide, diallyldimethylammonium trifluoromethanesulfonate, diallyldimethylammonium bis(trifluoromethanesulfonyl) imide, diallyldimethylammonium bis(pentafluoroethanesulfonyl) imide, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium trifluoromethanesulfonate, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium bis(trifluoromethanesulfonyl)imide, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium bis(pentafluoroethanesulfonyl)imide, Glycidyltrimethylammonium trifluoromethanesulfonate Fluoromethanesulfonate, glycidyl trimethyl ammonium bis(trifluoromethanesulfonyl)imide, glycidyl trimethyl ammonium bis(pentafluoroethanesulfonyl)imide, diallyl dimethyl ammonium bis(trifluoromethanesulfonyl)imide, diallyl dimethyl bis(pentafluoroethanesulfonyl)imide, lithium bis(trifluoromethanesulfonyl)imide, lithium bis(fluorosulfonyl)imide, etc.

Among the ionic liquids, more preferred are 1-hexylpyridinium bis(fluorosulfonyl)imide, 1-ethyl-3-methylpyridinium trifluoromethanesulfonate, 1-ethyl-3-methylpyridinium pentafluoroethanesulfonate, 1-ethyl-3-methylpyridinium heptafluoropropanesulfonate, 1-ethyl-3-methylpyridinium nonafluorobutanesulfonate. , 1-butyl-3-methylpyridinium trifluoromethanesulfonate, 1-butyl-3-methylpyridinium bis(trifluoromethanesulfonyl)imide, 1-octyl-4-methylpyridinium bis(fluorosulfonyl)imide, 1-methyl-1-propylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-propylpyrrolidinium Bis(fluorosulfonyl)imide, 1-methyl-1-propylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-propylpiperidinium bis(fluorosulfonyl)imide, 1-ethyl-3-methylimidazolium trifluoromethanesulfonate, 1-ethyl-3-methylimidazolium heptafluoropropanesulfonate, 1-ethyl-3-methyl Imidazolium bis(trifluoromethanesulfonyl)imide, 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide, 1-hexyl-3-methylimidazolium bis(fluorosulfonyl)imide, trimethylpropylammonium bis(trifluoromethanesulfonyl)imide, lithium bis(trifluoromethanesulfonyl)imide, lithium bis(fluorosulfonyl)imide.

The ionic liquid may be a commercially available one or may be synthesized as described below. The method for synthesizing the ionic liquid is not particularly limited as long as the target ionic liquid can be obtained. Generally, the halogenide method, hydroxide method, acid ester method, complexation method, and neutralization method described in the document "Ionic Liquids - Frontiers and Future of Development -" (published by CMC Publishing Co., Ltd.) may be used.

In the following, the synthesis methods of the halogenide method, the hydroxide method, the acid ester method, the complex method and the neutralization method are described by taking nitrogen-containing onium salts as an example. Other ionic liquids such as sulfur-containing onium salts and phosphorus-containing onium salts can also be obtained by the same method.

The halogenide method is a method that is carried out by the reactions shown in reaction formulas (1) to (3). First, a tertiary amine is reacted with a halogenide to obtain a halide (reaction formula (1), using chlorine, bromine, or iodine as the halogen).

The obtained halogenide is reacted with an acid (HA) or a salt (MA, M is a cation such as ammonium, lithium, sodium, potassium, etc. that forms a salt with the target anion) having the anionic structure (A ^- ) of the target ionic liquid to obtain the target ionic liquid (R ₄ NA).

[Chemistry 2]

The hydroxide method is a method that proceeds through the reactions shown in reaction formulas (4) to (8). First, a halogenide (R ₄ NX) is electrolyzed by an ion exchange membrane method (reaction formula (4)), an OH-type ion exchange resin method (reaction formula (5)), or reacted with silver oxide (Ag ₂ O) (reaction formula (6)) to obtain a hydroxide (R ₄ NOH) (using chlorine, bromine, or iodine as the halogen).

The obtained hydroxide is subjected to the reactions of reaction formulas (7) to (8) in the same manner as the above-mentioned halogenation method to obtain the target ionic liquid (R ₄ NA).

[Chemistry 3]

The acid ester method is a method performed by the reactions shown in reaction formulas (9) to (11). First, a tertiary amine (R ₃ N) is reacted with an acid ester to obtain an acid ester (in reaction formula (9), an ester of an inorganic acid such as sulfuric acid, sulfurous acid, phosphoric acid, phosphorous acid, carbonic acid, or an ester of an organic acid such as methanesulfonic acid, methylphosphonic acid, formic acid, etc. is used as the acid ester).

The obtained acid ester is subjected to the reaction of reaction formulas (10) to (11) in the same manner as the above halogenation method to obtain the target ionic liquid (R ₄ NA). Alternatively, the ionic liquid can be directly obtained by using methyl trifluoromethanesulfonate, methyl trifluoroacetate, etc. as the acid ester.

[Chemistry 4]

The neutralization method is a method performed by the reaction shown in reaction formula (12). It can be obtained by reacting a tertiary amine with an organic acid such as CF ₃ COOH, CF ₃ SO ₃ H, (CF ₃ SO ₂ ) ₂ NH, (CF ₃ SO ₂ ) ₃ CH, or (C ₂ F ₅ SO ₂ ) ₂ NH.

[Chemistry 5]

In the above reaction formulas (1) to (12), R represents hydrogen or a carbon number of 1 to 20 carbon atoms, and may contain impurity atoms.

<A-1-4. Fluorine compounds> As the fluorine compound, any appropriate fluorine compound can be used within the scope that does not impair the effect of the present invention. By making the adhesive composition contain both the fluorine compound and the above-mentioned ionic compound in addition to the base polymer, a surface protective film that can fully suppress the peeling electrostatic voltage and does not damage the optical component or the electronic component during peeling can be provided. The surface protective film is typically a surface protective film including an adhesive layer, which is attached to the exposed surface of the optical component or the electronic component in the manufacturing step of the optical component or the electronic component in order to prevent the surface of the optical component or the electronic component from being damaged during processing, assembly, inspection, transportation, etc.

The fluorine-based compound may be present in one kind or in two or more kinds.

Examples of the fluorine-based compound include at least one selected from fluorine-containing compounds, hydroxyl-containing fluorine-based compounds, and crosslinkable functional group-containing fluorine-based compounds.

Examples of fluorine-containing compounds include compounds having a fluorine-containing aliphatic hydrocarbon skeleton, fluorine-containing organic compounds obtained by copolymerizing an organic compound with a fluorine-containing compound, and fluorine-containing compounds containing an organic compound. Examples of fluorine-containing aliphatic hydrocarbon skeletons include fluorine C1-C10 alkanes such as fluoromethane, fluoroethane, fluoropropane, fluoroisopropane, fluorobutane, fluoroisobutane, fluorotert-butane, fluoropentane, and fluorohexane.

A preferred embodiment of the fluorine-containing compound is an oligomer having a fluorine-containing group and a hydrophilic group and/or a lipophilic group ("specific fluorine-based compound"). By including (using together) both an ionic compound and the "specific fluorine-based compound" as described above, the effect of the present invention can be significantly manifested. The reason is presumed to be that, as described above, by allowing an ionic compound capable of exhibiting an antistatic effect to coexist with a fluorine-based compound (preferably a specific fluorine-based compound) in the adhesive composition, and by the synergistic effect with the fluorine-based compound (preferably a specific fluorine-based compound), the ionic compound is concentrated on the surface side of the adhesive layer (the side bonded to the adherend). Representative examples of the fluorine-containing group include fluorine-containing alkyl groups (e.g., CF ₃ -, etc.) and/or fluorine-containing alkylene groups (e.g., -CF ₂ -CF ₂ -, etc.). A hydrophilic group refers to a group having hydrophilicity. Hydrophilicity is translated into "hydrophilic" in English, which means "having affinity with water", and this is a property well known to those skilled in the art (e.g., see McGraw-Hill Dictionary of Scientific and Technical Terms (Revised 3rd Edition, Nikkan Kogyo Shimbun)). A lipophilic group refers to a group having lipophilicity. Lipophilicity is translated into "lipophilic" in English, which means "having affinity with oil", and this is a property well known to those skilled in the art (e.g., see McGraw-Hill Dictionary of Scientific and Technical Terms (Revised 3rd Edition, Nikkan Kogyo Shimbun)).

As the "specific fluorine-based compound", in terms of being able to better express the effect of the present invention, an oligomer containing a fluorine-containing group, a hydrophilic group and a lipophilic group is more preferred. If the "specific fluorine-based compound" does not contain a hydrophilic group or the "specific fluorine-based compound" does not contain a lipophilic group, there is a risk that the effect of the present invention cannot be fully expressed.

Regarding the preferred embodiment of the fluorine-containing compound, in terms of being able to better demonstrate the effect of the present invention, it is preferred that the surface tension of the fluorine-containing compound when prepared as a 0.1% toluene solution is 26.0 mN/m to 27.0 mN/m (the surface tension of toluene is 27.9 mN/m). Thus, if the surface tension of the fluorine-containing compound when prepared as a 0.1% toluene solution is within the extremely narrow specific range of 26.0 mN/m to 27.0 mN/m, the effect of the present invention can be better demonstrated, especially the unexpected significant effect of being able to fully suppress the peeling electrostatic voltage of both glass and resin. In particular, when the surface protection film in the preferred embodiment of the present invention is used for its intended purpose, i.e., to be bonded to the exposed surface of an optical component or an electronic component, it is extremely important to be able to fully suppress both the peeling electrostatic voltage of the glass and the peeling electrostatic voltage of the resin.

A particularly preferred embodiment of the fluorine-containing compound is an oligomer containing a fluorine-containing group, a hydrophilic group, and a lipophilic group, and when a 0.1% toluene solution is prepared, the surface tension is 26.0 mN/m to 27.0 mN/m (the surface tension of toluene is 27.9 mN/m). If a particularly preferred embodiment of the fluorine-containing compound is an oligomer containing a fluorine-containing group, a hydrophilic group, and a lipophilic group, and when a 0.1% toluene solution is prepared, the surface tension is 26.0 mN/m to 27.0 mN/m (the surface tension of toluene is 27.9 mN/m), the effect of the present invention can be more manifested, and in particular, the unexpected and extremely significant effect of being able to fully suppress the peeling electrostatic voltage of both glass and resin can be manifested. In particular, when the surface protection film in the preferred embodiment of the present invention is used for its intended purpose, i.e., to be bonded to the exposed surface of an optical component or an electronic component, it is extremely important to be able to fully suppress both the peeling electrostatic voltage of the glass and the peeling electrostatic voltage of the resin.

As commercially available products of fluorine-containing compounds, the following can be cited, for example.

MEGAFAC Series manufactured by DIC Corporation: Representatively, "MEGAFAC F-114", "MEGAFAC F-251", "MEGAFAC F-253", "MEGAFAC F-281", "MEGAFAC F-410", "MEGAFAC F-430", "MEGAFAC F -444", "MEGAFAC F-477", "MEGAFAC F-510", "MEGAFAC F-551-A", "MEGAFAC F-553", "MEGAFAC F-554", "MEGAFAC F-555-A", "MEGAFAC F-556", "MEGAFAC F-557", "MEGAFAC F-558" , "MEGAFAC F-559", "MEGAFAC F-560", "MEGAFAC F-561", "MEGAFAC F-562", "MEGAFAC F-563", "MEGAFAC F-565", "MEGAFAC F-568", "MEGAFAC F-569", "MEGAFAC F-570", "MEGAFAC F -576", "MEGAFAC R-01", "MEGAFAC R-40", "MEGAFAC R-40-LM", "MEGAFAC R-41", "MEGAFAC R-41-LM", "MEGAFAC R-94", "MEGAFAC RS-56", "MEGAFAC RS-72- K", "MEGAFAC RS-75-A", "MEGAFAC RS-75-NS", "MEGAFAC RS-78", "MEGAFAC RS-90", etc.

Surflon Series manufactured by AGC Seimei Chemical Co., Ltd.: Representatively, "S-242", "S-243", "S-386", etc.

FC Series manufactured by Sumitomo 3M Co., Ltd.: Representatively, "FC-4430", "FC-4432", etc.

FTERGENT Series manufactured by NEOS (stock): Representatively, "FTERGENT100", "FTERGENT100C", "FTERGENT110", "FTERGENT150", "FTERGENT150CH", "FTERGENT250", "FTERGENT400SW", etc.

PF Series manufactured by Kitamura Chemical Industry Co., Ltd.: Representatively, "PF-136A", "PF-156A", "PF-151N", "PF-636", "PF-6320", "PF-656", "PF-6520", "PF-651", "PF-652", "PF-3320", etc.

As the hydroxyl-containing fluorine-based compound, for example, a previously known resin can be used, for example, hydroxyl-containing fluorine resins described in International Publication No. 94/06870, Japanese Patent Laid-Open No. 8-12921, Japanese Patent Laid-Open No. 10-72569, Japanese Patent Laid-Open No. 4-275379, International Publication No. 97/11130, International Publication No. 96/26254, etc. As other hydroxyl-containing fluororesins, for example, fluoroolefin copolymers described in Japanese Patent Laid-Open No. 8-231919, Japanese Patent Laid-Open No. 10-265731, Japanese Patent Laid-Open No. 10-204374, Japanese Patent Laid-Open No. 8-12922, etc. In addition, copolymers of hydroxyl-containing compounds and compounds having fluorinated alkyl groups, fluorine-containing organic compounds obtained by copolymerization of hydroxyl-containing compounds and fluorine-containing compounds, and fluorine-containing compounds containing hydroxyl-containing organic compounds can also be cited. Examples of commercially available products of such fluorine-based compounds containing a hydroxyl group include the product called "Lumiflon" (manufactured by Asahi Glass Co., Ltd.), the product called "CEFRAL COAT" (manufactured by Chuo Glass Co., Ltd.), the product called "ZAFFLON" (manufactured by Toagosei Co., Ltd.), and the product called "ZEFFLE" (manufactured by Daikin Industries Co., Ltd.).

Examples of fluorine-based compounds containing crosslinkable functional groups include carboxylic acid compounds having a fluorinated alkyl group such as perfluorooctanoic acid, copolymers of a compound containing a crosslinkable functional group and a compound having a fluorinated alkyl group, fluorine-containing organic compounds obtained by copolymerizing a compound containing a crosslinkable functional group and a fluorine-containing compound, and fluorine-containing compounds containing a compound containing a crosslinkable functional group. Examples of commercially available products of such crosslinkable functional group-containing fluorine-based compounds include "MEGAFAC F-570," "MEGAFAC RS-55," "MEGAFAC RS-56," "MEGAFAC RS-72-K," "MEGAFAC RS-75," "MEGAFAC RS-76-E," "MEGAFAC RS-76-NS," "MEGAFAC RS-78," and "MEGAFAC RS-90" (manufactured by DIC Corporation).

Among the fluorine-containing compounds available in the form of commercial products, as the ones corresponding to the above-mentioned "oligomers having fluorine-containing groups and hydrophilic groups and/or lipophilic groups", representative examples include the following fluorine-containing compounds manufactured by DIC Co., Ltd.: "MEGAFAC F-477" (oligomers containing fluorine-containing groups, hydrophilic groups and lipophilic groups, surface tension = 26.4 mN/m when prepared as a 0.1% toluene solution); "MEGAFAC F-551-A" (oligomers containing fluorine-containing groups and lipophilic groups, surface tension = 25.6 mN/m when prepared as a 0.1% toluene solution); "MEGAFAC F-553" (oligomers containing fluorine-containing groups, hydrophilic groups and lipophilic groups, surface tension = 26.4 mN/m when prepared as a 0.1% toluene solution); "MEGAFAC F-554" (oligomer containing fluorine-containing groups and lipophilic groups, surface tension = 25.0 mN/m when prepared as a 0.1% toluene solution); "MEGAFAC F-555-A" (oligomer containing fluorine-containing groups, hydrophilic groups and lipophilic groups, surface tension = 20.4 mN/m when prepared as a 0.1% toluene solution); "MEGAFAC F-557" (oligomer containing fluorine-containing groups, hydrophilic groups and lipophilic groups, surface tension = 26.3 mN/m when prepared as a 0.1% toluene solution); "MEGAFAC F-559" (oligomer containing fluorine-containing groups, hydrophilic groups and lipophilic groups, surface tension = 26.1 mN/m when prepared as a 0.1% toluene solution); "MEGAFAC F-563" (oligomer containing fluorine and lipophilic groups, surface tension = 20.2 mN/m when made into 0.1% toluene solution); "MEGAFAC F-569" (oligomer containing fluorine and hydrophilic groups, surface tension = 19.7 mN/m when made into 0.1% toluene solution), etc.

Among the fluorinated compounds available in the form of commercial products, the ones corresponding to the above-mentioned "oligomers containing fluorinated groups, hydrophilic groups and lipophilic groups, the surface tension of which is 26.0 mN/m to 27.0 mN/m (the surface tension of toluene is 27.9 mN/m) when prepared as a 0.1% toluene solution, fluorinated compounds" are representatively listed as follows: "MEGAFAC F-477" (oligomers containing fluorinated groups, hydrophilic groups and lipophilic groups, the surface tension of which is 26.4 mN/m when prepared as a 0.1% toluene solution); "MEGAFAC F-553" (oligomers containing fluorinated groups, hydrophilic groups and lipophilic groups, the surface tension of which is 26.4 mN/m when prepared as a 0.1% toluene solution); "MEGAFAC F-557" (oligomer containing fluorine, hydrophilic and lipophilic groups, surface tension = 26.3 mN/m when made into 0.1% toluene solution); "MEGAFAC F-559" (oligomer containing fluorine, hydrophilic and lipophilic groups, surface tension = 26.1 mN/m when made into 0.1% toluene solution), etc.

<A-1-5. Other components> The adhesive composition may contain any other appropriate components within the scope that does not impair the effect of the present invention. Such other components include, for example: resin components, crosslinking promoters, crosslinking catalysts, silane coupling agents, silicone additives such as modified silicone oils, adhesive-imparting resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), anti-aging agents, inorganic fillers, organic fillers, etc. Fillers, metal powder, coloring agents (pigments or dyes, etc.), foils, UV absorbers, antioxidants, light stabilizers, chain transfer agents, plasticizers, softeners, conductive agents, stabilizers, surface lubricants, preservatives, heat-resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts, etc.

As other components in the adhesive composition, modified silicone oil may be included, typically within a range that does not impair the effects of the present invention. By including modified silicone oil in the adhesive composition, the antistatic effect can be exhibited. In particular, by using it in combination with an ionic liquid, the antistatic effect can be more effectively exhibited.

When the adhesive composition includes modified silicone oil, the content ratio of the modified silicone oil is preferably 0.001 to 50 parts by weight, more preferably 0.005 to 40 parts by weight, further preferably 0.007 to 30 parts by weight, particularly preferably 0.008 to 20 parts by weight, and most preferably 0.01 to 10 parts by weight relative to 100 parts by weight of the base polymer. By adjusting the content ratio of the modified silicone oil to the above range, the antistatic property effect can be more effectively exhibited.

As the modified silicone oil, any appropriate modified silicone oil can be used within the range that does not impair the effects of the present invention. As such a modified silicone oil, for example, a modified silicone oil available from Shin-Etsu Chemical Co., Ltd. can be cited.

As the modified silicone oil, polyether modified silicone oil is preferred. By using polyether modified silicone oil, the anti-static property effect can be more effectively exhibited.

Examples of polyether-modified silicone oils include side chain polyether-modified silicone oils, double-end polyether-modified silicone oils, etc. Among them, double-end polyether-modified silicone oils are preferred in terms of being able to fully and more effectively exhibit the effect of antistatic properties.

≪A-2. Base material layer≫ The base material layer may be only one layer or may be two or more layers. The base material layer may be an extended one.

The thickness of the substrate layer is preferably 4 μm to 450 μm, more preferably 8 μm to 400 μm, further preferably 12 μm to 350 μm, and particularly preferably 16 μm to 250 μm.

For the surface of the substrate layer not provided with the adhesive layer, for the purpose of forming a roll that is easily unwound, for example, a release treatment may be performed by adding fatty amide, polyethyleneimine, long-chain alkyl additives, etc. to the substrate layer, or a coating layer containing any appropriate stripping agent such as silicone, long-chain alkyl, fluorine, etc. may be provided.

As the material of the base layer, any appropriate material can be adopted according to the purpose. For example, plastic, paper, metal film, non-woven fabric, etc. are listed. Plastic is preferred. That is, the base layer is preferably a plastic film. The base layer can be composed of one material or two or more materials. For example, it can be composed of two or more plastics.

Examples of the above-mentioned plastics include polyester resins, polyamide resins, polyolefin resins, etc. Examples of polyester resins include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, etc. Examples of polyolefin resins include homopolymers of olefin monomers, copolymers of olefin monomers, etc. Examples of the polyolefin resin include homopolypropylene; block, random, graft, and other propylene copolymers using ethylene as a copolymer component; Reactor-TPO (thermoplastic polyolefin directly prepared by reactor); low-density, high-density, linear low-density, and ultra-low-density ethylene polymers; ethylene-propylene copolymers, ethylene-vinyl acetate copolymers, ethylene-methyl acrylate copolymers, ethylene-ethyl acrylate copolymers, ethylene-butyl acrylate copolymers, ethylene-methacrylic acid copolymers, ethylene-methyl methacrylate copolymers, and the like.

The substrate layer may contain any appropriate additives as required. Examples of additives that may be contained in the substrate layer include antioxidants, ultraviolet light absorbers, light stabilizers, antistatic agents, fillers, pigments, etc. The type and amount of additives that may be contained in the substrate layer may be appropriately set according to the purpose. In particular, when the material of the substrate layer is plastic, it is preferred to contain some of the above-mentioned additives in order to prevent deterioration. In order to improve weather resistance, etc., it is particularly preferred to list antioxidants, ultraviolet light absorbers, light stabilizers, and fillers as additives.

Any appropriate antioxidant may be used as the antioxidant. Examples of such antioxidants include phenolic antioxidants, phosphorus-based processing heat stabilizers, lactone-based processing heat stabilizers, sulfur-based heat stabilizers, phenol/phosphorus-based antioxidants, etc. The content of the antioxidant is preferably 1% by weight or less, more preferably 0.5% by weight or less, and further preferably 0.01% by weight to 0.2% by weight relative to the base resin of the base layer (when the base layer is a blend, the blend is the base resin).

Any appropriate ultraviolet absorber can be used as the ultraviolet absorber. Examples of such ultraviolet absorbers include benzotriazole ultraviolet absorbers, triazine ultraviolet absorbers, and benzophenone ultraviolet absorbers. The content of the ultraviolet absorber is preferably 2% by weight or less, more preferably 1% by weight or less, and further preferably 0.01% by weight to 0.5% by weight relative to the base resin forming the base layer (when the base layer is a blend, the blend is the base resin).

Any appropriate light stabilizer can be used as the light stabilizer. Examples of such light stabilizers include hindered amine light stabilizers and benzoate light stabilizers. The light stabilizer content is preferably 2% by weight or less, more preferably 1% by weight or less, and further preferably 0.01% by weight to 0.5% by weight relative to the base resin forming the base layer (when the base layer is a blend, the blend is the base resin).

Any appropriate filler can be used as the filler. Examples of such fillers include inorganic fillers. Specifically, examples of inorganic fillers include carbon black, titanium oxide, zinc oxide, etc. The content of the filler is preferably 20% by weight or less, more preferably 10% by weight or less, and further preferably 0.01% by weight to 10% by weight relative to the base resin forming the base layer (when the base layer is a blend, the blend is the base resin).

Furthermore, as additives, in order to impart antistatic properties, inorganic, low molecular weight and high molecular weight antistatic agents such as surfactants, inorganic salts, polyols, metal compounds and carbon are also preferred. In particular, in order to prevent contamination and maintain adhesion, high molecular weight antistatic agents or carbon are preferred.

≪≪B. Application≫≫ The surface protection film of the embodiment of the present invention can fully suppress the peeling electrostatic voltage and does not damage the optical component or the electronic component during peeling. Representatively, it is a surface protection film that is attached to the exposed surface of the optical component or the electronic component in order to prevent the surface of the optical component or the electronic component from being damaged during processing, assembly, inspection, transportation, etc. in the manufacturing step of the optical component or the electronic component, and includes an adhesive layer. Therefore, it is suitable for surface protection of optical components or electronic components. The optical component of the present invention is attached with the surface protection film of the present invention. The electronic component of the present invention is attached with the surface protection film of the present invention. [Example]

Hereinafter, the present invention will be specifically described using examples, but the present invention is not limited to these examples. Furthermore, the test and evaluation methods in the examples are as follows. Furthermore, when "parts" are recorded, they mean "parts by weight" unless otherwise specified, and when "%" is recorded, they mean "% by weight" unless otherwise specified.

<Measurement of the surface free energy of the adhesive layer surface to diiodomethane> The surface protective film of the peeled isolation member was cut into a size of 50 mm in width and 100 mm in length, and the adhesive layer surface was fixed on a contact angle meter (manufactured by Kyowa Interface Science Co., Ltd., model "CA-X") with the adhesive layer surface as the upper surface. 2.0 μL of water was dripped on the adhesive layer surface to measure the contact angle. Next, according to the same steps, 2.0 μL of diiodomethane was dripped and the contact angle was measured. Based on the contact angle values of the above two liquids, the surface free energy of the adhesive layer surface to diiodomethane was calculated using the Owens-Wendt method.

<Measurement of the peeling force from the glass plate (after standing at a temperature of 23°C for 30 minutes)> The adhesive layer side of the surface protective film (width 25 mm × length 140 mm) that had been peeled off the spacer was attached to a glass plate (sodium calcium glass, manufactured by Matsunami Glass Industries Co., Ltd.) by moving a 2 kg hand roller back and forth once, and then stood at an ambient temperature of 23°C for 30 minutes. The evaluation sample obtained in the above manner was measured using a tensile testing machine. As a tensile testing machine, a product named "Autograph AG-Xplus HS 6000 mm/min high-speed model (AG-50NX plus)" manufactured by Shimadzu Corporation was used. The evaluation sample was set in the tensile testing machine and the tensile test was started. Specifically, the load when the surface protective film is peeled off from the above-mentioned glass plate is measured, and the average load at this time is set as the peeling force of the surface protective film from the glass plate. The conditions of the tensile test are set as the test environment temperature: 23°C, the peeling angle: 180 degrees, and the peeling speed (tensile speed): 300 mm/minute.

<Determination of peeling electrostatic voltage on glass and acrylic resin plate> The surface protective film of the peeled isolator was cut into a size of 70 mm in width and 100 mm in length, and one end of the surface protective film was pressed onto the surface of glass (sodium calcium glass, manufactured by Matsunami Glass Industries Co., Ltd.) or acrylic resin plate (Acrylite, manufactured by Mitsubishi Chemical Co., Ltd.) using a hand roller so that one end of the surface protective film protruded 30 mm from the end of the glass. The sample was placed in an environment of 23℃×50%RH for 1 day, and then placed at a specified position on a sample fixing table with a height of 20 mm. The end of the surface protection film extending 30 mm from the glass is fixed to an automatic winder and peeled at a peeling angle of 150° and a peeling speed of 30 m/min. The potential on the surface of the adherend generated at this time is measured by a potential measuring device (manufactured by SHISHIDO Static Electric Co., Ltd., model "STATIRON DZ-4") fixed at a height of 30 mm from the center of the adherend, and is set as the peeling electrostatic voltage to the glass or the peeling electrostatic voltage to the acrylic resin plate. The measurement is carried out in an environment of 23°C and 50%RH.

<Measurement of residual adhesion to glass> The surface protection film was applied to the entire surface of a glass plate (Made by Matsunami Glass, 1.35 mm × 10 cm × 10 cm) using a hand roller, and stored at 23°C and 55%RH for 24 hours. The surface protection film was then peeled off at a speed of 0.3 m/min, and No.31B tape (Made by Nitto Denko, substrate thickness: 25 μm) was cut into 150 mm long and 19 mm wide by rolling a 2.0 kg roller back and forth once at 23°C and 55%RH. After curing for 30 minutes at a temperature of 23°C and a humidity of 55%RH, the adhesive strength was measured by peeling at a peeling angle of 180 degrees and a tensile speed of 300 mm/min using a tensile tester (manufactured by Shimadzu Corporation, "Autograph AG-Xplus HS 6000 mm/min High Speed Model (AG-50NX plus)"). In addition, the adhesive strength of the No.31B tape with a width of 19 mm was similarly measured for the glass plate that was not treated as described above, and the residual adhesion rate was calculated using the following formula. Residual adhesion rate (%) = (No.31B adhesion to glass plate after surface protection film peeling off / No.31B adhesion to glass plate) × 100 The residual adhesion rate to glass is an indicator of the extent to which the adhesive components of the surface protection film are transferred to the surface of the adherend and whether it causes contamination. The higher the residual adhesion rate of the glass, the lower the possibility of the surface protection film causing contamination to the adherend, and the lower the residual adhesion rate of the glass, the higher the possibility of the surface protection film causing contamination to the adherend.

<Measurement of haze> The adhesive solution obtained in the following examples and comparative examples was applied to the release-treated surface of a polyester film (trade name: DIAFOIL MRF75, manufactured by Mitsubishi Chemical Co., Ltd.) with a thickness of 75 μm and subjected to a silicone release treatment on one side under the conditions described in the following examples and comparative examples and dried to prepare an adhesive layer. Next, a polyester film (trade name: DIAFOIL MRE75, manufactured by Mitsubishi Chemical Co., Ltd.) with a thickness of 75 μm and subjected to a silicone release treatment on one side was applied to the surface of the adhesive layer in such a manner that the release-treated surface of the film became the adhesive layer side, and aged at room temperature for 5 days. Prepare two sheets of 50 mm × 50 mm thick paper with a 20 mm × 20 mm hole in the center. Use a hand roller to press back and forth once to stick the sample to one of the sheets of thick paper, and then stick the other sheet of thick paper. Use the "HM-150N" manufactured by Murakami Color Technology Laboratory to measure the evaluation sample obtained in the above manner.

<Description of fluorine-containing compounds used in the examples and comparative examples> As fluorine-containing compounds, the compounds used in the examples and comparative examples are as follows. "MEGAFAC F-477" (manufactured by DIC Co., Ltd., an oligomer containing a fluorine-containing group, a hydrophilic group, and a lipophilic group, when prepared as a 0.1% toluene solution, the surface tension = 26.4 mN/m); "MEGAFAC F-551-A" (manufactured by DIC Co., Ltd., an oligomer containing a fluorine-containing group and a lipophilic group, when prepared as a 0.1% toluene solution, the surface tension = 25.6 mN/m); "MEGAFAC F-553" (manufactured by DIC Co., Ltd., an oligomer containing a fluorine-containing group, a hydrophilic group, and a lipophilic group, when prepared as a 0.1% toluene solution, the surface tension = 26.4 mN/m); "MEGAFAC F-554" (manufactured by DIC Co., Ltd., an oligomer containing a fluorine group and a lipophilic group, the surface tension of which is 25.0 mN/m when prepared as a 0.1% toluene solution); "MEGAFAC F-555-A" (manufactured by DIC Co., Ltd., an oligomer containing a fluorine group, a hydrophilic group, and a lipophilic group, the surface tension of which is 20.4 mN/m when prepared as a 0.1% toluene solution); "MEGAFAC F-557" (manufactured by DIC Co., Ltd., an oligomer containing a fluorine group, a hydrophilic group, and a lipophilic group, the surface tension of which is 26.3 mN/m when prepared as a 0.1% toluene solution); "MEGAFAC F-559" (manufactured by DIC Co., Ltd., containing oligomers containing fluorine groups, hydrophilic groups and lipophilic groups, the surface tension of which is 26.1 mN/m when it is made into a 0.1% toluene solution); "MEGAFAC F-563" (manufactured by DIC Co., Ltd., containing oligomers containing fluorine groups and lipophilic groups, the surface tension of which is 20.2 mN/m when it is made into a 0.1% toluene solution); "MEGAFAC F-569" (manufactured by DIC Co., Ltd., containing oligomers containing fluorine groups and hydrophilic groups, the surface tension of which is 19.7 mN/m when it is made into a 0.1% toluene solution).

[Example 1] 85 parts by weight of PREMINOL S3011 (manufactured by Asahi Glass Co., Ltd., Mn=10000) as a polyol having three hydroxyl groups, 13 parts by weight of SANNIX GP3000 (manufactured by Sanyo Chemical Co., Ltd., Mn=3000) as a polyol having three hydroxyl groups, 2 parts by weight of SANNIX GP1000 (manufactured by Sanyo Chemical Co., Ltd., Mn=1000) as a polyol having three hydroxyl groups; 18 parts by weight of an isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) as a crosslinking agent; 0.02 parts by weight of iron triacetate (manufactured by Nippon Chemical Industry Co., Ltd.) as a catalyst, and 0.1 parts by weight of a fluorine-based oligomer of MEGAFAC F-553 (manufactured by DIC Corporation) 1 part by weight; 1-ethyl-3-methylimidazolium tri(fluoromethanesulfonyl)imide (AS110, manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) as an ionic compound 1 part by weight were diluted with ethyl acetate in such a manner that the total solid content became 35% by weight, thereby obtaining a urethane adhesive solution. Then, the urethane adhesive solution was applied to a substrate including a polyester resin (trade name "T100-75S", thickness 75 μm, manufactured by Mitsubishi Chemical Co., Ltd.) in such a manner that the thickness after drying became 20 μm, and was aged and dried at a drying temperature of 130°C and a drying time of 2 minutes. Next, a 25 μm thick release sheet containing a polyester resin and subjected to silicone treatment (trade name "MRF25", thickness 25 μm, manufactured by Mitsubishi Chemical Co., Ltd.) was attached to the surface of the obtained adhesive layer on the silicone-treated surface to obtain a surface protective film (1). Aging was performed at room temperature for 5 days and then an evaluation was performed. The release sheet was peeled off immediately before the evaluation. The results are shown in Table 1.

[Example 2] As shown in Table 1, the fluorine-based oligomer (trade name "F-569", manufactured by DIC) was changed to 0.25 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (2) was prepared in the same manner as in Example 1 to obtain a surface protective film (2). The results are shown in Table 1.

[Example 3] As shown in Table 1, except that the fluorine-based oligomer (trade name "F-554", manufactured by DIC) was changed to 1 part by weight in terms of solid content, an adhesive layer containing the adhesive composition (3) was prepared in the same manner as in Example 1, thereby obtaining a surface protective film (3). The results are shown in Table 1.

[Example 4] As shown in Table 1, the fluorine-based oligomer (trade name "F-553", manufactured by DIC) was changed to 0.25 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (4) was prepared in the same manner as in Example 1 to obtain a surface protective film (4). The results are shown in Table 1.

[Example 5] As shown in Table 1, the fluorine-based oligomer (trade name "F-553", manufactured by DIC) was changed to 0.25 parts by weight, and the ionic compound (trade name "AS110", manufactured by Daiichi Kogyo Seiyaku) was changed to 0.5 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (5) was prepared in the same manner as in Example 1, thereby obtaining a surface protective film (5). The results are shown in Table 1.

[Example 6] As shown in Table 1, the fluorine-based oligomer (trade name "F-553", manufactured by DIC) was changed to 0.25 parts by weight, and the ionic compound (trade name "AS110", manufactured by Daiichi Kogyo Seiyaku) was changed to 0.25 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (6) was prepared in the same manner as in Example 1, thereby obtaining a surface protective film (6). The results are shown in Table 1.

[Example 7] As shown in Table 1, the fluorine-based oligomer (trade name "F-555-A", manufactured by DIC) was changed to 0.25 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (7) was prepared in the same manner as in Example 1 to obtain a surface protective film (7). The results are shown in Table 1.

[Example 8] As shown in Table 1, the fluorine-based oligomer (trade name "F-559", manufactured by DIC) was changed to 0.25 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (8) was prepared in the same manner as in Example 1 to obtain a surface protective film (8). The results are shown in Table 1.

[Example 9] As shown in Table 1, the fluorine-based oligomer (trade name "F-477", manufactured by DIC) was changed to 1 part by weight in terms of solid content. An adhesive layer containing the adhesive composition (9) was prepared in the same manner as in Example 1 to obtain a surface protective film (9). The results are shown in Table 1.

[Example 10] As shown in Table 1, the fluorine-based oligomer (trade name "F-554", manufactured by DIC) was changed to 0.25 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (10) was prepared in the same manner as in Example 1 to obtain a surface protective film (10). The results are shown in Table 1.

[Example 11] As shown in Table 1, the fluorine-based oligomer (trade name "F-553", manufactured by DIC) was changed to 0.1 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (11) was prepared in the same manner as in Example 1 to obtain a surface protective film (11). The results are shown in Table 1.

[Example 12] As shown in Table 1, the fluorine-based oligomer (trade name "F-477", manufactured by DIC) was changed to 0.25 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (12) was prepared in the same manner as in Example 1 to obtain a surface protective film (12). The results are shown in Table 1.

[Example 13] As shown in Table 1, the fluorine-based oligomer (trade name "F-477", manufactured by DIC) was changed to 0.25 parts by weight, and the ionic compound (trade name "AS110", manufactured by Daiichi Kogyo Seiyaku) was changed to 0.5 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (13) was prepared in the same manner as in Example 1, thereby obtaining a surface protective film (13). The results are shown in Table 1.

[Example 14] As shown in Table 1, the fluorine-based oligomer (trade name "F-477", manufactured by DIC) was changed to 0.25 parts by weight, and the ionic compound (trade name "AS110", manufactured by Daiichi Kogyo Seiyaku) was changed to 0.25 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (14) was prepared in the same manner as in Example 1, thereby obtaining a surface protective film (14). The results are shown in Table 1.

[Example 15] As shown in Table 1, except that the fluorine-based oligomer (trade name "F-551-A", manufactured by DIC) was changed to 1 part by weight in terms of solid content, an adhesive layer containing the adhesive composition (15) was prepared in the same manner as in Example 1, thereby obtaining a surface protective film (15). The results are shown in Table 1.

[Example 16] As shown in Table 1, the fluorine-based oligomer (trade name "F-556", manufactured by DIC) was changed to 0.25 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (16) was prepared in the same manner as in Example 1 to obtain a surface protective film (16). The results are shown in Table 1.

[Example 17] As shown in Table 1, the fluorine-based oligomer (trade name "F-551-A", manufactured by DIC) was changed to 0.25 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (17) was prepared in the same manner as in Example 1 to obtain a surface protective film (17). The results are shown in Table 1.

[Example 18] As shown in Table 1, except that the fluorine-based oligomer (trade name "F-554", manufactured by DIC) was changed to 0.1 parts by weight in terms of solid content, an adhesive layer containing the adhesive composition (18) was prepared in the same manner as in Example 1, thereby obtaining a surface protective film (18). The results are shown in Table 1.

[Example 19] As shown in Table 1, the fluorine-based oligomer (trade name "F-563", manufactured by DIC) was changed to 0.25 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (19) was prepared in the same manner as in Example 1 to obtain a surface protective film (19). The results are shown in Table 1.

[Example 20] As shown in Table 1, the fluorine-based oligomer (trade name "F-477", manufactured by DIC) was changed to 0.1 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (20) was prepared in the same manner as in Example 1 to obtain a surface protective film (20). The results are shown in Table 1.

[Example 21] As shown in Table 1, the fluorine-based oligomer (trade name "F-553", manufactured by DIC) was changed to 2.0 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (21) was prepared in the same manner as in Example 1 to obtain a surface protective film (21). The results are shown in Table 1.

[Example 22] As shown in Table 1, the fluorine-based oligomer (trade name "F-553", manufactured by DIC) was changed to 4.0 parts by weight in terms of solid content. In addition, an adhesive layer containing the adhesive composition (22) was prepared in the same manner as in Example 1 to obtain a surface protective film (22). The results are shown in Table 1.

[Example 23] As shown in Table 1, the fluorine-based oligomer (trade name "F-553", manufactured by DIC) was changed to 6.0 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (23) was prepared in the same manner as in Example 1 to obtain a surface protective film (23). The results are shown in Table 1.

[Example 24] As shown in Table 1, the fluorine-based oligomer (trade name "F-477", manufactured by DIC) was changed to 2.0 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (24) was prepared in the same manner as in Example 1 to obtain a surface protective film (24). The results are shown in Table 1.

[Example 25] As shown in Table 1, the fluorine-based oligomer (trade name "F-477", manufactured by DIC) was changed to 4.0 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (25) was prepared in the same manner as in Example 1 to obtain a surface protective film (25). The results are shown in Table 1.

[Example 26] As shown in Table 1, the fluorine-based oligomer (trade name "F-477", manufactured by DIC) was changed to 6.0 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (26) was prepared in the same manner as in Example 1 to obtain a surface protective film (26). The results are shown in Table 1.

[Example 27] As shown in Table 1, an adhesive layer containing an adhesive composition (27) was prepared in the same manner as in Example 4 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 15.9 parts by weight in terms of solid content, thereby obtaining a surface protective film (27). The results are shown in Table 1.

[Example 28] As shown in Table 1, an adhesive layer containing an adhesive composition (28) was prepared in the same manner as in Example 4 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 14.1 parts by weight in terms of solid content, thereby obtaining a surface protective film (28). The results are shown in Table 1.

[Example 29] As shown in Table 1, an adhesive layer containing an adhesive composition (29) was prepared in the same manner as in Example 4 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 12.4 parts by weight in terms of solid content, thereby obtaining a surface protective film (29). The results are shown in Table 1.

[Example 30] As shown in Table 1, an adhesive layer containing an adhesive composition (30) was prepared in the same manner as in Example 4 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 10.6 parts by weight in terms of solid content, thereby obtaining a surface protective film (30). The results are shown in Table 1.

[Example 31] As shown in Table 1, an adhesive layer containing an adhesive composition (31) was prepared in the same manner as in Example 4 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 8.8 parts by weight in terms of solid content, thereby obtaining a surface protective film (31). The results are shown in Table 1.

[Example 32] As shown in Table 1, an adhesive layer containing an adhesive composition (32) was prepared in the same manner as in Example 12 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 15.9 parts by weight in terms of solid content, thereby obtaining a surface protective film (32). The results are shown in Table 1.

[Example 33] As shown in Table 1, an adhesive layer containing an adhesive composition (33) was prepared in the same manner as in Example 12 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 14.1 parts by weight in terms of solid content, thereby obtaining a surface protective film (33). The results are shown in Table 1.

[Example 34] As shown in Table 1, an adhesive layer containing an adhesive composition (34) was prepared in the same manner as in Example 12, except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 12.4 parts by weight in terms of solid content, thereby obtaining a surface protective film (34). The results are shown in Table 1.

[Example 35] As shown in Table 1, an adhesive layer containing an adhesive composition (35) was prepared in the same manner as in Example 12 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 10.6 parts by weight in terms of solid content, thereby obtaining a surface protective film (35). The results are shown in Table 1.

[Example 36] As shown in Table 1, an adhesive layer containing an adhesive composition (36) was prepared in the same manner as in Example 12 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 8.8 parts by weight in terms of solid content, thereby obtaining a surface protective film (36). The results are shown in Table 1.

[Example 37] As shown in Table 1, the fluorine-based oligomer (trade name "F-557", manufactured by DIC) was changed to 0.25 parts by weight in terms of solid content. In addition, an adhesive layer containing the adhesive composition (37) was prepared in the same manner as in Example 4 to obtain a surface protective film (37). The results are shown in Table 1.

[Example 38] As shown in Table 1, an adhesive layer containing an adhesive composition (38) was prepared in the same manner as in Example 37 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 15.9 parts by weight in terms of solid content, thereby obtaining a surface protective film (38). The results are shown in Table 1.

[Example 39] As shown in Table 1, an adhesive layer containing an adhesive composition (39) was prepared in the same manner as in Example 37, except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 14.1 parts by weight in terms of solid content, thereby obtaining a surface protective film (39). The results are shown in Table 1.

[Example 40] As shown in Table 1, an adhesive layer containing an adhesive composition (40) was prepared in the same manner as in Example 37 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 12.4 parts by weight in terms of solid content, thereby obtaining a surface protective film (40). The results are shown in Table 1.

[Example 41] As shown in Table 1, an adhesive layer containing an adhesive composition (41) was prepared in the same manner as in Example 37 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 10.6 parts by weight in terms of solid content, thereby obtaining a surface protective film (41). The results are shown in Table 1.

[Example 42] As shown in Table 1, an adhesive layer containing an adhesive composition (42) was prepared in the same manner as in Example 37 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 8.8 parts by weight in terms of solid content, thereby obtaining a surface protective film (42). The results are shown in Table 1.

[Example 43] As shown in Table 1, the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 15.9 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (43) was prepared in the same manner as in Example 8 to obtain a surface protective film (43). The results are shown in Table 1.

[Example 44] As shown in Table 1, an adhesive layer containing an adhesive composition (44) was prepared in the same manner as in Example 8 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 14.1 parts by weight in terms of solid content, thereby obtaining a surface protective film (44). The results are shown in Table 1.

[Example 45] As shown in Table 1, an adhesive layer containing an adhesive composition (45) was prepared in the same manner as in Example 8 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 12.4 parts by weight in terms of solid content, thereby obtaining a surface protective film (45). The results are shown in Table 1.

[Example 46] As shown in Table 1, an adhesive layer containing an adhesive composition (46) was prepared in the same manner as in Example 8 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 10.6 parts by weight in terms of solid content, thereby obtaining a surface protective film (46). The results are shown in Table 1.

[Example 47] As shown in Table 1, an adhesive layer containing an adhesive composition (47) was prepared in the same manner as in Example 8 except that the isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 8.8 parts by weight in terms of solid content, thereby obtaining a surface protective film (47). The results are shown in Table 1.

[Example 48] 100 parts by weight of urethane prepolymer A, 3 parts by weight of isocyanate compound (Coronate HX: C/HX, manufactured by Nippon Polyurethane Co., Ltd.) as a crosslinking agent, 0.5 parts by weight of Irganox 1010 (manufactured by BASF) as an antioxidant, 1 part by weight of MEGAFAC F-553 (manufactured by DIC) as a fluorine-based oligomer, and 1 part by weight of 1-ethyl-3-methylimidazolium tri(fluoromethanesulfonyl)imide (AS110, manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) as an ionic compound were diluted with ethyl acetate so that the total solid content was 49% by weight, thereby obtaining a urethane adhesive solution. Then, the urethane adhesive solution was applied to a substrate containing a polyester resin (trade name "T100-75S", thickness 75 μm, manufactured by Mitsubishi Chemical Co., Ltd.) in a manner to have a thickness of 75 μm after drying, and was aged and dried at a drying temperature of 120°C and a drying time of 3 minutes to prepare an adhesive layer containing an adhesive composition (48). Subsequently, a silicone-treated surface of a release sheet containing a polyester resin (trade name "MRF25", thickness 25 μm, manufactured by Mitsubishi Chemical Co., Ltd.) with a thickness of 25 μm and a silicone treatment was attached to the surface of the obtained adhesive layer to obtain a surface protective film (48). The samples were aged for 5 days at room temperature and then evaluated. The peeled sheets were peeled just before the evaluation. The results are shown in Table 1.

[Example 49] As shown in Table 1, except that the fluorine-based oligomer (trade name "F-477", manufactured by DIC) was changed to 1.0 parts by weight in terms of solid content, an adhesive layer containing the adhesive composition (49) was prepared in the same manner as in Example 48 to obtain a surface protective film (49). The results are shown in Table 1.

[Example 50] As shown in Table 1, the fluorine-based oligomer (trade name "F-557", manufactured by DIC) was changed to 1.0 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (50) was prepared in the same manner as in Example 48 to obtain a surface protective film (50). The results are shown in Table 1.

[Example 51] As shown in Table 1, the fluorine-based oligomer (trade name "F-559", manufactured by DIC) was changed to 1.0 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (51) was prepared in the same manner as in Example 48 to obtain a surface protective film (51). The results are shown in Table 1.

[Comparative Example 1] As shown in Table 1, the fluorine-based oligomer (trade name "F-569", manufactured by DIC) was calculated as 0.25 parts by weight in terms of solid content, and no ionic compound (trade name "AS110", manufactured by Daiichi Kogyo Seiyaku) was used. In addition, an adhesive layer containing the adhesive composition (C1) was prepared in the same manner as in Example 1 to obtain a surface protective film (C1). The results are shown in Table 1.

[Comparative Example 2] As shown in Table 1, the fluorine-based oligomer (trade name "F-553", manufactured by DIC) was calculated as 0.25 parts by weight in terms of solid content, and no ionic compound (trade name "AS110", manufactured by Daiichi Kogyo Seiyaku) was used. In addition, an adhesive layer containing the adhesive composition (C2) was prepared in the same manner as in Example 1 to obtain a surface protective film (C2). The results are shown in Table 1.

[Comparative Example 3] As shown in Table 1, the fluorine-based oligomer (trade name "F-477", manufactured by DIC) was calculated as 0.25 parts by weight in terms of solid content, and no ionic compound (trade name "AS110", manufactured by Daiichi Kogyo Seiyaku) was used. In addition, an adhesive layer containing the adhesive composition (C3) was prepared in the same manner as in Example 1 to obtain a surface protective film (C3). The results are shown in Table 1.

[Comparative Example 4] As shown in Table 1, the fluorine-based oligomer (trade name "F-551-A", manufactured by DIC) was calculated as 0.25 parts by weight in terms of solid content, and no ionic compound (trade name "AS110", manufactured by Daiichi Kogyo Seiyaku) was used. In addition, an adhesive layer containing the adhesive composition (C4) was prepared in the same manner as in Example 1 to obtain a surface protective film (C4). The results are shown in Table 1.

[Comparative Example 5] As shown in Table 1, the fluorine-based oligomer (trade name "F-571", manufactured by DIC) was changed to 0.25 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (C5) was prepared in the same manner as in Example 1 to obtain a surface protective film (C5). The results are shown in Table 1.

[Comparative Example 6] As shown in Table 1, the fluorine-based oligomer (trade name "F-552", manufactured by DIC) was changed to 0.25 parts by weight in terms of solid content. An adhesive layer containing the adhesive composition (C6) was prepared in the same manner as in Example 1 to obtain a surface protective film (C6). The results are shown in Table 1.

[Comparative Example 7] As shown in Table 1, an adhesive layer containing an adhesive composition (C7) was prepared in the same manner as in Example 1 except that a fluorine-based oligomer was not used, thereby obtaining a surface protective film (C7). The results are shown in Table 1.

[Comparative Example 8] As shown in Table 1, an adhesive layer containing an adhesive composition (C8) was prepared in the same manner as in Example 1 except that no fluorine-based oligomer and no ionic compound (trade name "AS110", manufactured by Daiichi Kogyo Seiyaku) were used, thereby obtaining a surface protective film (C8). The results are shown in Table 1.

[Comparative Example 9] As shown in Table 1, an adhesive layer containing an adhesive composition (C9) was prepared in the same manner as in Example 48 except that no fluorine-based oligomer and no ionic compound (trade name "AS110", manufactured by Daiichi Kogyo Seiyaku) were used, thereby obtaining a surface protective film (C9). The results are shown in Table 1.

[Comparative Example 10] As shown in Table 1, an adhesive layer containing an adhesive composition (C10) was prepared in the same manner as in Example 49 except that no fluorine-based oligomer and no ionic compound (trade name "AS110", manufactured by Daiichi Kogyo Seiyaku) were used, thereby obtaining a surface protective film (C10). The results are shown in Table 1.

[Comparative Example 11] As shown in Table 1, except that the fluorine-based oligomer (trade name "F-571", manufactured by DIC) was changed to 1 part by weight in terms of solid content, an adhesive layer containing the adhesive composition (C11) was prepared in the same manner as in Example 48 to obtain a surface protective film (C11). The results are shown in Table 1.

[Table 1]

[Examples 52 to 103] For each of the surface protection films (1) to (51) obtained by using Examples 1 to 51, the spacer is peeled off and the adhesive layer side is bonded to a polarizing plate (a product named "TEG1465DUHC" manufactured by Nitto Denko Co., Ltd.) as an optical component, thereby obtaining an optical component bonded with a surface protection film.

[Examples 104 to 155] For each of the surface protection films (1) to (51) obtained by using Examples 1 to 51, the isolating member is peeled off and the adhesive layer side is bonded to a conductive film (a product named "ELECRYSTA V270L-TFMP" manufactured by Nitto Denko Co., Ltd.) as an electronic component, thereby obtaining an electronic component bonded with a surface protection film. [Industrial Applicability]

The surface protection film of the present invention can be used for any appropriate purpose. Preferably, the surface protection film of the present invention can be used in the field of optical components or electronic components.

1: Base material layer 2: Adhesive layer 10: Surface protective film

FIG. 1 is a schematic cross-sectional view of a surface protection film according to an embodiment of the present invention.

1: Base material layer

2: Adhesive layer

10: Surface protection film

Claims (5)

A surface protection film comprises an adhesive layer, wherein the adhesive constituting the adhesive layer is formed of an adhesive composition, wherein the adhesive composition comprises at least one selected from polyols and urethane prepolymers, a multifunctional isocyanate, an ionic compound and a fluorine compound, wherein the content ratio of the fluorine compound relative to 100 parts by weight of the at least one selected from polyols and urethane prepolymers is 0.05 parts by weight to 1.5 parts by weight, and the surface free energy of the adhesive layer surface to diiodomethane is 6mJ/m ² to 30mJ/m ² . As in claim 1, the surface protection film, wherein the content ratio of the above-mentioned ionic compound relative to 100 parts by weight of at least one selected from the above-mentioned polyol and urethane prepolymer is 0.2 parts by weight or more. For example, the surface protection film of claim 1 or 2, wherein the adhesive layer contained in the surface protection film is attached to a glass plate and placed at a temperature of 23°C for 30 minutes, and then the surface protection film is peeled off from the glass plate at a temperature of 23°C at a peeling angle of 180 degrees and a peeling speed of 300 mm/minute, and the peeling force is 0.005N/25mm~0.1N/25mm. An optical component having a surface protective film as described in any one of claims 1 to 3 attached thereto. An electronic component having a surface protection film as described in any one of claims 1 to 3 attached thereto.

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