TWI859351B - Adhesive film sticking device - Google Patents

Abstract

[Topic] In the adhesive film laminating device, a circular adhesive film is attached to a ring frame and a wafer in a way that does not generate wrinkles or bubbles. [Solution] A film pasting device includes: a holding table having an annular frame holding portion and a wafer holding portion in an opening of the frame; a peel plate, which is between a unit for outputting a film unit and a unit for winding a sheet from which the film has been peeled, and which bends the film unit and peels the film from the sheet; a film pasting roller; and a nozzle, which sprays air toward the pasting roller from an outer side than an outer periphery of an annular frame held by the annular frame holding portion in a direction orthogonal to a rotation axis of the film pasting roller.

Description

Adhesive film sticking device

The present invention relates to an adhesive film pasting device, which pastes the adhesive film on a ring frame and a wafer.

For example, as disclosed in Patent Document 1, there is a film pasting device that pastes a circular film (e.g., a cutting film) on a ring-shaped frame having a circular opening to plug the opening, and pastes a wafer on the film exposed from the opening, thereby integrating the ring-shaped frame and the wafer through the film.

In the above-mentioned adhesive film sticking device, an adhesive film unit is used, which is a device that arranges and sticks circular adhesive films at equal intervals in the longitudinal direction of a strip-shaped protective sheet (hereinafter referred to as a sheet) to form an integrated structure. The adhesive film unit is wound into a roll shape on a reel in such a way that the circular adhesive film is arranged on the inner side. Next, when the roll on which the rolled adhesive film unit is wound is passed through a shaft provided in the adhesive film pasting device, a sheet is gripped from one end of the outer periphery of the rolled adhesive film unit and pulled out, and a peel plate is pressed from the sheet side of the adhesive film unit to bend the sheet, thereby peeling one end of the adhesive film from the sheet.

Next, one end of the circular adhesive film peeled off from the sheet is positioned on the annular frame, and the adhesive film is pushed against the annular frame by a rotating roller, thereby adhering one end of the adhesive film to the annular frame. Furthermore, the sheet is peeled off while the adhesive film is pushed against the roller, and is adhered to the upper surface of the wafer and the upper surface of the annular frame. [Known technical literature] [Patent literature]

Patent document 1: Japanese Patent Application Publication No. 2011-086687

[Problems to be solved by the invention] As described above, in order to peel the adhesive film from the sheet while performing the pasting, a gap is provided between the peeling plate and the roller. Furthermore, after the adhesive film is pasted to the wafer and the ring frame, the adhesive film separated from the sheet by its own weight will adhere to the ring frame by its own weight, and then the roller will push the adhesive film against the ring frame. Therefore, the adhesive film will adhere to the ring frame in a wrinkled state, or bubbles will be generated between the adhesive film and the ring frame.

If there are wrinkles or bubbles in the adhesive film attached to the ring frame, the adhesive force is weak, and when the adhesive film is expanded and the wafers are divided, the adhesive film may not be fully expanded. In addition, this may cause the chips to contact each other and cause chip breakage, or the adhesive film may be peeled off from the ring frame.

Therefore, the object of the present invention is to provide an adhesive film pasting device, which can paste a circular adhesive film on a ring frame and a wafer in a manner without generating wrinkles and bubbles.

[Technical means for solving the problem] According to one aspect of the present invention, a kind of adhesive film pasting device is provided, which pastes the adhesive film peeled off from the thin sheet in the strip-shaped adhesive film unit to the ring-shaped frame and the wafer arranged at the opening of the ring-shaped frame, and integrates the ring-shaped frame and the wafer by the adhesive film. The strip-shaped adhesive film unit is arranged in the length direction of the strip-shaped thin sheet. The adhesive film pasting device comprises: a holding table having an annular frame holding part for holding the annular frame and a wafer holding part for holding the wafer in the opening of the annular frame; an output unit for outputting the adhesive film unit while rotating; a winding unit for rotating and winding the thin sheet from which the adhesive film has been peeled off; and a peeling plate. , which contacts the sheet between the output unit and the winding unit, bends the adhesive film unit in a manner that the sheet becomes the inner side, and peels the adhesive film from the sheet; a pasting roller, which pushes one side of the adhesive film that has been peeled off from the sheet against the annular frame and the wafer side for pasting; and a spray nozzle, which sprays the adhesive film in a direction orthogonal to the rotation axis of the pasting roller. The air is sprayed toward the sticking roller from the outer side than the outer periphery of the annular frame held by the annular frame holding portion. The adhesive film sticking device pushes the adhesive film that is peeled off from the sheet and is about to fall against the side surface of the sticking roller by the air sprayed from the spray nozzle, and at the same time rotates the sticking roller to stick the adhesive film to the annular frame and the wafer.

The spray nozzle preferably sprays air along the upper surface of the annular frame held by the annular frame holding portion.

The spray angle of the air sprayed from the spray nozzle is preferably within a range of 0 degrees to 45 degrees upward when the direction parallel to the upper surface of the annular frame is set to 0 degrees.

[Effect of the invention] The adhesive film pasting device of the present invention is equipped with a spray nozzle, and the spray nozzle sprays air toward the pasting roller from the outer side of the annular frame held by the annular frame holding part in a direction orthogonal to the rotation axis of the pasting roller, so that the adhesive film that is peeled off from the sheet and is about to fall can be pushed against the side surface of the pasting roller by the air sprayed from the spray nozzle, while the pasting roller is rotated, so that the adhesive film can be pasted to the annular frame and the wafer. In this way, the adhesive film can be pasted to the annular frame and the wafer in a manner that does not generate wrinkles or bubbles. Therefore, when the film is expanded and the wafer is separated, it is possible to prevent adjacent separated chips from contacting each other and prevent chip breakage.

In the case where the spray nozzle sprays air along the upper surface of the annular frame held by the annular frame holding portion, the adhesive film can be more surely pushed against the side surface of the laminating roller by the air.

When the direction parallel to the upper surface of the annular frame is set to 0 degrees, and the spray angle of the air sprayed from the spray nozzle is set to within the range of 0 degrees to 45 degrees upward, the adhesive film can be pushed against the side of the laminating roller more reliably by the air.

The adhesive film unit TU shown in FIG1 is, for example, a structure in which a strip-shaped adhesive film T5 and a strip-shaped protective sheet T1 are bonded together. The strip-shaped adhesive film T5 is composed of a base material T51 composed of a polyolefin resin or the like and an adhesive layer T52 formed on one side of the base material T51. The protective sheet T1 is a protective adhesive layer T52 (hereinafter referred to as sheet T1). The tape-shaped adhesive film T5 shown in the present embodiment is pre-cut into a plurality of circular shapes in accordance with the opening diameter of the annular frame F (see FIG. 2 ) to be pasted, and a plurality of circular adhesive films T2 corresponding to the circular shape of the wafer W are pasted to the thin film T1 at equal intervals in the length direction of the thin film T1 (the X-axis direction in FIG. 1 ). As shown in FIG. 1 , the above-mentioned adhesive film unit TU is in the form of a rolled adhesive film rolled up on a cylinder T3 with the adhesive film T2 as the inner side. In addition, the diameter of the adhesive film T2 is larger than the inner diameter of the circular opening of the annular frame F (see FIG. 2 ) and smaller than the outer diameter of the annular frame F.

The adhesive film sticking device 1 of the present invention shown in FIG. 2 has a base 10, which can form a workpiece assembly in which a ring frame F and a wafer W are integrated by a circular adhesive film T2. The base 10 is provided with the constituent elements of the invention described below and has a longitudinal direction in the X-axis direction.

As shown in FIG. 2 , the annular frame F is made of a predetermined metal (such as SUS) and is in the shape of an annular flat plate, and has a circular opening whose inner diameter is larger than the outer diameter of the wafer W. In addition, for example, a portion of the outer periphery of the annular frame F is cut flat, thereby having a pair of first flat surfaces and a pair of second flat surfaces facing each other in parallel, and the pair of first flat surfaces and the pair of second flat surfaces are used for positioning the annular frame F.

Wafer W is, for example, a circular semiconductor wafer made of a silicon mother material, etc. In FIG. 2 , the front surface Wa (lower surface Wa) of wafer W facing downward is formed with a plurality of components in a grid-shaped area, and is protected by a protective adhesive film not shown in the figure. The back surface Wb (upper surface Wb) of wafer W becomes the surface to which the adhesive film T2 is attached. In addition, wafer W may be made of gallium arsenide, sapphire, gallium nitride, ceramic, resin or silicon carbide, etc., in addition to silicon, and may also be a rectangular packaging substrate, etc.

The upper surface of the base 10 of the adhesive film pasting device 1 is a horizontal plane, and an output unit 80 is arranged above the rear side (+X direction side) of the base 10, and the output unit 80 outputs the adhesive film unit TU while rotating. The output unit 80 supports the adhesive film unit TU rotatably in a state where the rotating shaft is inserted into the cylinder T3 of the rolled adhesive film unit TU shown in FIG. 1, and the axial direction of the rotating shaft is the Y-axis direction orthogonal to the X-axis direction in the horizontal plane. As the rotating shaft rotates, the rolled adhesive film unit TU rotates, and the adhesive film unit TU becomes a strip and is output to the peeling plate 15. In addition, between the peeling plate 15 and the output unit 80, a clamping roller (not shown) is provided to prevent the adhesive film unit TU from loosening.

A winding unit 82 is provided at a position below and behind the output unit 80. The winding unit 82 winds up the sheet T1 from which the rubber film T2 has been peeled while rotating it. A peeling plate 15 is provided at a position obliquely below and in front of the output unit 80. The peeling plate 15 contacts the sheet T1 between the output unit 80 and the winding unit 82, bends the rubber film unit TU with the sheet T1 as the inner side, and peels the rubber film T2 from the sheet T1.

The peeling plate 15 is, for example, an inclined plate that is in a triangular shape when viewed from the Y-axis direction, and extends in the Y-axis direction by a length greater than the width of the sheet T1 (the length in the Y-axis direction). In order not to damage the film unit TU, the front end of the peeling plate 15 may be curled into an R shape. As shown in FIGS. 3 and 4 , the peeling plate 15 can use its front end to press the sheet T1 and bend it into a sharp angle, thereby peeling the film T2 from the sheet T1.

For example, as shown in FIG. 5 , the peeling plate 15 is disposed on a plate base 160 extending obliquely upward and facing the sticking roller 30 through a plate movable member 161. The sticking roller 30 pushes the adhesive film T2 that has been peeled off from the sheet T1 against the annular frame F and the wafer W while sticking. The plate movable member 161 enables the plate base 160 to move back and forth in an oblique vertical direction by a ball screw mechanism (not shown), thereby positioning the peeling plate 15 at an appropriate position relative to the adhesive film unit TU. In addition, in FIGS. 2 to 4 , the plate base 160 and the plate movable member 161 that enable the peeling plate 15 to move are omitted.

As shown in FIG2 , the sheet T1 from which the rubber film T2 has been peeled off is sent to the rear (+X direction) of the peeling plate 15 by the peeling plate 15. Then, the sheet T1 is rolled into a roll by the winding unit 82, which is rotated by a rotation drive source such as a motor and uses a rotation axis in the Y-axis direction as an axis. The rotation drive source of the winding unit 82 controls the speed of pulling the sheet T1 out of the rolled rubber film unit TU, for example, by torque control. In addition, a sheet support roller 820 is provided between the winding unit 82 and the peeling plate 15, and the sheet support roller 820 prevents the sheet T1 from being peeled off the rubber film T2 from being loosened.

As shown in FIG. 2 , the adhesive film pasting device 1 comprises: a holding table (holding means) 2, which is composed of an annular frame holding portion 20 for holding the annular frame F, and a wafer holding portion 21 for holding the wafer W in the opening of the annular frame F; and a pasting roller 30, which pushes the adhesive film T2 peeled off from the sheet T1 against the annular frame F and the wafer W while pasting.

The annular frame holding part 20 shown in Figures 2 and 3 is formed, for example, in a square shape when viewed from above, and a wafer holding part 21 is accommodated in a recessed part 200 formed in the center thereof. The upper surface 20a of the annular frame holding part 20 is a flat annular frame holding surface. The upper surface 20a of the annular frame holding part 20 has an opening, and is provided with concave, for example, four suction cup accommodating parts not shown in the figure. In these four suction cup accommodating parts not shown in the figure, suction cups 25 (only shown in Figure 2) that can adsorb the annular frame F are respectively provided. The suction cup 25 is, for example, a deformable elastic material such as rubber formed into a circular shape when viewed from above. Each suction cup 25 is connected to a suction source not shown in the figure, such as a vacuum generating device. In addition, the shape and structure of the annular frame holding portion 20 are not limited to the present embodiment.

On the upper surface 20a of the annular frame holding portion 20, a first fixed positioning portion 23 and a first movable positioning portion 24 are arranged. The first fixed positioning portion 23 is used to position (center) the annular frame F on the upper surface 20a and is composed of a fixed pin, etc. The first movable positioning portion 24 is composed of a movable pin, etc., and approaches and moves away from the first fixed positioning portion 23 in a direction facing the first fixed positioning portion 23 and parallel to the upper surface 20a. Furthermore, a second fixed positioning portion 26 and a second movable positioning portion 27 are arranged on the upper surface 20a. The second movable positioning portion 27 is composed of a movable pin, etc., and approaches and moves away from the second fixed positioning portion 26 in a direction facing the second fixed positioning portion 26 and parallel to the upper surface 20a. For example, the direction in which the first fixed positioning portion 23 and the first movable positioning portion 24 face each other, and the direction in which the second fixed positioning portion 26 and the second movable positioning portion 27 face each other are substantially orthogonal to each other in a horizontal plane.

In this embodiment, at least one of the first fixed positioning part 23 and the first movable positioning part 24, and at least one of the second fixed positioning part 26 and the second movable positioning part 27 clamps at least one of the pair of first flat surfaces and the pair of second flat surfaces in the outer periphery of the annular frame F, and positions (centers) the annular frame F at the target position on the upper surface 20a of the annular frame holding part 20. Thereafter, the annular frame F is held by suction by each suction cup 25.

The wafer holding part 21 shown in detail in FIG. 3 is, for example, circular in shape and comprises: an adsorption part 210, which is composed of a porous member and adsorbs the wafer W; and a frame 211, which has a concave longitudinal section and supports the adsorption part 210. The adsorption part 210 embedded in the concave part of the frame 211 is connected to a suction source not shown. The suction force generated by the suction source is transmitted to the holding surface 210a, which is a flat surface and serves as the upper surface of the adsorption part 210, so that the wafer holding part 21 attracts and holds the wafer W on the holding surface 210a.

For example, the height of the upper surface 20a of the annular frame holding portion 20 is set in the following manner: when the wafer W is held on the holding surface 210a of the wafer holding portion 21 and the annular frame F is held by the upper surface 20a of the annular frame holding portion 20, the upper surface of the annular frame F and the upper surface Wb of the wafer W become approximately the same height.

As shown in FIGS. 2 and 3 , a holding table moving mechanism (holding means moving means) 13 is provided on the base 10 , which enables the wafer holding portion 21 and the ring-shaped frame holding portion 20 to reciprocate in the X-axis direction. The holding table moving mechanism 13 includes: a ball screw 130 having an axis in the X-axis direction; a guide rail 131 arranged parallel to the ball screw 130; and a motor 132 connected to the ball screw 130 to rotate the ball screw 130. In the ring-shaped frame holding portion 20 , a nut (not shown) provided on its lower surface is screwed with the ball screw 130. When the motor 132 rotates the ball screw 130 , the wafer holding portion 21 and the ring-shaped frame holding portion 20 are guided by the guide rail 131 and reciprocate in the X-axis direction.

As shown in FIG2 , a pasting roller 30 is provided above the moving path of the annular frame holding portion 20 and near the front end of the peeling plate 15 that has been lowered to the pasting position. The pasting roller 30 has a length greater than the width of the annular frame holding portion 20 in the Y-axis direction, for example, and is supported to be rotatable by a roller frame and a roller rotating shaft 32 (hereinafter referred to as the rotating shaft 32) not shown in the figure. Moreover, the pasting roller 30 crosses the annular frame holding portion 20 in the Y-axis direction and can move in the up-and-down direction by a roller up-and-down moving mechanism (roller up-and-down moving means) 31 (see FIG5 ).

As shown in Figures 2 and 3, the adhesive film pasting device 1 has a spray nozzle 35, which sprays air toward the pasting roller 30 from the outer side of the annular frame F held by the annular frame holding portion 20 in the X-axis direction. The X-axis direction is a direction that is orthogonal in the horizontal plane to the rotation axis 32 of the pasting roller 30 whose axial direction is the Y-axis direction.

For example, a nozzle mounting platform 36 is provided in the center of the side surface on the +X direction side of the annular frame holding portion 20 in a manner of being pulled out in the horizontal direction, and a spray nozzle 35 is fixed on the nozzle mounting platform 36. The spray nozzle 35 is, for example, L-shaped in side view, and its spray port 350 is oriented toward the -X direction side in the example shown in FIGS. 2 and 3 , and the air sprayed from the spray port 350 flows toward the -X direction side along the upper surface of the annular frame F held in the annular frame holding portion 20. As shown in FIG. 3 , the spray nozzle 35 is connected to an air supply source 359, which is composed of a compressor and can supply compressed air. For example, the ejection port 350 of the ejection nozzle 35 only needs to push the peripheral portion of the adhesive film T2 that will be bonded last against the side of the pasting roller 30, and therefore only needs to face at least the central area of the side of the pasting roller 30 in the length direction (Y-axis direction). In addition, the ejection nozzle 35 is located behind the first fixed positioning portion 23 (+X direction side). The air ejected by the ejection nozzle 35 can pass through the two positioning pins of the first fixed positioning portion 23 and advance, so the ejected airflow will not be hindered by the first fixed positioning portion 23.

For example, an ionizer 6 is arranged above the holding table 2 shown in FIG6. When the holding table 2 moves in the -X direction to the position passing through the pasting roller 30, the ionizer 6 is used to eliminate static electricity of the adhesive film T2 pasted on the wafer W and the annular frame F. The ionizer 6 is, for example, a nozzle-type pulse AC (pulsed alternating current) type, but is not limited to this. As shown in FIGS. 2 and 3, the ionizer 6 has, for example: an ionization nozzle 60, which is arranged in a manner that the nozzle 60a and the adhesive film T2 are facing each other in the Z-axis direction, and the adhesive film T2 is pasted on the annular frame F held on the holding table 2; and an air source 61, which is connected to the ionization nozzle 60. In the example shown in FIG. 2 , the ionization nozzle 60 extends in the Y-axis direction across the length of the holding table 2 and becomes the outer periphery of the other side of the center from the outer periphery passing through the lower film T2, but the present invention is not limited thereto.

The following is an example of the operation of the adhesive film laminating device 1 shown in FIG. 2. First, the wafer W is placed on the wafer holding portion 21 of the holding table 2 in a manner that the centers of the wafer W and the ring frame F are placed on the ring frame holding portion 20. Then, the suction source (not shown) operates to hold the wafer W by suction using the holding surface 210a of the wafer holding portion 21, and to hold the ring frame F by suction using the holding surface, i.e., the upper surface 20a, of the ring frame holding portion 20.

Furthermore, the output unit 80 outputs the adhesive film unit TU toward the peeling plate 15 while rotating.

In this state, the holding table moving mechanism 13 moves the holding table 2, for example, in the -X direction, whereby the annular frame holding portion 20 holding the annular frame F approaches directly below the pasting roller 30. Thereafter, the pasting roller 30 is lowered by the roller up-and-down moving mechanism 31 (not shown in FIG. 2 ), and the pasting roller 30 is positioned at a height position when the adhesive film T2 is pasted to the annular frame F held by the annular frame holding portion 20.

Furthermore, by the peeling plate 15 being lowered and positioned at the film peeling position, for example, the film unit TU is in a state of passing through the gap between the front end of the peeling plate 15 and the outer peripheral side surface of the pasting roller 30. In addition, the gap is a small gap that the film unit TU can just pass through. Therefore, the peeling plate 15 is arranged in a manner such that the front end is higher than the upper surface of the annular frame F held by the annular frame holding portion 20. The distance between the upper surface of the annular frame F and the front end of the peeling plate 15 is within the radius of the pasting roller 30. In addition, as shown in Figures 3 and 4, if the peeling plate 15 is arranged at an angle close to the horizontal, the above-mentioned distance can be shortened. However, there is a problem that the adhesive film pasting device 1 becomes larger in the X-axis direction. In response to this, as shown in Figures 5 and 6, if the peeling plate 15 is arranged at an angle close to vertical, the above-mentioned distance will become larger. Therefore, as in the present invention, the mechanism described later for spraying air and pushing the adhesive film T2 against the pasting roller 30 can be more effectively utilized. In addition, by arranging the peeling plate 15 at an angle close to vertical, the distance in the X-axis direction of the adhesive film pasting device 1 can be reduced. Moreover, the front end of the peeling plate 15 contacts/presses the thin film T1 of the adhesive film unit TU, and the adhesive film unit TU is bent with the thin film T1 as the inner side to form a sharp angle. In this way, the rubber film T2 can be peeled off from the rubber film unit TU and sent to the bottom of the laminating roller 30.

As shown in FIG3 , while the adhesive film unit TU is transported to the peeling plate 15 by the output unit 80 , the laminating roller 30 is rotated at a predetermined rotation speed. Furthermore, as shown in FIG3 , the ring frame holding part 20 and the wafer holding part 21 are output to the -X direction by the holding stage moving mechanism 13 , so that the adhesive film T2 can be pushed from one side of the ring frame F held in the ring frame holding part 20 by the laminating roller 30 . In addition, the winding unit 82 winds up the sheet T1 from which the adhesive film T2 has been peeled.

Then, if the adhesive film T2 is pushed against the annular frame F and the wafer W by the adhesive roller 30 while the holding table 2 is moved in the -X direction to a predetermined position after passing through the adhesive roller 30 as shown in Figures 4 and 5, a piece of adhesive film T2 can be adhered to the wafer W and the annular frame F, and a workpiece group can be manufactured in which the wafer W and the annular frame F are integrated by the adhesive film T2.

Here, in the adhesive film laminating device 1 of the present invention, as shown in FIG5 , the air sprayed from the spray nozzle 35 prevents the following situation: the outer peripheral portion of the adhesive film T2 adhered to the sheet T1 to the end is peeled off from the sheet T1 and falls to the upper surface of the ring frame F due to the self-weight of the adhesive film T2. That is, as shown in FIG5 , compressed air is supplied to the spray nozzle 35 from the air supply source 359, and the air sprayed from the spray port 350 is directed toward the laminating roller 30 from the outer side of the outer periphery of the ring frame F held by the ring frame holding portion 20. At this time, the air flows, for example, along the upper surface of the ring frame F held by the ring frame holding portion 20, and contacts the lower surface side (paste layer side) of the adhesive film T2, and further rises in a manner of supporting the adhesive film T2 that is peeled off from the sheet T1 and is about to fall from the lower side. That is, while the adhesive film T2 is pushed along the side surface of the pasting roller 30 by the air, a piece of adhesive film T2 is pasted on the wafer W and the ring frame F. As a result, the adhesive film T2 can be pasted on the ring frame F and the wafer W in a manner that does not generate wrinkles and bubbles. Therefore, when the wafer W is subsequently divided and the adhesive film T2 is expanded, it is possible to prevent the divided adjacent chips from contacting each other, and chip chipping will not occur.

For example, as shown in FIG. 6 , the following situation can be prevented by spraying air from another form of the spray nozzle 35 shown in FIG. 5 , namely, the spray nozzle 37: the peripheral portion of the adhesive film T2 adhered to the sheet T1 until the end is peeled off from the sheet T1 and is about to fall to the upper surface of the annular frame F.

The spray nozzle 37 shown in FIG. 6 is formed integrally with the annular frame holding portion 20, for example, and has: an air inlet 370, which opens on the side of the annular frame holding portion 20; and an air ejection port 371, which opens in the rear area of the first fixed positioning portion 23 on the upper surface of the annular frame holding portion 20. In addition, the air inlet 370 is connected to the air supply source 359. A guide portion 205 is formed near the air ejection port 371 of the annular frame holding portion 20, and the guide portion 205 is formed in an R shape, and guides the air ejected from the air ejection port 371 to the upper side in a manner that is obliquely upward toward the side of the holding table 2. The air ejected from the air ejection port 371 directly upward changes its flow direction along the R shape (R surface) of the guide portion 205, and flows parallel to the upper surface of the guide portion 205, thereby flowing on the upper surface of the ring frame F held by the ring frame holding portion 20, and toward the pasting roller 30. Furthermore, a rectifying plate 375 is provided at a position obliquely above the guide portion 205, and the rectifying plate 375 adjusts the airflow ejected from the ejection nozzle 37 and guided by the guide portion 205 to be fixed.

As shown in FIG6 , compressed air is supplied to the spray nozzle 37 from the air supply source 359, and the air sprayed from the air spray port 371 is directed toward the laminating roller 30 from the outer side of the outer periphery of the annular frame F held by the annular frame holding portion 20. Here, the spray angle of the air is, for example, adjusted by adjusting the angle of the straightening plate 375, and when the direction parallel to the upper surface of the annular frame F is set to 0 degrees, it becomes a range of 0 degrees to 45 degrees upward (clockwise direction viewed from the front side of the paper) in FIG6 . Then, the air contacts the lower surface side of the adhesive film T2, and further rises in a manner of supporting the adhesive film T2 peeled off from the sheet T1 and about to fall from below. That is, while the adhesive film T2 is pushed along the side of the pasting roller 30 by the air, a piece of adhesive film T2 is pasted on the wafer W and the ring frame F. As a result, the adhesive film T2 can be pasted on the ring frame F and the wafer W without generating wrinkles and bubbles. Therefore, when the wafer W is subsequently divided and the adhesive film T2 is expanded, the adjacent chips that have been divided can be prevented from contacting each other, and chip chipping will not occur. In addition, for example, if the air sprayed from the spray nozzle 37 contacts the adhesive film T2 peeled off from the sheet T1 and not yet adhered in an orthogonal manner, the adhesive film T2 will be in a relaxed state along the pasting roller 30, but if the spray angle of the air is within the range of 0 degrees to 45 degrees upward, such relaxation can be prevented.

While air is sprayed by the spray nozzle 35 shown in FIG. 5 or the spray nozzle 37 shown in FIG. 6 , for example, after the workpiece group is manufactured by pasting the adhesive film T2 between the wafer W and the annular frame F, air is supplied to the ionization nozzle 60 from the air source 61 shown in FIG. 5 , and approximately the same amount of ionized air with (+) charge and ionized air with (-) charge is sprayed from the ionization nozzle 60 onto the adhesive film T2 of the workpiece group passing under the ionization nozzle 60, so as to eliminate static electricity of the adhesive film T2 that is charged due to being peeled off from the thin film T1. Thereafter, the wafers W that have passed through the ring frame F and are processed as a workpiece group are transferred to a dicing device or the like by a transport unit (not shown) and diced or the like.

The adhesive film pasting device 1 of the present invention is not limited to this implementation method. Moreover, the configuration of the adhesive film pasting device 1 shown in the attached figure is not limited thereto and can be appropriately changed within the scope of the effectiveness of the present invention.

TU: Adhesive film unit T1: Thin film T2: Circular adhesive film T3: Cylinder W: Wafer F: Ring frame 1: Adhesive film pasting device 10: Base 80: Output unit 82: Winding unit 820: Thin film support roller 15: Peeling plate 160: Plate base 161: Plate movable member 2: Holding table (holding means) 20: Ring frame holding part 21: Wafer holding part 210a: Holding surface 25: Suction cup 23: First fixed positioning part 24: First movable positioning part 26: Second Fixed positioning part 27: Second movable positioning part 13: Holding platform moving mechanism (holding means moving means) 130: Ball screw 132: Motor 30: Paste roller 31: Roller up and down moving mechanism (roller up and down moving means) 32: Roller rotating shaft 35: Jet nozzle 36: Nozzle setting platform 359: Air supply source 6: Ionizer 60: Ionization nozzle 61: Air source 37: Jet nozzle 370: Air inlet 371: Air ejection port 205: Guide part 375: Rectifier plate

FIG. 1 is a perspective view showing an example of a film unit wound into a roll. FIG. 2 is a perspective view showing an example of a film pasting device. FIG. 3 is a side view showing a state where the film pasting device starts pasting the film to the ring frame and the wafer. FIG. 4 is a side view showing a state where the film pasting device completes pasting the film to the ring frame and the wafer while the film is pushed against the side of the pasting roll by air sprayed along the upper surface of the ring frame. FIG5 is an enlarged side view illustrating a state in which the adhesive film is pasted to the annular frame and the wafer by pushing the adhesive film against the side of the pasting roller by air sprayed along the upper surface of the annular frame in the adhesive film pasting device. FIG6 is an enlarged side view illustrating a state in which the adhesive film is pasted to the annular frame and the wafer by pushing the adhesive film against the side of the pasting roller by air sprayed in a range of 0 degrees to 45 degrees upward when the direction parallel to the upper surface of the annular frame is set to 0 degrees in the adhesive film pasting device.

TU: membrane unit

T1: Thin slices

T2: Round film

W: Wafer

Wa: Front

Wb:Back

F: Ring frame

1: Adhesive film pasting device

10: Abutment

80: Output unit

82: Winding unit

820: Thin sheet support roller

15: Peel off board

2: Holding table (holding means)

20: Ring frame holding part

20a: Upper surface

21: Wafer holding part

23: First fixed positioning part

24: First movable positioning part

25: Suction cup

26: Second fixed positioning part

27: Second movable positioning part

13: Holding platform moving mechanism (holding means moving means)

130:Ball Screw

131:Guide rail

132: Motor

30: Paste Roller

32: Roller shaft

35: Spray nozzle

6: Ionizer

60: Ionization nozzle

61: Air source

200: concave

Claims (3)

A film pasting device is provided, which pastes the film peeled off from the sheet in the strip-shaped film unit to the ring-shaped frame and the wafer arranged at the opening of the ring-shaped frame, and integrates the ring-shaped frame and the wafer by the film. The strip-shaped film unit is arranged in the length direction of the strip-shaped sheet and the circular film is pasted. The film pasting device comprises: a holding table having a ring-shaped frame holding part for holding the ring-shaped frame, and a holding member on the ring-shaped frame. The wafer holding part holds the wafer in the opening of the frame; an output unit that outputs the adhesive film unit while rotating; a winding unit that rolls up the sheet from which the adhesive film has been peeled off while rotating; a peeling plate that contacts the sheet between the output unit and the winding unit, bends the adhesive film unit in a manner that the sheet becomes the inner side, and peels the adhesive film from the sheet; and a sticking roller that pushes one side of the adhesive film that has been peeled off from the sheet against the adhesive film. The annular frame is bonded to the wafer; and a holding platform moving means is used to move the holding platform in a horizontal direction relative to the peeling plate and the bonding roller; a spray nozzle is arranged on the annular frame holding portion, and sprays air toward the bonding roller from the outer side of the annular frame held by the annular frame holding portion in a direction orthogonal to the rotation axis of the bonding roller. The adhesive film bonding device is configured by moving the spray nozzle from the annular frame holding portion to the bonding roller. The air ejected from the spray nozzle pushes the adhesive film that is peeled off from the sheet and about to fall against the side of the sticking roller, while the holding table moving means moves the holding table and rotates the sticking roller, so that the adhesive film is stuck to the annular frame and the wafer, and the air ejected from the spray nozzle pushes the outer peripheral portion of the adhesive film that is peeled off from the sheet and is finally stuck against the side of the sticking roller and sticks to the annular frame. As in claim 1, the adhesive film pasting device, wherein the spray nozzle sprays air along the upper surface of the aforementioned annular frame held in the aforementioned annular frame holding portion. As in claim 1, the spray angle of the air sprayed from the spray nozzle is within the range of 0 degrees to 45 degrees upward when the direction parallel to the upper surface of the annular frame is set to 0 degrees.