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TWI859141B - Sealant for organic electroluminescent display elements - Google Patents

Sealant for organic electroluminescent display elements Download PDF

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Publication number
TWI859141B
TWI859141B TW108118786A TW108118786A TWI859141B TW I859141 B TWI859141 B TW I859141B TW 108118786 A TW108118786 A TW 108118786A TW 108118786 A TW108118786 A TW 108118786A TW I859141 B TWI859141 B TW I859141B
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sealant
meth
acrylate
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monomer
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TW108118786A
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Chinese (zh)
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TW202003777A (en
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佐佐木麻希子
山下幸彦
栗村啓之
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日商電化股份有限公司
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10Esters
    • C08F20/22Esters containing halogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/10Materials in mouldable or extrudable form for sealing or packing joints or covers
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • H10K50/8445Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • H10K59/8731Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Sealing Material Composition (AREA)

Abstract

本發明之有機電致發光顯示元件用密封劑含有:單體成分,其包含具有氟原子及(甲基)丙烯醯基之含氟單體(A);及光聚合起始劑。The sealant for an organic electroluminescent display element of the present invention comprises: a monomer component including a fluorine-containing monomer (A) having a fluorine atom and a (meth)acryl group; and a photopolymerization initiator.

Description

有機電致發光顯示元件用密封劑Sealant for organic electroluminescent display element

本發明係關於一種有機電致發光(EL)顯示元件用密封劑。又,本發明係關於一種有機EL顯示元件用密封劑之硬化體、包含該硬化體之有機EL顯示元件用密封材、及包含該密封材之有機EL顯示裝置。The present invention relates to a sealant for an organic electroluminescent (EL) display element, a cured body of the sealant for an organic EL display element, a sealant for an organic EL display element including the cured body, and an organic EL display device including the sealant.

有機電致發光顯示元件(亦稱為有機EL顯示元件、有機EL元件或OLED(Organic Light Emitting Diode,有機發光二極體)元件)作為可進行較高之亮度之發光之元件體而備受關注。然而,有機EL顯示元件有因水分而劣化,發光特性降低之課題。Organic electroluminescent display elements (also called organic EL display elements, organic EL elements or OLED (Organic Light Emitting Diode) elements) have attracted much attention as elements that can emit light with higher brightness. However, organic EL display elements have the problem of deterioration due to moisture, and the luminescence characteristics are reduced.

為了解決此種課題,業界正研究將有機EL顯示元件密封,而防止由水分所引起之劣化之技術(例如專利文獻1~3)。 先前技術文獻 專利文獻To solve this problem, the industry is researching technologies to seal organic EL display elements to prevent degradation caused by moisture (e.g., patent documents 1 to 3). Previous technical documents Patent documents

專利文獻1:日本專利特開平10-74583號公報 專利文獻2:日本專利特開2001-307873號公報 專利文獻3:日本專利特開2009-37812號公報Patent document 1: Japanese Patent Publication No. 10-74583 Patent document 2: Japanese Patent Publication No. 2001-307873 Patent document 3: Japanese Patent Publication No. 2009-37812

[發明所欲解決之問題][The problem the invention is trying to solve]

近年來,業界對有機EL顯示元件之要求特性提高,而要求可實現更高之可靠性之密封材。In recent years, the industry has been demanding higher performance for organic EL display elements, and has been demanding sealing materials that can achieve higher reliability.

本發明之目的之一在於提供一種與玻璃基板等之潤濕性優異,可高效率地將有機EL顯示元件密封之有機EL顯示元件用密封劑。又,本發明之目的之一在於提供一種包含上述密封劑之硬化物之有機EL顯示元件用密封材。進而,本發明之目的之一在於提供一種包含上述密封材之有機EL顯示裝置。 [解決問題之技術手段]One of the purposes of the present invention is to provide a sealant for an organic EL display element that has excellent wettability with a glass substrate and can efficiently seal an organic EL display element. Another purpose of the present invention is to provide a sealant for an organic EL display element that includes a cured product of the sealant. Furthermore, another purpose of the present invention is to provide an organic EL display device that includes the sealant. [Technical means for solving the problem]

本發明之一態樣係關於一種有機電致發光顯示元件用密封劑,其含有:單體成分,其包含具有氟原子及(甲基)丙烯醯基之含氟單體(A);及光聚合起始劑。One aspect of the present invention relates to a sealant for an organic electroluminescent display element, comprising: a monomer component including a fluorine-containing monomer (A) having a fluorine atom and a (meth)acryl group; and a photopolymerization initiator.

上述有機電致發光顯示元件用密封劑由於與玻璃基板等之潤濕性優異,故而可高效率地將有機EL顯示元件密封。The above-mentioned sealant for organic electroluminescent display element has excellent wettability with glass substrates and the like, and thus can efficiently seal the organic EL display element.

於一態樣中,上述含氟單體之氟原子含量以上述含氟單體之總量基準計可為2~75質量%。In one aspect, the fluorine atom content of the fluorine-containing monomer may be 2-75 mass % based on the total amount of the fluorine-containing monomer.

於一態樣中,上述單體成分之氟原子含量以上述單體成分之總量基準計可為0.1~75質量%。In one aspect, the fluorine atom content of the monomer component may be 0.1 to 75 mass % based on the total amount of the monomer component.

於一態樣中,上述含氟單體可包含具有3~25個氟原子之化合物。In one aspect, the fluorine-containing monomer may include a compound having 3 to 25 fluorine atoms.

於一態樣中,上述含氟單體可包含選自由式(A-1)所表示之化合物、式(A-2)所表示之化合物及式(A-3)所表示之化合物所組成之群中之至少一種。 [化1] [式(A-1)中, R1 表示氫原子或甲基, R2 表示氟化烷基、或於氟化烷基中之碳-碳鍵及碳-氫鍵之一部分中插入有氧原子之基] [化2] [式(A-2)中, R3 表示氫原子或甲基, R4 表示氟化烷二基、或於氟化烷二基中之碳-碳鍵及碳-氫鍵之一部分中插入有氧原子之基。 存在複數個之R3 互相可相同亦可不同] [化3] [式(A-3)中, R5 表示氫原子或甲基, R6 表示單鍵、烷二基、氟化烷二基、或者於烷二基或氟化烷二基中之碳-碳鍵及碳-氫鍵之一部分中插入有氧原子之基, Ar1 表示氟化芳基]In one embodiment, the fluorine-containing monomer may include at least one selected from the group consisting of a compound represented by formula (A-1), a compound represented by formula (A-2), and a compound represented by formula (A-3). [In formula (A-1), R1 represents a hydrogen atom or a methyl group, and R2 represents a fluorinated alkyl group, or a group in which an oxygen atom is inserted into a portion of the carbon-carbon bond and the carbon-hydrogen bond of the fluorinated alkyl group] [Chemical 2] [In formula (A-2), R 3 represents a hydrogen atom or a methyl group, and R 4 represents a fluorinated alkanediyl group, or a group in which an oxygen atom is inserted into a portion of the carbon-carbon bond and the carbon-hydrogen bond of the fluorinated alkanediyl group. The presence of a plurality of R 3 groups may be the same or different] [Chemical 3] [In formula (A-3), R 5 represents a hydrogen atom or a methyl group, R 6 represents a single bond, an alkanediyl group, a fluorinated alkanediyl group, or a group in which an oxygen atom is inserted into a portion of the carbon-carbon bond and the carbon-hydrogen bond in the alkanediyl group or the fluorinated alkanediyl group, and Ar 1 represents a fluorinated aryl group]

於一態樣中,上述含氟單體可包含選自由式(A-1-1)所表示之化合物、式(A-2-1)所表示之化合物及式(A-3-1)所表示之化合物所組成之群中之至少一種。 [化4] [式(A-1-1)中,R1 表示氫原子或甲基,R21 表示氫原子或氟原子,n表示1以上之整數。存在複數個之R21 互相可相同亦可不同。其中,R21 之至少一個為氟原子] [化5] [式(A-2-1)中,R3 表示氫原子或甲基,R41 表示氫原子或氟原子,m表示1以上之整數。存在複數個之R3 互相可相同亦可不同。存在複數個之R41 互相可相同亦可不同。其中,R41 之至少一個為氟原子] [化6] [式(A-3-1)中,R5 表示氫原子或甲基,R61 表示氫原子或氟原子,R62 表示氫原子或氟原子,p表示0以上之整數。存在複數個之R61 互相可相同亦可不同。存在複數個之R62 互相可相同亦可不同。其中,R62 之至少一個為氟原子]In one embodiment, the fluorine-containing monomer may include at least one selected from the group consisting of a compound represented by formula (A-1-1), a compound represented by formula (A-2-1), and a compound represented by formula (A-3-1). [In formula (A-1-1), R 1 represents a hydrogen atom or a methyl group, R 21 represents a hydrogen atom or a fluorine atom, and n represents an integer greater than 1. A plurality of R 21s may be the same or different from each other. Among them, at least one of R 21s is a fluorine atom] [Chemistry 5] [In formula (A-2-1), R 3 represents a hydrogen atom or a methyl group, R 41 represents a hydrogen atom or a fluorine atom, and m represents an integer greater than 1. A plurality of R 3s may be the same or different from each other. A plurality of R 41s may be the same or different from each other. Among them, at least one of R 41s is a fluorine atom] [Chemistry 6] [In formula (A-3-1), R 5 represents a hydrogen atom or a methyl group, R 61 represents a hydrogen atom or a fluorine atom, R 62 represents a hydrogen atom or a fluorine atom, and p represents an integer greater than 0. A plurality of R 61s may be the same or different from each other. A plurality of R 62s may be the same or different from each other. Among them, at least one of R 62s is a fluorine atom]

於一態樣中,上述單體成分可進而包含上述含氟單體以外之單體(B)。In one aspect, the monomer component may further include a monomer (B) other than the fluorine-containing monomer.

於一態樣中,上述單體成分可包含具有環狀結構之單體(B-1)作為上述單體(B)。In one aspect, the monomer component may include a monomer (B-1) having a ring structure as the monomer (B).

於一態樣中,上述單體(B-1)可包含選自由乙氧基化鄰苯基苯酚(甲基)丙烯酸酯、(甲基)丙烯酸間苯氧基苄酯、三環癸烷二甲醇二(甲基)丙烯酸酯及乙氧基化雙酚A二(甲基)丙烯酸酯所組成之群中之至少一種。In one aspect, the monomer (B-1) may include at least one selected from the group consisting of ethoxylated o-phenylphenol (meth)acrylate, m-phenoxybenzyl (meth)acrylate, tricyclodecanedimethanol di(meth)acrylate, and ethoxylated bisphenol A di(meth)acrylate.

於一態樣中,上述單體成分可包含具有碳數6以上之烷二基之烷二醇二(甲基)丙烯酸酯(B-2)作為上述單體(B)。In one aspect, the monomer component may include an alkanediol di(meth)acrylate (B-2) having an alkanediyl group having 6 or more carbon atoms as the monomer (B).

於一態樣中,上述烷二醇二(甲基)丙烯酸酯(B-2)可包含選自由1,9-壬二醇二(甲基)丙烯酸酯、1,10-癸二醇二(甲基)丙烯酸酯及1,12-十二烷二醇二(甲基)丙烯酸酯所組成之群中之至少一種。In one aspect, the alkanediol di(meth)acrylate (B-2) may include at least one selected from the group consisting of 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, and 1,12-dodecanediol di(meth)acrylate.

於一態樣中,上述光聚合起始劑可包含醯基氧化膦型光聚合起始劑。In one aspect, the photopolymerization initiator may include an acylphosphine oxide type photopolymerization initiator.

本發明之另一態樣係關於一種硬化體,其係使上述有機電致發光顯示元件用密封劑硬化而成。此種硬化體由於透濕度較低,與玻璃基板等之接著性優異,故而可適宜地用作將有機電致發光顯示元件密封之密封材。Another aspect of the present invention is a hardened body formed by hardening the above-mentioned organic electroluminescent display element with a sealant. This hardened body has low moisture permeability and excellent adhesion to glass substrates, so it can be suitably used as a sealant for sealing the organic electroluminescent display element.

本發明之進而另一態樣係關於一種有機電致發光顯示元件用密封材,其包含上述硬化體。此種密封材之防濕性優異,且與玻璃基板等之接著性優異。因此,根據上述密封材,可獲得可靠性及耐久性優異之有機電致發光顯示裝置。Another aspect of the present invention is a sealing material for an organic electroluminescent display element, which includes the above-mentioned hardened body. This sealing material has excellent moisture resistance and excellent adhesion to a glass substrate, etc. Therefore, according to the above-mentioned sealing material, an organic electroluminescent display device with excellent reliability and durability can be obtained.

本發明之進而另一態樣係關於一種有機電致發光顯示元件用密封材,其包含無機膜與有機膜積層而成之積層體。於該密封材中,上述有機膜包含上述硬化體。根據此種密封材,藉由包含上述硬化體之有機膜與無機膜之組合,而實現更高之防濕性。又,上述硬化體由於對玻璃基板及無機膜之接著性優異,故而根據上述密封材,實現更高之可靠性及耐久性。Another aspect of the present invention is a sealing material for an organic electroluminescent display element, which includes a laminated body formed by laminating an inorganic film and an organic film. In the sealing material, the organic film includes the hardened body. According to this sealing material, a higher moisture resistance is achieved by combining the organic film including the hardened body and the inorganic film. In addition, since the hardened body has excellent adhesion to the glass substrate and the inorganic film, according to the sealing material, higher reliability and durability are achieved.

本發明之進而另一態樣係關於一種有機電致發光顯示裝置,其包含有機電致發光顯示元件、及上述有機電致發光顯示元件用密封材。 [發明之效果]Another aspect of the present invention is an organic electroluminescent display device, which includes an organic electroluminescent display element and a sealing material for the organic electroluminescent display element. [Effect of the invention]

根據本發明,提供一種與玻璃基板等之潤濕性優異,可高效率地將有機EL顯示元件密封之有機EL顯示元件用密封劑。又,根據本發明,提供一種包含上述密封劑之硬化物之有機EL顯示元件用密封材。進而,根據本發明,提供一種包含上述密封材之有機EL顯示裝置。According to the present invention, there is provided a sealant for an organic EL display element which has excellent wettability with a glass substrate and can efficiently seal an organic EL display element. Also, according to the present invention, there is provided a sealant for an organic EL display element comprising a cured product of the sealant. Furthermore, according to the present invention, there is provided an organic EL display device comprising the sealant.

以下,對本發明之實施形態詳細地進行說明。Hereinafter, the implementation forms of the present invention will be described in detail.

本實施形態之有機電致發光(EL)顯示元件用密封劑(以下,亦簡稱為密封劑)含有:單體成分,其包含具有氟原子及(甲基)丙烯醯基之含氟單體(以下,亦稱為(A)成分);及光聚合起始劑。The sealant for an organic electroluminescent (EL) display element of the present embodiment (hereinafter also referred to as the sealant) contains: a monomer component including a fluorine-containing monomer having a fluorine atom and a (meth)acryl group (hereinafter also referred to as the (A) component); and a photopolymerization initiator.

本實施形態之密封劑與玻璃基板等具有無機表面之基板(玻璃基板、成膜有無機膜之樹脂基板等)之潤濕性優異。藉由密封劑之潤濕性優異,塗佈性變得良好,於短時間內密封劑於基板上擴散,因此作業效率提高。又,藉由密封劑之潤濕性優異,塗膜之平坦性提高,可形成平坦性優異之密封材。又,根據本實施形態之密封劑,可形成防濕性優異之密封材。進而,利用本實施形態之密封劑形成之密封材與玻璃基板、成膜有無機膜之基板(玻璃基板、樹脂基板等)等之接著性優異。The sealant of this embodiment has excellent wettability with glass substrates and other substrates with inorganic surfaces (glass substrates, resin substrates with inorganic films formed on them, etc.). Due to the excellent wettability of the sealant, the coating property becomes good, and the sealant diffuses on the substrate in a short time, thereby improving the working efficiency. In addition, due to the excellent wettability of the sealant, the flatness of the coating is improved, and a sealant with excellent flatness can be formed. In addition, according to the sealant of this embodiment, a sealant with excellent moisture resistance can be formed. Furthermore, the sealant formed by the sealant of this embodiment has excellent adhesion with glass substrates, substrates with inorganic films formed on them (glass substrates, resin substrates, etc.).

發揮上述效果之原因雖然未必受到限定,但認為其原因之一為含氟單體使得密封劑之表面自由能降低,容易追隨微細之凹凸,藉此對基板等之密接性提高。The reason for the above effect is not necessarily limited, but one of the reasons is considered to be that the fluorine-containing monomer reduces the surface free energy of the sealant, making it easier to follow fine irregularities, thereby improving the adhesion to the substrate and the like.

含氟單體具有氟原子與(甲基)丙烯醯基。再者,(甲基)丙烯醯基表示丙烯醯基或甲基丙烯醯基。含氟單體可單獨使用1種,亦可組合2種以上而使用。The fluorine-containing monomer has a fluorine atom and a (meth)acryl group. The (meth)acryl group represents an acryl group or a methacryl group. The fluorine-containing monomer may be used alone or in combination of two or more.

含氟單體所具有之氟原子之數量只要為1個以上即可,例如可為2個以上,較佳為3個以上。又,含氟單體所具有之氟原子之數量之上限並無特別限定,例如可為40個以下,較佳為30個以下,更佳為25個以下。The number of fluorine atoms possessed by the fluorine-containing monomer only needs to be 1 or more, for example, 2 or more, preferably 3 or more. The upper limit of the number of fluorine atoms possessed by the fluorine-containing monomer is not particularly limited, for example, 40 or less, preferably 30 or less, and more preferably 25 or less.

氟原子相對於含氟單體之總量之含量例如可為1質量%以上,較佳為2質量%以上,更佳為5質量%以上。又,關於氟原子之含量,以含氟單體之總量基準計,例如可為75質量%以下,較佳為70質量%以下,更佳為65質量%以下。The content of fluorine atoms relative to the total amount of the fluorine-containing monomer may be, for example, 1 mass % or more, preferably 2 mass % or more, and more preferably 5 mass % or more. In addition, the content of fluorine atoms, based on the total amount of the fluorine-containing monomer, may be, for example, 75 mass % or less, preferably 70 mass % or less, and more preferably 65 mass % or less.

含氟單體所具有之(甲基)丙烯醯基之數量只要為1個以上即可。就容易獲得玻璃轉移溫度較低之硬化體之觀點而言,含氟單體所具有之(甲基)丙烯醯基之數量可為1個。又,就容易獲得玻璃轉移溫度較高之硬化體之觀點而言,含氟單體所具有之(甲基)丙烯醯基之數量可為2個以上。含氟單體所具有之(甲基)丙烯醯基之數量之上限並無特別限定,例如可為4個以下,就容易獲得柔軟性優異之硬化體之觀點而言,較佳為3個以下,更佳為2個以下。The number of (meth)acryl groups possessed by the fluorinated monomer only needs to be 1 or more. From the viewpoint of easily obtaining a cured body with a lower glass transition temperature, the number of (meth)acryl groups possessed by the fluorinated monomer may be 1. Furthermore, from the viewpoint of easily obtaining a cured body with a higher glass transition temperature, the number of (meth)acryl groups possessed by the fluorinated monomer may be 2 or more. The upper limit of the number of (meth)acryl groups possessed by the fluorinated monomer is not particularly limited, and for example, it may be 4 or less. From the viewpoint of easily obtaining a cured body with excellent flexibility, it is preferably 3 or less, and more preferably 2 or less.

作為含氟單體之具體例之一,可列舉式(A-1)所表示之化合物。As one specific example of the fluorine-containing monomer, there can be mentioned a compound represented by formula (A-1).

[化7] [Chemistry 7]

式(A-1)中,R1 表示氫原子或甲基。又,R2 表示氟化烷基、或於氟化烷基中之碳-碳鍵及碳-氫鍵之一部分中插入有氧原子之基。In formula (A-1), R1 represents a hydrogen atom or a methyl group. Also, R2 represents a fluorinated alkyl group, or a group in which an oxygen atom is inserted into a portion of the carbon-carbon bond and the carbon-hydrogen bond of the fluorinated alkyl group.

氟化烷基可稱為烷基所具有之氫原子之一部分或全部被取代為氟原子之基。氟化烷基之碳原子數並無特別限定,例如可為1個以上,較佳為2個以上,更佳為3個以上。又,氟化烷基之碳原子數例如可為25個以下,亦可為20個以下。The fluorinated alkyl group may be referred to as a group in which a part or all of the hydrogen atoms of the alkyl group are replaced by fluorine atoms. The number of carbon atoms of the fluorinated alkyl group is not particularly limited, and may be, for example, 1 or more, preferably 2 or more, and more preferably 3 or more. In addition, the number of carbon atoms of the fluorinated alkyl group may be, for example, 25 or less, or 20 or less.

作為氟化烷基,可適宜地使用包含二氟亞甲基(-CF2 -)之基。As the fluorinated alkyl group, a group containing a difluoromethylene group (-CF 2 -) can be suitably used.

作為氟化烷基之具體例,可列舉:二氟甲基、三氟甲基、1,1-二氟乙基、2,2-二氟乙基、1,1,1-三氟乙基、2,2,2-三氟乙基、全氟乙基、1,1,2,2-四氟丙基、1,1,1,2,2-五氟丙基、1,1,2,2,3,3-六氟丙基、全氟丙基、全氟乙基甲基、1-(三氟甲基)-1,2,2,2-四氟乙基、2,2,3,3-四氟丙基、全氟丙基、1,1,2,2-四氟丁基、1,1,2,2,3,3-六氟丁基、1,1,1,2,2,3,3-七氟丁基、1,1,2,2,3,3,4,4-八氟丁基、全氟丁基、1,1-雙(三氟)甲基-2,2,2-三氟乙基、2-(全氟丙基)乙基、1,1,2,2,3,3,4,4-八氟戊基、2,2,3,3,4,4,5,5-八氟戊基、全氟戊基、1,1,2,2,3,3,4,4,5,5-十氟戊基、1,1-雙(三氟甲基)-2,2,3,3,3-五氟丙基、2-(全氟丁基)乙基、1,1,1,2,2,3,3,4,4-九氟戊基、1,1,2,2,3,3,4,4,5,5-十氟己基、1,1,2,2,3,3,4,4,5,5,6,6-十二氟己基、全氟己基、全氟戊基甲基及全氟己基等。Specific examples of fluorinated alkyl groups include difluoromethyl, trifluoromethyl, 1,1-difluoroethyl, 2,2-difluoroethyl, 1,1,1-trifluoroethyl, 2,2,2-trifluoroethyl, perfluoroethyl, 1,1,2,2-tetrafluoropropyl, 1,1,1,2,2-pentafluoropropyl, 1,1,2,2,3,3-hexafluoropropyl, perfluoropropyl, perfluoroethylmethyl, 1-(trifluoromethyl)-1,2,2,2-tetrafluoroethyl, 2,2,3,3-tetrafluoropropyl, perfluoropropyl, 1,1,2,2-tetrafluorobutyl, 1,1,2,2,3,3-hexafluorobutyl, 1,1,1,2,2,3,3-heptafluorobutyl, 1,1,2,2,3,3,4,4-octafluorobutyl, perfluorobutyl , 1,1-bis(trifluoro)methyl-2,2,2-trifluoroethyl, 2-(perfluoropropyl)ethyl, 1,1,2,2,3,3,4,4-octafluoropentyl, 2,2,3,3,4,4,5,5-octafluoropentyl, perfluoropentyl, 1,1,2,2,3,3,4,4,5,5-decafluoropentyl, 1,1-bis(trifluoromethyl)-2,2,3,3,3-pentafluoropropyl, 2-(perfluorobutyl)ethyl, 1,1,1,2,2,3,3,4,4-nonafluoropentyl, 1,1,2,2,3,3,4,4,5,5-decafluorohexyl, 1,1,2,2,3,3,4,4,5,5,6,6-dodecafluorohexyl, perfluorohexyl, perfluoropentylmethyl and perfluorohexyl, etc.

氟化烷基中之碳-碳鍵及碳-氫鍵之一部分中插入有氧原子之基(以下,亦稱為R2 之含氧基)可為於一處插入有氧原子之基,亦可為於兩處以上插入有氧原子之基。The group in which an oxygen atom is inserted into a portion of the carbon-carbon bond and carbon-hydrogen bond in the fluorinated alkyl group (hereinafter also referred to as an oxygen-containing group of R 2 ) may be a group in which an oxygen atom is inserted into one position, or may be a group in which an oxygen atom is inserted into two or more positions.

再者,若於碳-碳鍵插入氧原子,則形成醚鍵。又,若於碳-氫鍵插入氧原子,則形成羥基。即,R2 之含氧基亦可稱為包含選自由醚鍵及羥基所組成之群中之至少一種之基。Furthermore, if an oxygen atom is inserted into a carbon-carbon bond, an ether bond is formed. Also, if an oxygen atom is inserted into a carbon-hydrogen bond, a hydroxyl group is formed. That is, the oxygen-containing group of R2 can also be referred to as a group containing at least one selected from the group consisting of an ether bond and a hydroxyl group.

作為R2 之含氧基之具體例,例如可列舉下述式所表示之基。As specific examples of the oxygen-containing group for R 2 , for example, groups represented by the following formulas can be cited.

[化8] [Chemistry 8]

式(A-1)所表示之化合物中之氟原子含量例如可為2質量%以上,較佳為5質量%以上,更佳為15質量%以上,進而較佳為30質量%以上。又,式(A-1)所表示之化合物中之氟原子含量例如可為75質量%以下,較佳為70質量%以下,更佳為65質量%以下。The fluorine atom content in the compound represented by formula (A-1) may be, for example, 2% by mass or more, preferably 5% by mass or more, more preferably 15% by mass or more, and further preferably 30% by mass or more. In addition, the fluorine atom content in the compound represented by formula (A-1) may be, for example, 75% by mass or less, preferably 70% by mass or less, and further preferably 65% by mass or less.

作為式(A-1)所表示之化合物之具體例之一,例如可列舉式(A-1-1)所表示之化合物。As one specific example of the compound represented by formula (A-1), for example, there can be mentioned a compound represented by formula (A-1-1).

[化9] [Chemistry 9]

式(A-1-1)中,R1 表示氫原子或甲基,R21 表示氫原子或氟原子,n表示1以上之整數。存在複數個之R21 互相可相同亦可不同。其中,R21 之至少一個為氟原子。In formula (A-1-1), R 1 represents a hydrogen atom or a methyl group, R 21 represents a hydrogen atom or a fluorine atom, and n represents an integer greater than 1. A plurality of R 21s may be the same or different from each other. At least one of R 21s is a fluorine atom.

n只要為1以上即可,較佳為2以上。又,n之上限並無特別限定,例如可為25以下,亦可為20以下。n may be 1 or more, and is preferably 2 or more. The upper limit of n is not particularly limited, and may be, for example, 25 or less, or 20 or less.

R21 於式(A-1-1)中存在複數個,其中之至少一個為氟原子。又,R21 中較佳為2個以上為氟原子,更佳為3個以上為氟原子。R21 可全部為氟原子。There are plural R 21's in formula (A-1-1), at least one of which is a fluorine atom. Preferably, 2 or more R 21's are fluorine atoms, more preferably 3 or more R 21's are fluorine atoms. All R 21's may be fluorine atoms.

氟原子之數量相對於R21 之合計數之比率例如可為4%以上,較佳為8%以上,更佳為12%以上。該比率例如可為100%以下,較佳為80%以下,更佳為75%以下。The ratio of the number of fluorine atoms to the total number of R 21 may be, for example, 4% or more, preferably 8% or more, and more preferably 12% or more. The ratio may be, for example, 100% or less, preferably 80% or less, and more preferably 75% or less.

式(A-1-1)所表示之化合物較佳為附有n之括號內之二價基(-C(R21 )2 -)中至少一個為二氟亞甲基(-CF2 -)。The compound represented by formula (A-1-1) is preferably one in which at least one of the divalent groups (—C(R 21 ) 2 —) in the parentheses attached to n is a difluoromethylene group (—CF 2 —).

作為含氟單體之另一具體例,可列舉式(A-2)所表示之化合物。As another specific example of the fluorine-containing monomer, there can be mentioned a compound represented by formula (A-2).

[化10] [Chemistry 10]

式(A-2)中,R3 表示氫原子或甲基。又,R4 表示氟化烷二基、或於氟化烷二基中之碳-碳鍵及碳-氫鍵之一部分中插入有氧原子之基。存在複數個之R3 互相可相同亦可不同。In formula (A-2), R 3 represents a hydrogen atom or a methyl group. Also, R 4 represents a fluorinated alkanediyl group, or a group in which an oxygen atom is inserted into a portion of the carbon-carbon bond and the carbon-hydrogen bond of the fluorinated alkanediyl group. A plurality of R 3 groups may be the same or different.

氟化烷二基可稱為烷二基所具有之氫原子之一部分或全部被取代為氟原子之基。氟化烷二基之碳原子數並無特別限定,例如可為1以上,較佳為2以上,更佳為3以上,進而較佳為4以上。又,氟化烷二基之碳原子數例如可為17以下,較佳為12以下,更佳為10以下。The fluorinated alkanediyl group may be referred to as a group in which a part or all of the hydrogen atoms of the alkanediyl group are replaced by fluorine atoms. The number of carbon atoms of the fluorinated alkanediyl group is not particularly limited, and may be, for example, 1 or more, preferably 2 or more, more preferably 3 or more, and further preferably 4 or more. In addition, the number of carbon atoms of the fluorinated alkanediyl group may be, for example, 17 or less, preferably 12 or less, and more preferably 10 or less.

作為氟化烷二基,可適宜地使用包含二氟亞甲基(-CF2 -)之基。As the fluorinated alkanediyl group, a group containing a difluoromethylene group (—CF 2 —) can be suitably used.

作為氟化烷二基之具體例,可列舉:碳數1~17之直鏈狀或支鏈狀之氟化烷二基(例如2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9-十六氟-1,10-癸二基)、碳數1~17之氟化環烷二基等。Specific examples of fluorinated alkanediyl groups include linear or branched fluorinated alkanediyl groups having 1 to 17 carbon atoms (e.g., 2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9-hexafluoro-1,10-decanediyl) and fluorinated cycloalkanediyl groups having 1 to 17 carbon atoms.

氟化烷二基中之碳-碳鍵及碳-氫鍵之一部分中插入有氧原子之基(以下,亦稱為R4 之含氧基)可為於一處插入有氧原子之基,亦可為於兩處以上插入有氧原子之基。The group in which an oxygen atom is inserted into a portion of the carbon-carbon bond and carbon-hydrogen bond in the fluorinated alkanediyl group (hereinafter also referred to as an oxygen-containing group of R 4 ) may be a group in which an oxygen atom is inserted into one position or may be a group in which an oxygen atom is inserted into two or more positions.

再者,若於碳-碳鍵插入氧原子,則形成醚鍵。又,若於碳-氫鍵插入氧原子,則形成羥基。即,R4 之含氧基亦可稱為包含選自由醚鍵及羥基所組成之群中之至少一種之基。Furthermore, if an oxygen atom is inserted into a carbon-carbon bond, an ether bond is formed. Also, if an oxygen atom is inserted into a carbon-hydrogen bond, a hydroxyl group is formed. That is, the oxygen-containing group of R4 can also be referred to as a group containing at least one selected from the group consisting of an ether bond and a hydroxyl group.

作為R4 之含氧基之具體例,例如可列舉下述式所表示之基。As specific examples of the oxygen-containing group for R 4 , for example, groups represented by the following formulas can be cited.

[化11] [Chemistry 11]

式(A-2)所表示之化合物中之氟原子含量例如可為4質量%以上,較佳為8質量%以上,更佳為12質量%以上。又,式(A-2)所表示之化合物中之氟原子含量例如可為90質量%以下,較佳為75質量%以下,更佳為65質量%以下。The fluorine atom content in the compound represented by formula (A-2) may be, for example, 4% by mass or more, preferably 8% by mass or more, and more preferably 12% by mass or more. In addition, the fluorine atom content in the compound represented by formula (A-2) may be, for example, 90% by mass or less, preferably 75% by mass or less, and more preferably 65% by mass or less.

作為式(A-2)所表示之化合物之具體例之一,例如可列舉式(A-2-1)所表示之化合物。As one specific example of the compound represented by formula (A-2), for example, there can be mentioned a compound represented by formula (A-2-1).

[化12] [Chemistry 12]

式(A-2-1)中,R3 表示氫原子或甲基,R41 表示氫原子或氟原子,m表示1以上之整數。存在複數個之R3 互相可相同亦可不同。存在複數個之R41 互相可相同亦可不同。其中,R41 之至少一個為氟原子。In formula (A-2-1), R 3 represents a hydrogen atom or a methyl group, R 41 represents a hydrogen atom or a fluorine atom, and m represents an integer greater than 1. A plurality of R 3s may be the same or different from each other. A plurality of R 41s may be the same or different from each other. At least one of R 41s is a fluorine atom.

m只要為1以上即可,較佳為2以上,更佳為3以上,進而較佳為4以上。又,m之上限並無特別限定,例如可為20以下,較佳為17以下,更佳為15以下。m only needs to be 1 or more, preferably 2 or more, more preferably 3 or more, and further preferably 4 or more. The upper limit of m is not particularly limited, and for example, it may be 20 or less, preferably 17 or less, and further preferably 15 or less.

R41 於式(A-2-1)中存在複數個,其中之至少一個為氟原子。又,R41 中較佳為2個以上為氟原子,更佳為4個以上為氟原子。R41 可全部為氟原子。There are plural R 41's in formula (A-2-1), at least one of which is a fluorine atom. Preferably, 2 or more R 41's are fluorine atoms, more preferably 4 or more R 41's are fluorine atoms. All R 41's may be fluorine atoms.

氟原子之數量相對於R41 之合計數之比率例如可為1%以上,較佳為5%以上,更佳為10%以上。該比率例如可為100%以下,較佳為95%以下,更佳為90%以下。The ratio of the number of fluorine atoms to the total number of R 41 may be, for example, 1% or more, preferably 5% or more, more preferably 10% or more. The ratio may be, for example, 100% or less, preferably 95% or less, more preferably 90% or less.

式(A-2-1)所表示之化合物較佳為附有m之括號內之二價基(-C(R41 )2 -)中至少一個為二氟亞甲基(-CF2 -)。In the compound represented by the formula (A-2-1), at least one of the divalent groups (—C(R 41 ) 2 —) in the parentheses attached to m is preferably a difluoromethylene group (—CF 2 —).

作為含氟單體之另一具體例,可列舉式(A-3)所表示之化合物。As another specific example of the fluorine-containing monomer, there can be mentioned a compound represented by formula (A-3).

[化13] [Chemistry 13]

式(A-3)中,R5 表示氫原子或甲基。又,R6 表示單鍵、烷二基、氟化烷二基、或者於烷二基或氟化烷二基中之碳-碳鍵及碳-氫鍵之一部分中插入有氧原子之基。又,Ar1 表示氟化芳基。In formula (A-3), R 5 represents a hydrogen atom or a methyl group. Also, R 6 represents a single bond, an alkanediyl group, a fluorinated alkanediyl group, or a group in which an oxygen atom is inserted into a portion of the carbon-carbon bond and the carbon-hydrogen bond in the alkanediyl group or the fluorinated alkanediyl group. Also, Ar 1 represents a fluorinated aryl group.

再者,所謂「R6 表示單鍵」係指Ar1 與氧原子直接鍵結。Furthermore, the phrase "R 6 represents a single bond" means that Ar 1 is directly bonded to the oxygen atom.

作為Ar1 之氟化芳基,較佳為氟化苯基。氟化苯基亦可稱為苯基中之氫原子之1~5個被取代為氟原子之基。氟化苯基可為具有1個以上氟原子者,亦可為具有5個者。The fluorinated aryl group as Ar 1 is preferably a fluorinated phenyl group. The fluorinated phenyl group may also be referred to as a group in which 1 to 5 hydrogen atoms in the phenyl group are substituted with fluorine atoms. The fluorinated phenyl group may have one or more fluorine atoms, or may have five fluorine atoms.

R6 之烷二基之碳原子數並無特別限定,例如可為1以上。又,R6 之烷二基之碳原子數例如可為17以下,較佳為15以下,更佳為12以下。The number of carbon atoms in the alkanediyl group of R 6 is not particularly limited, and may be, for example, 1 or more. The number of carbon atoms in the alkanediyl group of R 6 may be, for example, 17 or less, preferably 15 or less, and more preferably 12 or less.

作為烷二基之具體例,可列舉:碳數1~17之直鏈狀或支鏈狀之烷二基(例如亞甲基、伸乙基等)、碳數1~17之環烷二基等。Specific examples of the alkanediyl group include a linear or branched alkanediyl group having 1 to 17 carbon atoms (e.g., a methylene group, an ethylene group, etc.), a cycloalkanediyl group having 1 to 17 carbon atoms, and the like.

R6 之氟化烷二基可稱為上述烷二基所具有之氫原子之一部分或全部被取代為氟原子之基。R6 之氟化烷二基之碳原子數並無特別限定,例如可為1以上。又,R6 之氟化烷二基之碳原子數例如可為17以下,較佳為15以下,更佳為12以下。The fluorinated alkanediyl group of R 6 can be referred to as a group in which a part or all of the hydrogen atoms of the above-mentioned alkanediyl group are replaced by fluorine atoms. The number of carbon atoms of the fluorinated alkanediyl group of R 6 is not particularly limited, and can be, for example, 1 or more. In addition, the number of carbon atoms of the fluorinated alkanediyl group of R 6 can be, for example, 17 or less, preferably 15 or less, and more preferably 12 or less.

作為R6 之氟化烷二基,可適宜地使用包含二氟亞甲基(-CF2 -)之基。As the fluorinated alkanediyl group for R 6 , a group containing a difluoromethylene group (—CF 2 —) can be suitably used.

烷二基或氟化烷二基中之碳-碳鍵及碳-氫鍵之一部分中插入有氧原子之基(以下,亦稱為R6 之含氧基)可為於一處插入有氧原子之基,亦可為於兩處以上插入有氧原子之基。The group in which an oxygen atom is inserted into a portion of the carbon-carbon bond and carbon-hydrogen bond in the alkanediyl group or the fluorinated alkanediyl group (hereinafter also referred to as the oxygen-containing group of R 6 ) may be a group in which an oxygen atom is inserted at one position or may be a group in which an oxygen atom is inserted at two or more positions.

再者,若於碳-碳鍵插入氧原子,則形成醚鍵。又,若於碳-氫鍵插入氧原子,則形成羥基。即,R6 之含氧基亦可稱為包含選自由醚鍵及羥基所組成之群中之至少一種之基。Furthermore, if an oxygen atom is inserted into a carbon-carbon bond, an ether bond is formed. Also, if an oxygen atom is inserted into a carbon-hydrogen bond, a hydroxyl group is formed. That is, the oxygen-containing group of R 6 can also be referred to as a group containing at least one selected from the group consisting of an ether bond and a hydroxyl group.

作為R6 之含氧基之具體例,例如可列舉包含-CH2 CH2 O-之基等。Specific examples of the oxygen-containing group for R 6 include, for example, a group containing -CH 2 CH 2 O-.

式(A-3)所表示之化合物中之氟原子含量例如可為3質量%以上,較佳為7質量%以上,更佳為15質量%以上。又,式(A-3)所表示之化合物中之氟原子含量例如可為90質量%以下,較佳為80質量%以下,更佳為70質量%以下。The fluorine atom content in the compound represented by formula (A-3) may be, for example, 3% by mass or more, preferably 7% by mass or more, and more preferably 15% by mass or more. In addition, the fluorine atom content in the compound represented by formula (A-3) may be, for example, 90% by mass or less, preferably 80% by mass or less, and more preferably 70% by mass or less.

作為式(A-3)所表示之化合物之具體例之一,例如可列舉式(A-3-1)所表示之化合物。As one specific example of the compound represented by formula (A-3), for example, there can be mentioned a compound represented by formula (A-3-1).

[化14] [Chemistry 14]

式(A-3-1)中,R5 表示氫原子或甲基,R61 表示氫原子或氟原子,R62 表示氫原子或氟原子,p表示0以上之整數。於p為1以上時,存在複數個之R61 互相可相同亦可不同。又,存在複數個之R62 互相可相同亦可不同。其中,R62 之至少一個為氟原子。In formula (A-3-1), R 5 represents a hydrogen atom or a methyl group, R 61 represents a hydrogen atom or a fluorine atom, R 62 represents a hydrogen atom or a fluorine atom, and p represents an integer greater than or equal to 0. When p is greater than or equal to 1, a plurality of R 61s may be the same or different from each other. In addition, a plurality of R 62s may be the same or different from each other. Among them, at least one of R 62s is a fluorine atom.

p表示0以上之整數。此處,所謂p為0表示苯環與氧原子直接鍵結。p可為1以上之整數。又,p之上限並無特別限定,例如可為17以下,較佳為15以下,更佳為12以下。p represents an integer greater than or equal to 0. Here, p being 0 indicates that the benzene ring and the oxygen atom are directly bonded. p may be an integer greater than or equal to 1. In addition, the upper limit of p is not particularly limited, and may be, for example, 17 or less, preferably 15 or less, and more preferably 12 or less.

於在式(A-3-1)中存在R61 時(即,於p為1以上之整數時),R61 可全部為氫原子,可全部為氟原子,亦可一部分為氫原子而另一部分為氟原子。When R 61 exists in formula (A-3-1) (ie, when p is an integer greater than or equal to 1), all R 61 may be hydrogen atoms, all may be fluorine atoms, or a part may be hydrogen atoms and the other part may be fluorine atoms.

R62 於式(A-3-1)中存在複數個,其中之至少1個為氟原子。又,R62 中可2個以上為氟原子,亦可3個以上為氟原子以上。又,R62 可全部(5個)為氟原子。There are plural R 62 in formula (A-3-1), at least one of which is a fluorine atom. Moreover, two or more R 62 may be fluorine atoms, or three or more R 62 may be fluorine atoms. Moreover, all (5) R 62 may be fluorine atoms.

氟原子之數量相對於R61 及R62 之合計數之比率例如可為5%以上,較佳為10%以上,更佳為20%以上。該比率例如可為100%以下,較佳為95%以下,更佳為80%以下。The ratio of the number of fluorine atoms to the total number of R 61 and R 62 may be, for example, 5% or more, preferably 10% or more, more preferably 20% or more. The ratio may be, for example, 100% or less, preferably 95% or less, more preferably 80% or less.

含氟單體並不限定於上述化合物。The fluorine-containing monomers are not limited to the above compounds.

本實施形態之密封劑可進而含有含氟單體以外之其他單體成分(以下,亦稱為(B)成分)。(B)成分只要為可與含氟單體((A)成分)共聚合之化合物即可,例如可為具有可與(甲基)丙烯醯基共聚合之聚合性基之化合物。The sealant of this embodiment may further contain other monomer components (hereinafter, also referred to as component (B)) in addition to the fluorinated monomer. Component (B) may be any compound that can copolymerize with the fluorinated monomer (component (A)), for example, a compound having a polymerizable group that can copolymerize with a (meth)acryloyl group.

作為(B)成分所具有之聚合性基,例如可列舉:乙烯基、(甲基)丙烯醯基、烯丙基、乙烯醚基、乙烯酯基等,該等中,較佳為(甲基)丙烯醯基。Examples of the polymerizable group possessed by the component (B) include a vinyl group, a (meth)acryl group, an allyl group, a vinyl ether group, a vinyl ester group, and the like. Among these, a (meth)acryl group is preferred.

作為(B)成分,可適宜地使用具有(甲基)丙烯醯基之單體。即,(B)成分較佳為不具有氟原子且具有(甲基)丙烯醯基之單體。As the component (B), a monomer having a (meth)acryl group can be suitably used. That is, the component (B) is preferably a monomer having no fluorine atom and having a (meth)acryl group.

作為(B)成分,例如可列舉:(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸苄酯、乙氧基化鄰苯基苯酚丙烯酸酯等單官能(甲基)丙烯酸酯;1,6-己二醇二(甲基)丙烯酸酯、1,12-十二烷二醇二(甲基)丙烯酸酯、二羥甲基三環癸烷二(甲基)丙烯酸酯等多官能(甲基)丙烯酸酯等。Examples of the component (B) include monofunctional (meth)acrylates such as ethyl (meth)acrylate, butyl (meth)acrylate, benzyl (meth)acrylate, and ethoxylated o-phenylphenol acrylate; and polyfunctional (meth)acrylates such as 1,6-hexanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, and dihydroxymethyltricyclodecane di(meth)acrylate.

作為(B)成分之適宜之一例,可列舉具有環狀結構之單體(以下,亦稱為(B-1)成分)。作為(B-1)成分所具有之環狀結構,例如可列舉:環狀醯胺、四氫呋喃環、哌啶環等雜環;環戊烷環、環己烷環、環己烯環、環十二碳三烯環、降𦯉烷環、金剛烷環等脂肪族烴環;苯環等芳香族烴環,該等中,較佳為選自由脂肪族烴環及芳香族烴環所組成之群中之至少一種。再者,(B-1)成分不具有氟原子,而與上述含氟單體區別開來。As a suitable example of the component (B), a monomer having a cyclic structure (hereinafter, also referred to as the component (B-1)) can be cited. Examples of the cyclic structure possessed by the component (B-1) include: heterocyclic rings such as cyclic amide, tetrahydrofuran ring, piperidine ring, etc.; aliphatic hydrocarbon rings such as cyclopentane ring, cyclohexane ring, cyclohexene ring, cyclododecatriene ring, norethane ring, and adamantane ring; and aromatic hydrocarbon rings such as benzene ring. Among them, at least one selected from the group consisting of aliphatic hydrocarbon rings and aromatic hydrocarbon rings is preferred. Furthermore, the component (B-1) does not have a fluorine atom, and is distinguished from the above-mentioned fluorine-containing monomers.

(B-1)成分中,作為具有芳香族烴環之單體,可列舉: (甲基)丙烯酸苄酯、(甲基)丙烯酸4-丁基苯酯、(甲基)丙烯酸苯酯、(甲基)丙烯酸2,4,5-四甲基苯酯、(甲基)丙烯酸4-氯苯酯、(甲基)丙烯酸苯氧基甲酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸2-羥基-3-苯氧基丙酯(2-HPA)、2-羥基丙基鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、EO(Ethylene Oxide,環氧乙烷)改性苯酚(甲基)丙烯酸酯、EO(環氧乙烷)改性甲酚(甲基)丙烯酸酯、EO改性壬基苯酚(甲基)丙烯酸酯、PO(環氧丙烷)改性壬基苯酚(甲基)丙烯酸酯、乙氧基化鄰苯基苯酚(甲基)丙烯酸酯、(甲基)丙烯酸間苯氧基苄酯等單官能單體; 乙氧基化雙酚A二(甲基)丙烯酸酯、丙氧基化雙酚A二(甲基)丙烯酸酯、丙氧基化乙氧基化雙酚A二(甲基)丙烯酸酯、雙酚A環氧二(甲基)丙烯酸酯等多官能單體等。In the component (B-1), monomers having an aromatic hydrocarbon ring include: benzyl (meth)acrylate, 4-butylphenyl (meth)acrylate, phenyl (meth)acrylate, 2,4,5-tetramethylphenyl (meth)acrylate, 4-chlorophenyl (meth)acrylate, phenoxymethyl (meth)acrylate, phenoxyethyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate (2-HPA), 2-(meth)acryloyloxyethyl 2-hydroxypropylphthalate, EO (Ethylene Oxide, ethylene oxide) modified phenol (meth) acrylate, EO (ethylene oxide) modified cresol (meth) acrylate, EO modified nonylphenol (meth) acrylate, PO (propylene oxide) modified nonylphenol (meth) acrylate, ethoxylated o-phenylphenol (meth) acrylate, m-phenoxybenzyl (meth) acrylate and other monofunctional monomers; ethoxylated bisphenol A di(meth) acrylate, propoxylated bisphenol A di(meth) acrylate, propoxylated ethoxylated bisphenol A di(meth) acrylate, bisphenol A epoxy di(meth) acrylate and other multifunctional monomers.

作為具有芳香族烴環之單體,更佳為具有2個苯環之單體,作為該單體,例如可列舉:乙氧基化鄰苯基苯酚(甲基)丙烯酸酯、(甲基)丙烯酸間苯氧基苄酯、乙氧基化雙酚A二(甲基)丙烯酸酯,尤佳為選自由乙氧基化鄰苯基苯酚(甲基)丙烯酸酯及乙氧基化雙酚A二(甲基)丙烯酸酯所組成之群中之至少一種。The monomer having an aromatic hydrocarbon ring is preferably a monomer having two benzene rings. Examples of such monomers include ethoxylated o-phenylphenol (meth)acrylate, m-phenoxybenzyl (meth)acrylate, and ethoxylated bisphenol A di(meth)acrylate. It is particularly preferred to be at least one selected from the group consisting of ethoxylated o-phenylphenol (meth)acrylate and ethoxylated bisphenol A di(meth)acrylate.

作為乙氧基化鄰苯基苯酚(甲基)丙烯酸酯,例如較佳為下述式(B-1-1)所表示之化合物。As the ethoxylated o-phenylphenol (meth)acrylate, for example, a compound represented by the following formula (B-1-1) is preferred.

[化15] [Chemistry 15]

式(B-1-1)中,q表示1以上之整數(較佳為1~5),R7 表示氫原子或甲基。In formula (B-1-1), q represents an integer greater than or equal to 1 (preferably 1 to 5), and R7 represents a hydrogen atom or a methyl group.

作為乙氧基化雙酚A二(甲基)丙烯酸酯,例如較佳為下述式(B-1-2)所表示之化合物。As the ethoxylated bisphenol A di(meth)acrylate, for example, a compound represented by the following formula (B-1-2) is preferred.

[化16] [Chemistry 16]

式(B-1-2)中,r及s分別獨立地表示1以上之整數(較佳為r+s=2~10),R8 及R9 分別獨立表示地氫原子或甲基。In formula (B-1-2), r and s each independently represent an integer greater than 1 (preferably r+s=2 to 10), and R 8 and R 9 each independently represent a hydrogen atom or a methyl group.

(B-1)成分中,作為具有脂肪族烴環之單體,例如可列舉:(甲基)丙烯酸環己酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸二環戊氧基乙酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊烯氧基乙酯、(甲基)丙烯酸異𦯉酯、甲氧基化環癸三烯(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、六氫鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯等。In the component (B-1), examples of the monomer having an aliphatic hydrocarbon ring include cyclohexyl (meth)acrylate, dicyclopentyl (meth)acrylate, dicyclopentyloxyethyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, isobutylene (meth)acrylate, methoxylated cyclodecatriene (meth)acrylate, tricyclodecanedimethanol di(meth)acrylate, and 2-(meth)acryloyloxyethyl hexahydrophthalate.

作為具有脂肪族烴環之單體,更佳為具有選自由降𦯉烷環及環戊烷環所組成之群中之至少一種之單體,作為該單體,例如可列舉:三環癸烷二甲醇二(甲基)丙烯酸酯、(甲基)丙烯酸二環戊氧基乙酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊烯氧基乙酯,尤佳為選自由(甲基)丙烯酸二環戊酯及三環癸烷二甲醇二(甲基)丙烯酸酯所組成之群中之至少一種。The monomer having an aliphatic hydrocarbon ring is preferably a monomer having at least one selected from the group consisting of a isocyanate ring and a cyclopentane ring. Examples of such monomers include tricyclodecanedimethanol di(meth)acrylate, dicyclopentyloxyethyl (meth)acrylate, dicyclopentenyl (meth)acrylate, and dicyclopentenyloxyethyl (meth)acrylate. Particularly preferred is at least one selected from the group consisting of dicyclopentyl (meth)acrylate and tricyclodecanedimethanol di(meth)acrylate.

作為(B-1)成分,就容易獲得低透濕性更優異之密封材之觀點而言,較佳為分子內具有2個以上環狀結構之單體,更佳為分子內具有2個環狀結構之單體。From the viewpoint of easily obtaining a sealing material having a low moisture permeability and being more excellent, the component (B-1) is preferably a monomer having two or more ring structures in the molecule, and more preferably a monomer having two ring structures in the molecule.

作為分子內具有2個以上環狀結構之單體,例如可列舉: 選自由乙氧基化鄰苯基苯酚(甲基)丙烯酸酯、(甲基)丙烯酸間苯氧基苄酯及乙氧基化雙酚A二(甲基)丙烯酸酯所組成之群中之具有芳香族烴環之單體; 三環癸烷二甲醇二(甲基)丙烯酸酯、(甲基)丙烯酸二環戊氧基乙酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊烯氧基乙酯等具有脂肪族烴環之單體。Examples of monomers having two or more ring structures in the molecule include: Monomers having aromatic hydrocarbon rings selected from the group consisting of ethoxylated o-phenylphenol (meth)acrylate, m-phenoxybenzyl (meth)acrylate, and ethoxylated bisphenol A di(meth)acrylate; Monomers having aliphatic hydrocarbon rings such as tricyclodecane dimethanol di(meth)acrylate, dicyclopentyloxyethyl (meth)acrylate, dicyclopentenyl (meth)acrylate, and dicyclopentenyloxyethyl (meth)acrylate.

就容易獲得低透濕性更優異之密封材之觀點而言,(B-1)成分較佳為選自由乙氧基化鄰苯基苯酚(甲基)丙烯酸酯、(甲基)丙烯酸間苯氧基苄酯、三環癸烷二甲醇二(甲基)丙烯酸酯及乙氧基化雙酚A二(甲基)丙烯酸酯所組成之群。From the viewpoint of easily obtaining a sealing material with a lower moisture permeability and better performance, the component (B-1) is preferably selected from the group consisting of ethoxylated o-phenylphenol (meth)acrylate, m-phenoxybenzyl (meth)acrylate, tricyclodecanedimethanol di(meth)acrylate and ethoxylated bisphenol A di(meth)acrylate.

作為(B)成分之適宜之另一例,可列舉具有碳數6以上之烷二基之烷二醇二(甲基)丙烯酸酯(以下,亦稱為(B-2)成分)。(B-2)成分所具有之烷二基之碳數較佳為1~20,更佳為6~15,進而較佳為9~12。又,(B-2)成分所具有之烷二基較佳為α,ω-烷二基。再者,(B-2)成分不具有氟原子,而與上述含氟單體區別開來。As another suitable example of the component (B), there can be cited an alkanediol di(meth)acrylate having an alkanediyl group having 6 or more carbon atoms (hereinafter, also referred to as the component (B-2)). The carbon number of the alkanediyl group possessed by the component (B-2) is preferably 1 to 20, more preferably 6 to 15, and further preferably 9 to 12. Furthermore, the alkanediyl group possessed by the component (B-2) is preferably an α,ω-alkanediyl group. Furthermore, the component (B-2) does not have a fluorine atom, and is distinguished from the above-mentioned fluorine-containing monomer.

作為(B-2)成分,例如可列舉:1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、1,10-癸二醇二(甲基)丙烯酸酯、1,12-十二烷二醇二(甲基)丙烯酸酯等,較佳為選自由1,9-壬二醇二(甲基)丙烯酸酯、1,10-癸二醇二(甲基)丙烯酸酯、1,12-十二烷二醇二(甲基)丙烯酸酯所組成之群中之至少一種,更佳為1,12-十二烷二醇二(甲基)丙烯酸酯。Component (B-2) includes, for example, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, etc. Preferably, it is at least one selected from the group consisting of 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, and 1,12-dodecanediol di(meth)acrylate, and more preferably, it is 1,12-dodecanediol di(meth)acrylate.

於本實施形態中,含氟單體於全部單體成分中所占之比率較佳為3質量%以上,更佳為5質量%以上,進而較佳為10質量%以上。該比率之上限並無特別限定,例如可為100質量%。In this embodiment, the ratio of the fluorine-containing monomer to the total monomer components is preferably 3 mass % or more, more preferably 5 mass % or more, and further preferably 10 mass % or more. The upper limit of the ratio is not particularly limited, and may be, for example, 100 mass %.

關於相對於單體成分之總量之氟原子含量,就潤濕性及接著性之觀點而言,例如可為0.1質量%以上,較佳為0.3質量%以上,更佳為1質量%以上,進而較佳為2質量%以上,最佳為5質量%以上。又,關於氟原子之含量,以單體成分之總量基準計,例如可為75質量%以下,較佳為70質量%以下,更佳為65質量%以下。Regarding the fluorine atom content relative to the total amount of the monomer components, from the viewpoint of wettability and adhesion, it can be, for example, 0.1 mass % or more, preferably 0.3 mass % or more, more preferably 1 mass % or more, further preferably 2 mass % or more, and most preferably 5 mass % or more. In addition, regarding the fluorine atom content, based on the total amount of the monomer components, it can be, for example, 75 mass % or less, preferably 70 mass % or less, and more preferably 65 mass % or less.

光聚合起始劑只要為藉由可見光、紫外線等活性光線而活化,可開始或促進包含含氟單體之單體成分之化合物即可。光聚合起始劑可單獨使用1種,亦可組合2種以上而使用。作為光聚合起始劑,較佳為光自由基聚合起始劑。The photopolymerization initiator may be any compound that can be activated by active light such as visible light or ultraviolet light and can start or promote the monomer component containing the fluorine-containing monomer. The photopolymerization initiator may be used alone or in combination of two or more. As the photopolymerization initiator, a photoradical polymerization initiator is preferred.

作為光自由基聚合起始劑,可列舉: 二苯甲酮及其衍生物; 苯偶醯及其衍生物; 蒽醌及其衍生物; 安息香、安息香甲醚、安息香乙醚、安息香丙醚、安息香異丁醚、苯偶醯二甲基縮酮等安息香型光聚合起始劑; 二乙氧基苯乙酮、4-第三丁基三氯苯乙酮等苯乙酮型光聚合起始劑; 苯甲酸2-二甲基胺基乙酯; 苯甲酸對二甲基胺基乙酯; 二苯基二硫醚; 9-氧硫及其衍生物; 樟腦醌、7,7-二甲基-2,3-二氧代雙環[2.2.1]庚烷-1-羧酸、7,7-二甲基-2,3-二氧代雙環[2.2.1]庚烷-1-羧基-2-溴乙酯、7,7-二甲基-2,3-二氧代雙環[2.2.1]庚烷-1-羧基-2-甲酯、7,7-二甲基-2,3-二氧代雙環[2.2.1]庚烷-1-羧醯氯等樟腦醌型光聚合起始劑; 2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮-1等α-胺基烷基苯酮型光聚合起始劑; 苯甲醯基二苯基氧化膦、2,4,6-三甲基苯甲醯基二苯基氧化膦、苯甲醯基二乙氧基氧化膦、2,4,6-三甲基苯甲醯基二甲氧基苯基氧化膦、2,4,6-三甲基苯甲醯基二乙氧基苯基氧化膦、雙(2,4,6-三甲基苯甲醯基)苯基氧化膦等醯基氧化膦型光聚合起始劑; 苯基乙醛酸甲酯; 羥基-苯基-乙酸2-[2-氧代-2-苯基-乙醯氧基-乙氧基]乙酯; 羥基-苯基-乙酸2-[2-羥基-乙氧基]乙酯等。As the photo-free radical polymerization initiator, there can be listed: benzophenone and its derivatives; benzoyl and its derivatives; anthraquinone and its derivatives; benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isobutyl ether, benzoyl dimethyl ketal and other benzoin-type photopolymerization initiators; diethoxyacetophenone, 4-tert-butyltrichloroacetophenone and other acetophenone-type photopolymerization initiators; 2-dimethylaminoethyl benzoate; p-dimethylaminoethyl benzoate; diphenyl disulfide; 9-oxysulfide and its derivatives; camphorquinone type photopolymerization initiators such as 7,7-dimethyl-2,3-dioxobicyclo[2.2.1]heptane-1-carboxylic acid, 7,7-dimethyl-2,3-dioxobicyclo[2.2.1]heptane-1-carboxy-2-bromoethyl ester, 7,7-dimethyl-2,3-dioxobicyclo[2.2.1]heptane-1-carboxy-2-methyl ester, and 7,7-dimethyl-2,3-dioxobicyclo[2.2.1]heptane-1-carboxylic acid chloride; α-aminoalkylphenone type photopolymerization initiators such as 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinylpropane-1-one and 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-butanone-1; Acylphosphine oxide type photopolymerization initiators such as benzoyldiphenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, benzoyldiethoxyphosphine oxide, 2,4,6-trimethylbenzoyldimethoxyphenylphosphine oxide, 2,4,6-trimethylbenzoyldiethoxyphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide; Methyl phenylglyoxylate; 2-[2-oxo-2-phenyl-acetyloxy-ethoxy]ethyl hydroxy-phenyl-acetate; Hydroxy-phenyl-acetic acid 2-[2-hydroxy-ethoxy]ethyl ester, etc.

作為光聚合起始劑,就可僅使用390 nm以上之可見光進行硬化之觀點而言,較佳為醯基氧化膦型光聚合起始劑。再者,醯基氧化膦型光聚合起始劑亦可稱為具有醯基氧化膦基(-(C=O)-(P=O)<)之光聚合起始劑。又,就可利用395 nm以上之光進行硬化,容易獲得可見光透過率更高之硬化體之觀點而言,尤佳為2,4,6-三甲基苯甲醯基二苯基氧化膦。作為2,4,6-三甲基苯甲醯基二苯基氧化膦,例如可列舉BASF Japan公司製造之「Irgacure TPO」等。As a photopolymerization initiator, from the viewpoint that curing can be performed using only visible light above 390 nm, an acylphosphine oxide type photopolymerization initiator is preferred. Furthermore, an acylphosphine oxide type photopolymerization initiator can also be referred to as a photopolymerization initiator having an acylphosphine oxide group (-(C=O)-(P=O)<). Moreover, from the viewpoint that curing can be performed using light above 395 nm, and a cured body with a higher visible light transmittance can be easily obtained, 2,4,6-trimethylbenzyldiphenylphosphine oxide is particularly preferred. As 2,4,6-trimethylbenzyldiphenylphosphine oxide, for example, "Irgacure TPO" manufactured by BASF Japan can be cited.

關於光聚合起始劑之含量,相對於單體成分之總量100質量份,較佳為0.05質量份以上,更佳為0.5質量份以上,進而較佳為2質量份以上,更佳為2.5質量份以上。藉由增加光聚合起始劑之含量,有密封劑之硬化性能進一步提高之傾向。關於光聚合起始劑之含量,相對於單體成分之總量100質量份,較佳為12質量份以下,更佳為8質量份以下,進而較佳為6質量份以下。藉由減少光聚合起始劑之含量,容易獲得可見光透過率更高之硬化體。The content of the photopolymerization initiator is preferably 0.05 parts by mass or more, more preferably 0.5 parts by mass or more, further preferably 2 parts by mass or more, and further preferably 2.5 parts by mass or more, relative to 100 parts by mass of the total amount of the monomer components. By increasing the content of the photopolymerization initiator, the curing performance of the sealant tends to be further improved. The content of the photopolymerization initiator is preferably 12 parts by mass or less, more preferably 8 parts by mass or less, and further preferably 6 parts by mass or less, relative to 100 parts by mass of the total amount of the monomer components. By reducing the content of the photopolymerization initiator, it is easy to obtain a cured body with a higher visible light transmittance.

本實施形態之密封劑可進而含有單體成分及光聚合起始劑以外之其他成分。本實施形態之密封劑例如可進而含有該技術領域中所使用之公知之添加劑作為其他成分。作為添加劑,例如可列舉:抗氧化劑、金屬減活劑、填料、穩定劑、中和劑、潤滑劑、抗菌劑等。The sealant of the present embodiment may further contain other components besides the monomer component and the photopolymerization initiator. The sealant of the present embodiment may further contain, for example, known additives used in the art as other components. Examples of additives include antioxidants, metal deactivators, fillers, stabilizers, neutralizers, lubricants, antibacterial agents, and the like.

本實施形態之密封劑之表面張力、尤其是靜態表面張力較佳為40 mN/m以下,更佳為30 mN/m以下。藉此,容易利用噴墨等進行塗佈,作業性提高。又,藉此,有對基板等之密接性提高,防濕性及接著性進一步提高之傾向。靜態表面張力之下限並無特別限定,例如可為10 mN/m以上。The surface tension, especially the static surface tension, of the sealant of this embodiment is preferably 40 mN/m or less, and more preferably 30 mN/m or less. This makes it easier to apply the sealant by inkjet, etc., and improves workability. In addition, this improves adhesion to substrates, etc., and tends to further improve moisture resistance and adhesion. The lower limit of the static surface tension is not particularly limited, and may be, for example, 10 mN/m or more.

再者,靜態表面張力係藉由平板法(Plate Method)、環法(Ring Method)、懸滴法等加以測定,本實施形態中所規定之靜態表面張力之值係依據懸滴法者。所謂懸滴法係指自管之前端擠出液體,根據懸垂之懸滴(Pendant Drop)之形狀算出表面張力之方法。Furthermore, static surface tension is measured by the plate method, ring method, pendant drop method, etc. The static surface tension value specified in this embodiment is based on the pendant drop method. The so-called pendant drop method refers to a method of squeezing liquid out of the front end of a tube and calculating the surface tension based on the shape of the pendant drop.

本實施形態之密封劑可藉由照射可見光或紫外線之至少一種而進行硬化。再者,於本說明書中,密封劑之所謂「硬化」,未必限定於剛性地固化,只要單體成分進行聚合而形成聚合物即可。例如,密封劑之硬化體可為剛性之固體(例如玻璃狀),亦可為橡膠狀。The sealant of this embodiment can be cured by irradiating at least one of visible light or ultraviolet light. In addition, in this specification, the so-called "curing" of the sealant is not necessarily limited to rigid curing, as long as the monomer components are polymerized to form a polymer. For example, the cured body of the sealant can be a rigid solid (such as glass) or a rubber.

作為用以照射可見光或紫外線之能量照射源,可列舉:氘燈、高壓水銀燈、超高壓水銀燈、低壓水銀燈、氙氣燈、氙氣-水銀混合燈、鹵素燈、準分子燈、銦燈、鉈燈、LED(Light Emitting Diode,發光二極體)燈、無電極放電燈等能量照射源。Examples of energy irradiation sources for irradiating visible light or ultraviolet light include: deuterium lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, low-pressure mercury lamps, xenon lamps, xenon-mercury mixed lamps, halogen lamps, excimer lamps, indium lamps, cobalt lamps, LED (Light Emitting Diode) lamps, electrodeless discharge lamps, and the like.

本實施形態之密封劑就不易對有機EL顯示元件造成損傷之觀點而言,較佳為利用380 nm以上之波長之光進行硬化,更佳為利用395 nm以上之波長之光進行硬化,最佳為利用395 nm之波長之光進行硬化。作為照射光之波長,就避免由紅外光所引起之照射部之溫度上升,對有機EL顯示元件造成損傷之可能性較小之方面而言,較佳為500 nm以下。作為能量照射源,較佳為發光波長為單波長之LED燈。From the viewpoint of not easily damaging the organic EL display element, the sealant of this embodiment is preferably cured by light with a wavelength of 380 nm or more, more preferably by light with a wavelength of 395 nm or more, and most preferably by light with a wavelength of 395 nm. As for the wavelength of the irradiated light, it is preferably 500 nm or less in order to avoid the temperature rise of the irradiated part caused by infrared light and to reduce the possibility of damaging the organic EL display element. As the energy irradiation source, it is preferably an LED lamp with a single wavelength of light emission.

使密封劑硬化時之照射量較佳為100~8000 mJ/cm2 ,更佳為300~2000 mJ/cm2 。藉由將照射量設為100 mJ/cm2 以上,密封劑充分地硬化,容易獲得較高之接著強度。又,藉由將照射量設為8000 mJ/cm2 以下,可於不對有機EL顯示元件造成損傷之情況下使密封劑硬化。The irradiation dose when curing the sealant is preferably 100 to 8000 mJ/cm 2 , more preferably 300 to 2000 mJ/cm 2 . By setting the irradiation dose to 100 mJ/cm 2 or more, the sealant is sufficiently cured and a high bonding strength is easily obtained. By setting the irradiation dose to 8000 mJ/cm 2 or less, the sealant can be cured without causing damage to the organic EL display element.

本實施形態之密封劑之硬化體較理想為透明性優異。具體而言,硬化體之360 nm以上800 nm以下之紫外-可見光範圍之分光透過率於厚度每10 μm下較佳為95%以上,更佳為97%以上,進而較佳為99%以上。若該分光透過率為95%以上,則容易獲得亮度及對比度優異之有機EL顯示裝置。The cured sealant of this embodiment is preferably excellent in transparency. Specifically, the spectral transmittance of the cured sealant in the ultraviolet-visible light range of 360 nm to 800 nm is preferably 95% or more per 10 μm of thickness, more preferably 97% or more, and further preferably 99% or more. If the spectral transmittance is 95% or more, it is easy to obtain an organic EL display device with excellent brightness and contrast.

本實施形態之密封劑之硬化體依據JIS Z 0208:1976,於23℃、90%RH之環境下暴露24小時測得之100 μm厚下之透濕度之值較佳為350 g/m2 以下,更佳為150 g/m2 以下,進而較佳為75 g/m2 以下。若透濕度較低,則可抑制由水分到達有機發光材料層所引起之暗點之產生。The moisture permeability of the cured sealant of this embodiment is preferably 350 g/m 2 or less, more preferably 150 g/m 2 or less, and further preferably 75 g/m 2 or less , at a thickness of 100 μm, measured in an environment of 23°C and 90% RH for 24 hours in accordance with JIS Z 0208:1976. If the moisture permeability is lower, the generation of dark spots caused by moisture reaching the organic light-emitting material layer can be suppressed.

本實施形態之密封劑之使用方法並無特別限定。例如,藉由在對象物(例如有機EL顯示元件)上塗佈密封劑,並於對象物上使密封劑硬化,可形成包含密封劑之硬化體之密封材。The method of using the sealant of this embodiment is not particularly limited. For example, by applying the sealant on an object (such as an organic EL display element) and curing the sealant on the object, a sealant including a cured body of the sealant can be formed.

又,可使密封劑以特定之形狀(例如膜狀、片狀等)硬化,而形成具有特定之形狀之密封材。於該情形時,例如,藉由將該密封材配置於有機EL顯示元件上,可將有機EL顯示元件密封。Furthermore, the sealant can be cured in a specific shape (e.g., film, sheet, etc.) to form a sealant having a specific shape. In this case, for example, the organic EL display element can be sealed by placing the sealant on the organic EL display element.

以下,對於使用本實施形態之密封劑而形成之有機EL顯示裝置之一態樣,以頂部發光型之有機EL顯示裝置為例而進行說明。再者,應用本實施形態之密封劑之有機EL顯示裝置並不限定於頂部發光型,亦可為自基板側照射於有機EL層中所產生之光之底部發光型之有機EL顯示裝置。Hereinafter, an organic EL display device formed by using the sealant of the present embodiment will be described by taking a top-emission type organic EL display device as an example. Furthermore, the organic EL display device to which the sealant of the present embodiment is applied is not limited to the top-emission type, and may also be a bottom-emission type organic EL display device in which light generated in the organic EL layer is irradiated from the substrate side.

頂部發光型之有機EL顯示裝置具備:有機EL顯示元件;密封層,其將有機EL顯示元件密封;及密封基板,其係設置於密封層上。A top-emitting organic EL display device includes: an organic EL display element; a sealing layer that seals the organic EL display element; and a sealing substrate that is disposed on the sealing layer.

有機EL顯示元件例如具有於基板上依序積層有陽極、包含發光層之有機EL層、及陰極之構造。An organic EL display element has, for example, a structure in which an anode, an organic EL layer including a light-emitting layer, and a cathode are sequentially stacked on a substrate.

作為有機EL顯示元件之基板,例如可列舉:玻璃基板、矽基板、塑膠基板等。該等中,較佳為選自由玻璃基板及塑膠基板所組成之群中之至少一種,更佳為玻璃基板。As the substrate of the organic EL display element, for example, there can be listed: a glass substrate, a silicon substrate, a plastic substrate, etc. Among them, at least one selected from the group consisting of a glass substrate and a plastic substrate is preferred, and a glass substrate is more preferred.

作為塑膠基板所使用之塑膠,可列舉:聚醯亞胺、聚醚醯亞胺、聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚㗁二唑、芳香族聚醯胺、聚苯并咪唑、聚苯并雙噻唑、聚苯并㗁唑、聚噻唑、聚對苯乙炔、聚甲基丙烯酸甲酯、聚苯乙烯、聚碳酸酯、聚環烯烴、聚丙烯酸等。該等中,就低水分透過性、低氧透過性、耐熱性優異之方面而言,較佳為由聚醯亞胺、聚醚醯亞胺、聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚㗁二唑、芳香族聚醯胺、聚苯并咪唑、聚苯并雙噻唑、聚苯并㗁唑、聚噻唑、聚對苯乙炔所組成之群中之1種以上,就紫外線或可見光等能量線之透過性較高之方面而言,更佳為由聚醯亞胺、聚醚醯亞胺、聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯所組成之群中之1種以上。Examples of plastics used for plastic substrates include polyimide, polyetherimide, polyethylene terephthalate, polyethylene naphthalate, polyoxadiazole, aromatic polyamide, polybenzimidazole, polybenzobisthiazole, polybenzoxazole, polythiazole, polyphenylene vinylene, polymethyl methacrylate, polystyrene, polycarbonate, polycycloolefin, polyacrylic acid, and the like. Among them, in terms of low water permeability, low oxygen permeability, and excellent heat resistance, preferably one or more of the group consisting of polyimide, polyetherimide, polyethylene terephthalate, polyethylene naphthalate, polyoxadiazole, aromatic polyamide, polybenzimidazole, polybenzobisthiazole, polybenzoxazole, polythiazole, and polyphenylene vinylene are used. In terms of high permeability to energy rays such as ultraviolet rays or visible light, more preferably one or more of the group consisting of polyimide, polyetherimide, polyethylene terephthalate, and polyethylene naphthalate are used.

作為陽極,通常使用功函數相對較大(較適宜為具有大於4.0 eV之功函數者)之導電性之金屬氧化物膜或半透明之金屬薄膜等。作為陽極之材料,例如可列舉:氧化銦錫(Indium Tin Oxide,以下稱為ITO)、氧化錫等金屬氧化物、金(Au)、鉑(Pt)、銀(Ag)、銅(Cu)等金屬或含有該等中之至少1種之合金、聚苯胺或其衍生物、聚噻吩或其衍生物等之有機透明導電膜等。視需要可利用2層以上之層構成形成陽極。陽極之膜厚可考慮導電度(於底部發光型之情形時,亦考慮光之透過性)而適當加以選擇。陽極之膜厚較佳為10 nm~10 μm,更佳為20 nm~1 μm,最佳為50 nm~500 nm。作為陽極之製作方法,可列舉:真空蒸鍍法、濺鍍法、離子電鍍法、鍍覆法等。於頂部發光型之情形時,可將用以使向基板側照射之光反射之反射膜設置於陽極之下方。As the anode, a conductive metal oxide film or a semi-transparent metal film with a relatively large work function (preferably a work function greater than 4.0 eV) is usually used. Examples of materials for the anode include: metal oxides such as indium tin oxide (hereinafter referred to as ITO), tin oxide, metals such as gold (Au), platinum (Pt), silver (Ag), copper (Cu), or alloys containing at least one of these, organic transparent conductive films such as polyaniline or its derivatives, polythiophene or its derivatives, etc. The anode can be formed using a layer structure of two or more layers as needed. The film thickness of the anode can be appropriately selected in consideration of conductivity (in the case of bottom-emitting type, the light transmittance is also considered). The thickness of the anode is preferably 10 nm to 10 μm, more preferably 20 nm to 1 μm, and most preferably 50 nm to 500 nm. The anode can be made by vacuum evaporation, sputtering, ion plating, coating, etc. In the case of top emission, a reflective film for reflecting light irradiated to the substrate side can be placed under the anode.

有機EL層至少包含含有有機物之發光層。該發光層含有發光性材料。作為發光性材料,可列舉發出螢光或磷光之有機物(低分子化合物或高分子化合物)等。發光層可進而含有摻雜劑材料。作為有機物,可列舉:色素系材料、金屬錯合物系材料、高分子材料等。摻雜劑材料係為了提高有機物之發光效率或改變發光波長等而向有機物中摻雜者。包含該等有機物與視需要摻雜之摻雜劑之發光層之厚度通常為2~200 nm。The organic EL layer at least includes a light-emitting layer containing an organic substance. The light-emitting layer contains a light-emitting material. Examples of the light-emitting material include organic substances (low molecular weight compounds or high molecular weight compounds) that emit fluorescence or phosphorescence. The light-emitting layer may further contain a dopant material. Examples of the organic substance include: pigment materials, metal complex materials, high molecular weight materials, etc. The dopant material is doped into the organic substance in order to improve the light-emitting efficiency of the organic substance or change the light-emitting wavelength. The thickness of the light-emitting layer including the organic substance and the dopant doped as needed is usually 2 to 200 nm.

作為色素系材料,可列舉:環噴他明衍生物、四苯基丁二烯衍生物化合物、三苯基胺衍生物、㗁二唑衍生物、吡唑并喹啉衍生物、二苯乙烯基苯衍生物、二苯乙烯基芳烴衍生物、吡咯衍生物、噻吩環化合物、吡啶環化合物、紫環酮(perinone)衍生物、苝衍生物、寡聚噻吩衍生物、三反丁烯二醯胺衍生物、㗁二唑二聚物、吡唑啉二聚物等。Examples of pigment materials include cyclopentamine derivatives, tetraphenylbutadiene derivatives, triphenylamine derivatives, oxadiazole derivatives, pyrazoloquinoline derivatives, distyrylbenzene derivatives, distyryl aromatic hydrocarbon derivatives, pyrrole derivatives, thiophene ring compounds, pyridine ring compounds, perinone derivatives, perylene derivatives, oligothiophene derivatives, tris(2-butylene)diamide derivatives, oxadiazole dimers, pyrazoline dimers, and the like.

作為金屬錯合物系材料,可列舉:銥錯合物、鉑錯合物等具有來自三重激發態之發光之金屬錯合物、羥基喹啉鋁錯合物、羥基苯并喹啉鈹錯合物、苯并㗁唑鋅錯合物、苯并噻唑鋅錯合物、偶氮甲基鋅錯合物、卟啉鋅錯合物、銪錯合物等金屬錯合物等。作為金屬錯合物,可列舉中心金屬具有鋱(Tb)、銪(Eu)、鏑(Dy)等稀土金屬、鋁(Al)、鋅(Zn)、鈹(Be)等,且配位基具有㗁二唑、噻二唑、苯基吡啶、苯基苯并咪唑、喹啉結構等之金屬錯合物等。該等中,較佳為中心金屬具有鋁(Al)且配位基具有喹啉結構等之金屬錯合物。中心金屬具有鋁(Al)且配位基具有喹啉結構等之金屬錯合物中,較佳為三(8-羥基喹啉基)鋁。Examples of metal complex materials include iridium complexes, platinum complexes, and other metal complexes that emit light from a triplet excited state, hydroxyquinoline aluminum complexes, hydroxybenzoquinoline beryllium complexes, benzoxazole zinc complexes, benzothiazole zinc complexes, azomethyl zinc complexes, porphyrin zinc complexes, and cerium complexes. Examples of metal complexes include rare earth metals such as zirconium (Tb), chalcohol (Eu), and dysprosium (Dy), aluminum (Al), zinc (Zn), and benzene (Be), and ligands having structures such as oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, and quinoline. Among these, preferred are metal complexes having aluminum (Al) as the central metal and quinoline structures as the ligand. Among metal complexes having aluminum (Al) as the central metal and quinoline structures as the ligand, tris(8-hydroxyquinolinyl)aluminum is preferred.

作為高分子材料,可列舉:聚對苯乙炔衍生物、聚噻吩衍生物、聚對苯衍生物、聚矽烷衍生物、聚乙炔衍生物、聚茀衍生物、聚乙烯咔唑衍生物、將上述色素體或金屬錯合物系發光材料高分子化所得者等。Examples of the polymer material include poly(p-phenylene vinylene) derivatives, polythiophene derivatives, poly(p-phenylene) derivatives, polysilane derivatives, polyacetylene derivatives, polyfluorene derivatives, polyvinylcarbazole derivatives, and polymerized products of the above-mentioned pigments or metal complex-based luminescent materials.

上述發光性材料中,作為發出藍色光之材料,可列舉:二苯乙烯基芳烴衍生物、㗁二唑衍生物、聚乙烯咔唑衍生物、聚對苯衍生物、聚茀衍生物、該等之聚合物等。該等中,較佳為高分子材料。高分子材料中,較佳為由聚乙烯咔唑衍生物、聚對苯衍生物、聚茀衍生物所組成之群中之1種以上。Among the above-mentioned luminescent materials, materials emitting blue light include distyrylarene derivatives, oxadiazole derivatives, polyvinylcarbazole derivatives, poly(p-phenylene) derivatives, polyfluorene derivatives, and polymers thereof. Among them, polymer materials are preferred. Among polymer materials, one or more of the group consisting of polyvinylcarbazole derivatives, poly(p-phenylene) derivatives, and polyfluorene derivatives are preferred.

作為發出綠色光之材料,可列舉:喹吖啶酮衍生物、香豆素衍生物、聚對苯乙炔衍生物、聚茀衍生物、該等之聚合物等。該等中,較佳為高分子材料。高分子材料中,較佳為由聚對苯乙炔衍生物、聚茀衍生物所組成之群中之1種以上。Materials that emit green light include quinacridone derivatives, coumarin derivatives, poly(p-phenylene vinylene) derivatives, polyfluorene derivatives, and polymers thereof. Among these, polymer materials are preferred. Among polymer materials, one or more of the group consisting of poly(p-phenylene vinylene) derivatives and polyfluorene derivatives are preferred.

作為發出紅色光之材料,可列舉:香豆素衍生物、噻吩環化合物、聚對苯乙炔衍生物、聚噻吩衍生物、聚茀衍生物、該等之聚合物等。該等中,較佳為高分子材料。高分子材料中,較佳為由聚對苯乙炔衍生物、聚噻吩衍生物、聚茀衍生物所組成之群中之1種以上。Materials that emit red light include coumarin derivatives, thiophene ring compounds, poly(p-phenylene vinylene) derivatives, polythiophene derivatives, polyfluorene derivatives, and polymers thereof. Among these, polymer materials are preferred. Among polymer materials, one or more of the group consisting of poly(p-phenylene vinylene) derivatives, polythiophene derivatives, and polyfluorene derivatives are preferred.

作為摻雜劑材料,可列舉:苝衍生物、香豆素衍生物、紅螢烯衍生物、喹吖啶酮衍生物、方酸鎓衍生物、卟啉衍生物、苯乙烯系色素、稠四苯衍生物、吡唑啉酮衍生物、十環烯、吩㗁 𠯤酮等。As doping materials, there can be listed: perylene derivatives, coumarin derivatives, erythrofluorene derivatives, quinacridone derivatives, squarylium derivatives, porphyrin derivatives, styrene pigments, tetraphenylene derivatives, pyrazolone derivatives, decacyclic ene, phenanthene, etc.

有機EL層除發光層以外,可適當設置設於發光層與陽極之間之層、及設於發光層與陰極之間之層。首先,作為設於發光層與陽極之層,可列舉改善自陽極注入電洞之電洞注入效率之電洞注入層、或向發光層輸送自陽極或電洞注入層注入之電洞之電洞輸送層等。作為設於發光層與陰極之間之層,可列舉改善自陰極注入電子之電子注入效率之電子注入層、或向發光層輸送自陰極或電子注入層注入之電子之電子輸送層等。In addition to the light-emitting layer, the organic EL layer may be appropriately provided with a layer provided between the light-emitting layer and the anode, and a layer provided between the light-emitting layer and the cathode. First, as a layer provided between the light-emitting layer and the anode, a hole injection layer that improves the hole injection efficiency of injecting holes from the anode, or a hole transport layer that transports holes injected from the anode or the hole injection layer to the light-emitting layer, etc. may be cited. As a layer provided between the light-emitting layer and the cathode, an electron injection layer that improves the electron injection efficiency of injecting electrons from the cathode, or an electron transport layer that transports electrons injected from the cathode or the electron injection layer to the light-emitting layer, etc. may be cited.

作為形成電洞注入層之材料,可列舉:4',4''-三{2-萘基(苯基)胺基}三苯基胺等苯基胺系、星爆型胺系、酞菁系、氧化釩、氧化鉬、氧化釕、氧化鋁等氧化物、非晶形碳、聚苯胺、聚噻吩衍生物等。Materials for forming the hole injection layer include phenylamines such as 4',4''-tri{2-naphthyl(phenyl)amino}triphenylamine, starburst amines, phthalocyanines, oxides such as vanadium oxide, molybdenum oxide, ruthenium oxide, aluminum oxide, amorphous carbon, polyaniline, polythiophene derivatives, and the like.

作為構成電洞輸送層之材料,可列舉:聚乙烯咔唑或其衍生物、聚矽烷或其衍生物、於側鏈或主鏈具有芳香族胺之聚矽氧烷衍生物、吡唑啉衍生物、芳基胺衍生物、茋衍生物、三苯基二胺衍生物、聯苯胺衍生物、聚苯胺或其衍生物、聚噻吩或其衍生物、聚芳基胺或其衍生物、聚吡咯或其衍生物、聚(對苯乙炔)或其衍生物、聚(2,5-噻吩乙炔)或其衍生物等。Examples of materials for forming the hole transport layer include polyvinyl carbazole or its derivatives, polysilane or its derivatives, polysiloxane derivatives having aromatic amines in the side chains or main chains, pyrazoline derivatives, arylamine derivatives, stilbene derivatives, triphenyldiamine derivatives, benzidine derivatives, polyaniline or its derivatives, polythiophene or its derivatives, polyarylamine or its derivatives, polypyrrole or its derivatives, poly(p-phenylene vinylene) or its derivatives, poly(2,5-thiophene acetylene) or its derivatives, and the like.

於該等電洞注入層或電洞輸送層具有阻礙電子之輸送之功能之情形時,有時亦稱為電子阻擋層。When the hole injection layer or the hole transport layer has the function of blocking the transport of electrons, it is sometimes called an electron blocking layer.

作為構成電子輸送層之材料,可列舉:㗁二唑衍生物、蒽醌二甲烷或其衍生物、苯醌或其衍生物、萘醌或其衍生物、蒽醌或其衍生物、四氰基蒽醌二甲烷或其衍生物、茀酮衍生物、二苯基二氰乙烯或其衍生物、聯苯醌衍生物、8-羥基喹啉或其衍生物、聚喹啉或其衍生物、聚喹㗁啉或其衍生物、聚茀或其衍生物等。作為衍生物,可列舉金屬錯合物等。該等中,較佳為8-羥基喹啉或其衍生物。8-羥基喹啉或其衍生物中,就亦可用作發光層中所含之發出螢光或磷光之有機物之方面而言,較佳為三(8-羥基喹啉基)鋁。As materials constituting the electron transport layer, there can be listed: diazole derivatives, anthraquinone dimethane or its derivatives, benzoquinone or its derivatives, naphthoquinone or its derivatives, anthraquinone or its derivatives, tetracyanoanthraquinone dimethane or its derivatives, fluorenone derivatives, diphenyl dicyanoethylene or its derivatives, diphenoquinone derivatives, 8-hydroxyquinoline or its derivatives, polyquinoline or its derivatives, polyfluorene or its derivatives, etc. As derivatives, there can be listed metal complexes, etc. Among them, 8-hydroxyquinoline or its derivatives are preferred. Among 8-hydroxyquinoline or its derivatives, tris(8-hydroxyquinolyl)aluminum is preferred in terms of being also used as an organic substance emitting fluorescence or phosphorescence contained in the light-emitting layer.

作為電子注入層,根據發光層之種類,可列舉:包含鈣(Ca)層之單層構造之電子注入層;或者包含利用由為週期表IA族與IIA族之金屬且功函數為1.5~3.0 eV之金屬以及該金屬之氧化物、鹵化物及碳酸化物所組成之群中之1種以上形成之層之單層構造,或利用由為週期表IA族與IIA族之金屬且功函數為1.5~3.0 eV之金屬以及該金屬之氧化物、鹵化物及碳酸化物所組成之群中之1種以上形成之層與Ca層之積層構造之電子注入層等。作為功函數為1.5~3.0 eV之週期表IA族之金屬或其氧化物、鹵化物、碳酸化物,可列舉:鋰(Li)、氟化鋰、氧化鈉、氧化鋰、碳酸鋰等。作為功函數為1.5~3.0 eV之週期表IIA族之金屬或其氧化物、鹵化物、碳酸化物,可列舉:鍶(Sr)、氧化鎂、氟化鎂、氟化鍶、氟化鋇、氧化鍶、碳酸鎂等。As the electron injection layer, depending on the type of the light-emitting layer, there can be exemplified an electron injection layer having a single layer structure including a calcium (Ca) layer; or an electron injection layer having a single layer structure including a layer formed of one or more metals selected from the group consisting of metals of Group IA and Group IIA of the periodic table with a work function of 1.5 to 3.0 eV and oxides, halides and carbonates of the metals; or an electron injection layer having a layer formed of one or more metals selected from the group consisting of metals of Group IA and Group IIA of the periodic table with a work function of 1.5 to 3.0 eV and oxides, halides and carbonates of the metals and a Ca layer. Examples of metals of Group IA of the periodic table with a work function of 1.5 to 3.0 eV or their oxides, halides, and carbonates include lithium (Li), lithium fluoride, sodium oxide, lithium oxide, and lithium carbonate. Examples of metals of Group IIA of the periodic table with a work function of 1.5 to 3.0 eV or their oxides, halides, and carbonates include strontium (Sr), magnesium oxide, magnesium fluoride, strontium fluoride, barium fluoride, strontium oxide, and magnesium carbonate.

於該等電子輸送層或電子注入層具有阻礙電洞之輸送之功能之情形時,有時亦將該等電子輸送層或電子注入層稱為電洞阻擋層。When the electron transport layers or electron injection layers have the function of blocking the transport of holes, the electron transport layers or electron injection layers are sometimes referred to as hole blocking layers.

作為陰極,較佳為功函數相對較小(較適宜為具有小於4.0 eV之功函數者)且容易向發光層注入電子之透明或半透明之材料。作為陰極之材料,可列舉:鋰(Li)、鈉(Na)、鉀(K)、銣(Rb)、銫(Cs)、鈹(Be)、鎂(Mg)、鈣(Ca)、鍶(Sr)、鋇(Ba)、鋁(Al)、鈧(Sc)、釩(V)、鋅(Zn)、釔(Y)、銦(In)、鈰(Ce)、釤(Sm)、銪(Eu)、鋱(Tb)、鐿(Yb)等金屬;或包含上述金屬中之2種以上之合金;或包含該等中之1種以上與金(Au)、銀(Ag)、鉑(Pt)、銅(Cu)、鉻(Cr)、錳(Mn)、鈦(Ti)、鈷(Co)、鎳(Ni)、鎢(W)、錫(Sn)中之1種以上之合金;或者石墨或石墨層間化合物;或ITO、氧化錫等金屬氧化物等。As the cathode, it is preferred to use a transparent or semi-transparent material with a relatively small work function (preferably a work function of less than 4.0 eV) and easy to inject electrons into the light-emitting layer. Examples of cathode materials include lithium (Li), sodium (Na), potassium (K), rhodium (Rb), cesium (Cs), curium (Be), magnesium (Mg), calcium (Ca), strontium (Sr), barium (Ba), aluminum (Al), stygium (Sc), vanadium (V), zinc (Zn), yttrium (Y), indium (In), thorium (Ce), samarium (Sm), eutectic (Eu), terbium (Tb), and ytterbium (Yb). Metal; or alloys containing two or more of the above metals; or alloys containing one or more of the above metals and one or more of gold (Au), silver (Ag), platinum (Pt), copper (Cu), chromium (Cr), manganese (Mn), titanium (Ti), cobalt (Co), nickel (Ni), tungsten (W), tin (Sn); or graphite or graphite intercalation compounds; or metal oxides such as ITO and tin oxide, etc.

可將陰極設為2層以上之積層構造。作為2層以上之積層構造,可列舉上述金屬、金屬氧化物、氟化物、該等之合金與Al、Ag、Cr等金屬之積層構造等。陰極之膜厚可考慮導電度或耐久性而適當加以選擇。陰極之膜厚較佳為10 nm~10 μm,更佳為15 nm~1 μm,最佳為20 nm~500 nm。作為陰極之製作方法,可列舉:真空蒸鍍法、濺鍍法、對金屬薄膜進行熱壓接之層壓法等。The cathode may be a laminated structure of more than two layers. Examples of laminated structures of more than two layers include the above-mentioned metals, metal oxides, fluorides, alloys thereof, and laminated structures of metals such as Al, Ag, and Cr. The film thickness of the cathode may be appropriately selected in consideration of conductivity or durability. The film thickness of the cathode is preferably 10 nm to 10 μm, more preferably 15 nm to 1 μm, and most preferably 20 nm to 500 nm. Examples of cathode manufacturing methods include vacuum evaporation, sputtering, and lamination by hot pressing a metal film.

該等設於發光層與陽極之間、及發光層與陰極之間之層可根據所製造之有機EL顯示裝置所要求之性能而適當加以選擇。例如,作為本實施形態中所使用之有機EL顯示元件之構造,可具有下述(i)~(xv)之層構成中之任一種。 (i)陽極/電洞輸送層/發光層/陰極 (ii)陽極/發光層/電子輸送層/陰極 (iii)陽極/電洞輸送層/發光層/電子輸送層/陰極 (iv)陽極/電洞注入層/發光層/陰極 (v)陽極/發光層/電子注入層/陰極 (vi)陽極/電洞注入層/發光層/電子注入層/陰極 (vii)陽極/電洞注入層/電洞輸送層/發光層/陰極 (viii)陽極/電洞輸送層/發光層/電子注入層/陰極 (ix)陽極/電洞注入層/電洞輸送層/發光層/電子注入層/陰極 (x)陽極/電洞注入層/發光層/電子輸送層/陰極 (xi)陽極/發光層/電子輸送層/電子注入層/陰極 (xii)陽極/電洞注入層/發光層/電子輸送層/電子注入層/陰極 (xiii)陽極/電洞注入層/電洞輸送層/發光層/電子輸送層/陰極 (xiv)陽極/電洞輸送層/發光層/電子輸送層/電子注入層/陰極 (xv)陽極/電洞注入層/電洞輸送層/發光層/電子輸送層/電子注入層/陰極 (此處,「/」表示各層鄰接地進行積層。下同)The layers provided between the light-emitting layer and the anode, and between the light-emitting layer and the cathode can be appropriately selected according to the performance required of the organic EL display device to be manufactured. For example, the structure of the organic EL display element used in this embodiment can have any of the following layer structures (i) to (xv). (i) Anode/hole transport layer/luminescent layer/cathode (ii) Anode/luminescent layer/electron transport layer/cathode (iii) Anode/hole transport layer/luminescent layer/electron transport layer/cathode (iv) Anode/hole injection layer/luminescent layer/cathode (v) Anode/luminescent layer/electron injection layer/cathode (v i) Anode/hole injection layer/luminescent layer/electron injection layer/cathode (vii) Anode/hole injection layer/hole transport layer/luminescent layer/cathode (viii) Anode/hole transport layer/luminescent layer/electron injection layer/cathode (ix) Anode/hole injection layer/hole transport layer/luminescent layer/electron injection layer / cathode (x) anode/hole injection layer/luminescent layer/electron transport layer/cathode (xi) anode/luminescent layer/electron transport layer/electron injection layer/cathode (xii) anode/hole injection layer/luminescent layer/electron transport layer/electron injection layer/cathode (xiii) anode/hole injection layer/hole transport layer Layer/luminescent layer/electron transport layer/cathode (xiv)Anode/hole transport layer/luminescent layer/electron transport layer/electron injection layer/cathode (xv)Anode/hole injection layer/hole transport layer/luminescent layer/electron transport layer/electron injection layer/cathode (Here, "/" means that each layer is stacked adjacent to each other. Same below)

設置密封層之目的在於:為了防止水蒸氣或氧氣等氣體與有機EL顯示元件接觸而藉由對上述氣體具有較高之阻隔性之層將有機EL顯示元件密封。該密封層自下方起交替地形成無機膜與有機膜。無機/有機積層體可重複2次以上而形成。The purpose of setting up the sealing layer is to prevent water vapor, oxygen and other gases from contacting the organic EL display element and to seal the organic EL display element with a layer having a high barrier property to the above gases. The sealing layer alternately forms inorganic films and organic films from the bottom. The inorganic/organic laminate can be formed by repeating it more than 2 times.

無機/有機積層體之無機膜係為了防止有機EL顯示元件暴露於存在於有機EL顯示裝置所處之環境中之水蒸氣或氧氣等氣體中而設置之膜。無機/有機積層體之無機膜較佳為針孔等缺陷較少之連續且緻密之膜。作為無機膜,可列舉:SiN膜、SiO膜、SiON膜、Al2 O3 膜、AlN膜等單一成分膜或該等之積層膜等。The inorganic film of the inorganic/organic laminate is a film provided to prevent the organic EL display element from being exposed to gases such as water vapor or oxygen in the environment of the organic EL display device. The inorganic film of the inorganic/organic laminate is preferably a continuous and dense film with fewer defects such as pinholes. Examples of the inorganic film include single component films such as SiN films, SiO films, SiON films, Al2O3 films, AlN films, or laminated films thereof.

無機/有機積層體之有機膜係為了被覆形成於無機膜上之針孔等缺陷而設置,又,係為了對表面賦予平坦性而設置。有機膜係形成於較形成無機膜之區域狹窄之區域。其原因在於:若與無機膜之形成區域相同或較其寬廣地形成有機膜,則有機膜於露出之區域中劣化。但形成於整個密封層之最上層之最上位有機膜係形成於與無機膜之形成區域大致相同之區域。並且,以將密封層之上表面平坦化之方式形成。有機膜可為使用上述本實施形態之密封劑而形成之膜(即,包含密封劑之硬化體之膜)。The organic film of the inorganic/organic laminate is provided to cover defects such as pinholes formed on the inorganic film, and is provided to give flatness to the surface. The organic film is formed in a narrower area than the area where the inorganic film is formed. The reason is that if the organic film is formed in the same area as or wider than the area where the inorganic film is formed, the organic film deteriorates in the exposed area. However, the uppermost organic film formed on the uppermost layer of the entire sealing layer is formed in an area roughly the same as the area where the inorganic film is formed. And, it is formed in a manner that flattens the upper surface of the sealing layer. The organic film can be a film formed using the sealant of the above-mentioned embodiment (that is, a film containing a hardened body of the sealant).

本實施形態之密封劑例如適於可於短時間內進行膜厚3 μm以上之平坦性優異之塗佈之噴墨塗佈,且利用噴墨之噴出性與噴墨塗佈後之平坦性優異。若使用利用噴墨法之塗佈法,則可高速且均勻地形成有機膜。The sealant of this embodiment is suitable for, for example, inkjet coating, which can coat a film with a thickness of 3 μm or more with excellent flatness in a short time, and the inkjet has excellent sprayability and excellent flatness after inkjet coating. If a coating method using the inkjet method is used, an organic film can be formed at high speed and uniformly.

密封層若將無機/有機積層體以1組計數,則較佳為1~5組。其原因在於:於無機/有機積層體為6組以上之情形時,對有機EL顯示元件之密封效果與5組之情形時大致相同。無機/有機積層體之無機膜之厚度較佳為50 nm~1 μm。無機/有機積層體之有機膜之厚度較佳為1~15 μm,更佳為3~10 μm。若有機膜之厚度為1 μm以上,則可完全被覆於元件形成時所產生之微粒,能夠以良好之平坦性於無機膜上成膜。若有機膜之厚度為15 μm以下,則抑制水分自有機膜之側面滲入,提高有機EL顯示元件之可靠性。If the sealing layer counts the inorganic/organic multilayer as 1 group, it is preferably 1 to 5 groups. The reason is that when the inorganic/organic multilayer is 6 or more groups, the sealing effect on the organic EL display element is roughly the same as that in the case of 5 groups. The thickness of the inorganic film of the inorganic/organic multilayer is preferably 50 nm to 1 μm. The thickness of the organic film of the inorganic/organic multilayer is preferably 1 to 15 μm, and more preferably 3 to 10 μm. If the thickness of the organic film is 1 μm or more, it can completely cover the particles generated when the element is formed, and can form a film on the inorganic film with good flatness. If the thickness of the organic film is 15 μm or less, it inhibits the penetration of moisture from the side of the organic film, thereby improving the reliability of the organic EL display element.

密封基板係以覆蓋密封層之最上位有機膜之整個上表面之方式密接地形成。作為該密封基板,可列舉上述基板。該等中,較佳為對可見光透明之基板。對可見光透明之基板(透明密封基板)中,較佳為由玻璃基板、塑膠基板所組成之群中之1種以上,更佳為玻璃基板。The sealing substrate is formed in a manner of covering the entire upper surface of the uppermost organic film of the sealing layer. As the sealing substrate, the above-mentioned substrates can be cited. Among them, a substrate transparent to visible light is preferred. Among the substrates transparent to visible light (transparent sealing substrates), one or more of the group consisting of a glass substrate and a plastic substrate is preferred, and a glass substrate is more preferred.

透明密封基板之厚度較佳為1 μm以上1 mm以下,更佳為10 μm以上800 μm以下,最佳為50 μm以上300 μm以下。藉由將透明密封基板設置於密封層之更上層,可抑制最上位有機膜之表面若與氣體接觸則進行之劣化,可提高有機EL顯示裝置之阻隔性。The thickness of the transparent sealing substrate is preferably 1 μm to 1 mm, more preferably 10 μm to 800 μm, and most preferably 50 μm to 300 μm. By placing the transparent sealing substrate above the sealing layer, the degradation of the surface of the top organic film when it comes into contact with gas can be suppressed, and the barrier property of the organic EL display device can be improved.

其次,對具有此種構成之有機EL顯示裝置之製造方法進行說明。首先,藉由先前公知之方法,於第1基板上依序形成以特定之形狀圖案化之陽極、包含發光層之有機EL層、及陰極,而形成有機EL顯示元件。例如,於使用有機EL顯示裝置作為點矩陣顯示裝置之情形時,為了將發光區域分隔為矩陣狀而形成觸排,於由該觸排所圍成之區域中形成包含發光層之有機EL層。Next, a method for manufacturing an organic EL display device having such a structure is described. First, an anode patterned in a specific shape, an organic EL layer including a light-emitting layer, and a cathode are sequentially formed on a first substrate by a previously known method to form an organic EL display element. For example, when the organic EL display device is used as a dot matrix display device, a contact array is formed to divide the light-emitting area into a matrix shape, and the organic EL layer including the light-emitting layer is formed in the area surrounded by the contact array.

繼而,藉由濺鍍法等PVD(Physical Vapor Deposition,物理氣相沈積法)法或電漿CVD(Chemical Vapor Deposition,化學氣相沈積法)法等CVD法等成膜方法,於形成有機EL顯示元件之基板上形成具有特定之厚度之第1無機膜。其後,使用溶液塗佈法或噴霧塗佈法等塗膜形成方法或快閃蒸鍍法、噴墨法等,使本實施形態之密封劑附著於第1無機膜上。該等中,就生產性之方面而言,較佳為噴墨法。其後,藉由紫外線、可見光等能量線之照射,密封劑硬化,而形成第1有機膜。藉由以上之步驟,形成1組無機/有機積層體。密封劑之硬化率只要發揮出本實施形態之效果即可,並無特別限定,例如以依據下述測定方法所獲得之值計可設為80%以上,較佳可設為90%以上,更佳可設為95%以上。Next, a first inorganic film having a specific thickness is formed on a substrate on which an organic EL display element is formed by a film forming method such as a PVD (Physical Vapor Deposition) method such as a sputtering method or a CVD method such as a plasma CVD (Chemical Vapor Deposition) method. Thereafter, a film forming method such as a solution coating method or a spray coating method, or a flash evaporation method, an inkjet method, etc. is used to attach the sealant of the present embodiment to the first inorganic film. Among these, the inkjet method is preferred in terms of productivity. Thereafter, the sealant is hardened by irradiation with energy rays such as ultraviolet rays and visible light, thereby forming the first organic film. Through the above steps, an inorganic/organic laminate is formed. The curing rate of the sealant is not particularly limited as long as it can exert the effect of the present embodiment. For example, it can be set to 80% or more, preferably 90% or more, and more preferably 95% or more according to the value obtained by the following measurement method.

將以上所示之無機/有機積層體之形成步驟僅重複特定之次數。其中,關於最後之組、即最上層之無機/有機積層體,可藉由塗佈法或快閃蒸鍍法、噴墨法等,以上表面平坦化之方式,使密封劑附著於無機膜之上表面。The above-mentioned steps of forming the inorganic/organic multilayer are repeated only for a specific number of times. For the last group, i.e., the top inorganic/organic multilayer, the sealing agent can be attached to the upper surface of the inorganic film by coating, flash evaporation, inkjet, etc. to flatten the surface.

繼而,於基板上之附著有密封劑之面貼合透明密封基板。於貼合時進行對位。其後,藉由自透明密封基板側照射能量線,使存在於最上層之無機膜與透明密封基板之間之本實施形態之密封劑硬化。藉此,密封劑硬化,形成最上位有機膜,並且將最上位有機膜與透明密封基板接著。藉由以上,有機EL顯示裝置之製造方法結束。Next, a transparent sealing substrate is attached to the surface of the substrate to which the sealing agent is attached. Alignment is performed during the attachment. Thereafter, the sealing agent of this embodiment between the uppermost inorganic film and the transparent sealing substrate is hardened by irradiating energy rays from the side of the transparent sealing substrate. Thus, the sealing agent is hardened to form the uppermost organic film, and the uppermost organic film is bonded to the transparent sealing substrate. With the above, the manufacturing method of the organic EL display device is completed.

於使密封劑附著於無機膜上後,可局部地照射能量線而使之聚合。藉此,於載置透明密封基板時,可防止最上位有機膜之形狀之變形。無機膜與有機膜之厚度於各無機/有機積層體中可設為相同,亦可為各無機/有機積層體不同。After the sealant is attached to the inorganic film, it can be partially irradiated with energy rays to polymerize it. This can prevent the shape of the uppermost organic film from being deformed when the transparent sealing substrate is mounted. The thickness of the inorganic film and the organic film can be the same in each inorganic/organic laminate or different in each inorganic/organic laminate.

於本實施形態中,有機EL顯示裝置可用作面狀光源、段式顯示裝置、點矩陣顯示裝置。In this embodiment, the organic EL display device can be used as a planar light source, a segment display device, or a dot matrix display device.

以上,對本發明之適宜之實施形態進行了說明,但本發明並不限定於上述實施形態。 實施例The above describes suitable implementation forms of the present invention, but the present invention is not limited to the above implementation forms. Implementation Examples

以下,藉由實施例更具體地說明本發明,但本發明並不限定於實施例。Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to the examples.

(實施例1) 混合甲基丙烯酸三氟甲酯(東京化成工業公司製造)100質量份、及2,4,6-三甲基苯甲醯基二苯基氧化膦(TPO)(BASF Japan公司製造)5質量份,而製備密封劑。再者,氟原子相對於單體成分之總量之含量為32質量%。藉由如下所示之評價方法對所獲得之密封劑進行評價。又,使所獲得之密封劑於如下所示之光硬化條件下硬化而形成硬化體,並藉由如下所示之方法評價硬化體之透濕度。(Example 1) 100 parts by mass of trifluoromethyl methacrylate (manufactured by Tokyo Chemical Industry Co., Ltd.) and 5 parts by mass of 2,4,6-trimethylbenzyldiphenylphosphine oxide (TPO) (manufactured by BASF Japan) were mixed to prepare a sealant. The content of fluorine atoms relative to the total amount of monomer components was 32% by mass. The obtained sealant was evaluated by the evaluation method shown below. Furthermore, the obtained sealant was cured under the light curing conditions shown below to form a cured body, and the moisture permeability of the cured body was evaluated by the method shown below.

[表面張力] 密封劑之靜態表面張力係於23℃之氣氛下,使用(協和界面科學公司製造之DM500),藉由懸滴法進行測定。將測定結果示於表1。[Surface tension] The static surface tension of the sealant was measured by the hanging drop method using (DM500 manufactured by Kyowa Interface Science Co., Ltd.) in an atmosphere of 23°C. The measurement results are shown in Table 1.

[潤濕性] 於70 mm×70 mm×0.7 mmt之基材(無鹼玻璃(Corning公司製造之Eagle XG))上,於前後左右隔開10 μm之間隔,藉由蝕刻法製作25 μm×25 μm×3 μmt之凹陷。再者,基材係於使用前分別使用丙酮、異丙醇洗淨,其後使用TECHNOVISION公司製造之UV(Ultra Violet,紫外線)臭氧洗淨裝置UV-208洗淨5分鐘。繼而,於設有凹陷之基板上,藉由電漿CVD法形成200 nm之SiN膜。其次,使用噴墨噴出裝置(Musashi Engineering公司製造之MID500B、溶劑系噴頭「MID噴頭」),以成為50 mm×50 mm×10 μmt之方式將密封劑進行圖案塗佈。於圖案塗佈後,於溫度23℃、相對濕度50%之條件下放置5分鐘,觀察塗佈區域(50 mm×50 mm)中之密封劑之形狀。利用以下之式求出密封劑之潤濕性。將結果示於表1。 潤濕性(%)=(放置5分鐘後之塗佈區域中之密封劑之面積)/(50 mm×50 mm) 再者,例如,所謂潤濕性50%表示已圖案塗佈之密封劑之一部分未濡濕,於50 mm×50 mm之範圍之一半(50%)中,露出SiN膜。[Wettability] On a 70 mm×70 mm×0.7 mmt substrate (alkaline-free glass (Eagle XG manufactured by Corning)), 25 μm×25 μm×3 μmt depressions were made by etching at intervals of 10 μm in the front, back, left and right directions. In addition, the substrate was cleaned with acetone and isopropyl alcohol before use, and then cleaned for 5 minutes using UV (Ultra Violet) ozone cleaning device UV-208 manufactured by TECHNOVISION. Then, a 200 nm SiN film was formed on the substrate with the depressions by plasma CVD. Next, the sealant was applied in a pattern using an inkjet device (MID500B manufactured by Musashi Engineering, solvent-based inkjet head "MID inkjet head") to form a 50 mm × 50 mm × 10 μmt area. After the pattern was applied, it was placed at a temperature of 23°C and a relative humidity of 50% for 5 minutes, and the shape of the sealant in the applied area (50 mm × 50 mm) was observed. The wettability of the sealant was calculated using the following formula. The results are shown in Table 1. Wettability (%) = (area of sealant in the coated area after 5 minutes) / (50 mm × 50 mm) Furthermore, for example, the so-called 50% wettability means that part of the pattern-coated sealant is not wetted, and the SiN film is exposed in half (50%) of the 50 mm × 50 mm range.

[拉伸剪切接著強度] 依據JIS K 6850而進行測定。具體而言,使用耐熱玻璃(商品名「耐熱Pyrex(註冊商標)玻璃」,長度25 mm×寬度25 mm×厚度2.0 mm)作為被接著材,將接著部位設為直徑8 mm之圓形,以密封層之厚度成為0.08 mm之方式,使用密封劑將2片耐熱玻璃貼合。繼而,利用發出395 nm之波長之LED燈(HOYA公司製造之UV-LED LIGHT SOURCE H-4MLH200-V1),於395 nm之波長之光之累計光量成為1,500 mJ/cm2 之條件下自上表面照射光,使之硬化,而製作拉伸剪切接著強度試片。對於所製作之試片,使用萬能試驗機,於溫度23℃、濕度50%之環境下,以拉伸速度10 mm/min測定拉伸剪切接著強度。將結果示於表1。[Tensile shear bonding strength] The test was conducted in accordance with JIS K 6850. Specifically, heat-resistant glass (trade name "heat-resistant Pyrex (registered trademark) glass", length 25 mm × width 25 mm × thickness 2.0 mm) was used as the bonded material, the bonding portion was set to a circular shape with a diameter of 8 mm, and two sheets of heat-resistant glass were bonded together using a sealant in such a way that the thickness of the sealing layer became 0.08 mm. Then, using an LED lamp emitting a wavelength of 395 nm (UV-LED LIGHT SOURCE H-4MLH200-V1 manufactured by HOYA), light was irradiated from the upper surface under the condition that the cumulative light amount of light with a wavelength of 395 nm became 1,500 mJ/ cm2 , and it was cured to produce a tensile shear bonding strength test piece. The tensile shear strength of the prepared specimens was measured using a universal testing machine at a temperature of 23°C and a humidity of 50% at a tensile speed of 10 mm/min. The results are shown in Table 1.

[光硬化條件] 利用發出395 nm之波長之LED燈(HOYA公司製造之UV-LED LIGHT SOURCE H-4MLH200-V1),於395 nm之波長之光之累計光量成為1,500 mJ/cm2 之條件下,使密封劑進行光硬化,而製作硬化率為80%以上之硬化體。[Light Curing Conditions] The sealant was light-cured using an LED lamp emitting a wavelength of 395 nm (UV-LED LIGHT SOURCE H-4MLH200-V1 manufactured by HOYA) under the condition that the cumulative light intensity of the light at a wavelength of 395 nm reached 1,500 mJ/ cm2 , and a cured body with a curing rate of more than 80% was produced.

[透濕度] 於上述光硬化條件下製作厚度0.1 mm之片狀之硬化體。依據JIS Z0208:1976「防濕包裝材料之透濕度試驗方法(杯式法)」,使用氯化鈣(無水)作為吸濕劑,於溫度23℃或85℃、相對濕度90%之條件下暴露24小時,而測定100 μm厚度下之硬化體之透濕度。將結果示於表1。再者,表中於在85℃下硬化體軟化或溶解而難以測定之情形時以「-」表示。[Moisture permeability] A sheet-shaped hardened body with a thickness of 0.1 mm was prepared under the above-mentioned light curing conditions. In accordance with JIS Z0208:1976 "Moisture permeability test method for moisture-proof packaging materials (cup method)", calcium chloride (anhydrous) was used as a moisture absorbent, and the moisture permeability of the hardened body with a thickness of 100 μm was measured at a temperature of 23°C or 85°C and a relative humidity of 90% for 24 hours. The results are shown in Table 1. In addition, in the table, "-" is used to indicate the situation where the hardened body softens or dissolves at 85°C and is difficult to measure.

(實施例2) 使用甲基丙烯酸五氟苄酯(東京化成工業公司製造)100質量份代替甲基丙烯酸三氟甲酯,除此以外,以與實施例1同樣之方式製作密封劑及其硬化體,並進行評價。將評價結果示於表1。再者,氟原子相對於單體成分之總量之含量為34質量%。(Example 2) A sealant and its cured product were prepared and evaluated in the same manner as in Example 1 except that 100 parts by mass of pentafluorobenzyl methacrylate (manufactured by Tokyo Chemical Industry Co., Ltd.) was used instead of trifluoromethyl methacrylate. The evaluation results are shown in Table 1. The content of fluorine atoms relative to the total amount of monomer components was 34% by mass.

(實施例3) 使用丙烯酸2,2,3,3-四氟丙酯(大阪有機化學工業公司製造)100質量份代替甲基丙烯酸三氟甲酯,除此以外,以與實施例1同樣之方式製作密封劑及其硬化體,並進行評價。將評價結果示於表1。再者,氟原子相對於單體成分之總量之含量為39質量%。(Example 3) A sealant and its cured product were prepared and evaluated in the same manner as in Example 1 except that 100 parts by mass of 2,2,3,3-tetrafluoropropyl acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.) was used instead of trifluoromethyl methacrylate. The evaluation results are shown in Table 1. The content of fluorine atoms relative to the total amount of monomer components was 39% by mass.

(實施例4) 使用丙烯酸1H,1H,5H-八氟戊酯(大阪有機化學工業公司製造)100質量份代替甲基丙烯酸三氟甲酯,除此以外,以與實施例1同樣之方式製作密封劑及其硬化體,並進行評價。將評價結果示於表1。再者,氟原子相對於單體成分之總量之含量為51質量%。(Example 4) A sealant and its cured product were prepared and evaluated in the same manner as in Example 1 except that 100 parts by mass of 1H,1H,5H-octafluoropentyl acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.) was used instead of trifluoromethyl methacrylate. The evaluation results are shown in Table 1. The content of fluorine atoms relative to the total amount of monomer components was 51% by mass.

(實施例5) 使用2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9-十六氟-1,10-癸二醇二丙烯酸酯(共榮社化學公司製造)100質量份代替甲基丙烯酸三氟甲酯,除此以外,以與實施例1同樣之方式製作密封劑及其硬化體,並進行評價。將評價結果示於表1。再者,氟原子相對於單體成分之總量之含量為51質量%。(Example 5) A sealant and its cured product were prepared and evaluated in the same manner as in Example 1 except that 100 parts by mass of 2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9-hexafluoro-1,10-decanediol diacrylate (manufactured by Kyoeisha Chemical Co., Ltd.) was used instead of trifluoromethyl methacrylate. The evaluation results are shown in Table 1. The content of fluorine atoms relative to the total amount of monomer components was 51% by mass.

(實施例6) 使用丙烯酸1H,1H,5H-八氟戊酯(大阪有機化學工業公司製造)20質量份及1,6-己二醇二甲基丙烯酸酯80質量份代替甲基丙烯酸三氟甲酯,除此以外,以與實施例1同樣之方式製作密封劑及其硬化體,並進行評價。將評價結果示於表1。再者,氟原子相對於單體成分之總量之含量為10質量%。(Example 6) A sealant and its cured product were prepared and evaluated in the same manner as in Example 1 except that 20 parts by mass of 1H,1H,5H-octafluoropentyl acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.) and 80 parts by mass of 1,6-hexanediol dimethacrylate were used instead of trifluoromethyl methacrylate. The evaluation results are shown in Table 1. The content of fluorine atoms relative to the total amount of monomer components was 10% by mass.

(實施例7) 使用甲基丙烯酸1H,1H,5H-八氟戊酯(大阪有機化學工業公司製造)20質量份、1,12-十二烷二醇二甲基丙烯酸酯(Sartomer公司製造)70質量份、二羥甲基三環癸烷二丙烯酸酯(共榮社化學公司製造)5質量份、及乙氧基化鄰苯基苯酚丙烯酸酯(新中村化學公司製造)5質量份代替甲基丙烯酸三氟甲酯,除此以外,以與實施例1同樣之方式製作密封劑及其硬化體,並進行評價。將評價結果示於表1。再者,氟原子相對於單體成分之總量之含量為10質量%。(Example 7) A sealant and its cured product were prepared in the same manner as in Example 1, except that 20 parts by mass of 1H,1H,5H-octafluoropentyl methacrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.), 70 parts by mass of 1,12-dodecanediol dimethacrylate (manufactured by Sartomer Co., Ltd.), 5 parts by mass of dihydroxymethyltricyclodecane diacrylate (manufactured by Kyoeisha Chemical Co., Ltd.), and 5 parts by mass of ethoxylated o-phenylphenol acrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.) were used instead of trifluoromethyl methacrylate. The evaluation results are shown in Table 1. The content of fluorine atoms relative to the total amount of monomer components was 10% by mass.

(實施例8) 使用2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9-十六氟-1,10-癸二醇二丙烯酸酯(共榮社化學公司製造之LINC-162A)1質量份、1,12-十二烷二醇二甲基丙烯酸酯(Sartomer公司製造)70質量份、二羥甲基三環癸烷二丙烯酸酯(共榮社化學公司製造)24質量份、及乙氧基化鄰苯基苯酚丙烯酸酯(新中村化學公司製造,式(B-1-1)中之R7 為氫原子且n為1之化合物)5質量份代替甲基丙烯酸三氟甲酯,除此以外,以與實施例1同樣之方式製作密封劑及其硬化體,並進行評價。將評價結果示於表1。再者,氟原子相對於單體成分之總量之含量為0.3質量%。(Example 8) A sealant and a cured product thereof were prepared in the same manner as in Example 1, except that 1 part by mass of 2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9-hexafluoro-1,10-decanediol diacrylate (LINC-162A manufactured by Kyoeisha Chemical Co., Ltd.), 70 parts by mass of 1,12-dodecanediol dimethacrylate (manufactured by Sartomer Co., Ltd.), 24 parts by mass of dihydroxymethyltricyclodecane diacrylate (manufactured by Kyoeisha Chemical Co., Ltd.), and 5 parts by mass of ethoxylated o-phenylphenol acrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., a compound in which R7 in formula (B-1-1) is a hydrogen atom and n is 1) were used instead of trifluoromethyl methacrylate. The evaluation results are shown in Table 1. Furthermore, the content of fluorine atoms relative to the total amount of monomer components was 0.3 mass %.

(實施例9) 使用丙烯酸1H,1H,2H,2H-十三氟辛酯(大阪有機化學工業公司製造之13F)1質量份、1,12-十二烷二醇二甲基丙烯酸酯(Sartomer公司製造)79質量份、二羥甲基三環癸烷二丙烯酸酯(共榮社化學公司製造)15質量份、及乙氧基化鄰苯基苯酚丙烯酸酯(新中村化學公司製造)5質量份代替甲基丙烯酸三氟甲酯,除此以外,以與實施例1同樣之方式製作密封劑及其硬化體,並進行評價。將評價結果示於表1。再者,氟原子相對於單體成分之總量之含量為0.6質量%。(Example 9) A sealant and its cured product were prepared in the same manner as in Example 1, except that 1 part by mass of 1H,1H,2H,2H-tridecafluorooctyl acrylate (13F manufactured by Osaka Organic Chemical Industry Co., Ltd.), 79 parts by mass of 1,12-dodecanediol dimethacrylate (manufactured by Sartomer Co., Ltd.), 15 parts by mass of dihydroxymethyltricyclodecane diacrylate (manufactured by Kyoeisha Chemical Co., Ltd.), and 5 parts by mass of ethoxylated o-phenylphenol acrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.) were used instead of trifluoromethyl methacrylate. The evaluation results are shown in Table 1. The content of fluorine atoms relative to the total amount of monomer components was 0.6% by mass.

(實施例10) 使用2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9-十六氟-1,10-癸二醇二丙烯酸酯(大阪有機化學工業公司製造之Lnic162A HP)1質量份、1,12-十二烷二醇二甲基丙烯酸酯(Sartomer公司製造)63質量份、乙氧基化雙酚A二甲基丙烯酸酯(新中村化學公司製造之BPE-200,式(B-1-2)中之R8 及R9 為甲基且m+n為4之化合物)7.5質量份、及乙氧基化鄰苯基苯酚丙烯酸酯(新中村化學公司製造)28.5質量份代替甲基丙烯酸三氟甲酯,除此以外,以與實施例1同樣之方式製作密封劑及其硬化體,並進行評價。將評價結果示於表1。再者,氟原子相對於單體成分之總量之含量為0.3質量%。(Example 10) A sealant and a cured product thereof were prepared and evaluated in the same manner as in Example 1, except that 1 part by mass of 2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9-hexafluoro-1,10-decanediol diacrylate (Lnic162A HP manufactured by Osaka Organic Chemical Industry Co., Ltd.), 63 parts by mass of 1,12-dodecanediol dimethacrylate (manufactured by Sartomer Co., Ltd.), 7.5 parts by mass of ethoxylated bisphenol A dimethacrylate (BPE-200 manufactured by Shin-Nakamura Chemical Co., Ltd., a compound in which R 8 and R 9 in formula (B-1-2) are methyl groups and m+n is 4), and 28.5 parts by mass of ethoxylated o-phenylphenol acrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.) were used instead of trifluoromethyl methacrylate. The evaluation results are shown in Table 1. The content of fluorine atoms relative to the total amount of the monomer components was 0.3 mass %.

(比較例1) 使用甲基丙烯酸乙酯(共榮社化學公司製造)100質量份代替甲基丙烯酸三氟甲酯,除此以外,以與實施例1同樣之方式製作密封劑及其硬化體,並進行評價。將評價結果示於表2。(Comparative Example 1) A sealant and its cured product were prepared and evaluated in the same manner as in Example 1 except that 100 parts by mass of ethyl methacrylate (manufactured by Kyoeisha Chemical Co., Ltd.) was used instead of trifluoromethyl methacrylate. The evaluation results are shown in Table 2.

(比較例2) 使用甲基丙烯酸苄酯(東京化成工業公司製造)100質量份代替甲基丙烯酸三氟甲酯,除此以外,以與實施例1同樣之方式製作密封劑及其硬化體,並進行評價。將評價結果示於表2。(Comparative Example 2) A sealant and its cured product were prepared and evaluated in the same manner as in Example 1 except that 100 parts by mass of benzyl methacrylate (manufactured by Tokyo Chemical Industry Co., Ltd.) was used instead of trifluoromethyl methacrylate. The evaluation results are shown in Table 2.

(比較例3) 使用丙烯酸丁酯(三菱化學公司製造)100質量份代替甲基丙烯酸三氟甲酯,除此以外,以與實施例1同樣之方式製作密封劑及其硬化體,並進行評價。將評價結果示於表2。(Comparative Example 3) A sealant and its cured product were prepared and evaluated in the same manner as in Example 1 except that 100 parts by mass of butyl acrylate (manufactured by Mitsubishi Chemical Corporation) was used instead of trifluoromethyl methacrylate. The evaluation results are shown in Table 2.

(比較例4) 使用十二烷二醇二丙烯酸酯(Sartomer公司製造)100質量份代替甲基丙烯酸三氟甲酯,除此以外,以與實施例1同樣之方式製作密封劑及其硬化體,並進行評價。將評價結果示於表2。(Comparative Example 4) A sealant and its cured product were prepared and evaluated in the same manner as in Example 1 except that 100 parts by mass of dodecanediol diacrylate (manufactured by Sartomer) was used instead of trifluoromethyl methacrylate. The evaluation results are shown in Table 2.

(比較例5) 使用丙烯酸丁酯(三菱化學公司製造)20質量份及1,6-己二醇二甲基丙烯酸酯(共榮社化學公司製造)80質量代替甲基丙烯酸三氟甲酯,除此以外,以與實施例1同樣之方式製作密封劑及其硬化體,並進行評價。將評價結果示於表2。(Comparative Example 5) A sealant and its cured product were prepared and evaluated in the same manner as in Example 1 except that 20 parts by mass of butyl acrylate (manufactured by Mitsubishi Chemical Corporation) and 80 parts by mass of 1,6-hexanediol dimethacrylate (manufactured by Kyoeisha Chemical Co., Ltd.) were used instead of trifluoromethyl methacrylate. The evaluation results are shown in Table 2.

(比較例6) 使用1,12-十二烷二醇二甲基丙烯酸酯1質量份代替2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9-十六氟-1,10-癸二醇二丙烯酸酯,除此以外,以與實施例8同樣之方式製作密封劑及其硬化體,並進行評價。將評價結果示於表2。(Comparative Example 6) A sealant and a cured product thereof were prepared and evaluated in the same manner as in Example 8 except that 1 part by mass of 1,12-dodecanediol dimethacrylate was used instead of 2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9-hexafluoro-1,10-decanediol diacrylate. The evaluation results are shown in Table 2.

[表1] [Table 1]

[表2] [Table 2]

如表1及表2所示,藉由實施例之密封劑,形成潤濕性、接著性及防濕性優異之密封材。As shown in Table 1 and Table 2, the sealant of the embodiment can form a sealant having excellent wettability, adhesion and moisture resistance.

Claims (12)

一種有機電致發光顯示元件用密封劑,其含有:單體成分,其包含具有氟原子及(甲基)丙烯醯基之含氟單體(A);及光自由基聚合起始劑,上述含氟單體(A)包含式(A-2-1)所表示之化合物,上述單體成分之氟原子含量以上述單體成分之總量基準計為0.1質量%以上且10質量%以下,
Figure 108118786-A0305-02-0041-1
式(A-2-1)中,R3表示氫原子或甲基,R41表示氫原子或氟原子,m表示1以上之整數;存在複數個之R3互相可相同亦可不同;存在複數個之R41互相可相同亦可不同;其中,R41之至少一個為氟原子。
A sealant for an organic electroluminescent display element, comprising: a monomer component comprising a fluorine-containing monomer (A) having a fluorine atom and a (meth)acryl group; and a photoradical polymerization initiator, wherein the fluorine-containing monomer (A) comprises a compound represented by formula (A-2-1), and the fluorine atom content of the monomer component is 0.1 mass % or more and 10 mass % or less based on the total amount of the monomer component.
Figure 108118786-A0305-02-0041-1
In formula (A-2-1), R 3 represents a hydrogen atom or a methyl group, R 41 represents a hydrogen atom or a fluorine atom, and m represents an integer greater than 1; a plurality of R 3s may be the same or different from each other; a plurality of R 41s may be the same or different from each other; wherein at least one of R 41s is a fluorine atom.
如請求項1之有機電致發光顯示元件用密封劑,其中上述含氟單體(A)之氟原子含量以上述含氟單體(A)之總量基準計為2~75質量%。 For example, in the sealant for an organic electroluminescent display element of claim 1, the fluorine atom content of the above-mentioned fluorine-containing monomer (A) is 2 to 75% by mass based on the total amount of the above-mentioned fluorine-containing monomer (A). 如請求項1或2之有機電致發光顯示元件用密封劑,其中上述單體成分進而包含單體(B),該單體(B)係不具有氟原子且可與上述含氟單體(A)共聚合之化合物。 As in claim 1 or 2, the sealant for an organic electroluminescent display element, wherein the above-mentioned monomer component further comprises a monomer (B), and the monomer (B) is a compound that does not have a fluorine atom and can be copolymerized with the above-mentioned fluorine-containing monomer (A). 如請求項3之有機電致發光顯示元件用密封劑,其中上述單體成分包含具有環狀結構之單體(B-1)作為上述單體(B)。 As in claim 3, the sealant for an organic electroluminescent display element, wherein the monomer component includes a monomer (B-1) having a ring structure as the monomer (B). 如請求項4之有機電致發光顯示元件用密封劑,其中上述單體(B-1)包含選自由乙氧基化鄰苯基苯酚(甲基)丙烯酸酯、(甲基)丙烯酸間苯氧基苄酯、三環癸烷二甲醇二(甲基)丙烯酸酯及乙氧基化雙酚A二(甲基)丙烯酸酯所組成之群中之至少一種。 As for the sealant for organic electroluminescent display elements of claim 4, the monomer (B-1) comprises at least one selected from the group consisting of ethoxylated o-phenylphenol (meth)acrylate, m-phenoxybenzyl (meth)acrylate, tricyclodecane dimethanol di(meth)acrylate and ethoxylated bisphenol A di(meth)acrylate. 如請求項3之有機電致發光顯示元件用密封劑,其中上述單體成分包含具有碳數6以上之烷二基之烷二醇二(甲基)丙烯酸酯(B-2)作為上述單體(B)。 As in claim 3, the sealant for an organic electroluminescent display element, wherein the monomer component includes an alkanediol di(meth)acrylate (B-2) having an alkanediyl group with 6 or more carbon atoms as the monomer (B). 如請求項6之有機電致發光顯示元件用密封劑,其中上述烷二醇二(甲基)丙烯酸酯(B-2)包含選自由1,9-壬二醇二(甲基)丙烯酸酯、1,10-癸二醇二(甲基)丙烯酸酯及1,12-十二烷二醇二(甲基)丙烯酸酯所組成之群中之至少一種。 As for the sealant for organic electroluminescent display elements of claim 6, the above-mentioned alkanediol di(meth)acrylate (B-2) comprises at least one selected from the group consisting of 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate and 1,12-dodecanediol di(meth)acrylate. 如請求項1或2之有機電致發光顯示元件用密封劑,其中上述光自由基聚合起始劑包含醯基氧化膦型光聚合起始劑。 As for the sealant for organic electroluminescent display element of claim 1 or 2, the above-mentioned photo-radical polymerization initiator comprises an acylphosphine oxide type photo-polymerization initiator. 一種硬化體,其係使如請求項1至8中任一項之有機電致發光顯示元件用密封劑硬化而成。 A hardened body, which is formed by hardening an organic electroluminescent display element as in any one of claims 1 to 8 with a sealant. 一種有機電致發光顯示元件用密封材,其包含如請求項9之硬化體。 A sealing material for an organic electroluminescent display element, comprising a hardened body as claimed in claim 9. 一種有機電致發光顯示元件用密封材,其包含無機膜與有機膜積層 而成之積層體,且上述有機膜包含如請求項9之硬化體。 A sealing material for an organic electroluminescent display element, comprising a laminate formed by laminating an inorganic film and an organic film, wherein the organic film comprises a hardened body as described in claim 9. 一種有機電致發光顯示裝置,其包含有機電致發光顯示元件、及如請求項10或11之有機電致發光顯示元件用密封材。 An organic electroluminescent display device, comprising an organic electroluminescent display element and a sealing material for the organic electroluminescent display element as claimed in claim 10 or 11.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009172991A (en) * 2007-12-27 2009-08-06 Fujifilm Corp Barrier laminate, barrier film substrate, device and optical member
JP2011148878A (en) * 2010-01-20 2011-08-04 Daikin Industries Ltd Light-resistant sealing resin composition

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1074583A (en) 1996-08-30 1998-03-17 Sanyo Electric Co Ltd Organic EL display and method of manufacturing organic EL display
JP2001307873A (en) 2000-04-21 2001-11-02 Toppan Printing Co Ltd Organic electroluminescent display device and method of manufacturing the same
JP2009037812A (en) 2007-07-31 2009-02-19 Sumitomo Chemical Co Ltd Organic EL device and manufacturing method thereof
WO2012147828A1 (en) * 2011-04-27 2012-11-01 富士フイルム株式会社 Curable composition for imprinting, pattern formation method, and pattern
JP5528493B2 (en) * 2012-03-12 2014-06-25 富士フイルム株式会社 Positive photosensitive resin composition, method for producing cured film, cured film, organic EL display device and liquid crystal display device
JP6284217B2 (en) * 2013-03-29 2018-02-28 日本化薬株式会社 Energy ray curable resin composition and cured product thereof
DE102014207074A1 (en) * 2014-04-11 2015-10-15 Tesa Se Adhesive tape for the encapsulation of an organic electronic device
CN111345116B (en) 2017-10-26 2023-04-04 电化株式会社 Encapsulant for organic electroluminescent display element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009172991A (en) * 2007-12-27 2009-08-06 Fujifilm Corp Barrier laminate, barrier film substrate, device and optical member
JP2011148878A (en) * 2010-01-20 2011-08-04 Daikin Industries Ltd Light-resistant sealing resin composition

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