TWI857212B - Processing equipment - Google Patents
Processing equipment Download PDFInfo
- Publication number
- TWI857212B TWI857212B TW110106158A TW110106158A TWI857212B TW I857212 B TWI857212 B TW I857212B TW 110106158 A TW110106158 A TW 110106158A TW 110106158 A TW110106158 A TW 110106158A TW I857212 B TWI857212 B TW I857212B
- Authority
- TW
- Taiwan
- Prior art keywords
- grinding
- processing
- turntable
- exhaust
- exhaust duct
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0042—Devices for removing chips
- B23Q11/0046—Devices for removing chips by sucking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/08—Protective coverings for parts of machine tools; Splash guards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/002—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring the holding action of work or tool holders
- B23Q17/005—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring the holding action of work or tool holders by measuring a force, a pressure or a deformation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/08—Work-clamping means other than mechanically-actuated
- B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q2703/00—Work clamping
- B23Q2703/02—Work clamping means
- B23Q2703/04—Work clamping means using fluid means or a vacuum
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
[課題]提供一種加工裝置,前述加工裝置一般會監視加工裝置的排氣導管內的壓力,且對於排氣導管內的暫時的負壓的大小的降低不會發出警報。 [解決手段]提供一種加工裝置,為一邊對被工作夾台所保持之被加工物供給加工水,一邊以具有主軸之加工單元來對被加工物進行加工之加工裝置,前述加工裝置具備:加工室,覆蓋工作夾台與加工單元的一部分;及排氣導管,連接於加工室,排氣導管具有:排氣路徑,一端連接於加工室,且另一端連接於具有吸引源之排氣單元;及箱體,透過形成於排氣導管的側面之開口部而連通於排氣路徑,且於內部包含壓力感測器,開口部具有可減少排氣路徑之壓力的急遽的變化擴及到箱體之大小。[Topic] Provide a processing device, which generally monitors the pressure in the exhaust duct of the processing device and does not issue an alarm for a decrease in the magnitude of the temporary negative pressure in the exhaust duct. [Solution] Provided is a processing device for supplying processing water to a workpiece held by a workpiece clamp while processing the workpiece with a processing unit having a spindle, the processing device comprising: a processing chamber covering the workpiece clamp and a portion of the processing unit; and an exhaust duct connected to the processing chamber, the exhaust duct having: an exhaust path, one end of which is connected to the processing chamber and the other end of which is connected to the exhaust unit having a suction source; and a box body connected to the exhaust path through an opening formed on a side surface of the exhaust duct and including a pressure sensor therein, the opening having a size that can reduce the rapid change in pressure in the exhaust path from spreading to the box body.
Description
本發明是有關於一種一邊對被工作夾台所保持之被加工物供給加工水,一邊對該被加工物進行加工之加工裝置。The present invention relates to a processing device for processing a workpiece held by a work clamp while supplying processing water to the workpiece.
在半導體器件晶片的製造程序中,是將於正面側設定有互相交叉之複數條分割預定線,且在以此分割預定線所區劃出的各區域中形成有IC(積體電路,Integrated Circuit)、LSI(大型積體電路,Large Scale Integration)等的器件之晶圓,分割成複數個器件晶片。In the manufacturing process of semiconductor device chips, a wafer having a plurality of intersecting predetermined dividing lines set on the front side and having devices such as IC (Integrated Circuit) and LSI (Large Scale Integration) formed in each area demarcated by the predetermined dividing lines is divided into a plurality of device chips.
在將晶圓分割成複數個器件晶片時,是例如首先以磨削裝置磨削晶圓的背面側,而將晶圓薄化為成為預定的厚度。並且,藉由使用切削裝置沿著各分割預定線來切削已薄化之晶圓,而將晶圓分割成一個個的器件晶片。When dividing a wafer into a plurality of device chips, the back side of the wafer is firstly ground by a grinding device to thin the wafer to a predetermined thickness, and then the wafer is divided into individual device chips by cutting the thinned wafer along each predetermined dividing line using a cutting device.
在磨削裝置、切削裝置等之加工裝置上,設置有加工晶圓的加工室。加工室是以板材等包圍預定的空間所形成的封閉空間。在加工室內配置有用於吸引保持晶圓的工作夾台。A processing chamber for processing wafers is provided on processing equipment such as grinding equipment and cutting equipment. The processing chamber is a closed space formed by a predetermined space surrounded by a plate or the like. A worktable for attracting and holding the wafer is arranged in the processing chamber.
若在以工作夾台保持有晶圓的狀態下,一邊對晶圓供給純水等加工水一邊對晶圓進行加工,會有以下情形:含有因加工而產生之加工屑的加工水形成為霧狀並在加工室內擴散。When processing a wafer while supplying processing water such as pure water to the wafer while the wafer is held on a work chuck, the processing water containing processing chips generated by the processing may become mist and spread in the processing chamber.
當霧狀的加工水附著在設置於加工裝置之窗戶時,會使透過窗戶的目視確認性降低,而使確認加工裝置的內部變得困難。又,當霧狀的加工水飛散到加工室外時,會污染位於加工室外之加工裝置的各構成要素、或加工前之晶圓。When the misty processing water adheres to the window installed in the processing equipment, the visual confirmation through the window will be reduced, making it difficult to confirm the inside of the processing equipment. In addition, when the misty processing water splashes outside the processing room, it will contaminate various components of the processing equipment outside the processing room or wafers before processing.
例如,若吸附並搬送晶圓的搬送機構被霧狀的加工水污染,會有以下情況:透過搬送機構而污染其他的晶圓、或因吸附不良狀況而使晶圓掉落並破裂。又,也有除了含有加工屑之霧狀的加工水外,粉狀的加工屑也在加工室內擴散而污染加工室內之情形。For example, if the transport mechanism that absorbs and transports wafers is contaminated by the misty process water, there may be the following situations: other wafers may be contaminated through the transport mechanism, or wafers may fall and break due to poor absorption. In addition to the misty process water containing process chips, powdery process chips may also spread in the process room and contaminate the process room.
像這樣,包含加工屑之霧狀的加工水或粉狀的加工屑,皆會對晶圓或加工裝置造成不良影響。為了避免此弊病,而對加工室連接有用於排出霧狀的加工水或粉狀的加工屑之排氣導管(例如參照專利文獻1)。In this way, the misty processing water or powdery processing chips containing processing chips may have adverse effects on the wafer or the processing device. In order to avoid this disadvantage, an exhaust duct for exhausting the misty processing water or powdery processing chips is connected to the processing chamber (for example, refer to patent document 1).
排氣導管的內部的壓力通常是設定得比大氣壓力或無塵室內的壓力更低之壓力(亦即負壓)。並且,有時會為了監視排氣導管內的壓力是否適當,而在排氣導管配置壓力計。The pressure inside the exhaust duct is usually set to a lower pressure than the atmospheric pressure or the pressure inside the clean room (i.e., negative pressure). In addition, a pressure gauge is sometimes installed in the exhaust duct to monitor whether the pressure inside the exhaust duct is appropriate.
但是,加工室會因為晶圓的搬入或搬出,而暫時地朝大氣或無塵室內的氣體環境開放。空氣會因此暫時的開放而往加工室及排氣導管內流入,且排氣導管內之負壓之大小會暫時地降低。亦即,排氣導管內的壓力會暫時地上升成接近於大氣壓力或無塵室內之壓力。However, the processing chamber will be temporarily open to the atmosphere or the gas environment in the clean room due to the wafer being moved in or out. Air will flow into the processing chamber and the exhaust duct due to this temporary opening, and the negative pressure in the exhaust duct will temporarily decrease. In other words, the pressure in the exhaust duct will temporarily rise to a level close to the atmospheric pressure or the pressure in the clean room.
為了偵測加工室及排氣導管的異常,會設定成例如即使是暫時的,若排氣導管內的負壓的大小降低至預定的閾值以下,加工裝置即發出警報。當加工裝置發出警報時,會變得需要由操作人員進行的警報解除等之對應處理。In order to detect abnormalities in the processing room and exhaust duct, the processing device is set to issue an alarm if the negative pressure in the exhaust duct drops below a predetermined threshold, even if it is temporary. When the processing device issues an alarm, the operator needs to perform corresponding processing such as clearing the alarm.
雖然所期望的是正確地偵測加工室及排氣導管的異常,但由於晶圓的搬入或搬出是頻繁地進行的動作,因此所期望的是加工裝置不會發出起因於這些動作之不必要的警報。若發出不必要的警報,會變得需要操作人員的對應處理,而使每單位時間的生產性降低。 先前技術文獻 專利文獻Although it is desirable to accurately detect abnormalities in the processing chamber and exhaust duct, since wafers are frequently moved in and out, it is desirable that the processing equipment does not issue unnecessary alarms due to these actions. If unnecessary alarms are issued, the operator will need to respond, which will reduce productivity per unit time. Prior Art Literature Patent Literature
專利文獻1:日本特開平11-188568號公報Patent document 1: Japanese Patent Application Publication No. 11-188568
發明欲解決之課題Invention Problems to be Solved
本發明是有鑒於所述的問題點而作成的發明,目的在於提供一種一般會監視加工裝置的排氣導管內的壓力,且對排氣導管內之暫時的負壓的大小的降低並不會發出警報之加工裝置。 用以解決課題之手段This invention is made in view of the above-mentioned problem, and its purpose is to provide a processing device that generally monitors the pressure in the exhaust duct of the processing device and does not issue an alarm for the temporary decrease in the magnitude of the negative pressure in the exhaust duct. Means for solving the problem
根據本發明之一態樣,可提供一種加工裝置,為一邊對被工作夾台所保持之被加工物供給加工水,一邊以具有主軸之加工單元來對該被加工物進行加工之加工裝置,前述加工裝置具備:加工室,覆蓋該工作夾台與該加工單元的一部分;及排氣導管,連接於該加工室,該排氣導管具有:排氣路徑,一端連接於該加工室,且另一端連接於具有吸引源之排氣單元;及箱體,透過形成於該排氣導管的側面之開口部而連通於該排氣路徑,且於內部包含壓力感測器,該開口部具有可減少該排氣路徑之壓力的急遽的變化擴及到該箱體之大小。 發明效果According to one aspect of the present invention, a processing device can be provided, which is a processing device that supplies processing water to a workpiece held by a workpiece clamp while processing the workpiece with a processing unit having a spindle, and the aforementioned processing device has: a processing chamber covering the workpiece clamp and a portion of the processing unit; and an exhaust duct connected to the processing chamber, the exhaust duct having: an exhaust path, one end of which is connected to the processing chamber, and the other end of which is connected to an exhaust unit having a suction source; and a box body, which is connected to the exhaust path through an opening formed on the side of the exhaust duct, and contains a pressure sensor inside, and the opening portion has a size that can reduce the rapid change of pressure in the exhaust path from spreading to the box body. Effect of the invention
本發明之一態樣的加工裝置具備加工室、及連接於加工室的排氣導管。排氣導管具有排氣路徑與箱體。排氣路徑是一端連接於加工室,且另一端連接於具有吸引源之排氣單元。箱體透過形成於排氣路徑的側面的開口部而連通於排氣路徑,且於內部包含壓力感測器。A processing device according to one embodiment of the present invention comprises a processing chamber and an exhaust duct connected to the processing chamber. The exhaust duct has an exhaust path and a housing. One end of the exhaust path is connected to the processing chamber, and the other end is connected to an exhaust unit having a suction source. The housing is connected to the exhaust path through an opening formed on the side of the exhaust path, and includes a pressure sensor inside.
使排氣路徑與箱體連通之開口部具有可減少排氣路徑之壓力的急遽的變化擴及到箱體之大小。因此,即使排氣路徑的負壓的大小暫時地降低,箱體內部的負壓的大小也不會成為預定的閾值以下。The opening portion connecting the exhaust path and the housing has a size that can reduce the rapid change of the pressure in the exhaust path from spreading to the housing. Therefore, even if the negative pressure in the exhaust path is temporarily reduced, the negative pressure inside the housing will not be less than a predetermined threshold.
從而,壓力感測器即使一般會持續監視排氣導管內的排氣路徑的壓力,對於排氣路徑之暫時的負壓的大小的降低仍然難以受到影響。藉此,由於即使排氣路徑的負壓的大小暫時地降低,加工裝置仍然不會發出警報,因此可以減少不必要的警報。Therefore, even if the pressure sensor generally continuously monitors the pressure of the exhaust path in the exhaust duct, it is still difficult to be affected by the temporary decrease in the magnitude of the negative pressure in the exhaust path. Thus, even if the magnitude of the negative pressure in the exhaust path temporarily decreases, the processing device will not issue an alarm, thereby reducing unnecessary alarms.
用以實施發明之形態The form used to implement the invention
參照附加圖式,說明本發明之一態樣的實施形態。圖1是加工裝置之一例的磨削裝置2的立體圖。再者,圖1所示之X軸方向、Y軸方向(前後方向)、及Z軸方向(鉛直方向、磨削進給方向)是互相正交。Referring to the attached drawings, an embodiment of the present invention is described. Fig. 1 is a perspective view of a
磨削裝置2具有支撐或容置構成要素之大致長方體形的基台4。於基台4的前方(Y軸方向的一邊)形成有凹部4a,於此凹部4a設置有搬送被加工物11(參照圖2等)的搬送機器人6。The
以在X軸方向上隔著凹部4a的方式,存在片匣載置區域8a及片匣載置區域8b。例如,在片匣載置區域8a上載置有片匣10a,前述片匣10a容置有加工前之1個以上的被加工物11。The
例如,於片匣10a分別容置有於正面側貼附有樹脂製的保護膠帶之1個或複數個被加工物11。又,於片匣載置區域8b上載置有片匣10b,前述片匣10b可容置加工後之1個以上的被加工物11。For example, one or more processed
片匣載置區域8a的後方(Y軸方向的另一邊)設置有定位工作台12,前述定位工作台12可決定已被搬送機器人6搬出之被加工物11的位置。在X軸方向上相鄰於定位工作台12的區域設置有裝載臂14。A positioning table 12 is provided behind the
在裝載臂14的後方設置有可在XY平面上旋轉之圓盤狀的轉台16。在轉台16的下表面側配置有使轉台16旋轉的馬達等之第1旋轉驅動源(未圖示)。A disc-
在轉台16的上表面側,以在轉台16的圓周方向上分開大致120度的態樣設置有3個工作夾台18。在最接近於裝載臂14的搬入搬出區域A配置有1個工作夾台18。Three
又,在從搬入搬出區域A朝在俯視視角下順時針方向前進大致120度的粗磨削區域B、及從搬入搬出區域A朝在俯視視角下逆時針方向前進大致120度的精磨削區域C,分別配置有1個工作夾台18。In addition, a
各個工作夾台18具有以陶瓷等所形成之圓盤狀的框體。在框體的上表面側形成有圓盤狀的凹部,且以嵌合於此凹部的態樣在凹部固定有圓盤狀的多孔板。Each
多孔板的下表面側是連接於形成在框體內的流路(未圖示)的一端。在此流路的另一端連接有真空泵等的吸引源(未圖示)。若使吸引源動作,即在多孔板的上表面(保持面18a(參照圖2等))產生負壓。The lower surface of the porous plate is connected to one end of a flow path (not shown) formed in the frame. A suction source (not shown) such as a vacuum pump is connected to the other end of the flow path. When the suction source is activated, a negative pressure is generated on the upper surface of the porous plate (holding
在各工作夾台18的下方設置有馬達等的第2旋轉驅動源(未圖示)。第2旋轉驅動源的輸出軸是連結於工作夾台18的下部。當使第2旋轉驅動源動作時,工作夾台18即朝預定方向旋轉。A second rotation drive source (not shown) such as a motor is provided below each
在轉台16的粗磨削區域B的後方,以從基台4的上表面突出的態樣設置有四角柱狀的支撐構造22a。在支撐構造22a的前表面側設置有磨削進給單元(移動單元)24。A quadrangular
磨削進給單元24具有已固定在支撐構造22a的前表面之大致平行於Z軸方向的一對Z軸導軌26。在一對Z軸導軌26上可滑動地安裝有Z軸移動板28。The grinding
在Z軸移動板28的後方(背面側)設置有螺帽部(未圖示)。在螺帽部以可旋轉的態樣連結有在一對Z軸導軌26之間沿著Z軸方向設置的Z軸滾珠螺桿30。A nut portion (not shown) is provided at the rear (back side) of the Z-
在Z軸滾珠螺桿30的上端部連結有Z軸脈衝馬達32。只要以Z軸脈衝馬達32使Z軸滾珠螺桿30旋轉,Z軸移動板28即沿著Z軸導軌26在Z軸方向上移動。A Z-
在Z軸移動板28的前表面固定有粗磨削單元(加工單元)36a。粗磨削單元36a具有固定於Z軸移動板28之圓筒狀的保持構件38。在保持構件38的內部設置有大致朝Z軸方向平行地配置之圓筒狀的主軸殼體40(參照圖2)。A rough grinding unit (processing unit) 36a is fixed to the front surface of the Z-
在主軸殼體40內以可旋轉的狀態容置有大致朝Z軸方向平行地配置之圓柱形狀的主軸42(參照圖2)的一部分。主軸42的上端部連結有馬達44。A part of a cylindrical spindle 42 (see FIG. 2 ) arranged substantially parallel to the Z-axis direction is rotatably accommodated in the
主軸42的下端部固定有圓盤狀的輪座48。在輪座48的下表面,是藉由螺絲等固定構件(未圖示)而裝設有圓環狀的粗磨削輪50a。A disc-shaped
粗磨削輪50a的正下方是對應於上述之粗磨削區域B。粗磨削輪50a具有以鋁合金等金屬材料所形成之圓環狀的輪基台52a、及裝設於輪基台52a的下表面側之複數個粗磨削磨石54a(參照圖2)。The rough grinding area B corresponds to the rough grinding area just below the
複數個粗磨削磨石54a是以沿著輪基台52a的下表面的圓周且於相鄰之粗磨削磨石54a彼此之間設置有間隙的態樣配置排列成環狀。粗磨削磨石54a是例如將鑽石、cBN(立方氮化硼,cubic boron nitride)等的磨粒混合到金屬、陶瓷、樹脂等的結合材而形成。A plurality of rough
在輪基台52a、輪座48、主軸42等設置有用於對粗磨削磨石54a供給純水等的磨削水(加工水)之流路(未圖示)。在該流路的一端連接有磨削水供給單元(未圖示)。磨削水供給單元包含例如積存有磨削水的槽(未圖示)、用於從槽對輪基台52a等供給磨削水的泵(未圖示)等。A flow path (not shown) for supplying grinding water (processing water) such as pure water to the
如圖1所示,在相鄰於支撐構造22a的X軸方向的一邊,且在精磨削區域C的後方設置有四角柱狀的支撐構造22b。在支撐構造22b的前方,與支撐構造22a同樣地設置有磨削進給單元24。As shown in Fig. 1, a quadrangular
在支撐構造22b的磨削進給單元24連結有精磨削單元(加工單元)36b。精磨削單元36b也是與粗磨削單元36a同樣地具有保持構件38、主軸殼體40、主軸42、馬達44及輪座48。A fine grinding unit (processing unit) 36b is connected to the grinding
但是,在精磨削單元36b的主軸42是隔著輪座48而裝設有圓環狀的精磨削輪50b。精磨削輪50b的正下方是對應於上述之精磨削區域C。However, a circular ring-shaped
精磨削輪50b具備具有與輪基台52a相同的構造之輪基台。在精磨削單元36b的輪基台、輪座48、主軸42等也設置有用於供給磨削水的流路(未圖示)。又,在該流路的一端連接有磨削水供給單元(未圖示)。The
精磨削輪50b之輪基台的下表面側設置有複數個精磨削磨石。複數個精磨削磨石是以沿著輪基台的下表面的圓周且在相鄰的精磨削磨石彼此之間設置間隙的態樣配置排列成環狀。A plurality of fine grinding stones are provided on the lower surface of the wheel base of the
精磨削磨石的磨粒之平均粒徑比粗磨削磨石54a的磨粒更小。但是,對精磨削磨石的結合材或磨粒的材料並無特別的限制,可以因應於精磨削磨石的規格來適當選擇。The average particle size of the abrasive grains of the fine grinding grindstone is smaller than that of the
在搬入搬出區域A的前方且相鄰於裝載臂14之X軸方向的區域,設置有卸載臂56。在卸載臂56的前方,設置有用於將磨削後的被加工物11洗淨及乾燥之旋轉洗淨單元58。A
磨削裝置2具備控制構成要素之動作的控制部(未圖示)。控制部會控制定位工作台12、裝載臂14、轉台16、工作夾台18、粗磨削單元36a、精磨削單元36b、卸載臂56、旋轉洗淨單元58等的動作。The grinding
控制部是藉由電腦來構成,前述電腦包含例如CPU(中央處理單元,Central Processing Unit)等之處理裝置、DRAM(動態隨機存取記憶體,Dynamic Random Access Memory)等之主記憶裝置、快閃記憶體、硬碟驅動機等之輔助記憶裝置。可藉由依照記憶於輔助記憶裝置的軟體且使處理裝置等動作,來實現控制部的功能。The control unit is constituted by a computer including a processing device such as a CPU (Central Processing Unit), a main memory device such as a DRAM (Dynamic Random Access Memory), and an auxiliary memory device such as a flash memory and a hard disk drive. The functions of the control unit can be realized by operating the processing device etc. according to the software stored in the auxiliary memory device.
接著,參照圖1及圖2,說明磨削裝置2之磨削室等。圖2為磨削室等的局部剖面側視圖。如圖1所示,在粗磨削區域B的上方,設置有以金屬所形成之角柱狀的罩蓋構件60a。Next, the grinding chamber etc. of the grinding
罩蓋構件60a形成有讓粗磨削區域B自搬入搬出區域A及精磨削區域C分離之粗磨削用的磨削室(加工室)62a。罩蓋構件60a具有複數個側板與1個上板,以覆蓋位於粗磨削區域B之工作夾台18、與粗磨削單元36a的一部分(輪座48、粗磨削輪50a等)。The
在罩蓋構件60a的上板形成有用於供主軸42貫通的第1開口(未圖示)。由於該第1開口的直徑比主軸42的直徑稍大,因此第1開口的內周部不會接觸於主軸42的外周部。A first opening (not shown) is formed on the upper plate of the
在罩蓋構件60a的後方側的側板形成有第2開口,在此第2開口連接有以金屬所形成之排氣導管64a。排氣導管64a是彎曲之圓筒狀的導管,且具有內徑90mm的空洞部(亦即排氣路徑70a)。A second opening is formed on the side plate on the rear side of the
排氣路徑70a的一端連接於磨削室62a。又,排氣路徑70a的另一端連接於排氣單元68,前述排氣單元68包含風扇等之吸引源66、與過濾器(未圖示)。One end of the
於排氣導管64a的側面形成有將排氣導管64a的一部分貫通的貫通開口(開口部)72a。本實施形態的貫通開口72a具有圓柱形狀,且貫通開口72a的長度(亦即圓柱的高度)與構成排氣導管64a之壁的厚度大致相等。A through opening (opening) 72a is formed on the side of the
又,貫通開口72a的大小(亦即圓柱的直徑)充分地小到以下程度:可以減少在排氣路徑70a上之急遽的壓力的變化擴及於箱體74a之情形。本實施形態之貫通開口72a具有0.2mm(排氣導管64a之直徑的0.22%)之直徑。Furthermore, the size of the through
但是,貫通開口72a亦可具有0.1mm以上且0.5mm以下(亦即排氣導管64a之直徑的約0.11%以上且約0.56%以下)之任意的直徑。只要在此範圍,就可以減少在排氣路徑70a上之急遽的壓力的變化擴及於箱體74a之情形。However, the through
在相對於貫通開口72a而與排氣路徑70a為相反的相反側,設置有以和排氣導管64a相同之金屬材料所形成之空洞的箱體74a。箱體74a透過貫通開口72a而連通於排氣路徑70a。On the opposite side of the
在箱體74a設置有檢測箱體74a內部的壓力之壓力感測器76a。作為壓力感測器76a,可使用壓阻型、靜電容量型等之各種壓力感測器。壓力感測器76a在已偵測到箱體74a內部的壓力的大小低於預定的閾值(例如-100Pa之大小)的情況下,會對上述的控制部傳送預定的訊號。A
控制部在從壓力感測器76a接收到預定的訊號的情況下,會使安裝於基台4上的殼體(未圖示)之警示燈、蜂鳴器、監視器等之警報通知部(未圖示)動作,而發出警報。When the control unit receives a predetermined signal from the
於精磨削區域C的上方設置有與罩蓋構件60a同樣的罩蓋構件60b(參照圖1)。罩蓋構件60b形成有精磨削用之磨削室(加工室)62b。A
罩蓋構件60b具有複數個側板與1個上板,以覆蓋位於精磨削區域C之工作夾台18、與精磨削單元36b的一部分(輪座48、精磨削輪50b等)。於罩蓋構件60b的上板也形成有供主軸42貫通的第1開口。The
又,在罩蓋構件60b的後方側的側板形成有第2開口(未圖示),在此第2開口連接有以金屬所形成之排氣導管64b。排氣導管64b由於具有和排氣導管64a大致相同的形狀、構造、功能等,因此省略詳細的說明。A second opening (not shown) is formed on the side plate of the rear side of the
於排氣導管64b的內部也形成有和排氣路徑70a相同的形狀之排氣路徑。又,在排氣導管64b的側面形成有和貫通開口72a相同的形狀之貫通開口(未圖示)。An exhaust path having the same shape as the
在相對於排氣導管64b的貫通開口而與排氣導管64b之排氣路徑為相反的相反側,設置有與箱體74a相同的箱體(未圖示)。在此箱體的內部也設置有和壓力感測器76a相同的壓力感測器(未圖示)。A box (not shown) identical to the
但是,磨削室62a、62b的底部配置有轉台16。圖3(A)是轉台16的俯視圖。在轉台16的上表面,以將圓形的轉台16大致三等分的方式,設置有複數個區隔板78。However, the
各區隔板78是在轉台16的上表面的中心附近互相連接,並從轉台16的上表面的中心附近形成至外周。圖3(B)是轉台16的立體圖。The
區隔板78從轉台16的上表面突出有相當於預定長度。在轉台16的靜止時,各區隔板78的上部與在Z軸方向上相鄰之罩蓋構件60a及罩蓋構件60b之側板的底部稍微分開(參照圖2)。The
接著,說明使用磨削裝置2來磨削被加工物11之順序。首先,搬送機器人6從片匣10a往定位工作台12搬送被加工物11。以定位工作台12調整被加工物11的位置後,裝載臂14將被加工物11往位於搬入搬出區域A之工作夾台18搬送。Next, the procedure of grinding the
此時,被加工物11是以被加工物11的背面側朝向上方的方式來載置到保持面18a上。並且,可藉保持面18a吸引保持被加工物11的正面側。之後,使轉台16朝順時針方向旋轉。At this time, the
藉此,吸引保持有被加工物11的工作夾台18會移動至粗磨削區域B。在粗磨削區域B中,使工作夾台18與粗磨削單元36a的主軸42各自旋轉。然後,一邊對粗磨削磨石54a供給磨削水,一邊將粗磨削單元36a磨削進給。Thereby, the work table 18 holding the
如圖2所示,當粗磨削磨石54a接觸於被加工物11的背面側時,會對背面側進行粗磨削(加工)。磨削時,可藉由使吸引源66動作,而將磨削室62a及排氣路徑70a之氣壓設成比大氣壓力更低之狀態(亦即負壓)。As shown in Fig. 2, when the
磨削室62a及排氣路徑70a的氣壓是例如調整成比大氣壓力更低相當於110Pa之負壓(亦即-110Pa[gauge])。像這樣,藉由將磨削室62a及排氣路徑70a形成為負壓,可將霧狀的磨削水或粉狀之加工屑透過排氣路徑70a等於磨削裝置2往外部排出。The air pressure of the grinding
粗磨削結束後,首先使吸引源66的動作停止。接著,例如花費約1.3秒的時間來使轉台16朝順時針方向旋轉約120度,以使位於粗磨削區域B之工作夾台18往精磨削區域C移動。After the rough grinding is finished, the action of the
於轉台16的旋轉時,如圖4所示,會在區隔板78的上部、及罩蓋構件60a的下部之間產生間隙,而將磨削室62a、62b暫時地朝大氣或無塵室內的氣體環境開放。When the
圖4為本實施形態之磨削室62a等的局部剖面側視圖,且顯示已暫時地將磨削室62a開放之情形。再者,本說明書中,所謂磨削室62a、62b的暫時之開放意指:起因於轉台16的旋轉之開放,且為例如1秒以上且3秒以下的時間之開放。Fig. 4 is a partial cross-sectional side view of the grinding
由於磨削室62a的暫時之開放,空氣會往磨削室62a流入,且排氣路徑70a之負壓的大小會暫時地降低。亦即,排氣路徑70a的壓力會暫時地上升成接近於大氣壓力。Due to the temporary opening of the grinding
但是,如上述,由於使排氣路徑70a與箱體74a連通之貫通開口72a充分地小,因此排氣路徑70a之壓力的急遽的變化難以擴及到箱體74a。其結果,箱體74a內的負壓雖然其大小會稍微降低,但可維持在-100Pa以下且-120Pa以上的範圍。However, as described above, since the through
從而,壓力感測器76a即使一般會持續監視排氣路徑70a的壓力,對於排氣路徑70a之暫時的負壓的大小的降低仍然難以受到影響。因此,即使排氣路徑70a的負壓的大小暫時地降低,磨削裝置2仍然不會發出警報。Therefore, even if the
再者,由於在形成於排氣導管64b的側面之貫通開口中也產生同樣的現象,因此即使排氣導管64b的排氣路徑之負壓的大小暫時地降低,磨削裝置2仍然不會發出警報。因此,可以減少在磨削裝置2之不必要的警報。Furthermore, since the same phenomenon occurs in the through opening formed on the side of the
接著,在精磨削區域C中,一邊對被加工物11的背面側供給磨削水一邊施行精磨削(加工)。精磨削結束後,首先使吸引源66的動作停止。接著,花費例如約2.6秒的時間來使轉台16朝逆時針方向旋轉。Next, in the finish grinding area C, finish grinding (processing) is performed while supplying grinding water to the back side of the
藉此,使位於精磨削區域C的工作夾台18往搬入搬出區域A移動。但是,在轉台16旋轉時,也會因為磨削室62a及62b的暫時的開放,而使排氣路徑70a與排氣導管64b的排氣路徑之各負壓的大小暫時地降低。Thereby, the
但是,如上述,在本實施形態中,難以讓箱體74a內的負壓的大小降低。同樣地,也難以讓排氣導管64b之箱體內的負壓的大小降低。因此,可以減少磨削裝置2中的不必要的警報。However, as described above, in this embodiment, it is difficult to reduce the magnitude of the negative pressure in the
位於已返回到搬入搬出區域A之工作夾台18上的被加工物11,是以卸載臂56往旋轉洗淨單元58搬送,並於進行在旋轉洗淨單元58之洗淨及乾燥之後,藉由搬送機器人6往片匣10b搬送。The
其次,針對比較例進行說明。圖5為比較例之磨削室62a等的局部剖面側視圖,且顯示已暫時地將磨削室62a開放之情形。在比較例中,使排氣路徑70a與箱體74a連通之貫通開口82a的大小為比上述之貫通開口72a大。Next, the comparative example is described. FIG5 is a partial cross-sectional side view of the grinding
貫通開口82a具有例如圓柱形狀。貫通開口82a的大小(亦即圓柱的直徑)為例如與排氣導管64a的內徑大致相同。在轉台16的旋轉時,箱體74a內部的負壓的大小會起因於貫通開口82a的大小,而降低到與排氣路徑70a相同的程度。The through
因此,壓力感測器76a容易受到排氣路徑70a的負壓的大小之暫時的降低的影響。圖6是說明使工作夾台18從粗磨削區域B往精磨削區域C移動時的排氣路徑70a的壓力變化的示意圖。Therefore, the
橫軸表示時間。t1
是表示轉台16的旋轉開始時間點,t2
是表示轉台16的旋轉停止時間點。t1
至t2
的時間是轉台16的旋轉時間,可為例如約1.3秒。The horizontal axis represents time. t1 represents the start time of the rotation of the
縱軸表示以大氣壓力為基準之負壓(Pa[gauge])。再者,在縱軸中,是越朝下負壓的大小變得越大,且越朝上負壓的大小變得越小。圖6之圖形90(實線)是表示比較例之排氣路徑70a的壓力變化。The vertical axis represents the negative pressure (Pa [gauge]) based on the atmospheric pressure. In addition, in the vertical axis, the negative pressure becomes larger as it goes down, and the negative pressure becomes smaller as it goes up. The graph 90 (solid line) in FIG6 represents the pressure change of the
如圖形90(實線)所示,比較例之箱體74a內的負壓的大小在排氣路徑70a的負壓的大小暫時地降低時,會急遽地降低。因此,壓力感測器76a所測定之箱體74a內的負壓的大小會低於-100Pa[gauge]的大小,而降低至-70Pa[gauge]左右的大小。從而,成為以下情形:在每次使轉台16旋轉時,磨削裝置2即發出警報。As shown in the graph 90 (solid line), the magnitude of the negative pressure in the
相對於此,圖6的圖形92(一點鏈線)是表示上述之實施形態的排氣路徑70a的壓力變化。如圖形92所示,即使排氣路徑70a的負壓的大小暫時地降低,本實施形態之箱體74a內的負壓的大小也不會低於-100Pa[gauge]的大小。從而,可以減少磨削裝置2中的不必要的警報。In contrast, the graph 92 (one-dot chain) in FIG6 shows the pressure change of the
另外,上述實施形態之構成、方法等,只要在不脫離本發明之目的之範圍內,均可適當變更而實施。在一例中,在上述實施形態中,雖然將箱體74a直接連接於排氣導管64a的側面,但是亦可透過連接軟管(未圖示)來連接排氣導管64a的貫通開口72a與箱體74a。In addition, the configuration and method of the above-mentioned embodiments can be appropriately modified and implemented as long as they do not deviate from the scope of the purpose of the present invention. In one example, in the above-mentioned embodiment, although the
在此情況下,對連接軟管的長度方向正交之截面的內徑是設成和貫通開口72a大致相同直徑。再者,只要可將磨削室62a等的加工室形成為負壓氣體環境,亦可將本申請案之技術思想適用於其他的加工裝置。In this case, the inner diameter of the cross section perpendicular to the length direction of the connecting hose is set to be substantially the same as the diameter of the through
作為其他的加工裝置,可列舉例如研磨裝置。研磨裝置具備研磨單元、與配置在研磨單元的下方且吸引保持被加工物11的工作夾台。研磨單元具有主軸、與裝設在主軸的下端部的研磨墊輪。As another processing device, a grinding device can be cited, for example. The grinding device includes a grinding unit and a worktable disposed below the grinding unit and sucking and holding the
研磨裝置的工作夾台的上方會被罩蓋構件所覆蓋。罩蓋構件具有複數個側板與1個上板,以覆蓋工作夾台、與研磨單元的一部分。該罩蓋構件構成研磨室(加工室)。The top of the work clamp of the grinding device is covered by a cover member. The cover member has a plurality of side plates and an upper plate to cover the work clamp and a part of the grinding unit. The cover member constitutes a grinding chamber (processing chamber).
在罩蓋構件的上板形成有用於供主軸貫通的開口。該開口的直徑比主軸的直徑稍大。在罩蓋構件的後方側的側板形成有其他開口,於其他開口連接有以金屬所形成之排氣導管。An opening is formed on the upper plate of the cover member for the spindle to pass through. The diameter of the opening is slightly larger than the diameter of the spindle. Another opening is formed on the side plate of the rear side of the cover member, and an exhaust duct formed of metal is connected to the other opening.
在被加工物11的研磨時,是將研磨室設為負壓氣體環境,並透過已連接於研磨室的排氣導管,來對在研磨室內產生之霧狀的研磨水(加工水)等進行排氣。再者,亦可將研磨裝置的工作夾台配置在轉台16的一部分,來設成磨削研磨裝置(加工裝置)。When grinding the
2:磨削裝置
4:基台
4a:凹部
6:搬送機器人
8a,8b:片匣載置區域
10a,10b:片匣
11:被加工物
12:定位工作台
14:裝載臂
16:轉台
18:工作夾台
18a:保持面
22a,22b:支撐構造
24:磨削進給單元
26:Z軸導軌
28:Z軸移動板
30:Z軸滾珠螺桿
32:Z軸脈衝馬達
36a:粗磨削單元
36b:精磨削單元
38:保持構件
40:主軸殼體
42:主軸
44:馬達
48:輪座
50a:粗磨削輪
50b:精磨削輪
52a:輪基台
54a:粗磨削磨石
56:卸載臂
58:旋轉洗淨單元
60a,60b:罩蓋構件
62a,62b:磨削室
64a,64b:排氣導管
66:吸引源
68:排氣單元
70a:排氣路徑
72a:貫通開口
74a:箱體
76a:壓力感測器
78:區隔板
82a:貫通開口
90,92:圖形
A:搬入搬出區域
B:粗磨削區域
C:精磨削區域
X,Y,Z:方向2: Grinding device
4:
圖1為磨削裝置的立體圖。 圖2為磨削室等的局部剖面側視圖。 圖3(A)是轉台的俯視圖,圖3(B)是轉台的立體圖。 圖4為本實施形態之磨削室等的局部剖面側視圖。 圖5為比較例之磨削室等的局部剖面側視圖。 圖6是說明排氣路徑的壓力變化的示意圖。FIG1 is a perspective view of a grinding device. FIG2 is a partial cross-sectional side view of a grinding chamber, etc. FIG3(A) is a top view of a turntable, and FIG3(B) is a perspective view of a turntable. FIG4 is a partial cross-sectional side view of a grinding chamber, etc. of the present embodiment. FIG5 is a partial cross-sectional side view of a grinding chamber, etc. of a comparative example. FIG6 is a schematic diagram illustrating pressure changes in an exhaust path.
11:被加工物 11: Object to be processed
16:轉台 16: Turntable
18:工作夾台 18: Workbench
18a:保持面 18a: Keep the face
38:保持構件 38: Retaining components
40:主軸殼體 40: Spindle housing
42:主軸 42: Main axis
48:輪座 48: Wheel seat
50a:粗磨削輪 50a: Rough grinding wheel
52a:輪基台 52a: Wheel base
54a:粗磨削磨石 54a: Rough grinding grindstone
60a:罩蓋構件 60a: Covering member
62a:磨削室 62a: Grinding room
64a:排氣導管 64a: Exhaust duct
66:吸引源 66: Attraction source
68:排氣單元 68: Exhaust unit
70a:排氣路徑 70a: Exhaust path
72a:貫通開口 72a: Through opening
74a:箱體 74a: Cabinet
76a:壓力感測器 76a: Pressure sensor
78:區隔板 78: Divider
Claims (2)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-037099 | 2020-03-04 | ||
| JP2020037099A JP7446677B2 (en) | 2020-03-04 | 2020-03-04 | processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202135156A TW202135156A (en) | 2021-09-16 |
| TWI857212B true TWI857212B (en) | 2024-10-01 |
Family
ID=77667381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110106158A TWI857212B (en) | 2020-03-04 | 2021-02-22 | Processing equipment |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7446677B2 (en) |
| KR (1) | KR20210112243A (en) |
| CN (1) | CN113427339B (en) |
| TW (1) | TWI857212B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7726796B2 (en) * | 2022-01-06 | 2025-08-20 | 株式会社ディスコ | processing equipment |
| TWI876526B (en) * | 2023-09-11 | 2025-03-11 | 均華精密工業股份有限公司 | Multi-axis operation apparatus in opposite arrangement |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006194680A (en) * | 2005-01-12 | 2006-07-27 | Denso Corp | Pressure sensor |
| JP2016198838A (en) * | 2015-04-08 | 2016-12-01 | 株式会社ディスコ | Cutting equipment |
| US20180158700A1 (en) * | 2015-06-19 | 2018-06-07 | J.E.T. Co., Ltd. | Substrate processing system and substrate processing method |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5979135A (en) * | 1982-10-27 | 1984-05-08 | Nippon Soken Inc | Atmospheric pressure sensor |
| JP4170428B2 (en) | 1997-12-25 | 2008-10-22 | 株式会社ディスコ | Exhaust system |
| JP4331449B2 (en) * | 2002-08-22 | 2009-09-16 | 株式会社ディスコ | Processing equipment |
| DE102012211635B4 (en) * | 2012-07-04 | 2024-07-04 | Robert Bosch Gmbh | Particle extraction device |
| JP2013070102A (en) * | 2013-01-21 | 2013-04-18 | Ebara Corp | Exhaust device of substrate processing apparatus, and system |
| JP6108999B2 (en) * | 2013-07-18 | 2017-04-05 | 株式会社ディスコ | Cutting equipment |
| JP2015080834A (en) * | 2013-10-22 | 2015-04-27 | 株式会社ディスコ | Wafer processing system, and grinding apparatus |
| NL2012364B1 (en) * | 2014-03-05 | 2015-12-03 | Blastrac B V | Grinding machine and method for grinding a floor surface. |
| JP2018167367A (en) * | 2017-03-30 | 2018-11-01 | 株式会社ディスコ | Grinding device |
| JP7034543B2 (en) * | 2017-10-13 | 2022-03-14 | 株式会社ディスコ | Tool cutting equipment |
-
2020
- 2020-03-04 JP JP2020037099A patent/JP7446677B2/en active Active
-
2021
- 2021-02-22 TW TW110106158A patent/TWI857212B/en active
- 2021-02-26 KR KR1020210026638A patent/KR20210112243A/en active Pending
- 2021-03-02 CN CN202110228175.8A patent/CN113427339B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006194680A (en) * | 2005-01-12 | 2006-07-27 | Denso Corp | Pressure sensor |
| JP2016198838A (en) * | 2015-04-08 | 2016-12-01 | 株式会社ディスコ | Cutting equipment |
| US20180158700A1 (en) * | 2015-06-19 | 2018-06-07 | J.E.T. Co., Ltd. | Substrate processing system and substrate processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021137909A (en) | 2021-09-16 |
| JP7446677B2 (en) | 2024-03-11 |
| TW202135156A (en) | 2021-09-16 |
| CN113427339B (en) | 2025-12-12 |
| CN113427339A (en) | 2021-09-24 |
| KR20210112243A (en) | 2021-09-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI879990B (en) | Grinding method of workpiece | |
| TWI857212B (en) | Processing equipment | |
| JP2016154168A (en) | Delivery method for workpiece | |
| JP2011108979A (en) | Method of cutting workpiece | |
| JP5410940B2 (en) | Grinding equipment | |
| JP2021191598A (en) | Method and device for grinding of workpiece | |
| JP5926042B2 (en) | Method for detecting cracks in plate-like substrates | |
| US20240238938A1 (en) | Grinding apparatus and grinding method | |
| TWI890905B (en) | Grinding device and driving method of grinding device | |
| JP2017019055A (en) | Chuck table and processing device equipped with chuck table | |
| JP2025118200A (en) | processing equipment | |
| CN113001283B (en) | Method for cleaning grinding chamber | |
| TWI906313B (en) | Processing device | |
| JP7636120B2 (en) | Processing Equipment | |
| JP7593878B2 (en) | Processing device, method for cutting off power supply to processing device, and method for preparing processing device for use | |
| JP7614709B2 (en) | Conveyor | |
| JP2021175586A (en) | Grinding device and method | |
| CN110416112A (en) | Cleaning device | |
| TW202341272A (en) | Processing equipment | |
| KR20230174162A (en) | Grinding apparatus | |
| TW202349478A (en) | Transport unit and processing device | |
| JP2023171983A (en) | grinding equipment | |
| JP2024054473A (en) | Processing Equipment | |
| JP2025134401A (en) | Processing device | |
| JP2022049289A (en) | Method for protecting holding surface of chuck table |