[go: up one dir, main page]

TWI857212B - Processing equipment - Google Patents

Processing equipment Download PDF

Info

Publication number
TWI857212B
TWI857212B TW110106158A TW110106158A TWI857212B TW I857212 B TWI857212 B TW I857212B TW 110106158 A TW110106158 A TW 110106158A TW 110106158 A TW110106158 A TW 110106158A TW I857212 B TWI857212 B TW I857212B
Authority
TW
Taiwan
Prior art keywords
grinding
processing
turntable
exhaust
exhaust duct
Prior art date
Application number
TW110106158A
Other languages
Chinese (zh)
Other versions
TW202135156A (en
Inventor
久保徹雄
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202135156A publication Critical patent/TW202135156A/en
Application granted granted Critical
Publication of TWI857212B publication Critical patent/TWI857212B/en

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0042Devices for removing chips
    • B23Q11/0046Devices for removing chips by sucking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/08Protective coverings for parts of machine tools; Splash guards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/002Arrangements for observing, indicating or measuring on machine tools for indicating or measuring the holding action of work or tool holders
    • B23Q17/005Arrangements for observing, indicating or measuring on machine tools for indicating or measuring the holding action of work or tool holders by measuring a force, a pressure or a deformation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06Work-clamping means
    • B23Q3/08Work-clamping means other than mechanically-actuated
    • B23Q3/088Work-clamping means other than mechanically-actuated using vacuum means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • B24B41/068Table-like supports for panels, sheets or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q2703/00Work clamping
    • B23Q2703/02Work clamping means
    • B23Q2703/04Work clamping means using fluid means or a vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

[課題]提供一種加工裝置,前述加工裝置一般會監視加工裝置的排氣導管內的壓力,且對於排氣導管內的暫時的負壓的大小的降低不會發出警報。 [解決手段]提供一種加工裝置,為一邊對被工作夾台所保持之被加工物供給加工水,一邊以具有主軸之加工單元來對被加工物進行加工之加工裝置,前述加工裝置具備:加工室,覆蓋工作夾台與加工單元的一部分;及排氣導管,連接於加工室,排氣導管具有:排氣路徑,一端連接於加工室,且另一端連接於具有吸引源之排氣單元;及箱體,透過形成於排氣導管的側面之開口部而連通於排氣路徑,且於內部包含壓力感測器,開口部具有可減少排氣路徑之壓力的急遽的變化擴及到箱體之大小。[Topic] Provide a processing device, which generally monitors the pressure in the exhaust duct of the processing device and does not issue an alarm for a decrease in the magnitude of the temporary negative pressure in the exhaust duct. [Solution] Provided is a processing device for supplying processing water to a workpiece held by a workpiece clamp while processing the workpiece with a processing unit having a spindle, the processing device comprising: a processing chamber covering the workpiece clamp and a portion of the processing unit; and an exhaust duct connected to the processing chamber, the exhaust duct having: an exhaust path, one end of which is connected to the processing chamber and the other end of which is connected to the exhaust unit having a suction source; and a box body connected to the exhaust path through an opening formed on a side surface of the exhaust duct and including a pressure sensor therein, the opening having a size that can reduce the rapid change in pressure in the exhaust path from spreading to the box body.

Description

加工裝置Processing equipment

本發明是有關於一種一邊對被工作夾台所保持之被加工物供給加工水,一邊對該被加工物進行加工之加工裝置。The present invention relates to a processing device for processing a workpiece held by a work clamp while supplying processing water to the workpiece.

在半導體器件晶片的製造程序中,是將於正面側設定有互相交叉之複數條分割預定線,且在以此分割預定線所區劃出的各區域中形成有IC(積體電路,Integrated Circuit)、LSI(大型積體電路,Large Scale Integration)等的器件之晶圓,分割成複數個器件晶片。In the manufacturing process of semiconductor device chips, a wafer having a plurality of intersecting predetermined dividing lines set on the front side and having devices such as IC (Integrated Circuit) and LSI (Large Scale Integration) formed in each area demarcated by the predetermined dividing lines is divided into a plurality of device chips.

在將晶圓分割成複數個器件晶片時,是例如首先以磨削裝置磨削晶圓的背面側,而將晶圓薄化為成為預定的厚度。並且,藉由使用切削裝置沿著各分割預定線來切削已薄化之晶圓,而將晶圓分割成一個個的器件晶片。When dividing a wafer into a plurality of device chips, the back side of the wafer is firstly ground by a grinding device to thin the wafer to a predetermined thickness, and then the wafer is divided into individual device chips by cutting the thinned wafer along each predetermined dividing line using a cutting device.

在磨削裝置、切削裝置等之加工裝置上,設置有加工晶圓的加工室。加工室是以板材等包圍預定的空間所形成的封閉空間。在加工室內配置有用於吸引保持晶圓的工作夾台。A processing chamber for processing wafers is provided on processing equipment such as grinding equipment and cutting equipment. The processing chamber is a closed space formed by a predetermined space surrounded by a plate or the like. A worktable for attracting and holding the wafer is arranged in the processing chamber.

若在以工作夾台保持有晶圓的狀態下,一邊對晶圓供給純水等加工水一邊對晶圓進行加工,會有以下情形:含有因加工而產生之加工屑的加工水形成為霧狀並在加工室內擴散。When processing a wafer while supplying processing water such as pure water to the wafer while the wafer is held on a work chuck, the processing water containing processing chips generated by the processing may become mist and spread in the processing chamber.

當霧狀的加工水附著在設置於加工裝置之窗戶時,會使透過窗戶的目視確認性降低,而使確認加工裝置的內部變得困難。又,當霧狀的加工水飛散到加工室外時,會污染位於加工室外之加工裝置的各構成要素、或加工前之晶圓。When the misty processing water adheres to the window installed in the processing equipment, the visual confirmation through the window will be reduced, making it difficult to confirm the inside of the processing equipment. In addition, when the misty processing water splashes outside the processing room, it will contaminate various components of the processing equipment outside the processing room or wafers before processing.

例如,若吸附並搬送晶圓的搬送機構被霧狀的加工水污染,會有以下情況:透過搬送機構而污染其他的晶圓、或因吸附不良狀況而使晶圓掉落並破裂。又,也有除了含有加工屑之霧狀的加工水外,粉狀的加工屑也在加工室內擴散而污染加工室內之情形。For example, if the transport mechanism that absorbs and transports wafers is contaminated by the misty process water, there may be the following situations: other wafers may be contaminated through the transport mechanism, or wafers may fall and break due to poor absorption. In addition to the misty process water containing process chips, powdery process chips may also spread in the process room and contaminate the process room.

像這樣,包含加工屑之霧狀的加工水或粉狀的加工屑,皆會對晶圓或加工裝置造成不良影響。為了避免此弊病,而對加工室連接有用於排出霧狀的加工水或粉狀的加工屑之排氣導管(例如參照專利文獻1)。In this way, the misty processing water or powdery processing chips containing processing chips may have adverse effects on the wafer or the processing device. In order to avoid this disadvantage, an exhaust duct for exhausting the misty processing water or powdery processing chips is connected to the processing chamber (for example, refer to patent document 1).

排氣導管的內部的壓力通常是設定得比大氣壓力或無塵室內的壓力更低之壓力(亦即負壓)。並且,有時會為了監視排氣導管內的壓力是否適當,而在排氣導管配置壓力計。The pressure inside the exhaust duct is usually set to a lower pressure than the atmospheric pressure or the pressure inside the clean room (i.e., negative pressure). In addition, a pressure gauge is sometimes installed in the exhaust duct to monitor whether the pressure inside the exhaust duct is appropriate.

但是,加工室會因為晶圓的搬入或搬出,而暫時地朝大氣或無塵室內的氣體環境開放。空氣會因此暫時的開放而往加工室及排氣導管內流入,且排氣導管內之負壓之大小會暫時地降低。亦即,排氣導管內的壓力會暫時地上升成接近於大氣壓力或無塵室內之壓力。However, the processing chamber will be temporarily open to the atmosphere or the gas environment in the clean room due to the wafer being moved in or out. Air will flow into the processing chamber and the exhaust duct due to this temporary opening, and the negative pressure in the exhaust duct will temporarily decrease. In other words, the pressure in the exhaust duct will temporarily rise to a level close to the atmospheric pressure or the pressure in the clean room.

為了偵測加工室及排氣導管的異常,會設定成例如即使是暫時的,若排氣導管內的負壓的大小降低至預定的閾值以下,加工裝置即發出警報。當加工裝置發出警報時,會變得需要由操作人員進行的警報解除等之對應處理。In order to detect abnormalities in the processing room and exhaust duct, the processing device is set to issue an alarm if the negative pressure in the exhaust duct drops below a predetermined threshold, even if it is temporary. When the processing device issues an alarm, the operator needs to perform corresponding processing such as clearing the alarm.

雖然所期望的是正確地偵測加工室及排氣導管的異常,但由於晶圓的搬入或搬出是頻繁地進行的動作,因此所期望的是加工裝置不會發出起因於這些動作之不必要的警報。若發出不必要的警報,會變得需要操作人員的對應處理,而使每單位時間的生產性降低。 先前技術文獻 專利文獻Although it is desirable to accurately detect abnormalities in the processing chamber and exhaust duct, since wafers are frequently moved in and out, it is desirable that the processing equipment does not issue unnecessary alarms due to these actions. If unnecessary alarms are issued, the operator will need to respond, which will reduce productivity per unit time. Prior Art Literature Patent Literature

專利文獻1:日本特開平11-188568號公報Patent document 1: Japanese Patent Application Publication No. 11-188568

發明欲解決之課題Invention Problems to be Solved

本發明是有鑒於所述的問題點而作成的發明,目的在於提供一種一般會監視加工裝置的排氣導管內的壓力,且對排氣導管內之暫時的負壓的大小的降低並不會發出警報之加工裝置。 用以解決課題之手段This invention is made in view of the above-mentioned problem, and its purpose is to provide a processing device that generally monitors the pressure in the exhaust duct of the processing device and does not issue an alarm for the temporary decrease in the magnitude of the negative pressure in the exhaust duct. Means for solving the problem

根據本發明之一態樣,可提供一種加工裝置,為一邊對被工作夾台所保持之被加工物供給加工水,一邊以具有主軸之加工單元來對該被加工物進行加工之加工裝置,前述加工裝置具備:加工室,覆蓋該工作夾台與該加工單元的一部分;及排氣導管,連接於該加工室,該排氣導管具有:排氣路徑,一端連接於該加工室,且另一端連接於具有吸引源之排氣單元;及箱體,透過形成於該排氣導管的側面之開口部而連通於該排氣路徑,且於內部包含壓力感測器,該開口部具有可減少該排氣路徑之壓力的急遽的變化擴及到該箱體之大小。 發明效果According to one aspect of the present invention, a processing device can be provided, which is a processing device that supplies processing water to a workpiece held by a workpiece clamp while processing the workpiece with a processing unit having a spindle, and the aforementioned processing device has: a processing chamber covering the workpiece clamp and a portion of the processing unit; and an exhaust duct connected to the processing chamber, the exhaust duct having: an exhaust path, one end of which is connected to the processing chamber, and the other end of which is connected to an exhaust unit having a suction source; and a box body, which is connected to the exhaust path through an opening formed on the side of the exhaust duct, and contains a pressure sensor inside, and the opening portion has a size that can reduce the rapid change of pressure in the exhaust path from spreading to the box body. Effect of the invention

本發明之一態樣的加工裝置具備加工室、及連接於加工室的排氣導管。排氣導管具有排氣路徑與箱體。排氣路徑是一端連接於加工室,且另一端連接於具有吸引源之排氣單元。箱體透過形成於排氣路徑的側面的開口部而連通於排氣路徑,且於內部包含壓力感測器。A processing device according to one embodiment of the present invention comprises a processing chamber and an exhaust duct connected to the processing chamber. The exhaust duct has an exhaust path and a housing. One end of the exhaust path is connected to the processing chamber, and the other end is connected to an exhaust unit having a suction source. The housing is connected to the exhaust path through an opening formed on the side of the exhaust path, and includes a pressure sensor inside.

使排氣路徑與箱體連通之開口部具有可減少排氣路徑之壓力的急遽的變化擴及到箱體之大小。因此,即使排氣路徑的負壓的大小暫時地降低,箱體內部的負壓的大小也不會成為預定的閾值以下。The opening portion connecting the exhaust path and the housing has a size that can reduce the rapid change of the pressure in the exhaust path from spreading to the housing. Therefore, even if the negative pressure in the exhaust path is temporarily reduced, the negative pressure inside the housing will not be less than a predetermined threshold.

從而,壓力感測器即使一般會持續監視排氣導管內的排氣路徑的壓力,對於排氣路徑之暫時的負壓的大小的降低仍然難以受到影響。藉此,由於即使排氣路徑的負壓的大小暫時地降低,加工裝置仍然不會發出警報,因此可以減少不必要的警報。Therefore, even if the pressure sensor generally continuously monitors the pressure of the exhaust path in the exhaust duct, it is still difficult to be affected by the temporary decrease in the magnitude of the negative pressure in the exhaust path. Thus, even if the magnitude of the negative pressure in the exhaust path temporarily decreases, the processing device will not issue an alarm, thereby reducing unnecessary alarms.

用以實施發明之形態The form used to implement the invention

參照附加圖式,說明本發明之一態樣的實施形態。圖1是加工裝置之一例的磨削裝置2的立體圖。再者,圖1所示之X軸方向、Y軸方向(前後方向)、及Z軸方向(鉛直方向、磨削進給方向)是互相正交。Referring to the attached drawings, an embodiment of the present invention is described. Fig. 1 is a perspective view of a grinding device 2 as an example of a processing device. Furthermore, the X-axis direction, Y-axis direction (front-back direction), and Z-axis direction (lead vertical direction, grinding feed direction) shown in Fig. 1 are orthogonal to each other.

磨削裝置2具有支撐或容置構成要素之大致長方體形的基台4。於基台4的前方(Y軸方向的一邊)形成有凹部4a,於此凹部4a設置有搬送被加工物11(參照圖2等)的搬送機器人6。The grinding device 2 has a substantially rectangular parallelepiped base 4 for supporting or accommodating components. A recess 4a is formed in the front (one side in the Y-axis direction) of the base 4, and a transport robot 6 for transporting a workpiece 11 (see FIG. 2, etc.) is installed in the recess 4a.

以在X軸方向上隔著凹部4a的方式,存在片匣載置區域8a及片匣載置區域8b。例如,在片匣載置區域8a上載置有片匣10a,前述片匣10a容置有加工前之1個以上的被加工物11。The cassette mounting area 8a and the cassette mounting area 8b are provided in a manner sandwiching the recessed portion 4a in the X-axis direction. For example, a cassette 10a is mounted on the cassette mounting area 8a, and the cassette 10a accommodates one or more workpieces 11 before processing.

例如,於片匣10a分別容置有於正面側貼附有樹脂製的保護膠帶之1個或複數個被加工物11。又,於片匣載置區域8b上載置有片匣10b,前述片匣10b可容置加工後之1個以上的被加工物11。For example, one or more processed objects 11 with a resin protective tape attached to the front side are respectively accommodated in the film cassette 10a. In addition, a film cassette 10b is mounted on the film cassette mounting area 8b, and the aforementioned film cassette 10b can accommodate more than one processed object 11 after processing.

片匣載置區域8a的後方(Y軸方向的另一邊)設置有定位工作台12,前述定位工作台12可決定已被搬送機器人6搬出之被加工物11的位置。在X軸方向上相鄰於定位工作台12的區域設置有裝載臂14。A positioning table 12 is provided behind the cassette loading area 8a (on the other side in the Y-axis direction) to determine the position of the workpiece 11 removed by the transfer robot 6. A loading arm 14 is provided in the area adjacent to the positioning table 12 in the X-axis direction.

在裝載臂14的後方設置有可在XY平面上旋轉之圓盤狀的轉台16。在轉台16的下表面側配置有使轉台16旋轉的馬達等之第1旋轉驅動源(未圖示)。A disc-shaped turntable 16 that can rotate on the XY plane is provided behind the loading arm 14. A first rotation drive source (not shown) such as a motor that rotates the turntable 16 is arranged on the lower surface side of the turntable 16.

在轉台16的上表面側,以在轉台16的圓周方向上分開大致120度的態樣設置有3個工作夾台18。在最接近於裝載臂14的搬入搬出區域A配置有1個工作夾台18。Three work clamps 18 are provided on the upper surface side of the turntable 16 at intervals of approximately 120 degrees in the circumferential direction of the turntable 16. One work clamp 18 is disposed in the loading and unloading area A closest to the loading arm 14.

又,在從搬入搬出區域A朝在俯視視角下順時針方向前進大致120度的粗磨削區域B、及從搬入搬出區域A朝在俯視視角下逆時針方向前進大致120度的精磨削區域C,分別配置有1個工作夾台18。In addition, a work clamp 18 is disposed in each of the rough grinding area B which is approximately 120 degrees clockwise from the loading and unloading area A in a top view, and the fine grinding area C which is approximately 120 degrees counterclockwise from the loading and unloading area A in a top view.

各個工作夾台18具有以陶瓷等所形成之圓盤狀的框體。在框體的上表面側形成有圓盤狀的凹部,且以嵌合於此凹部的態樣在凹部固定有圓盤狀的多孔板。Each work clamp 18 has a disc-shaped frame body formed of ceramics, etc. A disc-shaped recessed portion is formed on the upper surface side of the frame body, and a disc-shaped porous plate is fixed in the recessed portion in a manner of being fitted in the recessed portion.

多孔板的下表面側是連接於形成在框體內的流路(未圖示)的一端。在此流路的另一端連接有真空泵等的吸引源(未圖示)。若使吸引源動作,即在多孔板的上表面(保持面18a(參照圖2等))產生負壓。The lower surface of the porous plate is connected to one end of a flow path (not shown) formed in the frame. A suction source (not shown) such as a vacuum pump is connected to the other end of the flow path. When the suction source is activated, a negative pressure is generated on the upper surface of the porous plate (holding surface 18a (see FIG. 2, etc.)).

在各工作夾台18的下方設置有馬達等的第2旋轉驅動源(未圖示)。第2旋轉驅動源的輸出軸是連結於工作夾台18的下部。當使第2旋轉驅動源動作時,工作夾台18即朝預定方向旋轉。A second rotation drive source (not shown) such as a motor is provided below each work clamp 18. The output shaft of the second rotation drive source is connected to the lower portion of the work clamp 18. When the second rotation drive source is operated, the work clamp 18 rotates in a predetermined direction.

在轉台16的粗磨削區域B的後方,以從基台4的上表面突出的態樣設置有四角柱狀的支撐構造22a。在支撐構造22a的前表面側設置有磨削進給單元(移動單元)24。A quadrangular columnar support structure 22a is provided behind the rough grinding area B of the turntable 16 so as to protrude from the upper surface of the base 4. A grinding feed unit (moving unit) 24 is provided on the front surface side of the support structure 22a.

磨削進給單元24具有已固定在支撐構造22a的前表面之大致平行於Z軸方向的一對Z軸導軌26。在一對Z軸導軌26上可滑動地安裝有Z軸移動板28。The grinding feed unit 24 has a pair of Z-axis guide rails 26 fixed to the front surface of the support structure 22a and substantially parallel to the Z-axis direction. A Z-axis moving plate 28 is slidably mounted on the pair of Z-axis guide rails 26.

在Z軸移動板28的後方(背面側)設置有螺帽部(未圖示)。在螺帽部以可旋轉的態樣連結有在一對Z軸導軌26之間沿著Z軸方向設置的Z軸滾珠螺桿30。A nut portion (not shown) is provided at the rear (back side) of the Z-axis moving plate 28. A Z-axis ball screw 30 provided along the Z-axis direction between a pair of Z-axis guide rails 26 is rotatably connected to the nut portion.

在Z軸滾珠螺桿30的上端部連結有Z軸脈衝馬達32。只要以Z軸脈衝馬達32使Z軸滾珠螺桿30旋轉,Z軸移動板28即沿著Z軸導軌26在Z軸方向上移動。A Z-axis pulse motor 32 is connected to the upper end of the Z-axis ball screw 30. When the Z-axis pulse motor 32 rotates the Z-axis ball screw 30, the Z-axis moving plate 28 moves along the Z-axis guide rail 26 in the Z-axis direction.

在Z軸移動板28的前表面固定有粗磨削單元(加工單元)36a。粗磨削單元36a具有固定於Z軸移動板28之圓筒狀的保持構件38。在保持構件38的內部設置有大致朝Z軸方向平行地配置之圓筒狀的主軸殼體40(參照圖2)。A rough grinding unit (processing unit) 36a is fixed to the front surface of the Z-axis moving plate 28. The rough grinding unit 36a has a cylindrical holding member 38 fixed to the Z-axis moving plate 28. A cylindrical spindle housing 40 is provided inside the holding member 38 and is arranged substantially parallel to the Z-axis direction (see FIG. 2 ).

在主軸殼體40內以可旋轉的狀態容置有大致朝Z軸方向平行地配置之圓柱形狀的主軸42(參照圖2)的一部分。主軸42的上端部連結有馬達44。A part of a cylindrical spindle 42 (see FIG. 2 ) arranged substantially parallel to the Z-axis direction is rotatably accommodated in the spindle housing 40 . A motor 44 is connected to the upper end of the spindle 42 .

主軸42的下端部固定有圓盤狀的輪座48。在輪座48的下表面,是藉由螺絲等固定構件(未圖示)而裝設有圓環狀的粗磨削輪50a。A disc-shaped wheel seat 48 is fixed to the lower end of the main shaft 42. A ring-shaped rough grinding wheel 50a is mounted on the lower surface of the wheel seat 48 by a fixing member (not shown) such as a screw.

粗磨削輪50a的正下方是對應於上述之粗磨削區域B。粗磨削輪50a具有以鋁合金等金屬材料所形成之圓環狀的輪基台52a、及裝設於輪基台52a的下表面側之複數個粗磨削磨石54a(參照圖2)。The rough grinding area B corresponds to the rough grinding area just below the rough grinding wheel 50a. The rough grinding wheel 50a has a ring-shaped wheel base 52a formed of a metal material such as an aluminum alloy, and a plurality of rough grinding grindstones 54a installed on the lower surface of the wheel base 52a (see FIG. 2 ).

複數個粗磨削磨石54a是以沿著輪基台52a的下表面的圓周且於相鄰之粗磨削磨石54a彼此之間設置有間隙的態樣配置排列成環狀。粗磨削磨石54a是例如將鑽石、cBN(立方氮化硼,cubic boron nitride)等的磨粒混合到金屬、陶瓷、樹脂等的結合材而形成。A plurality of rough grinding stones 54a are arranged in a ring along the circumference of the lower surface of the wheel base 52a with gaps between adjacent rough grinding stones 54a. The rough grinding stones 54a are formed by mixing abrasive grains such as diamond and cBN (cubic boron nitride) with a binder such as metal, ceramic, or resin.

在輪基台52a、輪座48、主軸42等設置有用於對粗磨削磨石54a供給純水等的磨削水(加工水)之流路(未圖示)。在該流路的一端連接有磨削水供給單元(未圖示)。磨削水供給單元包含例如積存有磨削水的槽(未圖示)、用於從槽對輪基台52a等供給磨削水的泵(未圖示)等。A flow path (not shown) for supplying grinding water (processing water) such as pure water to the rough grinding grindstone 54a is provided on the wheel base 52a, the wheel seat 48, the spindle 42, etc. A grinding water supply unit (not shown) is connected to one end of the flow path. The grinding water supply unit includes, for example, a tank (not shown) storing grinding water, a pump (not shown) for supplying grinding water from the tank to the wheel base 52a, etc.

如圖1所示,在相鄰於支撐構造22a的X軸方向的一邊,且在精磨削區域C的後方設置有四角柱狀的支撐構造22b。在支撐構造22b的前方,與支撐構造22a同樣地設置有磨削進給單元24。As shown in Fig. 1, a quadrangular columnar support structure 22b is provided adjacent to one side of the support structure 22a in the X-axis direction and behind the finish grinding area C. A grinding feed unit 24 is provided in front of the support structure 22b similarly to the support structure 22a.

在支撐構造22b的磨削進給單元24連結有精磨削單元(加工單元)36b。精磨削單元36b也是與粗磨削單元36a同樣地具有保持構件38、主軸殼體40、主軸42、馬達44及輪座48。A fine grinding unit (processing unit) 36b is connected to the grinding feed unit 24 of the support structure 22b. The fine grinding unit 36b also has a holding member 38, a spindle housing 40, a spindle 42, a motor 44, and a wheel seat 48, similarly to the rough grinding unit 36a.

但是,在精磨削單元36b的主軸42是隔著輪座48而裝設有圓環狀的精磨削輪50b。精磨削輪50b的正下方是對應於上述之精磨削區域C。However, a circular ring-shaped fine grinding wheel 50b is mounted on the main shaft 42 of the fine grinding unit 36b via a wheel seat 48. The fine grinding area C described above is located directly below the fine grinding wheel 50b.

精磨削輪50b具備具有與輪基台52a相同的構造之輪基台。在精磨削單元36b的輪基台、輪座48、主軸42等也設置有用於供給磨削水的流路(未圖示)。又,在該流路的一端連接有磨削水供給單元(未圖示)。The fine grinding wheel 50b has a wheel base having the same structure as the wheel base 52a. A flow path (not shown) for supplying grinding water is also provided in the wheel base, wheel seat 48, spindle 42, etc. of the fine grinding unit 36b. In addition, a grinding water supply unit (not shown) is connected to one end of the flow path.

精磨削輪50b之輪基台的下表面側設置有複數個精磨削磨石。複數個精磨削磨石是以沿著輪基台的下表面的圓周且在相鄰的精磨削磨石彼此之間設置間隙的態樣配置排列成環狀。A plurality of fine grinding stones are provided on the lower surface of the wheel base of the fine grinding wheel 50b. The plurality of fine grinding stones are arranged in a ring shape along the circumference of the lower surface of the wheel base with gaps between adjacent fine grinding stones.

精磨削磨石的磨粒之平均粒徑比粗磨削磨石54a的磨粒更小。但是,對精磨削磨石的結合材或磨粒的材料並無特別的限制,可以因應於精磨削磨石的規格來適當選擇。The average particle size of the abrasive grains of the fine grinding grindstone is smaller than that of the coarse grinding grindstone 54a. However, there is no particular limitation on the binder material or the material of the abrasive grains of the fine grinding grindstone, and they can be appropriately selected according to the specifications of the fine grinding grindstone.

在搬入搬出區域A的前方且相鄰於裝載臂14之X軸方向的區域,設置有卸載臂56。在卸載臂56的前方,設置有用於將磨削後的被加工物11洗淨及乾燥之旋轉洗淨單元58。A discharge arm 56 is provided in front of the loading and unloading area A and adjacent to the loading arm 14 in the X-axis direction. In front of the discharge arm 56, a rotary cleaning unit 58 is provided for cleaning and drying the workpiece 11 after grinding.

磨削裝置2具備控制構成要素之動作的控制部(未圖示)。控制部會控制定位工作台12、裝載臂14、轉台16、工作夾台18、粗磨削單元36a、精磨削單元36b、卸載臂56、旋轉洗淨單元58等的動作。The grinding device 2 has a control unit (not shown) for controlling the motion of the components. The control unit controls the motion of the positioning table 12, the loading arm 14, the turntable 16, the work clamp 18, the rough grinding unit 36a, the fine grinding unit 36b, the unloading arm 56, the rotary cleaning unit 58, and the like.

控制部是藉由電腦來構成,前述電腦包含例如CPU(中央處理單元,Central Processing Unit)等之處理裝置、DRAM(動態隨機存取記憶體,Dynamic Random Access Memory)等之主記憶裝置、快閃記憶體、硬碟驅動機等之輔助記憶裝置。可藉由依照記憶於輔助記憶裝置的軟體且使處理裝置等動作,來實現控制部的功能。The control unit is constituted by a computer including a processing device such as a CPU (Central Processing Unit), a main memory device such as a DRAM (Dynamic Random Access Memory), and an auxiliary memory device such as a flash memory and a hard disk drive. The functions of the control unit can be realized by operating the processing device etc. according to the software stored in the auxiliary memory device.

接著,參照圖1及圖2,說明磨削裝置2之磨削室等。圖2為磨削室等的局部剖面側視圖。如圖1所示,在粗磨削區域B的上方,設置有以金屬所形成之角柱狀的罩蓋構件60a。Next, the grinding chamber etc. of the grinding device 2 will be described with reference to Fig. 1 and Fig. 2. Fig. 2 is a partial cross-sectional side view of the grinding chamber etc. As shown in Fig. 1, a prism-shaped cover member 60a formed of metal is provided above the rough grinding area B.

罩蓋構件60a形成有讓粗磨削區域B自搬入搬出區域A及精磨削區域C分離之粗磨削用的磨削室(加工室)62a。罩蓋構件60a具有複數個側板與1個上板,以覆蓋位於粗磨削區域B之工作夾台18、與粗磨削單元36a的一部分(輪座48、粗磨削輪50a等)。The cover member 60a forms a grinding chamber (processing chamber) 62a for rough grinding that separates the rough grinding area B from the loading and unloading area A and the fine grinding area C. The cover member 60a has a plurality of side plates and an upper plate to cover the work clamp 18 located in the rough grinding area B and a part of the rough grinding unit 36a (wheel seat 48, rough grinding wheel 50a, etc.).

在罩蓋構件60a的上板形成有用於供主軸42貫通的第1開口(未圖示)。由於該第1開口的直徑比主軸42的直徑稍大,因此第1開口的內周部不會接觸於主軸42的外周部。A first opening (not shown) is formed on the upper plate of the cover member 60a for the spindle 42 to pass through. Since the diameter of the first opening is slightly larger than the diameter of the spindle 42, the inner peripheral portion of the first opening does not contact the outer peripheral portion of the spindle 42.

在罩蓋構件60a的後方側的側板形成有第2開口,在此第2開口連接有以金屬所形成之排氣導管64a。排氣導管64a是彎曲之圓筒狀的導管,且具有內徑90mm的空洞部(亦即排氣路徑70a)。A second opening is formed on the side plate on the rear side of the cover member 60a, and an exhaust duct 64a formed of metal is connected to the second opening. The exhaust duct 64a is a curved cylindrical duct and has a hollow portion (i.e., exhaust path 70a) with an inner diameter of 90 mm.

排氣路徑70a的一端連接於磨削室62a。又,排氣路徑70a的另一端連接於排氣單元68,前述排氣單元68包含風扇等之吸引源66、與過濾器(未圖示)。One end of the exhaust path 70a is connected to the grinding chamber 62a. The other end of the exhaust path 70a is connected to the exhaust unit 68. The exhaust unit 68 includes a suction source 66 such as a fan and a filter (not shown).

於排氣導管64a的側面形成有將排氣導管64a的一部分貫通的貫通開口(開口部)72a。本實施形態的貫通開口72a具有圓柱形狀,且貫通開口72a的長度(亦即圓柱的高度)與構成排氣導管64a之壁的厚度大致相等。A through opening (opening) 72a is formed on the side of the exhaust duct 64a, through which a part of the exhaust duct 64a passes. The through opening 72a of this embodiment has a cylindrical shape, and the length of the through opening 72a (that is, the height of the cylinder) is substantially equal to the thickness of the wall constituting the exhaust duct 64a.

又,貫通開口72a的大小(亦即圓柱的直徑)充分地小到以下程度:可以減少在排氣路徑70a上之急遽的壓力的變化擴及於箱體74a之情形。本實施形態之貫通開口72a具有0.2mm(排氣導管64a之直徑的0.22%)之直徑。Furthermore, the size of the through opening 72a (i.e., the diameter of the cylinder) is sufficiently small to reduce the spread of the rapid pressure change on the exhaust path 70a to the box 74a. The through opening 72a of this embodiment has a diameter of 0.2 mm (0.22% of the diameter of the exhaust duct 64a).

但是,貫通開口72a亦可具有0.1mm以上且0.5mm以下(亦即排氣導管64a之直徑的約0.11%以上且約0.56%以下)之任意的直徑。只要在此範圍,就可以減少在排氣路徑70a上之急遽的壓力的變化擴及於箱體74a之情形。However, the through opening 72a may have any diameter between 0.1 mm and 0.5 mm (i.e., between about 0.11% and about 0.56% of the diameter of the exhaust duct 64a). As long as it is within this range, the rapid pressure change on the exhaust path 70a can be reduced from spreading to the box 74a.

在相對於貫通開口72a而與排氣路徑70a為相反的相反側,設置有以和排氣導管64a相同之金屬材料所形成之空洞的箱體74a。箱體74a透過貫通開口72a而連通於排氣路徑70a。On the opposite side of the exhaust path 70a relative to the through opening 72a, a hollow box 74a formed of the same metal material as the exhaust duct 64a is provided. The box 74a is connected to the exhaust path 70a through the through opening 72a.

在箱體74a設置有檢測箱體74a內部的壓力之壓力感測器76a。作為壓力感測器76a,可使用壓阻型、靜電容量型等之各種壓力感測器。壓力感測器76a在已偵測到箱體74a內部的壓力的大小低於預定的閾值(例如-100Pa之大小)的情況下,會對上述的控制部傳送預定的訊號。A pressure sensor 76a for detecting the pressure inside the box 74a is provided in the box 74a. As the pressure sensor 76a, various pressure sensors such as a piezoresistance type and an electrostatic capacitance type can be used. When the pressure sensor 76a detects that the pressure inside the box 74a is lower than a predetermined threshold value (e.g., -100Pa), it transmits a predetermined signal to the above-mentioned control unit.

控制部在從壓力感測器76a接收到預定的訊號的情況下,會使安裝於基台4上的殼體(未圖示)之警示燈、蜂鳴器、監視器等之警報通知部(未圖示)動作,而發出警報。When the control unit receives a predetermined signal from the pressure sensor 76a, it activates an alarm notification unit (not shown) such as a warning light, buzzer, monitor, etc. of a housing (not shown) mounted on the base 4 to sound an alarm.

於精磨削區域C的上方設置有與罩蓋構件60a同樣的罩蓋構件60b(參照圖1)。罩蓋構件60b形成有精磨削用之磨削室(加工室)62b。A cover member 60b (see FIG. 1 ) similar to the cover member 60a is provided above the finish grinding area C. The cover member 60b forms a grinding chamber (processing chamber) 62b for finish grinding.

罩蓋構件60b具有複數個側板與1個上板,以覆蓋位於精磨削區域C之工作夾台18、與精磨削單元36b的一部分(輪座48、精磨削輪50b等)。於罩蓋構件60b的上板也形成有供主軸42貫通的第1開口。The cover member 60b has a plurality of side plates and an upper plate to cover the work clamp 18 and a portion of the fine grinding unit 36b (wheel seat 48, fine grinding wheel 50b, etc.) located in the fine grinding area C. A first opening for the main shaft 42 to pass through is also formed on the upper plate of the cover member 60b.

又,在罩蓋構件60b的後方側的側板形成有第2開口(未圖示),在此第2開口連接有以金屬所形成之排氣導管64b。排氣導管64b由於具有和排氣導管64a大致相同的形狀、構造、功能等,因此省略詳細的說明。A second opening (not shown) is formed on the side plate of the rear side of the cover member 60b, and an exhaust duct 64b formed of metal is connected to the second opening. Since the exhaust duct 64b has substantially the same shape, structure, function, etc. as the exhaust duct 64a, detailed description thereof is omitted.

於排氣導管64b的內部也形成有和排氣路徑70a相同的形狀之排氣路徑。又,在排氣導管64b的側面形成有和貫通開口72a相同的形狀之貫通開口(未圖示)。An exhaust path having the same shape as the exhaust path 70a is also formed inside the exhaust duct 64b. A through opening (not shown) having the same shape as the through opening 72a is formed on the side surface of the exhaust duct 64b.

在相對於排氣導管64b的貫通開口而與排氣導管64b之排氣路徑為相反的相反側,設置有與箱體74a相同的箱體(未圖示)。在此箱體的內部也設置有和壓力感測器76a相同的壓力感測器(未圖示)。A box (not shown) identical to the box 74a is provided on the opposite side of the exhaust passage of the exhaust duct 64b relative to the through opening of the exhaust duct 64b. A pressure sensor (not shown) identical to the pressure sensor 76a is also provided inside the box.

但是,磨削室62a、62b的底部配置有轉台16。圖3(A)是轉台16的俯視圖。在轉台16的上表面,以將圓形的轉台16大致三等分的方式,設置有複數個區隔板78。However, the turntable 16 is disposed at the bottom of the grinding chambers 62a and 62b. Fig. 3(A) is a top view of the turntable 16. A plurality of partition plates 78 are provided on the upper surface of the turntable 16 so as to divide the circular turntable 16 into approximately three equal parts.

各區隔板78是在轉台16的上表面的中心附近互相連接,並從轉台16的上表面的中心附近形成至外周。圖3(B)是轉台16的立體圖。The partition plates 78 are connected to each other near the center of the upper surface of the turntable 16, and are formed from the center of the upper surface of the turntable 16 to the outer periphery. FIG3(B) is a perspective view of the turntable 16.

區隔板78從轉台16的上表面突出有相當於預定長度。在轉台16的靜止時,各區隔板78的上部與在Z軸方向上相鄰之罩蓋構件60a及罩蓋構件60b之側板的底部稍微分開(參照圖2)。The partition plates 78 protrude from the upper surface of the turntable 16 by a predetermined length. When the turntable 16 is stationary, the upper portion of each partition plate 78 is slightly separated from the bottom of the side plates of the cover member 60a and the cover member 60b adjacent in the Z-axis direction (see FIG. 2 ).

接著,說明使用磨削裝置2來磨削被加工物11之順序。首先,搬送機器人6從片匣10a往定位工作台12搬送被加工物11。以定位工作台12調整被加工物11的位置後,裝載臂14將被加工物11往位於搬入搬出區域A之工作夾台18搬送。Next, the procedure of grinding the workpiece 11 using the grinding device 2 is described. First, the transport robot 6 transports the workpiece 11 from the magazine 10a to the positioning table 12. After the positioning table 12 adjusts the position of the workpiece 11, the loading arm 14 transports the workpiece 11 to the work clamp 18 located in the loading and unloading area A.

此時,被加工物11是以被加工物11的背面側朝向上方的方式來載置到保持面18a上。並且,可藉保持面18a吸引保持被加工物11的正面側。之後,使轉台16朝順時針方向旋轉。At this time, the workpiece 11 is placed on the holding surface 18a with the back side of the workpiece 11 facing upward. The front side of the workpiece 11 can be sucked and held by the holding surface 18a. Thereafter, the turntable 16 is rotated in the clockwise direction.

藉此,吸引保持有被加工物11的工作夾台18會移動至粗磨削區域B。在粗磨削區域B中,使工作夾台18與粗磨削單元36a的主軸42各自旋轉。然後,一邊對粗磨削磨石54a供給磨削水,一邊將粗磨削單元36a磨削進給。Thereby, the work table 18 holding the workpiece 11 by suction moves to the rough grinding area B. In the rough grinding area B, the work table 18 and the spindle 42 of the rough grinding unit 36a are rotated. Then, the rough grinding unit 36a is fed for grinding while supplying grinding water to the rough grinding grindstone 54a.

如圖2所示,當粗磨削磨石54a接觸於被加工物11的背面側時,會對背面側進行粗磨削(加工)。磨削時,可藉由使吸引源66動作,而將磨削室62a及排氣路徑70a之氣壓設成比大氣壓力更低之狀態(亦即負壓)。As shown in Fig. 2, when the rough grinding grindstone 54a contacts the back side of the workpiece 11, the back side is roughly ground (processed). During grinding, the air pressure of the grinding chamber 62a and the exhaust path 70a can be set to a state lower than the atmospheric pressure (i.e., negative pressure) by operating the suction source 66.

磨削室62a及排氣路徑70a的氣壓是例如調整成比大氣壓力更低相當於110Pa之負壓(亦即-110Pa[gauge])。像這樣,藉由將磨削室62a及排氣路徑70a形成為負壓,可將霧狀的磨削水或粉狀之加工屑透過排氣路徑70a等於磨削裝置2往外部排出。The air pressure of the grinding chamber 62a and the exhaust path 70a is adjusted to a negative pressure equivalent to 110Pa (i.e. -110Pa [gauge]) lower than the atmospheric pressure, for example. In this way, by forming the grinding chamber 62a and the exhaust path 70a to a negative pressure, atomized grinding water or powdered machining chips can be discharged to the outside of the grinding device 2 through the exhaust path 70a.

粗磨削結束後,首先使吸引源66的動作停止。接著,例如花費約1.3秒的時間來使轉台16朝順時針方向旋轉約120度,以使位於粗磨削區域B之工作夾台18往精磨削區域C移動。After the rough grinding is finished, the action of the suction source 66 is stopped first. Then, for example, it takes about 1.3 seconds to rotate the turntable 16 about 120 degrees in the clockwise direction so that the work clamp 18 located in the rough grinding area B moves to the fine grinding area C.

於轉台16的旋轉時,如圖4所示,會在區隔板78的上部、及罩蓋構件60a的下部之間產生間隙,而將磨削室62a、62b暫時地朝大氣或無塵室內的氣體環境開放。When the turntable 16 rotates, as shown in FIG. 4 , a gap is created between the upper portion of the partition plate 78 and the lower portion of the cover member 60a, and the grinding chambers 62a and 62b are temporarily opened to the atmosphere or the gas environment in the clean room.

圖4為本實施形態之磨削室62a等的局部剖面側視圖,且顯示已暫時地將磨削室62a開放之情形。再者,本說明書中,所謂磨削室62a、62b的暫時之開放意指:起因於轉台16的旋轉之開放,且為例如1秒以上且3秒以下的時間之開放。Fig. 4 is a partial cross-sectional side view of the grinding chamber 62a, etc. of this embodiment, and shows that the grinding chamber 62a is temporarily opened. In this specification, the temporary opening of the grinding chambers 62a and 62b means that the grinding chambers 62a and 62b are opened due to the rotation of the turntable 16, and the opening time is, for example, more than 1 second and less than 3 seconds.

由於磨削室62a的暫時之開放,空氣會往磨削室62a流入,且排氣路徑70a之負壓的大小會暫時地降低。亦即,排氣路徑70a的壓力會暫時地上升成接近於大氣壓力。Due to the temporary opening of the grinding chamber 62a, air will flow into the grinding chamber 62a, and the negative pressure of the exhaust path 70a will temporarily decrease. In other words, the pressure of the exhaust path 70a will temporarily rise to be close to the atmospheric pressure.

但是,如上述,由於使排氣路徑70a與箱體74a連通之貫通開口72a充分地小,因此排氣路徑70a之壓力的急遽的變化難以擴及到箱體74a。其結果,箱體74a內的負壓雖然其大小會稍微降低,但可維持在-100Pa以下且-120Pa以上的範圍。However, as described above, since the through opening 72a connecting the exhaust path 70a and the box 74a is sufficiently small, the rapid change in the pressure of the exhaust path 70a is difficult to spread to the box 74a. As a result, the negative pressure in the box 74a is slightly reduced, but can be maintained in the range of less than -100Pa and more than -120Pa.

從而,壓力感測器76a即使一般會持續監視排氣路徑70a的壓力,對於排氣路徑70a之暫時的負壓的大小的降低仍然難以受到影響。因此,即使排氣路徑70a的負壓的大小暫時地降低,磨削裝置2仍然不會發出警報。Therefore, even if the pressure sensor 76a generally continues to monitor the pressure of the exhaust path 70a, it is still difficult to be affected by the temporary decrease in the magnitude of the negative pressure of the exhaust path 70a. Therefore, even if the magnitude of the negative pressure of the exhaust path 70a temporarily decreases, the grinding device 2 will not issue an alarm.

再者,由於在形成於排氣導管64b的側面之貫通開口中也產生同樣的現象,因此即使排氣導管64b的排氣路徑之負壓的大小暫時地降低,磨削裝置2仍然不會發出警報。因此,可以減少在磨削裝置2之不必要的警報。Furthermore, since the same phenomenon occurs in the through opening formed on the side of the exhaust duct 64b, even if the negative pressure of the exhaust path of the exhaust duct 64b is temporarily reduced, the grinding device 2 will not issue an alarm. Therefore, unnecessary alarms in the grinding device 2 can be reduced.

接著,在精磨削區域C中,一邊對被加工物11的背面側供給磨削水一邊施行精磨削(加工)。精磨削結束後,首先使吸引源66的動作停止。接著,花費例如約2.6秒的時間來使轉台16朝逆時針方向旋轉。Next, in the finish grinding area C, finish grinding (processing) is performed while supplying grinding water to the back side of the workpiece 11. After the finish grinding is completed, the operation of the suction source 66 is first stopped. Next, the turntable 16 is rotated counterclockwise for, for example, about 2.6 seconds.

藉此,使位於精磨削區域C的工作夾台18往搬入搬出區域A移動。但是,在轉台16旋轉時,也會因為磨削室62a及62b的暫時的開放,而使排氣路徑70a與排氣導管64b的排氣路徑之各負壓的大小暫時地降低。Thereby, the work clamp 18 located in the finish grinding area C is moved to the loading and unloading area A. However, when the turntable 16 rotates, the grinding chambers 62a and 62b are temporarily opened, so that the magnitude of each negative pressure of the exhaust path 70a and the exhaust path of the exhaust duct 64b is temporarily reduced.

但是,如上述,在本實施形態中,難以讓箱體74a內的負壓的大小降低。同樣地,也難以讓排氣導管64b之箱體內的負壓的大小降低。因此,可以減少磨削裝置2中的不必要的警報。However, as described above, in this embodiment, it is difficult to reduce the magnitude of the negative pressure in the housing 74a. Similarly, it is also difficult to reduce the magnitude of the negative pressure in the housing of the exhaust duct 64b. Therefore, unnecessary alarms in the grinding device 2 can be reduced.

位於已返回到搬入搬出區域A之工作夾台18上的被加工物11,是以卸載臂56往旋轉洗淨單元58搬送,並於進行在旋轉洗淨單元58之洗淨及乾燥之後,藉由搬送機器人6往片匣10b搬送。The workpiece 11 on the work clamp 18 that has returned to the loading and unloading area A is transported to the rotary cleaning unit 58 by the unloading arm 56, and after being cleaned and dried in the rotary cleaning unit 58, it is transported to the sheet magazine 10b by the transport robot 6.

其次,針對比較例進行說明。圖5為比較例之磨削室62a等的局部剖面側視圖,且顯示已暫時地將磨削室62a開放之情形。在比較例中,使排氣路徑70a與箱體74a連通之貫通開口82a的大小為比上述之貫通開口72a大。Next, the comparative example is described. FIG5 is a partial cross-sectional side view of the grinding chamber 62a of the comparative example, and shows the grinding chamber 62a being temporarily opened. In the comparative example, the size of the through opening 82a that connects the exhaust path 70a and the housing 74a is larger than the through opening 72a described above.

貫通開口82a具有例如圓柱形狀。貫通開口82a的大小(亦即圓柱的直徑)為例如與排氣導管64a的內徑大致相同。在轉台16的旋轉時,箱體74a內部的負壓的大小會起因於貫通開口82a的大小,而降低到與排氣路徑70a相同的程度。The through opening 82a has, for example, a cylindrical shape. The size of the through opening 82a (i.e., the diameter of the cylinder) is, for example, substantially the same as the inner diameter of the exhaust duct 64a. When the turntable 16 rotates, the size of the negative pressure inside the box 74a is reduced to the same level as the exhaust path 70a due to the size of the through opening 82a.

因此,壓力感測器76a容易受到排氣路徑70a的負壓的大小之暫時的降低的影響。圖6是說明使工作夾台18從粗磨削區域B往精磨削區域C移動時的排氣路徑70a的壓力變化的示意圖。Therefore, the pressure sensor 76a is easily affected by the temporary decrease in the magnitude of the negative pressure of the exhaust path 70a. Fig. 6 is a schematic diagram illustrating the change in the pressure of the exhaust path 70a when the work clamp 18 is moved from the rough grinding area B to the fine grinding area C.

橫軸表示時間。t1 是表示轉台16的旋轉開始時間點,t2 是表示轉台16的旋轉停止時間點。t1 至t2 的時間是轉台16的旋轉時間,可為例如約1.3秒。The horizontal axis represents time. t1 represents the start time of the rotation of the turntable 16, and t2 represents the stop time of the rotation of the turntable 16. The time from t1 to t2 is the rotation time of the turntable 16, which may be, for example, about 1.3 seconds.

縱軸表示以大氣壓力為基準之負壓(Pa[gauge])。再者,在縱軸中,是越朝下負壓的大小變得越大,且越朝上負壓的大小變得越小。圖6之圖形90(實線)是表示比較例之排氣路徑70a的壓力變化。The vertical axis represents the negative pressure (Pa [gauge]) based on the atmospheric pressure. In addition, in the vertical axis, the negative pressure becomes larger as it goes down, and the negative pressure becomes smaller as it goes up. The graph 90 (solid line) in FIG6 represents the pressure change of the exhaust path 70a of the comparative example.

如圖形90(實線)所示,比較例之箱體74a內的負壓的大小在排氣路徑70a的負壓的大小暫時地降低時,會急遽地降低。因此,壓力感測器76a所測定之箱體74a內的負壓的大小會低於-100Pa[gauge]的大小,而降低至-70Pa[gauge]左右的大小。從而,成為以下情形:在每次使轉台16旋轉時,磨削裝置2即發出警報。As shown in the graph 90 (solid line), the magnitude of the negative pressure in the housing 74a of the comparative example decreases rapidly when the magnitude of the negative pressure in the exhaust path 70a decreases temporarily. Therefore, the magnitude of the negative pressure in the housing 74a measured by the pressure sensor 76a decreases to about -70Pa[gauge], which is lower than -100Pa[gauge]. As a result, the grinding device 2 generates an alarm each time the turntable 16 is rotated.

相對於此,圖6的圖形92(一點鏈線)是表示上述之實施形態的排氣路徑70a的壓力變化。如圖形92所示,即使排氣路徑70a的負壓的大小暫時地降低,本實施形態之箱體74a內的負壓的大小也不會低於-100Pa[gauge]的大小。從而,可以減少磨削裝置2中的不必要的警報。In contrast, the graph 92 (one-dot chain) in FIG6 shows the pressure change of the exhaust path 70a of the above-mentioned embodiment. As shown in the graph 92, even if the magnitude of the negative pressure of the exhaust path 70a is temporarily reduced, the magnitude of the negative pressure in the housing 74a of the present embodiment will not be lower than -100Pa [gauge]. Thus, unnecessary alarms in the grinding device 2 can be reduced.

另外,上述實施形態之構成、方法等,只要在不脫離本發明之目的之範圍內,均可適當變更而實施。在一例中,在上述實施形態中,雖然將箱體74a直接連接於排氣導管64a的側面,但是亦可透過連接軟管(未圖示)來連接排氣導管64a的貫通開口72a與箱體74a。In addition, the configuration and method of the above-mentioned embodiments can be appropriately modified and implemented as long as they do not deviate from the scope of the purpose of the present invention. In one example, in the above-mentioned embodiment, although the box 74a is directly connected to the side of the exhaust duct 64a, the through opening 72a of the exhaust duct 64a and the box 74a can also be connected through a connecting hose (not shown).

在此情況下,對連接軟管的長度方向正交之截面的內徑是設成和貫通開口72a大致相同直徑。再者,只要可將磨削室62a等的加工室形成為負壓氣體環境,亦可將本申請案之技術思想適用於其他的加工裝置。In this case, the inner diameter of the cross section perpendicular to the length direction of the connecting hose is set to be substantially the same as the diameter of the through opening 72a. Furthermore, as long as the processing chamber such as the grinding chamber 62a can be formed into a negative pressure gas environment, the technical concept of this application can also be applied to other processing devices.

作為其他的加工裝置,可列舉例如研磨裝置。研磨裝置具備研磨單元、與配置在研磨單元的下方且吸引保持被加工物11的工作夾台。研磨單元具有主軸、與裝設在主軸的下端部的研磨墊輪。As another processing device, a grinding device can be cited, for example. The grinding device includes a grinding unit and a worktable disposed below the grinding unit and sucking and holding the workpiece 11. The grinding unit has a main spindle and a grinding pad mounted on the lower end of the main spindle.

研磨裝置的工作夾台的上方會被罩蓋構件所覆蓋。罩蓋構件具有複數個側板與1個上板,以覆蓋工作夾台、與研磨單元的一部分。該罩蓋構件構成研磨室(加工室)。The top of the work clamp of the grinding device is covered by a cover member. The cover member has a plurality of side plates and an upper plate to cover the work clamp and a part of the grinding unit. The cover member constitutes a grinding chamber (processing chamber).

在罩蓋構件的上板形成有用於供主軸貫通的開口。該開口的直徑比主軸的直徑稍大。在罩蓋構件的後方側的側板形成有其他開口,於其他開口連接有以金屬所形成之排氣導管。An opening is formed on the upper plate of the cover member for the spindle to pass through. The diameter of the opening is slightly larger than the diameter of the spindle. Another opening is formed on the side plate of the rear side of the cover member, and an exhaust duct formed of metal is connected to the other opening.

在被加工物11的研磨時,是將研磨室設為負壓氣體環境,並透過已連接於研磨室的排氣導管,來對在研磨室內產生之霧狀的研磨水(加工水)等進行排氣。再者,亦可將研磨裝置的工作夾台配置在轉台16的一部分,來設成磨削研磨裝置(加工裝置)。When grinding the workpiece 11, the grinding chamber is set to a negative pressure gas environment, and the mist-like grinding water (processing water) generated in the grinding chamber is exhausted through the exhaust duct connected to the grinding chamber. Furthermore, the work clamp of the grinding device can also be arranged on a part of the turntable 16 to set up a grinding device (processing device).

2:磨削裝置 4:基台 4a:凹部 6:搬送機器人 8a,8b:片匣載置區域 10a,10b:片匣 11:被加工物 12:定位工作台 14:裝載臂 16:轉台 18:工作夾台 18a:保持面 22a,22b:支撐構造 24:磨削進給單元 26:Z軸導軌 28:Z軸移動板 30:Z軸滾珠螺桿 32:Z軸脈衝馬達 36a:粗磨削單元 36b:精磨削單元 38:保持構件 40:主軸殼體 42:主軸 44:馬達 48:輪座 50a:粗磨削輪 50b:精磨削輪 52a:輪基台 54a:粗磨削磨石 56:卸載臂 58:旋轉洗淨單元 60a,60b:罩蓋構件 62a,62b:磨削室 64a,64b:排氣導管 66:吸引源 68:排氣單元 70a:排氣路徑 72a:貫通開口 74a:箱體 76a:壓力感測器 78:區隔板 82a:貫通開口 90,92:圖形 A:搬入搬出區域 B:粗磨削區域 C:精磨削區域 X,Y,Z:方向2: Grinding device 4: Base 4a: Recess 6: Transfer robot 8a, 8b: Cassette loading area 10a, 10b: Cassette 11: Workpiece 12: Positioning table 14: Loading arm 16: Turntable 18: Work clamp 18a: Holding surface 22a, 22b: Support structure 24: Grinding feed unit 26: Z-axis guide rail 28: Z-axis moving plate 30: Z-axis ball screw 32: Z-axis pulse motor 36a: Rough grinding unit 36b: Fine grinding unit 38: Holding member 40: Spindle housing 42: Spindle 44: Motor 48: Wheel seat 50a: Rough grinding wheel 50b: Fine grinding wheel 52a: Wheel base 54a: Rough grinding stone 56: Unloading arm 58: Rotary cleaning unit 60a, 60b: Cover member 62a, 62b: Grinding chamber 64a, 64b: Exhaust duct 66: Suction source 68: Exhaust unit 70a: Exhaust path 72a: Through opening 74a: Box 76a: Pressure sensor 78: Partition plate 82a: Through opening 90, 92: Graphics A: Loading and unloading area B: Rough grinding area C: Fine grinding area X, Y, Z: Direction

圖1為磨削裝置的立體圖。 圖2為磨削室等的局部剖面側視圖。 圖3(A)是轉台的俯視圖,圖3(B)是轉台的立體圖。 圖4為本實施形態之磨削室等的局部剖面側視圖。 圖5為比較例之磨削室等的局部剖面側視圖。 圖6是說明排氣路徑的壓力變化的示意圖。FIG1 is a perspective view of a grinding device. FIG2 is a partial cross-sectional side view of a grinding chamber, etc. FIG3(A) is a top view of a turntable, and FIG3(B) is a perspective view of a turntable. FIG4 is a partial cross-sectional side view of a grinding chamber, etc. of the present embodiment. FIG5 is a partial cross-sectional side view of a grinding chamber, etc. of a comparative example. FIG6 is a schematic diagram illustrating pressure changes in an exhaust path.

11:被加工物 11: Object to be processed

16:轉台 16: Turntable

18:工作夾台 18: Workbench

18a:保持面 18a: Keep the face

38:保持構件 38: Retaining components

40:主軸殼體 40: Spindle housing

42:主軸 42: Main axis

48:輪座 48: Wheel seat

50a:粗磨削輪 50a: Rough grinding wheel

52a:輪基台 52a: Wheel base

54a:粗磨削磨石 54a: Rough grinding grindstone

60a:罩蓋構件 60a: Covering member

62a:磨削室 62a: Grinding room

64a:排氣導管 64a: Exhaust duct

66:吸引源 66: Attraction source

68:排氣單元 68: Exhaust unit

70a:排氣路徑 70a: Exhaust path

72a:貫通開口 72a: Through opening

74a:箱體 74a: Cabinet

76a:壓力感測器 76a: Pressure sensor

78:區隔板 78: Divider

Claims (2)

一種加工裝置,是一邊對被工作夾台所保持之被加工物供給加工水,一邊以具有主軸之加工單元來對該被加工物進行加工之加工裝置,前述加工裝置的特徵在於:具備:罩蓋構件,包含上板與複數個側板,並覆蓋該工作夾台與該加工單元的一部分;排氣導管,連接於該罩蓋構件;及圓盤狀的轉台,在上表面側配置有該工作夾台,且該圓盤狀的轉台是配置在比該罩蓋構件的該上板更下方,該轉台具有從該轉台的該上表面突出的複數個區隔板,在該轉台的靜止時,該複數個區隔板配置在該複數個側板當中各自對應的側板之下方,在該轉台的靜止時,至少在用該罩蓋構件、該轉台之該上表面及該複數個區隔板所規定的空間維持預定的負壓,但若藉由該轉台的旋轉,使該空間開放,則該空間的壓力會上升,該排氣導管具有:排氣路徑,一端連接於該罩蓋構件,且另一端連接於具有吸引源之排氣單元;及箱體,透過形成於該排氣導管的側面之開口部而連通於該排氣路徑,且於內部包含壓力感測器,該開口部具有可減少該排氣路徑之壓力的急遽的變化擴及到該箱體之大小。 A processing device is a processing device that supplies processing water to a workpiece held by a workpiece clamp while processing the workpiece with a processing unit having a main spindle. The processing device is characterized in that it has: a cover component, including an upper plate and a plurality of side plates, and covering the workpiece clamp and a portion of the processing unit; an exhaust duct connected to the cover component; and a disc-shaped turntable, on the side of the upper surface of which the workpiece clamp is arranged, and the disc-shaped turntable is arranged below the upper plate of the cover component, and the turntable has a plurality of partition plates protruding from the upper surface of the turntable, and when the turntable is stationary, the plurality of partition plates are arranged on the turntable. Under the corresponding side plates among the plurality of side plates, when the turntable is stationary, at least a predetermined negative pressure is maintained in the space defined by the cover member, the upper surface of the turntable and the plurality of partition plates. However, if the space is opened by the rotation of the turntable, the pressure in the space will rise. The exhaust duct has: an exhaust path, one end of which is connected to the cover member and the other end is connected to an exhaust unit having a suction source; and a box body, which is connected to the exhaust path through an opening formed on the side of the exhaust duct and contains a pressure sensor inside. The opening portion has a size that can reduce the rapid change of the pressure in the exhaust path and expand to the box body. 如請求項1之一種加工裝置,其中包含控制該加工單元及該轉 台之動作的控制部。A processing device as claimed in claim 1, comprising a control unit for controlling the movement of the processing unit and the turntable.
TW110106158A 2020-03-04 2021-02-22 Processing equipment TWI857212B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-037099 2020-03-04
JP2020037099A JP7446677B2 (en) 2020-03-04 2020-03-04 processing equipment

Publications (2)

Publication Number Publication Date
TW202135156A TW202135156A (en) 2021-09-16
TWI857212B true TWI857212B (en) 2024-10-01

Family

ID=77667381

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110106158A TWI857212B (en) 2020-03-04 2021-02-22 Processing equipment

Country Status (4)

Country Link
JP (1) JP7446677B2 (en)
KR (1) KR20210112243A (en)
CN (1) CN113427339B (en)
TW (1) TWI857212B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7726796B2 (en) * 2022-01-06 2025-08-20 株式会社ディスコ processing equipment
TWI876526B (en) * 2023-09-11 2025-03-11 均華精密工業股份有限公司 Multi-axis operation apparatus in opposite arrangement

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006194680A (en) * 2005-01-12 2006-07-27 Denso Corp Pressure sensor
JP2016198838A (en) * 2015-04-08 2016-12-01 株式会社ディスコ Cutting equipment
US20180158700A1 (en) * 2015-06-19 2018-06-07 J.E.T. Co., Ltd. Substrate processing system and substrate processing method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5979135A (en) * 1982-10-27 1984-05-08 Nippon Soken Inc Atmospheric pressure sensor
JP4170428B2 (en) 1997-12-25 2008-10-22 株式会社ディスコ Exhaust system
JP4331449B2 (en) * 2002-08-22 2009-09-16 株式会社ディスコ Processing equipment
DE102012211635B4 (en) * 2012-07-04 2024-07-04 Robert Bosch Gmbh Particle extraction device
JP2013070102A (en) * 2013-01-21 2013-04-18 Ebara Corp Exhaust device of substrate processing apparatus, and system
JP6108999B2 (en) * 2013-07-18 2017-04-05 株式会社ディスコ Cutting equipment
JP2015080834A (en) * 2013-10-22 2015-04-27 株式会社ディスコ Wafer processing system, and grinding apparatus
NL2012364B1 (en) * 2014-03-05 2015-12-03 Blastrac B V Grinding machine and method for grinding a floor surface.
JP2018167367A (en) * 2017-03-30 2018-11-01 株式会社ディスコ Grinding device
JP7034543B2 (en) * 2017-10-13 2022-03-14 株式会社ディスコ Tool cutting equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006194680A (en) * 2005-01-12 2006-07-27 Denso Corp Pressure sensor
JP2016198838A (en) * 2015-04-08 2016-12-01 株式会社ディスコ Cutting equipment
US20180158700A1 (en) * 2015-06-19 2018-06-07 J.E.T. Co., Ltd. Substrate processing system and substrate processing method

Also Published As

Publication number Publication date
JP2021137909A (en) 2021-09-16
JP7446677B2 (en) 2024-03-11
TW202135156A (en) 2021-09-16
CN113427339B (en) 2025-12-12
CN113427339A (en) 2021-09-24
KR20210112243A (en) 2021-09-14

Similar Documents

Publication Publication Date Title
TWI879990B (en) Grinding method of workpiece
TWI857212B (en) Processing equipment
JP2016154168A (en) Delivery method for workpiece
JP2011108979A (en) Method of cutting workpiece
JP5410940B2 (en) Grinding equipment
JP2021191598A (en) Method and device for grinding of workpiece
JP5926042B2 (en) Method for detecting cracks in plate-like substrates
US20240238938A1 (en) Grinding apparatus and grinding method
TWI890905B (en) Grinding device and driving method of grinding device
JP2017019055A (en) Chuck table and processing device equipped with chuck table
JP2025118200A (en) processing equipment
CN113001283B (en) Method for cleaning grinding chamber
TWI906313B (en) Processing device
JP7636120B2 (en) Processing Equipment
JP7593878B2 (en) Processing device, method for cutting off power supply to processing device, and method for preparing processing device for use
JP7614709B2 (en) Conveyor
JP2021175586A (en) Grinding device and method
CN110416112A (en) Cleaning device
TW202341272A (en) Processing equipment
KR20230174162A (en) Grinding apparatus
TW202349478A (en) Transport unit and processing device
JP2023171983A (en) grinding equipment
JP2024054473A (en) Processing Equipment
JP2025134401A (en) Processing device
JP2022049289A (en) Method for protecting holding surface of chuck table