TWI857272B - Docking assembly - Google Patents
Docking assembly Download PDFInfo
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- TWI857272B TWI857272B TW111103938A TW111103938A TWI857272B TW I857272 B TWI857272 B TW I857272B TW 111103938 A TW111103938 A TW 111103938A TW 111103938 A TW111103938 A TW 111103938A TW I857272 B TWI857272 B TW I857272B
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- docking
- tester
- socket base
- base
- unit
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
本發明涉及測試器結合部。 The present invention relates to a tester joint.
測試處理器(test handler)是一種設備,該設備支持對通過預定製造工藝製造的半導體元件等設備進行測試,根據測試結果對電子部件進行等級分類,然後將其裝載到客戶托盤(customer tray)中。 A test handler is a device that supports testing of devices such as semiconductor components manufactured through a predetermined manufacturing process, classifies the electronic components according to the test results, and then loads them into a customer tray.
為了使測試處理器測試半導體元件等設備,需要將設備電連接並對其進行測試的測試器(TESTER)。這種測試器與測試處理器分開製造,並且可以與測試處理器分開移送。另一方面,為了使用測試處理器和測試器,需要將測試器緊固連接在測試處理器上。以往都是通過螺栓結合來緊固連接測試處理器與測試器的。 In order for the test processor to test devices such as semiconductor components, a tester (TESTER) is required to electrically connect the device and test it. This tester is manufactured separately from the test processor and can be transported separately from the test processor. On the other hand, in order to use the test processor and the tester, the tester needs to be firmly connected to the test processor. In the past, the test processor and the tester were firmly connected by bolts.
但是,為了使設備穩定運行,有必要定期或不定期進行檢查,並且當測試器出現問題時,有必要將測試器與測試處理器分離。由於這種分離是由使用人員將手放在測試處理器內並直接解開螺栓連接來執行的,因此一旦將測試器對接至測試處理器,就很難將測試器與測試處理器分離。 However, in order for the equipment to operate stably, it is necessary to perform regular or irregular inspections, and when a problem occurs with the tester, it is necessary to separate the tester from the test handler. Since this separation is performed by the user putting his hand inside the test handler and directly unfastening the bolt connection, it is difficult to separate the tester from the test handler once the tester is docked to the test handler.
另外,當測試處理器與測試器分離及結合多次時,形成在作為測試器一部分的插座基座中的螺紋可能會損壞。為了更換插座基座,需要重新連 接設置在插座基座周圍的大量配線,並且更換時間很長。另外,當在更換插座基座之後沒有精確地連接配線時,還存在更換整個測試器的情況。 In addition, when the test handler is separated from and combined with the tester many times, the threads formed in the socket base which is a part of the tester may be damaged. In order to replace the socket base, a large amount of wiring provided around the socket base needs to be reconnected, and the replacement time is long. In addition, when the wiring is not accurately connected after replacing the socket base, there is also a case where the entire tester is replaced.
因此,需要一種能夠容易地將測試器與測試處理器結合及分離的測試器結合部。 Therefore, there is a need for a tester coupling portion that can easily couple and separate a tester to a test handler.
考慮到上述背景而發明了本發明的實施例,並且本發明的實施例旨在提供一種可以容易地與測試器結合及分離的測試器結合部。 In view of the above background, the embodiments of the present invention are invented, and the embodiments of the present invention are intended to provide a tester coupling portion that can be easily coupled to and separated from the tester.
另外,旨在提供一種能夠防止測試期間在設備周圍發生結露現象的測試器結合部。 In addition, it is intended to provide a tester joint that can prevent condensation from occurring around the device during testing.
根據本發明的一方面,可以提供一種測試器結合部,可以與設置有可容納設備的插座基座的測試器及處理器中的任一個相結合,包括對接板,所述對接板中形成有多個開口部及引導部,所述開口部用於將設置於所述插座基座中的所述設備暴露於所述處理器,為了可分離式結合於所述測試器,所述引導部具有槽及突起中的一個形狀,多個所述引導部中的至少一部分與形成於所述測試器中的多個測試器引導件相結合,從而所述對接板能夠與所述測試器相結合。 According to one aspect of the present invention, a tester coupling part can be provided, which can be coupled with any one of a tester and a processor provided with a socket base capable of accommodating a device, comprising a docking plate, wherein a plurality of openings and guides are formed in the docking plate, wherein the openings are used to expose the device provided in the socket base to the processor, and in order to be detachably coupled to the tester, the guide has a shape selected from a groove and a protrusion, and at least a portion of the plurality of guides is coupled with a plurality of tester guides formed in the tester, so that the docking plate can be coupled with the tester.
進一步地,可以提供一種測試器結合部,可以與設置有可容納設備的插座基座的測試器及處理器中的任一個相結合,包括:對接組件,能夠與所述插座基座相結合;以及對接板,形成有開口部,所述開口部用於將設置於所述插座基座中的所述設備暴露於所述處理器並包圍所述對接組件的至少一部分,當所述測試器接近所述對接板預定距離以下時,所述對接板能夠通過支撐所述對接組件來固定相對於所述對接板的所述插座基座的位置。 Furthermore, a tester coupling part can be provided, which can be coupled with any one of a tester and a processor provided with a socket base capable of accommodating a device, comprising: a docking assembly capable of being coupled with the socket base; and a docking plate formed with an opening portion, the opening portion being used to expose the device provided in the socket base to the processor and surround at least a portion of the docking assembly, and when the tester approaches the docking plate below a predetermined distance, the docking plate can fix the position of the socket base relative to the docking plate by supporting the docking assembly.
進一步地,可以提供一種測試器結合部,所述對接組件包括輔助 對接單元,所述輔助對接單元能夠與所述插座基座相連,所述對接板包括鎖定裝置,為了選擇性地支撐所述輔助對接單元,所述鎖定裝置中設置有夾緊件,所述夾緊件以朝向所述輔助對接單元進退的方式驅動,所述夾緊件支撐與所述插座基座相連的所述輔助對接單元,以此所述鎖定裝置可以固定相對於所述對接板的所述插座基座的位置。 Furthermore, a tester coupling part can be provided, wherein the docking assembly includes an auxiliary docking unit, the auxiliary docking unit can be connected to the socket base, the docking plate includes a locking device, and in order to selectively support the auxiliary docking unit, a clamping member is provided in the locking device, the clamping member is driven in a forward and backward manner toward the auxiliary docking unit, and the clamping member supports the auxiliary docking unit connected to the socket base, so that the locking device can fix the position of the socket base relative to the docking plate.
進一步地,可以提供一種測試器結合部,所述輔助對接單元包括輥部,所述輥部通過與朝向所述輔助對接單元前進的所述夾緊件相接觸來進行旋轉,所述夾緊件以朝向所述輥部進退的方式驅動。 Furthermore, a tester coupling portion may be provided, wherein the auxiliary docking unit includes a roller, the roller rotates by contacting the clamping member advancing toward the auxiliary docking unit, and the clamping member is driven in a manner of advancing and retreating toward the roller.
進一步地,可以提供一種測試器結合部,所述對接組件包括清洗套件,所述清洗套件可以與所述插座基座一起形成清洗流路,並通過所述清洗流路使濕度調節用流體流動。 Furthermore, a tester coupling portion can be provided, wherein the docking assembly includes a cleaning kit, and the cleaning kit can form a cleaning flow path together with the socket base, and a humidity adjustment fluid can flow through the cleaning flow path.
進一步地,可以提供一種測試器結合部,所述對接組件中形成有結合孔,形成於所述插座基座中的結合突起可以貫通插入於所述結合孔中,所述對接板可以通過與貫通所述結合孔的所述結合突起相結合來固定相對於所述對接板的所述插座基座的位置。 Furthermore, a tester coupling part can be provided, wherein a coupling hole is formed in the docking assembly, a coupling protrusion formed in the socket base can be inserted through the coupling hole, and the docking plate can be fixed at the position of the socket base relative to the docking plate by coupling with the coupling protrusion passing through the coupling hole.
進一步地,可以提供一種對接組件,能夠與設置有能夠容納設備的插座基座的測試器及向所述測試器移送所述設備的處理器中的任一個相結合,包括:輔助對接單元,可以與所述插座基座相連;以及清洗套件,所述清洗套件可以與所述插座基座一起形成清洗流路,通過所述清洗流路使從所述測試器及所述處理器中的任一個接收到的濕度調節用流體流動。 Furthermore, a docking assembly can be provided, which can be combined with any one of a tester provided with a socket base capable of accommodating a device and a processor for transferring the device to the tester, comprising: an auxiliary docking unit, which can be connected to the socket base; and a cleaning kit, which can form a cleaning flow path with the socket base, and the humidity adjustment fluid received from any one of the tester and the processor flows through the cleaning flow path.
根據本發明的實施例,具有可以容易地與測試器結合及分離的效果。 According to the embodiment of the present invention, it has the effect of being able to be easily combined with and separated from the tester.
另外,具有可以防止測試設備時在設備周圍發生結露現象的效果。 In addition, it can prevent condensation around the equipment when testing the equipment.
1:處理器 1: Processor
2:測試器 2: Tester
2a:插座基座 2a: Socket base
2b:結合突起 2b: junctional protrusion
10:測試器結合部 10: Tester joint
20:基板 20: Substrate
30:框架 30: Framework
40:第一梭子單元 40: First shuttle unit
41:第一裝載區域 41: First loading area
42:第一交換區域 42: First exchange area
43:第一卸載區域 43: First unloading area
50:第二梭子單元 50: Second shuttle unit
51:第二裝載區域 51: Second loading area
52:第二交換區域 52: Second exchange area
53:第二卸載區域 53: Second unloading area
60:元件供應單元 60: Component supply unit
70:溫度調節部 70: Temperature control unit
80:裝載部 80: Loading unit
90:卸載部 90: Unloading Department
100:對接板 100: Docking plate
110:對接基座 110: Docking base
111:開口部 111: Opening
112,113:引導部 112,113: Guidance Department
114:緊固孔 114: Fastening hole
120:鎖定裝置 120: Locking device
121:夾緊件 121: Clamping piece
122:驅動部 122: Drive Department
130:操作部 130: Operation Department
200:對接組件 200: Docking assembly
201:結合孔 201: Binding hole
202:結合輥 202: Combined roller
210:主對接單元 210: Main docking unit
211:輔助溫度調節單元;加熱裝置 211: Auxiliary temperature control unit; heating device
212:雙金屬 212: Bimetallic
213:遮蔽體 213: Shielding Body
214:主整列銷 214: Main train pin
220:溫度調節單元 220: Temperature control unit
221:主體部 221: Main body
221a:移送流路 221a: Transfer flow path
222:流體流入口 222: Fluid inlet
223:阻擋件 223:Blocking piece
230:輔助對接單元 230: Auxiliary docking unit
231:輔助對接主體 231: Assist in connecting with the main body
232:輥部 232: Roller
233:凸出部 233: protrusion
234:輔助整列銷 234: Assisting in the whole train sales
240:清洗套件 240: Cleaning kit
241:清洗流入口 241: Cleaning inlet
242:套件整列孔 242: Kit row holes
250:接觸部 250: Contact part
260:歧管 260: Manifold
270:整列部件 270: Entire row of parts
圖1為本發明一實施例的處理器的俯視圖。 Figure 1 is a top view of a processor of an embodiment of the present invention.
圖2為本發明一實施例的測試器結合部的立體圖。 Figure 2 is a three-dimensional diagram of the tester coupling portion of an embodiment of the present invention.
圖3為圖2的測試器結合部的底部立體圖。 Figure 3 is a bottom perspective view of the tester joint of Figure 2.
圖4為圖2的測試器結合部的分解立體圖。 Figure 4 is a disassembled three-dimensional diagram of the tester joint in Figure 2.
圖5示出朝向圖2的輥部移動的鎖定裝置側視圖。 FIG5 shows a side view of the locking device moving toward the roller of FIG2.
圖6為圖2的輔助對接單元、清洗套件及插座基座的立體圖。 Figure 6 is a three-dimensional diagram of the auxiliary docking unit, cleaning kit and socket base of Figure 2.
圖7為圖2的主對接單元的橫向剖視圖。 Figure 7 is a transverse cross-sectional view of the main docking unit of Figure 2.
圖8為圖2的溫度調節單元的橫向剖視圖。 Figure 8 is a transverse cross-sectional view of the temperature control unit of Figure 2.
圖9為圖7的清洗套件的仰視圖。 Figure 9 is a bottom view of the cleaning kit of Figure 7.
圖10為本發明第二實施例的對接組件及插座基座的立體圖。 Figure 10 is a three-dimensional diagram of the docking assembly and the socket base of the second embodiment of the present invention.
在下文中,將參照附圖詳細說明用於實現本發明精神的具體實施例。 In the following, specific embodiments for realizing the spirit of the present invention will be described in detail with reference to the attached drawings.
另外,在說明本發明時,當判斷為相關公知構成或功能的具體說明可能使本發明的主旨不清楚時,將省略其詳細描述。 In addition, when describing the present invention, if it is determined that the specific description of the relevant known structure or function may make the main purpose of the present invention unclear, its detailed description will be omitted.
另外,當提到某個構成要素“連接”,“支撐”、“傳達”、“供應”、“對接”、“結合”、“緊固連接”及“固定”到另一構成要素時,應當理解,可以直接連接、支撐、傳達、供應、對接、結合、緊固連接及固定到另一構成要素,但是其他構成要素可以存在於中間。 In addition, when a component is mentioned to be "connected", "supported", "transmitted", "supplied", "interfacing", "combined", "fastened connected" and "fixed" to another component, it should be understood that it can be directly connected, supported, communicated, supplied, interfacing, combined, fastened connected and fixed to another component, but other components can exist in between.
本說明書中使用的術語僅用於說明特定的實施例,而無意于限制本發明。除非上下文另外明確指出,否則單數表示方式包括複數表示方式。 The terms used in this specification are only used to illustrate specific embodiments and are not intended to limit the present invention. Unless the context clearly indicates otherwise, singular expressions include plural expressions.
另外,包括諸如第一、第二等序數的術語可以用於說明各種構成要素,但是相應的構成要素不受這些術語的限制。這些術語僅用於將一個構成 要素與另一個構成要素區分開。 In addition, terms including ordinal numbers such as first, second, etc. may be used to describe various constituent elements, but the corresponding constituent elements are not limited by these terms. These terms are only used to distinguish one constituent element from another constituent element.
如說明書中所使用的“包括”的含義是指具體化特定的特性、區域、整數、步驟、動作、元素和/或成分,不排除其他特定的特性、區域、整數、步驟、動作、元素、成分和/或群的存在或附加。 As used in the specification, the meaning of "include" refers to specifying specific characteristics, regions, integers, steps, actions, elements and/or components, and does not exclude the existence or addition of other specific characteristics, regions, integers, steps, actions, elements, components and/or groups.
另外,在本說明書中,基於附圖中的圖示說明了底面等的表現形式,並且需要注意,如果改變相應物體的方向,則可以不同地表達。同時,在本說明書中,上下方向可以是圖4的上下方向。 In addition, in this specification, the representation of the bottom surface, etc. is explained based on the illustrations in the attached drawings, and it should be noted that if the direction of the corresponding object is changed, it can be expressed differently. At the same time, in this specification, the up and down direction can be the up and down direction of Figure 4.
本發明一實施例的測試器結合部10可以與處理器1及測試器2中的任一個相結合。在下文中,將首先說明測試器2。 The tester combination part 10 of an embodiment of the present invention can be combined with any one of the processor 1 and the tester 2. In the following, the tester 2 will be described first.
測試器2可以測試從處理器1接收到的設備。測試器2中可以設置有插座基座2a,所述插座基座2a中形成有插座。在這種插座中可以安裝待測試的設備。可以通過後述的元件供應單元60將待測試的設備裝載到插座基座2a中。 The tester 2 can test the device received from the processor 1. The tester 2 can be provided with a socket base 2a, in which a socket is formed. The device to be tested can be installed in this socket. The device to be tested can be loaded into the socket base 2a through the component supply unit 60 described later.
測試器2可以與處理器1相結合,並可以與處理器1電連接。測試器2可以設置在處理器1的下部以使插座基座2a進行升降,升降的插座基座2a可以與處理器1相結合。這種測試器2的上升可以通過操縱器(未圖示)來驅動。 The tester 2 can be combined with the processor 1 and can be electrically connected to the processor 1. The tester 2 can be set at the bottom of the processor 1 to make the socket base 2a rise and fall, and the rising and falling socket base 2a can be combined with the processor 1. The rise of this tester 2 can be driven by a manipulator (not shown).
在下文中,將參照附圖來說明包括本發明實施例的測試器結合部10的處理器1的具體構造。 In the following, the specific structure of the processor 1 including the tester coupling part 10 of the embodiment of the present invention will be described with reference to the attached drawings.
處理器1可以測試通過製造工藝製造的設備,根據測試結果將其分類為各等級,並裝載到客戶托盤上。處理器1可以可分離式與測試器2相結合。這種處理器1可以包括測試器結合部10、基板20、框架30、第一梭子單元40、第二梭子單元50、元件供應單元60、溫度調節部70、裝載部80及卸載部90。 The processor 1 can test the equipment manufactured by the manufacturing process, classify it into grades according to the test results, and load it onto the customer tray. The processor 1 can be detachably combined with the tester 2. Such a processor 1 can include a tester combining part 10, a substrate 20, a frame 30, a first shuttle unit 40, a second shuttle unit 50, a component supply unit 60, a temperature regulating part 70, a loading part 80, and an unloading part 90.
在下文中將詳細說明測試器結合部10。 The tester coupling portion 10 will be described in detail below.
基板20可以提供與測試器結合部10相結合的部分。這種基板20的底面可以與測試器結合部10相結合,基板20可以通過螺栓與測試器結合部10緊 固連接。 The substrate 20 may provide a portion to be coupled with the tester coupling portion 10. The bottom surface of the substrate 20 may be coupled with the tester coupling portion 10, and the substrate 20 may be securely connected with the tester coupling portion 10 by bolts.
框架30可以支撐測試器結合部10、基板20、第一梭子單元40、第二梭子單元50、元件供應單元60、溫度調節部70、裝載部80及卸載部90。 The frame 30 can support the tester coupling part 10, the substrate 20, the first shuttle unit 40, the second shuttle unit 50, the component supply unit 60, the temperature adjustment part 70, the loading part 80 and the unloading part 90.
第一梭子單元40可以將待測試的設備從第一裝載區域41移送到第一交換區域42,將被測試的設備從第一交換區域42移送到第一卸載區域43。 The first shuttle unit 40 can transfer the equipment to be tested from the first loading area 41 to the first exchange area 42, and transfer the equipment to be tested from the first exchange area 42 to the first unloading area 43.
第二梭子單元50可以將待測試的設備從第二裝載區域51移送到第二交換區域52,將被測試的設備從第二交換區域52移送到第二卸載區域53。 The second shuttle unit 50 can transfer the equipment to be tested from the second loading area 51 to the second exchange area 52, and transfer the equipment to be tested from the second exchange area 52 to the second unloading area 53.
元件供應單元60可以將待測試的設備從第一交換區域42和第二交換區域52移送到插座基座2a,或將已測試的設備從插座基座2a移送到第一交換區域42和第二交換區域52。 The component supply unit 60 can move the device to be tested from the first exchange area 42 and the second exchange area 52 to the socket base 2a, or move the tested device from the socket base 2a to the first exchange area 42 and the second exchange area 52.
溫度調節部70可以在將待測試的設備供應給第一梭子單元40和第二梭子單元50之前對設備進行加熱或冷卻。 The temperature adjustment unit 70 can heat or cool the equipment to be tested before supplying it to the first shuttle unit 40 and the second shuttle unit 50.
裝載部80可以提供空間,在所述空間中裝載需要被測試器2測試的設備。 The loading section 80 can provide a space in which the equipment to be tested by the tester 2 is loaded.
卸載部90可以提供空間,在所述空間中裝載已被測試器2測試過的設備。 The unloading portion 90 can provide a space in which the equipment tested by the tester 2 can be loaded.
參照圖2至圖4,測試器結合部10可以提供與測試器2結合的部分以及用於將設備裝載或卸載到測試器2中的空間。這種測試器結合部10可以結合到基板20的底面,並可以通過螺栓緊固連接到基板20。而且,當測試器結合部10與測試器2相結合時,可以對測試器2的位置進行整列後固定。在本說明書中,可以通過後述的硬對接或自動對接方式將測試器結合部10直接/間接地與測試器2對接或取消對接。其中,對接可以表示測試器結合部10與測試器2相結合或相連接,而取消對接可以表示解除所述結合或連接。另一方面,在本說明書中,測試器結合部10已經被描述為包括在處理器1中,但可以是未包括在處理器1中 的單獨結構。因此,測試器結合部10也可以結合到處理器1及測試器2中的任一個上。這種測試器結合部10可以包括對接板100及對接組件200。 2 to 4 , the tester coupling portion 10 may provide a portion coupled to the tester 2 and a space for loading or unloading equipment into the tester 2. Such a tester coupling portion 10 may be coupled to the bottom surface of the substrate 20 and may be securely connected to the substrate 20 by bolts. Moreover, when the tester coupling portion 10 is coupled to the tester 2, the position of the tester 2 may be aligned and fixed. In the present specification, the tester coupling portion 10 may be directly/indirectly docked or undocking with the tester 2 by a hard docking or automatic docking method described later. Among them, docking may mean that the tester coupling portion 10 is coupled or connected to the tester 2, and undocking may mean releasing the coupling or connection. On the other hand, in this specification, the tester coupling part 10 has been described as being included in the processor 1, but may be a separate structure not included in the processor 1. Therefore, the tester coupling part 10 may also be coupled to either the processor 1 or the tester 2. Such a tester coupling part 10 may include a docking plate 100 and a docking assembly 200.
對接板100可以提供與測試器2相結合的部分。這種對接板100可以通過硬對接或自動對接的方式直接/間接地與測試器2相結合。這種對接板100可以包括對接基座110,鎖定裝置120及操作部130。 The docking plate 100 may provide a portion for coupling with the tester 2. The docking plate 100 may be directly/indirectly coupled with the tester 2 by hard docking or automatic docking. The docking plate 100 may include a docking base 110, a locking device 120, and an operating portion 130.
參照圖3,對接基座110可以提供與測試器2相結合的部分以及設備通過測試器2的空間。可以在這種對接基座110中形成開口部111,所述開口部111用於將設置在插座基座2a中的設備暴露於處理器1。換句話說,開口部111用於將設置於插座基座2a中的設備暴露於元件供應單元60。這種開口部111可以從對接基座110的中心部開放形成。 Referring to FIG. 3 , the docking base 110 may provide a portion combined with the tester 2 and a space for the device to pass through the tester 2. An opening portion 111 may be formed in the docking base 110, and the opening portion 111 is used to expose the device disposed in the socket base 2a to the processor 1. In other words, the opening portion 111 is used to expose the device disposed in the socket base 2a to the component supply unit 60. The opening portion 111 may be formed by opening from the center portion of the docking base 110.
對接基座110可以提供與測試器2相結合的部分。當測試器2通過操縱器朝向對接基座110的底面上升時,這種對接基座110可以與測試器2相結合。參照圖3,在對接基座110中可以形成有引導部112、113,為了可分離式結合於測試器2,所述引導部112、113可以具有槽及突起中的一個形狀。所述槽可以為從對接基座110引入預定深度的槽,所述突起可以是從對接基座110凸出的銷或桿。另外,引導部112可以具有孔形狀。這樣,對接基座110可以通過使多個引導部112、113中的至少一部分與形成在測試器2上的測試器引導件(未圖示)相結合而結合到測試器2上。其中,與引導部112、113的形狀相對應地,測試器引導件可以具有突起及槽中的一個形狀。另外,可以在對接基座110中形成緊固孔114,可以將用於與基板20緊固連接的螺栓(未圖示)插入其中。插入到這種緊固孔114中的螺栓與基板20緊固連接,從而對接基座110可以與基板20相結合。 The docking base 110 may provide a portion to be coupled with the tester 2. When the tester 2 is raised toward the bottom surface of the docking base 110 by the manipulator, the docking base 110 may be coupled with the tester 2. Referring to FIG. 3 , guide portions 112 and 113 may be formed in the docking base 110, and the guide portions 112 and 113 may have one of a groove and a protrusion in order to be detachably coupled to the tester 2. The groove may be a groove introduced into the docking base 110 to a predetermined depth, and the protrusion may be a pin or a rod protruding from the docking base 110. In addition, the guide portion 112 may have a hole shape. In this way, the docking base 110 can be coupled to the tester 2 by coupling at least a portion of the plurality of guides 112 and 113 to a tester guide (not shown) formed on the tester 2. The tester guide may have a shape of a protrusion and a groove corresponding to the shape of the guides 112 and 113. In addition, a fastening hole 114 may be formed in the docking base 110, into which a bolt (not shown) for fastening to the substrate 20 may be inserted. The bolt inserted into the fastening hole 114 is fastened to the substrate 20, so that the docking base 110 can be coupled to the substrate 20.
在下文中,將參照圖3說明硬對接方式。可以通過使形成在對接基座110上的槽狀的引導部112與形成在測試器2上的測試器引導件相結合來實現硬對接。換句話說,在測試器2朝向對接基座110的底面上升期間,測試器引導 件將插入至對接基座110的槽狀的引導部112中,從而對接板100可以與測試器2相結合。另外,在進行硬對接期間,測試器引導件將插入至槽狀的引導部112中,從而可以整列相對於對接基座110的測試器2的位置。當完成硬對接時,測試器2的插座基座2a可以緊貼於對接基座110的底面,插座基座2a的位置可以在開口部111的下側。 Hereinafter, the hard docking method will be described with reference to FIG. 3. The hard docking can be achieved by combining the groove-shaped guide portion 112 formed on the docking base 110 with the tester guide formed on the tester 2. In other words, during the period when the tester 2 rises toward the bottom surface of the docking base 110, the tester guide will be inserted into the groove-shaped guide portion 112 of the docking base 110, so that the docking plate 100 can be combined with the tester 2. In addition, during the hard docking, the tester guide will be inserted into the groove-shaped guide portion 112, so that the position of the tester 2 relative to the docking base 110 can be arranged. When the hard docking is completed, the socket base 2a of the tester 2 can be tightly attached to the bottom surface of the docking base 110, and the position of the socket base 2a can be on the lower side of the opening 111.
另一方面,根據不同的測試器2製造商測試器2的種類可以為多種。另外,形成在測試器2上的測試器引導件的位置可以根據測試器2的種類而不同,測試器引導件的尺寸及形態也可以不同。據此,可以在對接基座110中形成多個槽狀的引導部112,多個槽狀的引導部112可以形成在對接基座110的不同位置以插入設置於多種種類的測試器2中的測試器引導件。另外,多個槽狀的引導部112可以具有不同的尺寸及形態以插入設置於多種種類的測試器2中的測試器引導件。因此,本發明一實施例的對接基座110中包括的多個槽狀的引導部112可以與形成於多種種類的測試器2上的引導件,即,具有不同位置、尺寸及形態的測試器引導件相結合。換句話說,多種種類的測試器2可以通過硬對接方式與對接板100相結合。 On the other hand, the types of testers 2 may be various according to different manufacturers of the testers 2. In addition, the position of the tester guide formed on the tester 2 may be different according to the type of the tester 2, and the size and shape of the tester guide may also be different. Accordingly, a plurality of groove-shaped guide portions 112 may be formed in the docking base 110, and the plurality of groove-shaped guide portions 112 may be formed at different positions of the docking base 110 to insert the tester guides provided in the various types of testers 2. In addition, the plurality of groove-shaped guide portions 112 may have different sizes and shapes to insert the tester guides provided in the various types of testers 2. Therefore, the plurality of groove-shaped guide portions 112 included in the docking base 110 of an embodiment of the present invention may be combined with guides formed on the various types of testers 2, that is, tester guides having different positions, sizes, and shapes. In other words, various types of testers 2 can be combined with the docking plate 100 by hard docking.
另外,可以在對接基座110上形成突起形狀的引導部113,在測試器2上形成槽狀的測試器引導件。因此,在進行硬對接期間,首先將測試器2的突起形狀的測試器引導件插入至對接基座110的槽狀的引導部112中以進行第一次校正,之後將對接基座110的突起形狀的引導部113插入至槽狀的測試器引導件中以進行第二次校正。如上所述,在進行硬對接期間進行一次以上的校正,從而可以精確地調整測試器2相對於對接基座110的位置。這種突起形狀的引導部113及槽狀的測試器引導件可以形成為多個。另外,用於第一次校正的槽狀引導部112可以相比用於第二次校正的突起形狀引導部112形成於更遠離開口部111的位置處。用於這種第一次校正的突起形狀的測試器引導件可以相比用於第 二次校正的突起形狀的引導部113更長更粗。由於這種用於第一次校正的突起及用於第二次校正的突起的形狀不同,因此在進行第二次校正時可以實現更精確的位置校正。 In addition, a protrusion-shaped guide portion 113 may be formed on the docking base 110, and a groove-shaped tester guide may be formed on the tester 2. Therefore, during hard docking, the protrusion-shaped tester guide of the tester 2 is first inserted into the groove-shaped guide portion 112 of the docking base 110 for the first calibration, and then the protrusion-shaped guide portion 113 of the docking base 110 is inserted into the groove-shaped tester guide for the second calibration. As described above, more than one calibration is performed during hard docking, so that the position of the tester 2 relative to the docking base 110 can be accurately adjusted. Such a protrusion-shaped guide portion 113 and a groove-shaped tester guide may be formed in plural. In addition, the groove-shaped guide portion 112 used for the first correction can be formed at a position farther away from the mouth portion 111 than the protrusion-shaped guide portion 112 used for the second correction. The tester guide member of the protrusion shape used for this first correction can be longer and thicker than the guide portion 113 of the protrusion shape used for the second correction. Since the shapes of the protrusion used for the first correction and the protrusion used for the second correction are different, more accurate position correction can be achieved when performing the second correction.
另一方面,也可以通過突起形狀的引導部113進行第一次校正,通過槽狀的引導部112進行第二次校正。在這種情況下,突起形狀的引導部113可以相比槽狀的引導部112形成於更遠離開口部111的位置處。另外,用於第一次校正的突起形狀的引導部113可以相比用於第二次校正的突起形狀的測試器引導件更短更細。 On the other hand, the first correction may be performed by the protrusion-shaped guide portion 113, and the second correction may be performed by the groove-shaped guide portion 112. In this case, the protrusion-shaped guide portion 113 may be formed at a position farther from the mouth portion 111 than the groove-shaped guide portion 112. In addition, the protrusion-shaped guide portion 113 used for the first correction may be shorter and thinner than the protrusion-shaped tester guide used for the second correction.
在上述硬對接方式中說明了,在測試器2朝向對接基座110的底面上升期間,突起形狀的測試器引導件將插入於對接基座110的槽狀的引導部112中,突起形狀的引導部113將插入於槽狀的測試器引導件中,從而使對接基座110與測試器2相結合。然而,這僅是示例,在對接基座110中也可以形成槽狀的引導部112及突起形狀的引導部113中的任一個。因此,在進行硬對接期間,對接基座110的突起形狀的引導部113將插入至槽狀的測試器引導件中,從而使對接基座110與測試器2相結合,或突起形狀測試器引導件將插入至對接基座110的槽狀的引導部112中,從而可以使對接基座110與測試器2相結合。 In the above-mentioned hard docking method, it is explained that during the rise of the tester 2 toward the bottom surface of the docking base 110, the protrusion-shaped tester guide is inserted into the groove-shaped guide portion 112 of the docking base 110, and the protrusion-shaped guide portion 113 is inserted into the groove-shaped tester guide, thereby combining the docking base 110 with the tester 2. However, this is only an example, and either the groove-shaped guide portion 112 or the protrusion-shaped guide portion 113 may be formed in the docking base 110. Therefore, during the hard docking, the protrusion-shaped guide portion 113 of the docking base 110 will be inserted into the groove-shaped tester guide, so that the docking base 110 and the tester 2 are combined, or the protrusion-shaped tester guide will be inserted into the groove-shaped guide portion 112 of the docking base 110, so that the docking base 110 and the tester 2 can be combined.
鎖定裝置120可以支撐後述對接組件200的輔助對接單元230,可以將插座基座2a固定到對接基座110上。換句話說,鎖定裝置120可以通過支撐與插座基座2a相連的輔助對接單元230來固定插座基座2a相對於對接基座110的相對位置。所述鎖定裝置120可以包括夾緊件121及驅動部122。 The locking device 120 can support the auxiliary docking unit 230 of the docking assembly 200 described later, and can fix the socket base 2a to the docking base 110. In other words, the locking device 120 can fix the relative position of the socket base 2a relative to the docking base 110 by supporting the auxiliary docking unit 230 connected to the socket base 2a. The locking device 120 can include a clamping member 121 and a driving part 122.
參照圖5,為了選擇性地支撐輔助對接單元230,可以驅動夾緊件121朝向輔助對接單元230進退。這種夾緊件121可以通過支撐輔助對接單元230的輥部232來固定輔助對接單元230。另外,夾緊件121可以朝向輥部232進退,並且可以通過驅動部122來驅動。可以提供多個所述夾緊件121,並且多個夾緊 件121可以在不同位置支撐輔助對接單元230。在本說明書中,如圖5所示,被表示為夾緊件121朝向輥部232移動,並且在輥部232的一側支撐輥部232,但這僅是示例,也可以在輥部的兩側把持輥部232。在這種鎖定裝置120中,輔助對接單元230與插座基座2a成為一體,從而可以不直接支撐插座基座2a,而是支撐輔助對接單元230以固定插座基座2a的位置。 5 , in order to selectively support the auxiliary docking unit 230, the clamping member 121 may be driven to advance and retreat toward the auxiliary docking unit 230. Such a clamping member 121 may fix the auxiliary docking unit 230 by supporting the roller 232 of the auxiliary docking unit 230. In addition, the clamping member 121 may advance and retreat toward the roller 232 and may be driven by the driving portion 122. A plurality of the clamping members 121 may be provided, and the plurality of clamping members 121 may support the auxiliary docking unit 230 at different positions. In this specification, as shown in FIG. 5, the clamping member 121 is shown to move toward the roller 232 and support the roller 232 on one side of the roller 232, but this is only an example, and the roller 232 may be held on both sides of the roller. In this locking device 120, the auxiliary docking unit 230 is integrated with the socket base 2a, so that the socket base 2a is not directly supported, but the auxiliary docking unit 230 is supported to fix the position of the socket base 2a.
驅動部122可以使夾緊件121朝向輥部232進退。例如,驅動部122可以由液壓缸構成,並且可以通過液壓缸的液壓來驅動夾緊件121。另外,可以提供多個驅動部122,並且可以驅動多個夾緊件121。 The driving part 122 can make the clamping member 121 move forward and backward toward the roller 232. For example, the driving part 122 can be composed of a hydraulic cylinder, and the clamping member 121 can be driven by the hydraulic pressure of the hydraulic cylinder. In addition, a plurality of driving parts 122 can be provided, and a plurality of clamping members 121 can be driven.
操作部130可以控制多個驅動部122的操作。換句話說,操作部130可以通過多個驅動部122來操作夾緊件121或停止操作。這種操作部130可以設置在對接基座110的一側。 The operating part 130 can control the operation of the multiple driving parts 122. In other words, the operating part 130 can operate the clamping member 121 or stop the operation through the multiple driving parts 122. Such an operating part 130 can be arranged on one side of the docking base 110.
在下文中,將說明自動對接方式。自動對接為當測試器2通過操縱器上升時,鎖定裝置120支撐並固定輔助對接單元230以固定插座基座2a的方式。換句話說,在自動對接方式中,當測試器2接近對接板100預定距離以下時,對接板100將支撐對接組件200,從而可以相對於對接板100固定插座基座2a。這樣,對接組件200不僅可以用於固定插座基座2a,而且可以用於決定位置。另外,如果需要更高的精度,則類似於硬對接方式,插座基座2a的位置可以通過至少一個以上銷(例如主整列銷214)來引導。 In the following, the automatic docking method will be described. Automatic docking is a method in which the locking device 120 supports and fixes the auxiliary docking unit 230 to fix the socket base 2a when the tester 2 is raised by the manipulator. In other words, in the automatic docking method, when the tester 2 approaches the docking plate 100 below a predetermined distance, the docking plate 100 will support the docking assembly 200, so that the socket base 2a can be fixed relative to the docking plate 100. In this way, the docking assembly 200 can be used not only to fix the socket base 2a, but also to determine the position. In addition, if higher precision is required, similar to the hard docking method, the position of the socket base 2a can be guided by at least one or more pins (such as the main alignment pin 214).
這種自動對接可以通過操作部130來控制。當測試器2朝向對接基座110的底部上升並且接近對接基座110預定距離以下時,操作部130能夠以預定角度旋轉。當操作部130以預定角度旋轉時,多個驅動部122可以驅動多個夾緊件121以使多個夾緊件121朝向輔助對接單元230移動。當完成自動對接時,多個夾緊件121可以在不同位置支撐輔助對接單元230,與輔助對接單元230相連的插座基座2a可以固定在開口部111的下側。 This automatic docking can be controlled by the operating part 130. When the tester 2 rises toward the bottom of the docking base 110 and approaches the docking base 110 below a predetermined distance, the operating part 130 can rotate at a predetermined angle. When the operating part 130 rotates at a predetermined angle, the multiple driving parts 122 can drive the multiple clamping members 121 to move the multiple clamping members 121 toward the auxiliary docking unit 230. When the automatic docking is completed, the multiple clamping members 121 can support the auxiliary docking unit 230 at different positions, and the socket base 2a connected to the auxiliary docking unit 230 can be fixed on the lower side of the opening 111.
為了解除自動對接,當操作部以驅動部122驅動之前的角度旋轉時,可以停止多個驅動部122的操作。另外,多個夾緊件121的驅動將停止,並且多個夾緊件121將朝向多個驅動部122移動,從而可以解除輔助對接單元230的支撐。當解除輔助對接單元230的支撐時,可以解除插座基座2a的固定。 In order to release the automatic docking, when the operating part is rotated at the angle before the driving part 122 is driven, the operation of the multiple driving parts 122 can be stopped. In addition, the driving of the multiple clamping members 121 will stop, and the multiple clamping members 121 will move toward the multiple driving parts 122, so that the support of the auxiliary docking unit 230 can be released. When the support of the auxiliary docking unit 230 is released, the fixation of the socket base 2a can be released.
另一方面,在本說明書中,描述了在進行硬對接之後進行了自動對接,但能夠以與硬對接分開的對接方式獨立地執行自動對接。因此,可以僅進行硬對接,且即使不進行硬對接,也可以通過自動對接來固定插座基座2a。 On the other hand, in this specification, it is described that automatic docking is performed after hard docking, but automatic docking can be performed independently in a docking manner separate from hard docking. Therefore, only hard docking can be performed, and even if hard docking is not performed, the socket base 2a can be fixed by automatic docking.
參照圖4及圖6,當通過硬對接或自動對接使插座基座2a上升並設置在開口部111的下側時,對接組件200可以整列並固定插座基座2a的位置。另外,對接組件200可以調節插座基座2a的一部分或外圍部分的溫度,還可以調節支撐在插座基座2a上的設備的溫度。對接組件200可以通過降低插座底座2a周圍的濕度來防止結露現象。這種對接組件200可以通過在執行測試之前向設備供應溫度調節用流體來對設備進行預冷或預熱,並且可以在進行測試期間,甚至在完成測試之後調節設備的溫度。另一方面,對接組件200可以將溫度調節用流體供應到插座基座2a中,以便從執行硬對接或自動對接之前就開始調節設備的溫度。這種對接組件200可以包括主對接單元210,溫度調節單元220,輔助對接單元230及清洗套件240。 Referring to Fig. 4 and Fig. 6, when the socket base 2a is raised and arranged on the lower side of the opening 111 by hard docking or automatic docking, the docking assembly 200 can align and fix the position of the socket base 2a. In addition, the docking assembly 200 can adjust the temperature of a part or the outer peripheral part of the socket base 2a, and can also adjust the temperature of the equipment supported on the socket base 2a. The docking assembly 200 can prevent condensation by reducing the humidity around the socket base 2a. This docking assembly 200 can pre-cool or pre-heat the equipment by supplying a temperature regulating fluid to the equipment before performing a test, and can adjust the temperature of the equipment during the test or even after the test is completed. On the other hand, the docking assembly 200 can supply a temperature regulating fluid into the socket base 2a so as to regulate the temperature of the device before performing hard docking or automatic docking. Such a docking assembly 200 may include a main docking unit 210, a temperature regulating unit 220, an auxiliary docking unit 230 and a cleaning kit 240.
當插座基座2a上升並位於開口部111下側時,主對接單元210可以將插座基座2a整列到預定位置。另外,主對接單元210可以加熱插座基座2a。這種主對接單元210可以包括輔助溫度調節單元211,雙金屬212,遮蔽體213及主整列銷214。 When the socket base 2a rises and is located at the lower side of the opening 111, the main docking unit 210 can align the socket base 2a to a predetermined position. In addition, the main docking unit 210 can heat the socket base 2a. Such a main docking unit 210 may include an auxiliary temperature adjustment unit 211, a bimetal 212, a shielding body 213 and a main alignment pin 214.
參照圖7,加熱裝置211可以通過加熱插座基座2a來改變插座基座2a的溫度。當需要迅速改變通過溫度調節單元220調節到預定溫度範圍的插座基座2a的溫度時,這種加熱裝置211將加熱插座基座2a,從而可以調節插座基座2a 的溫度。例如,加熱裝置211可以是加熱器,加熱器可以加熱插座基座2a。可以提供多個這種加熱裝置211。 Referring to FIG. 7 , the heating device 211 can change the temperature of the socket base 2a by heating the socket base 2a. When the temperature of the socket base 2a adjusted to a predetermined temperature range by the temperature adjustment unit 220 needs to be quickly changed, the heating device 211 will heat the socket base 2a, thereby adjusting the temperature of the socket base 2a. For example, the heating device 211 can be a heater, and the heater can heat the socket base 2a. A plurality of such heating devices 211 can be provided.
雙金屬212可以防止插座基座2a過熱。當插座基座2a過熱時,這種雙金屬212可以自動切斷加熱裝置211的電源,從而停止加熱裝置211的操作。 The bimetal 212 can prevent the socket base 2a from overheating. When the socket base 2a overheats, the bimetal 212 can automatically cut off the power supply of the heating device 211, thereby stopping the operation of the heating device 211.
遮蔽體213可以防止從加熱裝置211產生的熱擴散到外部。這種遮蔽體213可以是絕熱材料。 The shielding body 213 can prevent the heat generated by the heating device 211 from diffusing to the outside. The shielding body 213 can be a heat-insulating material.
參照圖4及圖6,主整列銷214可以整列插座基座2a的位置。可以將這種主整列銷214插入於後述的輔助對接單元230的輔助整列銷234的內側。例如,將主整列銷214插入到輔助整列銷234中,所述輔助整列銷234插入於固定在插座基座2a上的整列部件270中,從而可以整列並固定插座基座2a的位置。這樣,主整列銷214可以整列並固定相對於主對接單元210的插座基座2a的位置。 Referring to FIG. 4 and FIG. 6 , the main alignment pin 214 can align the position of the socket base 2a. Such a main alignment pin 214 can be inserted into the inner side of the auxiliary alignment pin 234 of the auxiliary docking unit 230 described later. For example, the main alignment pin 214 is inserted into the auxiliary alignment pin 234, and the auxiliary alignment pin 234 is inserted into the alignment component 270 fixed on the socket base 2a, so that the position of the socket base 2a can be aligned and fixed. In this way, the main alignment pin 214 can align and fix the position of the socket base 2a relative to the main docking unit 210.
溫度調節單元220可以將用於加熱設備或冷卻設備的溫度調節用流體供應到插座基座2a中。換句話說,可以為了加熱設備而將高溫流體供應到插座基座2a中,並且可以為了冷卻設備而將低溫流體供應到插座基座2a中。這種溫度調節單元220可以將預先調節過溫度的流體(即,調節到預定溫度的高溫或低溫流體)供應給設備。另外,溫度調節單元220可以通過將所述溫度調節用流體供應給插座基座2a來調節插座基座2a周圍的溫度,並且可以調節安置在插座基座2a上的設備的溫度。 The temperature adjustment unit 220 can supply a temperature adjustment fluid for heating or cooling the device to the socket base 2a. In other words, a high-temperature fluid can be supplied to the socket base 2a for heating the device, and a low-temperature fluid can be supplied to the socket base 2a for cooling the device. Such a temperature adjustment unit 220 can supply a fluid that has been pre-temperature-adjusted (i.e., a high-temperature or low-temperature fluid adjusted to a predetermined temperature) to the device. In addition, the temperature adjustment unit 220 can adjust the temperature around the socket base 2a by supplying the temperature adjustment fluid to the socket base 2a, and can adjust the temperature of the device placed on the socket base 2a.
溫度調節單元220可以選擇性地與接觸部250相連以供應溫度調節用流體。例如,當對接基座110與測試器2相結合時,溫度調節單元220將與接觸部250相連,可以將用於加熱設備或冷卻設備的溫度調節用流體供應至插座基座2a的設備中。另外,當對接基座110與測試器2分離時,溫度調節單元220可以與接觸部250分離。這種溫度調節單元220可以同時或獨立地將流體供應至多個接觸部250中。另外,可以實時地控制溫度調節單元220的溫度調節。例如,溫度 調節單元220可以是自動溫度控制器(Automatic Temperature Control,ATC)。這種溫度調節單元220可以被支撐在主對接單元210上。溫度調節單元220可以包括主體部221、流體流入口222、阻擋件223。 The temperature regulating unit 220 can be selectively connected to the contact portion 250 to supply a temperature regulating fluid. For example, when the docking base 110 is combined with the tester 2, the temperature regulating unit 220 will be connected to the contact portion 250, and the temperature regulating fluid for heating or cooling the device can be supplied to the device of the socket base 2a. In addition, when the docking base 110 is separated from the tester 2, the temperature regulating unit 220 can be separated from the contact portion 250. Such a temperature regulating unit 220 can supply fluid to multiple contacts 250 simultaneously or independently. In addition, the temperature regulation of the temperature regulating unit 220 can be controlled in real time. For example, the temperature regulating unit 220 can be an automatic temperature controller (Automatic Temperature Control, ATC). This temperature adjustment unit 220 can be supported on the main docking unit 210. The temperature adjustment unit 220 can include a main body 221, a fluid inlet 222, and a blocking member 223.
主體部221可以支撐流體流入口222及阻擋件223。另外,主體部221可以由主對接單元210支撐。參照圖8,可以在這種主體部221的內部形成移送流路221a,從流體流入口222供應的溫度調節用流體可以在所述移送流路221a中流動。移送流路221a可以提供流路,所述流路用於使從流體流入口222供應的溫度調節用流體流動到連通部件(未圖示)。這種移送流路221a的一部分可以與流體流入口222連通,移送流路221a的另一部分可以通過連通部件與後述的接觸部250連通。另外,當對接基座110與測試器2分離時,移送流路221a可以與接觸部250分離,當對接基座110與測試器2結合時,可以與接觸部250連通。 The main body 221 can support the fluid inlet 222 and the blocking member 223. In addition, the main body 221 can be supported by the main docking unit 210. Referring to FIG8 , a transfer flow path 221a can be formed inside the main body 221, and the temperature regulating fluid supplied from the fluid inlet 222 can flow in the transfer flow path 221a. The transfer flow path 221a can provide a flow path for the temperature regulating fluid supplied from the fluid inlet 222 to flow to a connecting member (not shown). A portion of the transfer flow path 221a can be connected to the fluid inlet 222, and another portion of the transfer flow path 221a can be connected to the contact portion 250 described later through the connecting member. In addition, when the docking base 110 is separated from the tester 2, the transfer flow path 221a can be separated from the contact portion 250, and when the docking base 110 is combined with the tester 2, it can be connected to the contact portion 250.
流體入口222可以被供應溫度調節用流體,所述溫度調節用流體用於從外部加熱設備或冷卻設備。這種流體流入口222可以與主體部221的一側端部相連。另外,可以提供多個流體流入口222,多個流體流入口222可以與移送流路221a相連。 The fluid inlet 222 can be supplied with a temperature regulating fluid, which is used to heat or cool the device from the outside. This fluid inlet 222 can be connected to one side end of the main body 221. In addition, multiple fluid inlets 222 can be provided, and the multiple fluid inlets 222 can be connected to the transfer flow path 221a.
阻擋件223可以防止與測試器2相連的插座基座2a上升預定範圍以上。換句話說,當插座基座2a上升時,阻擋件223接觸與插座基座2a相連的輔助對接單元230,從而可以防止插座基座2a及輔助對接單元230上升預定範圍以上。另外,當插座基座2a及輔助對接單元230上升時,阻擋件223可以插入于形成在輔助對接單元230中的槽(未圖示)中,並且可以在所述槽中與輔助對接單元230接觸。這種阻擋件223可以與主體部221相連,並可以從主體部221凸出形成。另外,可以提供多個阻擋件223,並且可以通過插入於輔助對接單元230的多個槽中,以防止插座基座2a及輔助對接單元230上升預定範圍以上。 The blocking member 223 can prevent the socket base 2a connected to the tester 2 from rising above a predetermined range. In other words, when the socket base 2a rises, the blocking member 223 contacts the auxiliary docking unit 230 connected to the socket base 2a, thereby preventing the socket base 2a and the auxiliary docking unit 230 from rising above a predetermined range. In addition, when the socket base 2a and the auxiliary docking unit 230 rise, the blocking member 223 can be inserted into a groove (not shown) formed in the auxiliary docking unit 230, and can contact the auxiliary docking unit 230 in the groove. Such a blocking member 223 can be connected to the main body 221 and can be formed to protrude from the main body 221. In addition, a plurality of blocking members 223 may be provided and inserted into a plurality of slots of the auxiliary docking unit 230 to prevent the socket base 2a and the auxiliary docking unit 230 from rising above a predetermined range.
輔助對接單元230通過連接至與插座基座2a相連的清洗套件240, 可以支撐插座基座2a及清洗套件240。另外,當測試器2與對接基座110相結合時,輔助對接單元230可以提供由鎖定裝置120支撐的部分。這種輔助對接單元230由鎖定裝置120支撐,從而使插座基座2a可以位於開口部111的下側。這種輔助對接單元230可以包括輔助對接主體231、輥部232、凸出部233及輔助整列銷234。 The auxiliary docking unit 230 can support the socket base 2a and the cleaning kit 240 by connecting to the cleaning kit 240 connected to the socket base 2a. In addition, when the tester 2 is combined with the docking base 110, the auxiliary docking unit 230 can provide a portion supported by the locking device 120. The auxiliary docking unit 230 is supported by the locking device 120, so that the socket base 2a can be located at the lower side of the opening 111. The auxiliary docking unit 230 can include an auxiliary docking body 231, a roller 232, a protrusion 233 and an auxiliary alignment pin 234.
參照圖6,輔助對接主體231可以支撐輥部232、凸出部233及輔助整列銷234。這種輔助對接主體231可以與清洗套件240相連。另外,在輔助對接主體231中可以形成有槽,所述槽可以與溫度調節單元220的阻擋件223相接觸。例如,當輔助對接主體231與插座基座2a一起朝向對接基座110上升時,阻擋件223將插入于形成在輔助對接主體231中的槽中,從而使輔助對接主體231與阻擋件223相接觸。 6, the auxiliary docking body 231 can support the roller 232, the protrusion 233 and the auxiliary alignment pin 234. Such an auxiliary docking body 231 can be connected to the cleaning kit 240. In addition, a groove can be formed in the auxiliary docking body 231, and the groove can contact the blocking member 223 of the temperature adjustment unit 220. For example, when the auxiliary docking body 231 rises toward the docking base 110 together with the socket base 2a, the blocking member 223 will be inserted into the groove formed in the auxiliary docking body 231, so that the auxiliary docking body 231 contacts the blocking member 223.
當執行自動對接時,輥部232可以是由鎖定裝置120的夾緊件121支撐的部分。這種輥部232可以相對於輔助對接單元230旋轉,以防止被夾緊件121損壞。這樣,輥部232對應於夾緊件121的移動而進行旋轉,從而可以防止輔助對接單元230被進退的夾緊件121的加壓力損壞。 When automatic docking is performed, the roller 232 may be a portion supported by the clamping member 121 of the locking device 120. Such a roller 232 may rotate relative to the auxiliary docking unit 230 to prevent the clamping member 121 from being damaged. In this way, the roller 232 rotates corresponding to the movement of the clamping member 121, thereby preventing the auxiliary docking unit 230 from being damaged by the pressure of the advancing and retreating clamping member 121.
凸出部233可以支撐後述的輔助整列銷234。例如,可以在凸出部233中形成可插入輔助整列銷234的孔(未圖示),並且通過將輔助整列銷234插入于所述孔中,凸出部233可以支撐輔助整列銷234。這種凸出部233可以從輔助對接主體231的外周面凸出形成。 The protrusion 233 can support the auxiliary alignment pin 234 described later. For example, a hole (not shown) into which the auxiliary alignment pin 234 can be inserted can be formed in the protrusion 233, and the protrusion 233 can support the auxiliary alignment pin 234 by inserting the auxiliary alignment pin 234 into the hole. Such a protrusion 233 can be formed by protruding from the outer peripheral surface of the auxiliary docking body 231.
輔助整列銷234可以整列插座基座2a的位置。這種輔助整列銷234插入于孔中,所述孔形成在固定於插座基座2a上的整列部件270中,從而整列並固定插座基座2a的位置。另外,主整列銷214可以插入於輔助整列銷234的內側,並且可以支撐主整列銷214。這種輔助整列銷234可以插入於後述的套件整列孔242中,並通過插入於套件整列孔242及整列部件270中,從而整列並固定插座基 座2a的位置。 The auxiliary alignment pin 234 can align the position of the socket base 2a. This auxiliary alignment pin 234 is inserted into a hole formed in an alignment component 270 fixed to the socket base 2a, thereby aligning and fixing the position of the socket base 2a. In addition, the main alignment pin 214 can be inserted into the inner side of the auxiliary alignment pin 234 and can support the main alignment pin 214. This auxiliary alignment pin 234 can be inserted into the kit alignment hole 242 described later, and by being inserted into the kit alignment hole 242 and the alignment component 270, the position of the socket base 2a is aligned and fixed.
清洗套件240可以通過向插座基座2a供應濕度調節用流體來防止在插座基座2a周圍發生結露。換句話說,當溫度調節單元220向設備供應低溫的溫度調節用流體以冷卻設備時,清洗套件240可以通過向插座基座2a供應低濕度的空氣來防止產生結露。例如,濕度調節用流體可以使用乾燥空氣或清洗氣體等。此外,清洗套件240可以在加熱設備時(例如,在高溫測試時)切斷電源,在冷卻設備時(例如,在低溫測試時)啟動。 The cleaning kit 240 can prevent condensation around the socket base 2a by supplying a humidity regulating fluid to the socket base 2a. In other words, when the temperature regulating unit 220 supplies a low-temperature temperature regulating fluid to the device to cool the device, the cleaning kit 240 can prevent condensation by supplying low-humidity air to the socket base 2a. For example, the humidity regulating fluid can use dry air or cleaning gas. In addition, the cleaning kit 240 can cut off the power when heating the device (for example, during a high-temperature test) and start when cooling the device (for example, during a low-temperature test).
在這種清洗套件240中可以形成清洗流入口241,所述清洗流入口241可以從外部裝置(未圖示)接收流體。另外,清洗套件240可以與插座基座2a一起形成清洗流路。換句話說,清洗流路可以被清洗套件240和插座基座2a包圍形成。參照圖9,當濕度調節用流體從外部供應到清洗流入口241時,流體可以從形成在清洗套件240內部的清洗流路沿預定方向(例如,圖9中的箭頭方向)排出至外部。這種清洗流入口241可以形成為多個。以這種方式,濕度調節用流體循環清洗套件240的內部並排出,從而可以防止在插座基座2a中可能發生的結露現象。 A cleaning inlet 241 may be formed in such a cleaning kit 240, and the cleaning inlet 241 may receive a fluid from an external device (not shown). In addition, the cleaning kit 240 may form a cleaning flow path together with the socket base 2a. In other words, the cleaning flow path may be formed surrounded by the cleaning kit 240 and the socket base 2a. Referring to FIG. 9, when the humidity adjustment fluid is supplied from the outside to the cleaning inlet 241, the fluid may be discharged to the outside from the cleaning flow path formed inside the cleaning kit 240 in a predetermined direction (e.g., the direction of the arrow in FIG. 9). Such a cleaning inlet 241 may be formed in multiple numbers. In this way, the humidity adjustment fluid circulates inside the cleaning kit 240 and is discharged, thereby preventing condensation that may occur in the socket base 2a.
另外,可以在清洗套件240中形成可插入輔助整列銷234的套件整列孔242。 In addition, a kit alignment hole 242 into which the auxiliary alignment pin 234 can be inserted can be formed in the cleaning kit 240.
接觸部250可以從溫度調節單元220接收用於加熱設備或冷卻設備的溫度調節用流體,並將其供應到歧管260中。這種接觸部250的一側可以通過連通部件選擇性地與溫度調節單元220的移送流路221a連通,接觸部250的另一側可以與歧管260連通。因此,當測試器2與對接基座110分離時,接觸部250可以與溫度調節單元220分離。可以提供多個這種接觸部250。 The contact part 250 can receive the temperature regulating fluid for heating or cooling the device from the temperature regulating unit 220 and supply it to the manifold 260. One side of such a contact part 250 can be selectively connected to the transfer flow path 221a of the temperature regulating unit 220 through a connecting component, and the other side of the contact part 250 can be connected to the manifold 260. Therefore, when the tester 2 is separated from the docking base 110, the contact part 250 can be separated from the temperature regulating unit 220. A plurality of such contact parts 250 can be provided.
歧管260可以從接觸部250接收用於加熱設備或冷卻設備的溫度調節用流體,並且可以在插座基座2a周圍供應接收的流體。另外,歧管260可以將 從接觸部250接收的流體直接供應給設備。 The manifold 260 can receive a temperature regulating fluid for heating or cooling the device from the contact portion 250, and can supply the received fluid around the socket base 2a. In addition, the manifold 260 can directly supply the fluid received from the contact portion 250 to the device.
整列部件270可以提供插入有輔助整列銷234的部分。這種整列部件270可以固定支撐在插座基座2a的一側上。因此,通過將輔助整列銷234插入於整列部件270中,可以整列及固定插座基座2a及整列部件270相對於對接基座110的位置。 The alignment component 270 may provide a portion into which the auxiliary alignment pin 234 is inserted. Such an alignment component 270 may be fixedly supported on one side of the socket base 2a. Therefore, by inserting the auxiliary alignment pin 234 into the alignment component 270, the position of the socket base 2a and the alignment component 270 relative to the docking base 110 may be aligned and fixed.
在下文中,將說明具有上述結構的處理器1的作用及效果。 In the following, the function and effect of the processor 1 having the above structure will be described.
使用人員可以使用硬對接方式將對接板100與測試器2結合。在進行硬對接期間,測試器2可以朝向對接板100上升。這樣,在測試器2朝向對接基座110的底面上升期間,突起形狀的測試器引導件將首先插入於對接基座110的槽狀的引導部112中以進行第一次校正,對接基座110的突起形狀的引導部113可以在之後插入到槽狀的測試器引導件中以進行第二次校正。當完成硬對接時,可以將測試器2的插座基座2a設置在形成於對接基座110中的開口部111下側,並且可以固定插座基座2a的位置。 The user can combine the docking plate 100 with the tester 2 using a hard docking method. During the hard docking, the tester 2 can rise toward the docking plate 100. In this way, during the tester 2 rising toward the bottom surface of the docking base 110, the protrusion-shaped tester guide will first be inserted into the groove-shaped guide portion 112 of the docking base 110 for the first correction, and the protrusion-shaped guide portion 113 of the docking base 110 can be inserted into the groove-shaped tester guide for the second correction. When the hard docking is completed, the socket base 2a of the tester 2 can be set at the lower side of the opening portion 111 formed in the docking base 110, and the position of the socket base 2a can be fixed.
另一方面,使用人員可以使用自動對接方式將對接板100與測試器2結合。在進行自動對接期間,可以朝向對接板100上升。當測試器2位於對接基座110的底面時,使用人員可以旋轉操作部130以驅動多個鎖定裝置120。當操作部130旋轉時,多個驅動部122可以使不同位置處的多個夾緊件121朝向輔助對接單元230的輥部232前進。多個夾緊件121可以通過支撐輔助對接單元230來固定與輔助對接單元230相連的插座基座2a的位置。 On the other hand, the user can use the automatic docking method to combine the docking plate 100 with the tester 2. During the automatic docking, it can rise toward the docking plate 100. When the tester 2 is located on the bottom surface of the docking base 110, the user can rotate the operating part 130 to drive the multiple locking devices 120. When the operating part 130 rotates, the multiple driving parts 122 can make the multiple clamping members 121 at different positions move toward the roller 232 of the auxiliary docking unit 230. The multiple clamping members 121 can fix the position of the socket base 2a connected to the auxiliary docking unit 230 by supporting the auxiliary docking unit 230.
通過硬對接方式及自動對接方法中的至少一種方式將插座基座2a的位置設置在對接板100的開口部111的下側期間,主整列銷214可以插入於輔助整列銷中,輔助整列銷234可以插入於套件整列孔242及整列部件270中。以此方式,將主整列銷214插入於整列部件270及輔助整列銷234中,所述整列部件270固定於插座基座2a中,所述輔助整列銷234插入於套件整列孔242中,從而主整 列銷214可以整列及固定插座基座2a的位置。當通過主整列銷214整列及固定插座基座2a的位置時,測試器2可以與插座基座2a電連接以執行設備測試。 During the period when the position of the socket base 2a is set at the lower side of the opening portion 111 of the docking plate 100 by at least one of the hard docking method and the automatic docking method, the main alignment pin 214 can be inserted into the auxiliary alignment pin, and the auxiliary alignment pin 234 can be inserted into the kit alignment hole 242 and the alignment component 270. In this way, the main alignment pin 214 is inserted into the alignment component 270 and the auxiliary alignment pin 234, the alignment component 270 is fixed in the socket base 2a, and the auxiliary alignment pin 234 is inserted into the kit alignment hole 242, so that the main alignment pin 214 can align and fix the position of the socket base 2a. When the position of the socket base 2a is aligned and fixed by the main alignment pin 214, the tester 2 can be electrically connected to the socket base 2a to perform equipment testing.
另一方面,在進行測試期間,溫度調節單元220可以調節插座基座2a的設備溫度。這種溫度調節單元220可以從流體流入口222接收用於加熱設備或冷卻設備的溫度調節用流體,將其供應給接觸部250。可以通過歧管260將流動到接觸部250的流體供應給設備。這種溫度調節單元220的設備溫度調節可以被實時控制。另外,當通過溫度調節單元220冷卻設備時,清洗套件240將乾燥空氣供應給插座基座2a,從而可以防止可能在插座基座2a周圍發生的結露現象。這種清洗套件240的操作可以與設備的溫度調節同時進行。 On the other hand, during the test, the temperature regulating unit 220 can regulate the device temperature of the socket base 2a. This temperature regulating unit 220 can receive the temperature regulating fluid for heating or cooling the device from the fluid inlet 222 and supply it to the contact part 250. The fluid flowing to the contact part 250 can be supplied to the device through the manifold 260. The device temperature regulation of this temperature regulating unit 220 can be controlled in real time. In addition, when the device is cooled by the temperature regulating unit 220, the cleaning kit 240 supplies dry air to the socket base 2a, thereby preventing condensation that may occur around the socket base 2a. The operation of this cleaning kit 240 can be performed simultaneously with the temperature regulation of the device.
當完成測試時,可以通過元件供應單元60將插座基座2a的設備移送到第一交換區域42或第二交換區域52。 When the test is completed, the device of the socket base 2a can be moved to the first exchange area 42 or the second exchange area 52 through the component supply unit 60.
本發明一實施例的處理器1具有可以容易地與測試器2結合及分離的效果。另外,在進行測試期間,具有可以調節設備溫度的效果。另外,當輔助對接單元230損壞時,將輔助對接單元230與插座基座2a分離,並且僅替換輔助對接單元230,從而具有不用替換插座基座2a的效果。 The processor 1 of an embodiment of the present invention has the effect of being able to be easily combined with and separated from the tester 2. In addition, during the test, it has the effect of being able to adjust the temperature of the device. In addition, when the auxiliary docking unit 230 is damaged, the auxiliary docking unit 230 is separated from the socket base 2a, and only the auxiliary docking unit 230 is replaced, thereby having the effect of not having to replace the socket base 2a.
另一方面,除了這種結構之外,根據本發明的第二實施例,在對接組件200中可以省略主對接單元210、溫度調節單元220、輔助對接單元230及清洗套件240。在下文中,將進一步參照圖10說明本發明的第二實施例。在說明第二實施例時,主要描述與上述實施例相比時的差異,相同的說明及附圖標記引用上述實施例。 On the other hand, in addition to this structure, according to the second embodiment of the present invention, the main docking unit 210, the temperature adjustment unit 220, the auxiliary docking unit 230 and the cleaning kit 240 can be omitted in the docking assembly 200. Hereinafter, the second embodiment of the present invention will be further described with reference to FIG. 10. When describing the second embodiment, the difference compared with the above embodiment is mainly described, and the same description and figure markings are quoted from the above embodiment.
可以在對接基座110中形成孔(未圖示),所述孔可以與插座基座2a的結合突起2b相結合。對接基座110可以與結合突起2b相結合,所述結合突起2b在所述孔中貫通後述結合孔201,從而可以固定相對於對接基座110的位置。 A hole (not shown) may be formed in the docking base 110, and the hole may be coupled with the coupling protrusion 2b of the socket base 2a. The docking base 110 may be coupled with the coupling protrusion 2b, and the coupling protrusion 2b passes through the coupling hole 201 described later in the hole, so that the position relative to the docking base 110 may be fixed.
對接組件200可以與插座基座2a相結合,並且可以被支撐在對接基 座110上。這種對接組件200中可以形成結合孔201,所述結合孔201中可以插入有插座基座2a的結合突起2b。這種結合孔201及結合突起2b可以形成為多個。因此,通過將插座基座2a的多個結合突起2b插入於對接組件200的多個結合孔201中,可以固定插座基座2a相對於對接組件200的位置。另外,當將結合突起2b插入于結合孔201中時,對接組件200與插座基座2a可以通過螺栓緊固連接。 The docking assembly 200 can be combined with the socket base 2a and can be supported on the docking base 110. A combination hole 201 can be formed in the docking assembly 200, and a combination protrusion 2b of the socket base 2a can be inserted into the combination hole 201. The combination hole 201 and the combination protrusion 2b can be formed in multiple numbers. Therefore, by inserting the multiple combination protrusions 2b of the socket base 2a into the multiple combination holes 201 of the docking assembly 200, the position of the socket base 2a relative to the docking assembly 200 can be fixed. In addition, when the combination protrusion 2b is inserted into the combination hole 201, the docking assembly 200 and the socket base 2a can be fastened by bolts.
可以在對接組件200中設置結合輥202。這種結合輥202可以旋轉以防止被鎖定裝置120損壞。另外,結合輥202可以被鎖定裝置120支撐。 A coupling roller 202 may be provided in the docking assembly 200. Such a coupling roller 202 may be rotated to prevent damage by the locking device 120. In addition, the coupling roller 202 may be supported by the locking device 120.
在下文中,將說明本發明第二實施例的處理器1的作用及效果。 In the following, the function and effect of the processor 1 of the second embodiment of the present invention will be described.
使用人員可以在結合測試器2與對接板100之前結合插座基座2a與對接組件200。使用人員可以通過將插座基座2a的多個結合突起2b插入到對接組件200的多個結合孔201中來將插座基座2a固定到對接組件200上。另外,對接組件200與插座基座2a的其他部分可以通過螺栓緊固連接。 The user can combine the socket base 2a and the docking assembly 200 before combining the tester 2 and the docking plate 100. The user can fix the socket base 2a to the docking assembly 200 by inserting the multiple coupling protrusions 2b of the socket base 2a into the multiple coupling holes 201 of the docking assembly 200. In addition, the docking assembly 200 and other parts of the socket base 2a can be fastened by bolts.
當插座基座2a與對接組件200緊固連接時,測試器2可以朝向對接板100的底面上升。貫通對接組件200的結合孔201的插座基座2a的結合突起2b可以插入於形成在對接基座110中的孔中。這樣,插座基座2a的結合突起2b一起插入到對接組件200的結合孔201及形成在對接基座110中的孔中,從而可以將對接組件200的位置整列及固定到對接基座110中。另外,當將插座基座2a設置在開口部111下側時,使用人員可以通過操作部130驅動鎖定裝置120。鎖定裝置120的夾緊件121支撐對接組件200的結合輥202,從而對接組件200及插座基座2a能夠以一定位置固定在對接板100上。 When the socket base 2a is firmly connected to the docking assembly 200, the tester 2 can rise toward the bottom surface of the docking plate 100. The coupling protrusion 2b of the socket base 2a that passes through the coupling hole 201 of the docking assembly 200 can be inserted into the hole formed in the docking base 110. In this way, the coupling protrusion 2b of the socket base 2a is inserted into the coupling hole 201 of the docking assembly 200 and the hole formed in the docking base 110 together, so that the position of the docking assembly 200 can be aligned and fixed to the docking base 110. In addition, when the socket base 2a is set at the lower side of the opening portion 111, the user can drive the locking device 120 through the operating portion 130. The clamping member 121 of the locking device 120 supports the coupling roller 202 of the docking assembly 200, so that the docking assembly 200 and the socket base 2a can be fixed on the docking plate 100 at a certain position.
這種測試器結合部10具有使插座底座2a通過對接組件200容易地與對接基座110結合或分離的效果。 This tester coupling portion 10 has the effect of making the socket base 2a easily coupled to or separated from the docking base 110 through the docking assembly 200.
由上述討論,將可理解,本發明可以多種實例形式體現,包含但不限於下列: From the above discussion, it will be understood that the present invention can be embodied in a variety of embodiments, including but not limited to the following:
實例1、一種測試器結合部,與設置有容納設備的插座基座的測試器及處理器中的任一個相結合,其特徵在於,包括對接板,所述對接板中形成有開口部及多個引導部,所述開口部用於將設置於所述插座基座中的所述設備暴露於所述處理器,為了可分離式結合於所述測試器,所述引導部具有槽及突起中的一個形狀,多個所述引導部中的至少一部分與形成於所述測試器中的多個測試器引導件相結合,從而所述對接板與所述測試器相結合。 Example 1: A tester coupling part is coupled with any one of a tester and a processor provided with a socket base for accommodating equipment, and is characterized in that it includes a docking plate, an opening and a plurality of guide parts are formed in the docking plate, the opening is used to expose the equipment provided in the socket base to the processor, and the guide part has a shape of a groove and a protrusion in order to be detachably coupled to the tester, and at least a part of the plurality of guide parts is coupled with a plurality of tester guides formed in the tester, so that the docking plate is coupled with the tester.
實例2、一種測試器結合部,與設置有容納設備的插座基座的測試器及處理器中的任一個相結合,其特徵在於,包括:對接組件,與所述插座基座相結合;以及對接板,形成有開口部,所述開口部用於將設置於所述插座基座中的所述設備暴露於所述處理器並包圍所述對接組件的至少一部分,當所述測試器接近所述對接板預定距離以下時,所述對接板通過支撐所述對接組件來固定相對於所述對接板的所述插座基座的位置。 Example 2: A tester coupling part is coupled with any one of a tester and a processor provided with a socket base for accommodating a device, and is characterized in that it includes: a docking assembly coupled with the socket base; and a docking plate formed with an opening, the opening being used to expose the device provided in the socket base to the processor and surround at least a portion of the docking assembly, and when the tester approaches the docking plate below a predetermined distance, the docking plate fixes the position of the socket base relative to the docking plate by supporting the docking assembly.
實例3、如實例2所述的測試器結合部,其特徵在於,所述對接組件包括輔助對接單元,所述輔助對接單元與所述插座基座相連,所述對接板包括鎖定裝置,為了選擇性地支撐所述輔助對接單元,所述鎖定裝置中設置有夾緊件,所述夾緊件以朝向所述輔助對接單元進退的方式驅動,所述夾緊件支撐與所述插座基座相連的所述輔助對接單元,從而所述鎖定裝置固定相對於所述對接板的所述插座基座的位置。 Example 3: The tester coupling portion as described in Example 2 is characterized in that the docking assembly includes an auxiliary docking unit, the auxiliary docking unit is connected to the socket base, the docking plate includes a locking device, and in order to selectively support the auxiliary docking unit, a clamping piece is provided in the locking device, the clamping piece is driven in a forward and backward manner toward the auxiliary docking unit, and the clamping piece supports the auxiliary docking unit connected to the socket base, so that the locking device fixes the position of the socket base relative to the docking plate.
實例4、如實例3所述的測試器結合部,其特徵在於,所述輔助對接單元包括輥部,所述輥部通過與朝向所述輔助對接單元前進的所述夾緊件相接觸來進行旋轉,所述夾緊件以朝向所述輥部進退的方式驅動。 Example 4: The tester coupling portion as described in Example 3 is characterized in that the auxiliary docking unit includes a roller, the roller rotates by contacting the clamping member advancing toward the auxiliary docking unit, and the clamping member is driven in a forward and backward manner toward the roller.
實例5、如實例2所述的測試器結合部,其特徵在於,所述對接組件包括清洗套件,所述清洗套件與所述插座基座一起形成清洗流路,並通過所述清洗流路使濕度調節用流體流動。 Example 5: The tester coupling portion as described in Example 2 is characterized in that the docking assembly includes a cleaning kit, and the cleaning kit forms a cleaning flow path together with the socket base, and the humidity adjustment fluid flows through the cleaning flow path.
實例6、如實例2所述的測試器結合部,其特徵在於,所述對接組件中形成有結合孔,形成於所述插座基座中的結合突起貫通插入於所述結合孔中,所述對接板通過與貫通所述結合孔的所述結合突起相結合來固定相對於所述對接板的所述插座基座的位置。 Example 6: The tester coupling portion as described in Example 2 is characterized in that a coupling hole is formed in the docking assembly, a coupling protrusion formed in the socket base is inserted through the coupling hole, and the docking plate is fixed at the position of the socket base relative to the docking plate by coupling with the coupling protrusion passing through the coupling hole.
實例7、一種對接組件,與設置有容納設備的插座基座的測試器及向所述測試器移送所述設備的處理器中的任一個相結合,其特徵在於,包括清洗套件,所述清洗套件與所述插座基座一起形成清洗流路,通過所述清洗流路使從所述測試器及所述處理器中的任一個接收到的濕度調節用流體流動。 Example 7: A docking assembly is combined with a tester provided with a socket base for accommodating a device and a processor for transferring the device to the tester, and is characterized in that it includes a cleaning kit, and the cleaning kit and the socket base together form a cleaning flow path, through which a humidity adjustment fluid received from either the tester or the processor flows.
儘管已經以具體實施形態說明了本發明的實施例,但是這些僅是示例,並且本發明不限於此,並且應根據本說明書中公開的基本思想將其解釋為具有最廣泛的範圍。本領域技術人員可以組合/置換所公開的實施形態以實現未示出的形狀的圖案,但這也不脫離本發明的範圍。另外,本領域技術人員可以容易地改變或修改基於本說明書所公開的實施形態,並且明確這種改變或修改也屬於本發明的範圍。 Although the embodiments of the present invention have been described in specific implementation forms, these are only examples, and the present invention is not limited thereto and should be interpreted as having the broadest scope based on the basic ideas disclosed in this specification. A person skilled in the art may combine/replace the disclosed implementation forms to realize a pattern of a shape not shown, but this does not deviate from the scope of the present invention. In addition, a person skilled in the art may easily change or modify the implementation forms disclosed based on this specification, and it is clear that such changes or modifications also belong to the scope of the present invention.
1:處理器 1: Processor
10:測試器結合部 10: Tester joint
20:基板 20: Substrate
30:框架 30: Framework
40:第一梭子單元 40: First shuttle unit
41:第一裝載區域 41: First loading area
42:第一交換區域 42: First exchange area
43:第一卸載區域 43: First unloading area
50:第二梭子單元 50: Second shuttle unit
51:第二裝載區域 51: Second loading area
52:第二交換區域 52: Second exchange area
53:第二卸載區域 53: Second unloading area
60:元件供應單元 60: Component supply unit
70:溫度調節部 70: Temperature control unit
80:裝載部 80: Loading unit
90:卸載部 90: Unloading Department
Claims (2)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190151742A KR20210063164A (en) | 2019-11-22 | 2019-11-22 | Tester coupling portion |
KR10-2019-0151742 | 2019-11-22 |
Publications (2)
Publication Number | Publication Date |
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TW202223421A TW202223421A (en) | 2022-06-16 |
TWI857272B true TWI857272B (en) | 2024-10-01 |
Family
ID=75923331
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
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TW111103938A TWI857272B (en) | 2019-11-22 | 2020-11-20 | Docking assembly |
TW109140865A TWI757986B (en) | 2019-11-22 | 2020-11-20 | Tester coupling portion |
TW113132196A TW202507313A (en) | 2019-11-22 | 2020-11-20 | Tester Coupling Portion and Docking Assembly |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
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TW109140865A TWI757986B (en) | 2019-11-22 | 2020-11-20 | Tester coupling portion |
TW113132196A TW202507313A (en) | 2019-11-22 | 2020-11-20 | Tester Coupling Portion and Docking Assembly |
Country Status (3)
Country | Link |
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KR (1) | KR20210063164A (en) |
CN (2) | CN119064644A (en) |
TW (3) | TWI857272B (en) |
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MY151553A (en) * | 2009-08-18 | 2014-06-13 | Multitest Elektronische Syst | Two abutting sections of an align fixture together floatingly engaging an electronic component |
KR101333435B1 (en) * | 2012-03-30 | 2013-11-26 | 세메스 주식회사 | Test handler |
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2019
- 2019-11-22 KR KR1020190151742A patent/KR20210063164A/en active Pending
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2020
- 2020-11-20 TW TW111103938A patent/TWI857272B/en active
- 2020-11-20 TW TW109140865A patent/TWI757986B/en active
- 2020-11-20 TW TW113132196A patent/TW202507313A/en unknown
- 2020-11-23 CN CN202411195935.XA patent/CN119064644A/en active Pending
- 2020-11-23 CN CN202011322855.8A patent/CN112834788B/en active Active
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US7138811B1 (en) * | 2005-07-01 | 2006-11-21 | Xilinx, Inc. | Seals used for testing on an integrated circuit tester |
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Also Published As
Publication number | Publication date |
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KR20210063164A (en) | 2021-06-01 |
TW202507313A (en) | 2025-02-16 |
TW202120927A (en) | 2021-06-01 |
CN119064644A (en) | 2024-12-03 |
TW202223421A (en) | 2022-06-16 |
CN112834788B (en) | 2024-09-20 |
TWI757986B (en) | 2022-03-11 |
CN112834788A (en) | 2021-05-25 |
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