TWI857037B - Heating device for substrate holder of CVD reactor - Google Patents
Heating device for substrate holder of CVD reactor Download PDFInfo
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- TWI857037B TWI857037B TW109110125A TW109110125A TWI857037B TW I857037 B TWI857037 B TW I857037B TW 109110125 A TW109110125 A TW 109110125A TW 109110125 A TW109110125 A TW 109110125A TW I857037 B TWI857037 B TW I857037B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
- H05B3/08—Heater elements structurally combined with coupling elements or holders having electric connections specially adapted for high temperatures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/145—Carbon only, e.g. carbon black, graphite
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/262—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
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- H10P72/0432—
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- H10P72/7624—
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Resistance Heating (AREA)
Abstract
本發明係有關於一種用於加熱CVD反應器(10)之基板座的裝置(1)。設有三個大小相同或不同、圍繞中心(Z)分佈的加熱面(2)。加熱面(2)由導電、在一個平面內以形成並排之側邊(4)的方式曲折形延伸的加熱元件(3)形成。實質之處在於:側邊(4)具有平行於界線(a、b、c)延伸之側邊區段(5),該等界線沿兩個加熱面(2)間之徑向界限延伸。採用此種建構方案之加熱區配置被一圓形第二加熱配置包圍。The invention relates to a device (1) for heating a substrate holder of a CVD reactor (10). Three heating surfaces (2) of equal or different size are provided and are distributed around a center (Z). The heating surfaces (2) are formed by electrically conductive heating elements (3) extending in a zigzag manner in a plane to form side edges (4) arranged side by side. The essence is that the side edges (4) have side segments (5) extending parallel to boundaries (a, b, c) extending along the radial boundaries between two heating surfaces (2). The heating zone arrangement using this construction scheme is surrounded by a circular second heating arrangement.
Description
本發明係有關於一種用於加熱CVD反應器之基板座的裝置,具有至少三個較佳結構相同、導電、佈置在同一平面內、在該平面內以形成並排之側邊的方式曲折形延伸、分別限制在較佳大小相同且圍繞中心均勻分佈且被徑向界線隔開之加熱面上、分別在第一末端上具有第一連接接點並在第二末端上具有第二連接接點、以該等第一及第二連接接點與導電之配電元件連接的加熱元件。The present invention relates to a device for heating a substrate holder of a CVD reactor, comprising at least three heating elements which are preferably of the same structure, electrically conductive, arranged in the same plane, extending in a zigzag manner in the plane to form side edges side by side, respectively confined on a heating surface of preferably the same size and uniformly distributed around a center and separated by radial boundaries, respectively having a first connection point at the first end and a second connection point at the second end, and connected to a conductive distribution element via the first and second connection points.
本發明亦有關於一種具有此種加熱元件的CVD反應器以及一種用於加熱裝置的加熱元件。The present invention also relates to a CVD reactor having such a heating element and a heating element for a heating device.
WO 2006/060134 A2描述過此種裝置。該案描述一種加熱裝置,其具有多個佈置在一平面內之導電加熱元件。此等加熱元件形成一徑向外區及一徑向內區。弧形延伸之外加熱元件包圍此內區,該內區中延伸有一具有多個弧形側邊的加熱元件。此等側邊係透過180度弧形區段而相連,故其在一平面內並排延伸。Such a device is described in WO 2006/060134 A2. The case describes a heating device having a plurality of conductive heating elements arranged in a plane. The heating elements form a radial outer region and a radial inner region. The inner region is surrounded by an arc-shaped outer heating element, in which a heating element having a plurality of arc-shaped sides extends. The sides are connected by 180 degree arc segments, so that they extend side by side in a plane.
US 5,759,281、US 2016/0270150 A1及DE 10 2013 113 049 A1中亦有描述過類似的加熱元件。Similar heating elements are also described in US 5,759,281, US 2016/0270150 A1 and DE 10 2013 113 049 A1.
WO 2004/089039描述一種具有共四個加熱面的加熱裝置,此等加熱面被徑向界線隔開。此等四個蛋糕塊狀加熱面各具一加熱元件,其具有一徑向外連接接點及一徑向內連接接點,其中,徑向內連接接點佈置在中心附近。加熱元件以形成並排延伸之弧形側邊的方式在此等連接接點之間延伸。WO 2004/089039 describes a heating device having a total of four heating surfaces separated by radial boundaries. Each of the four cake-shaped heating surfaces has a heating element having a radially outward connection point and a radially inward connection point, wherein the radially inward connection point is arranged near the center. The heating element extends between the connection points in a manner forming arcuate sides extending side by side.
本發明之目的在於對一種用於CVD反應器或在CVD反應器上之同類型加熱元件進行最佳化。The object of the present invention is to optimize a heating element of the same type used in or on a CVD reactor.
本發明用以達成上述目的之解決方案為在申請專利範圍中給出之裝置。The solution of the present invention to achieve the above-mentioned purpose is the device given in the scope of the patent application.
首先且實質上提出,該等側邊由平行於該等界線延伸之側邊區段構成。至少該等緊鄰界線的側邊較佳係直線延伸。由此,不同加熱元件的兩個側邊可彼此平行。特定言之,至少部分、較佳全部側邊皆由平行於界線的側邊區段構成。其中,每個側邊可具有兩個側邊區段。特定言之,該等加熱面間大小一致並且分別在一圍繞中心的區間內延伸,因此,每個加熱面皆具兩個例如互成120度、90度或72度角的徑向界線及一個在圍繞該中心之圓弧線上延伸之弧形界線。因而每個加熱面皆呈蛋糕塊狀。至少該等側邊區段中的最長側邊區段平行於該等直線延伸之徑向界線。兩個彼此平行之側邊區段較佳分別透過一180度弧形區段而相連,其中,在該等彼此平行之側邊區段之間延伸有間隙。該間隙的間隙寬度在此間隙末端的區域內有所增大,從而例如形成圓盤形間隙端面。此外,形成一側邊的兩個側邊區段可形成一角部區段,在該角部區段中,該二側邊區段互成120度角、90度角或72度角。內側邊區域可形成一角部凹口,故該間隙在此亦有所增大。特別有利地,該等加熱元件例如藉由雷射切割而自一板件,如石墨或金屬板沖切而成。該板件之材料係導電且具有較高的耐溫性。透過通電便能將該加熱裝置加熱至2000℃以上。每個加熱元件具有第一連接接點及第二連接接點。第一連接接點與該等側邊中的最短側邊連接。第二連接接點與加熱元件之側邊中的最長側邊連接並且將該加熱元件的相應末端與一配電元件連接在一起。該等配電元件可佈置在同一平面內並可由板件構成,此等板件被隔離間隙隔開。該等板件佈置在一平行於加熱元件的平行平面內。在加熱元件與配電元件之間可設有隔離元件。該等隔離元件可指板件,其由陶瓷材料構成且佈置在加熱元件與配電元件之間。該等隔離元件亦可由凸緣構成,其僅佈置在加熱元件與配電元件之間的某些彼此隔開的位置上。在本發明的一種改良方案中,該等特別是三個中心加熱元件形成一中心加熱區,該中心加熱區被一徑向外加熱區包圍。該徑向外加熱區較佳由弧形延伸之第二加熱元件構成。該等弧形延伸之加熱元件可形成該等加熱面之圓弧形界線。此外,該中心加熱區的所有加熱元件係並聯,以及/或者該徑向外加熱區的所有加熱元件係並聯。此外,該等一或多個構成該徑向外加熱區的加熱元件可分別具有兩個側邊。該等側邊並排延伸,因而在兩個透過弧形區段相連的側邊區段之間形成一間隙。該間隙亦可在該間隙末端中有所增寬。該間隙可以形成一面積較大區的方式朝該間隙末端增寬,其中,該面積較大區可具有緣邊,該緣邊係圓弧形、三角形、梯形或一般而言多邊形地延伸。根據另一方案,亦可在最短側邊之區域內設有面積較大的凹口。此外,該等第二加熱元件可具有疊置之側邊。在此情況下,該等側邊具有疊合形狀。因此,該第二加熱元件的側邊可在兩個平面內延伸。該等平面可與該等第一加熱元件所處的同一平面錯開。該內加熱元件例如可相對該外加熱元件的上側邊而言以該外加熱元件之材料厚度的幅度朝該下方之外加熱元件錯開。該等配電元件以及/或者佈置在該等配電元件與該等加熱元件之間的隔離元件可形成承載該等加熱元件的承載元件。該等加熱元件可僅藉由該等連接接點而與該承載元件連接。亦可利用例如由陶瓷材料構成之固定元件來將該等加熱元件固定在該承載元件上。固定元件可具有固定在直徑較小之桿部上的頭部。該桿部可穿過加熱元件之開口並固定在承載元件上。在此情形下,該頭部較佳放置在加熱元件之指向上方的表面上。可設有多個此類固定元件,其亦可佈置在兩個加熱元件之間之間隙的區域內。作為有利方案,在兩個不同加熱元件之兩個鄰接界線的側邊區段之間形成一直線延伸之間隙,該間隙在其整個延伸長度內具有恆定的間隙寬度。該間隙較佳在該加熱裝置的一徑線(相對中心而言)上延伸。該間隙較佳僅略大於屬於一加熱元件的兩個側邊之間的間隙。較佳地,所有間隙具有大致相同的間隙寬度。First and in essence, the sides are formed by side segments extending parallel to the boundaries. At least the sides adjacent to the boundaries are preferably straight line extensions. Thus, two sides of different heating elements can be parallel to each other. Specifically, at least part of, preferably all of the sides are formed by side segments parallel to the boundaries. Wherein, each side can have two side segments. Specifically, the heating surfaces are of the same size and extend in a region around the center, so that each heating surface has two radial boundaries, for example, at an angle of 120 degrees, 90 degrees or 72 degrees to each other, and an arc boundary extending on a circular arc around the center. Thus, each heating surface is in the shape of a cake piece. At least the longest side segment of the side segments is parallel to the radial boundary of the extension of the straight lines. Two side segments parallel to each other are preferably connected by a 180-degree arc segment, wherein a gap extends between the side segments parallel to each other. The gap width of the gap increases in the area at the end of the gap, thereby forming a disc-shaped gap end face, for example. In addition, the two side segments forming a side can form a corner segment, in which the two side segments are at an angle of 120 degrees, 90 degrees or 72 degrees to each other. The inner side region can form a corner notch, so the gap is also increased here. Particularly advantageously, the heating elements are punched from a plate, such as graphite or metal plate, for example by laser cutting. The material of the plate is conductive and has a high temperature resistance. The heating device can be heated to above 2000°C by supplying electricity. Each heating element has a first connection point and a second connection point. The first connection point is connected to the shortest side of the sides. The second connection point is connected to the longest side of the sides of the heating element and connects the corresponding end of the heating element to a distribution element. The distribution elements can be arranged in the same plane and can be composed of plates, which are separated by isolation gaps. The plates are arranged in a parallel plane parallel to the heating elements. An isolation element may be provided between the heating element and the distribution element. The isolation elements may refer to plates, which are composed of ceramic material and arranged between the heating element and the distribution element. The isolating elements may also be formed by flanges, which are only arranged at certain mutually spaced positions between the heating element and the distribution element. In a modified version of the present invention, the three central heating elements, in particular, form a central heating zone, which is surrounded by a radially outer heating zone. The radially outer heating zone is preferably formed by a second heating element extending in an arc. The arc-shaped heating elements can form the circular arc boundaries of the heating surfaces. In addition, all the heating elements of the central heating zone are connected in parallel, and/or all the heating elements of the radially outer heating zone are connected in parallel. In addition, the one or more heating elements constituting the radially outer heating zone may have two sides respectively. The sides extend side by side, thereby forming a gap between two side sections connected by arc sections. The gap may also be widened in the end of the gap. The gap may be widened towards the end of the gap in the form of a larger area, wherein the larger area may have an edge, which extends in the shape of a circular arc, a triangle, a trapezoid or generally a polygon. According to another embodiment, a larger recess may also be provided in the region of the shortest side. In addition, the second heating elements may have overlapping sides. In this case, the sides have an overlapping shape. Therefore, the sides of the second heating element may extend in two planes. The planes may be staggered with the same plane in which the first heating elements are located. The inner heating element may, for example, be staggered towards the outer heating element below with respect to the upper side of the outer heating element by the material thickness of the outer heating element. The distribution elements and/or the isolation elements arranged between the distribution elements and the heating elements can form a carrier element that carries the heating elements. The heating elements can be connected to the carrier element only by the connection points. The heating elements can also be fixed to the carrier element by means of fixing elements, for example, made of ceramic material. The fixing element can have a head fixed to a rod with a smaller diameter. The rod can pass through the opening of the heating element and be fixed to the carrier element. In this case, the head is preferably placed on the upwardly pointing surface of the heating element. A plurality of such fixing elements can be provided, which can also be arranged in the area of the gap between two heating elements. As an advantageous solution, a straight-line gap is formed between the side sections of two adjacent boundaries of two different heating elements, which gap has a constant gap width over its entire extension. The gap preferably extends on a radial line (relative to the center) of the heating device. The gap is preferably only slightly larger than the gap between two sides belonging to a heating element. Preferably, all gaps have approximately the same gap width.
圖22示意性示出CVD反應器10,其中,在氣密之特別是由優質鋼製成之殼體中佈置有氣體入口構件11,其具有蓮蓬頭狀排氣面,被饋入氣體入口構件11之製程氣體可經由該排氣面的多個排氣口而流入製程室14。該製程氣體特別是包含載氣(如氫氣)、有機金屬組分(特別是第III主族元素的有機金屬化合物,如三甲基鎵或三甲基銦),以及第V主族元素(如氨、砷或磷)的氫化物。製程室14之底部由基板座12構成,該基板座形成多個載槽,該等載槽可分別容置一基板13,該基板藉由饋入之製程氣體而被塗佈。基板座12自下而上地被加熱裝置1加熱,該加熱裝置為紅外線輻射器。FIG. 22 schematically shows a CVD reactor 10, wherein a gas inlet component 11 having a showerhead-like exhaust surface is arranged in a gastight housing, in particular made of high-quality steel, and the process gas fed into the gas inlet component 11 can flow into a process chamber 14 through a plurality of exhaust ports of the exhaust surface. The process gas in particular comprises a carrier gas (such as hydrogen), an organic metal component (in particular an organic metal compound of a group III element, such as trimethyl gallium or trimethyl indium), and a hydride of a group V element (such as ammonia, arsenic or phosphorus). The bottom of the process chamber 14 is formed by a substrate holder 12, which forms a plurality of carrier slots, each of which can accommodate a substrate 13, which is coated by the fed process gas. The substrate holder 12 is heated from bottom to top by the heating device 1, which is an infrared radiator.
圖1至21示出可應用於CVD反應器10中之本發明之加熱裝置1的不同實施例。1 to 21 show different embodiments of the heating device 1 of the present invention that can be used in a CVD reactor 10.
實施例1至3之加熱裝置1首先具有以下共同特點:The heating device 1 of embodiments 1 to 3 first has the following common features:
加熱元件1為多層結構之圓盤形主體。在指向上方的一側上,形成加熱裝置1的主體具有多個加熱元件3,其分佈在大小相同的加熱面2上。自加熱元件1之中心Z出發設有三個互以120角錯開佈置的徑向線a、b、c,其表示三個加熱面2的假想徑向界線。加熱面2在徑向朝外方向上被三個弧形之徑向外部的第二加熱元件21限制。加熱元件1的所有加熱元件21可由耐溫材料構成。特定言之,該等加熱元件由金屬或石墨構成。The heating element 1 is a disc-shaped body with a multi-layer structure. On the side pointing upward, the body forming the heating device 1 has a plurality of heating elements 3, which are distributed on the heating surfaces 2 of the same size. Starting from the center Z of the heating element 1, there are three radial lines a, b, and c arranged at an angle of 120 to each other, which represent the imaginary radial boundaries of the three heating surfaces 2. The heating surface 2 is limited in the radial outward direction by three arc-shaped radially outward second heating elements 21. All heating elements 21 of the heating element 1 can be made of temperature-resistant materials. Specifically, the heating elements are made of metal or graphite.
每個加熱面2較佳具有正好一個帶第一末端3'及第二末端3''的加熱元件3。第一末端3'透過連接接點6與多個配電元件15、15'、16、17連接。加熱元件3的第二末端3''具有第二連接接點7,該第二末端透過該連接接點與配電元件15至17中的另一個連接。第二末端3''由加熱元件3之側邊4的一末端構成,其中,加熱元件3具有多個並排之側邊4。兩個並排之側邊4分別具有側邊區段5,該等側邊區段間的角度等於限制相應加熱面2之該二徑向界線a、b、c間的角度。第二連接接點7上連接有緊鄰徑向界線a、b、c之最長側邊區段5,其以在角部區段9中形成一角度的方式過渡至另一側邊區段5,該另一側邊區段過渡為弧形區段8。弧形區段8又過渡為兩個側邊區段5,該二側邊區段結構相同且在其間形成一角部區段9。曲折形延伸之側邊4具有最短側邊,其形成加熱元件的第一末端3'。Each heating surface 2 preferably has exactly one heating element 3 with a first end 3' and a second end 3". The first end 3' is connected to a plurality of distribution elements 15, 15', 16, 17 via a connection point 6. The second end 3'' of the heating element 3 has a second connection point 7, via which the second end is connected to another of the distribution elements 15 to 17. The second end 3'' is formed by an end of a side 4 of the heating element 3, wherein the heating element 3 has a plurality of side edges 4 arranged side by side. Two side edges 4 arranged side by side each have a side segment 5, the angle between the side segments being equal to the angle between the two radial boundaries a, b, c limiting the corresponding heating surface 2. The second connection point 7 is connected to the longest side section 5 adjacent to the radial boundaries a, b, c, which transitions to another side section 5 in a manner forming an angle in the corner section 9, and the other side section transitions to an arc section 8. The arc section 8 transitions to two side sections 5, which have the same structure and form a corner section 9 between them. The zigzag-shaped side 4 has the shortest side, which forms the first end 3' of the heating element.
在彼此平行延伸之側邊5之間分別延伸有一較窄間隙18,其在弧形區段8之區域內呈圓形地面積較大,因而形成一面積較大的間隙末端19。多個、較佳所有間隙18平行於徑向界線a、b、c。因此,每個加熱面2具有多個彼此平行且平行於一徑向界線a、b、c的側邊區段5。A relatively narrow gap 18 extends between the parallel sides 5, which is larger in the area of the arc section 8 in a circular shape, thereby forming a larger gap end 19. A plurality of, preferably all, gaps 18 are parallel to the radial boundaries a, b, c. Therefore, each heating surface 2 has a plurality of side sections 5 that are parallel to each other and parallel to a radial boundary a, b, c.
在中心Z中設有固定元件27,圖4中例如示出該固定元件。該固定元件27搭接加熱元件3的在此相鄰接之角部區段9的三個尖端。A fixing element 27 is provided in the center Z, which is shown by way of example in FIG 4. The fixing element 27 overlaps the three tips of the corner sections 9 of the heating element 3 which are adjacent here.
設有若干第二加熱元件21,其亦在該等第一加熱元件3所處的區間內延伸。分別有一個第二加熱元件21弧形包圍一個內加熱元件3。該等徑向外部之第二加熱元件21具有兩個並排延伸之側邊22,其中,第二加熱元件21或該等側邊22的該二末端21'、21''分別以連接接點23、24與配電元件15、15'、16、17連接。A plurality of second heating elements 21 are provided, which also extend in the area where the first heating elements 3 are located. Each second heating element 21 arcuately surrounds an inner heating element 3. The radially outer second heating elements 21 have two side edges 22 extending side by side, wherein the two ends 21', 21" of the second heating element 21 or the side edges 22 are connected to the distribution elements 15, 15', 16, 17 via connection points 23, 24, respectively.
圖2或4示出加熱裝置1的豎向結構。加熱元件3及加熱元件21處於最上面。配電元件15、15'、16、17處於最下面,其共同形成一被若干間隙隔開的圓形板件。在配電元件15、15'、16、17與加熱元件3、21之間設有隔離元件,其在第一實施例中建構為隔離板25,其具有供連接接點穿過的開口。FIG. 2 or 4 shows the vertical structure of the heating device 1. The heating element 3 and the heating element 21 are at the top. The distribution elements 15, 15', 16, 17 are at the bottom, and together they form a circular plate separated by a number of gaps. Between the distribution elements 15, 15', 16, 17 and the heating elements 3, 21, there is an isolation element, which in the first embodiment is constructed as an isolation plate 25, which has an opening for the connection point to pass through.
圖4示出連接接點7,其透過亦可起間隔套管之作用的接觸套管25而與配電元件15連接。FIG. 4 shows a connection point 7 which is connected to a distribution element 15 via a contact bushing 25 which can also function as a spacer bushing.
圖4亦示出多個用來將加熱元件3連接在配電元件15、15'、16、17上之固定元件27中的一個。固定元件27係指隔離體,如陶瓷體,其具有放置在加熱元件3、21上的頭部。固定元件27的桿部穿過隔離元件並在配電元件16下方被開口銷固定住。FIG4 also shows one of the fixing elements 27 used to connect the heating element 3 to the distribution element 15, 15', 16, 17. The fixing element 27 is an isolating body, such as a ceramic body, which has a head placed on the heating element 3, 21. The rod of the fixing element 27 passes through the isolating element and is fixed under the distribution element 16 by a split pin.
圖5示出接點24的替代建構方案,第二加熱元件21透過該接點與配電元件15'連接。在此情況下,在加熱元件21與配電元件15'之間同樣設有間隔套管26,其可採用導電方案。Fig. 5 shows an alternative construction scheme of the joint 24, through which the second heating element 21 is connected to the distribution element 15'. In this case, a spacer sleeve 26 is also provided between the heating element 21 and the distribution element 15', which can adopt a conductive scheme.
圖6示出固定螺釘28,其位於加熱元件3下方且用來使得隔離元件(此處之隔離板25)與配電元件16連接。固定螺釘28的頭部插在凹部中。擰緊在固定螺釘28之螺紋桿上的螺母支撐在配電元件15'的底側上。Figure 6 shows a fixing screw 28, which is located below the heating element 3 and is used to connect the isolation element (here the isolation plate 25) to the distribution element 16. The head of the fixing screw 28 is inserted into the recess. The nut tightened on the threaded rod of the fixing screw 28 is supported on the bottom side of the distribution element 15'.
第一加熱元件3的第一連接接點6及第二連接接點7位於相應加熱面2的徑向外區域內。連接接點6、7所處的徑向外區域之徑向延伸度較佳小於該等側邊5中的一個的寬度。The first connection point 6 and the second connection point 7 of the first heating element 3 are located in a radially outer region of the corresponding heating surface 2. The radial extension of the radially outer region in which the connection points 6, 7 are located is preferably smaller than the width of one of the side edges 5.
加熱裝置1的最下面的平面由共五個配電元件15、15'、16、17的佈置方案構成。一個配電元件16在三個60度區段內延伸。在配電元件16的該等三個區段之間延伸有配電元件15、15'、16、17。此外,該等配電元件具有外部之弧形配電元件17,其圍繞中心Z在大於180度範圍內延伸。配電元件16為一共用之配電元件,若干加熱元件與該配電元件連接。透過配電元件15、15'便能為內加熱元件3個別供電。透過徑向外部之配電元件17便能為徑向外部之加熱元件21個別供電。但根據較佳方案,所有內加熱元件3係並聯並且所有外加熱元件21係並聯。但該等外加熱元件及內加熱元件3、21可以彼此分離之方式饋電。The bottom plane of the heating device 1 is composed of a total of five distribution elements 15, 15', 16, 17. One distribution element 16 extends in three 60-degree sections. Distribution elements 15, 15', 16, 17 extend between the three sections of the distribution element 16. In addition, the distribution elements have an external arc-shaped distribution element 17, which extends around the center Z in a range greater than 180 degrees. The distribution element 16 is a common distribution element, and a number of heating elements are connected to the distribution element. The internal heating elements 3 can be individually powered through the distribution elements 15, 15'. The radially external heating elements 21 can be individually powered through the radially external distribution element 17. However, according to a preferred embodiment, all internal heating elements 3 are connected in parallel and all external heating elements 21 are connected in parallel. However, the external heating elements and the internal heating elements 3, 21 can be powered separately from each other.
在圖1至7所示第一實施例中及在圖8至13所示第二實施例中,第二加熱元件21並排地在同一平面內延伸,該平面內亦延伸有加熱元件3。在該二由此而形成之側邊22之間延伸有較窄間隙。In the first embodiment shown in Figures 1 to 7 and in the second embodiment shown in Figures 8 to 13, the second heating element 21 extends side by side in the same plane in which the heating element 3 also extends. A narrow gap extends between the two sides 22 formed thereby.
圖8至13所示第二實施例之特別之處在於具有採用替代設計方案的隔離體。作為第一實施例所用隔離板25的替代方案,此處之隔離體由具有方形形狀之凸緣29、30構成。該等凸緣29、30在配電元件15、15'、16、17與加熱元件3、21之間延伸。隔離體29、30在其上表面上具有栓釘,其可卡入相鄰之側邊4或22之間的空隙。與將配電元件15、15'、16、17保持距離的間隔元件33一樣,隔離體29、30亦可由陶瓷材料製成。The second embodiment shown in FIGS. 8 to 13 is characterized in that it has an isolating body with an alternative design. As an alternative to the isolating plate 25 used in the first embodiment, the isolating body here consists of flanges 29, 30 with a square shape. These flanges 29, 30 extend between the distribution elements 15, 15', 16, 17 and the heating elements 3, 21. The isolating bodies 29, 30 have studs on their upper surface, which can be snapped into the gap between the adjacent sides 4 or 22. Like the spacing elements 33 that keep the distribution elements 15, 15', 16, 17 at a distance, the isolating bodies 29, 30 can also be made of ceramic material.
第二實施例與第一實施例的另一區別之處在於角部凹口20。特別是最長側邊4之緊鄰徑向界線a、b、c的側邊區段5具有角部區段9,其在角部內側上具有凹槽。該凹槽具有直線延伸之緣邊並且在角部區段9中增寬了兩個並排延伸之側邊區段之間的間隙18。Another difference of the second embodiment from the first embodiment is the corner notch 20. In particular, the side segment 5 adjacent to the radial boundaries a, b, c of the longest side 4 has a corner segment 9, which has a groove on the inside of the corner. The groove has a straight-running edge and widens the gap 18 between two side segments extending side by side in the corner segment 9.
本發明之圖14至21所示第三實施例具有對應於第二實施例之隔離體的隔離體,故可參照相關闡述。在第三實施例中,第二加熱元件21的側邊22並不處於同一平面內,而是處於彼此錯開的平面內。此外,加熱元件3所處的平面亦與側邊22之平面錯開。The third embodiment shown in Figures 14 to 21 of the present invention has an isolator corresponding to the isolator of the second embodiment, so reference can be made to the relevant description. In the third embodiment, the side edges 22 of the second heating element 21 are not in the same plane, but in planes that are staggered from each other. In addition, the plane in which the heating element 3 is located is also staggered from the plane of the side edges 22.
第二加熱元件21的側邊22疊合地上下佈置。此處在接觸區域內同樣設有用來將該二側邊22彼此保持一定距離的間隔套管。圖2所示連接接點23表明,其亦將最下面的側邊22與配電元件17保持一定距離。分別有一個連接接點23、24將第二加熱元件21的兩個側邊22連接在一起。該等間隔套管可採用導電方案或電絕緣方案。The sides 22 of the second heating element 21 are arranged one above the other in a superimposed manner. Here too, a spacer sleeve is provided in the contact area to keep the two sides 22 at a certain distance from each other. The connection point 23 shown in FIG. 2 shows that it also keeps the lowermost side 22 at a certain distance from the distribution element 17. There is a connection point 23, 24 respectively connecting the two sides 22 of the second heating element 21 together. The spacer sleeves can adopt a conductive solution or an electrically insulating solution.
在此實施例中,接觸條32鉤狀延伸。在徑向外側邊與接觸條32之間形成有大體呈三角形之角部凹口20'。接觸條32在某種程度上位於加熱元件3的兩個側邊之間。加熱元件3之位於徑向外區域內的弧形區段包圍大體呈梯形之自由空間,該自由空間形成間隙末端19。In this embodiment, the contact strip 32 extends in a hook shape. A substantially triangular corner notch 20' is formed between the radially outer side and the contact strip 32. The contact strip 32 is located to some extent between the two sides of the heating element 3. The arc-shaped section of the heating element 3 located in the radially outer region encloses a substantially trapezoidal free space, which forms the gap end 19.
圖18示出接觸條31,其將連接接點23與配電元件16連接在一起。連接接點23佈置在配電元件17的豎向上方,但不與配電元件17連接。確切言之,接觸條31跨接配電元件17與相鄰之配電元件16之間的間隙,接觸條31與該相鄰之配電元件連接。接觸條31具有Z形形狀。FIG18 shows a contact bar 31 that connects the connection point 23 to the distribution element 16. The connection point 23 is arranged vertically above the distribution element 17, but is not connected to the distribution element 17. Specifically, the contact bar 31 spans the gap between the distribution element 17 and the adjacent distribution element 16, and the contact bar 31 is connected to the adjacent distribution element. The contact bar 31 has a Z shape.
圖19示出另一同樣呈Z形之接觸條32,其將第一加熱元件3之高於配電元件16的連接接點6,與另一配電元件15'連接在一起,其中,此處之接觸條32同樣跨接該二配電元件16與15'之間的間隙。接觸條31、32可透過未予繪示之螺釘而與分配給它們的配電元件連接。FIG. 19 shows another Z-shaped contact strip 32, which connects the connection point 6 of the first heating element 3, which is higher than the distribution element 16, to another distribution element 15', wherein the contact strip 32 here also spans the gap between the two distribution elements 16 and 15'. The contact strips 31, 32 can be connected to the distribution elements assigned to them by screws not shown.
前述實施方案係用於說明本申請整體所包含之發明,該等發明至少透過以下特徵組合分別獨立構成相對於先前技術之改良方案,其中,此等特徵組合中的兩項、數項或其全部亦可相互組合,即:The aforementioned embodiments are used to illustrate the inventions included in the present application as a whole, which at least independently constitute improvements over the prior art through the following feature combinations, wherein two, several or all of these feature combinations may also be combined with each other, namely:
一種裝置,其特徵在於:該等側邊4由平行於該等界線a、b、c延伸之側邊區段5構成。A device is characterized in that the sides 4 are composed of side segments 5 extending parallel to the boundaries a, b, c.
一種裝置,其特徵在於:每個側邊4具有兩個側邊區段5,該等側邊區段分別平行於該等彼此存在一角距之界線a、b、c中的一個。A device is characterized in that each side 4 has two side sections 5, which are respectively parallel to one of the boundary lines a, b, c that are at an angular distance from each other.
一種裝置,其特徵在於:該等第一及第二連接接點6、7位於該加熱面2之徑向最外面的區中,以及/或者該加熱面2之該徑向最外面的區具有兩個疊置元件。A device is characterized in that the first and second connection points 6, 7 are located in the radially outermost area of the heating surface 2 and/or the radially outermost area of the heating surface 2 has two superimposed elements.
一種裝置,其特徵在於:兩個平行式並排延伸之側邊區段5透過該加熱元件3的180度弧形區段8而相連。A device is characterized in that two parallel side sections 5 extending side by side are connected through a 180 degree arc section 8 of the heating element 3.
一種裝置,其特徵在於:該等側邊區段5分別在一弧形區段8與一角部區段9之間延伸。A device is characterized in that the side segments 5 extend between an arc segment 8 and a corner segment 9 respectively.
一種裝置,其特徵在於:該等加熱元件3自扁平坯件,特別是自石墨或金屬件沖切而成。A device is characterized in that the heating elements 3 are punched out of a flat blank, in particular from graphite or metal.
一種裝置,其特徵在於:該第一連接接點6被分配給該等側邊4中的最短側邊,該第二連接接點7被分配給該等側邊4中的最長側邊,該最長側邊具有兩個長度相等的側邊區段5。A device is characterized in that the first connection point 6 is assigned to the shortest side of the sides 4, the second connection point 7 is assigned to the longest side of the sides 4, and the longest side has two side sections 5 of equal length.
一種裝置,其特徵在於兩個彼此平行之側邊區段5之間的間隙18,其中,該間隙18在弧形區段8之區域內增寬至面積較大的間隙末端19,其中,該藉此而形成之面積具有緣邊,該緣邊係圓弧形、多邊形,特別是三角形或梯形地延伸。A device characterized by a gap 18 between two mutually parallel side sections 5, wherein the gap 18 widens in the region of the arc-shaped section 8 to a gap end 19 of larger area, wherein the area thus formed has an edge which extends in the shape of a circular arc, a polygon, in particular a triangle or a trapezoid.
一種裝置,其特徵在於:兩個V形抵接之側邊區段5的角部區段9在角部內側具有角部凹口20,其中特定言之,該角部凹口20僅設置在該等側邊4中的最長側邊上。A device is characterized in that the corner section 9 of two V-shaped abutting side sections 5 has a corner notch 20 on the inner side of the corner, wherein in particular, the corner notch 20 is only arranged on the longest side of the side sections 4.
一種裝置,其特徵在於:該等特別是三個加熱元件3形成一中心加熱區,該中心加熱區被一徑向外加熱區包圍,該外加熱區具有若干弧形延伸之第二加熱元件21。A device, characterized in that the heating elements 3, in particular three, form a central heating zone, which is surrounded by a radial outer heating zone, which has a number of arc-shaped extending second heating elements 21.
一種裝置,其特徵在於:該等弧形延伸之加熱元件21形成該等加熱面2之弧形之方位角界線。A device, characterized in that the arc-shaped extending heating elements 21 form the azimuth boundaries of the arcs of the heating surfaces 2.
一種裝置,其特徵在於:該等加熱面2之加熱元件3處於同一平面內,以及/或者該等第二加熱元件21係佈置在相同平面內或彼此錯開地佈置。A device is characterized in that the heating elements 3 of the heating surfaces 2 are located in the same plane and/or the second heating elements 21 are arranged in the same plane or staggered with respect to each other.
一種裝置,其特徵在於:該第二加熱元件21具有兩個弧形側邊22,該等側邊在一個平面內並排延伸或者疊合地上下佈置。A device is characterized in that the second heating element 21 has two arc-shaped sides 22, which extend side by side in a plane or are arranged one above the other in an overlapping manner.
一種裝置,其特徵在於佈置在該等加熱元件3、21與該等配電元件15、15'、16、17之間的隔離元件25、29、30,以及/或者該中心加熱區的加熱元件2係並聯,以及/或者該徑向外加熱區的第二加熱元件21係並聯。A device characterized in that isolation elements 25, 29, 30 are arranged between the heating elements 3, 21 and the distribution elements 15, 15', 16, 17, and/or the heating elements 2 of the central heating zone are connected in parallel, and/or the second heating elements 21 of the radially outer heating zone are connected in parallel.
一種CVD反應器,其具有氣體入口構件11及用於容置基板13的基板座12,該基板座可被加熱裝置1加熱,其中,該加熱裝置1採用前述請求項中任一項之建構方案。A CVD reactor has a gas inlet component 11 and a substrate holder 12 for accommodating a substrate 13, wherein the substrate holder can be heated by a heating device 1, wherein the heating device 1 adopts the construction scheme of any one of the aforementioned claims.
所有已揭露特徵(作為單項特徵或特徵組合)皆為發明本質所在。故本申請之揭露內容亦包含相關/所附優先權檔案(在先申請副本)所揭露之全部內容,該等檔案所述特徵亦一併納入本申請之申請專利範圍。附屬項以其特徵對本發明針對先前技術之改良方案的特徵予以說明(即使不含相關請求項之特徵),其目的主要在於在該等請求項基礎上進行分案申請。每個請求項中所給出的發明可進一步具有前述說明中給出的、特別是以符號標示且/或在符號說明中給出的特徵中之一或數項。本發明亦有關於如下設計形式:前述說明中所述及之個別特徵不實現,特別是對於具體用途而言為非必需的或者可被技術上具有相同功效的其他構件所替代之特徵。All disclosed features (as individual features or in combination of features) are essential to the invention. Therefore, the disclosure of this application also includes all the contents disclosed in the relevant/attached priority files (copies of prior applications), and the features described in such files are also included in the scope of the patent application of this application. The dependent items describe the features of the invention as an improvement over the prior art by their features (even if they do not contain the features of the relevant claim items), and their main purpose is to make divisional applications based on such claim items. The invention given in each claim item may further have one or more of the features given in the preceding description, especially those indicated by symbols and/or given in the symbol description. The present invention also relates to the following design forms: individual features described in the above description are not realized, especially features that are not necessary for a specific use or can be replaced by other components with the same technical effect.
1:加熱裝置,裝置 2:加熱面 3:加熱元件 3':第一末端 3'':第二末端 4:側邊 5:側邊區段 6:連接接點 7:連接接點 8:弧形區段 9:角部區段 10:CVD反應器 11:氣體入口構件 12:基板座 13:基板 14:製程室 15:配電元件 15':配電元件 16:配電元件 17:配電元件 18:間隙 19:間隙末端 20:角部凹口 20':角部凹口 21:加熱元件 21':第一末端 21'':第二末端 22:側邊 23:連接接點 24:連接接點 25:隔離元件,隔離板 26:間隔套管 27:固定元件 28:固定螺釘 29:隔離元件 30:隔離元件 31:接觸條 32:接觸條 33:間隔元件 a:界線 b:界線 c:界線 Z:中心1: heating device, device 2: heating surface 3: heating element 3': first end 3'': second end 4: side 5: side section 6: connection point 7: connection point 8: arc section 9: corner section 10: CVD reactor 11: gas inlet component 12: substrate holder 13: substrate 14: process chamber 15: power distribution element 15': power distribution element 16: power distribution element 17: power distribution element 18: gap 19: gap end of gap 20: corner notch 20': corner notch 21: heating element 21': first end 21'': second end 22: side 23: connection point 24: connection point 25: isolation element, isolation plate 26: spacer sleeve 27: fixing element 28: fixing screw 29: isolation element 30: isolation element 31: contact strip 32: contact strip 33: spacer element a: boundary b: boundary c: boundary Z: center
下面結合附圖對本發明之實施例進行說明。其中: 圖1為第一實施例之加熱裝置1的透視圖, 圖2為對應於圖1的視圖,但採用剖開以展示加熱裝置1的豎向結構, 圖3為繪示有徑向界線a、b、c之加熱裝置1的俯視圖, 圖4為根據圖3中之線IV-IV的截面圖, 圖5為根據圖3中之線V-V的截面圖, 圖6為根據圖3中之線VI-VI的截面圖, 圖7為加熱裝置1之主要元件的分解圖, 圖8為本發明之第二實施例之對應於圖1的視圖, 圖9為對應於圖8的視圖,但採用剖開以展示加熱裝置1的豎向結構, 圖10為該加熱裝置的俯視圖, 圖11為隔離體29之透視圖, 圖12為隔離體30之透視圖, 圖13為第二實施例的分解圖, 圖14為對應於圖1的視圖,包含第三實施例之遮蓋緣邊, 圖15為圖14中之局部XV, 圖16為圖14中之局部XVI, 圖17為加熱裝置1的俯視圖, 圖18為根據圖17中之線XVIII-XVIII的截面圖, 圖19為根據圖17中之線XIX-XIX的截面圖, 圖20為根據圖17中之線XX-XX的截面圖, 圖21為第三實施例的分解圖,及 圖22為加熱裝置1在CVD反應器10中之應用實例的示意圖。The following is an explanation of the embodiments of the present invention with reference to the accompanying drawings. Among them: Figure 1 is a perspective view of the heating device 1 of the first embodiment, Figure 2 is a view corresponding to Figure 1, but is cut open to show the vertical structure of the heating device 1, Figure 3 is a top view of the heating device 1 showing radial boundaries a, b, and c, Figure 4 is a cross-sectional view according to line IV-IV in Figure 3, Figure 5 is a cross-sectional view according to line V-V in Figure 3, Figure 6 is a cross-sectional view according to line VI-VI in Figure 3, Figure 7 is an exploded view of the main components of the heating device 1, Figure 8 is a view corresponding to Figure 1 of the second embodiment of the present invention, Figure 9 is a view corresponding to Figure 8, but is cut open to show the vertical structure of the heating device 1, Figure 10 is a top view of the heating device, Figure 11 is a perspective view of the isolator 29, Figure 12 is a perspective view of the isolator 30, Figure 13 is an exploded view of the second embodiment, Figure 14 is a view corresponding to Figure 1, including the cover edge of the third embodiment, Figure 15 is a partial XV in Figure 14, Figure 16 is a partial XVI in Figure 14, Figure 17 is a top view of the heating device 1, Figure 18 is a cross-sectional view according to the line XVIII-XVIII in Figure 17, Figure 19 is a cross-sectional view according to the line XIX-XIX in Figure 17, Figure 20 is a cross-sectional view according to the line XX-XX in Figure 17, Figure 21 is an exploded view of the third embodiment, and Figure 22 is a schematic diagram of an application example of the heating device 1 in the CVD reactor 10.
1:加熱裝置,裝置 1: Heating device, device
2:加熱面 2: Heating noodles
3:加熱元件 3: Heating element
3':第一末端 3': First end
3":第二末端 3": Second end
4:側邊 4: Side
5:側邊區段 5: Side section
6:連接接點 6: Connection point
7:連接接點 7: Connection point
8:弧形區段 8: Arc section
9:角部區段 9: Corner section
18:間隙 18: Gap
19:間隙末端 19: End of gap
21:加熱元件 21: Heating element
21':第一末端 21': First end
21":第二末端 21": Second end
22:側邊 22: Side
23:連接接點 23: Connection point
24:連接接點 24: Connection point
Z:中心 Z: Center
a:界線 a:Boundary
b:界線 b:Boundary
c:界線 c:Boundary
Claims (16)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102019107857.1 | 2019-03-27 | ||
| DE102019107857.1A DE102019107857A1 (en) | 2019-03-27 | 2019-03-27 | Heating device for a susceptor of a CVD reactor |
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| Publication Number | Publication Date |
|---|---|
| TW202041707A TW202041707A (en) | 2020-11-16 |
| TWI857037B true TWI857037B (en) | 2024-10-01 |
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| TW109110125A TWI857037B (en) | 2019-03-27 | 2020-03-26 | Heating device for substrate holder of CVD reactor |
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| CN (1) | CN113840944B (en) |
| DE (1) | DE102019107857A1 (en) |
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| DE102020107552A1 (en) | 2020-03-19 | 2021-09-23 | AIXTRON Ltd. | Heating device for a susceptor of a CVD reactor |
| DE102020130339A1 (en) | 2020-11-17 | 2022-05-19 | Aixtron Se | Heating device for a CVD reactor |
| GB2621859A (en) * | 2022-08-24 | 2024-02-28 | Dyson Technology Ltd | Heating element, heating system & manufacturing method |
| DE102023102724A1 (en) * | 2023-02-03 | 2024-08-08 | Webasto SE | Electric heating device for mobile applications and method for producing such a heating device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5679405A (en) * | 1990-07-16 | 1997-10-21 | National Semiconductor Corp. | Method for preventing substrate backside deposition during a chemical vapor deposition operation |
| US5759281A (en) * | 1997-06-30 | 1998-06-02 | Emcore Corporation | CVD reactor for uniform heating with radiant heating filaments |
| US20030015517A1 (en) * | 2001-04-27 | 2003-01-23 | Hiroshi Fure | Wafer heating apparatus |
| US20160270150A1 (en) * | 2015-03-09 | 2016-09-15 | Nuflare Technology, Inc. | Heater and apparatus for manufacturing semiconductor device using heater |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3618640B2 (en) * | 2000-06-15 | 2005-02-09 | イビデン株式会社 | Hot plate for semiconductor manufacturing and inspection equipment |
| WO2002043441A1 (en) * | 2000-11-24 | 2002-05-30 | Ibiden Co., Ltd. | Ceramic heater, and production method for ceramic heater |
| WO2004089039A1 (en) | 2003-03-31 | 2004-10-14 | Ibiden Co., Ltd. | Heater for semiconductor manufacturing and inspecting equipment |
| WO2006060134A2 (en) | 2004-11-15 | 2006-06-08 | Cree, Inc. | Restricted radiated heating assembly for high temperature processing |
| JP2007258585A (en) * | 2006-03-24 | 2007-10-04 | Tokyo Electron Ltd | Substrate mounting mechanism and substrate processing apparatus |
| JP5996519B2 (en) * | 2013-03-13 | 2016-09-21 | 信越化学工業株式会社 | Ceramic heater |
| US20150013608A1 (en) * | 2013-07-12 | 2015-01-15 | Suncore Photovoltaics Incorporated | Ceramic heater |
| JP5911179B2 (en) * | 2013-08-21 | 2016-04-27 | 信越化学工業株式会社 | Three-dimensional ceramic heater |
| DE102013113049A1 (en) | 2013-11-26 | 2015-05-28 | Aixtron Se | Contact device for connecting a heating element with a contact plate and heating device with such a contact device |
| DE102015108580A1 (en) * | 2015-05-30 | 2016-12-01 | Webasto SE | Electric heater for mobile applications |
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2019
- 2019-03-27 DE DE102019107857.1A patent/DE102019107857A1/en active Pending
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- 2020-03-24 WO PCT/EP2020/058049 patent/WO2020193494A1/en not_active Ceased
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5679405A (en) * | 1990-07-16 | 1997-10-21 | National Semiconductor Corp. | Method for preventing substrate backside deposition during a chemical vapor deposition operation |
| US5759281A (en) * | 1997-06-30 | 1998-06-02 | Emcore Corporation | CVD reactor for uniform heating with radiant heating filaments |
| US20030015517A1 (en) * | 2001-04-27 | 2003-01-23 | Hiroshi Fure | Wafer heating apparatus |
| US20160270150A1 (en) * | 2015-03-09 | 2016-09-15 | Nuflare Technology, Inc. | Heater and apparatus for manufacturing semiconductor device using heater |
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| CN113840944A (en) | 2021-12-24 |
| TW202041707A (en) | 2020-11-16 |
| WO2020193494A1 (en) | 2020-10-01 |
| CN113840944B (en) | 2024-06-11 |
| DE102019107857A1 (en) | 2020-10-01 |
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