TWI856814B - Connecting module for high-frequency test - Google Patents

Abstract

A connecting module for high-frequency test is provided, including: a circuit substrate, and a cage. The circuit substrate includes at least one through hole. The cage is disposed on the circuit substrate and includes an insertion groove configured for an optical module to be inserted therewithin and a plurality of heat dissipation holes communicated with the insertion groove. At least one of the plurality of heat dissipation holes is communicated with the at least one through hole so as to provide rapid heat dissipation effect and high testing efficiency.

Description

High frequency test connection module

The present invention relates to a high-frequency test connection module for inserting at least one optical module to perform high-frequency transmission test.

An optical module is an electronic device used for photoelectric or electro-optical conversion. During the manufacturing process, the optical module is often connected to a connector (cage) and the quality of the optical signal transmitted is tested at a standard temperature (e.g., 0°C and 70°C) to ensure the production quality of the optical module. However, the conventional connector completely covers the periphery of the optical module, resulting in poor heat dissipation. After high-temperature testing, it is necessary to wait for the connector and the optical module to cool down before low-temperature testing can be performed, which is time-consuming and leads to poor testing efficiency. There are shortcomings that need to be improved urgently.

Therefore, it is necessary to provide a novel and advanced high-frequency test connection module to solve the above problems.

The main purpose of the present invention is to provide a high-frequency test connection module with a simple structure and good heat dissipation effect.

To achieve the above-mentioned purpose, the present invention provides a high-frequency test connection module for installation in a testing device, comprising: a circuit substrate and a housing. The circuit substrate comprises at least one through hole; the housing is arranged on the circuit substrate and comprises a slot for inserting an optical module and a plurality of heat dissipation holes connected to the slot, and at least one of the plurality of heat dissipation holes is connected to the at least one through hole.

The following examples are merely used to illustrate possible implementations of the present invention, but are not intended to limit the scope of protection of the present invention. The "one" or "at least one" preceding the terms mentioned in the text does not limit the quantity, and it can also be "plural" according to needs. This change in quantity is also within the scope of protection, which should be explained in advance.

Please refer to FIGS. 1 to 8 , which show a preferred embodiment of the present invention. The high-frequency test connection module 1 of the present invention is provided in a testing device 2 and includes a circuit substrate 10 and a housing 20.

The circuit substrate 10 includes at least one through hole 11; the housing 20 is disposed on the circuit substrate 10 and includes a slot 21 for inserting an optical module and a plurality of heat dissipation holes 22 connected to the slot 21, and at least one of the plurality of heat dissipation holes 22 is connected to the at least one through hole 11 to improve the heat dissipation effect and thus improve the detection efficiency. The optical module is, for example but not limited to, a QSFP-DD module, an OSFP module, etc. The detection device 2 can, for example, control the temperature of the optical module by a cold and hot air supply device to achieve the required detection conditions.

In detail, the housing 20 further includes a first side wall 23 facing the circuit substrate 10, and the plurality of heat dissipation holes 22 include at least one first heat dissipation hole 221 disposed on the first side wall 23 and connected to the at least one through hole 11, so as to allow gas convection, and a good heat dissipation effect. The housing 20 further includes a second side wall 24 spaced opposite to the circuit substrate 10, and the plurality of heat dissipation holes 22 preferably further include at least one second heat dissipation hole 222 disposed on the second side wall 24, and the slot 21 includes a slot 211 for the optical module to pass through, and the at least one second heat dissipation hole 222 is disposed on one side of the second side wall 24 close to the slot 211 and corresponding to the at least one through hole 11, and has a good heat dissipation effect and structural strength and can maintain a good electromagnetic shielding effect. In this embodiment, the at least one through hole 11 is a circumferentially closed rectangular hole, and the distribution area of the rectangular hole is not less than 1/2 of the distribution area of the first heat dissipation hole 221, which effectively increases the contact area between the optical module and the air outside the housing 20 and conducts heat energy out of the housing 20. However, the at least one through hole can also be open to one side of the slot, which can be set according to the configuration requirements.

In other embodiments, the plurality of heat dissipation holes 22a may also include a plurality of the first heat dissipation holes 221, 221a and a plurality of the second heat dissipation holes 222a, and the housing 20a may also further include two third side walls 25 respectively connected between the first side wall 23a and the second side wall 24a, and each of the third side walls 25 may also be provided with a plurality of third heat dissipation holes 223 arranged in a matrix to increase heat convection and enhance the heat dissipation effect, as shown in Figures 9 and 10.

The high-frequency test connection module 1 further includes at least one heat dissipation unit 30. Each heat dissipation unit 30 includes a cooling chip 31 and a heat sink 32. The cooling chip 31 is disposed between the housing 20 and the heat sink 32 to quickly cool the optical module. Preferably, each heat dissipation unit 30 further includes a conductive member 33 sandwiched between the housing 20 and the cooling chip 31. The conductive member 33 is partially embedded in one of the housing 20 and the circuit substrate 10 and can contact the housing 20 or/and the optical module to increase heat conduction efficiency. Specifically, each cooling chip 31 includes a heat absorbing surface 311 and a heat dissipating surface 312 opposite to each other, wherein the heat absorbing surface 311 faces the housing 20, and the heat dissipating surface 312 faces the heat sink 32; at least one of the heat sink 32 and the conductive element 33 is connected to the cooling chip 31 by a heat conductive adhesive, and the heat conductive adhesive can fix the cooling chip 31 between the heat sink 32 and the conductive element 33, while providing a heat conduction effect.

In this embodiment, a heat sink 30 is disposed on two opposite sides of the circuit substrate 10, wherein the conductive member 33 of one heat sink 30 is provided with a first bump 331, and the conductive member 33 of the other heat sink 30 is provided with a second bump 332. The first bump 331 is embedded in the at least one through hole 11, and the second bump 332 is embedded in the at least one second heat sink hole 222, as shown in FIG. 6 and FIG. 7, which is convenient for positioning and assembly, and the second bump 332 can be provided for contacting the optical module, and the heat conduction effect is good. Preferably, the first protrusion 331 corresponds to the shape of the at least one through hole 11, and the second protrusion 332 corresponds to the shape of the at least one second heat dissipation hole 222, so that the positioning effect is better; the heat sink 32 and the conductive member 33 of each heat dissipation unit 30 are detachably connected to each other, thereby the at least one heat dissipation unit 30 can be modularized for easy disassembly, maintenance and replacement.

The high-frequency test connection module 1 further includes a first package 40 and a second package 50 that are detachably assembled. At least one accommodation space 60 is enclosed between the first package 40 and the second package 50. The circuit substrate 10 and the housing 20 are integrally accommodated in the accommodation space 60 to avoid unexpected collisions and ensure good assembly stability. Specifically, the first package 40 is provided with a plurality of lock holes 41, and a plurality of fasteners 51 penetrate the second package 50 and are locked to the plurality of lock holes 41, which is convenient for assembly, maintenance and replacement of internal components. By means of the first package 40 and the second package 50, the high-frequency test connection module 1 is conveniently installed on different detection devices 2.

Preferably, at least one of the first package 40 and the second package 50 is provided with a first air supply channel 42, 52, which is connected to the at least one accommodating space 60 and can be used to input a cooling gas from the outside, which can effectively help cool down and dissipate heat. A plurality of ventilation spaces 70 located on opposite sides of each of the accommodating spaces 60 are further constructed between the first package 40 and the second package 50. At least one of the first package 40 and the second package 50 is provided with a second air supply channel 53, which is connected to the plurality of ventilation spaces 70 and can be used to input a dry gas from the outside to avoid condensation of water vapor and maintain a suitable operating environment. In this embodiment, the first package 40 and the second package 50 are respectively provided with a first air supply channel 42, 52, thereby providing cooling gas to the heat dissipation unit 30 on two opposite sides of the circuit substrate 10, respectively, with good effect; each first air supply channel 42, 52 and each second air supply channel 53 are respectively provided in a branch pipe 42a, 52a, 53a, and these branch pipes 42a, 52a, 53a are detachably installed on the first package 40 and the second package 50.

In summary, with the high-frequency test connection module of the present invention, when high-frequency transmission testing is performed on the optical module at different temperatures, the configuration of the heat sink units, the housing, the first air supply channel and the second air supply channel helps to quickly cool down, has a simple structure and can effectively improve the testing efficiency.

1: High frequency test connection module 2: Detection device 10: Circuit board 11: Perforation 20, 20a: Housing 21: Slot 211: Notch 22, 22a: Heat dissipation hole 221, 221a: First heat dissipation hole 222, 222a: Second heat dissipation hole 223: Third heat dissipation hole 23, 23a: First side wall 24, 24a: Second side wall 25: Third side wall 30: Heat dissipation unit 31: Cooling chip 311: Heat absorption surface 312: Heat dissipation surface 32: Heat sink 33: Conductor 331: First bump 332: Second bump 40: First package 41: Lock hole 42, 52: First air supply channel 42a, 52a, 53a: Branch pipe 50: Second packaging component 51: Fastener 53: Second air supply channel 60: Accommodation space 70: Ventilation space

Figure 1 is an assembly diagram of a preferred embodiment of the present invention. Figure 2 is a three-dimensional diagram of a preferred embodiment of the present invention. Figure 3 is a partial exploded diagram of a preferred embodiment of the present invention. Figure 4 is a partial enlarged diagram of Figure 3. Figure 5 is an assembly diagram of a circuit substrate and a housing of a preferred embodiment of the present invention. Figure 6 is a cross-sectional view along the A-A end face of Figure 2. Figure 7 is a partial enlarged view of Figure 6. Figure 8 is a cross-sectional view along the B-B end face of Figure 2. Figure 9 is a three-dimensional diagram of a housing of another preferred embodiment of the present invention. Figure 10 is an assembly diagram of the housing of Figure 9 and a circuit substrate.

1: High frequency test connection module

20: Shell

30: Heat dissipation unit

40: First packaging part

50: Second packaging component

60: Storage space

Claims (9)

A high-frequency test connection module is provided for a detection device, comprising: a circuit substrate including at least one through hole; and a housing provided on the circuit substrate, comprising a slot for inserting an optical module and a plurality of heat dissipation holes connected to the slot, wherein at least one of the plurality of heat dissipation holes is connected to the at least one through hole; wherein the housing further comprises a first side wall facing the circuit substrate, and the plurality of heat dissipation holes comprises at least one first heat dissipation hole provided on the first side wall and connected to the at least one through hole. A high-frequency test connection module as described in claim 1, wherein the housing further includes a second side wall spaced opposite to the circuit substrate, the plurality of heat dissipation holes include at least one second heat dissipation hole disposed on the second side wall, the slot includes a slot for the optical module to be inserted, and the at least one second heat dissipation hole is disposed on a side of the second side wall that is relatively close to the slot and corresponds to the at least one through hole. The high-frequency test connection module as described in claim 1 further includes at least one heat dissipation unit, wherein each heat dissipation unit includes a cooling chip and a heat sink, and the cooling chip is arranged between the housing and the heat sink. As described in claim 3, the high-frequency test connection module, wherein each heat dissipation unit further includes a conductive member sandwiched between the housing and the cooling chip, and the conductive member is partially embedded in one of the housing and the circuit substrate. A high-frequency test connection module as described in claim 3, wherein a heat sink is provided on each of two opposite sides of the circuit substrate. The high-frequency test connection module as described in any one of claims 1 to 5 further comprises a first package and a second package that are detachably assembled, wherein at least one accommodation space is enclosed between the first package and the second package, and the circuit substrate and the housing are integrally accommodated in the accommodation space. A high-frequency test connection module as described in claim 6, wherein at least one of the first package and the second package is provided with a first air supply channel, the first air supply channel is connected to the at least one accommodating space and can be used to input a cooling gas from the outside. As described in claim 6, the high-frequency test connection module, wherein the first package and the second package further enclose a plurality of ventilation spaces located on opposite sides of each of the accommodating spaces, and at least one of the first package and the second package is provided with a second air supply channel, the second air supply channel is connected to the plurality of ventilation spaces and can be used to input a dry gas from the outside. A high-frequency test connection module as described in claim 4, wherein the housing further includes a second side wall spaced opposite to the circuit substrate, the plurality of heat dissipation holes include at least one second heat dissipation hole disposed on the second side wall, the slot includes a slot for the optical module to be inserted, the at least one second heat dissipation hole is disposed on a side of the second side wall that is relatively close to the slot and corresponds to the at least one through hole; the at least one through hole is a circumferentially closed rectangular hole, and the distribution area of the rectangular hole is not less than that of the first heat dissipation hole. The heat sink of each heat sink unit is detachably connected to the conductive member; at least one of the heat sink units and the conductive member is connected to the cooling chip by a heat conduction cross-connection. The cooling chip comprises a heat absorbing surface and a heat dissipating surface facing each other, the heat absorbing surface faces the housing, and the heat dissipating surface faces the heat sink; the high-frequency test connection module further comprises a first package and a second package which are detachably assembled, the first package and the second package enclose at least one accommodation space, the circuit substrate and the housing are integrally accommodated in the accommodation space; the first package and the second package are respectively provided with a first air supply channel, each of the first air supply channels The first package is connected to the at least one accommodating space and can be used to input a cooling gas from the outside; the first package and the second package are surrounded by a plurality of ventilation spaces located on two opposite sides of each of the accommodating spaces, and at least one of the first package and the second package is provided with a second air supply channel, the second air supply channel is connected to the plurality of ventilation spaces and can be used to input a dry gas from the outside; and the first package is provided with a plurality of lock holes, and a plurality of fasteners are passed through the second package and locked to the plurality of lock holes.

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