TWI856878B - Double-layer rack - Google Patents
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本發明係關於一種雙層機架,特別是一種可兼容多種網卡和資料處理器配置的雙層機架。 The present invention relates to a double-layer rack, in particular to a double-layer rack that is compatible with a variety of network cards and data processor configurations.
資料處理器(Data Processing Units,簡稱DPU)是一種在伺服器和儲存設備上使用的輔助運算裝置,其通常可分為I/O介面卡和運算型儲存裝置等兩大類型。I/O介面卡以擴充介面卡的形式為主,而運算型儲存裝置則主要為2.5吋SSD或PCIe SSD卡。這兩種類型各自具備不同的應用方向和特性。其中,I/O介面卡可進一步細分為智慧型網路卡、伺服器卸載處理器和運算型儲存控制器等類型。無論是哪種類型,它們基本上都是一張PCIe介面卡,內建嵌入式運算單元和高速網路埠,亦可以視為具有加速運算功能的網路卡。因此,所述I/O介面卡除了滿足基本的網路傳輸需求外,還能提供運算卸載功能。另一方面,運算型儲存控制器配備嵌入式運算單元和SSD,因此可以同時提供運算卸載服務和儲存功能。 Data Processing Units (DPUs) are auxiliary computing devices used in servers and storage devices. They can generally be divided into two types: I/O interface cards and computational storage devices. I/O interface cards are mainly in the form of expansion interface cards, while computational storage devices are mainly 2.5-inch SSDs or PCIe SSD cards. These two types each have different application directions and characteristics. Among them, I/O interface cards can be further divided into types such as smart network cards, server offload processors, and computational storage controllers. Regardless of the type, they are basically a PCIe interface card with a built-in embedded computing unit and a high-speed network port, and can also be regarded as a network card with accelerated computing capabilities. Therefore, in addition to meeting basic network transmission requirements, the I/O interface card can also provide computing offload functions. On the other hand, the computing storage controller is equipped with an embedded computing unit and SSD, so it can provide computing offload services and storage functions at the same time.
近年來,資料處理器的發展迅速,其卓越性能使其在越來越多的產品和相關應用中得到廣泛使用。因此,現今的2U伺服器通常整合有資料處理器,以提升運算和儲存能力。然而,由於每個使用者的需求各不相同,因此目前的資料處理器產品主要基於全高半長(FHHL)的PCIe卡,並配合大尺寸開放式運算(LFF OCP)網卡或小尺寸開放式運算(SFF OCP) 網卡等模組。但是,這種固定配置的方法導致實際的製造需要針對不同的產品進行設計和生產,甚至需要設立多條生產線,無法依據實際上的需求靈活的切換不同的模組。 In recent years, data processors have developed rapidly, and their excellent performance has made them widely used in more and more products and related applications. Therefore, today's 2U servers are usually integrated with data processors to improve computing and storage capabilities. However, since the needs of each user are different, current data processor products are mainly based on full-height half-length (FHHL) PCIe cards, and are combined with modules such as large-form-factor open computing (LFF OCP) network cards or small-form-factor open computing (SFF OCP) network cards. However, this fixed configuration method results in actual manufacturing requiring design and production for different products, and even requires the establishment of multiple production lines, and it is impossible to flexibly switch different modules according to actual needs.
本發明在於提供一種雙層機架,藉以解決先前技術中整合有資料處理器產品的伺服器無法依據實際上的需求靈活的切換不同模組的問題。 The present invention provides a double-layer rack to solve the problem in the prior art that servers integrated with data processor products cannot flexibly switch between different modules according to actual needs.
本發明之一實施例所揭露之雙層機架,包含一PCIe卡框架、一網卡框架、一PCIe轉接卡以及一網卡連接器組件。PCIe卡框架具有一PCIe組裝空間,用以容置一PCIe介面卡。PCIe卡框架固定疊設於網卡框架。網卡框架具有一網卡容置空間,用以選擇性地容置一個OCP網卡、兩個OCP網卡或一個資料處理器。PCIe轉接卡設置於PCIe組裝空間中,用以電性連接PCIe介面卡。網卡連接器組件設置於網卡容置空間中,用以電性連接所述一個OCP網卡、兩個OCP網卡或一個資料處理器。其中,雙層機架更包含一擋板件或一隔板,且擋板件與隔板可選擇性地裝卸於網卡框架並位於網卡容置空間中,使網卡容置空間形成相異的容置空間配置,以選擇性地容置所述一個OCP網卡、兩個OCP網卡或一個資料處理器。 The double-layer rack disclosed in one embodiment of the present invention includes a PCIe card frame, a network card frame, a PCIe adapter card and a network card connector assembly. The PCIe card frame has a PCIe assembly space for accommodating a PCIe interface card. The PCIe card frame is fixedly stacked on the network card frame. The network card frame has a network card accommodating space for selectively accommodating an OCP network card, two OCP network cards or a data processor. The PCIe adapter card is arranged in the PCIe assembly space for electrically connecting the PCIe interface card. The network card connector assembly is arranged in the network card accommodating space for electrically connecting the one OCP network card, two OCP network cards or a data processor. The double-layer rack further includes a baffle or a partition, and the baffle and the partition can be selectively installed and removed from the network card frame and located in the network card accommodating space, so that the network card accommodating space forms different accommodating space configurations to selectively accommodate the one OCP network card, two OCP network cards or a data processor.
根據上述實施例所揭露的雙層機架,透過將擋板件與隔板可選擇性地裝卸於網卡框架,使網卡容置空間形成多種的容置空間配置,以選擇性地容置一個OCP網卡、兩個OCP網卡或一個資料處理器。藉此,透過模具的共同性,可靈活地切換不同的模組以因應客戶的需求來調整產品的型態,並可降低產品的製造成本,以及減少人工操作運行維護的時間 和成本。 According to the double-layer rack disclosed in the above embodiment, the baffles and partitions can be selectively installed and removed from the network card frame, so that the network card storage space can form a variety of storage space configurations to selectively accommodate one OCP network card, two OCP network cards or one data processor. In this way, through the commonality of the mold, different modules can be flexibly switched to adjust the product type in response to customer needs, and the manufacturing cost of the product can be reduced, as well as the time and cost of manual operation and maintenance.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。 The above description of the content of the present invention and the following description of the implementation method are used to demonstrate and explain the principle of the present invention, and provide a further explanation of the scope of the patent application of the present invention.
1:雙層機架 1: Double rack
10:網卡框架 10: Network card framework
100:底板 100: Base plate
101:頂板 101: Top plate
102:側板 102: Side panels
1020:凸包 1020: convex hull
1021:止擋凸塊 1021: Stop bump
11:網卡連接器組件 11: Network card connector assembly
110:網卡連接器 110: Network card connector
12:PCIe卡框架 12: PCIe card framework
13:隔板 13: Partition
14:側導引件 14: Side guides
15:底部導引件 15: Bottom guide
16:支架 16: Bracket
17:擋板件 17: Baffle plate
6:資料處理器 6: Data processor
7:SFF OCP網卡 7:SFF OCP network card
8:LFF OCP網卡 8: LFF OCP network card
9:伺服器機殼 9: Server case
S1:網卡容置空間 S1: Network card storage space
SB:子空間 SB: Subspace
S2:PCIe組裝空間 S2: PCIe assembly space
F:螺絲 F: Screws
D1:插入方向 D1: Insertion direction
D2:高度方向 D2: Height direction
D3:寬度方向 D3: Width direction
O1:開口 O1: Opening
圖1為根據本發明之第一實施例所述之容置兩個LFF OCP網卡的雙層機架固定於伺服器機殼的立體示意圖。 FIG1 is a three-dimensional schematic diagram of a double-layer rack for accommodating two LFF OCP network cards fixed to a server chassis according to the first embodiment of the present invention.
圖2為圖1之雙層機架及LFF OCP網卡的爆炸示意圖。 Figure 2 is an exploded view of the double-layer rack and LFF OCP network card in Figure 1.
圖3為圖1之雙層機架的立體示意圖。 Figure 3 is a three-dimensional schematic diagram of the double-layer rack in Figure 1.
圖4為圖3之雙層機架沿剖切線4-4的剖切示意圖。 Figure 4 is a schematic cross-sectional view of the double-layer rack in Figure 3 along the cross-sectional line 4-4.
圖5為根據本發明之第二實施例所述之容置兩個SFF OCP網卡的雙層機架的立體示意圖。 FIG5 is a three-dimensional schematic diagram of a double-layer rack accommodating two SFF OCP network cards according to the second embodiment of the present invention.
圖6為圖5之雙層機架及SFF OCP網卡的爆炸示意圖。 Figure 6 is an exploded diagram of the double-layer rack and SFF OCP network card in Figure 5.
圖7為根據本發明之第三實施例所述之容置一個LFF OCP網卡的雙層機架的立體示意圖。 FIG7 is a three-dimensional schematic diagram of a double-layer rack accommodating an LFF OCP network card according to the third embodiment of the present invention.
圖8為圖7之雙層機架及LFF OCP網卡的爆炸示意圖。 Figure 8 is an exploded diagram of the double-layer rack and LFF OCP network card in Figure 7.
圖9為根據本發明之第四實施例所述之容置一個SFF OCP網卡的雙層機架的立體示意圖。 FIG9 is a three-dimensional schematic diagram of a double-layer rack accommodating an SFF OCP network card according to the fourth embodiment of the present invention.
圖10為圖9之雙層機架及SFF OCP網卡的爆炸示意圖。 Figure 10 is an exploded diagram of the double-layer rack and SFF OCP network card in Figure 9.
圖11根據本發明之第五實施例所述之容置一個資料處理器的雙層機架的立體示意圖。 FIG11 is a three-dimensional schematic diagram of a double-layer rack accommodating a data processor according to the fifth embodiment of the present invention.
圖12為圖11之雙層機架及資料處理器的爆炸示意圖。 Figure 12 is an exploded diagram of the double-layer rack and data processor in Figure 11.
以下在實施方式中詳細敘述本發明之實施例之詳細特徵以及優點,其內容足以使任何本領域中具通常知識者了解本發明之實施例之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何本領域中具通常知識者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。 The detailed features and advantages of the embodiments of the present invention are described in detail in the following implementation method. The content is sufficient to enable any person with ordinary knowledge in the field to understand the technical content of the embodiments of the present invention and implement it accordingly. According to the content disclosed in this specification, the scope of the patent application and the drawings, any person with ordinary knowledge in the field can easily understand the relevant purposes and advantages of the present invention. The following embodiments are to further illustrate the viewpoints of the present invention, but do not limit the scope of the present invention by any viewpoint.
請參閱圖1至圖4,圖1為根據本發明之第一實施例所述之容置兩個LFF OCP網卡的雙層機架固定於伺服器機殼的立體示意圖,圖2為圖1之雙層機架及LFF OCP網卡的爆炸示意圖,圖3為圖1之雙層機架的立體示意圖,且圖4為圖3之雙層機架沿剖切線4-4的剖切示意圖。 Please refer to Figures 1 to 4. Figure 1 is a three-dimensional schematic diagram of a double-layer rack accommodating two LFF OCP network cards fixed to a server chassis according to the first embodiment of the present invention. Figure 2 is an exploded schematic diagram of the double-layer rack and the LFF OCP network card of Figure 1. Figure 3 is a three-dimensional schematic diagram of the double-layer rack of Figure 1. Figure 4 is a cross-sectional schematic diagram of the double-layer rack of Figure 3 along the cross-sectional line 4-4.
雙層機架1適於固定於一伺服器機殼9,且雙層機架1可例如具有五種容置空間配置,用以選擇性地容置兩個LFF OCP網卡8、兩個SFF OCP網卡7、一個LFF OCP網卡8、一個SFF OCP網卡7或一個資料處理器6。本揭示透過第一至第五實施例說明上述的五種容置空間配置。以下首先以第一實施例說明雙層機架1的其中一種容置空間配置,用以容置兩個LFF OCP網卡8。
The double-
雙層機架1包含一網卡框架10、一網卡連接器組件11、一PCIe卡框架12、一PCIe轉接卡(未繪示)、一隔板13、兩個側導引件14以及兩個底部導引件15。
The double-
網卡框架10具有一網卡容置空間S1,用以選擇性地容置一
個OCP網卡、兩個OCP網卡或一個資料處理器6。詳細來說,網卡框架10包含一底板100、一頂板101以及兩個側板102,其中底板100與頂板101相對設置,底板100的相對兩側分別透過兩個側板102連接於頂板101的相對兩側,且底板100、頂板101與兩個側板102共同圍繞網卡容置空間S1。在本實施例中,網卡容置空間S1係用以容置兩個LFF OCP網卡8。
The
網卡連接器組件11包含兩個網卡連接器110,且這兩個網卡連接器110皆位於網卡容置空間S1中,分別用以電性連接這兩個LFF OCP網卡8。
The network
PCIe卡框架12可透過螺絲固定並疊設於網卡框架10,且PCIe卡框架12具有一PCIe組裝空間S2,用以容置一個或多個PCIe介面卡(未繪示)。
The
PCIe轉接卡設置於PCIe卡框架12,用以電性連接PCIe介面卡。
The PCIe adapter card is disposed in the
如圖4所示,網卡框架10的這兩個側板102各自可具有位於網卡容置空間S1中的多個凸包1020以及一止擋凸塊1021。各側板102上的這些凸包1020沿網卡容置空間S1的一插入方向D1排列設置,且這些凸包1020用以承載並導引隔板13沿插入方向D1移動。止擋凸塊1021位於這些凸包1020的一側,用以抵頂隔板13並在插入方向D1上止擋隔板13。
As shown in FIG. 4 , the two
隔板13位於網卡容置空間S1中並可拆卸地的固定於網卡框架10,且隔板13將網卡容置空間S1分隔為兩個子空間SB,以分別容
置這兩個LFF OCP網卡8。其中,這兩個LFF OCP網卡8在網卡容置空間S1的一高度方向D2上堆疊排列。
The
在組裝隔板13時,可將隔板13沿一插入方向D1插入網卡容置空間S1,並透過凸包1020導引隔板13在網卡容置空間S1中的滑動方向,接著,藉由止擋凸塊1021對隔板13在插入方向D1上的止擋,可定位隔板13在網卡容置空間S1中的位置。最後,隔板13可透過螺絲F固定於網卡框架10。
When assembling the
這兩個側導引件14可透過螺絲F固定於其中一側板102並沿插入方向D1延伸,且這兩個側導引件14分別位於網卡容置空間S1的這兩個子空間SB中。這兩個底部導引件15可透過螺絲F分別固定於底板100及隔板13並沿插入方向D1延伸,且這兩個底部導引件15分別位於網卡容置空間S1的這兩個子空間SB中。其中,位於同一個子空間SB中的側導引件14與底部導引件15用以共同承載並導引其中一個LFF OCP網卡8沿插入方向D1滑動。
The two side guides 14 can be fixed to one of the
在本實施例中,網卡連接器組件11的這兩個網卡連接器110可透過螺絲F分別固定於底板100及隔板13,且這兩個網卡連接器110分別位於網卡容置空間S1的這兩個子空間SB中,分別用以電性連接這兩個LFF OCP網卡8。
In this embodiment, the two
在安裝這兩個LFF OCP網卡8時,可將這兩個LFF OCP網卡8沿插入方向D1分別插入網卡容置空間S1的這兩個子空間SB中,並透過側導引件14與底部導引件15共同導引LFF OCP網卡8在網卡容置空間S1中的滑動方向,使這兩個LFF OCP網卡8分別與這兩個網卡連
接器110對接。
When installing the two LFF
在本實施例中,PCIe組裝空間S2的高度例如為1U,網卡容置空間S1的高度例如為1U,且單一LFF OCP網卡8的高度例如小於網卡容置空間S1的高度的一半。
In this embodiment, the height of the PCIe assembly space S2 is, for example, 1U, the height of the network card accommodation space S1 is, for example, 1U, and the height of a single LFF
在本實施例中,這兩個側板102皆具有止擋凸塊1021,但本發明不以此為限。在其他實施例中,可僅有一個側板具有止擋凸塊。
In this embodiment, both
請參閱圖5和圖6,圖5為根據本發明之第二實施例所述之容置兩個SFF OCP網卡的雙層機架的立體示意圖,且圖6為圖5之雙層機架及SFF OCP網卡的爆炸示意圖。 Please refer to Figures 5 and 6. Figure 5 is a three-dimensional schematic diagram of a double-layer rack accommodating two SFF OCP network cards according to the second embodiment of the present invention, and Figure 6 is an exploded schematic diagram of the double-layer rack and SFF OCP network card of Figure 5.
在第二實施例中,雙層機架1為另一種容置空間配置,用以容置兩個SFF OCP網卡7。
In the second embodiment, the double-
在本實施例的配置中,雙層機架1更包含兩個支架16,這兩個支架16分別用以連接於這兩個SFF OCP網卡7並分別與這兩個SFF OCP網卡7共同容置於網卡容置空間S1的這兩個子空間SB中,且彼此連接的支架16與SFF OCP網卡7在網卡容置空間S1的一寬度方向D3上並排設置。換句話說,其中一組彼此連接的支架16與SFF OCP網卡7共同容置於其中一個子空間SB中,而另一組彼此連接的支架16與SFF OCP網卡7共同容置於另一個子空間SB中。其中,這兩個SFF OCP網卡7在網卡容置空間S1的高度方向D2上堆疊排列,且這兩個SFF OCP網卡7分別與網卡連接器組件11的這兩個網卡連接器110電性連接。
In the configuration of this embodiment, the double-
在安裝這兩個SFF OCP網卡7時,可將這兩個SFF OCP網卡7及這兩個支架16沿插入方向D1分別插入網卡容置空間S1的這兩個
子空間SB中,並透過側導引件14與底部導引件15共同導引SFF OCP網卡7在網卡容置空間S1中的滑動方向,使這兩個SFF OCP網卡7分別與這兩個網卡連接器110對接。
When installing the two SFF
透過在SFF OCP網卡7的一側固定連接有支架16,使彼此連接的SFF OCP網卡7和支架16的總寬度可匹配於網卡容置空間S1的寬度。藉此,在安裝SFF OCP網卡7時,支架16遠離SFF OCP網卡7的一側可承靠於側導引件14,而SFF OCP網卡7遠離支架16的一側可承靠於底部導引件15,以確保SFF OCP網卡7和支架16在插入網卡容置空間S1的過程中,可同時受到側導引件14和底部導引件15的導引及承載。
By fixing the
在本實施例中,PCIe組裝空間S2的高度例如為1U,網卡容置空間S1的高度例如為1U,且單一SFF OCP網卡7的高度例如小於網卡容置空間S1的高度的一半。
In this embodiment, the height of the PCIe assembly space S2 is, for example, 1U, the height of the network card accommodation space S1 is, for example, 1U, and the height of a single SFF
請參閱圖7和圖8,圖7為根據本發明之第三實施例所述之容置一個LFF OCP網卡的雙層機架的立體示意圖,且圖8為圖7之雙層機架及LFF OCP網卡的爆炸示意圖。 Please refer to Figures 7 and 8. Figure 7 is a three-dimensional schematic diagram of a double-layer rack accommodating an LFF OCP network card according to the third embodiment of the present invention, and Figure 8 is an exploded schematic diagram of the double-layer rack and the LFF OCP network card in Figure 7.
在第三實施例中,雙層機架1為另一種容置空間配置,用以容置一個LFF OCP網卡8。
In the third embodiment, the double-
在本實施例的配置中,雙層機架1更包含一擋板件17而不包含前述第一實施例的隔板13,且側導引件14、底部導引件15和網卡連接器110的數量皆為一個。亦即,雙層機架1透過選擇性地在網卡框架10上裝設擋板件17,並將隔板13自網卡框架10卸除(即不裝設隔板13),可形成用以容置一個LFF OCP網卡8的容置空間配置。此外,用以導引LFF
OCP網卡8的側導引件14和底部導引件15以及用以與LFF OCP網卡8電性連接的網卡連接器110亦對應此容置空間配置而適應性地調整成相對應的數量。
In the configuration of this embodiment, the double-
擋板件17可透過螺絲F固定於網卡框架10並遮擋部分網卡容置空間S1的開口O1,且擋板件17在網卡容置空間S1的高度方向D2上用以與LFF OCP網卡8堆疊排列。藉此,擋板件17可提供防塵的效果。
The
在本實施例中,網卡連接器110與底部導引件15係固定於底板100。
In this embodiment, the
在安裝這一個LFF OCP網卡8時,可將LFF OCP網卡8沿插入方向D1插入網卡容置空間S1中,並透過側導引件14與底部導引件15共同導引LFF OCP網卡8在網卡容置空間S1中的滑動方向,使LFF OCP網卡8與網卡連接器110對接。
When installing this LFF
請參閱圖9和圖10,圖9為根據本發明之第四實施例所述之容置一個SFF OCP網卡的雙層機架的立體示意圖,且圖10為圖9之雙層機架及SFF OCP網卡的爆炸示意圖。 Please refer to Figures 9 and 10. Figure 9 is a three-dimensional schematic diagram of a double-layer rack accommodating an SFF OCP network card according to the fourth embodiment of the present invention, and Figure 10 is an exploded schematic diagram of the double-layer rack and the SFF OCP network card of Figure 9.
在第四實施例中,雙層機架1為另一種容置空間配置,用以容置一個SFF OCP網卡7。
In the fourth embodiment, the double-
本實施例的容置空間配置與第三實施例的容置空間配置類似,其差異在於本實施例的雙層機架1更包含一支架16,用以連接於這一個SFF OCP網卡7並與這一個SFF OCP網卡7共同容置於網卡容置空間S1中。其中,支架16與SFF OCP網卡7在網卡容置空間S1的寬度方向D3上並排設置。
The storage space configuration of this embodiment is similar to that of the third embodiment, the difference being that the double-
擋板件17在網卡容置空間S1的高度方向D2上用以與SFF OCP網卡7堆疊排列。藉此,擋板件17可提供防塵的效果。
The
在安裝這一個SFF OCP網卡7時,可將SFF OCP網卡7沿插入方向D1插入網卡容置空間S1中,並透過側導引件14與底部導引件15共同導引支架16和SFF OCP網卡7在網卡容置空間S1中的滑動方向,使SFF OCP網卡7與網卡連接器110對接。
When installing this SFF
請參閱圖11和圖12,圖11根據本發明之第五實施例所述之容置一個資料處理器的雙層機架的立體示意圖,且圖12為圖11之雙層機架及資料處理器的爆炸示意圖。 Please refer to Figures 11 and 12. Figure 11 is a three-dimensional schematic diagram of a double-layer rack accommodating a data processor according to the fifth embodiment of the present invention, and Figure 12 is an exploded schematic diagram of the double-layer rack and the data processor of Figure 11.
在第五實施例中,雙層機架1為另一種容置空間配置,用以容置一個資料處理器6。
In the fifth embodiment, the double-
在本實施例的配置中,雙層機架1不包含前述實施例的隔板13和擋板件17,且側導引件14、底部導引件15和網卡連接器110的數量皆為一個。亦即,雙層機架1透過選擇性地將隔板13和擋板件17自網卡框架10卸除(即不裝設隔板13和擋板件17),可形成用以容置一個資料處理器6的容置空間配置。此外,用以導引資料處理器6的側導引件14和底部導引件15以及用以與資料處理器6電性連接的網卡連接器110亦對應此容置空間配置而適應性地調整成相對應的數量。
In the configuration of this embodiment, the double-
在本實施例中,網卡連接器110與底部導引件15係固定於底板100。
In this embodiment, the
在安裝這一個資料處理器6時,可將資料處理器6沿插入方向D1插入網卡容置空間S1中,並透過側導引件14與底部導引件15共同
導引資料處理器6在網卡容置空間S1中的滑動方向,使資料處理器6與網卡連接器110對接。
When installing this
根據上述實施例之雙層機架,透過將擋板件與隔板可選擇性地裝卸於網卡框架,使網卡容置空間形成多種的容置空間配置,以選擇性地容置一個OCP網卡、兩個OCP網卡或一個資料處理器。藉此,透過模具的共同性,可靈活地切換不同的模組以因應客戶的需求來調整產品的型態,並可降低產品的製造成本,以及減少人工操作運行維護的時間和成本。 According to the double-layer rack of the above embodiment, the baffles and partitions can be selectively installed and removed from the network card frame, so that the network card storage space can form a variety of storage space configurations to selectively accommodate one OCP network card, two OCP network cards or one data processor. In this way, through the commonality of the mold, different modules can be flexibly switched to adjust the product type in response to customer needs, and the manufacturing cost of the product can be reduced, as well as the time and cost of manual operation and maintenance.
雖然本發明以前述之較佳實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the present invention is disclosed as above with the aforementioned preferred embodiment, it is not used to limit the present invention. Anyone familiar with similar techniques can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.
10:網卡框架 10: Network card framework
100:底板 100: Base plate
101:頂板 101: Top plate
102:側板 102: Side panels
1020:凸包 1020: convex hull
1021:止擋凸塊 1021: Stop bump
11:網卡連接器組件 11: Network card connector assembly
110:網卡連接器 110: Network card connector
12:PCIe卡框架 12: PCIe card framework
13:隔板 13: Partition
14:側導引件 14: Side guides
15:底部導引件 15: Bottom guide
8:LFF OCP網卡 8: LFF OCP network card
S1:網卡容置空間 S1: Network card storage space
S2:PCIe組裝空間 S2: PCIe assembly space
F:螺絲 F: Screws
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112144414A TWI856878B (en) | 2023-11-17 | 2023-11-17 | Double-layer rack |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112144414A TWI856878B (en) | 2023-11-17 | 2023-11-17 | Double-layer rack |
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| TWI856878B true TWI856878B (en) | 2024-09-21 |
| TW202523031A TW202523031A (en) | 2025-06-01 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108334172A (en) * | 2018-03-30 | 2018-07-27 | 无锡睿勤科技有限公司 | A kind of cabinet |
| CN114258233A (en) * | 2020-09-22 | 2022-03-29 | 戴尔产品有限公司 | Hybrid oil immersion server and associated computer rack |
| CN115348791A (en) * | 2022-09-13 | 2022-11-15 | 上海顺诠科技有限公司 | Multi-network card compatible double-layer rack |
| TW202312843A (en) * | 2021-09-10 | 2023-03-16 | 英業達股份有限公司 | Server and casing thereof |
| TW202324856A (en) * | 2021-12-02 | 2023-06-16 | 美商英特爾公司 | Back interface for rack shelf |
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2023
- 2023-11-17 TW TW112144414A patent/TWI856878B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108334172A (en) * | 2018-03-30 | 2018-07-27 | 无锡睿勤科技有限公司 | A kind of cabinet |
| CN114258233A (en) * | 2020-09-22 | 2022-03-29 | 戴尔产品有限公司 | Hybrid oil immersion server and associated computer rack |
| TW202312843A (en) * | 2021-09-10 | 2023-03-16 | 英業達股份有限公司 | Server and casing thereof |
| TW202324856A (en) * | 2021-12-02 | 2023-06-16 | 美商英特爾公司 | Back interface for rack shelf |
| CN115348791A (en) * | 2022-09-13 | 2022-11-15 | 上海顺诠科技有限公司 | Multi-network card compatible double-layer rack |
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| TW202523031A (en) | 2025-06-01 |
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