TWI856721B - Magnetic Component Shielding Methods - Google Patents
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Abstract
一種磁性元件屏蔽方法,其包括將一磁性元件之複數接腳部做遮蔽;在磁性元件之表面噴塗一導電漆層;及移除各接腳部之遮蔽。本發明以簡單的噴塗方式製作磁性元件外側的屏蔽,讓覆蓋著磁性元件全體的導電漆層作為屏蔽,比起習知屏蔽方式容易製作且不易留下可能漏出磁場的縫隙。本發明並提供一種具有屏蔽的磁性元件結構。 A magnetic element shielding method includes shielding a plurality of pins of a magnetic element; spraying a conductive paint layer on the surface of the magnetic element; and removing the shielding of each pin. The present invention uses a simple spraying method to make the shielding of the outer side of the magnetic element, so that the conductive paint layer covering the entire magnetic element is used as a shield. Compared with the known shielding method, it is easier to make and is less likely to leave gaps that may leak magnetic fields. The present invention also provides a magnetic element structure with shielding.
Description
本發明是有關於一種磁性元件的屏蔽製作方法,特別是一種以噴塗導電漆來製作外部屏蔽的磁性元件屏蔽方法。 The present invention relates to a method for manufacturing a shield for a magnetic component, in particular, a method for manufacturing a shield for a magnetic component by spraying conductive paint to manufacture an external shield.
在科技發達的時代,各種電子裝置皆追求小型化與極致電路板功率密度的狀況下,電路板的電子零件的間距不斷縮小,而有許多元件是利用磁場的原理來作動,例如電感、變壓器等等磁性元件,此類的磁性元件會釋放磁場到元件周圍(也就是電磁干擾,Electromagnetic Interference),在近距離時會影響了其他元件的工作狀態,在要求高穩定性的應用中(例如車用電子)必須非常注意電磁干擾的影響。 In the era of advanced technology, various electronic devices are pursuing miniaturization and extreme circuit board power density. The spacing of electronic components on circuit boards is constantly shrinking. Many components are activated by the principle of magnetic fields, such as inductors, transformers and other magnetic components. Such magnetic components will release magnetic fields to the surrounding components (that is, electromagnetic interference). When they are close to each other, they will affect the working status of other components. In applications that require high stability (such as automotive electronics), the impact of electromagnetic interference must be paid great attention.
故有出現了一種具有屏蔽的電感器,如我國專利公告號TWI734771中揭露了一種在電感本體外側再加上一外殼作為屏蔽,但由於模鑄電感本身的材料特性,壓模鑄造後的外型尺寸容易出現些許公差,此時若要與預先製作的外殼結合容易出現空隙無法密合;且若在結合時對外殼施加過大壓力來夾合電感本體,也有可能會損壞了電感本體;外殼也難以加工到可以完整覆蓋電感本體的複雜形狀,通常如上述習知專利的代表圖(圖4)一般,會在角落留下空隙便於彎折加工。故屏蔽與電感本體之間的密合度、覆蓋度有進一步改良的空間。 Therefore, a shielded inductor has emerged. For example, Taiwan's patent announcement number TWI734771 discloses a shielding method in which a shell is added to the outside of the inductor body. However, due to the material properties of the die-cast inductor itself, the external dimensions after die-casting are prone to some tolerances. At this time, if it is combined with the pre-made shell, it is easy to have gaps and cannot be tightly fitted; and if too much pressure is applied to the shell to clamp the inductor body during the combination, it may also damage the inductor body; the shell is also difficult to process into a complex shape that can completely cover the inductor body. Usually, as shown in the representative figure of the above-mentioned known patent (Figure 4), there will be gaps in the corners to facilitate bending processing. Therefore, there is room for further improvement in the tightness and coverage between the shield and the inductor body.
有鑑於此,本發明人乃潛心研思、設計組製,期能提供一種能完整屏蔽磁性元件又容易加工的磁性元件屏蔽方法及具有屏蔽的磁性元件,即為本發明所欲研創之發明動機者。 In view of this, the inventor of the present invention has devoted himself to research and design, hoping to provide a magnetic element shielding method and a magnetic element with shielding that can completely shield the magnetic element and is easy to process, which is the motivation for the invention.
本發明之主要目的,即在提供一種磁性元件屏蔽方法及具有屏蔽的磁性元件,使用噴塗導電漆的方式製作屏蔽,可以讓磁性元件被屏蔽完整包覆。 The main purpose of the present invention is to provide a magnetic element shielding method and a magnetic element with shielding, and to use a method of spraying conductive paint to make the shielding so that the magnetic element can be completely shielded and covered.
本發明之磁性元件屏蔽方法,其包括有將一磁性元件之複數接腳部做遮蔽;在磁性元件之表面噴塗一導電漆層;及移除各接腳部之遮蔽。如此一來便完成了屏蔽的製作。導電漆可為金屬系導電漆,例如內含銀粒子、銅粒子或是鍍銀銅粒子的導電漆。 The magnetic element shielding method of the present invention includes shielding a plurality of pins of a magnetic element; spraying a conductive paint layer on the surface of the magnetic element; and removing the shielding of each pin. In this way, the shielding is completed. The conductive paint can be a metal conductive paint, such as a conductive paint containing silver particles, copper particles, or silver-plated copper particles.
噴塗於磁性元件外側的導電漆層可以形成一完整無縫隙的屏蔽,將磁場洩漏的可能性降到最低;而且可以藉由增加導電漆層的厚度來增加屏蔽效果,以滿足各種不同場合的需求。 The conductive paint layer sprayed on the outside of the magnetic component can form a complete and seamless shield, minimizing the possibility of magnetic field leakage; and the shielding effect can be increased by increasing the thickness of the conductive paint layer to meet the needs of various occasions.
若是磁性元件表面不適合與會導電的導電漆層直接接觸,在將磁性元件之接腳部做遮蔽之後,可在磁性元件之表面上噴塗一絕緣塗層,再進行噴塗導電漆層。若磁性元件的表面已設有接地端點,則在噴塗絕緣塗層時需要對接地端點進行遮蔽,絕緣塗層完成之後再移除接地端點的遮蔽。 If the surface of the magnetic component is not suitable for direct contact with the conductive paint layer, after masking the pins of the magnetic component, you can spray an insulating coating on the surface of the magnetic component, and then spray the conductive paint layer. If the surface of the magnetic component has a grounding terminal, the grounding terminal needs to be masked when spraying the insulating coating, and the shielding of the grounding terminal is removed after the insulating coating is completed.
由於屏蔽必須接地,若是磁性元件的表面未設有接地端點,可在噴塗導電漆層之前,於磁性元件之表面上設至少一接地片。如此一來噴塗完導電漆層之後,導電漆層自然與接地片產生電性連接,可以將導電漆層做接地。由於導電漆層可以完整包覆磁性元件,接地片可以設於最接近接地點的表面即可,接地片無須像習知技術中的屏蔽由頂面一路向下延伸。若要同時設置絕緣塗層及接地片,可先塗布絕緣塗層再設置接地片,因為接地片無須與本體導電。也可以先設置接地片,然後遮蔽接地片再進行設置絕緣塗層,設置絕緣塗層後再移除接地片的遮蔽。或是在於導電漆層之表面上噴塗一保護漆層之前,先在至少一預定位置對導電漆層進行遮蔽,在於導電漆層之表面上噴塗一保護漆層之後,移除導電漆層之遮蔽,再於導電漆層電鍍製作至少一接地電極。Since the shield must be grounded, if there is no grounding terminal on the surface of the magnetic component, at least one grounding plate can be set on the surface of the magnetic component before spraying the conductive paint layer. In this way, after spraying the conductive paint layer, the conductive paint layer will naturally be electrically connected to the grounding plate, and the conductive paint layer can be grounded. Since the conductive paint layer can completely cover the magnetic component, the grounding plate can be set on the surface closest to the grounding point, and the grounding plate does not need to extend from the top all the way down like the shield in the known technology. If you want to set up the insulating coating and the grounding plate at the same time, you can apply the insulating coating first and then set the grounding plate, because the grounding plate does not need to be conductive to the body. Alternatively, a grounding plate may be provided first, and then the insulating coating may be provided after the grounding plate is shielded, and the shielding of the grounding plate may be removed after the insulating coating is provided. Alternatively, before a protective paint layer is sprayed on the surface of the conductive paint layer, the conductive paint layer may be shielded at at least one predetermined position, and after the protective paint layer is sprayed on the surface of the conductive paint layer, the shielding of the conductive paint layer may be removed, and then at least one grounding electrode may be produced by electroplating on the conductive paint layer.
若要防止導電漆層的氧化,可在噴塗導電漆層之後,於導電漆層之表面上噴塗一保護漆層。若有需要在噴塗保護漆層時可以對接地片或是磁性元件原有的接地端點進行遮蔽避免保護漆層覆蓋接地片或是磁性元件原有的接地端點。To prevent oxidation of the conductive paint layer, a protective paint layer can be sprayed on the surface of the conductive paint layer after spraying the conductive paint layer. If necessary, the grounding plate or the original grounding terminal of the magnetic component can be shielded when spraying the protective paint layer to prevent the protective paint layer from covering the grounding plate or the original grounding terminal of the magnetic component.
本發明之具有屏蔽的磁性元件包括:一磁性元件,其包含一本體及複數接腳部;及一導電漆層,其設於磁性元件之表面,導電漆層與各接腳部之間為絕緣狀態。The shielded magnetic element of the present invention comprises: a magnetic element, which comprises a body and a plurality of pins; and a conductive paint layer, which is arranged on the surface of the magnetic element, and the conductive paint layer and each pin are in an insulated state.
在一實施例中,進一步在本體與導電漆層之間有一絕緣塗層。In one embodiment, an insulating coating layer is further provided between the main body and the conductive paint layer.
在一實施例中,進一步在本體設有至少一接地片,接地片與導電漆層電性連接。In one embodiment, at least one grounding plate is further provided on the main body, and the grounding plate is electrically connected to the conductive paint layer.
在一實施例中,進一步在導電漆層之外側有一保護漆層。In one embodiment, there is further a protective paint layer outside the conductive paint layer.
在一實施例中,保護漆層在至少一預定位置有開孔,導電漆層在對應開孔之位置設有至少一接地電極。In one embodiment, the protective paint layer has an opening at at least one predetermined position, and the conductive paint layer has at least one grounding electrode at a position corresponding to the opening.
為了能夠更進一步瞭解本發明之特徵、特點和技術內容,請參閱以下有關本發明之詳細說明。In order to further understand the features, characteristics and technical contents of the present invention, please refer to the following detailed description of the present invention.
請參閱第一圖至第四圖,揭示本發明實施方式的圖例中,由上述圖式說明本發明之一種磁性元件屏蔽方法之實施例(一),其包括將一磁性元件1之複數接腳部11做遮蔽(S1);在磁性元件1之表面上噴塗一絕緣塗層2(S1A);於磁性元件1之表面上設至少一接地片12(S1B);在磁性元件1之表面噴塗一導電漆層3(S2);在導電漆層3之表面上噴塗一保護漆層4(S2A);移除各接腳部11之遮蔽(S3)。本實施例(一)中的磁性元件1為一模製電感,磁性元件1亦可為變壓器等會對外散發出磁場的磁性元件1。Please refer to the first to fourth figures, which disclose the examples of the implementation of the present invention. The above figures illustrate an implementation (I) of a magnetic element shielding method of the present invention, which includes shielding a plurality of
本實施例(一)中,導電漆層3為金屬系導電漆,例如內含銀粒子、銅粒子或是鍍銀銅粒子的導電漆層3。以往導電漆層3常用在塑料外殼的內表面作為屏蔽,本發明則是將導電漆層3直接施加到磁性元件1的外表面作為屏蔽。In the present embodiment (I), the
而本發明之具有屏蔽的磁性元件之實施例(一)包括:一磁性元件1,其包含一本體13及複數接腳部11;及一導電漆層3,其設於磁性元件1之表面,導電漆層3與各接腳部11之間為絕緣狀態,第二圖中可以看到因為在噴塗導電漆層3時各接腳部11是被遮蔽的,各接腳部11並未接觸到導電漆層3,所以導電漆層3與各接腳部11之間為絕緣狀態。本實施例(一)進一步在本體13與導電漆層3之間有一絕緣塗層2;本實施例(一)進一步在本體13設有至少一接地片12(圖中為兩個接地片12),接地片12與導電漆層3電性連接;本實施例(一)進一步在導電漆層3之外側有一保護漆層4。The embodiment (I) of the shielded magnetic element of the present invention comprises: a
噴塗於磁性元件1外側的導電漆層3可以形成一完整無縫隙的屏蔽於本體13之外表面,不像習知的屏蔽外殼在加工時容易留下空隙(例如角落),本實施例(一)中本體13為長方體,本體13的六面皆可以噴塗導電漆層3,將磁場洩漏的可能性降到最低。且噴漆的方式容易對應到各種複雜起伏的磁性元件1外表面,若是要用機械加工的外殼來對應複雜起伏,加工成本會大幅增加。本發明可以藉由增加導電漆層3的厚度來增加屏蔽效果,以滿足各種不同場合的需求,機械加工的外殼要加厚時則會有不易彎折加工的問題。The
本發明之磁性元件屏蔽方法之實施例(一)中為了對應不適合與導電的導電漆層3直接接觸的磁性元件1之本體13,在將一磁性元件1之複數接腳部11做遮蔽(S1)之後,進行在磁性元件1之表面上噴塗一絕緣塗層2(S1A)。而若磁性元件1的表面已設有接地端點(未繪製),則在噴塗絕緣塗層2時需要對接地端點(未繪製)進行遮蔽,絕緣塗層完成之後再移除接地端點(未繪製)的遮蔽。In the embodiment (1) of the magnetic element shielding method of the present invention, in order to correspond to the body 13 of the
由於屏蔽必須接地,本實施例(一)為了對應表面未設有接地端點(未繪製)的磁性元件1,在磁性元件1之表面噴塗一導電漆層3(S2)之前,進行於磁性元件1之表面上設至少一接地片12(S1B)。如此一來噴塗完導電漆層3之後,導電漆層3自然與接地片12產生電性連接,可以將導電漆層3做接地。由於導電漆層3可以完整包覆磁性元件1之本體13,接地片12可以設於最接近接地點的表面即可(本實施例(一)中為側面或底面),接地片12無須像習知技術中的屏蔽由頂面一路向下延伸。本實施例(一)中同時設置絕緣塗層2及接地片12,可先塗布絕緣塗層2再設置接地片12,因為接地片12無須與本體13導電。也可以先設置接地片12,然後遮蔽接地片12再進行設置絕緣塗層2,設置絕緣塗層2後再移除接地片12的遮蔽。Since the shield must be grounded, in order to correspond to the
本實施例(一)中為了防止導電漆層3的氧化,在磁性元件1之表面噴塗一導電漆層3(S2)之後,進行在導電漆層3之表面上噴塗一保護漆層4(S2A)。若有需要在噴塗保護漆層4時可以對接地片12或是磁性元件1原有的接地端點(未繪製)進行遮蔽避免保護漆層4覆蓋接地片12或是磁性元件1原有的接地端點(未繪製)。In this embodiment (I), in order to prevent oxidation of the
在第五圖可以看到,本發明之一種磁性元件屏蔽方法之實施例(二),其包括將一磁性元件1之複數接腳部11做遮蔽(S1);在磁性元件1之表面上噴塗一絕緣塗層2(S1A);在磁性元件1之表面噴塗一導電漆層3(S2);在至少一預定位置對導電漆層3進行遮蔽(S2B);在導電漆層3之表面上噴塗一保護漆層4(S2A);移除導電漆層3之遮蔽(S2C);於導電漆層3電鍍製作至少一接地電極31(S2D);移除各接腳部11之遮蔽(S3)。As can be seen in FIG. 5 , an embodiment (II) of a magnetic element shielding method of the present invention includes shielding a plurality of
實施例(二)中不安裝接地片12,而是在噴塗導電漆層3之後對預定位置進行遮蔽,實施例(二)中為本體13之底面未設有接腳部11的相對兩側邊,噴上電性絕緣的保護漆層4後,再移除導電漆層3的遮蔽來進行電鍍製作出接地電極31,使用者可以挑選不同的製作流程。在接地電極31製作完成後才移除各接腳部11的遮蔽,各接腳部11便不會在電鍍過程中受到影響。In the second embodiment, the
在第六圖及第七圖,本發明之具有屏蔽的磁性元件之實施例(二)包括:一磁性元件1,其包含一本體13及複數接腳部11;及一導電漆層3,其設於磁性元件1之表面,導電漆層3與各接腳部11之間為絕緣狀態。實施例(二)在本體13與導電漆層3之間有一絕緣塗層2;實施例(二)在導電漆層3之外側有一保護漆層4,保護漆層4在至少一預定位置有開孔,導電漆層3在對應開孔之位置設有至少一接地電極31,實施例(二)的保護漆層4在相對的兩側邊皆有開孔,導電漆層3在對應開孔的位置分別以電鍍方式設有一接地電極31。In FIG. 6 and FIG. 7, the embodiment (II) of the shielded magnetic element of the present invention includes: a
惟以上所述者,僅為本發明之較佳實施例,當不能用以限定本發明可實施之範圍,凡習於本業之人士所明顯可作的變化與修飾,皆應視為不悖離本發明之實質內容。However, the above is only a preferred embodiment of the present invention and should not be used to limit the scope of the present invention. Any changes and modifications that are obviously possible for people skilled in the art should be considered as not deviating from the essential content of the present invention.
1:磁性元件 11:接腳部 12:接地片 13:本體 2:絕緣塗層 3:導電漆層 31:接地電極 4:保護漆層 S1~S3:步驟 S1A:步驟 S1B:步驟 S2A:步驟1: Magnetic element 11: Pin 12: Grounding plate 13: Body 2: Insulation coating 3: Conductive paint layer 31: Grounding electrode 4: Protective paint layer S1~S3: Steps S1A: Steps S1B: Steps S2A: Steps
第一圖為本發明之磁性元件屏蔽方法之實施例(一)之流程圖。 第二圖為本發明之具有屏蔽的磁性元件之實施例(一)之立體圖。 第三圖為本發明之具有屏蔽的磁性元件之實施例(一)之縱剖面圖(一)。 第四圖為本發明之具有屏蔽的磁性元件之實施例(一)之縱剖面圖(二)。 第五圖為本發明之磁性元件屏蔽方法之實施例(二)之流程圖。 第六圖為本發明之具有屏蔽的磁性元件之實施例(二)之立體圖。 第七圖為本發明之具有屏蔽的磁性元件之實施例(二)之縱剖面圖。 The first figure is a flow chart of the embodiment (I) of the magnetic element shielding method of the present invention. The second figure is a three-dimensional diagram of the embodiment (I) of the present invention with a shielded magnetic element. The third figure is a longitudinal cross-sectional diagram (I) of the embodiment (I) of the present invention with a shielded magnetic element. The fourth figure is a longitudinal cross-sectional diagram (II) of the embodiment (I) of the present invention with a shielded magnetic element. The fifth figure is a flow chart of the embodiment (II) of the magnetic element shielding method of the present invention. The sixth figure is a three-dimensional diagram of the embodiment (II) of the present invention with a shielded magnetic element. The seventh figure is a longitudinal cross-sectional diagram of the embodiment (II) of the present invention with a shielded magnetic element.
無without
S1~S3:步驟 S1~S3: Steps
S1A:步驟 S1A: Steps
S1B:步驟 S1B: Steps
S2A:步驟 S2A: Steps
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112124407A TWI856721B (en) | 2023-06-29 | 2023-06-29 | Magnetic Component Shielding Methods |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112124407A TWI856721B (en) | 2023-06-29 | 2023-06-29 | Magnetic Component Shielding Methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI856721B true TWI856721B (en) | 2024-09-21 |
| TW202501509A TW202501509A (en) | 2025-01-01 |
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| TW112124407A TWI856721B (en) | 2023-06-29 | 2023-06-29 | Magnetic Component Shielding Methods |
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| Country | Link |
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| TW (1) | TWI856721B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200013729A1 (en) * | 2017-06-01 | 2020-01-09 | Murata Manufacturing Co., Ltd. | Electronic component |
| TW202217874A (en) * | 2020-10-23 | 2022-05-01 | 乾坤科技股份有限公司 | A magnetic device and the method to make the same |
| TWM652938U (en) * | 2023-06-29 | 2024-03-21 | 汎速科技有限公司 | Magnetic components with shielding |
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2023
- 2023-06-29 TW TW112124407A patent/TWI856721B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200013729A1 (en) * | 2017-06-01 | 2020-01-09 | Murata Manufacturing Co., Ltd. | Electronic component |
| TW202217874A (en) * | 2020-10-23 | 2022-05-01 | 乾坤科技股份有限公司 | A magnetic device and the method to make the same |
| TWM652938U (en) * | 2023-06-29 | 2024-03-21 | 汎速科技有限公司 | Magnetic components with shielding |
Also Published As
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| TW202501509A (en) | 2025-01-01 |
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