TWI856629B - Laser processing system and processing method - Google Patents
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本發明係關於一種雷射加工，更特定言之是透過同時考量雷射加工的加工速度、外部軸向速度等多項品質指標，將此同動控制問題規劃最佳化的同動雷射掃描路徑的雷射加工系統及其加工方法。The present invention relates to laser processing, and more specifically, to a laser processing system and a processing method thereof that optimize the synchronous control problem by simultaneously considering multiple quality indicators such as the processing speed and external axial speed of the laser processing and planning a synchronous laser scanning path.
雷射加工系統中同動雷射路徑掃描係指工件座標、振鏡座標(外部軸向馬達移動振鏡位置)、振鏡掃描點座標(振鏡範圍內的加工點位置)三者同步移動以決定最終加工位置，達到擴大整體加工範圍、優化加工品質的效果。In the laser processing system, synchronized laser path scanning refers to the synchronous movement of the workpiece coordinates, the galvanometer coordinates (the position of the galvanometer moved by the external axial motor), and the galvanometer scanning point coordinates (the position of the processing point within the galvanometer range) to determine the final processing position, thereby expanding the overall processing range and optimizing the processing quality.
一般而言，振鏡範圍內的加工點掃描速度遠大於外部軸向馬達帶動振鏡移動的速度，因此外部軸向馬達帶動振鏡移動的速度(以下簡稱外部軸向速度)變化越小越好，且外部軸向馬達帶動振鏡移動的路徑(以下簡稱外部軸向路徑)越簡化越好。舉例來說，當外部軸向速度變化越小時，雷射加工品質也較佳；當外部軸向路徑越簡化時，外部軸向速度加減速段越少。Generally speaking, the scanning speed of the processing point within the galvanometer range is much greater than the speed at which the external axial motor drives the galvanometer to move. Therefore, the smaller the change in the speed at which the external axial motor drives the galvanometer to move (hereinafter referred to as the external axial speed), the better, and the simpler the path of the external axial motor driving the galvanometer to move (hereinafter referred to as the external axial path), the better. For example, when the external axial speed changes less, the laser processing quality is also better; when the external axial path is simpler, the external axial speed has fewer acceleration and deceleration sections.
現有雷射加工技術為單純根據加工圖形幾何形狀生成一固定加工路徑，無法依據使用者實際加工需求進行加工路徑優化，應用較為受限。Existing laser processing technology simply generates a fixed processing path based on the geometric shape of the processing figure, and cannot optimize the processing path according to the user's actual processing requirements, so its application is relatively limited.
本發明的目的在於提供一種雷射加工系統及其加工方法，因雷射振鏡加工範圍與振鏡掃描範圍相關，當大範圍加工時，需搭配外部軸向移動振鏡，藉由工件軸(控制工件座標)、外部軸(控制振鏡座標)與振鏡軸(控制振鏡掃描點座標)的同步控制移動雷射光點，以擴充整體加工範圍。The purpose of the present invention is to provide a laser processing system and a processing method thereof. Since the processing range of the laser galvanometer is related to the scanning range of the galvanometer, when a large range is processed, an external axial moving galvanometer is required. The laser spot is moved by synchronously controlling the workpiece axis (controlling the workpiece coordinates), the external axis (controlling the galvanometer coordinates) and the galvanometer axis (controlling the galvanometer scanning point coordinates) to expand the overall processing range.
本發明的另一目的在於提供一種雷射加工系統及其加工方法，透過同時考量雷射加工的目標加工速度、外部軸向速度等多項品質指標，將此同動控制問題規劃為多目標最佳化問題 (Multi-objective Optimization Problem, MOP)，並進行同動路徑最佳化。Another object of the present invention is to provide a laser processing system and a processing method thereof, by simultaneously considering multiple quality indicators such as the target processing speed and external axial speed of laser processing, planning the synchronous control problem as a multi-objective optimization problem (Multi-objective Optimization Problem, MOP), and performing synchronous path optimization.
為了達成上述目的，本發明提供一種雷射加工系統，應用於雷射加工的一加工機台，包括：一輸入單元；一工件驅動裝置；一振鏡驅動裝置；一外部軸向驅動裝置；一控制單元其耦接該輸入單元、該工件驅動裝置、該振鏡驅動裝置與該外部軸向驅動裝置；該控制單元接收由該輸入單元傳來的一加工檔、一振鏡加工範圍與一目標加工速度，該控制單元根據該加工檔、該振鏡加工範圍與該目標加工速度計算出加工路徑的一第一組可行解，該第一組可行解滿足完全覆蓋該加工檔中的一加工圖形；該控制單元根據該第一組可行解的外部軸向平滑度，用以產生對應該第一組可行解的一第一加工路徑資訊；該控制單元再根據該第一加工路徑資訊產生一第一工件驅動裝置控制命令、一第一振鏡驅動裝置控制命令及一第一外部軸向驅動裝置控制命令；該控制單元將該第一工件驅動裝置控制命令、該第一振鏡驅動裝置控制命令及該第一外部軸向驅動裝置控制命令分別傳送至該工件驅動裝置、該振鏡驅動裝置與該外部軸向驅動裝置用以控制及執行相對應的驅動。In order to achieve the above-mentioned purpose, the present invention provides a laser processing system, which is applied to a processing machine for laser processing, comprising: an input unit; a workpiece driving device; a galvanometer driving device; an external axial driving device; a control unit coupled to the input unit, the workpiece driving device, the galvanometer driving device and the external axial driving device; the control unit receives a processing file, a galvanometer processing range and a target processing speed transmitted by the input unit, and the control unit calculates a first set of feasible solutions for the processing path according to the processing file, the galvanometer processing range and the target processing speed, and the first set of feasible solutions satisfies the requirement of completely covering the processing file. a processing pattern; the control unit generates a first processing path information corresponding to the first set of feasible solutions according to the external axial smoothness of the first set of feasible solutions; the control unit generates a first workpiece drive device control command, a first galvanometer drive device control command and a first external axial drive device control command according to the first processing path information; the control unit transmits the first workpiece drive device control command, the first galvanometer drive device control command and the first external axial drive device control command to the workpiece drive device, the galvanometer drive device and the external axial drive device respectively for controlling and executing corresponding drives.
為了達成上述目的，本發明提供一種雷射加工方法，應用於雷射加工的一加工機台，包括：一控制單元根據由一輸入單元傳來一加工檔、一振鏡加工範圍與一目標加工速度計算找出加工路徑的一第一組可行解，該第一組可行解滿足完全覆蓋該加工檔中的一加工圖形；該控制單元根據該第一組可行解的外部軸向平滑度，找出該第一組可行解的一第一加工路徑資訊；該控制單元根據該第一加工路徑資訊產生一第一工件驅動裝置控制命令、一第一振鏡驅動裝置控制命令及一第一外部軸向驅動裝置控制命令；該控制單元輸出該第一工件驅動裝置控制命令、該第一振鏡驅動裝置控制命令及該第一外部軸向驅動裝置控制命令分別傳送至一工件驅動裝置、一振鏡驅動裝置與一外部軸向驅動裝置用以控制及執行相對應的驅動。In order to achieve the above-mentioned object, the present invention provides a laser processing method, which is applied to a processing machine for laser processing, comprising: a control unit calculates and finds a first set of feasible solutions for a processing path according to a processing file transmitted by an input unit, a galvanometer processing range and a target processing speed, and the first set of feasible solutions satisfies the requirement of completely covering a processing pattern in the processing file; the control unit calculates and finds a first processing path data of the first set of feasible solutions according to the external axial smoothness of the first set of feasible solutions. information; the control unit generates a first workpiece drive device control command, a first galvanometer drive device control command and a first external axial drive device control command according to the first processing path information; the control unit outputs the first workpiece drive device control command, the first galvanometer drive device control command and the first external axial drive device control command and transmits them to a workpiece drive device, a galvanometer drive device and an external axial drive device respectively for controlling and executing corresponding drives.
相較於先前技術，本發明提出一個大範圍同動雷射掃描路徑設計，透過同時考量雷射加工的目標加工速度、外部軸向速度等多項品質指標，將此同動控制問題規劃為多目標最佳化問題，用以同動路徑最佳化。藉此，可達到同時考量加工路徑長、外部軸向速度、加工品質(如過燒程度等)最佳化的同動雷射掃描路徑。改善目前現有作法僅根據加工圖形簡化為外部軸向、振鏡軸向搭配的同動路徑，路徑生成無彈性，且無考量加工條件與特性的限制。Compared with the previous technology, the present invention proposes a large-scale synchronous laser scanning path design. By considering multiple quality indicators such as the target processing speed and external axial speed of laser processing at the same time, this synchronous control problem is planned as a multi-objective optimization problem for synchronous path optimization. In this way, a synchronous laser scanning path that simultaneously considers the processing path length, external axial speed, and processing quality (such as overburning degree, etc.) can be achieved. The existing practice is improved, which is only simplified to a synchronous path of external axial and galvanometer axial matching according to the processing pattern. The path generation is inflexible and does not consider the limitations of processing conditions and characteristics.
以下將詳述本發明之各實施例，並配合圖式作為例示。除了這些詳細說明之外，本發明亦可廣泛地施行於其它的實施例中，任何所述實施例的輕易替代、修改、等效變化都包含在本發明之範圍內，並以申請專利範圍為準。在說明書的描述中，為了使讀者對本發明有較完整的瞭解，提供了許多特定細節；然而，本發明可能在省略部分或全部特定細節的前提下，仍可實施。此外，眾所周知的步驟或元件並未描述於細節中，以避免對本發明形成不必要之限制。圖式中相同或類似之元件將以相同或類似符號來表示。特別注意的是，圖式僅為示意之用，並非代表元件實際之尺寸或數量，有些細節可能未完全繪出，以求圖式之簡潔。The following will describe in detail various embodiments of the present invention, and will be illustrated with accompanying drawings. In addition to these detailed descriptions, the present invention can also be widely implemented in other embodiments, and any easy replacement, modification, and equivalent changes of the embodiments are included in the scope of the present invention and are subject to the scope of the patent application. In the description of the specification, many specific details are provided to enable readers to have a more complete understanding of the present invention; however, the present invention may still be implemented on the premise of omitting some or all of the specific details. In addition, well-known steps or components are not described in the details to avoid unnecessary limitations on the present invention. The same or similar components in the drawings will be represented by the same or similar symbols. It should be noted that the drawings are for illustration purposes only and do not represent the actual size or quantity of components. Some details may not be fully drawn for the sake of simplicity.
本案的目的在於提供一種雷射加工系統及其加工方法，當大範圍加工時，搭配外部軸向移動振鏡，藉由工件軸(控制工件座標)、外部軸(控制振鏡座標)與振鏡軸(控制振鏡掃描點座標)的同步控制移動雷射光點，以擴充整體加工範圍。透過同時考量雷射加工的目標加工速度、外部軸向速度等多項品質指標，將此同動控制問題規劃為多目標最佳化問題 (Multi-objective Optimization Problem, MOP)，並進行同動路徑最佳化。舉例來說，如圖1所示，針對加工圖形10比較圖1中第一外部軸向路徑20與第二外部軸向路徑30的外部軸向速度變化程度(例如：平滑度)、速度限制、路徑簡化程度(例如：路徑長)等多種指標後，選擇最符合使用者實際需求的外部軸向路徑進行加工。The purpose of this case is to provide a laser processing system and a processing method thereof. When processing a large range, an external axial moving galvanometer is used to move the laser spot by synchronously controlling the workpiece axis (controlling the workpiece coordinates), the external axis (controlling the galvanometer coordinates) and the galvanometer axis (controlling the galvanometer scanning point coordinates) to expand the overall processing range. By simultaneously considering multiple quality indicators such as the target processing speed of laser processing and the external axial speed, this synchronous control problem is planned as a multi-objective optimization problem (MOP) and the synchronous path is optimized. For example, as shown in FIG. 1 , after comparing the external axial speed variation degree (e.g., smoothness), speed limit, path simplification degree (e.g., path length) and other indicators of the first external axial path 20 and the second external axial path 30 in FIG. 1 for the processing figure 10, the external axial path that best meets the actual needs of the user is selected for processing.
請參閱圖2，本案雷射加工系統的方塊圖。本案是一種雷射加工系統，應用於雷射加工的一加工機台100，包括：一輸入單元110，該輸入單元110不限制輸入方式，可以是該加工機台100上的輸入界面或外接的輸入裝置(例如筆電、伺服器)；一工件驅動裝置120用以控制加工工件的位置、角度(空間座標)；一振鏡驅動裝置130用以控制振鏡範圍內的加工點(空間座標)位置；一外部軸向驅動裝置140用以控制移動振鏡位置(空間座標)。Please refer to FIG2 for a block diagram of the laser processing system of the present invention. The present invention is a laser processing system, which is applied to a processing machine 100 for laser processing, and includes: an input unit 110, which is not limited to the input method, and can be an input interface on the processing machine 100 or an external input device (such as a laptop, server); a workpiece drive device 120 for controlling the position and angle (spatial coordinates) of the processed workpiece; a galvanometer drive device 130 for controlling the position of the processing point (spatial coordinates) within the range of the galvanometer; and an external axial drive device 140 for controlling the position (spatial coordinates) of the moving galvanometer.
一控制單元150其耦接該輸入單元110、該工件驅動裝置120、該振鏡驅動裝置130與該外部軸向驅動裝置140；該控制單元150接收由該輸入單元110傳來的一加工檔、一振鏡加工範圍與一目標加工速度等資訊。其中該加工檔110的加工圖檔可以是CAD檔或影像檔等不加以限制，或該加工檔110可以是加工路徑檔(例如以程式描述加工路徑)。本說明例該振鏡加工範圍(如圖3所示)為一矩形區塊200(實施應用上不限形狀，視雷射加工機台的振鏡而定)舉例說明，一個加工圖形300的外部軸向路徑點由多個該振鏡加工範圍的矩形區塊200中心點所構成，如圖4所示。一個可行解必須達到所有矩形區塊200與加工圖形300覆蓋率100%，外部軸向路徑涵蓋之加工範圍可包含、覆蓋完整的加工圖案300。A control unit 150 is coupled to the input unit 110, the workpiece drive device 120, the galvanometer drive device 130 and the external axial drive device 140; the control unit 150 receives information such as a processing file, a galvanometer processing range and a target processing speed transmitted from the input unit 110. The processing drawing file of the processing file 110 can be a CAD file or an image file without limitation, or the processing file 110 can be a processing path file (for example, a processing path described by a program). In this example, the processing range of the galvanometer (as shown in FIG. 3 ) is a rectangular block 200 (the shape is not limited in the implementation application, depending on the galvanometer of the laser processing machine). For example, the external axial path points of a processing pattern 300 are composed of multiple center points of the rectangular blocks 200 of the processing range of the galvanometer, as shown in FIG. 4 . A feasible solution must achieve a 100% coverage rate of all rectangular blocks 200 and processing patterns 300, and the processing range covered by the external axial path can include and cover the complete processing pattern 300.
該振鏡加工範圍的矩形區塊200的座標、排列順序的改變，就代表外部軸向路徑的改變，路徑長短、轉角角度等皆會影響速度規劃細節，改變外部軸向速度平滑程度進而影響加工品質。The change of the coordinates and arrangement order of the rectangular block 200 within the galvanometer processing range represents the change of the external axial path. The path length, turning angle, etc. will affect the speed planning details, change the smoothness of the external axial speed and thus affect the processing quality.
請參閱圖5，為本案雷射加工方法的流程圖一。該控制單元150根據由該輸入單元110傳來的該加工檔、該振鏡加工範圍與該目標加工速度計算找出加工路徑的多組可行解為一第一組可行解，該第一組可行解滿足完全覆蓋該加工檔中的加工圖形。其中，該目標加工速度為該工件驅動裝置、該振鏡驅動裝置與該外部軸向驅動裝置三者的合成速度。Please refer to FIG. 5, which is a flow chart of the laser processing method of the present invention. The control unit 150 calculates and finds multiple feasible solutions of the processing path as a first feasible solution according to the processing file, the galvanometer processing range and the target processing speed transmitted by the input unit 110. The first feasible solution satisfies the complete coverage of the processing pattern in the processing file. Among them, the target processing speed is the composite speed of the workpiece drive device, the galvanometer drive device and the external axial drive device.
該控制單元150根據該第一組可行解的外部軸向平滑度，評估前述第一組可行解的多組可行解，找出該第一組可行解的最佳加工路徑資訊為一第一加工路徑資訊；其中，該外部軸向平滑度是該外部軸向驅動裝置在加工路徑上產生的運動軌跡速度平滑度。The control unit 150 evaluates multiple feasible solutions of the first feasible solution according to the external axial smoothness of the first feasible solution, and finds out the best processing path information of the first feasible solution as a first processing path information; wherein the external axial smoothness is the smoothness of the motion trajectory speed generated by the external axial drive device on the processing path.
該控制單元150再根據該第一加工路徑資訊產生一第一工件驅動裝置控制命令、一第一振鏡驅動裝置控制命令及一第一外部軸向驅動裝置控制命令；該控制單元150輸出該第一工件驅動裝置控制命令、該第一振鏡驅動裝置控制命令及該第一外部軸向驅動裝置控制命令分別傳送至該工件驅動裝置120、該振鏡驅動裝置130與該外部軸向驅動裝置140用以控制及執行該些裝置相對應的驅動。實施應用上，該控制單元150依據不同的該目標加工速度將計算出不同的該第一加工路徑資訊。由於該目標加工速度為該工件驅動裝置120、該振鏡驅動裝置130與該外部軸向驅動裝置140三者的合成速度。在不同的加工情境中，當該目標加工速度有變化時，該工件驅動裝置120、該振鏡驅動裝置130與該外部軸向驅動裝置140三者各自的速度可能也會改變，該控制單元150會對應計算出不同的該第一加工路徑資訊。The control unit 150 generates a first workpiece drive device control command, a first oscillating mirror drive device control command and a first external axial drive device control command according to the first processing path information; the control unit 150 outputs the first workpiece drive device control command, the first oscillating mirror drive device control command and the first external axial drive device control command to the workpiece drive device 120, the oscillating mirror drive device 130 and the external axial drive device 140 respectively to control and execute the corresponding driving of these devices. In practice, the control unit 150 calculates different first processing path information according to different target processing speeds. Since the target processing speed is the composite speed of the workpiece drive device 120, the galvanometer drive device 130 and the external axial drive device 140, in different processing scenarios, when the target processing speed changes, the speeds of the workpiece drive device 120, the galvanometer drive device 130 and the external axial drive device 140 may also change, and the control unit 150 will calculate different first processing path information accordingly.
實施應用上，進一步該控制單元150更包括接收由該輸入單元110傳來的一外部軸向速度限制，該控制單元150根據該加工檔、該振鏡加工範圍、該外部軸向速度限制與該目標加工速度計算出加工路徑的一第一組可行解的多組可行解，該第二組可行解滿足完全覆蓋該加工檔中的該加工圖形；該控制單元根據該第二組可行解的外部軸向平滑度，用以產生對應該第二組可行解的最佳加工路徑資訊為一第二加工路徑資訊。該控制單元150再根據該第二加工路徑資訊產生一第二工件驅動裝置控制命令、一第二振鏡驅動裝置控制命令與一第二外部軸向驅動裝置控制命令，該控制單元150再將該第二工件驅動裝置控制命令、該第二振鏡驅動裝置控制命令與該第二外部軸向驅動裝置控制命令分別傳送至該工件驅動裝置120、該振鏡驅動裝置130與該外部軸向驅動裝置140用以控制及執行該些裝置相對應的驅動。In practical application, the control unit 150 further includes receiving an external axial speed limit transmitted by the input unit 110. The control unit 150 calculates a first set of feasible solutions of the processing path according to the processing file, the galvanometer processing range, the external axial speed limit and the target processing speed, and the second set of feasible solutions satisfies the requirement of completely covering the processing figure in the processing file; the control unit generates the best processing path information corresponding to the second set of feasible solutions as a second processing path information according to the external axial smoothness of the second set of feasible solutions. The control unit 150 then generates a second workpiece drive device control command, a second oscillating mirror drive device control command and a second external axial drive device control command according to the second processing path information. The control unit 150 then transmits the second workpiece drive device control command, the second oscillating mirror drive device control command and the second external axial drive device control command to the workpiece drive device 120, the oscillating mirror drive device 130 and the external axial drive device 140 respectively for controlling and executing the corresponding drives of these devices.
請再參閱圖6，為本案雷射加工方法的流程圖二。實施應用上，本案需符合外部軸向速度限制，或/及考慮外部軸向路徑長度。Please refer to Figure 6, which is a second flow chart of the laser processing method of this case. In practical application, this case needs to comply with the external axial speed limit, or/and consider the external axial path length.
實施應用上，該控制單元150更包括根據該第一組可行解的路徑長度，用以產生對應該第一組可行解的一第三加工路徑資訊；該第一組可行解的路徑長度為該工件驅動裝置120、該振鏡驅動裝置130與該外部軸向驅動裝置130三者於雷射加工中的路徑長度。In practical application, the control unit 150 further includes a third processing path information corresponding to the first set of feasible solutions based on the path length of the first set of feasible solutions; the path length of the first set of feasible solutions is the path length of the workpiece driving device 120, the galvanometer driving device 130 and the external axial driving device 130 in laser processing.
實施應用上，該控制單元150更包括根據該第二組可行解的路徑長度，用以產生對應該第二組可行解的一第四加工路徑資訊；該第二組可行解的路徑長度為該工件驅動裝置、該振鏡驅動裝置與該外部軸向驅動裝置三者於雷射加工中的路徑長度。In practical application, the control unit 150 further includes generating a fourth processing path information corresponding to the second set of feasible solutions according to the path length of the second set of feasible solutions; the path length of the second set of feasible solutions is the path length of the workpiece drive device, the galvanometer drive device and the external axial drive device in laser processing.
請參閱圖7，實施應用上，應用於雷射加工的加工機台400，除前述的該輸入單元110、該工件驅動裝置120、該振鏡驅動裝置及該外部軸向驅動裝置140外，該控制單元150耦接一雷射源160，因此，前述的該第一加工路徑資訊、該第二加工路徑資訊、該第三加工路徑資訊或該第四加工路徑資訊包含有該雷射源160的強度和開關時間資訊。Please refer to Figure 7. In practice, the processing machine 400 used for laser processing, in addition to the aforementioned input unit 110, the workpiece drive device 120, the galvanometer drive device and the external axial drive device 140, the control unit 150 is coupled to a laser source 160. Therefore, the aforementioned first processing path information, the second processing path information, the third processing path information or the fourth processing path information includes the intensity and switching time information of the laser source 160.
進一步，該控制單元150根據該第一組可行解的雷射源160的開關次數與該第一組可行解的外部軸向平滑度，用以產生對應該第一組可行解的一第五加工路徑資訊控制該雷射源的強度和開關時間。Furthermore, the control unit 150 generates a fifth processing path information corresponding to the first set of feasible solutions to control the intensity and switching time of the laser source according to the switching times of the laser source 160 of the first set of feasible solutions and the external axial smoothness of the first set of feasible solutions.
進一步，該控制單元150根據該第二組可行解的雷射源160的開關次數與該第二組可行解的外部軸向平滑度，用以產生對應該第二組可行解的一第六加工路徑資訊控制該雷射源的強度和開關時間。Furthermore, the control unit 150 generates a sixth processing path information corresponding to the second set of feasible solutions to control the intensity and switching time of the laser source according to the switching times of the laser source 160 of the second set of feasible solutions and the external axial smoothness of the second set of feasible solutions.
進一步，該控制單元150根據該第一組可行解的雷射源開關次數、該第一組可行解的外部軸向平滑度與該第一組可行解的路徑長度，用以產生對應該第一組可行解的一第七加工路徑資訊控制該雷射源的強度和開關時間。Furthermore, the control unit 150 generates a seventh processing path information corresponding to the first set of feasible solutions to control the intensity and switching time of the laser source according to the number of laser source switching of the first set of feasible solutions, the external axial smoothness of the first set of feasible solutions and the path length of the first set of feasible solutions.
進一步，該控制單元150根據該第二組可行解的雷射源開關次數、該第二組可行解的外部軸向平滑度與該第二組可行解的路徑長度，用以產生對應該第二組可行解的一第八加工路徑資訊控制該雷射源的強度和開關時間。Furthermore, the control unit 150 generates an eighth processing path information corresponding to the second set of feasible solutions to control the intensity and switching time of the laser source according to the number of laser source switching of the second set of feasible solutions, the external axial smoothness of the second set of feasible solutions and the path length of the second set of feasible solutions.
實施應用上，該控制單元150根據一第一演算法計算產生該第一組可行解或該第二組可行解，該控制單元150根據一第二演算法計算產生該第一加工路徑資訊、該第二加工路徑資訊、該第三加工路徑資訊、該第四加工路徑資訊、該第五加工路徑資訊、該第六加工路徑資訊、該第七加工路徑資訊或該第八加工路徑資訊，且該第一演算法和該第二演算法可以是相同或不同的演算法。In practical application, the control unit 150 generates the first set of feasible solutions or the second set of feasible solutions according to a first algorithm, and the control unit 150 generates the first processing path information, the second processing path information, the third processing path information, the fourth processing path information, the fifth processing path information, the sixth processing path information, the seventh processing path information or the eighth processing path information according to a second algorithm, and the first algorithm and the second algorithm may be the same or different algorithms.
本技術透過大範圍同動雷射掃描路徑設計方法，可達到同時考量加工路徑長、外部軸向速度、加工品質(如過燒程度等)最佳化的同動雷射掃描路徑。改善目前現有僅根據加工圖形簡化為外部軸向、振鏡軸向搭配的同動路徑，路徑生成無彈性，且無考量加工條件與特性的缺失。This technology uses a large-scale synchronous laser scanning path design method to achieve a synchronous laser scanning path that takes into account the processing path length, external axial speed, and processing quality (such as overburning degree, etc.). It improves the current synchronous path that is simplified to the external axial and galvanometer axial matching according to the processing pattern, and the path generation is inflexible and does not consider the lack of processing conditions and characteristics.
本技術將此大範圍同動雷射路徑掃描問題規劃為一多目標最佳化問題(Multi-objective Optimization Problem, MOP)，並使用多目標演化式演算法求解，考量實際物理、工程應用限制與邊界條件，進一步限縮搜尋空間，將問題規劃解析為有限制的多目標最佳化問題。This technology plans this large-scale co-moving laser path scanning problem as a multi-objective optimization problem (MOP) and uses a multi-objective evolutionary algorithm to solve it. Taking into account the actual physical and engineering application restrictions and boundary conditions, the search space is further restricted and the problem planning is analyzed as a constrained multi-objective optimization problem.
實施應用上，該第一演算法及第二演算法可以是 Population-Based Metaheuristic Algorithm (種群元啟發式演算法)，每個步驟皆有一定的隨機性，族群中的每一個體即為一個候選解，透過將同動雷射路徑在意的加工品質指標設計為多項可評估、量化的計算函式，在族群演化的過程中進行留強汰弱的演化機制，最終得到多個目標相互權衡後的最佳解。In practical application, the first algorithm and the second algorithm can be a Population-Based Metaheuristic Algorithm. Each step has a certain degree of randomness. Each individual in the population is a candidate solution. By designing the processing quality indicators that the co-moving laser path cares about into multiple evaluable and quantifiable calculation functions, an evolutionary mechanism of retaining the strong and eliminating the weak is carried out in the process of population evolution, and finally the best solution is obtained after balancing multiple goals.
同動控制問題規劃各個目標的評估方式可透過真實計算得該目標的表現，或是透過設計啟發函式來進行該目標表現估計。多目標間的權重可由使用者自行定義，選擇偏好權重進行最佳化；或是使用帕累托最優(Dominance and Pareto Optimality )的概念設計多目標演算法。The evaluation method of each objective in the planning of the simultaneous control problem can be obtained by actually calculating the performance of the objective, or by designing a heuristic function to estimate the performance of the objective. The weights between multiple objectives can be defined by the user, and the preferred weights can be selected for optimization; or the multi-objective algorithm can be designed using the concepts of Dominance and Pareto Optimality.
上述揭示的實施形態僅例示性說明本發明之原理、特點及其功效，並非用以限制本發明之可實施範疇，任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下，對上述實施形態進行修飾與改變。任何運用本發明所揭示內容而完成之等效改變及修飾，均仍應為下述之申請專利範圍所涵蓋。The above disclosed embodiments are merely illustrative of the principles, features and effects of the present invention, and are not intended to limit the scope of the present invention. Any person skilled in the art may modify and alter the above embodiments without violating the spirit and scope of the present invention. Any equivalent changes and modifications made using the contents disclosed in the present invention shall still be covered by the scope of the patent application below.
10:加工圖形 20:第一外部軸向路徑 30:第二外部軸向路徑 100、400:加工機台 110:輸入單元 120:工件驅動裝置 130:振鏡驅動裝置 140:外部軸向驅動裝置 150:控制單元 160:雷射源 200:矩形區塊 300:加工圖形 10: Processing figure 20: First external axial path 30: Second external axial path 100, 400: Processing machine 110: Input unit 120: Workpiece drive device 130: Vibrating mirror drive device 140: External axial drive device 150: Control unit 160: Laser source 200: Rectangular block 300: Processing figure
[圖1]為本案雷射加工多目標路徑示意圖。 [圖2]為本案雷射加工系統的方塊圖。 [圖3]為本案振鏡加工範圍的定義圖。 [圖4]為本案外部軸向路徑點示意圖。 [圖5]為本案雷射加工方法的流程圖一。 [圖6]為本案雷射加工方法的流程圖二。 [圖7] 為本案雷射加工系統的另一方塊圖。 [Figure 1] is a schematic diagram of the multi-target path of laser processing in this case. [Figure 2] is a block diagram of the laser processing system in this case. [Figure 3] is a definition diagram of the processing range of the galvanometer in this case. [Figure 4] is a schematic diagram of the external axial path points in this case. [Figure 5] is a flow chart 1 of the laser processing method in this case. [Figure 6] is a flow chart 2 of the laser processing method in this case. [Figure 7] is another block diagram of the laser processing system in this case.
100:加工機台 100: Processing machine
110:輸入單元 110: Input unit
120:工件驅動裝置 120: Workpiece driving device
130:振鏡驅動裝置 130: Vibrating mirror drive device
140:外部軸向驅動裝置 140: External axial drive device
150:控制單元 150: Control unit
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| TWM607212U (en) * | 2020-10-12 | 2021-02-01 | 旭臻科技有限公司 | Nanosecond pulsed laser system for lift-off of epitaxial wafer |
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