TWI856611B - Floating assembly structure for multiple substrates - Google Patents
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- TWI856611B TWI856611B TW112114001A TW112114001A TWI856611B TW I856611 B TWI856611 B TW I856611B TW 112114001 A TW112114001 A TW 112114001A TW 112114001 A TW112114001 A TW 112114001A TW I856611 B TWI856611 B TW I856611B
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- 125000006850 spacer group Chemical group 0.000 claims abstract description 54
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- 238000010586 diagram Methods 0.000 description 5
- 238000013500 data storage Methods 0.000 description 1
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Abstract
Description
本發明有關於一種浮動組裝構造,尤指一種浮動組裝多個基板的構造。 The present invention relates to a floating assembly structure, in particular to a structure for floating assembly of multiple substrates.
隨著科技的進步,電子設備(如伺服器或電池儲能設備)的機櫃中通常會設置有多個基板(如印刷電路板),利用該些基板的運作來提升電子設備的效能。 With the advancement of technology, multiple substrates (such as printed circuit boards) are usually installed in the cabinets of electronic equipment (such as servers or battery storage devices), and the operation of these substrates is used to improve the performance of the electronic equipment.
傳統上,多個基板亦可以採用連接器來組裝一起。如圖1所示,電子設備100包括有一第一基板11及一第二基板12。第一基板11的一表面上設置有一第一連接器110,而第二基板12的一表面上設置有一第二連接器120。第一基板11可以固設在電子設備100之機櫃的殼體10的內表面上。並且,第一基板11與第二基板12透過第一連接器110與第二連接器120的連接以組裝一起。例如:第二連接器120可以為一公的連接器,第一連接器110可以為一母的連接器,第二連接器120插接在第一連接器110上,而使第二基板12與第一基板11組裝一起。
Traditionally, multiple substrates can also be assembled together using connectors. As shown in FIG. 1 , the
第一基板11與第二基板12以連接器方式來組裝,第一連接器110與第二連接器120間的公差要十分精準,否則,第二連接器120係無法順利插入至第一連接器110中或插入至第一連接器110時容易從第一連接器110之中鬆脫。
The
再者,目前的伺服器或電池儲能設備的機櫃長度越做越長,縱向的機身越來越深,若第一基板11設置在機櫃的深處,第二基板12的第二連接器120不易與第一基板11的第一連接器110對位插接。進一步地,若基板上乘載有重量較重的電子元件(如資料儲存器或電池芯),在組裝過程中,必須用力地將第二基板12往第一基板11的設置方向推去,將導致一較大的衝撞力產生在第一連接器110與第二連接器120之間。該較大的衝撞力亦可能造成第一連接器110及第二連接器120結構上的損壞,進而使得第二基板12無法順利地與第一基板11組裝一起。
Furthermore, the length of the current server or battery storage cabinet is getting longer and longer, and the longitudinal body is getting deeper and deeper. If the
鑑於上述利用連接器組裝多個基板所存在的問題,本發明提出一種浮動組裝多個基板的構造,以便輕易地將多個基板組裝一起。 In view of the above-mentioned problems in assembling multiple substrates using connectors, the present invention proposes a structure for floating assembly of multiple substrates so that multiple substrates can be easily assembled together.
本發明的一目的,在於提供一種多個基板的浮動組裝構造,其包括一固定座、一間隔柱及一限位件。固定座設於一殼體的內表面上,且在固定座的一端面上凸設有一第一凸柱。第一凸柱的中心設有一第一固定孔。間隔柱的一端面上凸設有一第二凸柱,而另一端面上凸設有一第一定位桿。第二凸柱的中心設有一第二固定孔。限位件包括一限位塊及一垂直於限位塊的第二定位桿。間隔柱的第一定位桿穿過一第一層基板的穿孔而設置在第一固定孔中時,一第一環形空間形成在第一凸柱的外圍。當限位件的第二定位桿穿過一第二層基板的穿孔而設置在第二固定孔中時,一第二環形空間形成在第二凸柱的外圍;第一層的基板浮動在第一環形空間中,而第二層的基板浮動在第二環形空間中。如此,以浮動組裝構造組裝多個基板的過程中,每一層的基板在對應的 環形空間中保持浮動的狀態,不會被組裝構造夾死,則,不需對於浮動狀態的基板進行精準的對位,組裝構造就可以輕易地將基板組裝一起,以便增加組裝上的便利性。 One purpose of the present invention is to provide a floating assembly structure for multiple substrates, which includes a fixing seat, a spacer column and a limiter. The fixing seat is arranged on the inner surface of a shell, and a first boss is convexly provided on one end surface of the fixing seat. A first fixing hole is provided in the center of the first boss. A second boss is convexly provided on one end surface of the spacer column, and a first positioning rod is convexly provided on the other end surface. A second fixing hole is provided in the center of the second boss. The limiter includes a limit block and a second positioning rod perpendicular to the limit block. When the first positioning rod of the spacer column passes through a through hole of a first layer of substrate and is arranged in the first fixing hole, a first annular space is formed on the periphery of the first boss. When the second positioning rod of the stopper passes through the through hole of the second layer substrate and is set in the second fixing hole, a second annular space is formed on the periphery of the second convex column; the first layer substrate floats in the first annular space, and the second layer substrate floats in the second annular space. In this way, in the process of assembling multiple substrates with the floating assembly structure, each layer of the substrate remains in a floating state in the corresponding annular space and will not be clamped by the assembly structure. Therefore, there is no need to accurately align the floating substrates, and the assembly structure can easily assemble the substrates together to increase the convenience of assembly.
為達到上述的目的,本發明提供一種浮動組裝構造,用以將多個基板組裝一起,每一基板分別包括一穿孔,浮動組裝構造包括:一殼體;一固定座,設於殼體的內表面上,且在固定座的一端面上凸設有一第一凸柱,其中第一凸柱的中心設有一第一固定孔;一間隔柱,其一端面上凸設有一第二凸柱,而另一端面上凸設有一第一定位桿,其中第二凸柱的中心設有一第二固定孔;及一限位件,包括一限位塊及一垂直於限位塊的第二定位桿;其中,當間隔柱的第一定位桿穿過對應的基板的穿孔而設置在第一固定孔中時,一第一環形空間形成在第一凸柱的外圍;當限位件的第二定位桿穿過對應的基板的穿孔而設置在第二固定孔中時,一第二環形空間形成在第二凸柱的外圍;其中一基板浮動在第一環形空間中,其他的基板浮動在第二環形空間中。 To achieve the above-mentioned purpose, the present invention provides a floating assembly structure for assembling a plurality of substrates together, each substrate including a through hole. The floating assembly structure includes: a housing; a fixing seat disposed on the inner surface of the housing, and a first protrusion protruding from one end surface of the fixing seat, wherein a first fixing hole is provided at the center of the first protrusion; a spacing column, a second protrusion protruding from one end surface of the spacing column, and a first positioning rod protruding from the other end surface, wherein a second fixing hole is provided at the center of the second protrusion ; and a stopper, including a stopper block and a second positioning rod perpendicular to the stopper block; wherein, when the first positioning rod of the spacer column passes through the corresponding through hole of the substrate and is disposed in the first fixing hole, a first annular space is formed on the periphery of the first protruding column; when the second positioning rod of the stopper passes through the corresponding through hole of the substrate and is disposed in the second fixing hole, a second annular space is formed on the periphery of the second protruding column; one substrate floats in the first annular space, and the other substrates float in the second annular space.
本發明一實施例中,間隔柱的直徑為D1,基板的穿孔的孔徑為D2,第一凸柱的直徑為D3,D1>D2>D3。 In one embodiment of the present invention, the diameter of the spacer column is D1, the diameter of the through hole of the substrate is D2, the diameter of the first protrusion is D3, and D1>D2>D3.
本發明一實施例中,間隔柱的直徑為D1,基板的穿孔的孔徑為D2,第二凸柱的直徑為D4,D1>D2>D4。 In one embodiment of the present invention, the diameter of the spacer column is D1, the diameter of the through hole of the substrate is D2, and the diameter of the second protrusion is D4, D1>D2>D4.
本發明一實施例中,固定座為一植釘,而限位件為一螺絲。 In one embodiment of the present invention, the fixing seat is a nail, and the limiting member is a screw.
本發明一實施例中,第一定位桿及第二定位桿分別以一鎖固方式設置在第一固定孔及第二固定孔中。 In one embodiment of the present invention, the first positioning rod and the second positioning rod are respectively arranged in the first fixing hole and the second fixing hole in a locking manner.
本發明又提供一種浮動組裝構造,用以將多個基板組裝一起,每一基板分別包括一穿孔,浮動組裝構造包括:一殼體;一固定座,設於殼體的內表面上,且在固定座的一端面上凸設有一第一凸柱,其中第一凸柱的中心設有一第一固定孔;複數個間隔柱,每一間隔柱的一端面上凸設有一第二凸柱,而另一端面上凸設有一第一定位桿,其中第二凸柱的中心設有一第二固定孔;及一限位件,包括一限位塊及一垂直於限位塊的第二定位桿;其中,每一間隔柱的第一定位桿穿過對應的基板的穿孔而設置在固定座的第一固定孔中或設置在另一間隔柱的第二固定孔中,而限位件的第二定位桿穿過對應的基板的穿孔而設置在其中一間隔柱的第二固定孔中;其中,當其中一間隔柱的第一定位桿設置在固定座的第一固定孔中時,一第一環形空間形成在第一凸柱的外圍;當其他的間隔柱的第一定位桿設置在另一間隔柱的第二固定孔中或限位件的第二定位桿設置在其中一間隔柱的第二固定孔中時,一第二環形空間分別形成在每一間隔柱的第二凸柱的外圍;其中一基板將浮動在第一環形空間中,其他的基板將浮動在第二環形空間中。 The present invention also provides a floating assembly structure for assembling a plurality of substrates together, each substrate including a through hole. The floating assembly structure includes: a shell; a fixing seat, which is disposed on the inner surface of the shell, and a first boss is convexly provided on one end surface of the fixing seat, wherein a first fixing hole is provided at the center of the first boss; a plurality of spacer columns, each of which has a second boss convexly provided on one end surface and a first positioning rod convexly provided on the other end surface, wherein a second fixing hole is provided at the center of the second boss; and a limiting member, including a limiting block and a second positioning rod perpendicular to the limiting block; wherein the first positioning rod of each spacer column passes through the through hole of the corresponding substrate and is disposed on the first fixing hole of the fixing seat. The first fixing hole of the spacer column or the second fixing hole of another spacer column is set, and the second positioning rod of the limiting member passes through the through hole of the corresponding substrate and is set in the second fixing hole of one of the spacer columns; wherein, when the first positioning rod of one of the spacer columns is set in the first fixing hole of the fixing seat, a first annular space is formed on the periphery of the first protrusion; when the first positioning rod of the other spacer column is set in the second fixing hole of another spacer column or the second positioning rod of the limiting member is set in the second fixing hole of one of the spacer columns, a second annular space is formed on the periphery of the second protrusion of each spacer column; one of the substrates will float in the first annular space, and the other substrates will float in the second annular space.
100:電子設備 100: Electronic equipment
10:殼體 10: Shell
11:第一基板 11: First substrate
110:第一連接器 110: First connector
12:第二基板 12: Second substrate
120:第二連接器 120: Second connector
20:基板 20: Substrate
201:穿孔 201:Piercing
31:固定座 31: Fixed seat
32:第一凸柱 32: First boss
320:第一環形空間 320: The first circular space
321:第一固定孔 321: First fixing hole
33:間隔柱 33: Spacer column
34:第二凸柱 34: Second boss
340:第二環形空間 340: The second circular space
341:第二固定孔 341: Second fixing hole
342:第一定位桿 342: First positioning rod
35:限位件 35: Limiting parts
351:限位塊 351: Limit block
352:第二定位桿 352: Second positioning rod
40:殼體 40: Shell
圖1為習用多個基板的組裝示意圖。 Figure 1 is a schematic diagram of an assembly using multiple substrates.
圖2為本發明以浮動組裝構造組裝多個基板的一實施例的結構立體分解圖。 Figure 2 is a structural three-dimensional exploded view of an embodiment of the present invention for assembling multiple substrates using a floating assembly structure.
圖3為本發明以浮動組裝構造組裝多個基板的一實施例的結構立體組合圖。 Figure 3 is a three-dimensional structural assembly diagram of an embodiment of the present invention for assembling multiple substrates using a floating assembly structure.
圖4為本發明以浮動組裝構造組裝多個基板的一實施例的結構剖面組合圖。 Figure 4 is a structural cross-sectional assembly diagram of an embodiment of the present invention for assembling multiple substrates using a floating assembly structure.
圖5為本發明以浮動組裝構造組裝多個基板又一實施例的結構立體分解圖。 Figure 5 is a structural three-dimensional exploded view of another embodiment of the present invention for assembling multiple substrates using a floating assembly structure.
圖6為本發明以浮動組裝構造組裝多個基板的一實施例的結構立體組合圖。 Figure 6 is a three-dimensional structural assembly diagram of an embodiment of the present invention for assembling multiple substrates using a floating assembly structure.
圖7為本發明以浮動組裝構造組裝多個基板的一實施例的結構剖面組合圖。 Figure 7 is a structural cross-sectional assembly diagram of an embodiment of the present invention for assembling multiple substrates using a floating assembly structure.
請參閱圖2、圖3及圖4,為本發明以浮動組裝構造組裝多個基板的一實施例的結構立體分解圖、結構立體組合圖及結構剖面組合圖。如圖2、圖3及圖4所示,本實施例浮動組裝構造用以將多個基板(如兩層基板)20組裝一起,其包括一固定座31、一間隔柱33及一限位件35。其中,基板20亦可為一印刷電路板,且每一層基板20的板體上設置有至少一穿孔201。
Please refer to Figures 2, 3 and 4, which are the structural three-dimensional exploded view, structural three-dimensional assembly view and structural cross-sectional assembly view of an embodiment of the present invention for assembling multiple substrates with a floating assembly structure. As shown in Figures 2, 3 and 4, the floating assembly structure of this embodiment is used to assemble multiple substrates (such as two-layer substrates) 20 together, which includes a fixing
固定座31設於一殼體40的內表面上。本發明一實施例中,殼體40為一電子裝置的機櫃外殼,固定座31為一固定在機櫃外殼的內表面上的圓柱型的植釘。再者,固定座31的一上端面凸設有一第一凸柱32,且在第一凸柱32的中心設有一第一固定孔321。
The fixing
間隔柱33的上端面凸設有一第二凸柱34,且在第二凸柱34的中心設有一第二固定孔341。間隔柱33的下端面凸設有一第一定位桿342。限位件35
亦可以為一螺絲,其包括一限位塊(如端帽)351及一垂直於限位塊351的第二定位桿(如螺桿)352。
A
浮動組裝過程中,間隔柱33的第一定位桿342穿過第一層的基板20的穿孔201而設置在第一凸柱32的第一固定孔321中,限位件35的第二定位桿352穿過第二層的基板20的穿孔201而設置在第二凸柱34的第二固定孔341中。間隔柱33的直徑為D1,基板20的穿孔201的孔徑為D2,第一凸柱32的直徑為D3,而第二凸柱34的直徑為D4。在本發明中,D1>D2>D3,D1>D2>D4,而D3D4。
During the floating assembly process, the
本發明一實施例中,第一定位桿342及第二定位桿352分別為具有外螺紋的桿體,第一固定孔321及第二固定孔341分別為具有內螺紋的孔洞。間隔柱33的第一定位桿342及限位件35的第二定位桿352分別以一鎖固方式設置在第一凸柱32的第一固定孔321中及第二凸柱34的第二固定孔341中。
In one embodiment of the present invention, the
當間隔柱33的第一定位桿342設置在固定座31的第一凸柱32的第一固定孔321中時,一第一環形空間320形成在第一凸柱32的外圍。當限位件35的第二定位桿352設置在間隔桿33的第二凸柱34的第二固定孔341中時,一第二環形空間340形成在第二凸柱34的外圍。
When the
則,第一層基板20將被間隔柱33的下端面與固定座31的上端面限位在第一環形空間320中,且可以在第一環形空間320中進行活動。同理,第二層基板20將被限位件35的限位塊351與間隔柱33的上端面限位在第二環形空間340中,且可以在第二環形空間340中進行活動。
Then, the
於是,以浮動組裝構造組裝多個基板20的過程中,每一層的基板20一直在環形空間320、340中保持浮動的狀態,不會被組裝構造夾死。如此,
在組裝過程中,組裝構造就不需對於浮動狀態的基板20進行精準的對位,即可輕易地將基板20組裝一起,以便增加組裝上的便利性。
Therefore, in the process of assembling
請參閱圖5、圖6及圖7,為本發明以浮動組裝構造組裝多個基板的又一實施例的結構立體分解圖、結構立體組合圖及結構剖面組合圖。如圖5、圖6及圖7所示,本實施例浮動組裝構造進一步增設間隔柱33的數量,以便組裝三層或三層以上的基板20。
Please refer to Figures 5, 6 and 7, which are the structural three-dimensional exploded view, structural three-dimensional assembly view and structural cross-sectional assembly view of another embodiment of the present invention for assembling multiple substrates with a floating assembly structure. As shown in Figures 5, 6 and 7, the floating assembly structure of this embodiment further increases the number of
在浮動組裝過程中,每一間隔柱33的第一定位桿342穿過對應的基板20的穿孔201而設置在固定座31的第一凸柱32的第一固定孔321中或設置在另一間隔柱33的第二凸柱34的第二固定孔341中;而,限位件35的第二定位桿352穿過最上層基板20的穿孔201而設置在最上方的間隔柱33的第二凸柱34的第二固定孔341中。
During the floating assembly process, the
最下方的間隔柱33的第一定位桿352設置在固定座33的第一固定孔321中時,一第一環形空間320形成在第一凸柱32的外圍。其他的間隔柱33的第一定位桿352設置在另一間隔柱33的第二固定孔341中時或限位件35的第二定位桿352設置在最上方的間隔柱33的第二固定孔341中時,一第二環形空間340分別形成在每一間隔柱33的第二凸柱34的外圍。最下層的基板20將限位在第一環形空間320中且在第一環形空間320中進行活動,而其他層的基板20將限位在第二環形空間340中且在第二環形空間340中進行活動。
When the
於此,透過間隔柱33的增設,本發明浮動組裝構造將可以組裝更多層的基板20。並且,在組裝過程中,每一層的基板20都能夠在對應的環形空間320、340中進行活動,以增加組裝上的便利性。
Here, by adding the
以上所述者,僅為本發明之一實施例而已,並非用來限定本發明實施之範圍,即凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本發明的申請專利範圍內。 The above is only an example of the present invention and is not intended to limit the scope of the present invention. All equivalent changes and modifications made according to the shape, structure, features and spirit described in the patent application scope of the present invention should be included in the patent application scope of the present invention.
20:基板 20: Substrate
31:固定座 31: Fixed seat
33:間隔柱 33: Spacer column
35:限位件 35: Limiting parts
40:殼體 40: Shell
Claims (10)
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| TW112114001A TWI856611B (en) | 2023-04-14 | 2023-04-14 | Floating assembly structure for multiple substrates |
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| TW112114001A TWI856611B (en) | 2023-04-14 | 2023-04-14 | Floating assembly structure for multiple substrates |
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|---|---|
| TWI856611B true TWI856611B (en) | 2024-09-21 |
| TW202444166A TW202444166A (en) | 2024-11-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112114001A TWI856611B (en) | 2023-04-14 | 2023-04-14 | Floating assembly structure for multiple substrates |
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| Country | Link |
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| TW (1) | TWI856611B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017088324A1 (en) * | 2015-11-25 | 2017-06-01 | 无锡华瑛微电子技术有限公司 | Semiconductor processing device and method |
| CN110963137A (en) * | 2018-09-28 | 2020-04-07 | 景硕科技股份有限公司 | Film lifting mechanism |
| TWM644970U (en) * | 2023-04-14 | 2023-08-11 | 新盛力科技股份有限公司 | Floating assembly structure for multiple substrates |
-
2023
- 2023-04-14 TW TW112114001A patent/TWI856611B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017088324A1 (en) * | 2015-11-25 | 2017-06-01 | 无锡华瑛微电子技术有限公司 | Semiconductor processing device and method |
| CN110963137A (en) * | 2018-09-28 | 2020-04-07 | 景硕科技股份有限公司 | Film lifting mechanism |
| TWM644970U (en) * | 2023-04-14 | 2023-08-11 | 新盛力科技股份有限公司 | Floating assembly structure for multiple substrates |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202444166A (en) | 2024-11-01 |
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