TWI856318B - Pressure reduction drying device, pressure reduction drying method and storage medium - Google Patents

Abstract

The present invention provides a decompression drying device, a decompression drying method and a program. The subject of the present invention is to dry the coating formed on the upper surface of the substrate more evenly. In the chamber, the support part supports the substrate from below, the exhaust part exhausts the gas environment in the chamber, and the gas supply part supplies gas into the chamber. When at least one of the exhaust part and the gas supply part is used for exhausting and the gas supply part is used for supplying, the lifting part causes the support part to be repeatedly lifted and lowered.

Description

Pressure-reducing drying device, pressure-reducing drying method and storage medium

The present invention relates to a technology for drying a coating formed on the upper surface of a substrate by reducing pressure.

For example, there is a known decompression drying device for decompression drying of a coating of a photoresist or the like applied on various substrates (e.g., Patent Document 1, etc.). For various substrates, for example, semiconductor chips, glass substrates, or ceramic substrates used to form various components can be applied. For various components, for example, semiconductor devices, display panels, magnetic disks, or optical disks can be applied. For display panels, for example, liquid crystal display panels, organic electroluminescence (EL) display panels, or plasma display panels can be applied.

When using a decompression drying device to dry a coating, for example, with a substrate supported by multiple pins in a chamber, exhaust is performed from the chamber using a vacuum pump through an exhaust port at the bottom of the chamber. Then, for example, when the vacuum reaches a specified value, exhaust from the chamber is stopped, and the chamber is restored to atmospheric pressure by supplying gas into the chamber. For the gas, for example, an inert gas such as nitrogen or air can be used.

[Prior art literature]

[Patent Literature]

[Patent document 1] Japanese Patent No. 4335786

However, in a reduced pressure drying device, for example, in a coating formed on the upper surface of a substrate, if the drying speed varies depending on the location, drying unevenness (also called drying unevenness) may occur corresponding to the difference in drying speed. Drying unevenness may cause, for example, a deviation in the thickness of the coating after drying.

For example, when the pressure in the chamber is reduced, when the gas in the chamber is exhausted by a vacuum pump through the exhaust port, a continuous specific pattern of airflow (also called the first stable flow) may be generated above the substrate. As a result, for example, the drying speed of the coating corresponding to the location may differ according to the first stable flow. As a result, for example, strip-shaped drying unevenness may occur in a specific part of the coating corresponding to the first stable flow. Here, the first stable flow may be generated, for example, according to the shape of the chamber and the shape of a plate with multiple pins vertically arranged for lifting the substrate arranged in the chamber.

In addition, for example, when the pressure in the chamber is restored to atmospheric pressure by supplying gas into the chamber after decompression by exhaust, a continuous specific pattern of airflow (also called a second stable flow) may be generated above the substrate. As a result, for example, if the coating is in a semi-dry state, the drying speed of the coating corresponding to the location may differ according to the second stable flow. As a result, for example, strip-shaped drying unevenness may occur in a specific part of the coating corresponding to the second stable flow. Here, the second stable flow may be generated, for example, according to the shape of the chamber and the shape of a plate on which a plurality of pins are vertically arranged for lifting and lowering the substrate arranged in the chamber.

In addition, for example, on a substrate, due to the contact of multiple pins, a temperature difference may occur between a portion supported by multiple pins and a portion surrounding the portion. As a result, for example, a difference may occur in the drying speed of the coating according to the temperature difference caused by the multiple pins. As a result, for example, drying unevenness may occur on the coating corresponding to the arrangement of the multiple pins. Here, for example, during the reduced pressure drying of the coating, although the temperature of the substrate decreases due to the vaporization heat generated when the solvent, etc. vaporizes from the coating, the temperature of the multiple pins is difficult to change regardless of whether the heat capacity of the multiple pins is large or the multiple pins are connected to a chamber with a large heat capacity. Therefore, for example, a temperature difference may occur on the substrate corresponding to the arrangement of the multiple pins.

In addition, for example, when the pressure in the chamber is reduced, the solvent in the coating vaporizes in the area on the upper surface of the substrate where the coating is formed (also called the coating area), whereas the solvent does not vaporize in the area on the upper surface of the substrate where the coating is not formed (also called the non-coating area).

Here, for example, it is assumed that a coating film is formed on substantially the entire upper surface of the substrate. In this case, for example, above the end of the coating area, the components of the evaporated solvent are easily diffused to the outside of the substrate, so the concentration of the components of the evaporated solvent is difficult to increase, and the coating film at the end of the coating area is easy to dry. On the other hand, for example, above the central part of the coating area, the components of the evaporated solvent are difficult to diffuse, so the concentration of the components of the evaporated solvent is easy to increase, and the coating film at the central part of the coating area is difficult to dry. As a result, for example, a difference in drying speed may occur between the central part and the end of the coating area. As a result, for example, in the coating area, uneven drying may occur due to the difference in drying speed between the center and the end.

Here, for example, it is assumed that a coating film is formed in a plurality of regions corresponding to a plurality of elements in the upper surface of the substrate. In this case, for example, above the end of each coating region, the components of the evaporated solvent are easily diffused to the outer side or non-coating region on the substrate, so the concentration of the components of the evaporated solvent is difficult to increase, and the coating film at the end of each coating region is easy to dry. On the other hand, for example, above the central part of each coating region, the components of the evaporated solvent are difficult to diffuse, so the concentration of the components of the evaporated solvent is easy to increase, and the coating film at the central part of each coating region is difficult to dry. As a result, for example, a difference in drying speed may occur between the central part and the end of each coating region. As a result, for example, in each coating area, uneven drying may occur due to the difference in drying speed between the center and the end.

The present invention is made in view of the above-mentioned problem, and its purpose is to provide a technology for drying the coating formed on the upper surface of the substrate more uniformly.

In order to solve the above problem, the decompression drying device of the first embodiment is a decompression drying device for drying a coating formed on the upper surface of a substrate, comprising: a chamber, a support part, a lifting part, an exhaust part, an air supply part, and a control part. The chamber accommodates the substrate. The support part supports the substrate from below in the chamber. The lifting part lifts and lowers the support part in the chamber. The exhaust part exhausts the gas environment in the chamber. The air supply part supplies gas into the chamber. When the control part performs at least one of exhausting the exhaust part and supplying the air by the air supply part, the lifting part controls the lifting part so that the support part is repeatedly lifted and lowered.

The decompression drying device of the second embodiment is the decompression drying device of the first embodiment, wherein the control unit controls the lifting unit when exhausting air using the exhaust unit and supplying air using the air supply unit, so that the support unit repeatedly rises and falls.

The decompression drying method of the third embodiment is a decompression drying method for drying a coating formed on the upper surface of the substrate using a decompression drying device including a chamber, a support part, a lifting part, an exhaust part, and an air supply part, wherein the chamber accommodates the substrate, the support part supports the substrate from below in the chamber, the lifting part lifts and lowers the support part in the chamber, the exhaust part exhausts the gas environment in the chamber, and the air supply part supplies gas into the chamber, and the decompression drying method includes an exhaust step, an air supply step, and a lifting step. In the exhaust step, the gas environment in the chamber is exhausted by the exhaust part while the substrate is supported from below by the support part in the chamber. In the gas supply step, after the exhaust step, in the state where the substrate is supported from below by the support part in the chamber, gas is supplied into the chamber through the gas supply part. In the lifting step, when performing at least one of the exhaust step and the gas supply step, the support part is repeatedly lifted and lowered by the lifting part.

The decompression drying method of the fourth embodiment is the decompression drying method of the third embodiment, wherein the lifting step comprises: a first lifting step, in which the support part is repeatedly lifted and lowered by the lifting part when the exhaust step is performed; and a second lifting step, in which the support part is repeatedly lifted and lowered by the lifting part when the air supply step is performed.

The program of the fifth embodiment is in a reduced pressure drying device for drying a coating formed on the upper surface of the substrate, which includes a chamber, a support part, a lifting part, an exhaust part, an air supply part, and a control part. When executed by a processor included in the control part, an exhaust step, a air supply step, and a lifting step are executed. The chamber accommodates the substrate, the support part supports the substrate from below in the chamber, the lifting part lifts and lowers the support part in the chamber, the exhaust part exhausts the gas environment in the chamber, the air supply part supplies gas into the chamber, and the control part controls the exhaust part, the air supply part, and the lifting part. In the exhaust step, the control unit exhausts the gas environment in the chamber through the exhaust unit while the substrate is supported from below by the support unit in the chamber. In the gas supply step, after the exhaust step, the control unit supplies gas into the chamber through the gas supply unit while the substrate is supported from below by the support unit in the chamber. In the lifting step, the control unit repeatedly lifts and lowers the support unit through the lifting unit when performing at least one of the exhaust step and the gas supply step.

The program of the sixth embodiment is the program of the fifth embodiment, wherein the lifting step includes: a first lifting step, in which the control unit repeatedly lifts and lowers the support unit through the lifting unit when executing the exhaust step; and a second lifting step, in which the control unit repeatedly lifts and lowers the support unit through the lifting unit when executing the air supply step.

According to any one of the reduced pressure drying device of the first embodiment, the reduced pressure drying method of the third embodiment, and the program of the fifth embodiment, for example, the substrate is repeatedly raised and lowered when at least one of the gas environment in the chamber is exhausted and the gas is supplied to the chamber. As a result, for example, in at least one of the exhaust and the supply, turbulence of the airflow can be generated in the chamber. As a result, for example, in at least one of the exhaust and the supply, it is difficult to generate a continuous specific pattern of airflow in the chamber, and the concentration of the components of the solvent evaporated from the coating is difficult to be biased on the coating. Therefore, for example, the coating formed on the upper surface of the substrate can be dried more uniformly.

According to the decompression drying device of the second embodiment, the decompression drying method of the fourth embodiment, and any one of the procedures of the sixth embodiment, for example, the substrate is repeatedly raised and lowered when the gas environment in the chamber is exhausted and the gas is supplied to the chamber. As a result, for example, whether it is exhausting or supplying, turbulence of the airflow can be generated in the chamber. As a result, for example, whether it is exhausting or supplying, it is difficult to generate a continuous specific pattern of airflow in the chamber, and the concentration of the components of the solvent evaporated from the coating is difficult to be biased on the coating. Therefore, for example, the coating formed on the upper surface of the substrate can be dried more uniformly.

1: Pressure reduction drying device

9: Substrate

10: Chamber

10b: Sealing material

10l: Cover

10s: Inner space

11: Bottom plate

11h, 40h: through hole

12: Side wall

13: Top plate

14: Move in and move out

15: Gate part (gate valve)

16: Open and close the drive unit

16a, 16b, 16c, 16d: Exhaust port

16f: Air supply port

20: Support part

21: Support plate

22: Support pin

30: Exhaust section

31: Exhaust pipe

31a, 31b, 31c, 31d: Individual piping

31e: Main pipe

32: Vacuum pump

40: Bottom rectifier plate

41: Diagonal

50: Side rectifier plate

60: Air supply department

61: Air supply piping

62: Air supply source

70: Pressure gauge

80: Control Department

81: Open/Close control unit

82: Lifting control unit

83: Switching control unit

84: Exhaust control unit

85: Pump control unit

86: Air supply control department

90: coating

100: Lifting unit

100a: Main body

100b: Moving part

801: Processor

802: Memory

803: Memory Department

803p: Program (computer program)

804: Input Department

805: Output unit

806: Communications Department

807:Driver

807m: Memory media

A1: Area (formed area, painted area)

A2: Area (non-painted area)

A3: Area (covered area)

A4: Area (exposed area)

F1: First surface (upper surface)

F2: Second side (lower surface)

H1: descending position

H2: rising position

S1, S2, S3, S4, S5, S6, S7, S8, S9, S10, Sa1, Sa2, Sa3, Sa4, Sa5, Sa6, Sa7, Sa8, Sa9, Sa10, Sb1, Sb2, Sb3, Sb4, Sb5, Sb6, Sb7, Sb8, Sb9, Sb10: steps

Va, Vb, Vc, Vd: single valve

Ve: Main valve

Vf: Air supply valve

FIG1 is a diagram showing an example of a longitudinal section of a reduced pressure drying device in an embodiment.

FIG2 is a diagram showing an example of a cross-section of a reduced pressure drying device in an embodiment.

FIG3 is a diagram showing an example of a longitudinal section of a reduced pressure drying device of an embodiment.

FIG4 is a three-dimensional diagram showing an example of a substrate.

FIG5 is a diagram showing an example of a longitudinal cross-section of a portion of a substrate.

FIG6 is a block diagram conceptually showing the functions implemented in the control unit.

FIG7 is a flow chart showing an example of a process of a reduced pressure drying treatment in an implementation form.

FIG8 is a flow chart showing an example of a process of a reduced pressure drying process of a modified example.

FIG9 is a flow chart showing an example of a process of a reduced pressure drying process of a modified example.

FIG. 10 is a diagram showing an example of a longitudinal section of a reduced pressure drying device of a modified example.

Hereinafter, an embodiment of the present invention and various variations are described with reference to the attached drawings. In the attached drawings, parts with the same structure and function are marked with the same symbols, and repeated descriptions are omitted in the following description. The attached drawings are only schematically shown, and the dimensions and positional relationships of the various structures in each drawing are not accurately illustrated.

<1. Structure of pressure-reducing drying device>

FIG. 1 is a diagram schematically showing an example of a longitudinal section of a decompression drying device 1 in an embodiment. FIG. 2 is a diagram schematically showing an example of a transverse section of a decompression drying device 1 in an embodiment. FIG. 3 is a diagram schematically showing an example of a longitudinal section of a decompression drying device 1 in an embodiment. The longitudinal section of FIG. 1 and the longitudinal section of FIG. 3 have a relationship of being observed from directions that differ by about 90 degrees. In FIG. 3, in order to avoid complication of the attached drawings, for the sake of convenience, the structures related to the exhaust section 30, the air supply section 60, the pressure gauge 70 and the control section 80 described later are omitted. The decompression drying device 1 is a device for drying a coating 90 (see FIG. 5) formed on the upper surface of a substrate 9.

For the substrate 9, for example, a glass substrate, a semiconductor wafer or a ceramic substrate can be applied. The substrate 9 is, for example, a flat substrate having a first surface F1 (refer to FIG. 4 and FIG. 5) as a first main surface and a second surface F2 (refer to FIG. 5) as a second main surface opposite to the first surface. For example, in the reduced pressure drying device 1, the first surface F1 of the substrate 9 is set as the upper surface of the substrate 9, and the second surface F2 of the substrate 9 is set as the lower surface of the substrate 9. Here, it is appropriate to cite a specific example in which a rectangular glass substrate is applied to the substrate 9 for explanation. On the first surface F1 of the substrate 9, for example, a coating film 90 is partially formed by pre-coating a processing liquid containing an organic material and a solvent. The coating of the processing liquid is performed, for example, by a slit coater or an inkjet device. For the treatment liquid, for example, a coating liquid such as a liquid containing a polyimide precursor and a solvent (also called a polyimide (PI) liquid) or an anti-etching agent liquid can be applied. For the polyimide precursor, for example, polyamide acid (polyamic acid) can be applied. For the solvent, for example, NMP (N-methyl-2-pyrrolidone: N-Methyl-2-Pyrrolidone) can be applied. In addition, for example, when the reduced pressure drying device 1 is applied to the manufacturing step of the organic EL display, the coating film 90 can be dried in the reduced pressure drying device 1 to become a hole injection layer, a hole transport layer or a light-emitting layer of the organic EL display panel.

FIG. 4 is a perspective view showing an example of a substrate 9. FIG. 5 is a view showing an example of a longitudinal section of a portion of the substrate 9. As shown in FIG. 4 , the substrate 9 has a rectangular shape with different lengths in the longitudinal and transverse directions when viewed from above. A plurality of areas A1 for forming components and the like (also referred to as formed areas and coating areas) are arranged on the upper surface of the substrate 9. In the example of FIG. 4 , four rectangular coating areas A1 are arranged in a matrix of two rows and two columns on the upper surface of the substrate 9. However, the shape, number, and arrangement of the coating area A1 are not limited to the example described above. The coating film 90 is formed in each coating area A1 according to a desired pattern by a slit coating machine or an inkjet device in a coating step before a decompression drying step using a decompression drying device 1. For the desired pattern, for example, a circuit pattern can be applied. Here, for example, as shown in FIG. 5, each coating area A1 has an area (also referred to as a covered area) A3 covered by the coating film 90 and an exposed area (also referred to as an exposed area) A4 not covered by the coating film 90. In addition, the area (also referred to as a non-coating area) A2 between adjacent coating areas A1 becomes an exposed area (exposed area) A4 not covered by the coating film 90.

As shown in FIG. 1 and FIG. 2 , the decompression drying device 1 includes, for example, a chamber 10, a support portion 20, a lifting portion 100, an exhaust portion 30, an air supply portion 60, and a control portion 80. In addition, the decompression drying device 1 includes, for example, a bottom straightening plate 40, a side straightening plate 50, and a pressure gauge 70.

The chamber 10 is a portion for accommodating the substrate 9. For the chamber 10, a pressure-resistant container having an internal space 10s for accommodating the substrate 9 can be applied. The chamber 10 is fixed to, for example, an apparatus frame which is not shown in the figure. The shape of the chamber 10 is, for example, a flat rectangular parallelepiped. The chamber 10 has, for example, a substantially square bottom plate portion 11, four side wall portions 12, and a substantially square top plate portion 13. The four side wall portions 12 connect, for example, the four end sides of the bottom plate portion 11 and the four end sides of the top plate portion 13 in the up-down direction. For example, a loading/unloading port 14 and a gate portion (also referred to as a gate valve) 15 for opening and closing the loading/unloading port 14 are provided in one of the four side wall portions 12. The gate portion 15 is connected to the opening and closing drive portion 16, for example. In FIG. 3, the opening and closing drive portion 16 is conceptually shown to avoid complication of the attached figure. For the opening and closing drive portion 16, for example, a drive mechanism such as a cylinder can be applied. Here, for example, by the action of the opening and closing drive portion 16, the gate portion 15 can move between a position (also referred to as a closed position) for closing the loading and unloading port 14 and a position (also referred to as an open position) for opening the loading and unloading port 14.

Here, for example, when the gate portion 15 is configured in the closed position, the internal space 10s of the chamber 10 is sealed. For example, when the gate portion 15 is configured in the open position, the substrate 9 can be moved into the internal space 10s of the chamber 10 and the substrate 9 can be moved out of the internal space 10s of the chamber 10 through the loading and unloading port 14.

The support part 20 is a part that supports the substrate 9 from below in the chamber 10. For example, the support part 20 is located in the internal space 10s of the chamber 10, and can support the substrate 9 accommodated in the internal space 10s of the chamber 10 from below. The support part 20 has, for example, a plurality of support plates 21 and a plurality of support pins 22. The plurality of support plates 21 are arranged at intervals in the horizontal direction, for example. A plurality of support pins 22 are vertically provided on the upper surface of each support plate 21. The substrate 9 is, for example, arranged above the plurality of support plates 21, and the upper ends of the plurality of support pins 22 are in contact with the lower surface of the substrate 9, whereby the substrate 9 is supported in a horizontal posture.

The lifting unit 100 is a part that lifts and lowers the support unit 20 in the chamber 10. In other words, for example, the lifting unit 100 has a mechanism (also referred to as a lifting mechanism) that can lift and lower the support unit 20 located in the internal space 10s of the chamber 10. For example, the substrate 9 supported by the support unit 20 can be lifted and lowered by the lifting unit 100. In FIG1 , in order to avoid the complication of the drawings, the lifting unit 100 is conceptually shown. As shown in FIG3 , for the lifting unit 100, for example, a driving device such as a direct-acting motor or a cylinder can be applied. The lifting unit 100 has, for example, a main body 100a and a moving part 100b. The main body 100a is, for example, fixed to an apparatus frame that is not shown in the figure outside the chamber 10. The moving part 100b can, for example, move in the up and down directions relative to the main body 100a. For example, a rod-shaped member or the like can be applied to the moving part 100b. The moving part 100b exists in a state of being inserted into the through hole 11h of the bottom plate part 11 of the chamber 10, for example. Moreover, for example, a support part 20 is fixed to the upper end of the moving part 100b. Here, for example, if a bellows or the like is provided between the lower surface of the bottom plate part 11 and the moving part 100b, the gap between the bottom plate part 11 and the moving part 100b can be sealed. For example, when the support portion 20 has a plurality of support plates 21, the moving portion 100b has a rod-shaped portion (also referred to as a rod-shaped portion) fixed to the support plate 21 for each support plate 21 and inserted into the through hole 11h of the bottom plate portion 11, a portion connecting the plurality of rod-shaped portions (also referred to as a connecting portion), and a portion connected to the connecting portion and slidably supported on the main body 100a (also referred to as a sliding portion).

Here, for example, when the lifting part 100 is operated, the support part 20 is lifted and lowered in the vertical direction between the lowered position H1 (the position indicated by the dotted line in Figures 1 and 3) and the raised position H2 (the position indicated by the double-dotted line in Figures 1 and 3) higher than the lowered position H1. At this time, for example, a plurality of support plates 21 can be lifted and lowered as a whole.

The exhaust section 30 is a part that performs the operation of exhausting the gas environment in the chamber 10 (also called exhaust). For the exhaust section 30, for example, a mechanism that sucks gas from the internal space 10s of the chamber 10 to reduce the pressure in the chamber 10 can be applied. As shown in Figures 1 and 2, four exhaust ports 16a, 16b, 16c, and 16d are provided on the bottom plate 11 of the chamber 10. The four exhaust ports 16a, 16b, 16c, and 16d are configured to be located below the substrate 9 supported by the support portion 20. In addition, the four exhaust ports 16a, 16b, 16c, and 16d are located, for example, below the bottom surface rectifying plate 40 described later. The exhaust section 30, for example, has an exhaust pipe 31 connected to four exhaust ports 16a, 16b, 16c, and 16d, four individual valves Va, Vb, Vc, and Vd, a main valve Ve, and a vacuum pump 32. The exhaust pipe 31, for example, has four individual pipes 31a, 31b, 31c, and 31d and one main pipe 31e. For example, one end of the individual pipe 31a is connected to the exhaust port 16a, one end of the individual pipe 31b is connected to the exhaust port 16b, one end of the individual pipe 31c is connected to the exhaust port 16c, and one end of the individual pipe 31d is connected to the exhaust port 16d. For example, the other ends of the four individual pipes 31a, 31b, 31c, and 31d merge and are connected to one end of the main pipe 31e. For example, the other end of the main pipe 31e is connected to the vacuum pump 32. For example, the individual valve Va is set on the path of the individual pipe 31a, the individual valve Vb is set on the path of the individual pipe 31b, the individual valve Vc is set on the path of the individual pipe 31c, and the individual valve Vd is set on the path of the individual pipe 31d. For example, the main valve Ve is set on the path of the main pipe 31e.

Here, for example, when the loading and unloading port 14 is closed by the gate portion 15, at least a part of the four individual valves Va, Vb, Vc, and Vd and a main valve Ve are opened to operate the vacuum pump 32, and the gas in the chamber 10 is discharged to the outside of the chamber 10 through the exhaust pipe 31. Thus, for example, the pressure of the internal space 10s of the chamber 10 can be reduced.

The four individual valves Va, Vb, Vc, and Vd are, for example, valves used to adjust the exhaust volume from the four exhaust ports 16a, 16b, 16c, and 16d individually. For each of the four individual valves Va, Vb, Vc, and Vd, for example, a valve that switches between an open state and a closed state based on a command from the control unit 80 (also called an on-off valve) can be applied. The main valve Ve is, for example, a valve used to adjust the total exhaust volume from the four exhaust ports 16a, 16b, 16c, and 16d. For the main valve Ve, for example, a valve that can adjust the opening based on a command from the control unit 80 (also called an opening control valve) can be applied.

Here, for example, by locating the four exhaust ports 16a, 16b, 16c, and 16d below the substrate 9 supported by the support portion 20, the uniformity of the flow of gas above the substrate 9 can be promoted, and the occurrence of uneven drying of the coating 90 formed on the upper surface of the substrate 9 can be reduced compared to the case where the exhaust ports are located above the substrate 9.

The bottom straightening plate 40 is a plate for limiting the flow of gas in the internal space 10s when the exhaust portion 30 is used to reduce the pressure in the chamber 10. For example, the bottom straightening plate 40 is arranged between the substrate 9 supported by the support portion 20 and the bottom plate portion 11 of the chamber 10. More specifically, for example, the bottom straightening plate 40 is arranged on the lower side of the support portion 20 in a manner that is spaced from the support portion 20 arranged at the descending position H1, and is arranged on the upper side of the bottom plate portion 11 in a manner that is spaced from the upper surface of the bottom plate portion 11. In addition, the bottom straightening plate 40 exists, for example, in a manner that is horizontally extended along the upper surface of the bottom plate portion 11. The bottom straightening plate 40 is fixed to the bottom plate portion 11 of the chamber 10 via a plurality of pillars that are omitted from the figure. As shown in FIG. 2 , for example, the bottom straightening plate 40 has a square shape when viewed from above. Moreover, for example, the length of each side of the bottom straightening plate 40 when viewed from above is longer than any of the long sides and short sides of the rectangular substrate 9. Therefore, for example, regardless of the orientation of the substrate 9 disposed on the support portion 20, the bottom straightening plate 40 is larger than the substrate 9 when viewed from above. In addition, the bottom straightening plate 40 has, for example, a through hole 40h in a state where the moving portion 100b of the lifting portion 100 is inserted. In the through hole 40h, the bottom straightening plate 40 and the moving portion 100b exist with a very small gap.

The side straightening plate 50 is a plate used together with the bottom straightening plate 40 to restrict the flow of gas in the internal space 10s when the pressure in the chamber 10 is reduced by the exhaust portion 30. For example, the side straightening plate 50 is arranged between the substrate 9 supported by the support portion 20 arranged at the lowered position H1 and the side wall portion 12 of the chamber 10. More specifically, for example, the side straightening plate 50 is arranged on the outer side of the substrate 9 at a distance from the end of the substrate 9 supported by the support portion 20 arranged at the lowered position H1, and is located on the inner side of the side wall portion 12 at a distance from the inner surface of the side wall portion 12. Here, for example, four side straightening plates 50 are arranged so as to surround the substrate 9 supported by the support portion 20. Each side straightening plate 50 exists, for example, in a manner extending along the inner surface of the side wall portion 12. Therefore, for example, the four side straightening plates 50 are straightening plates that are formed as a square tube-shaped straightening plate that surrounds the substrate 9 as a whole. In addition, for example, the bottom straightening plate 40 and the four side straightening plates 50 are straightening plates that are formed as a box-shaped straightening plate with a bottom tube shape as a whole.

Here, for example, when the exhaust section 30 is used to reduce the pressure in the chamber 10, the gas in the internal space 10s of the chamber 10 passes through the space between the side straightening plate 50 and the side wall section 12, the space between the bottom straightening plate 40 and the bottom plate section 11, and the exhaust port 16a, the exhaust port 16b, the exhaust port 16c, and the exhaust port 16d in the order described above, and is discharged to the outside of the chamber 10. In this way, for example, the gas flows in the space away from the substrate 9, and it is difficult to form an airflow near the substrate 9. Moreover, it is difficult to generate a concentrated airflow around the substrate 9. As a result, for example, the generation of uneven drying of the coating 90 formed on the upper surface of the substrate 9 can be reduced.

In addition, here, for example, as shown in FIG. 2, the box-shaped rectifying plate formed by the bottom rectifying plate 40 and the four side rectifying plates 50 has a square shape when viewed from above. Moreover, the length of each side of the box-shaped rectifying plate when viewed from above is longer than any of the long sides and short sides of the rectangular substrate 9. Therefore, for example, regardless of the orientation of the substrate 9 arranged on the support portion 20, when the exhaust portion 30 is used to depressurize the chamber 10, the flow of the gas in the internal space 10s is uniform, and the flow of the gas in the internal space 10s is unlikely to differ depending on the orientation of the substrate 9.

In addition, here, for example, as shown in FIG. 2, a structure is adopted in which the four exhaust ports 16a, 16b, 16c, and 16d are all located on the diagonal 41 of the bottom rectifying plate 40 of a square shape when viewed from above. In this case, for example, through each exhaust port 16a, exhaust port 16b, exhaust port 16c, and exhaust port 16d, a symmetrical airflow relative to the center (intersection of two diagonal lines 41) of the bottom rectifying plate 40 can be formed. As a result, for example, a more uniform airflow can be formed in the internal space 10s of the chamber 10.

In addition, here, for example, three of the four side straightening plates 50 are fixed to the side wall portion 12 of the chamber 10. However, the remaining one of the four side straightening plates 50 may be moved relative to the side wall portion 12 and the bottom straightening plate 40, for example, to ensure a path for carrying in and carrying out the substrate 9 between the chamber 10 and the outside. In this case, the one side straightening plate 50 may be configured to move together with the gate portion 15, for example. Thus, for example, when the gate portion 15 moves from the closed position to the open position, the one side straightening plate 50 also moves, and it is possible to ensure a path for carrying in and carrying out the substrate 9 between the chamber 10 and the outside. Here, for example, when the movable side straightening plate 50 is arranged at a regular position (position constituting the box-shaped straightening plate), if it is not in contact with other side straightening plates 50 and the bottom straightening plate 40, the movable side straightening plate 50 does not slide with other side straightening plates 50 and the bottom straightening plate 40. As a result, for example, dust generated by sliding contact of components is unlikely to be generated. On the other hand, for example, if the box-shaped straightening plate is configured in a state where the movable side straightening plate 50, other side straightening plates 50 and the bottom straightening plate 40 are in contact with each other, it is unlikely that a gap will be generated in the box-shaped straightening plate. In this case, for example, when the exhaust portion 30 is used to reduce the pressure in the chamber 10, the flow of gas in the internal space 10s can be further restricted.

The air supply section 60 is a portion that performs the operation of supplying gas into the chamber 10 (also referred to as air supply). The air supply section 60 can be applied, for example, to a mechanism for supplying gas to the internal space 10s of the chamber 10 whose pressure has dropped due to exhaust from the exhaust section 30, so as to restore the pressure in the chamber 10 to atmospheric pressure. As shown in FIG. 1 , an air supply port 16f is provided on the bottom plate portion 11 of the chamber 10, for example. The air supply port 16f is located, for example, below the bottom surface straightening plate 40. The air supply section 60 has an air supply pipe 61 connected to the air supply port 16f, an air supply valve Vf, and an air supply source 62. For example, one end of the air supply pipe 61 is connected to the air supply port 16f. For example, the other end of the air supply pipe 61 is connected to the air supply source 62. For example, the air supply valve Vf is provided on the path of the air supply pipe 61.

Here, for example, when the air supply valve Vf is opened, gas is supplied from the air supply source 62 to the internal space 10s of the chamber 10 via the air supply pipe 61 and the air supply port 16f. As a result, the air pressure in the chamber 10 can be increased. The gas supplied from the air supply source 62 can be, for example, an inert gas such as nitrogen, or clean dry air. Clean dry air can be prepared by, for example, purifying the air in a general environment to remove particles and moisture.

The pressure gauge 70 is a sensor for measuring the air pressure of the internal space 10s of the chamber 10. As shown in FIG. 1 , for example, the pressure gauge 70 is installed in a part of the chamber 10. The pressure gauge 70 can measure the air pressure of the internal space 10s of the chamber 10, for example, and output its measurement result to the control unit 80.

The control unit 80 is a unit for controlling the operation of each part of the decompression drying device 1. For example, the control unit 80 can control the exhaust unit 30, the air supply unit 60, and the lifting unit 100. The control unit 80 includes, for example, a computer having a processor 801 such as a central processing unit (CPU), a memory 802 such as a random access memory (RAM), and a memory unit 803 of a hard disk drive. The memory unit 803 stores, for example, a computer program (also called a program) 803p and various data for executing a process (also called a decompression drying process) for drying the coating 90 on the substrate 9 by decompression in the decompression drying device 1. The memory unit 803 stores, for example, a program 803p, and functions as a non-temporary memory medium that can be read by a computer. The control unit 80 reads, for example, the program 803p and data from the memory unit 803 to the memory 802, and performs calculations in accordance with the program 803p and the data in the processor 801, thereby controlling the operation of each part of the decompression drying device 1. Therefore, for example, the program 803p can be executed by the processor 801 included in the control unit 80 in the decompression drying device 1 to perform decompression drying processing.

In addition, the control unit 80 may be connected to, for example, an input unit 804, an output unit 805, a communication unit 806, and a driver 807. The input unit 804 is, for example, a part that inputs various signals to the control unit 80 in response to the user's actions. The input unit 804 may include, for example, an operation unit that inputs a signal corresponding to the user's operation, a microphone that inputs a signal corresponding to the user's voice, and various sensors that input a signal corresponding to the user's movement. The output unit 805 is, for example, a part that outputs various information in a manner that the user can recognize. The output unit 805 may include, for example, a display unit, a projector, and a speaker. The display unit may also be a touch screen integrated with the input unit 804. The communication unit 806 is, for example, a part that transmits and receives various information with an external device such as a server through a wired or wireless communication component. For example, a program 803p received from an external device through the communication unit 806 may also be stored in the memory unit 803. The drive 807 is, for example, a part that can load and unload a removable storage medium 807m such as a magnetic disk or an optical disk. The drive 807, for example, performs data transmission between the storage medium 807m and the control unit 80 when the storage medium 807m is installed. For example, the storage medium 807m storing the program 803p may be installed in the drive 807, and the program 803p may be read from the storage medium 807m and stored in the storage unit 803. Here, the storage medium 807m, such as the storage program 803p, functions as a non-temporary storage medium that can be read by a computer.

FIG6 is a block diagram conceptually showing the functions implemented in the control unit 80. As shown in FIG6, the control unit 80 is electrically connected to, for example, the opening and closing drive unit 16, the lifting unit 100, the four individual valves Va, Vb, Vc, Vd, the main valve Ve, the vacuum pump 32, the air supply valve Vf, and the pressure gauge 70. The control unit 80 can control the operation of the above-mentioned parts by referring to the measured value output from the pressure gauge 70, for example.

As conceptually shown in FIG. 6 , the control unit 80 has, for example, an opening and closing control unit 81, a lifting control unit 82, a switching control unit 83, an exhaust control unit 84, a pump control unit 85, and an air supply control unit 86 as functional structures implemented. For example, the opening and closing control unit 81 controls the operation of the opening and closing drive unit 16. For example, the lifting control unit 82 controls the operation of the lifting unit 100. For example, the switching control unit 83 controls the opening and closing states of four individual valves Va, Vb, Vc, and Vd, respectively. For example, the exhaust control unit 84 controls the opening and closing state and the opening degree of the main valve Ve. For example, the pump control unit 85 controls the operation of the vacuum pump 32. For example, the air supply control unit 86 controls the opening and closing state of the air supply valve Vf. The functions of each part of the control unit 80 are realized by, for example, the processor 801 performing calculations according to the program 803p, etc.

<2. Pressure reduction and drying treatment>

Next, the decompression drying process of the substrate 9 using the decompression drying device 1 is described. FIG. 7 is a flow chart showing an example of the process of the decompression drying process in an embodiment. The process of the decompression drying process is implemented, for example, by executing the program 803p in the processor 801 included in the control unit 80. Here, for example, the processing of steps S1 to S10 of FIG. 7 is performed in the order described.

When the reduced pressure drying device 1 is used to perform the reduced pressure drying process, for example, first, the substrate 9 is moved into the chamber 10 (step S1). At this time, an undried coating 90 is formed on the upper surface of the substrate 9. In step S1, for example, First, the opening and closing control unit 81 operates the opening and closing drive unit 16, and moves the gate unit 15 from the closed position to the open position, thereby opening the loading and unloading port 14. Then, for example, the transport robot, which is not shown in the figure, carries the substrate 9 into the internal space 10s of the chamber 10 through the loading and unloading port 14 of the chamber 10 while placing the substrate 9 on the fork-shaped manipulator. At this point in time, the support unit 20 is, for example, arranged at the lowered position H1. The transport robot, for example, places the substrate 9 on the support portion 20 while inserting a fork-shaped manipulator between the plurality of support plates 21 of the support portion 20. When the substrate 9 is placed on the support portion 20, the transport robot retreats to the outside of the chamber 10. Then, for example, the opening and closing control unit 81 operates the opening and closing drive unit 16 again, and moves the gate unit 15 from the open position to the closed position, thereby closing the loading and unloading port 14. Thus, the substrate 9 is accommodated in the internal space 10s of the chamber 10.

Next, for example, the decompression drying device 1 starts the action of repeatedly lifting and lowering the support part 20 (step S2). Here, for example, the lifting control part 82 starts the action of repeatedly lifting and lowering the support part 20 through the lifting part 100. At this time, for example, the support part 20 starts to be lifted and lowered between the descending position H1 and the ascending position H2 in the vertical direction. As a result, for example, the distance between the upper surface of the substrate 9 and the top plate part 13 of the chamber 10 repeatedly changes between a long state and a short state. Here, the period (cycle) of lifting and lowering the support part 20 is set to, for example, about several seconds. The distance between the descending position H1 and the ascending position H2 is set to, for example, about 10 millimeters (mm) to 100 mm.

Next, for example, the decompression drying device 1 starts exhausting gas from the chamber 10 (step S3). Thus, for example, the control unit 80 executes a step (also referred to as an exhaust step) of exhausting the gas environment in the chamber 10 through the exhaust unit 30 while the substrate 9 is supported from below by the support unit 20 in the chamber 10. At this time, for example, when the control unit 80 executes the exhaust step, it becomes a state of executing a step (also referred to as a first lifting step) of repeatedly lifting the support unit 20 through the lifting unit 100. In other words, when the control unit 80, for example, performs exhaust using the exhaust unit 30, it controls the lifting unit 100 so that the support unit 20 is repeatedly lifted and lowered.

Here, for example, the pump control unit 85 starts the operation of the vacuum pump 32, the switching control unit 83 opens at least a part of the plurality of individual valves Va, Vb, Vc, and Vd, and the exhaust control unit 84 opens the main valve Ve. Thus, for example, the gas starts to be discharged from the internal space 10s of the chamber 10 to the exhaust pipe 31, and the air pressure in the chamber 10 starts to drop from the atmospheric pressure.

Here, for example, when exhausting from the chamber 10, the space between the upper surface of the substrate 9 and the ceiling 13 of the chamber 10 changes repeatedly between a contracted state and an expanded state by repeatedly lifting and lowering the support portion 20. At this time, for example, airflow turbulence occurs in the chamber 10. As a result, for example, it is difficult to produce a phenomenon of a continuous specific pattern of airflow (also called a first stable flow) on the coating 90. As a result, for example, it is difficult to produce a difference in drying speed corresponding to the location in the coating 90, and it is difficult to produce a bad condition of stripe-shaped drying unevenness at a specific location in the coating 90.

In addition, for example, even if a temperature difference occurs in the substrate 9 due to the presence of a plurality of support pins 22, the difference in concentration between the solvent component evaporated from the coating 90 directly above the portion of the substrate 9 supported by the support pins 22 and the solvent component evaporated from the coating 90 around it can be reduced by the stirring effect caused by the turbulence of the airflow. In other words, for example, the concentration of the solvent component evaporated from the coating 90 is unlikely to be biased on the coating 90. As a result, for example, it is unlikely to cause a defective condition of uneven drying at a portion of the coating 90 corresponding to the position of the support pins 22.

In addition, for example, the difference between the concentration of the solvent component evaporated from the coating film 90 just above the center of the coating area A1 in the substrate 9 and the concentration of the solvent component evaporated from the coating film 90 just above the end of the coating area A1 can be reduced by the stirring effect caused by the turbulence of the airflow. In other words, for example, the concentration of the solvent component evaporated from the coating film 90 is unlikely to be biased on the coating film 90. As a result, for example, it is unlikely to cause a defective condition of uneven drying at a portion of the coating film 90 corresponding to the shape of the coating area A1.

Therefore, for example, when the exhaust unit 30 exhausts the air from the chamber 10, if the support unit 20 is repeatedly raised and lowered, the coating 90 formed on the upper surface of the substrate 9 can be dried more evenly.

In addition, for example, when exhausting the exhaust section 30, the opening of the main valve Ve can be appropriately changed through the exhaust control section 84, and the opening and closing states of the four individual valves Va, Vb, Vc, and Vd can be switched in sequence through the switching control section 83.

Next, for example, the decompression drying device 1 determines whether the internal space 10s of the chamber 10 has reached a specified vacuum degree (step S4). Here, for example, the control unit 80 determines whether the internal space 10s of the chamber 10 has dropped to a specified pressure corresponding to the specified vacuum degree based on the measurement result obtained using the pressure gauge 70. For example, the determination of step S4 is repeated until the internal space 10s reaches the specified vacuum degree. Then, when the internal space 10s reaches the specified vacuum degree, the decompression drying device 1 ends the exhaust from the chamber 10 (step S5). Here, for example, the exhaust control unit 84 closes the main valve Ve, and the pump control unit 85 ends the operation of the vacuum pump 32. Thus, for example, the exhaust of gas from the internal space 10s of the chamber 10 to the exhaust pipe 31 is completed. Here, for example, the time from the start to the end of the exhaust can be about 300 seconds to 500 seconds.

Next, for example, the decompression drying device 1 starts supplying gas into the chamber 10 (step S6). Thus, for example, after the exhaust step, the control unit 80 executes a step of supplying gas into the chamber 10 through the gas supply unit 60 in a state where the substrate 9 is supported from below by the support unit 20 in the chamber 10 (also referred to as a gas supply step). At this time, for example, when the control unit 80 executes the gas supply step, it becomes a state of executing a step of repeatedly raising and lowering the support unit 20 through the lifting unit 100 (also referred to as a second lifting step). In other words, when the control unit 80, for example, performs gas supply using the gas supply unit 60, it controls the lifting unit 100 so that the support unit 20 is repeatedly raised and lowered.

Here, for example, the air supply control unit 86 opens the air supply valve Vf. As a result, for example, gas starts to be supplied from the air supply source 62 to the internal space 10s of the chamber 10 through the air supply pipe 61 and the air supply port 16f. At this time, the air pressure in the chamber 10 starts to rise to the atmospheric pressure. In the air supply step, for example, a relatively strong air flow may be generated in the chamber 10. In contrast, for example, the coating 90 is sometimes in a semi-dry state that is not fully dried.

Here, for example, when supplying air to the chamber 10, the space between the upper surface of the substrate 9 and the ceiling portion 13 of the chamber 10 changes repeatedly between a contracted state and an expanded state by repeatedly raising and lowering the support portion 20. At this time, for example, turbulence of the airflow occurs in the chamber 10. As a result, for example, it is difficult to produce a phenomenon of a continuous specific pattern of airflow (also called a second stable flow) on the coating 90. As a result, for example, it is difficult to produce a difference in drying speed corresponding to the location in the coating 90, and it is difficult to produce a bad condition of stripe-shaped drying unevenness at a specific location in the coating 90.

In addition, for example, even if a temperature difference occurs in the substrate 9 due to the presence of a plurality of support pins 22, the difference in concentration between the components of the solvent evaporated from the coating 90 directly above the portion of the substrate 9 supported by the support pins 22 and the components of the solvent evaporated from the coating 90 around it can be reduced by the stirring effect caused by the turbulence of the airflow. In other words, for example, the concentration of the components of the solvent evaporated from the coating 90 is unlikely to be biased on the coating 90. As a result, for example, it is unlikely that the defective condition of uneven drying occurs at the portion of the coating 90 corresponding to the position of the support pins 22.

In addition, for example, the difference between the concentration of the solvent component evaporated from the coating film 90 just above the center of the coating area A1 in the substrate 9 and the concentration of the solvent component evaporated from the coating film 90 just above the end of the coating area A1 can be reduced by the stirring effect caused by the turbulence of the airflow. In other words, for example, the concentration of the solvent component evaporated from the coating film 90 is unlikely to be biased on the coating film 90. As a result, for example, it is unlikely to cause a defective condition of uneven drying at a portion of the coating film 90 corresponding to the shape of the coating area A1.

Therefore, for example, when supplying gas into the chamber 10 through the gas supply unit 60, if the support unit 20 is repeatedly raised and lowered, the coating 90 formed on the upper surface of the substrate 9 can be dried more evenly.

Next, for example, the decompression drying device 1 determines whether the internal space 10s of the chamber 10 has reached atmospheric pressure (step S7). Here, for example, the control unit 80 determines whether the internal space 10s of the chamber 10 has reached atmospheric pressure based on the measurement result obtained by the pressure gauge 70. For example, the determination of step S7 is repeated until the internal space 10s reaches atmospheric pressure. Then, when the internal space 10s reaches atmospheric pressure, the decompression drying device 1 ends the air supply to the chamber 10 (step S8). Here, for example, the air supply control unit 86 closes the air supply valve Vf. Thus, for example, the supply of gas from the gas supply source 62 to the internal space 10s of the chamber 10 through the gas supply pipe 61 and the gas supply port 16f is terminated. Here, for example, the time from the start to the end of the gas supply can be about 50 seconds to 150 seconds.

Next, for example, the decompression drying device 1 ends the action of repeatedly raising and lowering the support part 20 (step S9). Here, for example, the lifting control unit 82 ends the action of repeatedly raising and lowering the support part 20 through the lifting unit 100. At this time, for example, when the support part 20 is arranged at the lowered position H1, the lifting and lowering of the support part 20 is stopped.

Then, for example, the substrate 9 is finally carried out from the chamber 10 (step S10). In step S10, for example, first, the opening and closing control unit 81 operates the opening and closing drive unit 16, and moves the gate unit 15 from the closed position to the open position, thereby opening the loading and unloading port 14. Then, for example, a transport robot (not shown) carries the dried substrate 9 placed on the support unit 20 out of the chamber 10 through the loading and unloading port 14 of the chamber 10. In this way, the decompression drying process of a substrate 9 can be completed.

Thus, the method for drying the coating 90 formed on the upper surface of the substrate 9 using the reduced pressure drying device 1 (also referred to as the reduced pressure drying method) includes, for example, an exhaust step, an air supply step, a first lifting step, and a second lifting step. From another perspective, the reduced pressure drying method using the reduced pressure drying device 1 includes, for example, an exhaust step, an air supply step, and a step of repeatedly lifting the support portion 20 by the lifting portion 100 including the first lifting step and the second lifting step (also referred to as the lifting step). In other words, the control portion 80 controls the lifting portion 100 to repeatedly lift the support portion 20 when, for example, exhausting the exhaust portion 30 and supplying the air by the air supply portion 60 are performed respectively.

As described above, in a reduced pressure drying device 1 of one embodiment, for example, the substrate 9 is repeatedly raised and lowered when the gas environment in the chamber 10 is exhausted and the gas is supplied to the chamber 10. Thus, for example, whether the gas is exhausted in the chamber 10 or the gas is supplied to the chamber 10, turbulence of the airflow can be generated in the chamber 10. As a result, whether the gas is exhausted in the chamber 10 or the gas is supplied to the chamber 10, it is difficult to generate a continuous specific pattern of airflow above the substrate 9, and the concentration of the components of the solvent evaporated from the coating 90 is difficult to be biased on the coating 90. Therefore, for example, the coating 90 formed on the upper surface of the substrate 9 can be dried more uniformly.

<3. Variations>

The present invention is not limited to the above-mentioned implementation form, and various changes and improvements can be made without departing from the scope of the present invention.

In the embodiment, for example, the control unit 80 may control the lifting unit 100 to repeatedly lift the support unit 20 when performing at least one of exhausting air by the exhaust unit 30 and supplying air by the air supply unit 60. In other words, when performing the reduced pressure drying process using the reduced pressure drying device 1, the control unit 80 may perform at least one of a step of repeatedly lifting the support unit 20 by the lifting unit 100 when performing the exhausting step (a first lifting step) and a step of repeatedly lifting the support unit 20 by the lifting unit 100 when performing the air supplying step (a second lifting step). In other words, for example, the decompression drying method using the decompression drying device 1 may have an exhaust step, an air supply step, and a first lifting step, or an exhaust step, an air supply step, and a second lifting step. From another perspective, the decompression drying method using the decompression drying device 1 may have, for example, an exhaust step, an air supply step, and a lifting step as a step of repeatedly lifting the support portion 20 through the lifting portion 100 when performing at least one of the exhaust step and the air supply step. In other words, the lifting step may also include, for example, at least one of the first lifting step and the second lifting step.

Here, for example, the substrate 9 can be repeatedly raised and lowered when at least one of the gas environment in the chamber 10 is exhausted and the gas is supplied to the chamber 10. Thus, for example, in at least one of the exhaust and the supply, turbulence of the airflow can be generated in the chamber 10. As a result, for example, in at least one of the exhaust and the supply, it is difficult to generate a continuous specific pattern of airflow in the chamber 10, and the concentration of the components of the solvent evaporated from the coating 90 is difficult to be biased on the coating 90. Therefore, for example, the coating 90 formed on the upper surface of the substrate 9 can be dried more uniformly.

Here, an example of the decompression drying process of the first lifting step in the first lifting step and the second lifting step is described. FIG. 8 is a flowchart showing an example of the process of the decompression drying process of a variant. The process of the decompression drying process is implemented, for example, by executing the program 803p in the processor 801 included in the control unit 80. Here, for example, the processing of steps Sa1 to Sa10 of FIG. 8 is performed in the order described.

First, the substrate 9 is moved into the chamber 10 (step Sa1). Here, for example, the same action as the above step S1 is performed.

Next, for example, the pressure-reducing drying device 1 starts to repeatedly raise and lower the support portion 20 (step Sa2). Here, for example, the same action as the step S2 is performed.

Next, for example, the decompression drying device 1 starts exhausting air from the chamber 10 (step Sa3). Here, for example, the same action as the step S3 is performed.

Next, for example, the decompression drying device 1 determines whether the internal space 10s of the chamber 10 reaches a specified vacuum degree (step Sa4). Here, for example, the same action as the step S4 is performed. Here, for example, the determination of step Sa4 is repeated until the internal space 10s reaches the specified vacuum degree. When the internal space 10s reaches the specified vacuum degree, the decompression drying device 1 ends the exhaust from the chamber 10 (step Sa5). Here, for example, the same action as the step S5 is performed.

Next, for example, the pressure-reducing drying device 1 ends the action of repeatedly raising and lowering the support portion 20 (step Sa6). Here, for example, the same action as the above-mentioned step S9 is performed.

Next, for example, the decompression drying device 1 starts supplying air into the chamber 10 (step Sa7). Here, for example, the same action as the step S6 is performed.

Next, for example, the decompression drying device 1 determines whether the internal space 10s of the chamber 10 reaches atmospheric pressure (step Sa8). Here, for example, the same action as the step S7 is performed. Here, for example, when the internal space 10s reaches atmospheric pressure, the decompression drying device 1 ends the air supply to the chamber 10 (step Sa9). Here, for example, the same action as the step S8 is performed.

Then, for example, the substrate 9 is finally taken out of the chamber 10 (step Sa10). Here, for example, the same action as the step S10 is performed.

In addition, here, an example of the decompression drying process of the second lifting step in the first lifting step and the second lifting step is described. FIG. 9 is a flow chart showing an example of the process of the decompression drying process of a variant. The process of the decompression drying process is implemented, for example, by executing the program 803p in the processor 801 included in the control unit 80. Here, for example, the processing of steps Sb1 to Sb10 of FIG. 9 is performed in the order described.

First, the substrate 9 is moved into the chamber 10 (step Sb1). Here, for example, the same actions as the above-mentioned step S1 and step Sa1 are performed.

Next, for example, the decompression drying device 1 starts exhausting air from the chamber 10 (step Sb2). Here, for example, the same actions as the above-mentioned step S3 and step Sa3 are performed.

Next, for example, the decompression drying device 1 determines whether the internal space 10s of the chamber 10 reaches a specified vacuum degree (step Sb3). Here, for example, the same actions as the above steps S4 and Sa4 are performed. Here, for example, the determination of step Sb3 is repeated until the internal space 10s reaches the specified vacuum degree. When the internal space 10s reaches the specified vacuum degree, the decompression drying device 1 ends the exhaust from the chamber 10 (step Sb4). Here, for example, the same actions as the above steps S5 and Sa5 are performed.

Next, for example, the pressure-reducing drying device 1 starts to repeatedly raise and lower the support portion 20 (step Sb5). Here, for example, the same actions as the above-mentioned steps S2 and Sa2 are performed.

Next, for example, the decompression drying device 1 starts supplying air into the chamber 10 (step Sb6). Here, for example, the same actions as the above-mentioned step S6 and step Sa7 are performed.

Next, for example, the decompression drying device 1 determines whether the internal space 10s of the chamber 10 reaches atmospheric pressure (step Sb7). Here, for example, the same actions as the above-mentioned steps S7 and Sa8 are performed. Here, for example, when the internal space 10s reaches atmospheric pressure, the decompression drying device 1 ends the air supply to the chamber 10 (step Sb8). Here, for example, the same actions as the above-mentioned steps S8 and Sa9 are performed.

Next, for example, the decompression drying device 1 ends the action of repeatedly raising and lowering the support portion 20 (step Sb9). Here, for example, the same action as the above-mentioned step S9 and step Sa6 is performed.

Then, for example, the substrate 9 is finally taken out of the chamber 10 (step Sb10). Here, for example, the same actions as the above-mentioned step S10 and step Sa10 are performed.

In the embodiment, for example, the control unit 80 may control the lifting unit 100 to repeatedly lift the support unit 20 during a portion of the exhausting period using the exhaust unit 30. Also, for example, the control unit 80 may control the lifting unit 100 to repeatedly lift the support unit 20 during a portion of the air supplying period using the air supply unit 60. In other words, when the reduced pressure drying device 1 is used to perform the reduced pressure drying process, for example, the first lifting step may be performed during a portion of the exhausting period, and the second lifting step may be performed during a portion of the air supplying period. Here, for example, the execution of the first lifting step may be started after the execution of the exhaust step is started, or the execution of the first lifting step may be ended before the execution of the exhaust step is ended. In addition, for example, the execution of the second lifting step may be started after the execution of the air supply step is started, or the execution of the second lifting step may be ended before the execution of the air supply step is ended.

In the embodiment, for example, the chamber 10 has four exhaust ports 16a, 16b, 16c, and 16d, but the present invention is not limited thereto. For example, the number of exhaust ports of the chamber 10 may be any one from one to three and five or more. In addition, for example, there may be no separate valve Va, separate valve Vb, separate valve Vc, and separate valve Vd.

In the embodiment described above, the decompression drying device 1 dries the coating 90 on the substrate 9 by decompression, but is not limited thereto. For example, the decompression drying device 1 may also dry the coating 90 on the substrate 9 by decompression and heating.

In the embodiment described above, the side wall portion 12 of the chamber 10 is provided with a loading and unloading port 14 for the substrate 9, but the present invention is not limited thereto. For example, a cover portion 101 formed as a whole by the four side wall portions 12 and the top plate portion 13 of the chamber 10 may be adopted, and the cover portion 101 may be separated from the bottom plate portion 11 and retreated upward. FIG. 10 is a diagram schematically showing an example of a longitudinal section of a modified example of a reduced pressure drying device 1. Here, for example, as shown in FIG. 10, if the cover portion 101 is in contact with the bottom plate portion 11 via a sealing material 10b such as an O-ring, the internal space 10s of the chamber 10 is in a closed state. Here, for example, by using the opening and closing drive unit 16 to move the cover 101 upward, the cover 101 is separated upward from the bottom plate 11, and the internal space 10s of the chamber 10 is opened. At this time, for example, the substrate 9 can be carried into the internal space 10s of the chamber 10 and the substrate 9 can be carried out from the internal space 10s of the chamber 10. In addition, for example, by using the opening and closing drive unit 16 to move the cover 101 downward, the cover 101 is pressed against the sealing material 10b on the bottom plate 11, and the internal space 10s of the chamber 10 is closed. In addition, here, for example, four side rectifying plates 50 are fixed to the cover 101, and can also be moved upward together with the cover 101. When this structure is adopted, for example, it is easy to reduce the internal space by 10s, and the time from the start to the end of exhaust can be reduced to about 60 seconds to 100 seconds, and the time from the start to the end of air supply can be reduced to about 10 seconds to 30 seconds.

In the embodiment, for example, the support portion 20 may have various shapes. For example, the plurality of support plates 21 may also be a single integrated support plate 21.

In the embodiment described above, for example, the bottom straightening plate 40 and the side straightening plate 50 may be omitted.

In the embodiment, for example, various actions in the pressure reduction drying device 1 may also be started or ended in response to a user's action on the input unit 804 or a signal input from an external device to the communication unit 806.

In one embodiment, for example, in the control unit 80, at least a portion of the implemented functional structure may also include hardware of a dedicated electronic circuit.

In addition, of course, all or part of the embodiments and various variations that constitute the above-mentioned embodiment can be appropriately combined within the scope of non-contradiction.

S1, S2, S3, S4, S5, S6, S7, S8, S9, S10: Steps

Claims (6)

A decompression drying device is a decompression drying device for drying a coating formed on the upper surface of a substrate, comprising: a chamber for accommodating the substrate; a support portion for supporting the substrate from below in the chamber; a lifting portion for lifting the support portion in the chamber between a descending position and a rising position higher than the descending position in the vertical direction; an exhaust portion for exhausting the gas environment in the chamber from an exhaust port provided on the bottom plate of the chamber; an air supply portion for supplying gas into the chamber from an air supply port provided on the bottom plate of the chamber; a bottom rectifying plate arranged to be located between the substrate supported by the support portion and the bottom plate of the chamber; a plurality of side rectifying plates arranged on the descending portion; The substrate supported by the support portion at the lowered position is located inside the side wall portion in a manner that the substrate is spaced apart from the inner surface of the side wall portion, and is arranged in a manner that surrounds the substrate supported by the support portion arranged at the lowered position; and the control portion controls the lifting portion between the lowered position where the plurality of side straightening plates exist between the substrate supported by the support portion and the side wall portion, and the raised position where the substrate supported by the support portion is located above the plurality of side straightening plates in the horizontal direction, when performing at least one of exhausting air by the exhaust portion and supplying air by the air supply portion, so that the support portion is repeatedly raised and lowered. The decompression drying device as described in claim 1, wherein the control unit controls the lifting unit between the descending position and the ascending position when exhausting air using the exhaust unit and supplying air using the air supply unit, so that the support unit repeatedly rises and falls. A decompression drying method is a decompression drying method for drying a coating formed on the upper surface of a substrate using a decompression drying device including a chamber, a support part, a lifting part, an exhaust part, an air supply part, a bottom face rectifying plate, and a plurality of side face rectifying plates, wherein the chamber accommodates the substrate, the support part supports the substrate from below in the chamber, and the lifting part lifts the support part in the chamber between a lowered position and an ascending position higher than the lowered position in a vertical direction. The exhaust part exhausts the gas environment in the chamber from the exhaust port provided on the bottom plate of the chamber, the gas supply part supplies gas into the chamber from the gas supply port provided on the bottom plate of the chamber, the bottom surface rectifying plate is arranged to be located between the substrate supported by the supporting part and the bottom plate of the chamber, and the plurality of side rectifying plates are arranged between the substrate supported by the supporting part arranged at the descending position and the side wall of the chamber to leave a space from the inner surface of the side wall. The side wall is located at an interval and is arranged to surround the substrate supported by the support portion arranged at the descending position, and the decompression drying method includes: an exhaust step, in which the gas environment in the chamber is exhausted through the exhaust portion while the substrate is supported from below by the support portion in the chamber; and a gas supply step, after the exhaust step, in which the substrate is supported from below by the support portion in the chamber. In the state, gas is supplied into the chamber through the gas supply part; and a lifting step, when performing at least one of the exhaust step and the gas supply step, the support part is repeatedly lifted and lowered by the lifting part between the lowered position where the plurality of side straightening plates exist between the substrate supported by the support part and the side wall part in the horizontal direction and the raised position where the substrate supported by the support part is located above the plurality of side straightening plates. The reduced pressure drying method as described in claim 3, wherein the lifting step includes: a first lifting step, in which the support part is repeatedly lifted and lowered between the lowered position and the raised position by the lifting part when the exhaust step is performed; and a second lifting step, in which the support part is repeatedly lifted and lowered between the lowered position and the raised position by the lifting part when the air supply step is performed. A storage medium stores a program, and in a pressure-reducing drying device for drying a coating formed on an upper surface of a substrate, the program includes a chamber, a support portion, a lifting portion, an exhaust portion, an air supply portion, a bottom rectifying plate, a plurality of side rectifying plates, and a control portion, the program, when executed by a processor included in the control portion, executes the following steps: the chamber accommodates the substrate, the support portion supports the substrate from below in the chamber, and the lifting portion moves the support portion in the chamber between a lowered position and a position lower than the lowered position. The exhaust part discharges the gas environment in the chamber from the exhaust port provided on the bottom plate of the chamber, and the gas supply part supplies gas into the chamber from the gas supply port provided on the bottom plate of the chamber. The bottom rectifying plate is arranged between the substrate supported by the supporting part and the bottom plate of the chamber, and the plurality of side rectifying plates are arranged between the substrate supported by the supporting part arranged at the descending position and the side wall of the chamber to supply gas from the inner surface of the side wall. The control unit is located at an inner side of the side wall portion in a spaced manner and is arranged in a manner of surrounding the substrate supported by the support portion arranged in the descending position. The control unit controls the exhaust unit, the air supply unit and the lifting unit, namely: in an exhaust step, the control unit exhausts the gas environment in the chamber through the exhaust unit when the substrate is supported from below by the support portion in the chamber; in an air supply step, the control unit supplies air to the support portion in the chamber after the exhaust step. In a state where the substrate is supported from below, gas is supplied into the chamber through the gas supply unit; and a lifting step, when the control unit performs at least one of the exhaust step and the gas supply step, the support unit is repeatedly lifted and lowered by the lifting unit between the lowered position where the plurality of side straightening plates exist between the substrate supported by the support unit and the side wall in the horizontal direction and the raised position where the substrate supported by the support unit is located above the plurality of side straightening plates. The storage medium as described in claim 5, wherein the lifting step includes: a first lifting step, in which the control unit causes the support unit to repeatedly lift and lower between the lowered position and the raised position through the lifting unit when executing the exhaust step; and a second lifting step, in which the control unit causes the support unit to repeatedly lift and lower between the lowered position and the raised position through the lifting unit when executing the air supply step.