TWI856010B - Display device and support film structure for display device - Google Patents

Abstract

A display device includes a display panel, a support film, and a polymer layer. The display panel includes a display area comprising a first area that is bendable, and a non-display area adjacent to the display area. The support film is coupled to a bottom surface of the display panel. The support film includes a first groove overlapping with the first area. The polymer layer is disposed in the first groove. The polymer layer includes a material with higher flexibility than the support film. Angles formed by the top surface of the support film and inner sides of the support film defining the first groove are acute angles.

Description

Display device and supporting film structure for display device

Cross-references to related applications

This application claims priority to and the benefits of Korean Patent Application No. 10-2018-0051059 filed on May 3, 2018 and Korean Patent Application No. 10-2019-0027870 filed on March 12, 2019, the entire contents of which are hereby incorporated by reference as if described herein.

Exemplary embodiments generally relate to a display device and a display device for supporting a thin film structure.

A display device is a device that can display an image signal. Examples of display devices include almost all types of devices that display image signals input from, for example, an external source, such as a television (TV), a computer detector, a personal digital assistant (PDA), a smart device, etc. High-quality flat panel display modules, such as organic light-emitting diode (OLED) display panels, liquid crystal display (LCD) panels, plasma display panels (PDP), electrophoretic display panels, and the like can be used for display devices. Flexible display devices that are bendable, foldable, rollable, etc. can be made into thin and lightweight display devices and can have the advantage of being portable. Flexible display devices can be implemented using a flexible substrate formed of, for example, a plastic material. The plastic material can be replaced by a glass substrate.

The above information disclosed in the background technology section is only used to understand the background of the concept of the present invention, and therefore it may contain information that does not constitute prior art.

Some exemplary embodiments can provide a bendable or foldable display device.

Some exemplary embodiments provide a supporting film structure for a display device. The supporting film structure can be applied to a bendable or foldable display device.

Other aspects will be described in the detailed description below, and in part will become apparent from the disclosure, or can be learned by practice of the inventive concept.

According to some exemplary embodiments, a display device includes a display panel, a supporting film, and a polymer layer. The display panel includes: a display area including a bendable first area; and a non-display area adjacent to the display area. The supporting film is coupled to the bottom surface of the display panel. The supporting film includes a first groove overlapping the first area. The polymer layer is disposed in the first groove. The polymer layer includes a material having a higher flexibility than the supporting film. The angle formed by the top surface of the supporting film and the inner side of the supporting film defining the first groove is an acute angle.

According to some exemplary embodiments, a display device includes a display panel, the display panel includes a display area and a non-display area, the display area includes a first area extending in a first direction, the first area is bendable, and the non-display area is adjacent to the display area. A polymer layer is disposed below the display panel, coupled to the display panel, and overlaps with the first area. A support film is disposed below the display panel and coupled to the display panel. The support film includes a first film portion and a second film portion spaced apart from each other in a second direction, and the polymer layer is inserted between the first film portion and the second film portion. The second direction intersects with the first direction. The width of the polymer layer in the second direction gradually increases along the thickness direction intersecting the first direction and the second direction as the distance from the display panel increases.

According to some exemplary embodiments, a supporting film structure for a display device includes a supporting film and a polymer layer. The supporting film includes a first groove extending in a first direction, and a second groove extending in the first direction and spaced from the first groove in a second direction intersecting the first direction. The polymer layer is disposed in the first groove. The polymer layer includes a material having a higher flexibility than the supporting film. The polymer layer includes a portion having a variable width along a thickness direction intersecting the first direction and the second direction.

Other features and exemplary embodiments will be apparent from the following detailed description, drawings and scope of the invention.

The foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further description of the claimed subject matter.

1,2,2a,2b,2c,3,4,5,6,7,8:Display device

100: Display panel

1000:Show cells

101,315,335,355: bottom surface

110: Display panel

120: Driving layer

130: Organic light-emitting element layer

140: Packaging layer

141: The first inorganic film

143: Second inorganic film

145: Organic membrane

2000: Motherboard

211: Active layer

213: Gate electrode

215: Source electrode

217: Drain electrode

221: First insulation film

223: Second insulation film

230: Passivation film

300,3000,3001,3002: Support film

310: First film part

311,331,351: Top

313,333,337,353,401,402:Inside

330: Second film part

350: Third film part

400,4000,4001,4002: Resin layer

400a1,400b1,4010:Part 1

400a2,400b2:Part 2

400c1: First remaining part

400c2: Second remaining part

500,501,502,503: polymer layer

A1: Area 1

A2: Second area

AE: first electrode

BPL: Neutral surface conditioning layer

BUR: Burr pattern

BX1: First bend crankshaft

BX2: Second crankshaft

CH1, CH2, CH3: contact holes

CE: Second electrode

CM: Carbide

CMA: Carbide layer

DA: Display Area

DD: Virtual District

E1: First edge

E2: Second Edge

FPC: Flexible Printed Circuit Board

FS,FS1,FS2,FS3: Supported membrane structure

G1: First slot

G2: Second slot

IC: Driver integrated circuit

L1, L2: Laser light

LD: Organic light-emitting device

MP: Main printed circuit board

MS: Motherboard substrate

MS1,MS2: Motherboard structure

NDA: Non-Display Area

NDA1: First non-display area

NDA2: Second non-display area

OL: Organic layer

PA: Pixel Area

PDL: Pixel Definition Layer

Td, Ta1, Tnd, Ta2, Tb1, Tb2: thickness

Qd: driving transistor

W1: First width

W2: Second width

Wg: width

X: First direction

Y: Second direction

Z: thickness direction

θ1,θ2,θ3,θ4: angles

The accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated into and constitute a part of this specification. The accompanying drawings show exemplary embodiments of the inventive concept and together with the specification are used to explain the principles of the inventive concept.

Figure 1 is a schematic diagram of a display device according to some exemplary embodiments.

FIG. 2 is a plan view of the display device of FIG. 1 according to some exemplary embodiments.

FIG. 3 is a rear view of the display device of FIG. 1 according to some exemplary embodiments.

Figure 4 is an enlarged rear view of the P portion of Figure 3 according to some exemplary embodiments.

FIG. 5 is a cross-sectional view taken along line X1-X1' of FIG. 2 according to some exemplary embodiments.

Figure 6 is an enlarged cross-sectional view of the Q1 portion of Figure 5 according to some exemplary embodiments.

FIG. 7 is a cross-sectional view showing a pixel structure of a display panel of the display device of FIG. 1 according to some exemplary embodiments.

Figure 8 is a schematic diagram of the Q3 portion of Figure 5 according to some exemplary embodiments.

Figure 9 is an enlarged cross-sectional view of the Q3 portion of Figure 5 according to some exemplary embodiments.

FIG. 10 is an enlarged cross-sectional view of the Q5 portion of FIG. 5 according to some exemplary embodiments.

FIG. 11 is a cross-sectional view showing the display device of FIG. 5 in a bent state in a non-display area according to some exemplary embodiments.

FIG. 12 is a cross-sectional view showing the display device of FIG. 5 in a curved state in the display area and the non-display area according to some exemplary embodiments.

FIG. 13 is a cross-sectional view showing the display device of FIG. 5 in a curved state in the display area and the non-display area according to some exemplary embodiments.

FIG. 14A is an enlarged cross-sectional view of a portion of a display device according to another exemplary embodiment of the present disclosure corresponding to the Q3 portion of FIG. 5.

FIG. 14B is an enlarged cross-sectional view of a portion of the display device of FIG. 14A corresponding to the Q5 portion of FIG. 5.

Figure 15A is an enlarged cross-sectional view of a modified example of Figure 14A.

Figure 15B is an enlarged cross-sectional view of a modified example of Figure 14B.

Figure 15C is an enlarged cross-sectional view of another modified example of Figure 14A.

Figure 15D is an enlarged cross-sectional view of a modified example of Figure 14B.

Figure 15E is an enlarged cross-sectional view of another modified example of Figure 14A.

Figure 15F is an enlarged cross-sectional view of another modified example of Figure 14B.

Figures 16, 17, 18, 19, 20 and 21 are enlarged cross-sectional views of a portion of the display device corresponding to the Q3 portion of Figure 5 according to some exemplary embodiments.

Figure 22 is a schematic diagram of a motherboard for a display device according to some exemplary embodiments.

FIG. 23 is a rear view of the motherboard of FIG. 22 according to some exemplary embodiments.

Figures 24, 25, 26 and 27 are cross-sectional views taken along line X3-X3' of Figure 23 and illustrate display devices at various manufacturing stages according to some exemplary embodiments.

In the following description, for the purpose of illustration, many specific details are set forth in order to provide a thorough understanding of various exemplary embodiments. However, it is apparent that various exemplary embodiments can be practiced without these specific details or with one or more equivalent configurations. In other examples, known structures and devices are shown in block diagram form to avoid unnecessarily obscuring various exemplary embodiments. In addition, various exemplary embodiments may be different, but not exclusive. For example, without departing from the concept of the present invention, a specific shape, configuration, and embodiment of an exemplary embodiment may be used or implemented in another exemplary embodiment.

Unless otherwise stated, the exemplary embodiments shown are understood to provide exemplary features of different details of some exemplary embodiments. Therefore, unless otherwise stated, the features, components, modules, layers, films, panels, regions and/or aspects of various embodiments (hereinafter referred to as "elements" or "elements" respectively or collectively) can be combined, separated, interchanged and/or reconfigured without departing from the concept of the present invention.

The use of cross-hatching and/or shading in the drawings generally provides for clarifying the boundaries between adjacent elements. Therefore, unless otherwise stated, the presence or absence of cross-hatching or shading does not indicate or indicate any preference or requirement for specific materials, material properties, dimensions, proportions, commonalities between diagram elements, and/or any other characteristics, attributes, properties, etc. In addition, in the drawings, the sizes and relative sizes of the elements may be exaggerated for the purpose of clarity and/or description. Therefore, the sizes and relative sizes of the respective elements are not necessarily limited to the sizes and relative sizes shown in the drawings. When the exemplary embodiments can be implemented in different ways, the specific process sequence can be performed differently from the described sequence. For example, two consecutive processes are described as being performed substantially simultaneously or in a sequence opposite to the described sequence. In addition, the same element symbols represent the same elements.

When an element is referred to as being "on," "connected to," or "coupled to" another element, it may be directly on, directly connected to, or coupled to the other element, or there may be intervening elements. However, when an element is referred to as being "directly on," "directly connected to," or "directly coupled to" another element, there are no intervening elements. Other terms and/or phrases used to describe the relationship between elements should be interpreted in a similar manner, such as "between" versus "directly between," "adjacent" versus "directly adjacent," "on" versus "directly on," etc. Further, the term "connected" may refer to being physically, electrically, and/or fluidly connected. In addition, the x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. For the purpose of the present disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ, etc. The term "and/or" as used herein includes any and all combinations of one or more of the relevant listed items.

Although the terms "first", "second", etc. are used herein to describe various components, these components should not be limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component discussed below can be referred to as the second component without departing from the teachings of this disclosure.

Spatially relative terms, such as "beneath," "below," "under," "lower," "above," "upper," "over," "higher," "side" (e.g., as "sidewall"), and the like may be used for descriptive purposes herein and thereby describe the relationship of one element to another element as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the apparatus in use, operation, and/or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the apparatus in the drawings is turned over, elements described as being "below" or "beneath" other elements or features would be oriented "above" the other elements or features. Thus, the exemplary term "below" may include both above and below orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 00 degrees or at other orientations), and thus spatially relative descriptors used herein are interpreted accordingly.

The terms used herein are for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. In addition, when used in this specification, the terms "comprises", "comprising", "includes" and/or "including" specify the presence of the features, wholes, steps, operations, elements, components and/or groups thereof, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and/or groups thereof. It should also be noted that the terms "substantially," "about," and other similar terms as used herein are used as terms of approximation rather than degree, and are therefore used to account for the inherent deviations in measured, calculated, and/or provided values that are recognized by those of ordinary skill in the art.

Various exemplary embodiments are described herein with reference to cross-sectional and/or exploded views, which are schematic representations of idealized exemplary embodiments and/or intermediate structures. Therefore, manufacturing techniques and/or tolerances, for example, may be expected to result in variations in the shapes of the drawings illustrated therein. Therefore, the exemplary embodiments disclosed herein should not be interpreted as limited to the specific illustrated shapes of regions, but rather include deviations in shapes resulting from, for example, manufacturing. In this manner, the regions illustrated in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of regions of the device, and are therefore not intended to be limiting.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those with ordinary knowledge in the field to which this disclosure belongs. For example, those terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and should not be interpreted with an idealized or overly formal meaning unless expressly defined as such herein.

As is customary in the art, some exemplary embodiments are described and shown in the accompanying drawings in terms of functional blocks, units and/or modules. It will be understood by those skilled in the art that these functional blocks, units and/or modules are physically implemented through electronic (or optical) circuits, such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connections, and the like, which can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. Where functional blocks, units and/or modules are implemented by a microprocessor or other similar hardware, they may be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and may optionally be driven by firmware and/or software. It is also contemplated that each functional block, unit and/or module may be implemented by dedicated hardware, or implemented as a combination of dedicated hardware that performs some functions and a processor (e.g., one or more programmed microprocessors and associated circuits) that performs other functions. In addition, without departing from the concept of the present invention, each functional block, unit and/or module of some exemplary embodiments may be physically divided into two or more interactive and discrete functional blocks, units and/or modules. In addition, without departing from the concept of the present invention, some of the functional blocks, units and/or modules of the exemplary embodiments may be physically combined into more complex functional blocks, units and/or modules.

Hereinafter, an exemplary embodiment will be described with reference to the accompanying drawings.

FIG. 1 is a schematic diagram of a display device according to some exemplary embodiments. FIG. 2 is a plan view of the display device according to FIG. 1 of some exemplary embodiments. FIG. 3 is a rear view of the display device according to FIG. 1 of some exemplary embodiments. It should be noted that the rear view of FIG. 3 shows the display device in a state before bending or folding. FIG. 4 is an enlarged rear view of the P portion of FIG. 3 of some exemplary embodiments.

Referring to FIGS. 1 to 4, the display device 1 can be applied to, for example, a mobile terminal. Examples of mobile terminals include tablet computers (PCs), smart phones, personal digital assistants (PDAs), portable multimedia players (PMPs), game consoles, wristwatch-type electronic devices, and the like. However, the type of mobile terminal that can be applied to the display device 1 is not specifically limited. In some exemplary embodiments, the display device 1 can be used not only for large-sized electronic devices, such as televisions (TVs), outdoor billboards, etc., but also for small and medium-sized electronic devices, such as PCs, laptops, car navigation devices, cameras, etc.

The display device 1 may have a rectangular shape in a plan view. The display device 1 may have two short sides extending in a first direction X and two long sides extending in a second direction Y. The angle at which the two long sides and the two short sides of the display device 1 intersect may be a right angle or may be curved. The planar shape of the display device 1 is not particularly limited, and the display device 1 may have a circular shape or other shapes in a plan view.

The display device 1 may include a display panel 100, a supporting film 300, and a polymer layer 500. The display device 1 may further include a resin layer 400.

The display panel 100 may have a display area DA for displaying an image and a non-display area NDA for not displaying an image. In some exemplary embodiments, the non-display area NDA may be disposed adjacent to the display area DA, such as outside the display area DA.

The display panel 100 may have a first area A1 and a second area A2, wherein the display panel 100 is bendable or foldable.

In a plan view, the first area A1 may span the display area DA along the first direction X. The display panel 100 may be folded or bent along a first bending axis BX1 extending in the first area A1 along the first direction X. The first area A1 may include a portion of the display area DA and a portion of the non-display area NDA.

Similarly, the second area A2 may span the non-display area NDA along the first direction X. In some exemplary embodiments, the second area A2 may be disposed in a portion of the non-display area NDA adjacent to the display area DA, for example, adjacent to the display area DA in the second direction Y. That is, the second area A2 may be located in the non-display area NDA, for example, between the display area DA and a portion of the non-display area NDA connected to a flexible printed circuit board (PCB) FPC.

The second area A2 may be part of the non-display area NDA and may be spaced apart from the display area DA. Referring to FIG. 2, the part of the non-display area NDA disposed below the display area DA may include a first non-display area NDA1 adjacent to the display area DA, and a second non-display area NDA2 that is farther from the display area DA than the first non-display area NDA1 and connected to the flexible printed circuit board FPC. The second area A2 may be located between the first non-display area NDA1 and the second non-display area NDA2. The display panel 100 may be bent along a second bending axis BX2 that extends along the first direction X in the second area A2.

In some exemplary embodiments, the display panel 100 may be a display panel including a light-emitting element. For example, the display panel 100 may include an organic light-emitting diode (OLED), a quantum dot light-emitting diode (LED), and/or an inorganic material-based micro-LED. For ease of explanation, it will be assumed that the display panel 100 includes an OLED, and the elements of the display panel 100 will be described in more detail below.

Unless otherwise specified, the terms "upper", "top", "top surface" and "upward" as used herein refer to the display side of the display panel 100, that is, one side of the display panel 100 in the Z-axis direction, and the terms "lower", "bottom", "bottom surface" and "downward" as used herein refer to a side of the display panel 100 relative to the display side, that is, one side of the display panel 100 in the opposite direction of the Z-axis direction.

The supporting film 300 may be disposed below the display panel 100. In some exemplary embodiments, the supporting film 300 may be coupled to the bottom surface of the display panel 100. The supporting film 300 may support the display panel 100, and the supporting film 300 is flexible and may protect the bottom surface of the display panel 100.

In some exemplary embodiments, the supporting film 300 may be formed of a rigid material that is harder than the polymer layer 500, which will be described below. In some exemplary embodiments, the supporting film 300 may include one of polyethylene terephthalate (PET), polycarbonate (PC) and polymethyl methacrylate (PMMA). For example, the supporting film 300 may include polyethylene terephthalate (PET).

The first groove G1 and the second groove G2 can be defined in the supporting film 300.

The first groove G1 may be formed to overlap with the first area A1 of the display panel 100 and may extend along the first direction X. Since the first groove G1 is defined in the supporting film 300 to overlap with the first area A1, the display panel 100 may be bent or folded in the first area A1. In addition, the first area A1 includes a portion of the display area DA, and the display device 1 may be implemented as a foldable display device.

The second groove G2 may be formed to overlap with the second area A2 of the display panel 100 and may extend along the first direction X. Since the second groove G2 is defined in the supporting film 300 to overlap with the second area A2, the display panel 100 may be bent in the second area A2. The entire second area A2 is included in the non-display area NDA. That is, the display panel 100 may bend downward in a portion of the non-display area NDA. Thus, the non-display area NDA viewed from above the display device 1 may be reduced, and the frame width of the display device 1 may also be reduced.

The supporting film 300 may include a first film portion 310 and a second film portion 330 separated by a first groove G1, and a third film portion 350 separated from the second film portion 330 by a second groove G2.

The first film portion 310 and the second film portion 330 may overlap with the display area DA of the display panel 100 and may partially overlap with the non-display area NDA of the display panel 100. For example, the second film portion 330 may overlap with the first non-display area NDA1 of the non-display area NDA. The third film portion 350 may overlap with the non-display area NDA of the display panel 100 but not with the display area DA.

The resin layer 400 may be disposed between the supporting film 300 and the display panel 100. The resin layer 400 may couple the display panel 100 and the supporting film 300 together. That is, the supporting film 300 may be coupled to the display panel 100 via the resin layer 400.

The first groove G1 and the second groove G2 may be further defined in the resin layer 400. Thus, a portion of the bottom surface of the display panel 100 may be exposed through the first groove G1 and the second groove G2.

In some exemplary embodiments, the resin layer 400 may include at least one of urethane resin, acrylic resin, and silicone resin. For example, the resin layer 400 may be formed of acrylic resin.

The first groove G1 and the second groove G2 may be formed by a laser process. Therefore, in some exemplary embodiments, as shown in FIG. 4, the distance between the first edge E1 and the second edge E2 of the first groove G1 may be uneven. For example, when viewed from the back of the display panel 100, the first edge E1 and the second edge E2 of the first groove G1 may not fall on a straight line extending along the first direction X, but may be partially arc-shaped. Therefore, the bottom surface portion of the display panel 100 exposed through the first groove G1 may have an uneven width in the second direction Y. For example, the bottom surface of the display panel 100 may include a portion having a first width W1 in the second direction Y and a portion having a second width W2 in the second direction Y. The second width W2 is different from the first width W1.

Although not specifically shown, the distance between the edges of the second groove G2 may be uneven, similar to the first edge E1 and the second edge E2 of the first groove G1.

The polymer layer 500 may be disposed in the first groove G1, which is defined in the supporting film 300 and the resin layer 400. The polymer layer 500 may be formed of a more flexible material than the supporting film 300. In some exemplary embodiments, the polymer layer 500 may include at least one of polyethylene naphthalate (PEN), polyimide (PI), polyethylene sulfide (PES), polyamide (PA), and aramid. For example, the supporting film 300 may include polyethylene terephthalate (PET), and the polymer layer 500 may include polyimide (PI).

When the display panel 100 is repeatedly bent or folded in the first area A1, the first film portion 310 and the second film portion 330 of the supporting film 300 may be peeled off from the display panel 100, and the display panel 100 may still remain bent due to insufficient (or lacking) restoring force. However, since the polymer layer 500 exists in the first groove G1, the supporting film 300 can be prevented from being peeled off from the display panel 100 when the display panel 100 is repeatedly bent or folded. In addition, since the polymer layer 500 can provide a restoring force to the display panel 100, the reliability of the display device 1 can be improved.

The flexible printed circuit board FPC can be connected to the display panel 100. In some exemplary embodiments, the flexible printed circuit board FPC can be connected to the non-display area NDA of the display panel 100, for example, it can be connected to the second non-display area NDA2.

In some exemplary embodiments, the driver integrated chip (or circuit) IC may be mounted on a flexible printed circuit board FPC. The driver integrated chip IC provides a driving signal to the display panel 100. In some exemplary embodiments, the driver integrated chip IC may include at least one of a data driver that applies a data signal to a data line, a gate driver that applies a gate signal to a gate line, and a signal controller that controls the operation of the data driver and the gate driver. In some exemplary embodiments, the driver integrated chip IC may be mounted on a flexible printed circuit board FPC in a chip-on-film (COF) manner. In some exemplary embodiments, the driver integrated chip IC can be mounted in the non-display area NDA of the display panel 100. The flexible printed circuit board FPC can be implemented as a flexible wiring board.

The main printed circuit board MP can be electrically connected to the display panel 100 via the flexible printed circuit board FPC and can transmit signals to the driver integrated chip IC or receive signals from the driver integrated chip IC. The main printed circuit board MP can provide image data, control signals and power supply voltage to the display panel or the flexible printed circuit board FPC. The main printed circuit board MP can include active components and passive components.

The display device 1 will be described in more detail below with reference to Figures 5 to 10.

FIG. 5 is a cross-sectional view taken along the line X1-X1' of FIG. 2 according to some exemplary embodiments. FIG. 6 is an enlarged cross-sectional view of the Q1 portion of FIG. 5 according to some exemplary embodiments. FIG. 7 is a cross-sectional view showing the pixel structure of the display panel of the display device according to FIG. 1 according to some exemplary embodiments. FIG. 8 is a schematic diagram of the Q3 portion of FIG. 5 according to some exemplary embodiments. FIG. 9 is an enlarged cross-sectional view of the Q3 portion of FIG. 5 according to some exemplary embodiments. FIG. 10 is an enlarged cross-sectional view of the Q5 portion of FIG. 5 according to some exemplary embodiments.

Referring to FIGS. 5 to 10 , the display panel 100 of the display device 1 may include a base substrate 110, a driving layer 120, an organic light-emitting element layer 130, and a packaging layer 140. The base substrate 110 provides a bottom surface 101 of the display panel 100. The base substrate may be a flexible substrate and may include a plastic material having relatively excellent heat resistance and durability, such as polyethylene ether phthalate, polyethylene naphthalate (PEN), polycarbonate (PC), polyarylate, polyether imide, polyethylene sulfide (PES), or polyimide (PI). For ease of explanation, it will be assumed that the base substrate 110 includes polyimide (PI).

The driving layer 120 may include elements for providing signals to the organic light-emitting element layer 130. The driving layer 120 may include various signal lines, such as scanning lines (not shown), data lines (not shown), power lines (not shown), and emission lines (not shown). The driving layer 120 may include a plurality of transistors and a plurality of capacitors. The transistor may include a switching transistor (not shown) and a driving transistor Qd. Each pixel (not shown) of the display panel 100 may include a corresponding switching transistor and a corresponding driving transistor Qd.

FIG. 7 shows a driving transistor Qd of the driving layer 120. The driving transistor Qd includes an active layer 211, a gate electrode 213, a source electrode 215, and a drain electrode 217.

The active layer 211 may be disposed on the base substrate 110. The driving layer 120 may further include a first insulating film 221 disposed between the active layer 211 and the gate electrode 213. The first insulating film 221 may insulate the active layer 211 and the gate electrode 213 from each other. The source electrode 215 and the drain electrode 217 may overlap respective portions of the gate electrode 213. The driving layer 120 may further include a second insulating film 223 disposed between the gate electrode 213 and the source electrode 215 and between the gate electrode 213 and the drain electrode 217. The source electrode 215 and the drain electrode 217 may be connected to the active layer 211 through contact holes CH1 and CH2 formed in the first insulating film 221 and the second insulating film 223, respectively.

The driving layer 120 may further include a passivation film 230 disposed on the source electrode 215 and the drain electrode 217.

Although not specifically shown in FIG. 7 , the switch transistor may have a structure substantially the same as or similar to the drive transistor Qd, but the exemplary embodiment is not limited thereto. That is, alternatively, the switch transistor and the drive transistor Qd may have different structures. For example, the active layer of the switch transistor and the active layer 211 of the drive transistor Qd may be placed in different layers.

In some exemplary embodiments, the driving layer 120 may be disposed not only in the display area DA, but also in the non-display area NDA. The portion of the driving layer 120 disposed in the first non-display area NDA1, the second area A2, and the second non-display area NDA2 may include a wiring and/or pad portion electrically connected to the flexible printed circuit board FPC.

The organic light-emitting element layer 130 may include an organic light-emitting element LD as an emission element. The organic light-emitting element LD may be a top emission type and may emit light in an upward direction (ie, in the Z-axis direction).

The organic light-emitting element LD may include a first electrode AE, an organic layer OL and a second electrode CE.

The first electrode AE is disposed on the passivation film 230. The first electrode AE is connected to the drain electrode 217 via the contact hole CH3 formed in the passivation film 230. The first electrode AE may be a pixel electrode or an anode. The first electrode AE may be a semi-transmissive electrode or a reflective electrode. In the case where the first electrode AE is a semi-transmissive electrode or a reflective electrode, the first electrode AE may include at least one of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir) and chromium (Cr) and an alloy of at least one of these materials.

The first electrode AE may have a single-layer or multi-layer structure formed of a metal oxide or a metal. For example, the first electrode AE may have a single-layer structure including indium tin oxide (ITO), Ag, or a metal mixture (e.g., a mixture of Ag and Mg), a single-layer structure including ITO/Mg or ITO/MgF, or a three-layer structure including ITO/Ag/ITO, but the exemplary embodiment is not limited thereto.

The organic layer OL may include an organic light-emitting layer (EML) formed of a low-molecular organic material or a polymer organic material. The organic EML may emit light based on the voltage difference between the first electrode AE and the second electrode CE. Although not shown, the organic layer OL may further include a hole transport layer (HTL), a hole injection layer (HIL), an electron transport layer (ETL), and an electron injection layer (EIL). Thus, holes from the first electrode AE and electrons from the second electrode CE may be injected into the organic layer OL. Holes and electrons may combine to generate excitons in the organic EML, and as the excitons self-excite to fall to the ground state, light may be emitted.

The second electrode CE may be disposed on the organic layer OL. The second electrode CE may be a common electrode or a cathode. The second electrode CE may be a transmissive electrode or a semi-transmissive electrode. In the case where the second electrode CE is a transmissive electrode or a semi-transmissive electrode, the second electrode CE may include at least one of Li, Liq, Ca, LiF/Ca, LiF/Al, Al, Mg, BaF, Ba and Ag, or a compound or mixture of at least one of these materials, for example, a mixture of Ag and Mg.

Although not shown, the second electrode CE may include an auxiliary electrode. The auxiliary electrode may include a film formed by depositing at least one of Li, Liq, Ca, LiF/Ca, LiF/Al, Al, Mg, BaF, Ba and Ag, or a compound or mixture of at least one of these materials in a manner facing the organic light-emitting layer EML, and a transparent metal oxide formed on the film (for example, at least one of ITO, indium zinc oxide (IZO), zinc oxide (ZnO) and indium tin zinc oxide (ITZO)), or may include at least one of molybdenum (Mo), titanium (Ti) and Ag.

The organic light-emitting element layer 130 may further include a pixel definition film PDL disposed on the passivation film 230. In a plan view, the pixel definition film PDL may overlap with an edge of the pixel area PA.

In some exemplary embodiments, the organic light-emitting element LD of the organic light-emitting element layer 130 may be disposed in the display area DA, but not in the non-display area NDA. For ease of explanation, it will be assumed that the organic light-emitting element layer 130 is not disposed in the non-display area NDA.

The encapsulation layer 140 may be disposed on the organic light-emitting element layer 130. The encapsulation layer 140 may protect the organic light-emitting element layer 130 to resist (or avoid) external moisture and air.

In some exemplary embodiments, the encapsulation layer 140 may be formed as a thin film encapsulation layer and may include at least one organic film and at least one inorganic film. For example, the encapsulation layer 140 may include a first inorganic film 141 disposed on the second electrode CE, an organic film 145 disposed on the first inorganic film 141, and a second inorganic film 143 disposed on the organic film 145.

The first inorganic film 141 may be disposed on the organic light-emitting element LD and may prevent moisture and air (e.g., oxygen) from penetrating into the organic light-emitting element LD. In some exemplary embodiments, the first inorganic film 141 may include an inorganic material. Examples of the inorganic material include at least one selected from the group consisting of silicon oxide (SiOx), silicon nitride (SiNx), and silicon nitride oxide (SiONx).

The organic film 145 may be disposed on the first inorganic film 141. The organic film 145 may improve planarity. The organic film 145 may include an organic material. Examples of the organic material include at least one selected from the group consisting of epoxy, acrylate, and urethane acrylate.

The second inorganic film 143 may be disposed on the organic film 145. The second inorganic film 143 may substantially perform the same or similar function as the first inorganic film 141, and may substantially include the same or similar material as the first inorganic film 141. The second inorganic film 143 may completely cover the organic film 145. In some exemplary embodiments, the second inorganic film 143 and the first inorganic film 141 may contact each other outside the display area DA, and thus form an inorganic-inorganic junction, in which case moisture and the like may be effectively prevented from penetrating from the outside of the display device 1 into the display device 1.

Although FIG. 7 shows the first inorganic film 141, the organic film 145, and the second inorganic film 143 as single-layer films, the exemplary embodiment is not limited thereto. For example, at least one of the first inorganic film 141, the organic film 145, and the second inorganic film 143 may be a multi-layer film.

In the case where at least one of the first inorganic film 141 and the second inorganic film 143 is formed as a multi-layer film, at least one layer of each of the first inorganic film 141 and the second inorganic film 143 may be a hexamethyldisiloxane (HMDSO) layer. In this case, since the HMDSO layer can absorb pressure, the encapsulation layer 140 may be more flexible. In another example, the organic film 145 may be replaced by the HMDSO layer.

The encapsulation layer 140 may not completely cover the non-display area NDA of the display panel 100. For example, the encapsulation layer 140 may not be disposed in the first non-display area NDA1, the second area A2, and the second non-display area NDA2. As another example, the encapsulation layer 140 may be disposed in the first non-display area NDA1, but not in the second area A2 and the second non-display area NDA2. For ease of explanation, it is assumed that the encapsulation layer 140 is disposed in the display area DA, but not in the first non-display area NDA1, the second area A2, and the second non-display area NDA2.

As described above, the resin layer 400 is disposed on the bottom surface 101 of the display panel 100, and the supporting film 300 is disposed under the resin layer 400. The first groove G1 and the second groove G2 respectively overlapping the first area A1 and the second area A2 of the display panel 100 may be defined in the resin layer 400 and the supporting film 300. The supporting film 300 may include a first film portion 310, a second film portion 330, and a third film portion 350. The first film portion 310 and the second film portion 330 may be separated by the first groove G1, and the second film portion 330 and the third film portion 350 may be separated by the second groove G2.

In some exemplary embodiments, the resin layer 400 may include an inner side 401 defining the first groove G1 and an inner side 402 defining the second groove G2.

The first film portion 310 may include an inner side 313 close to the first groove G1, a top surface 311 facing the resin layer 400, and a bottom surface 315 opposite to the top surface 311.

The second film portion 330 may include an inner side 333 close to the first groove G1, an inner side 337 close to the second groove G2, a top surface 331 facing the resin layer 400, and a bottom surface 335 opposite to the top surface 331.

The third film portion 350 may include an inner side 353 close to the second groove G2, a top surface 351 facing the resin layer 400, and a bottom surface 355 opposite to the top surface 351.

The first groove G1 may be defined by the inner side 401 of the resin layer 400, the inner side 313 of the first film portion 310, and the inner side 333 of the second film portion 330. The second groove G2 may be defined by the inner side 402 of the resin layer 400, the inner side 337 of the second film portion 330, and the inner side 353 of the third film portion 350.

In some exemplary embodiments, since the first groove G1 is formed by applying laser light, the angle θ1 formed by the top surface 311 and the inner side 313 of the first film portion 310 may be a sharp angle, and the angle θ2 formed by the top surface 331 and the inner side 333 of the second film portion 330 may also be a sharp angle.

Therefore, in some exemplary embodiments, the width Wg of the first groove G1 in the second direction Y may gradually decrease as the distance from the display panel 100 decreases. In addition, in some exemplary embodiments, the distance between the top surface 311 of the first film portion 310 and the top surface 331 of the second film portion 330 in the second direction Y may be smaller than the distance between the bottom surface 315 of the first film portion 310 and the bottom surface 335 of the second film portion 330 in the second direction Y.

The angle θ3 formed by the top surface 331 and the inner side 337 of the second film portion 330 may be a sharp angle, and the angle θ4 formed by the top surface 351 and the inner side 353 of the third film portion 350 may also be a sharp angle. Therefore, the width of the second groove G2 in the second direction Y, similar to the width Wg of the first groove G1 in the second direction Y, may gradually decrease as the distance from the display panel 100 decreases. In addition, in some exemplary embodiments, the distance between the top surface 351 of the third film portion 350 and the top surface 331 of the second film portion 330 in the second direction Y may be smaller than the distance between the bottom surface 355 of the third film portion 350 and the bottom surface 335 of the second film portion 330 in the second direction Y.

In some exemplary embodiments, the burr pattern BUR may be formed on the bottom surfaces 315 and 335 of the first film portion 310 and the second film portion 330 around the first groove G1. In addition, the burr pattern BUR may be formed on the bottom surfaces 335 and 355 of the second film portion 330 and the third film portion 350 around the second groove G2. The burr pattern BUR may be formed by melting a portion of the supporting film 300 due to the heat energy of the applied laser light during the formation of the first groove G1 and the second groove G2.

The burr pattern BUR may be formed together with the first groove G1 and the second groove G2. Therefore, in some exemplary embodiments, the burr pattern BUR may extend in the same direction as the first groove G1 and the second groove G2, for example, in the first direction X.

The polymer layer 500 may be disposed in the first groove G1. In some exemplary embodiments, the polymer layer 500 may fill the first groove G1. For example, the polymer layer 500 may be formed by applying a polymer in the form of a solution or paste to the inner side of the first groove G1 and drying the polymer.

The polymer layer 500 may contact the inner side 401 of the resin layer 400, and may also contact the inner sides 313 and 333 of the first film portion 310 and the second film portion 330. When the bottom surface 101 of the display panel 100 is exposed through the first groove G1, the polymer layer 500 may also contact the bottom surface 101 of the display panel 100 or the bottom surface 101 of the base substrate 110 of the display panel 100.

In some exemplary embodiments, the polymer used to form the polymer layer 500 may overflow the first groove G1, and thus the polymer layer 500 may also be formed on the outer side of the first groove G1. Thus, the polymer layer 500 may partially contact the burr pattern BUR and may also contact at least one of the bottom surfaces 315 and 335 of the first film portion 310 and the second film portion 330.

When the display panel 100 is bent or folded in the first area A1, the polymer layer 500 can prevent the first film portion 310 and the second film portion 330 from being peeled off from the display panel 100. In addition, when the display panel 100 returns to its original state after being bent or folded, the polymer layer 500 can provide elastic restoring force to the display panel 100.

As described above, the width Wg of the first groove G1 in the second direction Y may gradually decrease as the distance from the display panel 100 decreases. Therefore, the width of the polymer layer 500 filling the first groove G1 in the second direction Y may also gradually decrease along the thickness direction (e.g., Z direction) of the polymer layer 500 as the distance from the display panel 100 decreases.

The supporting film 300 and the polymer layer 500 may form a supporting film structure FS for the display device 1 disposed below the display panel 100. The supporting film structure FS includes the polymer layer 500 and the supporting film 300, the polymer layer 500 overlaps with the first area A1 where the display panel 100 can be repeatedly folded or bent, and the first groove G1 and the second groove G2 are defined in the supporting film. The supporting film 300 may protect and support the display panel 100, and the second groove G2 helps and the second groove G2 may help bend the display panel 100 in the non-display area NDA. The polymer layer 500 may help improve the reliability of the display device 1 to resist repeated folding or bending of the display panel 100. That is, the supporting film structure FS can help realize a display device 1 with improved reliability and reduced bezel width.

The neutral plane adjustment layer BPL may be disposed in the non-display area NDA of the display panel 100. The neutral plane adjustment layer BPL may be disposed to overlap with the second area A2 of the non-display area NDA. In some exemplary embodiments, a portion of the neutral plane adjustment layer BPL may be disposed in the first non-display area NDA1 and the second non-display area NDA2.

The neutral plane adjustment layer BPL can prevent cracks in the wiring (not shown) in the driving layer 120 by reducing the pressure applied to the driving layer 120 in the second area A2 when the display panel 100 is bent. For example, the driving layer 120 may include wiring passing through the first non-display area NDA1, the second area A2, and the second non-display area NDA2, and the components in the driving layer 120 may be electrically connected to the flexible printed circuit board FPC and the driver integrated chip IC through the wiring. The neutral plane adjustment layer BPL adjusts the position of the neutral plane so that tensile stress is not applied to the wiring in the second area A2. The neutral plane refers to a plane to which no compressive stress or tensile stress is applied when the display panel 100 is bent or folded in the second area A2. For example, when the display panel 100 is bent in the second area A2, compressive stress acts on the inner side of the curvature of the bent display panel 100, and tensile stress acts on the outer side of the curvature of the bent display panel 100. Therefore, the stress direction gradually changes from the compressive direction to the tensile direction along the direction from the inner side to the outer side of the curvature of the bent display panel 100, and there is a point (or plane) where neither compressive stress nor tensile stress acts. This point becomes the neutral plane. By adjusting the position of the neutral plane with the neutral plane adjustment layer BPL, compressive stress can be applied to the wiring in the driving layer 120, and thus the risk of cracks in the driving layer 120 can be reduced.

In some exemplary embodiments, the neutral plane adjustment layer BPL may include an organic material, and the organic material may be, for example, a photosensitive organic material. For example, the neutral plane adjustment layer BPL may include an acrylic material.

In some exemplary embodiments, the neutral plane adjustment layer BPL can contact the flexible printed circuit board FPC and can cover the portion of the flexible printed circuit board FPC connected to the second non-display area NDA2. Therefore, the second non-display area NDA2 can be prevented from being separated from the flexible printed circuit board FPC, and the reliability of the display device 1 can be improved.

FIG. 11 is a cross-sectional view showing the display device of FIG. 5 in a state of bending in the non-display region according to some exemplary embodiments. FIG. 12 is a cross-sectional view showing the display device of FIG. 5 in a state of bending in the display region and the non-display region according to some exemplary embodiments. FIG. 13 is a cross-sectional view showing the display device of FIG. 5 in a state of bending in the display region and the non-display region according to some exemplary embodiments.

Referring to FIGS. 11 to 13, the display panel 100 of the display device 1 can be bent in the second area A2 in the downward direction along the bending axis BX2 (refer to FIG. 1) extending in the first direction X. Since the second groove G2 overlapping the second area A2 is defined in the supporting film 300, the display panel 100 can be easily bent.

Since the display panel 100 is partially bent in the non-display area NDA, the non-display area NDA of the display device 1 as viewed from the outside can be reduced, and the frame width of the display device 1 can be reduced. In addition, since the neutral plane adjustment layer BPL overlapping with the second area A2 is arranged in the second area A2, the wiring in the second area A2 of the display panel 100 can be prevented from cracking, and the reliability of the display device 1 can be improved.

The display panel 100 can be folded or bent in the first area A1 along the bending axis BX1 (refer to FIG. 1) extending in the first direction X. In some exemplary embodiments, as shown in FIG. 12, the display panel 100 can be folded in the upward direction facing its display surface. In some exemplary embodiments, as shown in FIG. 13, the display panel 100 can be bent in the opposite direction of the display surface, such as the downward direction. That is, the display device 1 can be implemented as an inner folding type foldable display device and/or an outer folding type foldable display device.

Since the first groove G1 overlapping with the first area A1 is at least defined in the supporting film 300, the display panel 100 can be easily folded or bent. In addition, since the polymer layer 500 is disposed in the first groove G1, the reliability of the display device 1 can be maintained when the display panel 100 is repeatedly folded or bent.

FIG. 14A is an enlarged cross-sectional view of a portion of the display device corresponding to the Q3 portion of FIG. 5 according to some exemplary embodiments. FIG. 14B is an enlarged cross-sectional view of a portion of the display device of FIG. 14A corresponding to the Q5 portion of FIG. 5 according to some exemplary embodiments.

Referring to FIG. 14A and FIG. 14B , except that the display device 2 further includes carbide CM, the display device 2 is substantially the same as the display device 1. Therefore, the description of the display device 2 below will mainly focus on the differences from the display device 1.

The carbide CM may be disposed in the first groove G1 of the supporting film 300. The carbide CM may overlap with the first area A1, may be disposed between the bottom surface 101 of the display panel 100 and the polymer layer 500, and may contact the polymer layer 500 and the bottom surface 101 of the display panel 100.

As described above, the first groove G1 may be formed by applying laser light to the supporting film 300. The base substrate 110 of the display panel 100 may be formed of a polymer material having flexibility. Thus, the base substrate 110 or the resin layer 400 of the display panel 100 may be partially carbonized, and thus the carbide CM may remain on the bottom surface 101 of the display panel 100.

Similarly, the carbide CM can also be disposed in the second groove G2, for example, on the bottom surface 101 of the display panel 100.

As described above, since carbide CM may be formed in the process of forming the first groove G1 and the second groove G2, carbide CM may not exist on the bottom surface 101 of the display panel 100 outside the first area A1 and the second area A2. Since carbide CM exists in the first area A1 and the second area A2, the transmittance of the base substrate 110 of the display panel 100 may change depending on the area. For example, the transmittance of the base substrate 110 may be lower in the first area A1 and the second area A2 than in other areas. Alternatively, although not specifically shown, carbide CM may exist in the first groove G1 but not in the second groove G2. As another alternative, carbide CM may not exist in the first groove G1 but may only exist in the second groove G2.

FIG. 15A is an enlarged cross-sectional view of a modified example of FIG. 14A, and FIG. 15B is an enlarged cross-sectional view of a modified example of FIG. 14B.

Referring to FIG. 15A and FIG. 15B, the display device 2a may have a resin layer 400 that is not removed from its first area A1 and second area A2. That is, a first portion 400a1 of the portion of the resin layer 400 that is not removed still remains and can be disposed in the first area A1, and a second portion 400a2 of another portion of the resin layer 400 that is not removed still remains and can be disposed in the second area A2.

In some exemplary embodiments, the thickness Ta1 of the first portion 400a1 may be substantially the same as the thickness Td of the portion of the resin layer 400 disposed in the entire display area DA excluding the first area A1.

In some exemplary embodiments, in the first groove G1, the polymer layer 500 may directly contact the top surface of the first portion 400a1.

The first portion 400a1 of the portion of the resin layer 400 remaining in the first area A1 may not expose the bottom surface 101 of the display panel 110, but may completely cover the bottom surface 101 of the display panel 110, but the present disclosure is not limited thereto. Alternatively, the bottom surface 101 of the display panel 110 may be partially exposed in the first area A1, but not completely covered by the first portion 400a1.

In some exemplary embodiments, the thickness Ta2 of the second portion 400a2 of the portion of the resin layer 400 that is not removed may be substantially the same as the thickness Tnd of the portion of the resin layer 400 disposed in the entire non-display area NDA excluding the second area A2.

FIG. 15C is an enlarged cross-sectional view of another modified example of FIG. 14A, and FIG. 15D is an enlarged cross-sectional view of a modified example of FIG. 14B.

Referring to FIG. 15C and FIG. 15D , the display device 2b may have a resin layer 400 that is not removed from its first area A1 and second area A2.

In some exemplary embodiments, the first portion 400b1 of the remaining portion of the resin layer 400 may be disposed in the first area A1. In some embodiments, the thickness Tb1 of the first portion 400b1 may be less than the thickness Td of the portion of the resin layer 400 disposed in the entire display area DA excluding the first area A1.

In some exemplary embodiments, in the first groove G1, the polymer layer 500 may directly contact the side surface of the resin layer 400 and the top surface of the first portion 400b1.

The first portion 400b1 may not expose the bottom surface 101 of the display panel 110, but may completely cover the bottom surface 101 of the display panel 110, but the present disclosure is not limited thereto. Alternatively, the bottom surface 101 of the display panel 110 may be partially exposed in the first area A1, but not completely covered by the first portion 400b1.

In some exemplary embodiments, the second portion 400b2 of another portion of the remaining resin layer 400 may be disposed in the second area A2. In some embodiments, the thickness Tb2 of the second portion 400b2 may be less than the thickness Tnd of the portion of the resin layer 400 disposed in the entire non-display area NDA excluding the second area A2.

FIG. 15E is an enlarged cross-sectional view of another modified example of FIG. 14A, and FIG. 15F is an enlarged cross-sectional view of another modified example of FIG. 14B.

Referring to FIG. 15E and FIG. 15F, the display device 2c may have a resin layer 400 that is not removed from the first area A1 and the second area A2.

In some exemplary embodiments, the first remaining portion 400c1 of the remaining resin layer 400 may be disposed in the first area A1. The first remaining portion 400c1 may not completely cover but may partially expose the bottom surface 101 of the display panel 110.

In some exemplary embodiments, in the first groove G1, the polymer layer 500 may be in direct contact with the first remaining portion 400c1.

In some exemplary embodiments, the second remaining portion 400c2 of the remaining resin layer 400 may be disposed in the second area A2. The second remaining portion 400c2 may not completely cover but may partially expose the bottom surface 101 of the display panel 110.

Figures 16, 17, 18, 19, 20 and 21 are enlarged cross-sectional views of a portion of the display device corresponding to the Q3 portion of Figure 5 according to some exemplary embodiments.

Referring to FIG. 16 , except for the structure of the supporting film structure FS1 of the display device 3 , the display device 3 is substantially the same as the display device 1 . Therefore, the following description of the display device 3 will mainly focus on the differences from the display device 1 .

The supporting film structure FS1 may include a supporting film 300 and a polymer layer 501.

The polymer layer 501 may be formed as an adhesive tape and may be attached to the portion of the bottom surface 101 of the display panel 100 exposed through the first groove G1.

In some exemplary embodiments, the polymer layer 501 may contact the bottom surface 101 of the display panel 100 and may be spaced from at least one of the inner side 401 of the resin layer 400, the inner side 313 of the first film portion 310, and the inner side 333 of the second film portion 330. For example, as shown in FIG. 16, the polymer layer 501 may contact the bottom surface 101 of the display panel 100 and may be spaced from all of the inner side 401 of the resin layer 400, the inner side 313 of the first film portion 310, and the inner side 333 of the second film portion 330.

Referring to FIG. 17 , the display device 4 is substantially the same as the display device 3 except that the carbide CM is further disposed between and in contact with the polymer layer 501 of the supporting film structure FS1 for the display device 4 and the bottom surface 101 of the display panel 100 . Therefore, the detailed description of the display device 4 will be omitted.

Referring to FIG. 18 , the display device 5 is substantially the same as the display device 3 except that the carbide CM is further provided in the supporting film structure FS2 for the display device 5 including the supporting film 300 and the polymer layer 502 formed as an adhesive tape. The polymer layer 502 contacts not only the bottom surface 101 of the display panel 100, but also the inner side 401 of the resin layer 400, the inner side 313 of the first film portion 310, and the inner side 333 of the second film portion 330. Therefore, the detailed description of the display device 5 will be omitted.

Referring to FIG. 19 , display device 6 is substantially the same as display device 5 except that carbide CM is further disposed between and in contact with polymer layer 502 and bottom surface 101 of display panel 100. Therefore, a detailed description of display device 6 will be omitted.

Referring to FIG. 20, display device 7 is substantially the same as display device 5 except that the supporting film structure FS3 for display device 7 includes a supporting film 300 and a polymer layer 503 formed as an adhesive tape. Therefore, the following description of display device 3 will mainly focus on the differences from display device 1. The polymer layer 503 is in contact with not only the bottom surface 101 of the display panel 100, the inner side 401 of the resin layer 400, the inner side 313 of the first film portion 310, and the inner side 333 of the second film portion 330, but also the burr pattern BUR, the bottom surface 315 of the first film portion 310, and the bottom surface 335 of the second film portion 330. Therefore, the detailed description of display device 7 will be omitted.

Referring to FIG. 21 , display device 8 is substantially the same as display device 7 except that carbide CM is further disposed between and in contact with the polymer layer 503 and the bottom surface 101 of the display panel 100. Therefore, a detailed description of display device 8 will be omitted.

The structure of each of the display devices 3 to 8 in Figures 16 to 21 in the second area A2 may be substantially the same as the structure shown in Figure 10, Figure 14B, Figure 15B, Figure 15D or Figure 15F.

FIG. 22 is a schematic diagram of a motherboard for a display device according to some exemplary embodiments. FIG. 23 is a rear view of the motherboard of FIG. 22 according to some exemplary embodiments. FIG. 24, FIG. 25, FIG. 26 and FIG. 27 are cross-sectional views taken along line X3-X3' of FIG. 23 and show the display device at various manufacturing stages according to some exemplary embodiments.

The following will describe a method for manufacturing a display device according to some exemplary embodiments with reference to FIGS. 22 to 27.

Referring to FIG. 22 and FIG. 23, a motherboard 2000 is formed, a resin layer 4000 is formed on the bottom surface of the motherboard 2000, and a motherboard substrate MS is manufactured by coupling a supporting film 3000 and the resin layer 4000, and the supporting film 3000 has not yet been cut into respective supporting films.

The motherboard 2000 may include a plurality of display cells 1000 and a virtual area DD. The display cells 1000 may share the same board and may become respective display panels 100 after being separated from the motherboard 2000. That is, the cross-sectional stacking structure of the display cells 1000 may be the same as the cross-sectional stacking structure of the display panel 100 of FIG. 6 or FIG. 7. Each of the display cells 1000 may include a first area A1 and a second area A2.

The virtual area DD may be disposed between the display cells 1000. The virtual area DD may be disposed near the display cells 1000 and may surround the display cells 1000. The virtual area DD is a removable element, such as a completely removable element.

In the following, referring to FIG. 24, laser light L1 is applied from below the supporting film 3000. The laser light L1 can be selectively applied to the supporting film 3000 portion corresponding to the first area A1 and the second area A2 of each of the display cells 1000. In some exemplary embodiments, the laser light L1 can be ultraviolet (UV) laser light.

When the laser light L1 is applied, the adhesion between the mother board 2000 and the resin layer 4000 may be weakened in the first area A1 and the second area A2 of each of the display cells 1000. For example, when the laser light L1 is applied to the first area A1 and the second area A2 of each of the display cells 1000, the carbide layer CMA may be formed on the bottom surface of the mother board 2000, the base substrate of the mother board 2000 may expand, or the carbide layer CMA may be formed in the first portion 4010 of the resin layer 4000 corresponding to the first area A1 and/or the second area A2 of each of the display cells 1000, and thus the adhesion between the first portion 4010 and the mother board 2000 may be weakened. Although not specifically shown, the laser light L1 may be applied to a portion of the virtual area DD where the extended lines of the first area A1 and the second area A2 of each of the display cells 1000 are located in the virtual area DD.

25, the resin layer 4000 and the supporting film 3000 may be cut by applying the laser light L2 from below the supporting film 3000 along each edge of the first area A1 and the second area A2 of each of the display cells 1000. In this manner, the resin layer 4001 and the supporting film 3001 of the mother structure MS1 may be formed. In some exemplary embodiments, the laser light L2 may be a carbon dioxide ( _CO2 ) laser light having a relatively high energy efficiency.

In the process of applying the laser light L2, the burr pattern BUR may be formed on the bottom surface of the support film 3001. The burr pattern BUR may be formed along each edge of the first area A1 and the second area A2 of each display cell 1000. The burr pattern BUR may be formed by melting a portion of the support film 3001 due to the heat energy of the laser light L2. Although not specifically shown, the laser light L2 may also be applied to the edge of a portion of the virtual area DD, the edge of which is located on the extension line of the first area A1 and the second area A2 of each display cell 1000.

Hereinafter, referring to FIG. 26, the first groove G1 and the second groove G2 are formed by removing the portion of the support film 3001 overlapping the first area A1 and the second area A2 of each of the display cells 1000. In this manner, the resin layer 4002 and the support film 3002 of the motherboard structure MS2 can be formed. In some exemplary embodiments, the carbide layer CMA may be partially retained without being removed, and thus may be disposed in the first groove G1 and the second groove G2 as the carbide CM. Although not specifically shown, the portion of each of the resin layer 4002 and the support film 3002 corresponding to the virtual area DD portion located on the extension line of the first area A1 and the second area A2 of each of the display cells 1000 may also be removed.

Hereinafter, referring to FIG. 27, the display cell 1000 is separated by removing a portion of the motherboard structure MS2 corresponding to the virtual area DD. Each of the display cells 1000 may include a display panel 100, a resin layer 400, and a supporting film 300. Each of the display cells 1000 may further include a carbide CM. The supporting film 300 may include a first film portion 310 and a second film portion 330 separated by a first groove G1 of the supporting film 300, and a third film portion 350 separated from the second film portion 330 by a second groove G2 of the supporting film 300.

Hereinafter, the supporting film structure FS for the display device is manufactured by forming a polymer layer 500 in the first groove G1 of the supporting film 300. The polymer layer 500 may be formed by filling the first groove G1 of the supporting film 300 with a polymer in the form of a solution or paste and drying the polymer. Alternatively, although not specifically shown, the polymer layer 500 may be formed by attaching a polymer in the form of an adhesive tape to at least the inner side of the first groove G1 of the supporting film 300. Still another alternative, the polymer layer 500 may be formed before the separation of the display cell 1000. That is, the polymer layer 500 may be formed in the first groove G1 of the supporting film 3002, and then the display cell 1000 may be separated.

Hereinafter, the flexible printed circuit board FPC may be coupled to the display panel 100, and the neutral plane adjustment layer BPL may be formed to overlap with the second area A2 of the display panel 100, thereby forming the display device 1 of FIG. 1.

In the following, the display panel 100 may be bent, for example, bent in the downward direction in the second area A2, thereby forming the display device 1 of FIG. 11.

As described according to FIGS. 22 to 27, the first groove G1 and the second groove G2 are simultaneously formed in the motherboard structure MS2, and then the display unit 1000 is separated. Therefore, the manufacturing of the display device can be simplified, but the exemplary embodiment is not limited to forming the first groove G1 and the second groove G2 at the same time. In addition, the polymer layer 500 can be easily formed by applying a polymer solution or attaching an adhesive tape polymer to the inner side of the first groove G1, thereby further simplifying the manufacturing of the display device. Although various effects of the exemplary embodiment have been described, the various effects are not limited to the foregoing, and other effects are expected.

Although this document describes specific exemplary embodiments and implementation methods, other embodiments and modifications will be apparent from this specification. Therefore, the present invention concept is not limited to these embodiments, but is limited to the broader scope of the attached patent application and various obvious modifications and equivalent configurations that are obvious to those with ordinary knowledge in the art.

1: Display device

100: Display panel

300: Support film

310: First film part

330: Second film part

350: Third film part

400: Resin layer

500:Polymer layer

A1: Area 1

A2: Second area

BX1: First bend crankshaft

BX2: Second crankshaft

DA: Display Area

FPC: Flexible Printed Circuit Board

FS: Supported membrane structure

G1: First slot

G2: Second slot

MP: Main printed circuit board

NDA: Non-Display Area

X: First direction

Y: Second direction

Z: thickness direction

Claims (14)

A display device comprises: a display panel, comprising: a display area, comprising a first bendable area; and a non-display area adjacent to the display area; a supporting film coupled to a bottom surface of the display panel, the supporting film comprising a first groove overlapping the first area; a polymer layer disposed in the first groove, the polymer layer comprising a material having a higher flexibility than the supporting film; and a burr pattern disposed near the first groove and formed on a bottom surface of the supporting film, wherein a top surface of the supporting film and an inner side of the supporting film defining the first groove are connected to form a burr pattern. The angle formed is a sharp angle, and the polymer layer covers the burr pattern and further contacts the bottom surface of the supporting film, wherein: the non-display area includes a bendable second area; the supporting film further includes a second groove, the second groove overlaps with the second area and extends in the same direction as the first groove; the second groove is left empty; the display device further includes a neutral plane adjustment layer, which overlaps with the second area and includes an organic material; the neutral plane adjustment layer is disposed in the non-display area and is not disposed in the display area; and the neutral plane adjustment layer overlaps with the second groove. A display device as described in claim 1, wherein the polymer layer fills the first groove and contacts the inner side of the supporting film. The display device as described in claim 1 further comprises: a resin layer disposed between the display panel and the supporting film, the resin layer coupling the display panel and the supporting film, wherein: the first groove is further defined in the resin layer; and the polymer layer is further in contact with an inner side of the resin layer defining the first groove. A display device as described in claim 1, wherein: a portion of the bottom surface of the display panel is exposed by the first groove; and in the first groove, the polymer layer further contacts the portion of the bottom surface of the display panel. A display device as described in claim 4, wherein the display panel comprises: a base substrate having flexibility and providing the bottom surface of the display panel; a driving layer disposed on the base substrate; an organic light-emitting element disposed on the driving layer; and a thin film encapsulation layer covering the organic light-emitting element, and In the first groove, the polymer layer contacts a portion of a bottom surface of the base substrate. A display device as described in claim 1, wherein the polymer layer is formed as an adhesive tape. The display device as described in claim 1 further comprises: a carbide disposed between the bottom surface of the display panel and the polymer layer. A display device as described in claim 7, wherein the carbide is in contact with the bottom surface of the display panel and the polymer layer. A display device as described in claim 1, wherein: the supporting film comprises polyethylene terephthalate (PET); and the polymer layer comprises polyimide (PI). A display device as described in claim 1, wherein the width of the first groove gradually increases in a thickness direction as the distance from the display panel increases. A display device as described in claim 1, wherein the burr pattern and the polymer layer extend in the same direction. The display device as described in claim 1 further comprises: a carbide disposed on a portion of the bottom surface of the display panel exposed by the second groove. A display device as described in claim 1, wherein: the burr pattern is also disposed near the second groove. The display device as described in claim 1 further comprises: a flexible printed circuit board (PCB) connected to the display panel, wherein the non-display area further comprises: a first non-display area adjacent to the display area; and a second non-display area farther from the display area than the first non-display area, the second area being inserted between the first non-display area and the second non-display area, wherein in the second non-display area, the flexible printed circuit board is connected to the display panel and contacts the neutral plane adjustment layer.

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