TWI855748B - Optical signal processing device and optical signal measurement method - Google Patents

Abstract

The present disclosure provides an optical signal processing device configured to measure wafer-scale micro LEDs, including optical signal testing units and an optical sensing device. The optical signal testing units are configured to transmit optical signals generated by micro LEDs. An optical signal testing unit transmits an optical signal generated by a micro LED. The optical signal sensing device is configured to sense the optical signals transmitted by the optical signal testing units during a plurality of time periods, and is configured to generate sensing signals according to the optical signals.

Description

Optical signal processing device and optical signal measurement method

The present disclosure relates to a light signal processing device, and more particularly to a light signal processing device for sensing a light signal generated by a light-emitting element.

As the demand for light-emitting components increases, the size of light-emitting components is getting smaller and smaller. In contrast, the number of light-emitting components per unit area is increasing. Before light-emitting components are manufactured and shipped, they must be tested. Therefore, how to efficiently test the increasing number and density of light-emitting components has become an important issue in this field.

The above “prior art” description is only to provide background technology, and does not admit that the above “prior art” description discloses the subject matter of the present disclosure, does not constitute the prior art of the present disclosure, and any description of the above “prior art” should not be regarded as any part of the present case.

An embodiment of the present disclosure provides an optical signal processing device for testing an optical signal of a micro-luminescent diode array, wherein the micro-luminescent diode array is divided into a plurality of test blocks, each test block includes a plurality of micro-luminescent diodes, and the optical signal processing device tests a single test block at a time, and the optical signal processing device includes a plurality of optical signal testing components and an optical signal sensing device. The optical signal testing components are used to transmit a plurality of first optical signals emitted by a plurality of first micro-luminescent diodes of a selected test block within a first time period; and transmit a plurality of second optical signals emitted by a plurality of second micro-luminescent diodes of the selected test block within a second time period. An optical signal test element is used to sense the first optical signals transmitted by the optical signal test elements in the first time period; sense the second optical signals transmitted by the optical signal test elements in the second time period; and generate a plurality of sensing signals according to the first optical signals and the second optical signals.

An embodiment of the present disclosure provides an optical signal measurement method for an optical signal processing device, for testing an optical signal of a micro-LED array, wherein the micro-LED array is divided into a plurality of test blocks, each test block includes a plurality of micro-LEDs, and the optical signal processing device tests a single test block at a time. The optical signal processing device includes a plurality of optical signal test components and an optical signal sensing device. The optical signal measurement method includes: aligning the optical signal test components with a plurality of micro-LEDs in a selected test block on a wafer, wherein the micro-LEDs include a plurality of first LEDs and a plurality of second LEDs; the optical signal test components transmit the first micro-LEDs to the optical signal processing device; A plurality of first light signals are emitted by the photodiode within a first time period, wherein one light signal test element transmits a light signal emitted by a first micro-luminescent diode; the light signal sensing device senses the first light signals transmitted by the light signal test elements and generates a plurality of first sensing signals according to the first light signals; the light signal test elements transmit a plurality of second light signals emitted by the second micro-luminescent diodes within a second time period, wherein one light signal test element transmits a light signal emitted by a second micro-luminescent diode; and the light signal sensing device senses the second light signals transmitted by the light signal test elements and generates a plurality of second sensing signals according to the second light signals.

An embodiment of the present disclosure provides an optical signal measurement method for an optical signal processing device, for testing an optical signal of a micro-luminescent diode array, wherein the micro-luminescent diode array is divided into a plurality of test blocks, each test block includes a plurality of micro-luminescent diodes, and the optical signal processing device tests a single test block at a time. The optical signal processing device includes a plurality of optical signal test components and an optical signal sensing device. The optical signal measurement method includes: aligning the optical signal test components with a plurality of first micro-luminescent diodes of a selected test block on a wafer; the optical signal test components transmit a plurality of first optical signals emitted by the first micro-luminescent diodes within a first time period, wherein one optical signal test component The optical signal testing component transmits an optical signal emitted by a first micro-luminescent diode; the optical signal sensing device senses the first optical signals transmitted by the optical signal testing components and generates a plurality of first sensing signals according to the first optical signals; the optical signal testing components are aligned with a plurality of second micro-luminescent diodes of another selected test area on the wafer; the optical signal testing components transmit a plurality of second optical signals emitted by the second micro-luminescent diodes within a second time period, wherein one optical signal testing component transmits an optical signal emitted by a first micro-luminescent diode; and the optical signal sensing device senses the second optical signals transmitted by the optical signal testing components and generates a plurality of second sensing signals according to the second optical signals.

The above has been a fairly broad overview of the technical features and advantages of the present disclosure, so that the detailed description of the present disclosure below can be better understood. Other technical features and advantages that constitute the subject matter of the patent application scope of the present disclosure will be described below. Those with ordinary knowledge in the technical field to which the present disclosure belongs should understand that the concepts and specific embodiments disclosed below can be easily used to modify or design other structures or processes to achieve the same purpose as the present disclosure. Those with ordinary knowledge in the technical field to which the present disclosure belongs should also understand that such equivalent constructions cannot deviate from the spirit and scope of the present disclosure as defined by the attached patent application scope.

The following description of the present disclosure is accompanied by the drawings which are incorporated into and constitute a part of the specification, and illustrate embodiments of the present disclosure, but the present disclosure is not limited to the embodiments. In addition, the following embodiments can be appropriately integrated to complete another embodiment.

"One embodiment", "embodiment", "exemplary embodiment", "other embodiments", "another embodiment", etc. refer to embodiments described in the present disclosure that may include specific features, structures or characteristics, but not every embodiment must include the specific features, structures or characteristics. Furthermore, repeated use of the phrase "in an embodiment" does not necessarily refer to the same embodiment, but may refer to the same embodiment.

In order to make the present disclosure fully understandable, the following description provides detailed steps and structures. Obviously, the implementation of the present disclosure is not limited to specific details known to those skilled in the art. In addition, known structures and steps are no longer described in detail to avoid unnecessarily limiting the present disclosure. The preferred embodiments of the present disclosure are described in detail below. However, in addition to the detailed description, the present disclosure can also be widely implemented in other embodiments. The scope of the present disclosure is not limited to the content of the detailed description, but is defined by the scope of the patent application.

It should be understood that the following disclosure provides many different embodiments or examples for implementing different features of the present invention. Specific embodiments or examples of components and arrangements are described below to simplify the disclosure. Of course, these are only examples and are not intended to be limiting. For example, the size of the components is not limited to the disclosed ranges or values, but may depend on the process conditions and/or the desired properties of the device. In addition, the following description of forming a first feature "on" or "on" a second feature may include embodiments in which the first feature and the second feature are formed to be in direct contact, and may also include embodiments in which additional features may be formed between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. For the sake of brevity and clarity, the various features may be arbitrarily drawn in different proportions. In the accompanying drawings, some layers/features may be omitted for simplicity.

Furthermore, for ease of explanation, spatially relative terms such as "beneath," "below," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or feature shown in the figures to another (other) element or feature. The spatially relative terms are intended to encompass different orientations of the elements in use or operation in addition to the orientation depicted in the figures. The device may have other orientations (rotated 90 degrees or in other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.

1 is a schematic diagram of an optical signal processing device 10 according to some embodiments of the present disclosure. The optical signal processing device 10 is used to measure a plurality of optical signals SP emitted by a plurality of micro-luminescent diodes MLED within a time period.

Specifically, the optical signal processing device 10 includes a plurality of optical signal test components 110 and an optical signal sensing device 120. Each optical signal test component 110 is used to receive an optical signal SP emitted by a corresponding micro-luminescent diode MLED and transmit the optical signal SP to the optical signal sensing device 120. In some embodiments, the optical signal test components 110 and the micro-luminescent diodes MLED are one-to-one corresponding. In other words, each optical signal test component 110 receives and transmits an optical signal SP emitted by a corresponding micro-luminescent diode MLED, and the micro-luminescent diode MLED corresponding to each optical signal test component 110 is not repeated.

Furthermore, the optical signal sensing device 120 is coupled to the optical signal test elements 110 to sense the optical signals SP transmitted by the optical signal test elements 110 and generate a plurality of sensing signals SS according to the optical signals SP. In this way, the sensing signals SS can be analyzed by a back-end analysis device (not shown) to obtain relevant test results.

In some embodiments, the micro LEDs MLEDs are wafer-scale micro LEDs disposed on a wafer W. In other words, the optical signal processing device 10 is used to directly measure optical signals of the micro LEDs MLEDs on the wafer W. However, the present disclosure is not limited thereto, for example, the micro LEDs MLEDs may be other components that generate optical signals.

In other embodiments, the micro-LEDs MLEDs are RGB LEDs. In this embodiment, each optical signal testing element 110 is used to receive RGB optical signals SP emitted by a plurality of micro-LEDs MLEDs within a time period. The optical signal SP may include a single color light signal in RGB, such as a red light signal, a green light signal, or a blue light signal.

2 is a schematic diagram of an optical signal processing device 20 according to some embodiments of the present disclosure. The optical signal processing device 20 is used to measure a plurality of optical signals SP emitted by a plurality of micro-luminescent diodes MLED within a time period.

Specifically, the optical signal processing device 20 includes a plurality of optical signal test elements 210, an optical signal sensing device 220, a positioning device 230, and a plurality of probes 240. Each probe 240 is used to transmit a control signal SC to a corresponding micro-LED MLED, so that the micro-LED MLED emits a light signal SP according to the control signal SC. Furthermore, the probes 240 are used to contact the micro-LEDs MLED and transmit the control signals SC to activate the micro-LEDs MLED, so that the micro-LEDs MLED emit light signals SP.

In some embodiments, the probes 240 are disposed on a probe card 245, and the positions of the probes 240 are adjusted through the probe card 245 so that each probe 240 can contact the corresponding micro-luminescent diode MLED. However, the present disclosure is not limited thereto, and various mechanisms or assemblies that can be provided with multiple probes 240 are within the scope of the present disclosure.

In some embodiments, each optical signal test element 210 includes a light guiding unit for receiving an optical signal SP emitted by a corresponding micro-luminescent diode MLED and transmitting the optical signal SP to the optical signal sensing device 220. In some embodiments, each light guiding unit may be an optical fiber, and the optical signal test elements 210 may be arranged in a fiber array block (FAB) structure. In some embodiments, the optical signal processing device 20 includes at least 48, 240, 480 or 960 optical signal test elements 210.

In some embodiments, the micro-luminescent diodes MLEDs are disposed on a wafer W and are wafer-level micro-luminescent diodes. In other words, the optical signal processing device 20 is used to directly measure the optical signals of the micro-luminescent diodes MLEDs on the wafer W. However, the present disclosure is not limited thereto, for example, the micro-luminescent diodes MLEDs are other types of components that can generate optical signals, and the optical signal processing device 20 is used to measure non-wafer-level micro-luminescent diodes MLEDs.

In other embodiments, the micro-LEDs MLEDs are RGB LEDs. In this embodiment, each optical signal test element 210 is used to receive RGB optical signals SP emitted by a plurality of micro-LEDs MLEDs within a time period. The optical signal SP may include a single color light signal in RGB, such as a red light signal, a green light signal, or a blue light signal.

It should be noted that for MLEDs, the conventional technology is to use an integrating sphere to receive the light emitted by them and perform subsequent measurements. However, since the volume of the integrating sphere is very large compared to the MLED, it is difficult to arrange multiple integrating spheres for measurement. In addition, the integrating sphere has its own limitations on the degree of light collection during measurement. It cannot completely receive the optical signal, and it may not be able to completely transmit the received optical signal to the measuring instrument. There will be losses during the transmission, which will inevitably cause errors. Furthermore, the number of LM diodes that can be covered by an integrating sphere at one time is extremely limited (e.g., 4, 8, 16, 32 LM diodes), and only a single LM diode within the range can be lit up for measurement at the same time. Therefore, the measurement of a large number of LM diodes is very time-consuming.

Accordingly, compared to the above-mentioned prior art, the optical signal test element 210 used in the present disclosure is small in size. Therefore, the optical signal test element 210 will not be affected by insufficient space and can be configured one-to-one corresponding to the arrangement of the micro-LEDs, thereby greatly increasing the number of micro-LEDs that can be covered by a single measurement. In addition, since the optical signal test element 210 and the micro-LEDs are configured one-to-one, multiple micro-LEDs can be lit up at the same time for measurement, that is, the optical signal test element 210 transmits multiple optical signals SP emitted simultaneously by multiple micro-LEDs MLEDs, thereby greatly shortening the measurement time. Furthermore, the optical signal testing element 210 uses optical fiber, so the received optical signal SP can be transmitted to the optical signal sensing device 220 almost without loss, so as to improve the measurement quality and reduce the measurement error.

For example, assuming that the integrating sphere of the prior art covers 8 MLEDs, the lighting test time of a single MLED is n seconds, and the time for the integrating sphere to move once is m seconds, then the time for testing 24,000 MLEDs is roughly 24000*n+(24000/8)*m seconds, that is, 24000*n+3000*m seconds. Using the present invention, assuming that the number of optical signal test components 210 of the optical signal processing device 20 is 240, the lighting test time of a single micro-luminescent diode MLED is n seconds, and the time for the optical signal test component 210 to move once as a whole is m seconds, the time to measure the same number of 24,000 micro-luminescent diodes MLED is approximately (24000/240)*n+(24000/240)*m seconds, that is, 100*n+100*m seconds. Obviously, the present disclosure effectively and significantly reduces the test time.

In some embodiments, a micro-LED MLED includes pixels of three primary color LEDs and is disposed on a display panel (not shown). In other words, the optical signal processing device 20 is used to measure optical signals of the pixels on the display panel.

More specifically, the optical signal sensing device 220 is coupled to the optical signal test elements 210 to sense the optical signals SP transmitted by the optical signal test elements 210 and generate a plurality of sensing signals SS according to the optical signals SP. In some embodiments, the optical signal sensing device 220 includes a camera to capture an image of the optical signals SP on an imaging plane in the camera and then generate the sensing signals SS according to the image. In some embodiments, the optical signal sensing device 220 includes a CMOS image sensor (CIS) to sense the optical signals SP using photodiodes on the CIS and generate the sensing signals SS accordingly.

In some embodiments, the sensing signals SS are transmitted to an analysis instrument (not shown), and a sensing signal SS represents the performance of a micro-luminescent diode MLED. For example, the analysis instrument can analyze the sensing signal SS to obtain the brightness, color difference, etc. of the micro-luminescent diode MLED. After the brightness and/or color difference of all micro-luminescent diodes MLED are obtained, all micro-luminescent diodes MLED can be classified (binning) according to the brightness and/or color difference, so that micro-luminescent diodes MLED with similar brightness and/or color difference are classified into the same category.

In some embodiments, the positioning device 230 is used to align the probes 240 and the light guiding units of the optical signal test components 210 with two different surfaces of the micro-LEDs MLEDs. As shown in FIG2 , the micro-LEDs MLEDs contact the probes 240 from the first surface S1 to receive the control signal SC, and send the light signal SP from the second surface S2 to the light guiding unit of the optical signal test component 210, wherein the first surface S1 is opposite to the second surface S2. In some embodiments, the positioning device 230 is used to align the control probes 240 (or the probe cards 245) and the light guiding units of the optical signal test components 210 with the micro-LEDs MLEDs. For example, the positioning device 230 independently controls the probes 240 to align with and contact the micro-LEDs MLEDs, or independently controls the light guiding units of the optical signal testing components 210 to align with the micro-LEDs MLEDs.

3 is a schematic diagram of an optical signal processing device 30 according to some embodiments of the present disclosure. The optical signal processing device 30 is used to measure optical signals SP emitted by a plurality of micro-luminescent diodes MLED. The optical signal processing device 30 includes a plurality of optical signal testing components 310, an optical signal sensing device 320 and a positioning device 330.

In some embodiments, the positioning device 330 is used to align the probes 312 and the light guiding units 311 with the micro-LEDs MLEDs, respectively. As shown in FIG3 , the positioning device 330 aligns the probes 312 and the light guiding units 311 with the first surface S1 of the micro-LEDs MLEDs. Compared to the optical signal processing device 20 , in the optical signal processing device 30 , the probes 312 and the light guiding units 311 are both located on the same side of the micro-LEDs MLEDs during measurement.

Each optical signal test element 310 includes a light guiding unit 311 and a probe 312, and corresponds to a micro-luminescent diode MLED. The light guiding unit 311 and the probe 312 are located on the same side surface of the micro-luminescent diode MLED. The probe 312 is used to contact the micro-luminescent diode MLED to transmit a control signal SC to the micro-luminescent diode MLED so that the micro-luminescent diode MLED emits a light signal SP. The light guiding unit 311 is used to receive the light signal SP emitted by the micro-luminescent diode MLED and transmit the light signal SP to the optical signal sensing device 320. In some embodiments, the light guiding unit 311 includes an optical fiber. In some embodiments, the optical signal processing device 30 includes at least 48, 240, 480, or 960 optical signal test components 310.

In some embodiments, the micro-LEDs MLEDs are light-emitting diodes and are disposed on a wafer W. In some embodiments, the micro-LEDs MLEDs are wafer-level micro-LEDs. In other words, the optical signal processing device 30 is used to directly measure optical signals on the micro-LEDs on the wafer W. However, the present disclosure is not limited thereto, for example, the micro-LEDs MLEDs are other types of components that can generate optical signals, and the optical signal processing device 30 is used to measure non-wafer-level micro-LEDs MLEDs.

In other embodiments, the micro-LEDs MLEDs are RGB LEDs. In this embodiment, each optical signal testing element 310 is used to receive RGB optical signals SP emitted by a plurality of micro-LEDs MLEDs within a time period. The optical signal SP may include a single color light signal in RGB, such as a red light signal, a green light signal, or a blue light signal.

In some embodiments, a micro-LED MLED includes pixels of three primary color LEDs and is disposed on a display panel (not shown). In other words, the optical signal processing device 30 is used to measure optical signals of the pixels on the display panel.

In some embodiments, the optical signal sensing device 320 is coupled to the optical signal test elements 310 to sense the optical signals SP transmitted by the optical signal test elements 310 and generate a plurality of sensing signals SS according to the optical signals SP. In some embodiments, the optical signal sensing device 320 includes a camera to capture an image of the optical signals SP on an imaging plane in the camera and then generate the sensing signals SS according to the image. In some embodiments, the optical signal sensing device 320 includes a CIS, and uses a photodiode on the CIS to sense the optical signals SP and generate the sensing signals SS accordingly.

In some embodiments, the sensing signals SS are transmitted to an analysis instrument (not shown), and a sensing signal SS represents the performance of a micro-luminescent diode MLED. For example, the analysis instrument can analyze the sensing signal SS to obtain the brightness, color difference, etc. of the micro-luminescent diode MLED. After the brightness and/or color difference of all micro-luminescent diodes MLED are obtained, all micro-luminescent diodes MLED can be classified according to the brightness and/or color difference, so that micro-luminescent diodes MLED with similar brightness and/or color difference are classified into the same category.

Referring to FIG. 4A , it is a schematic diagram of the structure and operation of the light guiding unit of the optical signal test component 210 of some embodiments of the present disclosure. In some embodiments, one end of the light guiding unit of the optical signal test component 210 for receiving the optical signal SP includes a plane 210A. When the light guiding unit of the optical signal test component 210 receives the optical signal SP, in order to make the plane 210A cover the entire divergence range of the optical signal SP as much as possible, the position of the light guiding unit of the optical signal test component 210 and the distance D1 of the micro-luminescent diode MLED must be adjusted according to the divergence angle θ1 of the micro-luminescent diode MLED and the axial radius R1 of the light guiding unit of the optical signal test component 210, wherein the distance D1 is adjusted by the positioning device 230. In some embodiments, the optical signal receiving range of the light guiding unit may completely cover (or "only cover") the divergence range of the optical signal SP of the corresponding micro-LED MLED, and does not include the divergence range of the optical signal SP of the adjacent micro-LED MLED. In such a case, whether or not the adjacent micro-LED MLED emits the optical signal SP will not affect the optical signal SP received by the light guiding unit. In other embodiments, the optical signal receiving range of the light guiding unit only partially covers the divergence range of the optical signal SP of the corresponding micro-LED MLED, so the divergence range of the optical signal SP of the micro-LED MLED may be partially located in the optical signal receiving range of other light guiding units. In this case, in order to prevent the optical signal received by the optical signal receiving range of the light guiding unit from being interfered by other signals, the adjacent or close micro-luminescent diodes MLED can be lighted separately in different time periods, so that each time the light guiding unit receives the optical signal SP, it can be as little interfered by the optical signal SP emitted by the adjacent or close micro-luminescent diodes MLED as possible, thereby reducing distortion. In some embodiments, the distance D1 is the shortest distance between the second surface S2 of the micro-luminescent diode MLED and the plane 210A. In some embodiments, the second surface S2 of the micro-luminescent diode MLED and the plane 210A are parallel to each other. In other embodiments, the second surface S2 of the micro-luminescent diode MLED and the plane 210A are not parallel to each other.

The distance D1 between the plane 210A and the second surface S2 of the micro-luminescent diode MLED must at least satisfy equation (1): ; Equation (1)

In some embodiments, in order to make the plane 210A cover the entire divergence range of the optical signal SP, when the divergence angle θ1 increases, the distance D1 needs to be shortened, and when the divergence angle θ1 decreases, the distance D1 may be increased. In other words, when the divergence angle θ1 increases, the distance D1 decreases.

Refer to FIG. 4B , which is a schematic diagram of the structure and operation of the light guiding unit of the optical signal test component 210 of some embodiments of the present disclosure. In some embodiments, the end of the light guiding unit of the optical signal test component 210 for receiving the optical signal SP includes a concave surface 210B. Similarly, the distance D2 between the position of the light guiding unit of the optical signal test component 210 and the micro-LED MLED must be adjusted according to the divergence angle θ2 of the micro-LED MLED and the axial radius R2 of the light guiding unit of the optical signal test component 210, wherein the distance D2 is adjusted by the positioning device 230. In some embodiments, the distance D2 is the shortest distance between the second surface S2 of the micro-LED MLED and the concave surface 210B. In some embodiments, the sidewall of the light guiding unit of the optical signal test device 210 intersects with the concave surface 210B at an intersection C1, and the distance D2 is the shortest distance between the second surface S2 of the micro-luminescent diode MLED and the intersection C1.

The distance D2 between the concave surface 210B and the second surface S2 of the micro-luminescent diode MLED must at least satisfy equation (2): ; Equation (2)

In some embodiments, in order to make the concave surface 210B cover the entire divergence range of the optical signal SP, when the divergence angle θ2 increases, the distance D2 needs to be shortened, and when the divergence angle θ2 decreases, the distance D2 may be increased. In other words, when the divergence angle θ2 increases, the distance D2 decreases.

Referring to FIG. 4C , it is a schematic diagram of the structure and operation of the light guiding unit of the optical signal test component 210 of some embodiments of the present disclosure. In some embodiments, the end of the light guiding unit of the optical signal test component 210 for receiving the optical signal SP includes a convex surface 210C. Similarly, the distance D3 between the position of the light guiding unit of the optical signal test component 210 and the micro-LED MLED must be adjusted according to the divergence angle θ3 of the micro-LED MLED and the axial radius R3 of the light guiding unit of the optical signal test component 210, wherein the distance D3 is adjusted by the positioning device 230. In some embodiments, the sidewall of the light guiding unit of the optical signal test component 210 intersects with the convex surface 210C at an intersection C2, and the distance D3 is the shortest distance between the second surface S2 of the micro-luminescent diode MLED and the intersection C2.

The distance D3 between the convex surface 210C and the second surface S2 of the micro-luminescent diode MLED must at least satisfy equation (3): ; Equation (3)

In some embodiments, in order to make the convex surface 210C cover the entire divergence range of the optical signal SP, when the divergence angle θ3 increases, the distance D3 needs to be shortened, and when the divergence angle θ3 decreases, the distance D3 may be increased. In other words, when the divergence angle θ3 increases, the distance D3 decreases.

In some embodiments, the radius R1, the radius R2 and the radius R3 are equal. In some embodiments, the divergence angle θ1, the divergence angle θ2 and the divergence angle θ3 are equal. In some embodiments, the radii R1, R2 and R3 are the axial radii of the core of the optical fiber of the light guiding unit of the optical signal test element 210.

Referring to FIG. 5A, FIG. 5B and FIG. 5C, the structure and operation of the light guiding unit 311 are similar to the structure and operation of the light guiding unit of the optical signal test element 210 described in FIG. 4A to FIG. 4C. That is, the end of the light guiding unit 311 for receiving the optical signal SP includes a flat surface 311A, a concave surface 311B and a convex surface 311C in different embodiments, and the distance between the end and the first surface S1 of the micro-luminescent diode MLED is at least required to satisfy equation (4): ; Equation (4)

Wherein D represents the distance D4, D5, or D6 between one end of the light guiding unit 311 for receiving the light signal SP and the first surface S1 of the micro-luminescent diode MLED, R represents the axial radius R4, R5, or R6 of the light guiding unit 311, and θ represents the divergence angle θ4, θ5, or θ6 of the micro-luminescent diode MLED.

In some embodiments, the distance D4 is the shortest distance between the first surface S1 of the micro-luminescent diode MLED and the plane 311A. In some embodiments, the distance D5 is the shortest distance between the first surface S1 of the micro-luminescent diode MLED and the concave surface 311B. In some embodiments, the side wall of the light guiding unit 311 intersects with the concave surface 311B at the intersection C3, and the distance D5 is the shortest distance between the first surface S1 of the micro-luminescent diode MLED and the intersection C3. In some embodiments, the side wall of the light guiding unit 311 intersects with the convex surface 311C at the intersection C4, and the distance D6 is the shortest distance between the first surface S1 of the micro-luminescent diode MLED and the intersection C4. In some embodiments, the radii R4, R5, and R6 are the axial radii of the core of the optical fiber of the light guiding unit 311.

In some embodiments, in order to make the plane 311A cover the entire divergence range of the optical signal SP, when the divergence angle θ4, θ5 or θ6 increases, the corresponding distance D4, D5 or D6 needs to be shortened, and when the divergence angle θ4, θ5 or θ6 decreases, the corresponding distance D4, D5 or D6 can be increased. In other words, when the divergence angle θ4, θ5 or θ6 is larger, the corresponding distance D4, D5 or D6 is smaller, and when the divergence angle θ4, θ5 or θ6 is smaller, the corresponding distance D4, D5 or D6 is larger.

Refer to FIG. 6A to FIG. 6C , which are schematic diagrams of the operation of the optical fiber array block FAB and the wafer W of some embodiments of the present disclosure. In some embodiments, the number of optical signal test components 210 included in the optical fiber array block FAB is less than the number of micro-LEDs MLEDs in the micro-LED array on the wafer W. It should be specially noted that, for the sake of simplicity of the drawings and for a further understanding of the present invention, the number and size of the optical signal test components 210 and the micro-LEDs MLEDs shown in FIG. 6A to FIG. 6E are only for illustration. In the embodiments demonstrated therein, the number of optical fibers in the optical fiber array block FAB and the number of MLEDs corresponding thereto are 16 as an example, but this is not the actual number; in some embodiments, In one example, a wafer W may include more micro-luminescent diodes MLEDs, and the fiber array block FAB may include different numbers of optical signal test components 210; for example, the optical signal processing device 20 includes at least 48, 240, 480 or 960 optical signal test components 210, and correspondingly, the micro-luminescent diodes MLEDs include at least 48, 240, 480 or 960.

As shown in FIG. 6A , the optical fiber array block FAB includes 16 optical signal test elements 210, and the micro-luminescent diode array is divided into a plurality of test blocks B1, B2, B3, and B4 (the ranges divided by the dashed blocks in the figure). The optical fiber array block FAB of the optical signal processing device tests a single test block at a time, in other words, the test block is selected for testing at one time. In the example of FIG. 6A , the test block B1 is selected for testing, so in one alignment performed by the positioning device 230 (e.g., the alignment position of FIG. 6A ), the optical fiber array block FAB aligns the 16 micro-luminescent diodes MLED included in the test block B1.

Please refer to FIG. 6B , the optical fiber array block FAB includes 16 optical signal test elements 210. In the example of FIG. 6B , the test block B4 is selected for testing. In one alignment performed by the positioning device 230 (e.g., the alignment position of FIG. 6B ), the number of micro-luminescent diodes MLED included in the alignment test block B4 of the optical fiber array block FAB may be less than 16.

Please refer to FIG. 6C , the fiber array block FAB includes 16 optical signal test components 210. In the example of FIG. 6C , the test block B1 is selected for testing, and in one alignment performed by the positioning device 230 (e.g., the alignment position of FIG. 6C ), the fiber array block FAB aligns the 16 micro-LEDs MLEDs included in the test block B1. The light source of the LED has a light emission angle, that is, the scattering angle of the LED light. In particular, the micro-LED MLED has smaller grains and is more densely arranged. When adjacent micro-LEDs MLED emit light at the same time, light interference will be generated between them, which will affect the optical signal test component 210 receiving the light signal of a single micro-LED MLED. In order to reduce light interference, the micro-LEDs MLEDs in the test block B1 can be divided into two or more groups at intervals. Different groups of micro-LEDs MLEDs light up at different time intervals, and the optical signal test element 210 is also divided into two or more groups corresponding to the micro-LEDs MLEDs in the test block B1.

As shown in FIG6C , the optical signal test components 210 are divided into two groups, where the circular dashed line represents the first group and the square dashed line represents the second group. The first group of optical signal test components 210 respectively corresponds to the first group of micro-luminescent diodes MLEDs, and the second group of optical signal test components 210 respectively corresponds to the second group of micro-luminescent diodes MLEDs. The first group of micro-luminescent diodes MLED and the second group of micro-luminescent diodes MLED are arranged alternately (for example, as shown in FIG. 6C , the first group of micro-luminescent diodes MLED are arranged with a unit interval up and down and left and right, and the second group of micro-luminescent diodes MLED are arranged with a unit interval up and down and left and right, and the first group of micro-luminescent diodes MLED and the second group of micro-luminescent diodes MLED are arranged alternately), and the first group of micro-luminescent diodes MLED and the second group of micro-luminescent diodes MLED do not have repeated micro-luminescent diodes. In some embodiments, the number of optical signal test components 210 in the fiber array block FAB must at least cover the number of all micro-LEDs. In other words, the total number of two groups of micro-LEDs is equal to or less than the number of optical signal test components 210 in the fiber array block FAB.

In this embodiment, the eight micro-LEDs MLEDs of the first group are lit in the first time period, and the optical signal test component 210 performs the first measurement in the first time period, and collects the light from the corresponding eight micro-LEDs MLEDs. The eight micro-LEDs MLEDs of the second group are lit in the second time period, and the optical signal test component 210 performs the second measurement in the second time period, and collects the light from the corresponding eight micro-LEDs MLEDs. In addition, during the first measurement and the second measurement, the optical fiber array block FAB does not need to be repositioned with the micro-LEDs MLEDs. In other words, the position of the optical signal sensing device 220 remains unchanged in the first time period and the second time period.

As shown in FIG7A , the optical signal test components 210 are divided into two groups, where the circular dashed line represents the first group and the square dashed line represents the second group. The first group of optical signal test components 210 respectively corresponds to the first group of micro-luminescent diodes MLEDs, and the second group of optical signal test components 210 respectively corresponds to the second group of micro-luminescent diodes MLEDs. The first group of micro-luminescent diodes MLED and the second group of micro-luminescent diodes MLED are arranged alternately (for example, as shown in FIG. 7A , the first group of micro-luminescent diodes MLED are arranged at intervals of three units in the vertical direction and the horizontal direction, and the second group of micro-luminescent diodes MLED are arranged at intervals of three units in the vertical direction and the horizontal direction, and the first group of micro-luminescent diodes MLED and the second group of micro-luminescent diodes MLED are arranged alternately), and the first group of micro-luminescent diodes MLED and the second group of micro-luminescent diodes MLED do not have repeated micro-luminescent diodes. In some embodiments, the number of optical signal test components 210 in the fiber array block FAB must at least cover the number of all micro-LEDs. In other words, the total number of two groups of micro-LEDs is equal to or less than the number of optical signal test components 210 in the fiber array block FAB.

In this embodiment, the eight micro-LEDs MLEDs of the first group are lit in the first time period, and the optical signal test component 210 performs the first measurement in the first time period, and collects the light from the corresponding eight micro-LEDs MLEDs. The eight micro-LEDs MLEDs of the second group are lit in the second time period, and the optical signal test component 210 performs the second measurement in the second time period, and collects the light from the corresponding eight micro-LEDs MLEDs. In addition, during the first measurement and the second measurement, the optical fiber array block FAB does not need to be repositioned with the micro-LEDs MLEDs. In other words, the position of the optical signal sensing device 220 remains unchanged in the first time period and the second time period.

It should be noted that the aforementioned spacing units are not intended to limit the implementation of the present invention. A person skilled in the art can adjust the staggered arrangement and spacing units of the first group of micro-luminescent diodes MLED and the second group of micro-luminescent diodes MLED according to actual needs.

Referring to FIG. 7B , the fiber array block FAB includes 36 optical signal test components 210, and in one alignment performed by the positioning device 230 (e.g., the alignment position in FIG. 7B ), the fiber array block FAB aligns 36 micro-LEDs MLEDs. The LED light source has a light emission angle, that is, the scattering angle of the LED light. In particular, the micro-LEDs MLEDs have smaller grains and are more densely arranged. When adjacent micro-LEDs MLEDs emit light at the same time, light interference will be generated between them, which will affect the optical signal test component 210 receiving the light signal of a single micro-LED MLED. In order to reduce light interference, the micro-luminescent diodes MLED can be divided into two or more groups at intervals. Different groups of micro-luminescent diodes MLED are lit at different time intervals, and the optical signal test components 210 are also divided into two or more groups corresponding to the micro-luminescent diodes MLED.

As shown in FIG. 7B , the optical signal test components 210 are divided into three groups for example, the circular dashed line represents the first group, the square dashed line represents the second group, and the triangular dashed line represents the third group. The first group of optical signal test components 210 respectively correspond to the first group of micro-luminescent diodes MLEDs, the second group of optical signal test components 210 respectively correspond to the second group of micro-luminescent diodes MLEDs, and the third group of optical signal test components 210 respectively correspond to the third group of micro-luminescent diodes MLEDs. The first group of micro-luminescent diodes MLED, the second group of micro-luminescent diodes MLED and the third group of micro-luminescent diodes MLED are arranged alternately (for example, as shown in Figure 7B, the first group of micro-luminescent diodes MLED are arranged in the same row or the same column with two units interval, the second group of micro-luminescent diodes MLED are arranged in the same row or the same column with two units interval, and the third group of micro-luminescent diodes MLED are arranged in the same row or the same column with two units interval), and the first group of micro-luminescent diodes MLED, the second group of micro-luminescent diodes MLED and the third group of micro-luminescent diodes MLED do not have repeated micro-luminescent diodes. In some embodiments, the number of optical signal test components 210 in the fiber array block FAB must at least cover the number of all micro-LEDs. In other words, the total number of three groups of micro-LEDs is equal to or less than the number of optical signal test components 210 in the fiber array block FAB.

In this embodiment, the 12 micro-luminescent diodes MLEDs of the first group are lit in a first time period, the optical signal test component 210 performs a first measurement in the first time period, and collects light from the corresponding 12 micro-luminescent diodes MLEDs; the 12 micro-luminescent diodes MLEDs of the second group are lit in a second time period, the optical signal test component 210 performs a second measurement in the second time period, and collects light from the corresponding 12 micro-luminescent diodes MLEDs; the 12 micro-luminescent diodes MLEDs of the third group are lit in a third time period, the optical signal test component 210 performs a third measurement in the third time period, and collects light from the corresponding 12 micro-luminescent diodes MLEDs. Furthermore, during the three measurement processes, the fiber array block FAB and the micro-luminescent diode MLED do not need to be repositioned. In other words, the position of the optical signal sensing device 220 remains unchanged during the first time period, the second time period, and the third time period.

In the embodiments shown in FIG. 6A to FIG. 7B , due to the circuit distance or the intentional intention of the designer, in one alignment, the micro-LEDs MLED aligned by the fiber array block FAB emit light signals SP at different time points in the same time period, and the fiber array block FAB transmits multiple light signals SP emitted at different time points in the time period. In other embodiments, the micro-LEDs MLED emit light signals SP at the same time, and the fiber array block FAB transmits the light signals SP at the same time.

Referring to FIG. 8 , it is a flow chart of an optical signal measurement method 800 of some embodiments of the present disclosure. In some embodiments, the measurement method 800 is implemented using an optical signal processing device (e.g., the optical signal processing device of the aforementioned embodiment), the optical signal processing device includes a plurality of optical signal test elements and an optical signal sensing device, the optical signal processing device is used to test an optical signal of a micro-LED array, the micro-LED array is divided into a plurality of test blocks, each test block includes a plurality of micro-LEDs, and the optical signal processing device tests a single test block at a time. The detailed steps are described as follows.

Specifically, step S801 is performed to align a plurality of optical signal test components with a plurality of micro-LEDs in a selected test area on a wafer. The plurality of micro-LEDs include a plurality of first LEDs and a plurality of second LEDs. Step S802 is performed to transmit a plurality of first optical signals emitted by a plurality of first micro-LEDs within a first time period by the plurality of optical signal test components. One optical signal test component transmits an optical signal emitted by a first micro-LED. Step S803 is performed to sense the plurality of first optical signals transmitted by the plurality of optical signal test components by the optical signal sensing device, and generate a plurality of first sensing signals based on the plurality of first optical signals.

Execute step S804, the plurality of optical signal test components transmit the plurality of second optical signals emitted by the plurality of second micro-LEDs in a second time period. Among them, one optical signal test component transmits the second optical signal emitted by one second micro-LED. Execute step S805, the optical signal sensing device senses the plurality of second optical signals transmitted by the plurality of optical signal test components, and generates a plurality of second sensing signals according to the plurality of second optical signals.

In some embodiments, after step S802 is completed, there is no need to move the wafer or the optical signal processing device, that is, the positions of the plurality of optical signal test components remain unchanged during the first time interval and the second time interval. In some embodiments, each of the plurality of first micro-LEDs and the plurality of second micro-LEDs corresponds to a light signal test component, and each light signal test component transmits a light signal emitted by a corresponding micro-LED. In some embodiments, the plurality of first micro-LEDs and the plurality of second micro-LEDs are arranged on the wafer in an alternating manner. In some embodiments, the first time interval and the second time interval do not overlap. In some embodiments, each optical signal test element corresponds to a non-repetitive micro-LED.

Referring to FIG. 9 , it is a flow chart of an optical signal measurement method 900 of some embodiments of the present disclosure. In some embodiments, the measurement method 900 is implemented using an optical signal processing device (e.g., the optical signal processing device of the aforementioned embodiment), the optical signal processing device includes a plurality of optical signal test elements and an optical signal sensing device, the optical signal processing device is used to test an optical signal of a micro-LED array, the micro-LED array is divided into a plurality of test blocks, each test block includes a plurality of micro-LEDs, and the optical signal processing device tests a single test block at a time. The detailed steps are described as follows.

Specifically, step S901 is performed to align a plurality of optical signal test components with a plurality of micro-LEDs in a selected test area on a wafer. The plurality of micro-LEDs include a plurality of first LEDs, a plurality of second LEDs, and a plurality of third LEDs. Step S902 is performed to transmit a plurality of first optical signals emitted by the plurality of first micro-LEDs in a first time interval. One optical signal test component transmits a first optical signal emitted by a first micro-LED. In step S903, the optical signal sensing device senses a plurality of first optical signals transmitted by a plurality of optical signal test elements, and generates a plurality of first sensing signals according to the plurality of first optical signals.

Execute step S904, the plurality of optical signal test components transmit the plurality of second optical signals emitted by the plurality of second micro-LEDs in the selected test block within a second time period. Among them, one optical signal test component transmits the second optical signal emitted by one second micro-LED. Execute step S905, the optical signal sensing device senses the plurality of second optical signals transmitted by the plurality of optical signal test components, and generates a plurality of second sensing signals according to the plurality of second optical signals.

Execute step S906, the plurality of optical signal test components transmit the plurality of third optical signals emitted by the plurality of third micro-LEDs in a third time period. Among them, one optical signal test component transmits the optical signal emitted by one third micro-LED. Execute step S907, the optical signal sensing device senses the plurality of third optical signals transmitted by the plurality of optical signal test components, and generates a plurality of third sensing signals according to the plurality of third optical signals.

In some embodiments, after steps S902 and S904 are completed, there is no need to move the wafer or the optical signal processing device, that is, the positions of the plurality of optical signal test components remain unchanged during the first time period, the second time period, and the third time period. In some embodiments, the plurality of first micro-luminescent diodes, the plurality of second micro-luminescent diodes, and the plurality of third micro-luminescent diodes are arranged on the wafer in an alternating manner. In some embodiments, the first time period, the second time period, and the third time period do not overlap. In some embodiments, the micro-luminescent diodes corresponding to each optical signal test component are not repeated.

Referring to FIG. 10 , it is a flow chart of an optical signal measurement method 1000 of some embodiments of the present disclosure. In some embodiments, the measurement method 1000 is implemented using an optical signal processing device (such as the optical signal processing device of the aforementioned embodiment), and the optical signal processing device includes a plurality of optical signal test elements and an optical signal sensing device. The detailed steps are described as follows.

Specifically, step S1001 is performed to align a plurality of optical signal test components with a plurality of first micro-luminescent diodes in a selected test area on a wafer. Step S1002 is performed to transmit a plurality of first optical signals emitted by a plurality of first micro-luminescent diodes in a first time period by the plurality of optical signal test components. Among them, one optical signal test component transmits an optical signal emitted by a first micro-luminescent diode. Step S1003 is performed to sense the plurality of first optical signals transmitted by the plurality of optical signal test components by the optical signal sensing device, and generate a plurality of first sensing signals according to the plurality of first optical signals.

Execute step S1004, align the plurality of optical signal test components with the plurality of second micro-luminescent diodes of another selected test block on the wafer. Execute step S1005, the plurality of optical signal test components transmit the plurality of second optical signals emitted by the plurality of second micro-luminescent diodes in a second time interval. Among them, one optical signal test component transmits the optical signal emitted by one second micro-luminescent diode. Execute step S1006, the optical signal sensing device senses the plurality of second optical signals transmitted by the plurality of optical signal test components, and generates a plurality of second sensing signals according to the plurality of second optical signals.

In some embodiments, the alignment is mainly accomplished by moving the wafer. For example, in step S1001, the wafer is mainly moved to align the plurality of optical signal test components with the plurality of first micro-luminescent diodes on the wafer; in step S1004, the wafer is mainly moved to align the plurality of optical signal test components with the plurality of second micro-luminescent diodes on the wafer.

In some prior arts, as the size of light-emitting elements continues to shrink as demand increases (e.g., micro-LEDs), the time required to test a unit area of light-emitting elements increases significantly. By using the aforementioned optical signal processing device disclosed herein, the optical signal test element is used to transmit the optical signal of the micro-LED, so that multiple micro-LEDs can be directly measured in one test, thereby increasing the efficiency of the measurement. Furthermore, the optical signal test element disclosed herein uses optical fibers to receive optical signals. Since the size of the optical fibers can match the size and spacing of the micro-LEDs, multiple optical fibers can be arranged in the optical signal test element. One optical fiber corresponds to one micro-LED, so when the number of optical fibers increases, the efficiency of the measurement also increases. Furthermore, if the divergence angle of the light emitted by the micro-LED is large, the light signal must be captured as close to the micro-LED as possible to avoid the optical signal processing device taking up too much space. The small size of the optical fiber can be close to the micro-LED and fully receive the light signal, thereby improving the measurement accuracy and reducing the size of the optical signal processing device.

Although the present disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions and replacements can be made without departing from the spirit and scope of the present disclosure as defined by the scope of the patent application. For example, many of the above processes can be implemented in different ways, and other processes or combinations thereof can be used to replace many of the above processes.

Furthermore, the scope of this application is not limited to the specific embodiments of the processes, machines, manufactures, material compositions, means, methods, and steps described in the specification. A person skilled in the art can understand from the disclosure of this disclosure that existing or future developed processes, machines, manufactures, material compositions, means, methods, or steps that have the same functions or achieve substantially the same results as the corresponding embodiments described herein can be used according to this disclosure. Accordingly, such processes, machines, manufactures, material compositions, means, methods, or steps are included in the scope of the patent application of this application.

10: Optical signal processing device 20: Optical signal processing device 30: Optical signal processing device 110: Optical signal test element 120: Optical signal sensing device 210: Optical signal test element 210A: Plane 210B: Concave surface 210C: Convex surface 220: Optical signal sensing device 230: Positioning device 240: Probe 245: Probe card 310: Optical signal test element 311: Light guiding unit 311A: Plane 311B: Concave surface 311C: Convex surface 312: Probe 320: Optical signal sensing device 330: Positioning device 800: Optical signal measurement method 900: Optical signal measurement method 1000: Optical signal measurement method B1: Test block B2: Test block B3: Test block B4: Test block C1: Intersection C2: Intersection C3: Intersection C4: Intersection D1: Distance D2: Distance D3: Distance D4: Distance D5: Distance D6: Distance FAB: Fiber Array Block MLED: Micro-LED R1: Radius R2: Radius R3: Radius R4: Radius R5: Radius R6: Radius S1: First surface S1001: Step S1002: Step S1003: Step S1004: step S1005: step S1006: step S2: second surface S801: step S802: step S803: step S804: step S805: step S901: step S902: step S903: step S904: step S905: step S906: step S907: step SC: control signal SP: light signal SS: sensing signal θ1: divergence angle θ2: divergence angle θ3: divergence angle θ4: divergence angle θ5: divergence angle θ6: divergence angle

When referring to the embodiments and the scope of the patent application together with the drawings, a more comprehensive understanding of the disclosure of the present application can be obtained. The same element symbols in the drawings refer to the same elements. FIG. 1 illustrates a schematic diagram of an optical signal processing device of some embodiments of the present disclosure. FIG. 2 illustrates a schematic diagram of an optical signal processing device of some embodiments of the present disclosure. FIG. 3 illustrates a schematic diagram of an optical signal processing device of some embodiments of the present disclosure. FIG. 4A illustrates a schematic diagram of the structure and operation of a light guiding unit of some embodiments of the present disclosure. FIG. 4B illustrates a schematic diagram of the structure and operation of a light guiding unit of some embodiments of the present disclosure. FIG. 4C illustrates a schematic diagram of the structure and operation of a light guiding unit of some embodiments of the present disclosure. FIG. 5A illustrates a schematic diagram of the structure and operation of a light guiding unit of some embodiments of the present disclosure. FIG. 5B illustrates a schematic diagram of the structure and operation of the light guiding unit of some embodiments of the present disclosure. FIG. 5C illustrates a schematic diagram of the structure and operation of the light guiding unit of some embodiments of the present disclosure. FIG. 6A illustrates an operation schematic diagram of the optical fiber array block and the wafer of some embodiments of the present disclosure. FIG. 6B illustrates an operation schematic diagram of the optical fiber array block and the wafer of some embodiments of the present disclosure. FIG. 6C illustrates an operation schematic diagram of the optical fiber array block and the wafer of some embodiments of the present disclosure. FIG. 7A illustrates an operation schematic diagram of the optical fiber array block and the wafer of some embodiments of the present disclosure. FIG. 7B illustrates an operation schematic diagram of the optical fiber array block and the wafer of some embodiments of the present disclosure. FIG. 8 illustrates a flow chart of the measurement method of some embodiments of the present disclosure. FIG. 9 illustrates a flow chart of a measurement method of some embodiments of the present disclosure. FIG. 10 illustrates a flow chart of a measurement method of some embodiments of the present disclosure.

10: Optical signal processing device

110: Optical signal test components

120: Optical signal sensing device

MLED: Micro-luminescent diode

SP: Optical signal

SS: Sensing signal

Claims (20)

An optical signal processing device is used to test an optical signal of a micro-luminescent diode array. The micro-luminescent diode array is divided into a plurality of test blocks, each test block includes a plurality of micro-luminescent diodes. The optical signal processing device tests a single test block at a time. The optical signal processing device includes: a plurality of optical signal test elements, which are used to: transmit a selected test block A plurality of first light signals emitted by a plurality of first micro-luminescent diodes of a selected test block in a first time period, and a plurality of second light signals emitted by a plurality of second micro-luminescent diodes of a selected test block in a second time period; and a light signal sensing device for: sensing the first light signals transmitted by the light signal test components in the first time period ; sensing the second light signals transmitted by the light signal test elements in the second time interval; and generating a plurality of sensing signals according to the first light signals and the second light signals; wherein each of the first micro-luminescent diodes and the second micro-luminescent diodes corresponds to a light signal test element, and each light signal test element transmits a light signal emitted by a corresponding micro-luminescent diode; wherein the micro-luminescent diodes corresponding to each light signal test element are not repeated; wherein the first micro-luminescent diodes and the second micro-luminescent diodes are arranged alternately; wherein the positions of the light signal test elements remain unchanged in the first time interval and the second time interval. An optical signal processing device as described in claim 1, wherein the sum of the number of the first micro-luminescent diodes and the number of the second micro-luminescent diodes is equal to or less than the number of the optical signal test elements. The optical signal processing device as described in claim 2, wherein each optical signal test element comprises: a light guiding unit for transmitting the optical signal emitted by the micro-luminescent diode corresponding to each optical signal test element. The optical signal processing device as described in claim 2, wherein each optical signal test element further comprises a probe, and the probes of the optical signal test elements are used to: contact the micro-luminescent diodes; and transmit a plurality of control signals to make the micro-luminescent diodes generate the optical signals. The optical signal processing device as described in claim 2 further comprises: a plurality of probes for: contacting the micro-luminescent diodes; and transmitting a plurality of control signals to cause the micro-luminescent diodes to generate the optical signals. The optical signal processing device as described in claim 3 further includes an optical fiber array block, wherein, the optical fiber array block includes the optical signal test elements, and each optical guide unit is an optical fiber. An optical signal processing device as described in claim 3, wherein one end of each optical guide unit for receiving a corresponding optical signal comprises a flat surface, a convex surface or a concave surface. The optical signal processing device as described in claim 3 further comprises: a positioning device for aligning the light guiding units with the first micro-luminescent diodes and the second micro-luminescent diodes. As described in claim 8, the optical signal processing device, wherein the positioning device is further used to: position a distance between the optical guide units and the first micro-luminescent diodes, so that the optical signal receiving range at one end of each optical guide unit covers the first optical signal generated by the corresponding first micro-luminescent diode, but does not cover the divergence range of the first optical signal generated by the adjacent first micro-luminescent diode. The optical signal processing device as described in claim 8, wherein the positioning device is further used to: position a distance between the optical guide units and the second micro-LEDs, so that the optical signal receiving range at one end of each optical guide unit covers the second optical signal generated by the corresponding second micro-LED, but does not cover the divergent range of the second optical signal generated by the adjacent second micro-LED. The optical signal processing device as described in claim 1, wherein the optical signal sensing device includes a camera or a CMOS image sensor. An optical signal processing device as described in claim 1, wherein the optical signal test elements simultaneously transmit the first optical signals emitted by the first micro-luminescent diodes. The optical signal processing device as described in claim 1, wherein the first micro-LEDs and the second micro-LEDs are RGB LEDs, and the optical signal testing components receive the RGB light signals emitted by the first micro-LEDs in the first time period or the RGB light signals emitted by the second micro-LEDs in the second time period. The optical signal processing device as described in claim 1, wherein the optical signal test elements are further used to transmit the plurality of third optical signals emitted by the plurality of third micro-luminescent diodes of the selected test block within a third time period, and the optical signal sensing device is further used to sense the third optical signals transmitted by the optical signal test elements within the third time period; wherein the first micro-luminescent diodes, the second micro-luminescent diodes and the third micro-luminescent diodes are arranged alternately; wherein the position of the optical signal sensing device remains unchanged within the first time period, the second time period and the third time period. An optical signal processing device as described in claim 14, wherein the sum of the number of the first micro-luminescent diodes, the number of the second micro-luminescent diodes, and the number of the third micro-luminescent diodes is equal to or less than the number of the optical signal test elements. A method for measuring an optical signal of an optical signal processing device is provided for testing an optical signal of a micro-luminescent diode array. The micro-luminescent diode array is divided into a plurality of test blocks, each test block includes a plurality of micro-luminescent diodes, and the optical signal processing device tests a single test block at a time. The optical signal processing device includes a plurality of optical signal test components and an optical signal sensing device. The method for measuring an optical signal includes: aligning the optical signal test components with a selected test element on a wafer; The plurality of micro-luminescent diodes in the test block include a plurality of first micro-luminescent diodes and a plurality of second micro-luminescent diodes; the plurality of optical signal test elements transmit a plurality of first optical signals emitted by the first micro-luminescent diodes in a first time period, wherein one optical signal test element transmits a first optical signal emitted by a first micro-luminescent diode; the optical signal sensing device senses the first optical signals transmitted by the optical signal test elements, and senses the first optical signals according to the first optical signals. The optical signal testing components transmit a plurality of second optical signals emitted by the second micro-luminescent diodes in a second time period, wherein one optical signal testing component transmits an optical signal emitted by a second micro-luminescent diode; and the optical signal sensing device senses the second optical signals transmitted by the optical signal testing components and generates a plurality of second sensing signals according to the second optical signals; wherein the first micro-luminescent diodes and the second micro-luminescent diodes are Each micro-luminescent diode in the photodiodes corresponds to a light signal test element, and each light signal test element transmits a second light signal emitted by a corresponding micro-luminescent diode; wherein the micro-luminescent diodes corresponding to each light signal test element are not repeated; wherein the first micro-luminescent diodes and the second micro-luminescent diodes are arranged alternately; wherein the positions of the light signal test elements remain unchanged during the first time interval and the second time interval. The optical signal measurement method as described in claim 16, wherein the first time interval and the second time interval do not overlap. As described in claim 16, the optical signal measurement method, wherein the optical signal test elements are further used to transmit the plurality of third optical signals emitted by the plurality of third micro-luminescent diodes of the selected test block in a third time period, and the optical signal sensing device is further used to sense the third optical signals transmitted by the optical signal test elements in the third time period; wherein the first micro-luminescent diodes, the second micro-luminescent diodes and the third micro-luminescent diodes are arranged alternately; wherein the position of the optical signal sensing device remains unchanged in the first time period, the second time period and the third time period. A light signal measurement method for a light signal processing device is used to test the light signal of a micro-luminescent diode array. The micro-luminescent diode array is divided into a plurality of test blocks, each test block includes a plurality of micro-luminescent diodes, and the light signal processing device tests a single test block at a time. The light signal processing device includes a plurality of light signal test components and a light signal sensing device. The light signal measurement method includes: aligning the light signal test components with a plurality of first micro-luminescent diodes in a selected test block on a wafer; the light signal test components transmit a plurality of first light signals emitted by the first micro-luminescent diodes in a first time period, wherein one light signal test component transmits a The first micro-luminescent diode emits a first light signal; the light signal sensing device senses the first light signals transmitted by the light signal test components and generates a plurality of first sensing signals according to the first light signals; the light signal test components are aligned with a plurality of second micro-luminescent diodes in another test block on the wafer; the light signal test components transmit a plurality of second light signals emitted by the second micro-luminescent diodes within a second time interval, wherein one light signal test component transmits a second light signal emitted by a second micro-luminescent diode; and the light signal sensing device senses the second light signals transmitted by the light signal test components and generates a plurality of second sensing signals according to the second light signals. The optical signal measurement method as described in claim 18, wherein aligning the optical signal test components with the second micro-luminescent diodes on the wafer further includes: moving the wafer to align the optical signal test components with the second micro-luminescent diodes on the wafer.