TWI855395B - Semiconductor edge grinding device and semiconductor edge grinding method - Google Patents

Abstract

The present invention provides a semiconductor edge grinding device and a semiconductor edge grinding method. The semiconductor edge grinding device comprises a driving element, a semiconductor fixing part and a grinding wheel element, wherein the driving element is used to drive the semiconductor fixed on the semiconductor fixing part to rotate; the grinding wheel element comprises a first grinding wheel and a second grinding wheel, wherein the first grinding wheel and the second grinding wheel are both used to grind the edge of the semiconductor fixed on the semiconductor fixing part, wherein the first grinding wheel and the second grinding wheel are located on the same plane, and the surface roughness of the first grinding wheel is greater than the surface roughness of the second grinding wheel.

Description

Semiconductor edge grinding device and semiconductor edge grinding method

The embodiments of the present invention belong to the field of semiconductor technology, and in particular to a semiconductor edge grinding device and a semiconductor edge grinding method.

The semiconductor processing process such as silicon wafers usually includes the process of edge grinding to process the side of the silicon wafer into a chamfer of a specified shape. The edge grinding process usually includes the steps of fine grinding and rough grinding in sequence. This grinding process requires the use of corresponding rough grinding wheels and fine grinding wheels. However, when replacing the grinding wheel, the position of the grinding wheel and the fine grinding wheel may deviate, which has an adverse effect on the edge grinding process of the silicon wafer.

The embodiment of the present invention provides a semiconductor edge grinding device and a semiconductor edge grinding method to solve the problem that when the grinding wheel is replaced, the positions of the grinding wheel and the fine grinding wheel may deviate, which has an adverse effect on the edge grinding process of the silicon wafer.

To solve the above problems, the present invention is implemented as follows:

In the first aspect, an embodiment of the present invention provides a semiconductor edge grinding device, comprising a driving element, a semiconductor fixing part and a grinding wheel element, wherein the driving element is used to drive a semiconductor fixed on the semiconductor fixing part to rotate; The grinding wheel element comprises a first grinding wheel and a second grinding wheel, wherein the first grinding wheel and the second grinding wheel are both used to grind the edge of the semiconductor fixed on the semiconductor fixing part, wherein the first grinding wheel and the second grinding wheel are located on the same plane, and the surface roughness of the first grinding wheel is greater than the surface roughness of the second grinding wheel.

In some embodiments, the grinding wheel element includes a supporting structure, the supporting structure includes a first supporting plate and a second supporting plate arranged in parallel and opposite to each other, the first grinding wheel and the second grinding wheel are arranged between the first supporting plate and the second supporting plate, the first grinding wheel and the second grinding wheel are configured to be rotatable, and the rotating axes of the first grinding wheel and the second grinding wheel are parallel to each other and perpendicular to the first supporting plate.

In some embodiments, the semiconductor edge grinding device includes a first displacement element, the second grinding wheel is connected to the first displacement element, and the first displacement element is configured to drive the second grinding wheel to move to a first working position close to the semiconductor fixing part and a second working position far from the semiconductor fixing part; wherein, when the second grinding wheel is located at the first working position, the distance between the second grinding wheel and the rotating shaft of the semiconductor fixing part is greater than the distance between the first grinding wheel and the rotating shaft of the semiconductor fixing part, and when the second grinding wheel is located at the second working position, the distance between the second grinding wheel and the rotating shaft of the semiconductor fixing part is less than or equal to the distance between the first grinding wheel and the rotating shaft of the semiconductor fixing part.

In some embodiments, the grinding wheel element further includes a second displacement element, the first grinding wheel is connected to the second displacement element, and the second displacement element is configured to drive the first grinding wheel to move toward or away from the rotation axis of the semiconductor fixing part.

In some embodiments, the grinding wheel element further includes a grinding wheel driver and a grinding wheel transmission belt, wherein the grinding wheel driver is connected to the first grinding wheel and/or the second grinding wheel through the grinding wheel transmission belt, and the grinding wheel driver is configured to drive the first grinding wheel and/or the second grinding wheel to rotate.

In some embodiments, the grinding wheel element further includes a tension control member, the tension control member abuts against the grinding wheel transmission belt, and the tension control member is configured to keep the grinding wheel transmission belt in a tensioned state.

In the second aspect, the embodiment of the present invention provides a semiconductor edge grinding method, which is applied to any of the semiconductor edge grinding devices mentioned above. The semiconductor edge grinding method includes: fixing the semiconductor to be ground on the semiconductor fixing part, and driving the semiconductor fixing part to rotate by the driving element; performing a first edge grinding on the semiconductor to be ground using the first grinding wheel of the grinding wheel element; and performing a second edge grinding on the semiconductor to be ground using the second grinding wheel of the grinding wheel element.

In some embodiments, when the semiconductor edge grinding device includes a first displacement element, the first grinding wheel of the grinding wheel element is used to perform the first edge grinding on the semiconductor to be ground, including: controlling the second grinding wheel to move to the first working position, and using the first grinding wheel to perform the first edge grinding on the semiconductor to be ground.

In some embodiments, the second grinding wheel of the grinding wheel element is used to perform a second edge grinding on the semiconductor to be ground, including: after the first edge grinding, controlling the second grinding wheel to move to a second working position, and performing a second edge grinding on the semiconductor to be ground using the second grinding wheel.

In some embodiments, when the semiconductor edge grinding device includes a second displacement element, after the first grinding wheel of the grinding wheel element performs the first edge grinding on the semiconductor to be ground, the semiconductor edge grinding method further includes: using the second displacement element to control the first grinding wheel to move in a direction away from the rotation axis of the semiconductor fixing part.

The embodiment of the present invention is provided with a grinding wheel element, which includes a first grinding wheel and a second grinding wheel, and the first grinding wheel and the second grinding wheel are located on the same plane. In this way, the positions of the first grinding wheel and the second grinding wheel can be adjusted by the grinding wheel element to achieve replacement of the grinding wheel required for edge grinding, which helps to improve the alignment accuracy between the first grinding wheel and the second grinding wheel, and helps to improve the edge grinding effect of the silicon wafer.

101: Driving components

102: Semiconductor fixing part

103: Grinding wheel element

1031: First grinding wheel

1031A: First grinding groove

1032: Second grinding wheel

1032A: Second grinding groove

1033:Support structure

1033A: The first support plate

1033B: Second support plate

1034: First displacement element

1035: Second displacement element

1036: Grinding wheel drive parts

1037: Grinding wheel drive belt

200: Silicon wafer

501-503: Steps

FIG. 1 is a schematic diagram of the structure of the semiconductor edge grinding device provided by the embodiment of the present invention; FIG. 2 is another schematic diagram of the structure of the semiconductor edge grinding device provided by the embodiment of the present invention; FIG. 3 is a schematic diagram of the structure of the grinding wheel element provided by the embodiment of the present invention; FIG. 4 is another schematic diagram of the structure of the grinding wheel element provided by the embodiment of the present invention; FIG. 5 is a flow chart of the semiconductor edge grinding method provided by the embodiment of the present invention; FIG. 6 is another schematic diagram of the structure of the grinding wheel element provided by the embodiment of the present invention; FIG. 7 is another schematic diagram of the structure of the grinding wheel element provided by the embodiment of the present invention.

In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the attached drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention.

It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or location relationships based on the positions or location relationships shown in the attached drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

In the present invention, unless otherwise clearly specified and limited, the terms "installation", "connection", "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two components or the interaction relationship between two components. For those with ordinary knowledge in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

The embodiment of the present invention provides a semiconductor edge grinding device and a semiconductor edge grinding method applied to the semiconductor grinding device.

As shown in FIG. 1 and FIG. 2, in one embodiment, the semiconductor edge grinding device includes a driving element 101, a semiconductor fixing part 102 and a grinding wheel element 103.

As shown in Figures 1 and 2, the semiconductor fixing part 102 is used to fix the semiconductor to be polished, which can be a silicon wafer 200 for example, and the driving element 101 is used to drive the semiconductor fixing part 102 to rotate, thereby driving the silicon wafer 200 fixed on the semiconductor fixing part 102 to rotate around its own central axis.

As shown in FIG. 2 and FIG. 3 , the grinding wheel element 103 includes a first grinding wheel 1031 and a second grinding wheel 1032. The first grinding wheel 1031 and the second grinding wheel 1032 are both used to grind the edge of the semiconductor fixed on the semiconductor fixing part 102. The surface roughness of the first grinding wheel 1031 is greater than the surface roughness of the second grinding wheel 1032. It can be understood that the first grinding wheel 1031 is a rough grinding wheel for rough grinding, and the second grinding wheel 1032 is a fine grinding wheel for fine grinding.

As shown in FIG. 3 , the first grinding wheel 1031 and the second grinding wheel 1032 are located on the same plane.

It can be understood that the grinding wheel used for edge grinding is roughly disc-shaped or cylindrical, the first grinding wheel 1031 has a first grinding groove 1031A on its side, and the second grinding wheel 1032 has a second grinding groove 1032A on its side. During the grinding process, the edge of the grinding wheel is ground through the first grinding groove 1031A and the second grinding groove 1032A, so that the edge of the silicon wafer 200 forms a T-shaped chamfer or an R-shaped chamfer.

As shown in FIG. 3 , in this embodiment, the first grinding wheel 1031 and the second grinding wheel 1032 are located on the same plane, which means that the central axes of the disc-shaped or cylindrical first grinding wheel 1031 and the second grinding wheel 1032 are parallel to each other, and the first grinding groove 1031A and the second grinding groove 1032A thereof are located on the same plane where the silicon wafer 200 is located.

Please refer to FIG. 3 and FIG. 4 at the same time. In some embodiments, the grinding wheel element 103 includes a supporting structure 1033, and the supporting structure 1033 includes a first supporting plate 1033A and a second supporting plate 1033B arranged in parallel and opposite to each other, and the first grinding wheel 1031 and the second grinding wheel 1032 are arranged between the first supporting plate 1033A and the second supporting plate 1033B.

The first grinding wheel 1031 and the second grinding wheel 1032 are configured to be rotatable. Specifically, the first grinding wheel 1031 and the second grinding wheel 1032 are both arranged between the first supporting plate 1033A and the second supporting plate 1033B via bearings, so that the first grinding wheel 1031 and the second grinding wheel 1032 can rotate around their own axes. The rotation axis of the first grinding wheel 1031 and the rotation axis of the second grinding wheel 1032 are parallel to each other and perpendicular to the first supporting plate 1033A.

During implementation, the first grinding wheel 1031 and the second grinding wheel 1032 may be arranged in other ways, as long as the first grinding wheel 1031 and the second grinding wheel 1032 are located in the same plane.

In the technical solution of this embodiment, when grinding the edge of the silicon wafer 200, the first grinding wheel 1031 is used for rough grinding, and then the second grinding wheel 1032 is used for fine grinding.

In one embodiment, the first grinding wheel 1031 and the second grinding wheel 1032 can also be brought into contact with the circular silicon wafer 200 at the same time, so that the rough grinding and the fine grinding can be completed through one grinding operation.

As shown in FIG. 5 , in one embodiment, the edge grinding method of a semiconductor provided by the embodiment of the present invention includes: step 501: fixing the semiconductor to be ground on the semiconductor fixing part, and driving the semiconductor fixing part to rotate by the driving element; step 502: performing the first edge grinding of the semiconductor to be ground using the first grinding wheel of the grinding wheel element; step 503: performing the second edge grinding of the semiconductor to be ground using the second grinding wheel of the grinding wheel element.

In this embodiment, the edge grinding is performed sequentially by the first grinding wheel 1031 and the second grinding wheel 1032. After the edge grinding is performed by the first grinding wheel 1031, the grinding wheel element 103 is controlled to translate or rotate until the second grinding wheel 1032 contacts the edge of the silicon wafer 200 to perform fine grinding on the edge of the silicon wafer 200. During this process, the first grinding wheel 1031 and the second grinding wheel 1032 are both kept in the plane where the silicon wafer 200 is located.

Thus, in the embodiment of the present invention, there will be no alignment deviation of the grinding wheel during the two grinding processes, thereby avoiding that each position of the edge of the grinding wheel is subjected to rough grinding and fine grinding in sequence, and avoiding that the position change of the grinding wheel causes part of the edge position of the silicon wafer 200 to contact only one of the first grinding wheel 1031 and the second grinding wheel 1032, and only rough grinding or only fine grinding is performed. This helps to improve the edge grinding quality of the silicon wafer 200 and also helps to reduce the possibility of damage to the second grinding wheel 1032.

The embodiment of the present invention is provided with a grinding wheel element 103, which includes a first grinding wheel 1031 and a second grinding wheel 1032. The first grinding wheel 1031 and the second grinding wheel 1032 are located on the same plane. In this way, the positions of the first grinding wheel 1031 and the second grinding wheel 1032 can be adjusted by the grinding wheel element 103 to achieve replacement of the grinding wheel required for edge grinding, which helps to improve the alignment accuracy between the first grinding wheel 1031 and the second grinding wheel 1032, and helps to improve the edge grinding effect of the silicon wafer 200.

As shown in FIG. 4 and FIG. 6 , in some embodiments, the semiconductor edge grinding device includes a first displacement element 1034, a second grinding wheel 1032 is connected to the first displacement element 1034, and the first displacement element 1034 is configured to drive the second grinding wheel 1032 to move to a first working position close to the semiconductor fixing portion 102 and a second working position away from the semiconductor fixing portion 102.

In the technical solution of this embodiment, the second grinding wheel 1032 is configured to be movable through the first displacement element 1034.

When the second grinding wheel 1032 is located at the first working position, the distance between the second grinding wheel 1032 and the rotating shaft of the semiconductor fixing part 102 is greater than the distance between the first grinding wheel 1031 and the rotating shaft of the semiconductor fixing part 102. When the second grinding wheel 1032 is located at the second working position, the distance between the second grinding wheel 1032 and the rotating shaft of the semiconductor fixing part 102 is less than or equal to the distance between the first grinding wheel 1031 and the rotating shaft of the semiconductor fixing part 102.

The first displacement element 1034 in this embodiment can be a drive cylinder such as an oil cylinder or an air cylinder, or a mechanical transmission structure such as a worm gear and a worm rod in conjunction with a motor, as long as it can drive the second grinding wheel 1032 to move. This embodiment does not further limit the specific implementation method of the first displacement element 1034.

During implementation, the first displacement element 1034 can be used to drive the second grinding wheel 1032 to move within the plane where the first grinding wheel 1031 and the second grinding wheel 1032 are located, so that the second grinding wheel 1032 is close to or away from the silicon wafer 200 to be ground.

In some embodiments, the above step 502 includes: controlling the second grinding wheel to move to the first working position, and using the first grinding wheel to perform the first edge grinding on the semiconductor to be ground.

In this embodiment, during the rough grinding process of the silicon wafer 200, the first grinding wheel 1031 is first controlled to contact the edge of the silicon wafer 200, and the second grinding wheel 1032 is driven by the first displacement element 1034 to move away from the silicon wafer 200, so that the second grinding wheel 1032 and the edge of the silicon wafer 200 are separated from each other.

In this way, during the rotation of the silicon wafer 200, the edge of the silicon wafer 200 can be roughly ground using the first grinding wheel 1031. During the rough grinding process, the second grinding wheel 1032 is separated from the edge of the silicon wafer 200.

In some embodiments, the above step 503 includes: after the first edge grinding, controlling the second grinding wheel to move to the second working position, and using the second grinding wheel to perform a second edge grinding on the semiconductor to be ground.

After the edge of the silicon wafer 200 is roughly ground, the second grinding wheel 1032 is controlled to move to the second working position and contact the edge of the silicon wafer 200. At this time, the silicon wafer 200 is controlled to rotate, so that the edge of the silicon wafer 200 can be finely ground.

In some embodiments, the grinding wheel element 103 further includes a second displacement element 1035, the first grinding wheel 1031 is connected to the second displacement element 1035, and the second displacement element 1035 is configured to drive the first grinding wheel 1031 to move toward or away from the rotation axis of the semiconductor fixing part 102.

In this embodiment, the structure of the second displacement element 1035 can refer to the first displacement element 1034, and this embodiment does not further limit its structure.

In some embodiments, after step 503, the semiconductor edge grinding method further includes: using the second displacement element 1035 to control the first grinding wheel 1031 to move away from the rotation axis of the semiconductor fixing part 102.

In this embodiment, by providing the second displacement element 1035, the first grinding wheel 1031 can be driven away from the silicon wafer 200 to reduce possible interference with the fine grinding process.

In some embodiments, the grinding wheel element 103 further includes a grinding wheel driver 1036 and a grinding wheel transmission belt 1037. The grinding wheel driver 1036 is connected to the first grinding wheel 1031 and/or the second grinding wheel 1032 through the grinding wheel transmission belt 1037. The grinding wheel driver 1036 is configured to drive the first grinding wheel 1031 and/or the second grinding wheel 1032 to rotate.

As shown in FIG. 7 , in an exemplary embodiment, the grinding wheel driving member 1036 may be a motor, and the grinding wheel transmission belt 1037 may be a belt respectively abutting against the output ends of the grinding wheel and the motor, by providing the grinding wheel driving member 1036 and the grinding wheel transmission belt 1037.

During the rough grinding process, the first grinding wheel 1031 is driven to rotate by the grinding wheel driver 1036, and during the fine grinding process, the second grinding wheel 1032 is driven to rotate by the grinding wheel driver 1036 using a belt, which can improve the grinding effect of the grinding wheel on the edge of the silicon wafer 200.

In some embodiments, the grinding wheel element 103 further includes a tension control member, which abuts against the grinding wheel transmission belt 1037, and the tension control member is configured to keep the grinding wheel transmission belt 1037 in a tensioned state.

In this embodiment, the tension control member can be a tension wheel that can rotate freely. During implementation, the tension wheel is arranged on the inner side of the belt and abuts against the belt. When the first grinding wheel 1031 or the second grinding wheel 1032 moves, the corresponding tension wheel moves accordingly, so that the belt remains in a tensioned state, which helps to improve the edge grinding effect.

The embodiments of the present invention are described above in conjunction with the attached drawings, but the present invention is not limited to the above specific implementations, which are only illustrative and not restrictive. Under the inspiration of the present invention, people with ordinary knowledge in the field can make many forms without departing from the scope of protection of the purpose of the present invention and the claims, all of which are within the protection of the present invention.

101: Driving components

102: Semiconductor fixing part

103: Grinding wheel element

1031: First grinding wheel

1032: Second grinding wheel

200: Silicon wafer

Claims (8)

A semiconductor edge grinding device comprises a driving element, a semiconductor fixing part and a grinding wheel element, wherein the driving element is used to drive the semiconductor fixed on the semiconductor fixing part to rotate; the grinding wheel element comprises a first grinding wheel and a second grinding wheel, wherein the first grinding wheel and the second grinding wheel are both used to grind the edge of the semiconductor fixed on the semiconductor fixing part, wherein the first grinding wheel and the second grinding wheel are located on the same plane, and the surface roughness of the first grinding wheel is greater than the surface roughness of the second grinding wheel; the grinding wheel element comprises a supporting structure, wherein the supporting structure comprises a first supporting plate and a second supporting plate which are arranged in parallel and opposite to each other, wherein the first grinding wheel and the second grinding wheel are arranged on the first supporting plate and the second supporting plate. The first grinding wheel and the second grinding wheel are configured to be rotatable, and the rotation axes of the first grinding wheel and the second grinding wheel are parallel to each other and perpendicular to the first supporting plate; the first grinding wheel is provided with a first grinding groove on the side, and the second grinding wheel is provided with a second grinding groove on the side; the central axes of the first grinding wheel and the second grinding wheel are parallel to each other, and the first grinding groove and the second grinding groove are located on the same plane where the silicon wafer is located; the grinding wheel element also includes a grinding wheel driving member and a grinding wheel transmission belt, the grinding wheel driving member is connected to the first grinding wheel and/or the second grinding wheel through the grinding wheel transmission belt, and the grinding wheel driving member is configured to drive the first grinding wheel and/or the second grinding wheel to rotate. The semiconductor edge grinding device as described in claim 1, wherein the semiconductor edge grinding device comprises a first displacement element, the second grinding wheel is connected to the first displacement element, and the first displacement element is configured to drive the second grinding wheel to move to a first working position close to the semiconductor fixing part and a second working position far from the semiconductor fixing part; wherein, when the second grinding wheel is located at the first working position, the distance between the second grinding wheel and the rotating shaft of the semiconductor fixing part is greater than the distance between the first grinding wheel and the rotating shaft of the semiconductor fixing part, and when the second grinding wheel is located at the second working position, the distance between the second grinding wheel and the rotating shaft of the semiconductor fixing part is less than or equal to the distance between the first grinding wheel and the rotating shaft of the semiconductor fixing part. The semiconductor edge grinding device as described in claim 2, wherein the grinding wheel element further includes a second displacement element, the first grinding wheel is connected to the second displacement element, and the second displacement element is configured to drive the first grinding wheel to move toward or away from the rotation axis of the semiconductor fixing part. The semiconductor edge grinding device as described in claim 3, wherein the grinding wheel element further includes a tension control member, the tension control member abuts against the grinding wheel transmission belt, and the tension control member is configured to keep the grinding wheel transmission belt in a tensioned state. A semiconductor edge grinding method is applied to the semiconductor edge grinding device described in any one of claims 1 to 4, and the semiconductor edge grinding method comprises: fixing the semiconductor to be ground on the semiconductor fixing part, and driving the semiconductor fixing part to rotate by the driving element; performing a first edge grinding on the semiconductor to be ground using the first grinding wheel of the grinding wheel element; and performing a second edge grinding on the semiconductor to be ground using the second grinding wheel of the grinding wheel element. The edge grinding method of a semiconductor as described in claim 5, wherein, when the semiconductor edge grinding equipment includes a first displacement element, the first grinding wheel of the grinding wheel element is used to perform the first edge grinding on the semiconductor to be ground, comprising: controlling the second grinding wheel to move to the first working position, and performing the first edge grinding on the semiconductor to be ground using the first grinding wheel. The edge grinding method of a semiconductor as described in claim 6, wherein the second grinding wheel of the grinding wheel element is used to perform a second edge grinding on the semiconductor to be ground, comprising: after the first edge grinding, controlling the second grinding wheel to move to a second working position, and performing a second edge grinding on the semiconductor to be ground using the second grinding wheel. The edge grinding method of a semiconductor as described in claim 7, wherein, when the semiconductor edge grinding equipment includes a second displacement element, after the first grinding wheel of the grinding wheel element performs the first edge grinding on the semiconductor to be ground, the edge grinding method of the semiconductor further includes: using the second displacement element to control the first grinding wheel to move in a direction away from the rotation axis of the semiconductor fixing part.

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