TWI855269B - Flipping method and device - Google Patents
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Abstract
本發明提供一種翻面方法及裝置,該翻面方法包括:使一物件被盛載於一第一載盤的一第一容納區中;使設有一第二容納區的一第二載盤與該第一載盤疊置;使一頂座推抵該物件由該第一載盤的一第一容納區位移至該第二載盤的該第二容納區;使該第一載盤、第二載盤及該頂座同時翻轉;藉此使物件可順利由一載盤轉換至另一載盤。The present invention provides a flipping method and device, the flipping method comprising: placing an object in a first receiving area of a first tray; overlapping a second tray with a second receiving area with the first tray; pushing the object from the first receiving area of the first tray to the second receiving area of the second tray by a top seat; flipping the first tray, the second tray and the top seat at the same time; thereby the object can be smoothly transferred from one tray to another tray.
Description
本發明係有關於一種翻面方法及裝置,尤指一種將盛放於一載盤中矩陣排列的複數個物件進行翻面的翻面方法及裝置。 The present invention relates to a flipping method and device, in particular to a flipping method and device for flipping a plurality of objects arranged in a matrix on a tray.
按,一般的電子元件製程中常會使用到載盤搬送,並在搬送時將電子元件以複數個作矩陣排列,而為進行加工的需要,電子元件常被置放在載盤的特定凹設區間中作定位,但基於製程的需要,盛放一載盤中的電子元件常被要求轉換至另一載盤中轉換朝上的表面供加工,這時就涉及翻面的操作;一般翻面的操作會在一載盤上方覆蓋另一載盤,然後使兩個相向、相疊的載盤作翻轉,使所盛載的物件由一載盤的凹設區間轉換到另一載盤的凹設區間中,並改變朝上的表面。 In general, electronic component manufacturing processes often use trays for transport, and during transport, multiple electronic components are arranged in a matrix. For processing purposes, electronic components are often placed in specific recessed areas of the tray for positioning. However, based on the needs of the process, electronic components placed in one tray are often required to be transferred to another tray to change the upward surface for processing, which involves a flipping operation. Generally, the flipping operation involves covering one tray with another tray, and then flipping the two facing and overlapping trays, so that the objects placed are transferred from the recessed area of one tray to the recessed area of another tray, and the upward surface is changed.
該先前技術翻面的操作中常會發生物件卡在原載盤的原凹設區間中未順料轉換到另一載盤的凹設間中的情況,或雖有轉換至另一載盤的凹設區間中,卻未正確定位而呈傾斜狀態,造成整個製程設備會發出警報停機的現象,仍有可改進的空間! In the flipping operation of the prior art, the parts often get stuck in the original recessed space of the original carrier and fail to be transferred to the recessed space of another carrier, or even if they are transferred to the recessed space of another carrier, they are not positioned correctly and are tilted, causing the entire process equipment to sound an alarm and shut down. There is still room for improvement!
爰是,本發明的目的,在於提供一種使物件可順利由一載盤轉換至另一載盤的翻轉方法。 Therefore, the purpose of the present invention is to provide a flipping method that allows objects to be smoothly transferred from one carrier to another.
本發明的另一目的,在於提供一種使物件可順利由一載盤轉換至另一載盤的翻轉裝置。 Another object of the present invention is to provide a flipping device that allows objects to be smoothly transferred from one carrier to another.
本發明的又一目的,在於提供一種用以執行如所述翻面方法的翻面裝置。 Another object of the present invention is to provide a flipping device for performing the flipping method as described above.
依據本發明目的之翻面方法,包括:使一物件被盛載於一第一載盤的一第一容納區中;使設有一第二容納區的一第二載盤與該第一載盤疊置;使一頂座推抵該物件由該第一載盤的一第一容納區位移至該第二載盤的該第二容納區;使該第一載盤、第二載盤及該頂座同時翻轉。 The flipping method according to the purpose of the present invention includes: placing an object in a first receiving area of a first carrier; overlapping a second carrier with a second receiving area with the first carrier; pushing the object from the first receiving area of the first carrier to the second receiving area of the second carrier by a top seat; flipping the first carrier, the second carrier and the top seat at the same time.
依據本發明另一目的之翻面裝置,包括:設有一第一容納區中以容納一物件的一第一載盤,該第一載盤可受一輸送流路搬送;設有一第二容納區的一第二載盤,受一翻轉架所搬送可與該第一載盤疊置;一頂抵機構,位於該輸送流路上該第一載盤的下方,其上設有一頂座可受驅動推抵該物件由該第一載盤的一第一容納區位移至該第二載盤的該第二容納區。 According to another purpose of the present invention, the flipping device includes: a first tray having a first storage area for accommodating an object, the first tray being transported by a conveying flow path; a second tray having a second storage area, being transported by a flipping frame and being stacked with the first tray; a push mechanism, located below the first tray on the conveying flow path, having a push seat thereon, which can be driven to push the object from a first storage area of the first tray to the second storage area of the second tray.
依據本發明又一目的之翻面裝置,用以執行如所述翻面方法。 According to another purpose of the present invention, a flipping device is used to perform the flipping method as described above.
本發明實施例之翻面方法及裝置,由於該第二載盤與該第一載盤疊置時,使該頂座推抵該物件由該第一載盤的一第一容納區位移至該第二載盤的該第二容納區,並使該第一載盤、第二載盤及該頂座同時翻轉,因此可以在無礙於翻轉進行下,確保翻轉時該物件被轉移保持在該第二載盤的該第二容納區中,使物件可順利由一載盤轉換至另一載盤。 The flipping method and device of the embodiment of the present invention, when the second tray is stacked with the first tray, the top seat pushes the object to move from a first receiving area of the first tray to the second receiving area of the second tray, and the first tray, the second tray and the top seat flip at the same time, so that the object can be transferred and kept in the second receiving area of the second tray during flipping without hindering the flipping, so that the object can be smoothly transferred from one tray to another.
請參閱圖1、2,本發明實施例可採用如圖所示的翻轉裝置來進行,該翻轉裝置設有:一輸送流路1,該輸送流路1可由單一或複數個軌架組成,在本實施例中設有第一軌架11及與該第一軌架11直線接續的第二軌架12;該第一軌架11設有相隔間距平行設置的二側架111及位於二側架111相向內側的可受驅動運轉的皮帶112,該第一軌架11中設有一頂抵機構13,該頂抵機構13設有水平矩形表面的可受一驅動件131驅動作Z軸向上下位移的一載台132,該載台132於該輸送流路1搬送方向的前、後兩端對應各設
有可受驅動水平位移作相向夾靠或分離的靠抵件133,該載台132上表面置設可活動分離或受該靠抵件133夾靠定位的一頂座14,該頂座14具有磁性,例如採用具有磁性的材質或鑲嵌具有磁性的材料或部件,該頂座14上表面設有複數個矩陣排列的凸設狀的由下往上伸設的頂抵部141,若以鑲嵌具有磁性的材料或部件方式使該頂座14具有磁性,則該磁性的材料或部件可以如圖2所示位於兩個該頂抵部141間或該頂抵部141鄰側的該頂座14上表面設置磁性部件142;該第二軌架12設有相隔間距平行設置的二側架121及位於二側架121相向內側的可受驅動運轉的皮帶122,該皮帶122上供搬送其上盛載複數個矩陣排列的物件2的一第一載盤3,該第一載盤3設有供容置該物件2的複數個凹設狀矩陣排列的第一容納區31,每個第一容納區31下方分別各設有與該第一容納區31相通的鏤空區間32;一翻轉架4,設於該輸送流路1一側的一龍門座架5上,該龍門座架5以相隔間距垂直立設的二立柱51間上方橫設Y軸向的一軌座52,並在該軌座52上設一Z軸向的軌座53,該翻轉架4呈矩形框體狀並以一樞接部41樞設於該軌座53上的一立設的固定座531上,並受馬達構成的一驅動件42以皮帶421驅動而以一X軸向的中心軸為中心可作翻轉,該翻轉架4相對該樞接部41的另一支撐部43以一”ㄇ”形的支撐架44與該固定座531聯設;該翻轉架4框體狀的中央形成矩形鏤空的夾持區間45,該夾持區間45可供容納一第二載盤6,該第二載盤6具有可供容置該物件2的複數個凹設狀矩陣排列的第二容納區61;該夾持區間45兩側分別對應各設有相隔間距且可分別各獨立受驅動作Y軸向位移的二個第一夾具46、二個第二夾具47、及二個第三夾具48,其中,該第一夾具46位於該第三夾具48
的上方,該第二夾具47的開口471大於該第一夾具46的開口461及該第三夾具48的開口481的總和;該翻轉架4可在該龍門座架5的該軌座52上位移對應該龍門座架5一側的該輸送流路1,也可在相對該輸送流路1的該龍門座架5另一側平行設置另一輸送流路(圖中未示,由該輸送流路1同理可推),使該翻轉架4可在該龍門座架5的該軌座52上位移對應至該另一輸送流路。
Please refer to Figures 1 and 2. The present invention can be implemented by using a flipping device as shown in the figure. The flipping device is provided with: a
請參閱圖1、2,本發明實施例在實施時,使該物件2以複數個矩陣排列方式被盛載於該第一載盤3的複數個矩陣排列的該第一容納區31中,並使盛載該物件2的該第一載盤3由該輸送流路1的該第二軌架12輸送至該第一軌架11的該皮帶112上停置,並恰位於該頂抵機構13的該載台132上方一預設高度處,而該翻轉架4恰以二個該第一夾具46自兩側夾持該第二載盤6以該第二容納區61的開口朝下方式對應位於該第一載盤3一預設高度處;此時該頂座14兩側受該靠抵件133夾靠定位在該載台132上。
1 and 2, when the embodiment of the present invention is implemented, the
請參閱圖1、3,該翻轉架4下移至使設有該第二容納區61的該第二載盤6與該第一載盤3上表面疊置,並該第三夾具48夾持該第一載盤3兩側,及以該第二夾具47夾持該第一載盤3、該第二載盤6兩側。
Please refer to Figures 1 and 3. The
請參閱圖1、4,該頂抵機構13驅動該載台132上移,以該頂座14上表面凸設狀的該頂抵部141伸經該第一載盤3的該鏤空區間32,而將該物件2由下往上頂地由該第一容納區31中推抵至該第二載盤6的該第二容納區61中,由於該頂座14具有磁性,其抵靠該第一載盤3底部時將與該第一載盤3吸附連動。
Please refer to Figures 1 and 4. The
請參閱圖1、5,該靠抵件133放開對該頂座14兩側的夾靠,使該頂座14與該頂抵機構13的該載台132脫離聯結分離地,藉由該頂座
14的磁性轉換至與該第一載盤結合連動,該翻轉架4提帶被該第二夾具47夾持的該第一載盤3、該第二載盤6,並連同與該第一載盤3吸附連動且與該載台132脫離聯結的該頂座14提帶至預設高度定位。
Please refer to Figures 1 and 5. The
請參閱圖1、6,在該頂抵部141被保持位於該第一載盤3的該鏤空區間32、該第一容納區31中,且抵觸及該物件2底面使其保持在該第二載盤6的該第二容納區61中的情況下,該翻轉架4執行將該第一載盤3、第二載盤6及該頂座14同時翻轉,使該第二載盤6位於該第一載盤3下方,並使該頂座14被連動翻轉至位於該第一載盤3上方,形成該頂座14在上而該頂抵部141朝下伸設狀;該翻轉架4同時在該龍門座架5的Y軸向的該軌座52上位移至對應另一輸送流路的一平台7上方;由於該物件2底面在翻轉過程中一直被該頂座14的該頂抵部141推抵限位在該第二容納區61中,因此在翻轉程序進行時,該物件2不會作由該第一容納區31往該第二容納區61翻移的位移,如該物件2可以減少翻轉時的碰撞損傷。
Please refer to Figures 1 and 6. When the
請參閱圖1、7,該翻轉架4提帶該第二夾具47夾持的該第一載盤3、該第二載盤6,並連同該頂座14下移至使該第二載盤6底部置靠於該平台7上。
Please refer to Figures 1 and 7. The turning
請參閱圖1、8,該翻轉架4的該第一夾具46放開對該第二載盤6的夾持,且該第二夾具47放對該第一載盤3、該第二載盤6的夾持,使該翻轉架4僅以該第三夾具48夾持該第一載盤3兩側連動其上的該頂座14上移至預設高度定位,而將盛載該物件2的該第二載盤6留置於該平台7上,隨後該第二載盤6將被輸送至其他製程。
Please refer to Figures 1 and 8. The
請參閱圖1、9,該翻轉架4執行翻轉使該頂座14位於該第一載盤3下方;該翻轉架4同時在該龍門座架5的Y軸向的該軌座52上位移回該輸送流路1的該載台132上方。
Please refer to Figures 1 and 9. The
請參閱圖1、10,該翻轉架4下移將該第一載盤3置於該第一軌架11的該皮帶112上停置後,該翻轉架4放開該第三夾具48對該第一載盤3兩側的夾持,其下方的該頂座14則被該頂抵機構13的該載台132承接,並藉該頂座14兩側受該靠抵件133夾靠定位而留置在該載台132上,該翻轉架4則在該龍門座架5的Y軸向的該軌座52上位移至該平台7上以該第一夾具46夾持提取新的一第二載盤6。
Please refer to Figures 1 and 10. After the
依前述圖2至圖10的反覆循環操作以逐一進行翻轉的製程。 The process of flipping is repeated one by one according to the above-mentioned Figures 2 to 10.
本發明實施例之翻面方法及裝置,由於該第二載盤6與該第一載盤3疊置時,使該頂座14推抵該物件2由該第一載盤3的一第一容納區31位移至該第二載盤6的該第二容納區61,並使該第一載盤3、第二載盤6及該頂座14同時翻轉,因此可以在無礙於翻轉進行下,確保翻轉時該物件被轉移保持在該第二載盤6的該第二容納區61中,使物件2可順利由一載盤轉換至另一載盤。
The flipping method and device of the embodiment of the present invention, when the
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 However, the above is only a preferred embodiment of the present invention, and it cannot be used to limit the scope of implementation of the present invention. In other words, all simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the invention description are still within the scope of the present invention patent.
1:輸送流路 1: Transport flow path
11:第一軌架 11: First rail
111:側架 111: Side frame
112:皮帶 112: Belt
12:第二軌架 12: Second rail
121:側架 121: Side frame
122:皮帶 122: Belt
13:頂抵機構 13: Top-up mechanism
131:驅動件 131:Driver
132:載台 132: Carrier
133:靠抵件 133: Relying on the parts
14:頂座 14: Top seat
141:頂抵部 141: Top of the head
142:磁性部件 142: Magnetic components
2:物件 2: Objects
3:第一載盤 3: First upload
31:第一容納區 31: First storage area
32:鏤空區間 32: hollow space
4:翻轉架 4: Flip frame
41:樞接部 41: Joint
42:驅動件 42:Driver
421:皮帶 421: Belt
43:支撐部 43: Support part
44:支撐架 44: Support frame
45:夾持區間 45: Clamping interval
46:第一夾具 46: First clamp
461:開口 461: Open mouth
47:第二夾具 47: Second clamp
471:開口 471: Open your mouth
48:第三夾具 48: The third clamp
481:開口 481: Open mouth
5:龍門座架 5: Gantry frame
51:立柱 51: Pillar
52:軌座 52: Rail seat
53:軌座 53: Rail seat
531:固定座 531: Fixed seat
6:第二載盤 6: Second loading
61:第二容納區 61: Second storage area
7:平台 7: Platform
圖1係本發明實施例中該翻轉裝置的示意圖。 Figure 1 is a schematic diagram of the flipping device in an embodiment of the present invention.
圖2係本發明實施例中第一載盤、第二載盤及頂抵機構的位置關係示意圖。 Figure 2 is a schematic diagram showing the positional relationship between the first carrier, the second carrier and the abutment mechanism in an embodiment of the present invention.
圖3係本發明實施例中該第二載盤被翻轉架搬送下移與第一載盤疊置的示意圖。 Figure 3 is a schematic diagram of the second carrier being transported downward by the turning frame and superimposed on the first carrier in the embodiment of the present invention.
圖4係本發明實施例中該頂抵機構驅動使該頂座上的頂抵部推抵物件的示意圖。 Figure 4 is a schematic diagram of the top-butting mechanism in the embodiment of the present invention being driven to cause the top-butting portion on the top seat to push against an object.
圖5係本發明實施例中該翻轉架提帶該第一載盤、該第二載盤及該頂座上移的示意圖。 Figure 5 is a schematic diagram of the turning frame carrying the first loading plate, the second loading plate and the top seat moving upward in an embodiment of the present invention.
圖6係本發明實施例中該翻轉架提帶該第一載盤、該第二載盤及該頂座進行翻轉並移至另一輸送流路上一平台上方的示意圖。 Figure 6 is a schematic diagram of the embodiment of the present invention in which the turning frame carries the first carrier plate, the second carrier plate and the top seat to turn over and move to the top of a platform on another conveying flow path.
圖7係本發明實施例中該翻轉架將該第一載盤、該第二載盤及該頂座置於該平台上的示意圖。 FIG. 7 is a schematic diagram showing the flip frame placing the first carrier plate, the second carrier plate and the top seat on the platform in an embodiment of the present invention.
圖8係本發明實施例中該翻轉架將已容納有該物件的該第二載盤置於該平台,並提帶該第一載盤及該頂座上移的示意圖。 FIG8 is a schematic diagram showing that the flip frame in the embodiment of the present invention places the second carrier containing the object on the platform and moves the first carrier and the top seat upward.
圖9係本發明實施例中該翻轉架提帶該第一載盤及該頂座進行翻轉並回移至原輸送流路上的該頂抵機構的該載台上方的示意圖。 FIG9 is a schematic diagram of the embodiment of the present invention in which the flip frame carries the first carrier plate and the top seat to flip and move back to the top of the carrier of the top support mechanism on the original conveying flow path.
圖10係本發明實施例該翻轉架將該第一載盤置於第一軌架的皮帶上,及將該頂座受該頂抵機構的該載台承接,並上移及至該另一輸送流路提取另一第二載盤回至原輸送流路的該第一載盤上方的示意圖。 FIG. 10 is a schematic diagram showing that the turning frame of the present invention places the first carrier on the belt of the first rail, and the top seat is supported by the carrier of the top support mechanism, and moves up to the other conveying flow path to extract another second carrier and return it to the top of the first carrier in the original conveying flow path.
13:頂抵機構 13: Top-up mechanism
131:驅動件 131:Driver
132:載台 132: Carrier
133:靠抵件 133: Relying on the parts
14:頂座 14: Top seat
141:頂抵部 141: Top of the head
142:磁性部件 142: Magnetic components
2:物件 2: Objects
3:第一載盤 3: First upload
31:第一容納區 31: First storage area
32:鏤空區間 32: hollow space
46:第一夾具 46: First clamp
47:第二夾具 47: Second clamp
48:第三夾具 48: The third clamp
6:第二載盤 6: Second loading
61:第二容納區 61: Second storage area
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110133603A TWI855269B (en) | 2021-09-09 | 2021-09-09 | Flipping method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110133603A TWI855269B (en) | 2021-09-09 | 2021-09-09 | Flipping method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202312857A TW202312857A (en) | 2023-03-16 |
| TWI855269B true TWI855269B (en) | 2024-09-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110133603A TWI855269B (en) | 2021-09-09 | 2021-09-09 | Flipping method and device |
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| Country | Link |
|---|---|
| TW (1) | TWI855269B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW440060U (en) * | 1998-10-15 | 2001-06-07 | Top Forward Science Entpr Co L | Flipping mechanism of BGA packaged integrated circuit detecting system |
| TW200741946A (en) * | 2006-04-27 | 2007-11-01 | Advanced Semiconductor Eng | Manufacturing method and structure for chip pickup device |
| JP2008010869A (en) * | 2006-06-23 | 2008-01-17 | Sigo Co Ltd | Semiconductor chip flip assembly, and semiconductor chip bonding device utilizing the same |
| TWM331744U (en) * | 2007-09-19 | 2008-05-01 | Global Master Tech Co Ltd | Flipping device for chip |
| TW201304086A (en) * | 2011-07-05 | 2013-01-16 | Keystone Electronics Corp | Apparatus and method of flipping over chip |
-
2021
- 2021-09-09 TW TW110133603A patent/TWI855269B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW440060U (en) * | 1998-10-15 | 2001-06-07 | Top Forward Science Entpr Co L | Flipping mechanism of BGA packaged integrated circuit detecting system |
| TW200741946A (en) * | 2006-04-27 | 2007-11-01 | Advanced Semiconductor Eng | Manufacturing method and structure for chip pickup device |
| JP2008010869A (en) * | 2006-06-23 | 2008-01-17 | Sigo Co Ltd | Semiconductor chip flip assembly, and semiconductor chip bonding device utilizing the same |
| TWM331744U (en) * | 2007-09-19 | 2008-05-01 | Global Master Tech Co Ltd | Flipping device for chip |
| TW201304086A (en) * | 2011-07-05 | 2013-01-16 | Keystone Electronics Corp | Apparatus and method of flipping over chip |
Also Published As
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|---|---|
| TW202312857A (en) | 2023-03-16 |
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