TWI854923B - Air flow resistance adjustment structure for housing - Google Patents
Air flow resistance adjustment structure for housing Download PDFInfo
- Publication number
- TWI854923B TWI854923B TW112149065A TW112149065A TWI854923B TW I854923 B TWI854923 B TW I854923B TW 112149065 A TW112149065 A TW 112149065A TW 112149065 A TW112149065 A TW 112149065A TW I854923 B TWI854923 B TW I854923B
- Authority
- TW
- Taiwan
- Prior art keywords
- flow resistance
- resistance adjustment
- buckle
- handle
- side wall
- Prior art date
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Air-Flow Control Members (AREA)
Abstract
Description
本發明係有關於機箱的散熱氣流的導引結構的技術領域,特別是有關於一種調整機箱中各分隔空間的流阻,而使得散熱氣流能夠均勻地在各分隔空間流動的機箱流阻調整結構。The present invention relates to the technical field of a heat dissipation airflow guiding structure of a chassis, and in particular to a chassis flow resistance adjusting structure for adjusting the flow resistance of each partition space in the chassis so that the heat dissipation airflow can flow evenly in each partition space.
電腦設備包含電路板及多個電子元件,電子元件運行時會產生熱,使得電子元件本身的溫度升高,電子元件溫度升高會影響電子元件的運行效率,因此必須在機箱中提供氣流以便進行散熱。Computer equipment includes circuit boards and multiple electronic components. When the electronic components are running, they will generate heat, causing the temperature of the electronic components themselves to rise. The increase in the temperature of the electronic components will affect the operating efficiency of the electronic components. Therefore, airflow must be provided in the chassis for heat dissipation.
電腦設備尤其是伺服器由於其包括主電路板及多個電子模組,每個電子模組本身都具有電路板,因此整體配置在機箱中會形成多個分隔空間,散熱氣流必須平均地流過每個分隔空間,才能對各電子模組進行散熱。但是每個電子模組具有不同數量及形狀的電子元件,因此每個分隔空間會對散熱氣流產生不同的流動阻力,這樣散熱氣流通過各分隔空間時,每個分隔空間的散熱氣流會有不平均的問題,尤其是電子元件數量較多的電子模組,由於其對於氣流的流動阻力較大,因此散熱氣流的流量會降低,但是電子元件數量較多的電子模組由於發熱量較大,反而是需要流量較大的散熱氣流,因而產生的散熱不佳的問題。Computer equipment, especially servers, include a main circuit board and multiple electronic modules. Each electronic module has its own circuit board. Therefore, the overall configuration in the chassis will form multiple partitions. The heat dissipation airflow must flow evenly through each partition to dissipate heat for each electronic module. However, each electronic module has electronic components of different numbers and shapes. Therefore, each partition will produce different flow resistances to the heat dissipation airflow. In this way, when the heat dissipation airflow passes through each partition, the heat dissipation airflow in each partition will be uneven. In particular, electronic modules with a large number of electronic components have a large flow resistance to the airflow, so the flow rate of the heat dissipation airflow will be reduced. However, electronic modules with a large number of electronic components have a large amount of heat generated, so they need a larger flow rate of heat dissipation airflow, which results in poor heat dissipation.
有鑑於此,本發明的目的在於提供一種機箱流阻調整結構,其可以對氣流流動阻力較小的分隔空間增加其流動阻力,避免大量的散熱氣流進入此分隔空間,使得其他流動阻力較大的分隔空間能夠得到足夠流量的散熱氣流,以解決由於散熱氣流的流量不足而導致散熱不佳的問題。In view of this, the purpose of the present invention is to provide a chassis flow resistance adjustment structure, which can increase the flow resistance of the partition space with smaller airflow resistance to prevent a large amount of heat dissipation airflow from entering this partition space, so that other partition spaces with larger flow resistance can obtain heat dissipation airflow with sufficient flow, thereby solving the problem of poor heat dissipation caused by insufficient flow of heat dissipation airflow.
本發明的機箱流阻調整結構的一實施例位於一機箱中且設置於一電子模組的一承載支架,承載支架將一機箱分隔成一第一空間以及一第二空間,散熱氣流同時流經第一空間及第二空間。本實施例的機箱流阻調整結構包括:一把手件、一卡扣件以及一流阻調整件。把手件可旋轉地設置於承載支架且位於第一空間,把手件可於一釋放位置以及一鎖扣位置之間轉動。卡扣件設置於把手件且可沿平行於把手件的方向於一卡合位置及一退避位置之間移動,當把手件從釋放位置往鎖扣位置樞轉時,卡扣件先抵接於支架的側壁而移動至退避位置,當對準承載支架的卡合槽時,卡扣件移動至卡合位置以卡合於卡合槽,以使把手件定位於該鎖扣位置。流阻調整件設置於把手件且與把手件的邊緣齊平,卡扣件止擋流阻調整件,當卡扣件移動至退避位置時,卡扣件釋放流阻調整件,流阻調整件可沿垂直於把手件的方向移動而突出於把手件,以調整第一空間的流阻。An embodiment of the chassis flow resistance adjustment structure of the present invention is located in a chassis and is arranged on a supporting bracket of an electronic module. The supporting bracket divides the chassis into a first space and a second space, and the heat dissipation airflow flows through the first space and the second space at the same time. The chassis flow resistance adjustment structure of this embodiment includes: a handle, a buckle, and a flow resistance adjustment member. The handle is rotatably arranged on the supporting bracket and is located in the first space. The handle can be rotated between a release position and a buckle position. The buckle is arranged on the handle and can move between a locking position and a retreat position in a direction parallel to the handle. When the handle pivots from the release position to the lock position, the buckle first abuts against the side wall of the bracket and moves to the retreat position. When aligned with the locking groove of the load-bearing bracket, the buckle moves to the locking position to lock the locking groove, so that the handle is positioned at the lock position. The flow resistance adjusting member is arranged on the handle and is flush with the edge of the handle. The buckle blocks the flow resistance adjusting member. When the buckle moves to the retreat position, the buckle releases the flow resistance adjusting member. The flow resistance adjusting member can move in a direction perpendicular to the handle and protrude from the handle to adjust the flow resistance of the first space.
藉由在承載支架的把手件上設置流阻調整件,而且在把手件上用於將把手件鎖扣於承載支架的卡扣件上設置適當的機構,使得在卡扣件移動卡扣於承載支架的過程中,流阻調整件能夠隨著卡扣件的動作也移動而突出於把手件,藉此對流過第一空間的氣流產生更大的阻力,以便調整流過第一空間與第二空間的氣流流量。By arranging a flow resistance adjusting piece on the handle piece of the supporting bracket and arranging a suitable mechanism on the handle piece for locking the handle piece to the buckle of the supporting bracket, the flow resistance adjusting piece can move along with the movement of the buckle and protrude from the handle piece during the process of the buckle moving and buckling on the supporting bracket, thereby generating greater resistance to the airflow flowing through the first space, so as to adjust the airflow rate flowing through the first space and the second space.
請參閱第一圖及第二圖,其表示本發明的機箱流阻調整結構2的一實施例。本實施例的機箱流阻調整結構2位於一機箱1中且設置於一承載支架H,承載支架H用於承載一電子模組E。承載支架H具有兩個相對且平行設置側壁H1,一主電路板C設置於機箱1的兩個側壁(未圖示)之間,承載支架H也設置於機箱1的兩個側壁(未圖示)之間且位於主電路板C的上方。承載支架H將機箱1內部分成一第一空間S1以及一第二空間S2,承載支架H上方為第一空間S1,電子模組E設置於承載支架H且位於第一空間S1中,主電路板C位於第二空間S2中。由風扇(未圖示)產生的散熱氣流同時流經第一空間S1及第二空間S2。Please refer to the first and second figures, which show an embodiment of the chassis flow
本實施例的機箱流阻調整結構2包括一把手件10、一卡扣件20以及一流阻調整件30。如第二圖所示,把手件10是用於供使用者握持而攜行電子模組E。把手件10可旋轉地設置於承載支架H且位於第一空間S1。把手件10可於一釋放位置以及一鎖扣位置之間樞轉。The chassis flow
請一併參閱第三圖、第四圖及第五圖,把手件10包括一操作橫桿11以及設置於操作橫桿11的相對兩側的兩個樞接部12,兩個樞接部12往遠離操作橫桿11的方向延伸且可旋轉地結合於承載支架H。Please refer to the third, fourth and fifth figures together. The
操作橫桿11包括一前部件111、一後部件112以及設置於前部件111與後部件112之間的結構強化部件113。前部件111包括一頂壁1111、一底壁1112以及一前側壁1113。頂壁1111及底壁1112成為操作橫桿11的頂壁11a與底壁11b,前側壁1113成為操作橫桿11的第一側壁11c,第一側壁11c位於遠離電子模組E的一側。操作橫桿11更包括一滑槽體114,卡扣件20可移動地設置於滑槽體114內。滑槽體114包括相對設置的兩個導引側壁1141、一第一承載側壁1142以及一第二承載側壁1145,第一承載側壁1142以及第二承載側壁1145為相對設置,卡扣件20承載於第一承載側壁1142以及第二承載側壁1145的頂緣而且抵接於導引側壁1141。The
卡扣件20設置於把手件10且可沿平行於把手件10的一第一方向L1於一卡合位置及一退避位置之間移動。卡扣件20包括一卡扣件本體21、一卡扣部22以及一止擋承載部23。卡扣件本體21設置於滑槽體114內且沿第一方向L1卡合位置及退避位置之間移動,第一方向L1與第一側壁11c的延伸方向平行。卡扣部22與止擋承載部23分別設置於卡扣件本體21的相對兩側。滑槽體114的第一承載側壁1142具有一凹口1143,卡扣部22移動從凹口1143凸出於滑槽體114或進入滑槽體114,止擋承載部23跨設於第二承載側壁1145且往相反方向延伸至滑槽體114的外部。操作橫桿11的左右兩端分別設置一開口11e,卡扣部22能夠從開口11e凸出於操作橫桿11或被推壓從開口11e進入操作橫桿11。當卡扣件本體21移動至卡合位置時,卡扣部22從開口11e凸出於操作橫桿11,當卡扣件本體21移動至退避位置,卡扣部22被推壓從開口11e進入操作橫桿11且退避進入滑槽體114。The
本實施例的流阻調整結構1更包括一復位彈性件40,復位彈性件40設置於滑槽體114內且復位彈性件40的兩端分別抵接於卡扣件本體21及滑槽體114的第二承載側壁1145,復位彈性件40施力於卡扣件本體21,當把手件10從釋放位置往鎖扣位置轉動時,卡扣件20由於與承載支架H的側壁H1形成干涉而被推壓移動至退避位置,此時復位彈性件40產生形變。當把手件10持續轉動直到卡扣件20對準承載支架H的側壁H1的卡合槽H2時,復位彈性件40對卡扣件本體21的施力使得卡扣件20移動至卡合位置以卡合於卡合槽H2,使把手件10定位於鎖扣位置。The flow
請參閱第六圖,止擋承載部23具有相對設置的一上表面231和一下表面232以及貫穿上表面231與下表面232的一穿槽233。而且止擋承載部23的下表面232鄰接於穿槽233的端緣處形成一第一斜面234。Referring to FIG. 6 , the
請一併參閱第三圖、第四圖及第五圖,流阻調整件30設置於把手件10且與把手件10的操作橫桿11的頂壁11a與底壁11b邊緣齊平,流阻調整件30可移動地設置於第一側壁11c。流阻調整件30包括一流體阻擋板31、一對止擋銷32以及一推壓板34,流體阻擋板31抵接於第一側壁11c。第一側壁11c具有一對第一槽孔11g以及一第二槽孔11h,一對止擋銷32以及推壓板34從流體阻擋板31分別經過第一槽孔11g以及第二槽孔11h延伸進入操作橫桿11的內部,其中止擋銷32抵接於止擋承載部23。止擋銷32在對應於穿槽233的第一斜面234的位置設有一第二斜面321。Please refer to the third, fourth and fifth figures together. The flow
請一併參閱第九圖及第十圖,本實施例的機箱流阻調整結構2更包括一偏壓彈性件50。偏壓彈性件50設置於把手件10與流阻調整件30之間,偏壓彈性件50的一端抵接於把手件10的操作橫桿11的頂壁11a,偏壓彈性件50的另一端抵接於推壓板34。Please refer to FIG9 and FIG10 together. The chassis flow
請參閱第七圖及第八圖,第一槽孔11g以及第二槽孔11h是沿一第二方向L2延伸,第二方向L2與第一方向L1垂直。因此當使用者轉動把手件10,使把手件10從釋放位置移動至鎖扣位置時,卡扣件本體21從卡合位置移動至退避位置,此時止擋承載部23相對於止擋銷32移動直到止擋銷32對準止擋承載部23的穿槽233,然後止擋銷32穿過穿槽233而從止擋承載部23的上表面231向下移動離開止擋承載部23,使得流體阻擋板31沿著第二方向L2向下移動,如第九圖及第十圖所示,同時偏壓彈性件50對於推壓板34的施力也會使流體阻擋板31可靠地向下移動,然後卡扣件本體21從退避位置移動至卡合位置,使止擋銷32被止擋於止擋承載部23的下表面232。此時流體阻擋板31向下突出於把手件10的操作橫桿11的底壁11b,使得操作橫桿11形成比第一側壁11c更大的截面積,如此當散熱氣流流經第一空間S1時,大面積的操作橫桿11提供了較大的流動阻力。藉由流體阻擋板31的移動,能夠調整第一空間S1的流動阻力。Please refer to FIG. 7 and FIG. 8 , the
當使用者要攜行電子模組E時,使用者施力推壓流體阻擋板31向上移動,使止擋銷32的第二斜面321抵接於止擋承載部23的第一斜面234,然後藉由第二斜面321與第一斜面234之間的相對移動,使卡扣件本體21從卡合位置移動至退避位置,直到止擋銷32對準止擋承載部23的穿槽233,使止擋銷32穿過穿槽233回到止擋承載部23的上表面231而且止擋於上表面231。此時,流體阻擋板31回復到與操作橫桿11的頂壁11a與底壁11b齊平的狀態,同時使用者可以樞轉把手件10使把手件10從鎖扣位置移動至釋放位置,以便於使用者從機箱1取下電子模組E。When the user wants to carry the electronic module E, the user applies force to push the
藉由在承載支架的把手件上設置流阻調整件,使得在卡扣件移動卡扣於承載支架的過程中,流阻調整件能夠隨著卡扣件的動作也移動而突出於把手件,藉此對流過第一空間的氣流產生更大的阻力,以便調整流過第一空間與第二空間的氣流流量。By arranging a flow resistance adjusting member on the handle member of the supporting bracket, the flow resistance adjusting member can move along with the movement of the buckle member and protrude from the handle member during the process of the buckle member moving and buckling on the supporting bracket, thereby generating greater resistance to the airflow flowing through the first space, so as to adjust the airflow rate flowing through the first space and the second space.
在本實施例中,本發明之伺服器係可用於人工智慧(Artificial Intelligence,簡稱AI)運算、邊緣運算(edge computing),亦可當作5G伺服器、雲端伺服器或車聯網伺服器使用。In this embodiment, the server of the present invention can be used for artificial intelligence (AI) computing, edge computing, and can also be used as a 5G server, cloud server, or Internet of Vehicles server.
藉由以上較佳具體實施例之詳述,係希望能更加清楚描述本發明之特徵與精神,而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地,其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇內。The above detailed description of the preferred specific embodiments is intended to more clearly describe the features and spirit of the present invention, but is not intended to limit the scope of the present invention by the preferred specific embodiments disclosed above. On the contrary, the purpose is to cover various changes and arrangements with equivalents within the scope of the patent application for the present invention.
1:機箱
2:機箱流阻調整結構
10:把手件
11:操作橫桿
11a:頂壁
11b:底壁
11c:第一側壁
11e:開口
11g:第一槽孔
11h:第二槽孔
12:樞接部
20:卡扣件
21:卡扣件本體
22:卡扣部
23:止擋承載部
30:流阻調整件
31:流體阻擋板
32:止擋銷
34:推壓板
40:復位彈性件
50:偏壓彈性件
111:前部件
112:後部件
113:結構強化部件
114:滑槽體
231:上表面
232:下表面
233:穿槽
234:第一斜面
321:第二斜面
1111:頂壁
1112:底壁
1113:前側壁
1141:導引側壁
1142:第一承載側壁
1143:凹口
1145:第二承載側壁
C:主電路板
E:電子模組
H:承載支架
H1:側壁
H2:卡合槽
L1:第一方向
L2:第二方向
S1:第一空間
S2:第二空間
1: Chassis
2: Chassis flow resistance adjustment structure
10: Handle
11: Operating lever
11a:
第一圖及第二圖係顯示本發明的機箱流阻調整結構的一實施例設置於一承載支架的立體圖,其中第一圖的把手件在釋放位置; 第二圖係顯示第一圖的部分放大圖; 第三圖係顯示本發明的機箱流阻調整結構的一實施例的立體圖; 第四圖係顯示本發明的機箱流阻調整結構的一實施例的立體分解圖; 第五圖係顯示第四圖的另一視角的立體圖; 第六圖是第三圖的部分放大圖。 第七圖及第八圖是沿第六圖的A-A線的剖視圖,且表示卡扣件移動使把手件與機箱形成鎖扣或釋放時,流阻調整件移動突出於把手件; 第九圖是偏壓彈性件設置於把手件及流阻調整件的示意圖; 第十圖是第九圖的B-B線的剖視圖。 The first and second figures are three-dimensional diagrams showing an embodiment of the chassis flow resistance adjustment structure of the present invention disposed on a supporting bracket, wherein the handle of the first figure is in the release position; The second figure is a partially enlarged view of the first figure; The third figure is a three-dimensional diagram showing an embodiment of the chassis flow resistance adjustment structure of the present invention; The fourth figure is a three-dimensional exploded view showing an embodiment of the chassis flow resistance adjustment structure of the present invention; The fifth figure is a three-dimensional diagram showing another viewing angle of the fourth figure; The sixth figure is a partially enlarged view of the third figure. Figures 7 and 8 are cross-sectional views along the A-A line of Figure 6, and indicate that when the latch moves to lock or release the handle and the chassis, the flow resistance adjustment member moves and protrudes from the handle; Figure 9 is a schematic diagram of the biasing elastic member disposed on the handle and the flow resistance adjustment member; Figure 10 is a cross-sectional view along the B-B line of Figure 9.
1:機箱 1: Chassis
2:機箱流阻調整結構 2: Chassis flow resistance adjustment structure
10:把手件 10:Handle piece
C:主電路板 C: Main circuit board
E:電子模組 E: Electronic module
H:承載支架 H: Loading bracket
H1:側壁 H1: Side wall
H2:卡合槽 H2: snap-in slot
S1:第一空間 S1: First Space
S2:第二空間 S2: Second Space
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112149065A TWI854923B (en) | 2023-12-15 | 2023-12-15 | Air flow resistance adjustment structure for housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112149065A TWI854923B (en) | 2023-12-15 | 2023-12-15 | Air flow resistance adjustment structure for housing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI854923B true TWI854923B (en) | 2024-09-01 |
| TW202527641A TW202527641A (en) | 2025-07-01 |
Family
ID=93649009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112149065A TWI854923B (en) | 2023-12-15 | 2023-12-15 | Air flow resistance adjustment structure for housing |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI854923B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI915209B (en) | 2024-11-20 | 2026-02-11 | 廣達電腦股份有限公司 | Handle assembly and connecting rod module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050185374A1 (en) * | 2003-12-29 | 2005-08-25 | Wendel Eric J. | System and method for reduced vibration interaction in a multiple-disk-drive enclosure |
| WO2010138824A2 (en) * | 2009-05-28 | 2010-12-02 | Microblade, Llc | Microtca device |
| TWI381798B (en) * | 2008-10-09 | 2013-01-01 | Inventec Corp | Fan module and fan frame thereof |
| US9426908B1 (en) * | 2015-09-14 | 2016-08-23 | Silverstone Technology Co., Ltd. | Box structure for data storage device |
| US20170303429A1 (en) * | 2016-04-18 | 2017-10-19 | International Business Machines Corporation | Electronics cooling assembly with multi-position, airflow-blocking mechanism |
-
2023
- 2023-12-15 TW TW112149065A patent/TWI854923B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050185374A1 (en) * | 2003-12-29 | 2005-08-25 | Wendel Eric J. | System and method for reduced vibration interaction in a multiple-disk-drive enclosure |
| TWI381798B (en) * | 2008-10-09 | 2013-01-01 | Inventec Corp | Fan module and fan frame thereof |
| WO2010138824A2 (en) * | 2009-05-28 | 2010-12-02 | Microblade, Llc | Microtca device |
| US9426908B1 (en) * | 2015-09-14 | 2016-08-23 | Silverstone Technology Co., Ltd. | Box structure for data storage device |
| US20170303429A1 (en) * | 2016-04-18 | 2017-10-19 | International Business Machines Corporation | Electronics cooling assembly with multi-position, airflow-blocking mechanism |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI915209B (en) | 2024-11-20 | 2026-02-11 | 廣達電腦股份有限公司 | Handle assembly and connecting rod module |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202527641A (en) | 2025-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7643280B2 (en) | Assembling structure for electronic module | |
| US6876547B2 (en) | Hard drive carrier | |
| US9705264B2 (en) | Processor loading system | |
| US7187552B1 (en) | Self-installing heat sink | |
| US20080053933A1 (en) | Mounting Bracket | |
| US12096589B2 (en) | Casing assembly and electronic device including the same | |
| TWI586249B (en) | Server device | |
| WO2018080466A1 (en) | Integrated electronic card front emi cage and latch for data storage system | |
| TWI854923B (en) | Air flow resistance adjustment structure for housing | |
| US10154606B1 (en) | Server unit and server | |
| TW201824257A (en) | Server and hard disk assembly | |
| CN203799323U (en) | Concealed handle module | |
| TWI783838B (en) | Cable management bracket and electronic device | |
| US20230031822A1 (en) | Electronic apparatus with mounting mechanism | |
| TWI612869B (en) | Housing module and electronic device with circuit board quiak-assembling function | |
| TWI478661B (en) | Fixing apparatus for fan | |
| US11836017B2 (en) | Lever mechanism for quick release of expansion component | |
| US11647604B1 (en) | Rack device for mounting server on multiple types of frame | |
| US20240264645A1 (en) | Integrated locking mechanism for drive blanks | |
| TWI845908B (en) | Fan cage and electronic device including the same | |
| US20230422422A1 (en) | Engaging mechanism | |
| TWI782642B (en) | Electronic apparatus with mounting mechanism | |
| TW202249572A (en) | Movable supporting frame and server device | |
| TWI764533B (en) | Server casing | |
| TWI832615B (en) | Case and quick release mechanism for case and electronic devices therein |