TWI854956B - Epoxy resin composition and electronic component apparatus - Google Patents

Abstract

An epoxy resin composition contains an epoxy resin having a melting point or a softening point of more than 40℃, a curing agent, and a compound having a glycidyl group and a melting point of 40℃ or less.

Description

Epoxy resin composition and electronic component device

The present invention relates to an epoxy resin composition and an electronic component device.

With the miniaturization, lightness, and high performance of electronic equipment in recent years, the high density of mounting is being promoted. As a result, the mainstream of electronic component devices has changed from the existing pin insertion type packaging to surface mounting type packaging such as integrated circuit (IC) and large scale integrated circuit (LSI).

The mounting method of the surface mount package is different from that of the existing pin insertion package. That is, when mounting the pins on the wiring board, the existing pin insertion package is soldered from the back of the wiring board after the pins are inserted into the wiring board, so the package is not directly exposed to high temperature. However, in the surface mount package, the entire electronic component device is processed using a solder bath, reflow equipment, etc., so the package is directly exposed to the soldering temperature (reflow temperature). As a result, when the package absorbs moisture, the moisture generated by the moisture absorption during soldering sometimes expands violently, and the generated vapor pressure acts as a peeling stress, causing peeling between the inserts such as components and lead frames and the sealing material, which becomes the cause of package cracks, poor electrical characteristics, etc. Therefore, it is desirable to develop a sealing material that has excellent adhesion to inserts and excellent solder heat resistance (reflow resistance).

In order to meet these requirements, various studies have been conducted on solid epoxy resins as the main material. For example, as solid epoxy resins, there are studies on methods of using biphenyl epoxy resins or naphthalene epoxy resins (for example, refer to Japanese Patent Laid-Open No. 64-65116 and Japanese Patent Laid-Open No. 2007-231159).

In addition, the use of various epoxy resin modified materials has also been studied. As one example, the use of silane coupling agents has been studied to improve the adhesion between components and inserts such as lead frames. Specifically, there are the use of epoxy-containing silane coupling agents or amine-containing silane coupling agents (for example, see Japanese Patent Laid-Open No. 11-147939) and the use of sulfur-containing silane coupling agents (for example, see Japanese Patent Laid-Open No. 2000-103940).

However, it is difficult to achieve a balance between fluidity and reflow resistance if only biphenyl epoxy resin or naphthalene epoxy resin is used.

In addition, if only epoxy-containing silane coupling agents or amine-containing silane coupling agents are used, the effect of improving adhesion is sometimes insufficient. In particular, the amine-containing silane coupling agents described in the Japanese Patent Laid-Open No. 11-147939 have high reactivity, and when used in a sealing epoxy resin composition, the fluidity during sealing decreases. Furthermore, regarding the epoxy-containing silane coupling agents and amine-containing silane coupling agents described in the Japanese Patent Laid-Open No. 11-147939, the silane coupling agents themselves gel, etc., and there are problems with fluidity.

Furthermore, when the sulfur-containing silane coupling agent described in Japanese Patent Application Laid-Open No. 2000-103940 is used, the effect of improving the adhesion to precious metals such as Ag and Au is not sufficient, and the effect of improving the reflow resistance is also not sufficient.

As described above, it is currently impossible to obtain an epoxy resin composition that satisfies both reflow resistance and fluidity. The present disclosure is made in view of the above situation, and its subject is to provide an epoxy resin composition that maintains fluidity and has excellent reflow resistance, and an electronic component device having a cured product of the epoxy resin composition.

Means for solving the above-mentioned problems include the following implementation aspects. ＜1＞ An epoxy resin composition comprising: an epoxy resin having a melting point or a softening point exceeding 40°C, a hardener, and a compound having a glycidyl group and a melting point of 40°C or less. ＜2＞ The epoxy resin composition as described in ＜1＞, wherein the compound having a glycidyl group and a melting point of 40°C or less has a dicyclopentadiene skeleton. ＜3＞ The epoxy resin composition as described in ＜1＞ or ＜2＞, wherein the content of the compound having a glycidyl group and a melting point of 40°C or less is 5% by mass or more and less than 45% by mass relative to the epoxy resin. <4> The epoxy resin composition as described in any one of <1> to <3>, further comprising a curing accelerator. <5> The epoxy resin composition as described in any one of <1> to <4>, further comprising an inorganic filler. <6> The epoxy resin composition as described in any one of <1> to <5>, further comprising a silane compound. <7> The epoxy resin composition as described in any one of <1> to <6>, wherein the melting point or softening point of the epoxy resin is 80°C to 130°C. <8> The epoxy resin composition as described in any one of <1> to <7>, wherein the compound having a glycidyl group and a melting point of 40°C or less has an epoxide equivalent of 165 g/eq to 365 g/eq. <9> The epoxy resin composition as described in any one of <1> to <8>, wherein the content of the compound having a glycidyl group and a melting point of 40°C or less is 20 mass% or more and less than 45 mass% relative to the epoxy resin. <10> An electronic component device comprising: a component; and a cured product of the epoxy resin composition as described in any one of <1> to <9> that seals the component.

According to the present disclosure, an epoxy resin composition having excellent reflow resistance and maintaining fluidity can be provided, and an electronic component device having a cured product of the epoxy resin composition can be provided. Therefore, the industrial value thereof is great.

The following is a detailed description of the embodiments for implementing the present invention. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including element steps, etc.) are not required unless otherwise specifically stated. The same is true for numerical values and their ranges, which do not limit the present invention.

In the present disclosure, the numerical range represented by "～" includes the numerical values recorded before and after the "～" as the minimum and maximum values, respectively. In the numerical range recorded in stages in the present disclosure, the upper limit value or lower limit value recorded in one numerical range can also be replaced by the upper limit value or lower limit value of the numerical range recorded in other stages. In addition, in the numerical range recorded in the present disclosure, the upper limit value or lower limit value of the numerical range can also be replaced by the value shown in the embodiments. In the present disclosure, regarding the content rate or content of each component in the composition, when there are multiple substances equivalent to each component in the composition, unless otherwise specified, it refers to the total content rate or content of the multiple substances present in the composition. In the present disclosure, the term "layer" includes not only the case where the layer is formed in the entire region, but also the case where the layer is formed in only a part of the region when observing the region where the layer exists. In the present disclosure, the term "layer" means stacking layers, and two or more layers may be combined or disassembled.

<Epoxy resin composition> The epoxy resin composition of the embodiment of the present invention contains: an epoxy resin having a melting point or softening point exceeding 40°C (hereinafter, also referred to as "(A) specific epoxy resin" or "specific epoxy resin"), a hardener (hereinafter, also referred to as "(B) hardener" or "hardener"), and a compound having a glycidyl group and a melting point of 40°C or less (hereinafter, also referred to as "(C) specific glycidyl compound" or "specific glycidyl compound"). The epoxy resin composition may also contain other components as necessary. Furthermore, as the (C) specific glycidyl compound, for example, a compound that is liquid at room temperature (e.g., 25°C) can be listed. With the above structure, the epoxy resin composition has excellent reflow resistance and good fluidity.

The reason why the epoxy resin composition maintains fluidity and has excellent reflow resistance is not clear, but it can be considered as follows. Specifically, it is believed that the reason is that the glycidyl group in the specific glycidyl compound combines with the hardener in the epoxy resin composition to obtain an effect of improving adhesion and reducing the modulus of elasticity, thereby maintaining high fluidity and improving reflow resistance.

The epoxy resin composition can be, for example, a solid at room temperature and pressure (e.g., 25° C., 1 atmosphere). The solid shape is not limited and can be any shape such as powder, granules, or flakes. In addition, the epoxy resin composition can also be used as a sealing resin composition and further as a transfer mold resin composition.

(C) Specific glycidyl compound (C) The specific glycidyl compound is a compound having a glycidyl group in its molecular structure and a melting point of 40°C or less. The specific glycidyl compound may be used alone or in combination of two or more. The epoxy resin composition contains the specific glycidyl compound, thereby maintaining fluidity and having excellent reflow resistance. Furthermore, from the viewpoint of obtaining an epoxy resin composition having maintained fluidity and excellent reflow resistance, the number of glycidyl groups possessed by one molecule of the specific glycidyl compound is preferably 1 to 6, and more preferably 2 to 4.

From the viewpoint of obtaining an epoxy resin composition that maintains fluidity and has excellent reflow resistance, the specific glycidyl compound preferably further has a dicyclopentadiene skeleton in the molecular structure. It is speculated that by containing a specific glycidyl compound having a glycidyl group and a dicyclopentadiene skeleton in the molecular structure, in addition to the glycidyl group in the specific glycidyl compound being bonded to the hardener in the epoxy resin composition, the dicyclopentadiene structure further interacts with the metal surface, thereby further improving the bonding force. Furthermore, from the viewpoint of obtaining an epoxy resin composition that maintains fluidity and has excellent reflow resistance, the number of dicyclopentadiene skeletons in one molecule of the specific glycidyl compound is preferably 1 to 4, and more preferably 1 to 2.

As a specific example of the specific glycidyl compound, for example, dicyclopentadiene dimethanol diglycidyl ether can be cited. In addition, as specific examples of the specific glycidyl compound, in addition to the above compounds, for example, rubber cross-linked bisphenol type epoxy resins and chelate modified epoxy resins can also be cited.

From the viewpoint of obtaining an epoxy resin composition having excellent reflow resistance while maintaining fluidity, the molecular weight of the specific glycidyl compound is preferably 100 to 600, more preferably 200 to 400. In addition, the melting point of the specific glycidyl compound is 40° C. or less, and from the viewpoint of obtaining an epoxy resin composition having excellent reflow resistance while maintaining fluidity, it is preferably 0° C. to 35° C., more preferably 0° C. to 30° C. In addition, the epoxy equivalent of the specific glycidyl compound is preferably 165 g/eq to 365 g/eq, more preferably 165 g/eq to 240 g/eq.

The content of the specific glycidyl compound in the epoxy resin composition is preferably 5 mass % or more and less than 45 mass % relative to the total amount of the specific epoxy resin (A). When the content is 5 mass % or more, there is a tendency that the adhesiveness is improved and the effect of improving the reflow resistance can be obtained compared with the case of less than 5 mass %. In addition, when the content is less than 45 mass %, there is a tendency that the decrease in hardness during molding is suppressed compared with the case of 45 mass % or more. Furthermore, the content of the specific glycidyl compound is preferably 10% by mass or more and less than 45% by mass, more preferably 20% by mass or more and less than 45% by mass, and particularly preferably 25% by mass or more and less than 45% by mass, relative to the total amount of the specific epoxy resin (A). In addition, the content of the specific glycidyl compound is preferably 1% by mass or more relative to the entire epoxy resin composition.

(A) Specific Epoxy Resin The epoxy resin composition contains at least one epoxy resin having a melting point or a softening point exceeding 40°C (i.e., (A) specific epoxy resin). Here, the melting point or the softening point of the epoxy resin is a value measured by the single cylinder rotational viscometer method described in Japanese Industrial Standards (JIS) K 7234:1986 and JIS K 7233:1986. The specific epoxy resin may be one commonly used in epoxy resin compositions, and is not particularly limited as long as the melting point or the softening point exceeds 40°C. From the viewpoint of obtaining an epoxy resin composition having excellent reflow resistance while maintaining fluidity, the melting point or softening point of the specific epoxy resin is preferably 45°C to 180°C, more preferably 50°C to 150°C, further preferably 80°C to 130°C, and particularly preferably 96°C to 113°C.

Among them, the specific epoxy resin is preferably one containing two or more epoxy groups in one molecule. From the viewpoint of obtaining an epoxy resin composition that maintains fluidity and has excellent reflow resistance, the epoxy equivalent of the specific epoxy resin is preferably 100 g/eq to 1000 g/eq, more preferably 150 g/eq to 1000 g/eq, further preferably 150 g/eq to 500 g/eq, and particularly preferably 196 g/eq to 245 g/eq. The epoxy equivalent is determined by dissolving the weighed epoxy resin in a solvent such as methyl ethyl ketone and adding acetic acid and tetraethylammonium bromide acetic acid solution, and then titrating with a perchloric acid acetic acid standard solution using a potentiometric titration. The titration may also use an indicator.

Specifically, the specific epoxy resin includes: a phenolic varnish obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenolic compounds such as phenol, cresol, xylenol, resorcinol, o-catechol, bisphenol A, bisphenol F, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, and propionaldehyde under an acidic catalyst. a phenolic varnish type epoxy resin (phenol phenolic varnish type epoxy resin, o-cresol phenolic varnish type epoxy resin, etc.) obtained by epoxidizing the phenolic varnish resin; a triphenylmethane type phenolic resin obtained by condensing or co-condensing the phenolic compound with an aromatic aldehyde compound such as benzaldehyde or salicylic aldehyde under an acidic catalyst and epoxidizing the triphenylmethane type phenolic resin to obtain a triphenylmethane type phenolic resin; a copolymerized epoxy resin obtained by epoxidizing a novolac resin obtained by co-condensing the phenol compound and the naphthol compound with an aldehyde compound under an acidic catalyst; a diphenylmethane epoxy resin as a diglycidyl ether of bisphenol A, bisphenol F, etc.; a biphenyl type cyclopentyl ether as a diglycidyl ether of an alkyl-substituted or unsubstituted diphenol; stilbene-type epoxy resins as diglycidyl ethers of stilbene-based phenol compounds; epoxy resins containing sulfur atoms such as diglycidyl ethers of bisphenol S and thiodiphenol-type epoxy resins; epoxy resins as glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl esters of polycarboxylic acid compounds such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; Ester type epoxy resin; glycidylamine type epoxy resin obtained by replacing the active hydrogen bonded to the nitrogen atom of aniline, diaminodiphenylmethane, isocyanuric acid, etc. with glycidyl group; dicyclopentadiene type epoxy resin obtained by epoxidation of a co-condensation resin of dicyclopentadiene and a phenol compound; dicycloethylene oxide vinylcyclohexene, 3-hydroxy-1-nitro-1-nitro-1-nitro-2-nitro-1-nitro-2-nitro-2-nitro-3-nitro-2-nitro-3-nitro-3-nitro-2-nitro-3-nitro-3-nitro-4 ... ,4-epoxyepoxyhexylmethyl-3,4-epoxyepoxyhexanecarboxylate, 2-(3,4-epoxy)epoxyhexyl-5,5-spiro(3,4-epoxy)epoxyhexane-m-dioxane and the like; p-xylene-modified epoxy resin as the glycidyl ether of p-xylene-modified phenol resin; m-xylene-modified epoxy resin as the glycidyl ether of m-xylene-modified phenol resin ; terpene-modified epoxy resin as the glycidyl ether of terpene-modified phenol resin; dicyclopentadiene-modified epoxy resin as the glycidyl ether of dicyclopentadiene-modified phenol resin; cyclopentadiene-modified epoxy resin as the glycidyl ether of cyclopentadiene-modified phenol resin; polycyclic aromatic ring-modified epoxy resin as the glycidyl ether of polycyclic aromatic ring-modified phenol resin; condensed phenol resin containing naphthyl ring as the glycidyl ether of phenol resin containing naphthyl ring; Naphthalene epoxy resin of hydroglyceryl ether; halogenated phenol novolac epoxy resin; hydroquinone epoxy resin; trihydroxymethylpropane epoxy resin; linear aliphatic epoxy resin obtained by oxidizing olefinic bonds with peracids such as peracetic acid; aralkyl epoxy resin obtained by epoxidizing aralkyl phenol resins such as phenol aralkyl resins and naphthol aralkyl resins containing a biphenyl skeleton, etc. Furthermore, epoxides of silicone resins, epoxides of acrylic resins, etc. can also be listed as specific epoxy resins. These epoxy resins can be used alone or in combination of two or more.

As the specific epoxy resin, among the epoxy resins, bisphenol F type epoxy resins, stilbene type epoxy resins and sulfur-containing epoxy resins, which are epoxy resins having a bisphenol F skeleton, are preferred from the viewpoint of fluidity and reflow resistance, and novolac type epoxy resins are preferred from the viewpoint of curability, and from the viewpoint of low moisture absorption, novolac type epoxy resins are preferred. In terms of heat resistance and low warping, dicyclopentadiene type epoxy resins are preferred. In terms of flame retardancy, biphenyl type epoxy resins, which are epoxy resins having a biphenyl skeleton, and naphthol aralkyl type epoxy resins obtained by epoxidizing a naphthol aralkyl resin are preferred. The specific epoxy resin preferably contains at least one of bisphenol F type epoxy resin, stilbene type epoxy resin, sulfur atom-containing epoxy resin, novolac type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin and naphthol aralkyl type epoxy resin. As the specific epoxy resin, a resin with good flame retardancy is used, and from the viewpoint of improving high temperature storage characteristics, it is preferably halogen-free and antimony-free (that is, an epoxy resin containing neither halogen atoms nor antimony atoms is used).

The specific epoxy resin can be selected and used according to the purpose and production conditions, etc. For example, as the specific epoxy resin, a phenol aralkyl type epoxy resin containing a biphenyl skeleton, which is an epoxide of a phenol aralkyl resin containing a biphenyl skeleton, and a methoxynaphthalene type epoxy resin, which is an epoxy resin having a methoxynaphthalene skeleton, can be used alone or in combination.

The total content of bisphenol F type epoxy resin, stilbene type epoxy resin, sulfur atom-containing epoxy resin, novolac type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, biphenylene type epoxy resin and naphthol aralkyl type epoxy resin relative to the entire specific epoxy resin is preferably 20 mass % or more, more preferably 30 mass % or more, and further preferably 50 mass % or more.

From the perspective of balancing various properties such as formability, reflow resistance, and electrical reliability, the content of the specific epoxy resin as a whole is preferably 0.4 mass% to 28 mass%, and more preferably 1.1 mass% to 26 mass% in the epoxy resin composition. If the content of the specific epoxy resin in the epoxy resin composition is 28 mass% or less, the reflow resistance tends to be well maintained compared to a content of more than 28 mass%. In addition, if it is 0.4 mass% or more, the fluidity tends to be well maintained compared to a content of less than 0.4 mass%.

(B) Hardener The epoxy resin composition includes at least one hardener. The hardener may be one commonly used in the epoxy resin composition and is not particularly limited. Examples of the (B) hardener include phenol hardeners, amine hardeners, acid anhydride hardeners, polythiol hardeners, polyaminoamide hardeners, isocyanate hardeners, and blocked isocyanate hardeners. From the viewpoint of obtaining an epoxy resin composition that maintains fluidity and has excellent reflow resistance, the hardener is preferably a phenol hardener, an amine hardener, and an acid anhydride hardener, and more preferably a phenol hardener.

As phenol curing agents, for example, phenol resins and polyphenol compounds having two or more phenolic hydroxyl groups in one molecule can be cited. Specifically, polyphenol compounds such as resorcinol, o-catechin, bisphenol A, bisphenol F, substituted or unsubstituted diphenols, etc. can be cited; novolac-type phenol resins obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcinol, o-catechin, bisphenol A, bisphenol F, phenylphenol, aminophenol, etc., and naphthol compounds such as α-naphthol, β-naphthol, dihydroxynaphthalene, etc., with aldehyde compounds such as formaldehyde, acetaldehyde, and propionaldehyde under an acidic catalyst; and polyphenol resins synthesized from the phenolic compounds and dimethoxy-p-xylene, bis(methoxymethyl)biphenyl, etc. Arylalkyl phenol resins (phenol aralkyl resins, naphthol aralkyl resins, etc.); p-xylene-modified phenol resins; m-xylene-modified phenol resins; melamine-modified phenol resins; terpene-modified phenol resins; dicyclopentadiene-type phenol resins and dicyclopentadiene-type naphthol resins synthesized by copolymerization of the above-mentioned phenolic compounds with dicyclopentadiene; cyclopentadiene-modified phenol resins; polycyclic aromatic ring-modified phenol resins; biphenyl-type phenol resins; triphenylmethane-type phenol resins obtained by condensing or co-condensing the above-mentioned phenolic compounds with aromatic aldehyde compounds such as benzaldehyde and salicylic aldehyde under an acidic catalyst; phenol resins obtained by copolymerizing two or more of these, etc. These phenolic resins may be used alone or in combination of two or more.

The above-exemplified hardeners (i.e., novolac-type phenol resins, aralkyl-type phenol resins, p-xylene-modified phenol resins, m-xylene-modified phenol resins, melamine-modified phenol resins, terpene-modified phenol resins, dicyclopentadiene-type phenol resins, dicyclopentadiene-type naphthol resins, cyclopentadiene-modified phenol resins, polycyclic aromatic-modified phenol resins, biphenyl-type phenol resins, triphenylmethane-type phenol resins, and phenol resins obtained by copolymerizing two or more of these) may be used alone or in combination of two or more. The content of the above-exemplified hardeners (their total when two or more types are used) is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 80% by mass or more in the total amount of the hardener.

The functional group equivalent of the hardener is not particularly limited, but from the viewpoint of balance among formability, reflow resistance and electrical reliability, it is preferably 70 g/eq to 1000 g/eq, and more preferably 80 g/eq to 500 g/eq. The functional group equivalent refers to the value measured in accordance with JIS K0070:1992. In addition, the softening point or melting point of the hardener is not particularly limited, but from the viewpoint of formability and reflow resistance, it is preferably 40°C to 180°C, and from the viewpoint of operability during the preparation of the epoxy resin composition, it is more preferably 50°C to 130°C. The method for measuring the softening point or melting point of the hardener is the same as the method for measuring the softening point or melting point of the specific epoxy resin.

In the epoxy resin composition, the equivalent ratio of (A) the specific epoxy resin and (C) the specific glycidyl compound to (B) the hardener, i.e., the ratio of the number of functional groups in the hardener to the total number of epoxy groups and glycidyl groups in the specific epoxy resin and the specific glycidyl compound (the number of functional groups in the hardener/the total number of epoxy groups and glycidyl groups in the specific epoxy resin and the specific glycidyl compound) is not particularly limited. In order to reduce the amount of each unreacted component, it is preferably set in the range of 0.5 to 2.0, and more preferably in the range of 0.6 to 1.3. In order to obtain an epoxy resin composition with better formability, solder resistance, and reflow resistance, it is further preferably set to a range of 0.8 to 1.2. When the ratio is 0.5 or more, the epoxy resin composition is easily fully cured compared to a case of less than 0.5, and the heat resistance, moisture resistance, and electrical properties of the cured epoxy resin composition tend to be improved. On the other hand, when the ratio is 2.0 or less, the curing efficiency caused by the excess curing agent component and the electrical properties and moisture resistance of the package caused by a large amount of functional groups remaining in the cured product tend to be suppressed compared to a case of exceeding 2.0. In particular, when a phenol curing agent is used as the curing agent, by making the ratio 2.0 or less, there is a tendency to suppress a decrease in curing efficiency due to excess phenolic resin components and a decrease in electrical characteristics and moisture resistance of the package due to a large amount of phenolic hydroxyl groups remaining in the cured product, as compared to a case where the ratio exceeds 2.0.

(D) Curing Accelerator The epoxy resin composition may contain at least one (D) curing accelerator as needed in addition to the (A) specific epoxy resin, the (B) curing agent, and the (C) specific glycidyl compound. The curing accelerator is not particularly limited as long as it is a compound that accelerates the reaction between the (A) specific epoxy resin and the (B) curing agent. Examples of the (D) hardening accelerator include cycloamidine compounds such as 1,8-diaza-bicyclo (5.4.0) undecene-7, 1,5-diaza-bicyclo (4.3.0) nonene, and 5,6-dibutylamino-1,8-diaza-bicyclo (5.4.0) undecene-7; and adding maleic acid to the cycloamidine compound. Anhydrides, quinone compounds (e.g., 1,4-benzoquinone, 2,5-toluoquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone), diazoniumphenylmethane, phenolic resins, etc. polarized compounds; tertiary amines such as benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris(dimethylaminomethyl)phenol and their derivatives; imidazoles such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and their derivatives; phosphine compounds such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, tri(4-methylphenyl)phosphine, diphenylphosphine, phenylphosphine and the like; phosphorus compounds having intramolecular polarization obtained by adding maleic anhydride, the quinone compound, diazonophenylmethane, phenol resin and the like compounds having π bonds to the above phosphine compounds; tetraphenylborates such as tetraphenylphosphonium tetraphenylborate, triphenylphosphine tetraphenylborate, 2-ethyl-4-methylimidazole tetraphenylborate, N-methylporphyrinium tetraphenylborate and their derivatives, etc. These hardening accelerators may be used alone or in combination of two or more.

(D) The content of the curing accelerator is not particularly limited as long as it is an amount that can achieve a curing acceleration effect, but is preferably 0.005% by mass to 2% by mass in the epoxy resin composition, and more preferably 0.01% by mass to 0.5% by mass. When the content of the curing accelerator in the epoxy resin composition is 0.005% by mass or more, the curing property tends to be better in a shorter time compared to a case of less than 0.005% by mass, and when it is 2% by mass or less, the curing speed does not become too fast compared to a case of more than 2% by mass, so that a good molded product tends to be easily obtained.

(E) Inorganic filler The epoxy resin composition may contain at least one (E) inorganic filler as necessary in addition to the (A) specific epoxy resin, (B) hardener and (C) specific glycidyl compound. The inorganic filler may be used, for example, to reduce hygroscopicity and linear expansion coefficient, improve thermal conductivity and improve strength.

There is no particular limitation on the type of inorganic filler. Specifically, inorganic materials such as spherical silica (e.g., fused silica), crystalline silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, potassium titanium oxide, silicon carbide, silicon nitride, aluminum nitride, boron nitride, ceria, zirconium oxide, zirconite, forsterite, steatite, spinel, mullite, titanium oxide, talc, clay, and mica can be cited. Inorganic fillers with flame retardant effects can also be used. Examples of inorganic fillers having a flame retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as composite hydroxides of magnesium and zinc, zinc borate, zinc molybdate, etc. Examples of the shape of the inorganic filler include powder, spherical particles of powder, and fibers.

These inorganic fillers may be used alone or in combination of two or more. Among them, spherical silica is preferred from the viewpoint of filling property and reduction of linear expansion coefficient, and alumina is preferred from the viewpoint of high thermal conductivity. From the viewpoint of filling property and mold wear resistance, the shape of the inorganic filler is preferably spherical.

From the viewpoints of flame retardancy, formability, moisture absorption, reduction of linear expansion coefficient, improvement of strength and reflow resistance, the content of the inorganic filler in the epoxy resin composition is preferably 60% by mass or more, and from the viewpoint of flame retardancy, it is more preferably 60% by mass to 95% by mass, and further preferably 70% by mass to 90% by mass. When the content of the inorganic filler in the epoxy resin composition is 60% by mass or more, the flame retardancy and reflow resistance tend to be improved compared with the case of less than 60% by mass. When the content of the inorganic filler in the epoxy resin composition is 95% by mass or less, the fluidity tends to be improved compared with the case of more than 95% by mass, and the flame retardancy also tends to be improved.

The epoxy resin composition may contain various additives such as coupling agents, flame retardants, anion exchangers, mold release agents, colorants, and stress relievers as shown below, in addition to the above-mentioned components (A) specific epoxy resin, (B) hardener, and (C) specific glycidyl compound. In addition, the epoxy resin composition is not limited to the following additives, and various additives known in the art may be added as needed.

(F) Coupling agent In order to improve the adhesion between the resin component and the filler, the epoxy resin composition may also contain at least one coupling agent as needed. The coupling agent is not particularly limited as long as it is commonly used in epoxy resin compositions, and examples thereof include: silane compounds having at least one of a primary amine group, a secondary amine group, and a tertiary amine group, various silane compounds such as epoxysilane, butylsilane, alkylsilane, ureidosilane, and vinylsilane (for example, the silane coupling agent described below), titanium compounds (for example, the titanium ester coupling agent described below), aluminum chelates, aluminum/zirconium compounds, and the like. From the viewpoint of reflow resistance, it is preferred to use the silane compound as the coupling agent.

Specific examples of coupling agents include vinyl trichlorosilane, vinyl triethoxysilane, vinyl tri(β-methoxyethoxy)silane, γ-methacryloyloxypropyl trimethoxysilane, β-(3,4-epoxycyclohexyl)ethyl trimethoxysilane, γ-glycidyloxypropyl trimethoxysilane, γ-glycidyloxypropyl methyl dimethoxysilane, Methoxysilane, vinyl triacetyloxysilane, γ-butyl propyl trimethoxysilane, γ-aminopropyl trimethoxysilane, γ-aminopropyl methyl dimethoxysilane, γ-aminopropyl triethoxysilane, γ-aminopropyl methyl diethoxysilane, γ-anilinopropyl trimethoxysilane, γ-anilinopropyl triethoxysilane, γ-(N,N γ-(N,N-dimethyl)aminopropyl trimethoxysilane, γ-(N,N-diethyl)aminopropyl trimethoxysilane, γ-(N,N-dibutyl)aminopropyl trimethoxysilane, γ-(N-methyl)anilinopropyl trimethoxysilane, γ-(N-ethyl)anilinopropyl trimethoxysilane, γ-(N,N-dimethyl)aminopropyl triethoxysilane, γ-(N,N-diethyl)aminopropyl triethoxysilane, γ-(N,N-dibutyl)aminopropyl triethoxysilane, γ-(N-methyl)anilinopropyl triethoxysilane, γ-(N-ethyl)anilinopropyl triethoxysilane, γ-(N,N-dimethyl)aminopropyl methyldimethoxysilane, γ-(N,N-diethyl) Aminopropyl methyl dimethoxysilane, γ-(N,N-dibutyl)aminopropyl methyl dimethoxysilane, γ-(N-methyl)anilinopropyl methyl dimethoxysilane, γ-(N-ethyl)anilinopropyl methyl dimethoxysilane, N-(trimethoxysilylpropyl)ethylenediamine, N-(dimethoxymethylsilylisopropyl)ethylenediamine, methyl Silane coupling agents such as trimethoxysilane, dimethyldimethoxysilane, methyltriethoxysilane, γ-chloropropyltrimethoxysilane, hexamethyldisilane, vinyltrimethoxysilane, γ-butylpropylmethyldimethoxysilane; isopropyl triisostearyl titanium ester, isopropyl tri(dioctyl pyrophosphate) titanium ester, isopropyl tri(N-aminoethyl-amino) bis(dioctyl pyrophosphate) ethyl titanium ester, tetraoctyl bis(di-tridecyl phosphite) titanium ester, tetra(2,2-diallyloxymethyl-1-butyl)bis(di-tridecyl phosphite) titanium ester, bis(dioctyl pyrophosphate) oxyacetate titanium ester, bis(dioctyl pyrophosphate) ethyl titanium ester, isopropyl trioctyl titanium ester, isopropyl dimethyl acrylate Titanium ester coupling agents such as isostearyl titanium acrylate, isopropyl tri-dodecylbenzenesulfonyl titanium ester, isopropyl isostearyl titanium diacrylate, isopropyl tri(dioctyl phosphate) titanium ester, isopropyl tricumylphenyl titanium ester, and tetraisopropyl di(dioctyl phosphite) titanium ester may be used alone or in combination of two or more.

Among them, from the viewpoint of fluidity and flame retardancy, a silane coupling agent having a diamine group is preferred. The silane coupling agent having a diamine group is not particularly limited as long as it is a silane compound having a diamine group in the molecule. Specific examples thereof include: γ-anilinopropyl trimethoxysilane, γ-anilinopropyl triethoxysilane, γ-anilinopropyl methyl dimethoxysilane, γ-anilinopropyl methyl diethoxysilane, γ-anilinopropyl ethyl diethoxysilane, γ-anilinopropyl ethyl dimethoxysilane, γ-anilinomethyl trimethoxysilane, γ-anilinomethyl triethoxysilane, γ-anilinopropyl Methylmethyldimethoxysilane, γ-anilinomethylmethyldiethoxysilane, γ-anilinomethylethyldiethoxysilane, γ-anilinomethylethyldimethoxysilane, N-(p-methoxyphenyl)-γ-aminopropyltrimethoxysilane, N-(p-methoxyphenyl)-γ-aminopropyltriethoxysilane, N-(p-methoxyphenyl)-γ-aminopropylmethyldimethoxysilane, N-(p-methoxyphenyl)-γ-aminopropylmethyldiethoxysilane, N-(p-methoxyphenyl)-γ-aminopropyl ethyldiethoxysilane, N-(p-methoxyphenyl)-γ-aminopropylethyldimethoxysilane, γ-(N-methyl)aminopropyltrimethoxysilane, γ-(N-ethyl)aminopropyltrimethoxysilane, γ-(N-butyl)aminopropyltrimethoxysilane, γ-(N-benzyl)aminopropyltrimethoxysilane, γ-(N-methyl)aminopropyltriethoxysilane, γ-(N-ethyl)aminopropyltriethoxysilane, γ-(N-butyl)aminopropyltriethoxysilane, γ-(N- γ-(N-methyl)aminopropylmethyldimethoxysilane, γ-(N-ethyl)aminopropylmethyldimethoxysilane, γ-(N-butyl)aminopropylmethyldimethoxysilane, γ-(N-benzyl)aminopropylmethyldimethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, γ-(β-aminoethyl)aminopropyltrimethoxysilane, N-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltrimethoxysilane, etc.

The content of the coupling agent in the epoxy resin composition is preferably 0.037 mass % to 4.75 mass %, more preferably 0.05 mass % to 5 mass %, and further preferably 0.1 mass % to 2.5 mass %. When the content of the coupling agent in the epoxy resin composition is 0.037 mass % or more, the adhesion to the frame tends to be improved compared to a case of less than 0.037 mass %, and when the content of the coupling agent in the epoxy resin composition is 4.75 mass % or less, the moldability of the package tends to be improved compared to a case of more than 4.75 mass %.

In order to impart flame retardancy, at least one flame retardant may be formulated in the epoxy resin composition as needed. There are no particular restrictions on the flame retardant, and examples thereof include known organic or inorganic compounds containing halogen atoms, antimony atoms, nitrogen atoms, or phosphorus atoms, metal hydroxides, etc., and one of these may be used alone or in combination of two or more. The content of the flame retardant is not particularly limited as long as the flame retardant effect is achieved, and is preferably 1% to 30% by mass, and more preferably 2% to 15% by mass, relative to the specific epoxy resin (A).

At least one anion exchanger may be formulated in the epoxy resin composition as needed. In particular, since the epoxy resin composition is used as a sealing molding material, it is preferred to contain an anion exchanger from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of an electronic component device having a sealed element. There is no particular limitation on the anion exchanger, and previously known ones can be used. Specific examples include: hydrotalcites; hydrated oxides of elements selected from magnesium, aluminum, titanium, zirconium and bismuth, etc. Anion exchangers may be used alone or in combination of two or more. Among them, the anion exchanger is preferably a hydrotalcite represented by the following general formula (1).

Mg _1-X Al _X (OH) ₂ (CO ₃ ) _X/2 ･mH ₂ O （1） （In formula (1), 0＜X≦0.5, m is a positive number）

The content of the anion exchanger is not particularly limited as long as it is a sufficient amount to capture anions such as halogen anions, but is preferably 0.1% by mass to 30% by mass, more preferably 1% by mass to 5% by mass, based on the specific epoxy resin (A).

Furthermore, in the epoxy resin composition, mold release agents such as higher fatty acids, higher fatty acid metal salts, ester waxes, polyolefin waxes, polyethylene, polyethylene oxide, etc.; coloring agents such as carbon black; and stress relievers such as silicone oil and silicone rubber powder can be formulated as other additives as needed.

The epoxy resin composition can be prepared by any method as long as various raw materials can be dispersed and mixed. As a common method, the raw materials are fully mixed by a mixer, etc., and then mixed or melt-kneaded by a mixing roll, an extruder, a pestle, a planetary mixer, etc., followed by cooling, defoaming and pulverization as needed. In addition, it can be tableted to a size and weight that meets the molding conditions as needed.

<Electronic component device> The electronic component device of the embodiment of the present invention includes: a component; and a cured product of the epoxy resin composition that seals the component. As the electronic component device, there can be listed an electronic component device in which components (active components such as semiconductor chips, transistors, diodes, gates, etc., and passive components such as capacitors, resistors, and coils) are mounted on a support member such as a lead frame, a wired tape carrier, a wiring board, glass, a silicon wafer, or a mounting substrate, and the required parts are sealed using the epoxy resin composition.

Here, there is no particular limitation on the mounting substrate, and specific examples include: insert substrates such as organic substrates, organic films, ceramic substrates, and glass substrates, glass substrates for liquid crystals, substrates for multi-chip modules (MCM), and substrates for hybrid ICs.

As specific examples of electronic component devices, for example, semiconductor devices can be cited. More specifically, the following can be cited: a semiconductor chip or other components are arranged on a lead frame (island, tab), and the terminal portion of the component such as a bonding pad is connected to the lead portion by wire bonding, bumps, etc., and then the epoxy resin composition is used to seal the package by transfer molding, etc., a dual inline package (DIP), a plastic leaded chip carrier (PLCC), a quad flat package (QFP), a small outline package (SOP), a small outline J-lead package (SOJ), a thin small outline package (TSOP), a thin quad flat package (TSP), etc. Package (TQFP) and other resin sealed ICs; Tape Carrier Package (TCP) formed by sealing a semiconductor chip whose lead is bonded to a carrier with the epoxy resin composition; Chip On Board (COB), Chip On Glass (COG) and other semiconductor devices mounted with bare chips obtained by sealing a semiconductor chip connected to wiring formed on a wiring board or glass by wire bonding, flip chip bonding, soldering, etc. by the epoxy resin composition; Hybrid ICs and MCMs (Multi-Chip Modules) formed by sealing at least one of active components (semiconductor chips, transistors, diodes, gates, etc.) and passive components (capacitors, resistors, coils, etc.) connected to wiring formed on a wiring board or glass by wire bonding, flip chip bonding, soldering, etc. by the epoxy resin composition. Chip Module); a semiconductor chip is mounted on an interposer substrate having terminals for connecting to a motherboard, and the semiconductor chip is connected to wiring formed on the interposer substrate by bumps or wire bonding, and then the mounting side of the semiconductor chip is sealed with the epoxy resin composition to obtain a ball grid array (BAG), chip size package (CSP), MCP (Multi Chip Package), etc. In addition, these semiconductor devices can also be stacked (laminated) type packages in which two or more components are stacked on a mounting substrate, or batch module type packages in which two or more components are sealed at one time with an epoxy resin composition.

Furthermore, as a method for using the epoxy resin composition as a sealing material to obtain an electronic component device such as a semiconductor device with sealed components, the most common method is a low-pressure transfer molding method, and injection molding methods, compression molding methods, etc. can also be listed. As a method for obtaining an electronic component device such as a semiconductor device with sealed components, a dispensing method, a casting method, a printing method, etc. can also be used. [Example]

Hereinafter, the embodiments are specifically described by way of examples, but the scope of the embodiments is not limited to these examples. In addition, unless otherwise specified, "parts" and "%" are based on mass.

The following components were blended in the mass proportions shown in Tables 1 and 2, respectively, and melt-kneaded by an extruder at a kneading temperature of 135° C. to prepare epoxy resin compositions of Examples and Comparative Examples. In addition, blank columns in the tables indicate “not blended”.

As the (A) specific epoxy resin, the following were used: Epoxy resin 1: thiodiphenol type epoxy resin (manufactured by Nippon Steel & Sumitomo Metal Chemicals Co., Ltd., trade name: YSLV-120TE, epoxide equivalent: 245, softening point: 113°C) Epoxy resin 2: aralkyl type epoxy resin obtained by epoxidizing a phenol aralkyl resin having a biphenyl skeleton (manufactured by Nippon Kayaku Co., Ltd., trade name: CER-3000L, epoxide equivalent: 240, softening point: 96°C) Epoxy resin 3: biphenyl type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., trade name: YX-4000, epoxide equivalent: 196, melting point: 106°C).

As the (B) hardener, the following were used: Hardener 1: phenol aralkyl resin with a hydroxyl equivalent of 176 and a softening point of 70°C (manufactured by Mitsui Chemicals, Inc., trade name: MILEX XLC); Hardener 2: melamine-modified phenol resin with a hydroxyl equivalent of 120 and a softening point of 85°C (manufactured by Hitachi Chemical Co., Ltd., trade name: HPM-J3).

As (C) specific glycidyl compounds (compounds having a glycidyl group in their structure), the following were used: Liquid Resin 1: dicyclopentadienyl dimethanol diglycidyl ether (manufactured by ADEKA Co., Ltd., trade name: EP-4088L, epoxy equivalent: 165, melting point: 25°C or lower); Liquid Resin 2: rubber cross-linked bisphenol type epoxy resin (manufactured by ADEKA Co., Ltd., trade name: EPR-4030, epoxy equivalent: 365, melting point: 25°C or lower); Liquid Resin 3: chelate modified epoxy resin (manufactured by ADEKA Co., Ltd., trade name: EP-49-10N, epoxy equivalent: 220, melting point: 25°C or lower).

As the (D) hardening accelerator, hardening accelerator 1: an addition reaction product of triphenylphosphine and benzoquinone; hardening accelerator 2: a mixture of tri-p-tolylphosphine and p-benzoquinone were used.

As the (E) inorganic filler, fused silica: spherical fused silica having a volume average particle size of 18 μm and a specific surface area of 1.5 m ² /g was used.

As the coupling agent (F), the following were used: Coupling agent 1: γ-phenylpropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM-803); Coupling agent 2: N-phenyl-γ-aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM-573); Coupling agent 3: methyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM-13).

In addition, various additives used include: Coloring agent: Carbon black (manufactured by Mitsubishi Chemical Co., Ltd., trade name: MA100); Mold release agent: Dioctadecanoic acid ester (manufactured by Clariant Japan Co., Ltd., trade name: HW-E); Additives: Magnesium, aluminum, hydroxide, carbonate, hydrate (anion exchanger, hydrotalcite, manufactured by Sakai Chemical Industry Co., Ltd., trade name: HT-P).

The epoxy resin compositions of the examples and comparative examples were evaluated by various property tests (1) to (5) below. The evaluation results are summarized in Tables 1 and 2 below. The epoxy resin compositions were molded by a transfer molding machine at a mold temperature of 180°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds unless otherwise specified. In addition, post-curing was performed at 175°C for 6 hours as needed.

(1) Spiral Flow Using a spiral flow measurement mold in accordance with EMMI-1-66, the epoxy resin composition was molded under the above conditions and the flow distance (cm) was determined.

(2) Hot hardness The epoxy resin composition was formed into a circular plate with a diameter of 50 mm and a thickness of 3 mm under the above conditions. Immediately after forming, the hot hardness was measured using a Shore D-type hardness tester (manufactured by Ueshima Manufacturing Co., Ltd., product number: HD-1120 (Model D)).

(3) Flexural modulus at 260°C (high temperature bending test) The epoxy resin composition was molded into a size of 10 mm × 70 mm × 3 mm under the above conditions and post-cured to prepare a test piece. The obtained test piece was subjected to a three-point bending test in accordance with JIS K6911:2006 using a bending tester (manufactured by A&D Co., Ltd., product name: Tensilon) while being maintained at 260°C in a constant temperature bath. The flexural modulus (MPa) at 260°C was determined by the following formula. In the following formula, "E" represents the bending elastic coefficient (Pa), "ΔP" represents the value of the load unit (N), "Δy" represents the displacement (mm), "l" represents the span (=48 mm), "w" represents the width of the test piece (=10 mm), and "h" represents the thickness of the test piece (=3 mm).

[Number 1]

(4) Adhesion test A palladium-plated copper plate was placed in a mold with a 9 mm × 9 mm slit, in which an epoxy resin composition was formed under the above conditions into a size of 4 mm in diameter on the bottom surface, 3 mm in diameter on the top surface, and 4 mm in height. After post-hardening, the shear adhesion (MPa) was measured at room temperature (25°C) and a shear rate of 50 μm/s using an adhesive strength tester (Series 4000 manufactured by Nordson Advanced Technology Co., Ltd.).

(5) Reflow resistance For 20 mm × 14 mm × 2 mm 80-pin flat packages (quad flat packages (QFP)) with 8 mm × 10 mm × 0.4 mm silicon chips (lead frame material: copper alloy, silver-plated products on the upper surface of the die pad and the tip of the leads ("Cu-Ag" in the table), and palladium-plated products ("PPF" in the table)), the epoxy resin composition was used for molding and post-hardening under the above conditions. After baking at 25°C for 24 hours, humidifying at 60°C and 60% RH for 40 hours, reflow treatment was performed three times at 260°C for 30 seconds. The interface between the resin and the frame was observed using an ultrasonic flaw detector to see if there was any peeling. The reflow resistance was evaluated by the number of packages that peeled relative to the number of test packages (20).

[Table 1]

[Table 2]

As is clear from Tables 1 and 2, the comparative example not containing the specific glycidyl compound (C) has poor reflow resistance. On the other hand, Examples 1 to 7 containing the specific glycidyl compound (C) have superior reflow resistance compared with the comparative example. The reason is not clear, but it is presumed to be due to the effect of reducing the elastic modulus and improving the adhesive force as described above. From the results of Examples 1 to 3 and the comparative example, it is known that the polycyclic aromatic compound having a dicyclopentadiene structure has superior reflow resistance. According to the results of Examples 4 to 7 and the comparative example, it can be seen that compared with Example 4 and Example 5 in which the ratio of the liquid resin 1 to the entire epoxy composition is 1 mass % or less, Example 6 and Example 7 in which the ratio of the liquid resin 1 to the entire epoxy composition is 1 mass % or more have better reflow resistance.

The disclosure of Japanese Patent Application No. 2017-072889 filed on March 31, 2017 is hereby incorporated by reference in its entirety into this specification. All documents, patent applications, and technical specifications described in this specification are hereby incorporated by reference to the same extent as if each document, patent application, and technical specification were specifically and individually described.

Claims (10)

An epoxy resin composition, comprising: an epoxy resin having a melting point or softening point exceeding 40°C, a hardener having a melting point or softening point of 40°C to 180°C, and a compound having a glycidyl group and a melting point below 40°C, wherein the compound having a glycidyl group and a melting point below 40°C includes at least one selected from the group consisting of a compound having a dicyclopentadiene skeleton, a rubber cross-linked bisphenol-type epoxy resin, and a chelate-modified epoxy resin, and the epoxy resin composition is solid at 25°C and 1 atmosphere. The epoxy resin composition as described in item 1 of the patent application, wherein the compound having a glycidyl group and a melting point below 40°C has a dicyclopentadiene skeleton. An epoxy resin composition as described in item 1 or 2 of the patent application, wherein the content of the compound having a glycidyl group and a melting point of 40°C or less is 5% by mass or more and less than 45% by mass relative to the epoxy resin. The epoxy resin composition described in item 1 or 2 of the patent application further contains a hardening accelerator. The epoxy resin composition described in item 1 or 2 of the patent application further contains an inorganic filler. The epoxy resin composition described in item 1 or 2 of the patent application further contains a silane compound. The epoxy resin composition as described in item 1 or 2 of the patent application, wherein the melting point or softening point of the epoxy resin is 80°C to 130°C. The epoxy resin composition as described in item 1 or 2 of the patent application, wherein the epoxy equivalent of the compound having a glycidyl group and a melting point below 40°C is 165g/eq~365g/eq. An epoxy resin composition as described in item 1 or 2 of the patent application, wherein the content of the compound having a glycidyl group and a melting point of 40°C or less is 20% by mass or more and less than 45% by mass relative to the epoxy resin. An electronic component device, comprising: a component; and a cured product of an epoxy resin composition as described in any one of items 1 to 9 of the patent application scope for sealing the component.