TWI854607B - Wafer processing device, semiconductor chip manufacturing method and semiconductor chip - Google Patents

Abstract

The wafer processing device of the present invention comprises: a wafer handling part, which takes out a wafer from a wafer box part or puts a wafer into a wafer box part; a cutting part, which cuts a wafer; and a wafer processing part, which performs processing different from cutting on the wafer. The wafer handling part is arranged in a manner of being located between the cutting part and the wafer processing part.

Description

Wafer processing device, semiconductor chip manufacturing method and semiconductor chip

The present invention relates to a wafer processing device, a method for manufacturing a semiconductor chip and a semiconductor chip, and more particularly to a wafer processing device having a cutting section for cutting wafers, a method for manufacturing a semiconductor chip and a semiconductor chip.

Previously, a wafer processing device having a cutting unit for cutting wafers is known, and such a wafer processing device is disclosed in Japanese Patent Laid-Open No. 2007-173587, for example.

The Japanese Patent Publication No. 2007-173587 discloses a cutting device (wafer processing device) which includes: a wafer box for accommodating wafers; an elevator for taking out wafers from the wafer box or putting wafers into the wafer box; a laser cutting unit for cutting wafers; an expansion unit for expanding the wafer sheet after cutting; and a transport device for transporting wafers from the elevator to the laser cutting unit and from the laser cutting unit to the expansion unit. In the cutting device, the wafer box accommodating wafers, the laser cutting unit and the expansion unit are arranged in sequence, and the wafers taken out from the wafer box are transported to the laser cutting unit and the expansion unit in sequence by the transport device for processing.

However, in the cutting device of the Japanese Patent Publication No. 2007-173587, a wafer box containing wafers, a laser cutting unit and an expansion unit are arranged in sequence, and the wafer taken out from the wafer box is sequentially transported to the laser cutting unit and the expansion unit by a transport device for processing. Therefore, even if the wafer is only processed by cutting or only expanded, the wafer needs to be taken out from the wafer box and sequentially transported to the cutting unit and the expansion unit. Therefore, it is difficult to efficiently process the wafer in order to transport the wafer to the processing unit that does not need to carry out processing. Therefore, a wafer processing device that can efficiently process the wafer even if only a part of a plurality of processing is carried out is desired.

The present invention is obtained through research to solve the above-mentioned problems. One purpose of the present invention is to provide a wafer processing device, a method for manufacturing a semiconductor chip, and a semiconductor chip that can efficiently process a wafer when only a part of a plurality of processing steps is performed.

The wafer processing device of the first aspect of the present invention comprises: a wafer box part, which accommodates wafers; a wafer placement part, which takes out wafers from the wafer box part or puts wafers into the wafer box part; a cutting part, which cuts wafers; and a wafer processing part, which performs processing on the wafer that is different from cutting; and the wafer placement part is configured in a manner of being located between the cutting part and the wafer processing part.

In the wafer processing device of the first aspect of the present invention, as described above, the wafer placement section is configured in a manner of being located between the cutting section and the wafer processing section. Thereby, the wafer can be directly supplied from the wafer box section to one of the cutting section and the wafer processing section without passing through the other of the cutting section and the wafer processing section, so that when a part of the processing is performed, the processing can be performed independently. As a result, even when only a part of the processing is performed among a plurality of processings, the processing of the wafer can be performed efficiently. In addition, when the processing performed by the cutting section and the wafer processing section is performed continuously, a plurality of processings can be performed by moving the wafer between the cutting section and the wafer processing section.

In the wafer processing device of the first aspect, it is preferred that: a wafer transport unit is further provided, which receives the wafer from the wafer placement unit and transports the wafer to the cutting unit or the wafer processing unit. If so configured, the wafer can be easily transported between the wafer placement unit, the cutting unit and the wafer processing unit by the wafer transport unit.

In this case, it is preferable that the wafer handover position of the cutting section, the wafer handover position of the wafer processing section, and the wafer handover position from the wafer placement section to the wafer transport section are arranged in a straight line, and the wafer transport section is constructed in a manner that can move in a straight line along the direction in which the wafer placement section, the cutting section, and the wafer processing section are arranged. If so constructed, the wafer can be transported between the wafer handover position of the cutting section, the wafer processing section, and the wafer handover position from the wafer placement section to the wafer transport section by a straight-line transfer axis, thereby suppressing the complexity of the structure for transporting wafers. In addition, the wafer can be easily and directly transported between the cutting section and the wafer processing section by the wafer transport section.

In the configuration of the wafer conveying unit, it is preferred that the wafer conveying unit is configured to convey a wafer ring structure including a sheet member and a ring member between the wafer placement unit, the cutting unit, and the wafer processing unit, wherein the sheet member is attached with a wafer and has elasticity, and the ring member is attached to the sheet member in a state of surrounding the wafer. If configured in this way, even if the wafers are of different sizes, the shape of the ring member is made common, and wafers of different sizes can be easily conveyed between the cutting unit and the wafer processing unit by the wafer conveying unit.

In the wafer processing device of the first aspect, it is preferred that the wafer processing section includes an expansion section for stretching a sheet member on which a wafer is disposed to split the wafer, or a grinding section for grinding the wafer. If so configured, the wafer can be cut and expanded, or ground and cut, individually or continuously.

In the wafer processing device of the first aspect, it is preferred that the wafer box and the wafer handling part are arranged in a direction orthogonal to the direction in which the wafer handling part, the cutting part and the wafer processing part are arranged. If so configured, when the wafer moves to the cutting part and the wafer processing part, the wafer box can be prevented from interfering with the moving wafer.

In the configuration of the wafer processing section including the expansion section or the polishing section, it is preferred that the wafer cooling section and the wafer heating section as the expansion section of the wafer processing section are arranged in a direction orthogonal to the direction in which the wafer handling section, the cutting section and the wafer processing section are arranged. If so configured, when the wafer moves to the cutting section and the wafer processing section, it is possible to prevent the components of the wafer heating section from interfering with the moving wafer.

In this case, it is preferred that the expansion section includes a wafer moving section that holds the wafer and moves the wafer between the wafer cooling section and the wafer heating section. If so configured, the wafer that has been transported to the expansion section can be easily moved independently between the wafer cooling section and the wafer heating section in the expansion section by the wafer moving section.

In the configuration in which the wafer cooling part and the wafer heating part of the expansion part are arranged in a direction orthogonal to the direction in which the wafer handling part, the cutting part and the wafer processing part are arranged, it is preferred that: the wafer box part is arranged on one side of the front-back direction relative to the wafer handling part, the wafer handling part is arranged on the other side of the front-back direction of the wafer box part, the wafer cooling part of the expansion part is arranged on the lateral side of the wafer handling part, and the wafer heating part of the expansion part is arranged on one side of the front-back direction of the wafer cooling part. If configured in this way, the wafer box part, the wafer handling part, the wafer cooling part and the wafer heating part of the expansion part can be compactly arranged along the moving path of the wafer.

The wafer box is arranged on one side of the front-to-back direction relative to the wafer placement part, the wafer placement part is arranged on the other side of the front-to-back direction of the wafer box, the wafer cooling part of the expansion part is arranged on the lateral side of the wafer placement part, and the wafer heating part of the expansion part is arranged on one side of the front-to-back direction of the wafer cooling part. It is preferred that the wafer box, the wafer placement part, the wafer cooling part of the expansion part and the wafer heating part are arranged in a rectangular shape. If so configured, compared with the case where the wafer box, the wafer placement part, the wafer cooling part of the expansion part and the wafer heating part are arranged in a straight line along a specified direction, the area of the maintenance space set up around the device can be reduced, thereby suppressing the increase in the area used to set up the wafer processing device.

The wafer box is arranged on one side of the wafer placement part in the front-to-back direction, the wafer placement part is arranged on the other side of the wafer box in the front-to-back direction, the wafer cooling part with an expansion part is arranged on the lateral side of the wafer placement part, and the wafer heating part with an expansion part is arranged on one side of the wafer cooling part in the front-to-back direction. It is preferred that a pressure-applying part for breaking the divided wafer is further provided, and the pressure-applying part is arranged at a position overlapping with the wafer heating part in the front-to-back direction. If so, the size of the expansion part in the front-to-back direction can be reduced compared with the case where the pressure-applying part is arranged at a position not overlapping with the wafer heating part.

The wafer box is arranged on one side of the wafer placement part in the front-to-back direction, the wafer placement part is arranged on the other side of the wafer box in the front-to-back direction, a wafer cooling part with an extension part is arranged on the lateral side of the wafer placement part, and a wafer heating part with an extension part is arranged on one side of the wafer cooling part in the front-to-back direction. It is preferred that: a pressure-applying part for breaking the divided wafer is further provided, and the pressure-applying part is arranged between the wafer cooling part and the wafer heating part in the front-to-back direction. If so, after cooling the wafer in the wafer cooling part, the wafer can be moved to the pressure-applying part and the wafer heating part in sequence while being broken and heated in sequence.

The wafer box is arranged on one side of the wafer placement part in the front-to-back direction, the wafer placement part is arranged on the other side of the wafer box in the front-to-back direction, the wafer cooling part of the expansion part is arranged on the lateral side of the wafer placement part, and the wafer heating part of the expansion part is arranged on one side of the wafer cooling part in the front-to-back direction. It is preferred that: an ultraviolet irradiation part is further provided, the ultraviolet irradiation part irradiates ultraviolet rays to the sheet member to which the wafer is attached, and the ultraviolet irradiation part is arranged at a position overlapping with the wafer heating part in the front-to-back direction. If so constituted, the size of the expansion part in the front-to-back direction can be reduced compared with the case where the ultraviolet irradiation part is arranged at a position not overlapping with the wafer heating part.

The manufacturing method of the semiconductor chip of the second aspect of the present invention includes the following steps: taking out the wafer from the wafer box part that accommodates the wafer by a wafer handling part, or putting the wafer into the wafer box part; cutting by a cutting part to divide the wafer into a plurality of semiconductor chips; and performing processing on the wafer different from cutting by a wafer processing part; and the wafer handling part is configured in a manner of being located between the cutting part and the wafer processing part.

In the manufacturing method of the semiconductor chip of the second aspect of the present invention, as described above, the wafer placement part is configured in a manner of being located between the cutting part and the wafer processing part. Thereby, the wafer can be directly supplied from the wafer box part to one of the cutting part and the wafer processing part without passing through the other of the cutting part and the wafer processing part, so that when a part of the processing is performed, the processing can be performed independently. As a result, a manufacturing method of a semiconductor chip can be provided, which can efficiently perform the processing of the wafer even when only a part of the processing is performed among a plurality of processing. In addition, when the processing performed by the cutting part and the wafer processing part is performed continuously, a plurality of processing can be performed by moving the wafer between the cutting part and the wafer processing part.

The semiconductor chip of the third aspect of the present invention is manufactured by a wafer processing device, which includes: a wafer box part, which accommodates wafers; a wafer placement part, which takes out wafers from the wafer box part or puts wafers into the wafer box part; a cutting part, which cuts wafers; and a wafer processing part, which performs processing on the wafer that is different from cutting; and the wafer placement part is configured in a manner of being located between the cutting part and the wafer processing part.

In the semiconductor chip of the third aspect of the present invention, as described above, the wafer placement section is configured in a manner of being located between the cutting section and the wafer processing section. Thereby, the wafer can be directly supplied from the wafer box section to one of the cutting section and the wafer processing section without passing through the other of the cutting section and the wafer processing section, so that when a part of the processing is performed, the processing can be performed independently. As a result, a semiconductor chip can be provided that can efficiently perform the processing of the wafer even when only a part of the processing is performed among a plurality of processings. In addition, when the processing performed by the cutting section and the wafer processing section is performed continuously, a plurality of processings can be performed by moving the wafer between the cutting section and the wafer processing section.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[First embodiment] Referring to FIGS. 1 to 14 , the structure of the semiconductor wafer processing device 100 of the first embodiment of the present invention is described. The semiconductor wafer processing device 100 is an example of a "wafer processing device" within the scope of the patent application.

(Semiconductor wafer processing device) As shown in FIG. 1 , the semiconductor wafer processing device 100 is a device for processing a wafer W1 disposed in a wafer ring structure W. The semiconductor wafer processing device 100 is configured to form a modified layer on the wafer W1 and to divide the wafer W1 along the modified layer to form a plurality of semiconductor chips Ch (see FIG. 8 ).

Here, the wafer ring structure W is described with reference to Fig. 2 and Fig. 3. The wafer ring structure W includes a wafer W1, a sheet member W2, and a ring member W3.

Wafer W1 is a circular thin plate formed by crystals of a semiconductor substance that is a material for a semiconductor integrated circuit. Inside the wafer W1, a modified layer is formed along a dividing line by processing in a semiconductor wafer processing device 100 to modify the inside. That is, wafer W1 will be processed so that it can be divided along the dividing line. The sheet member W2 is an adhesive tape with stretchability. An adhesive layer is provided on the upper surface W21 of the sheet member W2. Wafer W1 is attached to the adhesive layer of the sheet member W2. The annular member W3 is a metal frame that is annular in a plan view. The annular member W3 is attached to the adhesive layer of the sheet member W2 in a state of surrounding the wafer W1.

Furthermore, the semiconductor wafer processing device 100 includes a cutting device 1 and an expanding device 2. Hereinafter, the up-down direction is set as the Z direction, the up direction is set as the Z1 direction, and the down direction is set as the Z2 direction. The direction in which the cutting device 1 and the expanding device 2 are arranged in the horizontal direction orthogonal to the Z direction is set as the X direction, the expanding device 2 side in the X direction is set as the X1 direction, and the cutting device 1 side in the X direction is set as the X2 direction. The direction in the horizontal direction orthogonal to the X direction is set as the Y direction, one side in the Y direction is set as the Y1 direction, and the other side in the Y direction is set as the Y2 direction.

(Cutting device) As shown in FIG. 1, FIG. 4 and FIG. 5, the cutting device 1 is configured to form a modified layer by irradiating a laser having a wavelength having transparency to the wafer W1 along the dividing line (cutting road). The so-called modified layer refers to cracks and pores formed inside the wafer W1 by the laser. Furthermore, the cutting device 1 is an example of a "cutting part" in the scope of the patent application.

Specifically, the cutting device 1 includes a base 11 , a chuck table portion 12 , a laser portion 13 and an imaging portion 14 .

The base 11 is a base for installing the chuck worktable 12. The base 11 has a rectangular shape in a top view.

<Chuck worktable> The chuck worktable 12 has an adsorption portion 12a, a clamping portion 12b, a rotating mechanism 12c, and a worktable moving mechanism 12d. The adsorption portion 12a is configured to adsorb the wafer ring structure W on the upper surface on the Z1 direction side. The adsorption portion 12a is a worktable provided with suction holes and suction pipes, etc., to adsorb the lower surface of the annular component W3 of the wafer ring structure W on the Z2 direction side. The adsorption portion 12a is supported on the worktable moving mechanism 12d via the rotating mechanism 12c. The clamping portion 12b is provided at the upper end of the adsorption portion 12a. The clamping portion 12b is configured to press the wafer ring structure W adsorbed by the adsorption portion 12a. The clamping part 12b presses the annular component W3 of the wafer ring structure W adsorbed by the adsorption part 12a from the Z1 direction. In this way, the wafer ring structure W is held by the adsorption part 12a and the clamping part 12b.

The rotating mechanism 12c is configured to rotate the adsorption portion 12a in a circumferential direction around a rotation center axis C extending parallel to the Z direction. The rotating mechanism 12c is mounted on the upper end of the worktable moving mechanism 12d. The worktable moving mechanism 12d is configured to move the wafer ring structure W in the X direction and the Y direction. The worktable moving mechanism 12d has an X-direction moving mechanism 121 and a Y-direction moving mechanism 122. The X-direction moving mechanism 121 is configured to move the rotating mechanism 12c in the X1 direction or the X2 direction. The X-direction moving mechanism 121 includes, for example, a driving portion having a linear conveyor module, or a motor with a ball screw and an encoder. The Y-direction moving mechanism 122 is configured to move the rotating mechanism 12c in the Y1 direction or the Y2 direction. The Y-direction moving mechanism 122 includes, for example, a driving portion having a linear conveyor module or a motor with a ball screw and an encoder.

<Laser section> The laser section 13 is configured to irradiate laser light to the wafer W1 of the wafer ring structure W held on the chuck table section 12. The laser section 13 is arranged on the Z1 direction side of the chuck table section 12. The laser section 13 has a laser irradiation section 13a, a mounting member 13b, and a Z-direction moving mechanism 13c. The laser irradiation section 13a is configured to irradiate pulsed laser light. The mounting member 13b is a frame for mounting the laser section 13 and the camera section 14. The Z-direction moving mechanism 13c is configured to move the laser section 13 in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 13c includes, for example, a driving section having a linear conveyor module or a motor with a ball screw and an encoder. Furthermore, the laser irradiation section 13a may also be a laser irradiation section that oscillates continuous wave laser light other than pulse laser light as laser light, as long as it can form a modified layer realized by multiphoton absorption.

<Image capture unit> The image capture unit 14 is configured to capture the wafer W1 of the wafer ring structure W held on the chuck table 12. The image capture unit 14 is disposed on the Z1 direction side of the chuck table 12. The image capture unit 14 has a high-resolution camera 14a, a wide-angle camera 14b, a Z-direction moving mechanism 14c, and a Z-direction moving mechanism 14d.

The high-resolution camera 14a and the wide-angle camera 14b are cameras for near-infrared photography. The field of view of the high-resolution camera 14a is narrower than that of the wide-angle camera 14b. The resolution of the high-resolution camera 14a is higher than that of the wide-angle camera 14b. The field of view of the wide-angle camera 14b is wider than that of the high-resolution camera 14a. The resolution of the wide-angle camera 14b is lower than that of the high-resolution camera 14a. The high-resolution camera 14a is arranged on the X1 direction side of the laser irradiation section 13a. The wide-angle camera 14b is arranged on the X2 direction side of the laser irradiation section 13a. In this way, the high-resolution camera 14a, the laser irradiation section 13a, and the wide-angle camera 14b are arranged adjacent to each other in sequence from the X1 direction side to the X2 direction side.

The Z-direction moving mechanism 14c is configured to move the high-resolution camera 14a in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 14c includes, for example, a linear conveyor module or a driving part of a motor with a ball screw and an encoder. The Z-direction moving mechanism 14d is configured to move the wide-angle camera 14b in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 14d includes, for example, a linear conveyor module or a driving part of a motor with a ball screw and an encoder.

(Expansion device) As shown in FIG. 1, FIG. 6 and FIG. 7, the expansion device 2 is configured to divide the wafer W1 to form a plurality of semiconductor chips Ch (see FIG. 8). Furthermore, the expansion device 2 is configured to form a sufficient gap between the plurality of semiconductor chips Ch. Here, a modified layer is formed on the wafer W1 by irradiating the wafer W1 with a laser having a wavelength having a transmittance along the dividing line (cutting road) in the cutting device 1. In the expansion device 2, a plurality of semiconductor chips Ch are formed by dividing the wafer W1 along the modified layer that has been pre-formed in the cutting device 1.

Therefore, in the expansion device 2, the wafer W1 is divided along the reformed layer by expanding the sheet member W2. Also, in the expansion device 2, the gap between the plurality of semiconductor chips Ch formed by division is enlarged by expanding the sheet member W2.

The expansion device 2 includes an expansion body 200, a base 201, a wafer box 202, a lifting hand 203, a suction hand 204, a base 205, a cold air supply part 206, a cooling unit 207, an expansion part 208, a base 209, an expansion holding member 210, a heat shrinking part 211, an ultraviolet irradiation part 212, a pressure applying part 213 and a clamping part 214. The expansion body 200 performs a process of stretching a sheet member W2 on which a wafer W1 is arranged to split the wafer W1. Furthermore, the expansion body 200 is an example of a "wafer processing part" and an "expansion part" in the scope of the patent application.

<Base> The base 201 is a base for installing the wafer box part 202 and the lifting hand part 203. The base 201 has a rectangular shape when viewed from above.

<Wafer box section> The wafer box section 202 accommodates the wafer W1 (wafer ring structure W). The wafer box section 202 is configured to accommodate a plurality of wafer ring structures W. The wafer box section 202 includes a wafer box 202a, a Z-direction moving mechanism 202b, and a pair of loading sections 202c.

There are multiple (3) wafer boxes 202a arranged in the Z direction. The wafer box 202a has a storage space that can accommodate multiple (5) wafer ring structures W. The wafer ring structure W is supplied and placed on the wafer box 202a manually. Furthermore, the wafer box 202a can also accommodate 1 to 4 wafer ring structures W, or more than 6 wafer ring structures W. In addition, the wafer box 202a can also be arranged in the Z direction with 1, 2 or more than 4.

The Z-direction moving mechanism 202b is configured to move the wafer box 202a in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 202b includes, for example, a driving unit having a linear conveyor module or a motor with a ball screw and an encoder. In addition, the Z-direction moving mechanism 202b has a mounting table 202d that supports the wafer box 202a from the bottom. The mounting table 202d is configured in plurality (3) according to the positions of the plurality of wafer boxes 202a.

A plurality of (5) pairs of loading parts 202c are arranged inside the wafer box 202a. The annular member W3 of the wafer ring structure W is loaded on the pair of loading parts 202c from the Z1 direction side. One of the pair of loading parts 202c protrudes from the inner side surface of the X1 direction side of the wafer box 202a to the X2 direction side. The other of the pair of loading parts 202c protrudes from the inner side surface of the X2 direction side of the wafer box 202a to the X1 direction side.

<Lifting Hand> The lifting hand 203 takes out the wafer W1 (wafer ring structure W) from the wafer box 202, or puts the wafer W1 (wafer ring structure W) into the wafer box 202. The lifting hand 203 is configured to take out the wafer ring structure W from the wafer box 202. In addition, the lifting hand 203 is configured to accommodate the wafer ring structure W in the wafer box 202. Furthermore, the lifting hand 203 is an example of a "wafer pick-up and placement unit" in the scope of the patent application.

Specifically, the lifting hand 203 includes a Y-direction moving mechanism 203a and a lifting hand 203b. The Y-direction moving mechanism 203a includes, for example, a driving part having a linear conveyor module or a motor with a ball screw and an encoder. The lifting hand 203b is configured to support the annular member W3 of the wafer ring structure W from the Z2 direction side.

<Suction Hand> The suction hand 204 is configured to suction the annular member W3 of the wafer ring structure W from the Z1 direction side. Furthermore, the suction hand 204 is an example of a "wafer transfer unit" in the scope of the patent application.

The suction hand 204 receives the wafer W1 (wafer ring structure W) from the lifting hand 203 and transports the wafer W1 to the extended main body 200. Specifically, the suction hand 204 includes an X-direction moving mechanism 204a, a Z-direction moving mechanism 204b, and a suction hand 204c. The X-direction moving mechanism 204a is configured to move the suction hand 204c in the X-direction. The Z-direction moving mechanism 204b is configured to move the suction hand 204c in the Z-direction. The X-direction moving mechanism 204a and the Z-direction moving mechanism 204b, for example, include a driving part having a linear conveyor module or a motor with a ball screw and an encoder. The suction hand 204c is configured to suck and support the ring-shaped member W3 of the wafer ring structure W from the Z1 direction side. Here, the suction hand 204c supports the ring-shaped member W3 of the wafer ring structure W by generating a negative pressure.

<Base> As shown in FIG. 7 and FIG. 8 , the base 205 is a base for installing the expansion body 200, the expansion part 208, the cooling unit 207, the ultraviolet irradiation part 212, and the pressure applying part 213. The base 205 has a rectangular shape when viewed from above. In FIG. 8 , the clamping part 214 disposed at the position of the cooling unit 207 in the Z1 direction is indicated by a dotted line.

<Cold air supply section> The cold air supply section 206 is configured to supply cold air to the sheet member W2 from the Z1 direction when the sheet member W2 is expanded by the expansion section 208.

Specifically, the cold air supply unit 206 has a supply unit body 206a, a cold air supply port 206b, and a moving mechanism 206c. The cold air supply port 206b is configured so that the cold air supplied from the cold air supply device flows out. The cold air supply port 206b is provided at the end of the supply unit body 206a on the Z2 direction side. The cold air supply port 206b is arranged at the center of the end of the supply unit body 206a on the Z2 direction side. The moving mechanism 206c has, for example, a linear conveyor module, or a motor with a ball screw and an encoder.

The cold air supply device is a device for generating cold air. The cold air supply device supplies air cooled by a heat pump, for example. Such a cold air supply device is installed on the base 205. The cold air supply part 206 is connected to the cold air supply device by a hose (not shown).

<Cooling unit> The cooling unit 207 is configured to cool the sheet-shaped member W2 from the Z2 direction. Furthermore, the cooling unit 207 is an example of a "wafer cooling unit" in the scope of the patent application.

The cooling unit 207 is disposed at the wafer cooling position P4 of the extended body 200. Furthermore, the wafer cooling position P4 is located on the Y2 direction side of the extended body 200. The cooling unit 207 includes a cooling member 207a having a cooling body 271 and a Peltier element 272, and a Z-direction moving mechanism 207b. The cooling body 271 is composed of a member having a large heat capacity and a high thermal conductivity. The cooling body 271 is formed of a metal such as aluminum. The Peltier element 272 is configured in a manner to cool the cooling body 271. Furthermore, the cooling body 271 is not limited to aluminum, and may also be other members having a large heat capacity and a high thermal conductivity. The Z-direction moving mechanism 207b is a cylinder.

The cooling unit 207 is configured to be movable in the Z1 direction or the Z2 direction by the Z-direction moving mechanism 207b. Thus, the cooling unit 207 can be moved to a position in contact with the sheet member W2 or a position separated from the sheet member W2.

<Expanding section> The expanding section 208 is formed by expanding the sheet-shaped member W2 of the wafer ring structure W to divide the wafer W1 along the dividing line.

The expansion section 208 is disposed at the wafer heating position P5 of the expansion body 200. Furthermore, the wafer heating position P5 is located on the Y1 direction side of the expansion body 200. The expansion section 208 has an expansion ring 281. The expansion ring 281 is configured to expand (expand) the sheet member W2 by supporting the sheet member W2 from the Z2 direction side. The expansion ring 281 has a ring shape when viewed from above. Furthermore, the structure of the expansion ring 281 will be described in detail later.

<Base> The base 209 is a base material for installing the cooling air supply unit 206, the expansion and maintenance member 210 and the heat shrinking unit 211.

<Expansion maintaining member> As shown in FIG. 7 and FIG. 8, the expansion maintaining member 210 is configured to press the sheet member W2 from the Z1 direction to prevent the sheet member W2 near the wafer W1 from shrinking due to the heating performed by the heating ring 211a.

Specifically, the expansion maintaining member 210 has an extrusion ring portion 210a, a cover portion 210b and an air suction portion 210c. The extrusion ring portion 210a has an annular shape when viewed from above. The cover portion 210b is provided on the extrusion ring portion 210a in a manner to block the opening of the extrusion ring portion 210a. The air suction portion 210c is an air suction ring having an annular shape when viewed from above. A plurality of air suction ports are formed on the lower surface of the Z2 direction side of the air suction portion 210c. In addition, the extrusion ring portion 210a is configured to move in the Z direction by a Z direction moving mechanism 210d. That is, the Z-direction moving mechanism 210d is configured to move the extrusion ring 210a to a position pressing the sheet member W2 and to a position away from the sheet member W2. The Z-direction moving mechanism 210d includes, for example, a driving part having a linear conveyor module or a motor with a ball screw and an encoder.

<Heat shrinkage section> The heat shrinkage section 211 is configured so that the sheet member W2 expanded by the expansion section 208 is shrunk by heating while maintaining the gaps between the plurality of semiconductor chips Ch. The heat shrinkage section 211 is an example of a "wafer heating section" in the scope of the patent application.

The heat shrinking part 211 is disposed at the wafer heating position P5 of the extended main body 200. The heat shrinking part 211 has a heating ring 211a and a Z-direction moving mechanism 211b. The heating ring 211a has a ring shape when viewed from above. In addition, the heating ring 211a has a packaged heater for heating the sheet member W2. The Z-direction moving mechanism 211b is configured to move the heating ring 211a in the Z direction. The Z-direction moving mechanism 211b includes, for example, a driving part having a linear conveyor module or a motor with a ball screw and an encoder.

<Ultraviolet irradiation section> The ultraviolet irradiation section 212 is configured to irradiate ultraviolet rays Ut to the sheet member W2 to reduce the adhesive force of the adhesive layer of the sheet member W2. Specifically, the ultraviolet irradiation section 212 has ultraviolet lighting. The ultraviolet irradiation section 212 is arranged at the end of the Z1 direction side of the extrusion section 213a described below of the pressure-applying section 213. The ultraviolet irradiation section 212 is configured to irradiate ultraviolet rays Ut to the sheet member W2 while moving together with the pressure-applying section 213.

<Pressure-applying section> The pressure-applying section 213 is configured to partially squeeze the wafer W1 from the Z2 direction side after expanding the sheet-like member W2, thereby dividing the wafer W1 along the modified layer. That is, the pressure-applying section 213 breaks the divided wafer W1. Specifically, the pressure-applying section 213 has a squeezing section 213a, a Z-direction moving mechanism 213b, an X-direction moving mechanism 213c, and a rotating mechanism 213d.

The squeezing part 213a is constructed in such a way that the wafer W1 is squeezed from the Z2 direction side through the sheet-like component W2, and at the same time, it is moved through the rotating mechanism 213d and the X-direction moving mechanism 213c, thereby generating bending stress on the wafer W1 and dividing the wafer W1 along the modified layer. The squeezing part 213a is raised to the rising position on the Z1 direction side through the Z-direction moving mechanism 213b, thereby abutting against the wafer W1 through the sheet-like component W2, thereby squeezing the wafer W1. The squeezing part 213a is lowered to the lowering position on the Z2 direction side through the Z-direction moving mechanism 213b, thereby releasing the abutment with the wafer W1, and thus no longer squeezing the wafer W1. The extruding portion 213a is a pressure applicator.

The extrusion part 213a is mounted on the end of the Z-direction moving mechanism 213b on the Z1 direction side. The Z-direction moving mechanism 213b is configured so that the extrusion part 213a moves linearly in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 213b is, for example, a cylinder. The Z-direction moving mechanism 213b is mounted on the end of the X-direction moving mechanism 213c on the Z1 direction side.

The X-direction moving mechanism 213c is mounted on the end of the rotating mechanism 213d on the Z1 direction side. The X-direction moving mechanism 213c is configured to move the extruding portion 213a linearly in one direction. The X-direction moving mechanism 213c includes, for example, a driving portion having a linear conveyor module or a motor with a ball screw and an encoder.

In the pressurizing section 213, the squeezing section 213a is raised to the raised position by the Z-direction moving mechanism 213b. In the pressurizing section 213, the squeezing section 213a is partially squeezed from the Z2 direction side by the sheet member W2, and at the same time, the squeezing section 213a is moved in the Y direction by the X-direction moving mechanism 213c, thereby dividing the wafer W1. In the pressurizing section 213, the squeezing section 213a is lowered to the lowered position by the Z-direction moving mechanism 213b. In the pressurizing section 213, after the squeezing section 213a is moved in the Y direction, the squeezing section 213a is rotated 90 degrees by the rotating mechanism 213d.

In the pressurizing part 213, the squeezing part 213a is raised to the raised position by the Z-direction moving mechanism 213b. In the pressurizing part 213, after the squeezing part 213a is rotated 90 degrees, the squeezing part 213a partially squeezes the wafer W1 from the Z2 direction side through the sheet member W2, and at the same time, the squeezing part 213a is moved in the X direction by the X-direction moving mechanism 213c, thereby dividing the wafer W1.

<Clamping section> The clamping section 214 is provided on the extended main body 200. The clamping section 214 is configured to hold the annular member W3 of the wafer ring structure W. Specifically, the clamping section 214 has a holding section 214a, a Z-direction moving mechanism 214b, and a Y-direction moving mechanism 214c. The holding section 214a supports the annular member W3 from the Z2 direction side, and presses the annular member W3 from the Z1 direction side. In this way, the annular member W3 is held by the holding section 214a. The holding section 214a is mounted on the Z-direction moving mechanism 214b. The clamping part 214 holds the wafer W1 and moves the wafer W1 between the cooling unit 207 at the wafer cooling position P4 and the heat shrinking part 211 at the wafer heating position P5. Furthermore, the clamping part 214 is an example of a "wafer moving part" in the scope of the patent application.

The Z-direction moving mechanism 214b is configured so that the clamping portion 214 moves in the Z direction. Specifically, the Z-direction moving mechanism 214b is configured so that the holding portion 214a moves in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 214b, for example, includes a driving portion having a linear conveyor module, or a motor with a ball screw and an encoder. The Z-direction moving mechanism 214b is mounted on the Y-direction moving mechanism 214c. The Y-direction moving mechanism 214c is configured so that the Z-direction moving mechanism 214b moves in the Y1 direction or the Y2 direction. The Y-direction moving mechanism 214c, for example, includes a driving portion having a linear conveyor module, or a motor with a ball screw and an encoder.

(Composition of the control system of the semiconductor wafer processing device) As shown in FIG9, the semiconductor wafer processing device 100 has a first control unit 101, a second control unit 102, a third control unit 103, a fourth control unit 104, a fifth control unit 105, a sixth control unit 106, a seventh control unit 107, an eighth control unit 108, an expansion control operation unit 109, a processing control operation unit 110, a cutting control operation unit 111 and a memory unit 112.

The first control unit 101 is configured to control the pressure applying unit 213. The first control unit 101 includes a CPU (Central Processing Unit), a memory unit having a ROM (Read Only Memory) and a RAM (Random Access Memory). Furthermore, the first control unit 101 may also include a HDD (Hard Disk Drive) as a memory unit that retains the stored information even after the voltage is cut off. Furthermore, the HDD may be commonly provided for the first control unit 101, the second control unit 102, the third control unit 103, the fourth control unit 104, the fifth control unit 105, the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108.

The second control unit 102 is configured to control the cold air supply unit 206 and the cooling unit 207. The second control unit 102 includes a CPU and a memory unit including a ROM and a RAM. The third control unit 103 is configured to control the heat shrinking unit 211 and the ultraviolet irradiation unit 212. The third control unit 103 includes a CPU and a memory unit including a ROM and a RAM. Furthermore, the second control unit 102 and the third control unit 103 may also include a HDD or the like as a memory unit that retains the stored information even after the voltage is cut off.

The fourth control unit 104 is configured to control the wafer box unit 202 and the lifting hand unit 203. The fourth control unit 104 includes a CPU, a memory unit including ROM and RAM, etc. The fifth control unit 105 is configured to control the suction hand unit 204. The fifth control unit 105 includes a CPU, a memory unit including ROM and RAM, etc. Furthermore, the fourth control unit 104 and the fifth control unit 105 may also include a HDD or the like as a memory unit that retains the stored information even after the voltage is cut off.

The sixth control unit 106 is configured to control the chuck table unit 12. The sixth control unit 106 includes a CPU and a memory unit including a ROM and a RAM. The seventh control unit 107 is configured to control the laser unit 13. The seventh control unit 107 includes a CPU and a memory unit including a ROM and a RAM. The eighth control unit 108 is configured to control the imaging unit 14. The eighth control unit 108 includes a CPU and a memory unit including a ROM and a RAM. Furthermore, the sixth control unit 106, the seventh control unit 107 and the eighth control unit 108 may also include a HDD or the like as a memory unit that retains the stored information even after the voltage is cut off.

The expansion control operation unit 109 is configured to perform operations related to the expansion process of the sheet member W2 based on the processing results of the first control unit 101, the second control unit 102, and the third control unit 103. The expansion control operation unit 109 includes a CPU, a memory unit including a ROM and a RAM.

The processing control calculation unit 110 is configured to perform calculations related to the movement process of the wafer ring structure W based on the processing results of the fourth control unit 104 and the fifth control unit 105. The processing control calculation unit 110 includes a CPU and a memory unit including a ROM and a RAM.

The dicing control calculation unit 111 is configured to perform calculations related to the dicing process of the wafer W1 based on the processing results of the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108. The dicing control calculation unit 111 includes a CPU, a memory unit including a ROM and a RAM, and the like.

The memory unit 112 stores programs for operating the cutting device 1 and the expansion device 2. The memory unit 19 includes a ROM, a RAM, and a HDD.

(Semiconductor wafer manufacturing process) Below, referring to FIG. 10 and FIG. 11, the overall operation of the semiconductor wafer processing device 100 is described.

In step S1, the wafer ring structure W is taken out from the wafer box 202. That is, after the wafer ring structure W accommodated in the wafer box 202 is supported by the lifting hand 203b, the lifting hand 203b is moved to the Y1 direction by the Y direction moving mechanism 31, thereby taking out the wafer ring structure W from the wafer box 202. In step S2, the wafer ring structure W is transferred to the chuck table 12 of the cutting device 1 by the suction hand 204c. That is, the wafer ring structure W taken out from the wafer box 202 is moved to the X2 direction by the X direction moving mechanism 204a in a state of being sucked by the suction hand 204c. Then, the wafer ring structure W moved to the X2 direction side is transferred from the suction hand 204 c to the chuck table portion 12 and then held by the chuck table portion 12 .

In step S3, a modified layer is formed on the wafer W1 by the laser unit 13. In step S4, the wafer ring structure W having the wafer W1 formed with the modified layer is transferred to the clamping unit 214 by the suction hand 204c. In step S5, the sheet-like member W2 is cooled by the cold air supply unit 206 and the cooling unit 207. That is, the wafer ring structure W held by the clamping unit 214 is moved (descended) in the Z2 direction by the Z-direction moving mechanism 214b to contact the cooling unit 207, and the cold air supply unit 206 supplies cold air from the Z1 direction side, thereby cooling the sheet-like member W2.

In step S6, the wafer ring structure W is moved to the expansion part 208 through the clamping part 214. That is, the wafer ring structure W in which the sheet member W2 has been cooled is moved in the Y1 direction by the Y direction moving mechanism 214c while being held in the clamping part 214. In step S7, the sheet member W2 is expanded by the expansion part 208. That is, the wafer ring structure W is moved in the Z2 direction by the Z direction moving mechanism 214b while being held in the clamping part 214. Then, the sheet member W2 is abutted against the expansion ring 281 and stretched by the expansion ring 281, thereby expanding. Thus, the wafer W1 is divided along the dividing lines (modified layers).

In step S8, the sheet member W2 in the expanded state is pressed from the Z1 direction by the expansion holding member 210. That is, the squeezing ring 210a is moved (descended) in the Z2 direction by the Z-direction moving mechanism 210d until it contacts the sheet member W2. Then, the process proceeds to step S9 via point A in FIG. 10 to point A in FIG. 11.

As shown in FIG. 11 , in step S9 , after the sheet member W2 is pressed by the expansion and holding member 210 , the wafer W1 is squeezed by the pressing portion 213 , and the sheet member W2 is irradiated with ultraviolet rays Ut by the ultraviolet irradiation portion 212 . Thus, the wafer W1 is further divided by the pressing portion 213 . In addition, the adhesion of the sheet member W2 is reduced by the ultraviolet rays Ut irradiated from the ultraviolet irradiation portion 212 .

In step S10, the sheet member W2 is heated by the heat shrinking part 211 to shrink it, and at the same time, the clamping part 214 is raised. At this time, the suction part 210c is heated and sucks the air near the sheet member W2. In step S11, the wafer ring structure W is transferred from the clamping part 214 to the suction hand 204c. That is, the wafer ring structure W is moved in the Y2 direction by the Y-direction moving mechanism 214c while being fixed in the clamping part 214. Then, at the position on the Z1 direction side of the cooling unit 207, the clamping part 214 releases the wafer ring structure W, and then the wafer ring structure W is sucked by the suction hand 204c.

In step S12, the wafer ring structure W is transferred to the lifting hand 203b by the suction hand 204c. In step S13, the wafer ring structure W is stored in the wafer box part 202. That is, the wafer ring structure W supported by the lifting hand 203b is moved to the Y1 direction by the Y direction moving mechanism 203a, thereby storing the wafer ring structure W in the wafer box part 202. Through the above steps, the processing of one wafer ring structure W is completed. Then, it returns to step S1 via point B in Figure 11 to point B in Figure 10.

(Detailed structure of expansion part, expansion holding member, ultraviolet irradiation part and pressure applying part) Referring to FIG. 12 and FIG. 13, the detailed structure of the expansion part 208, the expansion holding member 210, the ultraviolet irradiation part 212 and the pressure applying part 213 is described. In addition, FIG. 12 does not show the heat shrinking part 211 of the expansion device 2 for the sake of explanation.

The expansion device 2 shown in Fig. 12 shows a state before the expansion ring 281 expands the sheet member W2. Here, the clamping portion 214 is arranged at the raised position Up. That is, the holding portion 214a is arranged at the raised position Up by the Z-direction moving mechanism 214b.

The expansion device 2 shown in FIG. 13 shows a state in which the expansion ring 281 is expanding the sheet member W2. Here, the clamping portion 214 is arranged at the lowered position Lw. That is, the holding portion 214a is moving from the rising position Up to the lowered position Lw toward the Z2 direction side by the Z-direction moving mechanism 214b.

When the holding portion 214a moves sideways in the Z2 direction from the rising position Up to the falling position Lw, the sheet member W2 is extended by contacting with the upper end portion 281a of the expansion ring 281. At this time, the wafer W1 is stretched by the sheet member W2, thereby generating a tensile stress in the wafer W1, thereby dividing the wafer W1 along the modified layer formed on the wafer W1. In this way, a plurality of semiconductor chips Ch are formed.

<Expansion section> The expansion section 208 has an expansion ring 281, which expands the sheet member W2 while the wafer ring structure W is held by the clamping section 214, thereby dividing the wafer W1 into a plurality of semiconductor chips Ch that are spaced Mr apart from each other. That is, the expansion ring 281 is configured to expand the sheet member W2 by utilizing the clamping section 214 that moves in the Z2 direction from the rising position Up to the falling position Lw by the Z-direction moving mechanism 214b.

The expansion ring 281 is fixed on the base 205. The upper end 281a of the expansion ring 281 is arranged at a predetermined height position Hd in the Z direction. The predetermined height position Hd is a height position based on the upper surface of the base 205. In this way, the upper end 281a of the expansion ring 281 is kept arranged at the predetermined height position Hd.

As shown in Fig. 14, the expansion maintaining member 210 is configured to maintain the expanded state of the sheet member W2 near the wafer W1. The heat shrinking portion 211 of the expansion device 2 is not shown in Fig. 14 for the sake of illustration.

Specifically, the expansion maintaining member 210 has an extrusion ring portion 210a and a cover portion 210b.

The extrusion ring 210a has a cylindrical shape configured to surround the wafer W1 in a top view. The cover 210b is provided in a manner to cover the opening of the extrusion ring 210a that opens in the Z1 direction. The cover 210b is provided on the inner side 1210a of the extrusion ring 210a in a manner to block the opening of the extrusion ring 210a that opens in the Z1 direction. The cover 210b is provided at the end of the inner side 1210a of the extrusion ring 210a on the Z1 direction side. The inner side 1210a is the inner side of the cylindrical extrusion ring 210a in the radial direction.

The ultraviolet irradiation unit 212 is configured to irradiate the sheet-like member W2 in the expanded state with ultraviolet rays Ut from the Z2 direction. The ultraviolet irradiation unit 212 is disposed at a position in the Z2 direction of the wafer W1 of the sheet-like member W2 in the expanded state.

The wafer W1 is covered from the Z1 direction side by the cylindrical extrusion ring portion 210a and the cover portion 210b, thereby preventing the ultraviolet rays Ut irradiated from the ultraviolet irradiation portion 212 from leaking to the outside from the expansion and maintenance member 210. In this way, the expansion and maintenance member 210 not only has the function of maintaining the expansion state of the sheet member W2 near the wafer W1, but also has the function of shielding the ultraviolet rays Ut. In addition, the expansion and maintenance member 210 is formed of metal such as stainless steel to suppress the deterioration of the material due to shielding the ultraviolet rays Ut.

Here, in the first embodiment, as shown in FIG1 , the lifting hand 203 is disposed between the cutting device 1 and the extension body 200. Specifically, the lifting hand 203 is disposed on the X1 direction side of the cutting device 1 in the X direction. Also, the lifting hand 203 is disposed on the X2 direction side of the extension body 200 in the X direction.

That is, the semiconductor chip manufacturing method implemented by the semiconductor wafer processing device 100 includes the following steps: taking out the wafer W1 from the wafer box part 202 that accommodates the wafer W1 by the lifting hand part 203, or putting the wafer W1 into the wafer box part 202; cutting by the cutting device 1 to divide the wafer W1 into a plurality of semiconductor chips Ch; and performing processing different from cutting on the wafer W1 by the extended body part 200; and the lifting hand part 203 is configured in a manner of being located between the cutting device 1 and the extended body part 200.

Furthermore, the semiconductor chip Ch manufactured using the semiconductor wafer processing device 100 is manufactured by the semiconductor wafer processing device 100, and the above-mentioned semiconductor wafer processing device 100 has: a wafer box part 202, which accommodates the wafer W1; a lifting hand part 203, which takes out the wafer W1 from the wafer box part 202, or puts the wafer W1 into the wafer box part 202; a cutting device 1, which cuts the wafer W1; and an extended body part 200, which performs processing on the wafer different from cutting; and the lifting hand part 203 is configured in a manner of being located between the cutting device 1 and the extended body part 200.

Furthermore, the suction hand 204 receives the wafer W1 from the lifting hand 203 and transports the wafer to the cutting device 1 or the extended body 200. Specifically, the suction hand 204 delivers the wafer W1 at a delivery position P1 disposed on the Y2 direction side of the wafer box 202 relative to the lifting hand 203. Furthermore, the suction hand 204 delivers the wafer W1 at a delivery position P2 disposed on the X2 direction side of the delivery position P1 relative to the cutting device 1. Furthermore, the suction hand 204 delivers the wafer W1 at a delivery position P3 disposed on the X1 direction side of the delivery position P1 relative to the extended body 200.

Furthermore, the wafer transfer position P2 of the dicing device 1, the wafer transfer position P3 of the extended body 200, and the wafer transfer position P1 from the lifting hand 203 to the suction hand 204 are arranged in a straight line. Furthermore, the suction hand 204 is configured to be movable in a straight line along the direction (X direction) in which the lifting hand 203, the dicing device 1, and the extended body 200 are arranged.

The suction hand 204 is constructed in such a way as to transport a wafer ring structure W including a sheet component W2 and an annular ring component W3 between the lifting hand 203, the cutting device 1 and the extended main body 200. The sheet component W2 is attached with a wafer W1 and has elasticity. The annular component W3 is attached to the sheet component W2 in a state of surrounding the wafer W1.

1, the wafer cassette unit 202 and the lifting arm 203 are arranged in a direction (Y direction) perpendicular to the direction in which the lifting arm 203, the dicing device 1, and the extended body 200 are arranged.

In addition, the cooling unit 207 of the wafer cooling position P4 and the heat shrinkage part 211 of the wafer heating position P5 of the extended body 200 as the wafer processing part are arranged along the direction (Y direction) orthogonal to the direction in which the lifting hand 203, the cutting device 1 and the extended body 200 are arranged.

Furthermore, the wafer box portion 202 is arranged on one side of the front-to-back direction (the Y1 direction side) relative to the lifting arm portion 203, the lifting arm portion 203 is arranged on the other side of the front-to-back direction of the wafer box portion 202 (the Y2 direction side), the cooling unit 207 of the wafer cooling position P4 of the extended body portion 200 is arranged on the lateral side (the X1 direction side) of the lifting arm portion 203, and the heat shrinkage portion 211 of the wafer heating position P5 of the extended body portion 200 is arranged on one side of the front-to-back direction of the wafer cooling position P4 (the Y1 direction side).

Specifically, the wafer box part 202, the lifting hand part 203, the cooling unit 207 at the wafer cooling position P4 of the extended body 200, and the heat shrinking part 211 at the wafer heating position P5 are arranged in a rectangular shape.

Furthermore, the pressure applying portion 213 is disposed at a position overlapping with the heat shrinking portion 211 at the wafer heating position P5 in the front-rear direction (Y direction).

Furthermore, the ultraviolet irradiation part 212 is arranged at a position overlapping with the heat shrinking part 211 at the wafer heating position P5 in the front-back direction (Y direction).

(Effects of the first implementation method) In the first implementation method, the following effects can be obtained.

In the first embodiment, as described above, the lifting hand 203 is arranged in a manner to be located between the cutting device 1 and the extended body 200. Thereby, the wafer W1 can be directly supplied from the wafer box 202 to one of the cutting device 1 and the extended body 200 without passing through the other of the cutting device 1 and the extended body 200, so that when a part of the processing is performed, the processing can be performed independently. As a result, even when only a part of the processing is performed among a plurality of processing, the processing of the wafer W1 can be performed efficiently. In addition, when the processing performed by the cutting device 1 and the extended body 200 is performed continuously, a plurality of processing can be performed by moving the wafer between the cutting device 1 and the extended body 200.

In the first embodiment, as described above, a suction hand 204 is further provided, which receives the wafer W1 from the lifting hand 203 and transfers the wafer to the dicing device 1 or the extended body 200. Thus, the suction hand 204 can easily transfer the wafer between the lifting hand 203, the dicing device 1 and the extended body 200.

Furthermore, in the first embodiment, as described above, the wafer handover position P2 of the cutting device 1, the wafer handover position P3 of the extended body 200, and the wafer handover position P1 from the lifting hand 203 to the suction hand 204 are arranged in a straight line, and the suction hand 204 is configured to be movable in a straight line along the direction (X direction) in which the lifting hand 203, the cutting device 1, and the extended body 200 are arranged. Thus, the wafer can be transported between the wafer handover position P2 of the cutting device 1, the wafer handover position P3 of the extended body 200, and the wafer handover position P1 from the lifting hand 203 to the suction hand 204 by a straight transfer axis, thereby suppressing the complexity of the structure for transporting the wafer W1. Furthermore, the wafer W1 can be easily and directly transferred between the dicing device 1 and the extended main body 200 by the suction hand 204 .

Furthermore, in the first embodiment, as described above, the suction hand 204 is configured to transport the wafer ring structure W including the sheet member W2 and the ring member W3 between the lifting hand 203, the cutting device 1, and the extended body 200. The sheet member W2 is attached with the wafer W1 and has elasticity, and the ring member W3 is attached to the sheet member W2 in a state of surrounding the wafer W1. Thus, even if the wafer W1 has different sizes, the shape of the ring member W3 is made common, and wafers W1 of different sizes can be easily transported between the cutting device 1 and the extended body 200 by the suction hand 204.

In the first embodiment, as described above, the expansion body 200 pulls the sheet member W2 on which the wafer W1 is placed to divide the wafer W1. Thus, the wafer W1 can be cut and expanded individually or continuously.

Furthermore, in the first embodiment, as described above, the wafer box 202 and the lifting arm 203 are arranged in a direction (Y direction) perpendicular to the direction in which the lifting arm 203, the cutting device 1, and the expansion body 200 are arranged. Thus, when the wafer W1 is moved toward the cutting device 1 and the expansion body 200, the wafer box 202 can be prevented from interfering with the moving wafer W1.

Furthermore, in the first embodiment, as described above, the cooling unit 207 of the wafer cooling position P4 and the heat shrinking part 211 of the wafer heating position P5 of the extended body 200 as the wafer processing part are arranged in a direction (Y direction) perpendicular to the direction in which the lifting hand 203, the cutting device 1 and the extended body 200 are arranged. Thus, when the wafer W1 is moved toward the cutting device 1 and the extended body 200, it is possible to suppress the components of the heat shrinking part 211 of the wafer heating position P5 from interfering with the moving wafer W1.

Furthermore, in the first embodiment, as described above, the extended body 200 includes the clamping part 214, which holds the wafer W1 and moves the wafer W1 between the cooling unit 207 at the wafer cooling position P4 and the heat shrinking part 211 at the wafer heating position P5. Thus, the wafer W1 transferred to the extended body 200 can be easily moved between the cooling unit 207 at the wafer cooling position P4 and the heat shrinking part 211 at the wafer heating position P5 in the extended body 200 by the clamping part 214 independently.

Furthermore, in the first embodiment, as described above, the wafer box portion 202 is arranged on one side of the front-rear direction (the Y1 direction side) relative to the lifting hand portion 203, the lifting hand portion 203 is arranged on the other side of the front-rear direction of the wafer box portion 202 (the Y2 direction side), the cooling unit 207 of the wafer cooling position P4 of the extended body 200 is arranged on the lateral side (the X1 direction side) of the lifting hand portion 203, and the heat shrinkage portion 211 of the wafer heating position P5 of the extended body 200 is arranged on one side of the front-rear direction of the wafer cooling position P4 (the Y1 direction side). Thereby, the wafer box part 202, the lifting hand part 203, the cooling unit 207 at the wafer cooling position P4 of the extended body part 200, and the heat shrinking part 211 at the wafer heating position P5 can be compactly arranged along the moving path of the wafer W1.

Furthermore, in the first embodiment, as described above, the wafer box 202, the lifting hand 203, the cooling unit 207 at the wafer cooling position P4 of the extended body 200, and the heat shrinking unit 211 at the wafer heating position P5 are arranged in a rectangular shape. Thus, compared with the case where the wafer box 202, the lifting hand 203, the cooling unit 207 at the wafer cooling position P4 of the extended body 200, and the heat shrinking unit 211 at the wafer heating position P5 are arranged in a straight line along a predetermined direction, the area of the maintenance space provided around the device can be reduced, thereby suppressing the increase in the area of the processing device 100 for placing semiconductor wafers.

In the first embodiment, as described above, the pressure applying part 213 for breaking the divided wafer W1 is provided, and the pressure applying part 213 is arranged at a position overlapping with the heat shrinking part 211 of the wafer heating position P5 in the front-back direction (Y direction). Thus, the size of the extended body 200 in the front-back direction can be reduced compared to the case where the pressure applying part 213 is arranged at a position not overlapping with the heat shrinking part 211 of the wafer heating position P5.

Furthermore, in the first embodiment, as described above, the ultraviolet irradiation unit 212 is provided, and the ultraviolet irradiation unit 212 irradiates ultraviolet rays to the sheet member W2 to which the wafer W1 is attached, and the ultraviolet irradiation unit 212 is arranged at a position overlapping with the heat shrinking unit 211 of the wafer heating position P5 in the front-back direction (Y direction). Thus, compared with the case where the ultraviolet irradiation unit 212 is arranged at a position not overlapping with the heat shrinking unit 211 of the wafer heating position P5, the size of the extended main body 200 in the front-back direction can be reduced.

[Second embodiment] Referring to FIGS. 15 to 20 , the structure of the semiconductor wafer processing device 300 of the second embodiment is described. In the second embodiment, unlike the first embodiment, the pressure applying portion 3213 is arranged outside the expansion ring 3281. In addition, in the second embodiment, the detailed description of the same structure as the first embodiment is omitted.

(Semiconductor wafer processing device) As shown in FIG. 15 and FIG. 16 , the semiconductor wafer processing device 300 is a device for processing the wafer W1 disposed in the wafer ring structure W. Furthermore, the semiconductor wafer processing device 300 is an example of a "wafer processing device" in the scope of the patent application.

Furthermore, the semiconductor wafer processing device 300 includes a cutting device 1 and an expansion device 302. The up-down direction is set as the Z direction, the up direction is set as the Z1 direction, and the down direction is set as the Z2 direction. The direction in which the cutting device 1 and the expansion device 302 are arranged in the horizontal direction orthogonal to the Z direction is set as the X direction, the expansion device 302 side in the X direction is set as the X1 direction, and the cutting device 1 side in the X direction is set as the X2 direction. The direction in the horizontal direction orthogonal to the X direction is set as the Y direction, one side in the Y direction is set as the Y1 direction, and the other side in the Y direction is set as the Y2 direction.

(Cutting device) The cutting device 1 is configured to form a modified layer by irradiating a laser having a wavelength having transparency to the wafer W1 along a dividing line (cutting road). The cutting device 1 is an example of a "cutting unit" in the scope of the patent application.

Specifically, the cutting device 1 includes a base 11 , a chuck table portion 12 , a laser portion 13 and an imaging portion 14 .

(Expansion device) As shown in FIG. 16 and FIG. 17, the expansion device 302 is configured to divide the wafer W1 into a plurality of semiconductor chips Ch.

The expansion device 302 includes an expansion body 200, a base 201, a wafer box part 202, a lifting hand 203, a suction hand 204, a base 205, a cold air supply part 206, a cooling unit 207, an expansion part 3208, a base 209, an expansion holding member 210, a heat shrinking part 211, an ultraviolet irradiation part 212, a pressure applying part 3213, a clamping part 214, a camera part 215 and a notification part 216.

<Expansion section> The expansion section 3208 is formed by expanding the sheet member W2 of the wafer ring structure W to divide the wafer W1 along the dividing line.

Specifically, the expansion portion 3208 has an expansion ring 3281 and a Z-direction moving mechanism 3282 .

The expansion ring 3281 is configured to expand (expand) the sheet member W2 by supporting the sheet member W2 from the Z2 direction. The expansion ring 3281 has a ring shape when viewed from above. The Z-direction moving mechanism 3282 is configured to move the expansion ring 3281 in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 3282 includes, for example, a driving portion having a linear conveyor module, or a motor with a ball screw and an encoder. The Z-direction moving mechanism 3282 is mounted on the base 205. In the expanded state, the upper end portion 3281a of the expansion ring 3281 is maintained at a specified height position Hd by the Z-direction moving mechanism 3282.

<Pressure-applying section> The pressure-applying section 3213 is configured to squeeze the wafer W1 from the Z2 direction after expanding the sheet-shaped member W2, thereby dividing the wafer W1 along the reformed layer. Specifically, the pressure-applying section 3213 has a squeezing section 3213a, an X-direction moving mechanism 3213b, a Z-direction moving mechanism 3213c, and a rotating mechanism 3213d.

The extrusion part 3213a is configured so that after the Z-direction moving mechanism 3213c moves in the Z1 direction, the wafer W1 is squeezed from the Z2 direction side through the sheet member W2, and the wafer W1 is simultaneously moved by the rotating mechanism 3213d and the X-direction moving mechanism 3213b, thereby generating bending stress on the wafer W1 and dividing the wafer W1 along the modified layer. The extrusion part 3213a is a pressure applicator. The extrusion part 3213a is mounted on the end of the rotating mechanism 3213d on the Z1 direction side. The Z-direction moving mechanism 3213c is configured so that the rotating mechanism 3213d moves in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 3213c has, for example, a cylinder. The Z-direction moving mechanism 3213c is mounted on the end of the X-direction moving mechanism 3213b on the Z1 direction side. The X-direction moving mechanism 3213b includes, for example, a driving part having a linear conveyor module or a motor with a ball screw and an encoder. The X-direction moving mechanism 3213b is mounted on the end of the base 205 on the Z1 direction side.

In the pressurizing part 3213, after the squeezing part 3213a is moved in the Z1 direction by the Z-direction moving mechanism 3213c, the wafer W1 is squeezed from the Z2 direction side through the sheet member W2, and at the same time, the squeezing part 3213a is moved in the Y direction by the X-direction moving mechanism 3213b, thereby dividing the wafer W1. In addition, in the pressurizing part 3213, after the squeezing part 3213a is moved in the Y direction, the squeezing part 3213a is rotated 90 degrees by the rotating mechanism 3213d. In the pressing part 3213, after the pressing part 3213a rotates 90 degrees, the pressing part 3213a presses the wafer W1 from the Z2 direction through the sheet member W2, and at the same time, the pressing part 3213a moves in the X direction through the X direction moving mechanism 3213b, thereby dividing the wafer W1.

(Composition of control system of semiconductor wafer processing device) As shown in FIG18, the semiconductor wafer processing device 300 has a first control unit 101, a second control unit 102, a third control unit 103, a fourth control unit 3104, a fifth control unit 3105, a sixth control unit 3106, a seventh control unit 3107, an eighth control unit 3108, a ninth control unit 3109, an expansion control operation unit 3110, a processing control operation unit 3111, a cutting control operation unit 3112, and a memory unit 3113. Furthermore, the first control unit 101, the second control unit 102, the third control unit 103, the fifth control unit 3105, the sixth control unit 3106, the seventh control unit 3107, the eighth control unit 3108, the ninth control unit 3109, the expansion control operation unit 3110, the processing control operation unit 3111, the cutting control operation unit 3112 and the memory unit 3113 are respectively the same as the first control unit 101, the second control unit 102, the third control unit 103, the fourth control unit 104, the fifth control unit 105, the sixth control unit 106, the seventh control unit 107, the eighth control unit 108, the expansion control operation unit 109, the processing control operation unit 110, the cutting control operation unit 111 and the memory unit 112 of the first embodiment, and therefore the description thereof is omitted.

The fourth control unit 3104 is configured to control the expansion unit 3208. The fourth control unit 3104 includes a CPU, a memory unit including a ROM and a RAM, etc. Furthermore, the fourth control unit 3104 may include a HDD or the like as a memory unit that retains the stored information even after the voltage is cut off.

(Semiconductor wafer manufacturing process) Below, the overall operation of the semiconductor wafer processing device 300 is described with reference to FIG. 19 and FIG. 20.

Steps S1 to S6, step S8, and step S11 are respectively the same as steps S1 to S6, step S8, and step S11 of the semiconductor chip manufacturing process of the first embodiment, and thus their description is omitted.

In step S307, the sheet-like member W2 is expanded by the expansion part 3208. That is, the expansion ring 3281 is moved in the Z1 direction by the Z-direction moving mechanism 3282. The wafer ring structure W is moved in the Z2 direction by the Z-direction moving mechanism 214b while being held by the clamping part 214. Then, the sheet-like member W2 is brought into contact with the expansion ring 3281 and stretched by the expansion ring 3281, thereby expanding. Thus, the wafer W1 is divided along the dividing line (modified layer).

As shown in FIG. 20 , in step S309, the sheet member W2 is heated by the heat shrinking section 211 to shrink it, and the sheet member W2 is irradiated with ultraviolet rays Ut by the ultraviolet irradiation section 212 while the clamping section 214 is raised. At this time, the suction section 210c is heated to suck in the air near the sheet member W2. In step S310, the wafer ring structure W is moved toward the pressure applying section 3213 by the clamping section 214. That is, the wafer ring structure W is moved in the Y2 direction by the Y-direction moving mechanism 214c while being fixed in the clamping section 214.

In step S311, after the wafer ring structure W moves to the pressing part 3213, the pressing part 3213 presses the wafer W1. Thus, the pressing part 3213 further divides the wafer W1.

Here, in the second embodiment, as shown in FIG. 15 , the lifting hand 203 is disposed between the cutting device 1 and the extension body 200. Specifically, the lifting hand 203 is disposed on the X1 direction side of the cutting device 1 in the X direction. Also, the lifting hand 203 is disposed on the X2 direction side of the extension body 200 in the X direction.

Furthermore, in the second embodiment, as shown in FIG. 17 , the pressure applying portion 3213 for breaking the divided wafer W1 is disposed in the front-rear direction (Y direction) between the cooling unit 207 at the wafer cooling position P4 and the heat shrinking portion 211 at the wafer heating position P5.

(Effects of the second implementation method) In the second implementation method, the following effects can be obtained.

In the second embodiment, similarly to the first embodiment, the wafer W1 can be directly supplied from the wafer box 202 to one of the cutting device 1 and the extended body 200 without passing through the other of the cutting device 1 and the extended body 200, so that when a part of the processing is performed, the processing can be performed independently. As a result, even when only a part of the processing is performed among a plurality of processing, the processing of the wafer W1 can be performed efficiently. In addition, when the processing performed by the cutting device 1 and the extended body 200 is performed continuously, a plurality of processing can be performed by moving the wafer between the cutting device 1 and the extended body 200.

Furthermore, in the second embodiment, as described above, a pressurizing section 3213 for breaking the divided wafer W1 is provided, and the pressurizing section 3213 is disposed between the cooling unit 207 at the wafer cooling position P4 and the heat shrinking section 211 at the wafer heating position P5 in the front-rear direction (Y direction). Thus, after the wafer W1 is cooled in the cooling unit 207 at the wafer cooling position P4, the wafer W1 can be sequentially moved to the pressurizing section 3213 and the heat shrinking section 211 at the wafer heating position P5 while being broken and heated in sequence.

Furthermore, other effects of the second embodiment are the same as those of the above-mentioned first embodiment.

[Third embodiment] Referring to FIG. 21 , the structure of the semiconductor wafer processing device 400 of the third embodiment is described. In the third embodiment, unlike the first and second embodiments, a polishing device is provided as a wafer processing unit for performing processing different from cutting. In addition, in the third embodiment, detailed descriptions of the same structures as the first embodiment are omitted.

(Semiconductor wafer processing device) As shown in FIG. 21, the semiconductor wafer processing device 400 is a device for processing the wafer W1 set in the wafer ring structure W. Furthermore, the semiconductor wafer processing device 400 is an example of a "wafer processing device" in the scope of the patent application.

Furthermore, the semiconductor wafer processing device 400 includes a cutting device 1, a wafer box unit 202, a lifting hand 203, a suction hand 204, and a grinding device 410. The up-down direction is set as the Z direction, the up direction is set as the Z1 direction, and the down direction is set as the Z2 direction. The direction in which the cutting device 1 and the grinding device 410 are arranged in the horizontal direction orthogonal to the Z direction is set as the X direction, the grinding device 410 side in the X direction is set as the X1 direction, and the cutting device 1 side in the X direction is set as the X2 direction. The direction in the horizontal direction orthogonal to the X direction is set as the Y direction, one side in the Y direction is set as the Y1 direction, and the other side in the Y direction is set as the Y2 direction.

(Cutting device) The cutting device 1 is configured to form a modified layer by irradiating a wafer W1 with a laser having a wavelength that is transparent along a dividing line (cutting road). The cutting device 1 is an example of a "cutting unit" in the scope of the patent application.

Specifically, the cutting device 1 includes a base 11 , a chuck table portion 12 , a laser portion 13 and an imaging portion 14 .

(Polishing device) The polishing device 410 is configured to process the wafer W1 by polishing it. Furthermore, the polishing device 410 is an example of a "wafer processing unit" and a "polishing unit" in the scope of the patent application.

The polishing device 410 includes a base 411 , a wafer holding portion 412 , and a polishing portion 413 .

<Base> The base 411 is a substrate for setting up the wafer holding part 412 and the polishing part 413.

<Wafer holding section> The wafer holding section 412 holds the wafer ring structure W. Furthermore, the wafer holding section 412 delivers the wafer W1 (wafer ring structure W) at the wafer delivery position P6 relative to the lifting hand section 203.

<Polishing section> The polishing section 413 polishes the wafer W1 held by the wafer holding section 412. The polishing section 413 is arranged on the upper side (Z1 direction side) of the wafer holding section 412.

Here, in the third embodiment, as shown in FIG. 21 , the lifting hand 203 is arranged between the cutting device 1 and the grinding device 410. Specifically, the lifting hand 203 is arranged on the X1 direction side of the cutting device 1 in the X direction. Also, the lifting hand 203 is arranged on the X2 direction side of the grinding device 410 in the X direction.

(Effects of the third implementation method) In the third implementation method, the following effects can be obtained.

In the third embodiment, similarly to the first embodiment, the wafer W1 can be directly supplied from the wafer box 202 to one of the cutting device 1 and the grinding device 410 without passing through the other of the cutting device 1 and the grinding device 410, so that when a part of the processing is performed, the processing can be performed independently. As a result, even when only a part of the processing is performed among a plurality of processing, the processing of the wafer W1 can be performed efficiently. In addition, when the processing performed by the cutting device 1 and the grinding device 410 is performed continuously, a plurality of processing can be performed by moving the wafer between the cutting device 1 and the grinding device 410.

In the third embodiment, as described above, the polishing device 410 polishes the wafer. Thus, the wafer W1 can be cut and polished individually or continuously.

Furthermore, other effects of the third embodiment are the same as those of the first embodiment described above.

[Variations] Furthermore, all aspects of the embodiments disclosed this time are illustrative and should not be considered restrictive. The scope of the present invention is not indicated by the description of the embodiments above, but by the scope of the patent application, and further includes all changes (variations) within the meaning and scope equivalent to the scope of the patent application.

For example, the first and second embodiments show an example of a structure in which a cutting device for cutting a wafer and an extended body for splitting a wafer are provided, and the third embodiment shows an example of a structure in which a cutting device for cutting a wafer and a polishing device for grinding a wafer are provided, but the present invention is not limited thereto. In the present invention, a cutting device for cutting a wafer, an extended body for splitting a wafer, and a polishing device for grinding a wafer may also be provided.

In the first to third embodiments, the dicing device irradiates the wafer with laser light to cause cracks and then dicing, but the present invention is not limited thereto. In the present invention, the dicing device can sever the wafer by irradiating the laser light or by using a blade.

In the first to third embodiments described above, the expansion and maintaining member has an example with a cover portion, but the present invention is not limited thereto. In the present invention, the expansion and maintaining member may not have a cover portion.

In the first and second embodiments described above, the expansion device includes an ultraviolet irradiation unit, but the present invention is not limited thereto. In the present invention, the expansion device may not include an ultraviolet irradiation unit.

In the first and second embodiments described above, an example in which the expansion device includes a pressure applying portion is shown, but the present invention is not limited thereto. In the present invention, the expansion device may not include a pressure applying portion.

In addition, in the first to third embodiments, for the sake of convenience, the examples shown are: using a flow chart of a process-driven type in which processing is performed in sequence according to the processing flow to explain the control processing; however, the present invention is not limited to this. In the present invention, the control processing of the extended control operation unit can also be performed by an event-driven type (event-driven type) processing in which processing is performed in units of events. In this case, a complete event-driven type can be used for processing, and a combination of event-driven and process-driven can also be used for processing.

1: Cutting device 2: Expanding device 11: Base 12: Chuck table 12a: Adsorption unit 12b: Clamping unit 12c: Rotation mechanism 12d: Table moving mechanism 13: Laser unit 13a: Laser irradiation unit 13b: Mounting component 13c: Z-direction moving mechanism 14: Camera unit 14a: High-resolution camera 14b: Wide-angle camera 14c: Z-direction moving mechanism 14d: Z-direction moving mechanism 100: Semiconductor wafer processing device 101: First control unit 102: Second control unit 103: Third control unit 104: Fourth control unit 105: Fifth control unit 106: Sixth control unit 107: 7th control unit 108: 8th control unit 109: expansion control operation unit 110: processing control operation unit 111: cutting control operation unit 112: memory unit 121: X-direction moving mechanism 122: Y-direction moving mechanism 200: expansion body unit 201: base 202: wafer box unit 202a: wafer box 202b: Z-direction moving mechanism 202c: loading unit 203: lifting hand unit 203a: Y-direction moving mechanism 203b: lifting hand 204: suction hand unit 204a: X-direction moving mechanism 204b: Z-direction moving mechanism 204c: suction hand 205: base 206: Cooling air supply unit 206a: Supply unit body 206b: Cooling air supply port 206c: Moving mechanism 207: Cooling unit 207a: Cooling member 207b: Z-direction moving mechanism 208: Expansion unit 209: Base 210: Expansion holding member 210a: Squeezing ring 210b: Cover 210c: Air suction unit 210d: Z-direction moving mechanism 211: Heat shrinking unit 211a: Heating ring 211b: Z-direction moving mechanism 212: Ultraviolet irradiation unit 213: Pressing unit 213a: Squeezing unit 213b: Z-direction moving mechanism 213c: X-direction moving mechanism 213d: Rotating mechanism 214: Clamping part 214a: Holding part 214b: Z-direction moving mechanism 214c: Y-direction moving mechanism 271: Cooling body 272: Peltier element 281: Expanding ring 300: Semiconductor wafer processing device 302: Expanding device 400: Semiconductor wafer processing device 410: Grinding device 411: Base 412: Wafer holding part 413: Grinding part 3104: 4th control part 3105: 5th control part 3106: 6th control part 3107: 7th control part 3108: 8th control unit 3109: 9th control unit 3110: expansion control operation unit 3111: processing control operation unit 3112: cutting control operation unit 3113: memory unit 3208: expansion unit 3213: pressure unit 3213a: extrusion unit 3213b: X-direction moving mechanism 3213c: Z-direction moving mechanism 3213d: rotation mechanism 3281: expansion ring 3281a: upper end of expansion ring 3282: Z-direction moving mechanism Ch: semiconductor chip P1: handover position P2: handover position P3: handover position P4: handover position P5: handover position Ut: ultraviolet light W: Wafer ring structure W1: Wafer W2: Sheet component W21: Upper surface of sheet component W3: Ring component

FIG. 1 is a top view of a semiconductor wafer processing device provided with a cutting device and an expansion device according to the first embodiment. FIG. 2 is a top view of a wafer ring structure processed in the semiconductor wafer processing device according to the first embodiment. FIG. 3 is a cross-sectional view along line III-III of FIG. 2. FIG. 4 is a top view of a cutting device arranged adjacent to the expansion device according to the first embodiment. FIG. 5 is a side view of a cutting device arranged adjacent to the expansion device according to the first embodiment, as viewed from the Y2 direction side. FIG. 6 is a top view of the expansion device according to the first embodiment. FIG. 7 is a side view of the expansion device according to the first embodiment, as viewed from the Y2 direction side. FIG8 is a side view of the expansion device of the first embodiment viewed from the X1 direction. FIG9 is a block diagram showing the structure of the control system of the semiconductor wafer processing device of the first embodiment. FIG10 is a flow chart of the first half of the semiconductor wafer manufacturing process of the semiconductor wafer processing device of the first embodiment. FIG11 is a flow chart of the second half of the semiconductor wafer manufacturing process of the semiconductor wafer processing device of the first embodiment. FIG12 is a side view showing a state in which the clamping part of the expansion device of the first embodiment is configured in an ascending position. FIG13 is a side view showing a state in which the clamping part of the expansion device of the first embodiment is configured in a descending position. FIG. 14 is a side view showing a state where the ultraviolet irradiation part in the expansion device of the first embodiment irradiates ultraviolet rays. FIG. 15 is a top view showing a semiconductor wafer processing device provided with a cutting device and an expansion device of the second embodiment. FIG. 16 is a side view of the semiconductor wafer processing device provided with a cutting device and an expansion device of the second embodiment viewed from the Y2 direction. FIG. 17 is a side view of the semiconductor wafer processing device provided with a cutting device and an expansion device of the second embodiment viewed from the X1 direction. FIG. 18 is a block diagram showing the structure of the control system of the semiconductor wafer processing device of the second embodiment. FIG. 19 is a flow chart of the first half of the semiconductor wafer manufacturing process of the semiconductor wafer processing device of the second embodiment. FIG. 20 is a flow chart of the second half of the semiconductor wafer manufacturing process of the semiconductor wafer processing device of the second embodiment. FIG. 21 is a top view of the semiconductor wafer processing device provided with a cutting device and a grinding device of the third embodiment.

1: Cutting device

2: Expansion device

11: Base

12: Chuck workbench

12a: Adsorption part

12b: Clamping part

12d: Workbench moving mechanism

13: Laser Department

13a: Laser irradiation unit

13b: Installation components

14: Camera Department

14a: High-resolution camera

14b: Wide-angle camera

100: Semiconductor wafer processing equipment

121: X-direction moving mechanism

122: Y direction moving mechanism

200: Expand the headquarters

201: Base

202: Wafer box department

203: Lifting the hands

204: Adsorption of hands

204a: X-direction moving mechanism

204b: Z-direction moving mechanism

204c: Suction Hand

205: Base

207: Cooling unit

208: Expansion Department

210: Expansion and maintenance components

213: Pressure application part

214: Clamping part

P1: Handover position

P2: Handover position

P3: Handover position

P4: Handover position

P5: Handover position

W: Wafer ring structure

Claims (14)

A wafer processing device comprises: a wafer box section for accommodating wafers; a wafer placement section for taking out the wafers from the wafer box section or putting the wafers into the wafer box section; a cutting section for cutting the wafers; a wafer processing section for performing processing other than cutting on the wafers; and a wafer conveying section for receiving the wafers from the wafer placement section and conveying the wafers to the cutting section or the wafer processing section; and the wafer placement section is arranged in a manner of being located between the cutting section and the wafer processing section in the conveying direction of the wafer conveying section. The wafer processing device of claim 1, wherein the wafer handover position of the cutting section, the wafer handover position of the wafer processing section, and the wafer handover position from the wafer placement section to the wafer conveying section are arranged in a straight line, and the wafer conveying section is constructed so as to be movable in a straight line along the direction in which the wafer placement section, the cutting section, and the wafer processing section are arranged. The wafer processing device of claim 1 or 2, wherein the wafer conveying unit is constructed by conveying a wafer ring structure including a sheet member and a ring member between the wafer placement unit, the cutting unit and the wafer processing unit, the sheet member is attached to the wafer and has elasticity, and the ring member is attached to the sheet member in a state of surrounding the wafer. As in claim 1, the wafer processing device, wherein the wafer processing section includes an expansion section for stretching a sheet-like member equipped with the wafer to split the wafer, or a grinding section for grinding the wafer. As in claim 1, the wafer processing device, wherein the wafer box section and the wafer handling section are arranged along a direction orthogonal to the direction in which the wafer handling section, the cutting section, and the wafer processing section are arranged. As in claim 4, the wafer processing device, wherein the wafer cooling section and the wafer heating section of the expansion section of the wafer processing section are arranged along a direction orthogonal to the direction in which the wafer placement section, the cutting section and the wafer processing section are arranged. The wafer processing device of claim 6, wherein the expansion unit includes a wafer moving unit, which holds the wafer and moves the wafer between the wafer cooling unit and the wafer heating unit. The wafer processing device of claim 6, wherein the wafer box is arranged on one side of the front-rear direction relative to the wafer placement part, the wafer placement part is arranged on the other side of the front-rear direction of the wafer box, the wafer cooling part of the expansion part is arranged on the lateral side of the wafer placement part, and the wafer heating part of the expansion part is arranged on one side of the front-rear direction of the wafer cooling part. As in claim 8, the wafer processing device, wherein the wafer box section, the wafer placement section, the wafer cooling section of the expansion section, and the wafer heating section are arranged in a rectangular shape. The wafer processing device of claim 8 further comprises a pressure-applying portion for breaking the wafer that has been divided, and the pressure-applying portion is arranged at a position overlapping with the wafer heating portion in the front-rear direction. A wafer processing device comprises: a wafer box section for accommodating wafers; a wafer placement section for taking out the wafers from the wafer box section or putting the wafers into the wafer box section; a cutting section for cutting the wafers; and a wafer processing section for performing processing different from cutting on the wafers; and the wafer placement section is arranged in a manner of being located between the cutting section and the wafer processing section; and the wafer processing section includes an expansion section for dividing the wafers by stretching a sheet member on which the wafers are arranged, or a grinding section for grinding the wafers; a wafer cooling section and a wafer heating section of the expansion section of the wafer processing section are arranged along the wafer placement section. , the cutting section and the wafer processing section are arranged in a direction orthogonal to each other; the wafer box section is arranged on one side of the front-to-back direction relative to the wafer placement section, the wafer placement section is arranged on the other side of the front-to-back direction of the wafer box section, the wafer cooling section of the expansion section is arranged on the lateral side of the wafer placement section, and the wafer heating section of the expansion section is arranged on one side of the front-to-back direction of the wafer cooling section; and the wafer processing device further has a pressure-applying section for breaking the divided wafer, and the pressure-applying section is arranged between the wafer cooling section and the wafer heating section in the front-to-back direction. A wafer processing device comprises: a wafer box section for accommodating wafers; a wafer placement section for taking out the wafers from the wafer box section or putting the wafers into the wafer box section; a cutting section for cutting the wafers; and a wafer processing section for performing processing different from cutting on the wafers; and the wafer placement section is arranged in a manner of being located between the cutting section and the wafer processing section; and the wafer processing section includes an expansion section for dividing the wafers by stretching a sheet member on which the wafers are arranged, or a grinding section for grinding the wafers; a wafer cooling section and a wafer heating section of the expansion section of the wafer processing section are arranged along the wafer placement section and the cutting section. and the wafer processing unit is arranged in a direction orthogonal to the arrangement direction of the wafer processing unit; the wafer box unit is arranged on one side of the front-to-back direction relative to the wafer placement unit, the wafer placement unit is arranged on the other side of the front-to-back direction of the wafer box unit, the wafer cooling unit of the expansion unit is arranged on the lateral side of the wafer placement unit, and the wafer heating unit of the expansion unit is arranged on one side of the front-to-back direction of the wafer cooling unit; and the wafer processing device further has an ultraviolet irradiation unit, which irradiates ultraviolet rays to the sheet member attached with the wafer, and the ultraviolet irradiation unit is arranged at a position overlapping with the wafer heating unit in the front-to-back direction. A method for manufacturing semiconductor chips, comprising the following steps: taking out the wafer from a wafer box containing the wafer by a wafer handling unit, or putting the wafer into the wafer box; cutting by a cutting unit to divide the wafer into a plurality of semiconductor chips; performing processing different from cutting on the wafer by a wafer processing unit; and receiving the wafer from the wafer handling unit by a wafer conveying unit, and conveying the wafer to the cutting unit or the wafer processing unit; and the wafer handling unit is arranged in a manner of being located between the cutting unit and the wafer processing unit in the conveying direction of the wafer conveying unit. A semiconductor chip is manufactured by a wafer processing device, wherein the wafer processing device comprises: a wafer box portion for accommodating wafers; a wafer placement portion for taking out the wafers from the wafer box portion or putting the wafers into the wafer box portion; a cutting portion for cutting the wafers; a wafer processing portion for performing processing different from cutting on the wafers; and a wafer conveying portion for receiving the wafers from the wafer placement portion and conveying the wafers to the cutting portion or the wafer processing portion; and the wafer placement portion is arranged in a manner of being located between the cutting portion and the wafer processing portion in the conveying direction of the wafer conveying portion.