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TWI852675B - Airflow guiding mechanism and electronic device - Google Patents

Airflow guiding mechanism and electronic device Download PDF

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Publication number
TWI852675B
TWI852675B TW112125950A TW112125950A TWI852675B TW I852675 B TWI852675 B TW I852675B TW 112125950 A TW112125950 A TW 112125950A TW 112125950 A TW112125950 A TW 112125950A TW I852675 B TWI852675 B TW I852675B
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Taiwan
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airflow
blade
blades
housing
rotating shaft
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TW112125950A
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Chinese (zh)
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TW202403187A (en
Inventor
丁元翔
劉耕廷
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緯穎科技服務股份有限公司
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Priority to TW112125950A priority Critical patent/TWI852675B/en
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Publication of TWI852675B publication Critical patent/TWI852675B/en

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Abstract

An airflow guiding mechanism includes a casing and an airflow guiding member. The airflow guiding member is rotatably disposed in the casing. The airflow guiding member is able to rotate between a first position and a second position. When the airflow guiding member is located at the first position, the airflow guiding member separates two airflow passages at opposite sides of the airflow guiding member from each other. When the airflow guiding member is located at the second position, the two airflow passages communicate with each other.

Description

氣流導引機構及電子裝置 Airflow guiding mechanism and electronic device

本發明關於一種氣流導引機構,尤指一種可有效改善氣流噪音之氣流導引機構及裝設有此氣流導引機構之電子裝置。 The present invention relates to an airflow guiding mechanism, in particular to an airflow guiding mechanism that can effectively improve airflow noise and an electronic device equipped with the airflow guiding mechanism.

隨著科技的發展與進步,各式各樣的電子裝置(例如,電腦、伺服器等)已逐漸成為人們日常生活中所不可或缺之必需品。一般而言,電子裝置中安裝有硬碟以及用以對硬碟散熱之風扇。然而,風扇產生的氣流噪音會影響硬碟的讀寫效能,使得硬碟的性能下降。 With the development and progress of technology, various electronic devices (such as computers, servers, etc.) have gradually become indispensable necessities in people's daily lives. Generally speaking, electronic devices are equipped with hard drives and fans for cooling the hard drives. However, the airflow noise generated by the fan will affect the read and write performance of the hard drive, causing the performance of the hard drive to decline.

本發明提供一種可有效改善氣流噪音之氣流導引機構及裝設有此氣流導引機構之電子裝置,以解決上述問題。 The present invention provides an airflow guiding mechanism that can effectively improve airflow noise and an electronic device equipped with the airflow guiding mechanism to solve the above-mentioned problems.

根據一實施例,本發明之氣流導引機構包含一殼體以及一氣流導引件。氣流導引件可轉動地設置於殼體中。氣流導引件可於一第一位置與一第二位置之間轉動。當氣流導引件位於第一位置時,氣流導引件將其二側之二氣流通道隔開。當氣流導引件位於第二位置時,二氣流通道連通。 According to one embodiment, the airflow guide mechanism of the present invention includes a housing and an airflow guide. The airflow guide is rotatably disposed in the housing. The airflow guide can rotate between a first position and a second position. When the airflow guide is in the first position, the airflow guide separates two airflow channels on its two sides. When the airflow guide is in the second position, the two airflow channels are connected.

根據另一實施例,本發明之電子裝置包含一電子單元、二氣流產生單元以及一氣流導引機構。二氣流產生單元相對電子單元設置。氣流導引機構設置於電子單元與二氣流產生單元之間。氣流導引機構包含一殼體以及一氣流導引件。氣流導引件可轉動地設置於殼體中。氣流導引件可於一第一位置與一第二位置之間轉動。當氣流導引件位於第一位置時,氣流導引件將其二側之二氣流通道隔開。當氣流導引件位於第二位置時,二氣流通道連通。各氣流通道 對應二氣流產生單元的其中之一。 According to another embodiment, the electronic device of the present invention includes an electronic unit, two airflow generating units and an airflow guiding mechanism. The two airflow generating units are arranged relative to the electronic unit. The airflow guiding mechanism is arranged between the electronic unit and the two airflow generating units. The airflow guiding mechanism includes a housing and an airflow guiding member. The airflow guiding member is rotatably arranged in the housing. The airflow guiding member can rotate between a first position and a second position. When the airflow guiding member is in the first position, the airflow guiding member separates the two airflow channels on its two sides. When the airflow guiding member is in the second position, the two airflow channels are connected. Each airflow channel corresponds to one of the two airflow generating units.

綜上所述,本發明係於氣流導引機構之殼體中設置氣流導引件,其中氣流導引件可於第一位置與第二位置之間轉動。當氣流產生單元皆正常運作時,氣流產生單元所產生之氣流會均衡地流經氣流導引件之二側,使得氣流導引件維持於第一位置而不會轉動。當氣流導引件位於第一位置時,氣流導引件將其二側之二氣流通道隔開。此時,氣流產生單元所產生之氣流即會被氣流導引件隔開,進而避免氣流產生單元所產生之氣流噪音的交互影響。藉此,即可達到整流降噪的效果,以避免電子單元的性能受氣流噪音影響而下降。此外,當氣流產生單元的其中之一異常運作時,氣流產生單元所產生之氣流即會偏向氣流導引件之一側。此時,氣流導引件即會隨著氣流產生單元所產生之氣流的變化自第一位置轉動至第二位置。當氣流導引件位於第二位置時,二氣流通道連通,使得正常運作的氣流產生單元所產生之氣流可流經二氣流通道,以對電子單元進行散熱。藉此,即可避免散熱效率因氣流產生單元異常運作而大幅降低。 In summary, the present invention is to set an airflow guide in the housing of the airflow guide mechanism, wherein the airflow guide can rotate between a first position and a second position. When the airflow generating units are operating normally, the airflow generated by the airflow generating units will flow through the two sides of the airflow guide evenly, so that the airflow guide is maintained in the first position without rotating. When the airflow guide is in the first position, the airflow guide separates the two airflow channels on its two sides. At this time, the airflow generated by the airflow generating unit will be separated by the airflow guide, thereby avoiding the mutual influence of the airflow noise generated by the airflow generating unit. In this way, the effect of rectification and noise reduction can be achieved to avoid the performance of the electronic unit being affected by the airflow noise and declining. In addition, when one of the airflow generating units operates abnormally, the airflow generated by the airflow generating unit will deviate to one side of the airflow guide. At this time, the airflow guide will rotate from the first position to the second position as the airflow generated by the airflow generating unit changes. When the airflow guide is in the second position, the two airflow channels are connected, so that the airflow generated by the normally operating airflow generating unit can flow through the two airflow channels to dissipate heat for the electronic unit. In this way, it is possible to avoid a significant reduction in heat dissipation efficiency due to abnormal operation of the airflow generating unit.

關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。 The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the attached drawings.

1:電子裝置 1: Electronic devices

10:電子單元 10: Electronic unit

12a~12f:氣流產生單元 12a~12f: airflow generating unit

14,34:氣流導引機構 14,34: Airflow guiding mechanism

140,340:殼體 140,340: Shell

142,342:氣流導引件 142,342: Airflow guide

144:多孔隙結構 144:Porous structure

1400,3400:頂板 1400,3400: Top plate

1402,3402:底板 1402,3402: Base plate

1404,3404:側板 1404,3404: Side panels

1406:樞接結構 1406: hinge structure

1408,3406:止擋結構 1408,3406: Stop structure

1420,3420:轉軸 1420,3420: Rotation axis

1422,3422:第一葉片 1422,3422:First leaf

1424,3424:第二葉片 1424,3424: Second leaf

1426:第三葉片 1426: The third leaf

1426a:曲面 1426a: Surface

1426b:平面 1426b: plane

3426:凸輪結構 3426: Cam structure

AF:流動方向 AF: Flow direction

L1~L7:長度 L1~L7: Length

P1,P2:氣流通道 P1, P2: air flow channel

S1:入風側 S1: Windward side

S2:出風側 S2: Air outlet side

θ:夾角 θ: angle of intersection

第1圖為根據本發明一實施例之電子裝置的內部立體圖。 Figure 1 is a three-dimensional diagram of the interior of an electronic device according to an embodiment of the present invention.

第2圖為第1圖中的電子裝置的俯視圖。 Figure 2 is a top view of the electronic device in Figure 1.

第3圖為第1圖中的氣流導引機構的立體圖。 Figure 3 is a three-dimensional diagram of the airflow guide mechanism in Figure 1.

第4圖為第3圖中的氣流導引件的立體圖。 Figure 4 is a three-dimensional view of the airflow guide in Figure 3.

第5圖為第3圖中的氣流導引件自第一位置轉動至第二位置的立體圖。 Figure 5 is a three-dimensional diagram of the airflow guide in Figure 3 rotating from the first position to the second position.

第6圖為第5圖中的氣流導引件與止擋結構的俯視圖。 Figure 6 is a top view of the airflow guide and stop structure in Figure 5.

第7圖為根據本發明另一實施例之氣流導引件與止擋結構的俯視圖。 Figure 7 is a top view of the airflow guide and the stop structure according to another embodiment of the present invention.

第8圖為根據本發明另一實施例之氣流導引機構的立體圖。 Figure 8 is a three-dimensional diagram of an airflow guiding mechanism according to another embodiment of the present invention.

第9圖為第8圖中的氣流導引件的立體圖。 Figure 9 is a three-dimensional view of the airflow guide in Figure 8.

第10圖為第8圖中的氣流導引機構的俯視圖。 Figure 10 is a top view of the airflow guide mechanism in Figure 8.

第11圖為第10圖中的氣流導引件自第一位置轉動至第二位置的俯視圖。 Figure 11 is a top view of the airflow guide in Figure 10 rotating from the first position to the second position.

請參閱第1圖至第6圖,第1圖為根據本發明一實施例之電子裝置1的內部立體圖,第2圖為第1圖中的電子裝置1的俯視圖,第3圖為第1圖中的氣流導引機構14的立體圖,第4圖為第3圖中的氣流導引件142的立體圖,第5圖為第3圖中的氣流導引件142自第一位置轉動至第二位置的立體圖,第6圖為第5圖中的氣流導引件142與止擋結構1408的俯視圖。 Please refer to Figures 1 to 6. Figure 1 is a three-dimensional view of the interior of an electronic device 1 according to an embodiment of the present invention. Figure 2 is a top view of the electronic device 1 in Figure 1. Figure 3 is a three-dimensional view of the airflow guide mechanism 14 in Figure 1. Figure 4 is a three-dimensional view of the airflow guide 142 in Figure 3. Figure 5 is a three-dimensional view of the airflow guide 142 in Figure 3 rotating from the first position to the second position. Figure 6 is a top view of the airflow guide 142 and the stop structure 1408 in Figure 5.

如第1圖所示,電子裝置1包含一電子單元10、二氣流產生單元12a、12b以及一氣流導引機構14。二氣流產生單元12a、12b相對電子單元10設置,且氣流導引機構14設置於電子單元10與二氣流產生單元12a、12b之間。氣流產生單元12a、12b用以產生氣流,以對電子單元10進行散熱。氣流導引機構14用以改善氣流產生單元12a、12b所產生的氣流噪音,以避免電子單元10的性能受氣流噪音影響而下降。電子裝置1可為電腦、伺服器或其它電子裝置,視實際應用而定。一般而言,電子裝置1中還會設有運作時必要的軟硬體元件,如處理器、記憶體、電源供應器、應用程式、通訊模組等,視實際應用而定。在本實施例中,電子單元10可為硬碟,且氣流產生單元12a、12b可為風扇,但不以此為限。 As shown in FIG. 1 , the electronic device 1 includes an electronic unit 10, two airflow generating units 12a, 12b, and an airflow guiding mechanism 14. The two airflow generating units 12a, 12b are arranged relative to the electronic unit 10, and the airflow guiding mechanism 14 is arranged between the electronic unit 10 and the two airflow generating units 12a, 12b. The airflow generating units 12a, 12b are used to generate airflow to dissipate heat of the electronic unit 10. The airflow guiding mechanism 14 is used to improve the airflow noise generated by the airflow generating units 12a, 12b to prevent the performance of the electronic unit 10 from being affected by the airflow noise and being reduced. The electronic device 1 can be a computer, a server or other electronic device, depending on the actual application. Generally speaking, the electronic device 1 is also provided with necessary hardware and software components for operation, such as a processor, a memory, a power supply, an application, a communication module, etc., depending on the actual application. In this embodiment, the electronic unit 10 may be a hard disk, and the airflow generating units 12a and 12b may be fans, but are not limited thereto.

需說明的是,電子單元與氣流產生單元之數量可根據實際應用而決定,不以圖中所繪示之實施例為限。進一步來說,電子單元之數量可為一或多個,且氣流產生單元之數量可為至少二個。舉例而言,如第1圖與第2圖所示,電子裝置1可包含四電子單元10以及六氣流產生單元12a~12f,其中上述之二氣流 產生單元12a、12b即為六氣流產生單元12a~12f的其中之二。 It should be noted that the number of electronic units and airflow generating units can be determined according to actual applications and is not limited to the embodiments shown in the figure. Further, the number of electronic units can be one or more, and the number of airflow generating units can be at least two. For example, as shown in Figures 1 and 2, the electronic device 1 can include four electronic units 10 and six airflow generating units 12a~12f, wherein the two airflow generating units 12a and 12b mentioned above are two of the six airflow generating units 12a~12f.

如第2圖與第3圖所示,氣流導引機構14包含一殼體140以及一氣流導引件142。氣流導引件142可轉動地設置於殼體140中,使得氣流導引件142可於一第一位置(如第3圖所示)與一第二位置(如第5圖所示)之間轉動。需說明的是,氣流導引件之數量可根據實際應用而決定,不以圖中所繪示之實施例為限。進一步來說,氣流導引件之數量可為一或多個。舉例而言,如第2圖與第3圖所示,氣流導引機構14可包含五氣流導引件142,其中各氣流導引件142分別位於六氣流產生單元12a~12f的其中之二之間。 As shown in FIG. 2 and FIG. 3, the airflow guide mechanism 14 includes a housing 140 and an airflow guide 142. The airflow guide 142 is rotatably disposed in the housing 140, so that the airflow guide 142 can rotate between a first position (as shown in FIG. 3) and a second position (as shown in FIG. 5). It should be noted that the number of airflow guides can be determined according to actual applications and is not limited to the embodiments shown in the figures. Further, the number of airflow guides can be one or more. For example, as shown in FIG. 2 and FIG. 3, the airflow guide mechanism 14 can include five airflow guides 142, wherein each airflow guide 142 is located between two of the six airflow generating units 12a~12f.

如第3圖與第4圖所示,氣流導引件142包含一轉軸1420、一第一葉片1422、一第二葉片1424以及二第三葉片1426。轉軸1420樞接於殼體140且大致平行氣流產生單元12a、12b所產生之氣流之流動方向AF。在本實施例中,殼體140可定義一入風側S1以及一出風側S2,其中入風側S1與出風側S2相對。氣流產生單元12a、12b所產生之氣流可由入風側S1朝出風側S2的方向流動,因此,氣流之流動方向AF即為入風側S1朝出風側S2的方向。在本實施例中,殼體140可包含一頂板1400、一底板1402以及二側板1404,其中二側板1404連接頂板1400與底板1402,使得殼體140呈方形。此外,對應各氣流導引件142,殼體140之入風側S1與出風側S2可另包含二樞接結構1406,且二樞接結構1406連接於頂板1400與底板1402。在本實施例中,各樞接結構1406可為具有樞接孔之柱體。轉軸1420之二端即是樞接於二樞接結構1406,使得氣流導引件142可轉動地設置於殼體140中。當轉軸1420樞接於二樞接結構1406時,轉軸1420係大致平行頂板1400與底板1402。需說明的是,上述”大致平行”的定義包含轉軸1420略微歪斜的情況。 As shown in FIG. 3 and FIG. 4 , the airflow guide 142 includes a rotating shaft 1420, a first blade 1422, a second blade 1424, and two third blades 1426. The rotating shaft 1420 is pivotally connected to the housing 140 and is substantially parallel to the flow direction AF of the airflow generated by the airflow generating units 12a and 12b. In this embodiment, the housing 140 may define an air inlet side S1 and an air outlet side S2, wherein the air inlet side S1 is opposite to the air outlet side S2. The airflow generated by the airflow generating units 12a and 12b may flow from the air inlet side S1 toward the air outlet side S2, and therefore, the flow direction AF of the airflow is the direction from the air inlet side S1 toward the air outlet side S2. In this embodiment, the housing 140 may include a top plate 1400, a bottom plate 1402, and two side plates 1404, wherein the two side plates 1404 connect the top plate 1400 and the bottom plate 1402, so that the housing 140 is square. In addition, corresponding to each airflow guide 142, the air inlet side S1 and the air outlet side S2 of the housing 140 may further include two hinge structures 1406, and the two hinge structures 1406 are connected to the top plate 1400 and the bottom plate 1402. In this embodiment, each hinge structure 1406 may be a column with a hinge hole. The two ends of the rotating shaft 1420 are pivoted to the two pivot structures 1406, so that the airflow guide 142 can be rotatably disposed in the housing 140. When the rotating shaft 1420 is pivoted to the two pivot structures 1406, the rotating shaft 1420 is substantially parallel to the top plate 1400 and the bottom plate 1402. It should be noted that the above definition of "substantially parallel" includes the situation where the rotating shaft 1420 is slightly skewed.

如第4圖所示,第一葉片1422與第二葉片1424連接於轉軸1420之相對二側,且二第三葉片1426亦連接於轉軸1420之相對二側,使得氣流導引件142呈十字形。在本實施例中,二第三葉片1426在轉軸1420之徑向上的長度L3小於第一 葉片1422與第二葉片1424在轉軸1420之徑向上的長度L1、L2。此外,第一葉片1422在轉軸1420之軸向上的長度L4小於第二葉片1424在轉軸1420之軸向上的長度L5,且第一葉片1422之質量小於第二葉片1424之質量。因此,氣流導引件142之整體重心會低於轉軸1420之軸心。在無外力的自然狀態下,氣流導引件142便會維持於第3圖所示之第一位置。需說明的是,本發明亦可藉由改變第一葉片1422與第二葉片1424之材料來改變第一葉片1422與第二葉片1424之質量,使得氣流導引件142之整體重心低於轉軸1420之軸心。 As shown in FIG. 4 , the first blade 1422 and the second blade 1424 are connected to opposite sides of the rotating shaft 1420, and the two third blades 1426 are also connected to opposite sides of the rotating shaft 1420, so that the airflow guide 142 is in a cross shape. In this embodiment, the length L3 of the two third blades 1426 in the radial direction of the rotating shaft 1420 is smaller than the length L1 and L2 of the first blade 1422 and the second blade 1424 in the radial direction of the rotating shaft 1420. In addition, the length L4 of the first blade 1422 in the axial direction of the rotating shaft 1420 is smaller than the length L5 of the second blade 1424 in the axial direction of the rotating shaft 1420, and the mass of the first blade 1422 is smaller than the mass of the second blade 1424. Therefore, the overall center of gravity of the airflow guide 142 will be lower than the axis of the rotating shaft 1420. In a natural state without external force, the airflow guide 142 will maintain the first position shown in Figure 3. It should be noted that the present invention can also change the mass of the first blade 1422 and the second blade 1424 by changing the material of the first blade 1422 and the second blade 1424, so that the overall center of gravity of the airflow guide 142 is lower than the axis of the rotating shaft 1420.

在本實施例中,各第三葉片1426具有一曲面1426a以及一平面1426b,其中曲面1426a朝向第一葉片1422之方向,且平面1426b朝向第二葉片1424之方向。當氣流通過各第三葉片1426時,平面1426b下方的壓力會高於曲面1426a上方的壓力。此時,壓力差即會對第三葉片1426產生抬升力。需說明的是,第三葉片1426之結構與尺寸可根據流體力學之原理來設計,使得第三葉片1426的兩側產生壓力差,而不限於本實施例的結構與尺寸,在此不再贅述。 In this embodiment, each third blade 1426 has a curved surface 1426a and a flat surface 1426b, wherein the curved surface 1426a faces the direction of the first blade 1422, and the flat surface 1426b faces the direction of the second blade 1424. When the air flows through each third blade 1426, the pressure below the flat surface 1426b will be higher than the pressure above the curved surface 1426a. At this time, the pressure difference will generate a lifting force on the third blade 1426. It should be noted that the structure and size of the third blade 1426 can be designed according to the principles of fluid mechanics, so that a pressure difference is generated on both sides of the third blade 1426, and is not limited to the structure and size of this embodiment, which will not be elaborated here.

以下係以二氣流產生單元12a、12b與對應的氣流導引件142來說明本發明之技術特點。當二氣流產生單元12a、12b皆正常運作時,二氣流產生單元12a、12b所產生之氣流會均衡地流經氣流導引件142之二側。此時,抬升力對二第三葉片1426所造成的力矩會相互抵消,使得氣流導引件142維持於第3圖所示之第一位置而不會轉動。當氣流導引件142位於第3圖所示之第一位置時,氣流導引件142之第一葉片1422與第二葉片1424會將其二側之二氣流通道P1、P2隔開,其中各氣流通道P1、P2對應二氣流產生單元12a、12b的其中之一。此時,二氣流產生單元12a、12b所產生之氣流即會被氣流導引件142隔開,進而避免二氣流產生單元12a、12b所產生之氣流噪音的交互影響。藉此,即可達到整流降噪的效果,以避免電子單元10的性能受氣流噪音影響而下降。 The following is a description of the technical features of the present invention using two airflow generating units 12a, 12b and the corresponding airflow guide 142. When the two airflow generating units 12a, 12b are operating normally, the airflow generated by the two airflow generating units 12a, 12b will flow evenly through the two sides of the airflow guide 142. At this time, the torques caused by the lifting force on the two third blades 1426 will offset each other, so that the airflow guide 142 remains in the first position shown in FIG. 3 without rotating. When the airflow guide 142 is in the first position shown in FIG. 3, the first blade 1422 and the second blade 1424 of the airflow guide 142 will separate the two airflow channels P1, P2 on its two sides, wherein each airflow channel P1, P2 corresponds to one of the two airflow generating units 12a, 12b. At this time, the airflows generated by the two airflow generating units 12a and 12b will be separated by the airflow guide 142, thereby avoiding the mutual influence of the airflow noise generated by the two airflow generating units 12a and 12b. In this way, the effect of rectification and noise reduction can be achieved to prevent the performance of the electronic unit 10 from being affected by the airflow noise and being reduced.

此外,當二氣流產生單元12a、12b的其中之一異常運作時,二氣流產 生單元12a、12b所產生之氣流即會偏向氣流導引件142之一側。舉例而言,當氣流產生單元12a異常運作時,氣流會偏向第3圖所示之氣流導引件142之右側。此時,抬升力對右側的第三葉片1426所造成的力矩便無法平衡,使得氣流導引件142逆時針轉動至第5圖所示之第二位置。當氣流導引件142位於第5圖所示之第二位置時,二氣流通道P1、P2即會經由二第三葉片1426連通,使得正常運作的氣流產生單元12b所產生之氣流可流經二氣流通道P1、P2,以對電子單元10進行散熱。藉此,即可避免散熱效率因氣流產生單元12a異常運作而大幅降低。同理,當氣流偏向第3圖所示之氣流導引件142之左側時,氣流導引件142便會順時針轉動至與第5圖所示之第二位置相反之另一第二位置,使得二氣流通道P1、P2經由二第三葉片1426連通。 In addition, when one of the two airflow generating units 12a and 12b operates abnormally, the airflow generated by the two airflow generating units 12a and 12b will deviate to one side of the airflow guide 142. For example, when the airflow generating unit 12a operates abnormally, the airflow will deviate to the right side of the airflow guide 142 shown in FIG. 3. At this time, the moment of force caused by the lifting force on the third blade 1426 on the right side cannot be balanced, so that the airflow guide 142 rotates counterclockwise to the second position shown in FIG. 5. When the airflow guide 142 is in the second position shown in FIG. 5, the two airflow channels P1 and P2 are connected through the two third blades 1426, so that the airflow generated by the normally operating airflow generating unit 12b can flow through the two airflow channels P1 and P2 to dissipate heat for the electronic unit 10. In this way, it is possible to avoid a significant reduction in heat dissipation efficiency due to abnormal operation of the airflow generating unit 12a. Similarly, when the airflow deviates to the left side of the airflow guide 142 shown in FIG. 3, the airflow guide 142 will rotate clockwise to another second position opposite to the second position shown in FIG. 5, so that the two airflow channels P1 and P2 are connected through the two third blades 1426.

如第5圖與第6圖所示,殼體140可具有一止擋結構1408,其中止擋結構1408可位於轉軸1420與樞接結構1406之樞接處。當氣流導引件142位於第5圖與第6圖所示之第二位置時,止擋結構1408會止擋第二葉片1424,以限制氣流導引件142轉動。由於第一葉片1422在轉軸1420之軸向上的長度L4小於第二葉片1424在轉軸1420之軸向上的長度L5,因此,第一葉片1422在轉動的過程中不會碰到止擋結構1408。 As shown in FIG. 5 and FIG. 6, the housing 140 may have a stop structure 1408, wherein the stop structure 1408 may be located at the pivot point between the rotating shaft 1420 and the pivot structure 1406. When the airflow guide 142 is located at the second position shown in FIG. 5 and FIG. 6, the stop structure 1408 stops the second blade 1424 to limit the rotation of the airflow guide 142. Since the length L4 of the first blade 1422 in the axial direction of the rotating shaft 1420 is less than the length L5 of the second blade 1424 in the axial direction of the rotating shaft 1420, the first blade 1422 will not hit the stop structure 1408 during the rotation process.

在本實施例中,殼體140中設置有多個氣流導引件142。當有一氣流導引件142因氣流變化轉動至第二位置時,其它的氣流導引件142也會因氣流變化而轉動至第二位置(如第5圖所示),使得氣流更均衡地分配給所有的電子單元10。 In this embodiment, a plurality of airflow guides 142 are disposed in the housing 140. When one airflow guide 142 rotates to the second position due to airflow changes, the other airflow guides 142 will also rotate to the second position due to airflow changes (as shown in FIG. 5 ), so that the airflow is more evenly distributed to all electronic units 10.

如第1圖與第2圖所示,氣流導引機構14可另包含一多孔隙結構144,設置於殼體140之入風側S1且位於電子單元10與殼體140之間。多孔隙結構144係用以穩定流入殼體140之氣流,以防止氣流導引件142受到不穩定的氣流影響而轉動。在本實施例中,多孔隙結構144可為蜂巢狀濾網或其它可穩定氣流之結構, 視實際應用而定。在另一實施例中,多孔隙結構144亦可省略。 As shown in FIG. 1 and FIG. 2, the airflow guide mechanism 14 may further include a porous structure 144, which is disposed on the air inlet side S1 of the housing 140 and between the electronic unit 10 and the housing 140. The porous structure 144 is used to stabilize the airflow flowing into the housing 140 to prevent the airflow guide 142 from rotating due to the unstable airflow. In this embodiment, the porous structure 144 may be a honeycomb filter or other structure that can stabilize the airflow, depending on the actual application. In another embodiment, the porous structure 144 may also be omitted.

請參閱第7圖,第7圖為根據本發明另一實施例之氣流導引件142與止擋結構1408的俯視圖。如第7圖所示,藉由適當的結構設計,止擋結構1408亦可位於對應第二葉片1424之端部處。當氣流導引件142位於第7圖所示之第二位置時,止擋結構1408即會止擋第二葉片1424,以限制氣流導引件142轉動。 Please refer to Figure 7, which is a top view of the airflow guide 142 and the stop structure 1408 according to another embodiment of the present invention. As shown in Figure 7, through appropriate structural design, the stop structure 1408 can also be located at the end corresponding to the second blade 1424. When the airflow guide 142 is located at the second position shown in Figure 7, the stop structure 1408 will stop the second blade 1424 to limit the rotation of the airflow guide 142.

請參閱第8圖至第11圖,第8圖為根據本發明另一實施例之氣流導引機構34的立體圖,第9圖為第8圖中的氣流導引件342的立體圖,第10圖為第8圖中的氣流導引機構34的俯視圖,第11圖為第10圖中的氣流導引件342自第一位置轉動至第二位置的俯視圖。 Please refer to Figures 8 to 11. Figure 8 is a three-dimensional view of the airflow guide mechanism 34 according to another embodiment of the present invention. Figure 9 is a three-dimensional view of the airflow guide member 342 in Figure 8. Figure 10 is a top view of the airflow guide mechanism 34 in Figure 8. Figure 11 is a top view of the airflow guide member 342 in Figure 10 rotating from the first position to the second position.

如第8圖所示,氣流導引機構34包含一殼體340以及一氣流導引件342。氣流導引件342可轉動地設置於殼體340中,使得氣流導引件342可於一第一位置(如第10圖所示)與一第二位置(如第11圖所示)之間轉動。第1圖中的氣流導引機構14可以第8圖中的氣流導引機構34替換,且多孔隙結構144亦可設置於氣流導引機構34之殼體340之入風側S1。需說明的是,氣流導引件之數量可根據實際應用而決定,不以圖中所繪示之實施例為限。進一步來說,氣流導引件之數量可為一或多個。舉例而言,如第8圖所示,氣流導引機構34可包含五氣流導引件342。 As shown in FIG. 8 , the airflow guide mechanism 34 includes a housing 340 and an airflow guide 342. The airflow guide 342 is rotatably disposed in the housing 340, so that the airflow guide 342 can rotate between a first position (as shown in FIG. 10 ) and a second position (as shown in FIG. 11 ). The airflow guide mechanism 14 in FIG. 1 can be replaced by the airflow guide mechanism 34 in FIG. 8 , and the porous structure 144 can also be disposed on the air inlet side S1 of the housing 340 of the airflow guide mechanism 34. It should be noted that the number of airflow guides can be determined according to actual applications and is not limited to the embodiments shown in the figures. Furthermore, the number of airflow guides can be one or more. For example, as shown in FIG. 8 , the airflow guide mechanism 34 may include five airflow guides 342 .

如第8圖與第9圖所示,氣流導引件342包含一轉軸3420、一第一葉片3422以及二第二葉片3424。在本實施例中,各第二葉片3424為一表面均勻的實心板體,亦即,各第二葉片3424之表面無凹凸結構或孔洞。轉軸3420樞接於殼體340且大致垂直氣流產生單元12a、12b所產生之氣流之流動方向AF。在本實施例中,殼體340可定義一入風側S1以及一出風側S2,其中入風側S1與出風側S2相對。第一葉片3422朝向殼體340之入風側S1,且二第二葉片3424朝向殼體340之出風側S2。氣流產生單元12a、12b所產生之氣流可由入風側S1朝出風側S2的方向流動, 因此,氣流之流動方向AF即為入風側S1朝出風側S2的方向。在本實施例中,殼體340可包含一頂板3400、一底板3402以及二側板3404,其中二側板3404連接頂板3400與底板3402,使得殼體340呈方形。轉軸3420之二端可樞接於頂板3400與底板3402,使得氣流導引件342可轉動地設置於殼體340中。當轉軸3420樞接於頂板3400與底板3402時,轉軸3420係大致垂直頂板3400與底板3402。需說明的是,上述”大致垂直”的定義包含轉軸3420略微歪斜的情況。 As shown in FIG. 8 and FIG. 9 , the airflow guide 342 includes a rotating shaft 3420, a first blade 3422, and two second blades 3424. In the present embodiment, each second blade 3424 is a solid plate with a uniform surface, that is, the surface of each second blade 3424 has no concave-convex structure or holes. The rotating shaft 3420 is pivotally connected to the housing 340 and is substantially perpendicular to the flow direction AF of the airflow generated by the airflow generating units 12a and 12b. In the present embodiment, the housing 340 can define an air inlet side S1 and an air outlet side S2, wherein the air inlet side S1 is opposite to the air outlet side S2. The first blade 3422 faces the air inlet side S1 of the housing 340, and the second blades 3424 face the air outlet side S2 of the housing 340. The airflow generated by the airflow generating units 12a and 12b can flow from the air inlet side S1 to the air outlet side S2, and thus, the airflow flow direction AF is the direction from the air inlet side S1 to the air outlet side S2. In this embodiment, the housing 340 may include a top plate 3400, a bottom plate 3402, and two side plates 3404, wherein the two side plates 3404 connect the top plate 3400 and the bottom plate 3402, so that the housing 340 is square. The two ends of the rotating shaft 3420 can be pivoted to the top plate 3400 and the bottom plate 3402, so that the airflow guide 342 can be rotatably arranged in the housing 340. When the rotating shaft 3420 is pivoted to the top plate 3400 and the bottom plate 3402, the rotating shaft 3420 is substantially perpendicular to the top plate 3400 and the bottom plate 3402. It should be noted that the above definition of "substantially perpendicular" includes the situation where the rotating shaft 3420 is slightly tilted.

如第9圖所示,第一葉片3422與二第二葉片3424自轉軸3420延伸出,其中二第二葉片3424對稱地位於第一葉片3422之一端的二側。因此,轉軸3420係位於第一葉片3422與二第二葉片3424之間。此外,第一葉片3422與二第二葉片3424之寬度朝遠離轉軸3420的方向漸減。在本實施例中,第一葉片3422與二第二葉片3424可一體成型為一扇葉結構,使得此扇葉結構可直接套設於轉軸3420上。在另一實施例中,第一葉片3422與二第二葉片3424亦可為獨立元件,視實際應用而定。在本實施例中,二第二葉片3424在轉軸3420之徑向上的長度L6小於第一葉片3422在轉軸3420之徑向上的長度L7。在本實施例中,各第二葉片3424與第一葉片3422之夾角θ大於90度,但不以此為限。各第二葉片3424與第一葉片3422之夾角θ可根據流體力學之原理來設計,在此不再贅述。 As shown in FIG. 9 , the first blade 3422 and the two second blades 3424 extend from the rotating shaft 3420, wherein the two second blades 3424 are symmetrically located on two sides of one end of the first blade 3422. Therefore, the rotating shaft 3420 is located between the first blade 3422 and the two second blades 3424. In addition, the widths of the first blade 3422 and the two second blades 3424 gradually decrease in a direction away from the rotating shaft 3420. In this embodiment, the first blade 3422 and the two second blades 3424 can be integrally formed into a fan blade structure, so that the fan blade structure can be directly mounted on the rotating shaft 3420. In another embodiment, the first blade 3422 and the two second blades 3424 can also be independent components, depending on the actual application. In this embodiment, the length L6 of the second blades 3424 in the radial direction of the rotation axis 3420 is less than the length L7 of the first blade 3422 in the radial direction of the rotation axis 3420. In this embodiment, the angle θ between each second blade 3424 and the first blade 3422 is greater than 90 degrees, but not limited thereto. The angle θ between each second blade 3424 and the first blade 3422 can be designed according to the principles of fluid mechanics, which will not be elaborated here.

以下係以二氣流產生單元12a、12b(如第1圖所示)與對應的氣流導引件342(如第10圖與第11圖所示)來說明本發明之技術特點。當二氣流產生單元12a、12b皆正常運作時,二氣流產生單元12a、12b所產生之氣流會均衡地流經氣流導引件342之二側。此時,氣流推力對二第二葉片3424所造成的力矩會相互抵消,使得氣流導引件342維持於第10圖所示之第一位置而不會轉動。當氣流導引件342位於第10圖所示之第一位置時,氣流導引件342之第一葉片3422與二第二葉片3424會將其二側之二氣流通道P1、P2隔開,其中各氣流通道P1、P2對應二氣流產生單元12a、12b的其中之一。此時,二氣流產生單元12a、12b所產生之氣流 即會被氣流導引件342隔開,進而避免二氣流產生單元12a、12b所產生之氣流噪音的交互影響。藉此,即可達到整流降噪的效果,以避免電子單元10(如第1圖所示)的性能受氣流噪音影響而下降。 The following is a description of the technical features of the present invention using two airflow generating units 12a, 12b (as shown in FIG. 1) and the corresponding airflow guide 342 (as shown in FIG. 10 and FIG. 11). When the two airflow generating units 12a, 12b are operating normally, the airflow generated by the two airflow generating units 12a, 12b will flow evenly through the two sides of the airflow guide 342. At this time, the torques caused by the airflow thrust on the two second blades 3424 will offset each other, so that the airflow guide 342 is maintained in the first position shown in FIG. 10 and does not rotate. When the airflow guide 342 is located at the first position shown in FIG. 10, the first blade 3422 and the second blades 3424 of the airflow guide 342 will separate the two airflow channels P1 and P2 on both sides thereof, wherein each airflow channel P1 and P2 corresponds to one of the two airflow generating units 12a and 12b. At this time, the airflow generated by the two airflow generating units 12a and 12b will be separated by the airflow guide 342, thereby avoiding the mutual influence of the airflow noise generated by the two airflow generating units 12a and 12b. In this way, the effect of rectifying and reducing noise can be achieved, so as to avoid the performance of the electronic unit 10 (as shown in FIG. 1) being affected by the airflow noise and reduced.

此外,當二氣流產生單元12a、12b的其中之一異常運作時,二氣流產生單元12a、12b所產生之氣流即會偏向氣流導引件342之一側。舉例而言,當氣流產生單元12a異常運作時,氣流會偏向第10圖所示之氣流導引件342之右側。此時,氣流推力對右側的第二葉片3424所造成的力矩便無法平衡,使得氣流導引件342逆時針轉動至第11圖所示之第二位置。當氣流導引件342位於第11圖所示之第二位置時,第一葉片3422與二第二葉片3424偏轉,使得二氣流通道P1、P2連通。此時,正常運作的氣流產生單元12b所產生之氣流可流經二氣流通道P1、P2,以對電子單元10進行散熱。藉此,即可避免散熱效率因氣流產生單元12a異常運作而大幅降低。同理,當氣流偏向第10圖所示之氣流導引件342之左側時,氣流導引件342便會順時針轉動至與第11圖所示之第二位置相反之另一第二位置,使得二氣流通道P1、P2連通。 In addition, when one of the two airflow generating units 12a and 12b operates abnormally, the airflow generated by the two airflow generating units 12a and 12b will deviate to one side of the airflow guide 342. For example, when the airflow generating unit 12a operates abnormally, the airflow will deviate to the right side of the airflow guide 342 shown in Figure 10. At this time, the torque caused by the airflow thrust on the second blade 3424 on the right side cannot be balanced, so that the airflow guide 342 rotates counterclockwise to the second position shown in Figure 11. When the airflow guide 342 is located in the second position shown in Figure 11, the first blade 3422 and the second blades 3424 are deflected, so that the two airflow channels P1 and P2 are connected. At this time, the airflow generated by the normally operating airflow generating unit 12b can flow through the two airflow channels P1 and P2 to dissipate heat for the electronic unit 10. In this way, the heat dissipation efficiency can be prevented from being greatly reduced due to the abnormal operation of the airflow generating unit 12a. Similarly, when the airflow deviates to the left side of the airflow guide 342 shown in Figure 10, the airflow guide 342 will rotate clockwise to another second position opposite to the second position shown in Figure 11, so that the two airflow channels P1 and P2 are connected.

如第8圖至第11圖所示,轉軸3420之一端可具有一凸輪結構3426,且殼體340可具有一止擋結構3406。在本實施例中,凸輪結構3426與止擋結構3406位於頂板3400之一側。在另一實施例中,凸輪結構3426與止擋結構3406亦可位於底板3402之一側。此外,止擋結構3406可包含二相對的凸塊,且凸輪結構3426設置於二凸塊之間。當氣流導引件342位於第11圖所示之第二位置時,止擋結構3406會止擋凸輪結構3426,以限制氣流導引件342轉動。 As shown in FIGS. 8 to 11, one end of the rotating shaft 3420 may have a cam structure 3426, and the housing 340 may have a stop structure 3406. In this embodiment, the cam structure 3426 and the stop structure 3406 are located on one side of the top plate 3400. In another embodiment, the cam structure 3426 and the stop structure 3406 may also be located on one side of the bottom plate 3402. In addition, the stop structure 3406 may include two opposite protrusions, and the cam structure 3426 is disposed between the two protrusions. When the airflow guide 342 is located in the second position shown in FIG. 11, the stop structure 3406 stops the cam structure 3426 to limit the rotation of the airflow guide 342.

在本實施例中,殼體340中設置有多個氣流導引件342。當有一氣流導引件342因氣流變化轉動至第二位置時,其它的氣流導引件342也會因氣流變化而轉動至第二位置(如第11圖所示),使得氣流更均衡地分配給所有的電子單元10。 In this embodiment, a plurality of airflow guides 342 are disposed in the housing 340. When one airflow guide 342 rotates to the second position due to airflow changes, the other airflow guides 342 will also rotate to the second position due to airflow changes (as shown in FIG. 11 ), so that the airflow is more evenly distributed to all electronic units 10.

綜上所述,本發明係於氣流導引機構之殼體中設置氣流導引件,其中氣流導引件可於第一位置與第二位置之間轉動。當氣流產生單元皆正常運作時,氣流產生單元所產生之氣流會均衡地流經氣流導引件之二側,使得氣流導引件維持於第一位置而不會轉動。當氣流導引件位於第一位置時,氣流導引件將其二側之二氣流通道隔開。此時,氣流產生單元所產生之氣流即會被氣流導引件隔開,進而避免氣流產生單元所產生之氣流噪音的交互影響。藉此,即可達到整流降噪的效果,以避免電子單元的性能受氣流噪音影響而下降。此外,當氣流產生單元的其中之一異常運作時,氣流產生單元所產生之氣流即會偏向氣流導引件之一側。此時,氣流導引件即會隨著氣流產生單元所產生之氣流的變化自第一位置轉動至第二位置。當氣流導引件位於第二位置時,二氣流通道連通,使得正常運作的氣流產生單元所產生之氣流可流經二氣流通道,以對電子單元進行散熱。藉此,即可避免散熱效率因氣流產生單元異常運作而大幅降低。 In summary, the present invention is to set an airflow guide in the housing of the airflow guide mechanism, wherein the airflow guide can rotate between a first position and a second position. When the airflow generating units are operating normally, the airflow generated by the airflow generating units will flow through the two sides of the airflow guide evenly, so that the airflow guide is maintained in the first position without rotating. When the airflow guide is in the first position, the airflow guide separates the two airflow channels on its two sides. At this time, the airflow generated by the airflow generating unit will be separated by the airflow guide, thereby avoiding the mutual influence of the airflow noise generated by the airflow generating unit. In this way, the effect of rectification and noise reduction can be achieved to avoid the performance of the electronic unit being affected by the airflow noise and declining. In addition, when one of the airflow generating units operates abnormally, the airflow generated by the airflow generating unit will deviate to one side of the airflow guide. At this time, the airflow guide will rotate from the first position to the second position as the airflow generated by the airflow generating unit changes. When the airflow guide is in the second position, the two airflow channels are connected, so that the airflow generated by the normally operating airflow generating unit can flow through the two airflow channels to dissipate heat for the electronic unit. In this way, it is possible to avoid a significant reduction in heat dissipation efficiency due to abnormal operation of the airflow generating unit.

以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The above is only the preferred embodiment of the present invention. All equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the present invention.

34:氣流導引機構 34: Airflow guiding mechanism

340:殼體 340: Shell

342:氣流導引件 342: Airflow guide

3406:止擋結構 3406: Stop structure

3420:轉軸 3420: Rotating axis

3422:第一葉片 3422: First leaf

3424:第二葉片 3424: Second leaf

3426:凸輪結構 3426: Cam structure

P1,P2:氣流通道 P1, P2: air flow channel

Claims (16)

一種氣流導引機構,包含:一殼體;以及一氣流導引件,可轉動地設置於該殼體中,該氣流導引件可於一第一位置與一第二位置之間轉動,該氣流導引件包含一轉軸、一第一葉片以及二第二葉片,該轉軸樞接於該殼體,該第一葉片與該二第二葉片自該轉軸延伸出,該第一葉片朝向該殼體之一入風側,且該二第二葉片朝向該殼體之一出風側;其中,當該氣流導引件位於該第一位置時,該第一葉片與該二第二葉片將該氣流導引件二側之二氣流通道隔開;當該氣流導引件位於該第二位置時,該第一葉片與該二第二葉片偏轉,使得該二氣流通道連通。 An airflow guide mechanism comprises: a housing; and an airflow guide rotatably disposed in the housing, the airflow guide can rotate between a first position and a second position, the airflow guide comprises a rotating shaft, a first blade and two second blades, the rotating shaft is pivoted to the housing, the first blade and the two second blades extend from the rotating shaft, the first blade faces an air inlet side of the housing, and the two second blades face an air outlet side of the housing; wherein, when the airflow guide is located at the first position, the first blade and the two second blades separate two airflow channels on two sides of the airflow guide; when the airflow guide is located at the second position, the first blade and the two second blades deflect, so that the two airflow channels are connected. 如請求項1所述之氣流導引機構,其中該二第二葉片對稱地位於該第一葉片之一端的二側,該二第二葉片在該轉軸之徑向上的長度小於該第一葉片在該轉軸之徑向上的長度。 The airflow guiding mechanism as described in claim 1, wherein the two second blades are symmetrically located on two sides of one end of the first blade, and the length of the two second blades in the radial direction of the rotating shaft is smaller than the length of the first blade in the radial direction of the rotating shaft. 如請求項1所述之氣流導引機構,其中該第一葉片與該二第二葉片一體成型為一扇葉結構,該扇葉結構套設於該轉軸上。 The airflow guiding mechanism as described in claim 1, wherein the first blade and the two second blades are integrally formed into a fan blade structure, and the fan blade structure is sleeved on the rotating shaft. 如請求項1所述之氣流導引機構,其中該轉軸之一端具有一凸輪結構,該殼體具有一止擋結構;當該氣流導引件位於該第二位置時,該止擋結構止擋該凸輪結構,以限制該氣流導引件轉動。 The airflow guide mechanism as described in claim 1, wherein one end of the rotating shaft has a cam structure, and the housing has a stop structure; when the airflow guide is in the second position, the stop structure stops the cam structure to limit the rotation of the airflow guide. 如請求項1所述之氣流導引機構,其中各該第二葉片為一表面均勻的實心板體。 The airflow guiding mechanism as described in claim 1, wherein each of the second blades is a solid plate with a uniform surface. 如請求項1所述之氣流導引機構,其中該轉軸位於該第一葉片與該二第二葉片之間。 The airflow guiding mechanism as described in claim 1, wherein the rotating shaft is located between the first blade and the two second blades. 如請求項1所述之氣流導引機構,其中該第一葉片與該二第二葉 片之寬度朝遠離該轉軸的方向漸減。 The airflow guiding mechanism as described in claim 1, wherein the width of the first blade and the two second blades gradually decreases in the direction away from the rotating shaft. 如請求項1所述之氣流導引機構,另包含一多孔隙結構,設置於該殼體之該入風側。 The airflow guiding mechanism as described in claim 1 further comprises a multi-porous structure disposed on the air inlet side of the housing. 一種電子裝置,包含:一電子單元;二氣流產生單元,相對該電子單元設置;以及一氣流導引機構,設置於該電子單元與該二氣流產生單元之間,該氣流導引機構包含:一殼體;以及一氣流導引件,可轉動地設置於該殼體中,該氣流導引件可於一第一位置與一第二位置之間轉動,該氣流導引件包含一轉軸、一第一葉片以及二第二葉片,該轉軸樞接於該殼體,該第一葉片與該二第二葉片自該轉軸延伸出,該第一葉片朝向該殼體之一入風側,且該二第二葉片朝向該殼體之一出風側;其中,當該氣流導引件位於該第一位置時,該第一葉片與該二第二葉片將該氣流導引件二側之二氣流通道隔開;當該氣流導引件位於該第二位置時,該第一葉片與該二第二葉片偏轉,使得該二氣流通道連通;各該氣流通道對應該二氣流產生單元的其中之一。 An electronic device includes: an electronic unit; two airflow generating units, which are arranged relative to the electronic unit; and an airflow guiding mechanism, which is arranged between the electronic unit and the two airflow generating units, wherein the airflow guiding mechanism includes: a housing; and an airflow guiding member, which is rotatably arranged in the housing, and the airflow guiding member can rotate between a first position and a second position, and the airflow guiding member includes a rotating shaft, a first blade, and two second blades, wherein the rotating shaft is pivotally connected to the housing, and the first blade is arranged between the first blade and the second blade. The first blade and the two second blades extend from the rotating shaft, the first blade faces an air inlet side of the housing, and the two second blades face an air outlet side of the housing; wherein, when the airflow guide is located at the first position, the first blade and the two second blades separate the two airflow channels on the two sides of the airflow guide; when the airflow guide is located at the second position, the first blade and the two second blades deflect, so that the two airflow channels are connected; each of the airflow channels corresponds to one of the two airflow generating units. 如請求項9所述之電子裝置,其中該二第二葉片對稱地位於該第一葉片之一端的二側,該二第二葉片在該轉軸之徑向上的長度小於該第一葉片在該轉軸之徑向上的長度。 An electronic device as described in claim 9, wherein the two second blades are symmetrically located on two sides of one end of the first blade, and the length of the two second blades in the radial direction of the rotation axis is smaller than the length of the first blade in the radial direction of the rotation axis. 如請求項9所述之電子裝置,其中該第一葉片與該二第二葉片一體成型為一扇葉結構,該扇葉結構套設於該轉軸上。 The electronic device as described in claim 9, wherein the first blade and the two second blades are integrally formed into a fan blade structure, and the fan blade structure is sleeved on the rotating shaft. 如請求項9所述之電子裝置,其中該轉軸之一端具有一凸輪結構, 該殼體具有一止擋結構;當該氣流導引件位於該第二位置時,該止擋結構止擋該凸輪結構,以限制該氣流導引件轉動。 An electronic device as described in claim 9, wherein one end of the rotating shaft has a cam structure, and the housing has a stop structure; when the airflow guide is in the second position, the stop structure stops the cam structure to limit the rotation of the airflow guide. 如請求項9所述之電子裝置,其中各該第二葉片為一表面均勻的實心板體。 An electronic device as described in claim 9, wherein each of the second blades is a solid plate with a uniform surface. 如請求項9所述之電子裝置,其中該轉軸位於該第一葉片與該二第二葉片之間。 An electronic device as described in claim 9, wherein the rotation axis is located between the first blade and the two second blades. 如請求項9所述之電子裝置,其中該第一葉片與該二第二葉片之寬度朝遠離該轉軸的方向漸減。 An electronic device as described in claim 9, wherein the widths of the first blade and the two second blades gradually decrease in a direction away from the rotation axis. 如請求項9所述之電子裝置,其中該氣流導引機構另包含一多孔隙結構,設置於該殼體之該入風側且位於該電子單元與該殼體之間。 The electronic device as described in claim 9, wherein the airflow guiding mechanism further comprises a multi-porous structure disposed on the air inlet side of the housing and located between the electronic unit and the housing.
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Publication number Priority date Publication date Assignee Title
US20080151490A1 (en) * 2006-12-22 2008-06-26 Hon Hai Precision Industry Co., Ltd. Airflow-guiding device
CN206602759U (en) * 2017-03-28 2017-10-31 联想(北京)有限公司 Heat abstractor, air guide structure and electronic equipment
CN109002147A (en) * 2018-08-21 2018-12-14 郑州云海信息技术有限公司 A kind of machine box for server and its high frequency air inlet flow field rectify radiator structure
TWI763293B (en) * 2021-02-02 2022-05-01 緯穎科技服務股份有限公司 Server case and flow-guiding device thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080151490A1 (en) * 2006-12-22 2008-06-26 Hon Hai Precision Industry Co., Ltd. Airflow-guiding device
CN206602759U (en) * 2017-03-28 2017-10-31 联想(北京)有限公司 Heat abstractor, air guide structure and electronic equipment
CN109002147A (en) * 2018-08-21 2018-12-14 郑州云海信息技术有限公司 A kind of machine box for server and its high frequency air inlet flow field rectify radiator structure
TWI763293B (en) * 2021-02-02 2022-05-01 緯穎科技服務股份有限公司 Server case and flow-guiding device thereof

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