TWI852351B - Modular packaging materials - Google Patents

Abstract

A modular packaging material includes a base and a plurality of enclosure modules selectively inserted into the base for fixing. The base has a plurality of insertion holes arranged in a matrix. The enclosure modules have at least one pin inserted into each insertion hole, so that the enclosure parts of the enclosure modules enclose more than one packaging accommodating space on the base. When the packaging system is used, the packaged object, such as an electric Finished or semi-finished products are packaged in each packaging space and then packed into boxes. The use of enclosure modules can construct packaging spaces of different shapes to adapt to the packaging of objects of different sizes. In addition, the enclosure modules can be repeatedly stacked and reassembled, so they are recyclable, highly common, and have low inventory when the enclosure modules are used. This is in line with the industry's trend of reducing packaging materials and environmental protection needs.

Description

Modular packaging materials

The present invention relates to a packaging material, and in particular to a modular packaging material.

The existing inner cushioning materials of packaging in the electronics industry include plastic trays or foam material trays, which are trays with different shapes and sizes of accommodation spaces tailored to the packaged objects. The packaged objects, such as electronic products, are placed in the accommodation spaces, and the packaging materials are then packed into boxes for transportation or storage.

Although the above-mentioned packaging materials have the function of packaging, they are customized for one-time use, so they lack commonality for different products. In addition, packaging of different products requires packaging buffer materials with different storage spaces. Once the design of the electronic product being packaged is changed, the prepared packaging materials will be discarded due to inapplicability. Different packaging materials also require different molds, so the production cost is high. When producing packaging materials for small batches of products, the minimum production volume must still be met, which will cause the problem of more packaging materials than required. The above-mentioned shortcomings make the existing packaging materials easy to cause inventory waste, high costs, and environmentally unfriendly and non-recyclable.

In view of this, the purpose of the present invention is to provide a packaging material that can be combined with modules according to needs to construct packaging spaces of different shapes on the base for packaging objects of different sizes. The base and the modules can be recycled and reused, and the commonality is high, which is environmentally friendly. When the design of the packaged object is changed, the packaging can also be adapted. There is no need to customize the design of different packaging materials for the packaged objects of various sizes, thereby improving the commonality and reuse rate and thus achieving the characteristics of reducing costs.

In order to achieve the above-mentioned purpose, the present invention provides a configurable modular packaging material, comprising a base and a plurality of enclosure modules. The base has a plurality of insertion holes arranged in a matrix. The enclosure modules respectively have an enclosure portion and at least one plug portion extending downward from the bottom side of the enclosure portion. The plug portions of each enclosure module are selectively inserted into each insertion hole for fixing, so that the enclosure portions enclose more than one packaging accommodating space on the base.

Preferably, each enclosure module is hollow inside, the enclosure part and each plug part of each enclosure module are connected to each other in a shell-like structure, the enclosure part of each enclosure module at least shields two or more plug holes from above, and the horizontal cross section of each enclosure part is in a straight line or L shape. A rib protrudes outward around each plug part, and the rib of each plug part abuts against the peripheral wall of each plug hole for fixation.

Preferably, each enclosure part has a enclosure part side piece around it, each pin part has a pin part side piece around it, each enclosure part side piece is a slanted shape with a wide top and a narrow bottom, a socket is formed between the top edges of the enclosure part side piece, and each pin part side piece is also a slanted shape with a wide top and a narrow bottom. Another enclosure module is selectively inserted into the socket of each enclosure module, and the shape of the enclosure module is the same as that of the inserted enclosure module, forming a stacking and heightening mode of the enclosure modules themselves.

When the present invention is used, the packaged objects, such as finished electronic products and semi-finished products, are packaged in the packaging accommodating space enclosed by the partitions on the base, so that the packaged objects are stably placed in the modular packaging material, and then one modular packaging material or a plurality of modular packaging materials stacked up and down are packaged in a packaging box.

The effect of the present invention is that by inserting different numbers of enclosure modules into different positions of the base, more than one packaging accommodating space for packaging can be enclosed on the base, and suitable packaging accommodating space can be formed on the base according to the size and shape of the product (article) to be packaged. These enclosure modules can be reused, so they have the environmental benefits of being recyclable and highly common. When the product appearance design changes, the position of the enclosure modules inserted into the base can be changed to adjust the shape and size of the packaging accommodating space to meet the packaging needs. In this way, there is no need to store different packaging materials for products of various sizes, and it also has the economic benefit of low inventory and reduced packaging material costs in use, which is in line with the industry trend of reducing packaging materials and environmental protection needs.

In order to explain the present invention more clearly, a preferred embodiment is given and described in detail with reference to the drawings. Please refer to FIG. 1 to FIG. 4 , which are a first preferred embodiment of the present invention, a configurable module packaging material 100, comprising a base 10 and a plurality of enclosure modules 20 detachably coupled to the base 10, wherein:

The base 10 has a plurality of holes 12 arranged in a matrix. In the preferred embodiment, each hole 12 is a square hole that passes through the base 10 vertically, and the holes 12 are distributed throughout the entire base 10. In other preferred embodiments, each hole 12 may also be a circular or polygonal hole, and the plurality of holes 12 arranged in a matrix may also be provided only in a partial area of the base 10 according to packaging requirements.

In the preferred embodiment, seven detachable enclosure modules 20 are combined on the base 10, and the enclosure modules 20 respectively have an enclosure portion 22 and at least one pin portion 24 extending downward from the bottom side of the enclosure portion 22. The shape of each pin portion 24 matches the shape of each socket 12, so that each pin portion 24 of each enclosure module 20 can be selectively inserted into each socket 12 for fixation, so that the enclosure portions 22 of the enclosure modules 20 enclose two packaging accommodating spaces A on the base 10.

The horizontal cross-section of each enclosure module 20 is configured to be a straight line or L-shaped shape of different lengths. In other preferred embodiments, the enclosure portion 22 of each enclosure module 20 can also be configured to be other shapes according to packaging requirements, and then according to the number of packaged objects B to be packaged on each base 10 and the range of the appearance of the packaged objects B, multiple enclosure modules 20 with the same or different enclosure portion 22 shapes are inserted into the corresponding insertion holes 12 of the base 10 to enclose more than one required number of packaging accommodating spaces A on the base 10.

When the bottom of some packaged objects B is not flat, and therefore there is a need to raise the packaged objects B, in the preferred embodiment, a pad module 30 is inserted into each of the two insertion holes 12 within the packaging accommodation space A for accommodating the packaged objects B. Each pad module 30 has a pad pin 32 and a pad portion 34 formed at the top of the pad pin 32. Each pad pin 32 is inserted into the corresponding insertion hole 12 for fixing. The height of each pad portion 34 inserted into the base 10 is between the top surface of the base 10 and the height of the enclosure modules 20 inserted into the base 10 for fixing. In other preferred embodiments, the pad module 30 may be inserted into only one socket 12 within the packaging accommodating space A, or the pad modules 30 may be inserted into three or more sockets 12 within the packaging accommodating space A respectively, so that the packaged object B placed in the packaging accommodating space A is raised by one or more pad parts 34 to eliminate the height difference at the bottom of the packaged object B, so that the packaged object B can be packaged flatly in the packaging accommodating space A.

The number of the pins 24 of each enclosure module 20 can be one or more than two depending on the stability requirements of the base 10, and can extend downward at different locations on the bottom of each enclosure portion 22. In order to increase the volume of each packaging accommodating space A enclosed by each enclosure portion 22, the enclosure portion 22 of each enclosure module 20 can be set to a size that at least covers two plug holes 12. In this case, the area occupied by each enclosure portion 22 is equivalent to the area of the plug holes 12 covered by the enclosure portion 22 and the area between the plug holes 12. When packaging the packaged object B in a packaging accommodating space A, it is preferably configured to have the same height as the surrounding partitions 22 around the packaging accommodating space A, so that when multiple packaged objects B are packed in a box by stacking a plurality of modular packaging materials 100 up and down, the modular packaging materials 100 can be stacked up and down in a balanced manner to avoid tilting.

Please refer to FIG. 2 and FIG. 3 , in the first preferred embodiment of the present invention, seven enclosure modules 20 are combined on the base 10 to enclose the two packaging accommodating spaces A. The seven enclosure modules 20 are divided into four shapes, and the structures of the four shapes of the enclosure modules 20 are described as follows.

Please refer to FIG. 2 and FIG. 5A to FIG. 5D , the enclosure portion 22 of the enclosure module 20 of the first shape is in a straight line shape and has a pin portion 24 extending downward from the middle of the bottom side of the enclosure portion 22; specifically, when the enclosure module 20 is fixed by inserting the pin portion 24 into the mating socket 12, the enclosure portion 22 shields the socket 12 into which the pin portion 24 is inserted and the sockets 12 on the opposite sides from above, and the area occupied by the enclosure portion 22 is equivalent to the area occupied by the three sockets 12 and the area between the three sockets 12 on the base 10. The interior of the enclosure module 20 is hollow, so that the enclosure portion 22 and the plug-in portion 24 of the enclosure module 20 form a connected shell-like structure. A rib 242 protrudes outwardly around the plug-in portion 24. When the plug-in portion 24 is inserted into the insertion hole 12 of the base 10, the rib 242 can be pressed against the peripheral wall of the insertion hole 12 to be fixed more tightly, further preventing the enclosure module 20 from being pushed over or squeezed and falling off.

The surrounding part 22 has a surrounding part side piece 221, and the inserting part 24 also has an inserting part side piece 241. The surrounding part side piece 221 is a slanted shape with a wide top and a narrow bottom, and the inserting part side piece 241 is also a slanted shape with a wide top and a narrow bottom. An angle θ1 is formed between the inner circumference of the surrounding part side piece 221 and the vertical plane, and another angle θ2 is formed between the inner circumference of the inserting part side piece 241 and the vertical plane. In the preferred embodiment, the two angles θ1 and θ2 are 3 degrees respectively, and in other embodiments, they can also be other angles of 0 to 5 degrees. In accordance with the inclined shapes of the enclosure side piece 221 and the pin side piece 241, a socket 26 is formed between the top edges of the enclosure side piece 221. Through the provision of the socket 26, another enclosure module 20 having the same shape as the enclosure module 20 can be inserted into the enclosure module 20 through the socket 26, so that two or more enclosure modules 20 having the same shape can be stacked up and down to increase the overall height.

2 and 6 , the enclosure portion 22 of the enclosure module 20 of the second shape is in a straight line shape and has a pin portion 24 extending downward from one of the two halves of the bottom side of the enclosure portion 22; specifically, when the enclosure module 20 is fixed by inserting the pin portion 24 into the mating socket 12, the enclosure portion 22 shields the socket 12 into which the pin portion 24 is inserted and a socket 12 next to it from above. The interior of the enclosure module 20 is hollow, so that the enclosure part 22 and the plug part 24 of the enclosure module 20 form a connected shell-like structure. A rib 242 protrudes outward around the plug part 24. The enclosure part 22 has a enclosure part side piece 221 around it, and the plug part 24 has a plug part side piece 241 around it. A socket 26 is formed between the top edges of the enclosure part side piece 221. The enclosure side piece 221 and the pin side piece 241 are each in an inclined shape with a wide top and a narrow bottom, and the inclined shape is the same as the enclosure module 20 of the first shape mentioned above, so that the enclosure module 20 of the second shape can also be stacked up and down in numbers of more than two to increase the overall height.

Please refer to FIG. 2 and FIG. 7 . The enclosure portion 22 of the enclosure module 20 of the third shape is also in a straight line shape. The difference is that the extension length of the enclosure portion 22 is longer than that of the first and second enclosure modules 20, and two pins 24 extend downward from opposite ends of the bottom side of the enclosure portion 22. Specifically, when the enclosure module 20 is fixed by inserting the two pins 24 into the two mating sockets 12, the enclosure portion 22 shields the two sockets 12 into which the pins 24 are inserted and the other two sockets 12 between the two sockets 12 from above. The interior of the enclosure module 20 is hollow, so that the enclosure portion 22 and the two plug-in legs 24 of the enclosure module 20 form a connected shell-like structure. A rib 242 protrudes outward around each plug-in leg 24. The enclosure portion 22 has a enclosure side piece 221 around it, and each plug-in leg 24 has a plug-in leg side piece 241 around it. A socket 26 is formed between the top edges of the enclosure side piece 221. The enclosure side piece 221 and each pin side piece 241 are respectively in an inclined shape with a wide top and a narrow bottom, and the inclined shape is the same as the enclosure module 20 of the first shape mentioned above, so that the enclosure module 20 of the third shape can also be stacked up and down in numbers of more than two to increase the overall height.

2 and 8 , the enclosure portion 22 of the fourth type of enclosure module 20 is L-shaped and has a pin portion 24 extending downward from the bottom corner of the enclosure portion 22; specifically, when the enclosure module 20 is fixed by inserting the pin portion 24 into the mating socket 12, the enclosure portion 22 shields the socket 12 into which the pin portion 24 is inserted and the two sockets 12 on both sides thereof from above. The interior of the enclosure module 20 is hollow, so that the enclosure part 22 and the plug part 24 of the enclosure module 20 form a connected shell-like structure. A rib 242 protrudes outward around the plug part 24. The enclosure part 22 has a enclosure part side piece 221, and the plug part 24 has a plug part side piece 241 around it. A socket 26 is formed between the top edges of the enclosure part side piece 221. The enclosure side piece 221 and the pin side piece 241 are each in an inclined shape with a wide top and a narrow bottom, and the inclined shape is the same as the setting of the enclosure module 20 of the first shape mentioned above, so that the enclosure module 20 of the fourth shape can also be stacked up and down in numbers of more than two to increase the overall height.

As shown in FIG. 9A to FIG. 9C , the interior of the pad module 30 is hollow and has an opening 36 at the top, so that the pad pin portion 32 and the pad portion 34 of the pad module 30 form a connected shell-like structure. The pad portion 34 is a rectangular ring and is connected to the top of the pad pin portion 32. In the preferred embodiment, the pad module 30 is a recyclable paper mold structure; in other preferred embodiments, the enclosure modules 20 can also be a structure made of plastic or composite materials.

Please refer to FIG. 1 to FIG. 4 . The above-mentioned various types of enclosure modules 20 can form a hollow buffer space inside the enclosure module 20 by means of a hollow setting, so that the enclosure side panels 221 of the enclosure parts 22 can provide buffering during packaging, reduce external impact force and the pressure generated by the internal packaged object B due to transportation vibration or squeezing between products, and ensure that the packaged object B is intact. In other preferred embodiments, each enclosure module 20 may not have the opening 36, and the angles θ1 and θ2 may be set close to zero degrees, so that the interior of the enclosure modules 20 is closed and hollow, which also has the effect of reducing external impact force and internal pressure.

In the above-mentioned first preferred embodiment of the present invention, the enclosure modules 20 are structures made of recyclable paper molds; in other preferred embodiments, the enclosure modules 20 can also be structures made of plastic or composite materials. By virtue of the design that the plurality of enclosure modules 20 can be detachably combined with any part of the base 10, the present invention can form a suitable packaging accommodating space A by inserting a plurality of enclosure modules 20 into the insertion holes 12 at different positions of the base 10 according to the packaging requirements of different packaged objects B. Since the enclosure modules 20 can be reused to package packaged objects B of different shapes and sizes, the modular modular packaging material 100 is more environmentally friendly in use. There is no need to redesign the appearance of the packaging material in order to package different products, which can greatly reduce the inventory of additional packaging materials.

Please refer to FIG. 1 to FIG. 4 , in the first preferred embodiment of the present invention, the base 10 includes two bottom plates 14 stacked up and down, the area of the upper bottom plate 14 is smaller than the area of the lower bottom plate 14, and each bottom plate 14 is made of corrugated paperboard. Each bottom plate 14 has a plurality of through holes 142 arranged in a matrix, and the through holes 142 of the two bottom plates 14 are aligned up and down to form a plurality of the aforementioned insertion holes 12. When each insertion pin 24 of the enclosure modules 20 passes through each insertion hole 12, it also passes through the two through holes 142 included in the insertion hole 12, so that the two bottom plates 14 simultaneously passed by the plurality of insertion pins 24 are fixed and cannot be easily separated. In addition to the first preferred embodiment described above, the base 10 includes two bottom plates 14 stacked one above the other. Alternatively, the base 10 may be a single-layer structure such as a single-layer corrugated cardboard structure.

In addition to the first preferred embodiment described above, the base 10 of the present invention has two bottom plates 14 stacked up and down with different areas. Alternatively, the two bottom plates 14 stacked up and down can be configured to have the same shape. Please refer to FIG. 10A and FIG. 10B , in which the base 10 includes two bottom plates 14 stacked up and down. The two bottom plates 14 have the same shape, and the only difference is that the lower bottom plate 14 is the upper bottom plate 14 inverted. In addition to being fixed by the pins 24 inserted into the respective insertion holes 12, the two bottom plates 14 of the base 10 also have a plurality of folding pieces 16 formed on the periphery of one of the two bottom plates 14 stacked up and down. The inner edge of each folding piece 16 is a connecting edge 161 and two cutting lines 162 are formed on the left and right sides. A plurality of inserting openings 18 are formed on the periphery of the other bottom plate 14 corresponding to the positions of the folding pieces 16. Each inserting opening 18 is a trapezoidal notch that is wide outside and narrow inside. By bending each folding piece 16 and inserting it into each inserting opening 18, the periphery of the two bottom plates 14 stacked up and down can be fixed and cannot be easily separated, and the effect of fixing the bottom plates 14 provided on the base 10 is also achieved.

Please refer to FIG. 11 and FIG. 12 , in the second preferred embodiment of the present invention, the base 10 includes four bottom plates 14 stacked up and down, and the area of the top bottom plate 14 is smaller than the area of the middle two and the bottom bottom plates 14, so the area of the base 10 is divided into a four-layer part and a three-layer part. Similarly, each bottom plate 14 has a plurality of through holes 142 arranged in a matrix manner, and the four bottom plates 14 included in the four-layer part of the base 10 are aligned with each other in the vertical direction to form a plurality of the above-mentioned plug holes 12; the three-layer part of the base 10 includes the three bottom plates 14 in the upper, middle and lower parts, and the plurality of through holes 142 are aligned with each other in the vertical direction to form a plurality of the above-mentioned plug holes 12.

A plurality of enclosure modules 20 are detachably connected to the four-layer portion of the base 10, and the enclosure modules 20 enclose three packaging accommodating spaces A on the four-layer portion of the base 10, and a packaged object B is packaged in each packaging accommodating space A. Another plurality of enclosure modules 20 are detachably connected to the three-layer portion of the base 10, and the enclosure modules 20 enclose one packaging accommodating space A on the three-layer portion of the base 10, and a packaged object B is packaged in the packaging accommodating space A. In the preferred embodiment, please refer to FIG. 11 and FIG. 13 and FIG. 14 , a plurality of enclosure modules 20 are combined with the four-layer portion of the base 10, wherein some of the enclosure modules 20 have an insertion opening 26 for another enclosure module 20 of the same shape to be inserted in a stacked manner, so that when the modular modular packaging material 100 is packed, another modular modular packaging material 100 is stacked on top of the two sets of increased enclosure modules 20, thereby packaging the two modular modular packaging materials 100 in the same packaging box C in a stacked manner.

The above description is only the preferred embodiment of the present invention. Any equivalent changes made by applying the present invention specification and the scope of patent application should be included in the patent scope of the present invention.

[The present invention] 100: Modular module packaging material 10: Base 12: Socket 14: Bottom plate 142: Through hole 16: Folding piece 161: Connecting edge 162: Cutting line 18: Embedding 20: Enclosure module 22: Enclosure part 221: Enclosure side piece 24: Insertion foot 241: Insertion foot side piece 242: Rib 26: Socket 30: Pad module 32: Pad insertion foot 34: Pad part 36: Opening A: Packaging space B: Packaged object C: Packaging box θ1: Angle θ2: Angle

FIG. 1 is a perspective view of the first preferred embodiment of the present invention. FIG. 2 is an exploded view of FIG. 1. FIG. 3 is a top view of FIG. 1. FIG. 4 is a cross-sectional view taken along the 4-4 direction of FIG. 3. FIG. 5A is a perspective view of a first-shaped enclosure module. FIG. 5B is a top view of FIG. 5A. FIG. 5C is a cross-sectional view taken along the 5C-5C direction of FIG. 5B. FIG. 5D is a cross-sectional view taken along the 5D-5D direction of FIG. 5B. FIG. 6 is a perspective view of a second-shaped enclosure module. FIG. 7 is a perspective view of a third-shaped enclosure module. FIG. 8 is a perspective view of a fourth-shaped enclosure module. FIG. 9A is a perspective view of a pad module. FIG. 9B is a top view of FIG. 9A. Figure 9C is a cross-sectional view taken along the 9C-9C direction of Figure 9B. Figure 10A is an exploded view of the base of another preferred embodiment. Figure 10B is a three-dimensional view of Figure A. Figure 11 is a three-dimensional view of the second preferred embodiment of the present invention. Figure 12 is a top view of Figure 11. Figure 13 is an exploded view of the packaging of the second preferred embodiment. Figure 14 is a top view of the packaging of the second preferred embodiment. Figure 15 is a cross-sectional view taken along the 15-15 direction of Figure 14.

100: Variable module packaging materials

10: Base

12: Socket

14: Base plate

142: Perforation

20: Enclosure module

22: Enclosure

30: Pad module

34: Pad section

Claims (10)

A configurable module packaging material comprises: a base having a plurality of plug holes arranged in a matrix; and a plurality of enclosure modules, each having an enclosure portion and at least one plug-in portion extending downward from the bottom side of the enclosure portion, wherein each plug-in portion of each enclosure module is selectively inserted into each plug hole for fixing, so that the enclosure portions enclose more than one packaging accommodating space on the base. The modular packaging material as described in claim 1, wherein the interior of each enclosure module is hollow, and the enclosure portion and each pin portion of each enclosure module are connected shell-like structures. A reconfigurable modular packaging material as described in claim 2, wherein each of the partitions is surrounded by a partition side piece, and each of the pins is surrounded by a pin side piece, and each of the partition side pieces is an inclined shape with a wide top and a narrow bottom, and a socket is formed between the top edges of the partition side pieces, and each of the pin side pieces is also an inclined shape with a wide top and a narrow bottom. The modular packaging material as described in claim 3, wherein a rib protrudes outwardly around each pin, and the rib of each pin is fixed against the peripheral wall of each socket. A configurable modular packaging material as described in claim 3, wherein another enclosure module is inserted into the socket of each enclosure module, and the shape of the enclosure module is the same as the shape of the inserted enclosure module. A modular packaging material as described in any one of claims 1 to 5, wherein the enclosure portion of each enclosure module shields at least two or more sockets from above, and the horizontal cross-section of each enclosure portion is in a straight or L-shaped shape. A configurable modular packaging material as described in any one of claims 1 to 5, wherein a pad module is inserted into at least one of the sockets in at least one of the packaging accommodating spaces, each pad module having a pad pin and a pad portion formed at the top end of the pad pin, each pad pin being inserted into each socket and fixed, and a height of each pad portion being between the top surface of the base and the height of the enclosure modules inserted and fixed to the base. A configurable modular packaging material as described in any one of claims 1 to 5, wherein the base comprises two or more stacked bottom plates, each bottom plate having a plurality of through holes arranged in a matrix, and the plurality of through holes of the bottom plates are aligned vertically to form the aforementioned sockets. The modular packaging material as described in claim 8, wherein a plurality of folding pieces are formed on the periphery of one of the two bottom plates stacked up and down, and a plurality of indentations are formed on the periphery of the other bottom plate corresponding to the folding pieces, and each folding piece is bent and inserted into each indentation to fix the periphery of the two bottom plates stacked up and down. The modular packaging material as described in claim 9, wherein each folding piece is a trapezoidal sheet that is wide on the outside and narrow on the inside, the inner edge of each folding piece is a connecting edge and two cutting lines are formed on the left and right sides, and each inlay is a trapezoidal notch that is wide on the outside and narrow on the inside.

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