TWI852234B - Electrode structure and device including the same - Google Patents
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Abstract
Description
本發明係有關於一種電極結構及包含該電極結構的裝置,特別是關於一種彎折區段的電阻值變化率受到控制的電極結構及包含該電極結構的裝置。The present invention relates to an electrode structure and a device comprising the electrode structure, and in particular to an electrode structure in which the resistance variation rate of a bending section is controlled and a device comprising the electrode structure.
近年來,可撓式應用已逐漸成為電子產品的標準規格,與固定形狀的顯示裝置相比,可撓式顯示裝置可以折疊、捲曲或彎折來改變收合狀態下的形狀,故易於攜帶並且改善了用戶的便利性。In recent years, flexible applications have gradually become a standard specification for electronic products. Compared with fixed-shape display devices, flexible display devices can be folded, rolled or bent to change the shape in the collapsed state, making them easier to carry and improving user convenience.
為了評估可撓式裝置在終端使用的可靠性,一般會採用動態彎折測試,例如台灣專利公開號TW202221400(以下簡稱TW400)公開一種在具有SNW電極與周邊金屬跡線的觸控面板,並量測周邊金屬跡線在特定曲率半徑下進行動態彎折測試(例如200K次),接著去量測周邊金屬跡線的整體電阻值變化,但其並未測量SNW電極在彎折區域的電阻值變化。另外,美國專利號US11343911(以下簡稱US911)公開一種固曲裝置,其讓透明導電電極先彎曲後固定其彎曲態樣,雖然US911有公開透明導電電極在彎曲前後的電阻值變化,然而,US911是測量整條電極的電阻值,例如US911的圖6所示,US911在整條長度為5cm的電極的兩端設置量測接點,在彎曲前後藉由兩端的接點量測的整條電極的電阻值變化,故也並未測量在彎折區域的電阻值變化,究其原因,US911屬於固曲結構,並非可撓式裝置,使用者並無法進行折疊與非折疊態樣的轉換,因此彎折區域在兩種使用態樣下的電阻值差異(或稱變化量)就非US911所關心的事項。In order to evaluate the reliability of flexible devices in terminal use, dynamic bending tests are generally used. For example, Taiwan Patent Publication No. TW202221400 (hereinafter referred to as TW400) discloses a touch panel with SNW electrodes and peripheral metal traces, and measures the peripheral metal traces for dynamic bending tests at a specific curvature radius (for example, 200K times), and then measures the overall resistance change of the peripheral metal traces, but does not measure the resistance change of the SNW electrode in the bending area. In addition, U.S. Patent No. US11343911 (hereinafter referred to as US911) discloses a bending fixing device, which allows a transparent conductive electrode to be bent first and then fix its bending state. Although US911 discloses the change in resistance value of the transparent conductive electrode before and after bending, US911 measures the resistance value of the entire electrode. For example, as shown in FIG. 6 of US911, US911 measures the resistance value of the entire electrode with a length of 5 cm on both sides. The US911 is a fixed structure, not a flexible device. Users cannot switch between folded and undone states. Therefore, the resistance difference (or change) of the bending area is not a concern of the US911.
可撓式裝置可以大略分為外折式與內折式兩種,對外折式設備而言,使用者是可以在摺疊狀態下進行觀看、觸控畫面。而當使用者要觸控位於彎折區的畫面時,系統是否能正常進行觸控感應會深刻影響使用體驗;再一方面,使用者有可能從非折疊狀態切換到折疊狀態,並同時在螢幕上進行觸控(例如手寫、手勢滑動等),若手指滑到折疊區時感受到觸控的延遲,也會造成體驗不佳。綜上所述,摺疊區的觸控表現是使用者體驗中相當重要的一環,而觸控電極在摺疊區域的線段電阻值不因折疊而產生明顯過大的電阻值變化率就扮演關鍵的角色。雖然US911不是可撓裝置,但從其公開的電阻數據,可以計算出US911在彎折區域的電阻值變化率超過100%,也就是說,在現有文獻中,由於彎折區域的電阻值變化率過高,造成使用者在觸控時有延遲、感應不佳等問題。 Flexible devices can be roughly divided into two types: external folding and internal folding. For external folding devices, users can view and touch the screen in the folded state. When users want to touch the screen in the bending area, whether the system can perform touch sensing normally will profoundly affect the user experience; on the other hand, users may switch from the unfolded state to the folded state and touch the screen at the same time (such as handwriting, gesture sliding, etc.). If the touch delay is felt when the finger slides to the folded area, it will also cause a poor experience. In summary, the touch performance of the folding area is a very important part of the user experience, and the key role is to ensure that the resistance of the touch electrode in the folding area does not produce a significantly large resistance change rate due to folding. Although the US911 is not a flexible device, from its public resistance data, it can be calculated that the resistance change rate of the US911 in the bending area exceeds 100%. In other words, in existing literature, due to the excessively high resistance change rate in the bending area, users experience delays and poor sensing when touching.
因此,鑒於上述缺失,遂有本發明之產生。 Therefore, in view of the above shortcomings, the present invention was created.
本發明的目的係提供一種電極結構,其中,該電極結構在彎折狀態下的彎折區段具有小於10%的電阻值變化率,因此,其具有導電度和光學特性的優異平衡。 The object of the present invention is to provide an electrode structure, wherein the bending section of the electrode structure in a bent state has a resistance value variation rate of less than 10%, so that it has an excellent balance of conductivity and optical properties.
本發明之電極結構,包括:一基板;以及一奈米銀線電極,設置於該基板上;其中,該電極結構可由展開狀態變化為彎折半徑約為2-4mm的彎折狀態,該電極結構在該彎折狀態下具有一彎折區域以及分別與所述彎折區域鄰接的第一、第二非彎折區域,該奈米銀線電極在該彎折區域的電極段,在該彎折狀態與該展開狀態的電阻值變化率小於10%。 The electrode structure of the present invention comprises: a substrate; and a nanosilver wire electrode disposed on the substrate; wherein the electrode structure can change from an unfolded state to a bent state with a bending radius of about 2-4 mm, and the electrode structure has a bending region and first and second non-bending regions adjacent to the bending region in the bent state, respectively; the electrode segment of the nanosilver wire electrode in the bending region has a resistance value variation rate of less than 10% between the bent state and the unfolded state.
較佳地,根據本發明之電極結構,其中,該奈米銀線電極包含納米銀線及樹脂。 Preferably, according to the electrode structure of the present invention, the nanosilver wire electrode comprises nanosilver wires and resin.
較佳地,根據本發明之電極結構,其中,該電極結構可由展開狀態變化為彎折半徑約為3mm的彎折狀態,該奈米銀線電極在該彎折區域的電極段,在該彎折狀態與該展開狀態的電阻值變化率介於約2.8%-7.2%;或者該電極結構可由展開狀態變化為彎折半徑約為2-4mm的彎折狀態,該奈米銀線電極在該彎折區域的電極段,在該彎折狀態與該展開狀態的電阻值變化率介於約2.4%-7.2%。 Preferably, according to the electrode structure of the present invention, the electrode structure can be changed from an unfolded state to a bent state with a bending radius of about 3 mm, and the electrode segment of the nanosilver wire electrode in the bending area has a resistance value change rate between the bent state and the unfolded state of about 2.8%-7.2%; or the electrode structure can be changed from an unfolded state to a bent state with a bending radius of about 2-4 mm, and the electrode segment of the nanosilver wire electrode in the bending area has a resistance value change rate between the bent state and the unfolded state of about 2.4%-7.2%.
較佳地,根據本發明之電極結構,其中,該電極結構可由展開狀態變化為彎折半徑約為3mm的彎折狀態,該奈米銀線電極在該彎折區域的電極段,在該彎折狀態與該展開狀態的電阻值變化率介於約2%-8%;或者該電極結構可由展開狀態變化為彎折半徑約為2-4mm的彎折狀態,該奈米銀線電極在該彎折區域的電極段,在該彎折狀態與該展開狀態的電阻值變化率介於約2%-8%。Preferably, according to the electrode structure of the present invention, the electrode structure can be changed from an unfolded state to a bent state with a bending radius of about 3 mm, and the electrode segment of the nanosilver wire electrode in the bending area has a resistance value change rate between the bent state and the unfolded state of about 2%-8%; or the electrode structure can be changed from an unfolded state to a bent state with a bending radius of about 2-4 mm, and the electrode segment of the nanosilver wire electrode in the bending area has a resistance value change rate between the bent state and the unfolded state of about 2%-8%.
較佳地,根據本發明之電極結構,其中,該奈米銀線電極具有第一電極與第二電極,所述第一電極與所述第二電極設置於該基板的不同側,所述第一電極在該彎折狀態與該展開狀態具有第一電阻值變化率,所述第二電極在該彎折狀態與該展開狀態具有第二電阻值變化率,該第一電阻值變化率不同於該第二電阻值變化率。Preferably, according to the electrode structure of the present invention, the nanosilver wire electrode has a first electrode and a second electrode, the first electrode and the second electrode are arranged on different sides of the substrate, the first electrode has a first resistance value change rate in the bent state and the unfolded state, the second electrode has a second resistance value change rate in the bent state and the unfolded state, and the first resistance value change rate is different from the second resistance value change rate.
較佳地,根據本發明之電極結構,其中,該奈米銀線電極具有第一電極與第二電極,所述第一電極與所述第二電極設置於該基板的不同側,且該第二電極距彎折軸線比該第一電極為近,所述第一電極在該彎折狀態與該展開狀態具有第一電阻值變化率,所述第二電極在該彎折狀態與該展開狀態具有第二電阻值變化率,該第二電阻值變化率大於該第一電阻值變化率。Preferably, according to the electrode structure of the present invention, the nanosilver wire electrode has a first electrode and a second electrode, the first electrode and the second electrode are arranged on different sides of the substrate, and the second electrode is closer to the bending axis than the first electrode, the first electrode has a first resistance value change rate between the bent state and the unfolded state, and the second electrode has a second resistance value change rate between the bent state and the unfolded state, and the second resistance value change rate is greater than the first resistance value change rate.
較佳地,根據本發明之電極結構,其中,該奈米銀線電極具有第一電極與第二電極,所述第一電極與所述第二電極設置於該基板的不同側,且該第二電極距彎折軸線比該第一電極為近,所述第一電極在彎折半徑約為3mm的彎折狀態與該展開狀態具有第一電阻值變化率,所述第二電極在彎折半徑約為3mm的該彎折狀態與該展開狀態具有第二電阻值變化率,該第二電阻值變化率為該第一電阻值變化率的約1.1-2.5倍或1.2-1.8倍,該第二電阻值變化率與該第一電阻值變化率均小於10%。Preferably, according to the electrode structure of the present invention, the nanosilver wire electrode has a first electrode and a second electrode, the first electrode and the second electrode are arranged on different sides of the substrate, and the second electrode is closer to the bending axis than the first electrode, the first electrode has a first resistance value change rate in a bent state with a bending radius of about 3 mm and the unfolded state, the second electrode has a second resistance value change rate in the bent state with a bending radius of about 3 mm and the unfolded state, the second resistance value change rate is about 1.1-2.5 times or 1.2-1.8 times the first resistance value change rate, and the second resistance value change rate and the first resistance value change rate are both less than 10%.
較佳地,根據本發明之電極結構,其中,該奈米銀線電極是由面阻介於15-100 ops的奈米銀線漿料所製成;或者該奈米銀線電極是由面阻為30-70 ops的奈米銀線漿料所製成,該奈米銀線電極的厚度小於50nm。Preferably, according to the electrode structure of the present invention, the nanosilver wire electrode is made of nanosilver wire paste with a surface resistance between 15-100 ops; or the nanosilver wire electrode is made of nanosilver wire paste with a surface resistance of 30-70 ops, and the thickness of the nanosilver wire electrode is less than 50nm.
又,本發明進一步提供一種裝置,例如一種顯示裝置,其係包含有如上所述之電極結構。該裝置為一可撓顯示裝置,該可撓顯示裝置包括一顯示元件,該顯示元件與該電極結構之間設有一光學膠層,該顯示元件對應該彎折區域以及該第一、第二非彎折區域顯示畫面。The present invention further provides a device, such as a display device, which includes the electrode structure as described above. The device is a flexible display device, which includes a display element, an optical glue layer is provided between the display element and the electrode structure, and the display element displays images corresponding to the bending area and the first and second non-bending areas.
較佳地,根據本發明之裝置,其中,在-30°C至60°C溫度範圍中,該光學膠層的儲能模量平均斜率介於-4.0 kPa/℃ 至-1.5 kPa/℃。Preferably, according to the device of the present invention, in the temperature range of -30°C to 60°C, the average slope of the energy storage modulus of the optical adhesive layer is between -4.0 kPa/°C and -1.5 kPa/°C.
綜上所述,本發明所提供之電極結構能讓使用者在彎折狀態下操作時有良好的觸控體驗,同時本發明所提供之電極結構在彎折狀態下的電性與光學特性(如透光度、霧度)都在產品的規格範圍。In summary, the electrode structure provided by the present invention can provide users with a good touch experience when operating in a bent state. At the same time, the electrical and optical properties (such as transmittance and haze) of the electrode structure provided by the present invention in the bent state are within the product specification range.
為使熟悉所屬技術領域中具有通常知識者瞭解本發明之目的、特徵及功效,茲藉由下述具體實施例,並配合所附圖式,對本發明詳加說明。In order to enable those skilled in the art to understand the purpose, features and effects of the present invention, the present invention is described in detail through the following specific embodiments in conjunction with the attached drawings.
以下將參照所附圖式,更詳細地闡述依據本發明的示例性實施例,本發明的優點、特徵及其達成方法將顯而易見。然而,應注意的是,本發明並非僅限於以下示例性實施例,而是可以各種形式來實施。The following will be described in more detail with reference to the attached drawings according to exemplary embodiments of the present invention, and the advantages, features and methods of achieving the present invention will be apparent. However, it should be noted that the present invention is not limited to the following exemplary embodiments, but can be implemented in various forms.
本文所用術語僅用於闡述特定實施例,並非旨在限制本發明。除非上下文中清楚地另外指明,否則本文所用的單數形式的用語「一」及「該」亦包括複數形式。The terms used herein are only used to describe specific embodiments and are not intended to limit the present invention. Unless the context clearly indicates otherwise, the singular forms of the terms "a", "an" and "the" used herein also include plural forms.
此外,應理解的是,空間用語,諸如:“下面(beneath)”、“下方(below)”、“之下(under)”、“下(lower)”、“上方(above)”、“上(upper)”、“之上(over)”、 “左側(left side)”、“右側(right side)”、 “側(side)”等可在本文中對應圖中的空間關係而使用,以描述如圖中所示的一個元件與另一個元件(多個元件)的關係。除了圖中描繪的取向之外,本文的空間用語還可以涵蓋設備/裝置/元件在使用、操作和/或製造中的不同取向。例如,如果圖中的設備/裝置/元件被翻轉,則被描述為在其它元件或特徵“下方”或“下面”的元件將對應的被認為在其它元件或特徵“上方”。因此,本文所述的“下方”用語可因應設備/裝置/元件的空間關係而包含上方和下方兩種取向。此外,設備/裝置/元件可以以其它方式取向(例如,旋轉45度、90度或處於其它取向),也就是說,本文中使用的空間相對描述詞應被相應地解釋。另外,文中若無明確說明,所提及的數值,例如厚度、寬度、線徑、線長等並非絕對而可視為近似值,即具有如「約」、「大約」或「大致」所表示的誤差或範圍,本領域通常知識者可理解所指的數值,例如厚度、寬度、線徑、線長等可能包含製作公差、量測誤差等,本文所指數值的誤差或範圍可介於正負20%以內,或是介於正負10%以內,或是介於正負5%以內。In addition, it should be understood that spatial terms, such as: "beneath", "below", "under", "lower", "above", "upper", "over", "left side", "right side", "side", etc. may be used herein in correspondence with the spatial relationship in the figure to describe the relationship between one element and another element (or elements) as shown in the figure. In addition to the orientations depicted in the figure, the spatial terms herein may also cover different orientations of the device/apparatus/element in use, operation and/or manufacture. For example, if the device/apparatus/element in the figure is flipped, the elements described as being "below" or "beneath" other elements or features will be correspondingly considered to be "above" the other elements or features. Therefore, the term "below" described herein may include both above and below orientations depending on the spatial relationship of the device/apparatus/element. In addition, the device/device/element can be oriented in other ways (e.g., rotated 45 degrees, 90 degrees or in other orientations), that is, the spatial relative descriptors used in this article should be interpreted accordingly. In addition, if not explicitly stated in the text, the numerical values mentioned, such as thickness, width, line diameter, line length, etc., are not absolute but can be regarded as approximate values, that is, they have errors or ranges such as "about", "approximately" or "roughly". Those skilled in the art can understand that the numerical values referred to, such as thickness, width, line diameter, line length, etc., may include manufacturing tolerances, measurement errors, etc. The errors or ranges of the numerical values referred to in this article may be within plus or minus 20%, or within plus or minus 10%, or within plus or minus 5%.
亦應理解,儘管本文中可能使用用語「第一」、「第二」等來闡述各種元件,然而,該些元件不應受限於該些用語。該些用語僅用於區分各個元件。因此,某些實施例中的第一元件可在其他實施例中被稱為第二元件,並不背離本發明的教示內容。在本說明書中,相同的參考編號表示相同的元件。It should also be understood that although the terms "first", "second", etc. may be used herein to describe various components, these components should not be limited to these terms. These terms are only used to distinguish between various components. Therefore, the first component in some embodiments may be referred to as the second component in other embodiments without departing from the teachings of the present invention. In this specification, the same reference numerals represent the same components.
請參照圖1至圖2所示,圖1為顯示根據本發明之電極結構的示意圖,其為一種感應觸控的電極結構;圖2是顯示圖1的電極結構被彎曲的狀態的剖視圖。參照圖1,電極結構10包括電極12和基板11,基板11可用於支撐電極12。在一實施例中,電極結構10可與透明蓋板、顯示模組、光學膜、光學膠等(以上未繪製於圖1)構成觸控顯示裝置100,而觸控顯示裝置100可為一種可彎折(bendable)、可折疊(fordable)或其他類似應用的柔性/可撓顯示裝置(flexible display),如圖3、圖4。Please refer to Figures 1 and 2. Figure 1 is a schematic diagram showing the electrode structure according to the present invention, which is an inductive touch electrode structure; Figure 2 is a cross-sectional view showing the electrode structure of Figure 1 in a bent state. Referring to Figure 1, the
在本實施方式中,觸控顯示裝置100包含一個彎曲區域BZ,然而,本發明不應限於此。根據本公開的另一實施方式,觸控顯示裝置100中可包含有多個折疊區域。觸控顯示裝置100可包含顯示區域DA及位於顯示區域DA側邊的周邊區域PA,而本發明實施例的電極結構10實質上對應顯示區域DA,以利使用者觀看顯示畫面並進行觸控操作。In this embodiment, the
為求簡潔,圖1、圖2僅繪製出電極結構。請參照圖2,本發明實施例的電極結構10包括彎曲區域BZ,也就是說電極12和基板11可在彎曲區域BZ中被彎曲、被反摺,如圖2所示,電極結構10可沿著預定方向上延伸的軸線FX1被折疊,而本發明實施例定義彎折半徑RR為軸線FX1在垂直方向的投影位置到基板11下表面的距離。在本文中,此折疊的狀態可稱為“折疊狀態”或“彎折狀態”。圖1是顯示電極結構10在展開時的態樣,即未被彎折的狀態可稱為 “展開狀態”、“未折疊狀態” 或“未彎折狀態”。另外,圖1繪示出了電極結構10包括一個彎曲區域BZ,但是本發明不限於此,也就是說電極結構10可包括多個彎曲區域BZ。本發明實施例的電極結構10可根據電子產品的操作模式而定義出多個區域,例如可包括彎曲區域BZ和非彎曲區域FZ中的至少一個。如圖1所示,彎曲區域BZ可限定在兩個非彎曲區域FZ之間。在其它實施例中,觸控顯示裝置可具有一個彎曲區域BZ及一個非彎曲區域FZ。For simplicity, FIG1 and FIG2 only depict the electrode structure. Referring to FIG2, the
在另一實施例中,本發明之電極結構10可與透明蓋板、顯示模組、光學膜、光學膠等(以上未繪製於圖1)構成觸控顯示裝置,而觸控顯示裝置可為可捲(rollable)式的觸控顯示裝置,當此裝置被捲折時,整個顯示裝置就構成一個單一的彎曲區域BZ。In another embodiment, the
在一些實施例中,基板11可以但不限於為玻璃基板(例如可彎折的超薄玻璃基板)、聚對苯二甲酸乙二酯(PET)基板、環烯烴聚合物(COP)基板、透明聚醯亞胺(CPI)基板、聚萘二甲酸乙二酯(PEN)基板、聚碳酸脂(PC)基板、聚醚碸(PES)基板等等;另外,基板11可具有乘載電極的功能,也可以依需求提供光學功能,例如基板11可以是相位差膜、補償膜、偏光膜、抗炫膜、抗反射膜或其組合等;或是其它功能膜,例如保護膜、抗刮磨、抗汙膜或其組合等等,或是以上的複合功能膜。In some embodiments, the
具體地,請參照圖1所示,電極12設置在基板11上。在一些實施例中,電極12包括一觸控電極層,設置在基板11上。根據一些實施例,觸控電極層可以為透明導電材料,包括選自金屬氧化物,如氧化銦錫(ITO),或是金屬網格(metal mesh)、奈米銀線(silver nanowire, SNW)、奈米碳管(carbon nanotube, CNT)、石墨烯(graphene)、或導電高分子如聚3,4-乙烯二氧噻吩(poly(3,4-ethylenedioxythiophene) , PEDOT)等的材料,特別是觸控電極層可以使用這些材料中的一或更多者來形成。Specifically, referring to FIG. 1 , the
更具體而言,在一實施例中,電極12是由奈米銀線所製作,所使用的方法可以是將含奈米銀線的分散液塗佈在基板11上,例如將奈米銀線混入溶劑,例如:水、醇、酮、醚、烴或芳族溶劑(苯、甲苯、二甲苯等)形成塗料/漿料;上述塗料/漿料亦可包含添加劑、介面活性劑或黏合劑,例如:羧甲基纖維素(carboxymethyl cellulose, CMC)、2-羥乙基纖維素(hydroxyethyl Cellulose, HEC)、羥基丙基甲基纖維素(hydroxypropyl methylcellulose, HPMC)、磺酸酯、硫酸酯、二磺酸鹽、磺基琥珀酸酯、磷酸酯或含氟界面活性劑等。More specifically, in one embodiment, the
更詳細的說,本文所用的「金屬奈米線(metal nano-wires)」為一集合名詞,其指包含多個元素金屬、金屬合金或金屬化合物(包括金屬氧化物)的金屬線的集合,其中所含金屬奈米線的數量,並不影響本發明所主張的保護範圍;且單一金屬奈米線的至少一個截面尺寸(即截面的直徑)小於約500 nm,較佳小於約100 nm,且更佳小於約50 nm;而本發明所稱為”線(wire)”的金屬奈米結構,主要具有高的縱橫比,例如介於約10至100,000之間,更詳細的說,金屬奈米線的縱橫比(線長度與截面的直徑的比值)可大於約10,較佳大於約50,且更佳大於約100;金屬奈米線可以為任何金屬,包括(但不限於)銀、金、銅、鎳及鍍金的銀。而其他用語,諸如絲(silk)、纖維(fiber)、管(tube)等若同樣具有上述的尺寸及高縱橫比,亦為本發明所涵蓋的範疇。考量到塗佈所使用的分散液所含奈米銀線的參數並不完全相同,例如相同規格但不同生產批次所產出的奈米銀線可能有不同的平均直徑(即線徑)、直徑標準差、最大/最小直徑、直徑的分佈等等,或是不同的平均線長、線長標準差、最大/最小線長、線長的分佈等等,關於金屬奈米線的分佈可參考US20110174190,並全文引入本發明實施例。因此,為了避免同一規格的奈米銀線漿料所製作出的電極在彎折區域有不同的電阻值變化,本發明實施例根據大量生產和產品驗收標準,要求電極在彎折區域有不同的電阻值變化限制在小於約15%、12%、10%、8%。More specifically, the term "metal nanowires" as used herein is a collective term, which refers to a collection of metal wires comprising a plurality of elemental metals, metal alloys or metal compounds (including metal oxides), wherein the number of metal nanowires contained therein does not affect the scope of protection claimed by the present invention; and at least one cross-sectional dimension (i.e., the diameter of the cross section) of a single metal nanowire is less than about 500 nm, preferably less than about 100 nm, and more preferably less than about 50 nm; and the metal nanostructure referred to as "wire" in the present invention mainly has a high aspect ratio, for example, between about 10 and 100,000. More specifically, the aspect ratio (ratio of wire length to cross-sectional diameter) of the metal nanowire may be greater than about 10, preferably greater than about 50, and more preferably greater than about 100; the metal nanowire may be any metal, including (but not limited to) silver, gold, copper, nickel, and gold-plated silver. Other terms, such as silk, fiber, tube, etc., if they also have the above-mentioned size and high aspect ratio, are also covered by the present invention. Considering that the parameters of the silver nanowires contained in the dispersion used for coating are not completely the same, for example, the silver nanowires produced in different production batches with the same specifications may have different average diameters (i.e., wire diameters), diameter standard deviations, maximum/minimum diameters, diameter distributions, etc., or different average wire lengths, wire length standard deviations, maximum/minimum wire lengths, wire length distributions, etc., the distribution of metal nanowires can be referred to US20110174190, and the entire text is introduced into the embodiments of the present invention. Therefore, in order to avoid the electrodes made of the same specification of nano silver wire slurry having different resistance value changes in the bending area, the embodiment of the present invention requires that the resistance value changes of the electrodes in the bending area be limited to less than about 15%, 12%, 10%, and 8% according to mass production and product acceptance standards.
在較佳實施例中,奈米結構之形狀為各向異性(亦即縱橫比≠1)。各向異性奈米結構通常具有沿其長度之縱軸。例示性各向異性奈米結構可包括奈米線,即縱橫比(線長與線徑之比值)為至少10且更通常至少50之固體奈米線結構。而特定規格的奈米線群體(例如合成及純化後之產物或混入溶劑所形成的塗料/漿料)並非具有均一尺寸,而是包括在一定尺寸(線長、線徑等)範圍內之奈米結構。因此,由該種奈米線群體形成之薄膜的規格(例如光學特性、電特性或受力後可撓特性)取決於整體奈米線群體的共同作用。In a preferred embodiment, the shape of the nanostructure is anisotropic (i.e., aspect ratio ≠ 1). Anisotropic nanostructures typically have a longitudinal axis along their length. Exemplary anisotropic nanostructures may include nanowires, i.e., solid nanowire structures having an aspect ratio (ratio of wire length to wire diameter) of at least 10 and more typically at least 50. A nanowire population of a specific specification (e.g., a product after synthesis and purification or a coating/slurry formed by mixing with a solvent) does not have a uniform size, but includes nanostructures within a certain size (wire length, wire diameter, etc.) range. Therefore, the specifications of a film formed by such a nanowire population (e.g., optical properties, electrical properties, or flexibility properties after being subjected to force) depend on the combined effect of the entire nanowire population.
塗佈完成後,再通過固化步驟形成奈米銀線層,此奈米銀線層即可再利用本領域人員公知的圖案化方法(例如利用光阻的黃光微影製程搭配雷射蝕刻或蝕刻液蝕刻製程等等)形成所述的電極12。After coating, a curing step is performed to form a nanosilver wire layer, and the nanosilver wire layer can be used to form the
較佳地,在一實施例中,可進一步設置高分子層,使高分子層覆蓋於奈米銀線層上,故此高分子層可稱為上塗層(overcoat,OC)。在具體實施例中,將適當的高分子/聚合物塗布在奈米銀線層上,具有流動狀態/性質的聚合物可以滲入奈米銀線之間而形成填充物,故此高分子層又可稱為基質層(matrix),而奈米銀線會嵌入高分子/聚合物中,待高分子固化後即形成銀線-樹脂的複合結構。也就是說,在此步驟中,塗布高分子/聚合物以外加高分子層於奈米銀線層上,而奈米銀線會內嵌於高分子層而形成複合結構。在本發明的部分實施方式中,高分子層由絕緣材料所形成。舉例而言,高分子層的材料可以是非導電的樹脂或其他有機材料,諸如聚丙烯酸酯、環氧樹脂、聚胺基甲酸酯、聚矽烷、聚矽氧、聚(矽-丙烯酸)、聚乙烯(polyethylene;PE)、聚丙烯(Polypropylene;PP)、聚乙烯醇縮丁醛(Polyvinyl butyral;PVB)、聚碳酸酯(polycarbonate;PC)、丙烯腈-丁二烯-苯乙烯共聚物(Acrylonitrile butadiene styrene;ABS)等等。在本發明的部分實施方式中,可以藉由旋塗、噴塗、印刷等方式形成高分子層。在本發明的部分實施方式中,高分子層的厚度大約為20nm至10mm、或50nm至200nm、或30nm至100nm,舉例而言,高分子層的厚度大約可為90nm或100nm。以上所述具體作法可參照並全文引入US20190227650A、CN101292362等文獻,而奈米銀線漿料與高分子塗布物均由供應商Cambrios提供。若沒有特別說明,本文所指的奈米銀線電極即為銀線/樹脂的複合結構導電層。在一些實施方式中,面阻為30ops(Ω/square)的奈米銀線電極的厚度可小於50nm、或介於10nm-50nm、20nm-40nm或40nm-50nm之間。在此面阻下,若奈米銀線電極的厚度過大(例如大於50nm),可能導致奈米銀線電極的光學性能(例如,黃度b*值)較難符合需求,且可能導致奈米銀線電極與後續設置的材料層(例如採用金屬材料的周邊區導線)之間的接觸阻抗較高;若奈米銀線電極的厚度過小(例如小於10nm),則可能導致奈米銀線電極的抗紫外光性能不足。 Preferably, in one embodiment, a polymer layer can be further provided so that the polymer layer covers the nanosilver wire layer, so the polymer layer can be called an overcoat (OC). In a specific embodiment, a suitable polymer/polymer is coated on the nanosilver wire layer, and the polymer with a flow state/property can penetrate between the nanosilver wires to form a filler, so the polymer layer can also be called a matrix layer (matrix), and the nanosilver wires will be embedded in the polymer/polymer, and after the polymer is solidified, a composite structure of silver wire-resin is formed. That is, in this step, a polymer/polymer-added polymer layer is coated on the silver nanowire layer, and the silver nanowire is embedded in the polymer layer to form a composite structure. In some embodiments of the present invention, the polymer layer is formed of an insulating material. For example, the material of the polymer layer can be a non-conductive resin or other organic material, such as polyacrylate, epoxy resin, polyurethane, polysilane, polysilicon, poly(silicon-acrylic acid), polyethylene (PE), polypropylene (PP), polyvinyl butyral (PVB), polycarbonate (PC), acrylonitrile-butadiene-styrene (ABS), etc. In some embodiments of the present invention, the polymer layer can be formed by spin coating, spray coating, printing, etc. In some embodiments of the present invention, the thickness of the polymer layer is about 20nm to 10mm, or 50nm to 200nm, or 30nm to 100nm. For example, the thickness of the polymer layer can be about 90nm or 100nm. The above-mentioned specific methods can refer to and fully introduce US20190227650A, CN101292362 and other documents, and the nanosilver wire slurry and polymer coating are provided by the supplier Cambrios. If not specifically stated, the nanosilver wire electrode referred to in this article is a composite structure conductive layer of silver wire/resin. In some embodiments, the thickness of the nanosilver wire electrode with a surface resistance of 30ops (Ω/square) may be less than 50nm, or between 10nm-50nm, 20nm-40nm, or 40nm-50nm. Under this surface resistance, if the thickness of the nanosilver wire electrode is too large (for example, greater than 50nm), it may cause the optical performance of the nanosilver wire electrode (for example, yellowness b* value) to be difficult to meet the requirements, and may cause the contact impedance between the nanosilver wire electrode and the subsequently arranged material layer (for example, the peripheral area conductor using metal material) to be higher; if the thickness of the nanosilver wire electrode is too small (for example, less than 10nm), it may cause the nanosilver wire electrode to have insufficient anti-ultraviolet light performance.
具體地,根據一些實施例,電極結構10可以更包括一隔離層或保護層,隔離層設置在奈米銀線層或奈米銀線/樹脂複合結構層的上方。在本發明中,用詞「隔離」涵蓋電性隔離及物理隔離二個方面。隔離層可以為無機封裝材料的單層或多層堆疊、或無機封裝材料與有機封裝材料的堆疊。所使用的無機封裝材料例如但不限於為氮化矽(SiNx)、氧化矽(SiOx)、氮氧化矽(SiONx)、氧化鋁(AlOx)、或氧化鈦(TiOx)。
Specifically, according to some embodiments, the
本發明第一實施例之電極結構的具體作法如下:The specific method of the electrode structure of the first embodiment of the present invention is as follows:
S1:提供基板11,由Toray公司所提供的厚度50µm的PET基板(產品型號U483)。S1: Provide a
S2:設置透明導電膜。將Cambrios提供的奈米銀線漿料(產品型號G6,面阻規格:30 ops(Ω/square) ,奈米線的縱橫比介於約450-550)與高分子塗布物(產品型號OCHE)藉由卷對卷的塗佈方式依次成型於基板11上,並固化形成厚度約30nm的奈米銀線層。S2: Setting a transparent conductive film. The nanosilver wire slurry (product model G6, surface resistance specification: 30 ops (Ω/square), the aspect ratio of the nanowire is between about 450-550) and the polymer coating (product model OCHE) provided by Cambrios are sequentially formed on the
S3:形成觸控電極。利用雷射蝕刻將奈米銀線層形成具有特定圖案的電極(例如圖5所示的多條軸向觸控電極121),即完成本發明實施例的電極結構10。另外並定義出電極在彎曲區域BZ的ab區段(即a點實質地位於彎曲區域BZ與非彎曲區域FZ之間的界線/介面;b點實質地位於彎曲區域BZ與另一非彎曲區域FZ之間的界線/介面),而c點、d點則為整條軸向觸控電極121的兩端點;其中cd區段的長度為約10 mm,ab區段的長度為約1 mm,軸向觸控電極121的寬度約為10µm。S3: forming a touch electrode. The nanosilver wire layer is formed into an electrode with a specific pattern (such as a plurality of
S4:量測觸控電極121的ab區段在彎折狀態下的電阻值(線阻)變化。首先,分別在觸控電極的a點位置與b點位置設置連接點,例如將導電銀漿設置在a點位置與b點位置,之後可以將電阻值量測設備的探頭連接到所述導電銀漿,即可量測ab區段的電阻值。據此,分別在彎折狀態(將本發明實施例的電極結構10在彎折半徑為3mm條件下反摺180度,如圖2所繪示意圖)與未彎折狀態下量測ab區段、cd區段的電阻值。S4: Measure the change in resistance (line resistance) of the ab section of the
本發明第二實施例之電極結構的具體作法與第一實施例相同,除了使用不同批次的奈米銀線漿料。The specific method of the electrode structure of the second embodiment of the present invention is the same as that of the first embodiment, except that different batches of nano silver wire slurry are used.
本發明第三實施例之電極結構的具體作法與第一實施例相同,除了使用不同產品規格的奈米銀線漿料,本實施例使用Cambrios產品型號G6,面阻規格:70 ops的奈米銀線漿料。The specific method of the electrode structure of the third embodiment of the present invention is the same as that of the first embodiment, except that a nano-silver wire slurry of a different product specification is used. This embodiment uses a nano-silver wire slurry of Cambrios product model G6 with a surface resistance specification of 70 ops.
本發明第四實施例之電極結構的具體作法與第三實施例相同,除了將彎折狀態的條件改為彎折半徑為2mm下反摺180度。The specific method of the electrode structure of the fourth embodiment of the present invention is the same as that of the third embodiment, except that the bending condition is changed to folding 180 degrees with a bending radius of 2 mm.
本發明第五實施例之電極結構的具體作法與第三實施例相同,除了將彎折狀態的條件改為彎折半徑為4mm下反摺180度。The specific method of the electrode structure of the fifth embodiment of the present invention is the same as that of the third embodiment, except that the bending condition is changed to folding 180 degrees with a bending radius of 4 mm.
本發明第六實施例之電極結構的具體作法與第一實施例相同,除了基板11改為由Toray公司所提供的厚度125µm的PET基板(產品型號U483)。The specific method of the electrode structure of the sixth embodiment of the present invention is the same as that of the first embodiment, except that the
本發明第七實施例之電極結構的具體作法與第一實施例相同,除了基板11改為由Toray公司所提供的厚度125µm的PET基板(產品型號U483);同時也用不同產品規格的奈米銀線漿料,本實施例使用Cambrios產品型號G5,面阻規格:30 ops,縱橫比介於約400-750的奈米銀線漿料。The specific method of the electrode structure of the seventh embodiment of the present invention is the same as that of the first embodiment, except that the
根據本發明實施例,由於觸控電極在彎曲區域BZ的ab區段產生電阻值變化,對運算元件(例如觸控晶片)而言,過大的電阻值變化就會導致訊號傳遞的延遲,造成觸控報點率過低或是觸控感應不良。在一實施例中,當觸控電極應用於外折式的電子產品(即在折疊狀態下,使用者仍可以觀看、觸控顯示畫面),若觸控電極在彎曲區域BZ的ab區段產生的電阻值變化超出運算元件的規格(例如大於15%、12%、10%),就會有上述問題產生,據此,本發明實施例可以符合運算元件的規格(例如觸控電極在彎曲區域BZ的ab區段產生電阻值變化可小於15%、12%、10%、8%),以滿足外折式的電子產品的使用。下表1顯示前述實施例所製作的電極在進行觸控感應模擬的結果,其中第二實施例的電極有出現觸控感應效果不佳的現象。雖然表1呈現的電阻值變化率均為正數,但本發明並不排除電阻值變化率為負數的態樣,換言之,只要電阻值變化率的絕對值符合本文所載的內容,就屬於本發明範疇。According to the embodiment of the present invention, since the touch electrode generates a resistance change in the ab section of the bending zone BZ, for the computing element (such as a touch chip), an excessive resistance change will cause a delay in signal transmission, resulting in a low touch reporting rate or poor touch sensing. In one embodiment, when the touch electrode is applied to an outward-folding electronic product (i.e., when the device is folded, the user can still view and touch the display screen), if the resistance value change of the touch electrode in the ab section of the bending zone BZ exceeds the specification of the computing element (for example, greater than 15%, 12%, 10%), the above-mentioned problem will occur. Accordingly, the embodiment of the present invention can meet the specifications of the computing element (for example, the resistance value change of the touch electrode in the ab section of the bending zone BZ can be less than 15%, 12%, 10%, 8%) to meet the use of outward-folding electronic products. Table 1 below shows the results of the touch sensing simulation of the electrodes made in the above-mentioned embodiments, in which the electrode of the second embodiment has a poor touch sensing effect. Although the resistance value change rate presented in Table 1 is a positive number, the present invention does not exclude the state of the resistance value change rate being a negative number. In other words, as long as the absolute value of the resistance value change rate conforms to the content set forth herein, it belongs to the scope of the present invention.
表1
綜合第一與第二實施例,發現相同規格但不同批次的奈米銀線所製成的電極會有不同的彎折後電阻值變化,而第二實施例的電極在進行觸控感應模擬時出現延遲報點的問題(即表1中“Δ”所代表)。也如同前文所述,由於各批次奈米銀線漿料的共同表現雖然一致,但各批次之間還是存在有個別銀線規格的不同,因此必須從電極的特性給予規範,藉以確保終端產品的檢驗合規。Combining the first and second embodiments, it is found that electrodes made of nanosilver wires of the same specification but different batches will have different changes in resistance after bending, and the electrode of the second embodiment has a problem of delayed reporting when performing touch sensing simulation (i.e., represented by "Δ" in Table 1). As mentioned above, although the common performance of each batch of nanosilver wire slurry is consistent, there are still differences in individual silver wire specifications between each batch, so it is necessary to give specifications based on the characteristics of the electrode to ensure that the inspection of the terminal product meets the specifications.
綜合第一與第三實施例,使用高面阻的奈米銀線漿料會有較小的電阻值變化率(%),其原因可理解為高面阻的奈米銀線漿料會塗佈形成較高電阻值的電極,故電極在彎折區造成的電阻值變化不會導致大的電阻值變化率(%)。然而,從訊號傳遞的觀點,高電阻值的電極並非優選;據此,雖然高面阻的奈米銀線漿料有助於達到較小的電阻值變化率(%),但從整個電極的訊號傳輸來評估,本發明實施例建議採用面阻小於100 ops的奈米銀線漿料,較佳為採用小於85 ops的奈米銀線漿料,或是採用小於70 ops的奈米銀線漿料。Combining the first and third embodiments, the use of high-resistance nanosilver wire slurry will result in a smaller resistance value variation rate (%). The reason for this is that the high-resistance nanosilver wire slurry will form an electrode with a higher resistance value after coating, so the resistance value variation caused by the electrode in the bending area will not result in a large resistance value variation rate (%). However, from the perspective of signal transmission, an electrode with a high resistance value is not preferred; therefore, although a nanosilver wire paste with a high surface resistance helps to achieve a smaller resistance value variation rate (%), from the perspective of signal transmission of the entire electrode, the embodiment of the present invention recommends using a nanosilver wire paste with a surface resistance less than 100 ops, preferably a nanosilver wire paste with a surface resistance less than 85 ops, or a nanosilver wire paste with a surface resistance less than 70 ops.
而同樣從第一與第三實施例分析,使用低面阻的奈米銀線漿料可能導致較高的電阻值變化率(%),且從光學的角度觀之,低面阻的奈米銀線漿料由於含有較多的奈米銀線組分,故也有可能使光學特性不佳(如霾度(haze)增加);因此本發明實施例建議採用面阻大於15 ops的奈米銀線漿料,較佳為採用大於20 ops的奈米銀線漿料,或是採用大於30 ops的奈米銀線漿料。綜合以上,為使觸控電極在彎曲區域BZ的ab區段產生的電阻值變化不超出運算元件的規格,且又有良好的光學特性(例如霧度小於1)與訊號傳輸特性,可以選用面阻介於15-100 ops的奈米銀線漿料,或是採用介於20-85 ops的奈米銀線漿料,或是採用介於30-70 ops的奈米銀線漿料。在第一實施例中,採用30 ops的奈米銀線漿料製成的導電膜,霧度介於0.4-0.6之間;在第三實施例中,採用70 ops的奈米銀線漿料製成的導電膜,霧度介於0.25-0.3之間。Similarly, from the analysis of the first and third embodiments, the use of a nano-silver wire paste with a low surface resistance may lead to a higher resistance value variation rate (%), and from an optical point of view, the nano-silver wire paste with a low surface resistance may also cause poor optical properties (such as increased haze) due to the presence of more nano-silver wire components; therefore, the embodiment of the present invention recommends the use of a nano-silver wire paste with a surface resistance greater than 15 ops, preferably a nano-silver wire paste greater than 20 ops, or a nano-silver wire paste greater than 30 ops. In summary, in order to make the resistance value change of the touch electrode in the ab section of the bending area BZ not exceed the specifications of the computing element, and to have good optical properties (for example, haze less than 1) and signal transmission characteristics, a nanosilver wire paste with a surface resistance between 15-100 ops, or a nanosilver wire paste with a surface resistance between 20-85 ops, or a nanosilver wire paste with a surface resistance between 30-70 ops can be selected. In the first embodiment, the conductive film made of the nanosilver wire paste with a surface resistance of 30 ops has a haze between 0.4-0.6; in the third embodiment, the conductive film made of the nanosilver wire paste with a surface resistance of 70 ops has a haze between 0.25-0.3.
綜合第一與第六實施例,當選用較厚的基板,可以理解奈米銀線電極在彎折區有較大的應變,依據力學模擬系統,第一與第六實施例的電極在彎折區的應變分別為0.56%與1.91%。也就是說,選用較厚的基板會使電極在彎折區有較大的應變,因而產生較大的彎折區電阻值變化率。若考慮應變與電極在彎折區電阻值變化率為正比關係,可以預期當應變大於2.76%,使用第一實施例的銀線就有可能讓電極在彎折區的電阻值變化率超過10%。另一方面,當採用較厚的基板,從力學理論上可以得知,當膜層受力彎折時,會有產生張應力區與壓應力區,而在兩區之間會形成一個受力為零的中性軸/中性面(neutral surface;可參考 ”Mechanics of Materials” ,由 James M. Gere et al.所著),故第一與第六實施例做說明,當基板較厚(即第六實施例),整體疊構受力彎折時,電極的位置會離中性軸較遠(與第一實施例做比較),故導致第六實施例的電極在彎折區有較大的應力/應變,因而產生較大的彎折區電阻值變化率。根據上述中性軸的觀點,當選用較厚的基板,可以考慮在奈米銀線電極上方加上其他膜層,例如保護層、膠層、光學膜層等等,讓中性軸的位置向上移,也就是讓奈米銀線電極更接近中性軸,以降低電極在彎折區的應力/應變,進而達到電阻值變化率不超過10%。 Combining the first and sixth embodiments, when a thicker substrate is used, it can be understood that the nano silver wire electrode has a larger strain in the bending zone. According to the mechanical simulation system, the strain of the electrode in the bending zone of the first and sixth embodiments is 0.56% and 1.91%, respectively. In other words, the use of a thicker substrate will cause the electrode to have a larger strain in the bending zone, thereby producing a larger resistance value change rate in the bending zone. If the strain and the resistance value change rate of the electrode in the bending zone are considered to be proportional, it can be expected that when the strain is greater than 2.76%, the use of the silver wire of the first embodiment may cause the resistance value change rate of the electrode in the bending zone to exceed 10%. On the other hand, when a thicker substrate is used, it can be known from the mechanical theory that when the film layer is bent under force, a tensile stress zone and a compressive stress zone will be generated, and a neutral axis/neutral surface (neutral surface; refer to "Mechanics of Materials" by James M. Gere et al .) with zero force will be formed between the two zones. Therefore, the first and sixth embodiments are used to illustrate that when the substrate is thicker (i.e., the sixth embodiment), when the entire stack is bent under force, the position of the electrode will be farther away from the neutral axis (compared with the first embodiment), so that the electrode of the sixth embodiment has a larger stress/strain in the bending zone, thereby generating a larger resistance value change rate in the bending zone. According to the above-mentioned neutral axis point of view, when a thicker substrate is selected, it is possible to consider adding other film layers on top of the nanosilver wire electrode, such as a protective layer, a glue layer, an optical film layer, etc., to move the position of the neutral axis upward, that is, to make the nanosilver wire electrode closer to the neutral axis, so as to reduce the stress/strain of the electrode in the bending area, thereby achieving a resistance value change rate of no more than 10%.
另外,在彎折狀態下,cd區段的電阻值變化也會影響觸控感應的靈敏度,以第一實施例而言,cd區段的電阻值變化約介於1-5%。In addition, in the bent state, the change in the resistance value of the cd section will also affect the sensitivity of the touch sensing. In the first embodiment, the change in the resistance value of the cd section is approximately between 1-5%.
本發明另一實施例之電極結構是將觸控電極設置在基板11的兩面(例如上、下側面),例如圖6所示,第二電極12B(如驅動電極)設置在基板11的下側面,第一電極12A(如感應電極)設置在基板11的上側面,而第一電極12A與第二電極12B均可利用前文所述的方式成型。在彎折狀態下,第一電極12A與第二電極12B均需滿足電阻值變化率不超過10%的要求;另一方面,由於第一電極12A與第二電極12B到軸線FX1的距離不同,故在相同的彎折條件下,第一電極12A與第二電極12B受到的應變就不同,因此可知第一電極12A與第二電極12B在相同的彎折條件下的電阻值變化率是不同的。在本實施例中,由於第一電極12A與軸線FX1的距離比第二電極12B與軸線FX1的距離較遠(相當於第一電極12A的彎折半徑越大),故第二電極12B受到較大的應力,因此第二電極12B的電阻值變化率會大於第一電極12A的電阻值變化率(但兩者均符合不超過10%的要求)。從第一與第六實施例來分析,在彎折半徑為3mm條件下,第二電極12B的電阻值變化率為第一電極12A的電阻值變化率的約1.1-2.5倍或1.2-1.8倍之間。The electrode structure of another embodiment of the present invention is to set the touch electrode on both sides (such as the upper and lower sides) of the
本發明第八實施例是將電極12製作於供應商:KONICA MINOLTA所提供的厚度25µm的環狀烯烴共聚物(Cyclo Olefin Polymer;COP)基板上,再藉由光學膠層與50µm的透明聚醯亞胺薄膜(Colorless PI,CPI)進行貼合,並進行彎折半徑為3mm的彎折測試,而在本實施例中CPI基板是用於模擬顯示元件,例如有機發光二極體顯示器(OLED)。在本實施例中,電極12的電阻值變化率符合前述規格。The eighth embodiment of the present invention is to manufacture the
另外,於不同溫度下進行動態載荷測試所量測的儲能模量以及彎折測試結果,光學膠層的儲能模量的平均斜率(-30°C至60°C)需介於-4.0 kPa/℃ 至-1.5 kPa/℃之間,才有足夠的穩定性(亦即不會因溫度變化而造成膠特性的大幅改變),也能有良好的產品可靠性。In addition, the energy storage modulus and bending test results measured by dynamic load tests at different temperatures show that the average slope of the energy storage modulus of the optical adhesive layer (-30°C to 60°C) must be between -4.0 kPa/℃ and -1.5 kPa/℃ to have sufficient stability (that is, the adhesive properties will not change significantly due to temperature changes) and good product reliability.
如表2所示,本發明實施例測試多種光學膠層。
由本實施例可知,儲能模量的平均斜率的絕對值越大(例如樣品4的儲能模量平均斜率的絕對值估計為其它3個樣品的10倍),表示-30°C至60°C的儲能模量變異性越大,故樣品4在高溫(如60°C)下之儲能模量過小,材料在溫度範圍內快速軟化,屬於高流動性(材料強度小,內部聚合/結晶力非常小),不利工程應用。具體而言,樣品4在高溫(如60°C)下的材料強度並不利於實際的生產製造過程;而在彎折狀態下,由於樣品4的低材料強度,有可能導致應力集中於電極12,進而無法滿足前述電阻值變化率的要求。It can be seen from this embodiment that the greater the absolute value of the average slope of the storage modulus (for example, the absolute value of the average slope of the storage modulus of sample 4 is estimated to be 10 times that of the other three samples), the greater the variability of the storage modulus from -30°C to 60°C. Therefore, the storage modulus of sample 4 at high temperature (such as 60°C) is too small, and the material softens quickly within the temperature range, which is highly fluid (the material strength is low, and the internal polymerization/crystallization force is very small), which is not conducive to engineering applications. Specifically, the material strength of sample 4 at high temperature (such as 60°C) is not conducive to the actual production process; and in the bent state, due to the low material strength of sample 4, it is possible to cause stress to be concentrated on the
相對地,儲能模量的平均斜率絕對值過小,例如小於1.5(-1.5的絕對值),雖然在溫度範圍下(-30°C至60°C)的儲能模量變異性不大,但卻使材料在高溫下的儲能模量是過大的,過大的儲能模量代表黏合材料的性質偏硬、黏性變差,故在高溫彎折測試下出現脫層/起泡等現象。而在彎折時所造成的脫層/起泡就有可能造成電極12同時被破壞(亦即無法滿足前述電阻值變化率的要求),也就會導致產品可靠性不佳的問題。In contrast, if the average slope absolute value of the energy storage modulus is too small, for example, less than 1.5 (-1.5 absolute value), although the energy storage modulus variability is small within the temperature range (-30°C to 60°C), the energy storage modulus of the material at high temperature is too large. An excessively large energy storage modulus means that the adhesive material is hard and has poor viscosity, so delamination/bubbling occurs under high-temperature bending tests. The delamination/bubbling caused by bending may cause the
綜合前述,本發明實施例可採用儲能模量的平均斜率(-30°C至60°C)介於-4.0 kPa/℃ 至-1.5 kPa/℃之間或-3.8 kPa/℃ 至-1.7 kPa/℃之間的光學膠進行透明蓋板、顯示模組、光學膜等組件的貼合以構成觸控顯示裝置,同時,所述觸控顯示裝置在彎折時可以滿足前述電阻值變化率的要求。In summary, the embodiments of the present invention can use an optical adhesive with an average slope of the energy storage modulus (-30°C to 60°C) between -4.0 kPa/℃ and -1.5 kPa/℃ or between -3.8 kPa/℃ and -1.7 kPa/℃ to bond components such as a transparent cover plate, a display module, and an optical film to form a touch display device. At the same time, the touch display device can meet the aforementioned resistance value change rate requirement when bent.
可以理解的是,本發明所屬技術領域中具有通常知識者能夠基於上述示例再作出各種變化和修飾,在此不再一一列舉。It is understandable that a person having ordinary knowledge in the technical field to which the present invention belongs can make various changes and modifications based on the above examples, which are not listed one by one here.
最後,將本發明的技術特徵及其可達成之技術功效彙整如下:Finally, the technical features of the present invention and the technical effects that can be achieved are summarized as follows:
一、根據本發明實施例,透明電極在彎折狀態下(不限制彎折條件)位於彎折區的線段電阻值變化率小於10%,讓使用者在彎折狀態下操作時有良好的觸控體驗。1. According to the embodiment of the present invention, when the transparent electrode is in a bent state (without limiting the bending conditions), the resistance value variation rate of the line segment located in the bending area is less than 10%, so that the user has a good touch experience when operating in the bent state.
二、根據本發明實施例,透明電極在彎折狀態下(彎折半徑介於約2-4mm或是彎折半徑為約2、3或4mm),位於彎折區的線段電阻值變化率介於2%-8%或2.4%-7.2%之間,同時透明電極的電性與光學特性(如透光度、霧度)都在產品的規格範圍。2. According to the embodiments of the present invention, when the transparent electrode is in a bent state (the bending radius is between about 2-4 mm or the bending radius is about 2, 3 or 4 mm), the resistance value variation rate of the line segment located in the bending area is between 2%-8% or 2.4%-7.2%, and the electrical and optical properties (such as transmittance and haze) of the transparent electrode are within the product specification range.
三、根據本發明實施例,透明電極在彎折半徑為約3mm的彎折狀態下位於彎折區的線段電阻值變化率介於2%-8%或2.8%-7.2%之間,同時透明電極的電性與光學特性(如透光度、霧度)都在產品的規格範圍。3. According to the embodiment of the present invention, when the transparent electrode is bent with a bending radius of about 3 mm, the resistance value variation rate of the line segment located in the bending area is between 2%-8% or 2.8%-7.2%. At the same time, the electrical and optical properties (such as transmittance and haze) of the transparent electrode are within the product specification range.
以上藉由特定的具體實施例說明本發明之實施方式,所屬技術領域中具有通常知識者可由本說明書所揭示之內容輕易地瞭解本發明之技術特徵、優點、以及功效。The above describes the implementation of the present invention by using specific embodiments. A person having ordinary knowledge in the relevant technical field can easily understand the technical features, advantages, and effects of the present invention from the contents disclosed in this specification.
以上所述僅為本發明之較佳實施例,並非用以限定本發明之範圍。凡其它未脫離本發明所揭示之精神下所完成的等效改變或修飾,均應包含在下述之申請專利範圍內。The above is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. Any other equivalent changes or modifications that are completed without departing from the spirit disclosed by the present invention should be included in the scope of the following patent application.
10:電極結構
11:基板
12:電極
12A: 第一電極
12B: 第二電極
100: 觸控顯示裝置
121: 觸控電極
a, b, c, d:點
BZ:彎曲區域
DA: 顯示區域
FX1:軸線
FZ:非彎曲區域
PA: 周邊區域
RR:彎折半徑
10: Electrode structure
11: Substrate
12:
圖1為根據本發明一實施例之電極結構的示意圖; 圖2為顯示圖1所示的電極結構被彎曲的狀態的剖視圖; 圖3為根據本發明之觸控顯示裝置的立體圖; 圖4為顯示圖3所示的觸控顯示裝置被彎曲的狀態的立體圖; 圖5為根據本發明之電極結構的圖案的示意圖;以及 圖6為顯示本發明之另一實施例的電極結構被彎曲的狀態的剖視圖。 FIG1 is a schematic diagram of an electrode structure according to an embodiment of the present invention; FIG2 is a cross-sectional view showing a bent state of the electrode structure shown in FIG1; FIG3 is a stereoscopic view of a touch display device according to the present invention; FIG4 is a stereoscopic view showing a bent state of the touch display device shown in FIG3; FIG5 is a schematic diagram of a pattern of an electrode structure according to the present invention; and FIG6 is a cross-sectional view showing a bent state of an electrode structure of another embodiment of the present invention.
10:電極結構 11:基板 12:電極 BZ:彎曲區域 FX1:軸線 FZ:非彎曲區域 RR:彎折半徑 10: Electrode structure 11: Substrate 12: Electrode BZ: Bending zone FX1: Axis FZ: Non-bending zone RR: Bending radius
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| TW202231795A (en) * | 2019-01-28 | 2022-08-16 | 美商C3奈米有限公司 | Thin flexible structures with surfaces with transparent conductive films and processes for forming the structures |
| TW202243887A (en) * | 2019-04-26 | 2022-11-16 | 日商柯尼卡美能達股份有限公司 | transparent electrode |
| CN115497667A (en) * | 2022-09-27 | 2022-12-20 | 刘莉 | Flexible metal conductive film and preparation method thereof |
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| TW202427028A (en) | 2024-07-01 |
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