TWI852066B - Power transmission line - Google Patents
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- TWI852066B TWI852066B TW111131319A TW111131319A TWI852066B TW I852066 B TWI852066 B TW I852066B TW 111131319 A TW111131319 A TW 111131319A TW 111131319 A TW111131319 A TW 111131319A TW I852066 B TWI852066 B TW I852066B
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 61
- 238000003466 welding Methods 0.000 claims description 30
- 238000003780 insertion Methods 0.000 abstract description 5
- 230000037431 insertion Effects 0.000 abstract description 5
- 230000004907 flux Effects 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 6
- 239000003973 paint Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012552 review Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
本發明為有關一種電傳輸線,該電傳輸線具有一傳導線路層、及一焊墊層,並該電傳輸線主要包括:至少一第一差動焊墊、一第二差動焊墊、一第一差動線路、一第二差動線路、一第一延伸線路、一第二延伸線路、一第一參考線路、及一第二參考線路,且第一、第二差動焊墊之寬度為差動焊墊寬度,第一、第二差動線路之寬度為差動線路寬度。其中第一差動焊墊之差動焊墊寬度小於第一差動線路之差動線路寬度,第二差動焊墊之差動焊墊寬度小於第二差動線路之差動線路寬度,藉此,使電傳輸線增加磁通量、減少插入損耗、降低反射損失、熱傳導優化、及優化阻抗匹配。 The present invention relates to an electric transmission line, which has a conductive line layer and a pad layer, and mainly includes: at least a first differential pad, a second differential pad, a first differential line, a second differential line, a first extension line, a second extension line, a first reference line, and a second reference line, and the width of the first and second differential pads is the differential pad width, and the width of the first and second differential lines is the differential line width. The differential pad width of the first differential pad is smaller than the differential line width of the first differential line, and the differential pad width of the second differential pad is smaller than the differential line width of the second differential line, thereby increasing the magnetic flux of the electric transmission line, reducing insertion loss, reducing reflection loss, optimizing thermal conduction, and optimizing impedance matching.
Description
本發明為提供一種藉由重新設計高頻端子的傳導線路層及焊墊層之寬度大小關係及間隙大小關係,以減少插入損耗、降低反射損失,達到優化傳輸品質目的之電傳輸線。 The present invention provides a power transmission line that optimizes the transmission quality by redesigning the width and gap relationship between the transmission line layer and the pad layer of the high-frequency terminal to reduce insertion loss and reflection loss.
按,電連接器,是連接電氣線路的一種導體設備,可作為同電路系統中不同元件間連接的端點,或者為不同的電路系統、設備間提供電力與訊號的接點,當電力或訊號通過接點時,必然會進入電路系統或設備中的電傳輸線,所述電傳輸線一般為電路基板的一部分,通常在印刷電路板(Printed circuit board,PCB)中以銅箔形式存在、或在軟性印刷電路板(Flexible Printed Circuit,FPC)中以銅線的形式存在,而該銅箔或銅線上則具有與電連接器接觸的焊墊,或稱焊盤(pad)。 According to the standard, an electrical connector is a conductive device that connects electrical circuits. It can be used as an endpoint for connecting different components in the same circuit system, or as a contact point for providing power and signals between different circuit systems and devices. When power or signals pass through the contact point, they will inevitably enter the electrical transmission line in the circuit system or device. The electrical transmission line is generally a part of the circuit substrate, usually in the form of copper foil in a printed circuit board (PCB) or in the form of copper wire in a flexible printed circuit board (FPC). The copper foil or copper wire has a solder pad, or pad, that contacts the electrical connector.
常見電連接器雖然可利用端子排列、鐵殼屏蔽、端子粗細等方式,進行屏蔽雜訊、降低干擾,進而對高頻訊號傳輸之動作達到優化之目的,但當訊號從作為接點的電連接器傳遞至電傳輸線時,不但因為瞬間失去電連接器的優化設計,還因為端子與焊墊的訊號銜接不當,產生電容效應而造成訊號衰減、及反射損耗,甚至在訊號從電傳輸線的焊墊傳遞至銅箔或銅線時,因為阻抗匹配不佳、壓降過高、升溫過高等因素,導致訊號進一步弱化或失真。 Although common electrical connectors can use terminal arrangement, iron shell shielding, terminal thickness and other methods to shield noise and reduce interference, thereby optimizing the transmission of high-frequency signals, when the signal is transmitted from the electrical connector as a contact to the power transmission line, not only does it lose the optimized design of the electrical connector instantly, but also the improper connection between the terminal and the pad generates a capacitance effect, causing signal attenuation and reflection loss. Even when the signal is transmitted from the pad of the power transmission line to the copper foil or copper wire, the signal is further weakened or distorted due to factors such as poor impedance matching, excessive voltage drop, and excessive temperature rise.
此狀況在傳輸速度越來越快的科技進程下,問題影響程度越趨明顯,是以,要如何解決上述習用之問題與缺失,即為本發明之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 As the transmission speed increases, the impact of this problem becomes more and more obvious. Therefore, how to solve the above-mentioned problems and deficiencies is the direction that the inventor of this invention and related manufacturers in this industry are eager to study and improve.
故,本發明之發明人有鑑於上述缺失,乃蒐集相關資料,經由多 方評估及考量,並以從事於此行業累積之多年經驗,經由不斷試作及修改,始設計出此種藉由重新設計高頻端子的傳導線路層及焊墊層之寬度大小關係及間隙大小關係,以減少插入損耗、降低反射損失,達到優化傳輸品質目的之電傳輸線的發明專利者。 Therefore, in view of the above-mentioned deficiencies, the inventor of the present invention has collected relevant data, evaluated and considered various aspects, and used the years of experience accumulated in this industry, through continuous trials and modifications, to design this kind of invention patent for the electric transmission line that reduces insertion loss and reflection loss by redesigning the width and gap relationship of the transmission line layer and the pad layer of the high-frequency terminal to achieve the purpose of optimizing the transmission quality.
本發明之主要目的在於:利用第一、第二差動線路與第一、第二差動焊墊的寬度大小關係及間隙大小關係,藉此減少插入損耗、降低反射損失,達到優化傳輸品質目的。 The main purpose of the present invention is to utilize the width and gap relationship between the first and second differential lines and the first and second differential pads to reduce insertion loss and reflection loss, thereby achieving the purpose of optimizing transmission quality.
為達成上述目的,本發明之電傳輸線具有一傳導線路層、及一設於該傳導線路層上之焊墊層,其主要包括:至少一形成於該焊墊層中之第一差動焊墊,一間隔形成於該第一差動焊墊一側且形成於該焊墊層中之第二差動焊墊,一形成於該傳導線路層中且位置對應該第一差動焊墊之第一差動線路,一形成於該傳導線路層中且位置對應該第二差動焊墊之第二差動線路,一延伸形成於該第一差動線路一端之第一延伸線路,一延伸形成於該第二差動線路一端之第二延伸線路,一間隔形成於該第一差動線路背離該第二差動線路一側之第一參考線路,及一間隔形成於該第二差動線路背離該第一差動線路一側之第二參考線路,並該第一差動焊墊及該第二差動焊墊之寬度係為差動焊墊寬度,該第一差動線路及該第二差動線路之寬度係為差動線路寬度,其中該差動焊墊寬度小於該差動線路寬度。藉此使電傳輸線增加磁通量、減少插入損耗、降低反射損失、熱傳導優化、及優化阻抗匹配。 To achieve the above-mentioned purpose, the electric transmission line of the present invention has a conductive line layer and a pad layer disposed on the conductive line layer, which mainly includes: at least one first differential pad formed in the pad layer, a second differential pad formed at a distance from one side of the first differential pad and formed in the pad layer, a first differential line formed in the conductive line layer and corresponding to the first differential pad, a second differential line formed in the conductive line layer and corresponding to the second differential pad, and a first differential line extending from the first differential line. A first extension line at one end of the circuit, a second extension line extending at one end of the second differential line, a first reference line formed at a spacing on the first differential line away from the second differential line, and a second reference line formed at a spacing on the second differential line away from the first differential line, and the width of the first differential pad and the second differential pad is the differential pad width, the width of the first differential line and the second differential line is the differential line width, wherein the differential pad width is smaller than the differential line width. This increases the magnetic flux of the electric transmission line, reduces insertion loss, reduces reflection loss, optimizes thermal conduction, and optimizes impedance matching.
藉由上述技術,可針對習用電傳輸線所存在之訊號從電連接器傳遞至電傳輸線時,會在端子、焊墊、銅箔等銜接處發生訊號衰減、反射損耗、阻抗匹配不佳、壓降過高的問題點加以突破,達到上述優點之實用進步性。 The above technology can overcome the problems of signal attenuation, reflection loss, poor impedance matching, and excessive voltage drop at the joints of terminals, solder pads, copper foil, etc. when the signal is transmitted from the electrical connector to the electrical transmission line, thereby achieving the practical progress of the above advantages.
1:傳導線路層 1: Conductive circuit layer
11:第一差動線路 11: First differential line
111:第一延伸線路 111: First extension line
12:第二差動線路 12: Second differential line
121:第二延伸線路 121: Second extension line
13:第一參考線路 13: First reference circuit
131:接地參考端 131: Ground reference terminal
14:第二參考線路 14: Second reference circuit
2:焊墊層 2: Solder pad layer
21:第一差動焊墊 21: First differential pad
22:第二差動焊墊 22: Second differential pad
23:第一參考焊墊 23: First reference pad
24:第二參考焊墊 24: Second reference pad
3:上漆層 3: Paint layer
4:下漆層 4: Lower paint layer
5:電連接器 5:Electrical connector
6:差動端子 6: Differential terminal
61:彎折連接部 61: Bend connection part
62:平面焊接部 62: Plane welding section
A:差動焊墊寬度 A: Differential pad width
B:差動線路寬度 B: Differential line width
C:延伸線路寬度 C: Extended line width
D:差動間隙寬度 D: Differential gap width
E:差動參考間隙 E: Differential reference gap
F:延伸參考間隙 F: Extended reference gap
GL:焊接部長度 GL: Length of welding section
GW:焊接部寬度 GW: Welding width
H:端子接地間距 H: Terminal grounding distance
I:線路接地間距 I: Line grounding distance
J:差動焊墊長度 J: Differential pad length
K:差動內凸寬度 K: Differential convex width
L:差動外凸寬度 L: Differential convex width
M:參考焊墊寬度 M: Reference pad width
N:參考線路寬度 N: Reference line width
N1:參考內凸寬度 N1: Reference inner convex width
N2:參考外凸寬度 N2: Reference convex width
第一圖 係為本發明較佳實施例之立體透視圖。 The first figure is a three-dimensional perspective view of a preferred embodiment of the present invention.
第二圖 係為本發明較佳實施例之分解圖。 The second figure is a disassembled diagram of a preferred embodiment of the present invention.
第三圖 係為本發明較佳實施例之平面圖。 The third figure is a plan view of a preferred embodiment of the present invention.
第四圖 係為本發明再一較佳實施例之立體透視圖。 The fourth figure is a three-dimensional perspective view of another preferred embodiment of the present invention.
第五圖 係為本發明再一較佳實施例之第四圖A-A線剖視圖。 The fifth figure is a cross-sectional view taken along the A-A line of the fourth figure of another preferred embodiment of the present invention.
第六圖 係為本發明再一較佳實施例之平面圖。 Figure 6 is a plan view of another preferred embodiment of the present invention.
第七圖 係為本發明又一較佳實施例之尺寸標示示意圖(一)。 Figure 7 is a schematic diagram showing the dimensions of another preferred embodiment of the present invention (I).
第八圖 係為本發明又一較佳實施例之尺寸標示示意圖(二)。 Figure 8 is a schematic diagram showing the dimensions of another preferred embodiment of the present invention (II).
為達成上述目的及功效,本發明所採用之技術手段及構造,茲繪圖就本發明較佳實施例詳加說明其特徵與功能如下,俾利完全了解。 In order to achieve the above-mentioned purpose and effect, the technical means and structure adopted by the present invention are described in detail in the following figure for the preferred embodiment of the present invention, and its features and functions are explained for complete understanding.
請參閱第一圖至第三圖所示,係為本發明較佳實施例之立體透視圖至平面圖,其中第三圖為隱藏上漆層3之平面圖,由圖中可清楚看出本發明之電傳輸線具有一傳導線路層1、及一設於該傳導線路層1上之焊墊層2,其中傳導線路層1係為銅箔,焊墊層2則為焊墊(pad),而該電傳輸線主要包括:
Please refer to the first to third figures, which are three-dimensional perspective views and plan views of the preferred embodiments of the present invention, wherein the third figure is a plan view with the
至少一第一差動焊墊21,係形成於該焊墊層2中;
At least one first
一第二差動焊墊22,係形成於該焊墊層2中且間隔形成於該第一差動焊墊21一側,並該第一差動焊墊21及該第二差動焊墊22之寬度係為差動焊墊寬度A;
A second
一第一差動線路11,係形成於該傳導線路層1中且位置對應該第一差動焊墊21;
A first
一第二差動線路12,係形成於該傳導線路層1中且位置對應該第二差動焊墊22,並該第一差動線路11及該第二差動線路12之寬度係為差動線路寬度B,該第一差動線路11與該第二差動線路12之間隙係為差動間隙寬度D,又該差動焊墊寬度A小於該差動線路寬度B;
A second
一第一延伸線路111,係延伸形成於該第一差動線路11一端;
A
一第二延伸線路121,係延伸形成於該第二差動線路12一端,並該第一延伸線路111及該第二延伸線路121之寬度係為延伸線路寬度C,又該差動焊墊寬度A小於該延伸線路寬度C,且該差動線路寬度B小於該延伸線路寬度C;
A
一第一參考線路13,係間隔形成於該第一差動線路11背離該第二差動線路12一側;及
A
一第二參考線路14,係間隔形成於該第二差動線路12背離該
第一差動線路11一側,該第一差動線路11與該第一參考線路13之間隙、及該第二差動線路12與該第二參考線路14之間隙係為差動參考間隙E,該第一延伸線路111與該第一參考線路13之間隙、及該第二延伸線路121與該第二參考線路14之間隙係為延伸參考間隙F,又該差動間隙寬度D小於該差動參考間隙E,該差動間隙寬度D小於該延伸參考間隙F,該差動參考間隙E大於該延伸參考間隙F。
A
藉由上述構件組構時,由圖中可清楚看出,本實施例之電傳輸線係為印刷電路板形式,故電傳輸線另具有位於上表面之上漆層3、及位於下表面之下漆層4,所述第一差動焊墊21、第二差動焊墊22、第一差動線路11、第二差動線路12中的差動一詞,係與如USB TypeC連接器中的高頻差動訊號端子的差動相對應,故但凡具有高頻差動訊號端子的連接器所對應連結的電連接線,皆應屬於本發明之範疇,例如第一差動焊墊21數量為一時,為USB TypeA連接器,第一差動焊墊21為複數時,為USB TypeC連接器。
Through the above-mentioned component assembly, it can be clearly seen from the figure that the electric transmission line of this embodiment is in the form of a printed circuit board, so the electric transmission line also has an
本發明係將電傳輸線中的差動焊墊寬度A設計為小於差動線路寬度B、將電傳輸線中的差動焊墊寬度A設計為小於延伸線路寬度C,甚至同時將電傳輸線中的差動線路寬度B設計為小於延伸線路寬度C,使高頻訊號從高頻端子傳遞至電傳輸線時,從第一差動焊墊21、第二差動焊墊22到第一差動線路11、第二差動線路12,甚至再到第一延伸線路111、第二延伸線路121之寬度,為寬度越來越寬的狀態,相對於習知電傳輸線從頭到尾寬度都一樣的做法,本發明可使高頻訊號傳遞過程中具有降低訊號衰減、減少壓降、及熱傳導優化之特性。
The present invention is to design the differential pad width A in the electric transmission line to be smaller than the differential line width B, and to design the differential pad width A in the electric transmission line to be smaller than the extended line width C, and even to design the differential line width B in the electric transmission line to be smaller than the extended line width C at the same time, so that when the high-frequency signal is transmitted from the high-frequency terminal to the electric transmission line, the first
另外,本發明係將電傳輸線中的差動間隙寬度D設計為小於差動參考間隙E、將電傳輸線中的差動間隙寬度D設計為小於延伸參考間隙F,甚至將電傳輸線中的差動參考間隙E大於延伸參考間隙F,使高頻訊號因為差動間隙寬度D的最小化,讓高頻訊號能夠良好的耦合,再者,由於第一差動線路11與第二差動線路12上分別具有第一差動焊墊21與第二差動焊墊22,故第一差動線路11與第二差動線路12處的厚度較厚,導致此部分阻抗較低,故除了優化高頻訊號的耦合外,也拉大第一差動線路11、第二差動線路12兩側的間隙寬度,使差動間隙寬度D小於該差動參考間隙E、及使差動參考間隙E大於延伸參考間隙F,藉此平衡阻抗,因此,當高頻訊號從第一差動線
路11、第二差動線路12傳遞出去,並傳遞至遠離第一差動焊墊21、第二差動焊墊22的第一延伸線路111、第二延伸線路121之過程,為寬度越來越寬的狀態,即讓差動間隙寬度D小於延伸參考間隙F,相對於習知電傳輸線從頭到尾寬度都一樣的做法,本發明可進一步加強使高頻訊號傳遞過程中具有降低訊號衰減、減少壓降、及熱傳導優化之特性。
In addition, the present invention designs the differential gap width D in the electric transmission line to be smaller than the differential reference gap E, designs the differential gap width D in the electric transmission line to be smaller than the extended reference gap F, and even makes the differential reference gap E in the electric transmission line larger than the extended reference gap F, so that the high-frequency signal can be well coupled due to the minimization of the differential gap width D. Furthermore, since the first
請同時配合參閱第四圖至第六圖所示,係為本發明再一較佳實施例之立體透視圖至平面圖,其中第六圖為隱藏上漆層之平面圖,並將視野鎖定在第一參考焊墊23、第一差動焊墊21、第二差動焊墊22、第二參考焊墊24附近,由圖中可清楚看出本發明之電傳輸線具有一傳導線路層1、及一設於該傳導線路層1上之焊墊層2,其中傳導線路層1係為銅箔,焊墊層2則為焊墊(pad),而本實施例與上述實施例的差異在於該電傳輸線另包括:
Please refer to Figures 4 to 6 at the same time, which are three-dimensional perspective views and plan views of another preferred embodiment of the present invention, wherein Figure 6 is a plan view with the paint layer hidden, and the field of view is locked near the
定義該第一差動焊墊21之長度及該第二差動焊墊22之長度係為差動焊墊長度J;
The length of the first
定義該第一差動線路11在寬度方向上,凸出該第一差動焊墊21且鄰近該第二差動線路12一側之部分係為差動內凸寬度K;
The portion of the first
定義該第一差動線路11在寬度方向上,凸出該第一差動焊墊21且鄰近該第一參考線路13一側之部分係為差動外凸寬度L,並該差動內凸寬度K大於該差動外凸寬度L;
The portion of the first
定義該第一參考線路13及該第二參考線路14之寬度係為參考線路寬度N;
Define the width of the
一電連接器5,係設於該電傳輸線上;
An
一接地參考端131,係延伸形成於該第一參考線路13一側且位於該電連接器5一側,該第一差動線路11與該接地參考端131之最短距離、及該第二差動線路12與該接地參考端131之最短距離係為線路接地間距I;
A
複數差動端子6,各該差動端子6設於該電連接器5上並包含有一延伸自該電連接器5之彎折連接部61、及一延伸形成於該彎折連接部61一端之平面焊接部62,並該平面焊接部62與該接地參考端131之最短距離係為端子接地間距H,該平面焊接部62之長度係為焊接部長度GL,該平面焊接部62之寬度係為焊接部寬度GW,又該端子接地間距H小於或等於該
線路接地間距I,該焊接部長度GL之兩倍小於或等於該差動焊墊長度J,該焊接部寬度GW等於該差動焊墊寬度A;及
A plurality of
一第一參考焊墊23,係形成於該焊墊層2中且位置對應該第一參考線路13;
A
一第二參考焊墊24,係形成於該焊墊層2中且位置對應該第二參考線路14,該第一參考焊墊23及該第二參考焊墊24之寬度係為參考焊墊寬度M,又該參考線路寬度N大於該參考焊墊寬度M,另該第一參考線路13在寬度方向上,凸出該第一參考焊墊23且鄰近該第一差動線路11一側之部分係為參考內凸寬度N1,該第一參考線路13在寬度方向上,凸出該第一參考焊墊23且遠離該第一差動線路11一側之部分係為參考外凸寬度N2,同理,該第二參考線路14在寬度方向上,凸出該第二參考焊墊24且鄰近該第二差動線路12一側之部分係為參考內凸寬度N1,該第二參考線路14在寬度方向上,凸出該第二參考焊墊24且遠離該第二差動線路12一側之部分係為參考外凸寬度N2,使第一參考線路13處的參考內凸寬度N1小於或等於參考外凸寬度N2,及使第二參考線路14處的參考內凸寬度N1小於或等於參考外凸寬度N2。
A
首先,由於焊接部寬度GW等於差動焊墊寬度A,且將端子接地間距H設計為小於或等於線路接地間距I,可在高頻訊號從平面焊接部62傳遞至第一差動線路11及第二差動線路12時,避免訊號向接地參考端131的方向反向移動,而避免反射損耗、及電容效應的發生,進而降低訊號衰減及阻抗過低的問題,其中本實施例係以端子接地間距H係小於線路接地間距I做為舉例。
First, since the welding portion width GW is equal to the differential pad width A, and the terminal grounding distance H is designed to be less than or equal to the line grounding distance I, when the high-frequency signal is transmitted from the
所述焊接部長度GL之兩倍小於或等於差動焊墊長度J,意即2GL≦J,而J-GL≧GL,換言之,第一差動焊墊21及第二差動焊墊22裸露在平面焊接部62外的部分,其長度大於或等於焊接部長度GL,藉此降低訊號衰減、減少壓降、及加熱熱傳導面積。本實施例則以焊接部長度GL之兩倍等於差動焊墊長度J做為舉例。
The twice of the welding portion length GL is less than or equal to the differential pad length J, that is, 2GL≦J, and J-GL≧GL. In other words, the length of the first
再者,除了設計差動焊墊寬度A小於差動線路寬度B外,本實施例進一步將差動內凸寬度K設計為大於差動外凸寬度L,其原理係等同於使差動間隙寬度D小於差動參考間隙E,由於第一差動線路11與第二差動線路1
2上分別具有第一差動焊墊21與第二差動焊墊22,故第一差動線路11與第二差動線路12處的厚度較厚,導致此部分阻抗較低,故利用調節差動內凸寬度K、差動外凸寬度L、差動間隙寬度D、及差動參考間隙E之尺寸,來平衡第一差動焊墊21與第二差動焊墊22間的阻抗,及平衡第一差動線路11與第一參考線路13、第二差動線路12與第二參考線路14的阻抗。尤其,針對後者,更可利用將參考線路寬度N設計為大於參考焊墊寬度M,此設計可在不加大第一參考焊墊23或第二參考焊墊24的情況下,因應大電流設計,甚至可進一步將參考內凸寬度N1設計為小於或等於參考外凸寬度N2,以此確保差動參考間隙E之寬度足夠大,而再次提升對阻抗調節的優化。其中,本實施例係以差動外凸寬度L大於0、參考內凸寬度N1等於參考外凸寬度N2做為舉例。
Furthermore, in addition to designing the differential pad width A to be smaller than the differential line width B, the present embodiment further designs the differential inner convex width K to be larger than the differential outer convex width L. The principle is equivalent to making the differential gap width D smaller than the differential reference gap E. Since the first
請同時配合參閱第七圖及第八圖所示,係為本發明又一較佳實施例之尺寸標示示意圖(一)及尺寸標示示意圖(二),由圖中可清楚看出,本實施例與上述實施例為大同小異,僅以端子接地間距H設計為等於線路接地間距I做為舉例,以在平面焊接部62可完整焊接於第一差動焊墊21及第二差動焊墊22的情況下,避免差動訊號反向移動,並以焊接部長度GL之兩倍小於差動焊墊長度J做為舉例,藉此再次加大第一差動焊墊21及第二差動焊墊22的面積,另以參考內凸寬度N1設計為小於參考外凸寬度N2做為舉例,藉此,再次加大差動參考間隙E來平衡阻抗。
Please refer to FIG. 7 and FIG. 8 at the same time, which are the dimension marking diagram (I) and the dimension marking diagram (II) of another preferred embodiment of the present invention. It can be clearly seen from the figures that the present embodiment is similar to the above-mentioned embodiment, except that the terminal grounding distance H is designed to be equal to the line grounding distance I as an example, so that the
惟,以上所述僅為本發明之較佳實施例而已,非因此即侷限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本發明之專利範圍內,合予陳明。 However, the above is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the contents of the present invention's specification and drawings should be included in the patent scope of the present invention and should be stated.
綜上所述,本發明之電傳輸線於使用時,為確實能達到其功效及目的,故本發明誠為一實用性優異之發明,為符合發明專利之申請要件,爰依法提出申請,盼 審委早日賜准本發明,以保障發明人之辛苦發明,倘若 鈞局審委有任何稽疑,請不吝來函指示,發明人定當竭力配合,實感德便。 In summary, the electric transmission line of this invention can achieve its effect and purpose when used. Therefore, this invention is truly an invention with excellent practicality. In order to meet the application requirements of invention patents, an application is filed in accordance with the law. I hope that the review committee will approve this invention as soon as possible to protect the inventor's hard work. If the review committee of the Jun Bureau has any doubts, please feel free to write to give instructions. The inventor will do his best to cooperate and will be grateful for the convenience.
1:傳導線路層 1: Conductive circuit layer
11:第一差動線路 11: First differential line
111:第一延伸線路 111: First extension line
12:第二差動線路 12: Second differential line
121:第二延伸線路 121: Second extension line
13:第一參考線路 13: First reference circuit
14:第二參考線路 14: Second reference circuit
2:焊墊層 2: Solder pad layer
21:第一差動焊墊 21: First differential pad
22:第二差動焊墊 22: Second differential pad
A:差動焊墊寬度 A: Differential pad width
B:差動線路寬度 B: Differential line width
C:延伸線路寬度 C: Extended line width
D:差動間隙寬度 D: Differential gap width
E:差動參考間隙 E: Differential reference gap
F:延伸參考間隙 F: Extended reference gap
Claims (12)
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| TW111131319A TWI852066B (en) | 2022-08-19 | 2022-08-19 | Power transmission line |
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| TW111131319A TWI852066B (en) | 2022-08-19 | 2022-08-19 | Power transmission line |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201801401A (en) * | 2016-03-31 | 2018-01-01 | 莫仕有限公司 | Cable tray assembly |
| TW201840062A (en) * | 2017-04-20 | 2018-11-01 | 宏致電子股份有限公司 | Improved structure of line end connector effectively reduce interferences, such as electromagnetic wave and crosstalk generated by closer distance |
| US20190372274A1 (en) * | 2018-05-31 | 2019-12-05 | Lotes Co., Ltd | Electrical connector |
| US20200021052A1 (en) * | 2010-05-07 | 2020-01-16 | Amphenol Corporation | High performance cable connector |
| US20200274301A1 (en) * | 2019-02-22 | 2020-08-27 | Amphenol Corporation | High performance cable connector assembly |
| TW202226678A (en) * | 2020-12-28 | 2022-07-01 | 財團法人工業技術研究院 | Terminal components of connector and connector structure |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200021052A1 (en) * | 2010-05-07 | 2020-01-16 | Amphenol Corporation | High performance cable connector |
| TW201801401A (en) * | 2016-03-31 | 2018-01-01 | 莫仕有限公司 | Cable tray assembly |
| TW201840062A (en) * | 2017-04-20 | 2018-11-01 | 宏致電子股份有限公司 | Improved structure of line end connector effectively reduce interferences, such as electromagnetic wave and crosstalk generated by closer distance |
| US20190372274A1 (en) * | 2018-05-31 | 2019-12-05 | Lotes Co., Ltd | Electrical connector |
| US20200274301A1 (en) * | 2019-02-22 | 2020-08-27 | Amphenol Corporation | High performance cable connector assembly |
| TW202226678A (en) * | 2020-12-28 | 2022-07-01 | 財團法人工業技術研究院 | Terminal components of connector and connector structure |
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