TWI851019B - Heat dissipation sheet structure and chip on film package structure - Google Patents

Abstract

A heat dissipation sheet structure includes a heat conductive base, a heat conductive cover and heat dissipation powders. The heat conductive base has a first surface and a second surface opposite to each other, and includes a bottom plate, a plurality of sidewalls connecting the bottom plate and a receiving cavity located at the second surface. The bottom plate and the plurality of sidewalls jointly define the receiving cavity. The heat conductive cover covers and seals the receiving cavity of the heat conductive base. The heat dissipation powders are disposed in the receiving cavity.

Description

Heat sink structure and chip-on-film packaging structure

The present disclosure relates to a heat sink structure and a chip-on-film package structure including the heat sink structure.

In recent years, especially in the field of electronics, the heat generated by the high density of integrated circuits has become a major problem, and how to dissipate heat has become an urgent issue. One of the current heat dissipation structures is to use powdered heat sinks (such as graphite, ceramics, aluminum oxide, etc.) that have better heat dissipation effects than traditional metal foils to make heat sinks. Specifically, the powdered heat sink is formed by pressing the upper and lower adhesive layers. However, such a structure easily causes the powdered heat sink to delaminate or crack with the adhesive layer, and the appearance is prone to wrinkles during pressing, which in turn affects the heat dissipation effect. In addition, in order to increase the structural strength of the heat sink, the heat sink structure is usually further stacked with metal foil (such as aluminum foil, etc.), but this will increase the overall thickness of the heat sink (for example: more than 200 microns (μm)), and the powdered heat sink is also easy to overflow from the adhesive layer to cause pollution, thereby resulting in a decrease in the heat dissipation effect and yield of the product.

The present disclosure provides a heat sink structure having a light, thin and flat appearance, excellent heat dissipation effect and structural strength, thereby reducing the overall thickness of a film-on-chip package structure having the heat sink structure and improving the heat dissipation effect and structural strength of the film-on-chip package structure.

A heat sink structure disclosed herein includes a heat conductive base, a heat conductive cover, and a plurality of heat dissipation powders. The heat conductive base has a first surface and a second surface opposite to each other, and includes a bottom plate, a plurality of side walls connected to the bottom plate, and a receiving groove located on the second surface, wherein the bottom plate and the plurality of side walls together define the receiving groove. The heat conductive cover covers and seals the receiving groove of the heat conductive base. The plurality of heat dissipation powders are disposed in the receiving groove.

A thin film chip package structure disclosed in the present invention includes the aforementioned heat sink structure, a flexible circuit carrier and a chip. The flexible circuit carrier has an upper surface and a lower surface relative to each other and a chip setting area defined on the upper surface. The chip is arranged in the chip setting area and is electrically connected to the flexible circuit carrier. The heat sink structure is arranged on the lower surface of the flexible circuit carrier and corresponds to the chip setting area or is arranged on the upper surface of the flexible circuit carrier and is located outside the chip setting area.

Based on the above, the heat sink structure disclosed in the present invention sets the heat dissipation powder in the receiving groove defined by the thermally conductive base, and covers it with a thermally conductive cover to seal the heat dissipation powder in the receiving groove. With such a configuration, the heat dissipation powder can be sealed in the sealed space defined by the thermally conductive base and the thermally conductive cover and is not easy to overflow. Therefore, this heat sink structure can provide a better heat dissipation effect and yield, and can also prevent the heat dissipation powder from overflowing and causing electronic components such as the film chip packaging structure to be contaminated or electrical abnormalities to occur. In addition, the thermally conductive base of the heat sink structure disclosed in the present invention can be made of a metal reinforcement plate, whereby, when the heat sink structure is attached to the film chip packaging structure, it can not only provide a heat dissipation function, but also enhance the structural strength of the film chip packaging structure. Furthermore, the heat sink structure disclosed in the present invention can have a thin and flat appearance, so that it can be attached to the chip-on-film packaging structure to assist the chip-on-film packaging structure in heat dissipation. Therefore, the heat sink structure disclosed in the present invention can effectively improve the heat dissipation efficiency of electronic components such as the chip-on-film packaging structure.

The above-mentioned and other technical contents, features and effects of the present disclosure will be clearly presented in the detailed description of each embodiment with reference to the drawings below. The directional terms mentioned in the following embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used are used for explanation, not for limiting the present disclosure. In addition, in the following embodiments, the same or similar components will adopt the same or similar labels.

FIG. 1 is a schematic cross-sectional view of a heat sink structure according to an embodiment of the present disclosure. FIG. 2 is a schematic cross-sectional view of a heat sink structure according to an embodiment of the present disclosure. Referring to FIG. 1 and FIG. 2, in some embodiments, the heat sink structure 100 includes a heat conductive base 120, a heat conductive cover 110, and a plurality of heat dissipation powders 130, wherein the heat conductive base 120 has a first surface S1 and a second surface S2 opposite to each other, and the heat conductive base 120 may include a bottom plate 121, a plurality of side walls 123, and a receiving groove C. In one embodiment, the side walls 123 are connected to the bottom plate 121, specifically, the side walls 123 may be connected to the side edges of the bottom plate 121, and therefore, the number of the side walls 123 may correspond to the number of the side edges of the bottom plate 121. For example, in this embodiment, the bottom plate 121 may be a quadrilateral, and the number of the side walls 123 may correspond to four, respectively connected to the four sides of the bottom plate 121. The bottom plate 121 and the plurality of side walls 123 together define the aforementioned receiving groove C, and the receiving groove C may be located on the second surface S2 of the thermal conductive base 120. The shape of the receiving groove C on the second surface S2 may be a quadrilateral, a circle, a polygon, etc., and the present invention does not limit the shape of the receiving groove C. For example, in this embodiment, the shape of the receiving groove C on the second surface S2 is a quadrilateral.

In some embodiments, the thermally conductive cover 110 is disposed on the thermally conductive base 120 to cover and seal the receiving groove C of the thermally conductive base 120. Specifically, in this embodiment, the thermally conductive cover 110 may include a cover plate 112 and a plurality of side plates 114 connected to the cover plate 112. In one embodiment, the side plates 114 may be respectively connected to a plurality of side edges of the cover plate 112, so the number of the side plates 114 may respectively correspond to the number of the side edges of the cover plate 112, and the number of the side edges of the cover plate 112 may correspond to the number of the side edges of the receiving groove C of the thermally conductive base 120. Therefore, in this embodiment, the cover plate 112 may be a quadrilateral corresponding to the receiving groove C, and the number of the side plates 114 may correspond to four, so as to be respectively connected to the four sides of the cover plate 112. In this embodiment, the side plates 114 are respectively located in the receiving groove C of the thermally conductive base 120 and respectively abut against the corresponding side walls 123. In other words, the thermally conductive cover 110 is embedded in the receiving groove C to cover and seal the receiving groove C of the thermally conductive base 120. In one embodiment, the material of the thermally conductive base 120 and the thermally conductive cover 110 includes a metal material with a high thermal conductivity coefficient, such as copper and aluminum. The thermally conductive base 120 can be formed by forming a groove on a surface of a metal reinforcement plate. Thus, when the heat sink structure 100 is attached to an electronic component such as a semiconductor package, it can not only provide a heat dissipation function, but also enhance the structural strength of the electronic component. In addition, the thickness of the heat sink structure 100 formed in this way can also be controlled to be less than 100 microns.

In some embodiments, the heat dissipation powder 130 is disposed in the receiving groove C and sealed in the receiving groove C via the thermally conductive cover 110. In some embodiments, the heat dissipation powder 130 includes powdered materials such as carbon-based materials, ceramics or metals and/or any combination thereof. The carbon-based materials may include graphite, graphene, nanocarbon, etc., and the metals may include aluminum, copper, etc. In this embodiment, the heat dissipation powder 130 may include graphite powder, ceramic powder, aluminum oxide powder and/or any combination thereof. In this configuration, the heat dissipation powder 130 can be sealed in the receiving space defined by the thermally conductive base 120 and the thermally conductive cover 110 and is not easy to overflow, thereby improving the heat dissipation effect and yield of the heat sink structure 100, and also preventing the heat dissipation powder 130 from overflowing and causing electronic components such as semiconductor packages to be contaminated or electrical abnormalities to occur. Furthermore, the heat sink structure 100 disclosed in the present invention may have a thin and flat appearance, so as to be easily attached to electronic components.

In some embodiments, the heat sink structure 100 may further include a first adhesive layer 140, which may be attached to the second surface S2 of the thermally conductive base 120 and the outer surface 116 of the thermally conductive cover 110. In this way, the first adhesive layer 140 may be attached to the thermally conductive base 120 and the thermally conductive cover 110 at the same time to fix the assembly relationship between the two, and may also be used to attach the heat sink structure 100 to other electronic components. Furthermore, the thermally conductive cover 110 is embedded in and engaged with the receiving groove C of the thermally conductive base 120, so that the second surface S2 of the thermally conductive base 120 and the outer surface 116 of the thermally conductive cover 110 are coplanar. In this way, the first adhesive layer 140 can be attached to the coplanar surface formed by the second surface S2 of the thermally conductive base 120 and the outer surface 116 of the thermally conductive cover 110 to fix the relative position between the thermally conductive base 120 and the thermally conductive cover 110 .

In one embodiment, the heat sink structure 100 may further include a second adhesive layer 150, which may be attached to the first surface S1 of the thermally conductive base 120. That is, the first adhesive layer 140 and the second adhesive layer 150 may be attached to two opposite surfaces of the heat sink structure 100 (e.g., the second surface S2 and the first surface S1), respectively, so that one side of the heat sink structure 100 may be attached to a device structure via the first adhesive layer 140, and the opposite side of the heat sink structure 100 may be attached to another device structure via the second adhesive layer 150, thereby simultaneously assisting two electronic components in heat dissipation.

FIG2A is a cross-sectional schematic diagram of a heat sink structure according to another embodiment of the present disclosure. This embodiment uses the component numbers and some contents of the embodiment of FIG2 , wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the aforementioned embodiment, and will not be repeated here.

The main difference between the heat sink structure 100' of FIG. 2A and the heat sink structure 100 of FIG. 2 is that the thermally conductive cover 110' may include only the cover plate 112 without the side plate 114, and the cover plate 112 covers the receiving groove C to seal the heat dissipation powder 130 in the receiving groove C. In this embodiment, the shape of the cover plate 112 may be conformal to the contour of the receiving groove C on the second surface S2, and the number of sides of the cover plate 112 may correspond to the number of sides of the receiving groove C. Specifically, in this embodiment, the cover plate 112 is embedded in and engaged with the receiving groove C, and the second surface S2 of the thermally conductive base 120 and the outer surface 116 of the thermally conductive cover 110' are coplanar, and the first adhesive layer 140 is attached to the coplanar surface formed by the second surface S2 and the outer surface 116. In this way, the first adhesive layer 140 can be attached to the second surface S2 of the thermally conductive base 120 and the outer surface 116 of the thermally conductive cover 110' at the same time to fix the assembly relationship between the two, and can also be used to attach the heat sink structure 100' to other electronic components.

FIG3 is a cross-sectional schematic diagram of a heat sink structure according to another embodiment of the present disclosure. FIG4 is a top view schematic diagram of some components of the heat sink structure of FIG3 . The top view of FIG4 omits the heat conductive cover 110 and the first adhesive layer 140 in order to more clearly present the structure of the heat conductive base below. The heat sink structure 100a of this embodiment uses the component numbers and some contents of the heat sink structure 100 of the embodiment of FIG2 , wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, please refer to the aforementioned embodiments, which will not be repeated here.

Please refer to FIG. 3 and FIG. 4 . The main difference between the heat sink structure 100a of FIG. 3 and the heat sink structure 100 of FIG. 2 is that: in this embodiment, the heat conductive base 120 may further include at least one partition 122, which is disposed in the receiving groove C defined by the heat conductive base 120 and connected to the bottom plate 121 to divide the receiving groove C into a plurality of sub-grooves C1, C2, and C3, and the heat dissipation powder 130 may be disposed in the plurality of sub-grooves C1, C2, and C3, respectively. In some embodiments, the partition 122 may extend upward from the bottom plate 121 to abut against the cover plate 112 of the heat conductive cover 110 covering it. In this embodiment, the thermally conductive base 120 may include two partitions 122 to divide the accommodating groove C defined by the thermally conductive base 120 into a first sub-groove C1, a second sub-groove C2, and a third sub-groove C3. The heat dissipation powder 130 may include a plurality of first heat dissipation powders 132 disposed in the first sub-groove C1, a plurality of second heat dissipation powders 134 disposed in the second sub-groove C2, and a plurality of third heat dissipation powders 136 disposed in the third sub-groove C3, wherein the material of the first heat dissipation powder 132 may be different from the material of the second heat dissipation powder 134 and/or the third heat dissipation powder 136. Of course, this embodiment is only used for illustration, and the present disclosure does not limit the number of partitions 122 and sub-grooves and their arrangement. The present disclosure does not limit the first heat dissipation powder 132, the second heat dissipation powder 134, and the third heat dissipation powder 136 to use the same or different materials.

For example, the first heat dissipation powder 132 disposed in the first sub-recess C1 may be graphite powder, the second heat dissipation powder 134 disposed in the second sub-recess C2 may be ceramic powder, and the third heat dissipation powder 136 disposed in the third sub-recess C3 may be alumina powder, but the present disclosure is not limited thereto. The configuration of the sub-recesses C1, C2, and C3 and the types of the heat dissipation powders 132, 134, and 136 placed therein may vary according to the heat dissipation requirements of the electronic component to which the heat sink structure 100a is attached. For example, if the electronic component has a greater heat dissipation requirement in the central area, a heat dissipation powder with a higher thermal conductivity (e.g., graphite powder) may be placed in the sub-recess corresponding to the central area of the electronic component, and a heat dissipation powder with a lower thermal conductivity (e.g., alumina powder) may be placed in the sub-recesses corresponding to other areas of the electronic component.

FIG5 and FIG6 are schematic top views of some components of the heat sink structure according to different embodiments of the present disclosure. The embodiments of FIG5 and FIG6 use the component numbers and some contents of the embodiment of FIG4, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the aforementioned embodiments, and will not be repeated here.

Please refer to FIG. 5 . In this embodiment, the plurality of sub-grooves include a first sub-groove C1 and a second sub-groove C2, and the size of the first sub-groove C1 is different from the size of the second sub-groove C2. In this embodiment, the thermally conductive base 120 may include a partition 122 to separate the first sub-groove C1 and the second sub-groove C2 of two different sizes, wherein the size of the first sub-groove C1 is smaller than the size of the second sub-groove C2. In one embodiment, the heat dissipation powder 130 may include a first heat dissipation powder 132 disposed in the first sub-groove C1 and a second heat dissipation powder 134 disposed in the second sub-groove C2, and the material of the first heat dissipation powder 132 may be different from the material of the second heat dissipation powder 134.

In some embodiments, the size of the sub-grooves C1 and C2 and the types of heat dissipation powders 132 and 134 placed therein can be changed according to the heat dissipation requirements of the electronic components to which the heat sink structure is attached. For example, if the heat dissipation requirements of the electronic components in the right area are larger and the area is smaller, the size of the sub-grooves corresponding to the right area of the electronic components (e.g., the first sub-grooves C1) can be smaller than the size of the sub-grooves in the left area (e.g., the second sub-grooves C2), and heat dissipation powders 132 with a higher thermal conductivity (e.g., graphite powder) are placed in the first sub-grooves C1, and heat dissipation powders 134 with a lower thermal conductivity (e.g., aluminum oxide powder) are placed in the second sub-grooves C2.

Please refer to FIG. 6 . In this embodiment, the sub-grooves may include a plurality of sub-grooves C1, C2, C3, C4, C5, and C6, in which heat dissipation powders 130 and 130a may be disposed respectively. For example, the number of sub-grooves C1, C2, C3, C4, C5, and C6 may be six and symmetrically disposed, and the heat dissipation powders 130 and 130a disposed therein may include at least two different types. In other words, the heat dissipation powders 130 and 130a disposed in the sub-grooves C1, C2, C3, C4, C5, and C6 may be of the same type or of different types depending on the heat dissipation requirements of the actual product. For example, if the electronic component has a greater heat dissipation requirement in the central area of the upper side, a heat dissipation powder 130a (such as graphite powder) with a higher thermal conductivity coefficient may be placed in the sub-groove (such as sub-groove C2) corresponding to the central area of the upper side of the electronic component, and a heat dissipation powder 130 with a lower thermal conductivity coefficient (such as aluminum oxide powder) may be placed in the remaining sub-grooves (such as sub-grooves C1, C3, C4, C5, and C6).

FIG. 7 is a bottom view schematic diagram of a thin film chip package structure according to an embodiment of the present disclosure. FIG. 8 is a cross-sectional schematic diagram of the thin film chip package structure of FIG. 7. The heat sink structure in the thin film chip package structure of this embodiment uses the component numbers and part of the content of the embodiment of FIG. 2, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical content is omitted. The description of the omitted part can be referred to the aforementioned embodiment, and will not be repeated here.

The aforementioned heat sink structure can be attached to other electronic components to assist them in heat dissipation. This embodiment is only used to illustrate one application of the heat sink structure, but the present disclosure does not limit the scope of application of the heat sink structure. Please refer to Figures 7 and 8 at the same time. The heat sink structure 100 can be applied to the thin film chip package structure 10 shown in Figures 7 and 8. In this embodiment, the thin film chip package structure 10 may include a heat sink structure 100, a flexible circuit carrier 210 and a chip 220. In this embodiment, the flexible circuit carrier 210 has a relative upper surface 210a and a lower surface 210b and a chip setting area R1 defined on the upper surface 210a. The chip 220 is configured in the chip setting area R1 and is electrically connected to the flexible circuit carrier 210. In this embodiment, the heat sink structure 100 may be disposed on the lower surface 210b of the flexible circuit carrier 210 and corresponds to the chip placement area R1.

In some embodiments, the flexible circuit carrier 210 may include a flexible substrate 212, a patterned circuit layer 214, and a solder mask 216. The patterned circuit layer 214 is disposed on the upper surface of the flexible substrate 212. The solder mask 216 partially covers the patterned circuit layer 214 and exposes at least the chip placement area R1. The chip 220 is disposed in the chip placement area R1 and is electrically connected to the flexible circuit carrier 210 by bonding the patterned circuit layer 214. In this embodiment, the patterned circuit layer 214 is partially located in the chip placement area R1, and the solder mask 216 exposes the patterned circuit layer 214 located in the chip placement area R1. As shown in Fig. 8, the chip 220 can be bonded to the patterned circuit layer 214 located in the chip setting area R1 by flip chip. In more detail, the upper surface 210a of the flexible circuit carrier 210 can be the exposed surface of any component thereof (including the flexible substrate 212, the patterned circuit layer 214 and the solder mask 216).

In one embodiment, the heat sink structure 100 may use the various heat sink structures described in the above embodiments, and may be attached to the lower surface 210b of the flexible circuit carrier 210 via the first adhesive layer 140. In this embodiment, the attachment position of the heat sink structure 100 may correspond to the chip setting area R1. In other words, from the bottom view shown in FIG. 7, the heat sink structure 100 partially overlaps the chip 220 (chip setting area R1). In this way, the heat sink structure 100 can dissipate heat for the chip 220. In addition, the film chip package structure 10 may further include a bottom filler 230 filled between the chip 220 and the flexible circuit carrier 210.

FIG9 is a cross-sectional schematic diagram of a thin film chip package structure according to another embodiment of the present disclosure. The thin film chip package structure 10a of this embodiment uses the component numbers and part of the content of the thin film chip package structure 10 of the previous embodiment, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical content is omitted. The description of the omitted part can refer to the previous embodiment, and will not be repeated here.

Please refer to FIG. 9 . In this embodiment, the heat sink structure 100 can be disposed on the upper surface 210a of the flexible circuit carrier 210 and outside the chip setting area R1. Specifically, the heat sink structure 100 can be disposed on the upper surface 210a where the chip 220 is disposed. In other words, the heat sink structure 100 and the chip 220 can be disposed on the same side of the flexible circuit carrier 210 and do not overlap with the chip setting area R1, but are disposed in the outer area of the chip setting area R1. In this embodiment, the heat sink structure 100 is attached to the solder mask 230 by the first adhesive layer 140 to assist the thin film flip chip package structure 10a in heat dissipation. Of course, this embodiment is only used for illustration. In other embodiments, the heat sink structure 100 may also be disposed on the upper surface 210a and the lower surface 210b of the flexible circuit carrier 210 at the same time, and may also be disposed at other positions other than the positions shown in FIGS. 7 to 9 .

In summary, the heat sink structure disclosed herein places heat dissipation powder in a receiving groove defined by a thermally conductive base, and covers the heat conductive cover thereon to seal the heat dissipation powder in the receiving groove. With such a configuration, the heat dissipation powder can be sealed in a sealed space defined by the thermally conductive base and the thermally conductive cover and is not easy to overflow. Therefore, this heat sink structure can provide a better heat dissipation effect and yield, and can also prevent the heat dissipation powder from overflowing and causing electronic components such as a film flip chip package structure to be contaminated or electrical abnormalities to occur. In addition, the thermally conductive base of the heat sink structure disclosed herein can be made of a metal reinforcement plate, whereby when the heat sink structure is attached to the film flip chip package structure, it can not only provide a heat dissipation function, but also enhance the structural strength of the film flip chip package structure. Furthermore, the heat sink structure disclosed in the present invention can have a thin and flat appearance, so that it can be attached to the chip-on-film packaging structure to assist the chip-on-film packaging structure in heat dissipation. Therefore, the heat sink structure disclosed in the present invention can effectively improve the heat dissipation efficiency of electronic components such as the chip-on-film packaging structure.

10, 10a: film chip package structure 100, 100', 100a: heat sink structure 110, 110': thermal conductive cover 112: cover plate 114: side plate 116: outer surface 120: thermal conductive base 121: bottom plate 122: partition plate 123: side wall 130, 130a, 132, 134, 136: heat dissipation powder 132: first heat dissipation powder 134: second heat dissipation powder 136: third heat dissipation powder 140: first adhesive layer 150: second adhesive layer 210: flexible circuit carrier 210a: upper surface 210b: lower surface 212: flexible base 214: Patterned circuit layer 216: Solder mask 220: Chip 230: Bottom filler C: Accommodating groove C1, C2, C3, C4, C5, C6: Sub-grooves C1: First sub-groove C2: Second sub-groove C3: Third sub-groove R1: Chip setting area S1: First surface S2: Second surface

FIG. 1 is a schematic diagram of a heat sink structure according to an embodiment of the present disclosure. FIG. 2 is a schematic diagram of a cross-sectional view of a heat sink structure according to an embodiment of the present disclosure. FIG. 2A is a schematic diagram of a cross-sectional view of a heat sink structure according to another embodiment of the present disclosure. FIG. 3 is a schematic diagram of a cross-sectional view of a heat sink structure according to another embodiment of the present disclosure. FIG. 4 is a schematic diagram of a top view of some components of the heat sink structure of FIG. 3. FIG. 5 to FIG. 6 are schematic diagrams of a top view of some components of the heat sink structure according to different embodiments of the present disclosure. FIG. 7 is a schematic diagram of a bottom view of a thin film chip-on-chip packaging structure according to an embodiment of the present disclosure. FIG. 8 is a schematic diagram of a cross-sectional view of the thin film chip-on-chip packaging structure of FIG. 7. FIG. 9 is a schematic diagram of a cross-sectional view of a thin film chip-on-chip packaging structure according to another embodiment of the present disclosure.

10: Thin film chip packaging structure

100: Heat sink structure

110: Thermal conductive cover

120: Thermal conductive base

130: Heat dissipation powder

140: First adhesive layer

210: Flexible circuit board

210a: Upper surface

210b: Lower surface

212: Flexible base

214: Patterned circuit layer

216: Solder mask

220: Chip

230: Bottom filling glue

C: Accommodating groove

R1: Chip setting area

Claims (9)

A heat sink structure includes: a heat conductive base having a first surface and a second surface opposite to each other, and including a bottom plate, a plurality of side walls connected to the bottom plate, and a receiving groove located on the second surface, wherein the bottom plate and the plurality of side walls together define the receiving groove; a heat conductive cover covering and sealing the receiving groove of the heat conductive base, wherein the heat conductive cover is embedded in and engaged with the receiving groove of the heat conductive base; a plurality of heat dissipation powders disposed in the receiving groove; and a first adhesive layer attached to the second surface of the heat conductive base and the outer surface of the heat conductive cover away from the receiving groove. As described in claim 1, the heat sink structure further includes at least one partition disposed in the receiving groove and connected to the bottom plate to divide the receiving groove into a plurality of sub-grooves, and the plurality of heat dissipation powders are disposed in the plurality of sub-grooves. The heat sink structure as described in claim 2, wherein the plurality of sub-grooves include a first sub-groove and a second sub-groove, the plurality of heat dissipation powders include a plurality of first heat dissipation powders disposed in the first sub-groove and a plurality of second heat dissipation powders disposed in the second sub-groove, and the material of the plurality of first heat dissipation powders is different from the material of the plurality of second heat dissipation powders. A heat sink structure as described in claim 2, wherein the plurality of sub-grooves include a first sub-groove and a second sub-groove, and the size of the first sub-groove is different from the size of the second sub-groove. The heat sink structure as described in claim 1, wherein the material of the plurality of heat dissipation powders includes carbon-based materials, ceramics or metals. The heat sink structure as described in claim 1, wherein the material of the thermally conductive base and the thermally conductive cover includes metal. The heat sink structure as described in claim 1, wherein the second surface of the thermally conductive base and the outer surface of the thermally conductive cover are coplanar, and the first adhesive layer is attached to the coplanar surface formed by the second surface of the thermally conductive base and the outer surface of the thermally conductive cover. The heat sink structure as described in claim 7 further includes a second adhesive layer attached to the first surface of the thermally conductive base. A film flip chip package structure, comprising: a heat sink structure as described in any one of claim 1 to claim 8; a flexible circuit carrier having an upper surface and a lower surface opposite to each other and a chip setting area defined on the upper surface; and a chip, arranged in the chip setting area and electrically connected to the flexible circuit carrier; wherein the heat sink structure is arranged on the lower surface of the flexible circuit carrier and corresponds to the chip setting area or is arranged on the upper surface of the flexible circuit carrier and is located outside the chip setting area.

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