TWI850178B - Pressurizing apparatus - Google Patents
Pressurizing apparatus Download PDFInfo
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- TWI850178B TWI850178B TW113101886A TW113101886A TWI850178B TW I850178 B TWI850178 B TW I850178B TW 113101886 A TW113101886 A TW 113101886A TW 113101886 A TW113101886 A TW 113101886A TW I850178 B TWI850178 B TW I850178B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
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Abstract
Description
本發明係關於一種加壓裝置。 The present invention relates to a pressurizing device.
已知有一種用於對由多個電子構件(基板、電路元件)等所構成之被加壓物進行加壓的加壓裝置(例如，參照專利文獻1)。該裝置具有上加壓單元與下加壓單元。被加壓物配置於上加壓單元與下加壓單元之間。上加壓單元具備基座構件、上模具、加壓墊、框架構件、以及彈簧構件。基座構件保持上模具與彈簧構件。上模具與基座構件一起向下方移動，藉由加壓墊對被加壓物進行加壓。框架構件以可相對於上模具在上下方向上相對移動的方式由彈簧構件所保持。框架構件保持有具備柔性的加壓墊。在被加壓物被上模具加壓時，加壓墊追隨被加壓物的形狀變形，對被加壓物進行均勻的加壓。下加壓單元具備下模具。被加壓物載置於下模具的表面。在被加壓物被上模具加壓時，被加壓物被加壓墊及下模具夾持並進行加壓。 A pressurizing device for pressurizing an object to be pressurized, which is composed of a plurality of electronic components (substrates, circuit elements), etc., is known (for example, refer to Patent Document 1). The device has an upper pressurizing unit and a lower pressurizing unit. The object to be pressurized is arranged between the upper pressurizing unit and the lower pressurizing unit. The upper pressurizing unit has a base member, an upper mold, a pressurizing pad, a frame member, and a spring member. The base member holds the upper mold and the spring member. The upper mold moves downward together with the base member, and the object to be pressurized is pressurized by the pressurizing pad. The frame member is held by the spring member in a manner that it can move relative to the upper mold in the up and down directions. The frame member holds a flexible pressurizing pad. When the object to be pressurized is pressurized by the upper mold, the pressurizing pad follows the shape deformation of the object to be pressurized and pressurizes the object uniformly. The lower pressurizing unit has a lower mold. The object to be pressurized is placed on the surface of the lower mold. When the object to be pressurized is pressurized by the upper mold, the object to be pressurized is clamped by the pressurizing pad and the lower mold and pressurized.
[先前技術文獻] [Prior Art Literature]
[專利文獻] [Patent Literature]
[專利文獻1]日本特開2007-896號公報 [Patent Document 1] Japanese Patent Publication No. 2007-896
在被加壓物被上模具加壓時，加壓墊朝所有方向施加大致均勻的壓力。因此，在被加壓物被高壓加壓時，高壓也會作用於保持加壓墊的框架構件上。因此，水平方向上的框架構件的長度被設計成能夠耐受高壓的長度。亦即，水平方向上的框架構件的長度隨著作用在框架構件上的壓力的增加而變大。結果，框架構件的尺寸變大，框架構件的重量亦增加。由於加壓墊係根據使用次數而定期更換，因此若框架構件的重量增加，則會增加操作員拆裝框架構件以更換加壓墊時的作業負擔。 When the object to be pressurized is pressurized by the upper mold, the pressure pad applies roughly uniform pressure in all directions. Therefore, when the object to be pressurized is pressurized at high pressure, the high pressure also acts on the frame member that holds the pressure pad. Therefore, the length of the frame member in the horizontal direction is designed to be able to withstand the high pressure. That is, the length of the frame member in the horizontal direction increases as the pressure acting on the frame member increases. As a result, the size of the frame member increases and the weight of the frame member also increases. Since the pressure pad is replaced regularly according to the number of times it is used, if the weight of the frame member increases, the operator's workload will increase when disassembling the frame member to replace the pressure pad.
此外，在水平方向上的框架構件的長度變大時，由於發生翹曲以及難以確保加工精度等加工風險，而難以確保框架構件之平坦面的平坦性。特別是，如果無法確保抵接於載置台之平坦面的平坦性，則在加壓處理中，無法確保加壓墊對被加壓物之壓力的均勻。結果，可能配置被加壓物的位置產生偏移，從而無法維持被加壓物的品質。如此，在製造框架構件時，可能產生框架構件發生翹曲以及難以確保框架構件的加工精度等加工風險變大的技術問題。 In addition, when the length of the frame member in the horizontal direction increases, it is difficult to ensure the flatness of the flat surface of the frame member due to processing risks such as warping and difficulty in ensuring processing accuracy. In particular, if the flatness of the flat surface abutting the mounting table cannot be ensured, the pressure of the pressurizing pad on the pressurized object cannot be ensured to be uniform during the pressurization process. As a result, the position of the pressurized object may be offset, and the quality of the pressurized object cannot be maintained. In this way, when manufacturing the frame member, there may be technical problems such as increased processing risks such as warping of the frame member and difficulty in ensuring the processing accuracy of the frame member.
本發明之目的在於，減輕操作員更換框架構件時的作業負擔，並降低製造框架構件時框架構件發生翹曲以及難以確保框架構件的加工精度等加工風險。 The purpose of the present invention is to reduce the operator's workload when replacing frame components, and to reduce processing risks such as warping of frame components and difficulty in ensuring the processing accuracy of frame components when manufacturing frame components.
本發明之一個實施態樣係一種加壓裝置，其在鉛直方向上夾持被加壓物進行加壓，其具有在鉛直方向上以對向的方式配置而夾持前述被加壓物進行加壓的一對加壓單元，一對前述加壓單元中的一個前述加壓單元具備：加壓墊，其具備在前述被加壓物被加壓時追隨前述被加壓物的表面形狀變形的柔性體；以及框架構件，其保持前述加壓墊，前述框架構件具備：第1框架構件，其在水平方向上，以包圍前述柔性體之整周的方式配置，保持前述柔性體；第2框架構件，其供前述第1框架構件以可拆裝的方式安裝；以及第3框架構件，其在水平 方向上，以包圍前述第1框架構件之整周的方式配置，以可拆裝的方式安裝於前述第2框架構件，將前述第1框架構件固定於前述第2框架構件，在水平方向上，前述第3框架構件抵接於前述第1框架構件以及前述第2框架構件。 One embodiment of the present invention is a pressurizing device, which clamps a pressurized object in a vertical direction of lead for pressurization, and has a pair of pressurizing units arranged in an opposite manner in the vertical direction of lead to clamp the pressurized object for pressurization, and one of the pressurizing units in the pair of pressurizing units has: a pressurizing pad, which has a flexible body that deforms to follow the surface shape of the pressurized object when the pressurized object is pressurized; and a frame member that holds the pressurizing pad, and the frame member has: a first frame member, which is horizontally The second frame member is disposed upwardly in a manner surrounding the entire circumference of the aforementioned flexible body to hold the aforementioned flexible body; the second frame member is provided for the aforementioned first frame member to be detachably mounted; and the third frame member is disposed horizontally in a manner surrounding the entire circumference of the aforementioned first frame member and is detachably mounted on the aforementioned second frame member to fix the aforementioned first frame member to the aforementioned second frame member. In the horizontal direction, the aforementioned third frame member abuts against the aforementioned first frame member and the aforementioned second frame member.
根據本發明，能夠減輕操作員更換框架構件時的作業負擔，並降低製造框架構件時框架構件發生翹曲以及難以確保框架構件的加工精度等加工風險。 According to the present invention, the operator's workload when replacing frame components can be reduced, and the processing risks such as warping of frame components and difficulty in ensuring the processing accuracy of frame components during manufacturing can be reduced.
1:加壓裝置 1: Pressurizing device
2:上加壓單元(其中一個加壓單元) 2: Upper pressure unit (one of the pressure units)
3:下加壓單元(其中另一加壓單元) 3: Lower pressure unit (another pressure unit)
21:基座構件 21: Base components
22:上模具 22: Upper mold
23:側邊構件 23: Side components
23a:排氣孔 23a: Exhaust hole
24:缸 24: Cylinder
25:加壓墊 25: Pressure pad
251:柔性體 251: Flexible body
252:膜 252: Membrane
253:膜 253: Membrane
26:框架構件 26: Frame components
26a:第1框架構件 26a: 1st frame member
a1:第1內周面 a1: 1st inner surface
a2:第1外周面 a2: 1st outer peripheral surface
a3:第1上表面 a3: 1st upper surface
a4:第1下表面 a4: 1st lower surface
26b:第2框架構件 26b: 2nd frame member
b1:凹部 b1: concave part
b2:凸部 b2: convex part
b3:安裝面 b3: Mounting surface
b4:第2內周面 b4: 2nd inner surface
b5:第2下表面 b5: 2nd lower surface
b6:第2上表面 b6: 2nd upper surface
26c:第3框架構件 26c: 3rd frame member
c1:第3內周面 c1: The third inner surface
c2:第3外周面 c2: The third outer surface
c3:第3下表面 c3: The third lower surface
c4:第3上表面 c4: 3rd upper surface
27:彈簧構件 27: Spring component
28a:第1安裝螺栓 28a: 1st mounting bolt
28b:第2安裝螺栓 28b: 2nd mounting bolt
31:載置台(對向構件) 31: Loading platform (opposite component)
311:對向面 311: Opposite side
312:下表面 312: Lower surface
32:下模具 32: Lower mold
s:間隙 s: gap
V:虛擬直線 V:Virtual straight line
W:被加壓物 W: Pressurized object
w1:基板 w1: substrate
w2:電路元件 w2: Circuit components
w3:黏接劑 w3: Adhesive
w11:配線 w11: Wiring
w21:凸點 w21: convex point
圖1係表示本發明之加壓裝置中的被加壓物的壓接步驟的概念圖。(a)表示配置於載置台之被加壓物的狀態。(b)表示加壓墊抵接於被加壓物的狀態。(c)表示加壓墊追隨被加壓物的形狀變形的狀態。 FIG1 is a conceptual diagram showing the pressing step of the pressurized object in the pressurizing device of the present invention. (a) shows the state of the pressurized object arranged on the mounting table. (b) shows the state of the pressurizing pad abutting against the pressurized object. (c) shows the state of the pressurizing pad deforming to follow the shape of the pressurized object.
圖2係表示本發明之加壓裝置的實施形態的示意剖視圖。 Figure 2 is a schematic cross-sectional view showing an implementation form of the pressurizing device of the present invention.
圖3係表示圖2之加壓裝置所具備之框架構件的局部放大示意剖視圖。 FIG3 is a partially enlarged schematic cross-sectional view showing the frame member of the pressurizing device of FIG2.
圖4係表示仰視觀察圖2之加壓裝置所具備之框架構件的狀態的仰視圖。 FIG. 4 is a bottom view showing the state of the frame member of the pressurizing device of FIG. 2 when viewed from above.
圖5係表示構成圖3之框架構件的第1框架構件、第2框架構件、以及第3框架構件分離的狀態的放大示意剖視圖。 FIG5 is an enlarged schematic cross-sectional view showing the first frame member, the second frame member, and the third frame member constituting the frame member of FIG3 in a separated state.
圖6係表示仰視觀察構成圖4之框架構件的第1框架構件的狀態的仰視圖。 FIG. 6 is a bottom view showing the state of the first frame member constituting the frame member of FIG. 4 when viewed from above.
圖7係表示仰視觀察構成圖4之框架構件的第2框架構件的狀態的仰視圖。 FIG. 7 is a bottom view showing the state of the second frame member constituting the frame member of FIG. 4 when viewed from above.
圖8係表示仰視觀察構成圖4之框架構件的第3框架構件的狀態的仰視圖。 FIG8 is a bottom view showing the state of the third frame member constituting the frame member of FIG4 when viewed from above.
圖9係表示使圖2之加壓裝置所具備之上加壓單元下降而上加壓單元之側邊構件抵接於下加壓單元之載置台的狀態的示意剖視圖。 FIG9 is a schematic cross-sectional view showing a state in which the upper pressurizing unit of the pressurizing device of FIG2 is lowered and the side member of the upper pressurizing unit abuts against the mounting table of the lower pressurizing unit.
圖10係表示從圖9所示之狀態使上加壓單元下降，被加壓物隔著加壓墊被上加壓單元之上模具加壓的狀態的示意剖視圖。 FIG10 is a schematic cross-sectional view showing the state in which the upper pressurizing unit is lowered from the state shown in FIG9 and the pressurized object is pressurized by the upper mold of the upper pressurizing unit through the pressurizing pad.
圖11係表示在圖10的狀態下施加壓力的狀態的放大示意剖視圖。 FIG11 is an enlarged schematic cross-sectional view showing the state of applying pressure in the state of FIG10.
以下，對本發明之加壓裝置(以下簡稱「本裝置」)的實施形態進行說明。在以下的說明中，適當參照圖式。在以下的說明中，對具有相同結構或功能的要件標註相同的圖式符號，而省略重複的說明。此外，各要件的尺寸比例不限於各圖式中示出的比例。 The following is a description of the implementation form of the pressurizing device of the present invention (hereinafter referred to as "the present device"). In the following description, the drawings are appropriately referred to. In the following description, the same drawing symbols are marked for the elements with the same structure or function, and repeated descriptions are omitted. In addition, the dimensional ratios of each element are not limited to the ratios shown in each drawing.
在以下的說明以及圖式中，若無特別強調，則本裝置皆設置於水平的地面上。在本裝置中，水平方向係指與地面的水平面平行的方向，鉛直方向係指與水平面垂直的方向。在鉛直方向上，下方係指相對於本裝置而言地面所在的方向，上方係指與下方相反的方向。下方係本發明中的第3方向之一例，上方係本發明中的第4方向之一例。 In the following description and drawings, unless otherwise specified, the device is set on a horizontal ground. In the device, the horizontal direction refers to the direction parallel to the horizontal plane of the ground, and the vertical direction refers to the direction perpendicular to the horizontal plane. In the vertical direction, the bottom refers to the direction of the ground relative to the device, and the top refers to the direction opposite to the bottom. The bottom is an example of the third direction in the present invention, and the top is an example of the fourth direction in the present invention.
●加壓裝置● ●Pressure device●
●被加壓物的壓接步驟 ●The step of pressing the pressurized object
首先，作為本裝置進行加壓之一例，對本裝置中的被加壓物的壓接步驟進行說明如下。 First, as an example of pressurization by this device, the crimping step of the pressurized object in this device is described as follows.
圖1係表示本裝置1(參照圖2；以下相同)中的被加壓物W的壓接步驟的概念圖。圖1之(a)表示配置於載置台31(參照圖2；以下相同)之被加壓物W的狀態。圖1(b)表示加壓墊25抵接於被加壓物W的狀態。圖1(c)表示加壓墊25追隨被加壓物W的形狀變形的狀態。 FIG1 is a conceptual diagram showing the pressing step of the pressurized object W in the present device 1 (refer to FIG2; the same below). FIG1 (a) shows the state of the pressurized object W arranged on the mounting table 31 (refer to FIG2; the same below). FIG1 (b) shows the state of the pressurized pad 25 abutting against the pressurized object W. FIG1 (c) shows the state of the pressurized pad 25 deforming to follow the shape of the pressurized object W.
被加壓物W係被本裝置1加壓的對象。被加壓物W通過組合多個電子構件而構成。被加壓物W例如具備基板w1、電路元件w2、以及黏接劑w3。 The object to be pressurized W is an object to be pressurized by the device 1. The object to be pressurized W is formed by combining a plurality of electronic components. The object to be pressurized W includes, for example, a substrate w1, a circuit element w2, and an adhesive w3.
需要說明的是，在本發明中，被加壓物W並不限於通過組合多個電子構件而構成。 It should be noted that in the present invention, the pressurized object W is not limited to being formed by combining multiple electronic components.
圖1所示之例中，基板w1載置於載置台31，電路元件w2配置於基板w1的上方，黏接劑w3配置於基板w1與電路元件w2之間。此時，基板w1的配線w11配置於電路元件w2的對應凸點w21的下方，與凸點w21對向。 In the example shown in FIG1 , the substrate w1 is placed on the mounting table 31, the circuit element w2 is arranged above the substrate w1, and the adhesive w3 is arranged between the substrate w1 and the circuit element w2. At this time, the wiring w11 of the substrate w1 is arranged below the corresponding bump w21 of the circuit element w2, and is opposite to the bump w21.
在藉由本裝置1對被加壓物W進行加壓時，首先，配置於被加壓物W之上方的加壓墊25下降，而抵接於電路元件w2(參照圖1之(b))。接著，加壓墊25一邊追隨被加壓物W的形狀，以包圍基板w1、電路元件w2、以及黏接劑w3的側方的方式變形，一邊對被加壓物W進行加壓。此時，被加壓物W一邊被加壓墊25包圍側方，一邊被從上方側以及側方側加壓。此外，黏接劑w3被壓縮，電路元件w2靠近基板w1。結果，配線w11靠近凸點w21，在兩者之間被壓縮的黏接劑w3導通。接著，被加壓之被加壓物W被加熱，黏接劑w3熱固化。如此，藉由本裝置1將電路元件w2壓接於基板w1。 When the object W is pressurized by the device 1, first, the pressurizing pad 25 disposed above the object W is lowered and abuts against the circuit element w2 (see FIG. 1(b)). Then, the pressurizing pad 25 follows the shape of the object W and deforms in a manner to surround the substrate w1, the circuit element w2, and the side of the adhesive w3, while pressurizing the object W. At this time, the object W is pressurized from the upper side and the side while being surrounded by the pressurizing pad 25. In addition, the adhesive w3 is compressed, and the circuit element w2 is close to the substrate w1. As a result, the wiring w11 approaches the bump w21, and the adhesive w3 compressed between the two is conductive. Then, the pressurized object W is heated, and the adhesive w3 is thermally cured. In this way, the circuit element w2 is pressed and bonded to the substrate w1 by the device 1.
●加壓裝置的結構 ●Structure of pressurizing device
接著，對本裝置1的結構進行說明如下。 Next, the structure of the device 1 is described as follows.
圖2係表示本裝置1的實施形態的示意剖視圖。 Figure 2 is a schematic cross-sectional view showing an implementation form of the present device 1.
圖3係表示本裝置1所具備之框架構件26的局部放大示意剖視圖。
Figure 3 is a partially enlarged schematic cross-sectional view of the
圖4係表示仰視觀察框架構件26的狀態的仰視圖。
FIG. 4 is a bottom view showing the state of the
本裝置1對被加壓物W進行加壓。本裝置1具有上加壓單元2、下加壓單元3、升降機構(圖中未顯示；以下相同)、真空泵P、以及控制部(圖中未顯示；以下相同)。上加壓單元2以及下加壓單元3係本發明中的一對加壓單元之一例。 The device 1 pressurizes the object W. The device 1 has an upper pressurizing unit 2, a lower pressurizing unit 3, a lifting mechanism (not shown in the figure; the same below), a vacuum pump P, and a control unit (not shown in the figure; the same below). The upper pressurizing unit 2 and the lower pressurizing unit 3 are an example of a pair of pressurizing units in the present invention.
在鉛直方向上，上加壓單元2與下加壓單元3一起夾持被加壓物W，對被加壓物W進行加壓。上加壓單元2配置於下加壓單元3的上方。亦即，
在鉛直方向上，上加壓單元2以與下加壓單元3對向的方式配置於下加壓單元3的上方。上加壓單元2可藉由升降機構在鉛直方向上移動。上加壓單元2具備基座構件21、上模具22、側邊構件23、缸24、加壓墊25、框架構件26、彈簧構件27、以及安裝螺栓28。上加壓單元2係本發明中的一個加壓單元之一例。
In the vertical direction of the lead, the upper pressurizing unit 2 and the lower pressurizing unit 3 clamp the pressurized object W together and pressurize the pressurized object W. The upper pressurizing unit 2 is arranged above the lower pressurizing unit 3. That is, in the vertical direction of the lead, the upper pressurizing unit 2 is arranged above the lower pressurizing unit 3 in a manner opposite to the lower pressurizing unit 3. The upper pressurizing unit 2 can be moved in the vertical direction of the lead by a lifting mechanism. The upper pressurizing unit 2 has a base component 21, an upper mold 22, a side component 23, a cylinder 24, a pressurizing pad 25, a
基座構件21保持上模具22、缸24、以及彈簧構件27。基座構件21以可藉由升降機構在鉛直方向上移動的方式被升降機構所保持。 The base member 21 holds the upper mold 22, the cylinder 24, and the spring member 27. The base member 21 is held by the lifting mechanism in a manner that allows it to move in a vertical direction.
上模具22隔著加壓墊25從上方對被加壓物W進行加壓。上模具22配置於基座構件21的下表面，由基座構件21所保持。上模具22與基座構件21一體移動。在水平方向上，上模具22的剖面形狀為矩形。上模具22的下表面的形狀為平面。上模具22在上模具22的內部具備加熱機構(圖中未顯示；以下相同)。加熱機構對被加壓物W進行加熱。加熱機構的具體說明於以下敘述。 The upper mold 22 presses the object W from above via the pressure pad 25. The upper mold 22 is arranged on the lower surface of the base member 21 and is held by the base member 21. The upper mold 22 moves integrally with the base member 21. In the horizontal direction, the cross-sectional shape of the upper mold 22 is rectangular. The shape of the lower surface of the upper mold 22 is a plane. The upper mold 22 has a heating mechanism inside the upper mold 22 (not shown in the figure; the same below). The heating mechanism heats the object W. The specific description of the heating mechanism is described below.
需要說明的是，在本發明中，上模具22亦可不在上模具22的內部具備加熱機構。 It should be noted that in the present invention, the upper mold 22 may not have a heating mechanism inside the upper mold 22.
側邊構件23密封上加壓單元2與下加壓單元3之間載置被加壓物W的空間。在水平方向上，側邊構件23以包圍被密封之空間(以下簡稱「密封空間」)之整周的方式配置。仰視觀察時，側邊構件23的形狀為矩形框狀。亦即，仰視觀察時，在側邊構件23的中央形成有矩形的內部空間。側邊構件23具備從側邊構件23的內側向外側貫通的排氣孔23a。在側邊構件23之內側的內部空間配置有上模具22、加壓墊25、框架構件26、以及彈簧構件27。在水平方向上，側邊構件23以包圍上模具22、加壓墊25、框架構件26、以及彈簧構件27的方式配置。側邊構件23藉由缸24由基座構件21所保持。通過側邊構件23抵接於後述之載置台31，由此密封載置有被加壓物W的空間，而形成密封空間。
The side member 23 seals the space between the upper pressurizing unit 2 and the lower pressurizing unit 3 in which the pressurized object W is placed. In the horizontal direction, the side member 23 is arranged in a manner to surround the entire circumference of the sealed space (hereinafter referred to as the "sealed space"). When viewed from above, the side member 23 has a rectangular frame shape. That is, when viewed from above, a rectangular internal space is formed in the center of the side member 23. The side member 23 has an exhaust hole 23a that passes from the inside to the outside of the side member 23. The upper mold 22, the pressure pad 25, the
「密封空間」係指在側邊構件23抵接於載置台31時，由上模具22、側邊構件23、框架構件26、以及載置台31劃分出的空間。在相互鄰接的構件之間配置有密封件(圖中未顯示；以下相同)，保持密封空間的密封性。
"Sealed space" refers to the space divided by the upper mold 22, the side member 23, the
缸24由基座構件21所保持，並以可升降的方式保持側邊構件23。缸24使側邊構件23下降，而使側邊構件23抵接於載置台31。缸24例如為習知的氣缸。 The cylinder 24 is held by the base member 21 and holds the side member 23 in a manner that allows it to be raised and lowered. The cylinder 24 lowers the side member 23 and makes the side member 23 abut against the mounting table 31. The cylinder 24 is, for example, a known air cylinder.
在被加壓物W被加壓時，加壓墊25追隨被加壓物W的表面形狀變形，對被加壓物W進行均勻的加壓。加壓墊25配置於上模具22與載置台31之間。加壓墊25具備柔性體251以及兩片膜252、253。 When the object W is pressurized, the pressurizing pad 25 deforms to follow the surface shape of the object W and uniformly pressurizes the object W. The pressurizing pad 25 is arranged between the upper mold 22 and the mounting table 31. The pressurizing pad 25 has a flexible body 251 and two films 252 and 253.
在被加壓物W被加壓時，柔性體251向被加壓物W施加均勻的壓力。柔性體251配置於上下的膜252、253之間。柔性體251例如係由習知的具有高流動性與低回彈模數的彈性體材料製成。 When the object W is pressurized, the flexible body 251 applies uniform pressure to the object W. The flexible body 251 is disposed between the upper and lower membranes 252 and 253. The flexible body 251 is made of, for example, a known elastic material with high fluidity and low rebound modulus.
膜252、253保持柔性體251，並防止因柔性體251的水平流動引起的被加壓物W之偏移。膜252、253例如為習知的矽膠膜。在水平方向上，兩片膜252、253各自的端部遍及整周地由框架構件26所保持。
The membranes 252 and 253 hold the flexible body 251 and prevent the displacement of the pressurized object W caused by the horizontal flow of the flexible body 251. The membranes 252 and 253 are, for example, known silicone membranes. In the horizontal direction, the ends of the two membranes 252 and 253 are held by the
以此方式構成的加壓墊25在水平方向上遍及整周地由框架構件26所保持。
The pressure pad 25 constructed in this way is held horizontally by the
框架構件26保持加壓墊25。仰視觀察時，框架構件26的形狀為矩形框狀。亦即，仰視觀察時，在框架構件26的中央形成有矩形的內部空間。框架構件26具備供螺栓等插入的多個孔。在水平方向上，框架構件26以包圍上模具22的方式配置。框架構件26藉由彈簧構件27，以可相對於上模具22在鉛直方向上相對移動的方式，保持於基座構件21。框架構件26例如係由習知的鋼合金製成。框架構件26具備第1框架構件26a、第2框架構件26b、以及第3框架構件26c。框架構件26具有通過組合第1框架構件26a、第2框架構件26b、
以及第3框架構件26c而能夠作為一個框架構件26耐受水平方向之壓力的結構。框架構件26的具體結構於以下敘述。
The
在水平方向上，第1框架構件26a以包圍加壓墊25之整周的方式配置，保持加壓墊25。第1框架構件26a具備三個保持構件以及螺栓。積層之三個保持構件係藉由螺栓所固定，而構成一個第1框架構件26a。加壓墊25的膜252、253之端部被夾持在各保持構件之間。結果，加壓墊25由第1框架構件26a所保持。保持有加壓墊25之第1框架構件26a構成加壓墊單元。
In the horizontal direction, the
此處，在水平方向上，相對於第1框架構件26a而言，配置有加壓墊25的方向為第1方向，與第1方向相反的方向為第2方向。
Here, in the horizontal direction, the direction in which the pressure pad 25 is arranged relative to the
第1框架構件26a具備第1內周面a1、第1外周面a2、第1上表面a3、以及第1下表面a4。
The
第1內周面a1朝向第1方向，抵接於柔性體251。 The first inner peripheral surface a1 faces the first direction and abuts against the flexible body 251.
第1外周面a2朝向第2方向，抵接於後述之第3內周面c1。第1外周面a2係隨著從下方趨向上方而以向第2方向側突出的方式傾斜的傾斜面。 The first outer peripheral surface a2 faces the second direction and contacts the third inner peripheral surface c1 described later. The first outer peripheral surface a2 is an inclined surface that is inclined in a manner that protrudes toward the second direction as it moves from the bottom to the top.
第1上表面a3朝向上方，抵接於後述之安裝面b3。第1上表面a3係與水平方向平行的面。 The first upper surface a3 faces upward and abuts against the mounting surface b3 described later. The first upper surface a3 is a surface parallel to the horizontal direction.
第1下表面a4朝向下方，與載置台31對向。第1下表面a4係與水平方向平行的面。本實施形態中，在第1外周面a2與第1下表面a4之間形成的角度θ1為鈍角(本實施形態中例如為120度)。 The first lower surface a4 faces downward and is opposite to the mounting table 31. The first lower surface a4 is a surface parallel to the horizontal direction. In this embodiment, the angle θ1 formed between the first outer peripheral surface a2 and the first lower surface a4 is a blunt angle (for example, 120 degrees in this embodiment).
第2框架構件26b係作為框架構件26之基座的構件。第1框架構件26a以可拆裝的方式安裝於第2框架構件26b。從第1方向朝向第2方向切割第2框架構件26b時的第2框架構件26b的剖面形狀為大致L形。在水平方向上，第2框架構件26b以包圍上模具22之整周、以及第3框架構件26c之整周的方式配置。第2框架構件26b以可相對於上模具22在鉛直方向上相對移動的
方式，藉由彈簧構件27保持於基座構件21。第2框架構件26b具備凹部b1(參照圖5)、凸部b2(參照圖5)、安裝面b3、第2內周面b4、第2下表面b5、以及第2上表面b6。
The
第2框架構件26b的下部之第1方向側的部分形成為遍及整周地向上方凹陷，而構成凹部b1。第1框架構件26a以及第3框架構件26c配置於凹部b1。凹部b1具備安裝面b3。
The first direction side portion of the lower portion of the
第2框架構件26b的下部之第2方向側的部分比凹部b1向下方突出，而構成凸部b2。亦即，凸部b2配置於凹部b1的第2方向側。在水平方向上，凸部b2以包圍第3框架構件26c之整周的方式配置。凸部b2具備第2內周面b4以及第2下表面b5。
The lower portion of the
安裝面b3朝向下方，抵接於第1上表面a3。安裝面b3係與水平方向平行的面。 The mounting surface b3 faces downward and abuts against the first upper surface a3. The mounting surface b3 is a surface parallel to the horizontal direction.
第2內周面b4朝向第1方向，抵接於後述之第3外周面c2。第2內周面b4係隨著從下方趨向上方而以向第1方向側突出的方式傾斜的傾斜面。第2內周面b4配置於安裝面b3的第2方向側。亦即，安裝面b3配置於第2內周面b4的第1方向側。 The second inner peripheral surface b4 faces the first direction and abuts against the third outer peripheral surface c2 described later. The second inner peripheral surface b4 is an inclined surface that is inclined in a manner protruding toward the first direction side as it goes from the bottom to the top. The second inner peripheral surface b4 is arranged on the second direction side of the mounting surface b3. That is, the mounting surface b3 is arranged on the first direction side of the second inner peripheral surface b4.
第2下表面b5朝向下方，與載置台31對向。第2下表面b5係與水平方向平行的面。本實施形態中，在第2內周面b4與第2下表面b5之間形成的角度θ2為鈍角(本實施形態中例如為120度)。 The second lower surface b5 faces downward and is opposite to the mounting table 31. The second lower surface b5 is a surface parallel to the horizontal direction. In this embodiment, the angle θ2 formed between the second inner peripheral surface b4 and the second lower surface b5 is a blunt angle (for example, 120 degrees in this embodiment).
第2上表面b6朝向上方，安裝有彈簧構件27。第2上表面b6係與水平方向平行的面。 The second upper surface b6 faces upward and is installed with a spring member 27. The second upper surface b6 is a surface parallel to the horizontal direction.
第3框架構件26c將第1框架構件26a固定於第2框架構件26b。從第1方向朝向第2方向切割第2框架構件26b時的鉛直方向上的第3框架構件26c的剖面形狀為梯形。在水平方向上，第3框架構件26c以包圍第1框架構
件26a之整周的方式配置，以可拆裝的方式安裝於第2框架構件26b。第3框架構件26c具備第3內周面c1、第3外周面c2、第3下表面c3、以及第3上表面c4。
The
第3內周面c1朝向第1方向，抵接於第1外周面a2。第3內周面c1係隨著從上方趨向下方而以向第1方向側突出的方式傾斜的傾斜面。 The third inner peripheral surface c1 faces the first direction and contacts the first outer peripheral surface a2. The third inner peripheral surface c1 is an inclined surface that is inclined in a manner that protrudes toward the first direction as it moves from the top to the bottom.
第3外周面c2朝向第2方向，抵接於第2內周面b4。第3外周面c2係隨著從上方趨向下方而以向第2方向側突出的方式傾斜的傾斜面。 The third outer peripheral surface c2 faces the second direction and abuts against the second inner peripheral surface b4. The third outer peripheral surface c2 is an inclined surface that is inclined in a manner that protrudes toward the second direction as it moves from the top to the bottom.
第3下表面c3朝向下方，係與水平方向平行的面。第3上表面c4朝向上方，係與水平方向平行的面。在水平方向上，第3下表面c3的長度比第3上表面c4的長度大。亦即，第3框架構件26c的剖面形狀為上部逐漸變細的梯形。本實施形態中，在第3內周面c1與第3下表面c3之間形成的角度θ3以及在第3外周面c2與第3下表面c3之間形成的角度θ4為銳角(本實施形態中例如為60度)。
The third lower surface c3 faces downward and is parallel to the horizontal direction. The third upper surface c4 faces upward and is parallel to the horizontal direction. In the horizontal direction, the length of the third lower surface c3 is greater than the length of the third upper surface c4. That is, the cross-sectional shape of the
通過組合第1框架構件26a、第2框架構件26b、以及第3框架構件26c而構成框架構件26。第1框架構件26a藉由第3框架構件26c以及第1安裝螺栓28a安裝於第2框架構件26b。第3框架構件26c藉由第2安裝螺栓28b安裝於第2框架構件26b。第3框架構件26c的第3內周面c1與第1框架構件26a的第1外周面a2對向配置。第3內周面c1的整個面抵接於第1外周面a2。第3框架構件26c的第3外周面c2與第2內周面b4對向配置。第3外周面c2的整個面抵接於第2內周面b4。亦即，在水平方向上，第3框架構件26c抵接於第1框架構件26a以及第2框架構件26b的凸部b2。換言之，在水平方向上，第3框架構件26c抵接於第1框架構件26a以及第2框架構件26b。
The
如上所述，第3框架構件26c的剖面形狀為上部逐漸變細的梯形。因此，第3內周面c1抵接於第1外周面a2時，第3內周面c1從斜下方保持第
1外周面a2。此時，第3內周面c1與第1外周面a2面接觸。結果，在水平方向上，第1框架構件26a遍及整周地由第3框架構件26c所保持。另外，第1框架構件26a被第3框架構件26c壓附於安裝面b3。
As described above, the cross-sectional shape of the
在鉛直方向上，第1框架構件26a的長度(厚度)比第2框架構件26b的凹部b1的長度(深度)大，第3框架構件26c的長度(厚度)比第2框架構件26b的凹部b1的長度(深度)小。第1框架構件26a的第1上表面a3抵接於第2框架構件26b的安裝面b3。在從柔性體251向第2方向延伸的虛擬直線V上，第3框架構件26c的長度(寬度)比第2框架構件26b的凸部b2以及第1框架構件26a各自的長度(寬度)小。
In the vertical direction, the length (thickness) of the
在鉛直方向上，在第2框架構件26b的安裝面b3與第3框架構件26c的第3上表面c4之間形成有間隙s，該間隙s比第1框架構件26a的厚度與第3框架構件26c的厚度之差小。如上所述，第3框架構件26c的剖面形狀為上部逐漸變細的梯形。因此，在第3框架構件26c被第2安裝螺栓28b向上方推壓時，第3內周面c1與第1外周面a2密合，第3外周面c2與第2內周面b4密合。此時，第1框架構件26a以及凸部b2因第3框架構件26c而受到向斜上方的力。結果，第1框架構件26a被第3框架構件26c向第1方向以及上方推壓，而安裝(固定)於第2框架構件26b。此時，在第1安裝螺栓28a被鬆開時，第1框架構件26a被第3框架構件26c向水平方向(第1方向或第2方向)推壓，在水平方向上，第1框架構件26a相對於第2框架構件26b的位置被確定。
In the vertical direction, a gap s is formed between the mounting surface b3 of the
第1框架構件26a從第3框架構件26c受到的力會隨著第2安裝螺栓28b將第3框架構件26c向上方推壓的力(亦即，第2安裝螺栓28b的緊固力)增加而增加。此處，假設在未形成間隙s的情況下(第3上表面c4與安裝面b3抵接的情況下)，若第1框架構件26a、第2框架構件26b以及第3框架構件26c各自的製造精度不高，則幾乎不會產生該力，結果，可能妨礙第3內周面c1與第
1外周面a2的密合、以及第3外周面c2與第2內周面b4的密合(亦即，可能在各表面之間產生間隙)。本實施形態中，由於形成了間隙s，因此第2安裝螺栓28b能夠始終以預定值以上的緊固力向上方推壓第3框架構件26c。因此，能夠始終保持第3內周面c1與第1外周面a2的密合、以及第3外周面c2與第2內周面b4的密合。結果，即使組合3個第1框架構件26a、第2框架構件26b、以及第3框架構件26c而構成框架構件26，框架構件26亦具有能夠耐受水平方向上的高壓的結構。
The force applied to the
彈簧構件27以框架構件26可相對於上模具22在鉛直方向上相對移動的方式保持框架構件26。彈簧構件27安裝於基座構件21的下表面以及第2框架構件26b的第2上表面b6。彈簧構件27例如為習知的彈簧。
The spring member 27 holds the
安裝螺栓28將第1框架構件26a以及第3框架構件26c安裝於第2框架構件26b。安裝螺栓28具備第1安裝螺栓28a以及第2安裝螺栓28b。第1安裝螺栓28a將第1框架構件26a安裝於第2框架構件26b，第2安裝螺栓28b將第3框架構件26c安裝於第2框架構件26b。結果，第1框架構件26a以及第3框架構件26c被固定於第2框架構件26b。
The mounting bolts 28 mount the
在鉛直方向上，下加壓單元3與上加壓單元2一起夾持被加壓物W，對被加壓物W進行加壓。下加壓單元3以與上加壓單元2對向的方式，配置於上加壓單元2的下方。下加壓單元3具備載置台31以及下模具32。下加壓單元3係本發明中的另一加壓單元之一例。 In the lead vertical direction, the lower pressurizing unit 3 and the upper pressurizing unit 2 clamp the pressurized object W together to pressurize the pressurized object W. The lower pressurizing unit 3 is arranged below the upper pressurizing unit 2 in a manner opposite to the upper pressurizing unit 2. The lower pressurizing unit 3 has a mounting table 31 and a lower mold 32. The lower pressurizing unit 3 is an example of another pressurizing unit in the present invention.
被加壓物W被載置於載置台31。載置台31具備對向面311以及下表面312。對向面311與側邊構件23、加壓墊25、以及框架構件26對向，係與水平方向平行的面。在被加壓物W被加壓時，載置台31以與框架構件26以及加壓墊25對向的方式配置於該等的下方，與加壓墊25一起夾持被加壓物W。載置台31係本發明中的對向構件之一例。
The pressurized object W is placed on the placing table 31. The placing table 31 has an opposing surface 311 and a lower surface 312. The opposing surface 311 is opposite to the side member 23, the pressurizing pad 25, and the
下模具32藉由載置台31對被加壓物W進行加壓。下模具32配置於載置台31的下表面312，被載置於地面。在水平方向上，下模具32的剖面形狀為矩形。下模具32的上表面的形狀為平面。 The lower mold 32 presses the object W through the mounting table 31. The lower mold 32 is arranged on the lower surface 312 of the mounting table 31 and is placed on the ground. In the horizontal direction, the cross-sectional shape of the lower mold 32 is a rectangle. The shape of the upper surface of the lower mold 32 is a plane.
需要說明的是，在本發明中，下模具32亦可在下模具32的內部具備加熱機構及/或冷卻機構。 It should be noted that in the present invention, the lower mold 32 may also have a heating mechanism and/or a cooling mechanism inside the lower mold 32.
升降機構保持上加壓單元2，使上加壓單元2升降，對被加壓物W進行加壓。升降機構例如具備習知的液壓缸。 The lifting mechanism holds the upper pressurizing unit 2, lifts and lowers the upper pressurizing unit 2, and pressurizes the pressurized object W. The lifting mechanism includes, for example, a known hydraulic cylinder.
需要說明的是，在本發明中，升降機構亦可具備能夠進行加壓動作的任何機構。亦即，升降機構例如亦可具備習知的氣缸。 It should be noted that in the present invention, the lifting mechanism may also have any mechanism capable of performing a pressurizing action. That is, the lifting mechanism may also have a known cylinder, for example.
真空泵P使載置有被加壓物W的密封空間成為真空狀態。真空泵P藉由真空泵用配管與排氣孔23a連接。真空泵P藉由真空泵用配管以及排氣孔23a抽吸密封空間內的空氣。真空泵P例如為習知的真空泵裝置。 The vacuum pump P makes the sealed space containing the pressurized object W into a vacuum state. The vacuum pump P is connected to the exhaust hole 23a via the vacuum pump piping. The vacuum pump P sucks the air in the sealed space via the vacuum pump piping and the exhaust hole 23a. The vacuum pump P is, for example, a known vacuum pump device.
控制部控制整個本裝置1的動作。控制部例如係由CPU(Central Processing Unit，中央處理器)等處理器、發揮作為CPU之作業區域的功能的RAM(Random Access Memory，隨機存取記憶體)等揮發性記憶體、以及儲存控制本裝置1之程式或其他控制程式等各種資訊的ROM(Read Only Memory，唯讀記憶體)等非揮發性記憶體所構成。 The control unit controls the operation of the entire device 1. The control unit is composed of, for example, a processor such as a CPU (Central Processing Unit), a volatile memory such as a RAM (Random Access Memory) that functions as a working area of the CPU, and a non-volatile memory such as a ROM (Read Only Memory) that stores various information such as a program for controlling the device 1 or other control programs.
●框架構件的拆裝步驟 ●Disassembly and assembly steps of frame components
接著，對框架構件26的拆裝步驟進行說明如下。在以下的說明中，適當參照圖2至圖4。
Next, the disassembly and assembly steps of the
圖5係表示構成框架構件26的第1框架構件26a、第2框架構件26b、以及第3框架構件26c分離的狀態的局部放大示意剖視圖。
FIG5 is a partially enlarged schematic cross-sectional view showing the state in which the
圖6係表示仰視觀察構成框架構件26之第1框架構件26a的狀態的仰視圖。
FIG. 6 is a bottom view showing the state of the
圖7係表示仰視觀察構成框架構件26之第2框架構件26b的狀態的仰視圖。
FIG. 7 is a bottom view showing the state of the
圖8係表示仰視觀察構成框架構件26之第3框架構件26c的狀態的仰視圖。
FIG8 is a bottom view showing the state of the
框架構件26的第1框架構件26a、第2框架構件26b、以及第3框架構件26c的拆裝步驟例如在維護本裝置1時，主要以更換加壓墊25為目的而執行。由於加壓墊25在使用數千次至數萬次後，會變得無法充分發揮加壓墊25的作用，因此需要定期更換加壓墊25。在更換加壓墊25時，從第2框架構件26b拆卸保持第1框架構件26a的第3框架構件26c以及保持加壓墊25的第1框架構件26a(加壓墊單元)。此時，由於第2框架構件26b藉由彈簧構件27保持於基座構件21，因此不從本裝置1拆卸第2框架構件26b。
The steps of disassembling and assembling the
接著，對框架構件26的拆裝步驟中的框架構件26的拆卸步驟進行說明如下。
Next, the disassembly steps of the
「拆卸步驟」係指從第2框架構件26b拆卸加壓墊單元的步驟。拆卸步驟中，從第2框架構件26b拆卸第3框架構件26c後，從第2框架構件26b拆卸第1框架構件26a。
The "disassembly step" refers to the step of disassembling the pressure pad unit from the
首先，在第3框架構件26c與載置台31之間配置例如多個千斤頂(圖中未顯示；以下相同)。多個千斤頂按照第3框架構件26c的形狀，配置於第3框架構件26c的下方，從下方支撐第3框架構件26c。
First, multiple jacks (not shown in the figure; the same applies below) are arranged between the
接著，拆卸第2安裝螺栓28b。此時，將第3框架構件26c載置於千斤頂上，從第2框架構件26b分離。
Next, remove the second mounting bolt 28b. At this time, place the
接著，將第3框架構件26c從本裝置1取出至外部。此時，在將第3框架構件26c保持水平的狀態下取出第3框架構件26c，以避免力不均勻地分布作用於第3框架構件26c。
Next, the
接著，進行從第2框架構件26b拆卸加壓墊單元的作業。亦即，進行從第2框架構件26b拆卸第1框架構件26a的作業。以下對該作業的具體內容進行說明。
Next, the pressure pad unit is removed from the
首先，在第1框架構件26a與載置台31之間配置例如多個千斤頂。多個千斤頂按照第1框架構件26a的形狀配置於第1框架構件26a的下方，從下方支撐第1框架構件26a。
First, multiple jacks are arranged between the
接著，拆卸第1安裝螺栓28a。此時，將第1框架構件26a載置於千斤頂上，從第2框架構件26b分離。
Next, remove the first mounting bolt 28a. At this time, place the
接著，將第1框架構件26a從本裝置1取出至外部。此時，在將第1框架構件26a保持水平的狀態下取出第1框架構件26a，以避免力不均勻地分布作用於第1框架構件26a。
Next, the
接著，對框架構件26的拆裝步驟中的框架構件26的安裝步驟進行說明如下。
Next, the installation step of the
「安裝步驟」係指將加壓墊單元安裝於第2框架構件26b的步驟。安裝步驟中，將第1框架構件26a安裝於第2框架構件26b後，將第3框架構件26c安裝於第2框架構件26b。然後，由操作員進一步擰緊第1安裝螺栓28a，將第1框架構件26a固定於第2框架構件26b。
The "installation step" refers to the step of installing the pressure pad unit on the
首先，進行將加壓墊單元安裝於第2框架構件26b的作業。亦即，進行將第1框架構件26a安裝於第2框架構件26b的作業。此時，與拆卸步驟同樣的方式配置多個千斤頂。
First, the pressure pad unit is installed on the
接著，使第1框架構件26a從本裝置1的外部沿水平方向移動，而載置於千斤頂。第1框架構件26a配置於與第2框架構件26b的安裝面b3對向的下方位置(參照圖5)。
Next, the
接著，使第1框架構件26a抵接於第2框架構件26b的安裝面b3。然後，以第1安裝螺栓28a將第1框架構件26a暫時固定於第2框架構件26b。
Next, the
「暫時固定」係指正式固定前進行的預備性固定。暫時固定的固定力比正式固定的固定力小。本實施形態中，在將第1框架構件26a暫時固定於第
2框架構件26b時，第1框架構件26a的第1上表面a3抵接於第2框架構件26b的安裝面b3。此時，第1框架構件26a可根據第1安裝螺栓28a與孔之間的間隙沿水平方向移動。
"Temporary fixation" refers to the preliminary fixation before formal fixation. The fixing force of temporary fixation is smaller than the fixing force of formal fixation. In this embodiment, when the
「正式固定」係指進行暫時固定後進行的固定。正式固定的固定力比暫時固定的固定力大。本實施形態中，在將第1框架構件26a正式固定於第2框架構件26b時，第1框架構件26a的第1上表面a3抵接於第2框架構件26b的安裝面b3。此時，第1框架構件26a無法沿水平方向移動。
"Formal fixation" refers to fixation performed after temporary fixation. The fixing force of formal fixation is greater than the fixing force of temporary fixation. In this embodiment, when the
接著，進行將第3框架構件26c安裝於第2框架構件26b的作業。此時，與拆卸步驟同樣的方式配置多個千斤頂。
Next, the
接著，使第3框架構件26c從本裝置1的外部沿水平方向移動，而載置於千斤頂。第3框架構件26c配置於第1框架構件26a與第2框架構件26b之間且與安裝面b3對向的下方位置(參照圖5)。
Next, the
接著，將第3框架構件26c插入至第1框架構件26a與第2框架構件26b之間。第3框架構件26c靠近第2框架構件26b的安裝面b3。
Next, insert the
接著，第3框架構件26c被第2安裝螺栓28b向上方推壓並固定於第2框架構件26b。此時，由於作為傾斜面之第3框架構件26c的第3內周面c1抵接於作為傾斜面之第1框架構件26a的第1外周面a2，因此第1框架構件26a被第3框架構件26c向第1方向以及上方推壓。結果，第1框架構件26a被第3框架構件26c沿水平方向推壓，在水平方向上，第1框架構件26a相對於第2框架構件26b的位置被確定。亦即，第3框架構件26c被固定時，第3內周面c1密合於第1外周面a2，第1框架構件26a相對於第2框架構件26b配置於適當的位置。此外，第3框架構件26c被第2安裝螺栓28b固定時，第1框架構件26a被向上方推壓，第1框架構件26a被固定於第2框架構件26b。
Next, the
接著，第1安裝螺栓28a由操作員進一步緊固，第1框架構件26a被正式固定於第2框架構件26b。此時，第1上表面a3密合於安裝面b3。在水平方向上，第1框架構件26a、第2框架構件26b(凸部b2)以及第3框架構件26c相互密合，而成為一體。
Next, the operator further tightens the first mounting bolt 28a, and the
●加壓裝置的動作 ●Operation of the pressurizing device
接著，對本裝置1的動作進行說明如下。在以下的說明中，適當參照圖1以及圖2。 Next, the operation of the device 1 is described as follows. In the following description, refer to Figures 1 and 2 as appropriate.
圖9係表示通過上加壓單元2下降來使側邊構件23抵接於下加壓單元3之載置台31的狀態的示意剖視圖。 FIG9 is a schematic cross-sectional view showing the state in which the side member 23 abuts against the mounting table 31 of the lower pressurizing unit 3 by lowering the upper pressurizing unit 2.
圖10係表示上加壓單元2從圖9所示之狀態下降，隔著加壓墊25由上模具22對被加壓物W進行加壓的狀態的示意剖視圖。 FIG10 is a schematic cross-sectional view showing the state in which the upper pressurizing unit 2 is lowered from the state shown in FIG9 and the pressurized object W is pressurized by the upper mold 22 via the pressurizing pad 25.
首先，將被加壓物W載置於載置台31的預定位置。接著，在控制部確認被加壓物W被載置於預定位置後，藉由升降機構使上加壓單元2下降。在上加壓單元2相對於載置台31下降至預定位置後，控制部暫停下降。 First, the object W to be pressed is placed at a predetermined position on the mounting platform 31. Then, after the control unit confirms that the object W to be pressed is placed at the predetermined position, the upper pressurizing unit 2 is lowered by the lifting mechanism. After the upper pressurizing unit 2 is lowered to the predetermined position relative to the mounting platform 31, the control unit stops the lowering.
接著，控制部使缸24伸出，僅使側邊構件23下降直至抵接於載置台31的對向面311。此時，形成密封空間。 Next, the control unit extends the cylinder 24, causing only the side member 23 to descend until it contacts the opposite surface 311 of the mounting platform 31. At this point, a sealed space is formed.
接著，控制部使真空泵P動作，使密封空間成為真空狀態。通過使密封空間成為真空狀態，由此去除被加壓物W周邊的空氣，例如可預防在黏接劑w3軟化等時發生空氣進入即夾氣等故障。 Next, the control unit activates the vacuum pump P to make the sealed space a vacuum state. By making the sealed space a vacuum state, the air around the pressurized object W is removed, and for example, air intrusion and air entrapment can be prevented when the adhesive w3 softens.
接著，控制部在使側邊構件23抵接於載置台31的狀態下，使上加壓單元2下降，而使加壓墊25抵接於被加壓物W(參照圖1之(b))。接著，控制部進一步使上加壓單元2下降，使第1框架構件26a的第1下表面a4抵接於載置台31的對向面311。如上所述，在鉛直方向上，第1框架構件26a的厚度比
第2框架構件26b的凹部b1的深度大，因此，框架構件26中，僅第1下表面a4抵接於載置台31的對向面311。
Next, the control unit lowers the upper pressure unit 2 while the side member 23 is in contact with the mounting table 31, and the pressure pad 25 is in contact with the object to be pressurized W (refer to FIG. 1 (b)). Next, the control unit further lowers the upper pressure unit 2 to make the first lower surface a4 of the
接著，控制部使上模具22下降，對被加壓物W進行暫時加壓(參照圖10)。如上所述，框架構件26能夠相對於上模具22在鉛直方向上相對移動。因此，即使第1下表面a4抵接於對向面311，亦可僅使上模具22下降，由上模具22從上方對加壓墊25進行加壓。由於被加壓的加壓墊25具備具有流動性的柔性體251，因此會追隨被加壓物W的表面形狀而變形(參照圖1之(c))。結果，加壓墊25會包圍被加壓物W的上方側以及側方側。
Next, the control unit lowers the upper mold 22 to temporarily pressurize the object W (see Figure 10). As described above, the
「暫時加壓」係指正式加壓前實施的預備性加壓。暫時加壓的加壓力比正式加壓的加壓力小。本實施形態中的暫時加壓中，向被加壓物W施加使加壓墊25追隨被加壓物W的表面形狀變形程度的壓力。 "Temporary pressurization" refers to the preliminary pressurization performed before the formal pressurization. The pressurization force of the temporary pressurization is smaller than the pressurization force of the formal pressurization. In the temporary pressurization in this embodiment, a pressure is applied to the pressurized object W to such an extent that the pressurization pad 25 follows the deformation of the surface shape of the pressurized object W.
「正式加壓」係指暫時加壓後執行的加壓。正式加壓的加壓力比暫時加壓的加壓力大。本實施形態中的正式加壓中，向被加壓物W施加在被加壓物W中基板w1以及電路元件w2被壓接程度的壓力。 "Formal pressurization" refers to pressurization performed after temporary pressurization. The pressure of formal pressurization is greater than the pressure of temporary pressurization. In the formal pressurization in this embodiment, a pressure is applied to the object W to the extent that the substrate w1 and the circuit element w2 in the object W are pressed.
接著，控制部進一步使上模具22下降，而進行正式加壓。此時，柔性體251一邊根據從上模具22受到的加壓力變形，一邊向所有方向施加大致均勻的壓力。結果，加壓墊25對被加壓物W均勻地進行加壓。 Then, the control unit further lowers the upper mold 22 to perform formal pressurization. At this time, the flexible body 251 deforms according to the pressure received from the upper mold 22 while applying roughly uniform pressure in all directions. As a result, the pressurization pad 25 uniformly pressurizes the pressurized object W.
此處，對來自柔性體251的壓力對框架構件26造成的影響進行說明如下。
Here, the effect of the pressure from the flexible body 251 on the
圖11係表示在圖10的狀態下施加壓力的狀態的局部放大示意剖視圖。 FIG11 is a partially enlarged schematic cross-sectional view showing the state of applying pressure in the state of FIG10.
該圖的空心箭頭表示壓力的方向。 The hollow arrows in the diagram indicate the direction of pressure.
如上所述，在被加壓物W被加壓時，加壓墊25藉由具有高流動性的柔性體251向所有方向施加大致均勻的壓力。在被加壓物W被加壓時，在水平方向上，也會有相同的壓力作用於保持加壓墊25之框架構件26。
As described above, when the object W is pressurized, the pressurizing pad 25 applies roughly uniform pressure in all directions through the flexible body 251 with high fluidity. When the object W is pressurized, the same pressure also acts on the
此處，以往的加壓裝置中，加壓墊25係藉由僅由積層之3個保持構件構成的框架構件(以下簡稱「以往框架構件」)所保持。以往框架構件的水平方向上的長度被設計為以往框架構件能夠耐受從加壓墊25(柔性體251)施加之高壓的長度。因此，即使從加壓墊25向以往框架構件施加高壓，以往框架構件亦不會變形，而確保由加壓墊25對被加壓物W施加之壓力的均勻性。另一方面，隨著加壓裝置所需加壓力的增大，以往框架構件的大小變大，以往框架構件的重量增加。 Here, in the conventional pressurizing device, the pressurizing pad 25 is held by a frame member (hereinafter referred to as "the conventional frame member") consisting of only three stacked retaining members. The horizontal length of the conventional frame member is designed to be a length that the conventional frame member can withstand the high pressure applied from the pressurizing pad 25 (flexible body 251). Therefore, even if high pressure is applied from the pressurizing pad 25 to the conventional frame member, the conventional frame member will not be deformed, and the uniformity of the pressure applied by the pressurizing pad 25 to the pressurized object W is ensured. On the other hand, as the pressure required by the pressurizing device increases, the size of the conventional frame member increases, and the weight of the conventional frame member increases.
本裝置1中，框架構件26係由3個第1框架構件26a、第2框架構件26b、以及第3框架構件26c組合而構成框架構件26。此外，第1框架構件26a的水平方向上的長度被設計為比以往框架構件的長度小。因此，第1框架構件26a比以往框架構件小且輕，但第1框架構件26a在水平方向上的耐壓性比以往框架構件差。在本發明中，由於在水平方向上，第1框架構件26a、第2框架構件26b、以及第3框架構件26c係藉由面接觸而密合，因此第1框架構件26a的耐壓性藉由第2框架構件26b(凸部b2)以及第3框架構件26c而得以補充。結果，整個框架構件26獲得與以往框架構件同等的耐壓性。亦即，即使通過組合3個第1框架構件26a、第2框架構件26b、以及第3框架構件26c而構成框架構件26，框架構件26亦可耐受高壓。
In the present device 1, the
此外，以往的加壓裝置，在更換加壓墊25(加壓墊單元)時，會拆卸整個以往框架構件。另一方面，本裝置1中，係在拆卸第3框架構件26c後，拆卸第1框架構件26a(加壓墊單元)。如上所述，第1框架構件26a比以往框架構
件小且輕，第3框架構件26c比第1框架構件26a輕。因此，相較於以往的加壓裝置的作業負擔，操作員更換加壓墊25時的作業負擔有所減輕。
In addition, in the conventional pressurizing device, when replacing the pressurizing pad 25 (pressurizing pad unit), the entire conventional frame member is disassembled. On the other hand, in the present device 1, the
另外，由於第1框架構件26a比以往框架構件更加小型化，因此抵接於對向面311之面(本實施形態中為第1下表面a4)的面積亦變小。因此，相較於對以往框架構件的精密加工，第1下表面a4的精密加工更加容易。亦即，降低製造第1框架構件26a時第1下表面a4發生翹曲以及難以確保第1下表面a4的加工精度等加工風險。
In addition, since the
回到圖10。 Return to Figure 10.
接著，控制部在被加壓物W被正式加壓的狀態下對被加壓物W進行例如加熱處理。通過對被加壓物W加熱，黏接劑w3固化，被加壓物W被壓接。 Next, the control unit performs a heating process on the object to be pressed W while the object to be pressed W is formally pressed. By heating the object to be pressed W, the adhesive w3 is cured and the object to be pressed W is pressed.
需要說明的是，在本發明中，在對被加壓物W進行加熱處理後，例如亦可進行冷卻處理。加熱處理以及冷卻處理可根據被加壓物W的特性適當選擇。 It should be noted that in the present invention, after the pressurized object W is subjected to a heat treatment, a cooling treatment may be performed, for example. The heating treatment and the cooling treatment may be appropriately selected according to the characteristics of the pressurized object W.
接著，在各處理結束後，控制部結束本裝置1的加壓動作。加壓動作結束後，從本裝置1取出被加壓物W。 Then, after each process is completed, the control unit ends the pressurization operation of the device 1. After the pressurization operation is completed, the pressurized object W is removed from the device 1.
總結 Summary
根據以上所說明之實施形態，在水平方向上，本裝置1的保持加壓墊25之框架構件26通過組合第1框架構件26a、第2框架構件26b、以及第3框架構件26c而構成。第1框架構件26a以包圍柔性體251之整周的方式配置，保持柔性體251。第1框架構件26a以可拆裝的方式安裝於第2框架構件26b。在水平方向上，第3框架構件26c以包圍第1框架構件26a之整周的方式配置，以可拆裝的方式安裝於第2框架構件26b，將第1框架構件26a固定於第2框架構件26b。根據該結構，由於框架構件26能夠分割，因此相較於以往框架構件，能夠實現保持加壓墊25之構件(本發明中的第1框架構件26a)的小型化。因此，在更換加
壓墊25時，所拆卸之第1框架構件26a的重量比以往框架構件的重量輕。結果，能夠輕易地實現第1框架構件26a相對於本裝置1的拆裝。因此，在進行加壓墊25的更換等維護保養過程中，能夠減輕操作員拆裝第1框架構件26a時的作業負擔。此外，由於第1框架構件26a小型化，因此抵接於載置台31之面(第1下表面a4)的面積亦變小，相較於以往框架構件的精密加工，抵接之面的精密加工亦變得容易。亦即，能夠降低製造第1框架構件26a時抵接之面發生翹曲以及難以確保抵接之面的加工精度等加工風險。
According to the embodiment described above, in the horizontal direction, the
此外，根據以上所說明之實施形態，第2框架構件26b具備凹部b1以及凸部b2。凹部b1配置於第2框架構件26b的下方側之端部中的第1方向側之端部，第1框架構件26a以及第3框架構件26c配置於凹部b1。在水平方向上，凸部b2配置於凹部b1的第2方向側，以包圍第3框架構件26c之整周的方式配置。在水平方向上，第3框架構件26c抵接於與第1框架構件26a以及凸部b2。根據該結構，在水平方向上，由於第1框架構件26a、第2框架構件26b、以及第3框架構件26c相互密合，因此第1框架構件26a的耐壓性藉由第2框架構件26b以及第3框架構件26c而得以補充。結果，在水平方向上，通過組合3個第1框架構件26a、第2框架構件26b、以及第3框架構件26c而構成的框架構件26，能夠獲得具備與框架構件26相同長度的以往框架構件同等的耐壓性。
Furthermore, according to the embodiment described above, the
再者，根據以上所說明之實施形態，在水平方向上，第3框架構件26c以包圍第1框架構件26a之整周的方式配置，具備第3內周面c1以及第3外周面c2。第3內周面c1抵接於第1框架構件26a的第1外周面a2。第3外周面c2抵接於第2框架構件26b的第2內周面b4。根據該結構，在水平方向上，由於第3框架構件26c與第1框架構件26a以及第2框架構件26b面接觸，因此第1框架構件26a的耐壓性藉由第2框架構件26b(凸部b2)以及第3框架構件26c而得以補充。結果，整個框架構件26獲得與以往框架構件同等的耐壓性。
Furthermore, according to the above-described embodiment, in the horizontal direction, the
又再者，根據以上所說明之實施形態，第3框架構件26c的第3內周面c1係隨著從上方趨向下方而以向第1方向側突出的方式傾斜的傾斜面。另一方面，第1框架構件26a的第1外周面a2係隨著從下方趨向上方而以向第2方向側突出的方式傾斜的傾斜面。第3框架構件26c在被向上方推壓的狀態下安裝於第2框架構件26b。根據該結構，將第3框架構件26c固定於第2框架構件26b時，第1外周面a2與第3內周面c1密合。由於第1外周面a2與第3內周面c1藉由傾斜面相互抵接，因此第1外周面a2與第3內周面c1能夠確實地面接觸。結果，在水平方向上，由於具有第1框架構件26a以及第3框架構件26c成為一體的結構，因此能夠獲得對於從柔性體251受到之壓力的耐壓性。根據該結構，第1框架構件26a被第3框架構件26c向第1方向以及上方推壓。因此，第1框架構件26a被第3框架構件26c沿水平方向推壓，在水平方向上，第1框架構件26a相對於第2框架構件26b被配置於適當的位置。另外，第3框架構件26c被固定時，第1框架構件26a被向上方推壓，第1框架構件26a被固定於第2框架構件26b。
Furthermore, according to the above-described embodiment, the third inner peripheral surface c1 of the
又再者，根據以上所說明之實施形態，第3框架構件26c的第3外周面c2係隨著從上方趨向下方而以向第2方向側突出的方式傾斜的傾斜面。另一方面，第2框架構件26b的第2內周面b4係隨著從下方趨向上方而以向第1方向側突出的方式傾斜的傾斜面。根據該結構，第3框架構件26c被固定於第2框架構件26b時，第2內周面b4能夠與第3外周面c2面接觸而實現密合。
Furthermore, according to the above-described embodiment, the third outer peripheral surface c2 of the
又再者，根據以上所說明之實施形態，第2框架構件26b的凹部b1具備安裝面b3。安裝面b3朝向下方，第1框架構件26a以及第3框架構件26c安裝於第2框架構件26b。安裝面b3配置於比第2內周面b4靠第1方向側。根據該結構，通過第1框架構件26a抵接於安裝面b3，由此在第1框架構件26a，水平方向上從柔性體251受到的壓力亦向上方分散。
Furthermore, according to the embodiment described above, the recess b1 of the
又再者，根據以上所說明之實施形態，載置台31具備與框架構件26以及加壓墊25對向、且與水平方向平行的對向面311。在鉛直方向上，第1框架構件26a的厚度比第2框架構件26b的凹部b1的深度大，第3框架構件26c的厚度比凹部b1的深度小。第1框架構件26a抵接於第2框架構件26b的安裝面b3，在第3框架構件26c與安裝面b3之間，形成有比第1框架構件26a的厚度與第3框架構件26c的厚度之差小的間隙s。根據該結構，在被加壓物W被加壓時，對向面311僅抵接於第1框架構件26a、第2框架構件26b、以及第3框架構件26c中的第1框架構件26a。因此，相較於以往框架構件，抵接於對向面311之面(第1下表面a4)的面積亦可更小。結果，相較於以往框架構件的精密加工，抵接之面的精密加工亦變得容易。亦即，相較於以往框架構件，抵接之面的面積更小，因此能夠降低製造第1框架構件26a時第1下表面a4發生翹曲以及難以確保第1下表面a4的加工精度等加工風險。另外，根據該結構，通過具有間隙s，第2安裝螺栓28b能夠始終以預定值以上的緊固力將第3框架構件26c向上方推壓。因此，能夠始終保持第3內周面c1與第1外周面a2的密合、以及第3外周面c2與第2內周面b4的密合。此時，藉由第3框架構件26c將第1框架構件26a向第1方向以及上方推壓。結果，第1框架構件26a被第3框架構件26c沿水平方向(第1方向)推壓，在水平方向上，相對於第2框架構件26b配置於適當的位置。第3框架構件26c被固定時，第1框架構件26a被向上方推壓，第1框架構件26a被固定於第2框架構件26b。
Furthermore, according to the above-described embodiment, the mounting table 31 has an opposing surface 311 that is opposed to the
又再者，根據以上所說明之實施形態，在從柔性體251朝向第2方向的虛擬直線V上，第3框架構件26c的寬度比第1框架構件26a以及凸部b2各自的寬度小。根據該結構，由於第3框架構件26c比第1框架構件26a以及第2框架構件26b小，因此在第1框架構件26a的拆裝步驟中，能夠提升拆裝第3框架構件26c的作業效率。
Furthermore, according to the above-described embodiment, on the virtual straight line V from the flexible body 251 toward the second direction, the width of the
●其他實施形態● ●Other implementation forms●
需要說明的是，在本發明中，仰視觀察時的框構件26的形狀只要根據被加壓物W的形狀適當設計即可，並不限定於矩形框狀。亦即，例如，仰視觀察時的框構件26的形狀亦可為圓環狀。
It should be noted that in the present invention, the shape of the
此外，在本發明中，框架構件26的材質只要可保持加壓墊25且具有能夠在壓力下保持形狀的強度即可，並不限於本實施形態。亦即，第1框架構件26a、第2框架構件26b、以及第3框架構件26c各自的材質例如亦可為各自不同的材質。
In addition, in the present invention, the material of the
再者，在本發明中，藉由第1框架構件26a中的由第1外周面a2以及第1下表面a4形成的角度θ1並不限於120度。亦即，該角度例如亦可為90度以上且135度以下。
Furthermore, in the present invention, the angle θ1 formed by the first outer peripheral surface a2 and the first lower surface a4 in the
又再者，在本發明中，第2框架構件26b中的由第2內周面b4以及第2下表面b5形成的角度θ2並不限於120度。亦即，該角度例如亦可為90度以上且135度以下。
Furthermore, in the present invention, the angle θ2 formed by the second inner peripheral surface b4 and the second lower surface b5 in the
又再者，在本發明中，由第3內周面c1與第3下表面c3形成的角度θ3以及由第3外周面c2與第3下表面c3形成的角度θ4並不限於60度。亦即，各自的該角度例如亦可為45度以上且90度以下。此外，由第3內周面c1與第3下表面c3形成的角度θ3例如亦可為不同於由第3外周面c2與第3下表面c3形成的角度θ4的角度。 Furthermore, in the present invention, the angle θ3 formed by the third inner circumferential surface c1 and the third lower surface c3 and the angle θ4 formed by the third outer circumferential surface c2 and the third lower surface c3 are not limited to 60 degrees. That is, each of the angles may be, for example, greater than 45 degrees and less than 90 degrees. In addition, the angle θ3 formed by the third inner circumferential surface c1 and the third lower surface c3 may be, for example, an angle different from the angle θ4 formed by the third outer circumferential surface c2 and the third lower surface c3.
又再者，在本發明中，第1框架構件26a的結構只要是能夠由第1框架構件26a保持膜252、253的結構即可，並不限於本實施形態。
Furthermore, in the present invention, the structure of the
又再者，在本發明中，水平方向上的第1框架構件26a、第2框架構件26b、以及第3框架構件26c各自的寬度的長度，可根據作用於被加壓物W之壓力的大小而適當設定。
Furthermore, in the present invention, the length of the width of each of the
又再者，在本發明中，在鉛直方向上，第1框架構件26a的厚度亦可與第2框架構件26b之凹部b1的深度相同。
Furthermore, in the present invention, in the vertical direction, the thickness of the
又再者，在本發明中，第1框架構件26a的第1下表面a4只要抵接於載置台31的對向面311即可，第2框架構件26b的第2下表面b5及/或第3框架構件26c的第3下表面c3亦可抵接於對向面311。
Furthermore, in the present invention, the first lower surface a4 of the
又再者，在本發明中，第3框架構件26c只要能夠包圍第1框架構件26a的水平方向之整周，亦可通過將多個構件組合而構成。亦即，第3框架構件26c例如亦可通過將4條棒狀構件組合為矩形框狀而構成。
Furthermore, in the present invention, the
又再者，在本發明中，上模具22以及下模具32既可在上模具22以及下模具32各自的內部僅具備冷卻機構，亦可同時具備加熱機構以及冷卻機構。 Furthermore, in the present invention, the upper mold 22 and the lower mold 32 may have only a cooling mechanism inside each of the upper mold 22 and the lower mold 32, or may have both a heating mechanism and a cooling mechanism.
又再者，在本發明中，下模具32亦可由不同於上模具22的升降機構所保持。根據該結構，在下模具32由升降機構所保持時，由於能夠藉由上下的升降機構對被加壓物W進行加壓，因此本裝置1能夠以更大的加壓力對被加壓物W進行加壓。 Furthermore, in the present invention, the lower mold 32 can also be held by a lifting mechanism different from the upper mold 22. According to this structure, when the lower mold 32 is held by the lifting mechanism, the pressurized object W can be pressurized by the upper and lower lifting mechanisms, so the device 1 can pressurize the pressurized object W with a greater pressure.
又再者，在本發明中，載置台31只要是能夠載置被加壓物W，且能夠在上加壓單元2與下加壓單元3之間進行加壓即可，並不限於本實施形態。亦即，載置台31例如亦可為搬運被加壓物W的搬運台。亦即，本裝置1本身亦可不具備載置台31。 Furthermore, in the present invention, the placing table 31 is not limited to the present embodiment as long as it can place the pressurized object W and can pressurize between the upper pressurizing unit 2 and the lower pressurizing unit 3. That is, the placing table 31 can also be a transporting table for transporting the pressurized object W. That is, the present device 1 itself may not have the placing table 31.
又再者，在本發明中，第1框架構件26a、第2框架構件26b、以及第3框架構件26c所具備之安裝螺栓28以及螺栓的位置與數量，可根據框架構件26的尺寸以及對被加壓物W的壓力大小而適當選擇。
Furthermore, in the present invention, the mounting bolts 28 of the
又再者，在本發明中，只要能夠確保第3框架構件26c與第1框架構件26a以及第2框架構件26b之間的密合性，亦可不在安裝面b3與第3上表面c4之間形成間隙s。
Furthermore, in the present invention, as long as the tightness between the
又再者，在本發明中，在從柔性體251朝向第2方向的虛擬直線V上，第3框架構件26c的寬度並不限於本實施形態。亦即，該寬度例如亦可大於或等於第1框架構件26a以及凸部b2各自的寬度。
Furthermore, in the present invention, the width of the
又再者，在本發明中，框架構件26只要是構成為能夠分離成至少3個第1框架構件26a、第2框架構件26b、以及第3框架構件26c即可，亦可構成為能夠進一步分離。亦即，凸部b2例如亦可構成為能夠從第2框架構件26b分離。
Furthermore, in the present invention, the
又再者，在本發明中，亦可為上加壓單元2發揮作為本發明中的另一加壓單元的作用，下加壓單元3發揮作為本發明中的一個加壓單元的作用。此時，亦可為下加壓單元3具備加壓墊25，被加壓物W載置於加壓墊25。 Furthermore, in the present invention, the upper pressurizing unit 2 can also function as another pressurizing unit in the present invention, and the lower pressurizing unit 3 can function as one pressurizing unit in the present invention. At this time, the lower pressurizing unit 3 can also be provided with a pressurizing pad 25, and the pressurized object W is placed on the pressurizing pad 25.
●本發明之實施態樣● ●Implementation of the present invention●
接著，引用各實施形態中記載的用語以及符號，將從以上所說明之各實施形態掌握的本發明之實施態樣記載如下。 Next, the terms and symbols described in each embodiment are cited, and the embodiments of the present invention grasped from the embodiments described above are described as follows.
本發明之第1實施態樣係一種加壓裝置(例如，本裝置1)，其在鉛直方向上夾持被加壓物(例如，被加壓物W)進行加壓，其具有在鉛直方向上以對向的方式配置而夾持前述被加壓物進行加壓的一對加壓單元(例如，上加壓單元2以及下加壓單元3)，一對前述加壓單元中的一個前述加壓單元(例如，上加壓單元2)具備：加壓墊(例如，加壓墊25)，其具備在前述被加壓物被加壓時追隨前述被加壓物的表面形狀變形的柔性體(例如，柔性體251)；以及框架構件(例如，框架構件26)，其保持前述加壓墊，前述框架構件具備：第1框架構件(例如，第1框架構件26a)，其在水平方向上，以包圍前述柔性體之整周的方式配置，保持
前述柔性體；第2框架構件(例如，第2框架構件26b)，其供前述第1框架構件以可拆裝的方式安裝；以及第3框架構件(例如，第3框架構件26c)，其在水平方向上，以包圍前述第1框架構件之整周的方式配置，以可拆裝的方式安裝於前述第2框架構件，將前述第1框架構件固定於前述第2框架構件，在水平方向上，前述第3框架構件抵接於前述第1框架構件以及前述第2框架構件。
The first embodiment of the present invention is a pressurizing device (e.g., the present device 1), which clamps a pressurized object (e.g., a pressurized object W) in a vertical direction and pressurizes the pressurized object, and has a pair of pressurizing units (e.g., an upper pressurizing unit 2 and a lower pressurizing unit 3) arranged in an opposite manner in the vertical direction of the lead to clamp the pressurized object for pressurization. One of the pressurizing units (e.g., the upper pressurizing unit 2) includes: a pressurizing pad (e.g., the pressurizing pad 25) having a flexible body (e.g., the flexible body 251) that deforms to follow the surface shape of the pressurized object when the pressurized object is pressurized; and a frame member (e.g., the frame member 26) that holds the pressurizing pad. The frame member includes: a first frame member (e.g., the
根據該結構，不僅能夠減輕操作員更換框架構件時的作業負擔，而且能夠降低製造框架構件時框架構件發生翹曲以及難以確保框架構件的加工精度等加工風險。 This structure can not only reduce the operator's workload when replacing frame components, but also reduce processing risks such as warping of frame components and difficulty in ensuring processing accuracy of frame components when manufacturing frame components.
本發明之第2實施態樣係如第1實施態樣所述之加壓裝置，其中，在水平方向上，相對於前述第1框架構件而言，配置有前述柔性體的方向為第1方向，與前述第1方向相反的方向為第2方向，在鉛直方向上，相對於前述加壓墊而言，配置有前述被加壓物的方向為第3方向(例如，下方)，與前述第3方向相反的方向為第4方向(例如，上方)，前述第2框架構件具備：凹部(例如，凹部b1)，其配置於前述第2框架構件的前述第3方向側之端部中的前述第1方向側之端部，供前述第1框架構件與前述第3框架構件配置；以及凸部(例如，凸部b2)，其在水平方向上，配置於比前述凹部靠前述第2方向側的位置，以包圍前述第3框架構件之整周的方式配置，在水平方向上，前述第3框架構件抵接於前述第1框架構件以及前述凸部。 The second embodiment of the present invention is a pressurizing device as described in the first embodiment, wherein, in the horizontal direction, relative to the first frame member, the direction in which the flexible body is arranged is the first direction, and the direction opposite to the first direction is the second direction, and in the vertical direction, relative to the pressurizing pad, the direction in which the pressurized object is arranged is the third direction (e.g., downward), and the direction opposite to the third direction is the fourth direction (e.g., upward), and the second frame member has: A concave portion (e.g., concave portion b1) is disposed at the end portion on the first direction side of the end portion on the third direction side of the second frame member, for arranging the first frame member and the third frame member; and a convex portion (e.g., convex portion b2) is disposed at a position on the second direction side relative to the concave portion in the horizontal direction, and is disposed in a manner surrounding the entire circumference of the third frame member, and the third frame member abuts against the first frame member and the convex portion in the horizontal direction.
根據該結構，在水平方向上，通過組合第1框架構件、第2框架構件、以及第3框架構件而構成的框架構件，獲得具備與框架構件相同長度的以往框架構件同等的耐壓性。 According to this structure, in the horizontal direction, the frame member formed by combining the first frame member, the second frame member, and the third frame member obtains the same pressure resistance as the conventional frame member having the same length as the frame member.
本發明之第3實施態樣係如第2實施態樣所述之加壓裝置，其中，前述第1框架構件具備朝向前述第2方向的第1外周面(例如，第1外周面a2)，在水平方向上，前述凸部以包圍前述第3框架構件之整周的方式配置，且具備朝 向前述第1方向的第2內周面(例如，第2內周面b4)，前述第3框架構件在水平方向上，以包圍前述第1框架構件之整周的方式配置，且具備：與前述第1外周面對向並抵接於前述第1外周面的第3內周面(例如，第3內周面c1)；以及與前述第2內周面對向並抵接於前述第2內周面的第3外周面(例如，第3外周面c2)。 The third embodiment of the present invention is a pressurizing device as described in the second embodiment, wherein the first frame member has a first outer peripheral surface (e.g., first outer peripheral surface a2) facing the second direction, the convex portion is arranged in a manner to surround the entire circumference of the third frame member in the horizontal direction, and has a second inner peripheral surface (e.g., second inner peripheral surface b4) facing the first direction, and the third frame member is arranged in a manner to surround the entire circumference of the first frame member in the horizontal direction, and has: a third inner peripheral surface (e.g., third inner peripheral surface c1) facing the first outer peripheral surface and abutting the first outer peripheral surface; and a third outer peripheral surface (e.g., third outer peripheral surface c2) facing the second inner peripheral surface and abutting the second inner peripheral surface.
根據該結構，在水平方向上，由於第3框架構件以面抵接於第1框架構件以及第2框架構件，因此整個框架構件獲得與以往框架構件同等的耐壓性。 According to this structure, in the horizontal direction, since the third frame member abuts against the first frame member and the second frame member with its surface, the entire frame member has the same pressure resistance as the conventional frame member.
本發明之第4實施態樣係如第3實施態樣所述之加壓裝置，其中，前述第3內周面係隨著從前述第4方向趨向前述第3方向而以向前述第1方向側突出的方式傾斜的傾斜面，前述第1外周面係隨著從前述第3方向趨向前述第4方向而以向前述第2方向側突出的方式傾斜的傾斜面，前述第3框架構件在被朝向前述第4方向推壓的狀態下安裝於前述第2框架構件。 The fourth embodiment of the present invention is a pressurizing device as described in the third embodiment, wherein the third inner peripheral surface is an inclined surface that is inclined in a manner protruding toward the first direction as it moves from the fourth direction toward the third direction, the first outer peripheral surface is an inclined surface that is inclined in a manner protruding toward the second direction as it moves from the third direction toward the fourth direction, and the third frame member is mounted on the second frame member in a state of being pressed toward the fourth direction.
根據該結構，在水平方向上，由於具有第1框架構件以及第3框架構件成為一體的結構，因此獲得對從柔性體受到的壓力的耐壓性。第1框架構件相對於第2框架構件配置於適當的位置。在第3框架構件被固定時，第1框架構件被向上方推壓，第1框架構件被固定於第2框架構件。 According to this structure, in the horizontal direction, since the first frame member and the third frame member are integrated, pressure resistance against pressure from the flexible body is obtained. The first frame member is arranged at an appropriate position relative to the second frame member. When the third frame member is fixed, the first frame member is pushed upward and fixed to the second frame member.
本發明之第5實施態樣係如第3實施態樣或第4實施態樣所述之加壓裝置，其中，前述第3外周面係隨著從前述第4方向趨向前述第3方向而以向前述第2方向側突出的方式傾斜的傾斜面，前述第2內周面係隨著從前述第3方向趨向前述第4方向而以向前述第1方向側突出的方式傾斜的傾斜面。 The fifth embodiment of the present invention is a pressurizing device as described in the third embodiment or the fourth embodiment, wherein the third outer peripheral surface is an inclined surface that is inclined in a manner that protrudes toward the second direction as it moves from the fourth direction toward the third direction, and the second inner peripheral surface is an inclined surface that is inclined in a manner that protrudes toward the first direction as it moves from the third direction toward the fourth direction.
根據該結構，在第3框架構件被固定於第2框架構件時，第2內周面與第3外周面密合。 According to this structure, when the third frame member is fixed to the second frame member, the second inner peripheral surface and the third outer peripheral surface are in close contact.
本發明之第6實施態樣係如第3實施態樣至第5實施態樣中任一實施態樣所述之加壓裝置，其中，前述凹部具備安裝面(例如，安裝面b3)，該安 裝面朝向前述第3方向，供前述第1框架構件與前述第3框架構件安裝，前述安裝面配置於前述第2內周面的前述第1方向側。 The sixth embodiment of the present invention is a pressurizing device as described in any one of the third to fifth embodiments, wherein the recess has a mounting surface (e.g., mounting surface b3), the mounting surface faces the third direction, for mounting the first frame member and the third frame member, and the mounting surface is arranged on the first direction side of the second inner peripheral surface.
根據該結構，通過第1框架構件抵接於安裝面，由此在第1框架構件，水平方向上從柔性體受到的壓力亦向上方分散。 According to this structure, the first frame member abuts against the mounting surface, so that the pressure received from the flexible body in the horizontal direction is also dispersed upward in the first frame member.
本發明之第7實施態樣係如第6實施態樣所述之加壓裝置，其中，在對向構件(例如，載置台31)上載置前述被加壓物，該對向構件在前述被加壓物被加壓時，以與前述框架構件以及前述加壓墊對向的方式配置，與前述加壓墊一起夾持前述被加壓物，前述對向構件具備對向面(例如，對向面311)，該對向面與前述框架構件以及前述加壓墊對向，且與水平方向平行，在鉛直方向上，前述第1框架構件的厚度大於或等於前述凹部的深度，在鉛直方向上，前述第3框架構件的厚度比前述凹部的深度小，在鉛直方向上，前述第1框架構件抵接於前述安裝面，在鉛直方向上，在前述第3框架構件與前述安裝面之間，形成比前述第1框架構件的厚度與前述第3框架構件的厚度之差小的間隙(例如，間隙s)。 The seventh embodiment of the present invention is a pressurizing device as described in the sixth embodiment, wherein the object to be pressurized is placed on an opposing member (e.g., a mounting table 31), and when the object to be pressurized is pressurized, the opposing member is arranged to be opposite to the frame member and the pressurizing pad, and holds the object to be pressurized together with the pressurizing pad, and the opposing member has an opposing surface (e.g., an opposing surface 311), which is opposite to the frame member and the pressurizing pad, and is in contact with the pressurizing pad. The first frame member is parallel to the horizontal direction, the thickness of the first frame member is greater than or equal to the depth of the recess in the vertical direction, the thickness of the third frame member is smaller than the depth of the recess in the vertical direction, the first frame member abuts against the mounting surface in the vertical direction, and a gap (e.g., gap s) is formed between the third frame member and the mounting surface in the vertical direction, which is smaller than the difference between the thickness of the first frame member and the thickness of the third frame member.
根據該結構，相較於以往框架構件，抵接於對向面之面的面積變小。此外，藉由第3框架構件，第1框架構件相對於第2框架構件的位置被確定，並且將第1框架構件固定於第2框架構件。 According to this structure, the area of the surface abutting against the opposing surface is smaller than that of the conventional frame member. In addition, the position of the first frame member relative to the second frame member is determined by the third frame member, and the first frame member is fixed to the second frame member.
本發明之第8實施態樣係如第2實施態樣至第7實施態樣中任一實施所述之加壓裝置，其中，在從前述柔性體朝向前述第2方向的虛擬直線(例如，虛擬直線V)上，前述第3框架構件的寬度比前述第1框架構件以及前述凸部各自的寬度小。 The eighth embodiment of the present invention is a pressurizing device as described in any one of the second to seventh embodiments, wherein, on a virtual straight line (e.g., virtual straight line V) from the flexible body toward the second direction, the width of the third frame member is smaller than the width of each of the first frame member and the protrusion.
根據該結構，由於能夠縮小第3框架構件，因此能夠在第1框架構件的拆裝步驟中提升拆裝第3框架構件的作業效率。 According to this structure, since the third frame member can be reduced in size, the efficiency of disassembling and assembling the third frame member can be improved during the disassembly and assembly step of the first frame member.
1:加壓裝置 1: Pressurizing device
2:上加壓單元(其中一個加壓單元) 2: Upper pressure unit (one of the pressure units)
3:下加壓單元(其中另一加壓單元) 3: Lower pressure unit (another pressure unit)
21:基座構件 21: Base components
22:上模具 22: Upper mold
23:側邊構件 23: Side components
23a:排氣孔 23a: Exhaust hole
24:缸 24: Cylinder
25:加壓墊 25: Pressure pad
26:框架構件 26: Frame components
27:彈簧構件 27: Spring component
31:載置台(對向構件) 31: Loading platform (opposite component)
311:對向面 311: Opposite side
312:下表面 312: Lower surface
32:下模具 32: Lower mold
W:被加壓物 W: Pressurized object
Claims (8)
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| JP2023017779A JP7339459B1 (en) | 2023-02-08 | 2023-02-08 | pressure device |
| JP2023-017779 | 2023-02-08 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000140950A (en) * | 1998-11-04 | 2000-05-23 | Fuji Heavy Ind Ltd | Mold for rubber press and molding method |
| JP2002011599A (en) * | 2000-06-29 | 2002-01-15 | Kinugawa Rubber Ind Co Ltd | Press |
| JP2002011791A (en) * | 2000-06-29 | 2002-01-15 | Kinugawa Rubber Ind Co Ltd | Pressure molding device |
| JP2004296746A (en) * | 2003-03-26 | 2004-10-21 | Nikkiso Co Ltd | Pressurizing device and circuit element mounting method |
| TW201920523A (en) * | 2017-08-28 | 2019-06-01 | 日商日立化成股份有限公司 | Method for manufacturing power semiconductor device, sheet for hot pressing, and thermosetting resin composition for hot pressing |
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| JP4077982B2 (en) * | 1998-06-26 | 2008-04-23 | 日機装株式会社 | Mold for pressure molding |
| JP6050103B2 (en) * | 2012-11-29 | 2016-12-21 | ミカド機器販売株式会社 | Vacuum heating pressure sealing molding apparatus and vacuum heating pressure sealing molding method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000140950A (en) * | 1998-11-04 | 2000-05-23 | Fuji Heavy Ind Ltd | Mold for rubber press and molding method |
| JP2002011599A (en) * | 2000-06-29 | 2002-01-15 | Kinugawa Rubber Ind Co Ltd | Press |
| JP2002011791A (en) * | 2000-06-29 | 2002-01-15 | Kinugawa Rubber Ind Co Ltd | Pressure molding device |
| JP2004296746A (en) * | 2003-03-26 | 2004-10-21 | Nikkiso Co Ltd | Pressurizing device and circuit element mounting method |
| TW201920523A (en) * | 2017-08-28 | 2019-06-01 | 日商日立化成股份有限公司 | Method for manufacturing power semiconductor device, sheet for hot pressing, and thermosetting resin composition for hot pressing |
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| CN118475025A (en) | 2024-08-09 |
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