TWI848715B - Connector and connecting finger - Google Patents
Connector and connecting finger Download PDFInfo
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- TWI848715B TWI848715B TW112118872A TW112118872A TWI848715B TW I848715 B TWI848715 B TW I848715B TW 112118872 A TW112118872 A TW 112118872A TW 112118872 A TW112118872 A TW 112118872A TW I848715 B TWI848715 B TW I848715B
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- annular groove
- cylindrical body
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 51
- 229910052737 gold Inorganic materials 0.000 claims abstract description 51
- 239000010931 gold Substances 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 239000004020 conductor Substances 0.000 claims description 35
- 239000007788 liquid Substances 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 2
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000009193 crawling Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Abstract
Description
本發明涉及一種連接器及金手指,尤其涉及一種高可靠度的連接器及金手指。The present invention relates to a connector and a gold finger, and in particular to a connector and a gold finger with high reliability.
現有連接器大多包含一電路板、一金手指、及一銲料,所述金手指成圓柱狀並通過所述焊料而被焊接於所述電路板上,從而使所述金手指電性耦接所述電路板。然而,現有連接器的金手指與電路板之間雖是被所述銲料固定,但所述焊料由液態變化為固態的過程中經常混入氣泡而發生孔洞,從而造成金手指脫離電路板、或金手指未完全地電性耦接電路板等情形,亦即現有連接器的可靠度不佳。Most existing connectors include a circuit board, a gold finger, and a solder. The gold finger is cylindrical and is soldered to the circuit board through the solder, so that the gold finger is electrically coupled to the circuit board. However, although the gold finger and the circuit board of the existing connector are fixed by the solder, bubbles are often mixed into the solder during the process of changing from liquid to solid, resulting in holes, which causes the gold finger to separate from the circuit board or the gold finger is not completely electrically coupled to the circuit board, that is, the reliability of the existing connector is poor.
於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。Therefore, the inventors of the present invention believe that the above defects can be improved, and have conducted intensive research and applied scientific principles to finally propose the present invention which has a reasonable design and effectively improves the above defects.
本發明所要解決的技術問題在於,針對現有技術的不足提供一種連接器及金手指。The technical problem to be solved by the present invention is to provide a connector and a gold finger to address the deficiencies of the prior art.
本發明實施例公開一種連接器,包括:一基板;一金手指,設置於所述基板上,所述金手指包含:一圓柱本體,具有一高度方向,所述圓柱本體包含相反的一底面與一頂面、及連接所述底面與所述頂面的一環側面,所述底面面朝所述基板;至少一個逃氣通道,設置於所述頂面上,所述至少一個逃氣通道的兩個端口分別連通所述環側面的兩側;及一環槽,設置於所述環側面上且鄰近所述底面,所述環槽的局部沿所述高度方向連通兩個所述端口;以及一導電體,一體地附著於所述基板及所述金手指的局部上,所述導電體填滿所述至少一個逃氣通道及所述環槽,並且所述導電體不接觸所述頂面。The embodiment of the present invention discloses a connector, comprising: a substrate; a gold finger, arranged on the substrate, the gold finger comprising: a cylindrical body, having a height direction, the cylindrical body comprising a bottom surface and a top surface opposite to each other, and an annular side surface connecting the bottom surface and the top surface, the bottom surface facing the substrate; at least one escape channel, arranged on the top surface, the two ports of the at least one escape channel are respectively connected to the two sides of the annular side surface; and an annular groove, arranged on the annular side surface and adjacent to the bottom surface, the part of the annular groove is connected to the two ports along the height direction; and a conductor, integrally attached to the substrate and the part of the gold finger, the conductor fills the at least one escape channel and the annular groove, and the conductor does not contact the top surface.
本發明實施例還公開一種金手指,能用來通過一導電體固定於一基板上,所述金手指包括:一圓柱本體,具有一高度方向,所述圓柱本體包含相反的一底面與一頂面、及連接所述底面與所述頂面的一環側面,所述底面能用來接觸所述基板;至少一個逃氣通道,設置於所述頂面上,所述至少一個逃氣通道的兩個端口分別連通所述環側面的兩側;以及一環槽,設置於所述環側面上且鄰近所述底面,所述環槽的局部沿所述高度方向連通兩個所述端口;其中,所述至少一個逃氣通道及所述環槽能用來被所述導電體填滿,使所述導電體一體地附著於所述基板及所述金手指的局部上且不接觸所述頂面。The embodiment of the present invention also discloses a gold finger that can be used to be fixed on a substrate through a conductor, and the gold finger includes: a cylindrical body having a height direction, the cylindrical body including a bottom surface and a top surface opposite to each other, and an annular side surface connecting the bottom surface and the top surface, and the bottom surface can be used to contact the substrate; at least one escape channel is arranged on the top surface, and two ports of the at least one escape channel are respectively connected to the two sides of the annular side surface; and an annular groove is arranged on the annular side surface and adjacent to the bottom surface, and a part of the annular groove is connected to the two ports along the height direction; wherein the at least one escape channel and the annular groove can be used to be filled with the conductor, so that the conductor is integrally attached to the substrate and a part of the gold finger without contacting the top surface.
綜上所述,本發明實施例所公開的連接器及金手指,能通過“所述至少一個逃氣通道的兩個端口分別連通所述環側面的兩側,並且所述環槽的局部沿所述高度方向連通兩個所述端口”、及“所述導電體一體地附著於所述基板及所述金手指的局部上,並且所述導電體填滿所述至少一個逃氣通道及所述環槽”的設計,使所述連接器能避免所述導電體(例如:銲料)一體地附著於所述基板及所述金手指的過程中產生孔洞,從而提升可靠度。In summary, the connector and gold finger disclosed in the embodiments of the present invention can improve reliability by adopting the designs of "the two ports of the at least one air escape channel are respectively connected to the two sides of the annular side surface, and the part of the annular groove is connected to the two ports along the height direction", and "the conductor is integrally attached to the substrate and the part of the gold finger, and the conductor fills the at least one air escape channel and the annular groove". This allows the connector to avoid the generation of holes in the process of integrally attaching the conductor (e.g., solder) to the substrate and the gold finger.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only used for reference and description and are not used to limit the present invention.
以下是通過特定的具體實施例來說明本發明所公開有關“連接器及金手指”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。The following is a specific embodiment to illustrate the implementation of the "connector and gold finger" disclosed in the present invention. Technical personnel in this field can understand the advantages and effects of the present invention from the content disclosed in this manual. The present invention can be implemented or applied through other different specific embodiments. The details in this manual can also be modified and changed based on different viewpoints and applications without deviating from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustrations and are not depicted according to actual sizes. Please note in advance. The following implementation will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者訊號,但這些元件或者訊號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一訊號與另一訊號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that, although the terms "first", "second", "third", etc. may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used in this document may include any one or more combinations of the related listed items depending on the actual situation.
另外,於以下說明中,如有指出請參閱特定圖式或是如特定圖式所示,其僅是用以強調於後續說明中,所述的相關內容大部份出現於該特定圖式中,但不限制該後續說明中僅可參考所述特定圖式。In addition, in the following description, if it is indicated to refer to a specific figure or as shown in a specific figure, it is only used to emphasize that most of the related content described in the subsequent description appears in the specific figure, but it does not limit the subsequent description to only refer to the specific figure.
參閱圖1至圖10所示,本實施例提供一種連接器100。如圖1及圖2所示,所述連接器100包含一基板1、設置於所述基板1上的一金手指2A、及附著於所述基板1與所述金手指2A的一導電體3(例如:銲料)。1 to 10 , the present embodiment provides a
需先說明的是,上述基板1、金手指2A、及導電體3於本實施例中雖共同被定義為所述連接器100,但本發明不受限於此。舉例來說,所述金手指2A也可以是單獨地被運用(如:實施、製造、販售等)或搭配其他構件使用。以下將分別介紹所述連接器100的各個元件構造,並適時說明所述連接器100的各個元件彼此之間的連接關係。It should be noted that, although the substrate 1, the
復參圖1及圖2所示,所述基板1於本實施例中為一印刷電路板,並且所述基板1大致呈矩形,但本發明不以此為限制。所述基板1能通過所述金手指2A從而電性連接一外部電子設備(未繪示)。其中,所述金手指2A包含一圓柱本體21、兩個逃氣通道22、及一環槽23。Referring again to FIG. 1 and FIG. 2 , the substrate 1 is a printed circuit board in this embodiment, and the substrate 1 is substantially rectangular, but the present invention is not limited thereto. The substrate 1 can be electrically connected to an external electronic device (not shown) through the
詳細地說,如圖2至圖4所示,所述圓柱本體21於本實施例中可以是任何導電材料(例如:銅柱),並且所述圓柱本體21具有一高度方向D1、及垂直所述高度方向D1的一徑向方向D2。所述圓柱本體21包含相反的一底面S211與一頂面S212、及連接所述底面S211與所述頂面S212的一環側面S213。Specifically, as shown in FIGS. 2 to 4 , the
所述圓柱本體21是以所述底面S211面朝所述基板1設置,亦即所述底面S211(電性)接觸所述基板1,所述頂面S212則遠離所述基板1,並且所述頂面S212與鄰近所述頂面S212的部分所述環側面S213能用來(電性)接觸所述外部電子設備。The
於實務上,所述圓柱本體21於所述頂面S212與所述環側面S213之間還可以包含一倒角面,使所述外部電子設備能更容易地接觸所述頂面S212與鄰近所述頂面S212的部分所述環側面S213。In practice, the
復參圖4至圖6所示,兩個所述逃氣通道22設置於所述頂面S212上,並且兩個所述逃氣通道22能供呈液態的所述導電體3與空氣穿過,從而被所述導電體3填滿(如圖2所示)。其中,兩個所述逃氣通道22於本實施例中能穿過所述圓柱本體21的中心,使兩個所述逃氣通道22相互連通且具有90度夾角θ,但本發明不以此為限制。舉例來說,本發明於其他未繪示的實施例中,兩個所述逃氣通道22也可以是不穿過所述圓柱本體21的中心,並且兩個所述逃氣通道22之間不存在夾角(即,兩個所述逃氣通道22互不相通)。Referring again to FIGS. 4 to 6 , the two
進一步地,各所述逃氣通道22具有相反的兩個端口(未標示),並且兩個所述端口能分別連通所述環側面S213的兩側,以作為逃氣用之一入口及一出口。Furthermore, each of the
於實際應用中,各所述逃氣通道22沿所述徑向方向D2的截面形狀可以被設計。舉一例來說,如圖4至圖6所示,各所述逃氣通道22的寬度W22沿所述徑向方向D2可以不具有任何變化,使各所述逃氣通道22的所述截面形狀大致呈矩形。In practical applications, the cross-sectional shape of each of the
舉另一例來說,如圖7與圖8所示,所述金手指2B、2C的各所述逃氣通道22的寬度(未標示)可以是沿所述徑向方向D2朝所述圓柱本體21的中心漸窄,使各所述逃氣通道22呈「中間窄兩側寬」。據此,當呈液體的所述導電體3、或空氣由其中一個所述逃氣通道22的所述入口移動至所述出口時,前述逃氣通道22的中心(即,窄部位)會產生負壓從而吸引位於另一個所述逃氣通道22內的空氣、或呈液體的所述導電體3,使兩個所述逃氣通道22內的流動速度能趨於一致而確保所述導電體3能均勻地填滿兩個所述逃氣通道22。For another example, as shown in FIG. 7 and FIG. 8 , the width (not shown) of each of the
舉又一例來說,如圖9與圖10所示,所述金手指2D、2E的各所述逃氣通道22沿所述徑向方向D2的截面形狀被設計為鋸齒或波浪,從而增加所述導電體3接觸兩個所述逃氣通道22的內表面的面積。For another example, as shown in FIG. 9 and FIG. 10 , the cross-sectional shape of each of the
配合圖2及圖5所示,所述環槽23設置於所述環側面S213上且鄰近所述底面S211,使所述環槽23能作為呈液態的所述導電體3的一爬行路徑。以圖5中的方向來看,所述環槽23的位置位於所述環側面S213的下側,並且所述圓柱本體21被所述環槽23區隔出一上墩部位UP及一下墩部位DP。其中,所述上墩部位UP的高度HUP是大於所述下墩部位DP的高度HDP,並且所述上墩部位UP是作為接觸所述外部電子設備之用。所述下墩部位DP被各所述逃氣通道22的兩個所述端口於所述高度方向D1上所貫通,使所述環槽23的局部能沿所述高度方向D1連通各所述逃氣通道22的兩個所述端口,從而使所述下墩部位DP及所述環槽23能作為呈液態的所述導電體3的一附著區域。As shown in FIG. 2 and FIG. 5 , the
換句話說,各所述逃氣通道22、所述環槽23、及各所述逃氣通道22會被所述導電體3填滿,使所述圓柱本體21於所述環槽23以下的部位被所述導電體3所包覆,從而固定所述金手指2A於所述基板1上。In other words, each of the
需說明的是,當所述環槽23的一寬度W23過寬時,呈液態的所述導電體3的附著力會不足,使所述導電體3無法附著於所述環槽23上。因此,所述環槽23的所述寬度W23較佳是介於所述圓柱本體21的高度H21的25%至35%之間,使所述環槽23上能被呈液態的所述導電體3以最面積被附著。其中,所述環槽23的寬度W23的實際尺寸較佳是不超過0.4mm。It should be noted that when the width W23 of the
另外,為確保呈液態的所述導電體3能順利地爬行,所述環槽23的一底緣S23於所述高度方向D1上的位置較佳是落在所述圓柱本體21的高度的10%至20%之間,並且所述環槽23的深度L23介於所述底緣S23的位置落在所述圓柱本體21的厚度的70%至80%之間。其中,所述環槽23的所述底緣S23的實際位置較佳是不超過0.3mm,所述環槽23的深度L23的實際尺寸較佳是不超過0.15mm。In addition, to ensure that the
也就是說,當所述圓柱本體21以所述基板1為起始面沿所述高度方向D1定義位置關係時,所述底面S211可以視為0%的位置,且所述頂面S212視為100%的位置,所述環槽23的所述底緣S23則位於10%至20%之間的位置。假設所述底緣S23實際所在高度為0.2毫米時,所述環槽23的深度L23則可以介於0.14毫米至0.15毫米之間。That is, when the
需另外說明的是,本發明的金手指2A於本實施例中是以兩個逃氣通道22做說明,但本發明不以此為限制。舉例來說,本發明於其他未繪示得實施例中,所述金手指2A也可以只有一個所述逃氣通道22。也就是說,所述金手指2A可以是包含至少一個所述逃氣通道22。It should be noted that the
[本發明實施例的技術效果][Technical Effects of the Embodiments of the Invention]
綜上所述,本發明實施例所公開的連接器及金手指,能通過“所述至少一個逃氣通道的兩個端口分別連通所述環側面的兩側,並且所述環槽的局部沿所述高度方向連通兩個所述端口”、及“所述導電體一體地附著於所述基板及所述金手指的局部上,並且所述導電體填滿所述至少一個逃氣通道及所述環槽”的設計,使所述連接器能避免所述導電體(例如:銲料)一體地附著於所述基板及所述金手指的過程中產生孔洞,從而提升可靠度。In summary, the connector and gold finger disclosed in the embodiments of the present invention can improve reliability by adopting the designs of "the two ports of the at least one air escape channel are respectively connected to the two sides of the annular side surface, and the part of the annular groove is connected to the two ports along the height direction", and "the conductor is integrally attached to the substrate and the part of the gold finger, and the conductor fills the at least one air escape channel and the annular groove". This allows the connector to avoid the generation of holes in the process of integrally attaching the conductor (e.g., solder) to the substrate and the gold finger.
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。The contents disclosed above are only preferred feasible embodiments of the present invention and are not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the specification and drawings of the present invention are included in the scope of the patent application of the present invention.
100:連接器
1:基板
2A~2E:金手指
21:圓柱本體
S211:底面
S212:頂面
S213:環側面
22:逃氣通道
23:環槽
3:導電體
D1:高度方向
D2:徑向方向
UP:上墩部位
DP:下墩部位
W22、W23:寬度
L23:深度
S23:底緣
HUP、HDP、H21:高度
θ:夾角
100: Connector
1:
圖1為本發明的連接器的立體示意圖。FIG1 is a three-dimensional schematic diagram of a connector of the present invention.
圖2為本發明的連接器的側視示意圖。FIG. 2 is a side view schematic diagram of the connector of the present invention.
圖3為本發明的金手指的立體示意圖。FIG. 3 is a three-dimensional schematic diagram of the gold finger of the present invention.
圖4為本發明的金手指的另一立體示意圖。FIG. 4 is another three-dimensional schematic diagram of the gold finger of the present invention.
圖5為本發明的金手指的側視示意圖。FIG. 5 is a side view schematic diagram of the gold finger of the present invention.
圖6為本發明的金手指的仰視示意圖。FIG. 6 is a bottom view of the gold finger of the present invention.
圖7為本發明的金手指於另一態樣時的仰視示意圖。FIG. 7 is a bottom view of the gold finger of the present invention in another state.
圖8為本發明的金手指於又一態樣時的仰視示意圖。FIG. 8 is a bottom view of the gold finger of the present invention in another state.
圖9為本發明的金手指於還一態樣時的仰視示意圖。FIG. 9 is a bottom view of the gold finger of the present invention in another state.
圖10為本發明的金手指於又另一態樣時的仰視示意圖。FIG. 10 is a bottom view of the gold finger of the present invention in yet another state.
2A:金手指 2A: Gold Finger
21:圓柱本體 21: Cylindrical body
S211:底面 S211: Bottom
S212:頂面 S212: Top surface
S213:環側面 S213: Side of the ring
22:逃氣通道 22: Escape channel
23:環槽 23: Ring groove
D1:高度方向 D1: Height direction
D2:徑向方向 D2: radial direction
UP:上墩部位 UP: upper part
DP:下墩部位 DP: Lower pier position
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112118872A TWI848715B (en) | 2023-05-22 | 2023-05-22 | Connector and connecting finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112118872A TWI848715B (en) | 2023-05-22 | 2023-05-22 | Connector and connecting finger |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI848715B true TWI848715B (en) | 2024-07-11 |
| TW202448030A TW202448030A (en) | 2024-12-01 |
Family
ID=92929296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112118872A TWI848715B (en) | 2023-05-22 | 2023-05-22 | Connector and connecting finger |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI848715B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI332812B (en) * | 2007-11-28 | 2010-11-01 | Delta Electronics Inc | Circuit board module with surface mount conductive pin and circuit boards assembly having same |
| CN104025727A (en) * | 2011-09-26 | 2014-09-03 | 阿尔发金属有限公司 | Systems and methods for void reduction in solder joints |
| US10785871B1 (en) * | 2018-12-12 | 2020-09-22 | Vlt, Inc. | Panel molded electronic assemblies with integral terminals |
| US10939559B2 (en) * | 2017-09-19 | 2021-03-02 | Schlage Lock Company Llc | Removing unwanted flux from an integrated circuit package |
| US10980160B2 (en) * | 2018-09-26 | 2021-04-13 | Canon Kabushiki Kaisha | Image pickup module, method for manufacturing image pickup module, and electronic device |
-
2023
- 2023-05-22 TW TW112118872A patent/TWI848715B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI332812B (en) * | 2007-11-28 | 2010-11-01 | Delta Electronics Inc | Circuit board module with surface mount conductive pin and circuit boards assembly having same |
| CN104025727A (en) * | 2011-09-26 | 2014-09-03 | 阿尔发金属有限公司 | Systems and methods for void reduction in solder joints |
| US10939559B2 (en) * | 2017-09-19 | 2021-03-02 | Schlage Lock Company Llc | Removing unwanted flux from an integrated circuit package |
| US10980160B2 (en) * | 2018-09-26 | 2021-04-13 | Canon Kabushiki Kaisha | Image pickup module, method for manufacturing image pickup module, and electronic device |
| US10785871B1 (en) * | 2018-12-12 | 2020-09-22 | Vlt, Inc. | Panel molded electronic assemblies with integral terminals |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202448030A (en) | 2024-12-01 |
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