TWI848399B - Display panel - Google Patents
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- 239000000758 substrate Substances 0.000 claims abstract description 55
- 230000005540 biological transmission Effects 0.000 claims abstract description 26
- 238000009434 installation Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 22
- 238000003860 storage Methods 0.000 description 4
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 3
- 101000812663 Homo sapiens Endoplasmin Proteins 0.000 description 3
- 101000689394 Homo sapiens Phospholipid scramblase 4 Proteins 0.000 description 3
- 101000796673 Homo sapiens Transformation/transcription domain-associated protein Proteins 0.000 description 3
- 101001067395 Mus musculus Phospholipid scramblase 1 Proteins 0.000 description 3
- 102100024494 Phospholipid scramblase 4 Human genes 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- CQZCVYWWRJDZBO-UHFFFAOYSA-N diphenyliodanium;nitrate Chemical compound [O-][N+]([O-])=O.C=1C=CC=CC=1[I+]C1=CC=CC=C1 CQZCVYWWRJDZBO-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000000087 stabilizing effect Effects 0.000 description 3
- 101150087985 SUB11 gene Proteins 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 101100419716 Podospora anserina RPS9 gene Proteins 0.000 description 1
- 101150025868 SUB12 gene Proteins 0.000 description 1
- 101100229953 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) SCT1 gene Proteins 0.000 description 1
- 101100194362 Schizosaccharomyces pombe (strain 972 / ATCC 24843) res1 gene Proteins 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
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Abstract
Description
本案係關於一種顯示面板,特別係關於一種顯示晶片用於觸控面板的技術。This case relates to a display panel, and more particularly to a technology for using a display chip in a touch panel.
在一些顯示面板的技術中,部分內嵌式觸控面板與純顯示面板的結構差異在於內嵌式觸控面板具有電極陣列而純顯示面板為共電極層。在這樣的情形中,如何將與純顯示面板具有相似結構的內嵌式觸控面板作為純顯示面板使用,以減少製程中的總體光罩數量,從而降低成本,為本領域中重要的議題。In some display panel technologies, the structural difference between some embedded touch panels and pure display panels is that the embedded touch panels have an electrode array while the pure display panels have a common electrode layer. In such a case, how to use the embedded touch panel with a similar structure as the pure display panel as a pure display panel to reduce the total number of masks in the manufacturing process, thereby reducing costs, is an important issue in this field.
本揭示文件提供一種顯示面板。顯示面板包含基板、畫素陣列、複數個顯示接墊、電極陣列以及複數個觸控接墊。畫素陣列包含複數個畫素,畫素陣列設置於基板上的顯示區。該些顯示接墊設置於基板的裝設區。顯示接墊經由複數條資料線電性耦接該些畫素,該些顯示接墊用以傳送複數個資料電壓至該些畫素中之對應者。電極陣列設置於基板上的顯示區,電極陣列包含複數個電極塊。該些觸控接墊設置於基板的裝設區。該些接墊分別經由複數條傳輸線電性耦接該些電極塊,搭配一顯示型單晶片,該些觸控接墊為浮接接墊。The present disclosure document provides a display panel. The display panel includes a substrate, a pixel array, a plurality of display pads, an electrode array, and a plurality of touch pads. The pixel array includes a plurality of pixels, and the pixel array is disposed in a display area on the substrate. The display pads are disposed in an installation area of the substrate. The display pads are electrically coupled to the pixels via a plurality of data lines, and the display pads are used to transmit a plurality of data voltages to corresponding ones of the pixels. The electrode array is disposed in the display area on the substrate, and the electrode array includes a plurality of electrode blocks. The touch pads are disposed in the installation area of the substrate. The pads are electrically coupled to the electrode blocks through a plurality of transmission lines, respectively, and are matched with a display type single chip. The touch pads are floating pads.
本揭示文件提供一種顯示面板。顯示面板包含基板、畫素陣列、電極陣列以及顯示晶片。畫素陣列包含複數個畫素,設置於基板上的顯示區。電極陣列包含複數個電極塊,設置於基板上的顯示區。顯示晶片設置於基板上的裝設區。單晶片無觸控功能,不提供觸控訊號。The present disclosure document provides a display panel. The display panel includes a substrate, a pixel array, an electrode array, and a display chip. The pixel array includes a plurality of pixels disposed in a display area on the substrate. The electrode array includes a plurality of electrode blocks disposed in a display area on the substrate. The display chip is disposed in a mounting area on the substrate. The single chip has no touch function and does not provide a touch signal.
綜上所述,本揭示文件將顯示面板中的部分接墊設置為浮接接墊,從而將具有電極陣列的顯示面板用作於純顯示電路。In summary, the present disclosure sets some pads in a display panel as floating pads, so that the display panel with an electrode array is used as a pure display circuit.
下列係舉實施例配合所附圖示做詳細說明,但所提供之實施例並非用以限制本揭露所涵蓋的範圍,而結構運作之描述非用以限制其執行順序,任何由元件重新組合之結構,所產生具有均等功效的裝置,皆為本揭露所涵蓋的範圍。另外,圖示僅以說明為目的,並未依照原尺寸作圖。為使便於理解,下述說明中相同元件或相似元件將以相同之符號標示來說明。The following is a detailed description of the embodiments with the attached diagrams, but the embodiments provided are not intended to limit the scope of the disclosure, and the description of the structure operation is not intended to limit its execution order. Any device with equal functions produced by the re-combination of components is within the scope of the disclosure. In addition, the diagrams are for illustration purposes only and are not drawn according to the original size. For ease of understanding, the same or similar components in the following description will be marked with the same symbols.
在全篇說明書與申請專利範圍所使用之用詞(terms),除有特別註明除外,通常具有每個用詞使用在此領域中、在此揭露之內容中與特殊內容中的平常意義。The terms used throughout the specification and claims generally have the ordinary meanings of each term used in the art, in the context of this disclosure and in the specific context, unless otherwise specified.
此外,在本文中所使用的用詞『包含』、『包括』、『具有』、『含有』等等,均為開放性的用語,即意指『包含但不限於』。此外,本文中所使用之『及/或』,包含相關列舉項目中一或多個項目的任意一個以及其所有組合。In addition, the terms "include", "including", "have", "contain", etc. used in this article are open terms, which means "including but not limited to". In addition, "and/or" used in this article includes any one or more items in the relevant enumerated items and all combinations thereof.
於本文中,當一元件被稱為『耦接』或『耦接』時,可指『電性耦接』或『電性耦接』。『耦接』或『耦接』亦可用以表示二或多個元件間相互搭配操作或互動。此外,雖然本文中使用『第一』、『第二』、…等用語描述不同元件,該用語僅是用以區別以相同技術用語描述的元件或操作。In this article, when an element is referred to as "coupled" or "coupled", it may refer to "electrically coupled" or "electrically coupled". "Coupled" or "coupled" may also be used to indicate the coordinated operation or interaction between two or more elements. In addition, although the terms "first", "second", etc. are used in this article to describe different elements, the terms are only used to distinguish between elements or operations described with the same technical terms.
請參閱第1圖,第1圖為依據本揭示文件的一些實施例所繪示的顯示面板100的示意圖。如第1圖所示,顯示面板100包含基板SUBa、畫素陣列PIX、閘極驅動電路GOA、單晶片裝置140、電極陣列110、第一開關組120、第二開關組130、軟性印刷電路板FPC、印刷電路板組件PCBA、電源管理積體電路PMIC。Please refer to FIG. 1, which is a schematic diagram of a display panel 100 according to some embodiments of the present disclosure. As shown in FIG. 1, the display panel 100 includes a substrate SUBa, a pixel array PIX, a gate drive circuit GOA, a single chip device 140, an
在一些實施例中,若顯示面板100用以作為純顯示面板實施,單晶片裝置140會採用純顯示驅動晶片(例如,時序控制器嵌入式驅動器(Timing Controller Embedded Driver;TED或源極驅動器),以驅動顯示面板100的畫素陣列PIX。若顯示面板100作為純顯示面板實施,如何將顯示面板100中的電極陣列110作為純顯示面板中的共電極層運作,以減少顯示畫面不均,會於後續實施例中詳細說明。In some embodiments, if the display panel 100 is implemented as a pure display panel, the single-chip device 140 will use a pure display driver chip (e.g., a timing controller embedded driver (TED or source driver)) to drive the pixel array PIX of the display panel 100. If the display panel 100 is implemented as a pure display panel, how to operate the
在一些實施例中,基板SUBa由玻璃基板實施。在一些實施例中,畫素陣列PIX以及電極陣列110設置於基板SUBa的顯示區。並且,畫素陣列PIX以及電極陣列110設置於相鄰層。In some embodiments, the substrate SUBa is implemented by a glass substrate. In some embodiments, the pixel array PIX and the
在一些實施例中,閘極驅動電路GOA設置於基板SUBa的非顯示區。閘極驅動電路GOA經由閘極線(例如,閘極線G1~G3)電性耦接畫素陣列PIX,並且單晶片裝置140經由資料線(例如,資料線D1~D3)電性耦接畫素陣列PIX。In some embodiments, the gate drive circuit GOA is disposed in the non-display area of the substrate SUBa. The gate drive circuit GOA is electrically coupled to the pixel array PIX via gate lines (e.g., gate lines G1-G3), and the single chip device 140 is electrically coupled to the pixel array PIX via data lines (e.g., data lines D1-D3).
在一些實施例中,單晶片裝置140設置於基板SUBa的裝設區。單晶片裝置140經由傳輸線(例如,傳輸線L1~L4)電性耦接電極陣列110,並且電極陣列110經由傳輸線(例如,傳輸線L1~L4)以及第二開關組130電性耦接測試接墊32~35,測試接墊32~35的數量用於示例,在其他實施例中,測試接墊具有更多或更少的數量,本案不以此為限。In some embodiments, the single chip device 140 is disposed in the mounting area of the substrate SUBa. The single chip device 140 is electrically coupled to the
請一併參閱第1圖以及第2圖,第2圖為依據本揭示文件的一些實施例所繪示第1圖的畫素陣列PIX中的畫素SB11~SB12以及SB21~SB22的示意圖。Please refer to FIG. 1 and FIG. 2 together. FIG. 2 is a schematic diagram illustrating pixels SB11-SB12 and SB21-SB22 in the pixel array PIX of FIG. 1 according to some embodiments of the present disclosure.
如第2圖所示,畫素陣列PIX中位於同一畫素列的畫素(例如,畫素SUB11及SU12或SUB21及SUB22)經由沿第一方向(例如,水平方向)延伸的閘極線G1、G2連接至閘極驅動電路GOA,以透過閘極線G1~G2傳送掃描訊號至對應的畫素列。畫素陣列PIX中位於同一行的畫素(例如,畫素SUB11及SU21或SUB12及SUB22) 經由沿第二方向(例如,垂直方向)延伸的資料線D1~D2連接至單晶片裝置140,以透過資料線D1~D2傳送資料電壓至對應的畫素。As shown in FIG. 2 , pixels in the same pixel row in the pixel array PIX (e.g., pixels SUB11 and SU12 or SUB21 and SUB22) are connected to the gate drive circuit GOA via gate lines G1 and G2 extending along a first direction (e.g., horizontal direction) to transmit a scanning signal to the corresponding pixel row through the gate lines G1-G2. Pixels in the same row in the pixel array PIX (e.g., pixels SUB11 and SU21 or SUB12 and SUB22) are connected to the single chip device 140 via data lines D1-D2 extending along a second direction (e.g., vertical direction) to transmit a data voltage to the corresponding pixel through the data lines D1-D2.
畫素SB11包含電晶體TRA1、畫素電極PE、共電極CE、液晶層LCL以及畫素電容Cst。電晶體TRA1的閘極端電性耦接閘極線G1,電晶體TRA1的第一端電性耦接資料線D1,電晶體的第二端電性耦接畫素電極PE以及畫素電容Cst。畫素電極PE以及共電極CE之間為液晶層LCL。在一些實施例中,共電極CE對應於電極陣列110的電極塊。The pixel SB11 includes a transistor TRA1, a pixel electrode PE, a common electrode CE, a liquid crystal layer LCL, and a pixel capacitor Cst. The gate terminal of the transistor TRA1 is electrically coupled to the gate line G1, the first end of the transistor TRA1 is electrically coupled to the data line D1, and the second end of the transistor is electrically coupled to the pixel electrode PE and the pixel capacitor Cst. The liquid crystal layer LCL is between the pixel electrode PE and the common electrode CE. In some embodiments, the common electrode CE corresponds to the electrode block of the
請一併參閱第1圖以及第3圖,第3圖為依據本揭示文件的一些實施例所繪示的基板SUBa的示意圖。在第3圖的實施例中,為較佳的理解,僅繪示3*4個電極塊。實際而言,電極陣列110包含陣列式排列的n*m個電極塊,其中「n」以及「m」為正整數。因此,本案不以此為限。電極陣列110電性耦接在第一開關組120以及第二開關組130之間。Please refer to FIG. 1 and FIG. 3 together. FIG. 3 is a schematic diagram of a substrate SUBa according to some embodiments of the present disclosure. In the embodiment of FIG. 3, for better understanding, only 3*4 electrode blocks are shown. In practice, the
第一開關組120以及第二開關組130沿水平方向設置於基板SUBa的顯示區AA的相對側,並且透過沿第二方向(例如,垂直方向)延伸的傳輸線L1~L4將電極塊112、114、116以及118電性耦接在第一開關組120與單晶片裝置140以及第二開關組130之間。在功能上,第一開關組120以及第二開關組130用以分別依據由單晶片裝置140所提供的控制訊號CS1以及CS2導通,使共電極電壓VCOM的電位經由傳輸線L1~L4傳送至電極塊112、114、116以及118,以作為共電極實施。The first switch group 120 and the second switch group 130 are disposed on opposite sides of the display area AA of the substrate SUBa along the horizontal direction, and the electrode blocks 112, 114, 116, and 118 are electrically coupled between the first switch group 120 and the single-chip device 140 and the second switch group 130 through transmission lines L1-L4 extending along the second direction (e.g., the vertical direction). Functionally, the first switch group 120 and the second switch group 130 are used to be turned on according to control signals CS1 and CS2 provided by the single-chip device 140, respectively, so that the potential of the common electrode voltage VCOM is transmitted to the electrode blocks 112, 114, 116, and 118 through the transmission lines L1-L4, so as to be implemented as a common electrode.
在一些實施例中,傳輸線L1~L4用以傳送共電極電壓VCOM至電極陣列110中的電極塊,以穩定電極陣列110中的電極塊的電位,從而改善電極塊的電位不穩造成顯示面板100a的顯示畫面不均、色差的問題。In some embodiments, the transmission lines L1-L4 are used to transmit the common electrode voltage VCOM to the electrode blocks in the
具體而言,請參閱第1圖、第3圖以及第4圖所示,第4圖為依據本揭示文件的一些實施例所繪示的基板SUBa的示意圖。顯示面板100包含設置在基板SUBa上的第一開關組120、第二開關組130以及電極陣列110。Specifically, please refer to Figure 1, Figure 3 and Figure 4, Figure 4 is a schematic diagram of a substrate SUBa according to some embodiments of the present disclosure. The display panel 100 includes a first switch group 120, a second switch group 130 and an
第一開關組120包含第一開關STP1~STP4。具體而言,第一開關STP1~ST4的第一端用以接收共電極電壓VCOM,第一開關STP1~STP4的第二端分別電性耦接傳輸線L1~L4各自的第一端。第一開關STP1~STP4的閘極端用以接收控制訊號CS1,並且第一開關STP1~STP4依據控制訊號CS1導通,以經由傳輸線L1~L4傳送共電極電壓VCOM至電極陣列110中的電極塊112、114、116以及118。The first switch group 120 includes first switches STP1-STP4. Specifically, the first ends of the first switches STP1-STP4 are used to receive the common electrode voltage VCOM, and the second ends of the first switches STP1-STP4 are electrically coupled to the first ends of the transmission lines L1-L4. The gate ends of the first switches STP1-STP4 are used to receive the control signal CS1, and the first switches STP1-STP4 are turned on according to the control signal CS1 to transmit the common electrode voltage VCOM to the electrode blocks 112, 114, 116 and 118 in the
第二開關組130包含第二開關SCT1~SCT4。具體而言,第二開關SCT1~SCT4的第一端分別電性耦接傳輸線L1~L4的第二端,第二開關SCT1~SCT4的第二端用以接收共電極電壓VCOM。第二開關SCT1~SCT4的閘極端用以接收控制訊號CS2,並且第二開關SCT1~SCT4用以依據控制訊號CS2導通,以經由傳輸線L1~L4傳送共電極電壓VCOM至電極陣列110中的電極塊112、114、116以及118。The second switch group 130 includes second switches SCT1-SCT4. Specifically, the first ends of the second switches SCT1-SCT4 are electrically coupled to the second ends of the transmission lines L1-L4, respectively, and the second ends of the second switches SCT1-SCT4 are used to receive the common electrode voltage VCOM. The gate ends of the second switches SCT1-SCT4 are used to receive the control signal CS2, and the second switches SCT1-SCT4 are used to be turned on according to the control signal CS2 to transmit the common electrode voltage VCOM to the electrode blocks 112, 114, 116 and 118 in the
在一些實施例中,電源管理積體電路PMIC電性耦接第二開關SCT1~SCT4的第二端以及第一開關STP1~ST4的第一端,共電極電壓VCOM由電源管理積體電路PMIC提供。在另一些實施例中,單晶片裝置140電性耦接第二開關SCT1~SCT4的第二端以及第一開關STP1~ST4的第一端,共電極電壓VCOM的電壓由單晶片裝置140提供。In some embodiments, the power management integrated circuit PMIC is electrically coupled to the second ends of the second switches SCT1-SCT4 and the first ends of the first switches STP1-ST4, and the common electrode voltage VCOM is provided by the power management integrated circuit PMIC. In other embodiments, the single-chip device 140 is electrically coupled to the second ends of the second switches SCT1-SCT4 and the first ends of the first switches STP1-ST4, and the voltage of the common electrode voltage VCOM is provided by the single-chip device 140.
在一些實施例中,電極陣列110經由第二開關組130以棋盤式圖樣連接至測試接墊32~35。舉例而言,電極塊112以及電極塊116經由第二開關組130連接至測試接墊32,並且電極塊114以及電極塊118經由第二開關組130連接至測試接墊33。如此,在測試階段可透過測試接墊32~35對各測試區域內的電極塊進行檢測。In some embodiments, the
在一些實施例中,基板SUBa的裝設區BA用以裝設單晶片裝置140。基板SUBa的裝設區BA包含觸控接墊(例如,觸控接墊11~14)、顯示接墊40。觸控接墊11~14經由傳輸線L1~L4分別電性耦接電極塊112、114、116以及118。顯示接墊40電性耦接資料線(如第1圖所示的資料線D1~D3),顯示接墊40用以經由資料線傳送複數個資料電壓至該些畫素中之對應者。In some embodiments, the mounting area BA of the substrate SUBa is used to mount the single chip device 140. The mounting area BA of the substrate SUBa includes touch pads (e.g., touch pads 11-14) and display pads 40. The touch pads 11-14 are electrically coupled to the electrode blocks 112, 114, 116, and 118 respectively through transmission lines L1-L4. The display pad 40 is electrically coupled to the data line (such as the data lines D1-D3 shown in FIG. 1), and the display pad 40 is used to transmit a plurality of data voltages to the corresponding ones of the pixels through the data line.
請參閱第1圖以及第3圖至第5A圖。第5A圖為依據本揭示文件的一些實施例所繪示的觸控與顯示驅動集成晶片TDDI的接腳的示意圖。在一些實施例中,若單晶片裝置140由觸控與顯示驅動集成晶片TDDI實施,在裝設觸控與顯示驅動集成晶片TDDI至基板SUBa上的裝設區BA之後,觸控與顯示驅動集成晶片TDDI的多個輸出接腳(例如,觸控接腳TPIN以及顯示接腳DPIN)分別電性耦接觸控接墊(例如,觸控接墊11~14)以及顯示接墊40。觸控與顯示驅動集成晶片TDDI的多個輸入接腳INPIN分別電性耦接多個接墊50。Please refer to FIG. 1 and FIG. 3 to FIG. 5A. FIG. 5A is a schematic diagram of pins of a touch and display driver integrated chip TDDI according to some embodiments of the present disclosure. In some embodiments, if the single chip device 140 is implemented by a touch and display driver integrated chip TDDI, after the touch and display driver integrated chip TDDI is installed in the installation area BA on the substrate SUBa, a plurality of output pins (e.g., touch pins TPIN and display pins DPIN) of the touch and display driver integrated chip TDDI are electrically coupled to touch pads (e.g., touch pads 11-14) and display pads 40, respectively. A plurality of input pins INPIN of the touch and display driver integrated chip TDDI are electrically coupled to a plurality of pads 50 respectively.
請參閱第1圖、第3圖至第4圖以及第5B圖。第5B圖為依據本揭示文件的一些實施例所繪示的時序控制器嵌入式驅動器TED的接腳的示意圖。若單晶片裝置140由純顯示晶片(例如,時序控制器嵌入式驅動器TED)實施,在裝設時序控制器嵌入式驅動器TED至基板SUBa上的裝設區BA之後,時序控制器嵌入式驅動器TED的多個輸出接腳(例如,顯示接腳DPIN)分別電性耦接顯示接墊40。時序控制器嵌入式驅動器TED的多個輸入接腳INPIN分別電性耦接多個接墊50。Please refer to FIG. 1, FIG. 3 to FIG. 4 and FIG. 5B. FIG. 5B is a schematic diagram of the pins of the timing controller embedded driver TED according to some embodiments of the present disclosure. If the single-chip device 140 is implemented by a pure display chip (e.g., a timing controller embedded driver TED), after installing the timing controller embedded driver TED to the installation area BA on the substrate SUBa, the multiple output pins (e.g., display pins DPIN) of the timing controller embedded driver TED are respectively electrically coupled to the display pads 40. The multiple input pins INPIN of the timing controller embedded driver TED are respectively electrically coupled to the multiple pads 50.
須要注意的是,由於時序控制器嵌入式驅動器TED不會具有觸控接腳,因此在裝設時序控制器嵌入式驅動器TED至SUBa上的裝設區BA之後,時序控制器嵌入式驅動器TED與基板SUBa上的觸控接墊11~14電性絕緣,觸控接墊11~14會處於浮接狀態,使觸控接墊11~14為浮接接墊。It should be noted that since the timing controller embedded driver TED does not have touch pins, after the timing controller embedded driver TED is installed in the installation area BA on SUBa, the timing controller embedded driver TED is electrically insulated from the touch pads 11~14 on the substrate SUBa, and the touch pads 11~14 will be in a floating state, making the touch pads 11~14 floating pads.
在一些實施例中,時序控制器嵌入式驅動器TED另一部分的輸出接腳用以電性耦接接墊21、22以及31。在一些實施例中,時序控制器嵌入式驅動器TED經由接墊21傳送控制訊號CS1至第一電晶體STP1~STP4的閘極端,並且時序控制器嵌入式驅動器TED用以經由接墊31傳送控制訊號CS2至第二電晶體SCT1~SCT4的閘極端。In some embodiments, another portion of the output pins of the timing controller embedded driver TED is used to electrically couple the pads 21, 22, and 31. In some embodiments, the timing controller embedded driver TED transmits the control signal CS1 to the gate terminals of the first transistors STP1-STP4 via the pad 21, and the timing controller embedded driver TED transmits the control signal CS2 to the gate terminals of the second transistors SCT1-SCT4 via the pad 31.
在一些實施例中,請參閱第1圖、第3圖至第4圖以及第6圖至第8圖。第6圖至第8圖為依據本揭示文件的一些實施例所繪示在單晶片裝置140由純顯示晶片實施的情形下的水平同步訊號Hsync、垂直同步訊號Vsync以及控制訊號CS1a~CS1c以及CS2a~CS2c的時序的示意圖。控制訊號CS1a~CS1c對應於第3圖以及第4圖的控制訊號CS1,控制訊號CS2a~CS2c對應於第3圖以及第4圖的控制訊號CS2。In some embodiments, please refer to FIG. 1, FIG. 3 to FIG. 4, and FIG. 6 to FIG. 8. FIG. 6 to FIG. 8 are schematic diagrams showing the timing of the horizontal synchronization signal Hsync, the vertical synchronization signal Vsync, and the control signals CS1a~CS1c and CS2a~CS2c when the single-chip device 140 is implemented by a pure display chip according to some embodiments of the present disclosure. The control signals CS1a~CS1c correspond to the control signals CS1 of FIG. 3 and FIG. 4, and the control signals CS2a~CS2c correspond to the control signals CS2 of FIG. 3 and FIG. 4.
在一些實施例中,水平同步訊號Hsync於一個週期的第一階段(顯示階段)T1的時間長度大於至少一閘極線的掃描時間(例如,於第6圖中第一階段T1,水平同步訊號Hsync具有多個脈衝,每一個脈衝代表閘極驅動電路GOA對一條閘極線的掃描作動),並且水平同步訊號Hsync於所述週期的第二階段T2的時間長度在100至600微秒的範圍內。在一些實施例中,單晶片裝置140於一幀中的長時間垂直消隱模式LVM的時間長度大於700微秒。In some embodiments, the duration of the horizontal synchronization signal Hsync in the first phase (display phase) T1 of a cycle is greater than the scanning time of at least one gate line (for example, in the first phase T1 in FIG. 6 , the horizontal synchronization signal Hsync has a plurality of pulses, each pulse representing the scanning action of the gate drive circuit GOA on a gate line), and the duration of the horizontal synchronization signal Hsync in the second phase T2 of the cycle is in the range of 100 to 600 microseconds. In some embodiments, the duration of the long vertical blanking mode LVM of the single-chip device 140 in a frame is greater than 700 microseconds.
在第6圖的實施例中,單晶片裝置140提供的控制訊號CS1a於一幀當中維持在高邏輯位準HH,以控制第一開關組120中的開關導通,使共電極電壓VCOM經由第一開關組120傳送至電極陣列110,從而在一幀當中穩定電極陣列110的電極塊(例如,電極塊112~118)的電位於共電極電位DC-VCOM,進而提升畫面均勻度。In the embodiment of FIG. 6 , the control signal CS1a provided by the single-chip device 140 is maintained at a high logic level HH in one frame to control the switch in the first switch group 120 to be turned on, so that the common electrode voltage VCOM is transmitted to the
單晶片裝置140依據水平同步訊號Hsync產生控制訊號CS2a。於長時間水平消隱模式LHM下,CS2a具有多個脈衝。在長時間水平消隱模式LHM下的第一階段T1中,控制訊號CS2a具有高邏輯位準HH,以控制第二開關組130中的開關導通,使共電極電壓VCOM經由第一開關組120以及第二開關組130傳送至電極陣列110,從而在畫素陣列PIX的作動期間,重置並穩定電極陣列110的電極塊(例如,電極塊112~118)的電位於共電極電位DC-VCOM,進而提升畫面均勻度。The single chip device 140 generates a control signal CS2a according to the horizontal synchronization signal Hsync. In the long horizontal blanking mode LHM, CS2a has a plurality of pulses. In the first stage T1 of the long horizontal blanking mode LHM, the control signal CS2a has a high logic level HH to control the switch in the second switch group 130 to be turned on, so that the common electrode voltage VCOM is transmitted to the
在第7圖的實施例中,單晶片裝置140提供的控制訊號CS2b於一幀當中維持在高邏輯位準HH,以控制第二開關組130中的開關導通,使共電極電壓VCOM經由第二開關組130傳送至電極陣列110,從而在一幀當中穩定電極陣列110的電極塊(例如,電極塊112~118)的電位於共電極電位DC-VCOM,進而提升畫面均勻度。In the embodiment of FIG. 7 , the control signal CS2b provided by the single-chip device 140 is maintained at a high logic level HH in one frame to control the switch in the second switch group 130 to be turned on, so that the common electrode voltage VCOM is transmitted to the
單晶片裝置140依據水平同步訊號Hsync產生控制訊號CS1b。於長時間水平消隱模式LHM下,CS1b具有多個脈衝。在長時間水平消隱模式LHM下的第一階段T1中,控制訊號CS1b具有高邏輯位準HH,以控制第一開關組120中的開關導通,使共電極電壓VCOM經由第一開關組120傳送至電極陣列110,從而在畫素陣列PIX的作動期間,重置並穩定電極陣列110的電極塊(例如,電極塊112~118)的電位於共電極電位DC-VCOM,進而提升畫面均勻度。The single chip device 140 generates a control signal CS1b according to the horizontal synchronization signal Hsync. In the long horizontal blanking mode LHM, CS1b has a plurality of pulses. In the first stage T1 of the long horizontal blanking mode LHM, the control signal CS1b has a high logic level HH to control the switch in the first switch group 120 to be turned on, so that the common electrode voltage VCOM is transmitted to the
在第8圖的實施例中,在畫素陣列PIX的作動期間,單晶片裝置140提供具有致能位準(例如,高邏輯位準HH)的電位作為控制訊號CS1c以及CS2c,以依據控制訊號CS1c以及CS2c控制第一開關組120以及第二開關組130導通並將共電極電壓VCOM傳送至電極陣列110,從而在畫素陣列PIX的作動期間,穩定電極陣列110的電極塊(例如,112~118)的電位於共電極電位DC-VCOM,進而提升畫面均勻度。In the embodiment of FIG. 8 , during the operation of the pixel array PIX, the single chip device 140 provides a potential having an enable level (e.g., a high logic level HH) as control signals CS1c and CS2c, so as to control the first switch group 120 and the second switch group 130 to be turned on and transmit the common electrode voltage VCOM to the
請參閱第1圖以及第9圖。第9圖為依據本揭示文件的一些實施例所繪示的基板SUBb的示意圖。在一些實施例中,第1圖中顯示面板100的基板SUBa可由第9圖中的基板SUBb實施。Please refer to FIG. 1 and FIG. 9. FIG. 9 is a schematic diagram of a substrate SUBb according to some embodiments of the present disclosure. In some embodiments, the substrate SUBa of the display panel 100 in FIG. 1 can be implemented by the substrate SUBb in FIG. 9.
與第4圖之實施例中的基板SUBa相較,第9圖之實施例中基板SUBb不同之處在於,不設置第二開關組130。具體而言,電極陣列110中的電極塊112~118經由傳輸線L1~L4連接至測試接墊32以及33的走線,並且測試接墊32以及33的走線用以接收共電極電壓VCOM,以經由傳輸線L1~L4傳送共電極電壓VCOM的電位至電極塊112~118。Compared with the substrate SUBa in the embodiment of FIG. 4, the substrate SUBb in the embodiment of FIG. 9 is different in that the second switch group 130 is not provided. Specifically, the electrode blocks 112-118 in the
在一些實施例中,若顯示面板100用作於觸控顯示面板,電極陣列110直接電性連接至共電極VCOM的走線的路徑須被切斷。In some embodiments, if the display panel 100 is used as a touch display panel, the path of the
為了切斷電極陣列110直接電性連接至共電極VCOM的走線的路徑,可依據雷射切割標記61~62沿水平軸向切割傳輸線L1~L4至測試接墊32以及33的走線之間的電路路徑,並且搭配觸控顯示驅動晶片將電極陣列110作為觸控電極陣列使用。In order to cut off the path of the
在一些實施例中,若顯示面板100用作於純顯示面板,可保留傳輸線L1~L4與測試接墊32以及33的走線之間的電路路徑,從而自測試接墊32以及33的走線傳送共電極電壓VCOM至電極陣列110,並且搭配純顯示晶片使用。於基板SUBb的其他細部連接關係與作動方式,大致相同於先前第4圖之實施例中基板SUBa,在此不另贅述。In some embodiments, if the display panel 100 is used as a pure display panel, the circuit paths between the transmission lines L1-L4 and the wiring of the test pads 32 and 33 can be retained, so as to transmit the common electrode voltage VCOM from the wiring of the test pads 32 and 33 to the
請參閱第10A圖以及第10B圖,第10A為依據本揭示文件的一些實施例所繪示第1圖中的顯示面板100的疊構圖的示意圖。第10B為依據其他實施例所繪示的顯示面板的疊構圖的示意圖。Please refer to FIG. 10A and FIG. 10B. FIG. 10A is a schematic diagram showing a stacked structure of the display panel 100 in FIG. 1 according to some embodiments of the present disclosure. FIG. 10B is a schematic diagram showing a stacked structure of a display panel according to other embodiments.
如第10A圖所示,顯示面板100包含偏光層PL、玻璃基板GL、濾光層LC、電極陣列110以及畫素陣列AR。第10A圖中的畫素陣列AR對應於第1圖的顯示面板100的畫素陣列PIX。第10A圖中的電極陣列110對應於第4圖以及第9圖的基板SUBa或SUBb上的電極陣列110。在這樣的情形中,在畫素陣列PIX的作動期間,由前述實施例中的作動方式穩定電極陣列110的電位,使電極陣列110的電極塊(例如,電極塊112、114、116以及118)可作為純顯示面板的共電極使用,從而提升顯示面板100的顯示畫面的均勻度。As shown in FIG. 10A , the display panel 100 includes a polarizing layer PL, a glass substrate GL, a filter layer LC, an
綜上所述,本揭示文件將顯示面板100中的部分接墊設置為浮接接墊,從而將具有電極陣列110的顯示面板100用作於純顯示面板。進一步而言,顯示面板100透過控制第一開關組120以及/或第二開關組130的開關導通,以傳送共電極電壓VCOM至電極陣列110,進而提升顯示面板100的顯示畫面的均勻度。In summary, the present disclosure sets some pads in the display panel 100 as floating pads, so that the display panel 100 having the
雖然本揭露已以實施方式揭露如上,然其並非用以限定本揭露,任何本領域通具通常知識者,在不脫離本揭露之精神和範圍內,當可作各種之更動與潤飾,因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。Although the present disclosure has been disclosed in the above implementation form, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be determined by the scope of the attached patent application.
為使本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附符號之說明如下 11~14:觸控接墊 21~22,31,50:接墊 40:顯示接墊 32~35:測試接墊 100:顯示面板 110:電極陣列 120:第一開關組 130:第二開關組 140:單晶片裝置 Vsync:垂直同步訊號 Hsync:水平同步訊號 LHM:長時間水平消隱模式 LVM:長時間垂直消隱模式 HL:高邏輯位準 LL:低邏輯位準 STP1~STP4:第一開關 SCT1~SCT4:第二開關 SUBa,SUBb:基板 SB11,SB12,SB21,SB22:畫素 LCL:液晶層 PE:畫素電極 CE:共電極 Cst:畫素電容 PIX:畫素陣列 G1~G3:閘極線 D1~D3:資料線 L1~L4:傳輸線 TPIN:觸控接腳 DPIN:顯示接腳 IPIN:輸入接腳 TDDI:觸控與顯示驅動集成晶片 TED:時序控制器嵌入式驅動器 CS1,CS2:控制訊號 GOA:閘極驅動電路 FPC:軟性印刷電路板 PCBA:印刷電路板組件 PMIC:電源管理積體電路 VCOM:共電極電壓 PL:偏光層 GL:玻璃基板 LC:濾光層 ITO:導電層 AR:畫素陣列 In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more clearly understandable, the attached symbols are explained as follows 11~14: touch pads 21~22,31,50: pads 40: display pads 32~35: test pads 100: display panel 110: electrode array 120: first switch group 130: second switch group 140: single chip device Vsync: vertical synchronization signal Hsync: horizontal synchronization signal LHM: long time horizontal blanking mode LVM: long time vertical blanking mode HL: high logic level LL: low logic level STP1~STP4: first switch SCT1~SCT4: second switch SUBa,SUBb:substrate SB11,SB12,SB21,SB22:pixel LCL:liquid crystal layer PE:pixel electrode CE:common electrode Cst:pixel capacitor PIX:pixel array G1~G3:gate line D1~D3:data line L1~L4:transmission line TPIN:touch pin DPIN:display pin IPIN:input pin TDDI:touch and display driver integrated chip TED:timing controller embedded driver CS1,CS2:control signal GOA:gate driver circuit FPC:flexible printed circuit board PCBA:printed circuit board assembly PMIC:power management integrated circuit VCOM: common electrode voltage PL: polarizing layer GL: glass substrate LC: filter layer ITO: conductive layer AR: pixel array
為使本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖為依據本揭示文件的一些實施例所繪示的顯示面板的示意圖。 第2圖為依據本揭示文件的一些實施例所繪示第1圖的畫素陣列中的畫素的示意圖。 第3圖為依據本揭示文件的一些實施例所繪示的基板的示意圖。 第4圖為依據本揭示文件的一些實施例所繪示的基板的示意圖。 第5A圖為依據本揭示文件的一些實施例所繪示的觸控與顯示驅動集成晶片的接腳的示意圖。 第5B圖為依據本揭示文件的一些實施例所繪示的時序控制器嵌入式驅動器的接腳的示意圖。 第6圖至第8圖為依據本揭示文件的一些實施例所繪示在單晶片裝置由純顯示晶片實施的情形下的水平同步訊號、垂直同步訊號以及控制訊號的時序的示意圖。 第9圖為依據本揭示文件的一些實施例所繪示的基板的示意圖。 第10A圖為依據本揭示文件的一些實施例所繪示第1圖中的顯示面板的疊構圖的示意圖。 第10B為依據其他實施例所繪示的顯示面板的疊構圖的示意圖。 In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more clearly understandable, the attached drawings are described as follows: Figure 1 is a schematic diagram of a display panel drawn according to some embodiments of the present disclosure. Figure 2 is a schematic diagram of a pixel in a pixel array of Figure 1 drawn according to some embodiments of the present disclosure. Figure 3 is a schematic diagram of a substrate drawn according to some embodiments of the present disclosure. Figure 4 is a schematic diagram of a substrate drawn according to some embodiments of the present disclosure. Figure 5A is a schematic diagram of the pins of a touch and display driver integrated chip drawn according to some embodiments of the present disclosure. Figure 5B is a schematic diagram of the pins of a timing controller embedded driver drawn according to some embodiments of the present disclosure. Figures 6 to 8 are schematic diagrams of the timing of horizontal synchronization signals, vertical synchronization signals, and control signals when a single-chip device is implemented by a pure display chip according to some embodiments of the present disclosure. Figure 9 is a schematic diagram of a substrate according to some embodiments of the present disclosure. Figure 10A is a schematic diagram of a stacked configuration of a display panel in Figure 1 according to some embodiments of the present disclosure. Figure 10B is a schematic diagram of a stacked configuration of a display panel according to other embodiments.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None
32~35:測試接腳 32~35: Test pins
100:顯示面板 100: Display panel
110:電極陣列 110:Electrode array
120:第一開關組 120: First switch group
130:第二開關組 130: Second switch group
140:單晶片裝置 140: Single chip device
SUBa:基板 SUBa: Substrate
PIX:畫素陣列 PIX: Pixel array
G1~G3:閘極線 G1~G3: Gate line
D1~D3:資料線 D1~D3: Data line
L1~L4:傳輸線 L1~L4: Transmission line
GOA:閘極驅動電路 GOA: Gate-Actuating Circuit
FPC:軟性印刷電路板 FPC: Flexible Printed Circuit Board
PCBA:印刷電路板組件 PCBA: Printed Circuit Board Assembly
PMIC:電源管理積體電路 PMIC: Power Management Integrated Circuit
VCOM:共電極電壓 VCOM: common electrode voltage
Claims (10)
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| TW111139117A TWI848399B (en) | 2022-10-14 | 2022-10-14 | Display panel |
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| TW111139117A TWI848399B (en) | 2022-10-14 | 2022-10-14 | Display panel |
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| TW202416101A TW202416101A (en) | 2024-04-16 |
| TWI848399B true TWI848399B (en) | 2024-07-11 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150009179A1 (en) * | 2012-02-28 | 2015-01-08 | Crucialtec Co., Ltd. | Touch detection method and touch detection apparatus having built up linearity |
| US20160170546A1 (en) * | 2014-08-15 | 2016-06-16 | Apex Material Technology Corp. | TOUCH SENSITIVE DEVICE, SYSTEM and METHOD THEREOF |
| US10671209B2 (en) * | 2018-06-12 | 2020-06-02 | Au Optronics Corporation | Touch device and method of driving touch device |
| US20210034215A1 (en) * | 2019-07-31 | 2021-02-04 | Innolux Corporation | Electronic device |
| US20210181916A1 (en) * | 2019-12-11 | 2021-06-17 | Lg Display Co., Ltd. | Touch display device |
-
2022
- 2022-10-14 TW TW111139117A patent/TWI848399B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150009179A1 (en) * | 2012-02-28 | 2015-01-08 | Crucialtec Co., Ltd. | Touch detection method and touch detection apparatus having built up linearity |
| US20160170546A1 (en) * | 2014-08-15 | 2016-06-16 | Apex Material Technology Corp. | TOUCH SENSITIVE DEVICE, SYSTEM and METHOD THEREOF |
| US10671209B2 (en) * | 2018-06-12 | 2020-06-02 | Au Optronics Corporation | Touch device and method of driving touch device |
| US20210034215A1 (en) * | 2019-07-31 | 2021-02-04 | Innolux Corporation | Electronic device |
| US20210181916A1 (en) * | 2019-12-11 | 2021-06-17 | Lg Display Co., Ltd. | Touch display device |
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| TW202416101A (en) | 2024-04-16 |
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