TWI848391B - Automatic correction device and method for robotic arm - Google Patents

Abstract

The present invention relates to a robot arm automatic correction device and method thereof, the main structure of which includes a robot arm, an optical camera mechanism disposed on the robot arm, a wafer storage mechanism disposed on one side of the robot arm, an image information code disposed on the wafer storage mechanism, the optical camera mechanism information is connected to an optical recognition module, and the optical recognition module has an information code analysis unit, an object distance analysis unit, and a wafer center analysis unit. Thus, the user can firstly use the optical camera mechanism to shoot the image information code to perform the first position correction of the robot arm, and then let the optical camera mechanism shoot the wafer and perform the focusing action, so as to calculate the distance between the robot arm and the center point of the wafer through the object distance analysis unit and the wafer center analysis unit, so as to achieve the effect of the second correction. In this way, quick and accurate correction can be achieved.

Description

Automatic correction device and method for robotic arm

The present invention provides a robot arm automatic correction device and method with fast and accurate correction action.

Since the structure and manufacturing of semiconductor wafers are very precise, the requirements for storage and transportation are also high. When storing wafers, they are placed and stored in special storage carriers to match various types of storage environments, such as vacuum storage or inert gas storage. When transporting, in addition to directly transporting the carrier, the wafer can also be opened and taken out. However, when taking out the internal wafer, most of them will use a robotic arm to take and place to prevent fragmentation or damage during transportation.

However, before the robot can pick and place, it must first completely locate the distance between the robot and the wafer carrier, so that it can correctly perform the pick and place action. The positioning action can be divided into automatic or manual methods to perform the pick and place action. If it is manual, the user can provide relevant distance information through visual inspection or mechanical measurement to assist the user in the positioning action of the robot. If the robot is automated, multiple sensors are used in conjunction with various types of measurements to correctly allow the robot to perform positioning actions.

If the positioning action is not accurate enough, various situations may occur when the robot arm picks and places, increasing the probability of defective products. However, if the positioning action is to be performed correctly, multiple sensors are required to cooperate with each other, which will increase the cost of use.

Therefore, how to solve the above-mentioned problems and deficiencies in usage is the direction that the applicant of this invention and related manufacturers engaged in this industry are eager to study and improve.

Therefore, in view of the above-mentioned deficiencies, the creator of this invention has collected relevant information, evaluated and considered various aspects, and used the years of experience accumulated in this industry, and after continuous trials and modifications, he finally designed this kind of automatic correction device for a robotic arm that uses a simple mechanism to achieve a complete correction action and the invention patent of the method thereof.

The main purpose of the present invention is to achieve a simple and accurate correction effect using an optical photography mechanism.

To achieve the above purpose, the main structure of the present invention includes: a robot arm, a wafer storage mechanism disposed at one side of the robot arm, an image information code disposed on the wafer storage mechanism, an optical camera mechanism disposed on the robot arm, an optical recognition module connected to the optical camera mechanism, an information code analysis unit disposed in the optical recognition module, an object distance analysis unit disposed in the optical recognition module, and a wafer center analysis unit disposed in the optical recognition module.

With the above structure, when the user wants to use the robot to take out the wafer, the robot can automatically perform the correction action. First, the image information code is photographed by the optical photography mechanism, and the image information code is analyzed by the information code analysis unit to obtain the relevant position information, so that the robot can perform the first correction action.

When the first correction is performed, the approximate position of the wafer storage mechanism can be known. At this time, the optical camera mechanism is focused on one of the wafers in the wafer storage mechanism, and the object distance resolution unit can be used to calculate the wafer distance between the optical camera mechanism and the wafer through the focal length of the lens in the optical camera mechanism and the distance between the lens and the photosensitive imaging position in the optical camera mechanism. After the wafer distance is calculated, the wafer center analysis unit uses the distance between the robot arm and the optical camera mechanism, the wafer distance, and the wafer width to calculate the distance between the robot arm and the center point of the wafer, thereby achieving a second correction action to achieve a complete correction effect, and then the wafer pick-up and placement action can be performed.

In this way, the robot arm can quickly and accurately complete the correction action through the above method, and it can be achieved only by using the filmed action, so that a complete and fast correction action can be achieved at a relatively low cost.

Through the above technology, the problem of high cost or low accuracy of the correction method used can be overcome, and the practical progress of the above advantages can be achieved.

1:Robotic arm

11: Warp sensor

12: Distance sensor

2: Wafer storage mechanism

21: Image information code

3: Optical photography mechanism

4: Optical identification module

41: Information code analysis unit

42: Object distance analysis unit

43: Wafer center analysis unit

W: Wafer

x: vertical distance

y: distance

o: Wafer distance

The first figure is a three-dimensional perspective view of a preferred embodiment of the present invention.

The second figure is a schematic diagram of the structural block of a preferred embodiment of the present invention.

The third figure is a step flow chart of a preferred embodiment of the present invention.

The fourth figure is a schematic diagram of the shooting of a preferred embodiment of the present invention.

The fifth figure is a schematic diagram of the focal length of a preferred embodiment of the present invention.

Figure 6 is a schematic diagram of the center calculation of the preferred embodiment of the present invention.

Figure 7 is a three-dimensional perspective view of another preferred embodiment of the present invention.

Figure 8 is a step flow chart of another preferred embodiment of the present invention.

Figure 9 is a schematic diagram of warp detection in another preferred embodiment of the present invention.

Figure 10 is a three-dimensional perspective view of another preferred embodiment of the present invention.

Figure 11 is a step flow chart of another preferred embodiment of the present invention.

Figure 12 is a schematic diagram of spacing detection of another preferred embodiment of the present invention.

Figure 13 is a three-dimensional perspective view of another preferred embodiment of the present invention.

Figure 14 is a step flow chart of another preferred embodiment of the present invention.

In order to achieve the above-mentioned purpose and effect, the technical means and structure adopted by the present invention are described in detail in the following figure for the preferred embodiment of the present invention, and its features and functions are explained for complete understanding.

Please refer to the first to sixth figures, which are three-dimensional perspective diagrams to center calculation schematic diagrams of the preferred embodiments of the present invention. It can be clearly seen from the figures that the present invention includes:

A robot arm 1, for example, a robot arm 1 that can be controlled by a computer and is used to pick up, place and move wafers;

A wafer storage mechanism 2 is provided at one side of the robot arm 1, and a storage device for storing wafers is used as an example;

An image information code 21 set on the wafer storage mechanism 2, using QR CODE as an example;

An optical camera mechanism 3 is arranged on the robot arm 1. The optical camera mechanism 3 of this embodiment is a camera using a charge-coupled device (CCD);

An optical recognition module 4 connected to the optical camera mechanism 3 and the robot arm 1, and a processor connected to the optical camera mechanism 3 and receiving the captured images is used as an example;

An information code analysis unit 41 disposed in the optical recognition module 4;

An object distance analysis unit 42 disposed in the optical recognition module 4; and

A wafer center analysis unit 43 is provided in the optical recognition module 4. The information code analysis unit 41, the object distance analysis unit 42, and the wafer center analysis unit 43 of this embodiment are all based on the software in the optical recognition module 4 as an example.

Through the above explanation, we can understand the structure of this technology. According to the corresponding coordination of this structure, we can achieve the advantage of fast and accurate correction at a lower cost. The detailed explanation will be given below.

The automatic correction method of the robot arm of the present invention includes the following steps:

(a) Image capture: using an optical photography mechanism 3 on a robot arm 1 to capture an image information code 21 on a wafer storage mechanism 2;

(b) First correction action: An information code analysis unit 41 in an optical recognition module 4 analyzes the image information code 21 to obtain relevant position information, so that the robot arm 1 performs the first correction action;

(c) Focusing on the wafer: using the optical camera mechanism 3 to photograph and focus on one of the wafers in the wafer storage mechanism 2;

(d) Wafer distance calculation: using an object distance analysis unit 42 in the optical recognition module 4, the wafer distance between the optical photography mechanism 3 and the wafer is calculated through the focal length of the lens in the optical photography mechanism 3 and the distance between the lens and the photosensitive imaging position in the optical photography mechanism 3;

(e) Second correction action: After calculating the wafer distance, a wafer center analysis unit 43 is used to calculate the distance between the robot arm 1 and the center point of the wafer through the distance between the robot arm 1 and the optical camera mechanism 3, the wafer distance, and the width of the wafer to achieve the second correction action; and

(f) Wafer clamping: The distance between the robot arm 1 and the center point of the wafer is used to control the robot arm 1 to perform the wafer clamping action.

From the above steps, it can be known that the user can first set the image information code 21 on the wafer storage mechanism 2, and when the robot arm 1 is used to clamp the wafer, it is necessary to perform a correction action first to accurately clamp the wafer in the wafer storage mechanism 2.

In this way, the optical camera mechanism 3 can be used to shoot the image information code 21, and the image information code 21 can be analyzed by the information code analysis unit 41 in the optical recognition module 4 to obtain relevant position information (such as the relative direction of the wafer storage mechanism 2 to the robot arm 1), thereby performing the first correction action.

After the first correction, the approximate position of the wafer storage mechanism 2 can be determined, so that the optical photography mechanism 3 can be used to photograph the wafers in the wafer storage mechanism 2 and focus on the wafer to be taken out. At this time, the object distance analysis unit 42 can perform calculation and analysis through the thin lens imaging formula (l/o+l/i=l/f), which is a mathematical formula that already exists.

The calculation method can be combined with the fifth figure, where the distance between the lens in the optical photographic mechanism 3 and the object (wafer) to be focused is o, the distance between the lens in the optical photographic mechanism 3 and the photosensitive imaging position in the optical photographic mechanism 3 is i, and the focal length of the lens in the optical photographic mechanism 3 is f. The focal length (f) of the lens in the optical photographic mechanism 3 is a known value when the lens is installed or purchased, and the focal length (f) of the lens in the optical photographic mechanism 3 is f. The distance (i) between the lens and the photosensitive imaging position in the optical photographic mechanism 3 is the distance that can be known after focusing. In this way, the distance o between the lens in the optical photographic mechanism 3 and the focused object (wafer) can be calculated by the above formula. Since the lens is at the front end of the optical photographic mechanism 3, it can be directly used as the distance between the optical photographic mechanism 3 and the wafer, and is defined as the wafer distance o in this case.

After the wafer distance is calculated, as shown in FIG. 6, since the optical camera mechanism 3 is directly installed on the upper side of the robot arm 1, the vertical distance x between the optical camera mechanism 3 and the robot arm 1 can be directly known. In this way, the wafer center analysis unit 43 can first calculate the wafer center through the calculation method of the Bethesda theorem ( ^x2 + ^y2 = ^o2 ), calculate the distance y from the robot arm 1 to the edge of the wafer (i.e., the position point where the optical camera mechanism 3 focuses), and since the radius (d) of the wafer is known data before grabbing, but it is not limited, when the optical camera mechanism 3 shoots the image information code 21 to obtain the relevant position information, the radius (d) of the wafer can be read and obtained at the same time, and transmitted to the wafer center analysis unit 43. In this way, the distance y from the robot arm 1 to the edge of the wafer is added to the radius (d) of the wafer, and the distance between the robot arm 1 and the center point of the wafer can be obtained, thereby achieving the second correction effect.

After the above two corrections, the robot arm 1 can automatically calculate the distance between the robot arm 1 and the center point of the wafer to perform the clamping action. The entire correction process can be completed by an optical camera mechanism 3 with an image information code 21 and then calculated by an optical recognition module 4. In this way, the cost saving effect can be achieved through a simple structure, and the overall action can be completed by shooting the action and performing related calculations, which can also greatly improve the time and efficiency of correction.

Please also refer to Figures 7 to 9, which are three-dimensional perspective views to warp detection schematic views of another preferred embodiment of the present invention. It can be clearly seen from the figures that this embodiment is similar to the above-mentioned embodiment, except that a warp sensor 11 is provided on the robot arm 1, and the warp sensor 11 of this embodiment is exemplified by a laser sensor.

The steps of this embodiment include: (a) image shooting: using an optical camera mechanism on a robot arm 1 to shoot an image information code on a wafer storage mechanism 2; (b) first correction action: parsing the image information code through an information code parsing unit in an optical recognition module to obtain relevant position information, so that the robot arm 1 performs the first correction action; (c) focusing the wafer: using the optical camera mechanism to shoot and focus on one of the wafers in the wafer storage mechanism 2; (d) wafer distance calculation: using an object distance parsing unit in the optical recognition module to calculate the distance between the lens in the optical camera mechanism and the distance between the lens and the optical camera mechanism. The distance between the optical camera mechanism and the wafer is calculated by the distance between the photosensitive imaging position; (e) the second correction action: after calculating the wafer distance, a wafer center analysis unit is used to calculate the distance between the robot arm 1 and the optical camera mechanism, the wafer distance, and the width of the wafer to achieve the second correction action; (f) wafer clamping: through the distance between the robot arm 1 and the center point of the wafer, the robot arm 1 is controlled to perform the wafer clamping action; and (g) warp detection: through a warp sensor 11 on the robot arm 1, the warp condition of the wafer is detected.

As can be seen from the above embodiment, the distance from the robot arm 1 to the center of the wafer has been calculated. By adding the radius of the last wafer W to this distance, the distance from the robot arm 1 to the bottom of the wafer storage mechanism 2 can be roughly estimated. If the length measured after the laser emitted by the warp sensor 11 rebounds is less than the above distance, it can be determined that the wafer W has blocked the laser path of the warp sensor 11 due to the warp condition, thereby reducing the possibility of fragmentation caused by touching the warped part when clamping the wafer W.

Please also refer to Figures 10 to 12, which are three-dimensional perspective views and distance detection schematic views of another preferred embodiment of the present invention. It can be clearly seen from the figures that this embodiment is similar to the above embodiment, except that a distance sensor 12 is provided on the robot arm 1, and the distance sensor 12 of this embodiment is a thin distance sensor as an example.

The steps of this embodiment include:

(a) Image capture: using an optical photography mechanism on a robot arm 1 to capture an image information code on a wafer storage mechanism;

(b) First correction action: An information code analysis unit in an optical recognition module analyzes the image information code to obtain relevant position information, so that the robot arm performs the first correction action;

(c) Focusing on the wafer: using the optical photography mechanism to photograph and focus on one of the wafers in the wafer storage mechanism 2;

(d) Wafer distance calculation: using an object distance analysis unit in the optical recognition module, the wafer distance between the optical photography mechanism and the wafer is calculated through the focal length of the lens in the optical photography mechanism and the distance between the lens and the photosensitive imaging position in the optical photography mechanism;

(e) Second correction action: After calculating the wafer distance, a wafer center analysis unit is used to calculate the distance between the robot arm 1 and the center point of the wafer through the distance between the robot arm and the optical camera mechanism, the wafer distance, and the width of the wafer to achieve the second correction action;

(f) Wafer clamping; controlling the robot arm 1 to clamp the wafer based on the distance between the robot arm 1 and the center point of the wafer; and

(g) Distance detection: A distance sensor 12 on the robot arm 1 is used to detect the distance between the wafer and the robot arm 1.

When the robot arm 1 extends into the wafer storage mechanism 2 to perform a clamping action, the distance between the upper and lower wafers W can be sensed by the distance sensor 12 to prevent collision caused by too small a distance.

Please also refer to Figures 13 and 14, which are three-dimensional perspective views and step flow charts of another preferred embodiment of the present invention. It can be clearly seen from the figures that this embodiment is similar to the above embodiment, except that a distance sensor 12 and a warp sensor 11 are provided on the robot arm 1 at the same time.

The steps of this embodiment include:

(a) Image capture: using an optical photography mechanism on a robot arm 1 to capture an image information code on a wafer storage mechanism;

(b) First correction action: An information code analysis unit in an optical recognition module analyzes the image information code to obtain relevant position information, so that the robot arm 1 performs the first correction action;

(c) Focusing on the wafer: using the optical photography mechanism to photograph and focus on one of the wafers in the wafer storage mechanism;

(d) Wafer distance calculation: using an object distance analysis unit in the optical recognition module, the wafer distance between the optical photography mechanism and the wafer is calculated through the focal length of the lens in the optical photography mechanism and the distance between the lens and the photosensitive imaging position in the optical photography mechanism;

(e) Second correction action: After calculating the wafer distance, a wafer center analysis unit is used to calculate the distance between the robot arm 1 and the center point of the wafer through the distance between the robot arm 1 and the optical camera mechanism, the wafer distance, and the width of the wafer to achieve the second correction action;

(f) Wafer clamping: controlling the robot arm 1 to clamp the wafer based on the distance between the robot arm 1 and the center point of the wafer; and

(g) Warp distance detection: The warp condition of the wafer is detected by a warp sensor 11 on the robot arm 1, and the distance between the wafer and the robot arm 1 is detected by a distance sensor 12 on the robot arm 1.

This allows the robot arm 1 of this case to have the effects of warp detection and distance detection at the same time, indicating that the warp sensor 11 and the distance sensor 12 can be set at the same time to improve the safety of this case when in use.

However, the above is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the contents of the present invention's specification and drawings should be included in the patent scope of the present invention and should be stated.

In summary, the robot arm automatic correction device and method of the present invention can achieve its effect and purpose when used. Therefore, the present invention is a practical invention. In order to meet the application requirements of invention patents, an application is filed in accordance with the law. I hope that the review committee will approve the present invention as soon as possible to protect the hard work of the creator. If the review committee of the Junju has any doubts, please feel free to write to give instructions. The creator will do his best to cooperate. I really appreciate the convenience.

1:Robotic arm

2: Wafer storage mechanism

21: Image information code

3: Optical photography mechanism

4: Optical identification module

Claims (10)

A robot arm automatic correction device mainly comprises: a robot arm; a wafer storage mechanism, which is arranged at one side of the robot arm; an image information code, which is arranged on the wafer storage mechanism; an optical photography mechanism, which is arranged on the robot arm; an optical recognition module, which is informationally connected to the optical photography mechanism and the robot arm; an information code analysis unit, which is arranged in the optical recognition module and is used to analyze the image information code to obtain relevant position information; an object distance analysis unit, which is arranged in the optical recognition module; The optical recognition module is connected to the information code analysis unit, and the object distance analysis unit calculates the wafer distance between the optical photography mechanism and the wafer in the wafer storage mechanism through the focal length of the lens in the optical photography mechanism and the distance between the lens and the photosensitive imaging position in the optical photography mechanism; and a wafer center analysis unit is arranged in the optical recognition module and connected to the information code analysis unit to calculate the distance between the robot arm and the center point of the wafer through the distance between the robot arm and the optical photography mechanism, the wafer distance, and the width of the wafer. As described in Item 1 of the patent application scope, the robot arm is provided with a warp sensor. As described in Item 1 of the patent application scope, the robotic arm automatic correction device, wherein the robotic arm is provided with a distance sensor. As described in Item 1 of the patent application scope, the robotic arm automatic correction device, wherein the object distance analysis unit performs calculation and analysis through the thin lens imaging formula. As described in Item 1 of the patent application, the robotic arm automatic correction device, wherein the wafer center analysis unit calculates the distance between the robotic arm and the center point of the wafer by using the Pisces theorem. A method for automatic correction of a robot arm includes the following steps: (a) using an optical camera mechanism on a robot arm to photograph an image information code on a wafer storage mechanism; (b) using an information code analysis unit in an optical recognition module to analyze the image information code to obtain relevant position information, so that the robot arm performs a first correction action; (c) using the optical camera mechanism to photograph and focus on one of the wafers in the wafer storage mechanism; (d) using an object distance analysis unit in the optical recognition module to analyze the image information code through a lens in the optical camera mechanism. (e) after calculating the wafer distance, a wafer center analysis unit is used to calculate the distance between the robot arm and the optical camera mechanism, the wafer distance, and the width of the wafer to achieve a second correction action; and (f) the robot arm is controlled to perform a wafer clamping action based on the distance between the robot arm and the wafer center. As described in Item 6 of the patent application scope, the robot arm automatic correction method, wherein step (g) is performed after step (f), and the warp condition of the wafer is detected by a warp sensor on the robot arm. As described in Item 6 of the patent application scope, the robot arm automatic correction method, wherein step (g) is performed after step (f), and a distance sensor on the robot arm is used to detect the distance between the wafer and the robot arm. As described in Item 6 of the patent application scope, the automatic correction method of the robotic arm, wherein the object distance analysis unit performs calculation and analysis through the thin lens imaging formula. As described in Item 6 of the patent application scope, the automatic correction method of the robot arm, wherein the wafer center analysis unit calculates the distance between the robot arm and the center point of the wafer by using the calculation method of the Pisces theorem.

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