TWI848175B - Laminated film and method for manufacturing the same - Google Patents
Laminated film and method for manufacturing the same Download PDFInfo
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- TWI848175B TWI848175B TW109129837A TW109129837A TWI848175B TW I848175 B TWI848175 B TW I848175B TW 109129837 A TW109129837 A TW 109129837A TW 109129837 A TW109129837 A TW 109129837A TW I848175 B TWI848175 B TW I848175B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
- B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
本發明提供一種積層薄膜,其係對於光學薄片表面之初期黏著力、黏著增強之抑制、加熱後之浮起之抑制及對於被黏體之污染之抑制的平衡極為優異。一種積層薄膜,其係在基材層(a)之一面上具有樹脂層(b)之積層薄膜,其中該樹脂層(b)為含有氫化共聚物組成物與增黏樹脂之樹脂組成物,該氫化共聚物組成物滿足下述(1)~(3), (1)氫化共聚物組成物係由以乙烯基芳香族單體單元為主體之聚合物嵌段與以共軛二烯單體單元為主體之聚合物嵌段所構成,以共軛二烯單體單元為主體之聚合物嵌段存在於末端; (2)氫化共聚物組成物整體之乙烯基芳香族單體單元之含量為5~30重量%; (3)氫化共聚物組成物之熔流速率為3~30g/10分鐘。The present invention provides a laminate film which has an excellent balance among initial adhesion to the surface of an optical sheet, suppression of adhesion enhancement, suppression of floating after heating, and suppression of contamination of an adherend. A laminate film having a resin layer (b) on one side of a substrate layer (a), wherein the resin layer (b) is a resin composition containing a hydrogenated copolymer composition and a tackifying resin, and the hydrogenated copolymer composition satisfies the following (1) to (3): (1) The hydrogenated copolymer composition is composed of a polymer block mainly composed of vinyl aromatic monomer units and a polymer block mainly composed of covalent diene monomer units, and the polymer block mainly composed of covalent diene monomer units is present at the end; (2) The content of vinyl aromatic monomer units in the hydrogenated copolymer composition as a whole is 5 to 30% by weight; (3) The melt flow rate of the hydrogenated copolymer composition is 3 to 30 g/10 minutes.
Description
本發明關於一種積層薄膜及其製造方法,該積層薄膜係對於光學薄片表面之初期黏著力、黏著增強之抑制、加熱後之浮起之抑制及對於被黏體之污染之抑制的平衡優異。The present invention relates to a laminated film and a method for manufacturing the same. The laminated film has an excellent balance among initial adhesion to the surface of an optical sheet, suppression of adhesion enhancement, suppression of floating after heating, and suppression of contamination of an adherend.
在包含合成樹脂、金屬、玻璃等各種素材的製品,係為了要防止加工步驟、輸送步驟、保管中所產生之損毀、污染,經常會貼上保護表面之材料來進行處理。保護表面之代表性材料為保護薄膜,一般係使用在支撐基材上形成有黏著層之積層薄膜,使黏著層面貼在被黏體而以支撐基材來覆蓋,藉此而保護表面者。又,對於該等積層薄膜,係要求黏著層與被黏體之黏著力為適當的強度。此適當強度係指不會自然地自己脫落或因輕微震動、衝擊即脫落的強度,且於剝離時不在被黏體表面殘留黏著層而可順利剝離的強度。Products made of synthetic resins, metals, glass, and other materials are often treated by applying materials to protect the surface in order to prevent damage and contamination during processing, transportation, and storage. The representative material for protecting the surface is a protective film, which is generally a laminated film with an adhesive layer formed on a supporting substrate. The adhesive layer is attached to the adherend and covered with the supporting substrate to protect the surface. In addition, for such laminated films, the adhesion between the adhesive layer and the adherend is required to be of appropriate strength. The appropriate strength refers to the strength that does not fall off naturally or due to slight vibration or impact, and the strength that does not leave any adhesive layer on the surface of the adherend and can be peeled off smoothly.
近年來,液晶顯示器、觸控面板顯示器持續普及,該等係由包含合成樹脂之許多的光學薄片等之構件所構成。該光學薄片係因為有極力減少光失真等缺點的必要,所以為了要防止會成為缺點之原因的損傷、污染,而常使用保護薄膜。In recent years, liquid crystal displays and touch panel displays have become increasingly popular, and they are made of a number of optical sheets containing synthetic resins. Since the optical sheets need to minimize defects such as light distortion, protective films are often used to prevent damage and contamination that may cause defects.
作為保護薄膜所要求之特性,可列舉:不會因溫度、濕度等之環境變化或承受些微應力的程度即從被黏體輕易剝離;不會有因時間及溫度等外在因素而增加被黏體與黏著劑層之間的接觸面積所造成之黏著力上升,即所謂的黏著增強;從被黏體剝離時黏著劑及黏著劑成分不會殘留在被黏體上等等。The properties required of a protective film include: it should not be easily peeled off from the adherend due to environmental changes such as temperature and humidity or the degree of slight stress; it should not have an increase in adhesion due to external factors such as time and temperature that increases the contact area between the adherend and the adhesive layer, which is the so-called adhesion enhancement; the adhesive and adhesive components should not remain on the adherend when peeled off, etc.
上述光學薄片之中,又於例如擴散板、稜鏡薄片,還有如稜鏡薄片背面上所形成之具有各種形狀之擴散面般在表面上具有凹凸之構件,在剛貼合保護薄膜後,黏著層對於凹凸部之追隨性不充分,無法獲得所期望的黏著力,會有剝離的情形。對於此類課題,已知道有使黏著層柔軟化的方法、使用增黏劑來提高黏著力的方法等。Among the optical sheets mentioned above, there are components with uneven surfaces such as diffusion plates, prism sheets, and diffusion surfaces with various shapes formed on the back of prism sheets. Immediately after the protective film is attached, the adhesive layer does not follow the uneven parts well, and the desired adhesive force cannot be obtained, resulting in peeling. For such issues, there are known methods of softening the adhesive layer and using a tackifier to increase the adhesive force.
在專利文獻1中,有記載黏著性樹脂組成物及使用其之保護薄膜。然而,此保護薄膜係在與被黏體貼合之後,若被加熱則產生局部剝離(亦有表現為浮起的情形),所以有大量含有增黏劑的必要,而若使黏著層大量含有增黏劑,則在剝離黏著薄膜之際,黏著層會變得容易殘留在被黏體表面,結果會有被黏體因為黏著層而受到污染的問題。Patent document 1 describes an adhesive resin composition and a protective film using the same. However, this protective film will partially peel off (or float up) if heated after being attached to an adherend, so it is necessary to contain a large amount of tackifier. If the adhesive layer contains a large amount of tackifier, the adhesive layer will easily remain on the surface of the adherend when the adhesive film is peeled off, resulting in the problem of contamination of the adherend by the adhesive layer.
在專利文獻2中,有記載一種特徵為含有共聚物或其氫化物(以下,有將氫化稱為加氫的時候)、與酸價為1~7之脂肪酸醯胺的黏著劑組成物以及表面保護薄膜。然而,由於與被黏體貼合之後,若被加熱則局部剝落,還有脂肪酸醯胺溢出(在製造薄膜時所使用之添加劑隨著時間的經過而於薄膜表面浮出的現象),因此有步驟和所製造之表面保護薄膜、甚至所貼合之被黏體也受到污染的問題。 [先前技術文獻] [專利文獻]Patent document 2 describes an adhesive composition and a surface protection film characterized by containing a copolymer or its hydrogenated product (hereinafter, hydrogenation is referred to as hydrogenation), a fatty acid amide with an acid value of 1 to 7. However, since the adhesive composition partially peels off when heated after being attached to an adherend, and the fatty acid amide overflows (the additive used in the film manufacturing floats on the film surface over time), there is a problem of contamination of the process, the manufactured surface protection film, and even the adherend to which the adhesive is attached. [Prior art document] [Patent document]
專利文獻1:國際公開第號2019/044637號 專利文獻2:日本特開2012-1630號公報Patent document 1: International Publication No. 2019/044637 Patent document 2: Japanese Patent Publication No. 2012-1630
[發明欲解決之課題][Problems to be solved by the invention]
本發明之課題係在於解決上述問題。亦即,在於提供一種積層薄膜,其係對於光學薄片表面之初期黏著力、黏著增強之抑制、加熱後之浮起之抑制及對於被黏體之污染之抑制的平衡極為優異。 [用以解決課題之手段]The subject of the present invention is to solve the above-mentioned problems. That is, to provide a laminated film that has an excellent balance in terms of initial adhesion to the surface of an optical sheet, suppression of adhesion enhancement, suppression of floating after heating, and suppression of contamination of the adherend. [Means for solving the subject]
上述課題可藉由以下之本發明來解決。The above problems can be solved by the following invention.
一種積層薄膜,其係在基材層(a)之一面上具有樹脂層(b)之積層薄膜,其中該樹脂層(b)為含有氫化共聚物組成物與增黏樹脂之樹脂組成物,該氫化共聚物組成物滿足下述(1)~(3), (1)氫化共聚物組成物係由以乙烯基芳香族單體單元為主體之聚合物嵌段與以共軛二烯單體單元為主體之聚合物嵌段所構成,以共軛二烯單體單元為主體之聚合物嵌段存在於末端; (2)氫化共聚物組成物整體之乙烯基芳香族單體單元之含量為5~30重量%; (3)氫化共聚物組成物之熔流速率為3~30g/10分鐘。 又,一種積層薄膜之製造方法,其係上述積層薄膜之製造方法,其中該基材層(a)、該樹脂層(b)係藉由熔融共壓出而形成。 [發明之效果]A laminate film having a resin layer (b) on one side of a substrate layer (a), wherein the resin layer (b) is a resin composition containing a hydrogenated copolymer composition and a tackifying resin, and the hydrogenated copolymer composition satisfies the following (1) to (3): (1) The hydrogenated copolymer composition is composed of a polymer block mainly composed of a vinyl aromatic monomer unit and a polymer block mainly composed of a covalent diene monomer unit, and the polymer block mainly composed of a covalent diene monomer unit is present at the end; (2) The content of the vinyl aromatic monomer unit in the hydrogenated copolymer composition as a whole is 5 to 30% by weight; (3) The melt flow rate of the hydrogenated copolymer composition is 3 to 30 g/10 minutes. In addition, a method for manufacturing a laminated film is the above-mentioned method for manufacturing a laminated film, wherein the substrate layer (a) and the resin layer (b) are formed by melt co-extrusion. [Effect of the invention]
藉由本發明,則可提供一種積層薄膜,其係對於光學薄片表面之初期黏著力、黏著增強之抑制、加熱後之浮起之抑制及對於被黏體之污染之抑制的平衡極為優異之積層薄膜。The present invention can provide a laminate film having an excellent balance among initial adhesion to the surface of an optical sheet, suppression of adhesion enhancement, suppression of floating after heating, and suppression of contamination of an adherend.
[用以實施發明的形態][Form used to implement the invention]
在本發明中,構成共聚物之各個單體單元的命名係依據該單體單元所由來之單體的命名。例如,所謂的「乙烯基芳香族單體單元」係意指將為單體之乙烯基芳香族化合物予以聚合之結果所產生之聚合物的構成單元。乙烯基芳香族單體單元係利用乙烯基芳香族化合物之乙烯基與其他單體單元鍵結。In the present invention, the naming of each monomer unit constituting the copolymer is based on the naming of the monomer from which the monomer unit is derived. For example, the so-called "vinyl aromatic monomer unit" means a constituent unit of a polymer produced by polymerizing a vinyl aromatic compound as a monomer. The vinyl aromatic monomer unit is bonded to other monomer units by the vinyl group of the vinyl aromatic compound.
又,所謂的「共軛二烯單體單元」係意指將為單體之共軛二烯化合物予以聚合之結果所產生之聚合物的構成單元。共軛二烯單體單元係利用共軛二烯化合物之2個雙鍵的其中之一與其他單體單元鍵結(1,2-鍵結或3,4-鍵結)、或者是利用共軛二烯化合物之2個雙鍵與其他單體單元鍵結(1,4-鍵結)。The so-called "conjugated diene monomer unit" refers to a constituent unit of a polymer produced as a result of polymerizing a conjugated diene compound as a monomer. The conjugated diene monomer unit is bonded to another monomer unit via one of the two double bonds of the conjugated diene compound (1,2-bonding or 3,4-bonding), or is bonded to another monomer unit via two double bonds of the conjugated diene compound (1,4-bonding).
作為構成「乙烯基芳香族單體單元」之「乙烯基芳香族化合物」,並非限定於以下所示者,但可列舉例如苯乙烯、α-甲基苯乙烯、對甲基苯乙烯、二乙烯基苯、1,1-二苯基乙烯、N,N-二甲基-對胺基乙基苯乙烯、N,N-二乙基-對胺基乙基苯乙烯等。該等之中,基於取得性及生產性的觀點,又較佳為α-甲基苯乙烯、對甲基苯乙烯。該等之中,又特佳為苯乙烯。該等係可單獨使用1種,也可合併使用2種以上。The "vinyl aromatic compound" constituting the "vinyl aromatic monomer unit" is not limited to those shown below, but examples thereof include styrene, α-methylstyrene, p-methylstyrene, divinylbenzene, 1,1-diphenylethylene, N,N-dimethyl-p-aminoethylstyrene, and N,N-diethyl-p-aminoethylstyrene. Among them, α-methylstyrene and p-methylstyrene are more preferred from the viewpoint of availability and productivity. Among them, styrene is particularly preferred. These may be used alone or in combination of two or more.
構成「共軛二烯單體單元」之「共軛二烯化合物」係具有一對共軛雙鍵的二烯烴。作為共軛二烯化合物,並未限定於以下所述者,但可列舉例如1,3-丁二烯、2-甲基-1,3-丁二烯(異戊二烯)、2,3-二甲基-1,3-丁二烯、1,3-戊二烯、2-甲基-1,3-戊二烯、1,3-己二烯、及菌綠烯。作為較佳的二烯烴,可列舉1,3-丁二烯、及異戊二烯。該等係可單獨使用1種,也可合併使用2種以上。The "conjugated diene compound" constituting the "conjugated diene monomer unit" is a diene having a pair of conjugated double bonds. The conjugated diene compound is not limited to those described below, but for example, 1,3-butadiene, 2-methyl-1,3-butadiene (isoprene), 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, 2-methyl-1,3-pentadiene, 1,3-hexadiene, and bacteriochloride can be listed. As preferred dienes, 1,3-butadiene and isoprene can be listed. These can be used alone or in combination of two or more.
在氫化共聚物組成物中較佳為使用偶合劑,但該偶合劑係使線性乙烯基芳香族共聚物鍵結成放射狀的多官能性化合物。作為偶合劑,並未特別限定,但可列舉例如多烯偶合劑等。作為較佳的多烯偶合劑,可列舉例如二乙烯基苯,較佳為鄰二乙烯基苯。又,作為偶合劑,也可列舉例如四乙氧基矽烷及四甲氧基矽烷等之四烷氧基矽烷、甲基三甲氧基矽烷等之烷基三烷氧基矽烷、二甲基二甲氧基矽烷等之二烷基二烷氧基矽烷、安息香酸乙酯和安息香酸甲酯等之羧酸酯化合物、以及由雙酚A與環氧氯丙烷之反應所衍生出之二縮水甘油基醚等之二縮水甘油基芳香族環氧化合物。It is preferred to use a coupling agent in the hydrogenated copolymer composition, but the coupling agent is a multifunctional compound that allows the linear vinyl aromatic copolymer to be bonded in a radial manner. The coupling agent is not particularly limited, but examples thereof include polyene coupling agents. Examples of preferred polyene coupling agents include divinylbenzene, preferably o-divinylbenzene. In addition, as coupling agents, there can be cited tetraalkoxysilanes such as tetraethoxysilane and tetramethoxysilane, alkyltrialkoxysilanes such as methyltrimethoxysilane, dialkyldialkoxysilanes such as dimethyldimethoxysilane, carboxylic acid ester compounds such as ethyl benzoate and methyl benzoate, and diglycidyl aromatic epoxy compounds such as diglycidyl ether derived from the reaction of bisphenol A and epichlorohydrin.
本發明之氫化共聚物組成物係包含以乙烯基芳香族單體單元為主體之聚合物嵌段、與以共軛二烯單體單元為主體之聚合物嵌段,且以共軛二烯單體單元為主體之聚合物嵌段存在於末端。亦即,在將以乙烯基芳香族單體單元為主體之聚合物嵌段當作A,且將以共軛二烯單體單元為主體之聚合物嵌段當作B之情形,為具有B-A-B之結構式者。再者,為具有藉由上述偶合劑而B-A-B-X之結構式及(B-A-B)之嵌段結構鍵結成放射狀的(B-A-B)nX(n=2~4)之結構式者。於此,X係所使用之偶合劑的殘基。可藉由將以共軛二烯單體單元為主體之聚合物嵌段配置在末端,而抑制加熱後之浮起。The hydrogenated copolymer composition of the present invention comprises a polymer block mainly composed of vinyl aromatic monomer units and a polymer block mainly composed of covalent diene monomer units, and the polymer block mainly composed of covalent diene monomer units is present at the end. That is, when the polymer block mainly composed of vinyl aromatic monomer units is regarded as A and the polymer block mainly composed of covalent diene monomer units is regarded as B, it has a structural formula of B-A-B. Furthermore, it has a structural formula of B-A-B-X and a structural formula of (B-A-B)nX (n=2~4) in which the block structural bonds of (B-A-B) are radially bonded by the above-mentioned coupling agent. Here, X is a residual group of the coupling agent used. By arranging a polymer block mainly composed of a conjugated diene monomer unit at the end, floating after heating can be suppressed.
本發明之氫化共聚物組成物中之乙烯基芳香族單體單元含量係以該組成物為基準,為5~30重量%,較佳為6~20重量%,更佳為8~12重量%。若乙烯基芳香族單體單元之含量超過30重量%,則初期黏著力降低,而乙烯基芳香族單體單元之含量小於5重量%之情形,黏著增強會惡化,或者是污染會惡化。The content of the vinyl aromatic monomer units in the hydrogenated copolymer composition of the present invention is 5 to 30% by weight, preferably 6 to 20% by weight, and more preferably 8 to 12% by weight, based on the composition. If the content of the vinyl aromatic monomer units exceeds 30% by weight, the initial adhesion is reduced, and if the content of the vinyl aromatic monomer units is less than 5% by weight, the adhesion enhancement is deteriorated or the contamination is deteriorated.
本發明之氫化共聚物組成物中之乙烯基芳香族單體單元含量係如後述之實施例所載,可藉由紫外分光光度計來測定。另外,乙烯基芳香族單體單元之含量係因為氫化前後幾乎相等,所以可利用氫化前之共聚物中之乙烯基芳香族單體單元之含量來掌握。The content of the vinyl aromatic monomer units in the hydrogenated copolymer composition of the present invention can be measured by an ultraviolet spectrophotometer as described in the examples below. In addition, the content of the vinyl aromatic monomer units is almost the same before and after hydrogenation, so it can be determined by the content of the vinyl aromatic monomer units in the copolymer before hydrogenation.
本發明之氫化共聚物組成物中所含共軛二烯單體單元之雙鍵的比例(以下,有稱為氫化率的情形)係較佳為81mol%以上,更佳為85mol%以上,進一步較佳為90mol%。如小於81mol%,則黏著增強會變大,或者是對於被黏體產生糊料殘留。The ratio of double bonds of the covalent diene monomer units contained in the hydrogenated copolymer composition of the present invention (hereinafter referred to as the hydrogenation rate) is preferably 81 mol% or more, more preferably 85 mol% or more, and further preferably 90 mol%. If it is less than 81 mol%, the adhesion enhancement will be greater, or paste residue will be generated on the adherend.
該氫化率係例如可藉由調整氫化時之觸媒量、添加氫量來控制。另外,氫化速度係例如可藉由調整氫化時之觸媒量、添加氫量、壓力及溫度等來控制。又,該氫化率係可藉由後述實施例中所載方法來測定。The hydrogenation rate can be controlled by, for example, adjusting the amount of catalyst and the amount of hydrogen added during hydrogenation. In addition, the hydrogenation rate can be controlled by, for example, adjusting the amount of catalyst and the amount of hydrogen added during hydrogenation, the pressure and the temperature. Furthermore, the hydrogenation rate can be measured by the method described in the embodiments described below.
本發明之氫化共聚物組成物之熔流速率(以下會有簡稱為「MFR」的情形,根據ISO 1133)係在溫度230℃、負重21.17N(2.16kgf)的條件下,為3~30g/10分鐘,較佳為5~20g/10分鐘,進一步較佳為6~16g/10分鐘。若MFR超過30g/10分鐘,則初期黏著力變強,且黏著增強大,也會產生糊料殘留。MFR小於3g/10分鐘之情形,會發生加熱後之浮起。氫化共聚物組成物之MFR係可藉由調整單體添加量、聚合時間、溫度、聚合起始劑等之聚合條件來控制,能夠依據後述實施例中所載方法來測定。The melt flow rate (hereinafter referred to as "MFR" according to ISO 1133) of the hydrogenated copolymer composition of the present invention is 3 to 30 g/10 minutes, preferably 5 to 20 g/10 minutes, and further preferably 6 to 16 g/10 minutes at a temperature of 230°C and a load of 21.17 N (2.16 kgf). If the MFR exceeds 30 g/10 minutes, the initial adhesion becomes stronger, and the adhesion is greatly enhanced, and paste residues will also be produced. If the MFR is less than 3 g/10 minutes, floating after heating will occur. The MFR of the hydrogenated copolymer composition can be controlled by adjusting the polymerization conditions such as the amount of monomer added, polymerization time, temperature, polymerization initiator, etc., and can be measured according to the method described in the embodiments described below.
本發明之樹脂層(b)係以提升初期黏著力為目的而包含增黏樹脂。只要是可將黏性賦予至本發明之積層薄膜的樹脂,則並未特別限定,例如較佳為從包含脂肪族系石油樹脂、芳香族系石油樹脂、脂肪族/芳香族系石油樹脂、脂環式系石油樹脂、萜烯系樹脂、萜烯苯酚系樹脂、松香系樹脂、烷基苯酚系樹脂及二甲苯系樹脂之群組中所選出之至少一個樹脂。又,也可以使用對該等的不飽和鍵進行了氫化的氫化物。進一步較佳為脂肪族系石油樹脂、芳香族系石油樹脂、脂肪族/芳香族系石油樹脂、脂環式系石油樹脂、萜烯系樹脂、萜烯苯酚系樹脂,最佳為是芳香族系石油樹脂、萜烯苯酚系樹脂。The resin layer (b) of the present invention contains a tackifying resin for the purpose of improving the initial adhesion. The resin is not particularly limited as long as it can impart viscosity to the laminated film of the present invention. For example, it is preferably at least one resin selected from the group consisting of aliphatic petroleum resins, aromatic petroleum resins, aliphatic/aromatic petroleum resins, alicyclic petroleum resins, terpene resins, terpene phenol resins, rosin resins, alkylphenol resins and xylene resins. In addition, hydrides obtained by hydrogenating the unsaturated bonds of these resins can also be used. More preferred are aliphatic petroleum resins, aromatic petroleum resins, aliphatic/aromatic petroleum resins, alicyclic petroleum resins, terpene resins, and terpene phenol resins, and most preferred are aromatic petroleum resins and terpene phenol resins.
增黏樹脂可單獨使用1種,也可以混合使用2種以上。本發明之樹脂層(b)之樹脂組成物中之增黏樹脂的含量係較佳為3~30重量%,更佳為5~20重量%。在增黏樹脂含量小於3重量%時,無法獲得所期望之初期黏著力,而當超過30重量%時,黏著增強會變大,對於被黏體產生糊料殘留。The tackifying resin may be used alone or in combination of two or more. The content of the tackifying resin in the resin composition of the resin layer (b) of the present invention is preferably 3 to 30% by weight, more preferably 5 to 20% by weight. When the tackifying resin content is less than 3% by weight, the desired initial adhesion cannot be obtained, and when it exceeds 30% by weight, the adhesion enhancement becomes greater, resulting in paste residue on the adherend.
本發明之樹脂層(b)之樹脂組成物,亦可相對於樹脂層(b)之樹脂組成物而以50重量%為上限,進一步含有具有上述之本發明之特定氫化共聚物組成物以外之結構的氫化苯乙烯系彈性體。The resin composition of the resin layer (b) of the present invention may further contain a hydrogenated styrene-based elastomer having a structure other than the above-mentioned specific hydrogenated copolymer composition of the present invention, with an upper limit of 50% by weight relative to the resin composition of the resin layer (b).
作為該氫化苯乙烯系彈性體,並未限定於以下所述者,但可列舉例如苯乙烯-丁二烯共聚物(SBR)、苯乙烯-異戊二烯-苯乙烯共聚物(SIS)、苯乙烯-丁二烯-苯乙烯共聚物(SBS)等之苯乙烯-共軛二烯系共聚物及該等之氫化物(例如,氫化苯乙烯-丁二烯共聚物(HSBR)和苯乙烯-乙烯-丁烯-苯乙烯共聚物(SEBS))、苯乙烯-異丁烯系共聚物(例如,苯乙烯-異丁烯-苯乙烯三嵌段共聚物(SIBS)和苯乙烯-異丁烯二嵌段共聚物(SIB)或該等之混合物),作為代表性的氫化苯乙烯系彈性體。The hydrogenated styrene elastomer is not limited to the following, but styrene-copolymers such as styrene-butadiene copolymers (SBR), styrene-isoprene-styrene copolymers (SIS), styrene-butadiene-styrene copolymers (SBS), and hydrogenated products thereof (e.g., hydrogenated styrene-butadiene copolymers (HSBR) and styrene-ethylene-butylene-styrene copolymers (SEBS)), and styrene-isobutylene copolymers (e.g., styrene-isobutylene-styrene triblock copolymers (SIBS) and styrene-isobutylene diblock copolymers (SIB) or mixtures thereof) can be cited as representative hydrogenated styrene elastomers.
於本發明之樹脂層(b)之樹脂組成物,亦可添加抗氧化劑、光安定劑等之安定劑。又,除了上述各種材料之外,也還可因應需要而添加各種添加劑。The resin composition of the resin layer (b) of the present invention may also contain stabilizers such as antioxidants and light stabilizers. In addition to the above-mentioned materials, various additives may also be added as needed.
作為該添加劑,並未限定於以下所述者,但可列舉例如赤鐵氧化物、二氧化鈦等之顏料、石蠟、微晶體蛋白、低分子量聚乙烯蠟等蠟類、無定形聚烯烴、乙烯-乙基丙烯酸酯共聚物等之聚烯烴或低分子量之乙烯基芳香族系熱塑性樹脂、天然橡膠、聚異戊二烯橡膠、聚丁二烯橡膠、苯乙烯-丁二烯橡膠、乙烯-丙烯橡膠、氯丁二烯橡膠、丙烯酸橡膠、異戊二烯-異丁烯橡膠、聚五聚物橡膠等之合成橡膠。The additive is not limited to the following, but includes, for example, pigments such as hematite and titanium dioxide, waxes such as wax, microcrystalline protein, low molecular weight polyethylene wax, amorphous polyolefin, polyolefin such as ethylene-ethyl acrylate copolymer, or low molecular weight vinyl aromatic thermoplastic resin, natural rubber, polyisoprene rubber, polybutadiene rubber, styrene-butadiene rubber, ethylene-propylene rubber, chloroprene rubber, acrylic rubber, isoprene-isobutylene rubber, polypentamer rubber, and other synthetic rubbers.
作為該合成橡膠,具體來說,可列舉「橡膠-塑膠配合藥品」(Rubber Digest公司編)等中所記載者。Specific examples of the synthetic rubber include those described in "Rubber-Plastic Compounding Products" (edited by Rubber Digest Co., Ltd.) and the like.
本發明之樹脂層(b)係作為包含上述之本發明之特定氫化共聚物組成物及增黏樹脂的樹脂組成物,而被積層形成在基材層(a)上。The resin layer (b) of the present invention is formed on the base layer (a) by being laminated as a resin composition comprising the specific hydrogenated copolymer composition of the present invention and a tackifying resin.
本發明之樹脂層(b)之厚度係較佳為1μm以上30μm以下,更佳為2μm以上20μm以下。若樹脂層(b)厚度超過30μm,則生產性會不安定,若小於1μm,則會有與被黏體之密接性惡化的情形。The thickness of the resin layer (b) of the present invention is preferably 1 μm to 30 μm, more preferably 2 μm to 20 μm. If the thickness of the resin layer (b) exceeds 30 μm, productivity will be unstable, and if it is less than 1 μm, the adhesion to the adherend may deteriorate.
作為本發明之基材層(a)之材料,並未特別限定,可使用非極性樹脂及極性樹脂的任一者。基於性能和價格面等觀點,作為非極性樹脂,較佳為聚烯烴系樹脂。做為基材中所含聚烯烴系樹脂,並未特別限定,但可列舉乙烯均聚物、乙烯-α-烯烴共聚物、乙烯-(甲基)丙烯酸共聚物、乙烯-(甲基)丙烯酸酯共聚物、及乙烯-醋酸乙烯酯共聚物等之聚乙烯系樹脂、丙烯均聚物、丙烯-α-烯烴共聚物、及丙烯-乙烯共聚物等之聚丙烯系樹脂、丁烯均聚物、丁二烯及異戊二烯等之共軛二烯之均聚物或共聚物等。又,作為上述聚乙烯系樹脂,可例示高密度聚乙烯、中密度聚乙烯或低密度聚乙烯。共聚之形態可為無規,也可為嵌段,還可為3元共聚物之形態。上述聚烯烴系樹脂係可單獨使用,也可合併使用2種以上。上述聚乙烯系樹脂係可使用乙烯作為主要成分而獲得。上述聚乙烯系樹脂之全結構單元100重量%中,源自於乙烯之結構單元的比例較佳為50重量%以上,更佳為70重量%以上,進一步較佳為90重量%以上。上述聚丙烯系樹脂係可使用丙烯作為主要成分而獲得。上述聚丙烯系樹脂之全結構單元100重量%中,源自於丙烯之結構單元的比例較佳為50重量%以上,更佳為70重量%以上,進一步較佳為90重量%以上。本發明之基材層(a)係基於耐熱性、耐候性、或與樹脂層(b)之密接性的觀點,而較佳為以聚丙烯系樹脂為主體。The material of the substrate layer (a) of the present invention is not particularly limited, and any non-polar resin or polar resin can be used. From the viewpoint of performance and price, the non-polar resin is preferably a polyolefin resin. The polyolefin resin contained in the substrate is not particularly limited, but polyethylene resins such as ethylene homopolymers, ethylene-α-olefin copolymers, ethylene-(meth)acrylic acid copolymers, ethylene-(meth)acrylate copolymers, and ethylene-vinyl acetate copolymers, polypropylene resins such as propylene homopolymers, propylene-α-olefin copolymers, and propylene-ethylene copolymers, butene homopolymers, and homopolymers or copolymers of co-dienes such as butadiene and isoprene can be listed. Furthermore, as the above-mentioned polyethylene resin, high-density polyethylene, medium-density polyethylene or low-density polyethylene can be exemplified. The copolymerization form can be random, block, or a tertiary copolymer. The above-mentioned polyolefin resin can be used alone or in combination of two or more. The above-mentioned polyethylene resin can be obtained using ethylene as a main component. In 100% by weight of the total structural units of the above-mentioned polyethylene resin, the proportion of structural units derived from ethylene is preferably 50% by weight or more, more preferably 70% by weight or more, and further preferably 90% by weight or more. The above-mentioned polypropylene resin can be obtained using propylene as a main component. The proportion of structural units derived from propylene in the total structural units of the polypropylene resin is preferably 50% by weight or more, more preferably 70% by weight or more, and further preferably 90% by weight or more. The substrate layer (a) of the present invention is preferably mainly composed of a polypropylene resin from the viewpoint of heat resistance, weather resistance, or adhesion with the resin layer (b).
本發明之基材層(a)的厚度較佳為10μm以上150μm以下,更佳為15μm以上80μm以下,最佳為20μm以上50μm以下。The thickness of the substrate layer (a) of the present invention is preferably 10 μm to 150 μm, more preferably 15 μm to 80 μm, and most preferably 20 μm to 50 μm.
在本發明之積層薄膜僅包含基材層(a)與樹脂層(b)之情形,為了要抑制基材層(a)之表面與樹脂層(b)之表面的黏著力,而較佳為對基材層(a)之表面賦予凹凸,使其與樹脂層(b)之接觸面積縮小。作為該手段,亦可添加與基材層(a)所使用之樹脂為非相溶之樹脂,或摻配有機系、無機系之粒子。In the case where the laminated film of the present invention only includes the substrate layer (a) and the resin layer (b), in order to suppress the adhesion between the surface of the substrate layer (a) and the surface of the resin layer (b), it is preferred to give the surface of the substrate layer (a) with irregularities so as to reduce the contact area with the resin layer (b). As such means, a resin that is incompatible with the resin used for the substrate layer (a) may be added, or organic or inorganic particles may be mixed.
在基材層(a)以聚丙烯為主體之情形,作為該非相溶之樹脂,可使用4-甲基戊烯-1系聚合物等之碳數4以上的α-烯烴聚合物。其他還可例示低密度聚乙烯、高密度聚乙烯、乙烯與少量α-烯烴的共聚物、乙烯與醋酸乙烯酯的共聚物、聚苯乙烯、脂環式烯烴樹脂、聚酯系樹脂、聚醯胺系樹脂。When the base layer (a) is mainly composed of polypropylene, as the incompatible resin, an α-olefin polymer having 4 or more carbon atoms such as 4-methylpentene-1-series polymers can be used. Other examples include low-density polyethylene, high-density polyethylene, copolymers of ethylene and a small amount of α-olefin, copolymers of ethylene and vinyl acetate, polystyrene, alicyclic olefin resins, polyester resins, and polyamide resins.
作為該有機系粒子,可列舉聚乙烯、聚苯乙烯、聚甲基丙烯酸甲酯等,作為聚乙烯系,可例示三井化學(股)製之高分子量聚乙烯微粒「mipelon」、綜研化學(股)製之交聯丙烯酸單分散粒子MX-1500H。又,作為無機系粒子,可例示二氧化矽、氧化鈦等。Examples of the organic particles include polyethylene, polystyrene, and polymethyl methacrylate. Examples of polyethylene particles include high molecular weight polyethylene microparticles "mipelon" manufactured by Mitsui Chemicals Co., Ltd. and cross-linked acrylic acid monodisperse particles MX-1500H manufactured by Soken Chemical Co., Ltd. In addition, examples of inorganic particles include silicon dioxide and titanium oxide.
另一方面,也能夠藉由對基材層(a)添加矽酮系之離型性賦予劑,而適度抑制與樹脂層(b)之表面的黏著力。作為該矽酮系之離型性賦予劑,可例示三井化學精細(股)製之「exfore」、道爾-東麗(股)製之BY27-201C及BY27-202H、Momentive Performance Materials Inc.製ParenY19220及SiPP MB01等。On the other hand, by adding a silicone-based release agent to the substrate layer (a), the adhesion to the surface of the resin layer (b) can be appropriately suppressed. Examples of the silicone-based release agent include "exfore" manufactured by Mitsui Chemicals Fine Chemicals Co., Ltd., BY27-201C and BY27-202H manufactured by Doyle-Toray Co., Ltd., and ParenY19220 and SiPP MB01 manufactured by Momentive Performance Materials Inc.
在本發明中,因可抑制上述樹脂層(b)與第2樹脂層(c)之黏著,而較佳為基材層(a)的另一面上積層有第2樹脂層(c)。In the present invention, since the adhesion between the resin layer (b) and the second resin layer (c) can be suppressed, it is preferred that the second resin layer (c) is laminated on the other surface of the base layer (a).
構成本發明之第2樹脂層(c)的材料並未特別限定,較佳為與基材層(a)相同的組成物,基於生產性、成本、離型效果的觀點,較佳為對第2樹脂層(c)添加非相溶之樹脂、有機系、無機系之粒子、離型劑等。The material constituting the second resin layer (c) of the present invention is not particularly limited, and is preferably the same composition as that of the substrate layer (a). From the viewpoint of productivity, cost, and release effect, it is preferred to add an incompatible resin, organic or inorganic particles, a release agent, etc. to the second resin layer (c).
本發明之第2樹脂層(c)的厚度係較佳為1μm以上20μm以下。若上述第2樹脂層(c)的厚度小於1μm,則製膜時之加工性不佳,而若超過20μm,則作為積層薄膜容易導致成本上升。The thickness of the second resin layer (c) of the present invention is preferably 1 μm to 20 μm. If the thickness of the second resin layer (c) is less than 1 μm, the processability during film formation is poor, and if it exceeds 20 μm, the cost of the laminated film is likely to increase.
接下來,針對本發明之積層薄膜之製造方法進行說明。Next, the manufacturing method of the laminated film of the present invention is described.
本發明之積層薄膜之製造方法並未特別限定,但可列舉例如:在樹脂層(b)、基材層(a)、第2樹脂層(c)之三層積層構成之情形,將構成各層之樹脂組成物從個別的壓出機熔融壓出,使在模型內一體化之所謂的共壓出法;在分別將上述樹脂層(b)、基材層(a)、第2樹脂層(c)予以個別熔融壓出之後,藉由層合法進行積層的方法等。基於生產性的觀點,較佳為以共壓出法製造。構成各層之材料可使用藉由漢歇爾混合器等予以個別混合者,也可以使用預先將各層之所有或一部分的材料予以混練者。關於共壓出法,可使用吹塑法、T模法等之公知方法,但基於厚度精確度優異、表面形狀控制的觀點,而特佳為利用T模法之熱熔融共壓出法。The method for producing the laminated film of the present invention is not particularly limited, but examples thereof include: in the case of a three-layer laminated structure of a resin layer (b), a substrate layer (a), and a second resin layer (c), the resin composition constituting each layer is melt-extruded from a separate extruder and integrated in a mold, which is called a co-extrusion method; after the resin layer (b), the substrate layer (a), and the second resin layer (c) are melt-extruded separately, a method of laminating them by a lamination method, etc. From the perspective of productivity, it is preferred to produce by the co-extrusion method. The materials constituting each layer may be mixed individually by a Henschel mixer or the like, or all or part of the materials of each layer may be kneaded in advance. As for the co-extrusion method, known methods such as blow molding and T-die method may be used, but from the viewpoint of excellent thickness accuracy and surface shape control, hot melt co-extrusion using T-die method is particularly preferred.
本發明之積層薄膜係可當作合成樹脂板、金屬板、玻璃板等之製造、加工、搬送時之防止刮傷、防止污染物附著用的表面保護薄膜而使用,但例如可較佳當作擴散板、稜鏡薄片等之表面上具有凹凸的光學用表面保護薄膜來使用。 [實施例]The laminated film of the present invention can be used as a surface protection film for preventing scratches and contaminants from adhering during the manufacturing, processing, and transportation of synthetic resin plates, metal plates, glass plates, etc., but it can be preferably used as an optical surface protection film having uneven surfaces such as diffusion plates and prism sheets. [Example]
以下,列舉具體的實施例及比較例來針對本發明進行詳細說明,本發明並非限定於以下實施例者。實施例及比較例中應用之物性之測定方法及評價方法係如下所示。The present invention is described in detail below by way of specific examples and comparative examples, but the present invention is not limited to the following examples. The physical property measurement methods and evaluation methods used in the examples and comparative examples are as follows.
(1)源自於氫化共聚物組成物之共軛二烯化合物的雙鍵氫化率 藉由核磁共振光譜解析(NMR),以下述條件來測定氫化共聚物組成物中之嵌段化率、乙烯基。另外,在測定時,將氫化反應後之液體投入至大量甲醇中,使氫化共聚物組成物沉澱並加以回收。接著,利用丙酮而萃取出氫化共聚物組成物,將萃取液真空乾燥,當作1 H-NMR測定之樣本來使用。將測定條件記載於下。 (測定條件) 測定機器:JNM-LA400(JEOL製) 溶媒:氘代氯仿 測定樣本:將聚合物氫化前後之採樣品 樣本濃度:50mg/mL 觀測頻率:400MHz 化學轉移基準:CDCl3 (氘代氯仿) 脈衝顯示:2.904秒鐘 掃描次數:256次 脈衝寬度:45° 測定溫度:26℃(1) The double bond hydrogenation rate of the conjugated diene compound derived from the hydrogenated copolymer composition was determined by nuclear magnetic resonance spectroscopy (NMR) under the following conditions to determine the block rate and vinyl group in the hydrogenated copolymer composition. In addition, during the determination, the liquid after the hydrogenation reaction was put into a large amount of methanol to precipitate the hydrogenated copolymer composition and recover it. Then, the hydrogenated copolymer composition was extracted with acetone, and the extract was vacuum dried and used as a sample for 1 H-NMR determination. The measurement conditions are described below. (Measurement conditions) Measurement equipment: JNM-LA400 (manufactured by JEOL) Solvent: deuterated chloroform Measurement sample: Samples before and after polymer hydrogenation Sample concentration: 50 mg/mL Observation frequency: 400 MHz Chemical transfer standard: CDCl 3 (deuterated chloroform) Pulse display: 2.904 seconds Scanning times: 256 times Pulse width: 45 ° Measurement temperature: 26 °C
(2)氫化共聚物組成物之熔體流速(MFR) 依據ISO 1133,以溫度230℃、負重21.17N(2.16kgf)之條件,測定氫化共聚物組成物之MFR(g/10分鐘)。(2) Melt flow rate (MFR) of hydrogenated copolymer composition According to ISO 1133, the MFR (g/10 min) of the hydrogenated copolymer composition was measured at a temperature of 230°C and a load of 21.17 N (2.16 kgf).
(3)氫化共聚物組成物之乙烯基芳香族單體單元之含量 將一定量的氫化共聚物組成物溶解於氯仿中,以紫外分光光度計(島津製作所製,UV-2450)進行測定。根據起因於乙烯基芳香族化合物(苯乙烯)之吸收波長(262nm)的波峰強度,採用檢量線來計算出氫化共聚物組成物中之乙烯基芳香族單體單元含量。(3) Vinyl aromatic monomer content of hydrogenated copolymer composition A certain amount of hydrogenated copolymer composition was dissolved in chloroform and measured using an ultraviolet spectrophotometer (manufactured by Shimadzu Corporation, UV-2450). The vinyl aromatic monomer content in the hydrogenated copolymer composition was calculated using a calibration curve based on the peak intensity of the absorption wavelength (262 nm) caused by the vinyl aromatic compound (styrene).
(4)初期黏著力 使用滾筒壓製機(安田精機製作所(股)製特殊壓接滾筒(硬度A80、自重2kg)),將在溫度23℃、相對濕度50%的條件下而調溫調濕24小時後之各積層薄膜,以貼合壓力0.35MPa、貼合度度3m/分鐘,以覆蓋該透鏡面的方式,貼合於稜鏡薄片的透鏡面上。其後,在溫度23℃、相對濕度50%下保管24小時之後,進行黏著力評價。另外,稜鏡薄片係使用包含厚度95μm之丙烯酸樹脂的稜鏡稜線間之間隙為25μm者。(4) Initial adhesion Using a roller press (special compression roller manufactured by Yasuda Seiki Co., Ltd. (hardness A80, weight 2kg)), each layer of film was temperature-controlled and humidified at 23°C and relative humidity 50% for 24 hours, and then laminated to the lens surface of the prism sheet at a lamination pressure of 0.35MPa and a lamination speed of 3m/min so that the lens surface was covered. After that, the film was stored at 23°C and relative humidity 50% for 24 hours, and then the adhesion was evaluated. In addition, the prism sheet used was a prism sheet with a gap of 25μm between prism ridges made of 95μm thick acrylic resin.
黏著力係使用拉伸試驗機(orientec(股)製萬能試驗機「tensilon」),以剝離速度300mm/分鐘、剝離角度180度來測定黏著力。測定係進行5次,將平均值當作初期黏著力。 (判定基準) 黏著力(初期) 優:10mN/25mm以上、小於100mN/25mm 良:100mN/25mm以上、小於300mN/25mm 不良:小於10mN/25mm、300mN/25mm以上Adhesion was measured using a tensile tester (Orientec Co., Ltd. universal testing machine "tensilon") at a peeling speed of 300 mm/min and a peeling angle of 180 degrees. The measurement was performed 5 times, and the average value was taken as the initial adhesion. (Judgment criteria) Adhesion (initial) Excellent: 10mN/25mm or more, less than 100mN/25mm Good: 100mN/25mm or more, less than 300mN/25mm Poor: less than 10mN/25mm, 300mN/25mm or more
(5)經時黏著力(黏著增強) 以與前述(4)初期黏著力之試驗相同的方法,將各積層薄膜以覆蓋該透鏡面的方式,貼合於稜鏡薄片之透鏡面。其後,在溫度控制在50℃之熱風烤箱內保管72小時,進而於溫度23℃、相對濕度50%下保管24小時之後,進行黏著力評價。(5) Adhesion over time (adhesion enhancement) In the same manner as the initial adhesion test (4) above, each layer of film was attached to the lens surface of the prism sheet in such a way that it covered the lens surface. After that, it was stored in a hot air oven at a temperature of 50°C for 72 hours, and then stored at a temperature of 23°C and a relative humidity of 50% for 24 hours before the adhesion evaluation was performed.
黏著力係使用拉伸試驗機(orientec(股)製萬能試驗機「tensilon」),以剝離速度300mm/分鐘、剝離角度180度來測定黏著力。測定係進行3次,將平均值當作經時黏著力。將如此進行而測得之剝離強度當作經時黏著力,以次式來計算出經時黏著力從初期黏著力起的變化率(黏著增強率)。 黏著增強率(%)=(經時黏著力/初期黏著力)×100(%) (判定基準) 黏著增強率 優:80%以上、小於150% 良:150%以上、小於250% 不良:250%以上Adhesion was measured using a tensile tester (Orientec Co., Ltd. universal testing machine "Tensilon") at a peeling speed of 300 mm/min and a peeling angle of 180 degrees. The measurement was performed three times, and the average value was used as the adhesion over time. The peel strength measured in this way was used as the adhesion over time, and the change rate of the adhesion over time from the initial adhesion (adhesion enhancement rate) was calculated using the following formula. Adhesion enhancement rate (%) = (adhesion over time/initial adhesion) × 100 (%) (Judgment criteria) Adhesion enhancement rate Excellent: 80% or more, less than 150% Good: 150% or more, less than 250% Poor: 250% or more
(6)加熱浮起評價 以與前述(4)初期黏著力之試驗相同的方法,將各積層薄膜以覆蓋該透鏡面的方式,貼合於稜鏡薄片之透鏡面。其後,在溫度控制在50℃之熱風烤箱內保管72小時,進而於溫度23℃、相對濕度50%下保管24小時之後,目視評價來自稜鏡薄片之表面保護薄膜之浮起有無。將沒見到浮起的情形評價為良,將見到浮起的情形評價為不良。(6) Evaluation of heating floating In the same manner as the initial adhesion test (4) above, each layer of film was attached to the lens surface of the prism sheet in such a way that it covered the lens surface. After that, it was stored in a hot air oven at a temperature of 50°C for 72 hours, and then stored at a temperature of 23°C and a relative humidity of 50% for 24 hours. The floating of the surface protective film from the prism sheet was visually evaluated. The case where no floating was observed was evaluated as good, and the case where floating was observed was evaluated as poor.
(7)糊料殘留(污染)評價 以與前述(4)初期黏著力之試驗相同的方法,將各表面保護薄片以覆蓋該透鏡面的方式,貼合於稜鏡薄片之透鏡面。在60℃的環境下放置30分鐘,於剝離表面保護薄膜之後,以目視評價對於稜鏡薄片之糊料殘留的有無。 (判定基準) 良:在稜鏡薄片上無法觀察到糊料殘留 不良:在稜鏡薄片上可以觀察到糊料殘留(7) Evaluation of paste residue (contamination) In the same manner as the initial adhesion test (4) above, each surface protection film is attached to the lens surface of the prism sheet in such a way that it covers the lens surface. After being placed in an environment of 60°C for 30 minutes, the surface protection film is peeled off and the presence of paste residue on the prism sheet is visually evaluated. (Judgment criteria) Good: No paste residue is observed on the prism sheet Poor: Paste residue is observed on the prism sheet
(氫化共聚物組成物之製造) (製造例) 使用具備有攪拌裝置及套殼之槽型反應器,以環己烷為溶媒,以正丁鋰(以下有記載為Bu-Li的情形)為聚合觸媒,首先,添加既定量之丁二烯單體(I),使聚合結束,接著,添加既定量之苯乙烯單體,使聚合結束,進一步添加既定量之丁二烯單體(II),使聚合結束。聚合結束後,添加偶合劑之四乙氧基矽烷,使丁二烯-苯乙烯-丁二烯共聚物的一部分交聯,得到丁二烯-苯乙烯-丁二烯共聚物與其交聯物之混合物(共聚物組成物)。(Production of hydrogenated copolymer composition) (Production example) Using a tank reactor equipped with a stirring device and a jacket, cyclohexane is used as a solvent, and n-butyl lithium (hereinafter referred to as Bu-Li) is used as a polymerization catalyst. First, a predetermined amount of butadiene monomer (I) is added to terminate the polymerization, then a predetermined amount of styrene monomer is added to terminate the polymerization, and then a predetermined amount of butadiene monomer (II) is added to terminate the polymerization. After the polymerization is completed, tetraethoxysilane is added as a coupling agent to crosslink a portion of the butadiene-styrene-butadiene copolymer, thereby obtaining a mixture of the butadiene-styrene-butadiene copolymer and its crosslinked product (copolymer composition).
其後,於所得到之聚合溶液中添加既定量之雙環戊二烯鈦氯化物與三甲基鋁作為氫化觸媒,使源自於丁二烯之雙鍵氫化,在反應結束之後,添加十八烷基-3-(3,5-二第三丁基-4-羥基苯基)丙酸酯作為抗氧化劑,獲得所期望之氫化共聚物組成物(以下實施例中之氫化物)。將所得到之氫化共聚物組成物之組成與物性示於表1。Subsequently, a predetermined amount of dicyclopentadiene titanium chloride and trimethylaluminum were added to the obtained polymerization solution as hydrogenation catalysts to hydrogenate the double bonds derived from butadiene. After the reaction was completed, octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate was added as an antioxidant to obtain the desired hydrogenated copolymer composition (the hydrogenated product in the following examples). The composition and physical properties of the obtained hydrogenated copolymer composition are shown in Table 1.
(實施例1) 作為氫化共聚物組成物,而以使製造例所得到之氫化物1為85重量%、三井化學(股)製芳香族系烴樹脂「FTR」8100為15重量%之比率來進行乾式混合,作成樹脂層(b)。(Example 1) As a hydrogenated copolymer composition, the hydrogenated product 1 obtained in the production example was 85% by weight and the aromatic hydrocarbon resin "FTR" 8100 manufactured by Mitsui Chemicals Co., Ltd. was 15% by weight, and the mixture was dry-mixed to prepare a resin layer (b).
在基材層(a)係使用Prime Polymer Co., Ltd.製「primepolypro」F113G,其係MFR為3.0g/10分鐘之同排聚丙烯(均質聚丙烯)。The base material (a) used was "primepolypro" F113G manufactured by Prime Polymer Co., Ltd., which is homogeneous polypropylene (homogeneous polypropylene) having an MFR of 3.0 g/10 minutes.
將上述樹脂層(b)及基材層(a)之樹脂投入至具備2台壓縮比4.2、L/D=25之單軸螺旋壓出機的2種2層T模製膜機,以使樹脂層(b)側接觸溫度控制在30℃之金屬冷卻滾筒的方式,進行澆鑄,進行冷卻固化而製作薄膜,獲得包含樹脂層(b)厚度4μm、基材層(a)厚度36μm、整體厚度40μm的積層薄膜。The resins of the resin layer (b) and the substrate layer (a) were fed into two types of two-layer T-molding film machines equipped with two single-screw extruders with a compression ratio of 4.2 and L/D=25, and cast in a manner such that the resin layer (b) side was in contact with a metal cooling drum whose temperature was controlled at 30°C. The films were cooled and solidified to obtain a laminated film having a resin layer (b) thickness of 4μm, a substrate layer (a) thickness of 36μm, and an overall thickness of 40μm.
(實施例2) 除了將實施例1之樹脂層(b)之組成變更如下之外,係與實施例1同樣地獲得整體厚度40μm之薄膜。 ‧製造例所得到之氫化物2:85重量% ‧「FTR」8100:15重量%(Example 2) Except that the composition of the resin layer (b) of Example 1 is changed as follows, a film with an overall thickness of 40 μm is obtained in the same manner as in Example 1. ‧Hydride 2 obtained in the manufacturing example: 85 wt% ‧"FTR" 8100: 15 wt%
(實施例3) 除了將實施例1之樹脂層(b)之組成變更如下之外,係與實施例1同樣地獲得整體厚度40μm之薄膜。 ‧製造例所得到之氫化物3:85重量% ‧「FTR」8100:15重量%(Example 3) Except that the composition of the resin layer (b) of Example 1 is changed as follows, a film with an overall thickness of 40 μm is obtained in the same manner as in Example 1. ‧Hydride 3 obtained in the manufacturing example: 85 wt% ‧"FTR" 8100: 15 wt%
(實施例4) 除了將實施例1之樹脂層(b)之組成變更如下之外,係與實施例1同樣地獲得整體厚度40μm之薄膜。 ‧製造例所得到之氫化物4:85重量% ‧「FTR」8100:15重量%(Example 4) Except that the composition of the resin layer (b) of Example 1 is changed as follows, a film with an overall thickness of 40 μm is obtained in the same manner as in Example 1. ‧Hydride 4 obtained in the manufacturing example: 85 wt% ‧"FTR" 8100: 15 wt%
(實施例5) 除了將實施例1之樹脂層(b)之組成變更如下之外,係與實施例1同樣地獲得整體厚度40μm之薄膜。 ‧製造例所得到之氫化物5:85重量% ‧「FTR」8100:15重量%(Example 5) Except that the composition of the resin layer (b) of Example 1 is changed as follows, a film with an overall thickness of 40 μm is obtained in the same manner as in Example 1. ‧Hydride 5 obtained in the manufacturing example: 85 wt% ‧"FTR" 8100: 15 wt%
(實施例6) 除了將實施例1之樹脂層(b)之組成變更如下之外,係與實施例1同樣地獲得整體厚度40μm之薄膜。 ‧製造例所得到之氫化物1:85重量% ‧安原化學(股)製萜烯苯酚樹脂YS POLYSTAR TH130:15重量%(Example 6) Except that the composition of the resin layer (b) of Example 1 is changed as follows, a film with an overall thickness of 40 μm is obtained in the same manner as in Example 1. ‧Hydrogenated product 1 obtained in the production example: 85 wt% ‧Terpene phenol resin YS POLYSTAR TH130 manufactured by Yasuhara Chemical Co., Ltd.: 15 wt%
(實施例7) 除了變更如實施例1之樹脂層(b)的厚度25μm、基材層(a)厚度15μm之外,係與實施例1同樣地獲得整體厚度40μm之積層薄膜。(Example 7) Except that the thickness of the resin layer (b) is changed to 25μm and the thickness of the substrate layer (a) is changed to 15μm as in Example 1, a laminated film with an overall thickness of 40μm is obtained in the same manner as in Example 1.
(實施例8) 除了變更如實施例1之樹脂層(b)的厚度2μm、基材層(a)厚度38μm之外,係與實施例1同樣地獲得整體厚度40μm之積層薄膜。(Example 8) Except that the thickness of the resin layer (b) is changed to 2μm and the thickness of the substrate layer (a) is changed to 38μm as in Example 1, a laminated film with an overall thickness of 40μm is obtained in the same manner as in Example 1.
(實施例9) 除了於實施例1中所示組成物之外,在基材層(a)之形成有樹脂層(b)相反面上,作為第2樹脂層(c),使用以下所示組成,將上述樹脂層(b)、基材層(a)及第2樹脂層(c)之樹脂投入至具備3台壓縮比4.2、L/D=25之短軸螺旋壓出機的3種3層T模製膜機,以使樹脂層(b)側接觸溫度控制在30℃之金屬冷卻滾筒的方式,進行澆鑄,進行冷卻固化而製作薄膜,獲得包含樹脂層(b)厚度4μm、基材層(a)與第2樹脂層(c)之合計厚度36μm、整體厚度40μm的3層積層薄膜。 ‧曉星日本(股)製 嵌段PP樹脂「topilen」J640F:90重量% ‧三井化學精密(股)製 烯烴-矽酮共聚物「exfore」PP母料:10重量% (比較例1) 除了將實施例1之樹脂層(b)之組成變更如下之外,係與實施例1同樣地獲得整體厚度40μm之薄膜。 ‧製造例所得到之氫化物6:85重量% ‧「FTR」8100:15重量%(Example 9) In addition to the composition shown in Example 1, a second resin layer (c) is formed on the opposite side of the substrate layer (a) where the resin layer (b) is formed, and the resins of the resin layer (b), the substrate layer (a) and the second resin layer (c) are placed in a short-axis spiral having a compression ratio of 4.2 and L/D=25. The three types of three-layer T-molding film machines of the extruder are cast by making the resin layer (b) contact the metal cooling drum controlled at 30°C, and then cooled and solidified to produce a film. The obtained three-layer laminated film includes a resin layer (b) with a thickness of 4μm, a base layer (a) and a second resin layer (c) with a total thickness of 36μm, and an overall thickness of 40μm. ‧ Block PP resin "topilen" J640F manufactured by Hirosei Japan Co., Ltd.: 90 wt% ‧ Olefin-silicone copolymer "exfore" PP masterbatch manufactured by Mitsui Chemicals Co., Ltd.: 10 wt% (Comparative Example 1) Except that the composition of the resin layer (b) of Example 1 is changed as follows, a film with an overall thickness of 40 μm is obtained in the same manner as Example 1. ‧ Hydrogenated product 6 obtained in the manufacturing example: 85 wt% ‧ "FTR" 8100: 15 wt%
(比較例2) 除了將實施例1之樹脂層(b)之組成變更如下之外,係與實施例1同樣地獲得整體厚度40μm之薄膜。 ‧製造例所得到之氫化物7:85重量% ‧「FTR」8100:15重量%(Comparative Example 2) Except that the composition of the resin layer (b) of Example 1 is changed as follows, a film with an overall thickness of 40 μm is obtained in the same manner as Example 1. ‧Hydride 7 obtained in the manufacturing example: 85 wt% ‧"FTR" 8100: 15 wt%
(比較例3) 除了將實施例1之樹脂層(b)之組成變更如下之外,係與實施例1同樣地獲得整體厚度40μm之薄膜。 ‧製造例所得到之氫化物8:85重量% ‧「FTR」8100:15重量%(Comparative Example 3) Except that the composition of the resin layer (b) of Example 1 is changed as follows, a film with an overall thickness of 40 μm is obtained in the same manner as Example 1. ‧Hydride 8 obtained in the manufacturing example: 85 wt% ‧"FTR" 8100: 15 wt%
(比較例4) 除了將實施例1之樹脂層(b)之組成變更如下之外,係與實施例1同樣地獲得整體厚度40μm之薄膜。 ‧製造例所得到之氫化物9:85重量% ‧「FTR」8100:15重量%(Comparative Example 4) Except that the composition of the resin layer (b) of Example 1 is changed as follows, a film with an overall thickness of 40 μm is obtained in the same manner as Example 1. ‧Hydride 9 obtained in the manufacturing example: 85 wt% ‧"FTR" 8100: 15 wt%
(比較例5) 除了將實施例1之樹脂層(b)之組成變更如下之外,係與實施例1同樣地獲得整體厚度40μm之薄膜。 ‧製造例所得到之氫化物1:100重量%(Comparative Example 5) Except that the composition of the resin layer (b) of Example 1 is changed as follows, a film with an overall thickness of 40 μm is obtained in the same manner as Example 1. ‧Hydride 1 obtained in the manufacturing example: 100 wt%
(比較例6) 除了將實施例1之樹脂層(b)之組成變更如下之外,係與實施例1同樣地獲得整體厚度40μm之薄膜。 ‧JSR(股)製氫化苯乙烯丁二烯橡膠「DYNARON」1321P(丁二烯單體未存在末端的氫化共聚物):85重量% ‧「FTR」8100:15重量%(Comparative Example 6) Except that the composition of the resin layer (b) of Example 1 is changed as follows, a film with an overall thickness of 40 μm is obtained in the same manner as in Example 1. ‧JSR (stock) hydrogenated styrene butadiene rubber "DYNARON" 1321P (hydrogenated copolymer without butadiene monomer terminals): 85 wt% ‧"FTR" 8100: 15 wt%
[表1]
[表2]
實施例1~8係對於光學薄片表面之初期黏著力、黏著增強之抑制、加熱後之浮起之抑制及對於被黏體之污染之抑制的平衡極為優異。另一方面,比較例1、4、5及6因在與被黏體貼合後進行加熱,而積層薄膜浮起,產生薄膜剝離的不良情形。比較例2、3因在與被黏體貼合後進行加熱,而黏著增強變大,產生黏著劑殘存在被黏體之表面而被黏體表面上有糊料殘留(污染)的不良情形。 [產業上利用之可能性]Examples 1 to 8 are extremely well balanced in terms of initial adhesion to the optical sheet surface, suppression of adhesion enhancement, suppression of floating after heating, and suppression of contamination of the adherend. On the other hand, in Comparative Examples 1, 4, 5, and 6, the laminated film is heated after being bonded to the adherend, resulting in undesirable film peeling. In Comparative Examples 2 and 3, the adhesion enhancement is increased after being heated after being bonded to the adherend, resulting in undesirable adhesive residues on the adherend surface and paste residues (contamination) on the adherend surface. [Possibility of industrial use]
本發明之積層薄膜不只是可防止表面具有凹凸之被黏體之損傷和污染的表面保護薄膜,還可較佳作為包含合成樹脂、金屬、玻璃等之各種素材的各種製品之表面保護薄膜用途使用。The laminated film of the present invention is not only a surface protection film that can prevent damage and contamination of adherends with uneven surfaces, but can also be preferably used as a surface protection film for various products made of various materials including synthetic resins, metals, glass, etc.
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