TWI847762B - Heat dissipation structure of electronic device - Google Patents

Abstract

A heat dissipation structure of electronic device is provided. The heat dissipation structure of electronic device includes a substrate, multiple connectors, a clamp, a bracket and a heat sink. The substrate has a first surface and a second surface, and the first surface is provided with a control chip and multiple connector fixing seats. The connectors are disposed on the connector fixing seats of the substrate. The clamp is used to fix the connectors on the substrate. The bracket is fixed on the substrate and has at least one locking hole. The heat sink is fixed on the substrate through the locking hole of the bracket. The clamp is provided with multiple elastic structures to respectively elastically press the upper surfaces of the connectors. The second surface of the substrate is provided with a stiffener to reinforce the strength of the substrate and provide heat conduction.

Description

Heat dissipation structure of electronic components

The present disclosure relates to a heat dissipation structure of an electronic component, and more particularly to a heat dissipation structure of an electronic component with a fixing device.

Near packaged optics (NPO) separates the optical engine (OE) from the switch chip, assembling them on the same printed circuit board (PCB) and adding an intermediate layer, making the signal routing from the switch chip to the optical engine more convenient. The use of the intermediate layer technology also means that the entire printed circuit board does not need to be upgraded, greatly reducing costs.

According to an embodiment of the present disclosure, a heat dissipation structure of an electronic component is provided, comprising: a substrate having a first surface and a second surface, the first surface being provided with a control chip and a plurality of connector fixing seats, each of the connector fixing seats having a first end and a second end, the first ends being arranged toward the outer edge of the substrate; a plurality of connectors arranged on the connector fixing seats of the substrate, and an interface of each of the connectors being located at the first end of each of the connector fixing seats; a fixing device, to fix the connectors on the substrate; a trailer, which is arranged to be fixed on the substrate and located at the second ends of the connector fixing seats, and the trailer has at least one keyhole; and a heat dissipation device, which is fixed to the substrate through the keyhole of the trailer and contacts the control chip on the substrate and the connectors, wherein the fixing device is provided with a plurality of elastic structures to elastically press the upper surfaces of the connectors respectively, wherein the second surface of the substrate is provided with a component to reinforce the strength of the substrate and provide heat conduction.

In some embodiments, the substrate includes a printed circuit board (PCB).

In some embodiments, the connectors include optical engines (OE) or electrical signal connectors. In some embodiments, the connectors surround the control chip.

In some embodiments, the fixing device includes an integrated fixing device or a separate fixing device. In some embodiments, each of the elastic structures has a first end and a second end, and one of the first end and the second end is embedded in the fixing device. In some embodiments, each of the elastic structures has a first end and a second end, and the first end and the second end are embedded in the fixing device.

In some embodiments, the carriage surrounds the control chip.

In some embodiments, the second surface of the substrate is provided with a power module and a plurality of second connectors. In some embodiments, the component has a first surface and a second surface, the first surface has a plurality of grooves to accommodate the power module, and the second surface is provided with a plurality of fins. In some embodiments, the grooves and the power module are further filled with a medium. In some embodiments, the heat dissipation structure of the electronic component further includes a second substrate and is electrically connected to the second substrate through the second connectors.

The following disclosure provides many different embodiments for implementing different features of the present invention. The following disclosure describes specific examples of each component and its arrangement to simplify the description. Of course, these specific examples are not intended to be limiting. For example, if the disclosed embodiment describes a first characteristic component formed on or above a second characteristic component, it means that it may include an embodiment in which the first characteristic component and the second characteristic component are in direct contact, and it may also include an additional characteristic component formed between the first characteristic component and the second characteristic component, so that the first characteristic component and the second characteristic component may not be in direct contact.

It should be understood that additional operating steps may be implemented before, during or after the method, and in other embodiments of the method, some operating steps may be replaced or omitted.

In addition, spatially related terms may be used, such as "below", "below", "lower", "above", "above", "higher" and similar terms. These spatially related terms are used to facilitate the description of the relationship between one (or some) elements or features and another (or some) elements or features in the diagram. These spatially related terms include different orientations of the device in use or operation, as well as the orientations described in the drawings. When the device is turned to a different orientation (rotated 45 degrees or other orientations), the spatially related adjectives used therein will also be interpreted according to the orientation after the rotation. In some embodiments of the present disclosure, terms such as "connected", "interconnected", etc., related to bonding and connection, unless otherwise specifically defined, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, wherein there is another structure disposed between the two structures. Moreover, such terms related to bonding and connection may also include situations where both structures are movable, or both structures are fixed.

In the specification, the terms "about", "approximately", "roughly", "substantially", "same", and "similar" usually indicate that a characteristic value is within plus or minus 15%, plus or minus 10%, plus or minus 5%, plus or minus 3%, plus or minus 2%, plus or minus 1%, or plus or minus 0.5% of a given value. The quantities given here are approximate quantities, that is, in the absence of specific description of "about", "approximately", "roughly", "substantially", the meanings of "about", "approximately", "roughly", "substantially" may still be implied.

It should be understood that, although the terms "first", "second", "third", etc. are used herein to describe different elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may only be used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Therefore, without departing from the technology disclosed herein, the first element, component, region, layer or section discussed below may be referred to as a second element, component, region, layer or section.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and this disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of this disclosure.

Please refer to FIG. 1 , according to an embodiment of the present disclosure, a heat dissipation structure 10 of an electronic component is provided. FIG. 1 is an exploded view of the heat dissipation structure 10 of the electronic component.

As shown in FIG. 1 , the heat dissipation structure 10 of the electronic component includes a substrate 12, a plurality of connectors 14, a fixing device 16, a bracket 18, and a heat dissipation device 20. The substrate 12 has a first surface 12a and a second surface 12b, and the first surface 12a is provided with a control chip 22 and a plurality of connector fixing seats 24. The number of connector fixing seats 24 is not limited, for example, 16 connector fixing seats (as shown in the embodiment of FIG. 1 ). Each connector fixing seat 24 has a first end 24a and a second end 24b, and the first end 24a is arranged toward the outer edge 12e of the substrate 12. A plurality of connectors 14 are arranged on the connector fixing seats 24 of the substrate 12, and the interface 14a of each connector 14 is located at the first end 24a of each connector fixing seat 24. There is no limit to the number of connectors 14, and it can be considered in conjunction with the number of connector fixing seats, for example, 16 connectors (as shown in the embodiment of FIG. 1). The fixing device 16 is used to fix the connector 14 to the substrate 12. The trailer 18 is arranged and fixed to the substrate 12, and is located at the second end 24b of the connector fixing seat 24. The trailer 18 has a key hole 26. There is no limit to the number of key holes 26, for example, 4 key holes (as shown in the embodiment of FIG. 1). The structural form of the trailer 18 will be described in detail later. The heat sink 20 is fixed to the substrate 12 through the key holes 26 of the trailer 18. The fixing device 16 is provided with a plurality of elastic structures (not shown) to elastically press against the upper surface 14t of the connector 14 respectively. The elastic structure in the fixing device 16 will be described in detail later. The second surface 12b of the substrate 12 is provided with a component 28 to reinforce the strength of the substrate 12 and provide heat conduction. The structural composition of the component 28 will be described in detail later.

In addition to fixing the connector 14 to the substrate 12, the fixing device 16 also provides appropriate downward pressure to make the connection between the connector 14 and the substrate 12 more secure. The heat sink 20 is locked and fixed to the substrate 12 through the lock hole 26 of the carriage 18. Since the lock hole 26 is located near the center of the overall package structure, for example, around the control chip 22, the heat dissipation can be reduced. The device 20 is locked by the locking holes located near the periphery of the overall package structure, resulting in the warping phenomenon caused by the increase in span. Since the heat sink 20 has a good fixing effect, the heat dissipation effect of the heat sink 20 is also improved. The carriage 18 can also increase the rigidity of the substrate 12 .

In some embodiments, the substrate 12 may include a printed circuit board (PCB).

In some embodiments, the connector 14 may include an optical engine (OE) or an electrical signal connector. In FIG. 1 , the connector 14 is an optical engine (OE), for example, an optical engine with different transmission speeds. The connector 14 surrounds the control chip 22 .

In some embodiments, the fixing device 16 may include an integrated fixing device or a separate fixing device. In FIG. 1 , the fixing device 16 is a separate fixing device. The related structural components of the integrated and separate fixing devices 16 will be described in detail below.

In FIG. 1 , the carriage 18 surrounds the control wafer 22 .

The heat sink 20 can promote heat dissipation of the connector 14 and the control chip 22. In some embodiments, the heat sink 20 may include a heat sink composed of a temperature plate and fins or a heat sink composed of a heat pipe and fins. In FIG. 1 , the heat sink 20 is a heat sink composed of a temperature plate and fins.

Please refer to FIG. 2. According to an embodiment of the present disclosure, a heat dissipation structure 10 of an electronic component is provided. FIG. 2 is an exploded view of the heat dissipation structure 10 of the electronic component.

As shown in FIG. 2 , the heat dissipation structure 10 of the electronic component includes a substrate 12, a plurality of connectors 14, a fixing device 16, a bracket 18, and a heat dissipation device 20. The substrate 12 has a first surface 12a and a second surface 12b, and the first surface 12a is provided with a control chip 22 and a plurality of connector fixing seats 24. The number of connector fixing seats 24 is not limited, for example, 16 connector fixing seats (as shown in the embodiment of FIG. 2 ). Each connector fixing seat 24 has a first end 24a and a second end 24b, and the first end 24a is arranged toward the outer edge 12e of the substrate 12. A plurality of connectors 14 are arranged on the connector fixing seat 24 of the substrate 12, and the interface 14a of each connector 14 is located at the first end 24a of each connector fixing seat 24. There is no limit to the number of connectors 14, and it can be considered in conjunction with the number of connector fixing seats, for example, 16 connectors (as shown in the embodiment of FIG. 2). The fixing device 16 is used to fix the connector 14 to the substrate 12. The trailer 18 is arranged and fixed to the substrate 12, and is located at the second end 24b of the connector fixing seat 24. The trailer 18 has a key hole 26. There is no limit to the number of key holes 26, for example, 4 key holes (as shown in the embodiment of FIG. 2). The structural form of the trailer 18 will be described in detail later. The heat sink 20 is fixed to the substrate 12 via the key holes 26 of the trailer 18. The fixing device 16 is provided with a plurality of elastic structures (not shown) to elastically press against the upper surface 14t of the connector 14 respectively. The elastic structure in the fixing device 16 will be described in detail later. The second surface 12b of the substrate 12 is provided with a component 28 to reinforce the strength of the substrate 12 and provide heat conduction. The structural composition of the component 28 will be described in detail later.

In addition to fixing the connector 14 to the substrate 12, the fixing device 16 also provides appropriate downward pressure to make the connection between the connector 14 and the substrate 12 more secure. The heat sink 20 is locked and fixed to the substrate 12 through the lock hole 26 of the carriage 18. Since the lock hole 26 is located near the center of the overall package structure, for example, around the control chip 22, the heat dissipation can be reduced. The device 20 is attached by means of a key hole located near the periphery of the overall package structure, which causes the warping phenomenon due to the increase in span. Since the heat sink 20 has a good fixing effect, the heat dissipation effect of the heat sink 20 is also improved. The carriage 18 can also increase the rigidity of the substrate 12 .

In some embodiments, the substrate 12 may include a printed circuit board (PCB).

In some embodiments, the connector 14 may include an optical engine (OE) or an electrical signal connector. In FIG. 2 , the connector 14 is an electrical signal connector, such as a common connector socket (CCS) connector. The connector 14 surrounds the control chip 22.

In some embodiments, the fixing device 16 may include an integrated fixing device or a separate fixing device. In FIG. 2 , the fixing device 16 is a separate fixing device. The related structural components of the integrated and separate fixing devices 16 will be described in detail below.

In FIG. 2 , the carriage 18 surrounds the control wafer 22 .

The heat sink 20 can promote heat dissipation of the connector 14 and the control chip 22. In some embodiments, the heat sink 20 may include a heat sink composed of a temperature plate and fins or a heat sink composed of a heat pipe and fins. In FIG. 2 , the heat sink 20 is a heat sink composed of a heat pipe and fins.

Please refer to FIG. 3, according to an embodiment of the present disclosure, the assembly of the partial structure 10' of the heat dissipation structure 10 of the electronic component shown in FIG. 1 is further described. FIG. 3 is a three-dimensional view of the partial structure 10' of the heat dissipation structure 10 of the electronic component, which includes a component 28 disposed below the substrate 12, the substrate 12, and the control chip 22 disposed above the substrate 12, the carriage 18, the connector 14, and the fixing device 16.

As shown in FIG. 3 , in the partial structure 10 ′ of the heat dissipation structure 10 of the electronic component, a control chip 22 and a plurality of connectors 14 are provided on the first surface 12a of the substrate 12, surrounding the control chip 22. A fixing device 16 provided on the substrate 12 is used to fix the connector 14 to the substrate 12. A carriage 18 is provided and fixed to the substrate 12, surrounding the control chip 22, and having a locking hole 26. The heat dissipation device (not shown) is fixed to the substrate 12 through the locking hole 26 of the carriage 18. A component 28 is provided on the second surface 12b of the substrate 12 to reinforce the strength of the substrate 12 and provide heat conduction.

Please refer to Fig. 4, according to an embodiment of the present disclosure, the configuration on the second surface 12b of the substrate 12 in the heat dissipation structure 10 of the electronic component as shown in Fig. 1 is further described. Fig. 4 is a three-dimensional diagram of a part of the heat dissipation structure 10 of the electronic component.

As shown in FIG. 4 , in a partial structure of the heat dissipation structure 10 of the electronic component, a power module 30 and a plurality of second connectors 32 are provided on the second surface 12 b of the substrate 12. In some embodiments, the power module 30 may include, for example, a plurality of DC-to-DC converters. The number of components constituting the power module 30 is not limited, for example, 19 DC-to-DC converters (as shown in the embodiment of FIG. 4 ). In some embodiments, the second connector 32 may be used as a board to board connector to connect to an external substrate. The number of the second connectors 32 is not limited, for example, 2 board to board connectors (as shown in the embodiment of FIG. 4 ).

Please refer to Fig. 5, which further illustrates the structure of the carriage 18 according to an embodiment of the present disclosure. Fig. 5 is a schematic diagram of the carriage 18 in the heat dissipation structure 10 of the electronic component.

As shown in FIG. 5 , the carriage 18 includes a plurality of holes 34 and a plurality of locking holes 26. The holes 34 of the carriage 18 are used to fix the carriage 18 to the substrate 12. The number of holes 34 is not limited, for example, 8 holes (as shown in the embodiment of FIG. 5 ). When considering locking the heat sink, due to the limitation of the wiring layout of the substrate, it is impossible to add additional holes around the control chip on the substrate for locking the heat sink. The present disclosure utilizes the locking holes 26 of the carriage 18 to lock the heat sink without adding additional holes. On the one hand, the fixing effect of the heat sink 20 is improved, and on the other hand, the rigidity around the control chip can be increased.

Please refer to Fig. 6, which further illustrates the structural composition of the fixing device 16 according to an embodiment of the present disclosure. Fig. 6 is a three-dimensional diagram of a portion 10a of the heat dissipation structure 10 of the electronic component.

As shown in FIG. 6 , in the partial structure 10a of the heat dissipation structure 10 of the electronic component, the case where the fixing device 16 has not yet been joined with the communication component 36 is used as an example for explanation. The communication component 36 includes a component 28 disposed below the substrate 12, the substrate 12, a control chip 22 disposed above the substrate 12, a bracket 18, and a connector 14. In FIG. 6 , the fixing device 16 is a separate fixing device, which includes a first portion 16a, a second portion 16b, a third portion 16c, and a fourth portion 16d, which are respectively used to fix the connector 14 in the communication component 36, and the separate fixing device 16 does not overlap with the bracket 18.

Please refer to Fig. 7, which further illustrates the structural composition of the fixing device 16 according to an embodiment of the present disclosure. Fig. 7 is a three-dimensional diagram of a portion 10b of the heat dissipation structure 10 of the electronic component.

As shown in FIG. 7 , in the partial structure 10b of the heat dissipation structure 10 of the electronic component, the fixing device 16 is not yet connected to the communication component 36 ′ as an example for explanation. The communication component 36 ′ includes a component 28 disposed below the substrate 12, the substrate 12, and a control chip 22 disposed above the substrate 12 and a connector 14. In FIG. 7 , the fixing device 16 is an integrated fixing device, for example, the bracket structure shown in FIG. 6 is integrated therein. In addition to fixing the connector 14 in the communication component 36 ′, the integrated fixing device 16 can also provide a heat dissipation device lock.

Please refer to Figures 8A and 8B, according to an embodiment of the present disclosure, the elastic structure 38 disposed in the fixing device 16 is further described. Figure 8A is a top view of the fixing device 16 in the heat dissipation structure 10 of the electronic component. Figure 8B is a cross-sectional view obtained along the A-A' section line of Figure 8A.

As shown in FIGS. 8A and 8B , each elastic structure 38 in the fixing device 16 has a first end 38a and a second end 38b, and at least one of the first end 38a and the second end 38b is embedded in the fixing device 16. In the embodiment shown in FIGS. 8A and 8B , both the first end 38a and the second end 38b of the elastic structure 38 are embedded in the fixing device 16.

The fixing device 16 shown in FIGS. 8A and 8B can provide each connector with an appropriate positive pressure, and the elastic structure 38 in the device can further control the positive pressure to stabilize the connector on the substrate.

Please refer to Figures 9A and 9B, according to an embodiment of the present disclosure, the elastic structure 38' disposed in the fixing device 16 is further described. Figure 9A is a top view of the fixing device 16 in the heat dissipation structure 10 of the electronic component. Figure 9B is a cross-sectional view obtained along the B-B' section line of Figure 9A.

As shown in FIGS. 9A and 9B , each elastic structure 38′ in the fixing device 16 has a first end 38′a and a second end 38′b, and at least one of the first end 38′a and the second end 38′b is embedded in the fixing device 16. In the embodiment shown in FIGS. 9A and 9B , the first end 38′a of the elastic structure 38′ is embedded in the fixing device 16, while the second end 38′b is suspended and not embedded in the fixing device 16.

The fixing device 16 shown in Figures 9A and 9B can provide each connector with appropriate positive pressure, and the elastic structure 38' in the device can further control the downward positive force to stabilize the connector on the substrate.

Please refer to Figures 10A, 10B and 10C, according to an embodiment of the present disclosure, further illustrating the assembly sequence of the bracket 18, the connector 14, the fixing device 16, and the heat dissipation device 20 in the heat dissipation structure 10 of the electronic component and the configuration relationship between the components. Figure 10A is an exploded view of the heat dissipation structure 10 of the electronic component. Figure 10B is a top view of a portion of the structure 10' in the heat dissipation structure 10 of the electronic component. Figure 10C is a cross-sectional view obtained along the C-C' section line of Figure 10B.

As shown in FIG. 10A , the carriage 18, the connector 14, the fixing device 16, and the heat sink 20 are assembled. First, the carriage 18 is locked to the first surface 12a (upper surface) of the substrate 12 by eight studs 40 and fixed around the control chip 22. The carriage 18 has four locking holes 26 for subsequent locking of the heat sink 20. The substrate 12 is provided with a component 28 on the second surface 12b (lower surface) of the carriage 18 opposite to the substrate 12. Afterwards, the connector 14 is assembled to the substrate 12. Next, the separate fixing device 16 (including the first part 16a, the second part 16b, the third part 16c, and the fourth part 16d) is locked to the substrate 12 by twenty screws 42 (divided into four groups) to fix the connector 14 located around the control chip 22. Afterwards, the heat sink 20 is locked onto the bracket 18 through the lock holes 26 of the bracket 18 by four spring screws (not shown), thereby completing the assembly of the heat sink structure 10 for the electronic component.

As shown in FIG. 10B , the above view further illustrates the arrangement relationship between the components on the substrate 12. The carriage 18 is locked to the substrate 12 by 8 studs (not shown) and fixed around the control chip 22. The carriage 18 has 4 locking holes 26 for subsequent locking of the heat sink 20. The separate fixing device 16 (including the first part 16a, the second part 16b, the third part 16c, and the fourth part 16d) is locked to the substrate 12 by 20 screws 42 (divided into four groups) to fix the connector 14 located around the control chip 22.

As shown in FIG. 10C , in a cross-sectional view, a member 28 is provided on the lower surface of the base plate 12. The carriage 18 is locked to the base plate 12 by means of a stud 40. The carriage 18 has a locking hole 26 for subsequent locking of the heat sink 20. The separate fixing device 16 (e.g., the first portion 16a) is locked to the base plate 12 by means of a screw 42.

Please refer to Figures 11A and 11B for further explanation of the structural composition of the component 28 according to an embodiment of the present disclosure. Figures 11A and 11B are three-dimensional diagrams of the component 28 in the heat dissipation structure 10 of the electronic component.

As shown in FIG. 11A , the first surface 28 a of the component 28 has a plurality of grooves 44 and a plurality of openings 46. The grooves 44 of the component 28 can be used to accommodate the power module 30 disposed on the second surface 12 b of the substrate 12 as shown in FIG. 4 , for example, 19 DC-to-DC converters can be accommodated. In some embodiments, a medium such as a gap filler is further filled between the grooves 44 and the power module 30, which can absorb various assembly tolerances on the one hand, and transfer the heat released by the power module 30 to the component 28 on the other hand. The number of grooves 44 of the component 28 is not limited, for example, there are 8 grooves (as shown in the embodiment of FIG. 11A ), which mainly depends on the number of components of the power module 30. In addition, as shown in FIG. 4 , the second connector 32 disposed on the second surface 12b of the substrate 12 can be exposed from the opening 46 of the component 28. The exposed second connector 32 can be further connected to an external substrate.

As shown in FIG. 11B , a plurality of fins 48 are disposed on the second surface 28 b of the component 28. When the heat released by the power module 30 is transferred to the component 28, the fins 48 disposed on the second surface 28 b can achieve a heat dissipation effect through conduction.

The component 28 disposed at the bottom of the substrate 12 of the present disclosure not only has the function of conducting and dissipating heat, but also can enhance the rigidity of the entire substrate.

Please refer to Figure 12, which further illustrates the bonding state of the partial structure 10' of the heat dissipation structure 10 of the electronic component and the external substrate according to an embodiment of the present disclosure. Figure 12 is a three-dimensional diagram of the bonding state of the partial structure 10' of the heat dissipation structure 10 of the electronic component and the external substrate.

As shown in FIG. 12 , a partial structure 10′ of the heat dissipation structure 10 of the electronic component is disposed on the second substrate 50, wherein the partial structure 10′ of the heat dissipation structure 10 of the electronic component is electrically connected to the second substrate 50 by connecting a second connector (not shown) disposed on the second surface of the substrate in the partial structure 10′ of the heat dissipation structure 10 of the electronic component with a third connector 52 of the second substrate 50. In some embodiments, the second substrate 50 may include a printed circuit board (PCB).

The components of some of the above embodiments are provided so that those with ordinary knowledge in the art to which the present disclosure belongs can better understand the viewpoints of the embodiments of the present disclosure. Those with ordinary knowledge in the art to which the present disclosure belongs should understand that they can design or modify other processes and structures based on the embodiments of the present disclosure to achieve the same purpose and/or advantages as the embodiments introduced herein. Those with ordinary knowledge in the art to which the present disclosure belongs should also understand that such equivalent structures do not deviate from the spirit and scope of the present disclosure, and they can make various changes, substitutions and replacements without violating the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be defined by the scope of the attached patent application. In addition, although the present disclosure has been disclosed as above with several preferred embodiments, it is not used to limit the present disclosure.

References throughout this specification to features, advantages, or similar language do not imply that all features and advantages that may be achieved using the present disclosure should or may be achieved in any single embodiment of the present disclosure. Rather, language referring to features and advantages is understood to mean that a particular feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the present disclosure. Thus, discussion of features and advantages and similar language throughout this specification may, but does not necessarily, refer to the same embodiment.

Furthermore, the described features, advantages, and characteristics of the present disclosure may be combined in any suitable manner in one or more embodiments. Based on the description herein, a person skilled in the relevant art will recognize that the present disclosure may be implemented without one or more of the specific features or advantages of a particular embodiment. In other cases, additional features and advantages may be identified in certain embodiments that may not be present in all embodiments of the present disclosure.

10: Heat dissipation structure of electronic components

10', 10a, 10b: Partial structure of heat dissipation structure of electronic components

12: Substrate

12a: first surface of substrate

12b: Second surface of substrate

12e: Outer edge of substrate

14: Connector

14a: Connector interface

14t: Top surface of connector

16:Fixed device

16a: First part of the fixing device

16b: Second part of the fixing device

16c: The third part of the fixing device

16d: The fourth part of the fixing device

18:Trailer

20: Heat dissipation device

22: Control chip

24: Connector fixing seat

24a: First end of connector holder

24b: Second end of connector fixing base

26: Keyhole

28: Components

28a: first surface of component

28b: Second surface of component

30: Power module

32: Second connector

34: Hole position

36,36’: Communication components

38,38’: Elastic structure

38a,38’a: First end of the elastic structure

38b, 38’b: Second end of the elastic structure

40: Stud

42: Screw

44: Groove

46: Opening

48: Fins

50: Second substrate

52: Third connector

The following will be described in detail with the accompanying drawings. It should be noted that the various characteristic components are not drawn to scale and are only used for illustration. In fact, the size of the components may be enlarged or reduced to clearly show the technical features of the disclosed embodiment. Figure 1 is an exploded view of a heat dissipation structure (optical signal) of an electronic component according to an embodiment of the present disclosure; Figure 2 is an exploded view of a heat dissipation structure (electrical signal) of an electronic component according to an embodiment of the present disclosure; Figure 3 is a three-dimensional view of a part of the structure in the heat dissipation structure of an electronic component according to an embodiment of the present disclosure; Figure 4 is a three-dimensional view of a part of the structure in the heat dissipation structure of an electronic component according to an embodiment of the present disclosure; Figure 5 is a schematic diagram of a bracket in the heat dissipation structure of an electronic component according to an embodiment of the present disclosure; Figure 6 is a three-dimensional view of a fixing device in the heat dissipation structure of an electronic component according to an embodiment of the present disclosure; Figure 7 is a three-dimensional view of a fixing device in the heat dissipation structure of an electronic component according to an embodiment of the present disclosure; FIG. 8A is a top view of a fixing device in a heat dissipation structure of an electronic component according to an embodiment of the present disclosure; FIG. 8B is a cross-sectional view of a fixing device in a heat dissipation structure of an electronic component according to an embodiment of the present disclosure; FIG. 9A is a top view of a fixing device in a heat dissipation structure of an electronic component according to an embodiment of the present disclosure; FIG. 9B is a cross-sectional view of a fixing device in a heat dissipation structure of an electronic component according to an embodiment of the present disclosure; FIG. 10A is an exploded view of a heat dissipation structure of an electronic component according to an embodiment of the present disclosure; FIG. 10B is a top view of a part of a heat dissipation structure of an electronic component according to an embodiment of the present disclosure; FIG. 10C is a cross-sectional view of a part of a heat dissipation structure of an electronic component according to an embodiment of the present disclosure; FIG. 11A is a three-dimensional diagram of a component in a heat dissipation structure of an electronic component according to an embodiment of the present disclosure; FIG. 11B is a three-dimensional diagram of a component in a heat dissipation structure of an electronic component according to an embodiment of the present disclosure; and FIG. 12 is a three-dimensional diagram of a partial structure of a heat dissipation structure of an electronic component and a bonding state with an external substrate according to an embodiment of the present disclosure.

10: Heat dissipation structure of electronic components

10’: Partial structure of the heat dissipation structure of the electronic component

12: Substrate

12a: first surface of substrate

12b: Second surface of substrate

12e: Outer edge of substrate

14: Connector

14a: Connector interface

14t: Upper surface of the connector

16:Fixed device

18:Trailer

20: Heat dissipation device

22: Control chip

24: Connector fixing seat

24a: First end of connector holder

24b: Second end of connector holder

26: Keyhole

28: Components

Claims (11)

A heat dissipation structure of an electronic component includes: a substrate having a first surface and a second surface, the first surface being provided with a control chip and a plurality of connector fixing seats, each of the connector fixing seats having a first end and a second end, the first ends being arranged toward the outer edge of the substrate, and the second surface of the substrate being provided with a component to reinforce the strength of the substrate and provide heat conduction; a plurality of connectors being arranged on the connector fixing seats of the substrate, and an interface of each of the connectors being located at the first end of each of the connector fixing seats; a fixing device for fixing the connectors on the substrate; a bracket being arranged and fixed on the substrate and located at the second ends of the connector fixing seats, the bracket having at least one keyhole; and a heat dissipation device being fixed on the substrate through the keyhole of the bracket. A heat dissipation structure of an electronic component as claimed in claim 1, wherein the substrate includes a printed circuit board (PCB). A heat dissipation structure for an electronic component as claimed in claim 1, wherein the connectors include an optical engine or an electrical signal connector. A heat dissipation structure of an electronic component as claimed in claim 1, wherein the connectors surround the control chip. A heat dissipation structure of an electronic component as claimed in claim 1, wherein the fixing device includes an integrated fixing device or a separate fixing device. A heat dissipation structure for an electronic component as claimed in claim 1, wherein the carrier surrounds the control chip. As in claim 1, the heat dissipation structure of the electronic component, wherein the fixing device is provided with a plurality of elastic structures to elastically press against the upper surfaces of the connectors respectively. As in claim 7, the heat dissipation structure of the electronic component, wherein each of the elastic structures has a first end and a second end, and at least one of the first end and the second end is embedded in the fixing device. The heat dissipation structure of the electronic component of claim 1, wherein the second surface of the substrate is provided with a power module and a plurality of second connectors. As in claim 9, the heat dissipation structure of the electronic component, wherein the component has a first surface and a second surface, the first surface has a plurality of grooves to accommodate the power module, and the second surface is provided with a plurality of fins. As for the heat dissipation structure of the electronic component of claim 9, the heat dissipation structure of the electronic component further includes being arranged on a second substrate and electrically connected to the second substrate through the second connectors.

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