TWI847036B - Floor structure with sound insulation layer and manufacturing method thereof - Google Patents

Abstract

A floor structure with a sound insulation layer and a manufacturing method thereof, wherein a sound insulation material containing rubber and styrene resin are mixed to form a viscous colloid mixture, and the mixture is evenly applied between the entire lower cement layer and the upper cement layer to form a sound insulation pad that covers the entire surface, so that after drying, it can be tightly attached between the lower cement layer and the upper cement layer. Since the sound insulation pad is a structure that covers the entire surface, no gaps will be generated, and a complete sound insulation effect can be achieved. Furthermore, since the styrene resin in the composition of the sound insulation pad is a waterproof structure, the sound insulation pad can have a complete waterproof function, which can prevent the liquid from the upper floor tiles from penetrating into the lower cement layer and leaking out to the lower building space, thereby avoiding the problem of water leakage.

Description

Floor structure with sound insulation layer and manufacturing method thereof

The present invention relates to a floor structure, in particular to a floor structure with a sound insulation layer and a manufacturing method thereof.

The floors of traditional buildings are mainly made of reinforced concrete. This structure has poor sound insulation effect, which makes it easy for the sounds from upper and lower floors to penetrate the floor and interfere with each other, generating unnecessary noise and affecting the quality of life. Therefore, more and more buildings now require their floors to have sound insulation structures to reduce sound interference between different floors and achieve the purpose of reducing noise.

The current soundproof floor structure is mainly to lay multiple soundproof pads on the cement floor of the building's interior space, and then lay a layer of cement on top of the soundproof pads to form a soundproof floor structure. This type of soundproof pad is usually a soft, small sheet of solid material. When laying, it needs to be spliced together piece by piece, and the adjacent parts are connected with adhesive materials such as tape.

However, the above-mentioned sound insulation pads still have gaps at the joints, so it is easy for noise to penetrate the concrete floor through these gaps, and it is impossible to achieve a good sound insulation effect. In addition, these gaps are also easy for liquids to penetrate, causing water leakage. Moreover, this type of sound insulation pad is already in a solid state during manufacturing (for example, made of cloth), so it cannot form a tight bond with the upper and lower layers of cement, affecting the sound insulation effect of the entire structure.

Therefore, this case hopes to propose a new floor structure with a sound insulation layer and its manufacturing method to solve the above-mentioned defects in the previous technology.

Therefore, the purpose of the present invention is to solve the above-mentioned problems in the prior art. The present invention proposes a floor structure with a sound insulation layer and a manufacturing method thereof, wherein a sound insulation material containing rubber and styrene resin are mixed to form a viscous colloid mixture, and the mixture is evenly applied between the entire lower cement layer and the upper cement layer to form a sound insulation pad that covers the entire surface, so that after drying, the sound insulation pad can be tightly attached between the lower cement layer and the upper cement layer. Since the sound insulation pad is a structure that covers the entire surface, no gaps are generated, and a complete sound insulation effect can be achieved, which can reduce noise by 17dB. Furthermore, since the styrene resin in the sound insulation pad is a waterproof structure, the sound insulation pad can have a complete waterproof function, which can prevent the liquid from the upper floor tiles from seeping into the lower cement layer and leaking into the lower building space, thus avoiding the problem of water leakage.

To achieve the above-mentioned purpose, the present invention provides a method for manufacturing a floor structure with a sound insulation layer, comprising the following steps: applying a batch of cement mortar on a construction surface, and forming a lower cement layer after it dries; mixing a sound insulation material with a styrene-acrylic resin to form a gel mixture, wherein the sound insulation material is in a granular or powdery form and its components mainly include rubber; the styrene-acrylic resin is a mixture of styrene and acrylic acid. A viscous colloidal polymer formed by mixing cement and water; the colloidal mixture is applied on the top of the lower cement layer, and after drying for a specific period of time, a sound insulation pad layer is formed; another batch of cement mortar is applied on the top of the sound insulation pad layer, and after drying, an upper cement layer is formed; thus, the lower cement layer, the sound insulation pad layer and the upper cement layer form a multi-layer floor structure as a whole; the cement mortar constituting the lower cement layer and the upper cement layer is a mixture of cement, sand and water.

This case also proposes a floor structure with a sound insulation layer, comprising a lower cement layer, which is composed of solidified cement mortar; a sound insulation pad layer, which is located above the lower cement layer; the sound insulation pad layer is composed of a mixture of granular or powdered sound insulation material and styrene-acrylic resin; the sound insulation material contains rubber; the styrene-acrylic resin is a polymer formed by styrene (Phenylethene) and acrylic acid (Acrylic acid); an upper cement layer, which is composed of solidified cement mortar, and the upper cement layer is located above the sound insulation pad layer; and the cement mortar constituting the lower cement layer and the upper cement layer is a mixture of cement, sand and water.

The following description will provide a better understanding of the features and advantages of the present invention. Please refer to the attached figures while reading.

1: Floor structure

10: Lower cement layer

15: Cement mortar

20: Sound insulation pad

21: Sound insulation material

22: Styrene acrylic resin

25:Colloidal mixture

30: Apply cement layer

35: Cement mortar

40: Tile layer

41: Floor tiles

100: Construction surface

Figure 1 shows a schematic diagram of the component combination of this case.

Figure 2 shows the schematic diagram of the component breakdown of this case.

Figure 3 shows a partial cross-sectional diagram of the component assembly of this case.

Figure 4 shows another schematic diagram of component combination in this case.

Figure 5 shows a schematic cross-sectional view of the lower cement layer formed in this case.

Figure 6 shows a schematic cross-sectional view of the sound insulation pad layer formed in this case.

Figure 7 shows a partial enlarged schematic diagram of Figure 6.

Figure 8 shows a schematic cross-sectional view of the upper cement layer formed in this case.

Figure 9 shows a schematic cross-sectional view of the floor tile layer formed in this case.

The following is a detailed description of the structural composition of this case, the effects and advantages it can produce, and a preferred embodiment of this case with the help of diagrams.

Please refer to Figures 5 to 9, the manufacturing method of the floor structure 1 with a sound insulation layer in this case includes the following steps:

A batch of cement mortar 15 is applied on a construction surface 100 and formed into a lower cement layer 10 after drying (as shown in FIG. 5 ).

The sound insulation material 21 and the styrene-acrylic resin 22 are mixed to form a colloidal mixture 25, wherein the sound insulation material 21 is in a granular or powdery form and its components mainly include rubber. The styrene-acrylic resin 22 is a viscous colloidal polymer formed by styrene (Phenylethene) and acrylic acid (Acrylic acid). The weight mixing ratio of the sound insulation material 21 and the styrene-acrylic resin 22 is (0.8~1.2): (1.6~2.4).

The components of the sound insulation material 21 may also include at least one of PE (polyethylene) or wood chips, wherein the PE (polyethylene) or wood chips are also in granular or powder form, and the weight mixing ratio of the "PE (polyethylene) or wood chips" to the rubber is 1: (0.5~1.5).

The colloidal mixture 25 is applied on top of the lower cement layer 10 and dried for a specific period of time to form a sound insulation pad 20 (as shown in Figures 6 and 7).

Another batch of cement mortar 35 is applied on top of the sound insulation pad layer 20, and after drying, an upper cement layer 30 is formed (as shown in FIG6 ). Preferably, the thickness of the upper cement layer 30 is 3 to 10 cm. Therefore, the lower cement layer 10, the sound insulation pad layer 20 and the upper cement layer 30 form a multi-layer floor structure 1 as a whole (as shown in FIG1 and FIG8 ).

The cement mortar 15, 35 constituting the lower cement layer 10 and the upper cement layer 30 is a mixture of cement, sand and water.

In this case, multiple floor tiles 41 can be laid on top of the upper cement layer 30 to form a floor tile layer 40 (as shown in FIG. 9 ).

As shown in Figures 1 and 2, the floor structure 1 with a sound insulation layer manufactured by the above method in this case includes the following elements: a lower cement layer 10, which is composed of solidified cement mortar 15.

A sound insulation pad layer 20 is located above the lower cement layer 10. As shown in FIG3 , the sound insulation pad layer 20 is composed of a mixture of a granular or powdered sound insulation material 21 and a styrene-acrylic resin 22. The sound insulation material 21 mainly includes rubber. The styrene-acrylic resin 22 is a viscous polymer formed by styrene and acrylic acid. The weight mixing ratio of the sound insulation material 21 to the styrene-acrylic resin 22 is (0.8~1.2): (1.6~2.4).

Preferably, the sound insulation material 21 may further include at least one of PE (polyethylene) or wood chips, wherein the PE (polyethylene) or wood chips are also in granular or powder form, and the weight mixing ratio of the "PE (polyethylene) or wood chips" to the rubber is 1: (0.5~1.5).

An upper cement layer 30 is formed of solidified cement mortar 35, and the upper cement layer 30 is located above the sound insulation pad layer 20. Preferably, the thickness of the upper cement layer 30 is 3-10 cm.

The cement mortar 15, 35 constituting the lower cement layer 10 and the upper cement layer 30 is a mixture of cement, sand and water.

As shown in FIG. 4 , the present case further includes a floor tile layer 40 located above the upper cement layer 30 , and the floor tile layer 40 includes a plurality of floor tiles 41 , and the plurality of floor tiles 41 are located above the upper cement layer 30 .

The advantage of this case is that a sound insulation material containing rubber and styrene resin are mixed to form a viscous colloid mixture, and evenly applied between the entire lower cement layer and the upper cement layer to form a sound insulation pad that covers the entire surface. Therefore, after drying, it can be tightly attached between the lower cement layer and the upper cement layer. Since the sound insulation pad is a structure that covers the entire surface, no gaps will be generated, and it can have a complete sound insulation effect, which can reduce noise by 17dB. Furthermore, since the styrene resin in the composition of the sound insulation pad is a waterproof structure, the sound insulation pad can have a complete waterproof function, which can prevent the liquid from the upper floor tiles from penetrating into the lower cement layer and leaking out to the lower building space, thus avoiding water leakage problems.

In summary, the humanized and considerate design of this case meets the actual needs. Its specific improvement of existing deficiencies is obviously a breakthrough in the known technology, and it does have the effect of enhancing the effectiveness, which is not easy to achieve. This case has not been published or disclosed in domestic and foreign literature and markets, and it has complied with the provisions of the Patent Law.

The above detailed description is a specific description of a feasible embodiment of the present invention, but the embodiment is not intended to limit the patent scope of the present invention. Any equivalent implementation or modification that does not deviate from the technical spirit of the present invention should be included in the patent scope of this case.

1: Floor structure

10: Lower cement layer

20: Sound insulation pad

30: Apply cement layer

Claims (11)

A method for manufacturing a floor structure with a sound insulation layer, comprising the following steps: Apply a batch of cement mortar on a construction surface and wait for it to dry to form a cement layer; The sound insulation material is mixed with styrene-acrylic resin to form a colloidal mixture, wherein the sound insulation material is in granular or powder form and its components mainly include rubber; the styrene-acrylic resin is a viscous colloidal polymer formed by styrene (Phenylethene) and acrylic acid (Acrylic acid); The gelatinous mixture is applied on top of the lower cement layer and dried for a specific period of time to form a sound insulation pad; Another batch of cement mortar is applied on top of the sound insulation pad layer, and after drying, an upper cement layer is formed; thus, the lower cement layer, the sound insulation pad layer and the upper cement layer as a whole form a multi-layer floor structure; The cement mortar constituting the lower cement layer and the upper cement layer is a mixture of cement, sand and water. The manufacturing method of the floor structure with a sound insulation layer as described in Item 1 of the patent application scope, wherein the weight mixing ratio of the sound insulation material and the styrene acrylic resin is (0.8~1.2): (1.6~2.4). As described in item 1 of the patent application, the method for manufacturing a floor structure with a sound insulation layer, wherein the sound insulation material also includes at least one of PE (polyethylene) or wood chips, wherein the PE (polyethylene) or wood chips are also in granular or powdered form. The manufacturing method of the floor structure with a sound insulation layer as described in item 3 of the patent application scope, wherein the weight mixing ratio of the "PE (polyethylene) or wood chips" and the rubber is 1: (0.5~1.5). The manufacturing method of the floor structure with a sound insulation layer as described in Item 1 of the patent application scope, wherein the thickness of the upper cement layer is 3 to 10 cm. The manufacturing method of the floor structure with a sound insulation layer as described in Item 1 of the patent application scope further includes the step of laying a plurality of floor tiles on the upper cement layer to form a floor tile layer. A floor structure with a sound insulation layer comprises: a lower cement layer, which is composed of solidified cement mortar; a sound insulation pad layer, which is located above the lower cement layer; the sound insulation pad layer is composed of a mixture of granular or powdered sound insulation material and styrene-acrylic resin; the sound insulation material comprises rubber; the styrene-acrylic resin is a polymer formed by styrene and acrylic acid; an upper cement layer, which is composed of solidified cement mortar, and the upper cement layer is located above the sound insulation pad layer; and the cement mortar constituting the lower cement layer and the upper cement layer is a mixture of cement, sand and water. The floor structure with a sound insulation layer as described in Item 7 of the patent application, wherein the weight mixing ratio of the sound insulation material and the styrene acrylic resin is (0.8~1.2):(1.6~2.4). As described in item 7 of the patent application, the floor structure with a sound insulation layer, wherein the sound insulation material also includes at least one of PE (polyethylene) or wood chips, wherein the PE (polyethylene) or wood chips are also in granular or powdered form. The floor structure with a sound insulation layer as described in Item 9 of the patent application, wherein the weight mixing ratio of the "PE (polyethylene) or wood chips" and the rubber is 1: (0.5~1.5). The floor structure with a sound insulation layer as described in Item 7 of the patent application, wherein the thickness of the upper cement layer is 3 to 10 cm.

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