TWI846354B - Packaging structure and its preparation method - Google Patents

Abstract

The present application provides a packaging structure, including a first transparent substrate, a support, a second transparent substrate, an optical lens element, a packaging element and an optical device. The first transparent substrate includes a first surface and a second surface. The second transparent substrate comprises a third surface facing the first transparent substrate and is stacked with the second transparent substrate. The support is connected to the second surface and the third surface. The optical lens element is located in a first containing cavity and fixed on the third surface. The optical lens element and the optical device overlap. The packaging element includes a substrate and an electrode. The substrate is fixed on the first surface and forms a second containing cavity with the first transparent substrate. The optical device is arranged in the second containing cavity. The packaging structure provided by the application can improve the yield and service life. The application also provides a preparation method of the packaging structure.

Description

Packaging structure and method for preparing packaging structure

This work involves the field of optical packaging structures, specifically a packaging structure and a method for preparing the packaging structure.

The known optical packaging structure usually includes a transparent substrate and optical devices and optical lens assemblies disposed on two opposite surfaces of the transparent substrate. The optical device may include a light emitter, such as a VCSEL laser. The optical lens assembly includes but is not limited to a lens, a super lens, and a micro lens array. However, the optical lens assembly is exposed to the air, and it is easy to cause abrasion and scratches on the optical lens assembly during the manufacturing, use or transportation process, which affects the yield and service life of the packaging structure.

In view of this, this invention provides a packaging structure that can improve yield and service life.

This invention also provides a method for preparing the packaging structure.

The invention provides a packaging structure. The packaging structure includes a first transparent substrate, a support, a second transparent substrate, an optical lens assembly, a packaging assembly and an optical device; the first transparent substrate includes a first surface and a second surface opposite to the first surface, the first transparent substrate and the second transparent substrate are stacked in a first direction, the second transparent substrate includes a third surface facing the first transparent substrate, the support is connected to the second surface and the third surface, the first transparent substrate, the second transparent substrate and the support together form a first receiving cavity ; The optical lens assembly is located in the first receiving cavity and fixed to the third surface, the optical device is fixed to the first surface or spaced apart from the first surface, and the optical lens assembly and the optical device overlap in the first direction; the packaging assembly includes a substrate and an electrode, the substrate is fixed to the first surface, the substrate and the first transparent substrate together form a second receiving cavity, the optical device is disposed in the second receiving cavity, and the electrode is electrically connected to the optical device and disposed away from the first surface.

Optionally, the second surface is provided with a receiving groove, and the packaging structure further includes a first adhesive layer, which is provided in the receiving groove and connects the supporting member and the first transparent substrate.

Optionally, the optical device is a light emitter, and the optical device is fixed to the first surface.

Optionally, the optical device is an imaging sensor, and the packaging structure further includes a second adhesive layer, the second adhesive layer connects the first surface and the surface of the substrate away from the electrode, the second adhesive layer is located outside the overlapping area of the optical device and the optical lens assembly, and the optical device is spaced from the first surface.

Optionally, the packaging structure further includes a light blocking member, the light blocking member connects the third surface and the surface of the support member facing away from the first transparent substrate, and the light blocking member is disposed around the periphery of the optical lens assembly.

This invention also provides a method for preparing a packaging structure, the preparation method comprising: providing a first packaging unit, the first packaging unit comprising a first transparent substrate, a packaging assembly and an optical device, the first transparent substrate comprising a first surface and a second surface opposite to the first surface, the packaging assembly comprising a substrate and an electrode, the substrate being fixed to the first surface, the substrate and the first transparent substrate jointly forming a second receiving cavity, the electrode being electrically connected to the optical device and being arranged away from the first surface, the optical device being fixed to the first surface or spaced apart from the first surface, and the optical device being arranged in the second receiving cavity; Providing a second packaging unit Unit, the second packaging unit includes a second transparent substrate, a support member and an optical lens assembly, the second transparent substrate includes a third surface facing the first transparent substrate, the support member is connected to the third surface and is surrounded by the third surface to form a receiving cavity, the optical lens assembly is located in the receiving cavity and fixed to the third surface; the first packaging unit and the second packaging unit are stacked and the support member and the second surface are connected, so that the first transparent substrate and the second transparent substrate are stacked in a first direction, the receiving cavity forms a first receiving cavity, and the optical lens assembly and the optical device overlap in the first direction.

Optionally, the second surface is provided with a receiving groove, and the preparation method of the packaging structure further includes: Forming a first adhesive layer in the receiving groove, the first adhesive layer connecting the supporting member and the first transparent substrate.

Optionally, the optical device is a light emitter, and the optical device is fixed to the first surface.

Optionally, the preparation method of the packaging structure further includes: forming a second adhesive layer connecting the first surface and the surface of the substrate away from the electrode, the second adhesive layer is located outside the overlapping area of the optical device and the optical lens assembly; the optical device is spaced from the first surface, and the optical device is an imaging sensor.

Optionally, the second packaging unit further includes a light blocking member, the light blocking member connects the third surface and the surface of the support member facing away from the first transparent substrate, and the light blocking member is disposed around the periphery of the optical lens assembly.

Compared with the prior art, the first transparent substrate, the second transparent substrate and the support member of the invention are surrounded to form a first receiving cavity, and the optical lens assembly is arranged in the first receiving cavity to realize the packaging protection of the optical lens assembly. The substrate is connected to the first surface of the first transparent substrate and forms a second receiving cavity. The optical device is located in the second receiving cavity to realize the packaging protection of the optical device. Therefore, the invention can prevent external forces from scratching the optical device and the optical lens assembly, which is beneficial to improve the yield and service life of the packaging structure.

100,200:Packaging structure

10: First transparent substrate

101: First surface

102: Second surface

103: Storage tank

106,106′: First packaging unit

20: Support parts

201: First receiving chamber

202: Second receiving chamber

204,204′: Second packaging unit

30: Second transparent substrate

301: Third surface

40:Optical lens assembly

50:Packaging components

51: Substrate

52: Electrode

60,60′: Optical devices

70: First bonding layer

80: Second adhesive layer

90: Light blocking piece

X: First direction

R: Spacing

S301, S302, S303: Steps

FIG1 is a schematic cross-sectional view of a packaging structure provided in one embodiment of the present invention; FIG2 is a schematic cross-sectional view of a packaging structure provided in another embodiment of the present invention; FIG3 is a flow chart of a method for preparing a packaging structure provided in one embodiment of the present invention.

The following will combine the attached figures in the embodiments of this invention to clearly and completely describe the technical solutions in the embodiments of this invention. Obviously, the embodiments described are only part of the embodiments of this invention, not all of them.

It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there can be a central component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there can be a central component at the same time. When a component is considered to be "set on" another component, it can be directly set on the other component or there can be a central component at the same time.

Unless otherwise defined, all technical and scientific terms used in this article have the same meaning as those commonly understood by technicians in the technical field of this creation. The terms used in this article in the description of this creation are only for the purpose of describing specific embodiments and are not intended to limit this creation.

In order to further explain the technical means and effects adopted by this creation to achieve the intended purpose, the following is a detailed description of this creation in combination with attached pictures and the best implementation method.

Implementation Example 1:

Referring to FIG. 1 , the present invention provides a packaging structure 100, which includes a first transparent substrate 10, a support 20, a second transparent substrate 30, an optical lens assembly 40, a packaging assembly 50 and an optical device 60.

The first transparent substrate 10 includes a first surface 101 and a second surface 102 opposite to the first surface 101. The first transparent substrate 10 and the second transparent substrate 30 are stacked in a first direction X. The second transparent substrate 30 includes a third surface 301 facing the first transparent substrate 10. The materials of the first transparent substrate 10 and the second transparent substrate 30 can be epitaxial wafers, transparent polymer materials, glass, silicon, germanium or semiconductor compounds. The support member 20 is connected to the second surface 102 and the third surface 301. The first transparent substrate 10, the second transparent substrate 30 and the support member 20 together form a first accommodating cavity 201. The material of the support member 20 can include a semiconductor material or a polymer material. The optical lens assembly 40 includes but is not limited to a super lens, a diffraction element or a lens array. In this embodiment, the optical lens assembly 40 may be a super lens. The optical lens assembly 40 is located in the first accommodating cavity 201 and fixed to the third surface 301. The optical device 60 is fixed to the first surface 101 or spaced apart from the first surface 101. The optical device 60 is fixed to the first surface 101 to reduce the volume of the package structure 100 in the first direction X. The optical lens assembly 40 and the optical device 60 overlap in the first direction X.

The packaging assembly 50 includes a substrate 51 and an electrode 52. The substrate 51 is fixed to the first surface 101. The substrate 51 and the first transparent substrate 10 together form a second receiving cavity 202. The optical device 60 is disposed in the second receiving cavity 202. The electrode 52 is electrically connected to the optical device 60 and is disposed away from the first surface 101.

In a specific embodiment, the number of the electrodes 52 can be at least two, a portion of the electrodes 52 is an n-electrode, and another portion of the electrodes 52 is a p-electrode. The substrate 51 can be provided with a conductive circuit. The n-type conductive electrode 52 is electrically connected to the n-type conductive electrode layer of the optical device 60 through the substrate 51, and the p-type conductive electrode 52 is electrically connected to the p-type conductive electrode layer of the optical device 60 through the substrate 51. When the electrode 52 is connected to a power supply device, the optical device 60 generates a light source or images the received light source.

In another embodiment, the substrate 51 may be only an insulating substrate. The electrode 52 may pass through the substrate 51 and connect to the electrode layer of the optical device 60.

The optical device 60 includes but is not limited to a light emitter or an imaging sensor. In this embodiment, the optical device 60 is a light emitter, such as a vertical cavity surface emitting laser (VCSEL), an edge emitting laser (EEL), a solid laser or a light laser. The package structure 100 is an emitting end device. At this time, when the electrode 52 is connected to a power supply device, the light-emitting layer of the optical device 60 is stimulated to emit light to generate laser light. The light-emitting surface of the optical device 60 faces the optical lens assembly 40, so that the laser light generated by the optical device 60 passes through the optical lens assembly 40 and generates a convergent beam or a divergent beam.

In some embodiments, the second surface 102 is provided with a receiving groove 103. The packaging structure 100 further includes a first adhesive layer 70. The material of the first adhesive layer 70 can be epoxy or vinyl. The first adhesive layer 70 is disposed in the receiving groove 103 and connects the support member 20 and the first transparent substrate 10. The first adhesive layer 70 connecting the support member 20 and the first transparent substrate 10 is disposed in the receiving groove 103, which can prevent the support member 20 from sliding on the first transparent substrate 10, so as to adjust the distance between the optical device 60 and the optical lens assembly 40, so as to adjust the light source quality or imaging quality of the packaging structure 100.

In another embodiment, the first transparent substrate 10 may not be provided with the receiving groove 103, the packaging structure 100 may not include the first adhesive layer 70, and the supporting member 20 may be directly fixed to the first transparent substrate 10.

In this embodiment, the support member 20 can be directly fixed to the third surface 301. In another embodiment, the support member 20 and the second transparent substrate 30 can also be connected by an adhesive layer.

In this embodiment, one optical lens assembly 40 is disposed in each of the first receiving chambers 201. One optical device 60 is disposed in each of the second receiving chambers 202. In another embodiment, multiple optical lens assemblies 40 may be disposed in each of the first receiving chambers 201. Multiple optical devices 60 may be disposed in each of the second receiving chambers 202.

In some embodiments, when the distance R between the optical device 60 and the optical lens assembly 40 is greater than or equal to 3 μm, the half angle of the laser beam emitted by the package structure 100 is less than or equal to 2.9 degrees.

Example 2:

Referring to FIG. 2 , the present invention provides a package structure 200, which is different from Embodiment 1 in that the optical device 60′ is an imaging sensor, so that the package structure 200 is a receiving end device. The light receiving surface of the optical device 60′ faces the optical lens assembly 40, so that the light source passing through the optical lens assembly 40 is projected onto the optical device 60′ to form an image. The imaging sensor may include a photoelectric conversion assembly (not shown), a filter (not shown) and a microlens assembly (not shown) stacked in sequence. The microlens assembly is closer to the first surface 101 than the filter. The photoelectric conversion assembly is electrically connected to the electrode 52. The photoelectric conversion assembly may be a charge coupled device (CCD). The optical device 60′ is spaced apart from the first surface 101. The optical device 60' is spaced apart from the first surface 101, which can prevent the first transparent substrate 10 from causing wear to the optical device 60'.

In some embodiments, the packaging structure 200 further includes a second adhesive layer 80. The second adhesive layer 80 connects the first surface 101 and the surface of the substrate 51 away from the electrode 52. The second adhesive layer 80 is located outside the overlapping area of the optical device 60' and the optical lens assembly 40.

In some embodiments, the packaging structure 200 further includes a light blocking member 90. The light blocking member 90 connects the third surface 301 and the surface of the support member 20 facing away from the first transparent substrate 10. The light blocking member 90 is arranged around the periphery of the optical lens assembly 40 to block light for the optical lens assembly 40. The material of the light blocking member 90 can be metal or opaque polymer. The light blocking member 90 can be provided to prevent the light incident through the side of the support member 20 facing away from the first receiving cavity 201 from affecting the imaging quality of the imaging sensor. At the same time, it is conducive to widening the material selection of the support member 20, so that the material of the support member 20 can be a transparent material.

In another embodiment, the packaging structure 200 may not include the light blocking member 90.

The first transparent substrate 10, the second transparent substrate 30 and the support member 20 are surrounded to form the first receiving cavity 201, and the optical lens assembly 40 is disposed in the first receiving cavity 201 to realize the packaging protection of the optical lens assembly 40. The substrate 51 is connected to the first surface 101 of the first transparent substrate 10 to form a second receiving cavity 202. The optical device 60 is located in the second receiving cavity 202 to realize the packaging protection of the optical device 60. Therefore, the invention can prevent the optical device 60 and the optical lens assembly 40 from being scratched by external force, which is beneficial to improve the yield and service life of the packaging structure 100 and the packaging structure 200.

Implementation Example 3:

This invention also provides a preparation method for preparing the packaging structure 100. According to different requirements, the order of the steps of the preparation method can be changed, and some steps can be omitted or combined. The preparation method includes the following steps:

Step S301: Referring to FIG. 1 and FIG. 3 , a first packaging unit 106 is provided. The first packaging unit 106 includes a first transparent substrate 10, a packaging assembly 50 and an optical device 60. The first transparent substrate 10 includes a first surface 101 and a second surface 102 opposite to the first surface 101. The packaging assembly 50 includes a substrate 51 and an electrode 52. The substrate 51 is fixed to the first surface 101, and the substrate 51 and the first transparent substrate 10 together form a second receiving cavity 202. The electrode 52 is electrically connected to the optical device 60 and is arranged away from the first surface 101. The optical device 60 is fixed to the first surface 101. The optical device 60 is arranged in the second receiving cavity 202. The optical device 60 includes a light emitter or an imaging sensor. In this embodiment, the optical device 60 can be a light emitter, such as a vertical cavity surface emitting laser (VCSEL), an edge emitting laser (EEL), a solid laser or a light laser. In a specific embodiment, the optical device 60 can be formed on the first surface 101 by metal organic chemical vapor deposition (MOCVD), imprinting technology, photolithography technology, electron beam lithography technology or femtosecond laser direct writing technology. The substrate 51 and the first surface 101 can be connected by imprinting technology.

In some embodiments, referring to FIG. 1 , the second surface 102 is provided with a receiving groove 103 .

Step S302: Referring to FIG. 1 and FIG. 3 , a second packaging unit 204 is provided. The second packaging unit 204 includes a second transparent substrate 30, a support member 20 and an optical lens assembly 40. The second transparent substrate 30 includes a third surface 301 facing the first transparent substrate 10. The support member 20 is connected to the third surface 301 and is surrounded by the third surface 301 to form a receiving cavity (not shown). The support member 20 fixed to the third surface 301 can be formed by an imprinting technique, an etching technique or a metal organic chemical vapor deposition technique. The optical lens assembly 40 is located in the receiving cavity and fixed to the third surface 301. The optical lens assembly 40 includes but is not limited to a super lens. The optical lens assembly 40 fixed on the third surface 301 can be obtained by photolithography, electron beam lithography (EBL), nanoimprint lithography (NIL) or femtosecond laser direct writing.

The order of step S301 and step S302 can be swapped.

Step S303: stack the first packaging unit 106 and the second packaging unit 204 and connect the support member 20 and the second surface 102, so that the first transparent substrate 10 and the second transparent substrate 30 are stacked in the first direction X. The accommodating cavity forms a first accommodating cavity 201, so the optical lens assembly 40 is arranged in the first accommodating cavity 201. The optical lens assembly 40 and the optical device 60 overlap in the first direction X.

In some embodiments, a first adhesive layer 70 is formed in the receiving groove 103, and the first adhesive layer 70 connects the support member 20 and the first transparent substrate 10 to obtain the packaging structure 100.

In another embodiment, the first transparent substrate 10 may not be provided with the receiving groove 103, and the supporting member 20 and the first transparent substrate 10 may be fixed by embossing technology.

Example 4:

The invention also provides a method for preparing the package structure 200. Different from Embodiment 3, the optical device 60' is an imaging sensor and is spaced apart from the first surface 101. The preparation method also includes: forming a second adhesive layer 80 connecting the first surface 101 and the surface of the substrate 51 away from the electrode 52. The second adhesive layer 80 is located outside the overlapping area of the optical device 60' and the optical lens assembly 40.

In another embodiment, the optical device 60' can be attached to the first surface 101.

In some embodiments, the second packaging unit 204' further includes a light blocking member 90. The light blocking member 90 connects the third surface 301 and the surface of the support member 20 facing away from the first transparent substrate 10. The light blocking member 90 is arranged around the periphery of the optical lens assembly 40 to block light for the optical lens assembly 40. The support member 20, the light blocking member 90 and the second transparent substrate 30 can be fixed by embossing technology.

In another embodiment, the second packaging unit 204' may not be provided with the light blocking member 90.

The materials of the components in Example 3-4 are the same as the materials of the corresponding components in Example 1-2. Therefore, they will not be described in detail.

The above implementation method is only used to illustrate this creation, but it cannot be limited to this implementation method in the actual application process. For ordinary technical personnel in this field, other variations and changes made based on the technical concept of this creation should all fall within the scope of the patent of this creation.

100:Packaging structure

10: First transparent substrate

101: First surface

102: Second surface

103: Storage tank

106: First packaging unit

20: Support parts

201: First receiving chamber

202: Second storage chamber

204: Second packaging unit

30: Second transparent substrate

301: Third surface

40:Optical lens assembly

50:Packaging components

51: Substrate

52: Electrode

60:Optical devices

X: First direction

R: Spacing

Claims (8)

A packaging structure, the improvement of which is that the packaging structure includes a first transparent substrate, a support, a second transparent substrate, an optical lens assembly, a packaging assembly and an optical device; the first transparent substrate includes a first surface and a second surface opposite to the first surface, the first transparent substrate and the second transparent substrate are stacked in a first direction, the second transparent substrate includes a third surface facing the first transparent substrate, the support is connected to the second surface and the third surface, the first transparent substrate, the second transparent substrate and the support together form a first accommodating cavity; the optical lens The assembly is located in the first receiving cavity and fixed to the third surface, the optical device is fixed to the first surface or spaced from the first surface, and the optical lens assembly and the optical device overlap in the first direction; the packaging assembly includes a substrate and an electrode, the substrate is fixed to the first surface, the substrate and the first transparent substrate together form a second receiving cavity, the optical device is arranged in the second receiving cavity, the electrode is electrically connected to the optical device and is arranged away from the first surface; the optical device is a light emitter, and the optical device is fixed to the first surface. The packaging structure as described in claim 1, wherein the second surface is provided with a receiving groove, and the packaging structure further includes a first adhesive layer, the first adhesive layer is provided in the receiving groove and connects the supporting member and the first transparent substrate. The packaging structure as described in claim 1, wherein the optical device is an imaging sensor, and the packaging structure further includes a second adhesive layer, the second adhesive layer connects the first surface and the surface of the substrate away from the electrode, the second adhesive layer is located outside the overlapping area of the optical device and the optical lens assembly, and the optical device is spaced from the first surface. The packaging structure as described in claim 3, wherein the packaging structure further includes a light blocking member, the light blocking member connects the third surface and the surface of the support member facing away from the first transparent substrate, and the light blocking member is disposed around the periphery of the optical lens assembly. A method for preparing a packaging structure, the improvement of which is that it includes: Providing a first packaging unit, the first packaging unit includes a first transparent substrate, a packaging assembly and an optical device, the first transparent substrate includes a first surface and a second surface opposite to the first surface, the packaging assembly includes a substrate and an electrode, the substrate is fixed to the first surface, the substrate and the first transparent substrate together form a second receiving cavity, the electrode is electrically connected to the optical device and is arranged away from the first surface, the optical device is fixed to the first surface or is spaced from the first surface, the optical device is arranged in the second receiving cavity, the optical device is a light emitter, the optical device is fixed to the The first surface; providing a second packaging unit, the second packaging unit including a second transparent substrate, a support member and an optical lens assembly, the second transparent substrate including a third surface facing the first transparent substrate, the support member connected to the third surface and surrounded by the third surface to form a receiving cavity, the optical lens assembly is located in the receiving cavity and fixed to the third surface; stacking the first packaging unit and the second packaging unit and connecting the support member and the second surface, so that the first transparent substrate and the second transparent substrate are stacked in the first direction, the receiving cavity forms a first receiving cavity, and the optical lens assembly and the optical device overlap in the first direction. The method for preparing a packaging structure as described in claim 5, wherein the second surface is provided with a receiving groove, and the method for preparing the packaging structure further comprises: forming a first adhesive layer in the receiving groove, wherein the first adhesive layer connects the support member and the first transparent substrate. The method for preparing a package structure as described in claim 5, wherein the method for preparing the package structure further comprises: forming a second adhesive layer connecting the first surface and the surface of the substrate away from the electrode, the second adhesive layer being located outside the overlapping area of the optical device and the optical lens assembly; the optical device is spaced apart from the first surface, and the optical device is an imaging sensor. The preparation method of the packaging structure as described in claim 5, wherein the second packaging unit further includes a light blocking member, the light blocking member connects the third surface and the surface of the support member facing away from the first transparent substrate, and the light blocking member is arranged around the periphery of the optical lens assembly.

Images