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TWI845640B - Alignment device, substrate processing device, alignment method and substrate processing method - Google Patents

Alignment device, substrate processing device, alignment method and substrate processing method Download PDF

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TWI845640B
TWI845640B TW109108701A TW109108701A TWI845640B TW I845640 B TWI845640 B TW I845640B TW 109108701 A TW109108701 A TW 109108701A TW 109108701 A TW109108701 A TW 109108701A TW I845640 B TWI845640 B TW I845640B
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substrate
corner
aforementioned
pressing
rectangular
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TW202101655A (en
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駒田秀樹
若林孝徳
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日商東京威力科創股份有限公司
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Abstract

[課題]調節並排配置之2片矩形基板的配置位置。 [解決手段]限制「形成分別對2片相鄰並排配置之矩形基板所設定的第1角部、第2角部」之邊部的位置,並將推壓部從與各邊部對向之方向分別推壓,進行矩形基板的對準。而且,構成為可在限制部設置移動機構,改變從第1角部及第2角部朝與2片矩形基板之並排方向交叉的方向延伸之2個邊部的離間間隔及該些邊所形成的角度。因此,可調節各矩形基板的配置位置。[Topic] Adjusting the configuration position of two rectangular substrates arranged side by side. [Solution] Limiting the position of the edge that "forms the first corner and the second corner set for two adjacent rectangular substrates arranged side by side", and pushing the pushing part from the direction opposite to each edge to align the rectangular substrate. In addition, the structure is such that a moving mechanism can be set in the limiting part to change the distance between the two edges extending from the first corner and the second corner in the direction intersecting the parallel direction of the two rectangular substrates and the angle formed by these edges. Therefore, the configuration position of each rectangular substrate can be adjusted.

Description

對準裝置、基板處理裝置、對準方法及基板處理方法Alignment device, substrate processing device, alignment method and substrate processing method

本揭示,係關於進行基板之對準的技術。The present disclosure relates to techniques for aligning substrates.

在平板顯示器(Flat Panel Display:FPD)之製造工程中,係以在將玻璃基板搬入進行基板處理的基板處理室時,可搬入正確之位置的方式,預先進行玻璃基板之對準,並進行對位。 專利文獻1,係著眼於在複數個基板之處理室被連接於搬送玻璃基板之搬送室的基板處理裝置中,當進行搬送至各處理室之玻璃基板的對準時,將各個處理室連接之際所產生的位置偏差。而且,記載有如下述技術:針對成為玻璃基板之搬送終點的每一處理室調節玻璃基板的配置位置,並將玻璃基板載置於正確之位置。 [先前技術文獻] [專利文獻]In the manufacturing process of flat panel displays (FPD), the glass substrates are aligned and positioned in advance so that they can be moved to the correct position when they are moved into the substrate processing chamber for substrate processing. Patent document 1 focuses on the position deviation that occurs when the glass substrates transported to each processing chamber are aligned in a substrate processing device in which the processing chambers for multiple substrates are connected to a transfer chamber for transporting the glass substrates. In addition, the following technology is described: the configuration position of the glass substrate is adjusted for each processing chamber that becomes the transfer end point of the glass substrate, and the glass substrate is placed in the correct position. [Prior technical document] [Patent document]

[專利文獻1]日本特開2006-324366號公報[Patent Document 1] Japanese Patent Application Publication No. 2006-324366

[本發明所欲解決之課題][Problems to be solved by the present invention]

本揭示,係有鑑於像這樣的情事而進行研究者,其在於提供如下述技術:調節並排配置之2片矩形基板的配置位置。 [用以解決課題之手段]This disclosure is made in view of such a situation, and provides the following technology: adjusting the configuration position of two rectangular substrates arranged side by side. [Means for solving the problem]

本揭示之對準裝置,係一種調節矩形基板之配置位置的對準裝置,其特徵係,具備有: 載置台,設定有用以相鄰並排地配置2片矩形基板的第1基板配置區域及第2基板配置區域; 第1限制部及第2限制部,在將從構成被配置於前述第1基板配置區域的矩形基板之4個角部所選擇的1個角部設成為第1角部時,分別限制形成前述第1角部之2個邊部的配置位置; 第1推壓部,將矩形基板從與形成前述第1角部之2個邊部對向的方向朝向前述第1限制部及前述第2限制部推壓; 第3限制部及第4限制部,在將從構成被配置於前述第2基板配置區域的矩形基板之4個角部所選擇的1個角部設成為第2角部時,分別限制形成前述第2角部之2個邊部的配置位置; 第2推壓部,將矩形基板從與形成前述第2角部之2個邊部對向的方向朝向前述第3限制部及前述第4限制部推壓;及 移動機構,使前述第1限制部~前述第4限制部分別移動,以改變從前述第1角部及前述第2角部朝與前述2片矩形基板之並排方向交叉的方向延伸之2個邊部的離間間隔及該些邊所形成的角度。 [發明之效果]The alignment device disclosed in the present invention is an alignment device for adjusting the configuration position of a rectangular substrate, and is characterized in that it comprises: A mounting table, which is provided with a first substrate configuration area and a second substrate configuration area for configuring two rectangular substrates adjacent to each other and side by side; A first limiting portion and a second limiting portion, which respectively limit the configuration position of the two sides forming the first corner when one corner selected from the four corners of the rectangular substrate configured in the first substrate configuration area is set as the first corner; A first pressing portion, which presses the rectangular substrate from the direction opposite to the two sides forming the first corner toward the first limiting portion and the second limiting portion; A third limiting portion, which presses the rectangular substrate from the direction opposite to the two sides forming the first corner toward the first limiting portion and the second limiting portion; The control part and the fourth limiting part respectively limit the configuration positions of the two sides forming the second corner when one corner selected from the four corners of the rectangular substrate configured in the second substrate configuration area is set as the second corner; the second pressing part presses the rectangular substrate from the direction opposite to the two sides forming the second corner toward the third limiting part and the fourth limiting part; and the moving mechanism moves the first limiting part to the fourth limiting part respectively to change the interval between the two sides extending from the first corner and the second corner in the direction intersecting the parallel direction of the two rectangular substrates and the angle formed by these sides. [Effect of the invention]

根據本揭示,可調節並排配置之2片矩形基板的配置位置。According to the present disclosure, the configuration positions of two rectangular substrates arranged side by side can be adjusted.

說明關於應用了本揭示的對準裝置之一實施形態的基板處理裝置即真空處理裝置。如圖1所示般,真空處理裝置,係以大氣搬送模組即大氣搬送室11、裝載鎖定模組即裝載鎖定室12及真空搬送模組即真空搬送室13該順序連接而構成。在以下說明書中,係相對於裝載鎖定室12,將連接有真空搬送室13的方向作為前方側,將連接有大氣搬送室11的方向作為後方側,且從後方側觀看前方側,分別將左右方作為左手側、右手側來進行說明。A substrate processing device, i.e., a vacuum processing device, to which an embodiment of the alignment device disclosed in the present invention is applied is described. As shown in FIG1 , the vacuum processing device is composed of an atmosphere transfer module, i.e., an atmosphere transfer chamber 11, a load lock module, i.e., a load lock chamber 12, and a vacuum transfer module, i.e., a vacuum transfer chamber 13, which are connected in this order. In the following description, the direction connected to the vacuum transfer chamber 13 is referred to as the front side, and the direction connected to the atmosphere transfer chamber 11 is referred to as the rear side, and when viewing the front side from the rear side, the left and right sides are referred to as the left-hand side and the right-hand side, respectively.

在大氣搬送室11之左右方,係分別設置有裝載埠14,該裝載埠14,係載置矩形基板即玻璃基板G的搬送容器C。在搬送容器C內,係可上下隔著間隔而多層地配置有複數片玻璃基板G。又,真空搬送室13,係例如被構成為平面視圖矩形,在側面中除了後方側之面以外的3面,分別連接有真空處理模組9作為基板處理模組。在大氣搬送室11及真空搬送室13,係分別設置有搬送玻璃基板G的基板搬送機構即搬送臂15、16。Loading ports 14 are provided on the left and right sides of the atmospheric transfer chamber 11. The loading ports 14 are transfer containers C for loading rectangular substrates, i.e., glass substrates G. In the transfer container C, a plurality of glass substrates G can be arranged in multiple layers with spaces between them. The vacuum transfer chamber 13 is, for example, configured as a rectangular shape in a plan view, and vacuum processing modules 9 are connected to three sides of the side surfaces except the rear side surface as substrate processing modules. Substrate transfer mechanisms, i.e., transfer arms 15 and 16 for transferring glass substrates G are provided in the atmospheric transfer chamber 11 and the vacuum transfer chamber 13, respectively.

設置於大氣搬送室11之搬送臂15,係具備有:基台15b;及基板保持部15a,將2片玻璃基板G保持於前端側及基端側。基台15b,係例如被構成為繞垂直軸旋轉自如,基板保持部15a,係被構成為對基台15b進退自如。 設置於真空搬送室13之搬送臂16,係例如在由可繞垂直軸旋轉及伸縮的關節臂所構成之臂部16b的前端,可調整角度地設置有基板保持部16a,該基板保持部16a,係將2片玻璃基板G保持於前端側與基端側。搬送臂16,係被構成為可藉由驅動基板保持部16a及臂部16b的方式,朝收授玻璃基板G的位置移動。The transport arm 15 provided in the atmospheric transport chamber 11 is provided with: a base 15b; and a substrate holding part 15a, which holds two glass substrates G at the front end side and the base end side. The base 15b is, for example, configured to be freely rotatable around a vertical axis, and the substrate holding part 15a is configured to be freely movable with respect to the base 15b. The transport arm 16 provided in the vacuum transport chamber 13 is, for example, provided with a substrate holding part 16a at an adjustable angle at the front end of an arm part 16b composed of an articulated arm that can rotate around a vertical axis and extend and retract, and the substrate holding part 16a holds two glass substrates G at the front end side and the base end side. The transport arm 16 is configured to be movable toward a position for receiving and delivering the glass substrates G by driving the substrate holding part 16a and the arm part 16b.

作為真空處理模組9,係例如設置有電漿處理裝置。該真空處理模組9,係在真空容器90內具備有載置台91,該載置台91,係並排載置有例如2片玻璃基板G。在載置台91,係例如埋設有電極,該電極,係用以在與被設置於真空容器90內的噴頭之間產生電漿(噴頭及電極皆未圖示)。As the vacuum processing module 9, for example, a plasma processing device is provided. The vacuum processing module 9 has a mounting table 91 in a vacuum container 90, and the mounting table 91 is provided with, for example, two glass substrates G placed side by side. In the mounting table 91, for example, an electrode is embedded, and the electrode is used to generate plasma between the electrode and a nozzle provided in the vacuum container 90 (the nozzle and the electrode are not shown).

在具備有上述概略構成之基板處理裝置中,當搬送容器C被載置於裝載埠14時,在該搬送容器C的各層,係並排收納有各2片玻璃基板G。此時,各層之玻璃基板G,係將其長邊朝向與基板保持部15a往搬送容器C內之進入方向交叉的方向配置。設置於大氣搬送室11之搬送臂15,係在其前端側與基端側接收相鄰並排的2片玻璃基板G。而且,將2片玻璃基板G沿前後方向而並排地收授至裝載鎖定室12內的後述載置台20。In the substrate processing apparatus having the above-described general structure, when the transfer container C is placed on the loading port 14, two glass substrates G are stored side by side on each layer of the transfer container C. At this time, the glass substrates G on each layer are arranged with their long sides facing in a direction intersecting with the direction in which the substrate holding portion 15a enters the transfer container C. The transfer arm 15 provided in the atmospheric transfer chamber 11 receives the two adjacent and side-by-side glass substrates G at its front end side and base end side. Furthermore, the two glass substrates G are received and delivered side by side in the front-back direction to the later-described placement table 20 in the loading lock chamber 12.

另一方面,真空搬送室13側之搬送臂16,係以並排於其前端側與基端側的方式,接收2片玻璃基板G,並收授至各真空處理模組9。 具體而言,係進行如下述處理:在將搬送臂16旋轉成與搬送對象之真空處理模組9後,使臂部16b朝向載置台91延伸。因此,在各真空處理模組9中,係從真空搬送室13側觀看,2片玻璃基板G並列地被收授於前側與後側。On the other hand, the transfer arm 16 on the side of the vacuum transfer chamber 13 receives two glass substrates G in parallel at the front end and the base end thereof, and delivers them to each vacuum processing module 9. Specifically, the following process is performed: after the transfer arm 16 is rotated to the vacuum processing module 9 to be transferred, the arm portion 16b is extended toward the mounting table 91. Therefore, in each vacuum processing module 9, when viewed from the side of the vacuum transfer chamber 13, two glass substrates G are received and delivered in parallel at the front and rear sides.

在像這樣的真空處理模組9中,係對搬送臂16進行記憶各玻璃基板G之搬送終點的教示(teaching),藉此,執行了往各載置台91上之更正確位置進行搬送的處置。而且,作為正確地執行教示之結果的前提,在真空處理裝置中,係例如進行了對準,該對準,係進行裝載鎖定室12中之各玻璃基板G的配置位置之對位。In such a vacuum processing module 9, the transfer arm 16 is taught to memorize the transfer end point of each glass substrate G, thereby performing a process of transferring to a more accurate position on each mounting table 91. In addition, as a prerequisite for correctly performing the teaching result, in the vacuum processing device, for example, alignment is performed, and the alignment is performed to align the arrangement positions of each glass substrate G in the load lock chamber 12.

然而,當藉由搬送臂16來將玻璃基板G搬送至各真空處理模組9時,難以將各真空處理模組9的相對位置調整為相同而稍微會產生位置偏差。而且,近年來,裝置伴隨著玻璃基板G之大型化而大型化。因此,有時因構成裝置之零件的設置公差之累積所造成的誤差、因熱膨脹所造成的誤差、組合裝置時之誤差等的累積值變大,而成為相對於搬送精度無法忽視的大小。又,由於在教示中,係藉由調節搬送臂16之垂直軸的角度θ、臂部16b之伸縮距離r的方式,調節玻璃基板G之載置位置,因此,對於2片玻璃基板G之個別的配置位置之調節存在限制。該結果,亦擔心無法將各玻璃基板G充分地載置於載置台91的正確位置。However, when the glass substrate G is transported to each vacuum processing module 9 by the transport arm 16, it is difficult to adjust the relative position of each vacuum processing module 9 to be the same, and a slight position deviation will occur. Moreover, in recent years, the device has been enlarged along with the enlargement of the glass substrate G. Therefore, sometimes the accumulated value of the error caused by the accumulation of the setting tolerance of the parts constituting the device, the error caused by thermal expansion, the error when assembling the device, etc. becomes large, and becomes a size that cannot be ignored relative to the transport accuracy. In addition, since the teaching adjusts the loading position of the glass substrate G by adjusting the angle θ of the vertical axis of the transport arm 16 and the extension distance r of the arm 16b, there are limitations on the adjustment of the individual configuration positions of the two glass substrates G. As a result, there is also a concern that each glass substrate G may not be sufficiently placed at a correct position on the placement table 91 .

因此,在本揭示之真空處理裝置中,係構成為當在裝載鎖定室12進行對準時,可個別地調節2片玻璃基板G的配置位置。圖2,係表示裝載鎖定室12的構成例。裝載鎖定室12,係被構成為具備有經由搬入搬出口22、23而與大氣搬送室11、真空搬送室13連接的真空容器200,並在藉由未圖示之閘閥關閉了搬入搬出口22、23的狀態下,可在大氣氛圍與真空氛圍之間切換內部氛圍。Therefore, in the vacuum processing apparatus disclosed in the present invention, the arrangement positions of the two glass substrates G can be adjusted individually when the alignment is performed in the load lock chamber 12. Fig. 2 shows an example of the structure of the load lock chamber 12. The load lock chamber 12 is configured to have a vacuum container 200 connected to the atmospheric transfer chamber 11 and the vacuum transfer chamber 13 via the loading and unloading ports 22 and 23, and the internal atmosphere can be switched between the atmospheric atmosphere and the vacuum atmosphere when the loading and unloading ports 22 and 23 are closed by a gate valve (not shown).

在真空容器200內,係設置有載置台20。在載置台20,係設置有用以將2片玻璃基板G相鄰並排地配置於前後方向的基板配置區域21a、21b。在該些基板配置區域21a、21b,係配置有該些玻璃基板G,其長邊朝向與基板處理裝置之前後方向交叉的方向。在以下說明書中,係將前方側之基板配置區域稱為第1基板配置區域21a,將後方側之基板配置區域稱為第2基板配置區域21b。A stage 20 is provided in the vacuum container 200. The stage 20 is provided with substrate placement areas 21a and 21b for placing two glass substrates G adjacent to each other and side by side in the front-back direction. The glass substrates G are placed in the substrate placement areas 21a and 21b with their long sides facing the direction intersecting the front-back direction of the substrate processing device. In the following description, the substrate placement area on the front side is referred to as the first substrate placement area 21a, and the substrate placement area on the rear side is referred to as the second substrate placement area 21b.

又,在載置台20,係設置有:限制部3、7,用以限制玻璃基板G之配置位置;及推壓部8,將玻璃基板G朝向限制部3、7推壓。 在圖2所示之例子中,構成第1基板配置區域21a所載置之玻璃基板G的4個角部中之右手側後方(朝向圖2,第1基板配置區域21a之右下)的角部,係被選擇為由限制部3、7所限制的第1角部c1。而且,以限制形成第1角部c1之2個邊部(第1邊部s1、第2邊部s2)的方式,設置限制部3、7。又,構成第2基板配置區域21b所載置之玻璃基板G的4個角部中之右手側前方(朝向圖2,第2基板配置區域21b之右上)的角部,係被選擇為第2角部c2。而且,以限制形成第2角部c2之2個邊部(第3邊部s3、第4邊部s4)之配置位置的方式,設置限制部3、7。 在此,上述限制部3,係如圖2所示般,被構成為用以同時限制第1邊部s1、第3邊部s3之配置於2片玻璃基板G之間隙的中央限制部3。在該例子中,係在前述間隙之左右的端部附近分別設置1個中央限制部3。另一方面,分別限制第2邊部s2與第4邊部s4之側方限制部7(7a、7b),係相互獨立地設置。Furthermore, the stage 20 is provided with: limiting parts 3 and 7 for limiting the configuration position of the glass substrate G; and a pressing part 8 for pressing the glass substrate G toward the limiting parts 3 and 7. In the example shown in FIG. 2 , the corner on the rear right side (toward the lower right of the first substrate configuration area 21a in FIG. 2 ) of the four corners of the glass substrate G placed in the first substrate configuration area 21a is selected as the first corner c1 limited by the limiting parts 3 and 7. Moreover, the limiting parts 3 and 7 are provided in a manner to limit the two sides (the first side s1 and the second side s2) forming the first corner c1. Furthermore, the corner on the front right side (toward the upper right of the second substrate configuration area 21b in FIG. 2 ) of the four corners of the glass substrate G placed in the second substrate configuration area 21b is selected as the second corner c2. Furthermore, the limiting parts 3 and 7 are provided in such a manner as to limit the arrangement positions of the two sides (the third side s3 and the fourth side s4) forming the second corner c2. Here, the limiting part 3 is configured as a central limiting part 3 for simultaneously limiting the arrangement of the first side s1 and the third side s3 in the gap between the two glass substrates G as shown in FIG. 2. In this example, one central limiting part 3 is provided near the left and right ends of the aforementioned gap. On the other hand, the side limiting parts 7 (7a, 7b) that respectively limit the second side s2 and the fourth side s4 are provided independently of each other.

而且,當著眼於第1基板配置區域21a時,在載置台20,係以將前方側之玻璃基板G從與形成第1角部c1的2個邊部s1、s2對向之方向朝向中央限制部3、側方限制部7a推壓的方式,設置長邊側推壓部8a、短邊側推壓部8b作為推壓部8。另一方面,當著眼於第2基板配置區域21b時,在載置台20,係以將前方側的玻璃基板G從與形成第2角部c2之2個邊部s3、s4對向的方向朝向中央限制部3、側方限制部7b推壓的方式,設置長邊側推壓部8c、短邊側推壓部8d作為推壓部8。Furthermore, when focusing on the first substrate arrangement region 21a, the long side pressing portion 8a and the short side pressing portion 8b are provided as the pressing portion 8 on the stage 20 so as to press the glass substrate G on the front side from the direction opposite to the two sides s1 and s2 forming the first corner c1 toward the central limiting portion 3 and the side limiting portion 7a. On the other hand, when focusing on the second substrate arrangement region 21b, the long side pressing portion 8c and the short side pressing portion 8d are provided as the pressing portion 8 on the stage 20 so as to press the glass substrate G on the front side from the direction opposite to the two sides s3 and s4 forming the second corner c2 toward the central limiting portion 3 and the side limiting portion 7b.

參閱圖3,說明關於中央限制部3。另外,圖3,係表示從後方觀看前方,被配置於右手側的中央限制部3,圖3中之X軸,係表示從真空搬送裝置之左方朝向右方的方向(左右方向),Y軸,係表示從真空搬送裝置之後方朝向前方側的方向(前後方向)。另外,配置於左手側之中央限制部3,係例如被配置為繞俯視載置台20時的中心位置而與右手側的中央限制部3呈180°旋轉對稱。Referring to FIG. 3 , the central limiting portion 3 is described. FIG. 3 shows the central limiting portion 3 arranged on the right side when viewed from the back. The X axis in FIG. 3 indicates the direction from the left side to the right side of the vacuum conveying device (left-right direction), and the Y axis indicates the direction from the rear side to the front side of the vacuum conveying device (front-back direction). The central limiting portion 3 arranged on the left side is arranged, for example, to be 180° rotationally symmetrical with the central limiting portion 3 on the right side about the center position when viewing the mounting table 20 from above.

中央限制部3,係具備有前後方向細長之梯形板狀的基體30。基體30,係例如被構成為沿著往前後方向延伸之未圖示的導引軌移動自如。基體30之左右的兩邊,係左手側比右手側長,且在基體30的後方側形成有楔狀的銳角。又,在基體30的上面之後方端的位置,係沿著往由前述銳角所形成之傾斜方向延伸的邊,形成溝部33。The central limiting part 3 has a base 30 in the shape of a trapezoidal plate that is elongated in the front-rear direction. The base 30 is configured to be movable along a guide rail (not shown) that extends in the front-rear direction. The left and right sides of the base 30 are longer on the left side than on the right side, and a wedge-shaped sharp corner is formed on the rear side of the base 30. In addition, a groove 33 is formed at the rear end of the upper surface of the base 30 along the side extending in the inclined direction formed by the aforementioned sharp corner.

在溝部33,係插入有往上下方向延伸的突起部35。突起部35,係被連接於從右方朝向左方延伸而前端朝向前方彎曲的樑狀構件34a之前端的下面。樑狀構件34a之基端側,係例如與被固定於載置台20的第1伸縮機構34連接,並藉由第1伸縮機構34使樑狀構件34a伸縮,藉此,突起部35,係被構成為在溝部33內移動自如。A protrusion 35 extending in the up-down direction is inserted into the groove 33. The protrusion 35 is connected to the bottom of the front end of a beam-shaped member 34a extending from the right to the left and bent toward the front. The base end side of the beam-shaped member 34a is connected to the first retractable mechanism 34 fixed to the mounting table 20, for example, and the beam-shaped member 34a is extended and retracted by the first retractable mechanism 34, thereby the protrusion 35 is configured to be movable in the groove 33.

而且,在基體30之上方,係與前述樑狀構件34a的基端側相同,設置有往左右方向延伸的樑狀構件31a,在樑狀構件31a之左手側的端部,係設置有朝向上方突出的突起部32。樑狀構件31a之基端側,係例如被構成為與固定於載置台20的第2伸縮機構31連接,並藉由第2伸縮機構31進行伸縮的方式,突起部32在左右方向(X軸方向)移動。Moreover, a beam-shaped member 31a extending in the left-right direction is provided on the upper side of the base body 30, similarly to the base end side of the beam-shaped member 34a, and a protrusion 32 protruding upward is provided at the left-hand end of the beam-shaped member 31a. The base end side of the beam-shaped member 31a is configured to be connected to the second telescopic mechanism 31 fixed to the mounting table 20, for example, and the protrusion 32 moves in the left-right direction (X-axis direction) by the second telescopic mechanism 31 being extended and retracted.

在該樑狀構件31a之更上方,係設置有往前後方向延伸之概略矩形板狀的板狀構件40。板狀構件40,係被構成為沿著往設置於基體30之上面的左右方向(X軸方向)延伸之未圖示的導引軌移動自如。在板狀構件40之靠近右邊的位置,係形成有貫通板狀構件40並往前後方向(Y軸方向)延伸的長孔洞42,在長孔洞42,係從板狀構件40之下面側插入有前述突起部32。又,在板狀構件40之靠近左邊的位置,係以朝向上方突出的方式,設置有圓柱狀的移動體41。Above the beam-shaped member 31a, a plate-shaped member 40 in a roughly rectangular plate shape extending in the front-rear direction is provided. The plate-shaped member 40 is configured to be movable along a guide rail (not shown) extending in the left-right direction (X-axis direction) provided on the upper surface of the base 30. Near the right side of the plate-shaped member 40, a long hole 42 is formed that passes through the plate-shaped member 40 and extends in the front-rear direction (Y-axis direction), and the aforementioned protrusion 32 is inserted into the long hole 42 from the lower side of the plate-shaped member 40. Furthermore, near the left side of the plate-shaped member 40, a cylindrical moving body 41 is provided in a manner protruding upward.

在板狀構件40之更上方,係以前後方向並排的方式,配置有2個塊體51、52。各塊體51、52,係被支撐為沿著往設置於基體30之上面的前後方向延伸之未圖示的導引軌移動自如。各塊體51、52,係分別被構成為概略矩形,並被配置成各塊體51、52之長邊方向朝向左右方向的姿勢。前方側之塊體51之後方側左端的部位,係成為朝向後方側突出的突出部53,並以朝向上方延伸的方式,在該突出部53之上面設置有圓柱狀的銷55。而且,後方側之塊體52之前方側左端的部位,係形成有與前方側之塊體51之突出部53的形狀對應而凹陷之形狀的缺口。Two blocks 51 and 52 are arranged side by side in the front-rear direction above the plate-shaped member 40. Each block 51 and 52 is supported to be movable along a guide rail (not shown) extending in the front-rear direction provided on the upper surface of the base 30. Each block 51 and 52 is formed into a roughly rectangular shape and arranged so that the long side of each block 51 and 52 faces the left-right direction. The left end of the rear side of the block 51 on the front side is a protrusion 53 protruding toward the rear side, and a cylindrical pin 55 is provided on the protrusion 53 so as to extend upward. Furthermore, a notch having a concave shape corresponding to the shape of the protruding portion 53 of the front side block 51 is formed at the left end of the front side block 52 of the rear side.

又,後方側之塊體52的凹陷形狀之部位的右手側,係成為朝向前方側突出的突出部54,並以朝向上方延伸的方式,在該突出部54之上面設置有圓柱狀的銷56。而且,在前方側之塊體51,係形成有與後方側之塊體52之突出部54的形狀對應而凹陷之形狀的缺口。The right hand side of the recessed portion of the rear block 52 is a protrusion 54 protruding toward the front side, and a cylindrical pin 56 is provided on the protrusion 54 in an upwardly extending manner. Furthermore, a notch having a recessed shape corresponding to the shape of the protrusion 54 of the rear block 52 is formed in the front block 51.

而且,在前方側之塊體51的後方側之靠近右方的部位與後方側之塊體52的前方側之靠近右方的部位之間隙,係當從上面側觀看時,形成有推拔部57,該推拔部57,係間隙從左手側朝向右手側呈錐狀逐漸變寬。而且,推拔部57之右手側,係成為前方側之塊體51的面與後方側之塊體52的面之間隙的寬度為固定的並行部58。Furthermore, a push-out portion 57 is formed in the gap between the right side portion of the rear side of the front side block 51 and the right side portion of the front side of the rear side block 52 when viewed from the upper side, and the push-out portion 57 is a gap that gradually widens in a cone shape from the left hand side toward the right hand side. Furthermore, the right hand side of the push-out portion 57 is a parallel portion 58 in which the width of the gap between the surface of the front side block 51 and the surface of the rear side block 52 is fixed.

在與前方側之塊體51之靠近左方側的側面對向之前方側的位置,係形成有被設置為豎立於基體30之上面的支撐部61。在支撐部61之側面,係設置有朝向塊體51突出的導引軸59。A support portion 61 is formed on the upper surface of the base 30 at a position facing the front side of the left side of the block 51 on the front side. A guide shaft 59 is provided on the side surface of the support portion 61 to protrude toward the block 51.

在與後方側之塊體52之靠近左方側的側面對向之後方側的位置,係形成有被設置為豎立於基體30之上面的支撐部62。在支撐部62之側面,係設置有朝向塊體52突出的導引軸60。A support portion 62 is formed on the rear side opposite to the left side of the rear block 52 and is provided vertically on the upper surface of the base 30. A guide shaft 60 is provided on the side surface of the support portion 62 so as to protrude toward the block 52.

又,在前方側的支撐部61與前方側的塊體51之間,係設置有彈簧構件63,在後方側的支撐部62與後方側的塊體52之間,係設置有彈簧構件64。藉由該些彈簧構件63、64,前方側之塊體51,係被彈壓至後方側,後方側之塊體52,係被彈壓至前方側。前述導引軸59、60,係分別被插入該些彈簧構件63、64,並引導以下所述之塊體51、52的移動動作。Furthermore, a spring member 63 is provided between the front support portion 61 and the front block 51, and a spring member 64 is provided between the rear support portion 62 and the rear block 52. The front block 51 is pushed to the rear side and the rear block 52 is pushed to the front side by the spring members 63 and 64. The guide shafts 59 and 60 are inserted into the spring members 63 and 64, respectively, and guide the movement of the blocks 51 and 52 described below.

在具備有上述構成的塊體51、52之間,係以位於構成前述並行部58之間隙內的方式,配置有前述移動體41。由各彈簧構件63、64所彈壓之塊體51、52,係藉由與該移動體41接觸的方式被限制而靜止。此時,移動體41的直徑或並行部58之間隙的寬度、各突出部53、54的突出長度等,係被設定為使由移動體41所限制之各塊體51、52上的銷55、56成為沿著左右方向(X軸方向)並排的狀態。The moving body 41 is disposed between the blocks 51 and 52 having the above-mentioned structure so as to be located in the gap constituting the parallel portion 58. The blocks 51 and 52, which are biased by the spring members 63 and 64, are restrained and stationary by contacting the moving body 41. At this time, the diameter of the moving body 41, the width of the gap of the parallel portion 58, the protruding length of each protruding portion 53 and 54, etc. are set so that the pins 55 and 56 on the blocks 51 and 52 restrained by the moving body 41 are in a state of being arranged side by side in the left-right direction (X-axis direction).

說明關於具備有以上構成之中央限制部3的動作。在圖4~圖6,係將記載於圖4之中央限制部3進行簡化而記載。 例如,如圖4所示般,中央限制部3,係當接收玻璃基板G時,在樑狀構件34a之突起部35位於溝部33之長度方向中央的狀態下待機。The operation of the central limiting portion 3 having the above structure is described. In FIG. 4 to FIG. 6, the central limiting portion 3 shown in FIG. 4 is simplified. For example, as shown in FIG. 4, when the central limiting portion 3 receives the glass substrate G, the protrusion 35 of the beam-shaped member 34a is in a standby state in the longitudinal center of the groove 33.

又,移動體41,係位於塊體51、52之間隙的並行部58。因此,如前述般,塊體51、52上之銷55、56,係成為並排於X軸方向的狀態。中央限制部3,係在該狀態下待機,同圖中以虛線所示之2片玻璃基板G,係隔著該些銷55、56而載置。Furthermore, the moving body 41 is located in the parallel portion 58 between the blocks 51 and 52. Therefore, as described above, the pins 55 and 56 on the blocks 51 and 52 are arranged in parallel in the X-axis direction. The central limiting portion 3 is on standby in this state, and the two glass substrates G shown by the dotted lines in the figure are placed with the pins 55 and 56 interposed therebetween.

若載置了玻璃基板G,則如圖5所示般,藉由第2伸縮機構31使移動體41往左手側移動並進入推拔部57。如前述般,推拔部57,係間隙之寬度比並行部58窄,且越朝向左手側,則間隙逐漸變窄。因此,隨著移動體41往左手側移動,施加將塊體51、52擴張的力。藉由其作用,兩塊體51、52,係反抗彈簧構件63、64之推彈力而沿前後方向移動。因應該些塊體51、52之移動,各銷55、56亦沿前後方向移動而兩銷55、56間的離間間隔變大。If the glass substrate G is placed, as shown in FIG5 , the second retractable mechanism 31 moves the moving body 41 to the left hand side and enters the push-pull section 57. As mentioned above, the width of the gap of the push-pull section 57 is narrower than that of the parallel section 58, and the gap gradually narrows toward the left hand side. Therefore, as the moving body 41 moves to the left hand side, a force is applied to expand the blocks 51 and 52. Due to this action, the two blocks 51 and 52 move in the front-back direction against the push force of the spring members 63 and 64. In response to the movement of the blocks 51 and 52, each pin 55 and 56 also moves in the front-back direction and the distance between the two pins 55 and 56 increases.

該結果,從被配置為夾著兩銷55、56的玻璃基板G觀看時,則由該些銷55、56所進行之各玻璃基板G的限制位置(各玻璃基板G的間隔)發生變化。 此時,隨著使位於推拔部57內之移動體41往左手側移動,由於塊體51、52的間隙亦被擴大,因此,銷55、56之離間間隔變大。此時,隨著使位於推拔部57之移動體41往右手側移動,由於塊體51、52之間的間隙變窄,因此,銷55、56之離間間隔變窄。如此一來,可藉由移動體41之位置來調節銷55、56的離間間隔,並可調節各玻璃基板G的限制位置(各玻璃基板G的間隔)。As a result, when viewed from the glass substrate G arranged to sandwich the two pins 55 and 56, the limiting position of each glass substrate G (the interval between each glass substrate G) performed by the pins 55 and 56 changes. At this time, as the movable body 41 located in the push-pull part 57 is moved to the left hand side, the gap between the blocks 51 and 52 is also expanded, so the interval between the pins 55 and 56 becomes larger. At this time, as the movable body 41 located in the push-pull part 57 is moved to the right hand side, the gap between the blocks 51 and 52 is narrowed, so the interval between the pins 55 and 56 is narrowed. In this way, the distance between the pins 55 and 56 can be adjusted by the position of the moving body 41, and the limiting position of each glass substrate G (the distance between each glass substrate G) can be adjusted.

又,如圖6所示般,中央限制部3,係使第1伸縮機構34伸縮,藉此,突起部35在溝部33內沿左右方向移動。另一方面,由於溝部33,係被形成為傾斜地橫切突起部35之移動方向,因此,作用有「沿左右方向移動之突起部35推回溝部33的內壁而使基體30沿前後方向移動」的力。該結果,藉由使第1伸縮機構34伸縮的方式,兩塊體51、52可與基體30一起沿前後方向移動,並藉由銷55、56,使限制2片玻璃基板G的位置沿前後方向移動。另外,第2伸縮機構31、樑狀構件31a及突起部32,雖係無法朝前後方向(Y軸方向)移動,但藉由使突起部32沿著被形成於板狀構件40之長孔洞42移動的方式,從而不會與基體30之前後方向的移動發生干涉。As shown in FIG6 , the central restricting portion 3 extends and retracts the first retractable mechanism 34, thereby causing the protrusion 35 to move in the left-right direction in the groove 33. On the other hand, since the groove 33 is formed to be obliquely transverse to the moving direction of the protrusion 35, a force is applied such that the protrusion 35 moving in the left-right direction pushes back the inner wall of the groove 33 to move the base 30 in the front-back direction. As a result, by extending and retracting the first retractable mechanism 34, the two blocks 51 and 52 can move in the front-back direction together with the base 30, and the positions restricting the two glass substrates G are moved in the front-back direction by the pins 55 and 56. In addition, although the second telescopic mechanism 31, the beam-shaped member 31a and the protrusion 32 cannot move in the front-back direction (Y-axis direction), the protrusion 32 is moved along the long hole 42 formed in the plate-shaped member 40, so as not to interfere with the front-back movement of the base 30.

返回到圖2,具備有上述構成之中央限制部3,係以使各銷55、56被配置於第1基板配置區域21a與第2基板配置區域21b之間隙的方式,被設置於載置台20之左右的位置。對以下右手側之中央限制部賦予符號3a,並對左手側之中央限制部賦予符號3b而進行說明。在該例子中,左手側之中央限制部3b,係被配置為以載置台20的中心部為中心,使右手側之中央限制部3a繞垂直軸呈大概180°旋轉對稱。亦即,在左手側的中央限制部3b中,2根銷55、56中之銷55限制被載置於第2基板配置區域21b之後方側的玻璃基板G,銷56限制被載置於第1基板配置區域21a之前方側的玻璃基板G。Returning to FIG. 2 , the central limiting portion 3 having the above-mentioned structure is disposed at the left and right positions of the mounting table 20 in such a manner that the pins 55 and 56 are disposed in the gap between the first substrate arrangement area 21a and the second substrate arrangement area 21b. The central limiting portion on the right hand side is given a symbol 3a, and the central limiting portion on the left hand side is given a symbol 3b for explanation. In this example, the central limiting portion 3b on the left hand side is disposed so that the central limiting portion 3a on the right hand side is approximately 180° rotationally symmetrical around the vertical axis with the central portion of the mounting table 20 as the center. That is, in the central limiting portion 3b on the left hand side, the pin 55 of the two pins 55 and 56 limits the glass substrate G placed on the rear side of the second substrate configuration area 21b, and the pin 56 limits the glass substrate G placed on the front side of the first substrate configuration area 21a.

其次,說明關於側方限制部7。側方限制部7,係例如被構成為棒狀,並被構成為以其前端限制玻璃基板G之右手側之邊(第2邊部s2、第4邊部s4)的配置位置。在該例子中,側方限制部7a、7b,係被配置為可分別限制第2邊部s2之靠近前方的位置、第4邊部s4之靠近後方的位置。各側方限制部7a、7b,係被構成為沿左右方向移動自如,在搬入搬出玻璃基板G之際,係被構成為在從第1基板配置區域21a、第2基板配置區域21b偏離的位置待機。Next, the side limiting portion 7 is described. The side limiting portion 7 is, for example, configured in a rod shape, and is configured to limit the configuration position of the right-hand side (the second side s2 and the fourth side s4) of the glass substrate G with its front end. In this example, the side limiting portions 7a and 7b are configured to limit the position near the front of the second side s2 and the position near the rear of the fourth side s4, respectively. Each of the side limiting portions 7a and 7b is configured to be freely movable in the left-right direction, and is configured to stand by at a position away from the first substrate configuration area 21a and the second substrate configuration area 21b when the glass substrate G is carried in and out.

在本實施形態中,從第1角部c1、第2角部c2沿著與玻璃基板G之並排方向(前後方向)交叉的方向觀看之2個邊部即第1邊部s1、第3邊部s3,係使用共通的中央限制部3a、3b(詳細為銷55、56)來予以限制。又,從第1角部c1、第2角部c2往前後延伸之2個邊部即第2邊部s2、第4邊部s4,係分別由側方限制部7(7a、7b)所限制。In the present embodiment, the two sides, i.e., the first side s1 and the third side s3, viewed from the first corner c1 and the second corner c2 in the direction intersecting the parallel direction (front-rear direction) of the glass substrate G are restricted by the common central restricting parts 3a and 3b (specifically, the pins 55 and 56). Furthermore, the two sides, i.e., the second side s2 and the fourth side s4, extending front-rear from the first corner c1 and the second corner c2 are restricted by the side restricting parts 7 (7a and 7b), respectively.

在該情況下,使用銷55、56進行被配置於第1基板配置區域21a之玻璃基板G的限制之2個中央限制部3a、3b相當於第1限制部,側方限制部7a相當於第2限制部。又,使用銷56、55進行被配置於第2基板配置區域21b之玻璃基板G的限制之2個中央限制部3a、3b亦相當於第3限制部,側方限制部7b相當於第4限制部。In this case, the two central limiting portions 3a and 3b that limit the glass substrate G disposed in the first substrate arrangement area 21a using the pins 55 and 56 correspond to the first limiting portion, and the side limiting portion 7a corresponds to the second limiting portion. In addition, the two central limiting portions 3a and 3b that limit the glass substrate G disposed in the second substrate arrangement area 21b using the pins 56 and 55 also correspond to the third limiting portion, and the side limiting portion 7b corresponds to the fourth limiting portion.

其次,推壓部8,係被構成為可藉由前端從側面側推壓玻璃基板G之一邊,並為了使推壓位置具有遊隙而例如設置有彈簧構件。 在該實施形態中,在第1基板配置區域21a之前方,係2個長邊側推壓部8a被設置於左右,並藉由長邊側推壓部8a,推壓被載置於第1基板配置區域21a的玻璃基板G,藉此,可將該玻璃基板G推壓至中央限制部3a、3b的各銷56、55。又,在第1基板配置區域21a之左手側,係以可將該玻璃基板G朝向側方限制部7a推壓的方式,設置有短邊側推壓部8b。長邊側推壓部8a、短邊側推壓部8b,係分別相當於第1邊部對向推壓部、第2邊部對向推壓部。又,長邊側推壓部8a及短邊側推壓部8b,係相當於第1推壓部。Next, the pressing part 8 is configured to press one side of the glass substrate G from the side by the front end, and a spring member is provided, for example, to provide a clearance at the pressing position. In this embodiment, two long-side pressing parts 8a are provided on the left and right in front of the first substrate arrangement area 21a, and the glass substrate G placed on the first substrate arrangement area 21a is pressed by the long-side pressing parts 8a, thereby the glass substrate G can be pressed to the pins 56 and 55 of the central limiting parts 3a and 3b. In addition, on the left hand side of the first substrate arrangement area 21a, a short-side pressing part 8b is provided in a manner that the glass substrate G can be pressed toward the side limiting part 7a. The long side pressing portion 8a and the short side pressing portion 8b correspond to the first side opposing pressing portion and the second side opposing pressing portion, respectively. In addition, the long side pressing portion 8a and the short side pressing portion 8b correspond to the first pressing portion.

另一方面,在第2基板配置區域21b之後方,係2個長邊側推壓部8c被設置於左右,並藉由長邊側推壓部8c,推壓被載置於第2基板配置區域21b的玻璃基板G,藉此,可將該玻璃基板G推壓至中央限制部3a、3b的各銷55、56。又,在第2基板配置區域21b之左手側,係以可將該玻璃基板G朝向側方限制部7b推壓的方式,設置有短邊側推壓部8d。長邊側推壓部8c、短邊側推壓部8d,係分別相當於第3邊部對向推壓部、第4邊部對向推壓部。又,長邊側推壓部8c及短邊側推壓部8d,係相當於第2推壓部。On the other hand, two long side pressing parts 8c are provided on the left and right of the rear of the second substrate arrangement area 21b, and the glass substrate G placed on the second substrate arrangement area 21b is pressed by the long side pressing parts 8c, thereby the glass substrate G can be pressed to the pins 55 and 56 of the central limiting parts 3a and 3b. In addition, on the left hand side of the second substrate arrangement area 21b, a short side pressing part 8d is provided so as to press the glass substrate G toward the side limiting part 7b. The long side pressing part 8c and the short side pressing part 8d are respectively equivalent to the third side opposing pressing part and the fourth side opposing pressing part. In addition, the long side pressing portion 8c and the short side pressing portion 8d correspond to the second pressing portion.

設置於玻璃基板G之搬送路徑上的長邊側推壓部8a、8c,係例如被構成為在將玻璃基板G搬入搬出裝載鎖定室12時,在載置台20之內部(比上面更下方的位置)待機,並在搬入了玻璃基板G後,往載置台20的上方上升。又,短邊側推壓部8b、8d,係被構成為沿左右方向移動自如,在搬入搬出玻璃基板G之際,係被構成為在從第1基板配置區域21a、第2基板配置區域21b偏離的位置待機。The long side pressing parts 8a and 8c provided on the conveying path of the glass substrate G are configured to wait inside the mounting table 20 (at a position lower than the upper side) when the glass substrate G is carried in and out of the loading lock chamber 12, and to rise above the mounting table 20 after the glass substrate G is carried in. In addition, the short side pressing parts 8b and 8d are configured to be movable in the left-right direction, and to wait at a position away from the first substrate arrangement area 21a and the second substrate arrangement area 21b when the glass substrate G is carried in and out.

真空處理裝置,係如圖1所示般,具備有:控制部100,控制真空處理裝置內之玻璃基板G的搬送、對準。控制部100,係例如由具備有未圖示之CPU與記憶部的電腦所構成。該記憶部,係記錄有程式,該程式,係編入有真空處理裝置中之玻璃基板G的搬送排程或裝載鎖定室12中之對準的步驟(命令)群。又,對搬送玻璃基板G之每個真空處理模組9,記憶有用以將玻璃基板G載置於正確位置的對準中之玻璃基板G之配置位置的資訊。而且,記憶有關於預先藉由配合各真空處理模組9之教示所取得的搬送臂16之搬送位置的資訊。該程式,係例如被儲存於硬碟、光碟、磁光碟、記憶卡等的記憶媒體並從該些安裝於電腦。As shown in FIG. 1 , the vacuum processing device includes a control unit 100 for controlling the conveyance and alignment of the glass substrate G in the vacuum processing device. The control unit 100 is, for example, composed of a computer having a CPU and a memory unit (not shown). The memory unit records a program, which is a group of steps (commands) for the conveyance schedule of the glass substrate G in the vacuum processing device or the alignment in the loading lock chamber 12. In addition, for each vacuum processing module 9 that conveys the glass substrate G, information on the configuration position of the glass substrate G in the alignment for placing the glass substrate G in the correct position is stored. In addition, information on the conveyance position of the conveying arm 16 obtained in advance by cooperating with the instructions of each vacuum processing module 9 is stored. The program is stored on a storage medium such as a hard disk, an optical disk, a magneto-optical disk, a memory card, etc. and installed on a computer from these.

接著,說明關於真空搬送裝置的作用。當收納了玻璃基板G之搬送容器C被載置於裝載埠14時,則大氣搬送室11的搬送臂15取出2片玻璃基板G。而且,開啟裝載鎖定室12之搬入搬出口22之未圖示的閘閥,並使搬送臂15進入裝載鎖定室12,將所保持的2片玻璃基板G分別收授至第1基板配置區域21a、第2基板配置區域21b。Next, the function of the vacuum transfer device is described. When the transfer container C containing the glass substrates G is placed on the loading port 14, the transfer arm 15 of the atmospheric transfer chamber 11 takes out two glass substrates G. Then, the unillustrated gate of the loading/unloading port 22 of the loading lock chamber 12 is opened, and the transfer arm 15 enters the loading lock chamber 12 to transfer the two glass substrates G held therein to the first substrate arrangement area 21a and the second substrate arrangement area 21b, respectively.

而且,當玻璃基板G被收授至載置台20時,則在裝載鎖定室12中,係以未圖示之閘閥來關閉搬入搬出口22,將內部的氛圍切換成真空氛圍。此時,控制部100,係從記憶部讀出與「將所收授之玻璃基板G搬送至裝載鎖定室12的真空處理模組9」對應之玻璃基板G之配置位置的資訊。在裝載鎖定室12中,係從控制部100接收「搬送所收授之玻璃基板G的真空處理模組9」中之玻璃基板G之配置位置的資訊。在以下的例子中,係說明關於「取得了用以將玻璃基板G配置於與真空搬送室13之左手側連接的真空處理模組9內之配置位置的資訊」之情形。而且,在裝載鎖定室12中,係因應所取得之配置位置的資訊,進行玻璃基板G之對準。Furthermore, when the glass substrate G is received and delivered to the stage 20, the loading and unloading port 22 is closed by a gate not shown in the figure in the loading lock chamber 12, and the internal atmosphere is switched to a vacuum atmosphere. At this time, the control unit 100 reads the information of the configuration position of the glass substrate G corresponding to "transporting the received glass substrate G to the vacuum processing module 9 of the loading lock chamber 12" from the memory unit. In the loading lock chamber 12, the information of the configuration position of the glass substrate G in the "vacuum processing module 9 to which the received glass substrate G is transported" is received from the control unit 100. In the following example, the situation of "obtaining the information of the configuration position for arranging the glass substrate G in the vacuum processing module 9 connected to the left hand side of the vacuum transfer chamber 13" is explained. Furthermore, in the load lock chamber 12, the glass substrate G is aligned according to the obtained configuration position information.

參閱圖7~圖9,說明於裝載鎖定室12中之對準。另外,在圖7~圖9中,一併記載於限制部3、7及推壓部8之實線的箭頭,係表示為了在各步驟中限制或推壓玻璃基板G而進行移動者,虛線的箭頭,係表示停止在限制玻璃基板G的位置或推壓位置者。7 to 9 illustrate the alignment in the load lock chamber 12. In addition, in FIG. 7 to 9, the solid arrows shown together on the limiting parts 3, 7 and the pushing part 8 indicate that they move in order to limit or push the glass substrate G in each step, and the dotted arrows indicate that they stop at the position of limiting the glass substrate G or the pushing position.

首先,如圖7所示般,當2片玻璃基板G被載置於第1基板配置區域21a、第2基板配置區域21b時,則進行左右之中央限制部3a、3b及側方限制部7a、7b的對位,並設定各玻璃基板G的限制位置。其次,如圖8所示般,使位於玻璃基板G之前方側及後方側的長邊側推壓部8a、8c往載置台20之上面上升。然後,將前方側之玻璃基板G朝向後方側的中央限制部3a、3b推壓,並且將後方側之玻璃基板G朝向前方側的中央限制部3a、3b推壓(相當於第1推壓工程及第3推壓工程)。藉此,決定2片玻璃基板G之前後方向的位置。其次,如圖9所示般,使短邊側推壓部8b、8d往玻璃基板G側移動,且將各玻璃基板G推壓至側方限制部7a、7b(相當於第2推壓工程及第4推壓工程)。藉此,決定各玻璃基板G之左右方向的位置。First, as shown in FIG. 7 , when two glass substrates G are placed on the first substrate arrangement area 21a and the second substrate arrangement area 21b, the left and right central limiting parts 3a and 3b and the side limiting parts 7a and 7b are aligned, and the limiting positions of the glass substrates G are set. Next, as shown in FIG. 8 , the long side pressing parts 8a and 8c located on the front and rear sides of the glass substrates G are raised to the top of the mounting table 20. Then, the glass substrate G on the front side is pressed toward the central limiting parts 3a and 3b on the rear side, and the glass substrate G on the rear side is pressed toward the central limiting parts 3a and 3b on the front side (equivalent to the first pressing process and the third pressing process). In this way, the positions of the two glass substrates G in the front-back direction are determined. Next, as shown in Fig. 9, the short side pressing parts 8b and 8d are moved toward the glass substrate G, and each glass substrate G is pressed to the side limiting parts 7a and 7b (equivalent to the second pressing step and the fourth pressing step). Thus, the left-right position of each glass substrate G is determined.

而且,在本例之裝載鎖定室12中,係可調節中央限制部3中之銷55、56的離間間隔與各中央限制部3之前後方向的配置位置。該結果,可個別地調節各玻璃基板G的配置位置。換言之,藉由「改變從第1角部c1及第2角部c2朝與2片玻璃基板G之並排方向交叉的方向延伸之2個邊部(第1邊部s1、第3邊部s3)的離間間隔及該些邊所形成的角度」之方式,可個別地調節各玻璃基板G的配置位置。藉此,可將各2片並排被收納於搬送容器C的各層之玻璃基板G的相對配置關係變更成配合搬送終點的各真空處理模組9者。Furthermore, in the loading lock chamber 12 of this example, the distance between the pins 55 and 56 in the central limiting portion 3 and the arrangement position of each central limiting portion 3 in the front-rear direction can be adjusted. As a result, the arrangement position of each glass substrate G can be adjusted individually. In other words, by "changing the distance between the two sides (the first side s1 and the third side s3) extending from the first corner c1 and the second corner c2 in the direction intersecting the parallel direction of the two glass substrates G and the angle formed by these sides", the arrangement position of each glass substrate G can be adjusted individually. In this way, the relative arrangement relationship of each layer of the two glass substrates G stored side by side in the conveying container C can be changed to match each vacuum processing module 9 at the conveying end point.

參閱圖10~圖13,說明於個別地調節各玻璃基板G之配置位置的手法。在以下圖10~圖13的說明中,中央限制部3之2根銷55、56的離間間隔,係設成為表示Y軸方向上之從前方側的銷55之前端的位置至後方側的銷56之後端的位置為止之寬度者。又,圖中之虛線,係表示後述基準位置上之前方側的玻璃基板G之後方側之邊部(第1邊部s1)的位置s10及後方側的玻璃基板G之前方側之邊部(第3邊部s3)的位置s30。Referring to FIG. 10 to FIG. 13 , the method of adjusting the arrangement position of each glass substrate G individually is described. In the following description of FIG. 10 to FIG. 13 , the interval between the two pins 55 and 56 of the central limiting portion 3 is set to represent the width from the position of the front end of the pin 55 on the front side to the position of the rear end of the pin 56 on the rear side in the Y-axis direction. In addition, the dotted line in the figure represents the position s10 of the rear side edge (first edge s1) of the front side glass substrate G and the position s30 of the front side edge (third edge s3) of the rear side glass substrate G on the reference position described later.

例如,如圖10所示般,左右之中央限制部3,係將各個銷55、56的離間間隔調節成相同距離,例如將離間間隔調節成20mm,並且使2根銷之Y軸方向的位置一致,藉此,可相互平行地配置2片玻璃基板G。在此,係將圖10之狀態作為基準位置s10、s30而進行說明。 而且,如圖11所示般,將各中央限制部3之銷55、56的離間間隔設定成20mm,例如使左手側之中央限制部3b往前方側移動,並且使右手側之中央限制部3a往後方側移動。藉此,以各玻璃基板G之中心為中心,可將位於基準位置的各玻璃基板G配置於從上方觀看呈往順時鐘方向旋轉的位置。For example, as shown in FIG. 10 , the left and right central limiting parts 3 are arranged such that the interval between the pins 55 and 56 is adjusted to the same distance, for example, the interval is adjusted to 20 mm, and the positions of the two pins in the Y-axis direction are made consistent, thereby arranging two glass substrates G in parallel with each other. Here, the state of FIG. 10 is described as the reference positions s10 and s30. Furthermore, as shown in FIG. 11 , the interval between the pins 55 and 56 of each central limiting part 3 is set to 20 mm, for example, the central limiting part 3b on the left hand side is moved forward, and the central limiting part 3a on the right hand side is moved backward. Thus, with the center of each glass substrate G as the center, each glass substrate G located at the reference position can be arranged at a position rotated in the clockwise direction when viewed from above.

而且,如圖12所示般,將各中央限制部3a、3b之銷55、56的離間間隔設定成20mm,並使兩者之中央限制部3例如往前方移動相同距離,藉此,在平行地配置了各玻璃基板G的狀態下,可從基準位置s10、s30往前後方向移動(圖12,係表示往前方向移動的狀態)。 又,如圖13所示般,將左手側之中央限制部3b的銷55、56之離間間隔設成為例如30mm,將右手側之中央限制部3a的銷55、56之離間間隔設成為20mm,並且使左手側之中央限制部3b之後方側的銷55與右手側之中央限制部3a之後方側的銷56之前後方向的位置一致。藉此,可僅將前方側之玻璃基板G配置於從上方觀看呈往順時鐘方向旋轉的位置,並將後方側之玻璃基板G設成為與基準位置平行的狀態。Moreover, as shown in FIG. 12, the interval between the pins 55 and 56 of each central limiting portion 3a and 3b is set to 20 mm, and the central limiting portions 3 of both sides are moved forward by the same distance, for example, so that the glass substrates G can be moved forward and backward from the reference positions s10 and s30 in a state where the glass substrates G are arranged in parallel (FIG. 12 shows the state of moving forward). In addition, as shown in FIG. 13, the interval between the pins 55 and 56 of the central limiting portion 3b on the left hand side is set to 30 mm, and the interval between the pins 55 and 56 of the central limiting portion 3a on the right hand side is set to 20 mm, and the front-back positions of the pins 55 on the rear side of the central limiting portion 3b on the left hand side and the pins 56 on the rear side of the central limiting portion 3a on the right hand side are made consistent. Thereby, only the glass substrate G on the front side can be arranged at a position rotated in the clockwise direction when viewed from above, and the glass substrate G on the rear side can be set in a state parallel to the reference position.

如此一來,藉由調節中央限制部3中之銷55、56的離間間隔與位置的方式,可個別地調節各玻璃基板G的配置位置。又,亦可一併調節限制第2邊部s2、第4邊部s4之側方限制部7a、7b之左右方向的位置,且調節玻璃基板G的角度。In this way, by adjusting the interval and position of the pins 55 and 56 in the central limiting portion 3, the arrangement position of each glass substrate G can be adjusted individually. In addition, the left-right position of the side limiting portions 7a and 7b that limit the second side s2 and the fourth side s4 can also be adjusted at the same time, and the angle of the glass substrate G can be adjusted.

藉由上述手法,實施各玻璃基板G之對準,並且將裝載鎖定室12內之氛圍設成為真空氛圍,開放真空搬送室13側的搬入搬出口23。而且,藉由搬送臂16一次接收2片玻璃基板G,並搬送至預定的真空處理模組9例如被連接於真空搬送室13之左方的真空處理模組9。By the above method, the glass substrates G are aligned, and the atmosphere in the load lock chamber 12 is set to a vacuum atmosphere, and the loading and unloading port 23 on the side of the vacuum transfer chamber 13 is opened. Then, two glass substrates G are received at a time by the transfer arm 16 and transferred to a predetermined vacuum processing module 9, for example, a vacuum processing module 9 connected to the left side of the vacuum transfer chamber 13.

由於2片玻璃基板G,係配合搬送終點之真空處理模組9,在裝載鎖定室12個別地實施對準,因此,可補償伴隨著真空處理模組9之設置偏差等所引起的載置偏差,且將各玻璃基板G配置於正確位置。如此一來,藉由將各玻璃基板G配置於真空處理模組9內之正確位置的方式,可正常地處理玻璃基板G。Since the two glass substrates G are aligned individually in the load lock chamber 12 in coordination with the vacuum processing module 9 at the transfer end, it is possible to compensate for the placement deviation caused by the setting deviation of the vacuum processing module 9 and the like, and to arrange each glass substrate G at a correct position. In this way, by arranging each glass substrate G at a correct position in the vacuum processing module 9, the glass substrates G can be processed normally.

在以各真空處理模組9進行玻璃基板G的處理後,藉由搬送臂16同時取出2個玻璃基板G並收授至裝載鎖定室12。而且,在裝載鎖定室12中,係以使該些玻璃基板G之位置成為例如基準位置的方式,進行對準。亦即,使各限制部3a、3b、7a、7b分別移動至配合將與2片玻璃基板G之並排方向交叉的方向延伸之2個邊部(第1邊部s1、第3邊部s3)收納於搬送容器C內的位置,且再次進行對準。其後,將裝載鎖定室12之氛圍切換成大氣氛圍,藉由搬送臂15取出被載置於裝載鎖定室12的2片玻璃基板G,並使其返回到搬送容器C。After the glass substrates G are processed by each vacuum processing module 9, two glass substrates G are taken out at the same time by the conveying arm 16 and received in the loading lock chamber 12. In addition, in the loading lock chamber 12, the positions of the glass substrates G are aligned in a manner such as a reference position. That is, each of the limiting parts 3a, 3b, 7a, 7b is moved to a position that matches the two sides (the first side s1 and the third side s3) extending in a direction intersecting the parallel direction of the two glass substrates G to be received in the conveying container C, and alignment is performed again. Thereafter, the atmosphere of the loading lock chamber 12 is switched to an atmospheric atmosphere, and the two glass substrates G placed in the loading lock chamber 12 are taken out by the conveying arm 15 and returned to the conveying container C.

上述實施形態,係藉由限制部3、7來限制「形成分別對2片相鄰並排配置之玻璃基板G所設定的第1角部c1、第2角部c2」之邊部的位置。而且,從與所限制之各邊部對向的方向分別推壓推壓部8,進行玻璃基板G的對準。此時,將被配置於2片玻璃基板G之間的中央限制部3構成為沿前後方向移動自如,並且構成為可調節銷55、56的離間間隔,該銷55、56,係調節玻璃基板G的離間間隔。因此,可個別地調節各玻璃基板G的配置位置。In the above-mentioned embodiment, the positions of the edges that "form the first corner c1 and the second corner c2 respectively set for two adjacent glass substrates G arranged side by side" are restricted by the restricting portions 3 and 7. Furthermore, the glass substrates G are aligned by respectively pressing the pressing portions 8 from the directions opposite to the restricted edges. At this time, the central restricting portion 3 arranged between the two glass substrates G is configured to be movable in the front-rear direction, and the spacing of the pins 55 and 56 that adjust the spacing of the glass substrates G is configured to be adjustable. Therefore, the arrangement position of each glass substrate G can be adjusted individually.

又,藉由可分別調節中央限制部3之銷55、56的離間間隔及前後方向之位置的方式,可自由地調節2片玻璃基板G的離間間隔及配置角度。 又,本揭示,係以「可改變前方側之玻璃基板G之後方側的第1邊部s1及與該第1邊部s1相鄰的後方側之玻璃基板G之前方側的第3邊部s3之離間間隔及角度」的方式,設定第1角部c1、第2角部c2。因此,可使限制第1邊部s1與第3邊部s3的中央限制部3共通化,並可減少構件。 而且,推壓部8,係只要可從與第1角部c1、第2角部c2對向之方向施加力即可。因此,例如亦可逐一設置從自各玻璃基板G之第1角部c1、第2角部c2延伸的對角線之方向推壓各玻璃基板G的推壓部8。Furthermore, by adjusting the distance between the pins 55 and 56 of the central limiting portion 3 and the positions in the front-rear direction respectively, the distance between the two glass substrates G and the configuration angle can be freely adjusted. In addition, the present disclosure sets the first corner c1 and the second corner c2 in such a manner that "the distance between the first side s1 on the rear side of the glass substrate G on the front side and the third side s3 on the front side of the glass substrate G on the rear side adjacent to the first side s1 can be changed". Therefore, the central limiting portion 3 that limits the first side s1 and the third side s3 can be made common, and the number of components can be reduced. Moreover, the pressing portion 8 can be used as long as it can apply force from the direction opposite to the first corner c1 and the second corner c2. Therefore, for example, a pressing portion 8 for pressing each glass substrate G in the direction of a diagonal line extending from the first corner c1 and the second corner c2 of each glass substrate G may be provided one by one.

又,亦可在進行各玻璃基板G之對位時,將被配置於前後的長邊側推壓部8a、8c與被配置於側方的短邊側推壓部8b、8d推壓至玻璃基板G,並同時限制各玻璃基板G之前後方向的位置與左右方向的位置。然而,藉由個別地執行從玻璃基板G的前後方向推壓長邊側推壓部8a、8c之時序與從側方推壓短邊側推壓部8b、8d之時序的方式,可使施加至玻璃基板G的力一次分散。因此,具有玻璃基板G之對準之精度提高的效果。推壓長邊側推壓部8a、8c之時序與推壓短邊側推壓部8b、8d之時序,係亦可先推壓長邊側推壓部8a、8c,其後,推壓短邊側推壓部8b、8d。抑或,亦可先推壓短邊側推壓部8b、8d,其後,推壓長邊側推壓部8a、8c。Furthermore, when aligning each glass substrate G, the long side pressing parts 8a and 8c arranged at the front and rear and the short side pressing parts 8b and 8d arranged at the side may be pressed against the glass substrate G, and the position of each glass substrate G in the front-back direction and the left-right direction may be restricted at the same time. However, by separately executing the timing of pressing the long side pressing parts 8a and 8c from the front-back direction of the glass substrate G and the timing of pressing the short side pressing parts 8b and 8d from the side, the force applied to the glass substrate G can be dispersed at once. Therefore, the accuracy of the alignment of the glass substrate G is improved. The timing of pushing the long side pushing parts 8a and 8c and the timing of pushing the short side pushing parts 8b and 8d may be that the long side pushing parts 8a and 8c are pushed first, and then the short side pushing parts 8b and 8d are pushed. Alternatively, the short side pushing parts 8b and 8d may be pushed first, and then the long side pushing parts 8a and 8c are pushed.

亦可在相互不同之時序,將被載置於第1基板配置區域21a之玻璃基板G的長邊側推壓部8a、短邊側推壓部8b、被載置於第2基板配置區域21b之玻璃基板G的長邊側推壓部8c及短邊側推壓部8d分別推壓至玻璃基板G。在該情況下,由於亦可在各玻璃基板G中,使一次施加至玻璃基板G的力分散,因此,具有玻璃基板G之對準之精度提高的效果。The long side pressing portion 8a and the short side pressing portion 8b of the glass substrate G placed in the first substrate arrangement region 21a and the long side pressing portion 8c and the short side pressing portion 8d of the glass substrate G placed in the second substrate arrangement region 21b may be pressed against the glass substrate G at different timings. In this case, since the force applied to the glass substrate G at one time can be dispersed among the glass substrates G, the alignment accuracy of the glass substrates G can be improved.

而且,在本揭示中,係在以中央限制部3變更銷55,56的離間間隔時,調節推拔部57中之移動體41的進入位置,藉此,可調節銷55,56的離間間隔。因此,可改變第1邊部s1與第3邊部s3之間的離間間隔及該些邊部所形成之角度的設定值。因此,可因應真空處理模組9之偏差來調節設定值。Furthermore, in the present disclosure, when the distance between the pins 55 and 56 is changed by the central limiting portion 3, the entry position of the moving body 41 in the pushing portion 57 is adjusted, thereby adjusting the distance between the pins 55 and 56. Therefore, the setting value of the distance between the first side s1 and the third side s3 and the angle formed by these sides can be changed. Therefore, the setting value can be adjusted in response to the deviation of the vacuum processing module 9.

又,由於設置有2個中央限制部3,因此,與一個中央限制部3的情形相比,可使第1邊部s1及第3邊部s3之離間間隔及角度在更廣的範圍內變化。 而且,亦可在使結束了處理之玻璃基板G從裝載鎖定室12返回到搬送容器C時,從記憶部讀出與儲存玻璃基板G的搬送容器C對應之玻璃基板G之配置位置的資訊,且進行對位。Furthermore, since two central limiting portions 3 are provided, the interval and angle between the first side portion s1 and the third side portion s3 can be changed in a wider range compared to the case of one central limiting portion 3. In addition, when the processed glass substrate G is returned from the loading lock chamber 12 to the conveying container C, the information of the configuration position of the glass substrate G corresponding to the conveying container C storing the glass substrate G can be read from the memory unit and aligned.

又,本揭示,係如圖14所示般,亦可具備有俯視六角形之真空搬送室130,並將連接了裝載鎖定室12與5個真空處理模組9的真空處理裝置應用於真空搬送室130的各側面。在像這樣的真空處理裝置中,係真空處理模組9相對於裝載鎖定室12與真空搬送室13之並排方向而被連接於傾斜的位置。因此,與被設置於「裝載鎖定室12及真空搬送室13並排之方向或相對於並排方向呈正交之方向」的真空處理模組9相比,難以實施僅由搬送臂16的教示所進行之配置位置的調整。Furthermore, the present disclosure may also include a hexagonal vacuum transfer chamber 130 in a top view, as shown in FIG. 14, and a vacuum processing device connected to a loading lock chamber 12 and five vacuum processing modules 9 may be applied to each side surface of the vacuum transfer chamber 130. In such a vacuum processing device, the vacuum processing module 9 is connected at an inclined position relative to the parallel direction of the loading lock chamber 12 and the vacuum transfer chamber 13. Therefore, compared with the vacuum processing module 9 that is set in the "direction in which the loading lock chamber 12 and the vacuum transfer chamber 13 are parallel or in a direction orthogonal to the parallel direction", it is difficult to adjust the configuration position by only the transfer arm 16.

關於該點,由於在本揭示之真空處理裝置中,係當在裝載鎖定室12進行對準時,可對每個真空處理模組9個別地調節2片玻璃基板G的配置位置,因此,即便在像這樣的真空處理裝置中,亦可將玻璃基板G正確地搬送至各真空處理模組9。 又,亦可為有別於裝載鎖定室12,將進行2片玻璃基板G之對準的對準模組另外連接於裝載鎖定室12或真空搬送室13、130的構成,以代替記載於圖1、圖14的例子。 又,真空搬送室,係不限於俯視六角形,亦可為俯視是任意多角形的構成。In this regard, in the vacuum processing apparatus disclosed in the present invention, when alignment is performed in the loading lock chamber 12, the configuration position of the two glass substrates G can be adjusted individually for each vacuum processing module 9. Therefore, even in such a vacuum processing apparatus, the glass substrates G can be correctly transferred to each vacuum processing module 9. In addition, it is also possible to connect the alignment module for aligning the two glass substrates G to the loading lock chamber 12 or the vacuum transfer chamber 13, 130 separately from the loading lock chamber 12, instead of the examples shown in Figures 1 and 14. In addition, the vacuum transfer chamber is not limited to a hexagonal shape in a top view, and can also be a structure that is an arbitrary polygon in a top view.

本揭示,係只要推壓部8從與形成所限制之第1角部c1的2個邊部對向之方向被推壓,且推壓部從與形成所限制之第2角部c2的2個邊部對向之方向被推壓即可。在圖15A~圖15E中表示像這樣的變化。在該些圖中,以粗線表示與由各限制部3、7所限制之玻璃基板G的邊對應之位置。例如如圖15B~圖15E般,有時2片玻璃基板G的第1邊部s1與第3邊部s3被分開配置。在該情況下,係亦可與側方限制部7a、7b相同地,個別地設置該些限制部3a、3b以代替設置共通的中央限制部3a、3b。The present disclosure only requires that the pushing portion 8 is pushed from the direction opposite to the two sides forming the restricted first corner c1, and the pushing portion is pushed from the direction opposite to the two sides forming the restricted second corner c2. Such changes are shown in Figures 15A to 15E. In these figures, the positions corresponding to the sides of the glass substrate G restricted by each restriction portion 3, 7 are indicated by bold lines. For example, as shown in Figures 15B to 15E, the first side s1 and the third side s3 of the two glass substrates G are sometimes separately arranged. In this case, the restriction portions 3a, 3b can also be individually provided in the same manner as the side restriction portions 7a, 7b instead of providing the common central restriction portions 3a, 3b.

如以上所探討般,本次所揭示之實施形態,係在所有方面皆為例示,吾人應瞭解該等例示並非用以限制本發明。上述之實施形態,係亦可在不脫離添附之申請專利範圍及其主旨的情況下,以各種形態進行省略、置換、變更。As discussed above, the embodiments disclosed herein are illustrative in all aspects, and it should be understood that such illustrative embodiments are not intended to limit the present invention. The embodiments described above may be omitted, replaced, or modified in various forms without departing from the scope and gist of the attached patent application.

3(3a,3b):中央限制部 7(7a,7b):側方限制部 8(8a~8d):推壓部 20:載置台 55,56:銷 c1:第1角部 c2:第2角部 G:玻璃基板3(3a, 3b): Central limiting part 7(7a, 7b): Side limiting part 8(8a~8d): Pushing part 20: Loading table 55, 56: Pin c1: 1st corner c2: 2nd corner G: Glass substrate

[圖1]一實施形態之真空處理裝置的平面圖。 [圖2]一實施形態之裝載鎖定室的平面圖。 [圖3]一實施形態之中央限制部的平面圖。 [圖4]表示一實施形態之中央限制部之作用的說明圖。 [圖5]表示一實施形態之中央限制部之作用的說明圖。 [圖6]表示一實施形態之中央限制部之作用的說明圖。 [圖7]表示一實施形態之裝載鎖定室之作用的說明圖。 [圖8]表示一實施形態之裝載鎖定室之作用的說明圖。 [圖9]表示一實施形態之裝載鎖定室之作用的說明圖。 [圖10]說明玻璃基板之配置位置的調節之一例的說明圖。 [圖11]說明玻璃基板之配置位置的調節之一例的說明圖。 [圖12]說明玻璃基板之配置位置的調節之一例的說明圖。 [圖13]說明玻璃基板之配置位置的調節之一例的說明圖。 [圖14]表示真空處理裝置之其他例的平面圖。 [圖15A]表示對準方式之其他例的示意圖。 [圖15B]表示對準方式之其他例的示意圖。 [圖15C]表示對準方式之其他例的示意圖。 [圖15D]表示對準方式之其他例的示意圖。 [圖15E]表示對準方式之其他例的示意圖。[Figure 1] A plan view of a vacuum processing device of an embodiment. [Figure 2] A plan view of a loading lock chamber of an embodiment. [Figure 3] A plan view of a central limiting portion of an embodiment. [Figure 4] An explanatory diagram showing the function of the central limiting portion of an embodiment. [Figure 5] An explanatory diagram showing the function of the central limiting portion of an embodiment. [Figure 6] An explanatory diagram showing the function of the central limiting portion of an embodiment. [Figure 7] An explanatory diagram showing the function of a loading lock chamber of an embodiment. [Figure 8] An explanatory diagram showing the function of a loading lock chamber of an embodiment. [Figure 9] An explanatory diagram showing the function of a loading lock chamber of an embodiment. [Figure 10] An explanatory diagram showing an example of adjusting the configuration position of a glass substrate. [FIG. 11] An explanatory diagram for explaining an example of adjusting the configuration position of a glass substrate. [FIG. 12] An explanatory diagram for explaining an example of adjusting the configuration position of a glass substrate. [FIG. 13] An explanatory diagram for explaining an example of adjusting the configuration position of a glass substrate. [FIG. 14] A plan view showing another example of a vacuum processing device. [FIG. 15A] A schematic diagram showing another example of an alignment method. [FIG. 15B] A schematic diagram showing another example of an alignment method. [FIG. 15C] A schematic diagram showing another example of an alignment method. [FIG. 15D] A schematic diagram showing another example of an alignment method. [FIG. 15E] A schematic diagram showing another example of an alignment method.

3:限制部 3: Restriction Department

3a:右手側之中央限制部 3a: Central restriction on the right side

3b:左手側之中央限制部 3b: Central restriction on the left hand side

7:限制部 7: Restriction Department

7a:側方限制部 7a: Side restriction section

7b:側方限制部 7b: Side restriction section

8:推壓部 8: Pushing part

8a:長邊側推壓部 8a: Long side push part

8b:短邊側推壓部 8b: Short side push part

8c:長邊側推壓部 8c: Long side push part

8d:短邊側推壓部 8d: Short side push part

12:裝載鎖定室 12: Loading lock room

20:載置台 20: Loading platform

21a:基板配置區域 21a: Substrate configuration area

21b:基板配置區域 21b: Substrate configuration area

22:搬入搬出口 22: Move in and move out

23:搬入搬出口 23: Move in and move out

55:銷 55: Sales

56:銷 56: Sales

200:真空容器 200: Vacuum container

c1:第1角部 c1: 1st corner

c2:第2角部 c2: 2nd corner

s1:第1邊部 s1:1st side

s2:第2邊部 s2: 2nd side

s3:第3邊部 s3: 3rd side

s4:第4邊部 s4: 4th side

Claims (11)

一種對準裝置,係調節矩形基板之配置位置,該對準裝置,其特徵係,具備有:載置台,設定有用以相鄰並排地配置2片矩形基板的第1基板配置區域及第2基板配置區域;第1限制部及第2限制部,在將從構成被配置於前述第1基板配置區域的矩形基板之4個角部所選擇的1個角部設成為第1角部時,分別限制形成前述第1角部之2個邊部的配置位置;第1推壓部,將矩形基板從與形成前述第1角部之2個邊部對向的方向朝向前述第1限制部及前述第2限制部推壓;第3限制部及第4限制部,在將從構成被配置於前述第2基板配置區域的矩形基板之4個角部所選擇的1個角部設成為第2角部時,分別限制形成前述第2角部之2個邊部的配置位置;第2推壓部,將矩形基板從與形成前述第2角部之2個邊部對向的方向朝向前述第3限制部及前述第4限制部推壓;及移動機構,使前述第1限制部~前述第4限制部分別移動,以改變從前述第1角部及前述第2角部朝與前述2片矩形基板之並排方向交叉的方向延伸之2個邊部的離間間隔及該些邊所形成的角度,在將改變前述離間間隔及前述角度的2個邊部稱為第1 邊部及第3邊部時,以成為該些第1邊部及第3邊部相鄰配置之位置的方式,選擇前述第1角部及前述第2角部,在分別以前述第1限制部及前述第3限制部來限制前述第1邊部及前述第3邊部的配置位置時,前述第1限制部及前述第3限制部,係被設置於共通移動機構,該共通移動機構,係指「可改變沿著與前述2片矩形基板之並排方向交叉的方向觀看到之前述第1限制部及前述第3限制部的離間間隔」之共通的移動機構。 An alignment device is used to adjust the arrangement position of a rectangular substrate. The alignment device is characterized in that it has: a loading table, which is provided with a first substrate arrangement area and a second substrate arrangement area for arranging two rectangular substrates adjacent to each other and side by side; a first limiting portion and a second limiting portion, when a corner selected from four corners of the rectangular substrate arranged in the first substrate arrangement area is set as the first corner, respectively limiting the arrangement position of two sides forming the first corner; a first pusher The pressing portion pushes the rectangular substrate from the direction opposite to the two sides forming the first corner toward the first limiting portion and the second limiting portion; the third limiting portion and the fourth limiting portion respectively limit the configuration positions of the two sides forming the second corner when one corner selected from the four corners of the rectangular substrate configured in the second substrate configuration area is set as the second corner; the second pressing portion pushes the rectangular substrate from the direction opposite to the two sides forming the second corner toward the first limiting portion and the second limiting portion. Pushing the aforementioned third limiting part and the aforementioned fourth limiting part; and a moving mechanism to move the aforementioned first limiting part to the aforementioned fourth limiting part respectively, so as to change the distance between the two sides extending from the aforementioned first corner and the aforementioned second corner in a direction intersecting the parallel direction of the aforementioned two rectangular substrates and the angle formed by these sides, when the two sides whose distance and the aforementioned angle are changed are called the first side and the third side, so as to become the position where these first sides and the third sides are arranged adjacently In the method of placement, the first corner and the second corner are selected, and when the first limiting part and the third limiting part are used to limit the configuration positions of the first side and the third side, respectively, the first limiting part and the third limiting part are set on a common moving mechanism, which refers to a common moving mechanism that "can change the distance between the first limiting part and the third limiting part when viewed along a direction intersecting the parallel arrangement direction of the two rectangular substrates". 如請求項1之對準裝置,其中,前述移動機構,係可變更前述離間間隔及前述角度的設定值。 As in the alignment device of claim 1, the moving mechanism can change the setting values of the interval and the angle. 如請求項1之對準裝置,其中,沿著前述第1邊部與前述第3邊部之間隙,設置有複數組前述第1限制部及前述第3限制部與前述共通移動機構的組。 As in claim 1, the alignment device, wherein a plurality of sets of the first limiting parts and the third limiting parts and the common moving mechanism are provided along the gap between the first side and the third side. 如請求項1~3中任一項之對準裝置,其中,在將形成前述第1角部之2個邊部的一方之邊部稱為第1邊部而將另一方之邊部稱為第2邊部,並將形成前述第2角部之2個邊部的一方之邊部稱為第3邊部而將另一方之邊部稱為第4邊部時,前述第1推壓部,係具備有:第1邊部對向推壓部,從與前述第1邊部對向之方向推壓矩形基板;及第2邊部對向推壓部,從與前述第2邊部對向之方向推壓矩形基板, 前述第2推壓部,係具備有:第3邊部對向推壓部,從與前述第3邊部對向之方向推壓矩形基板;及第4邊部對向推壓部,從與前述第4邊部對向之方向推壓矩形基板,前述第1邊部對向推壓部朝向第1邊部推壓矩形基板的時序與前述第2邊部對向推壓部朝向第2邊部推壓矩形基板的時序相互不同,前述第3邊部對向推壓部朝向第3邊部推壓矩形基板的時序與前述第4邊部對向推壓部朝向第4邊部推壓矩形基板的時序相互不同。 An alignment device as claimed in any one of claims 1 to 3, wherein when one of the two sides forming the aforementioned first corner is referred to as the first side and the other side is referred to as the second side, and when one of the two sides forming the aforementioned second corner is referred to as the third side and the other side is referred to as the fourth side, the aforementioned first pressing portion comprises: a first side opposing pressing portion for pressing the rectangular substrate from a direction opposite to the aforementioned first side; and a second side opposing pressing portion for pressing the rectangular substrate from a direction opposite to the aforementioned second side, The aforementioned second pressing portion The pressing part comprises: a third side pressing part for pressing the rectangular substrate from a direction opposite to the third side; and a fourth side pressing part for pressing the rectangular substrate from a direction opposite to the fourth side, wherein the timing of the first side pressing part pressing the rectangular substrate toward the first side is different from the timing of the second side pressing part pressing the rectangular substrate toward the second side, and the timing of the third side pressing part pressing the rectangular substrate toward the third side is different from the timing of the fourth side pressing part pressing the rectangular substrate toward the fourth side. 一種基板處理裝置,其特徵係,具備有:裝載鎖定模組,具備有如請求項1~4項中任一項之對準裝置,且被構成為將常壓氛圍與真空氛圍切換自如;真空搬送模組,被連接於前述裝載鎖定模組,並具備有基板搬送機構,該基板搬送機構,係在真空氛圍下,同時搬送以前述對準裝置調節了配置位置的2片矩形基板;及基板處理模組,被連接於前述真空搬送模組,收容藉由前述基板搬送機構所搬送的2片矩形基板,並在真空氛圍下進行基板處理。 A substrate processing device is characterized by comprising: a loading and locking module having an alignment device as described in any one of claim items 1 to 4 and configured to switch between normal pressure atmosphere and vacuum atmosphere freely; a vacuum transport module connected to the loading and locking module and having a substrate transport mechanism, the substrate transport mechanism transports two rectangular substrates whose arrangement positions are adjusted by the alignment device at the same time in a vacuum atmosphere; and a substrate processing module connected to the vacuum transport module, accommodating the two rectangular substrates transported by the substrate transport mechanism, and performing substrate processing in a vacuum atmosphere. 如請求項5之基板處理裝置,其中,複數個前述基板處理模組被連接於前述真空搬送模組。 A substrate processing device as claimed in claim 5, wherein a plurality of the aforementioned substrate processing modules are connected to the aforementioned vacuum transfer module. 如請求項6之基板處理裝置,其中,包含有: 前述基板處理模組,在俯視前述基板處理裝置時,沿著從前述裝載鎖定模組與前述真空搬送模組之並排方向及與該些模組之並排方向正交的方向偏離的方向,被連接於前述真空搬送模組。 The substrate processing device of claim 6, wherein: The substrate processing module is connected to the vacuum transfer module in a direction deviating from the parallel direction of the loading and locking module and the vacuum transfer module and a direction orthogonal to the parallel direction of the modules when the substrate processing device is viewed from above. 一種對準方法,係調節矩形基板之配置位置,該對準方法,其特徵係,包含有:在載置台配置該些矩形基板的工程,該載置台,係設定有用以相鄰並排地配置2片矩形基板的第1基板配置區域及第2基板配置區域;在將從構成被配置於前述第1基板配置區域的矩形基板之4個角部所選擇的1個角部設成為第1角部時,將該矩形基板從與形成前述第1角部之2個邊部對向的方向朝向分別限制形成前述第1角部之2個邊部的配置位置之第1限制部及第2限制部推壓的工程;及在將從構成被配置於前述第2基板配置區域的矩形基板之4個角部所選擇的1個角部設成為第2角部時,將該矩形基板從與形成前述第2角部之2個邊部對向的方向朝向分別限制形成前述第2角部之2個邊部的配置位置之第3限制部及第4限制部推壓的工程,前述第1限制部~前述第4限制部,係相對於各矩形基板朝前述第1基板配置區域及前述第2基板配置區域之最初的配置狀態,被配置於「改變從前述第1角部及前述第2角部朝與該些矩形基板之並排方向交叉的方向延伸之2個邊部的離間間隔及該些邊所形成的角度」之位置, 在將改變前述離間間隔及前述角度的2個邊部稱為第1邊部及第3邊部時,以成為該些第1邊部及第3邊部相鄰配置之位置的方式,選擇前述第1角部及前述第2角部,在分別以前述第1限制部及前述第3限制部來限制前述第1邊部及前述第3邊部的配置位置時,前述第1限制部及前述第3限制部,係被設置於共通移動機構,該共通移動機構,係指「可改變沿著與前述2片矩形基板之並排方向交叉的方向觀看到之前述第1限制部及前述第3限制部的離間間隔」之共通的移動機構。 An alignment method is to adjust the configuration position of a rectangular substrate. The alignment method is characterized in that it includes: a process of arranging the rectangular substrates on a stage, the stage being provided with a first substrate configuration area and a second substrate configuration area for arranging two rectangular substrates adjacent to each other and side by side; when setting a corner selected from four corners of the rectangular substrate arranged in the first substrate configuration area as the first corner, the rectangular substrate is adjusted from a direction opposite to two sides forming the first corner. The process of pushing the first limiting portion and the second limiting portion toward the configuration positions of the two sides forming the aforementioned first corner respectively; and the process of pushing the rectangular substrate from the direction opposite to the two sides forming the aforementioned second corner toward the third limiting portion and the fourth limiting portion for respectively limiting the configuration positions of the two sides forming the aforementioned second corner when setting one corner selected from the four corners of the rectangular substrate configured in the aforementioned second substrate configuration area as the second corner, wherein the aforementioned first limiting portion ~The aforementioned fourth limiting portion is arranged at a position that "changes the distance between two sides extending from the aforementioned first corner and the aforementioned second corner in a direction intersecting the parallel direction of the rectangular substrates and the angle formed by these sides" relative to the initial arrangement state of each rectangular substrate toward the aforementioned first substrate arrangement area and the aforementioned second substrate arrangement area. When the two sides whose distance and angle are changed are referred to as the first side and the third side, the first side and the third side are adjacent to each other. The configuration position is selected by selecting the aforementioned first corner and the aforementioned second corner, and when the aforementioned first limiting part and the aforementioned third limiting part are used to limit the configuration position of the aforementioned first side and the aforementioned third side, respectively, the aforementioned first limiting part and the aforementioned third limiting part are set on a common moving mechanism, and the common moving mechanism refers to a common moving mechanism that "can change the distance between the aforementioned first limiting part and the aforementioned third limiting part when viewed along a direction intersecting the parallel arrangement direction of the aforementioned two rectangular substrates." 如請求項8之對準方法,其中,在將改變前述離間間隔及前述角度的2個邊部稱為第1邊部及第3邊部時,以成為該些第1邊部及第3邊部相鄰配置之位置的方式,選擇前述第1角部及前述第2角部。 In the alignment method of claim 8, when the two sides whose spacing interval and angle are changed are referred to as the first side and the third side, the first corner and the second corner are selected in such a manner that the first side and the third side are adjacently arranged. 如請求項8或9之對準方法,其中,在將形成前述第1角部之2個邊部的一方之邊部稱為第1邊部而將另一方之邊部稱為第2邊部,並將形成前述第2角部之2個邊部的一方之邊部稱為第3邊部而將另一方之邊部稱為第4邊部時,從與形成前述第1角部之2個邊部對向的方向推壓該矩形基板之工程,係包含有:第1推壓工程,從與前述第1邊部對向的方向推壓矩形基板;及第2推壓工程,在與前述第1推壓工程不同之時序下,從與前述第2邊部對向的方向推壓矩形基板,從與形成前述第2角部之2個邊部對向的方向推壓該矩 形基板之工程,係包含有:第3推壓工程,從與前述第3邊部對向的方向推壓矩形基板;及第4推壓工程,在與前述第3推壓工程不同之時序下,從與前述第4邊部對向的方向推壓矩形基板。 In the alignment method of claim 8 or 9, when one of the two sides forming the first corner is referred to as the first side and the other side is referred to as the second side, and when one of the two sides forming the second corner is referred to as the third side and the other side is referred to as the fourth side, the process of pushing the rectangular substrate from a direction opposite to the two sides forming the first corner includes: a first pushing process of pushing from a direction opposite to the first side Rectangular substrate; and a second pressing process, in a different timing from the first pressing process, pressing the rectangular substrate from a direction opposite to the second side, and the process of pressing the rectangular substrate from a direction opposite to the two sides forming the second corner, includes: a third pressing process, pressing the rectangular substrate from a direction opposite to the third side; and a fourth pressing process, in a different timing from the third pressing process, pressing the rectangular substrate from a direction opposite to the fourth side. 一種基板處理方法,其特徵係,包含有:藉由共通的基板搬送機構,在真空氛圍下,同時搬送以如請求項8~10中任一項之對準方法調節了配置位置之2片矩形基板的工程;及將藉由前述基板搬送機構所搬送之2片矩形基板收容於基板處理模組,並在真空氛圍下進行基板處理的工程。 A substrate processing method, characterized by comprising: a process of simultaneously transporting two rectangular substrates whose configuration positions are adjusted by an alignment method as in any one of claims 8 to 10 by a common substrate transport mechanism in a vacuum atmosphere; and a process of placing the two rectangular substrates transported by the substrate transport mechanism in a substrate processing module and performing substrate processing in a vacuum atmosphere.
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