TWI844422B - Package structure and manufacturing method of package structure - Google Patents

Abstract

A package structure including a unit substrate, a measuring element, a chip and an encapsulation layer is provided. The measuring element is disposed on the unit substrate, and a section width of the measuring element changes with a height of the measuring element. The chip includes an upper surface and a lower surface, and the lower surface is connected to the unit substrate. The encapsulation layer is disposed on the unit substrate and covers the chip and the measuring element. A top surface of the measuring element is exposed to the encapsulation layer, and the upper surface is spaced from a surface of the encapsulation layer by a distance corresponding to a section width of the top surface of the measuring element. In addition, a manufacturing method of the package structure is also proposed.

Description

Package structure and method for manufacturing the same

The present invention relates to a packaging structure and a method for manufacturing the packaging structure, and in particular to a packaging structure and a method for manufacturing the packaging structure that can quickly and intuitively determine the spacing size.

In a specific package structure, such as a fingerprint reader, the product characteristics are related to the distance between the chip of the package structure and the surface of the package layer. The current method of confirming the distance of the package structure is, for example, cutting the package structure to obtain a cross section of the package structure to measure the distance. This measurement method will destroy the package structure, resulting in increased testing costs and time-consuming.

The present invention provides a packaging structure and a method for manufacturing the packaging structure, which can quickly and intuitively determine the product characteristics (such as a specific size) of the packaging structure without destroying the packaging structure.

The packaging structure of the present invention includes a unit substrate, a measuring device, a chip and a packaging layer. The measuring device is arranged on the unit substrate, and a cross-sectional width of the measuring device changes with a height of the measuring device. The chip includes an upper surface and a lower surface, and the lower surface is connected to the unit substrate. The packaging layer is arranged on the unit substrate and covers the chip and the measuring device. A top surface of the measuring device is exposed to the packaging layer, and a distance is spaced between the upper surface and a surface of the packaging layer, and the distance corresponds to the cross-sectional width of the top surface of the measuring device.

The manufacturing method of the packaging structure of the present invention includes the following steps. A substrate is provided. At least one protrusion is provided, and the at least one protrusion is provided on the substrate, and a cross-sectional width of each at least one protrusion changes with a height of each at least one protrusion. At least one chip is provided, and each at least one chip includes an upper surface and a lower surface, and the lower surface is connected to the substrate. A packaging layer is provided, and the packaging layer covers at least one chip and at least one protrusion. The packaging layer and the at least one protrusion are ground, and the upper surface of each at least one chip is spaced a distance from a surface of the ground packaging layer, and the at least one protrusion is ground to form at least one measuring piece, and a top surface of each at least one measuring piece is exposed on the ground packaging layer, and the distance corresponds to the cross-sectional width of the top surface of each at least one measuring piece. The substrate and the packaging layer are cut to form a packaging structure, and the substrate is cut to form at least one unit substrate.

Based on the above, the top of the measuring part of the package structure of the present invention is exposed on the package layer, and the cross-sectional width of the top corresponds to the distance between the upper surface of the chip and the surface of the package layer. The user can directly measure the cross-sectional width of the exposed top and know the distance between the upper surface of the chip and the surface of the package layer. In this way, the user can intuitively and quickly judge the product characteristics of the package structure, so as to improve the convenience of the package structure and reduce the detection cost and time.

In order to make the above features and advantages of the present invention more clearly understood, the following is a detailed description of the embodiments with the accompanying drawings.

A: Dashed line

β1, β2: angle

C: Cutting line

D1, D3: distance

D2: Thickness

H: Height

H1, H2, H3: Total height

W1, W2, W3, W4, W5: Cross-sectional width

S: Temporary support carrier

S1: Inclined surface

S2: Bottom surface

100a, 100b: packaging structure

110a: Substrate

110b: unit substrate

112: Anti-welding layer

120a, 120b: protruding parts

130a, 130b: measuring parts

132: Top

140: Chip

142: Upper surface

144: Lower surface

150a, 150b: packaging layer

152: Surface

160:Welding wire

170: Electronic components

180: Membrane layer

Figures 1 to 6 are partial cross-sectional schematic diagrams of a method for manufacturing a packaging structure according to an embodiment of the present invention.

FIG. 7 is a top view of the substrate of FIG. 6 .

FIG8 is a schematic cross-sectional view of the packaging structure of FIG6.

FIG9 is a partial cross-sectional schematic diagram of the manufacturing method of the packaging structure of FIG6.

Figure 10 is a schematic diagram of the package structure formed after cutting the measuring piece.

Figure 11 is a schematic diagram of a protrusion and a substrate according to another embodiment of the present invention.

FIG12 is a schematic diagram of the measuring device and substrate of FIG11 .

Fig. 1 to Fig. 6 are partial cross-sectional schematic diagrams of a method for manufacturing a package structure according to an embodiment of the present invention. Fig. 7 is a top view of the substrate of Fig. 6. Fig. 8 is a cross-sectional schematic diagram of the package structure of Fig. 6. Please refer to Fig. 1 to Fig. 8 for the manufacturing method of the package structure of this embodiment. First, as shown in Fig. 1, a temporary support carrier S and a substrate 110a are provided. The temporary support carrier S is used to support the substrate 110a. The substrate 110a can be provided on the temporary support carrier S. The temporary support carrier S can be a plate, a film, or a fixture or a clamp specially used on a machine. But it is not limited to this. In an embodiment not shown, the substrate 110a can be directly placed on the machine equipment without using a temporary support carrier S.

Next, as shown in FIG. 2 , at least one protrusion 120a is disposed on the substrate 110a. The material of the protrusion 120a of the present embodiment is the same as the insulating material of a solder-proof layer 112 of the substrate 110a, but is not limited thereto. Specifically, the solder-proof layer 112 and the protrusion 120a may be integrated. The method of disposing the protrusion 120a is, for example, to form the protrusion 120a at the same time as disposing the solder-proof layer 112 on the substrate 110a.

A cross-sectional width W1 of the protrusion 120a changes with a height H of the protrusion 120a. That is, the height of any point on the protrusion 120a corresponds to a specific cross-sectional width. The height H of the protrusion 120a is inversely proportional to the cross-sectional width W1, but is not limited thereto. An angle β1 is formed between an inclined surface S1 and a bottom surface S2 of the protrusion 120a, and the angle β1 corresponds to a total height H1 of the protrusion 120a.

The cross-sectional shape of the protrusion 120a is, for example, a triangle. The cross-sectional shape of the protrusion 120a of this embodiment is a right triangle, but is not limited thereto. The cross-sectional shape of the protrusion 120a can be any triangle such as an isosceles triangle or an equilateral triangle. The angle β1 is, for example, 30 degrees, but is not limited thereto. In an embodiment not shown, the angle β1 is, for example, 45 degrees, 60 degrees, or other angles that are easy to process. In another embodiment not shown, the angle β1 can be any angle.

As shown in FIG3, after the protrusion 120a is set, at least one chip 140 is set on the substrate 110a. The chip 140 includes an upper surface 142 and a lower surface 144, and the lower surface 144 can be fixed to the substrate 110a through, for example, die bonding glue. The upper surface 142 is opposite to the lower surface 144. The total height H1 of the protrusion 120a is greater than the distance D3 from the upper surface 142 of the chip 140 to the surface of the substrate 110a. After the chip 140 is set, as shown in FIG4, a welding wire 160 and an electronic component 170 are set. The upper surface 142 of the chip 140 is electrically connected to the substrate 110a through the welding wire 160. The electronic component 170 is set next to the chip 140, and the electronic component 170 is, for example, a passive component, but not limited to this.

After the chip 140, the soldering wire 160 and the electronic component 170 are set, as shown in FIG5, a packaging layer 150a is set. The packaging layer 150a completely covers the chip 140, the soldering wire 160, the electronic component 170 and the protrusion 120a. After the packaging layer 150a is set, the packaging layer 150a and the protrusion 120a are ground. FIG5 schematically shows the position of a surface 152 (FIG. 6) of the ground packaging layer 150b with a dotted line A, and shows a thickness D2 of the ground packaging layer 150b (i.e., the distance from the dotted line A to the surface of the substrate 110a). The protrusion 120a protrudes from the dotted line A, and the total height H1 of the protrusion 120a is greater than the thickness D2.

As shown in FIG. 6 , after the package layer 150a and the protrusion 120a are ground, the upper surface 142 of the chip 140 is spaced apart from the surface 152 of the package layer 150b after grinding by a distance D1, and the protrusion 120a is ground to form the measuring piece 130a. A cross-sectional width W2 of the measuring piece 130a changes with a height H of the measuring piece 130a. The shape of the measuring piece 130a after grinding is a trapezoid. Since the protrusion 120a protrudes from the dotted line A and the package layer 150a completely covers the protrusion 120a ( FIG. 5 ), after grinding, a top surface 132 of the measuring piece 130a is exposed on the surface 152 of the package layer 150b after grinding, and the top surface 132 of the measuring piece 130a can be directly seen from the outside. The total height H2 of the measuring piece 130a is equal to the thickness D2 of the package layer 150b after grinding. The total height H2 is equal to the thickness D2 of the package layer 150b after grinding.

As shown in FIG. 7 , the number of chips 140 disposed on the substrate 110a of this embodiment is, for example, 25, but not limited thereto. The measuring piece 130a (protruding piece 120a) is located at the edge of the substrate 110a, and the number of the measuring piece 130a (protruding piece 120a) is, for example, two, but not limited thereto. Without affecting the process of the packaging structure, the number of the measuring piece 130a (protruding piece 120a) can be any number, and can be disposed at any position of the substrate 110a. For example, in an embodiment not shown, the number of the measuring piece 130a (protruding piece 120a) can be four, and can be disposed at four sides of the substrate 110a. In another embodiment not shown, the measuring piece 130a (protruding piece 120a) can be located between two adjacent chips 140. The shape of the substrate 110a is not limited to this embodiment.

After the packaging layer 150a and the protrusion 120a are polished, the temporary support carrier S is removed, and the polished surface 152 of the packaging layer 150b is plated. A film layer 180 is formed on the surface 152 of the packaging layer 150b (Figure 8). After the plating is completed, the packaging layer 150b and the substrate 110a are cut to form a packaging structure 100a as shown in Figure 8. The substrate 110a is cut to form a unit substrate 110b.

The package structure 100a includes a unit substrate 110b, a chip 140, a measuring device 130a, a soldering wire 160, an electronic component 170, a film layer 180, and a package layer 150b. The lower surface 144 of the chip 140 is connected to the unit substrate 110b, and the measuring device 130a and the package layer 150b are disposed on the unit substrate 110b. The number of chips 140 is one, but not limited thereto. The package structure 100a of this embodiment can be used for fingerprint recognition products, but not limited thereto.

The package structure 100a is, for example, related to the product characteristics of the fingerprint reader and the distance between the chip 140 and the film layer 180 (package layer 150b). The distance is the distance D1 between the upper surface 142 of the chip 140 and the surface 152 of the package layer 150b. If the distance (distance D1) is too large or too small, it will affect the sensitivity of the chip 140.

The known measurement method also includes cutting the package structure to obtain a cross section of the package structure to measure the spacing (distance D1). This measurement method will destroy the package structure, resulting in increased testing costs and time-consuming.

As shown in FIG. 5 and FIG. 6 , the thickness D2 of the package layer 150b after grinding is equal to the sum of the distance D3 and the spacing (distance D1). The thickness D2 is equal to the total height H2 of the measuring piece 130a. The total height H1 and the angle β1 of the protruding piece 120a are known values. The cross-sectional width W3 of the top surface 132 of the measuring piece 130a can be obtained by measurement and is a known value. According to the trigonometric formula, the total height H2 of the measuring piece 130a (i.e., the thickness D2 of the package layer 150b) can be obtained by equation (1).

H2=H1-W3*tan(β1) (1)

The total height H2 of the measuring piece 130a corresponds to the cross-sectional width W3. After the chip 140 is set and before the packaging layer 150a is set (Figure 4), the distance D3 can be measured, so the distance D3 is a known value. According to equation (1) and the relationship between the total height H2 and the distances D1 and D3, the distance D1 can be obtained by equation (2).

D1=H1-(W3*(tanβ1))-D3 (2)

It can be seen that the distance D1 corresponds to the cross-sectional width W3 of the top surface 132 of the measuring piece 130a. The user can directly and intuitively obtain the value of the distance D1 by measuring the cross-sectional width W3 of the top surface 132 of the protruding piece 120a (measuring piece 130a). In this way, the user can quickly judge the product characteristics of the package structure 100a to improve the convenience of use of the package structure 100a and reduce the detection cost and time.

FIG9 is a partial cross-sectional schematic diagram of the manufacturing method of the package structure of FIG6. FIG10 is a schematic diagram of the package structure formed after cutting the measuring piece. Please refer to FIG9 and FIG10 at the same time. After grinding the package layer 150a and the protruding piece 120a and before forming the package structure, the step of cutting off the measuring piece 130a may be further included. Before cutting off the measuring piece 130a, the user may measure the cross-sectional width W3 of the top surface 132 of the measuring piece 130a to obtain the value of the distance D1, and then cut off the measuring piece 130a. A cutting line C is located between the chip 140 and the measuring piece 130a. The package structure 100b formed after the measuring piece 130a is cut off includes a unit substrate 110b, a chip 140, a welding wire 160, an electronic component 170, a film layer 180 and a package layer 150b.

FIG11 is a schematic diagram of a protrusion and a substrate according to another embodiment of the present invention. FIG12 is a schematic diagram of the measuring piece and the substrate of FIG11. Please refer to FIG5, FIG11 and FIG12 simultaneously. The protrusion 120b of this embodiment is similar to the aforementioned embodiment. The difference between the two is that the cross-sectional shape of the protrusion 120b of this embodiment is a trapezoid, and the material of the protrusion 120b is different from the material of the anti-soldering layer 112. Specifically, the cross-sectional shape of the protrusion 120b is an isosceles trapezoid, but not limited to this. The protrusion 120b is an independent component. The protrusion 120b is, for example, an independent insulating pressure strip, and the material of the protrusion 120b is, for example, an insulating material such as FR4, but not limited to this. The protrusion 120b can be pre-set on the substrate 110a through adhesive.

As shown in FIG. 12 , the angle β2 and the cross-sectional width W5 of the bottom surface of the measuring piece 130b are known values, and the cross-sectional width W4 of the top surface 132 of the measuring piece 130b can be measured and is a known value. According to the trapezoidal formula and the relationship between the total height H3 of the measuring piece 130b (the thickness D2 of the packaging layer 150b) and the distances D1 and D3, the distance D1 can be obtained by equation (3).

D1=((W5-W4)/2)*tan(β2)-D3 (3)

Thus, the user can directly and intuitively obtain the value of the distance D1 by measuring the cross-sectional width W4 of the top surface 132 of the measuring piece 130b without destroying the original packaging structure. The measurement method is, for example, to measure with a tool microscope or other measuring instruments with similar measuring functions. The protruding piece 120b and the measuring piece 130b of this embodiment have the same functions as the aforementioned embodiments. The user can set the protruding pieces 120a and 120b according to their needs.

In summary, the top of the measuring part of the packaging structure of the present invention is exposed on the packaging layer, and the cross-sectional width of the top corresponds to the distance between the upper surface of the chip and the surface of the packaging layer. The user can directly measure the cross-sectional width of the exposed top and know the distance between the upper surface of the chip and the surface of the packaging layer. In this way, the user can intuitively and quickly judge the product characteristics of the packaging structure without destroying the original packaging structure, saving measurement procedures, thus effectively improving the convenience of the packaging structure and reducing the detection cost and time.

Although the present invention has been disclosed as above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the attached patent application.

D1: Distance

D2: Thickness

100a:Packaging structure

110b: unit substrate

112: Anti-welding layer

130a: Measuring parts

132: Top

140: Chip

142: Upper surface

144: Lower surface

150b: Packaging layer

152: Surface

160:Welding wire

170: Electronic components

180: Membrane layer

Claims (10)

A packaging structure includes: a unit substrate; a measuring piece, which is arranged on the unit substrate, and a cross-sectional width of the measuring piece changes with a height of the measuring piece; a chip, which includes an upper surface and a lower surface, and the lower surface is connected to the unit substrate; and a packaging layer, which is arranged on the unit substrate and covers the chip and the measuring piece, and a top surface of the measuring piece is exposed to the packaging layer, and the upper surface is spaced from a surface of the packaging layer by a distance, and the distance corresponds to the cross-sectional width of the top surface of the measuring piece. And D1=((W5-W4)/2)*tan(β2)-D3, where D1 is the distance between the upper surface of the chip and the surface of the packaging layer, W5 is the cross-sectional width of a bottom surface of the measuring piece, W4 is the cross-sectional width of the top surface of the measuring piece, β2 is an angle of the measuring piece, D3 is a distance from the upper surface of the chip to the surface of the substrate, the top surface of the measuring piece is relative to the bottom surface, and the angle β2 corresponds to a total height of the measuring piece. The packaging structure as described in claim 1, wherein the unit substrate includes a solder-proof layer, and the solder-proof layer and the measuring device are integrated. The packaging structure as described in claim 1, wherein the total height of the measuring component is equal to the thickness of the packaging layer. A method for manufacturing a packaging structure includes the following steps: providing a substrate; providing at least one protrusion, the at least one protrusion being provided on the substrate, the cross-sectional width of each of the at least one protrusion changing with the height of each of the at least one protrusion; providing at least one chip, the at least one chip including an upper surface and a lower surface, the lower surface being connected to the substrate; providing a packaging layer, the packaging layer covering the at least one chip and the at least one protrusion; grinding the packaging layer and the at least one protrusion, the upper surface of each of the at least one chip being spaced a distance from a surface of the ground packaging layer, the at least one protrusion being ground to form at least one measuring piece, the top surface of each of the at least one measuring piece being exposed to the ground surface. The packaging layer of the chip, the distance corresponds to the cross-sectional width of the top surface of each of the at least one measuring piece, D1=((W5-W4)/2)*tan(β2)-D3, wherein D1 is the distance between the upper surface of the chip and the surface of the packaging layer, W5 is a cross-sectional width of a bottom surface of the measuring piece, W4 is the cross-sectional width of the top surface of the measuring piece, β2 is an angle of the measuring piece, D3 is a distance from the upper surface of the chip to the surface of the substrate, the top surface of the measuring piece is relative to the bottom surface, and the angle β2 corresponds to a total height of the measuring piece; and cutting the substrate and the packaging layer to form a packaging structure, the substrate is cut to form at least one unit substrate. A method for manufacturing a packaging structure as described in claim 4, wherein the packaging structure includes the unit substrate, the chip, the measuring device and the packaging layer. A method for manufacturing a packaging structure as described in claim 4, wherein the packaging layer after grinding has a thickness, and a total height of the at least one protrusion is greater than the thickness. The manufacturing method of the package structure as described in claim 4, wherein after grinding the package layer and the at least one protruding member and before forming the package structure, the following step is further included: cutting off the measuring member, a cutting line is located between the at least one chip and the measuring member. The manufacturing method of the package structure as described in claim 7, wherein the package structure formed after cutting off the measuring component includes the unit substrate, the chip and the package layer. A method for manufacturing a packaging structure as described in claim 4, wherein the substrate includes a solder-proof layer, and the solder-proof layer and the at least one protruding member are integrated. A method for manufacturing a packaging structure as described in claim 4, wherein the at least one protrusion is located at an edge of the substrate.

Images