TWI843274B - Multi-layered resonator circuit structure and multi-layered filter circuit structure - Google Patents

Abstract

The disclosure provides a multi-layered resonator circuit structure and multi-layered filter circuit structure. The multi-layered resonator circuit structure includes multi-layered substrate, a plurality of resonators and a plurality of conductive components. The multi-layered substrate has upper surface, lower surface and grounded layer. Upper and lower outer surfaces face away from each other and grounded layer is located between upper and lower outer surfaces. A part of the resonators is/are disposed on upper surface and the other part of the resonators is/are disposed on lower surface. Conductive components are located in multi-layered substrate and respectively electrically connect the resonators to the grounded layer.

Description

Multi-layer resonator circuit structure and multi-layer filter circuit structure

The present invention relates to a resonator circuit structure and a filter circuit structure, and in particular to a multi-layer resonator circuit structure and a multi-layer filter circuit structure.

Generally speaking, a band-pass filter is used to filter out signals in a frequency band between two specific frequencies. Since a resonator has a resonance characteristic that generates a frequency response only at a specific frequency, a resonator is often used to implement a band-pass filter. When a band-pass filter implemented by multiple resonators needs to be set on a circuit board, these resonators are usually set on the same mounting surface of the circuit board.

However, because these resonators are all installed on the same mounting surface of the circuit board, they will occupy a larger area on the mounting surface and compress the space where other electronic components are installed on the mounting surface. This will reduce the space utilization of the circuit board and make it difficult to miniaturize the circuit board.

The present invention provides a multi-layer resonator circuit structure and a multi-layer filter circuit structure to improve the space utilization of the circuit board and make the miniaturization of the circuit board easier.

The multi-layer resonator circuit structure disclosed in an embodiment of the present invention includes a multi-layer substrate, a plurality of resonators and a plurality of conductive components. The multi-layer substrate has an upper surface, a lower surface and a ground layer. The upper surface and the lower surface are opposite to each other and the ground layer is between the upper surface and the lower surface. Part of these resonators is arranged on the upper surface, and another part of these resonators is arranged on the lower surface. These conductive components are located in the multi-layer substrate and electrically connect these resonators to the ground layer respectively.

In one embodiment of the present invention, each resonator includes a contact portion and a plurality of resonant transmission lines. The resonant transmission line is connected to the contact portion, and the resonant transmission line is a ground line and at least one open line. These conductive components electrically connect these ground lines to the ground layer respectively.

In one embodiment of the present invention, the number of at least one open circuit is multiple.

In one embodiment of the present invention, each resonant transmission line includes an inner extension section and an outer extension section. The inner extension section is connected to the contact portion. The outer extension section is connected to the inner extension section. The outer extension section is not parallel to the inner extension section.

In one embodiment of the present invention, the inner extension section and the outer extension section of any resonant transmission line and the inner extension section of the adjacent resonant transmission line together surround a layout area. Each resonator further includes a plurality of expansion parts. These expansion parts are respectively located in these layout areas and connected to the contact part.

In one embodiment of the present invention, the number of resonators located on the upper surface and the number of resonators located on the lower surface are two, and the two resonators located on the upper surface and the lower surface are coupled through two parallel resonant transmission lines. The ground layer has two slots separated from each other. One of the two slots corresponds to the two resonant transmission lines coupled on the upper surface. The other of the two slots corresponds to the two resonant transmission lines coupled on the lower surface.

In one embodiment of the present invention, the projection of each slot on the upper surface or on the lower surface is located between two contact portions and is perpendicular to the two outer extension sections of the two coupled resonant transmission lines.

In one embodiment of the present invention, each slot includes a main slot section and two auxiliary slot sections. The projection of the main slot section on the upper surface or the lower surface is located between the two contact portions and is perpendicular to the two outer extension sections of the two coupled resonant transmission lines. The two auxiliary slot sections are respectively connected to the opposite ends of the main slot section and are perpendicular to the main slot section.

In one embodiment of the present invention, each slot further includes a plurality of sub-slot sections. These sub-slot sections are respectively connected to the opposite ends of the two auxiliary slot sections and are parallel to the main slot section.

The multi-layer filter circuit structure disclosed in another embodiment of the present invention includes a multi-layer substrate, a plurality of filters and a plurality of conductive components. The multi-layer substrate has an upper surface, a lower surface and a ground layer. The upper surface and the lower surface are opposite to each other and the ground layer is between the upper surface and the lower surface. Part of these filters is arranged on the upper surface, and another part of these filters is arranged on the lower surface. These conductive components are located in the multi-layer substrate and electrically connect these filters to the ground layer respectively.

In one embodiment of the present invention, each filter includes at least one resonator, an input port and an output port. The input port and the output port are respectively located on opposite sides of at least one resonator. These conductive components electrically connect these resonators to the ground layer.

In one embodiment of the present invention, the number of at least one resonator located on the upper surface and the number of at least one resonator located on the lower surface are multiple, and the resonators located on the upper surface and the resonators located on the lower surface are arranged in multiple rows in a straight line.

In one embodiment of the present invention, the number of these resonators in each row located on the upper surface and the lower surface is the same.

In one embodiment of the present invention, among the rows of resonators located on the upper surface, at least two rows of resonators have different numbers of resonators. Among the rows of resonators located on the lower surface, at least two rows of resonators have different numbers of resonators.

According to the multi-layer resonator circuit structure and multi-layer filter circuit structure disclosed in the above embodiments, the resonators are respectively arranged on the upper and lower surfaces of the multi-layer substrate facing each other, or the filters are respectively arranged on the upper and lower surfaces of the multi-layer substrate facing each other. In other words, part of the resonator or part of the filter can be reconfigured on the lower surface where the electronic components are not arranged without concentrating on any space on the upper surface of the multi-layer substrate where other electronic components are arranged. In this way, the change in the arrangement position of the resonator and the filter will allow more space on the upper surface where the electronic components are arranged to arrange other electronic components, thereby improving the space utilization rate of the circuit board and contributing to the miniaturization of the circuit board.

10,10a,10b,10c,10d,10e,10f,10g,10h,10i,10j,10p: Multi-layer resonator circuit structure

100,100a,100b,100c,100p:Multi-layer substrate

110: First dielectric layer

111: Upper surface

120: Second dielectric layer

121: Lower surface

130,130a,130b,130c: ground layer

131,131a,131b: slotting

1311a,1311b: Main slot section

1312a, 1312b: Auxiliary slot section

1313b: Secondary slot section

200,200d,200e,200f,200g,200h,200i,200j:Resonator

210,210g,210i,210j: Contact part

220,220g,220j: Resonance transmission line

2201,2201g,2201j: Grounding line

2202,2202g,2202j:Open line

221: Inner extension section

222:External extension section

230: Expansion Department

300: Conductive components

20k, 20m, 20n: multi-layer filter circuit structure

500k,500m,500n:Filter

510k,510m,510n: input port

520k,520m,520n: output port

S: Layout area

G: Gap

L: Length

Figure 1 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the first embodiment of the present invention.

Figure 2 is a three-dimensional cross-sectional diagram of the multi-layer resonator circuit structure in Figure 1.

Figure 3 is a top view of the multi-layer resonator circuit structure in Figure 1.

Figure 4 is a bottom view of the multi-layer resonator circuit structure in Figure 1.

Figure 5 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the second embodiment of the present invention.

FIG6 is a top view of the multi-layer resonator circuit structure in FIG5.

Figure 7 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the third embodiment of the present invention.

FIG8 is a top view of the multi-layer resonator circuit structure in FIG7.

FIG9 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the fourth embodiment of the present invention.

Figure 10 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the fifth embodiment of the present invention.

FIG11 is a top view of the multi-layer resonator circuit structure in FIG10.

Figure 12 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the sixth embodiment of the present invention.

FIG13 is a top view of the multi-layer resonator circuit structure in FIG12.

FIG14 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the seventh embodiment of the present invention.

FIG15 is a top view of the multi-layer resonator circuit structure in FIG14.

Figure 16 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the eighth embodiment of the present invention.

FIG17 is a top view of the multi-layer resonator circuit structure in FIG16.

Figure 18 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the ninth embodiment of the present invention.

FIG19 is a top view of the multi-layer resonator circuit structure in FIG18.

Figure 20 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the tenth embodiment of the present invention.

FIG21 is a top view of the multi-layer resonator circuit structure in FIG20.

Figure 22 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the eleventh embodiment of the present invention.

FIG23 is a top view of the multi-layer resonator circuit structure in FIG22.

Figure 24 is a three-dimensional schematic diagram of a multi-layer filter circuit structure according to the twelfth embodiment of the present invention.

Figure 25 is a top view of the multi-layer filter circuit structure in Figure 24.

Figure 26 is a three-dimensional schematic diagram of a multi-layer filter circuit structure according to the thirteenth embodiment of the present invention.

Figure 27 is a top view of the multi-layer filter circuit structure in Figure 26.

Figure 28 is a three-dimensional schematic diagram of a multi-layer filter circuit structure according to the fourteenth embodiment of the present invention.

Figure 29 is a top view of the multi-layer filter circuit structure in Figure 28.

The detailed features and advantages of the embodiments of the present invention are described in detail in the following implementation method. The content is sufficient to enable any person with ordinary knowledge in the field to understand the technical content of the embodiments of the present invention and implement it accordingly. According to the content disclosed in this specification, the scope of the patent application and the drawings, any person with ordinary knowledge in the field can easily understand the relevant purposes and advantages of the present invention. The following embodiments are to further illustrate the viewpoints of the present invention, but do not limit the scope of the present invention by any viewpoint.

It should be noted that throughout the specification, the same reference numerals refer to the same or similar components.

Please refer to Figures 1 to 4. Figure 1 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the first embodiment of the present invention. Figure 2 is a three-dimensional cross-sectional schematic diagram of the multi-layer resonator circuit structure in Figure 1. Figure 3 is an upper view of the multi-layer resonator circuit structure in Figure 1. Figure 4 is a lower view of the multi-layer resonator circuit structure in Figure 1.

In the present embodiment, the multi-layer resonator circuit structure 10 includes a multi-layer substrate 100, a plurality of resonators 200, and a plurality of conductive members 300. The multi-layer substrate 100 has an upper surface 111, a lower surface 121, and a ground layer 130. The upper surface 111 and the lower surface 121 are opposite to each other and the ground layer 130 is between the upper surface 111 and the lower surface 121. In the present embodiment, the multi-layer substrate 100 is, for example, a two-layer substrate. Specifically, in the present embodiment, the multi-layer substrate 100 includes a first dielectric layer 110, a second dielectric layer 120, and the ground layer 130. The first dielectric layer 110 and the second dielectric layer 120 are located on opposite sides of the ground layer 130. The upper surface 111 and the lower surface 121 are respectively located on the first dielectric layer 110 and the second dielectric layer 120 and are opposite to the ground layer 130.

In this embodiment, the ground layer 130 has two slots 131 separated from each other. In this embodiment, the slot 131 is, for example, in the shape of a long strip, and the slot 131 is, for example, filled with a dielectric material, but not limited thereto. In other embodiments, the slot is, for example, not filled with a dielectric material and is an empty slot.

Part of the resonator 200 is disposed on the upper surface 111. Another part of the resonator 200 is disposed on the lower surface 121. For example, the number of resonators 200 disposed on the upper surface 111 is two, and they are coupled to each other. The number of resonators 200 disposed on the lower surface 121 is two, and they are coupled to each other.

In this embodiment, the number of resonators 200 located on the upper surface 111 is, for example, the same as the number of resonators 200 located on the lower surface 121, but the present invention is not limited thereto. In other embodiments, the number of resonators located on the upper surface may also be different from the number of resonators located on the lower surface.

Since the structures of the resonators 200 are the same or similar, only one of the resonators 200 is described below. The resonator 200 includes a contact portion 210 and a plurality of resonant transmission lines 220. These resonant transmission lines 220 are connected to the contact portion 210, and these resonant transmission lines 220 are, for example, a ground line 2201 and three open lines 2202. In other words, the ground line 2201 and the three open lines 2202 are connected to the contact portion 210. In addition, the three open lines 2202 protrude from the contact portion 210 in different directions.

Each resonant transmission line 220 is bent and includes an inner extension section 221 and an outer extension section 222. In other words, the ground line 2201 and each open line 2202 are bent and each includes an inner extension section 221 and an outer extension section 222. These inner extension sections 221 are connected to the contact portion 210. These outer extension sections 222 are respectively connected to these inner extension sections 221, and these outer extension sections 222 are not parallel to these inner extension sections 221. In this embodiment, the outer contour of the resonator 200 is generally square, and each inner extension section 221 is, for example, located at the diagonal of the square, and each outer extension section 222 is, for example, located at each side of the square. In other words, each inner extension section 221 is arranged radially relative to the contact portion 210, and the angle between any two adjacent inner extension sections 221 is, for example, 90 degrees, and the angle between each outer extension section 222 and the connected inner extension section 221 is, for example, 45 degrees. In this way, the inner extension section 221 and the outer extension section 222 of any resonant transmission line 220 and the inner extension section 221 of the adjacent resonant transmission line 220 together surround a layout area S. The outer contour of the layout area S is roughly an isosceles triangle.

In this embodiment, the resonator 200 may also include a plurality of expansion parts 230. These expansion parts 230 are respectively located in these layout areas S and connected to the contact part 210. The expansion part 230 is separated from the surrounding inner extension section 221 and the outer extension section 222, for example, and fills the layout area S as much as possible under the premise of being separated from the surrounding inner extension section 221 and the outer extension section 222. In this way, the stopband of the resonator 200 can be widened by increasing the layout area of the expansion part 230. In addition, the stopband of the resonator 200 can also be widened by increasing the number of open lines 2202.

In this embodiment, the two resonant transmission lines 220 of the two resonators 200 are arranged side by side, so that the two resonators 200 are coupled. For example, as shown in FIG3, for the two resonators 200 located on the upper surface 111, the two outer extension sections 222 of the two grounding lines 2201 are parallel to each other and arranged side by side, so that the two resonators 200 are coupled. Alternatively, as shown in FIG4, for the two resonators 200 located on the lower surface 121, the two outer extension sections 222 of the two open lines 2202 are parallel to each other and arranged side by side, so that the two resonators 200 are coupled. Alternatively, in other embodiments, the outer extension section of the grounding line and the outer extension section of the open line may be parallel to each other and arranged side by side, so that the two resonators are coupled. In addition, the smaller the gap G between the two outer extension sections 222 of the two resonant transmission lines 220, the greater the coupling amount of the two coupled resonators 200.

One of the two slots 131 corresponds to the two resonant transmission lines 220 coupled on the upper surface 111, and the other of the two slots 131 corresponds to the two resonant transmission lines 220 coupled on the lower surface 121. Since the structures of the two slots 131 are the same or similar, only one of the slots 131 is described below. As shown in FIG3, for the two resonators 200 located on the upper surface 111, the projection of the slot 131 on the upper surface 111 is located between the two contact portions 210 of the corresponding two resonators 200, and is perpendicular to the two outer extension sections 222 of the two coupled resonant transmission lines 220. Since the relationship between the other slot 131 and the two resonators 200 located on the lower surface 121 is the same or similar to the above description, it will not be repeated.

In addition, the design of the slot 131 can increase the coupling amount of the two coupled resonators 200, and the length L of the slot 131 is positively correlated with the coupling amount of the two coupled resonators 200. In other words, the longer the length L of the slot 131, the greater the coupling amount of the two coupled resonators 200.

These conductive components 300 are, for example, conductive blind vias. These conductive components 300 are respectively located in the first dielectric layer 110 and the second dielectric layer 120 of the multi-layer substrate 100, and respectively electrically connect these grounding lines 2201 of the resonator 200 to the grounding layer 130.

In this embodiment, the number of resonators 200 located on the upper surface 111 is the same as the number of resonators 200 located on the lower surface 121, but the present invention is not limited thereto. In other embodiments, the number of resonators located on the upper surface may also be different from the number of resonators located on the lower surface.

Please refer to Figures 5 and 6. Figure 5 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the second embodiment of the present invention. Figure 6 is a top view of the multi-layer resonator circuit structure in Figure 5. The multi-layer resonator circuit structure 10a according to the second embodiment of the present invention includes a multi-layer substrate 100a, a plurality of resonators 200, and a plurality of conductive components 300. The multi-layer resonator circuit structure 10a of this embodiment is similar to the multi-layer resonator circuit structure 10 of the first embodiment, and the difference is only that the ground layer 130a of the multi-layer substrate 100a has a different form of the slot 131a.

As shown in FIG6 , the slot 131a includes a main slot section 1311a and two auxiliary slot sections 1312a. The projection of the main slot section 1311a on the upper surface 111 is located between the two contact portions 210 of the corresponding two resonators 200 and is perpendicular to the two outer extension sections 222 of the two coupled resonant transmission lines 220. The two auxiliary slot sections 1312a are respectively connected to the opposite ends of the main slot section 1311a and are perpendicular to the main slot section 1311a. Since the relationship between the other slot 131a and the two resonators 200 located on the lower surface 121 is the same or similar to the above description, it will not be repeated.

Please refer to Figures 7 and 8. Figure 7 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the third embodiment of the present invention. Figure 8 is a top view of the multi-layer resonator circuit structure in Figure 7. The multi-layer resonator circuit structure 10b according to the third embodiment of the present invention includes a multi-layer substrate 100b, a plurality of resonators 200, and a plurality of conductive components 300. The multi-layer resonator circuit structure 10b of this embodiment is similar to the multi-layer resonator circuit structure 10 of the first embodiment, and the difference is that the ground layer 130b of the multi-layer substrate 100b has two different forms of slots 131b.

As shown in FIG8 , the slot 131b includes a main slot section 1311b, two auxiliary slot sections 1312b and a plurality of secondary slot sections 1313b. The projection of the main slot section 1311b on the upper surface 111 is located between the two contact portions 210 of the corresponding two resonators 200 and is perpendicular to the two outer extension sections 222 of the two coupled resonant transmission lines 220. The two auxiliary slot sections 1312b are respectively connected to the opposite ends of the main slot section 1311b and are perpendicular to the main slot section 1311b. These secondary slot sections 1313b are respectively connected to the opposite ends of the two auxiliary slot sections 1312b and are parallel to the main slot section 1311b. Since the relationship between the other slot 131b and the two resonators 200 located on the lower surface 121 is the same or similar to the above description, it will not be repeated.

Please refer to FIG. 9, which is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to a fourth embodiment of the present invention. The multi-layer resonator circuit structure 10c according to the fourth embodiment of the present invention comprises a multi-layer substrate 100c, a plurality of resonators 200, and a plurality of conductive members 300. The multi-layer resonator circuit structure 10c of this embodiment is similar to the multi-layer resonator circuit structure 10 of the first embodiment, and the difference is that the ground layer 130c of the multi-layer substrate 100c does not have the groove 131 of FIG. 1, and the number of resonators 200 located on the upper surface 111 and the number of resonators 200 located on the lower surface 121 are only one. In this embodiment, the ground layer 130c does not have the groove 131 of FIG. 1 because the two resonators 200 on the upper surface 111 and the lower surface 121 are misaligned with each other, but the present invention is not limited to this. In other embodiments, if the two resonators on the upper surface and the lower surface at least partially overlap each other, the ground layer may also have a groove, and the groove is between the two resonators. That is, in other embodiments, the groove may also be between the two resonators stacked in the vertical direction of the multi-layer substrate.

The present invention is not limited to the form of the resonator. Please refer to Figures 10 and 11. Figure 10 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the fifth embodiment of the present invention. Figure 11 is a top view of the multi-layer resonator circuit structure in Figure 10. The multi-layer resonator circuit structure 10d according to the fifth embodiment of the present invention includes a multi-layer substrate 100c, a plurality of resonators 200d, and a plurality of conductive components 300. The multi-layer resonator circuit structure 10d of this embodiment is similar to the multi-layer resonator circuit structure 10c of the fourth embodiment, and the difference is only that the form of the resonator 200d is different.

As shown in FIG. 11 , each resonator 200d only includes a contact portion 210 and a plurality of resonant transmission lines 220. These resonant transmission lines 220 are connected to the contact portion 210, and these resonant transmission lines 220 are, for example, a ground line 2201 and three open lines 2202. Each resonant transmission line 220 is bent and includes an inner extension section 221 and an outer extension section 222. These inner extension sections 221 are connected to the contact portion 210. These outer extension sections 222 are respectively connected to these inner extension sections 221, and these outer extension sections 222 are not parallel to these inner extension sections 221. In other words, the resonator 200d may not include the expansion section 230 of FIG. 3 , for example.

The present invention is not limited by the number of open circuits. Please refer to Figures 12 and 13. Figure 12 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the sixth embodiment of the present invention. Figure 13 is a top view of the multi-layer resonator circuit structure in Figure 12. The multi-layer resonator circuit structure 10e according to the sixth embodiment of the present invention includes a multi-layer substrate 100c, a plurality of resonators 200e, and a plurality of conductive components 300. The multi-layer resonator circuit structure 10c of this embodiment is similar to the multi-layer resonator circuit structure 10d of the fifth embodiment, and the difference is that the number of open circuits of the resonator 200e is five.

Please refer to Figures 14 and 15. Figure 14 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the seventh embodiment of the present invention. Figure 15 is a top view of the multi-layer resonator circuit structure in Figure 14. The multi-layer resonator circuit structure 10f according to the seventh embodiment of the present invention includes a multi-layer substrate 100c, a plurality of resonators 200f, and a plurality of conductive components 300. The multi-layer resonator circuit structure 10f of this embodiment is similar to the multi-layer resonator circuit structure 10d of the fifth embodiment, and the difference is that the number of open circuits of the resonator 200f is two.

Please refer to FIG. 16 and FIG. 17. FIG. 16 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the eighth embodiment of the present invention. FIG. 17 is a top view of the multi-layer resonator circuit structure in FIG. 16. The multi-layer resonator circuit structure 10g according to the eighth embodiment of the present invention includes a multi-layer substrate 100c, a plurality of resonators 200g, and a plurality of conductive members 300. The multi-layer resonator circuit structure 10g of this embodiment is similar to the multi-layer resonator circuit structure 10d of the fifth embodiment, and the difference is only that the form of the resonator 200g is different. In this embodiment, the resonator 200g includes a contact portion 210g and a plurality of resonant transmission lines 220g. These resonant transmission lines 220g are connected to the contact portion 210g, and these resonant transmission lines 220g are, for example, a ground line 2201g and three open lines 2202g. Each resonant transmission line 220 is in a straight strip shape.

Please refer to Figures 18 and 19. Figure 18 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the ninth embodiment of the present invention. Figure 19 is a top view of the multi-layer resonator circuit structure in Figure 18. The multi-layer resonator circuit structure 10h according to the ninth embodiment of the present invention includes a multi-layer substrate 100c, a plurality of resonators 200h, and a plurality of conductive components 300. The multi-layer resonator circuit structure 10h of this embodiment is similar to the multi-layer resonator circuit structure 10g of the eighth embodiment, and the difference is that the number of open lines 2202g of the resonator 200h is five. In other words, the number of straight strip resonant transmission lines 220g is six.

Please refer to FIG. 20 and FIG. 21. FIG. 20 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the tenth embodiment of the present invention. FIG. 21 is a top view of the multi-layer resonator circuit structure in FIG. 20. The multi-layer resonator circuit structure 10i according to the tenth embodiment of the present invention includes a multi-layer substrate 100c, a plurality of resonators 200i, and a plurality of conductive components 300. The multi-layer resonator circuit structure 10i of this embodiment is similar to the multi-layer resonator circuit structure 10g of the eighth embodiment, and the difference is that the number of open lines 2202g of the resonator 200i is two. In other words, the number of straight strip resonant transmission lines 220g is three.

Please refer to FIG. 22 and FIG. 23. FIG. 22 is a three-dimensional schematic diagram of a multi-layer resonator circuit structure according to the eleventh embodiment of the present invention. FIG. 23 is a top view of the multi-layer resonator circuit structure in FIG. 22. The multi-layer resonator circuit structure 10j according to the eleventh embodiment of the present invention includes a multi-layer substrate 100c, a plurality of resonators 200j, and a plurality of conductive members 300. The multi-layer resonator circuit structure 10j of this embodiment is similar to the multi-layer resonator circuit structure 10g of the eighth embodiment, and the difference is that the number of open lines 2202j of the resonator 200j is single. That is, the resonator 200j includes a contact portion 210j and two resonant transmission lines 220j. The two resonant transmission lines 220j are connected to the contact part 210j and are in a straight strip shape. The resonant transmission line 220j is a ground line 2201j and an open line 2202j.

Please refer to Figures 24 and 25. Figure 24 is a three-dimensional schematic diagram of a multi-layer filter circuit structure according to the twelfth embodiment of the present invention. Figure 25 is a top view of the multi-layer filter circuit structure in Figure 24. The multi-layer filter circuit structure 20k includes a multi-layer substrate 100c, a plurality of filters 500k, and a plurality of conductive components 300.

The multi-layer substrate 100c has an upper surface 111, a lower surface 121 and a grounding layer 130c. The upper surface 111 and the lower surface 121 are opposite to each other and the grounding layer 130c is between the upper surface 111 and the lower surface 121. In this embodiment, the multi-layer substrate 100c is, for example, a two-layer substrate. Specifically, in this embodiment, the multi-layer substrate 100c includes a first dielectric layer 110, a second dielectric layer 120 and a grounding layer 130c. The first dielectric layer 110 and the second dielectric layer 120 are located on opposite sides of the grounding layer 130c.

Part of these filters 500k is disposed on the upper surface 111, and another part of these filters 500k is disposed on the lower surface 121. Since the structures of each filter 500k are the same or similar, only one filter 500k is used for explanation below. The filter 500k includes a resonator 200, an input port 510k, and an output port 520k. The resonator 200 includes a contact portion 210 and a plurality of resonant transmission lines 220. These resonant transmission lines 220 are connected to the contact portion 210, and these resonant transmission lines 220 are, for example, a ground line 2201 and three open lines 2202. That is, the ground line 2201 and the three open lines 2202 are connected to the contact portion 210.

It should be noted that in this embodiment, the number of filters 500k located on the upper surface 111 is, for example, the same as the number of filters 500k located on the lower surface 121, but the present invention is not limited thereto. In other embodiments, the number of filters located on the upper surface may also be different from the number of filters located on the lower surface.

The input port 510k and the output port 520k are located on opposite sides of the resonator 200. In other words, the input port 510k and the output port 520k are arranged in parallel on two resonant transmission lines 220 on opposite sides of the resonator 200. In this way, the signal can enter from the input port 510k and be emitted from the output port 520k through the resonator 200 to achieve the filtering function.

Please refer to Figures 26 and 27. Figure 26 is a three-dimensional schematic diagram of a multi-layer filter circuit structure according to the thirteenth embodiment of the present invention. Figure 27 is a top view of the multi-layer filter circuit structure in Figure 26. The multi-layer filter circuit structure 20m according to the thirteenth embodiment of the present invention includes a multi-layer substrate 100c, a plurality of filters 500m, and a plurality of conductive components 300. The multi-layer filter circuit structure 20m of this embodiment is similar to the multi-layer filter circuit structure 20k of the twelfth embodiment, and the difference is that the number of resonators 200 of the filter 500m on the upper surface 111 and the number on the lower surface 121 are both multiple, and the corresponding resonators 200 are arranged in multiple rows in a straight line. For example, the number of resonators 200 located on the upper surface 111 is four and arranged in a 2x2 array. In other words, the number of resonators 200 in each row located on the upper surface 111 and the lower surface 121 is the same. The input port 510m and the output port 520m are located on opposite sides of the resonator 200 array. In other words, the input port 510m and the output port 520m are arranged in parallel on two resonant transmission lines 220 on opposite sides of the resonator 200 array.

Please refer to FIG. 28 and FIG. 29. FIG. 28 is a three-dimensional schematic diagram of a multi-layer filter circuit structure according to the fourteenth embodiment of the present invention. FIG. 29 is a top view of the multi-layer filter circuit structure in FIG. 28. The multi-layer filter circuit structure 20n according to the fourteenth embodiment of the present invention comprises a multi-layer substrate 100c, a plurality of filters 500n, and a plurality of conductive members 300. The multi-layer filter circuit structure 20n of this embodiment is similar to the multi-layer filter circuit structure 20k of the twelfth embodiment, and the difference is that the number of resonators 200 of the filter 500n on the upper surface 111 and the number on the lower surface 121 are both multiple, and the corresponding resonators 200 are arranged in multiple rows in a straight line. For example, the number of resonators 200 located on the upper surface 111 is five, and the resonators 200 located on the upper surface 111 are arranged in two rows in a straight line. For example, two of the resonators 200 are in the first row and are arranged in a straight line, and the other three resonators 200 are in the second row and are arranged in a straight line. In other words, the number of resonators 200 in each row located on the upper surface 111 and the lower surface 121 is different. The input port 510n and the output port 520n are respectively located on opposite sides of the resonator 200 combination. In other words, the input port 510n and the output port 520n are respectively arranged in parallel on two resonant transmission lines 220 on opposite sides of the resonator 200 combination.

According to the multi-layer resonator circuit structure and multi-layer filter circuit structure disclosed in the above embodiments, the resonators are respectively arranged on the upper and lower surfaces of the multi-layer substrate facing each other, or the filters are respectively arranged on the upper and lower surfaces of the multi-layer substrate facing each other. In other words, part of the resonator or part of the filter can be reconfigured on the lower surface where the electronic components are not arranged without concentrating on any space on the upper surface of the multi-layer substrate where other electronic components are arranged. In this way, the change in the arrangement position of the resonator and the filter will allow more space on the upper surface where the electronic components are arranged to arrange other electronic components, thereby improving the space utilization rate of the circuit board and contributing to the miniaturization of the circuit board.

Although the present invention is disclosed as above by the aforementioned embodiments, they are not used to limit the present invention. Anyone familiar with similar techniques can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.

10: Multi-layer resonator circuit structure 100: Multi-layer substrate 110: First dielectric layer 111: Upper surface 120: Second dielectric layer 121: Lower surface 130: Ground layer 131: Grooving 200: Resonator 300: Conductive component

Claims (11)

A multi-layer resonator circuit structure includes: a multi-layer substrate having an upper surface, a lower surface and a ground layer, wherein the upper surface and the lower surface are opposite to each other and the ground layer is between the upper surface and the lower surface; a plurality of resonators, wherein a portion of the resonators is disposed on the upper surface and another portion of the resonators is disposed on the lower surface; and a plurality of conductive components, which are located in the multi-layer substrate and electrically connect the resonators to each other. connected to the ground layer; wherein each of the resonators comprises a contact portion and a plurality of resonant transmission lines, the resonant transmission lines are connected to the contact portion, and the resonant transmission lines are a ground line and at least one open line, and the conductive components respectively electrically connect the ground lines to the ground layer; wherein the number of the at least one open line is multiple; and wherein the open lines protrude from the contact portion in different directions. A multi-layer resonator line structure as described in claim 1, wherein each of the resonant transmission lines comprises an inner extension section and an outer extension section, the inner extension section is connected to the contact portion, the outer extension section is connected to the inner extension section, and the outer extension section is not parallel to the inner extension section. The multi-layer resonator circuit structure as described in claim 2, wherein the inner extension section and the outer extension section of any resonant transmission line and the inner extension section of the adjacent resonant transmission line together surround a layout area, and each resonator further includes a plurality of expansion parts, which are respectively located in the layout areas and connected to the contact part. The multi-layer resonator circuit structure as described in claim 3, wherein the number of the resonators located on the upper surface and the lower surface is two each, and the two resonators located on the upper surface and the lower surface are coupled through the two resonant transmission lines arranged in parallel, respectively, and the ground layer has two slots separated from each other, one of the two slots corresponds to the two resonant transmission lines coupled on the upper surface, and the other of the two slots corresponds to the two resonant transmission lines coupled on the lower surface. A multi-layer resonator line structure as described in claim 4, wherein the projection of each of the slots on the upper surface or on the lower surface is located between the two contact portions and is perpendicular to the two outer extensions of the two coupled resonant transmission lines. A multi-layer resonator line structure as described in claim 4, wherein each of the slots comprises a main slot section and two auxiliary slot sections, the main slot section is located on the upper surface or the projection of the lower surface is located between the two contact portions and is perpendicular to the two outer extension sections of the two coupled resonant transmission lines, and the two auxiliary slot sections are respectively connected to the opposite ends of the main slot section and are perpendicular to the main slot section. The multi-layer resonator circuit structure as described in claim 6, wherein each of the slots further comprises a plurality of sub-slot sections, which are respectively connected to the opposite ends of the two sub-slot sections and are parallel to the main slot section. A multi-layer filter circuit structure comprises: a multi-layer substrate having an upper surface, a lower surface and a grounding layer, the upper surface and the lower surface are opposite to each other and the grounding layer is between the upper surface and the lower surface; a plurality of filters, part of which is disposed on the upper surface, and another part of which is disposed on the lower surface; and a plurality of conductive components, which are located in the multi-layer substrate and electrically connect the filters to the grounding layer respectively; wherein each of the filters comprises at least one resonator, an input port and an output port, the input port and the output port are respectively and separately disposed on opposite sides of the at least one resonator, and the conductive components electrically connect the resonators to the grounding layer respectively. The multi-layer filter circuit structure as described in claim 8, wherein the number of the at least one resonator located on the upper surface and the lower surface is multiple, and the resonators located on the upper surface and the resonators located on the lower surface are arranged in multiple rows in a straight line. A multi-layer filter circuit structure as described in claim 9, wherein the number of resonators in each row located on the upper surface and the lower surface is the same. A multi-layer filter circuit structure as described in claim 9, wherein among the rows of resonators located on the upper surface, at least two rows of resonators have different numbers of resonators, and among the rows of resonators located on the lower surface, at least two rows of resonators have different numbers of resonators.