TWI841032B - Testing system - Google Patents
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Abstract
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本案與自動化系統有關,特別是關於一種自動化半導體測試系統。 This case is related to automation systems, and in particular to an automated semiconductor testing system.
按,隨著電子產業的發展越趨成熟,客戶端對於產品良率的要求也越來越高,因此,各種半導體元件出廠前都必須經過測試,測試後依測試結果進行分類(bin),最後再依分類別做出貨或其他的處置。 As the electronics industry matures, customers have higher and higher requirements for product yield. Therefore, all kinds of semiconductor components must be tested before leaving the factory. After testing, they are classified (bin) according to the test results, and finally shipped or otherwise disposed of according to the classification.
而半導體元件的種類眾多,除了功能上具有分別之外,其外觀型態上也不盡相同,而外觀型態不同的半導體元件在測試過程中就必須有不同的配置應對,本案即著眼於收容於料閘的試片之測試,以期提供一種高效率之試片測試系統。 There are many types of semiconductor components. In addition to their different functions, their appearances are also different. Different semiconductor components with different appearances must have different configurations during the testing process. This case focuses on the testing of the test piece contained in the gate, in order to provide a high-efficiency test piece testing system.
本案提供一種測試系統,適於複數試片之測試,複數試片沿Z方向彼此間隔地容置於料閘內,測試系統包括複數料閘移載裝置、入閘區、入料裝置、輸送單元、測試模組及出閘區。料閘移載裝置分別可沿垂直於Z方向的X方向位移並包括夾持器,夾持器可沿Z方向位移地設置於料閘移載裝置,複數料閘移載裝置包含第一料閘移載裝置及第二料閘移載裝置。入閘區沿X方向延伸且一端相對於第一料閘移載裝置的夾持器。入料裝置設置於第一料閘移載裝置的一側,用以沿垂直於X方向及Z方向的Y 方向自料閘卸載試片。輸送單元一端鄰接於第一料閘移載裝置的另一側以承接試片並沿Y方向輸送試片,且輸送單元的另一端鄰接於第二料閘移載裝置。測試模組包含設置於輸送單元兩側的規正單元、測試機以及移載試片於規正單元與測試機之間的測試片移載單元。出閘區一端相對於第二料閘移載裝置的夾持器,且出閘區沿X方向延伸。 The present invention provides a testing system suitable for testing a plurality of test pieces. The plurality of test pieces are placed in a gate spaced apart from each other along the Z direction. The testing system includes a plurality of gate transfer devices, a gate entry area, a feeding device, a conveying unit, a testing module and a gate exit area. The gate transfer devices can be displaced along the X direction perpendicular to the Z direction and include a clamp. The clamp can be displaced along the Z direction and arranged on the gate transfer device. The plurality of gate transfer devices include a first gate transfer device and a second gate transfer device. The gate entry area extends along the X direction and one end of which is opposite to the clamp of the first gate transfer device. The feeding device is arranged on one side of the first gate transfer device and is used to unload the test piece from the gate along the Y direction perpendicular to the X direction and the Z direction. One end of the conveying unit is adjacent to the other side of the first material gate transfer device to receive the test piece and transfer the test piece along the Y direction, and the other end of the conveying unit is adjacent to the second material gate transfer device. The test module includes a regularization unit arranged on both sides of the conveying unit, a test machine, and a test piece transfer unit for transferring the test piece between the regularization unit and the test machine. One end of the gate area is opposite to the clamp of the second material gate transfer device, and the gate area extends along the X direction.
藉此,裝載有待測試試片的料閘可集中於入閘區供第一料閘移載裝置取出,入料裝置自第一料閘移載裝置上的料閘卸載試片並輸入至輸送單元,測試片移載單元將輸送單元上的試片移載至規正單元規正位置後再移載入測試機進行測試,測試後的試片再由測試片移載單元取出重新輸入至輸送單元,輸送單元將測試後的試片輸送至第二料閘移載裝置內的料閘,第二料閘移載裝置收集測試後的試片完成後再將料閘集中至出閘區輸出料閘。測試系統可自動化地對收容於料閘內的複數試片進行入料、測試及出料,提高測試效率。 In this way, the gates loaded with the test pieces to be tested can be concentrated in the gate entry area for the first gate transfer device to take out. The feed device unloads the test pieces from the gate on the first gate transfer device and inputs them into the conveying unit. The test piece transfer unit transfers the test pieces on the conveying unit to the regular position of the regular unit and then transfers them into the test machine for testing. The tested test pieces are then taken out by the test piece transfer unit and re-input into the conveying unit. The conveying unit transports the tested test pieces to the gate in the second gate transfer device. After the second gate transfer device collects the tested test pieces, it concentrates the gates in the gate exit area to output the gates. The testing system can automatically feed, test and discharge multiple test pieces contained in the gates, thereby improving the testing efficiency.
一些實施例中,前述各料閘移載裝置分別包含底軌及立軌,底軌沿X方向延伸,立軌沿Z方向延伸並可沿X方向滑移地設置於底軌上,夾持器可沿Z方向滑移地設置於立軌上。 In some embodiments, each of the aforementioned material gate transfer devices includes a bottom rail and a vertical rail, the bottom rail extends along the X direction, the vertical rail extends along the Z direction and can be slidably arranged on the bottom rail along the X direction, and the clamp can be slidably arranged on the vertical rail along the Z direction.
一些實施例中,測試系統更包含機台,測試片移載單元包含基座、頂軌及移載裝置,基座沿Z方向延伸且一端固定於機台,頂軌固定於基座的另一端並沿X方向延伸,移載裝置可沿X方向位移地設置於頂軌上。 In some embodiments, the test system further includes a machine, and the test piece transfer unit includes a base, a top rail, and a transfer device. The base extends along the Z direction and one end is fixed to the machine. The top rail is fixed to the other end of the base and extends along the X direction. The transfer device can be displaced along the X direction and disposed on the top rail.
一些實施例中,前述頂軌於X方向上的範圍重疊於規正單元及測試機。 In some embodiments, the range of the aforementioned top rail in the X direction overlaps the regularization unit and the test machine.
一些實施例中,前述移載裝置包含第一移載頭及第二移載頭,第一移載頭及第二移載頭沿X方向並列設置。 In some embodiments, the aforementioned transfer device includes a first transfer head and a second transfer head, and the first transfer head and the second transfer head are arranged in parallel along the X direction.
一些實施例中,前述第一移載頭在X方向上的位置上相較於第二移載頭靠近規正單元,第二移載頭在X方向上相較於第一移載頭靠近測試機。 In some embodiments, the first transfer head is closer to the regularization unit than the second transfer head in the X direction, and the second transfer head is closer to the testing machine than the first transfer head in the X direction.
一些實施例中,測試系統更包含至少延伸輸送機構,且出閘區的數量為複數,第二料閘移載裝置的數量對應出閘區的數量,延伸輸送機構可沿Z方向滑移地設置於除了最遠離第一料閘移載裝置以外的其餘第二料閘移載裝置之立軌上。 In some embodiments, the test system further includes at least an extended conveying mechanism, and the number of gate-out areas is plural, the number of second gate transfer devices corresponds to the number of gate-out areas, and the extended conveying mechanism can be slidably disposed along the Z direction on the vertical rails of the remaining second gate transfer devices except the one farthest from the first gate transfer device.
一些實施例中,前述第二料閘移載裝置沿Y方向並列設置。 In some embodiments, the aforementioned second material gate transfer device is arranged in parallel along the Y direction.
一些實施例中,測試系統更包含機台,前述測試機的數量為二,二測試機沿Y方向並列設置,測試片移載單元包含基座、頂軌及移載裝置,基座沿Z方向延伸且一端固定於機台,頂軌固定於基座的另一端並沿X方向延伸,且二移載裝置分別可沿X方向位移地設置於頂軌的相對兩側。 In some embodiments, the test system further includes a machine, the number of the aforementioned test machines is two, the two test machines are arranged in parallel along the Y direction, the test piece transfer unit includes a base, a top rail and a transfer device, the base extends along the Z direction and one end is fixed to the machine, the top rail is fixed to the other end of the base and extends along the X direction, and the two transfer devices can be respectively arranged on opposite sides of the top rail so as to be displaceable along the X direction.
一些實施例中,前述入閘區包含二入閘容器,二入閘容器沿Z方向重疊設置。 In some embodiments, the aforementioned gate area includes two gate containers, and the two gate containers are overlapped along the Z direction.
S:試片 S:Test piece
M:料閘 M: material gate
M1:頂面 M1: Top surface
M2:底面 M2: bottom surface
M3:第一側面 M3: First side
M4:第二側面 M4: Second side
M5:插槽 M5: slot
10:料閘移載裝置 10: Gate transfer device
10A:第一料閘移載裝置 10A: First material gate transfer device
10B:第二料閘移載裝置 10B: Second material gate transfer device
11:底軌 11: Bottom rail
12:立軌 12: Vertical track
13:夾持器 13: Clamp
131:夾口 131: Clamping
14:滑座 14: Sliding seat
20:入閘區 20: Gate area
21:入閘容器 21: Gate container
21A:第一入閘容器 21A: First gate container
21B:第二入閘容器 21B: Second entry container
30:入料裝置 30: Feeding device
31:入料部 31: Feeding section
40:輸送單元 40:Transportation unit
50:測試模組 50:Test module
51:規正單元 51:Regular unit
52:測試機 52: Testing machine
53:測試片移載單元 53: Test piece transfer unit
531:基座 531: Base
532:頂軌 532: Top track
533:移載裝置 533:Transfer device
5331:第一移載頭 5331: First transfer head
5332:第二移載頭 5332: Second transfer head
60:出閘區 60: Exit area
60A:第一出閘區 60A: First exit gate area
60B:第二出閘區 60B: Second exit area
60C:第三出閘區 60C: The third exit area
61:出閘容器 61: Gate container
61A:第一出閘容器 61A: First outlet container
61B:第二出閘容器 61B: Second outlet container
70:機台 70: Machine
80:延伸輸送機構 80: Extended conveying mechanism
X,Y,Z:方向 X,Y,Z: Direction
圖1為本案測試系統之一實施例的立體示意圖。 Figure 1 is a three-dimensional schematic diagram of one embodiment of the test system of this case.
圖2為本案測試系統之一實施例的俯視圖。 Figure 2 is a top view of one embodiment of the test system of this case.
圖3為設置延伸輸送機構的第二料閘移載裝置之一實施例的局部示意圖。 Figure 3 is a partial schematic diagram of an embodiment of a second material gate transfer device with an extended conveying mechanism.
請配合參閱圖1至圖3,圖1為本案測試系統之一實施例的立體示意圖;圖2為本案測試系統之一實施例的俯視圖;圖3為設置延伸輸送機構的第二料閘移載裝置之一實施例的局部示意圖。本案測試系統適於複數試片S之測試,且試片S於測試前/後是沿Z方向彼此間隔地容置於料閘M內。 Please refer to Figures 1 to 3. Figure 1 is a three-dimensional schematic diagram of an embodiment of the test system of this case; Figure 2 is a top view of an embodiment of the test system of this case; Figure 3 is a partial schematic diagram of an embodiment of the second material gate transfer device with an extended conveying mechanism. The test system of this case is suitable for testing multiple test pieces S, and the test pieces S are placed in the material gate M at intervals along the Z direction before and after the test.
參閱圖1,料閘M(Magazine)為收容複數半導體試片S(Strip)的容器。一些實施例中,料閘M包括頂面M1、底面M2、第一側面M3及第二側面M4,頂面M1相對於底面M2,第一側面M3相對於第二側面M4並連接於頂面M1與底面M2之間。此些實施例中,第一側面M3及第二側面M4彼此相對的一面分別包括複數插槽M5,各插槽M5彼此相對沿伸於第一側面M3及第二側面M4的兩端間,且各插槽M5的兩端開放於第一側面M3及第二側面M4的兩端。藉此,各試片S可由第一側面M3及第二側面M4的兩端可滑移地插設入各插槽M5內。 Referring to FIG. 1 , the material gate M (Magazine) is a container for accommodating a plurality of semiconductor strips S (Strips). In some embodiments, the material gate M includes a top surface M1, a bottom surface M2, a first side surface M3, and a second side surface M4, wherein the top surface M1 is opposite to the bottom surface M2, and the first side surface M3 is opposite to the second side surface M4 and connected between the top surface M1 and the bottom surface M2. In these embodiments, the first side surface M3 and the second side surface M4 have a plurality of slots M5 on the sides opposite to each other, and each slot M5 extends between the two ends of the first side surface M3 and the second side surface M4 opposite to each other, and the two ends of each slot M5 are open at the two ends of the first side surface M3 and the second side surface M4. Thus, each test piece S can be slidably inserted into each slot M5 from both ends of the first side surface M3 and the second side surface M4.
參閱圖1,試片S為本測試系統之待測試物件(Device Under Test,DUT)。一些實施例中,試片S為薄片型態的半導體元件。此些實施例中,試片S為長矩形薄片結構。 Referring to FIG. 1 , the test piece S is the device under test (DUT) of the test system. In some embodiments, the test piece S is a semiconductor element in the form of a thin sheet. In these embodiments, the test piece S is a long rectangular thin sheet structure.
參閱圖1及圖2,測試系統包含複數料閘移載裝置10、入閘區20、入料裝置30、輸送單元40、測試模組50以及出閘區60。各料閘移載裝置10分別可沿垂直於Z方向的X方向位移並包括夾持器13,夾持器13
可沿Z方向位移地設置於料閘移載裝置10,複數料閘移載裝置10包含第一料閘移載裝置10A及第二料閘移載裝置10B。入閘區20沿X方向延伸且一端相對於第一料閘移載裝置10A的夾持器13。入料裝置30設置於第一料閘移載裝置10A的一側,用以沿垂直於X方向及Z方向的Y方向自料閘M卸載試片S。輸送單元40的一端鄰接於第一料閘移載裝置10A的另一側以承接試片S並沿Y方向輸送試片S,且輸送單元40的另一端鄰接於第二料閘移載裝置10B。測試模組50包含設置於輸送單元40兩側的規正單元51、測試機52以及移載試片S於規正單元51與該測試機52之間的測試片移載單元53。出閘區60的一端相對於第二料閘移載裝置10B的夾持器13,且出閘區60沿X方向延伸。
Referring to FIG. 1 and FIG. 2 , the test system includes a plurality of
藉此,裝載有待測試試片S的料閘M可集中於入閘區20供第一料閘移載裝置10A取出,入料裝置30自第一料閘移載裝置10A上的料閘M卸載試片S並輸入至輸送單元40,測試片移載單元53將輸送單元40上的試片S移載至規正單元51規正位置後再移載入測試機52進行測試,測試後的試片S再由測試片移載單元53取出重新輸入至輸送單元40,輸送單元40將測試後的試片S輸送至第二料閘移載裝置10B內的料閘M,第二料閘移載裝置10B收集測試後的試片S完成後再將料閘M集中至出閘區60輸出料閘M。由此可知,測試系統可自動化地對收容於料閘M內的複數試片S進行入料、測試及出料,提高測試效率。
Thereby, the material gate M loaded with the test piece S to be tested can be concentrated in the
參閱圖1及圖2,一些實施例中,測試系統包含機台70。此些實施例中,各零組件可以機台70為基礎地架構於機台70上,但本案並不以此為限。
Referring to FIG. 1 and FIG. 2 , in some embodiments, the test system includes a
參閱圖1至圖3,料閘移載裝置10用以沿Z方向及垂直於Z方向的X方向移載料閘M。一些實施例中,料閘移載裝置10包含底軌11、立軌12及夾持器13。此些實施例中,底軌11沿X方向延伸並固定設置於機台70上,立軌12沿Z方向延伸且可沿X方向滑移地設置於底軌11上,而夾持器13可沿Z方向滑移地設置於立軌12上。於此,夾持器13具有夾口131以夾持於料閘M的頂面M1及底面M2,且在料閘M被夾持於夾持器13時,料閘M內的插槽M5兩端連線沿Y方向延伸。
Referring to Figures 1 to 3, the
參閱圖1及圖2,一些實施例中,第一料閘移載裝置10A是用以取置入閘區20內的料閘M;而第二料閘移載裝置10B是用以取置出閘區60內的料閘M。此些實施例中,第一料閘移載裝置10A的夾持器13之夾口131面向入閘區20,且第一料閘移載裝置10A的底軌11之一端延伸至入閘區20;而第二料閘移載裝置10B的夾持器13之夾口131面向出閘區60,且第二料閘移載裝置10B的底軌11之一端延伸至出閘區60。
Referring to Figures 1 and 2, in some embodiments, the first
參閱圖1及圖2,一些實施例中,入閘區20包含複數入閘容器21,各入閘容器21為沿X方向延伸長度的長形空心容器用以容置料閘M。此些實施例中,各入閘容器21沿Z方向重疊設置,且各入閘容器21的一端在X方向上的位置鄰接於第一料閘移載裝置10A。藉此,第一料閘移載裝置10A的立軌12可於底軌11上沿X方向位移以帶動夾持器13至入閘容器21取出或置入料閘M。
Referring to FIG. 1 and FIG. 2 , in some embodiments, the
參閱圖1,一些實施例中,複數入閘容器21包含第一入閘容器21A與第二入閘容器21B,第一入閘容器21A用以容置裝載有待測試的試片S之料閘M,而第二入閘容器21B用以容置未裝載有試片S的空料閘
M。藉此,操作人員可在第一入閘容器21A內一次裝載複數裝載有待測試的試片S之料閘M供測試系統持續進行測試,而當第一料閘移載裝置10A取出的料閘M內之試片S均被入料裝置30輸入輸送單元40進入測試流程後,第一料閘移載裝置10A即能將空的料閘M置入第二入閘容器21B內供操作人員取走。如此一來,在測試過程中,不須等待空的料閘M被取走後才補充裝載有待測試的試片S之料閘M,而能提高測試速度及效率。
Referring to FIG. 1 , in some embodiments, the plurality of
值得說明的是,如圖1所繪示之實施例之入閘容器21的數量是以兩個入閘容器21為例進行說明,但本案並不以此為限。入閘容器21的數量可視需求及第一料閘移載裝置10A的夾持器13於Z方向的位移範圍而定。
It is worth noting that the number of
參閱圖1及圖2,一些實施例中,入料裝置30是能沿Y方向自料閘M內卸載試片S。此些實施例中,入料裝置30固定設置於機台70上並包含入料部31,入料部31可沿Y方向位移。於此,當料閘M夾持於第一料閘移載裝置10A時,入料裝置30的入料部31朝向料閘M的插槽M5之一端。如此一來,第一料閘移載裝置10A只要改變夾持器13於Z方向上的位置,入料裝置30就能相對應於料閘M內不同試片S的位置,只要驅動入料裝置30的入料部31沿Y方向伸縮,就能將料閘M內的試片S自料閘M內卸載並將試片S送入輸送單元40。一些實施例中,入料裝置30為氣/液壓缸帶動伸縮桿型態的入料部31伸縮以卸載試片S,但本案並不以此為限。
Referring to FIG. 1 and FIG. 2 , in some embodiments, the
參閱圖1及圖2,輸送單元40沿Y方向輸送試片S以完成測試。一些實施例中,輸送單元40可以是輸送帶。此些實施例中,輸送單元40沿Y方向延伸於第一料閘移載裝置10A與第二料閘移載裝置10B之間。
Referring to FIG. 1 and FIG. 2 , the
參閱圖1及圖2,一些實施例中,規正單元51設置於輸送單元40的一側用以規正試片S於X方向及Y方向的位置,使試片S於X方向及Y方向上的位置處於後續測試機52進行測試的位置。
Referring to FIG. 1 and FIG. 2 , in some embodiments, the
參閱圖1及圖2,測試機52設置於輸送單元40的另一側用以對試片S進行測試。此些實施例中,規正單元51與測試機52位於相同的Y方向位置上,藉以便於測試片移載單元53的快速移載。
Referring to Figures 1 and 2, the
參閱圖1及圖2,測試片移載單元53設置於規正單元51與測試機52之間,用以將未測試的試片S由輸送單元40移載至規正單元51進行規正、將規正後的試片S由規正單元51移載至測試機52內進行測試,以及將測試機52內經過測試的試片S移載至輸送單元40。
Referring to Figures 1 and 2, the test
一些實施例中,測試片移載單元53包含基座531、頂軌532及移載裝置533,此些實施例中,基座531沿Z方向延伸且一端固定於機台70,頂軌532固定於基座531的另一端並沿X方向延伸,移載裝置533可沿X方向位移地設置於頂軌532上。
In some embodiments, the test
參閱圖1及圖2,一些實施例中,頂軌532沿X方向延伸的範圍重疊於規正單元51及測試機52,藉此使移載裝置533可沿X方向位移至規正單元51或測試機52。
Referring to FIG. 1 and FIG. 2 , in some embodiments, the range of the
參閱圖1及圖2,一些實施例中,移載裝置533包含第一移載頭5331及第二移載頭5332,第一移載頭5331及第二移載頭5332分別可沿Z方向伸縮位移,且第一移載頭5331及第二移載頭5332是沿X方向並列設置。此些實施例中,在X方向上的位置上,第一移載頭5331相較於第二移載頭5332靠近規正單元51,而第二移載頭5332相較於第一移載頭5331靠
近測試機52,且第一移載頭5331用以移載未經測試的試片S,而第二移載頭5332用以移載經過測試的試片S。
Referring to FIG. 1 and FIG. 2 , in some embodiments, the
一些實施例中,第一移載頭5331及第二移載頭5332可以是吸取頭而能透過真空吸取的方式移載試片S,但本案並不以此為限。
In some embodiments, the
於此,當試片S由輸送單元40輸送至對應測試片移載單元53的位置時,測試片移載單元53的移載裝置533沿頂軌532位移至第一移載頭5331對應輸送單元40的位置,接著第一移載頭5331沿Z方向位移靠近輸送單元40將輸送單元40上的試片S取走,第一移載頭5331取走輸送單元40上未經測試的試片S後,移載裝置533沿頂軌532位移至第一移載頭5331對應規正單元51的位置,接著第一移載頭5331再將試片S置入規正單元51,規正單元51即能對試片S進行X方向與Y方向的位置規正,使規正後的試片S處於能於測試機52進行測試的位置。
Here, when the test piece S is transported by the
接著,當試片S於規正單元51內規正位置後,第一移載頭5331將規正位置後的試片S自規正單元51內取出,移載裝置533沿頂軌532位移至第一移載頭5331位置對應測試機52的位置並將規正位置後的試片S置入測試機52以進行測試。
Next, when the test piece S is aligned in the
值得說明的是,由於測試系統是持續不斷地進行測試,因此,在循環測試的過程中,測試機52內可能已存在經過測試後的試片S,於此狀況下,在第一移載頭5331位移至測試機52的過程中,由於第二移載頭5332在X方向上的位置是相較於第一移載頭5331靠近測試機52,因此第二移載頭5332將早於第一移載頭5331位移至對應測試機52的位置,此時,第二移載頭5332便能先將測試機52內的試片S取出,接著第一移載頭
5331繼續位移靠近測試機52,在第一移載頭5331位移至對應測試機52的位置時,第一移載頭5331便能將未經測試的試片S置入測試機52進行測試。
It is worth noting that since the test system is continuously testing, during the cyclic test, there may be a tested specimen S in the
接著,測試片移載單元53的移載裝置533沿頂軌532位移,在第二移載頭5332對應至輸送單元40的位置時,第二移載頭5332便能將經過測試的試片S重新載入輸送單元40,輸送單元40繼續將試片S沿Y方向進行輸送。經由前述可知,測試片移載單元53的移載裝置533可在取出已測試之試片S後不須往返輸送單元40就能再置入待測試之試片S,減少測試片移載單元53往返輸送單元40所耗費的時間,提高測試效率。
Then, the
參閱圖1及圖2,一些實施例中,測試模組50的測試機52之數量可以為二,二測試機52沿Y方向並列設置,此些實施例中,測試片移載單元53的頂軌532兩側分別設置一個移載裝置533,藉此即能適用於雙測試機52同時進行測試。
Referring to FIG. 1 and FIG. 2 , in some embodiments, the number of the
一些實施例中,出閘區60包含複數出閘容器61,出閘容器61與入閘容器21的結構態樣相同而不再贅述。此些實施例中,各出閘容器61沿Z方向重疊設置,且各出閘容器61的一端再X方向上的位置鄰接於第二料閘移載裝置10B。藉此,第二料閘移載裝置10B的立軌12可於底軌11上沿X方向位移以帶動夾持器13至出閘容器61取出或置入料閘M。
In some embodiments, the gate-
一些實施例中,複數出閘容器61包含第一出閘容器61A與第二出閘容器61B,第一出閘容器61A用以容置裝載有測試後的試片S之料閘M,而第二出閘容器61B用以容置未裝載試片S的空料閘M。藉此,操作人員可在第二出閘容器61B內一次裝載複數未裝載試片S之空料閘M供第二
料閘移載裝置10B取出空的料閘M以承接由輸送單元40送出的測試完成之試片S,而當第二料閘移載裝置10B取出的料閘M內承接測試完成之試片S滿載後,第二料閘移載裝置10B即能將已滿載測試完成之試片S的料閘M置入第一出閘容器61A內供操作人員取走。如此一來,在測試過程中,不須等待滿載的料閘M被取走後才能補充空的料閘M,而能提高測試速度及效率。
In some embodiments, the plurality of
一些實施例中,出閘區60的數量為複數而能作在輸出料閘M時同時進行分類,各出閘區60內容置裝載有不同特性(合格、不合格、未測)試片S的料閘M。此些實施例中,各出閘區60是沿Y方向並列設置,且各出閘區60的一端分別對應設有一個第二料閘移載裝置10B。
In some embodiments, the number of
在出閘區60及第二料閘移載裝置10B的數量為複數的一些實施例中,為使來自輸送單元40的測試完成之試片S能位移至對應特性的出閘區60,更包含延伸輸送機構80。此些實施例中,延伸輸送機構80可沿Z方向滑移地設置於除了最遠離第一料閘移載裝置10A以外的其餘第二料閘移載裝置10B之立軌12上(如圖2及圖3所示),也就是說,延伸輸送機構80的數量為第二料閘移載裝置10B之數量減一。
In some embodiments where the number of the
參閱圖3,具體而言,在設有延伸輸送機構80的第二料閘移載裝置10B上,第二料閘移載裝置10B更包含滑座14,滑座14可沿Z方向滑移地設置於立軌12上,而延伸輸送機構80及夾持器13設置於滑座14上以同步位移,此些實施例中,在Z方向的位置上,延伸輸送機構80相較於夾持器13遠離底軌11。
Referring to FIG. 3 , specifically, on the second material
參閱圖1及圖2,圖1及圖2所繪示之實施例中,出閘區60的數量以三組為例進行說明,但本案並不以此為限,此些實施例中,出閘區60包含沿Y方向依序並列設置的第一出閘區60A、第二出閘區60B及第三出閘區60C,第一出閘區60A相較於第三出閘區60C靠近入閘區20。
Referring to FIG. 1 and FIG. 2 , in the embodiments shown in FIG. 1 and FIG. 2 , the number of
於此,當輸送單元40輸出的試片S經過測試後判斷其特性為對應第一出閘區60A的特性時,對應第一出閘區60A的第二料閘移載裝置10B之滑座14沿Z方向調整其上的料閘M之插槽M5於Z方向上的位置至對應輸送單元40的位置。如此一來,由輸送單元40輸出的試片S即能直接進入對應第一出閘區60A的第二料閘移載裝置10B所夾持之料閘M內,待對應第一出閘區60A的第二料閘移載裝置10B所夾持之料閘M滿載後,對應第一出閘區60A的第二料閘移載裝置10B即能將滿載之料閘M輸入至第一出閘區60A。
Here, when the test piece S output by the conveying
當輸送單元40輸出的試片S經過測試後判斷其特性為對應第二出閘區60B的特性時,對應第一出閘區60A的第二料閘移載裝置10B之滑座14沿Z方向調整其上的延伸輸送機構80於Z方向上的位置至對應輸送單元40的位置(如圖1之狀態),而對應第二出閘區60B的第二料閘移載裝置10B之滑座14沿Z方向調整其上的料閘M於Z方向上的位置至對應延伸輸送機構80的位置。如此一來,由輸送單元40輸出的試片S即能通過延伸輸送機構80跨越第一出閘區60A進入對應第二出閘區60B的第二料閘移載裝置10B所夾持之料閘M內。
When the test piece S outputted by the conveying
參閱圖1,而當輸送單元40輸出的試片S經過測試後判斷其特性為對應第三出閘區60C的特性時,對應第一出閘區60A及第二出閘區
60B的第二料閘移載裝置10B之滑座14沿Z方向調整其上的延伸輸送機構80於Z方向上的位置至對應輸送單元40的位置,而對應第三出閘區60C的第二料閘移載裝置10B之滑座14沿Z方向調整其上的料閘M之插槽M5於Z方向上的位置至對應延伸輸送機構80的位置。如此一來,由輸送單元40輸出的試片S即能通過延伸輸送機構80跨越第一出閘區60A、第二出閘區60B進入對應第三出閘區60C的第二料閘移載裝置10B所夾持之料閘M內。
Referring to FIG. 1 , when the characteristics of the test piece S outputted by the conveying
雖然本揭露已以一些實施例揭露如上,然其並非用以限定本揭露,任何所屬技術領域中具有通常知識者,在不脫離本揭露之精神及範圍內,當可作些許更動及潤飾。因此本案之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the present disclosure has been disclosed as above with some embodiments, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in the relevant technical field may make some changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of patent protection of this case shall be subject to the scope of the patent application attached to this specification.
S:試片 S:Test piece
M:料閘 M: material gate
M1:頂面 M1: Top surface
M2:底面 M2: bottom surface
M3:第一側面 M3: First side
M4:第二側面 M4: Second side
M5:插槽 M5: slot
10:料閘移載裝置 10: Gate transfer device
10A:第一料閘移載裝置 10A: First material gate transfer device
10B:第二料閘移載裝置 10B: Second material gate transfer device
12:立軌 12: Vertical track
13:夾持器 13: Clamp
131:夾口 131: Clamping
20:入閘區 20: Gate area
21:入閘容器 21: Gate container
21A:第一入閘容器 21A: First gate container
21B:第二入閘容器 21B: Second entry container
30:入料裝置 30: Feeding device
31:入料部 31: Feeding section
40:輸送單元 40:Transportation unit
50:測試模組 50:Test module
51:規正單元 51:Regular unit
52:測試機 52: Testing machine
53:測試片移載單元 53: Test piece transfer unit
531:基座 531: Base
532:頂軌 532: Top track
533:移載裝置 533:Transfer device
5331:第一移載頭 5331: First transfer head
5332:第二移載頭 5332: Second transfer head
60:出閘區 60: Exit area
60A:第一出閘區 60A: First exit gate area
60B:第二出閘區 60B: Second exit area
60C:第三出閘區 60C: The third exit area
61:出閘容器 61: Gate container
61A:第一出閘容器 61A: First outlet container
61B:第二出閘容器 61B: Second outlet container
70:機台 70: Machine
80:延伸輸送機構 80: Extended conveying mechanism
X,Y,Z:方向 X,Y,Z: Direction
Claims (9)
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010051086A1 (en) * | 2000-03-13 | 2001-12-13 | Brian Blades | Automated feed mechanism for electronic components of silicon wafer |
| TW201405152A (en) * | 2012-07-27 | 2014-02-01 | Hon Tech Inc | Pneumatic testing apparatus and testing equipment implementing the same |
| TWI545075B (en) * | 2015-12-31 | 2016-08-11 | Hon Tech Inc | Electronic component carrying device and its application equipment |
| TW202203334A (en) * | 2020-07-03 | 2022-01-16 | 日商佳能股份有限公司 | Article manufacturing device, article manufacturing method, program, and recording medium |
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2022
- 2022-11-02 TW TW111141903A patent/TWI841032B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010051086A1 (en) * | 2000-03-13 | 2001-12-13 | Brian Blades | Automated feed mechanism for electronic components of silicon wafer |
| TW201405152A (en) * | 2012-07-27 | 2014-02-01 | Hon Tech Inc | Pneumatic testing apparatus and testing equipment implementing the same |
| TWI545075B (en) * | 2015-12-31 | 2016-08-11 | Hon Tech Inc | Electronic component carrying device and its application equipment |
| TW202203334A (en) * | 2020-07-03 | 2022-01-16 | 日商佳能股份有限公司 | Article manufacturing device, article manufacturing method, program, and recording medium |
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