TWI734618B - Cooling system for a mold and method thereof - Google Patents

Abstract

A cooling system for a mold includes a cooling pipe, an evaporating vessel, a pressure relief device, an inlet pipe and a controller. The cooling pipe is located in the mold. The evaporating vessel is connected to the cooling pipe through a first pipe. The evaporating vessel is also connected to the cooling pipe through a second pipe. A water pump is installed in the second pipe. The pressure relief device is connected to the evaporating vessel. The inlet pipe is connected to the evaporating vessel. A first switch valve is installed on the inlet pipe. The controller controls the start and stop of a water pump and the pressure relief device and the switch of the first switch valve.

Description

Cooling system and method for mold

The invention relates to the technical field of rapid cooling and heating of molds, in particular to a cooling system and method for molds.

The cooling of the existing rapid cooling and heating system is mainly to pass water directly into the cooling pipeline in the mold, so as to cool the mold. The cooling rate in this way is related to the flow rate and temperature of the water passing into the cooling pipeline. The water flow rate is limited by the tortuous pipes in the mold and the viscosity of the water, and the water temperature is affected by the environmental humidity and the dew point. limit.

Therefore, in the prior art, the cooling effect of the cooling method of directly passing water into the cooling pipeline in the mold is limited. In order to further improve the cooling effect, it is necessary to improve the existing technology.

The technical problem to be solved by the present invention is to solve the problem of limited cooling effect of the cooling method in the prior art that the water is directly passed into the cooling pipeline in the mold. The present invention provides a cooling system and method for molds to solve the above-mentioned problems.

The solution of the present invention to solve its technical problems is: A cooling system for molds, including: Cooling pipeline, the cooling pipeline is located in the mold; The evaporation container, the evaporation container and the cooling pipeline are connected through a first pipeline, the evaporation container and the cooling pipeline are also connected through a second pipeline, and a water pump is installed on the second pipeline; Decompression equipment, which is connected to the evaporation vessel; The water inlet pipe is connected to the evaporation vessel, and the first on-off valve is installed on the water inlet pipe; and The controller controls the start and stop of the water pump and the pressure reducing device and the opening and closing of the first on-off valve.

Preferably, the cooling system for the mold also includes a drainage pipeline, the drainage pipeline is connected with the cooling pipeline, the drainage pipeline is provided with a second on-off valve; the first pipeline is equipped with a third on-off valve; the second pipeline is installed There is a fourth on-off valve, the fourth on-off valve is located between the water pump and the cooling pipeline; the controller controls the on-off of the second on-off valve, the third on-off valve and the fourth on-off valve.

Preferably, the decompression device is a decompression pump, the suction port of the decompression pump is in communication with the evaporation container, and the controller controls the start and stop of the decompression pump.

Preferably, a liquid level sensor is provided in the evaporation container, and the liquid level sensor is electrically connected to the controller.

The present invention also provides a cooling method for the mold, including: In the closing step, the controller controls the first on-off valve to close, the second on-off valve to close, the water pump to close, the third on-off valve to open, and the fourth on-off valve to open; In the decompression step, the controller controls the decompression pump to turn on; and In the transportation step, after the water in the evaporation container boils, the controller controls the water pump to turn on, and after a predetermined period of time, the controller controls the water pump to turn off.

Preferably, after the conveying step, a draining step is further included, and the controller controls the third on-off valve to close, the fourth on-off valve to close, and the second on-off valve to open.

Preferably, before the closing step, a water injection step is also included. If the controller detects that the value of the liquid level sensor is lower than the predetermined value, the controller controls the first on-off valve to open until the controller detects the value of the liquid level sensor. When the value is equal to the predetermined value, the controller controls the first on-off valve to close.

The beneficial effect of the present invention is that the cooling system for the mold adopts a decompression method so that after the water is boiled at normal temperature, the water is passed into the cooling pipeline, and the heat absorption effect of the boiling water is used to absorb the cooling pipeline. The cooling effect is good, and the water in the cooling pipeline is in the state of liquid water and steam, and the fluidity is good, which is conducive to the flow of liquid water and steam in the cooling pipeline to absorb heat.

In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail the embodiments of the present invention and the accompanying drawings.

Please refer to FIG. 1. FIG. 1 shows a schematic diagram of a cooling system for a mold according to the present invention. The present invention provides a cooling system 100 for a mold, which includes a cooling pipe 1, an evaporation vessel 2, a pressure reducing device 3, a water inlet pipe 4, and a controller.

The cooling pipeline 1 is located in the mold, and a part of the cooling pipeline 1 penetrates the mold core.

The evaporating container 2 and the cooling pipe 1 are connected through a first pipe 5, and the evaporating container 2 and the cooling pipe 1 are also connected through a second pipe 6. A water pump 601 is installed on the second pipeline 6. When the water pump 601 starts, the water pump 601 pumps the water in the evaporation container 2 to the cooling pipe 1.

The decompression device 3 is in communication with the evaporation vessel 2. The decompression device 3 can pump the evaporation container 2 to a negative pressure, so that the water in the evaporation container 2 boils at normal temperature.

The water inlet pipe 4 is in communication with the evaporation container 2, and a first on-off valve 401 is installed on the water inlet pipe 4.

A controller (not shown in the figure), the controller is electrically connected to the water pump 601, the pressure reducing device 3, and the first switch valve 401, and the controller can control the start and stop of the water pump 601 and the pressure reducing device 3, and the first switch valve 401 Switch.

The working principle of this cooling system 100 for molds is as follows: After water is injected into the evaporation vessel 2 through the water inlet pipe 4, the controller controls the first on-off valve 401 to close, and then the controller controls the decompression device 3 to start to evaporate The container 2 is sucked into a negative pressure. Since the pressure in the evaporation vessel 2 becomes lower, the water in the evaporation vessel 2 can boil at normal temperature. Then the controller starts the water pump 601 to supply the water in the evaporation vessel 2 to the cooling pipe 1 through the second pipe 6. At this time, there is liquid water and water vapor in the cooling pipe 1. These water and water vapor are cooling The heat in the pipeline 1 is returned to the evaporation vessel 2 through the first pipeline 5 after the heat is absorbed.

This cooling system 100 for molds adopts a decompression method to make the water boil at room temperature and then pass the water into the cooling pipe 1, using the endothermic effect of the boiling water to absorb the heat in the cooling pipe 1. The cooling effect is good, and the water in the cooling pipe 1 exists in the state of liquid water and steam, and the fluidity is good, which is conducive to the flow of liquid water and steam in the cooling pipe 1 to absorb heat.

In some embodiments, the cooling system 100 for molds further includes a drain pipe 7, the drain pipe 7 is in communication with the cooling pipe 1, and the drain pipe 7 is provided with a second switch valve 701.

A third on-off valve 501 is installed on the first pipeline 5. A fourth on-off valve 602 is installed on the second pipeline 6, and the fourth on-off valve 602 is located between the water pump 601 and the cooling pipeline 1.

The controller is electrically connected to the second on-off valve 701, the third on-off valve 501, and the fourth on-off valve 602, and controls the on and off of the second on-off valve 701, the third on-off valve 501, and the fourth on-off valve 602.

When the controller controls the third on-off valve 501 to close, the fourth on-off valve 602 to close, and the second on-off valve 701 to open, the liquid water and water vapor in the cooling pipe 1 are discharged from the drain pipe 7.

In some embodiments, the decompression device 3 is a decompression pump, the suction port of the decompression pump is in communication with the evaporation container 2, and the controller controls the start and stop of the decompression pump.

In some embodiments, a liquid level sensor (not shown in the figure) is provided in the evaporation container 2, and the liquid level sensor is electrically connected to the controller. The liquid level sensor can detect liquid level data in the evaporation container 2.

Please refer to FIGS. 1 and 2. FIG. 1 shows a schematic diagram of a cooling system for a mold according to the present invention, and FIG. 2 shows a flow chart of a cooling method for a mold according to the present invention. Based on the aforementioned cooling system 100 for a mold, the present invention also provides a cooling method for a mold, including a water injection step S1, a sealing step S2, a decompression step S3, a conveying step S4, and a draining step S5.

In the water injection step S1, if the controller detects that the value of the liquid level sensor is lower than the predetermined value, the controller controls the first on-off valve 401 to open until the controller detects that the value of the liquid level sensor is equal to the predetermined value. The controller controls the first on-off valve 401 to close.

In the closing step S2, the controller controls the first on-off valve 401 to close, the second on-off valve 701 to close, the water pump 601 to close, the third on-off valve 501 to open, and the fourth on-off valve 602 to open.

In the decompression step S3, the controller controls the decompression pump to turn on. In this step, the decompression pump is activated to pump the evaporation vessel 2 to a negative pressure.

In the delivery step S4, after the water in the evaporation container 2 boils, the controller controls the water pump 601 to turn on, and after a predetermined period of time, the controller controls the water pump 601 to turn off. In this step, water boils at room temperature in the evaporation vessel 2, and is supplied to the cooling pipe 1 by the water pump 601 through the second pipe 6. The liquid water and water vapor absorb heat in the cooling pipe 1 and then pass through the first pipe. The path 5 returns to the evaporation vessel 2.

In the draining step S5, the controller controls the third on-off valve 501 to close, the fourth on-off valve 602 to close, and the second on-off valve 701 to open. In this step, the liquid water and water vapor in the cooling pipe 1 are discharged from the drain pipe 7.

This cooling method for molds adopts a decompression method to make the water boil at room temperature and then pass the water into the cooling pipe 1, using the endothermic effect of the boiling water to absorb the heat in the cooling pipe 1, and reduce the temperature The effect is good, and the water in the cooling pipe 1 exists in the state of liquid water and steam, and the fluidity is good, which is conducive to the flow of liquid water and steam in the cooling pipe 1 to absorb heat.

It should be pointed out that the present invention is not limited to the above-mentioned embodiments. Any simple modification, equivalent change and modification of the above-mentioned embodiments made by any person familiar with the profession based on the technical solution of the present invention shall fall within the protection scope of the present invention.

1: Cooling line 2: Evaporation container 3: Decompression equipment 4: Inlet pipe 5: The first pipeline 6: The second pipeline 7: Drainage line 100: Cooling system for mold 401: The first on-off valve 501: The third on-off valve 601: Water Pump 602: The fourth on-off valve 701: second on-off valve S1: If the controller detects that the value of the liquid level sensor is lower than the predetermined value, the controller controls the first on-off valve to open until the controller detects that the value of the liquid level sensor is equal to the predetermined value, the controller controls the first One switch valve closed S2: The controller controls the first switch valve to close, the second switch valve to close, the water pump to close, the third switch valve to open, and the fourth switch valve to open S3: The controller controls the pressure reducing pump to turn on S4: After the water in the evaporation vessel boils, the controller controls the water pump to turn on, and after a predetermined period of time, the controller controls the water pump to turn off S5: The controller controls the third on-off valve to close, the fourth on-off valve to close and the second on-off valve to open

Figure 1 is a schematic diagram of a cooling system for a mold of the present invention. Figure 2 is a flow chart of a cooling method for a mold of the present invention.

1: Cooling line

2: Evaporation container

3: Decompression equipment

4: Inlet pipe

5: The first pipeline

6: The second pipeline

7: Drainage line

100: Cooling system for mold

401: The first on-off valve

501: The third on-off valve

601: Water Pump

602: The fourth on-off valve

701: second on-off valve

Claims (6)

A cooling system for a mold includes: a cooling pipeline located in a mold; an evaporating container, the evaporating container communicates with the cooling pipeline through a first pipeline, and the evaporating container is connected to the cooling pipeline. The pipeline is also connected through a second pipeline, and a water pump is installed on the second pipeline; a pressure reducing device is connected with the evaporation container; a water inlet pipeline is connected with the evaporation container, A first on-off valve is installed on the water inlet pipeline; a controller that controls the start and stop of the water pump and the pressure reducing device and the on-off of the first on-off valve; and a drainage pipeline that is connected to the The cooling pipeline is connected, a second on-off valve is provided on the drain pipeline, a third on-off valve is installed on the first pipeline, a fourth on-off valve is installed on the second pipeline, and the fourth on-off valve is located between the water pump and the water pump. Between the cooling pipelines, the controller controls the on-off of the second on-off valve, the third on-off valve and the fourth on-off valve. The cooling system for a mold according to claim 1, wherein the pressure reducing device is a pressure reducing pump, a suction port of the pressure reducing pump is in communication with the evaporation container, and the controller controls the pressure reducing pump start stop. The cooling system for a mold according to claim 1, wherein a liquid level sensor is provided in the evaporation container, and the liquid level sensor is electrically connected with the controller. A cooling method for a cooling system of a mold according to any one of claims 1 to 3, comprising: In a closing step, a controller controls a first on-off valve to close, a second on-off valve to close, a water pump to turn off, a third on-off valve to open, and a fourth on-off valve to open; in a decompression step, the controller controls a The decompression pump is turned on; and in a delivery step, after the water in an evaporation container boils, the controller controls the water pump to turn on, and after a predetermined time, the controller controls the water pump to turn off. The cooling method for a mold according to claim 4, wherein after the conveying step, a draining step is further included, and the controller controls the third on-off valve to close, the fourth on-off valve to close, and the second on-off valve to open . The method for cooling a mold according to claim 4, wherein before the closing step, a water injection step is further included. If the controller detects that the value of a liquid level sensor is lower than a predetermined value, the controller The first on-off valve is controlled to open until the controller detects that the value of the liquid level sensor is equal to the predetermined value, the controller controls the first on-off valve to close.

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