TWI731072B - 樹脂組成物、預浸體、樹脂片、疊層樹脂片、疊層板、覆金屬箔疊層板及印刷電路板 - Google Patents
樹脂組成物、預浸體、樹脂片、疊層樹脂片、疊層板、覆金屬箔疊層板及印刷電路板 Download PDFInfo
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- TWI731072B TWI731072B TW106114168A TW106114168A TWI731072B TW I731072 B TWI731072 B TW I731072B TW 106114168 A TW106114168 A TW 106114168A TW 106114168 A TW106114168 A TW 106114168A TW I731072 B TWI731072 B TW I731072B
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| JP7154475B2 (ja) * | 2017-03-29 | 2022-10-18 | 三菱瓦斯化学株式会社 | プリント配線板用樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
| JP6994174B2 (ja) * | 2017-11-14 | 2022-01-14 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
| WO2020004211A1 (ja) * | 2018-06-27 | 2020-01-02 | 三菱瓦斯化学株式会社 | 樹脂組成物およびその応用 |
| JP7435444B2 (ja) * | 2018-07-18 | 2024-02-21 | 株式会社レゾナック | 銅張積層板、プリント配線板、半導体パッケージ及び銅張積層板の製造方法 |
| JP7243077B2 (ja) * | 2018-08-10 | 2023-03-22 | 株式会社レゾナック | プリプレグ、プリプレグの硬化物、積層板、プリント配線板及び半導体パッケージ |
| WO2020045489A1 (ja) * | 2018-08-30 | 2020-03-05 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
| JP7148859B2 (ja) * | 2018-08-31 | 2022-10-06 | 三菱瓦斯化学株式会社 | シアン酸エステル化合物の混合物及び硬化性組成物 |
| EP4074740B1 (en) * | 2019-12-11 | 2024-11-20 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device |
| EP4108710A4 (en) * | 2020-02-21 | 2023-12-06 | Toray Industries, Inc. | FIBER-REINFORCED COMPOSITE MOLDED ARTICLE AND ASSOCIATED MOLDING METHOD |
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| CN118382674A (zh) * | 2021-12-14 | 2024-07-23 | 阿萨达股份公司 | 具有改进的特性的新型组合物 |
| IL312591B2 (en) * | 2021-12-14 | 2025-10-01 | Arxada Ag | Preparations with improved properties |
| US20250136761A1 (en) * | 2022-10-11 | 2025-05-01 | Shengyi Technology (Suzhou) Co., Ltd | Modified bismaleimide prepolymer, resin composition and application of resin composition |
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| JPH02251518A (ja) * | 1989-03-27 | 1990-10-09 | Mitsui Toatsu Chem Inc | 熱硬化性樹脂組成物 |
| CN103562309A (zh) * | 2011-05-31 | 2014-02-05 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料和层压板 |
| US20140178751A1 (en) * | 2012-12-20 | 2014-06-26 | Industrial Technology Research Institute | Lithium ion secondary battery and electrolyte additive for the same |
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| JPH01306405A (ja) * | 1988-06-03 | 1989-12-11 | Hitachi Ltd | オルトジアリルビスシアナート系化合物、及び、この化合物を含む組成物 |
| JP5024205B2 (ja) | 2007-07-12 | 2012-09-12 | 三菱瓦斯化学株式会社 | プリプレグ及び積層板 |
| TW201204548A (en) | 2010-02-05 | 2012-02-01 | Sumitomo Bakelite Co | Prepreg, laminate, printed wiring board, and semiconductor device |
| CN103025775B (zh) * | 2010-07-26 | 2015-04-15 | 三菱丽阳株式会社 | 树脂组合物、使用了该树脂组合物的预浸料及纤维强化复合材料 |
| WO2012099132A1 (ja) | 2011-01-18 | 2012-07-26 | 日立化成工業株式会社 | 樹脂組成物、及びこれを用いたプリプレグ、積層板、プリント配線板 |
| JP2013001807A (ja) | 2011-06-16 | 2013-01-07 | Panasonic Corp | 電子回路基板材料用樹脂組成物、プリプレグ及び積層板 |
| JP3173332U (ja) | 2011-11-17 | 2012-02-02 | 奇▲こう▼科技股▲ふん▼有限公司 | 含油軸受ファン構造 |
| JP2013216884A (ja) | 2012-03-14 | 2013-10-24 | Hitachi Chemical Co Ltd | 熱硬化性樹脂組成物、プリプレグ及び積層板 |
| JP5949249B2 (ja) * | 2012-07-13 | 2016-07-06 | 日立化成株式会社 | 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及びプリント配線板 |
| CN111393854B (zh) * | 2012-10-19 | 2022-02-25 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、层压板、以及印刷电路板 |
| JP6107050B2 (ja) * | 2012-10-26 | 2017-04-05 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板 |
| CN103724999A (zh) * | 2013-05-30 | 2014-04-16 | 广东生益科技股份有限公司 | 一种氰酸酯树脂组合物及其用途 |
| JP6639072B2 (ja) * | 2014-02-06 | 2020-02-05 | 三菱瓦斯化学株式会社 | プリント配線板用樹脂組成物、プリプレグ、積層板及びプリント配線板 |
| KR102646963B1 (ko) | 2015-07-06 | 2024-03-13 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 프리프레그, 금속박 피복 적층판, 및 프린트 배선판 |
| JP6924388B2 (ja) | 2016-05-02 | 2021-08-25 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、樹脂シート、積層樹脂シート、積層板、金属箔張積層板、及びプリント配線板 |
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Patent Citations (3)
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| JPH02251518A (ja) * | 1989-03-27 | 1990-10-09 | Mitsui Toatsu Chem Inc | 熱硬化性樹脂組成物 |
| CN103562309A (zh) * | 2011-05-31 | 2014-02-05 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料和层压板 |
| US20140178751A1 (en) * | 2012-12-20 | 2014-06-26 | Industrial Technology Research Institute | Lithium ion secondary battery and electrolyte additive for the same |
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| CN108137800B (zh) | 2021-09-07 |
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