TWI730820B - Polymer film - Google Patents
Polymer film Download PDFInfo
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- TWI730820B TWI730820B TW109120987A TW109120987A TWI730820B TW I730820 B TWI730820 B TW I730820B TW 109120987 A TW109120987 A TW 109120987A TW 109120987 A TW109120987 A TW 109120987A TW I730820 B TWI730820 B TW I730820B
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- Prior art keywords
- film
- autoclave
- polymer
- polymer film
- treatment
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- 229920006254 polymer film Polymers 0.000 title claims abstract description 195
- 229920005989 resin Polymers 0.000 claims abstract description 46
- 239000011347 resin Substances 0.000 claims abstract description 46
- 239000004642 Polyimide Substances 0.000 claims abstract description 32
- 229920001721 polyimide Polymers 0.000 claims abstract description 32
- 239000002952 polymeric resin Substances 0.000 claims abstract description 32
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 32
- 229920002647 polyamide Polymers 0.000 claims abstract description 29
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 claims description 83
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 50
- 239000013557 residual solvent Substances 0.000 claims description 22
- 239000002904 solvent Substances 0.000 claims description 11
- 238000012360 testing method Methods 0.000 claims description 9
- 125000003368 amide group Chemical group 0.000 claims 3
- 239000010408 film Substances 0.000 description 210
- -1 formamidino group Chemical group 0.000 description 122
- 239000000243 solution Substances 0.000 description 120
- 229920000642 polymer Polymers 0.000 description 111
- 230000003287 optical effect Effects 0.000 description 41
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 32
- 238000010438 heat treatment Methods 0.000 description 28
- 238000011156 evaluation Methods 0.000 description 26
- 238000004519 manufacturing process Methods 0.000 description 22
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 21
- 150000001408 amides Chemical group 0.000 description 21
- 238000005259 measurement Methods 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 18
- 150000001875 compounds Chemical class 0.000 description 18
- 238000001816 cooling Methods 0.000 description 18
- 239000004952 Polyamide Substances 0.000 description 16
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 description 16
- 239000003054 catalyst Substances 0.000 description 16
- 230000000704 physical effect Effects 0.000 description 15
- 238000002834 transmittance Methods 0.000 description 15
- 239000011261 inert gas Substances 0.000 description 13
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- 239000003960 organic solvent Substances 0.000 description 12
- 238000006116 polymerization reaction Methods 0.000 description 12
- 238000010926 purge Methods 0.000 description 12
- 230000003068 static effect Effects 0.000 description 12
- 125000003118 aryl group Chemical group 0.000 description 11
- 238000005266 casting Methods 0.000 description 11
- 150000002466 imines Chemical class 0.000 description 11
- 239000010410 layer Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 10
- 239000012535 impurity Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 239000003002 pH adjusting agent Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 10
- 238000003756 stirring Methods 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- 238000001035 drying Methods 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 125000001072 heteroaryl group Chemical group 0.000 description 8
- 239000002346 layers by function Substances 0.000 description 8
- 125000001424 substituent group Chemical group 0.000 description 8
- 125000001931 aliphatic group Chemical group 0.000 description 7
- 125000004122 cyclic group Chemical group 0.000 description 7
- 125000004989 dicarbonyl group Chemical group 0.000 description 7
- 229910052731 fluorine Inorganic materials 0.000 description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 6
- 239000012024 dehydrating agents Substances 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 239000011737 fluorine Substances 0.000 description 6
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000009849 vacuum degassing Methods 0.000 description 6
- AZUYLZMQTIKGSC-UHFFFAOYSA-N 1-[6-[4-(5-chloro-6-methyl-1H-indazol-4-yl)-5-methyl-3-(1-methylindazol-5-yl)pyrazol-1-yl]-2-azaspiro[3.3]heptan-2-yl]prop-2-en-1-one Chemical compound ClC=1C(=C2C=NNC2=CC=1C)C=1C(=NN(C=1C)C1CC2(CN(C2)C(C=C)=O)C1)C=1C=C2C=NN(C2=CC=1)C AZUYLZMQTIKGSC-UHFFFAOYSA-N 0.000 description 5
- 125000004450 alkenylene group Chemical group 0.000 description 5
- 125000002947 alkylene group Chemical group 0.000 description 5
- 125000004419 alkynylene group Chemical group 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical class CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000005401 electroluminescence Methods 0.000 description 4
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000004962 Polyamide-imide Substances 0.000 description 3
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 229920002312 polyamide-imide Polymers 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000000304 alkynyl group Chemical group 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 238000004817 gas chromatography Methods 0.000 description 2
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 125000001183 hydrocarbyl group Chemical class 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 125000000468 ketone group Chemical group 0.000 description 2
- 229910052743 krypton Inorganic materials 0.000 description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 2
- 125000005647 linker group Chemical group 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229910052754 neon Inorganic materials 0.000 description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229910052704 radon Inorganic materials 0.000 description 2
- SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- WRRFUKGBBSUJOU-UHFFFAOYSA-N (2-decanoyloxy-3-decanoylsulfanylpropyl) 2-(trimethylazaniumyl)ethyl phosphate Chemical compound CCCCCCCCCC(=O)OC(COP([O-])(=O)OCC[N+](C)(C)C)CSC(=O)CCCCCCCCC WRRFUKGBBSUJOU-UHFFFAOYSA-N 0.000 description 1
- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 description 1
- QDBOAKPEXMMQFO-UHFFFAOYSA-N 4-(4-carbonochloridoylphenyl)benzoyl chloride Chemical compound C1=CC(C(=O)Cl)=CC=C1C1=CC=C(C(Cl)=O)C=C1 QDBOAKPEXMMQFO-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical group [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000005262 alkoxyamine group Chemical group 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 125000006297 carbonyl amino group Chemical group [H]N([*:2])C([*:1])=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 229910052805 deuterium Inorganic materials 0.000 description 1
- 239000012769 display material Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 239000012210 heat-resistant fiber Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine group Chemical group NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- 125000005597 hydrazone group Chemical group 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002343 natural gas well Substances 0.000 description 1
- ZNPKAOCQMDJBIK-UHFFFAOYSA-N nitrocyanamide Chemical group [O-][N+](=O)NC#N ZNPKAOCQMDJBIK-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004451 qualitative analysis Methods 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- RWRDLPDLKQPQOW-UHFFFAOYSA-N tetrahydropyrrole Substances C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
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- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
發明領域Field of invention
實施例係關於一種聚合物薄膜,其靜態撓曲特徵、摺疊特徵及透明度極佳,且在高溫及高濕下維持極佳光學特性及機械特性。The embodiment relates to a polymer film that has excellent static flexural characteristics, folding characteristics, and transparency, and maintains excellent optical and mechanical properties under high temperature and high humidity.
發明背景Background of the invention
以聚醯亞胺為主之樹脂,諸如聚(醯胺-醯亞胺) (PAI),對摩擦、熱及化學品之抗性極佳。因此,其用於諸如此類應用:一次電絕緣、塗層、黏著劑、擠出用樹脂、耐熱漆、耐熱板、耐熱黏著劑、耐熱纖維及耐熱薄膜。Polyimide-based resins, such as poly(amide-imide) (PAI), have excellent resistance to friction, heat and chemicals. Therefore, it is used in applications such as primary electrical insulation, coatings, adhesives, extrusion resins, heat-resistant paints, heat-resistant plates, heat-resistant adhesives, heat-resistant fibers, and heat-resistant films.
聚醯亞胺在各種領域中使用。舉例而言,聚醯亞胺製成粉末形式且用作金屬或磁線之塗料。聚醯亞胺與其他添加劑混合,視其應用而定。另外,聚醯亞胺與含氟聚合物一起用作用於裝飾及防腐蝕之漆。其亦起到將含氟聚合物鍵結至金屬基板之作用。另外,聚醯亞胺用於塗佈廚具,藉助於其耐熱性及耐化學性用作用於氣體分離之膜,且用於天然氣井以便過濾諸如二氧化碳、硫化氫之污染物及雜質。Polyimide is used in various fields. For example, polyimide is made in powder form and used as a coating for metals or magnetic wires. Polyimide is mixed with other additives, depending on its application. In addition, polyimide is used together with fluoropolymer as a paint for decoration and anti-corrosion. It also serves to bond the fluoropolymer to the metal substrate. In addition, polyimide is used to coat kitchen utensils, is used as a membrane for gas separation by virtue of its heat resistance and chemical resistance, and is used in natural gas wells to filter pollutants and impurities such as carbon dioxide and hydrogen sulfide.
近年來,已開發出呈薄膜形式之聚醯亞胺,其較便宜且具有極佳光學、機械及熱特徵。此類以聚醯亞胺為主之薄膜可應用於用於有機發光二極體(OLED)或液晶顯示器(LCD)及其類似物之顯示器材料,且應用於抗反射薄膜、補償薄膜,且若實現相位差特性,則可應用於相位差薄膜。In recent years, polyimide in the form of a film has been developed, which is relatively inexpensive and has excellent optical, mechanical and thermal characteristics. Such polyimide-based films can be applied to display materials for organic light-emitting diodes (OLED) or liquid crystal displays (LCD) and the like, as well as anti-reflection films, compensation films, and if To achieve retardation characteristics, it can be applied to retardation films.
此類以聚醯亞胺為主之薄膜具有形成障壁層之問題,因為其物理特性在高溫及高濕環境下劣化。為了解決此問題,引入對濕氣具有抗性之添加劑,諸如黏土,在此情況下光學特性或相容性可能劣化。Such polyimide-based films have the problem of forming barrier layers because their physical properties deteriorate under high temperature and high humidity environments. In order to solve this problem, additives that are resistant to moisture, such as clay, are introduced, in which case the optical properties or compatibility may be deteriorated.
另外,此類以聚醯亞胺為主之薄膜具有在其已經長時期摺疊時可恢復性不良的問題。當可恢復性不良時,可產生當薄膜應用於可摺疊顯示器及其類似物時螢幕失真之問題。In addition, such polyimide-based films have the problem of poor recoverability when they have been folded for a long period of time. When the recoverability is poor, there may be a problem of screen distortion when the film is applied to a foldable display and the like.
隨著近年來可摺疊顯示器、可撓性顯示器及其類似物的積極開發,持續需要關於開發在已經長時期摺疊且隨後展開時儘可能恢復至初始狀態之特徵及耐受反覆摺疊之特徵極佳的薄膜;及具有極佳機械特性及光學特性同時在高溫及高濕環境下維持極佳物理特性的薄膜的研究。With the active development of foldable displays, flexible displays and the like in recent years, there is a continuing need for the development of features that return to the original state as much as possible when they have been folded for a long period of time and are subsequently unfolded, and features that are extremely resistant to repeated folding Films; and research on films that have excellent mechanical and optical properties while maintaining excellent physical properties under high temperature and high humidity environments.
發明概要待解決之問題 SUMMARY The problem to be solved
實施例旨在提供一種聚合物薄膜,其靜態撓曲特徵、摺疊特徵及透明度極佳,且在高溫及高濕下維持極佳光學特性及機械特性。問題之解決方案 The embodiment aims to provide a polymer film which has excellent static flexural characteristics, folding characteristics and transparency, and maintains excellent optical and mechanical properties under high temperature and high humidity. The solution to the problem
根據一實施例之聚合物薄膜包含選自由以下組成之群的聚合物樹脂:以聚醯胺為主之樹脂及以聚醯亞胺為主之樹脂,且在高壓釜處理之前的霧度(HZ0 )為3%或更低,且由以下等式1a表示之ΔHZ24 為500%或更低: [等式1a] ∆HZ24 (%) =× 100 在等式1a中, HZ0 係指該薄膜在一高壓釜中處理之前的霧度, HZ24 係指該薄膜在一高壓釜中處理之後的霧度,且該高壓釜處理意謂一高壓釜填充有水且一薄膜在其中在120℃之溫度及1.2 atm之壓力下處理24小時。The polymer film according to an embodiment includes a polymer resin selected from the group consisting of: polyamide-based resin and polyimide-based resin, and the haze (HZ) before autoclave treatment 0 ) is 3% or less, and ΔHZ 24 expressed by the following equation 1a is 500% or less: [Equation 1a] ∆HZ 24 (%) = × 100 In equation 1a, HZ 0 refers to the haze of the film before treatment in an autoclave, HZ 24 refers to the haze of the film after treatment in an autoclave, and the autoclave treatment means a The autoclave was filled with water and a film was treated therein at a temperature of 120°C and a pressure of 1.2 atm for 24 hours.
根據另一實施例之聚合物薄膜包含選自由以下組成之群的聚合物樹脂:以聚醯胺為主之樹脂及以聚醯亞胺為主之樹脂,且在高壓釜處理之前的模數(MO0 )為5 GPa或更大,且由以下等式1b表示之∆TS24 為15%或更低: [等式1b] ∆TS24 (%) =×100 在等式1b中, TS0 係指該薄膜在一高壓釜中處理之前的模數, TS24 係指該薄膜在一高壓釜中處理之後的模數,且該高壓釜處理意謂一高壓釜填充有水且一薄膜在其中在120℃之溫度及1.2 atm之壓力下處理24小時。The polymer film according to another embodiment comprises a polymer resin selected from the group consisting of: polyamide-based resin and polyimide-based resin, and the modulus before autoclave treatment ( MO 0 ) is 5 GPa or more, and ∆TS 24 expressed by the following equation 1b is 15% or less: [Equation 1b] ∆TS 24 (%) = ×100 In Equation 1b, TS 0 refers to the modulus of the film before treatment in an autoclave, TS 24 refers to the modulus of the film after treatment in an autoclave, and the autoclave treatment means a The autoclave was filled with water and a film was treated therein at a temperature of 120°C and a pressure of 1.2 atm for 24 hours.
根據再一實施例之聚合物薄膜包含選自由以下組成之群的聚合物樹脂:以聚醯胺為主之樹脂及以聚醯亞胺為主之樹脂;及丁酸。本發明之有利效果 The polymer film according to still another embodiment includes a polymer resin selected from the group consisting of: polyamide-based resin and polyimide-based resin; and butyric acid. Advantages of the present invention
根據一實施例之聚合物薄膜不僅具有極佳靜態撓曲特徵、光學特性及機械特性,而且即使在高溫及高濕之苛刻條件下亦可維持極佳光學特性及機械特性。The polymer film according to an embodiment not only has excellent static deflection characteristics, optical properties, and mechanical properties, but also maintains excellent optical properties and mechanical properties even under severe conditions of high temperature and high humidity.
另外,根據一實施例之聚合物薄膜在已經長時期摺疊且隨後藉由釋放施加至薄膜之力返回至展開狀態時可恢復性極佳。因此,當應用於可摺疊顯示器、可撓性顯示器及其類似物時,其可提供均一螢幕狀態。In addition, the polymer film according to an embodiment has excellent recoverability when it has been folded for a long period of time and then returned to the unfolded state by releasing the force applied to the film. Therefore, when applied to foldable displays, flexible displays and the like, it can provide a uniform screen state.
此外,根據一實施例之聚合物薄膜的摺疊特徵極佳,使得其可有利地應用於顯示裝置之覆蓋窗及可摺疊顯示裝置、可捲曲顯示裝置或可撓性移動裝置。In addition, the polymer film according to an embodiment has excellent folding characteristics, so that it can be advantageously applied to cover windows of display devices, foldable display devices, rollable display devices, or flexible mobile devices.
較佳實施例之詳細說明Detailed description of the preferred embodiment
在下文中,將參考附圖詳細描述實施例,使得本發明所涉及之領域內熟習此項技術者可易於實踐該等實施例。不過,實施例可以許多不同方式實施且不限於本文所描述之彼等。Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings, so that those skilled in the art in the field to which the present invention relates can easily practice the embodiments. However, the embodiments can be implemented in many different ways and are not limited to those described herein.
在本說明書通篇,在提及各薄膜、窗、面板、層或其類似物在另一薄膜、窗、面板、層或其類似物「上」或「下」形成之情況下,其不僅意謂一個元件直接在另一元件上或下形成,而且意謂一個元件間接在另一元件上或下形成,該等元件之間插入有(多個)其他元件。另外,就各元件而言之術語上或下可針對圖式提及。為了描述,附圖中個別元件之大小可誇張地描繪,且不指示實際大小。另外,在本說明書通篇,相同圖示元件符號指代相同元件。Throughout this specification, when it is mentioned that each film, window, panel, layer or the like is formed "on" or "under" another film, window, panel, layer or the like, it means not only It means that one element is directly formed on or under another element, and it means that one element is formed on or under another element indirectly, and other elements (a plurality of) are interposed between these elements. In addition, the terms "up" or "down" for each element may be referred to in the drawings. For the purpose of description, the size of individual elements in the drawings may be exaggeratedly depicted, and the actual size is not indicated. In addition, throughout this specification, the same illustrated element symbols refer to the same elements.
在本說明書通篇,當一部分被稱為「包含」一元件時,應理解,除非另外具體說明,否則可包含其他元件,而非排除其他元件。Throughout this specification, when a part is referred to as "comprising" an element, it should be understood that, unless specifically stated otherwise, other elements may be included instead of excluding other elements.
在本說明書中,除非另外規定,否則單數表述解釋為涵蓋在上下文中解釋的單數或複數數目。In this specification, unless otherwise specified, the singular expression is interpreted as covering the singular or plural number interpreted in the context.
另外,除非另外指示,否則本文所用之與組分之量、反應條件及其類似者相關的所有數字及表述應理解為經術語「約」修飾。In addition, unless otherwise indicated, all numbers and expressions used herein related to the amounts of components, reaction conditions, and the like should be understood as modified by the term "about."
術語第一、第二及其類似者在本文中用以描述各種元件,且元件不應受該等術語限制。僅出於將一個元件與另一元件區分開來的目的使用該等術語。The terms first, second and the like are used herein to describe various elements, and the elements should not be limited by these terms. These terms are used only for the purpose of distinguishing one element from another element.
另外,如本文所用之術語「經取代」意謂經至少一個選自由以下組成之群的取代基取代:氘、-F、-Cl、-Br、-I、羥基、氰基、硝基、胺基、甲脒基、肼基、腙基、酯基、酮基、羧基經取代或未經取代之烷基、經取代或未經取代之烯基、經取代或未經取代之炔基、經取代或未經取代之烷氧基、經取代或未經取代之脂環族有機基、經取代或未經取代之雜環基、經取代或未經取代之芳基及經取代或未經取代之雜芳基。以上列舉之取代基可彼此連接以形成環。聚合物薄膜 In addition, the term "substituted" as used herein means substitution with at least one substituent selected from the group consisting of deuterium, -F, -Cl, -Br, -I, hydroxyl, cyano, nitro, amine Group, formamidino group, hydrazine group, hydrazone group, ester group, keto group, substituted or unsubstituted alkyl group, substituted or unsubstituted alkenyl group, substituted or unsubstituted alkynyl group, substituted or unsubstituted alkynyl group, Substituted or unsubstituted alkoxy, substituted or unsubstituted alicyclic organic group, substituted or unsubstituted heterocyclic group, substituted or unsubstituted aryl group, and substituted or unsubstituted The heteroaryl. The substituents listed above may be connected to each other to form a ring. Polymer film
實施例提供一種聚合物薄膜,其靜態撓曲特徵、摺疊特徵、光學特性及機械特性極佳,且在高溫及高濕下維持極佳光學特性及機械特性。The embodiment provides a polymer film that has excellent static flexural characteristics, folding characteristics, optical characteristics, and mechanical characteristics, and maintains excellent optical characteristics and mechanical characteristics under high temperature and high humidity.
根據一實施例之聚合物薄膜包含選自由以下組成之群的聚合物樹脂:以聚醯胺為主之樹脂及以聚醯亞胺為主之樹脂。The polymer film according to an embodiment includes a polymer resin selected from the group consisting of polyamide-based resin and polyimide-based resin.
聚合物薄膜在高壓釜處理之前的霧度(HZ0 )為3%或更低。 The haze (HZ 0 ) of the polymer film before the autoclave treatment is 3% or less.
具體而言,在高壓釜處理之前聚合物薄膜的霧度(HZ0 )可為2.5%或更低、2.0%或更低、1.5%或更低、1.0%更低、0.8%或更低或0.6%或更低,但其不限於此。Specifically, the haze (HZ 0 ) of the polymer film before the autoclave treatment can be 2.5% or lower, 2.0% or lower, 1.5% or lower, 1.0% lower, 0.8% or lower or 0.6% or less, but it is not limited to this.
聚合物薄膜由以下等式1a表示之ΔHZ24 值為500%或更低: [等式1a] ∆HZ24 (%) =× 100 在等式1a中, HZ0 係指該薄膜在一高壓釜中處理之前的霧度, HZ24 係指該薄膜在一高壓釜中處理之後的霧度,且該高壓釜處理意謂一高壓釜填充有水且一薄膜在其中在120℃之溫度及1.2 atm之壓力下處理24小時。薄膜置於高壓釜中,該薄膜未浸沒於水中且其可經由水產生之蒸氣處理。 The ΔHZ 24 value of the polymer film expressed by the following equation 1a is 500% or less: [Equation 1a] ΔHZ 24 (%) = × 100 In equation 1a, HZ 0 refers to the haze of the film before treatment in an autoclave, HZ 24 refers to the haze of the film after treatment in an autoclave, and the autoclave treatment means a The autoclave was filled with water and a film was treated therein at a temperature of 120°C and a pressure of 1.2 atm for 24 hours. The film is placed in an autoclave, the film is not immersed in water and it can be treated with steam generated by water.
具體而言,由以上等式1a呈現之聚合物薄膜的∆HZ24 值可為400%或更低、300%或更低、250%或更低或200%或更低,但其不限於此。 Specifically, the ∆HZ 24 value of the polymer film represented by the above equation 1a may be 400% or lower, 300% or lower, 250% or lower, or 200% or lower, but it is not limited to this .
若聚合物薄膜在高壓釜處理之前的霧度(HZ0 )及由以上等式1a表示之ΔHZ24 在以上範圍內,則薄膜可具有極佳耐久性,尤其光學特性幾乎不改變,即使在高溫及高濕之苛刻條件下亦如此。藉助於此等特徵,其可有利地應用於用於顯示器之前面板及顯示裝置。 If the haze (HZ 0 ) of the polymer film before the autoclave treatment and the ΔHZ 24 represented by the above equation 1a are within the above range, the film can have excellent durability, especially the optical properties hardly change, even at high temperatures And under severe conditions of high humidity. By virtue of these features, it can be advantageously applied to front panels and display devices used in displays.
聚合物薄膜在高壓釜處理之前的黃色指數(YI0 )為3或更小。The yellow index (YI 0 ) of the polymer film before autoclave treatment is 3 or less.
具體而言,在高壓釜處理之前聚合物薄膜的黃色指數(YI0 )可為2.8或更小,或2.7%或更小,但其不限於此。Specifically, the yellow index (YI 0 ) of the polymer film before the autoclave treatment may be 2.8 or less, or 2.7% or less, but it is not limited thereto.
聚合物薄膜在高壓釜處理之前的平面內相位差(Ro0 )為180 nm或更小。The in-plane phase difference (Ro 0 ) of the polymer film before the autoclave treatment is 180 nm or less.
具體而言,在高壓釜處理之前聚合物薄膜之平面內相位差(Ro0 )可為170 nm或更小、160 nm或更小、150 nm或更小、10 nm至160 nm、20 nm至160 nm、50 nm至160 nm或80 nm至150 nm,但其不限於此。Specifically, the in-plane phase difference (Ro 0 ) of the polymer film before the autoclave treatment can be 170 nm or less, 160 nm or less, 150 nm or less, 10 nm to 160 nm, 20 nm to 160 nm, 50 nm to 160 nm, or 80 nm to 150 nm, but it is not limited thereto.
聚合物薄膜由以下等式2a表示之∆YI24 值為30%或更低: [等式2a] ∆YI24 (%) =× 100 在等式2a中, YI0 係指該薄膜在一高壓釜中處理之前的黃色指數, YI24 係指該薄膜在一高壓釜中處理之後的黃色指數,且該高壓釜處理意謂一高壓釜填充有水且一薄膜在其中在120℃之溫度及1.2 atm之壓力下處理24小時。薄膜置於高壓釜中,該薄膜未浸沒於水中且其可經由水產生之蒸氣處理。 The ∆YI 24 value of the polymer film expressed by the following equation 2a is 30% or less: [Equation 2a] ∆YI 24 (%) = × 100 In Equation 2a, YI 0 refers to the yellow index of the film before treatment in an autoclave, YI 24 refers to the yellow index of the film after treatment in an autoclave, and the autoclave treatment means a The autoclave was filled with water and a film was treated therein at a temperature of 120°C and a pressure of 1.2 atm for 24 hours. The film is placed in an autoclave, the film is not immersed in water and it can be treated with steam generated by water.
具體而言,由以上等式2a呈現之聚合物薄膜的∆YI24 值可為25%或更低、20%或更低、15%或更低、10%或更低或5%或更低,但其不限於此。 Specifically, the ∆YI 24 value of the polymer film represented by the above equation 2a can be 25% or lower, 20% or lower, 15% or lower, 10% or lower or 5% or lower , But it is not limited to this.
聚合物薄膜由以下等式3a表示之∆Ro24 值為8%或更低: [等式3a] ∆Ro24 (%) =× 100 在等式3a中, Ro0 係指該薄膜在一高壓釜中處理之前的平面內相位差, Ro24 係指該薄膜在一高壓釜中處理之後的平面內相位差,且該高壓釜處理意謂一高壓釜填充有水且一薄膜在其中在120℃之溫度及1.2 atm之壓力下處理24小時。薄膜置於高壓釜中,該薄膜未浸沒於水中且其可經由水產生之蒸氣處理。 The ∆Ro 24 value of polymer film expressed by the following equation 3a is 8% or less: [Equation 3a] ∆Ro 24 (%) = × 100 In Equation 3a, Ro 0 refers to the in-plane phase difference of the film before being processed in an autoclave, Ro 24 refers to the in-plane phase difference of the film after being processed in an autoclave, and the autoclave Treatment means that an autoclave is filled with water and a film is treated therein at a temperature of 120°C and a pressure of 1.2 atm for 24 hours. The film is placed in an autoclave, the film is not immersed in water and it can be treated with steam generated by water.
具體而言,由以上等式3a表示之聚合物薄膜的∆Ro24 值可為7%或更低、6%或更低、5%或更低或4.8%或更低,但其不限於此。 Specifically, the ∆Ro 24 value of the polymer film represented by the above equation 3a may be 7% or lower, 6% or lower, 5% or lower, or 4.8% or lower, but it is not limited to this .
聚合物薄膜在高壓釜中處理24小時之後的霧度(HZ24 )為3%或更低。該高壓釜處理意謂一高壓釜填充有水且一薄膜在其中在120℃之溫度及1.2 atm之壓力下處理24小時。薄膜置於高壓釜中,該薄膜未浸沒於水中且其可經由水產生之蒸氣處理。 The haze (HZ 24 ) of the polymer film after being treated in an autoclave for 24 hours is 3% or less. The autoclave treatment means that an autoclave is filled with water and a film is treated therein at a temperature of 120° C. and a pressure of 1.2 atm for 24 hours. The film is placed in an autoclave, the film is not immersed in water and it can be treated with steam generated by water.
具體而言,聚合物薄膜在高壓釜中處理24小時之後的霧度(HZ24 )可為2.5%或更低、2.0%或更低、1.8%或更低或1.6%或更低,但其不限於此。 Specifically, the haze (HZ 24 ) of the polymer film after being treated in an autoclave for 24 hours can be 2.5% or lower, 2.0% or lower, 1.8% or lower, or 1.6% or lower, but its Not limited to this.
聚合物薄膜在高壓釜中處理24小時之後的黃色指數(YI24 )為3或更小。該高壓釜處理意謂一高壓釜填充有水且一薄膜在其中在120℃之溫度及1.2 atm之壓力下處理24小時。薄膜置於高壓釜中,該薄膜未浸沒於水中且其可經由水產生之蒸氣處理。 The yellow index (YI 24 ) of the polymer film after being treated in the autoclave for 24 hours was 3 or less. The autoclave treatment means that an autoclave is filled with water and a film is treated therein at a temperature of 120° C. and a pressure of 1.2 atm for 24 hours. The film is placed in an autoclave, the film is not immersed in water and it can be treated with steam generated by water.
具體而言,聚合物薄膜在高壓釜中處理24小時之後的黃色指數(YI24 )可為2.8或更小或2.7或更小,但其不限於此。 Specifically, the yellow index (YI 24 ) of the polymer film after being processed in the autoclave for 24 hours may be 2.8 or less or 2.7 or less, but it is not limited thereto.
特定而言,若聚合物薄膜在高壓釜中處理24小時之後的黃色指數(YI24 )超過以上範圍,則透明度在高溫及高濕環境中劣化,使得該薄膜不適合應用於前面板或顯示裝置。此外,由於螢幕呈現淺藍色及黑暗,因此產生消耗較多電力來維持較亮螢幕以對此進行補償的問題。 Specifically, if the yellow index (YI 24 ) of the polymer film after 24 hours of treatment in an autoclave exceeds the above range, the transparency deteriorates in a high temperature and high humidity environment, making the film unsuitable for use in front panels or display devices. In addition, since the screen is light blue and dark, it consumes more power to maintain a brighter screen to compensate for this problem.
聚合物薄膜在高壓釜中處理24小時之後的平面內相位差(Ro24 )為180 nm或更小。該高壓釜處理意謂一高壓釜填充有水且一薄膜在其中在120℃之溫度及1.2 atm之壓力下處理24小時。薄膜置於高壓釜中,該薄膜未浸沒於水中且其可經由水產生之蒸氣處理。 The in-plane retardation (Ro 24 ) of the polymer film after being treated in an autoclave for 24 hours was 180 nm or less. The autoclave treatment means that an autoclave is filled with water and a film is treated therein at a temperature of 120° C. and a pressure of 1.2 atm for 24 hours. The film is placed in an autoclave, the film is not immersed in water and it can be treated with steam generated by water.
具體而言,聚合物薄膜在高壓釜中處理24小時之後的平面內相位差(Ro24 )可為160 nm或更小、150 nm或更小、145 nm或更小、20 nm至160 nm、40 nm至150 nm或60 nm至145 nm,但其不限於此。 Specifically, the in-plane phase difference (Ro 24 ) of the polymer film after being treated in an autoclave for 24 hours can be 160 nm or less, 150 nm or less, 145 nm or less, 20 nm to 160 nm, 40 nm to 150 nm or 60 nm to 145 nm, but it is not limited thereto.
特定而言,由於根據一實施例之聚合物薄膜具有低∆HZ24 值、低∆YI24 值及低∆Ro24 值,因此其可在高溫及高濕之苛刻條件下維持極佳光學特性。因此,其可有利地應用於顯示裝置。即使當聚合物薄膜所應用於之顯示裝置在高濕或高溫區域中使用時,仍有可能實現透明且清潔的螢幕。In particular, since the polymer film according to an embodiment has a low ∆HZ 24 value, a low ∆YI 24 value, and a low ∆Ro 24 value, it can maintain excellent optical properties under severe conditions of high temperature and high humidity. Therefore, it can be advantageously applied to a display device. Even when the display device to which the polymer film is applied is used in a high humidity or high temperature area, it is still possible to realize a transparent and clean screen.
此外,由於根據一實施例之聚合物薄膜具有以上範圍內之HZ0 、YI0 、Ro0 、HZ24 、YI24 、Ro24 、∆HZ24 、∆YI24 及∆Ro24 值,因此有可能不僅實現清潔光學特性而且實現極佳摺疊特徵。因此,其可有利地應用於可摺疊顯示裝置或可撓性移動裝置。In addition, since the polymer film according to an embodiment has HZ 0 , YI 0 , Ro 0 , HZ 24 , YI 24 , Ro 24 , ∆HZ 24 , ∆YI 24 and ∆Ro 24 values within the above range, it is possible Not only achieves clean optical characteristics but also achieves excellent folding characteristics. Therefore, it can be advantageously applied to a foldable display device or a flexible mobile device.
聚合物薄膜在高壓釜處理之前的抗拉強度(TS0 )為20公斤力/平方毫米或更大。The tensile strength (TS 0 ) of the polymer film before autoclave treatment is 20 kgf/mm2 or more.
具體而言,聚合物薄膜在高壓釜處理之前的抗拉強度(TS0 )為20公斤力/平方毫米至35公斤力/平方毫米。替代地,聚合物薄膜在高壓釜處理之前的抗拉強度(TS0 )可為21公斤力/平方毫米或更大,但其不限於此。Specifically, the tensile strength (TS 0 ) of the polymer film before the autoclave treatment is 20 kgf/mm² to 35 kgf/mm². Alternatively, the tensile strength (TS 0 ) of the polymer film before the autoclave treatment may be 21 kgf/mm2 or more, but it is not limited thereto.
聚合物薄膜在高壓釜處理之前的斷裂伸長率(EL0 )為15%或更高。The elongation at break (EL 0 ) of the polymer film before autoclave treatment is 15% or higher.
具體而言,聚合物薄膜在高壓釜處理之前的斷裂伸長率(EL0 )為15%至40%。替代地,聚合物薄膜在高壓釜處理之前的斷裂伸長率(EL0 )可為17%或更高、18%或更高、19%或更高或20%或更高,但其不限於此。Specifically, the elongation at break (EL 0 ) of the polymer film before autoclave treatment is 15% to 40%. Alternatively, the elongation at break (EL 0 ) of the polymer film before the autoclave treatment may be 17% or higher, 18% or higher, 19% or higher, or 20% or higher, but it is not limited thereto .
聚合物薄膜在高壓釜處理之前的模數(MO0 )為5.0 GPa或更大。 The modulus (MO 0 ) of the polymer film before autoclave treatment is 5.0 GPa or more.
具體而言,聚合物薄膜在高壓釜處理之前的模數(MO0 )為5 GPa至10 GPa。替代地,聚合物薄膜在高壓釜處理之前的模數(MO0 )可為5.2 GPa或更大、5.3 GPa或更大或5.5 GPa或更大,但其不限於此。Specifically, the modulus (MO 0 ) of the polymer film before autoclave treatment is 5 GPa to 10 GPa. Alternatively, the modulus (MO 0 ) of the polymer film before the autoclave treatment may be 5.2 GPa or more, 5.3 GPa or more, or 5.5 GPa or more, but it is not limited thereto.
聚合物薄膜由以下等式1b表示之∆TS24 值為15%或更低。 [等式1b] ∆TS24 (%) =× 100The polymer film has a ΔTS 24 value of 15% or less expressed by the following equation 1b. [Equation 1b] ∆TS 24 (%) = × 100
在等式1b中,TS0 係指該薄膜在一高壓釜中處理之前的抗拉強度,TS24 係指該薄膜在一高壓釜中處理之後的抗拉強度,且該高壓釜處理意謂一高壓釜填充有水且一薄膜在其中在120℃之溫度及1.2 atm之壓力下處理24小時。薄膜置於高壓釜中,該薄膜未浸沒於水中且其可經由水產生之蒸氣處理。In Equation 1b, TS 0 refers to the tensile strength of the film before treatment in an autoclave, TS 24 refers to the tensile strength of the film after treatment in an autoclave, and the autoclave treatment means a The autoclave was filled with water and a film was treated therein at a temperature of 120°C and a pressure of 1.2 atm for 24 hours. The film is placed in an autoclave, the film is not immersed in water and it can be treated with steam generated by water.
具體而言,TS24 為20公斤力/平方毫米或更大。Specifically, TS 24 is 20 kgf/mm2 or more.
另外,聚合物薄膜之TS24 可為12%或更低、10%或更低或8.5%或更低,但其不限於此。In addition, the TS 24 of the polymer film may be 12% or lower, 10% or lower, or 8.5% or lower, but it is not limited thereto.
聚合物薄膜由以下等式2b表示之∆EL24 值為30%或更低。 [等式2b] ∆EL24 (%) =× 100The polymer film has a ΔEL 24 value of 30% or less expressed by the following equation 2b. [Equation 2b] ∆EL 24 (%) = × 100
在等式2b中,EL0 係指該薄膜在一高壓釜中處理之前的斷裂伸長率,EL24 係指該薄膜在一高壓釜中處理之後的斷裂伸長率,且該高壓釜處理意謂一高壓釜填充有水且一薄膜在其中在120℃之溫度及1.2 atm之壓力下處理24小時。薄膜置於高壓釜中,該薄膜未浸沒於水中且其可經由水產生之蒸氣處理。In Equation 2b, EL 0 refers to the elongation at break of the film before treatment in an autoclave, EL 24 refers to the elongation at break of the film after treatment in an autoclave, and the autoclave treatment means a The autoclave was filled with water and a film was treated therein at a temperature of 120°C and a pressure of 1.2 atm for 24 hours. The film is placed in an autoclave, the film is not immersed in water and it can be treated with steam generated by water.
具體而言,EL24 係15%或更高。替代地,EL24 可為17%或更高或20%或更高,但其不限於此。Specifically, EL 24 is 15% or higher. Alternatively, the EL 24 may be 17% or higher or 20% or higher, but it is not limited thereto.
另外,聚合物薄膜之EL24 值可為28%或更低或25%或更低,但其不限於此。In addition, the EL 24 value of the polymer film may be 28% or lower or 25% or lower, but it is not limited thereto.
聚合物薄膜由以下等式3b表示之∆MO24 值為15%或更低。 [等式3b] ∆MO24 (%) =× 100The polymer film has a ∆MO 24 value of 15% or less expressed by the following equation 3b. [Equation 3b] ∆MO 24 (%) = × 100
在等式3b中,MO0 係指該薄膜在一高壓釜中處理之前的模數,MO24 係指該薄膜在一高壓釜中處理之後的模數,且該高壓釜處理意謂一高壓釜填充有水且一薄膜在其中在120℃之溫度及1.2 atm之壓力下處理24小時。薄膜置於高壓釜中,該薄膜未浸沒於水中且其可經由水產生之蒸氣處理。In Equation 3b, MO 0 refers to the modulus of the film before treatment in an autoclave, MO 24 refers to the modulus of the film after treatment in an autoclave, and the autoclave treatment means an autoclave Filled with water and a film is treated therein at a temperature of 120°C and a pressure of 1.2 atm for 24 hours. The film is placed in an autoclave, the film is not immersed in water and it can be treated with steam generated by water.
具體而言,MO24 為15%或更高。替代地,MO24 可為5 GPa或更大、5.1 GPa或更大、5.5 GPa或6.0 GPa或更大,但其不限於此。Specifically, MO 24 is 15% or higher. Alternatively, the MO 24 may be 5 GPa or more, 5.1 GPa or more, 5.5 GPa or 6.0 GPa or more, but it is not limited thereto.
另外,聚合物薄膜之MO24 值可為12%或更低或10%或更低,但其不限於此。In addition, the MO 24 value of the polymer film may be 12% or lower or 10% or lower, but it is not limited thereto.
聚合物薄膜之∆SUM24 值為60%或更低。此處,∆SUM24 值為表示∆TS24 、∆EL24 及∆MO24 之總和的值。The ∆SUM 24 value of polymer film is 60% or lower. Here, ΔSUM 24 value represents 24, ΔEL 24 and the sum of the value of ΔTS of ΔMO 24.
具體而言,聚合物薄膜之∆SUM24 值可為50%或更低、40%或更低、或35%或更低,但其不限於此。Specifically, the ΔSUM 24 value of the polymer film may be 50% or lower, 40% or lower, or 35% or lower, but it is not limited thereto.
由於聚合物薄膜的∆TS24 、∆EL24 、∆MO24 及∆SUM24 值滿足以上範圍,因此薄膜即使在高溫及高濕下亦具有極佳耐久性,且物理特性幾乎不變形。因此,其可有利地應用於前面板及顯示裝置。Since ΔTS polymer film 24, ΔEL 24, ΔMO 24 and ΔSUM 24 value satisfies the above range, the film also has excellent durability even under high temperature and high humidity, and the physical properties hardly deformed. Therefore, it can be advantageously applied to front panels and display devices.
聚合物薄膜由以下等式4b表示之∆TS72 值為60%或更低。 [等式4b] ∆TS72 (%) =× 100The polymer film has a ΔTS 72 value of 60% or less expressed by the following equation 4b. [Equation 4b] ∆TS 72 (%) = × 100
在等式4b中,TS0 係指該薄膜在一高壓釜中處理之前的抗拉強度,TS72 係指該薄膜在一高壓釜中處理之後的抗拉強度,且該高壓釜處理意謂一高壓釜填充有水且一薄膜在其中在120℃之溫度及1.2 atm之壓力下處理72小時。薄膜置於高壓釜中,該薄膜未浸沒於水中且其可經由水產生之蒸氣處理。In Equation 4b, TS 0 refers to the tensile strength of the film before treatment in an autoclave, TS 72 refers to the tensile strength of the film after treatment in an autoclave, and the autoclave treatment means a The autoclave was filled with water and a film was treated therein at a temperature of 120°C and a pressure of 1.2 atm for 72 hours. The film is placed in an autoclave, the film is not immersed in water and it can be treated with steam generated by water.
具體而言,TS72 為5公斤力/平方毫米或更大、8公斤力/平方毫米或更大或9公斤力/平方毫米或更大。Specifically, the TS 72 is 5 kgf/mm2 or more, 8 kgf/mm2 or more, or 9 kgf/mm2 or more.
另外,聚合物薄膜之TS72 值可為50%或更低、40%或更低或30%或更低,但其不限於此。In addition, the TS 72 value of the polymer film may be 50% or lower, 40% or lower, or 30% or lower, but it is not limited thereto.
聚合物薄膜由以下等式5b表示之∆EL72 值為50%或更低。 [等式5b] ∆EL72 (%) =× 100 The ΔEL 72 value of the polymer film expressed by the following equation 5b is 50% or lower. [Equation 5b] ∆EL 72 (%) = × 100
在等式5b中,EL0 係指該薄膜在一高壓釜中處理之前的斷裂伸長率,EL72 係指該薄膜在一高壓釜中處理之後的斷裂伸長率,且該高壓釜處理意謂一高壓釜填充有水且一薄膜在其中在120℃之溫度及1.2 atm之壓力下處理72小時。薄膜置於高壓釜中,該薄膜未浸沒於水中且其可經由水產生之蒸氣處理。In Equation 5b, EL 0 refers to the elongation at break of the film before treatment in an autoclave, EL 72 refers to the elongation at break of the film after treatment in an autoclave, and the autoclave treatment means a The autoclave was filled with water and a film was treated therein at a temperature of 120°C and a pressure of 1.2 atm for 72 hours. The film is placed in an autoclave, the film is not immersed in water and it can be treated with steam generated by water.
具體而言,EL72 值為8%或更高、10%或更高或12%或更高。Specifically, the EL 72 value is 8% or higher, 10% or higher, or 12% or higher.
另外,聚合物薄膜之∆ EL72 值可為45%或更低或40%或更低,但其不限於此。In addition, the Δ EL 72 value of the polymer film can be 45% or lower or 40% or lower, but it is not limited to this.
聚合物薄膜由以下等式6b表示之∆MO72 值為60%或更低。 [等式6b] ∆MO72 (%) =× 100The polymer film has a ∆MO 72 value of 60% or less expressed by the following equation 6b. [Equation 6b] ∆MO 72 (%) = × 100
在等式6b中,MO0 係指該薄膜在一高壓釜中處理之前的模數,MO72 係指該薄膜在一高壓釜中處理之後的模數,且該高壓釜處理意謂一高壓釜填充有水且一薄膜在其中在120℃之溫度及1.2 atm之壓力下處理72小時。薄膜置於高壓釜中,該薄膜未浸沒於水中且其可經由水產生之蒸氣處理。In Equation 6b, MO 0 refers to the modulus of the film before treatment in an autoclave, MO 72 refers to the modulus of the film after treatment in an autoclave, and the autoclave treatment means an autoclave Filled with water and a film is treated therein at a temperature of 120°C and a pressure of 1.2 atm for 72 hours. The film is placed in an autoclave, the film is not immersed in water and it can be treated with steam generated by water.
具體而言,MO72 值為2 GPa或更大或2.5 GPa或更大。Specifically, the MO 72 value is 2 GPa or more or 2.5 GPa or more.
另外,聚合物薄膜之∆MO72 值可為50%或更低、40%或更低、30%或更低或20%或更低,但其不限於此。In addition, the ΔMO 72 value of the polymer film can be 50% or lower, 40% or lower, 30% or lower, or 20% or lower, but it is not limited thereto.
聚合物薄膜之∆SUM72 值為160%或更低。此處,∆SUM72 值為表示∆TS72 、∆EL72 及∆MO72 之總和的值。The ∆SUM 72 value of polymer film is 160% or lower. Here, ΔSUM 72 is represented, and the sum of the values of ΔEL ΔMO 72 of 72 ΔTS 72.
具體而言,聚合物薄膜之∆SUM72 值可為150%或更低、120%或更低、100%或更低或90%或更低,但其不限於此。Specifically, the ΔSUM 72 value of the polymer film can be 150% or lower, 120% or lower, 100% or lower, or 90% or lower, but it is not limited thereto.
由於聚合物薄膜之∆TS72 、∆EL72 、∆MO72 及∆SUM72 值滿足以上範圍,因此薄膜即使在高溫及高濕下亦具有極佳耐久性,且物理特性幾乎不變形。因此,其可有利地應用於前面板及顯示裝置。Since ΔTS of polymeric film 72, ΔEL 72, ΔMO 72 and ΔSUM 72 value satisfies the above range, the film also has excellent durability even under high temperature and high humidity, and the physical properties hardly deformed. Therefore, it can be advantageously applied to front panels and display devices.
當基於50 μm厚度的根據一實施例之聚合物薄膜經摺疊以具有3 mm曲率半徑時,斷裂之前的摺疊數為100,000次或更多。When the polymer film according to an embodiment based on a thickness of 50 μm is folded to have a radius of curvature of 3 mm, the number of folds before breaking is 100,000 times or more.
當薄膜經摺疊以具有3 mm曲率半徑且隨後展開時,摺疊數計數為一。When the film is folded to have a radius of curvature of 3 mm and then unfolded, the number of folds is counted as one.
由於聚合物薄膜之摺疊數滿足以上範圍,因此其可有利地應用於可摺疊顯示裝置或可撓性顯示裝置。Since the number of folds of the polymer film satisfies the above range, it can be advantageously applied to a foldable display device or a flexible display device.
當基於50 μm厚度的根據另一實施例之聚合物薄膜經摺疊以具有2 mm曲率半徑時,斷裂之前的摺疊數為200,000次或更多。When the polymer film according to another embodiment based on a thickness of 50 μm is folded to have a radius of curvature of 2 mm, the number of folds before breaking is 200,000 times or more.
當薄膜經摺疊以具有2 mm曲率半徑且隨後展開時,摺疊數計數為一。When the film is folded to have a radius of curvature of 2 mm and then unfolded, the number of folds is counted as one.
根據一實施例之聚合物薄膜其中具有2,500 ppm或更小或1,200 ppm或更小的殘餘溶劑含量。The polymer film according to an embodiment has therein a residual solvent content of 2,500 ppm or less or 1,200 ppm or less.
舉例而言,殘餘溶劑含量可為2,200 ppm或更小、2,000 ppm或更小、1,800 ppm或更小、1,500 ppm或更小、1,000 ppm或更小、800 ppm或更小、500 ppm或更小、1 ppm至1,000 ppm、1 ppm至800 ppm、1 ppm至500 ppm、5 ppm至1,000 ppm、10 ppm至1,000 ppm或20 ppm至1,000 ppm,但其不限於此。For example, the residual solvent content can be 2,200 ppm or less, 2,000 ppm or less, 1,800 ppm or less, 1,500 ppm or less, 1,000 ppm or less, 800 ppm or less, 500 ppm or less , 1 ppm to 1,000 ppm, 1 ppm to 800 ppm, 1 ppm to 500 ppm, 5 ppm to 1,000 ppm, 10 ppm to 1,000 ppm, or 20 ppm to 1,000 ppm, but it is not limited thereto.
殘餘溶劑含量係指未在薄膜產生期間揮發的溶劑之量且在最終產生之薄膜中繼續存在。The residual solvent content refers to the amount of solvent that did not volatilize during the film production and continues to exist in the final film.
若聚合物薄膜中之殘餘溶劑含量超過以上範圍,則在高溫及高濕條件下之薄膜耐久性及光學特性可能劣化,其尤其可能對薄膜之後續加工產生影響。具體而言,若殘餘溶劑含量超過以上範圍,則薄膜水解加快,導致機械特性或光學特性劣化。另外,若聚合物薄膜中之殘餘溶劑含量超過以上範圍,則薄膜之耐久性可能劣化,其可能對如上文所描述之靜態撓曲特徵及摺疊特徵產生影響。If the residual solvent content in the polymer film exceeds the above range, the durability and optical properties of the film under high temperature and high humidity conditions may be deteriorated, which may especially affect the subsequent processing of the film. Specifically, if the residual solvent content exceeds the above range, the hydrolysis of the film is accelerated, resulting in deterioration of mechanical properties or optical properties. In addition, if the residual solvent content in the polymer film exceeds the above range, the durability of the film may be deteriorated, which may affect the static flexural characteristics and folding characteristics as described above.
根據一實施例之聚合物薄膜由以下等式7表示之IS值為5至160。 [等式7] IS = IM + The IS value of the polymer film according to an embodiment is represented by the following equation 7 from 5 to 160. [Equation 7] IS = IM +
在等式7中,IM表示當該薄膜中醯亞胺重複單元及醯胺重複單元之總莫耳數係100時,該醯亞胺重複單元的莫耳數;且RS表示該薄膜中之殘餘溶劑含量(ppm)。In Equation 7, IM represents the molar number of the amide repeating unit when the total molar number of the amide repeating unit and the amide repeating unit in the film is 100; and RS represents the residue in the film Solvent content (ppm).
舉例而言,IS值可為5至150、10至150、30至150、50至150、5至80、5至60或5至50,但其不限於此。For example, the IS value may be 5 to 150, 10 to 150, 30 to 150, 50 to 150, 5 to 80, 5 to 60, or 5 to 50, but it is not limited thereto.
若聚合物薄膜之IS值滿足以上範圍,則即使在高溫及高濕之苛刻條件下處理後薄膜亦可具有極佳光學特性及耐久性,且具有極佳摺疊特徵。If the IS value of the polymer film satisfies the above range, the film can have excellent optical properties and durability even under severe conditions of high temperature and high humidity, and have excellent folding characteristics.
特定而言,若由於醯亞胺含量(IM)高或殘餘溶劑含量(RS)高而超過以上範圍,則薄膜之長期耐久性快速劣化。體而言,若醯亞胺含量過高且醯胺含量由此相對降低,則薄膜之吸濕性降低,使得其可能在高濕度條件下具有易受損特性。In particular, if the content of imine (IM) or the content of residual solvent (RS) is high and exceeds the above range, the long-term durability of the film rapidly deteriorates. In general, if the content of imine is too high and the content of amide is thus relatively reduced, the hygroscopicity of the film will be reduced, making it likely to be vulnerable to damage under high humidity conditions.
聚合物薄膜由以下等式8表示之CT值為10或更小。 [等式8] CT =× 在等式8中, HZ0 係指該薄膜在一高壓釜中處理之前的霧度,The CT value of the polymer film represented by the following equation 8 is 10 or less. [Equation 8] CT = X In Equation 8, HZ 0 refers to the haze of the film before being processed in an autoclave,
HZ24 係指該薄膜在一高壓釜中處理之後的霧度,且該高壓釜處理意謂一高壓釜填充有水且一薄膜在其中在120℃之溫度及1.2 atm之壓力下處理24小時。薄膜置於高壓釜中,該薄膜未浸沒於水中且其可經由水產生之蒸氣處理。HZ 24 refers to the haze of the film after treatment in an autoclave, and the autoclave treatment means that an autoclave is filled with water and a film is treated therein at a temperature of 120° C. and a pressure of 1.2 atm for 24 hours. The film is placed in an autoclave, the film is not immersed in water and it can be treated with steam generated by water.
另外,Ro0 係指該薄膜在一高壓釜中處理之前的平面內相位差。In addition, Ro 0 refers to the in-plane phase difference of the film before being processed in an autoclave.
CT可為指示耐熱性/耐濕性之指數,其反映結晶度。聚合物薄膜之結晶度愈高,ΔHZ24 可能愈低。亦即,聚合物薄膜之結晶度愈高,聚合物薄膜之耐熱性/耐濕性愈高。聚合物薄膜之結晶度愈高,聚合物薄膜之平面內相位差(Ro0 )可能愈高且光學特性可能愈低。CT can be an index indicating heat resistance/moisture resistance, which reflects crystallinity. The higher the crystallinity of the polymer film, the lower the ΔHZ 24 may be. That is, the higher the crystallinity of the polymer film, the higher the heat resistance/moisture resistance of the polymer film. The higher the crystallinity of the polymer film, the higher the in-plane retardation (Ro 0 ) of the polymer film may be and the lower the optical properties may be.
由於聚合物薄膜在適當製程中用適當組成製備,因此其可具有增強之光學特性及增強之耐熱性/耐濕性。舉例而言,聚合物薄膜用相對高醯胺含量、低殘餘溶劑含量、諸如丁酸之添加劑且在適當製程(諸如乾燥步驟及熱處理步驟)中製備。因此,聚合物薄膜可降低ΔHZ24 ,同時降低平面內相位差。Since the polymer film is prepared with the proper composition in the proper manufacturing process, it can have enhanced optical properties and enhanced heat resistance/moisture resistance. For example, polymer films are prepared with relatively high amide content, low residual solvent content, additives such as butyric acid, and in appropriate manufacturing processes (such as drying steps and heat treatment steps). Therefore, the polymer film can reduce the ΔHZ 24 and at the same time reduce the in-plane phase difference.
因此,CT值可為10或更小。CT可為8或更小。CT可為6或更小。CT可為4或更小。CT可為4或更小。CT可為3或更小。CT可為2或更小。Therefore, the CT value can be 10 or less. CT can be 8 or less. CT can be 6 or less. CT can be 4 or less. CT can be 4 or less. CT can be 3 or less. CT can be 2 or less.
由於聚合物薄膜具有低CT值,因此其可具有增強之耐熱性/耐濕性及增強之光學特性。因此,聚合物薄膜可有利地用於顯示器。具體而言,聚合物薄膜可有利地應用於對苛刻外部條件(諸如濕氣及/或熱量)敏感的移動顯示裝置。特定而言,聚合物薄膜可有利地應用於用於可摺疊顯示器之前面板。Since the polymer film has a low CT value, it can have enhanced heat resistance/humidity resistance and enhanced optical properties. Therefore, the polymer film can be advantageously used for displays. In particular, the polymer film can be advantageously applied to mobile display devices that are sensitive to harsh external conditions (such as moisture and/or heat). In particular, the polymer film can be advantageously applied to the front panel of a foldable display.
除聚合物樹脂外,根據一實施例之聚合物薄膜包含丁酸。In addition to the polymer resin, the polymer film according to an embodiment contains butyric acid.
根據一實施例之聚合物薄膜包含聚合物樹脂及丁酸。聚合物樹脂包含選自由以下組成之群的聚合物樹脂:以聚醯胺為主之樹脂及以聚醯亞胺為主之樹脂。聚合物薄膜包含聚合物樹脂,且聚合物樹脂包含多個醯亞胺重複單元。The polymer film according to an embodiment includes a polymer resin and butyric acid. The polymer resin includes polymer resins selected from the group consisting of polyamide-based resins and polyimide-based resins. The polymer film includes a polymer resin, and the polymer resin includes a plurality of imine repeating units.
丁酸由以下式T表示。 [式T] Butyric acid is represented by the following formula T. [Formula T]
具體而言,丁酸係指由以上式T表示之化合物。其不指代丁酸的一部分經取代之形式、丁酸之衍生物、鹽或酸酐。Specifically, butyric acid refers to the compound represented by formula T above. It does not refer to a partially substituted form of butyric acid, derivatives, salts or anhydrides of butyric acid.
聚合物薄膜包含丁酸,且基於聚合物薄膜之總重量計,薄膜中所含有之丁酸呈1 ppm至1,200 ppm之量。The polymer film contains butyric acid, and based on the total weight of the polymer film, the butyric acid contained in the film is in an amount of 1 ppm to 1,200 ppm.
具體而言,丁酸可以以下量含於薄膜中:1 ppm至1,000 ppm、5 ppm至1,000 ppm、10 ppm至1,000 ppm、50 ppm至1,000 ppm、100 ppm至1,000 ppm、500 ppm至1,000 ppm、1 ppm至800 ppm、1 ppm至700 ppm、1 ppm至500 ppm、1 ppm至300 ppm、10 ppm至300 ppm、30 ppm至300 ppm或50 ppm至270 ppm,但其不限於此。Specifically, butyric acid can be contained in the film in the following amounts: 1 ppm to 1,000 ppm, 5 ppm to 1,000 ppm, 10 ppm to 1,000 ppm, 50 ppm to 1,000 ppm, 100 ppm to 1,000 ppm, 500 ppm to 1,000 ppm, 1 ppm to 800 ppm, 1 ppm to 700 ppm, 1 ppm to 500 ppm, 1 ppm to 300 ppm, 10 ppm to 300 ppm, 30 ppm to 300 ppm, or 50 ppm to 270 ppm, but it is not limited thereto.
含量係指未在薄膜產生期間揮發的溶劑之量且在最終產生之薄膜中繼續存在的丁酸之量。The content refers to the amount of solvent that did not volatilize during film production and the amount of butyric acid that continues to exist in the final film produced.
若聚合物薄膜中之丁酸含量超過以上範圍,則可產生在高壓釜處理後一些物質可能在薄膜上溶離之問題,其快速提高薄膜霧度。If the content of butyric acid in the polymer film exceeds the above range, there may be a problem that some substances may dissolve on the film after autoclave treatment, which quickly increases the film haze.
丁酸可為在製備薄膜之製程中作為pH調整劑添加之丁酸的殘餘物,或可為由其他反應產生之副產物,但其不限於此。亦即,在最終薄膜中繼續存在的丁酸可能由各種過程產生。The butyric acid may be the residue of butyric acid added as a pH adjuster in the process of preparing the film, or may be a by-product produced by other reactions, but it is not limited thereto. That is, the butyric acid that continues to exist in the final film may be produced by various processes.
由於丁酸在聚合物薄膜中繼續存在,因此薄膜在已經長時期摺疊且隨後藉由釋放施加至薄膜之力返回至展開狀態時可恢復性極佳,且摺疊特徵極佳。因此,其可有利地應用於可摺疊顯示器、可撓性顯示器、可捲曲顯示器及其類似物。Since butyric acid continues to exist in the polymer film, the film has excellent recoverability and excellent folding characteristics when the film has been folded for a long period of time and then returned to the unfolded state by releasing the force applied to the film. Therefore, it can be advantageously applied to foldable displays, flexible displays, rollable displays and the like.
若在聚合物薄膜中繼續存在的丁酸含量超過以上範圍,則薄膜之靜態撓曲特徵及摺疊特徵可能劣化,且諸如透射率及黃色指數之光學特性亦可能劣化。If the content of butyric acid that continues to exist in the polymer film exceeds the above range, the static flexural characteristics and folding characteristics of the film may be degraded, and optical properties such as transmittance and yellow index may also be degraded.
當基於50 μm厚度的根據一實施例之聚合物薄膜經摺疊以具有2 mm曲率半徑,隨後薄膜在25℃下靜置24小時,且釋放施加至薄膜之力時,薄膜之內角為120°或更大。When the polymer film according to an embodiment based on a thickness of 50 μm is folded to have a radius of curvature of 2 mm, and then the film is allowed to stand at 25°C for 24 hours, and the force applied to the film is released, the inner angle of the film is 120° Or bigger.
具體而言,當基於50 μm厚度的根據一實施例之聚合物薄膜經摺疊以具有2 mm曲率半徑,隨後薄膜在25℃下靜置24小時,且釋放施加至薄膜之力時,薄膜之內角可為125°或更大、130°或更大或135°或更大,但其不限於此。Specifically, when the polymer film according to an embodiment based on a thickness of 50 μm is folded to have a radius of curvature of 2 mm, and then the film is allowed to stand at 25° C. for 24 hours, and the force applied to the film is released, the inside of the film The angle may be 125° or more, 130° or more, or 135° or more, but it is not limited thereto.
習知薄膜易受外部按壓損壞。特定而言,當其已經長時期摺疊時顯著變形。因此,當應用於顯示裝置時,其不展示均一螢幕狀態,導致螢幕失真之問題。具體而言,當基於50 μm厚度的習知薄膜經摺疊以具有2 mm曲率半徑,隨後薄膜在25℃下靜置24小時,且釋放施加至薄膜之力時,薄膜之內角小於120°,具體而言小於115°,導致靜態撓曲特徵的劣化。The conventional film is easily damaged by external pressure. In particular, it deforms significantly when it has been folded for a long period of time. Therefore, when applied to a display device, it does not display a uniform screen state, resulting in a problem of screen distortion. Specifically, when a conventional film based on a thickness of 50 μm is folded to have a radius of curvature of 2 mm, and then the film is allowed to stand at 25°C for 24 hours, and the force applied to the film is released, the inner angle of the film is less than 120°, Specifically, it is less than 115°, resulting in deterioration of static deflection characteristics.
相比之下,由於根據一實施例之聚合物薄膜在以上測試後內角為120°或更大,因此與習知薄膜相比,其確保極佳可恢復性。當其經歷後續製程(例如,其應用於可摺疊顯示器或可撓性顯示器)時,螢幕失真之問題得到解決。In contrast, since the polymer film according to an embodiment has an internal angle of 120° or more after the above test, it ensures excellent recoverability compared to conventional films. When it undergoes subsequent manufacturing processes (for example, it is applied to a foldable display or a flexible display), the problem of screen distortion is solved.
在另一實施例中,聚合物薄膜在MD方向上以1.01至1.15倍之拉伸比拉伸。In another embodiment, the polymer film is stretched at a stretching ratio of 1.01 to 1.15 times in the MD direction.
若根據一實施例之聚合物薄膜在MD方向上之拉伸比滿足以上範圍,則其在已經長時期摺疊且隨後藉由釋放施加至薄膜之力返回至展開狀態時幾乎不變形,摺疊特徵極佳,且抵抗物理衝擊之耐久性極佳。具體而言,拉伸經由定向造成薄膜中結晶,藉此有可能獲得撓曲抗性極佳之薄膜。If the stretch ratio of the polymer film in the MD direction according to an embodiment satisfies the above range, it will hardly deform when it has been folded for a long period of time and then returns to the unfolded state by releasing the force applied to the film, and the folding characteristic is extremely Good, and excellent durability against physical shocks. Specifically, stretching causes crystallization in the film through orientation, thereby making it possible to obtain a film with excellent flex resistance.
若根據一實施例之聚合物薄膜在MD方向上的拉伸比超過以上範圍,則薄膜之可恢復性尤其劣化,且難以實現所需物理特性。If the stretch ratio of the polymer film in the MD direction according to an embodiment exceeds the above range, the recoverability of the film is particularly deteriorated, and it is difficult to achieve desired physical properties.
以聚醯胺為主之樹脂為含有醯胺重複單元的樹脂。以聚醯亞胺為主之樹脂為含有醯亞胺重複單元的樹脂。Polyamide-based resins are resins containing repeating units of amides. Polyimine-based resins are resins containing repeating units of imines.
另外,包含醯亞胺重複單元及醯胺重複單元的樹脂可被稱作以聚醯胺為主之樹脂且可被稱作以聚醯亞胺為主之樹脂。In addition, a resin containing an amide repeating unit and an amide repeating unit may be referred to as a polyimide-based resin and may be referred to as a polyimide-based resin.
舉例而言,聚合物樹脂可為包含以聚醯胺為主之樹脂的樹脂、包含以聚醯亞胺為主之樹脂的樹脂或包含以聚醯胺為主之樹脂及以聚醯亞胺為主之樹脂二者的樹脂。For example, the polymer resin may be a resin containing a polyimide-based resin, a resin containing a polyimide-based resin, or a polyimide-based resin and a polyimide-based resin. The main resin is the resin of both.
根據一實施例之聚合物薄膜包含藉由使二胺化合物、二酐化合物及任擇地二羰基化合物聚合而製備之聚合物樹脂。The polymer film according to an embodiment includes a polymer resin prepared by polymerizing a diamine compound, a dianhydride compound, and optionally a dicarbonyl compound.
作為一實施例,二酐化合物與二羰基化合物之莫耳比為2:98至50:50、5:95至50:50、10:90至50:50、2:98至25:75、2:98至15:85、20:80至100:0、25:75至100:0、30:70至100:0、40:60至100:0或50:50至100:0。As an example, the molar ratio of the dianhydride compound to the dicarbonyl compound is 2:98 to 50:50, 5:95 to 50:50, 10:90 to 50:50, 2:98 to 25:75, 2 : 98 to 15:85, 20:80 to 100:0, 25:75 to 100:0, 30:70 to 100:0, 40:60 to 100:0, or 50:50 to 100:0.
若二酐化合物與二羰基化合物之莫耳比在以上範圍內,則可獲得在高溫及高濕環境中具有極佳光學特性及高耐久性之薄膜。另外,有可能獲得在已經長時期摺疊且隨後藉由釋放施加至薄膜之力返回至展開狀態時可恢復性極佳,且摺疊特徵極佳的透明薄膜。If the molar ratio of the dianhydride compound to the dicarbonyl compound is within the above range, a film with excellent optical properties and high durability in a high temperature and high humidity environment can be obtained. In addition, it is possible to obtain a transparent film having excellent recoverability and excellent folding characteristics when it has been folded for a long period of time and then returned to the unfolded state by releasing the force applied to the film.
作為另一實施例,二酐化合物可由一種、二種或更多種類型構成,且二羰基化合物可由零種、一種、二種或更多種類型構成。As another example, the dianhydride compound may be composed of one, two or more types, and the dicarbonyl compound may be composed of zero, one, two or more types.
聚合物樹脂包含衍生自二胺化合物與二酐化合物聚合之醯亞胺重複單元,及衍生自二胺化合物與二羰基化合物聚合之醯胺重複單元。The polymer resin includes an amide repeating unit derived from the polymerization of a diamine compound and a dianhydride compound, and an amide repeating unit derived from the polymerization of a diamine compound and a dicarbonyl compound.
此處,聚合物樹脂可按以下莫耳比包含醯亞胺重複單元及醯胺重複單元:2:98至50:50、5:95至50:50、10:90至50:50、2:98至25:75、2:98至15:85、20:80至100:0、25:75至100:0、30:70至100:0、40:60至100:0或50:50至100:0,但其不限於此。Here, the polymer resin may contain amide repeating units and amide repeating units in the following molar ratios: 2:98 to 50:50, 5:95 to 50:50, 10:90 to 50:50, 2: 98 to 25:75, 2:98 to 15:85, 20:80 to 100:0, 25:75 to 100:0, 30:70 to 100:0, 40:60 to 100:0 or 50:50 to 100:0, but it is not limited to this.
二胺化合物為與二酐化合物形成醯亞胺鍵且與二羰基化合物形成醯胺鍵以藉此形成共聚物之化合物。The diamine compound is a compound that forms an amide bond with the dianhydride compound and forms an amide bond with the dicarbonyl compound to thereby form a copolymer.
二胺化合物不受特別限制,但其可為例如含有芳族結構之芳族二胺化合物。舉例而言,二胺化合物可為由以下式1表示之化合物。 [式1] 在式1中,The diamine compound is not particularly limited, but it may be, for example, an aromatic diamine compound containing an aromatic structure. For example, the diamine compound may be a compound represented by Formula 1 below. [Formula 1] In Equation 1,
E可選自經取代或未經取代之二價C6 -C30 脂族環基、經取代或未經取代之二價C4 -C30 雜脂族環基、經取代或未經取代之二價C6 -C30 芳族環基、經取代或未經取代之二價C4 -C30 雜芳族環基、經取代或未經取代之C1 -C30 伸烷基、經取代或未經取代之C2 -C30 伸烯基、經取代或未經取代之C2 -C30 伸炔基、-O-、-S-、-C(=O)-、-CH(OH)-、-S(=O)2 -、-Si(CH3 )2 -、-C(CH3 )2 -及-C(CF3 )2 -。E can be selected from substituted or unsubstituted divalent C 6 -C 30 aliphatic cyclic groups, substituted or unsubstituted divalent C 4 -C 30 heteroaliphatic cyclic groups, substituted or unsubstituted Divalent C 6 -C 30 aromatic ring group, substituted or unsubstituted divalent C 4 -C 30 heteroaromatic ring group, substituted or unsubstituted C 1 -C 30 alkylene group, substituted Or unsubstituted C 2 -C 30 alkenylene, substituted or unsubstituted C 2 -C 30 alkynylene, -O-, -S-, -C(=O)-, -CH(OH )-, -S(=O) 2 -, -Si(CH 3 ) 2 -, -C(CH 3 ) 2 -and -C(CF 3 ) 2 -.
e選自1至5之整數。當e為2或更大時,E可彼此相同或不同。e is selected from an integer of 1 to 5. When e is 2 or greater, E may be the same or different from each other.
式1中之(E)e 可選自由以下式1-1a至1-14a表示之基團,但其不限於此。 (E) e in Formula 1 can be selected from the groups represented by the following Formulae 1-1a to 1-14a, but it is not limited thereto.
具體而言,式1中之(E)e 可選自由以下式1-1b至1-13b表示之基團,但其不限於此。 Specifically, (E) e in Formula 1 can be selected from the groups represented by the following Formulas 1-1b to 1-13b, but it is not limited thereto.
更具體而言,式1中之(E)e 可為由以上式1-6b表示之基團或由以上式1-9b表示之基團。More specifically, (E) e in Formula 1 may be a group represented by Formula 1-6b above or a group represented by Formula 1-9b above.
在一實施例中,二胺化合物可包含具有含氟取代基之化合物或具有醚基(-O-)之化合物。In one embodiment, the diamine compound may include a compound having a fluorine-containing substituent or a compound having an ether group (-O-).
二胺化合物可由具有含氟取代基之化合物構成。在此類情況下,含氟取代基可為氟化烴基且具體而言可為三氟甲基。但其不限於此。The diamine compound may be composed of a compound having a fluorine-containing substituent. In such cases, the fluorine-containing substituent may be a fluorinated hydrocarbon group and specifically may be a trifluoromethyl group. But it is not limited to this.
在另一實施例中,一種類別之二胺化合物可用作二胺化合物。亦即,二胺化合物可由單一組分構成。In another embodiment, one type of diamine compound can be used as the diamine compound. That is, the diamine compound may be composed of a single component.
舉例而言,二胺化合物可包含由以下式表示之2,2'-雙(三氟甲基)-4,4'-二胺基聯苯(TFDB),但其不限於此。 For example, the diamine compound may include 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl (TFDB) represented by the following formula, but it is not limited thereto.
替代地,二胺化合物可包含TFMB及4,4'-氧基二苯胺(ODA),但其不限於此。Alternatively, the diamine compound may include TFMB and 4,4'-oxydiphenylamine (ODA), but it is not limited thereto.
二酐化合物之雙折射率值低,使得其可有助於增強包含聚合物樹脂之薄膜的光學特性,諸如透射率。聚合物樹脂係指含有醯亞胺重複單元之樹脂。The dianhydride compound has a low birefringence value, so that it can contribute to enhancing the optical properties of the polymer resin-containing film, such as transmittance. Polymer resin refers to a resin containing imidine repeating units.
二酐化合物不受特別限制,但其可為例如含有芳族結構之芳族二酐化合物或含有脂環族結構之脂環族二酐化合物。The dianhydride compound is not particularly limited, but it may be, for example, an aromatic dianhydride compound containing an aromatic structure or an alicyclic dianhydride compound containing an alicyclic structure.
舉例而言,芳族二酐化合物可為由以下式2表示之化合物。 [式2] For example, the aromatic dianhydride compound may be a compound represented by Formula 2 below. [Equation 2]
在式2中,G可由選自以下之鍵結基團鍵結:經取代或未經取代之四價C6 -C30 脂族環基、經取代或未經取代之四價C4 -C30 雜脂族環基、經取代或未經取代之四價C6 -C30 芳族環基、經取代或未經取代之四價C4 -C30 雜芳族環基,其中脂族環基、雜脂族環基、芳族環基或雜芳族環基可單獨存在或可彼此鍵結以形成稠環,經取代或未經取代之C1 -C30 伸烷基、經取代或未經取代之C2 -C30 伸烯基、經取代或未經取代之C2 -C30 伸炔基、-O-、-S-、-C(=O)-、-CH(OH)-、-S(=O)2 -、-Si(CH3 )2 -、-C(CH3 )2 -及-C(CF3 )2 -。In formula 2, G can be bonded by a bonding group selected from the group consisting of: substituted or unsubstituted tetravalent C 6 -C 30 aliphatic cyclic group, substituted or unsubstituted tetravalent C 4 -C 30 heteroaliphatic ring group, substituted or unsubstituted tetravalent C 6 -C 30 aromatic ring group, substituted or unsubstituted tetravalent C 4 -C 30 heteroaromatic ring group, wherein the aliphatic ring Group, heteroaliphatic ring group, aromatic ring group or heteroaromatic ring group may exist alone or may be bonded to each other to form a condensed ring, substituted or unsubstituted C 1 -C 30 alkylene, substituted or Unsubstituted C 2 -C 30 alkenylene, substituted or unsubstituted C 2 -C 30 alkynylene, -O-, -S-, -C(=O)-, -CH(OH) -, -S(=O) 2 -, -Si(CH 3 ) 2 -, -C(CH 3 ) 2 -and -C(CF 3 ) 2 -.
式2中之G可選自由以下式2-1a至2-9a表示之基團,但其不限於此。 G in Formula 2 can be selected from the groups represented by the following Formulae 2-1a to 2-9a, but it is not limited thereto.
舉例而言,式2中之G可為由以上式2-2a表示之基團、由以上式2-8a表示之基團或由以上式2-9a表示之基團。For example, G in Formula 2 may be a group represented by Formula 2-2a above, a group represented by Formula 2-8a above, or a group represented by Formula 2-9a above.
另外,脂環族二酐化合物可包含具有環丁烷結構之化合物。具體而言,脂環族二酐化合物可為環丁烷-1,2,3,4-四甲酸二酐(CBDA),但其不限於此。In addition, the alicyclic dianhydride compound may include a compound having a cyclobutane structure. Specifically, the alicyclic dianhydride compound may be cyclobutane-1,2,3,4-tetracarboxylic dianhydride (CBDA), but it is not limited thereto.
在另一實施例中,二酐化合物可包含具有含氟取代基之化合物、具有聯苯基之化合物、具有酮基之化合物或具有環丁烷基之化合物。In another embodiment, the dianhydride compound may include a compound having a fluorine-containing substituent, a compound having a biphenyl group, a compound having a keto group, or a compound having a cyclobutane group.
二酐化合物可由具有含氟取代基之化合物構成。在此類情況下,含氟取代基可為氟化烴基且具體而言可為三氟甲基。但其不限於此。The dianhydride compound may be composed of a compound having a fluorine-containing substituent. In such cases, the fluorine-containing substituent may be a fluorinated hydrocarbon group and specifically may be a trifluoromethyl group. But it is not limited to this.
在另一實施例中,二酐化合物可由單一組分或二種或更多種組分之混合物構成。In another embodiment, the dianhydride compound may be composed of a single component or a mixture of two or more components.
舉例而言,二酐化合物可包含由以下式表示之2,2'-雙-(3,4-二羧基苯基)六氟丙烷二酐(6FDA),但其不限於此。 For example, the dianhydride compound may include 2,2'-bis-(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) represented by the following formula, but it is not limited thereto.
二胺化合物及二酐化合物可聚合以形成聚醯胺酸。The diamine compound and the dianhydride compound can be polymerized to form polyamide acid.
隨後,聚醯胺酸可經由脫水反應轉化為聚醯亞胺,且聚醯亞胺包含醯亞胺重複單元。Subsequently, the polyimide can be converted into polyimine through a dehydration reaction, and the polyimine includes an imine repeating unit.
聚醯亞胺可形成由以下式A表示之重複單元。 [式A] Polyimine can form a repeating unit represented by the following formula A. [Formula A]
在式A中,E、G及e如上文所描述。In formula A, E, G, and e are as described above.
舉例而言,聚醯亞胺可包含由以下式A-1表示之重複單元,但其不限於此。 [式A-1] For example, the polyimide may include a repeating unit represented by the following formula A-1, but it is not limited thereto. [Formula A-1]
在式A-1中,n為1至400之整數。In formula A-1, n is an integer from 1 to 400.
二羰基化合物不受特別限制,但其可為例如由以下式3表示之化合物。 [式3] 在式3中,The dicarbonyl compound is not particularly limited, but it may be, for example, a compound represented by Formula 3 below. [Equation 3] In Equation 3,
J可選自經取代或未經取代之二價C6 -C30 脂族環基、經取代或未經取代之二價C4 -C30 雜脂族環基、經取代或未經取代之二價C6 -C30 芳族環基、經取代或未經取代之二價C4 -C30 雜芳族環基、經取代或未經取代之C1 -C30 伸烷基、經取代或未經取代之C2 -C30 伸烯基、經取代或未經取代之C2 -C30 伸炔基、-O-、-S-、-C(=O)-、-CH(OH)-、-S(=O)2 -、-Si(CH3 )2 -、-C(CH3 )2 -及-C(CF3 )2 -。J can be selected from substituted or unsubstituted divalent C 6 -C 30 aliphatic cyclic group, substituted or unsubstituted divalent C 4 -C 30 heteroaliphatic cyclic group, substituted or unsubstituted Divalent C 6 -C 30 aromatic ring group, substituted or unsubstituted divalent C 4 -C 30 heteroaromatic ring group, substituted or unsubstituted C 1 -C 30 alkylene group, substituted Or unsubstituted C 2 -C 30 alkenylene, substituted or unsubstituted C 2 -C 30 alkynylene, -O-, -S-, -C(=O)-, -CH(OH )-, -S(=O) 2 -, -Si(CH 3 ) 2 -, -C(CH 3 ) 2 -and -C(CF 3 ) 2 -.
j選自1至5之整數。當j為2或更大時,J可彼此相同或不同。j is selected from an integer of 1 to 5. When j is 2 or greater, J may be the same or different from each other.
X為鹵素原子。具體而言,X可為F、Cl、Br、I或其類似物。更具體而言,X可為Cl,但其不限於此。X is a halogen atom. Specifically, X may be F, Cl, Br, I, or the like. More specifically, X may be Cl, but it is not limited thereto.
式3中之(J)j 可選自由以下式3-1a至3-14a表示之基團,但其不限於此。 (J) j in Formula 3 can be selected from the groups represented by the following Formulae 3-1a to 3-14a, but it is not limited thereto.
具體而言,式3中之(J)j 可選自由以下式3-1b至3-8b表示之基團,但其不限於此。 Specifically, (J) j in Formula 3 can be selected from the groups represented by the following Formulae 3-1b to 3-8b, but it is not limited thereto.
更具體而言,式3中之(J)j 可為由以上式3-1b表示之基團、由以上式3-2b表示之基團、由以上式3-3b表示之基團或由以上式3-8b表示之基團。More specifically, (J) j in Formula 3 may be a group represented by the above formula 3-1b, a group represented by the above formula 3-2b, a group represented by the above formula 3-3b, or a group represented by the above formula 3-3b or The group represented by formula 3-8b.
在一實施例中,一種類型之二羰基化合物或彼此不同的至少二種類型之二羰基化合物之混合物可用作二羰基化合物。若使用二種或更多種二羰基化合物,則其中以上式3中之(J)j 選自由以上式3-1b至3-8b表示之基團的至少二種二羰基化合物可用作二羰基化合物。In one embodiment, one type of dicarbonyl compound or a mixture of at least two types of dicarbonyl compounds different from each other can be used as the dicarbonyl compound. If two or more dicarbonyl compounds are used, at least two dicarbonyl compounds in which (J) j in the above formula 3 is selected from the groups represented by the above formulas 3-1b to 3-8b can be used as the dicarbonyl group Compound.
在另一實施例中,二羰基化合物可為含有芳族結構之芳族二羰基化合物。In another embodiment, the dicarbonyl compound may be an aromatic dicarbonyl compound containing an aromatic structure.
舉例而言,二羰基化合物可包含第一二羰基化合物及/或第二二羰基化合物。For example, the dicarbonyl compound may include a first dicarbonyl compound and/or a second dicarbonyl compound.
第一二羰基化合物及第二二羰基化合物可分別為芳族二羰基化合物。The first dicarbonyl compound and the second dicarbonyl compound may be aromatic dicarbonyl compounds, respectively.
第一二羰基化合物及第二二羰基化合物可為彼此不同之化合物。The first dicarbonyl compound and the second dicarbonyl compound may be different compounds from each other.
舉例而言,第一二羰基化合物及第二二羰基化合物可為彼此不同之芳族二羰基化合物,但其不限於此。For example, the first dicarbonyl compound and the second dicarbonyl compound may be different aromatic dicarbonyl compounds from each other, but they are not limited thereto.
若第一二羰基化合物及第二二羰基化合物分別為芳族二羰基化合物,則其包含苯環。因此,其可促成由此產生之包含聚醯胺-醯亞胺樹脂之薄膜的機械特性(諸如表面硬度及抗拉強度)改良。If the first dicarbonyl compound and the second dicarbonyl compound are respectively aromatic dicarbonyl compounds, they include a benzene ring. Therefore, it can contribute to the improvement of the mechanical properties (such as surface hardness and tensile strength) of the resulting polyamide-imide resin-containing film.
二羰基化合物可包含如由以下式表示之對酞醯氯(TPC)、1,1'-聯苯-4,4'-二羰基二氯化物(BPDC)、異酞醯氯(IPC),或其組合。但其不限於此。 The dicarbonyl compound may include terephthaloyl chloride (TPC), 1,1'-biphenyl-4,4'-dicarbonyl dichloride (BPDC), isophthaloyl chloride (IPC) as represented by the following formula, or Its combination. But it is not limited to this.
舉例而言,第一二羰基化合物可包含BPDC,且第二二羰基化合物可包含TPC,但其不限於此。For example, the first dicarbonyl compound may include BPDC, and the second dicarbonyl compound may include TPC, but it is not limited thereto.
若以適當組合將BPDC用作第一二羰基化合物且將TPC用作第二二羰基化合物,則由此產生之包含聚醯胺-醯亞胺樹脂的薄膜可具有高抗氧化性。If BPDC is used as the first dicarbonyl compound and TPC is used as the second dicarbonyl compound in an appropriate combination, the resulting film containing polyamide-imide resin can have high oxidation resistance.
替代地,第一二羰基化合物可包含IPC,且第二二羰基化合物可包含TPC,但其不限於此。Alternatively, the first dicarbonyl compound may include IPC, and the second dicarbonyl compound may include TPC, but it is not limited thereto.
若以適當組合將IPC用作第一二羰基化合物且將TPC用作第二二羰基化合物,則由此產生之包含聚醯胺-醯亞胺樹脂的薄膜不僅可具有高抗氧化性,而且由於可降低成本亦為經濟的。If IPC is used as the first dicarbonyl compound and TPC is used as the second dicarbonyl compound in an appropriate combination, the resulting film containing polyamide-imide resin can not only have high oxidation resistance, but also It is also economical to reduce costs.
二胺化合物及二羰基化合物可聚合以形成由以下式B表示之重複單元。 [式B] The diamine compound and the dicarbonyl compound can be polymerized to form a repeating unit represented by the following formula B. [Formula B]
在式B中,E、J、e及j如上文所描述。In formula B, E, J, e, and j are as described above.
舉例而言,二胺化合物及二羰基化合物可聚合以形成由以下式B-1及B-2表示之醯胺重複單元。For example, diamine compounds and dicarbonyl compounds can be polymerized to form amide repeating units represented by the following formulas B-1 and B-2.
替代地,二胺化合物及二羰基化合物可聚合以形成由以下式B-2及B-3表示之醯胺重複單元。 [式B-1] Alternatively, the diamine compound and the dicarbonyl compound may be polymerized to form amide repeating units represented by the following formulas B-2 and B-3. [Formula B-1]
在式B-1中,x為1至400之整數。 [式B-2] In formula B-1, x is an integer from 1 to 400. [Formula B-2]
在式B-2中,y為1至400之整數。 [式B-3] In formula B-2, y is an integer from 1 to 400. [Formula B-3]
在式B-3中,y為1至400之整數。 根據一實施例,聚合物樹脂可包含由以下式A表示之重複單元及任擇地由以下式B表示之重複單元: [式A] [式B] 在式A及B中, E及J各自獨立地選自經取代或未經取代之二價C6 -C30 脂族環基、經取代或未經取代之二價C4 -C30 雜脂族環基、經取代或未經取代之二價C6 -C30 芳族環基、經取代或未經取代之二價C4 -C30 雜芳族環基、經取代或未經取代之C1 -C30 伸烷基、經取代或未經取代之C2 -C30 伸烯基、經取代或未經取代之C2 -C30 伸炔基、-O-、-S-、-C(=O)-、-CH(OH)-、-S(=O)2 -、-Si(CH3 )2 -、-C(CH3 )2 -及C(CF3 )2 -, e及j各自獨立地選自1至5之整數, 當e為2或更大時,則二個或更多個E彼此相同或不同, 當j為2或更大時,則二個或更多個J彼此相同或不同,In formula B-3, y is an integer from 1 to 400. According to an embodiment, the polymer resin may include a repeating unit represented by the following formula A and optionally a repeating unit represented by the following formula B: [Formula A] [Formula B] In formulas A and B, E and J are each independently selected from substituted or unsubstituted divalent C 6 -C 30 aliphatic cyclic groups, substituted or unsubstituted divalent C 4 -C 30 heterolipids Group ring group, substituted or unsubstituted divalent C 6 -C 30 aromatic ring group, substituted or unsubstituted divalent C 4 -C 30 heteroaromatic ring group, substituted or unsubstituted C 1 -C 30 alkylene, substituted or unsubstituted C 2 -C 30 alkenylene, substituted or unsubstituted C 2 -C 30 alkynylene, -O-, -S-,- C(=O)-, -CH(OH)-, -S(=O) 2 -, -Si(CH 3 ) 2 -, -C(CH 3 ) 2 -and C(CF 3 ) 2 -, e And j are each independently selected from an integer of 1 to 5. When e is 2 or greater, then two or more Es are the same or different from each other, and when j is 2 or greater, then two or more J are the same or different from each other,
G可由選自以下之鍵結基團鍵結:經取代或未經取代之四價C6 -C30 脂族環基、經取代或未經取代之四價C4 -C30 雜脂族環基、經取代或未經取代之四價C6 -C30 芳族環基、經取代或未經取代之四價C4 -C30 雜芳族環基,其中脂族環基、雜脂族環基、芳族環基或雜芳族環基可單獨存在或可彼此鍵結以形成稠環,經取代或未經取代之C1 -C30 伸烷基、經取代或未經取代之C2 -C30 伸烯基、經取代或未經取代之C2 -C30 伸炔基、-O-、-S-、-C(=O)-、-CH(OH)-、-S(=O)2 -、-Si(CH3 )2 -、-C(CH3 )2 -及-C(CF3 )2 -。G can be bonded by a bonding group selected from: substituted or unsubstituted tetravalent C 6 -C 30 aliphatic ring group, substituted or unsubstituted tetravalent C 4 -C 30 heteroaliphatic ring Group, substituted or unsubstituted tetravalent C 6 -C 30 aromatic ring group, substituted or unsubstituted tetravalent C 4 -C 30 heteroaromatic ring group, of which aliphatic ring group, heteroaliphatic The cyclic group, aromatic ring group or heteroaromatic ring group may exist alone or may be bonded to each other to form a fused ring, substituted or unsubstituted C 1 -C 30 alkylene, substituted or unsubstituted C 2 -C 30 alkenylene, substituted or unsubstituted C 2 -C 30 alkynylene, -O-, -S-, -C(=O)-, -CH(OH)-, -S( =O) 2 -, -Si(CH 3 ) 2 -, -C(CH 3 ) 2 -and -C(CF 3 ) 2 -.
聚合物樹脂可按以下莫耳比包含由以下式A表示之重複單元及由以下式B表示之重複單元:2:98至50:50、5:95至50:50、10:90至50:50、2:98至25:75、2:98至15:85、20:80至100:0、25:75至100:0、30:70至100:0、40:60至100:0或50:50至100:0,但其不限於此。The polymer resin may comprise the repeating unit represented by the following formula A and the repeating unit represented by the following formula B in the following molar ratios: 2:98 to 50:50, 5:95 to 50:50, 10:90 to 50: 50, 2:98 to 25:75, 2:98 to 15:85, 20:80 to 100:0, 25:75 to 100:0, 30:70 to 100:0, 40:60 to 100:0 or 50:50 to 100:0, but it is not limited to this.
若由以上式A表示之重複單元與由以上式B表示之重複單元的莫耳比在以上範圍內,則聚合物薄膜摺疊特徵極佳且在高溫及高濕下光學特性及機械特性極佳。If the molar ratio of the repeating unit represented by the above formula A to the repeating unit represented by the above formula B is within the above range, the polymer film has excellent folding characteristics and excellent optical and mechanical properties under high temperature and high humidity.
具體而言,由以上式B表示之重複單元中存在的CONH結構與OH基團具有高親和力,藉此展示吸引濕氣之極佳吸濕性,藉此具有滑動特性。因此,有可能實現在高溫及高濕下機械特性及光學特性幾乎不劣化的薄膜。Specifically, the CONH structure and the OH group present in the repeating unit represented by the above formula B have high affinity, thereby exhibiting excellent hygroscopicity for attracting moisture, thereby having sliding properties. Therefore, it is possible to realize a film that hardly deteriorates mechanical properties and optical properties under high temperature and high humidity.
根據另一實施例,聚合物薄膜可進一步包含填充劑。According to another embodiment, the polymer film may further include a filler.
填充劑可為選自由以下組成之群之至少一者:硫酸鋇、二氧化矽及碳酸鈣。由於聚合物薄膜包含填充劑,因此有可能不僅增強粗糙度及可捲繞性,而且增強改良由薄膜製備中之滑動引起之刮痕的效果。The filler may be at least one selected from the group consisting of barium sulfate, silicon dioxide, and calcium carbonate. Since the polymer film contains fillers, it is possible not only to enhance roughness and windability, but also to enhance the effect of improving scratches caused by sliding during film preparation.
另外,填充劑之粒徑可為0.01 μm至1.0 μm或0.01 μm至小於1.0 μm。舉例而言,填充劑之粒徑可為0.05 μm至0.9 μm、0.1 μm至0.8 μm、0.1 μm至0.5 μm或0.1 μm至0.3 μm,但其不限於此。In addition, the particle size of the filler may be 0.01 μm to 1.0 μm or 0.01 μm to less than 1.0 μm. For example, the particle size of the filler may be 0.05 μm to 0.9 μm, 0.1 μm to 0.8 μm, 0.1 μm to 0.5 μm, or 0.1 μm to 0.3 μm, but it is not limited thereto.
基於聚合物薄膜之總重量計,聚合物薄膜可包含呈0.01至3.5重量%、0.01至3重量%或0.01至2.5重量%之量的填充劑。Based on the total weight of the polymer film, the polymer film may include a filler in an amount of 0.01 to 3.5% by weight, 0.01 to 3% by weight, or 0.01 to 2.5% by weight.
聚合物薄膜之透射率可為80%或更高。舉例而言,透射率可為85%或更高、88%或更高、89%或更高、80%至99%、85%至99%或88%至99%。The transmittance of the polymer film can be 80% or higher. For example, the transmittance may be 85% or higher, 88% or higher, 89% or higher, 80% to 99%, 85% to 99%, or 88% to 99%.
聚合物薄膜之黃色指數為5或更小。舉例而言,黃色指數可為4或更小或3.5或更小,但其不限於此。The yellow index of the polymer film is 5 or less. For example, the yellow index may be 4 or less or 3.5 or less, but it is not limited thereto.
聚合物薄膜之霧度為2%或更低,具體而言,霧度可為1.8%或更低、1.5%或更低、1%或更低、0.8%或更低或0.5%或更低,但其不限於此。The haze of the polymer film is 2% or lower, specifically, the haze can be 1.8% or lower, 1.5% or lower, 1% or lower, 0.8% or lower or 0.5% or lower , But it is not limited to this.
聚合物薄膜之模數為4.0 GPa或更大、4.2 GPa或更大、4.5 GPa或更大或5.0 GPa或更大。具體而言,模數可為5.5 GPa或更大、6.0 GPa或更大、6.2 GPa或更大或6.0 GPa至8.0 GPa,但其不限於此。The modulus of the polymer film is 4.0 GPa or more, 4.2 GPa or more, 4.5 GPa or more, or 5.0 GPa or more. Specifically, the modulus may be 5.5 GPa or more, 6.0 GPa or more, 6.2 GPa or more, or 6.0 GPa to 8.0 GPa, but it is not limited thereto.
聚合物薄膜之抗壓強度為0.3公斤力/微米或更大。具體而言,抗壓強度可為0.4公斤力/微米或更大、0.45公斤力/微米或更大或0.48公斤力/微米或更大,但其不限於此。The compressive strength of the polymer film is 0.3 kgf/micron or more. Specifically, the compressive strength may be 0.4 kgf/μm or more, 0.45 kgf/μm or more, or 0.48 kgf/μm or more, but it is not limited thereto.
當以UTM壓縮模式使用2.5 mm球形尖端以10毫米/分鐘之速率對聚合物薄膜進行穿孔時,包括裂痕之穿孔的最大直徑(mm)為65 mm或更小。具體而言,穿孔之最大直徑可為60 mm或更小、5至60 mm、10至60 mm、15至60 mm、20至60 mm、25至60 mm或25至58 mm,但其不限於此。When the polymer film is perforated with a 2.5 mm spherical tip in the UTM compression mode at a rate of 10 mm/min, the maximum diameter (mm) of the perforation including cracks is 65 mm or less. Specifically, the maximum diameter of the perforation may be 60 mm or less, 5 to 60 mm, 10 to 60 mm, 15 to 60 mm, 20 to 60 mm, 25 to 60 mm, or 25 to 58 mm, but it is not limited to this.
聚合物薄膜之表面硬度為HB或更高。具體而言,表面硬度可為H或更高,或2H或更高,但其不限於此。The surface hardness of the polymer film is HB or higher. Specifically, the surface hardness may be H or higher, or 2H or higher, but it is not limited thereto.
聚合物薄膜之抗拉強度為14公斤力/平方毫米或更大。具體而言,抗拉強度可為15公斤力/平方毫米或更大、16公斤力/平方毫米或更大、18公斤力/平方毫米或更大、20公斤力/平方毫米或更大、21公斤力/平方毫米或更大或22公斤力/平方毫米或更大,但其不限於此。The tensile strength of the polymer film is 14 kgf/mm2 or more. Specifically, the tensile strength can be 15 kgf/mm2 or more, 16 kgf/mm2 or more, 18 kgf/mm2 or more, 20 kgf/mm2 or more, 21 Kilogram force/square millimeter or more or 22 kilogram force/square millimeter or more, but it is not limited thereto.
聚合物薄膜之伸長率為13%或更高。具體而言,伸長率可為15%或更高、16%或更高、17%或更高或17.5%或更高,但其不限於此。The elongation of the polymer film is 13% or higher. Specifically, the elongation may be 15% or higher, 16% or higher, 17% or higher, or 17.5% or higher, but it is not limited thereto.
根據一實施例之聚合物薄膜可確保就低霧度及黃色指數(YI)而言之極佳光學特性,及就高模數、抗壓強度、穿孔最大直徑、表面硬度、抗拉強度及伸長率而言之極佳機械特性,以及極佳摺疊特徵及在高溫及高濕下之極佳光學特性及機械特性。因此,有可能將長期穩定之機械特性及光學特性賦予需要就模數、伸長率、拉伸特徵、彈性恢復力及撓曲抗性而言之可撓性的基板。The polymer film according to an embodiment can ensure excellent optical properties in terms of low haze and yellow index (YI), and in terms of high modulus, compressive strength, maximum perforation diameter, surface hardness, tensile strength and elongation In terms of efficiency, it has excellent mechanical properties, excellent folding characteristics, and excellent optical and mechanical properties under high temperature and high humidity. Therefore, it is possible to impart long-term stable mechanical properties and optical properties to a substrate that requires flexibility in terms of modulus, elongation, tensile characteristics, elastic restoring force, and flexural resistance.
如上文所描述之聚合物薄膜的物理特性係基於40 µm至60 µm之厚度或70 µm至90 µm之厚度。舉例而言,聚合物薄膜之物理特性係基於50 μm之厚度或80 μm之厚度。The physical properties of the polymer film as described above are based on a thickness of 40 µm to 60 µm or a thickness of 70 µm to 90 µm. For example, the physical properties of polymer films are based on a thickness of 50 μm or a thickness of 80 μm.
如上文所描述之聚合物薄膜之組分及特性的特徵可彼此組合。The components and characteristics of the polymer film as described above can be combined with each other.
另外,如上文所描述之聚合物薄膜的特性係藉由將構成聚合物薄膜之組分的化學及物理特性與如下文所描述之用於製備聚合物薄膜之製程各步驟中之條件組合而實現的結果。用於顯示器之前面板 In addition, the properties of the polymer film as described above are achieved by combining the chemical and physical properties of the components constituting the polymer film with the conditions in each step of the process for preparing the polymer film as described below. the result of. For the front panel of the monitor
根據一實施例之用於顯示器之前面板包含聚合物薄膜及功能層。The front panel for a display according to an embodiment includes a polymer film and a functional layer.
聚合物薄膜包含選自由以下組成之群的聚合物樹脂:以聚醯胺為主之樹脂及以聚醯亞胺為主之樹脂。The polymer film includes a polymer resin selected from the group consisting of polyamide-based resins and polyimide-based resins.
根據一實施例之聚合物薄膜在高壓釜處理之前的霧度(HZ0 )為3%或更低,且由以上等式1a表示之ΔHZ24 值為500%或更低。 The haze (HZ 0 ) of the polymer film according to an embodiment before autoclave treatment is 3% or lower, and the ΔHZ 24 value represented by the above equation 1a is 500% or lower.
根據另一實施例之聚合物薄膜在高壓釜處理之前的模數(MO0 )為5 GPa或更大,且由以上等式1b表示之∆TS24 為15%或更低。 The modulus (MO 0 ) of the polymer film according to another embodiment before the autoclave treatment is 5 GPa or more, and the ΔTS 24 represented by the above equation 1b is 15% or less.
根據再一實施例之聚合物薄膜包含聚合物樹脂及丁酸。A polymer film according to still another embodiment includes a polymer resin and butyric acid.
關於聚合物薄膜之細節如上文所描述。The details of the polymer film are as described above.
前面板可有利地應用於顯示裝置。The front panel can be advantageously applied to a display device.
聚合物薄膜之摺疊特徵極佳,且即使在高溫及高濕之苛刻條件下亦可維持極佳光學特性及機械特性。特定而言,功能層,更不必說聚合物薄膜,摺疊特徵極佳,使得前面板可有利地應用於可摺疊顯示裝置或可撓性顯示裝置。顯示裝置 The polymer film has excellent folding characteristics and can maintain excellent optical and mechanical properties even under severe conditions of high temperature and high humidity. In particular, the functional layer, not to mention the polymer film, has excellent folding characteristics, so that the front panel can be advantageously applied to a foldable display device or a flexible display device. Display device
根據一實施例之顯示裝置包含顯示單元;及安置於該顯示單元上之前面板,其中該前面板包含聚合物薄膜。A display device according to an embodiment includes a display unit; and a front panel disposed on the display unit, wherein the front panel includes a polymer film.
另外,聚合物薄膜包含選自由以下組成之群的聚合物樹脂:以聚醯胺為主之樹脂及以聚醯亞胺為主之樹脂。In addition, the polymer film includes polymer resins selected from the group consisting of polyamide-based resins and polyimide-based resins.
根據一實施例之聚合物薄膜在高壓釜處理之前的霧度(HZ0 )為3%或更低,且由以上等式1a表示之ΔHZ24 值為500%或更低。 The haze (HZ 0 ) of the polymer film according to an embodiment before autoclave treatment is 3% or lower, and the ΔHZ 24 value represented by the above equation 1a is 500% or lower.
根據另一實施例之聚合物薄膜在高壓釜處理之前的模數(MO0 )為5 GPa或更大,且由以上等式1b表示之∆TS24 為15%或更低。 The modulus (MO 0 ) of the polymer film according to another embodiment before the autoclave treatment is 5 GPa or more, and the ΔTS 24 represented by the above equation 1b is 15% or less.
根據再一實施例之聚合物薄膜包含聚合物樹脂及丁酸。A polymer film according to still another embodiment includes a polymer resin and butyric acid.
關於聚合物薄膜及前面板之細節如上文所描述。The details of the polymer film and the front panel are as described above.
圖1為根據一實施例之顯示裝置的剖面圖。FIG. 1 is a cross-sectional view of a display device according to an embodiment.
具體而言,圖1示出顯示裝置,其包含顯示單元(400)及安置於顯示單元(400)上之前面板(300),其中前面板包含具有第一側(101)及第二側(102)之聚合物薄膜(100)及功能層(200),及插入於顯示單元(400)與前面板(300)之間的黏著層(500)。Specifically, FIG. 1 shows a display device, which includes a display unit (400) and a front panel (300) disposed on the display unit (400), wherein the front panel includes a first side (101) and a second side (102). ) Polymer film (100) and functional layer (200), and an adhesive layer (500) inserted between the display unit (400) and the front panel (300).
顯示單元(400)係用於顯示影像,且其可具有可撓性特徵。The display unit (400) is used to display images, and it can have flexibility.
顯示單元(400)可為用於顯示影像之顯示面板。舉例而言,其可為液晶顯示面板或有機電致發光顯示器面板。有機電致發光顯示器面板可包含前偏光片及有機EL面板。The display unit (400) can be a display panel for displaying images. For example, it can be a liquid crystal display panel or an organic electroluminescence display panel. The organic electroluminescence display panel may include a front polarizer and an organic EL panel.
前偏光片可安置於有機EL面板之前側上。具體而言,前偏光片可附接至有機EL面板中在上面顯示影像之側。The front polarizer can be placed on the front side of the organic EL panel. Specifically, the front polarizer can be attached to the side of the organic EL panel on which the image is displayed.
有機EL面板藉由像素單元之自發射顯示影像。有機EL面板可包含有機EL基板及驅動基板。有機EL基板可包含多個有機電致發光單元,其各自對應於一個像素。具體而言,其可包含陰極、電子傳輸層、發光層、電洞傳輸層及陽極。驅動基板可操作地耦接至有機EL基板。亦即,驅動基板可耦接至有機EL基板以便施加驅動信號(諸如驅動電流),使得驅動基板可藉由將電流施加至各別有機電致發光單元驅動有機EL基板。The organic EL panel displays images through the self-emission of the pixel unit. The organic EL panel may include an organic EL substrate and a driving substrate. The organic EL substrate may include a plurality of organic electroluminescence units, each of which corresponds to one pixel. Specifically, it may include a cathode, an electron transport layer, a light-emitting layer, a hole transport layer, and an anode. The driving substrate is operatively coupled to the organic EL substrate. That is, the driving substrate can be coupled to the organic EL substrate to apply a driving signal (such as a driving current) so that the driving substrate can drive the organic EL substrate by applying current to the respective organic electroluminescence unit.
另外,黏著層(500)可插入於顯示單元(400)與前面板(300)之間。黏著層可為光學透明黏著層,但其不受特別限制。In addition, the adhesive layer (500) can be inserted between the display unit (400) and the front panel (300). The adhesive layer may be an optically transparent adhesive layer, but it is not particularly limited.
前面板(300)安置於顯示單元(400)上。前面板位於顯示裝置之最外位置處以藉此保護顯示單元。The front panel (300) is arranged on the display unit (400). The front panel is located at the outermost position of the display device to thereby protect the display unit.
前面板(300)可包含聚合物薄膜及功能層。功能層可為選自由以下組成之群之至少一者:硬塗層、降低反射率之層、抗污層及防眩光層。功能層可塗佈於聚合物薄膜之至少一側上。用於製備聚合物薄膜之製程 The front panel (300) may include a polymer film and a functional layer. The functional layer can be at least one selected from the group consisting of a hard coat layer, a layer that reduces reflectivity, an anti-fouling layer, and an anti-glare layer. The functional layer can be coated on at least one side of the polymer film. Process for preparing polymer film
一實施例提供一種用於製備聚合物薄膜之製程。An embodiment provides a process for preparing a polymer film.
根據一實施例用於製備聚合物薄膜之製程包含在有機溶劑中製備包含選自由以下組成之群之聚合物樹脂的聚合物溶液:以聚醯胺為主之樹脂及以聚醯亞胺為主之樹脂;將聚合物溶液轉移至槽中;擠出且澆鑄槽中之聚合物溶液且隨後對其進行乾燥以製備凝膠薄片;以及對凝膠薄片進行熱處理,其中進行凝膠薄片之熱處理,直至殘餘溶劑含量為1,200 ppm或更小。According to an embodiment, the process for preparing a polymer film includes preparing a polymer solution containing a polymer resin selected from the group consisting of: polyamide-based resin and polyimide-based resin in an organic solvent The resin; transfer the polymer solution to the tank; extrude and cast the polymer solution in the tank and then dry it to prepare the gel sheet; and heat the gel sheet, wherein the heat treatment of the gel sheet is performed, Until the residual solvent content is 1,200 ppm or less.
根據另一實施例用於製備聚合物薄膜之製程包含在聚合儀器中使二胺化合物、二酐化合物及二羰基化合物在有機溶劑中聚合,以製備包含聚合物樹脂之聚合物溶液;將聚合物溶液轉移至槽中;擠出且澆鑄槽中之聚合物溶液且隨後對其進行乾燥以製備凝膠薄片;以及對凝膠薄片進行熱處理,其中凝膠薄片之熱處理在80℃至500℃範圍內之溫度下進行5至180分鐘。According to another embodiment, the process for preparing a polymer film includes polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound in an organic solvent in a polymerization apparatus to prepare a polymer solution containing a polymer resin; The solution is transferred to the tank; the polymer solution in the tank is extruded and cast and then dried to prepare a gel flake; and the gel flake is heat-treated, wherein the heat treatment of the gel flake is in the range of 80°C to 500°C The temperature for 5 to 180 minutes.
根據再一實施例用於製備聚合物薄膜之製程包含在有機溶劑製備包含聚合物樹脂之聚合物溶液;將聚合物溶液轉移至槽中;將槽中之聚合物溶液澆鑄至傳動帶上且隨後對其進行乾燥以製備凝膠薄片;以及在移動凝膠薄片的同時對其進行熱處理以製備固化薄膜。According to another embodiment, the process for preparing a polymer film includes preparing a polymer solution containing a polymer resin in an organic solvent; transferring the polymer solution to a tank; casting the polymer solution in the tank onto the transmission belt and then It is dried to prepare a gel sheet; and while the gel sheet is moved, it is heat-treated to prepare a cured film.
參考圖2,用於製備聚合物薄膜之製程包含在聚合儀器中將二胺化合物、二酐化合物及任擇地二羰基化合物在有機溶劑中同時或依序混合,且使混合物反應以製備聚合物溶液(S100);將聚合物溶液轉移至槽中(S200);用惰性氣體吹掃(S300);將槽中之聚合物溶液澆鑄至傳動帶上且隨後對其進行乾燥以製備凝膠薄片(S400);在移動凝膠薄片的同時對其進行熱處理以製備固化薄膜(S500);在移動固化薄膜的同時使其冷卻(S600);以及使用捲繞機捲繞經冷卻之固化薄膜(S700)。Referring to FIG. 2, the process for preparing a polymer film includes mixing a diamine compound, a dianhydride compound, and optionally a dicarbonyl compound in an organic solvent simultaneously or sequentially in a polymerization apparatus, and reacting the mixture to prepare a polymer Solution (S100); transfer the polymer solution to the tank (S200); purge with inert gas (S300); cast the polymer solution in the tank onto the transmission belt and then dry it to prepare a gel sheet (S400 ); heat the gel sheet while moving it to prepare a solidified film (S500); cool it while moving the solidified film (S600); and wind the cooled solidified film using a winder (S700).
聚合物薄膜包含選自由以下組成之群的聚合物樹脂作為主要組分:以聚醯胺為主之樹脂及以聚醯亞胺為主之樹脂。The polymer film contains as a main component a polymer resin selected from the group consisting of polyamide-based resin and polyimide-based resin.
在用於製備聚合物薄膜之製程中,用於製備聚合物樹脂之聚合物溶液藉由在聚合儀器中將二胺化合物及二羰基化合物,或二胺化合物、二酐化合物及二羰基化合物在有機溶劑中同時或依序混合,且使混合物反應而製備(S100)。In the process used to prepare polymer films, the polymer solution used to prepare polymer resins is prepared by mixing diamine compounds and dicarbonyl compounds, or diamine compounds, dianhydride compounds, and dicarbonyl compounds in an organic The solvent is mixed simultaneously or sequentially, and the mixture is reacted to prepare (S100).
在一實施例中,聚合物溶液可藉由將二胺化合物、二酐化合物及二羰基化合物在有機溶劑中同時混合且使其反應而製備。In one embodiment, the polymer solution can be prepared by simultaneously mixing and reacting the diamine compound, the dianhydride compound, and the dicarbonyl compound in an organic solvent.
在另一實施例中,製備聚合物溶液之步驟可包含將二胺化合物及二酐化合物在溶劑中混合且使其反應以產生聚醯胺酸溶液;及使聚醯胺酸溶液經歷脫水以產生聚醯亞胺(PI)溶液。In another embodiment, the step of preparing the polymer solution may include mixing and reacting the diamine compound and the dianhydride compound in a solvent to produce a polyamide acid solution; and subjecting the polyamide acid solution to dehydration to produce Polyimide (PI) solution.
在再一實施例中,製備聚合物溶液之步驟可包含第一,將二胺化合物及二酐化合物在溶劑中混合且使其反應以產生聚醯胺酸(PAA)溶液;及第二,將聚醯胺酸(PAA)溶液及二羰基化合物混合且使其反應以形成醯胺鍵及醯亞胺鍵。聚醯胺酸溶液為包含聚醯胺酸之溶液。In still another embodiment, the step of preparing the polymer solution may include first, mixing and reacting the diamine compound and the dianhydride compound in a solvent to produce a polyamide acid (PAA) solution; and second, mixing The polyamide acid (PAA) solution and the dicarbonyl compound are mixed and allowed to react to form an amide bond and an amide bond. The polyamic acid solution is a solution containing polyamic acid.
替代地,製備聚合物溶液之步驟可包含第一,將二胺化合物及二酐化合物在溶劑中混合且使其反應以產生聚醯胺酸溶液;使聚醯胺酸溶液經歷脫水以產生聚醯亞胺(PI)溶液;及第二,將聚醯亞胺(PI)溶液及二羰基化合物混合且使其反應以進一步形成醯胺鍵。聚醯亞胺溶液為包含具有醯亞胺重複單元之聚合物的溶液。Alternatively, the step of preparing the polymer solution may include first, mixing the diamine compound and the dianhydride compound in a solvent and allowing them to react to produce a polyamide acid solution; subjecting the polyamide acid solution to dehydration to produce polyamide An imine (PI) solution; and second, the polyimine (PI) solution and the dicarbonyl compound are mixed and reacted to further form an amide bond. The polyimine solution is a solution containing a polymer having repeating units of the imine.
在再一實施例中,製備聚合物溶液之步驟可包含第一,將二胺化合物及二羰基化合物在溶劑中混合且使其反應以產生聚醯胺(PA)溶液;及第二,將聚醯胺(PA)溶液及二酐化合物混合且使其反應以進一步形成醯亞胺鍵。聚醯胺溶液為包含具有醯胺重複單元之聚合物的溶液。In still another embodiment, the step of preparing the polymer solution may include first, mixing and reacting the diamine compound and the dicarbonyl compound in a solvent to produce a polyamide (PA) solution; The amide (PA) solution and the dianhydride compound are mixed and allowed to react to further form an amide bond. The polyamide solution is a solution containing a polymer having repeating units of amide.
由此製備之聚合物溶液可為包含含有選自由以下組成之群之至少一者之聚合物的溶液:聚醯胺酸(PAA)重複單元、聚醯胺(PA)重複單元及聚醯亞胺(PI)重複單元。The polymer solution thus prepared may be a solution containing a polymer containing at least one selected from the group consisting of: polyamide acid (PAA) repeating unit, polyamide (PA) repeating unit, and polyimide (PI) Repeating unit.
舉例而言,聚合物溶液中所含有之聚合物可包含衍生自二胺化合物與二酐化合物聚合之醯亞胺重複單元。For example, the polymer contained in the polymer solution may include an imine repeating unit derived from the polymerization of a diamine compound and a dianhydride compound.
替代地,聚合物溶液中所含有之聚合物可包含衍生自二胺化合物與二酐化合物聚合之醯亞胺重複單元,及衍生自二胺化合物與二羰基化合物聚合之醯胺重複單元。Alternatively, the polymer contained in the polymer solution may include an amide repeating unit derived from the polymerization of a diamine compound and a dianhydride compound, and an amide repeating unit derived from the polymerization of a diamine compound and a dicarbonyl compound.
聚合物溶液中所含有之固體含量可為10重量%至30重量%。替代地,聚合物溶液中所含有之固體含量可為15重量%至25重量%,但其不限於此。The solid content contained in the polymer solution may be 10% to 30% by weight. Alternatively, the solid content contained in the polymer solution may be 15% to 25% by weight, but it is not limited thereto.
若聚合物溶液中所含有之固體含量在以上範圍內,則聚合物薄膜可在擠出及澆鑄步驟中有效地產生。另外,由此製備之聚合物薄膜維持清潔外觀及透明度,同時確保特定範圍之光學滑動指數、最大靜摩擦係數及動摩擦係數,引起極佳防黏特性。此外,其可具有即使在高溫及高濕下亦幾乎不劣化之極佳機械特性及光學特性(諸如低黃度),在長時期持續施加某一位準負載時幾乎不變形,且摺疊特徵極佳。If the solid content contained in the polymer solution is within the above range, the polymer film can be effectively produced in the extrusion and casting steps. In addition, the polymer film thus prepared maintains a clean appearance and transparency, while ensuring a specific range of optical sliding index, maximum static friction coefficient and dynamic friction coefficient, resulting in excellent anti-stick properties. In addition, it can have excellent mechanical properties and optical properties (such as low yellowness) that hardly deteriorate even under high temperature and high humidity, hardly deform when a certain level of load is continuously applied for a long period of time, and has excellent folding characteristics. good.
在一實施例中,製備聚合物溶液之步驟可進一步包含引入催化劑。In one embodiment, the step of preparing the polymer solution may further include introducing a catalyst.
此處,催化劑可包含選自由以下組成之群之至少一者:β甲吡啶(picoline)、乙酸酐、異喹啉(IQ)及以吡啶為主之化合物,但其不限於此。Here, the catalyst may include at least one selected from the group consisting of β picoline, acetic anhydride, isoquinoline (IQ), and pyridine-based compounds, but it is not limited thereto.
催化劑可以基於1莫耳聚醯胺酸計0.01至0.4莫耳當量之量添加,但其不限於此。The catalyst may be added in an amount of 0.01 to 0.4 mol equivalent based on 1 mol of polyamide acid, but it is not limited thereto.
替代地,催化劑可以基於聚合物溶液之總重量計0.01至0.3重量%之量添加。具體而言,催化劑可以基於聚合物溶液之總重量計0.01至0.2重量%、0.01至0.15重量%、0.01至0.1重量%或0.02至0.1重量%之量添加,但其不限於此。Alternatively, the catalyst may be added in an amount of 0.01 to 0.3% by weight based on the total weight of the polymer solution. Specifically, the catalyst may be added in an amount of 0.01 to 0.2% by weight, 0.01 to 0.15% by weight, 0.01 to 0.1% by weight, or 0.02 to 0.1% by weight based on the total weight of the polymer solution, but it is not limited thereto.
進一步添加催化劑可加快反應速率且增強重複單元結構之間或重複單元結構內之化學鍵結力。此外,有可能藉由使用催化劑製備具有低黃色指數之薄膜。Further addition of a catalyst can speed up the reaction rate and enhance the chemical bonding force between or within the repeating unit structure. In addition, it is possible to prepare a thin film with a low yellow index by using a catalyst.
在一實施例中,製備聚合物溶液之步驟可進一步包含引入脫水劑。In one embodiment, the step of preparing the polymer solution may further include introducing a dehydrating agent.
在此類情況下,脫水劑可為乙酸酐,但其不限於此。In such cases, the dehydrating agent may be acetic anhydride, but it is not limited thereto.
脫水劑可以基於聚合物溶液之總重量計0.01至10重量%、0.05至5重量%或0.05至3重量%之量添加,但其不限於此。The dehydrating agent may be added in an amount of 0.01 to 10% by weight, 0.05 to 5% by weight, or 0.05 to 3% by weight based on the total weight of the polymer solution, but it is not limited thereto.
添加脫水劑產生製備具有低黃度及低霧度之薄膜的效果。Adding a dehydrating agent produces the effect of preparing a film with low yellowness and low haze.
在另一實施例中,製備聚合物溶液之步驟可進一步包含調整聚合物溶液之黏度。In another embodiment, the step of preparing the polymer solution may further include adjusting the viscosity of the polymer solution.
具體而言,製備聚合物溶液之步驟可包含(a)將二胺化合物、二酐化合物及任擇地二羰基化合物在有機溶劑中同時或依序混合且使其反應以製備第一聚合物溶液;(b)量測第一聚合物溶液之黏度且評估是否已達到目標黏度;以及(c)若第一聚合物溶液之黏度未達到目標黏度,則進一步添加二酐化合物或二羰基化合物以製備具有目標黏度之第二聚合物溶液。Specifically, the step of preparing the polymer solution may include (a) simultaneously or sequentially mixing and reacting the diamine compound, the dianhydride compound, and optionally the dicarbonyl compound in an organic solvent to prepare the first polymer solution ; (B) Measure the viscosity of the first polymer solution and evaluate whether it has reached the target viscosity; and (c) if the viscosity of the first polymer solution does not reach the target viscosity, further add a dianhydride compound or a dicarbonyl compound to prepare A second polymer solution with target viscosity.
目標黏度可為在室溫下100,000 cps至500,000 cps。具體而言,目標黏度可為100,000 cps至400,000 cps、100,000 cps至350,000 cps、100,000 cps至300,000 cps、150,000 cps至300,000 cps或150,000 cps至250,000 cps,但其不限於此。The target viscosity can be 100,000 cps to 500,000 cps at room temperature. Specifically, the target viscosity may be 100,000 cps to 400,000 cps, 100,000 cps to 350,000 cps, 100,000 cps to 300,000 cps, 150,000 cps to 300,000 cps, or 150,000 cps to 250,000 cps, but it is not limited thereto.
在製備第一聚合物溶液及第二聚合物溶液之步驟中,聚合物溶液之黏度彼此不同。舉例而言,第二聚合物溶液之黏度高於第一聚合物溶液之黏度。In the steps of preparing the first polymer solution and the second polymer solution, the viscosity of the polymer solutions are different from each other. For example, the viscosity of the second polymer solution is higher than the viscosity of the first polymer solution.
在製備第一聚合物溶液及第二聚合物溶液之步驟中,攪拌速度彼此不同。舉例而言,製備第一聚合物溶液時之攪拌速度比製備第二聚合物溶液時之攪拌速度快。In the steps of preparing the first polymer solution and the second polymer solution, the stirring speeds are different from each other. For example, the stirring speed when preparing the first polymer solution is faster than the stirring speed when preparing the second polymer solution.
在再一實施例中,製備聚合物溶液之步驟可進一步包含調整聚合物溶液之pH。在此步驟中,聚合物溶液之pH可調整為4至7,例如4.5至7,或4.5至小於7,但其不限於此。In still another embodiment, the step of preparing the polymer solution may further include adjusting the pH of the polymer solution. In this step, the pH of the polymer solution can be adjusted to 4 to 7, for example, 4.5 to 7, or 4.5 to less than 7, but it is not limited thereto.
聚合物溶液之pH可藉由添加pH調整劑來調整。pH調整劑不受特別限制且可包括例如以胺為主之化合物,諸如烷氧基胺、烷基胺及烷醇胺,及基於羧酸之化合物,諸如乙酸及丁酸。The pH of the polymer solution can be adjusted by adding a pH adjuster. The pH adjuster is not particularly limited and may include, for example, amine-based compounds such as alkoxyamines, alkylamines, and alkanolamines, and carboxylic acid-based compounds such as acetic acid and butyric acid.
若將聚合物溶液之pH調整為以上範圍,則有可能防止後續製程中對設備造成損害,防止由聚合物溶液產生之薄膜中出現缺陷,且實現就黃色指數及模數而言之所需光學特性及機械特性。此外,可恢復性及摺疊特徵可能增強。If the pH of the polymer solution is adjusted to the above range, it is possible to prevent damage to the equipment in the subsequent process, prevent defects in the film produced by the polymer solution, and achieve the required optics in terms of yellow index and modulus Characteristics and mechanical characteristics. In addition, recoverability and folding characteristics may be enhanced.
pH調整劑可以基於聚合物溶液之總重量計0.01至0.7重量%、0.01至0.5重量%或0.02至0.4重量%之量添加,但其不限於此。The pH adjuster may be added in an amount of 0.01 to 0.7% by weight, 0.01 to 0.5% by weight, or 0.02 to 0.4% by weight based on the total weight of the polymer solution, but it is not limited thereto.
替代地,pH調整劑可以基於聚合物溶液中單體之總莫耳數計0.1莫耳%至10莫耳%之量添加。Alternatively, the pH adjusting agent may be added in an amount of 0.1 mol% to 10 mol% based on the total mol of monomers in the polymer solution.
具體而言,若催化劑在聚合物溶液製備時添加,則進行利用催化劑之化學亞胺化或熱亞胺化。若以適當量使用催化劑,則可製備具有低黃色指數之透明薄膜。另一方面,當使用催化劑時,可能產生副產物,或一些物理特性可能劣化。在此類情況下,pH調整劑可改良物理特性之劣化。舉例而言,丁酸可用作pH調整劑。丁酸之一部分在最終薄膜中繼續存在,其使得有可能獲得在已經長時期摺疊且隨後藉由釋放施加至薄膜之力返回至展開狀態時可恢復性極佳,且摺疊特徵極佳的透明薄膜。Specifically, if the catalyst is added during the preparation of the polymer solution, chemical imidization or thermal imidization using the catalyst is performed. If the catalyst is used in an appropriate amount, a transparent film with a low yellow index can be prepared. On the other hand, when a catalyst is used, by-products may be generated, or some physical properties may be deteriorated. In such cases, the pH adjuster can improve the deterioration of physical properties. For example, butyric acid can be used as a pH adjuster. A part of butyric acid continues to exist in the final film, which makes it possible to obtain a transparent film with excellent recoverability and excellent folding characteristics when it has been folded for a long period of time and then returned to the unfolded state by releasing the force applied to the film .
在許多情況下,衍生自用於產生聚合物樹脂之單體的氯端基或由在用於製備薄膜之製程期間產生之HCl產生的以Cl為主之副產物使反應性降低,藉此產生具有低分子量之聚合物。然而,若將丁酸用作pH調整劑,則催化劑之反應性經有效調整以減少具有低分子量之聚合物的量,且便於聚合達到高分子量。In many cases, chlorine end groups derived from monomers used to produce polymer resins or Cl-based by-products produced by HCl generated during the process for preparing films reduce the reactivity, thereby producing Low molecular weight polymer. However, if butyric acid is used as a pH adjuster, the reactivity of the catalyst is effectively adjusted to reduce the amount of polymers with low molecular weight and facilitate polymerization to achieve high molecular weight.
此外,已存在由於在高壓釜處理之後(亦即,在高溫及高濕之苛刻條件下處理之後)聚合物中剩餘低分子量聚合物溶離,藉此使光學特性快速劣化之問題。另外,已存在高溫及高濕環境中習知聚合物薄膜中形成障壁層之問題。為了解決此問題,引入對濕氣具有抗性之添加劑,諸如黏土,在此情況下光學特性或相容性可能劣化。In addition, there has been a problem that the low-molecular-weight polymer remaining in the polymer dissolves after the autoclave treatment (that is, after the treatment under severe conditions of high temperature and high humidity), thereby rapidly deteriorating the optical characteristics. In addition, there has been a problem of forming barrier layers in conventional polymer films in high temperature and high humidity environments. In order to solve this problem, additives that are resistant to moisture, such as clay, are introduced, in which case the optical properties or compatibility may be deteriorated.
相比之下,如在根據一實施例之聚合物薄膜中,在聚合製程期間添加丁酸可解決上文所提及之問題。有可能獲得即使在高溫及高濕之苛刻條件下處理後光學特性及機械特性亦幾乎不劣化且摺疊特徵極佳的聚合物薄膜。In contrast, as in a polymer film according to an embodiment, adding butyric acid during the polymerization process can solve the above-mentioned problems. It is possible to obtain a polymer film that hardly deteriorates in optical and mechanical properties even under severe conditions of high temperature and high humidity and has excellent folding characteristics.
在另一實施例中,製備聚合物溶液之步驟可進一步包含用惰性氣體吹掃。用惰性氣體吹掃之步驟可移除水分、減少雜質、提高反應產率且將極佳表面外觀及機械特性賦予最終產生之薄膜。In another embodiment, the step of preparing the polymer solution may further include purging with an inert gas. The step of purging with an inert gas can remove moisture, reduce impurities, increase the reaction yield, and impart excellent surface appearance and mechanical properties to the final film.
惰性氣體可為選自由以下組成之群之至少一者:氮氣、氦氣(He)、氖氣(Ne)、氬氣(Ar)、氪氣(Kr)、氙氣(Xe)及氡氣(Rn),但其不限於此。具體而言,惰性氣體可為氮氣。The inert gas can be at least one selected from the group consisting of nitrogen, helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe), and radon (Rn) ), but it is not limited to this. Specifically, the inert gas may be nitrogen.
用於製備聚合物溶液之二酐化合物與二羰基化合物的莫耳比可為2:98至15:85。舉例而言,莫耳比可為3:97至15:85、5:95至15:85、7:93至15:85、2:98至25:75、2:98至15:85、20:80至100:0、25:75至100:0、30:70至100:0、40:60至100:0或50:50至100:0,但其不限於此。The molar ratio of the dianhydride compound to the dicarbonyl compound used to prepare the polymer solution may be 2:98 to 15:85. For example, the molar ratio can be 3:97 to 15:85, 5:95 to 15:85, 7:93 to 15:85, 2:98 to 25:75, 2:98 to 15:85, 20 : 80 to 100:0, 25:75 to 100:0, 30:70 to 100:0, 40:60 to 100:0, or 50:50 to 100:0, but it is not limited thereto.
若以以上莫耳比採用二酐化合物及二羰基化合物,則有利於實現由聚合物溶液製備之聚合物薄膜的所需機械及光學特性。If the dianhydride compound and the dicarbonyl compound are used in the above molar ratio, it is beneficial to realize the required mechanical and optical properties of the polymer film prepared from the polymer solution.
關於二胺化合物、二酐化合物及二羰基化合物之細節如上文所描述。The details of the diamine compound, the dianhydride compound, and the dicarbonyl compound are as described above.
在一實施例中,有機溶劑可為選自由以下組成之群之至少一者:二甲基甲醯胺(DMF)、二甲基乙醯胺(DMAc)、N-甲基-2-吡咯啶酮(NMP)、間甲酚、四氫呋喃(THF)及氯仿。聚合物溶液中所採用之有機溶劑可為二甲基乙醯胺(DMAc),但其不限於此。In one embodiment, the organic solvent may be at least one selected from the group consisting of: dimethylformamide (DMF), dimethylacetamide (DMAc), N-methyl-2-pyrrolidine Ketone (NMP), m-cresol, tetrahydrofuran (THF) and chloroform. The organic solvent used in the polymer solution may be dimethylacetamide (DMAc), but it is not limited thereto.
接下來,在製備聚合物溶液之步驟後,將聚合物溶液轉移至槽中(S200)。Next, after the step of preparing the polymer solution, the polymer solution is transferred to the tank (S200).
圖3示意性示出用於製備根據一實施例之聚合物薄膜的製程設備。參考圖3,在聚合儀器(10)中製備如上文所描述之聚合物溶液,且將由此產生之聚合物溶液轉移至且儲存於槽(20)中。Fig. 3 schematically shows a process equipment for preparing a polymer film according to an embodiment. Referring to FIG. 3, the polymer solution as described above is prepared in the polymerization apparatus (10), and the polymer solution thus produced is transferred to and stored in the tank (20).
此處,一旦已製備聚合物溶液,則進行將聚合物溶液轉移至槽中之步驟,而不進行任何額外步驟。具體而言,將在聚合儀器中製備之聚合物溶液轉移至且儲存於槽中,而不進行用於移除雜質之任何獨立沈澱及再溶解步驟。在習知製程中,為了移除在聚合物溶液製備期間產生之雜質,諸如鹽酸(HCl),經由獨立步驟純化由此製備之聚合物溶液以移除雜質,且隨後將純化聚合物溶液再溶解於溶劑中。然而,在此情況下已存在移除雜質之步驟中活性成分之損失增加,導致產率降低的問題。Here, once the polymer solution has been prepared, the step of transferring the polymer solution to the tank is performed without any additional steps. Specifically, the polymer solution prepared in the polymerization apparatus is transferred to and stored in the tank without any independent precipitation and redissolution steps for removing impurities. In the conventional process, in order to remove impurities generated during the preparation of the polymer solution, such as hydrochloric acid (HCl), the polymer solution thus prepared is purified through a separate step to remove the impurities, and then the purified polymer solution is redissolved In the solvent. However, in this case, there has been a problem of increased loss of active ingredients in the step of removing impurities, resulting in a decrease in yield.
因此,根據一實施例之製備製程最終使製備聚合物溶液之步驟中產生的雜質之量減至最小,或適當地控制後續步驟中之雜質(即使存在某一量之雜質),以免使最終薄膜之物理特性劣化。因此,製程具有優點,此係因為在無獨立沈澱或再溶解步驟之情況下產生薄膜。Therefore, the preparation process according to an embodiment finally minimizes the amount of impurities generated in the step of preparing the polymer solution, or appropriately controls the impurities in the subsequent steps (even if there is a certain amount of impurities), so as to avoid making the final film The physical properties are degraded. Therefore, the process has advantages because the thin film is produced without a separate precipitation or re-dissolution step.
槽(20)為用於在將聚合物溶液成型為薄膜之前儲存聚合物溶液的場所,且其內部溫度可為-20℃至20℃。The tank (20) is a place for storing the polymer solution before forming the polymer solution into a film, and its internal temperature can be -20°C to 20°C.
具體而言,內部溫度可為-20℃至10℃、-20℃至5℃、-20℃至0℃或0℃至10℃,但其不限於此。Specifically, the internal temperature may be -20°C to 10°C, -20°C to 5°C, -20°C to 0°C, or 0°C to 10°C, but it is not limited thereto.
若槽(20)之內部溫度控制在以上範圍內,則有可能防止聚合物溶液在儲存期間劣化,且有可能降低水分含量以藉此防止由其產生之薄膜的缺陷。If the internal temperature of the tank (20) is controlled within the above range, it is possible to prevent the polymer solution from deteriorating during storage, and it is possible to reduce the moisture content to thereby prevent film defects caused by it.
用於製備聚合物薄膜之製程可進一步包含對轉移至槽(20)之聚合物溶液進行真空脫氣。The process for preparing the polymer film may further include vacuum degassing the polymer solution transferred to the tank (20).
可在將槽之內部壓力減壓至0.1巴至0.7巴後進行真空脫氣,持續30分鐘至3小時。此等條件下之真空脫氣可減少聚合物溶液中之氣泡。因此,有可能防止由其產生之薄膜的表面缺陷且實現極佳光學特性,諸如霧度。Vacuum degassing can be carried out after the internal pressure of the tank is reduced to 0.1 bar to 0.7 bar for 30 minutes to 3 hours. Vacuum degassing under these conditions can reduce bubbles in the polymer solution. Therefore, it is possible to prevent surface defects of the film produced therefrom and achieve excellent optical characteristics such as haze.
另外,用於製備聚合物薄膜之製程可進一步包含用惰性氣體吹掃轉移至槽(20)之聚合物溶液(S300)。In addition, the process for preparing the polymer film may further include purging the polymer solution (S300) transferred to the tank (20) with an inert gas.
具體而言,吹掃係藉由在1 atm至2 atm之內部壓力下用惰性氣體吹掃槽進行。此等條件下之氮氣吹掃可移除聚合物溶液中之水分,減少雜質以藉此提高反應產率,且實現極佳光學特性(諸如霧度)及機械特性。Specifically, the purge is performed by purging the tank with an inert gas under an internal pressure of 1 atm to 2 atm. Nitrogen purging under these conditions can remove the moisture in the polymer solution, reduce impurities to thereby increase the reaction yield, and achieve excellent optical properties (such as haze) and mechanical properties.
惰性氣體可為選自由以下組成之群之至少一者:氮氣、氦氣(He)、氖氣(Ne)、氬氣(Ar)、氪氣(Kr)、氙氣(Xe)及氡氣(Rn),但其不限於此。具體而言,惰性氣體可為氮氣。The inert gas can be at least one selected from the group consisting of nitrogen, helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe), and radon (Rn) ), but it is not limited to this. Specifically, the inert gas may be nitrogen.
真空脫氣之步驟及用惰性氣體吹掃槽之步驟分別在獨立步驟中進行。The step of vacuum degassing and the step of purging the tank with inert gas are carried out in separate steps.
舉例而言,可進行真空脫氣之步驟,後接用惰性氣體吹掃槽之步驟,但其不限於此。For example, a step of vacuum degassing can be performed, followed by a step of purging the tank with an inert gas, but it is not limited to this.
真空脫氣之步驟及/或用惰性氣體吹掃槽之步驟可改良由此產生之聚合物薄膜表面的物理特性。The step of vacuum degassing and/or the step of purging the groove with an inert gas can improve the physical properties of the polymer film surface produced thereby.
其後,製程可進一步包含將聚合物溶液在槽(20)中儲存1小時至360小時。此處,槽內部之溫度可保持在-20℃至20℃下。Thereafter, the process may further include storing the polymer solution in the tank (20) for 1 hour to 360 hours. Here, the temperature inside the tank can be maintained at -20°C to 20°C.
用於製備聚合物薄膜之製程可進一步包含將槽中之聚合物溶液擠出且澆鑄,且隨後對其進行乾燥以製備凝膠薄片(S400)。The process for preparing the polymer film may further include extruding and casting the polymer solution in the tank, and then drying it to prepare a gel sheet (S400).
聚合物溶液可澆鑄至鑄造體,諸如鑄軋輥或鑄造傳動帶上。The polymer solution can be cast onto a casting body, such as a casting roll or a casting drive belt.
參考圖3,根據一實施例,可將聚合物溶液施加至作為鑄造體之鑄造傳動帶(30)上,且在將其移動的同時對其進行乾燥,以將其製成呈凝膠形式之薄片。3, according to an embodiment, a polymer solution can be applied to a casting belt (30) as a casting body, and it can be dried while being moved to make it into a sheet in the form of a gel .
當將聚合物溶液注入至傳動帶(30)上時,注入速率可為300公克/分鐘至700公克/分鐘。若聚合物溶液之注入速率滿足以上範圍,則可將凝膠薄片均一地成型至適當厚度。When the polymer solution is injected onto the transmission belt (30), the injection rate can be 300 g/min to 700 g/min. If the injection rate of the polymer solution satisfies the above range, the gel sheet can be uniformly molded to an appropriate thickness.
另外,聚合物溶液之澆鑄厚度可為200 µm至700 µm。若將聚合物溶液澆鑄至以上範圍內之厚度,則乾燥及熱處理後產生之最終薄膜可具有適當且均一厚度。In addition, the casting thickness of the polymer solution can be 200 µm to 700 µm. If the polymer solution is cast to a thickness within the above range, the final film produced after drying and heat treatment can have an appropriate and uniform thickness.
如上文所描述,聚合物溶液在室溫下之黏度可為100,000 cps至500,000 cps,例如100,000 cps至400,000 cps、100,000 cps至350,000 cps、150,000 cps至350,000 cps或150,000 cps至250,000 cps。若黏度滿足以上範圍,則可將聚合物溶液澆以均一厚度鑄至傳動帶上而不產生缺陷。As described above, the viscosity of the polymer solution at room temperature may be 100,000 cps to 500,000 cps, for example, 100,000 cps to 400,000 cps, 100,000 cps to 350,000 cps, 150,000 cps to 350,000 cps, or 150,000 cps to 250,000 cps. If the viscosity meets the above range, the polymer solution can be cast on the transmission belt with a uniform thickness without defects.
聚合物溶液經澆鑄,且隨後在60℃至150℃之溫度下乾燥5分鐘至60分鐘以製備凝膠薄片。具體而言,乾燥可用熱空氣在60℃至120℃下進行10分鐘至50分鐘。舉例而言,乾燥可用熱空氣在100℃下進行30分鐘。The polymer solution is cast, and then dried at a temperature of 60°C to 150°C for 5 minutes to 60 minutes to prepare a gel sheet. Specifically, the drying can be performed with hot air at 60°C to 120°C for 10 minutes to 50 minutes. For example, the drying can be performed with hot air at 100°C for 30 minutes.
聚合物溶液之溶劑在乾燥期間部分或完全揮發以製備凝膠薄片。The solvent of the polymer solution is partially or completely volatilized during drying to prepare a gel sheet.
在乾燥時,凝膠薄片在鑄造體上之移動速度可為0.1公尺/分鐘至15公尺/分鐘,例如0.5公尺/分鐘至10公尺/分鐘,但其不限於此。During drying, the moving speed of the gel flakes on the casting body may be 0.1 m/min to 15 m/min, for example, 0.5 m/min to 10 m/min, but it is not limited thereto.
用於製備聚合物薄膜之製程包含在移動凝膠薄片的同時對其進行熱處理以製備固化薄膜(S500)。The process for preparing the polymer film includes heat-treating the gel sheet while moving it to prepare a cured film (S500).
參考圖3,凝膠薄片之熱處理可藉由使其通過熱固裝置(40)進行。Referring to Figure 3, the heat treatment of the gel sheet can be carried out by passing it through a thermosetting device (40).
凝膠薄片之熱處理在80℃至500℃範圍內之溫度下進行5分鐘至180分鐘。具體而言,凝膠薄片之熱處理可以2℃/分鐘至80℃/分鐘之溫度升高速率在80℃至500℃範圍內之溫度下進行5分鐘至150分鐘。更具體而言,凝膠薄片之熱處理可以2℃/分鐘至80℃/分鐘之溫度升高速率在80℃至300℃範圍內之溫度下進行。The heat treatment of the gel sheet is performed at a temperature in the range of 80°C to 500°C for 5 minutes to 180 minutes. Specifically, the heat treatment of the gel sheet can be performed at a temperature rise rate of 2°C/min to 80°C/min at a temperature in the range of 80°C to 500°C for 5 minutes to 150 minutes. More specifically, the heat treatment of the gel sheet can be performed at a temperature rise rate of 2°C/min to 80°C/min at a temperature in the range of 80°C to 300°C.
根據另一實施例,凝膠薄片可經熱空氣處理。According to another embodiment, the gel flakes may be treated with hot air.
若用熱空氣進行熱處理,則可均一地供應熱量。若未均一地供應熱量,則無法實現令人滿意之機械特性。特定而言,無法實現令人滿意之表面粗糙度,其可能使表面張力升高或降低過多。If hot air is used for heat treatment, heat can be supplied uniformly. If heat is not supplied uniformly, satisfactory mechanical properties cannot be achieved. In particular, satisfactory surface roughness cannot be achieved, which may increase or decrease the surface tension too much.
舉例而言,凝膠薄片可在200℃至320℃範圍內之溫度下經熱空氣處理5分鐘至60分鐘。更具體而言,凝膠薄片可在250℃至290℃範圍內之溫度下經熱空氣處理25分鐘至35分鐘。For example, the gel sheet can be treated with hot air at a temperature in the range of 200°C to 320°C for 5 minutes to 60 minutes. More specifically, the gel sheet can be treated with hot air at a temperature in the range of 250°C to 290°C for 25 minutes to 35 minutes.
根據再一實施例,凝膠薄片之熱處理可以二個或更多個步驟進行。According to still another embodiment, the heat treatment of the gel sheet can be performed in two or more steps.
根據另一實施例,可進行熱處理,直至凝膠薄片中所含有之殘餘溶劑含量為1,200 ppm或更小或1,000 ppm或更小。According to another embodiment, heat treatment may be performed until the residual solvent content contained in the gel sheet is 1,200 ppm or less or 1,000 ppm or less.
在熱處理中,第二熱處理步驟在第一熱處理步驟之後進行。在此類情況下,若在第二熱處理步驟後凝膠薄片中所含有之有機溶劑含量超過1,000 ppm或1,200 ppm,則可另外進行第三熱處理步驟。In the heat treatment, the second heat treatment step is performed after the first heat treatment step. In such cases, if the organic solvent content in the gel sheet exceeds 1,000 ppm or 1,200 ppm after the second heat treatment step, the third heat treatment step may be additionally performed.
具體而言,熱處理可包含在60℃至120℃範圍內進行5至30分鐘之第一熱處理步驟;及在150℃至350℃範圍內進行30分鐘至120分鐘之第二熱處理步驟。Specifically, the heat treatment may include a first heat treatment step in the range of 60°C to 120°C for 5 to 30 minutes; and a second heat treatment step in the range of 150°C to 350°C for 30 minutes to 120 minutes.
舉例而言,第三熱處理步驟可在200℃至350℃範圍內進行,直至凝膠薄片中所含有之殘餘溶劑含量為1,200 ppm或更小或1,000 ppm或更小。For example, the third heat treatment step may be performed in the range of 200°C to 350°C until the residual solvent content contained in the gel sheet is 1,200 ppm or less or 1,000 ppm or less.
另外,在熱處理步驟中,凝膠薄片可在MD方向上拉伸1.01倍至1.05倍。在第一熱處理步驟與第二熱處理步驟之間,凝膠薄片可在MD方向上拉伸1.01倍至1.05倍。In addition, in the heat treatment step, the gel sheet may be stretched 1.01 times to 1.05 times in the MD direction. Between the first heat treatment step and the second heat treatment step, the gel sheet may be stretched 1.01 times to 1.05 times in the MD direction.
在熱處理步驟中,凝膠薄片可在TD方向上拉伸1.01倍至1.05倍。在第二熱處理步驟中,凝膠薄片可在TD方向上拉伸1.01倍至1.05倍。In the heat treatment step, the gel sheet may be stretched 1.01 times to 1.05 times in the TD direction. In the second heat treatment step, the gel sheet may be stretched 1.01 times to 1.05 times in the TD direction.
凝膠薄片可同時在MD方向及TD方向上拉伸1.01倍至1.05倍。凝膠薄片可依序地在MD方向上拉伸1.01倍至1.05倍,且隨後在TD方向上拉伸1.01倍至1.05倍。The gel sheet can be stretched 1.01 times to 1.05 times in the MD and TD directions at the same time. The gel sheet may be sequentially stretched 1.01 times to 1.05 times in the MD direction, and then stretched 1.01 times to 1.05 times in the TD direction.
此等條件下之熱處理可固化凝膠薄片以具有適當表面硬度及模數,且由此製備之固化薄膜可能摺疊特徵極佳,高溫及高濕下光學特性及機械特性極佳,且在已經長時期摺疊且隨後釋放施加至薄膜之力時可恢復性極佳。Heat treatment under these conditions can cure the gel sheet to have appropriate surface hardness and modulus, and the cured film prepared therefrom may have excellent folding characteristics, excellent optical and mechanical properties under high temperature and high humidity, and has grown It has excellent recoverability when folded for a period of time and then released the force applied to the film.
用於製備聚合物薄膜之製程包含在移動固化薄膜的同時使其冷卻(S600)。The process for preparing the polymer film involves cooling the film while moving it (S600).
參考圖3,固化薄膜之冷卻在已使其通過熱固裝置(40)後進行。其可藉由使用獨立冷卻腔室(未圖示)或藉由在無獨立冷卻腔室之情況下形成適當溫度氛圍進行。Referring to Figure 3, the cooling of the cured film is performed after it has passed through the thermosetting device (40). This can be done by using an independent cooling chamber (not shown) or by forming an appropriate temperature atmosphere without an independent cooling chamber.
在移動固化薄膜的同時使其冷卻之步驟可包含使溫度以100℃/分鐘至1,000℃/分鐘之速率降低的第一降溫步驟,及使溫度以40℃/分鐘至400℃/分鐘之速率降低的第二降溫步驟。The step of cooling while moving the solidified film may include a first cooling step of lowering the temperature at a rate of 100°C/min to 1,000°C/min, and reducing the temperature at a rate of 40°C/min to 400°C/min The second cooling step.
在此類情況下,具體而言,第二降溫步驟在第一降溫步驟後進行。第一降溫步驟之降溫速率可比第二降溫步驟之降溫速率快。In such cases, specifically, the second cooling step is performed after the first cooling step. The cooling rate in the first cooling step may be faster than the cooling rate in the second cooling step.
舉例而言,第一降溫步驟之最大速率比第二降溫步驟之最大速率快。替代地,第一降溫步驟之最小速率比第二降溫步驟之最小速率快。For example, the maximum rate of the first cooling step is faster than the maximum rate of the second cooling step. Alternatively, the minimum rate of the first cooling step is faster than the minimum rate of the second cooling step.
若使固化薄膜冷卻之步驟以此類多階方式進行,則有可能使固化薄膜之物理特性進一步穩定,且更穩定地長時期維持在固化步驟期間實現之薄膜的光學特性及機械特性。If the step of cooling the cured film is performed in such a multi-stage manner, it is possible to further stabilize the physical properties of the cured film and maintain the optical and mechanical properties of the film realized during the curing step more stably for a long period of time.
凝膠薄片之移動速度與固化薄膜之移動速度相同。The moving speed of the gel sheet is the same as the moving speed of the cured film.
用於製備聚合物薄膜之製程包含使用捲繞機捲繞經冷卻之固化薄膜(S700)。The process for preparing the polymer film includes winding the cooled solidified film using a winder (S700).
參考圖3,經冷卻之固化薄膜可使用輥形捲繞機(50)捲繞。Referring to Figure 3, the cooled solidified film can be wound using a roll winder (50).
在此類情況下,在乾燥時凝膠薄片在傳動帶上之移動速度與在捲繞時固化薄膜之移動速度的比可為1:0.95至1:1.40。具體而言,移動速度之比可為1:0.99至1:1.20、1:0.99至1:1.10、1:1.0至1:1.05或1:1.01至1:1.05,但其不限於此。In such cases, the ratio of the moving speed of the gel sheet on the drive belt during drying to the moving speed of the cured film during winding may be 1:0.95 to 1:1.40. Specifically, the ratio of the moving speed may be 1:0.99 to 1:1.20, 1:0.99 to 1:1.10, 1:1.0 to 1:1.05, or 1:1.01 to 1:1.05, but it is not limited thereto.
若移動速度之比在以上範圍外,則固化薄膜之機械特性可能受損,且可撓性及彈性特性可能劣化。If the ratio of the moving speed is outside the above range, the mechanical properties of the cured film may be impaired, and the flexibility and elastic properties may be deteriorated.
在用於製備聚合物薄膜之製程中,根據以下等式1之厚度差異(%)可為3%至30%。具體而言,厚度差異(%)可為5%至20%,但其不限於此。 [等式1]厚度差異(%) = {(M1 - M2)/M2} × 100In the process for preparing the polymer film, the thickness difference (%) according to the following equation 1 can be 3% to 30%. Specifically, the thickness difference (%) may be 5% to 20%, but it is not limited thereto. [Equation 1] Thickness difference (%) = {(M1-M2)/M2} × 100
在以上等式1中,M1為凝膠薄片之厚度(μm),且M2為在捲繞時經冷卻之固化薄膜的厚度(μm)。In Equation 1 above, M1 is the thickness (μm) of the gel sheet, and M2 is the thickness (μm) of the solidified film cooled during winding.
藉由如上文所描述之製備製程製備的聚合物薄膜防黏特徵、光學特性及機械特性極佳。聚合物薄膜可適用於需要撓曲抗性、可撓性、耐久性及透明度之各種用途。舉例而言,聚合物薄膜可應用於太陽能電池、半導體裝置、感測器及其類似物,以及顯示裝置。The polymer film prepared by the preparation process as described above has excellent anti-adhesion characteristics, optical characteristics and mechanical characteristics. The polymer film can be applied to various applications requiring flex resistance, flexibility, durability, and transparency. For example, polymer films can be applied to solar cells, semiconductor devices, sensors and the like, and display devices.
關於藉由用於製備聚合物薄膜之製程製備的聚合物薄膜之細節如上文所描述。The details of the polymer film prepared by the process for preparing the polymer film are as described above.
下文中,將藉由參考實例詳細描述以上描述。然而,闡述此等實例以說明本發明,且本發明之範疇不限於此。實例及評估實例 實例1aHereinafter, the above description will be described in detail by referring to examples. However, these examples are set forth to illustrate the present invention, and the scope of the present invention is not limited thereto. Examples and evaluation examples Example 1a
在20℃下在氮氣氛圍下,向配備有溫度可控雙夾套之1公升玻璃反應器中裝入作為有機溶劑之二甲基乙醯胺(DMAc)。隨後,向其中緩慢添加2,2'-雙(三氟甲基)-4,4'-二胺基聯苯(TFMB) (0.2莫耳)以便其溶解。隨後,向其中緩慢添加2,2'-雙(3,4-二羧基苯基)六氟丙烷二酐(6FDA) (0.1莫耳),且將混合物攪拌1小時。隨後,添加作為二羰基化合物之對酞醯氯(TPC) (0.1莫耳),接著將混合物攪拌1小時,藉此製備聚合物溶液。In a nitrogen atmosphere at 20°C, a 1 liter glass reactor equipped with a temperature-controllable double jacket was charged with dimethylacetamide (DMAc) as an organic solvent. Subsequently, 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl (TFMB) (0.2 mol) was slowly added thereto to dissolve it. Subsequently, 2,2'-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) (0.1 mol) was slowly added thereto, and the mixture was stirred for 1 hour. Subsequently, terephthaloyl chloride (TPC) (0.1 mol) as a dicarbonyl compound was added, and then the mixture was stirred for 1 hour, thereby preparing a polymer solution.
隨後,向聚合物溶液中添加17 g作為脫水劑之乙酸酐及4.5 g作為催化劑之異喹啉,接著攪拌1小時。其後,添加作為pH調整劑之丁酸,接著攪拌2小時以製備聚合物溶液。Subsequently, 17 g of acetic anhydride as a dehydrating agent and 4.5 g of isoquinoline as a catalyst were added to the polymer solution, followed by stirring for 1 hour. Thereafter, butyric acid as a pH adjuster was added, followed by stirring for 2 hours to prepare a polymer solution.
將由此獲得之聚合物溶液塗佈於玻璃板上且隨後用熱空氣在100℃下乾燥30分鐘。隨後使其自玻璃板脫離且隨後固定於針腳框,將其在270℃下熱處理30分鐘以獲得厚度為50 μm之聚合物薄膜。 實例2a及3a及比較實例1a及2aThe polymer solution thus obtained was coated on a glass plate and then dried with hot air at 100°C for 30 minutes. It was then detached from the glass plate and then fixed to the pin frame, and heat-treated at 270°C for 30 minutes to obtain a polymer film with a thickness of 50 μm. Examples 2a and 3a and Comparative Examples 1a and 2a
以與實例1a中相同之方式製備薄膜,其例外之處在於如以下表1中所示改變各別反應物之類型及含量及其類似者。The film was prepared in the same manner as in Example 1a, except that the type and content of the respective reactants and the like were changed as shown in Table 1 below.
實例1a至3a及比較實例1a及2a中製備之薄膜各自針對以下特性經量測及評估。結果展示於以下表1中。 評估實例1a:薄膜厚度之量測The films prepared in Examples 1a to 3a and Comparative Examples 1a and 2a were each measured and evaluated for the following characteristics. The results are shown in Table 1 below. Evaluation example 1a: Measurement of film thickness
使用由Mitutoyo Corporation製造之數位測微計547-401在橫向方向上5個點處量測厚度。採用其平均值作為厚度。 評估實例2a:薄膜中殘餘溶劑含量之量測A digital micrometer 547-401 manufactured by Mitutoyo Corporation was used to measure the thickness at 5 points in the lateral direction. The average value is used as the thickness. Evaluation example 2a: Measurement of residual solvent content in the film
在熱重分析儀(由Shimadzu Corporation製造之DTG-50)中使溫度在氮氣流中以15℃/分鐘之溫度升高速率自室溫升高至300℃,且在300℃下維持30分鐘。將藉由將溫度自150℃升高至300℃及在300℃下維持30分鐘期間減少之重量的總和除以樣品之初始重量獲得之值視為薄膜中之殘餘溶劑含量。 評估實例3a:薄膜中丁酸含量之量測In a thermogravimetric analyzer (DTG-50 manufactured by Shimadzu Corporation), the temperature was increased from room temperature to 300°C at a temperature increase rate of 15°C/min in a nitrogen stream, and maintained at 300°C for 30 minutes. The value obtained by dividing the sum of the weight lost during the temperature increase from 150°C to 300°C and maintaining at 300°C for 30 minutes by the initial weight of the sample is regarded as the residual solvent content in the film. Evaluation example 3a: Measurement of the content of butyric acid in the film
使用TD-GC MS分析來量測薄膜中之丁酸含量。具體而言,將0.02 g薄膜樣品負載至樣品管中,將其以10℃/分鐘之速率自25℃加熱至300℃。隨溫度升高產生之氣體吸附至吸附管(Tenax)中,其經瞬時加熱(脫附)且藉由氣相層析分離成各組分。分離的組分在質譜儀上偵測,且針對所獲得之層析圖中的組分類型及含量進行分析。TD-GC MS analysis was used to measure the butyric acid content in the film. Specifically, 0.02 g of the film sample was loaded into the sample tube, and it was heated from 25°C to 300°C at a rate of 10°C/min. The gas generated as the temperature rises is adsorbed into the adsorption tube (Tenax), which is instantaneously heated (desorbed) and separated into components by gas chromatography. The separated components are detected on the mass spectrometer, and the type and content of the components in the obtained chromatogram are analyzed.
丁酸含量以基於薄膜總重量計之ppm量測。結果展示於以下表1中。 評估實例4a:透射率及霧度之量測The butyric acid content is measured in ppm based on the total weight of the film. The results are shown in Table 1 below. Evaluation example 4a: Measurement of transmittance and haze
550 nm下之透射率使用由Nippon Denshoku Kogyo製造之霧度計NDH-5000W量測。 評估實例5a:黃色指數之量測The transmittance at 550 nm is measured using a haze meter NDH-5000W manufactured by Nippon Denshoku Kogyo. Evaluation Example 5a: Measurement of Yellow Index
黃色指數(YI)用分光光度計(UltraScan PRO,Hunter Associates Laboratory)使用CIE色度系統量測。 評估實例6a:平面內相位差之量測The yellow index (YI) was measured with a spectrophotometer (UltraScan PRO, Hunter Associates Laboratory) using the CIE colorimetric system. Evaluation example 6a: Measurement of in-plane phase difference
平面內相位差(Ro)用相位差量測裝置量測(Axometrics之Axoscan,量測波長:550 nm)。另外,作為用於量測相位差之基本資料的折射率用Abbe折射計量測(由Atago Co., Ltd.製造之NAR-4T,量測波長:589.3 nm)。 評估實例7a:高壓釜處理The in-plane phase difference (Ro) is measured with a phase difference measuring device (Axoscan of Axometrics, measuring wavelength: 550 nm). In addition, the refractive index, which is the basic data for measuring the phase difference, was measured by Abbe refractometry (NAR-4T manufactured by Atago Co., Ltd., measurement wavelength: 589.3 nm). Evaluation example 7a: autoclave treatment
將長度為10 cm、寬度為2 cm且厚度為50 μm之薄膜固定於高壓釜中,高壓釜填充有2公升水,且高壓釜隨後經閉合及加熱。在此類情況下,高壓釜之溫度設定為120℃,且壓力升高至1.2 atm,以便處理24小時。設定時間過去之後,高壓釜自動關閉。出口閥打開之後,取出薄膜且量測物理特性。薄膜未浸沒於水中。 評估實例8a:撓曲抗性之量測A film with a length of 10 cm, a width of 2 cm and a thickness of 50 μm was fixed in an autoclave, the autoclave was filled with 2 liters of water, and the autoclave was then closed and heated. In such cases, the temperature of the autoclave was set to 120°C and the pressure was increased to 1.2 atm for 24 hours of treatment. After the set time has elapsed, the autoclave is automatically closed. After the outlet valve is opened, the film is taken out and the physical properties are measured. The film is not immersed in water. Evaluation Example 8a: Measurement of Flexural Resistance
當厚度為50 μm之薄膜經摺疊以具有3 mm曲率半徑且隨後展開時對摺疊數進行計數(在摺疊及展開後摺疊數計數為一)。若在重複摺疊100,000次後在摺疊側處未視覺觀測到變形,則其指示為○。若在重複摺疊100,000次後在摺疊側處視覺觀測到變形,則其指示為×。摺疊次數之數目使用YUASA U形摺疊設備計數。
[表1]
如自以上表1可見,實例1a至3a之聚合物薄膜在薄膜中之殘餘溶劑含量為1,200 ppm或更小,且丁酸含量為1,200 ppm或更小。因此,即使在高溫及高濕之苛刻條件下處理之後其亦維持極佳光學特性。As can be seen from Table 1 above, the polymer films of Examples 1a to 3a have a residual solvent content of 1,200 ppm or less in the film, and a butyric acid content of 1,200 ppm or less. Therefore, it maintains excellent optical properties even after being processed under severe conditions of high temperature and high humidity.
相比之下,比較實例1a及2a之聚合物薄膜在薄膜中無剩餘丁酸,且殘餘溶劑含量超過1,200 ppm。聚合物中剩餘的低分子量聚合物在高壓釜處理後溶離。因此,光學特性,諸如霧度、黃度及平面內相位差顯著劣化。 實例1bIn contrast, the polymer films of Comparative Examples 1a and 2a have no residual butyric acid in the film, and the residual solvent content exceeds 1,200 ppm. The low-molecular-weight polymer remaining in the polymer dissolves after autoclave treatment. Therefore, optical characteristics such as haze, yellowness, and in-plane phase difference are significantly deteriorated. Example 1b
在20℃下在氮氣氛圍下,向配備有溫度可控雙夾套之1公升玻璃反應器中裝入585.68 g作為有機溶劑之二甲基乙醯胺(DMAc)。隨後,向其中緩慢添加0.2莫耳2,2'-雙(三氟甲基)-4,4'-二胺基聯苯(TFMB)以便其溶解。其後,緩慢添加0.02莫耳3,3',4,4'-二苯基酮(BTDA),接著攪拌1小時。隨後,添加0.06莫耳異酞醯氯(IPC),接著攪拌1小時。且添加0.12莫耳對酞醯氯(TPC),接著攪拌1小時,藉此製備聚合物溶液。將由此獲得之聚合物溶液塗佈於玻璃板上且隨後用熱空氣在約80℃下乾燥20分鐘以製備凝膠薄片。使凝膠薄片自玻璃板脫離且隨後固定於針腳框。在將乾燥凝膠薄片分別在第一方向上及在垂直於第一方向之第二方向上拉伸1.03倍的同時將其固定於針腳框。將固定凝膠薄片在約270℃下熱處理30分鐘,以獲得厚度為50 μm之聚合物薄膜。In a nitrogen atmosphere at 20°C, a 1 liter glass reactor equipped with a temperature-controllable double jacket was charged with 585.68 g of dimethylacetamide (DMAc) as an organic solvent. Subsequently, 0.2 mol of 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl (TFMB) was slowly added thereto to dissolve it. Thereafter, 0.02 mol of 3,3',4,4'-diphenyl ketone (BTDA) was slowly added, followed by stirring for 1 hour. Subsequently, 0.06 mol isophthaloyl chloride (IPC) was added, followed by stirring for 1 hour. Furthermore, 0.12 mol of terephthalochloride (TPC) was added, followed by stirring for 1 hour, thereby preparing a polymer solution. The polymer solution thus obtained was coated on a glass plate and then dried with hot air at about 80°C for 20 minutes to prepare a gel sheet. The gel sheet is detached from the glass plate and then fixed to the stitch frame. The dried gel sheet is fixed to the stitch frame while being stretched 1.03 times in the first direction and in the second direction perpendicular to the first direction. The fixed gel sheet was heat-treated at about 270°C for 30 minutes to obtain a polymer film with a thickness of 50 μm.
關於TFMB、BTDA、TPC及IPC之含量,基於100莫耳二胺化合物計的二酐化合物及二羰基化合物之莫耳數展示於表2中。 實例2b至6b及比較實例1b至3bRegarding the contents of TFMB, BTDA, TPC and IPC, the molar numbers of dianhydride compounds and dicarbonyl compounds based on 100 molar diamine compounds are shown in Table 2. Examples 2b to 6b and Comparative Examples 1b to 3b
以與實例1b中相同之方式製備薄膜,其例外之處在於如以下表2中所示改變各別反應物之類型及含量、熱處理之時間及其類似者。The film was prepared in the same manner as in Example 1b, except that the type and content of the respective reactants, the heat treatment time, and the like were changed as shown in Table 2 below.
實例1b至6b及比較實例1b至3b中製備之薄膜各自針對以下特性經量測及評估。結果展示於以下表2中。 評估實例1b:薄膜厚度之量測The films prepared in Examples 1b to 6b and Comparative Examples 1b to 3b were each measured and evaluated for the following characteristics. The results are shown in Table 2 below. Evaluation example 1b: Measurement of film thickness
使用由Mitutoyo Corporation製造之數位測微計547-401在橫向方向上5個點處量測厚度。採用其平均值作為厚度。 評估實例2b:薄膜中殘餘溶劑之量測A digital micrometer 547-401 manufactured by Mitutoyo Corporation was used to measure the thickness at 5 points in the lateral direction. The average value is used as the thickness. Evaluation example 2b: Measurement of residual solvent in the film
取出0.02 g樣品且其使用Purge&Trap-GC/MSD裝置在30℃下吹掃1小時。在300℃下收集除氣10分鐘,其經定量及定性分析以量測殘餘溶劑之量。 評估實例3b:抗拉強度及斷裂伸長率之量測A sample of 0.02 g was taken and it was purged using a Purge & Trap-GC/MSD device at 30°C for 1 hour. The degassing was collected at 300°C for 10 minutes, which was subjected to quantitative and qualitative analysis to measure the amount of residual solvent. Evaluation example 3b: Measurement of tensile strength and elongation at break
以在垂直於薄膜主要收縮方向之方向上至少5 cm且在主要收縮方向上10 cm切斷樣品。其藉由以10 cm間隔安置之夾固定於通用測試機Instron UTM 5566A中。在將樣品在室溫下以12.5毫米/分鐘之速率拉伸的同時獲得應力應變曲線,直至樣品斷裂。由應力應變曲線量測抗拉強度及斷裂伸長率。 評估實例4b:模數之量測Cut the sample at least 5 cm in the direction perpendicular to the main shrinking direction of the film and 10 cm in the main shrinking direction. It is fixed in the universal testing machine Instron UTM 5566A with clips placed at intervals of 10 cm. The stress-strain curve is obtained while the sample is stretched at a rate of 12.5 mm/min at room temperature until the sample breaks. Measure the tensile strength and elongation at break from the stress-strain curve. Evaluation example 4b: Measurement of modulus
以在垂直於薄膜主要收縮方向之方向上至少5 cm且在主要收縮方向上10 cm切斷樣品。其藉由以5 cm間隔安置之夾固定於通用測試機Instron UTM 5566A中。在將樣品在室溫下以5毫米/分鐘之速率拉伸的同時獲得應力應變曲線,直至樣品斷裂。應力應變曲線上相對於初始應變之負載的斜率視為模數(GPa)。 評估實例5b:高壓釜處理Cut the sample at least 5 cm in the direction perpendicular to the main shrinking direction of the film and 10 cm in the main shrinking direction. It is fixed in the universal testing machine Instron UTM 5566A with clips placed at intervals of 5 cm. The stress-strain curve is obtained while the sample is stretched at a rate of 5 mm/min at room temperature until the sample breaks. The slope of the load relative to the initial strain on the stress-strain curve is regarded as the modulus (GPa). Evaluation example 5b: autoclave treatment
將長度為10 cm、寬度為2 cm且厚度為50 μm之薄膜固定於高壓釜中,高壓釜填充有2公升水,且高壓釜隨後經閉合及加熱。在此類情況下,高壓釜之溫度設定為120℃,且壓力升高至1.2 atm,以便處理24小時或72小時。設定時間過去之後,高壓釜自動關閉。出口閥打開之後,取出薄膜且量測物理特性。薄膜未浸沒於水中。 評估實例6b:透射率之量測A film with a length of 10 cm, a width of 2 cm and a thickness of 50 μm was fixed in an autoclave, the autoclave was filled with 2 liters of water, and the autoclave was then closed and heated. In such cases, the temperature of the autoclave is set to 120°C and the pressure is increased to 1.2 atm for 24 hours or 72 hours of treatment. After the set time has elapsed, the autoclave is automatically closed. After the outlet valve is opened, the film is taken out and the physical properties are measured. The film is not immersed in water. Evaluation example 6b: Measurement of transmittance
550 nm下之透射率使用由Nippon Denshoku Kogyo製造之霧度計NDH-5000W量測。 評估實例7b:黃色指數之量測The transmittance at 550 nm is measured using a haze meter NDH-5000W manufactured by Nippon Denshoku Kogyo. Evaluation Example 7b: Measurement of Yellow Index
黃色指數(YI)用分光光度計(UltraScan PRO,Hunter Associates Laboratory)使用CIE色度系統量測。 評估實例8b:撓曲抗性之量測The yellow index (YI) was measured with a spectrophotometer (UltraScan PRO, Hunter Associates Laboratory) using the CIE colorimetric system. Evaluation Example 8b: Measurement of Flexural Resistance
當厚度為50 μm之聚合物薄膜經摺疊以具有3 mm曲率半徑且隨後展開時對摺疊數進行計數(在摺疊及展開後摺疊數計數為一)。若其在重複摺疊100,000次後未斷裂,則其指示為○。若在重複摺疊100,000次之前斷裂,則其指示為×。摺疊次數之數目使用YUASA U形摺疊設備計數。
[表2]
如自以上表2可見,當實例1b至6b之聚合物薄膜經歷反覆摺疊,達到3 mm曲率半徑時,斷裂之前的摺疊數為100,000次或更多。As can be seen from Table 2 above, when the polymer films of Examples 1b to 6b undergo repeated folding and reach a radius of curvature of 3 mm, the number of folds before breaking is 100,000 times or more.
另外,實例1b至6b之聚合物薄膜的黃色指數及透射率極佳,更不必說極佳摺疊特徵。In addition, the yellow index and transmittance of the polymer films of Examples 1b to 6b are excellent, not to mention excellent folding characteristics.
此外,實例1b至6b之聚合物薄膜具有高機械特性,諸如抗拉強度、斷裂伸長率及模數,且即使在高溫及高濕之苛刻條件下處理某一時間段之後亦維持極佳機械特性。 實例1cIn addition, the polymer films of Examples 1b to 6b have high mechanical properties, such as tensile strength, elongation at break and modulus, and maintain excellent mechanical properties even after being treated for a certain period of time under severe conditions of high temperature and high humidity . Example 1c
在20℃下在氮氣氛圍下,向配備有溫度可控雙夾套之1公升玻璃反應器中裝入作為有機溶劑之二甲基乙醯胺(DMAc)。隨後,向其中緩慢添加2,2'-雙(三氟甲基)-4,4'-二胺基聯苯(TFMB)以便其溶解。隨後,向其中緩慢添加2,2'-雙(3,4-二羧基苯基)六氟丙烷二酐(6FDA),且將混合物攪拌1小時。隨後,添加對酞醯氯(TPC),接著將其攪拌2小時。In a nitrogen atmosphere at 20°C, a 1 liter glass reactor equipped with a temperature-controllable double jacket was charged with dimethylacetamide (DMAc) as an organic solvent. Subsequently, 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl (TFMB) was slowly added thereto to dissolve it. Subsequently, 2,2'-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) was slowly added thereto, and the mixture was stirred for 1 hour. Subsequently, terephthalochloride (TPC) was added, followed by stirring for 2 hours.
隨後,向聚合物溶液中添加作為催化劑之吡啶及作為脫水劑之乙酸酐。另外,添加作為pH調整劑之丁酸,接著攪拌2小時以製備聚合物溶液。Subsequently, pyridine as a catalyst and acetic anhydride as a dehydrating agent are added to the polymer solution. In addition, butyric acid as a pH adjuster was added, followed by stirring for 2 hours to prepare a polymer solution.
將由此獲得之聚合物溶液塗佈於玻璃板上且隨後用熱空氣在80℃下乾燥30分鐘。隨後將凝膠薄片以2℃/分鐘之溫度升高速率在80℃至300℃範圍內之溫度下乾燥,以獲得厚度為50 μm之聚合物薄膜。The polymer solution thus obtained was coated on a glass plate and then dried with hot air at 80°C for 30 minutes. Subsequently, the gel sheet was dried at a temperature in the range of 80°C to 300°C at a temperature increase rate of 2°C/min to obtain a polymer film with a thickness of 50 μm.
關於二胺化合物(TFMB)、二酐化合物(6FDA)及二羰基化合物(TPC)之含量,其莫耳數展示於表3中。Regarding the content of diamine compound (TFMB), dianhydride compound (6FDA) and dicarbonyl compound (TPC), the molar numbers are shown in Table 3.
另外,所添加之催化劑(吡啶)及丁酸之含量基於聚合物溶液之總重量轉換,且展示於表3中。 實例2c至5c及比較實例1c至3cIn addition, the content of the added catalyst (pyridine) and butyric acid is converted based on the total weight of the polymer solution, and is shown in Table 3. Examples 2c to 5c and Comparative Examples 1c to 3c
以與實例1c中相同之方式製備薄膜,其例外之處在於如以下表3中所展示改變各別反應物之類型及含量及其類似者。另外,在比較實例1c至3c中未添加丁酸。The film was prepared in the same manner as in Example 1c, except that the type and content of the respective reactants and the like were changed as shown in Table 3 below. In addition, butyric acid was not added in Comparative Examples 1c to 3c.
實例1c至5c及比較實例1c至3c中製備之薄膜各自針對以下特性經量測及評估。結果展示於以下表3中。 評估實例1c:薄膜中丁酸含量之量測The films prepared in Examples 1c to 5c and Comparative Examples 1c to 3c were each measured and evaluated for the following characteristics. The results are shown in Table 3 below. Evaluation example 1c: Measurement of the content of butyric acid in the film
使用TD-GC MS分析來量測薄膜中之丁酸含量。具體而言,將0.02 g薄膜樣品負載至樣品管中,將其以10℃/分鐘之速率自25℃加熱至300℃。隨溫度升高產生之氣體吸附至吸附管(Tenax)中,其經瞬時加熱(脫附)且藉由氣相層析分離成各組分。分離的組分在質譜儀上偵測,且針對所獲得之層析圖中的組分類型及含量進行分析。TD-GC MS analysis was used to measure the butyric acid content in the film. Specifically, 0.02 g of the film sample was loaded into the sample tube, and it was heated from 25°C to 300°C at a rate of 10°C/min. The gas generated as the temperature rises is adsorbed into the adsorption tube (Tenax), which is instantaneously heated (desorbed) and separated into components by gas chromatography. The separated components are detected on the mass spectrometer, and the type and content of the components in the obtained chromatogram are analyzed.
丁酸含量以基於薄膜總重量計之ppm量測。結果展示於以下表3中。 評估實例2c:變形角之評估(靜態撓曲測試)The butyric acid content is measured in ppm based on the total weight of the film. The results are shown in Table 3 below. Evaluation example 2c: Evaluation of deformation angle (static deflection test)
寬度為20 mm、長度為150 mm且厚度為50 μm之聚合物薄膜經摺疊以具有2 mm曲率半徑,隨後薄膜在25℃下靜置24小時,且釋放施加至薄膜之力。隨後,量測薄膜之內角。 評估實例3c:摺疊之評估A polymer film with a width of 20 mm, a length of 150 mm, and a thickness of 50 μm was folded to have a radius of curvature of 2 mm, and then the film was allowed to stand at 25° C. for 24 hours, and the force applied to the film was released. Subsequently, the inner angle of the film was measured. Evaluation Example 3c: Evaluation of Folding
使厚度為50 μm之薄膜經歷反覆摺疊以具有2 mm曲率半徑,且隨後展開(在摺疊及展開後,摺疊數計數為一)。摺疊速度為60 rpm。若其在重複摺疊200,000次後未斷裂,則其指示為合格。若在重複摺疊200,000次之前斷裂,則其指示為不合格。摺疊次數之數目使用YUASA U形摺疊設備計數。 評估實例4c:透射率之量測A film with a thickness of 50 μm is subjected to repeated folding to have a radius of curvature of 2 mm, and then unfolded (after folding and unfolding, the number of folds is counted as one). The folding speed is 60 rpm. If it does not break after repeated folding 200,000 times, it is indicated as qualified. If it breaks before repeated folding 200,000 times, it is indicated as unqualified. The number of times of folding is counted using YUASA U-shaped folding equipment. Evaluation example 4c: Measurement of transmittance
550 nm下之透射率使用由Nippon Denshoku Kogyo製造之霧度計NDH-5000W量測。 評估實例5c:黃色指數之量測The transmittance at 550 nm is measured using a haze meter NDH-5000W manufactured by Nippon Denshoku Kogyo. Evaluation Example 5c: Measurement of Yellow Index
黃色指數(YI)用分光光度計(UltraScan PRO,Hunter Associates Laboratory)使用CIE色度系統量測。 評估實例6c:模數之量測The yellow index (YI) was measured with a spectrophotometer (UltraScan PRO, Hunter Associates Laboratory) using the CIE colorimetric system. Evaluation example 6c: measurement of modulus
以在垂直於薄膜主要收縮方向之方向上至少5 cm且在主要收縮方向上10 cm切斷樣品。其藉由以5 cm間隔安置之夾固定於通用測試機Instron UTM 5566A中。在將樣品在室溫下以5毫米/分鐘之速率拉伸的同時獲得應力應變曲線,直至樣品斷裂。應力應變曲線上相對於初始應變之負載的斜率視為模數(GPa)。
[表3]
如自以上表3可見,實例1c至5c之聚合物薄膜中丁酸繼續存在。因此,在其已經長時期摺疊且隨後返回至展開狀態時可恢復性極佳。具體而言,實例1c至5c之聚合物薄膜在靜態撓曲測試中之變形角為120°或更大,而比較實例1c至3c之聚合物薄膜在靜態撓曲測試中之變形角為115°或更小,展示不良結果。As can be seen from Table 3 above, butyric acid continues to exist in the polymer films of Examples 1c to 5c. Therefore, the recoverability is excellent when it has been folded for a long period of time and then returned to the unfolded state. Specifically, the polymer films of Examples 1c to 5c had a deformation angle of 120° or greater in the static deflection test, while the polymer films of Comparative Examples 1c to 3c had a deformation angle of 115° in the static deflection test. Or smaller, showing bad results.
另外,當實例1c至5c之聚合物薄膜經歷反覆摺疊,達到2 mm曲率半徑時,斷裂之前的摺疊數為200,000次或更大。因此,其適合應用於可摺疊顯示器、可撓性顯示器、可捲曲顯示器及其類似物。相比之下,在摺疊測試中,比較實例1c至3c之聚合物薄膜在摺疊數為200,000次之前斷裂。In addition, when the polymer films of Examples 1c to 5c were repeatedly folded and reached a radius of curvature of 2 mm, the number of folds before breaking was 200,000 times or more. Therefore, it is suitable for use in foldable displays, flexible displays, rollable displays and the like. In contrast, in the folding test, the polymer films of Comparative Examples 1c to 3c were broken before the number of folds was 200,000.
此外,實例1c至5c之聚合物薄膜維持極佳機械特性(諸如靜態撓曲特徵、摺疊特徵及模數)及光學特性(諸如透射率及黃色指數)。In addition, the polymer films of Examples 1c to 5c maintained excellent mechanical properties (such as static deflection characteristics, folding characteristics, and modulus) and optical properties (such as transmittance and yellow index).
10:聚合儀器 20:槽 30:傳動帶 40:熱固裝置 50:捲繞機 100:聚合物薄膜 101:第一側 102:第二側 200:功能層 300:前面板 400:顯示單元 500:黏著層 S100:製備聚合物溶液 S200:將聚合物溶液轉移至槽中 S300:用惰性氣體吹掃槽 S400:澆鑄聚合物溶液且隨後對其進行乾燥以製備凝膠薄片 S500:對凝膠薄片進行熱處理以製備固化薄膜 S600:使固化薄膜冷卻 S700:使用捲繞機捲繞經冷卻之固化薄膜10: Polymerization instrument 20: Slot 30: Transmission belt 40: thermosetting device 50: Winder 100: polymer film 101: first side 102: second side 200: functional layer 300: front panel 400: display unit 500: Adhesive layer S100: Preparation of polymer solution S200: Transfer the polymer solution to the tank S300: Purge the tank with inert gas S400: Casting a polymer solution and then drying it to prepare a gel sheet S500: Heat treatment of the gel sheet to prepare a cured film S600: Cool the solidified film S700: Use a winder to wind the cooled solidified film
圖1為根據一實施例之顯示裝置的剖面圖。FIG. 1 is a cross-sectional view of a display device according to an embodiment.
圖2為根據一實施例用於製備聚合物薄膜之製程的示意性流程圖。Fig. 2 is a schematic flow chart of a process for preparing a polymer film according to an embodiment.
圖3示意性示出用於製備根據一實施例之聚合物薄膜的製程設備。Fig. 3 schematically shows a process equipment for preparing a polymer film according to an embodiment.
100:聚合物薄膜 100: polymer film
101:第一側 101: first side
102:第二側 102: second side
200:功能層 200: functional layer
300:前面板 300: front panel
400:顯示單元 400: display unit
500:黏著層 500: Adhesive layer
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