TWI730792B - Optical-electronic detection system and method for inspecting die - Google Patents

Abstract

An optical-electronic detection system is provided. The optical detection system includes a detection stage, a probe card, an image capture module and an analysis module. The image capture module could capture an image of the needle tip and its corresponding pad through a penetrating hole to obtain image information. The analysis module analyzes the image information to be calculated to calculate the horizontal offset, and the analysis module calculates a horizontal allowable value according to the horizontal offset, and then combines the horizontal allowable value with the horizontal position information to determine the needle horizontal position information. The motion module adjusts the horizontal relative position of the probe card and the detection stage according to the needle horizontal position information, and then controls the vertical relative position of the probe card and the detection stage according to a vertical position information, so that the needle tips could be electrically contacted pad. In addition, a method for inspecting die is provided.

Description

Photoelectric detection system and method for detecting crystal grain

The invention relates to a photoelectric detection system and a method for detecting crystal grains, in particular to a photoelectric detection system and a method for detecting crystal grains applied to the detection of LEDs.

Light Emitting Diode (LED) has characteristics such as power saving, long life and fast response speed. With the continuous improvement of the LED manufacturing process, the volume (size) of the LED die can be reduced, so that the on-wafer The more LED dies that can be carried, the more it can be used as a pixel of a display panel.

For the diced wafer, since the relative positions of the LEDs on the wafer are not the same, in order to effectively control the light characteristics of each LED, the prior art will measure each LED on a wafer one by one. By this, the pros and cons of each LED on the wafer can be judged. However, the method of inspecting LEDs one by one is too tedious. If the number of LEDs is larger, the time it takes to inspect a wafer will be longer, which becomes a bottleneck in the production process. This is for factories that need to mass produce wafers. , In addition to not conducive to the overall production cycle time, it also affects the subsequent process control evaluation time; moreover, if you want to test multiple LEDs at the same time, because the relative position of each LED after cutting is not as good as the original arrangement before cutting, it will There are technical difficulties in mechanical alignment to supply power to a plurality of cut LEDs at the same time.

Therefore, how to improve and provide a "photoelectric detection system and die detection method" to avoid the above-mentioned problems is a problem to be solved in the industry.

The invention provides a photoelectric detection system and a method for detecting crystal grains. During the alignment process, the needle tip and the soldering pad of the LED crystal grain can be taken simultaneously, and the optimal needle position of each probe is sought to be matched to make the area The electrical properties of the LED die are relatively uniform.

An embodiment of the present invention provides a photoelectric detection system, which includes a detection carrier, a probe card, an image capture module, and an analysis module. The detection carrier is connected to a motion module. One side of the inspection platform can carry a carrier. There are a plurality of LED dies on the carrier. Each LED die is provided with two soldering pads. The carrier defines at least one area to be inspected, and each soldering pad defines one Position reference point. The probe card is connected to the motion module. The probe card includes a probe substrate, a plurality of probes, and a penetration hole. The penetration hole penetrates the probe substrate. Each probe is connected to the probe substrate. Each probe has a needle tip and the penetration hole can Expose each needle tip and a plurality of solder pads in the area to be inspected. The image capture module is connected to the motion module. The motion module can control the horizontal relative position of the image capture module, the probe card, and the detection stage according to a horizontal position information, and make each needle point corresponding to the position to be detected. The solder pads in the area, and enable the image capture module to capture images of a plurality of needle tips and their corresponding solder pads through the through holes to obtain image information to be inspected. The image information to be inspected includes the corresponding plural needle tips One piece of needle tip information and one of the plurality of pads in the area to be inspected corresponding to the pad information to be inspected. The analysis module is connected to the image capture module. The analysis module analyzes the needle tip information and the information of the solder pads to be detected to calculate the horizontal offset of each needle tip relative to the position reference point of the corresponding solder pad, and the analysis module bases it on A horizontal allowable value is calculated for each horizontal offset, and then the horizontal allowable value is combined with the horizontal position information to determine the horizontal position information of a needle. The motion module is connected to the analysis module. The motion module adjusts the horizontal relative position of the probe card and the detection stage according to the needle horizontal position information, and then controls the probe card to be vertically opposed to one of the detection stages according to a vertical position information Position so that each needle tip can electrically contact its corresponding solder pad.

In one embodiment, the above-mentioned carrier further defines at least one area to be detected. The through hole exposes a plurality of solder pads in the area to be inspected and the area to be inspected. The image capture module can capture images of a plurality of solder pads in the area to be inspected and the area to be inspected through the penetrating hole, so that the image information to be inspected further includes one of the solder pads in the corresponding inspection area to be inspected. Pad information, and the analysis module can analyze the pad information to be inspected.

In one embodiment, the above-mentioned photoelectric detection system further includes an electrical detection module, the electrical detection module is electrically connected to a plurality of probes, and the electrical detection module is controlled by the analysis module.

In one embodiment, the above-mentioned photoelectric detection system further includes an optical detection module, which is arranged on the other side of the detection carrier and can receive and analyze the light signals emitted by the plurality of LED dies.

In one embodiment, the above-mentioned motion module can drive the detection stage to perform multi-axis motion relative to the probe card to control the horizontal and vertical relative positions of the image capture module, the probe card, and the detection stage .

An embodiment of the present invention also provides a method for inspecting die, including the following steps: providing a carrier with a plurality of LED dies on the inspection stage, each LED die is provided with two soldering pads, and the carrier is defined with At least one area to be inspected, each pad is defined with a position reference point; horizontal position control is performed, and the motion module controls the horizontal relative position of the image capture module, probe card, and inspection stage according to the horizontal position information. The needle card includes a probe substrate, a plurality of probes and penetration holes. The penetration holes penetrate the probe substrate. Each probe is connected to the probe substrate, and each probe has a needle tip, and the penetration hole can be exposed A plurality of soldering pads in each needle tip and the area to be inspected are drawn out, and each needle tip can correspond to the solder pads located in the area to be inspected; image capture is performed, and the image capture module can perform image capture on the plurality of needle tips and the area to be inspected. Corresponding solder pads are captured to obtain image information to be inspected. The image information to be inspected includes the tip information corresponding to a plurality of needle tips and the information of the pads to be inspected corresponding to the plurality of pads in the area to be inspected; analyze the position information, An analysis module analyzes the tip information and the information of the solder pad to be detected to calculate a horizontal offset of each tip relative to the position reference point of the corresponding solder pad, and the analysis module calculates a horizontal offset according to each horizontal offset. The horizontal allowable value is combined with the horizontal position information to determine the horizontal position information of the needle; and the needle operation is performed. The motion module adjusts the horizontal relative position of the probe card and the detection stage according to the needle horizontal position information , And then control the vertical relative position of the probe card and one of the detection stages according to a vertical position information, so that each needle tip can electrically contact its corresponding solder pad.

In one embodiment, in the step of analyzing the position information, the carrier further defines at least one area to be inspected, and the through hole exposes the area to be inspected and a plurality of solder pads in the area to be inspected. The image capture module can capture images of a plurality of solder pads in the area to be inspected and the area to be inspected through the through hole, so that the image information to be inspected also includes one of the pads corresponding to the area to be inspected to be inspected The solder pad information, and the analysis module can analyze the solder pad information to be inspected.

In one embodiment, the above-mentioned method for detecting crystal grains further includes the following steps: an electrical detection step. The electrical detection module is electrically connected to a plurality of probes, and the electrical detection module is controlled by the analysis module. After the step of performing the needle-pricking operation, the electrical detection module can detect a plurality of LED dies. Conduct electrical testing.

In one embodiment, the above-mentioned method for detecting crystal grains further includes the following steps: an optical inspection step. The optical detection module is arranged on the other side of the detection carrier, and the optical detection module is controlled by the analysis module. After the step of performing the needle prick operation, the optical detection module can receive and analyze a plurality of LED dies The light signal emitted.

In one embodiment, the above-mentioned motion module can drive the detection carrier to perform multi-axis movement relative to the probe card to control the horizontal and vertical relative positions of the image capture module, the probe card, and the detection carrier.

Based on the above, in the photoelectric detection system and detection method of the present invention, multiple LED dies in a region can be detected at the same time, and before the needle is inserted, the needle tip and the multiple LEDs can be inspected through the penetrating hole of the probe card. Take an image of the solder pads of each LED die to adjust the position of the needle tip and the solder pads.

Furthermore, the present invention can calculate the horizontal offset of each needle tip and its corresponding solder pad, and seek to match one of the best needle positions of each probe, so that the position of each needle tip relative to the solder pad is within the allowable range , So that the electrical properties of the LED dies in the area are more uniform.

In addition, since the present invention can effectively and accurately control the measurement position of the needle stick, it also contributes to the detection efficiency of the subsequent photoelectric measurement.

In order to make the present invention more comprehensible, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows.

The specific implementation of the present invention will be further described below in conjunction with the accompanying drawings and embodiments. The following embodiments are only used to illustrate the technical solutions of the present invention more clearly, and cannot be used to limit the protection scope of the present invention.

For the convenience and clarity of the description, the thickness or size of each element in the drawings is expressed in an exaggerated or omitted or general manner for the understanding and reading of those familiar with the art, and the size of each element is not exactly the same. The actual size is not used to limit the restrictive conditions for the implementation of the present invention, so it has no technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size does not affect the effects and effects of the present invention. All the goals that can be achieved should still fall within the scope of the technical content disclosed in this case.

Figure 1 is a schematic diagram of an embodiment of the photoelectric detection system of the present invention. Please refer to Figure 1. The photoelectric detection system 100 of this embodiment includes a detection stage 110, a probe card 130, an image capture module 140, and an analysis module 150. One side of the detection stage 110 can carry a carrier 50, and a plurality of LED dies 52 are provided on the carrier 50. The probe card 130, the detection carrier 110 and the image capturing module 140 have a relative positional relationship. As shown in Figure 1, the probe card 130 is located between the detection carrier 110 and the image capturing module 140. The analysis module 150 is connected to the image capture module 140.

In addition, the detection stage 110, the probe card 130, and the image capture module 140 are respectively connected to a motion module 120. The motion module 120 can drive the detection stage 110 to perform multi-axis motion relative to the probe card 130 (multi-axis). axis motion) to control the horizontal and vertical relative positions of the image capturing module 140, the horizontal and vertical relative positions of the probe card 130, and the horizontal and vertical relative positions of the detection stage 110, wherein Multi-axis movement is moving along any one of the first direction DX, the second direction DY, and the third direction DZ, or rotates around any one of the first direction DX, the second direction DY, and the third direction DZ, and Or a combination of the first direction DX, the second direction DY, and the third direction DZ. For example, controlling the horizontal relative position of the probe card 130 and the horizontal relative position of the detection carrier 110 is to move the probe card 130 relative to the detection carrier 110 along the first direction DX, and control the vertical relative position of the probe card 130 The position and the vertical relative position of the detection stage 110 are such that the probe card 130 moves relative to the detection stage 110 along the second direction DY, that is, the probe card 130 moves in the direction of the detection stage 110 or away from the detection stage 110 Move in direction. In other embodiments, the motion module 120 can drive the probe card 130 to perform multi-axis motion relative to the detection stage 110, or the motion module 120 can drive the probe card 130 and the detection stage 110 to simultaneously perform multi-axis motion with each other .

In this embodiment, the probe card 130 includes a probe substrate 132, a through hole 134, and a plurality of probes 136. The probe substrate 132 is, for example, a plate with a thickness, and the penetration hole 134 penetrates the probe substrate 132, that is, a hole is formed in the thickness direction of the probe substrate 132 (such as the second direction DY in Figure 1). The size of the through hole 134 and the through hole 134 is not limited, and can be adjusted depending on the range of the LED die 52 on the carrier 50 to be detected. A plurality of probes 136 are connected to the probe substrate 132, and one end of each probe 136 is connected to the probe substrate 132, the other end of the probe 136 has a needle tip P, and the needle tip P is one end of the probe 136 away from the probe substrate 132 , And the penetration hole 134 can expose each needle tip P. Moreover, in other embodiments, the penetration hole 134 may only expose a plurality of needle tips P locally.

Figure 2 is a schematic diagram of an embodiment of the probe card and carrier of the present invention. Please refer to Figures 1 and 2, where Figure 2 shows a part of the carrier 50 (such as a wafer) after being cut. The relative positions of the LED dies 52 on the carrier 50 are not exactly the same. Each of these LED chips The pellet 52 is provided with two soldering pads 524 and 526. The soldering pad 524 defines a position reference point PF1 and the soldering pad 526 defines a position reference point PF2. The carrier 50 defines an area G1 to be detected. The area G1 to be detected can be defined according to the number and range of the probes 136 in the probe card 130. As shown in Figure 2, there are four LED crystals in the area G1 to be detected. The particles 52 are taken as an example, but the present invention is not limited thereto. In other embodiments, the area G1 to be inspected may be two, three, etc., and the number of LED dies 52 in the area G1 to be inspected may be multiple.

In this embodiment, the motion module 120 can control the horizontal relative position of the image capturing module 140, the horizontal relative position of the probe card 130, and the horizontal relative position of the detection stage 110 according to the horizontal position information, as shown in Figure 2. As shown, the tip PT1 of the probe 136A can horizontally correspond to the pad 524 in the area G1 to be inspected, and the tip PT2 of the probe 136B can correspond to the pad 526 in the area G1 to be inspected in the horizontal direction, and the probe The through hole 134 in the pin card 130 can expose the pin tips PT1, PT2 and the solder pads 524, 526 in the area G1 to be inspected as shown in Figure 2. At this time, the relative positions of the LED dies 52 on the carrier 50 are not exhausted. The same, and the probes 136 are arranged on the probe substrate 132 according to the predetermined distance. The relative position of the probes 136 is fixed relative to the arrangement of the LED dies 52, so The positions of the solder pads 524 and 526 corresponding to the needle tips PT1 and PT2 are not exactly the same, so that the position reference points PF1 and PF2 of the needle tips PT1 and PT2 and their corresponding solder pads 524 have different horizontal offsets.

However, the present invention is not limited to this. FIG. 3 is a schematic diagram of another embodiment of the probe card and carrier of the present invention. Please refer to Figures 1 and 3, it should be noted that the carrier 50 in Figure 3, the probe substrate 132 in the probe card 130, and the carrier 50 in Figure 2, the probe substrate 132 in the probe card 130 Similar, the same components are denoted by the same reference numerals and have the same functions and will not be repeated. The following describes only the differences: the carrier 50 in Figure 3 still defines the area G2 to be detected, and the area G1 to be detected is just about to be detected. The area of the LED die 52 is inspected. The area to be inspected G2 is the area where the LED die 52 will be inspected next time. The area to be inspected G1 and the area to be inspected G2 can be determined according to the number and range of the probes 136 in the probe card 130. As shown in Fig. 3, there are four LED dies 52 in each of the areas G1 and G2 to be detected as an example, but the present invention is not limited to this. In other embodiments, the areas G1 and G2 to be detected The area to be inspected G2 can be two, three, etc. The number of LED dies 52 in the area to be inspected G1 and the area to be inspected G2 can be multiple. Of course, the size of the penetrating hole 134 covers the area to be inspected G1 and the area to be inspected G1. The detection area G2 is used for the image capturing module 140 to capture images.

Figure 4A is a schematic diagram of an embodiment of the photoelectric detection system of the present invention. Figure 4B is a schematic diagram of an implementation aspect of the analysis module of the present invention. Please refer to Figure 1, Figure 2, Figure 4A and Figure 4B. The horizontal position information MX and the vertical position information MY are transmitted to the motion module 120, and the motion module 120 can control the horizontal and vertical relative positions of the image capturing module 140 and the probe card according to the horizontal position information MX and the vertical position information MY The horizontal relative position and the vertical relative position of 130 and the detection stage 110. For example, the motion module 120 can control the horizontal relative position P1 of the image capturing module 140, the horizontal relative position P2 of the probe card 130, and the horizontal relative position P3 of the detection stage 110 according to the horizontal position information MX, so that each The needle tips (such as the needle tips PT1 and PT2) of the probes (such as the probes 136A and 136B) can correspond to the solder pads (such as the solder pads 524 and 526) located in the region G1 to be inspected. The image capturing module 140 can be, for example, a charge coupled device (CCD) or an image sensor CCD manufactured by complementary metal oxide semiconductor (CMOS) technology. Since the penetrating hole 134 in the probe card 130 can expose the probe ( For example, the tip of the probe 136A, 136B) (such as the tip PT1, PT2) and the corresponding solder pads (such as the solder pads 524, 526) in the area G1 to be inspected, so that the image capturing module 140 can pair through the through hole 134 These needle points (such as needle points PT1 and PT2) and their corresponding solder pads (such as solder pads 524, 526) are imaged to obtain an image information MD to be inspected. The image information MD to be inspected includes a needle tip information MD1 and a desired inspection The pad information MD2, where the needle tip information MD1 corresponds to a plurality of needle tips (such as the needle tips PT1 and PT2), and the to-be-detected pad information MD2 corresponds to the plurality of pads (such as the pads 524, 526) in the to-be-detected area G1. The analysis module 150 receives the needle tip information MD1 and the to-be-detected pad information MD2 transmitted from the image capturing module 140.

In this embodiment, the analysis module 150 can be implemented by hardware (such as an integrated circuit), software (such as program instructions executed by a processor), or a combination thereof. The analysis module 150 analyzes the needle tip information MD1 and the to-be-detected pad information MD2 to calculate the position reference point (such as the position reference point) of the needle tip (such as the needle tip PT1 and PT2) relative to its corresponding solder pad (such as the solder pads 524, 526) PF1, PF2) is one of the horizontal offsets. Taking Figure 2 as an example, the horizontal offset of the needle tip PT1 of the probe 136A relative to the position reference point PF1 of the corresponding pad 524 is to calculate the position of the needle tip PT1 (e.g. The X coordinate) and the position of the reference point PF1 (such as the X coordinate) of the pad 524 are different in the horizontal direction (such as the first direction DX or the second direction DY in FIG. 1).

Taking Figure 4B as an example, the probe 136 has, for example, N probes and their corresponding solder pads. The needle tip information MD11 represents the first probe, and the to-be-tested solder pad information MD21 represents the first probe corresponding to the area G1 to be inspected. The tip information MD12 represents the second probe, MD22 represents the second probe corresponding to the solder pad in the area G1 to be inspected; the tip information MD1N represents the Nth probe , The information about the pad to be inspected MD2N represents that the Nth probe corresponds to the pad in the area G1 to be inspected. The analysis module 150 analyzes the needle tip information MD11 of the first probe and the desired inspection pad information MD21 of the corresponding pad, and calculates the horizontal offset SX1 of the first probe relative to the position reference point of the corresponding pad; The analysis module 150 analyzes the needle tip information MD12 of the second probe and the desired inspection pad information MD22 of the corresponding solder pad, and calculates the horizontal offset SX2 of the second probe relative to the position reference point of the corresponding solder pad; Similarly, the analysis module 150 analyzes the tip information MD1N of the N-th probe and the pad information MD2N of the corresponding pad to be detected, and calculates the horizontal offset of the N-th probe relative to the position reference point of the corresponding pad.量SXN.

Then, the analysis module 150 calculates the horizontal allowable value TX according to the respective horizontal offsets SX1, SX2, SXN, etc. The so-called horizontal allowable value TX here does not mean that the tip of each probe is moved to its place. Corresponding to the position reference point of the soldering pad, the analysis module 150 adjusts the probe card 130 according to the horizontal offset SX1, SX2, SXN, etc., and then adjusts the probes in the area to be inspected G1 and their corresponding soldering as a whole. The horizontal offset of the pad makes these horizontal offsets within an allowable range. For example, the horizontal offset SX1 is 10 units, the horizontal offset SX2 is 1 unit, and the horizontal offset SXN is 3 units. The calculated horizontal allowable value TX is, for example, 5 units, so that these horizontal offsets SX1, SX2, and SXN can all be adjusted below the horizontal allowable value TX. For example, after adjustment, the horizontal offset SX1 is changed from 10 units to 5 The unit, the horizontal offset amount SX2 is changed from 1 unit to minus 4 units, and the horizontal offset amount SXN is changed from 3 units to minus 2 units. Then, the horizontal allowable value TX is combined with the horizontal position information MX to determine a needle horizontal position information PX. The movement module 120 receives the needle horizontal position information PX sent by the analysis module 150. The movement module 120 adjusts the horizontal relative position of the probe card 130 and the detection stage 110 according to the needle horizontal position information PX, and then according to the vertical position information MY controls the vertical relative position of the probe card 130 and the detection stage 110 so that each needle tip can electrically contact its corresponding solder pad.

In this embodiment, during the alignment process, the tip of the probe and the solder pad of the LED die can be captured at the same time, and one of the best pin positions of each probe can be matched to make the area (such as the area to be inspected) The electrical properties of the LED die 52 in G1) are relatively uniform.

In other embodiments, referring to FIGS. 3 and 1, the through hole 134 exposes a plurality of solder pads 524, 526 in the area to be inspected G1 and the area to be inspected G2, and the image capturing module 140 can penetrate through The through hole 134 captures images of the plurality of solder pads 524, 526 in the to-be-detected area G1 and the to-be-detected area G2, so that the image information MD to be detected further includes the corresponding to the plurality of solder pads 524, 526 in the to-be-detected area G1 The information of the solder pads to be inspected, and the analysis module 150 can analyze the information of the solder pads to be inspected, and the analysis steps are similar to those described above, and will not be repeated here.

Figure 5 is a schematic diagram of another embodiment of the photoelectric detection system of the present invention. Please refer to Figure 5. It should be noted that the photoelectric detection system 200 of FIG. 5 is similar to the photoelectric detection system 100 of FIG. 1, wherein the same components are denoted by the same reference numerals and have the same functions and will not be repeated. The following describes only the differences: The photoelectric detection system 200 in FIG. 5 further includes an electrical detection module 260. The electrical detection module 260 is electrically connected to a plurality of probes 136 in the probe card 130, and the electrical detection module 260 is controlled by the analysis module 150. When each needle tip P can electrically contact its corresponding solder pad, the electrical testing module 260 can perform electrical testing on the solder pad, that is, by adjusting the horizontal position of the probe card 130, thereby reducing each level deviation The amount of shift (such as the horizontal shift amount SX1, SX2, SXN in Figure 4B) is the difference between each other, so it is possible to perform electrical testing on a plurality of LED dies 52 at the same time, which is beneficial for testing man-hours and can take into account The horizontal offset of each probe 136 and its corresponding soldering pad to avoid excessive horizontal offset of one of the probes 136, and the horizontal offset of one of the probes 136 is very small , Resulting in poor position of the needle and affecting the results of electrical testing.

Figure 6 is a schematic diagram of another embodiment of the photoelectric detection system of the present invention. Please refer to Figure 6. It should be noted that the photoelectric detection system 300 of FIG. 6 is similar to the photoelectric detection system 100 of FIG. 1, wherein the same components are denoted by the same reference numerals and have the same functions, so the description will not be repeated. Only the differences are described below: The photoelectric detection system 300 in FIG. 6 further includes an optical detection module 370. The optical detection module 370 is disposed on the other side of the detection stage 110, and the optical detection module 370 can receive and analyze the light signals emitted by the plurality of LED dies 52.

In addition, in one embodiment, the photoelectric detection system includes the electrical detection module 260 in FIG. 5 and the optical detection module 370 in FIG. 6.

Figure 7 is a flow chart of the method for detecting crystal grains of the present invention. Please refer to Figure 7. The die detection method S100 of this embodiment includes the following steps S110 to S150. The die detection method S100 can be applied to the photoelectric detection systems 100, 200, 300 or similar photoelectric detection systems shown in Fig. 1, Fig. 5, and Fig. 6.

First, proceed to step S110 and refer to FIG. 1 and FIG. 2 to provide a carrier 50 with a plurality of LED dies 52 on a detection stage 110. Each LED die 52 is provided with two bonding pads 524 and 526, and the carrier 50 defines at least one area to be inspected G1, and each bonding pad 524 and 526 defines a position reference point PF1 and PF2.

Next, proceed to step S120 and refer to Fig. 1 and Fig. 2 to execute horizontal position control. A movement module 120 controls a horizontal relative position of an image capturing module 140, a probe card 130, and a detection stage 110 according to a horizontal position information MX, so that each probe (such as probes 136A, 136B) The needle tips (such as the needle tips PT1 and PT2) can correspond to the solder pads (such as the solder pads 524 and 526) located in the area G1 to be inspected. It should be noted that the specific structure of the probe card 130 and its related description can be referred to the foregoing, and will not be repeated here.

Next, proceed to step S130 and refer to Figure 1, Figure 2, and Figure 4A to perform image capture. The image capturing module 140 can perform image capturing of a plurality of needle tips (such as the needle tips PT1 and PT2) and their corresponding solder pads (such as solder pads 524, 526) through the through hole 134 to obtain a desired image information MD, The image information MD to be inspected includes a needle tip information MD1 and pad information MD2 to be inspected. The needle tip information MD1 corresponds to a plurality of needle tips (such as needle tips PT1 and PT2), and the inspected pad information MD2 corresponds to a plurality of solders in the area G1 to be inspected. Pads (such as solder pads 524, 526).

Next, proceed to step S130 and refer to Figure 1, Figure 2, Figure 4A, and Figure 4B to analyze the position information. An analysis module 150 analyzes the needle tip information MD1 and the to-be-detected pad information MD2 to calculate the needle tip (e.g. The horizontal offset (such as the horizontal offset SX1, SX2, SXN) of the needle tip PT1, PT2) relative to the position reference points (such as the position reference points PF1, PF2) of the corresponding solder pads (such as the solder pads 524, 526), And the analysis module 150 calculates a horizontal allowable value TX according to each horizontal offset (such as the horizontal offsets SX1, SX2, SXN), and then combines the horizontal allowable value TX with the horizontal position information MX to determine the horizontal position information of a needle. PX.

Then, step S150 is performed, and the needle insertion operation is performed with reference to Fig. 1, Fig. 2, Fig. 4A, and Fig. 4B. The motion module 120 adjusts the horizontal relative position of the probe card 130 and the inspection stage 110 according to the needle horizontal position information PX according to the motion module 120, and then controls the probe card 130 and the inspection stage 110 according to the vertical position information MY Vertical relative position, so that each needle tip can electrically contact its corresponding solder pad. Since the needle tip of the probe and the solder pad of the LED die can be captured at the same time during the alignment process, and one of the best pin positions of each probe can be matched, the electrical power of the LED die 52 in the region G1 to be inspected can be obtained. The sex is more uniform.

In other embodiments, the step S130 of analyzing the position information, referring to Fig. 3, the carrier 50 still defines the area to be inspected G2, and the through hole 134 exposes the plurality of solder pads 524, 524, and 524 in the area to be inspected G1 and the area to be inspected G2. 526. The image capturing module 140 can perform image capturing on the plurality of solder pads 524, 526 of the to-be-detected area G1 and the to-be-detected area G2 through the through hole 134, so that the image information MD to be detected further includes the corresponding to-be-detected area G2 One of the plurality of solder pads within is to be inspected pad information, and the analysis module 150 can analyze the to be inspected pad information. In this way, the present embodiment can firstly pierce the area G1 to be inspected, and at the same time, it can also use the penetrating hole 134 to capture images of the solder pads in the area G2 to be inspected next to be inspected, so that the probe card 130. After the needle is punctured in the region G1 to be detected, there is no need to calculate and adjust the needle position in the region G2 to be detected, and the needle can be punctured again, which helps to improve the time course of the needle.

Then, after the step S150 of performing the needle-pricking operation, an electrical testing step is further included, and the electrical testing module 260 can perform electrical testing on a plurality of LED dies 52.

In addition, after the step S150 of performing the acupuncture operation, an optical detection step is further included. The optical detection module 370 is disposed on the other side of the detection stage 110 and can receive and analyze the light signals emitted by the plurality of LED dies 52.

In summary, in the photoelectric detection system and method for detecting die of the present invention, multiple LED dies in an area can be detected at the same time, and the needle tip can be inspected through the penetrating hole of the probe card before the needle is inserted. Take an image with the solder pads of multiple LED dies to adjust the position of the needle tip and the solder pads.

Furthermore, the present invention can calculate the horizontal offset of each needle tip and its corresponding solder pad, and seek to match one of the best needle positions of each probe, so that the position of each needle tip relative to the solder pad is within the allowable range , So that the electrical properties of the LED dies in the area are more uniform.

In addition, since the present invention can effectively and accurately control the needle measurement position, it also contributes to the detection efficiency of the subsequent photoelectric measurement.

Further, the present invention can first pierce the area to be inspected, and at the same time, capture the image of the solder pad in the next area to be inspected through the penetration hole, so that the probe card can pierce the area to be inspected. After that, there is no need to calculate and adjust the position of the needle in the area to be detected, and then the needle can be punctured, which helps to improve the time course of the needle.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to those defined by the attached patent scope.

100, 200, 300: photoelectric detection system 110: Detection stage 120: Motion module 130: Probe card 132: Probe substrate 134: Through Hole 136, 136A, 136B: Probe 140: Image capture module 150: Analysis Module 260: Electrical testing module 370: photoelectric detection module 50: carrier 52: LED die 524,526: Solder pad DX: the first direction DY: second direction DZ: Third Party G1: the area to be detected G2: Area to be detected MD: To detect image information MD1, MD11, MD12, MD1N: Tip information MD2, MD21, MD22, MD2N: To inspect the pad information MX: Horizontal position information MY: vertical position information P1, P2, P3: horizontal relative position P, PT1, PT2: needle tip PF1, PF2: Position reference point PX: Needle horizontal position information SX1, SX2, SXN: horizontal offset TX: Horizontal allowable value S100: Method of detecting grains S110~S150: steps

Figure 1 is a schematic diagram of an embodiment of the photoelectric detection system of the present invention. Figure 2 is a schematic diagram of an embodiment of the probe card and carrier of the present invention. Figure 3 is a schematic diagram of another embodiment of the probe card and carrier of the present invention. Figure 4A is a schematic diagram of an embodiment of the photoelectric detection system of the present invention. Figure 4B is a schematic diagram of an implementation aspect of the analysis module of the present invention. Figure 5 is a schematic diagram of another embodiment of the photoelectric detection system of the present invention. Figure 6 is a schematic diagram of another embodiment of the photoelectric detection system of the present invention. Figure 7 is a flow chart of the method for detecting crystal grains of the present invention.

100: photoelectric detection system

110: Detection stage

120: Motion module

130: Probe card

132: Probe substrate

134: Through Hole

136: Probe

140: Image capture module

150: Analysis Module

50: carrier

52: LED die

DX: the first direction

DY: second direction

DZ: Third Party

P: Needle tip

Claims (10)

A photoelectric detection system includes: a detection carrier connected to a movement module, one side of the detection carrier can carry a carrier, the carrier is provided with a plurality of LED dies after cutting, each of the LED crystals The pellet is provided with two soldering pads, and the carrier defines at least one area to be inspected, each of the soldering pads defines a position reference point; a probe card connected to the motion module, the probe card including a probe substrate , A plurality of probes and a penetrating hole, the penetrating hole penetrates the probe substrate, each of the probes is connected to the probe substrate, and each of the probes has a needle tip, and the penetrating hole can expose Each of the needle tips and the plurality of solder pads in the area to be inspected; an image capture module connected to the motion module, and the motion module can control the image capture module, the image capture module, and the image capture module according to a horizontal position information. A horizontal relative position of the probe card and the detection carrier, and enables each of the needle tips to correspond to the solder pads in the area to be detected, and enables the image capturing module to pass through the penetration hole to the plurality of The needle tip and the corresponding solder pad are image-captured to obtain image information to be inspected. The image information to be inspected includes a needle tip information corresponding to a plurality of needle tips and a desired information corresponding to one of the plurality of solder pads in the area to be inspected. Detecting the pad information; and an analysis module connected to the image capturing module, the analysis module analyzes the needle tip information and the information of the pad to be inspected to calculate the corresponding pad of each of the needle tips A horizontal offset of a position reference point, and the analysis module calculates a horizontal allowable value according to each of the horizontal offsets, and then combines the horizontal allowable value with the horizontal position information to determine a needle horizontal position information; , The motion module is connected to the analysis module, the motion module adjusts the horizontal relative position of the probe card and the detection carrier according to the needle horizontal position information, and then controls the probe according to a vertical position information The card is positioned vertically relative to one of the detection stages, so that each of the needle tips can electrically contact the corresponding solder pad. The photoelectric inspection system according to claim 1, wherein the carrier further defines at least one area to be inspected, the penetration hole exposes the area to be inspected and the plurality of solder pads in the area to be inspected, and the image capturing model The group can perform image capture on the area to be inspected and the plurality of solder pads in the area to be inspected through the penetrating hole, so that the image information to be inspected further includes information corresponding to the plurality of pads in the area to be inspected A solder pad information to be inspected, and the analysis module can analyze the solder pad information to be inspected. The photoelectric detection system according to claim 1, further comprising: an electrical detection module electrically connected to the plurality of probes, and the electrical detection module is controlled by the analysis module. The photoelectric detection system according to claim 1, further comprising: an optical detection module, which is arranged on the other side of the detection carrier and can receive and analyze the light signals emitted by the plurality of LED dies. The photoelectric detection system according to claim 1, wherein the motion module can drive the detection stage to perform multi-axis motion relative to the probe card to control the image capture module, the probe card, and the detection carrier The horizontal relative position and the vertical relative position of the stage. A method for detecting dies, including the following steps: providing a carrier provided with a plurality of cut LED dies on a testing stage, each of the LED dies is provided with two soldering pads, and the carrier is defined with at least one desired In the inspection area, each of the solder pads defines a position reference point; implements horizontal position control, a motion module controls an image capture module, a probe card, and a horizontal relative position of the inspection stage based on a horizontal position information , Wherein the probe card includes a probe substrate, a plurality of probes and a penetration hole, the penetration hole penetrates the probe substrate, each probe is connected to the probe substrate, and each probe has A needle tip, and the penetration hole can expose each The needle tip and the plurality of solder pads in the area to be inspected, so that each of the needle tips can correspond to the pad located in the area to be inspected; image capture is performed, and the image capture module can pass through the penetration hole Image capture is performed on the plurality of needle tips and the corresponding solder pads to obtain image information to be inspected. The image information to be inspected includes needle tip information corresponding to the plurality of needle tips and corresponding to the plurality of needle tips in the area to be inspected. One of the pads wants to detect the pad information; analyze the position information, and an analysis module analyzes the needle tip information and the desired pad information to calculate one of the position reference points of each needle tip relative to its corresponding pad Horizontal offset, and the analysis module calculates a horizontal allowable value according to each horizontal offset, and then combines the horizontal allowable value with the horizontal position information to determine a needle-pricking horizontal position information; and performing a needle-pricking operation, the The movement module adjusts the horizontal relative position of the probe card and the detection carrier according to the needle horizontal position information, and then controls the vertical relative position of the probe card and the detection carrier according to the vertical position information. So that each of the needle tips can electrically contact the corresponding solder pad. The method for detecting die according to claim 6, wherein in the step of analyzing position information, the carrier further defines at least one area to be inspected, and the penetration hole exposes the area to be inspected and the area to be inspected. A plurality of soldering pads, the image capturing module can perform image capturing of the area to be inspected and the plurality of soldering pads in the area to be inspected through the penetration hole, so that the image information to be inspected also includes the corresponding waiting area One of the plurality of solder pads in the detection area is the information of the solder pad to be inspected, and the analysis module can analyze the information of the solder pad to be inspected. The method for detecting die according to claim 6, further comprising the following steps: an electrical testing step, an electrical testing module is electrically connected to the plurality of probes, and the electrical testing module is controlled by In the analysis module, after the step of performing the needle sticking operation, the electrical detection module can perform electrical detection on the plurality of LED dies. The method for detecting die according to claim 6, further comprising the following steps: an optical detection step, an optical detection module is arranged on the other side of the detection stage, and the optical detection module is controlled by the analysis The module, after the step of performing the needle prick operation, the optical detection module can receive and analyze the light signals emitted by the plurality of LED dies. The method for detecting die according to claim 6, wherein the motion module is capable of driving the detection stage to perform multi-axis motion relative to the probe card to control the image capturing module, the probe card, and the inspection The horizontal relative position and the vertical relative position of the carrier.

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