TWI729493B - Pixel array substrate - Google Patents
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- TWI729493B TWI729493B TW108132972A TW108132972A TWI729493B TW I729493 B TWI729493 B TW I729493B TW 108132972 A TW108132972 A TW 108132972A TW 108132972 A TW108132972 A TW 108132972A TW I729493 B TWI729493 B TW I729493B
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- 239000000758 substrate Substances 0.000 title claims abstract description 78
- 239000010409 thin film Substances 0.000 claims description 29
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000007704 transition Effects 0.000 claims description 6
- 230000003068 static effect Effects 0.000 description 17
- 230000005611 electricity Effects 0.000 description 16
- 239000002184 metal Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/811—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/611—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using diodes as protective elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/931—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs characterised by the dispositions of the protective arrangements
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Abstract
Description
本發明是有關於一種畫素陣列基板。The present invention relates to a pixel array substrate.
隨著多媒體應用的普及,具有高解析度及大可視範圍的顯示器已成為技術發展主流。隨著顯示器解析度的提升,位於顯示器之周邊區的導線數目也隨之增加。此外,為使顯示器不易被靜電擊傷,顯示器之畫素陣列基板的周圍還需設置靜電防護電路。因此,習知畫素陣列基板的周圍需保留一定的空間,以容納為數眾多的導線及多種靜電防護電路,造成顯示器的邊框無法進一步縮減。With the popularization of multimedia applications, displays with high resolution and large visual range have become the mainstream of technological development. As the resolution of the display increases, the number of wires located in the peripheral area of the display also increases. In addition, in order to prevent the display from being damaged by static electricity, an electrostatic protection circuit must be provided around the pixel array substrate of the display. Therefore, a certain space needs to be reserved around the conventional pixel array substrate to accommodate a large number of wires and various static electricity protection circuits, so that the frame of the display cannot be further reduced.
本發明提供一種畫素陣列基板,靜電防護效果佳。The invention provides a pixel array substrate with good electrostatic protection effect.
本發明的畫素陣列基板包括基板、多條資料線、多條閘極線、多個畫素結構、多條轉接線及靜電防護電路。多條資料線設置於基板上,且在第一方向上排列。多條閘極線設置於基板上,且在第二方向上排列。第一方向與第二方向交錯。多個畫素結構設置於基板上。每一畫素結構電性連接至一資料線及一閘極線。多條轉接線設置於基板上,且在第一方向上排列。多條轉接線分別電性連接至多條閘極線。靜電防護電路設置於基板的一邊緣與多個畫素結構之間。靜電防護電路包括多個靜電防護元件、多條資料接地線及至少一閘極接地線。多個靜電防護元件包括多個第一靜電防護元件及多個第二靜電防護元件。多個第一靜電防護元件電性連接於多條資料線與多條資料接地線之間。多個第二靜電防護元件電性連接於多條轉接線與至少一閘極接地線之間。至少一閘極接地線及多條資料接地線在第二方向上排列且互相隔開。The pixel array substrate of the present invention includes a substrate, a plurality of data lines, a plurality of gate lines, a plurality of pixel structures, a plurality of transfer wires and an electrostatic protection circuit. A plurality of data lines are arranged on the substrate and arranged in the first direction. A plurality of gate lines are arranged on the substrate and arranged in the second direction. The first direction is staggered with the second direction. A plurality of pixel structures are arranged on the substrate. Each pixel structure is electrically connected to a data line and a gate line. A plurality of transfer wires are arranged on the substrate and arranged in the first direction. The multiple transfer wires are electrically connected to the multiple gate wires respectively. The electrostatic protection circuit is arranged between an edge of the substrate and the plurality of pixel structures. The electrostatic protection circuit includes a plurality of electrostatic protection components, a plurality of data ground wires and at least one gate ground wire. The plurality of electrostatic protection elements includes a plurality of first electrostatic protection elements and a plurality of second electrostatic protection elements. The plurality of first electrostatic protection components are electrically connected between the plurality of data lines and the plurality of data grounding lines. The plurality of second electrostatic protection components are electrically connected between the plurality of transfer wires and at least one gate ground wire. At least one gate ground wire and a plurality of data ground wires are arranged in the second direction and separated from each other.
在本發明的一實施例中,上述的多個靜電防護元件設置於多條資料接地線及至少一閘極接地線的相對兩側。In an embodiment of the present invention, the above-mentioned plurality of electrostatic protection components are arranged on opposite sides of the plurality of data grounding lines and at least one gate grounding line.
在本發明的一實施例中,上述的每一靜電防護元件包括一薄膜電晶體,薄膜電晶體具有一第一端、一第二端、一控制端及一半導體圖案,第一端及第二端分別電性連接至半導體圖案的不同兩區,且第一端電性連接至控制端;一第一靜電防護元件的薄膜電晶體具有一通道寬長比W1/L1,一第二靜電防護元件的薄膜電晶體具有一通道寬長比W2/L2,且(W2/L2)>(W1/L1)。In an embodiment of the present invention, each of the above-mentioned electrostatic protection elements includes a thin film transistor, the thin film transistor has a first end, a second end, a control end and a semiconductor pattern, the first end and the second end The terminals are electrically connected to two different regions of the semiconductor pattern, and the first terminal is electrically connected to the control terminal; the thin film transistor of a first electrostatic protection element has a channel width-to-length ratio W1/L1, and a second electrostatic protection element The thin film transistor has a channel width to length ratio W2/L2, and (W2/L2)>(W1/L1).
在本發明的一實施例中,上述的多條閘極線包括多個奇數條閘極線及多個偶數條閘極線,且多條轉接線包括電性連接至多個奇數條閘極線的多條第一轉接線及電性連接至多個偶數條閘極線的多條第二轉接線。靜電防護電路的至少一閘極接地線包括一第一閘極接地線及一第二閘極接地線。多個第二靜電防護元件的一部分電性連接於多條第一轉接線與第一閘極接地線之間。多個第二靜電防護元件的另一部分電性連接於多條第二轉接線與第二閘極接地線之間。第一閘極接地線、第二閘極接地線及多條資料接地線在第二方向上排列且互相隔開。In an embodiment of the present invention, the above-mentioned plurality of gate lines includes a plurality of odd-numbered gate lines and a plurality of even-numbered gate lines, and the plurality of transfer lines include electrically connected to a plurality of odd-numbered gate lines A plurality of first transfer wires and a plurality of second transfer wires electrically connected to a plurality of even-numbered gate lines. The at least one gate ground wire of the electrostatic protection circuit includes a first gate ground wire and a second gate ground wire. A part of the plurality of second electrostatic protection elements is electrically connected between the plurality of first transfer wires and the first gate ground wire. The other part of the plurality of second electrostatic protection elements is electrically connected between the plurality of second transfer wires and the second gate ground wire. The first gate ground line, the second gate ground line and the multiple data ground lines are arranged in the second direction and separated from each other.
在本發明的一實施例中,上述的畫素陣列基板更包括一接墊組。接墊組包括多個接墊,其中多個接墊沿著基板的邊緣設置且分別電性連接至多條資料線及多條轉接線,且至少一閘極接地線、多條資料接地線及接墊組在第二方向上排列。In an embodiment of the present invention, the aforementioned pixel array substrate further includes a pad set. The pad set includes a plurality of pads, wherein the plurality of pads are arranged along the edge of the substrate and are respectively electrically connected to a plurality of data lines and a plurality of transfer lines, and at least one gate ground line, a plurality of data ground lines, and The pad groups are arranged in the second direction.
在本發明的一實施例中,上述的畫素陣列基板更包括一扇出走線組。扇出走線組包括多條扇出走線,其中多條扇出走線分別電性連接至多條資料線及多條轉接線,且至少一閘極接地線、多條資料接地線及扇出走線組在第二方向上排列。In an embodiment of the present invention, the aforementioned pixel array substrate further includes a fan-out wiring group. The fan-out wiring set includes multiple fan-out wirings, of which multiple fan-out wirings are respectively electrically connected to multiple data lines and multiple transition wires, and at least one gate ground wire, multiple data ground wires, and fan-out wiring set Arrange in the second direction.
現將詳細地參考本發明的示範性實施例,示範性實施例的實例說明於附圖中。只要有可能,相同元件符號在圖式和描述中用來表示相同或相似部分。Reference will now be made in detail to the exemplary embodiments of the present invention, and examples of the exemplary embodiments are illustrated in the accompanying drawings. Whenever possible, the same component symbols are used in the drawings and descriptions to indicate the same or similar parts.
應當理解,當諸如層、膜、區域或基板的元件被稱為在另一元件“上”或“連接到”另一元件時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為“直接在另一元件上”或“直接連接到”另一元件時,不存在中間元件。如本文所使用的,“連接”可以指物理及/或電性連接。再者,“電性連接”或“耦合”可以是二元件間存在其它元件。It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements can also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements. As used herein, "connected" can refer to physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may mean that there are other elements between two elements.
本文使用的“約”、“近似”、或“實質上”包括所述值和在本領域普通技術人員確定的特定值的可接受的偏差範圍內的平均值,考慮到所討論的測量和與測量相關的誤差的特定數量(即,測量系統的限制)。例如,“約”可以表示在所述值的一個或多個標準偏差內,或±30%、±20%、±10%、±5%內。再者,本文使用的“約”、“近似”或“實質上”可依光學性質、蝕刻性質或其它性質,來選擇較可接受的偏差範圍或標準偏差,而可不用一個標準偏差適用全部性質。As used herein, "about", "approximately", or "substantially" includes the stated value and the average value within the acceptable deviation range of the specific value determined by a person of ordinary skill in the art, taking into account the measurement in question and the The specific amount of measurement-related error (ie, the limitation of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, "about", "approximately" or "substantially" as used herein can be based on optical properties, etching properties or other properties to select a more acceptable range of deviation or standard deviation, and not one standard deviation can be applied to all properties .
除非另有定義,本文使用的所有術語(包括技術和科學術語)具有與本發明所屬領域的普通技術人員通常理解的相同的含義。將進一步理解的是,諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本發明的上下文中的含義一致的含義,並且將不被解釋為理想化的或過度正式的意義,除非本文中明確地這樣定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of related technologies and the present invention, and will not be interpreted as idealized or excessive The formal meaning, unless explicitly defined as such in this article.
圖1為本發明一實施例之畫素陣列基板100的俯視示意圖。FIG. 1 is a schematic top view of a
圖2示出本發明一實施例之畫素陣列基板100的資料線DL、轉接線gl、靜電防護元件120dl、120gl、資料接地線CLdl及閘極接地線CLgl的佈局(layout)。2 shows the layout of the data line DL, the transfer line gl, the electrostatic protection elements 120dl, 120gl, the data ground line CLdl, and the gate ground line CLgl of the
圖1以電路符號代表資料線DL、轉接線gl、靜電防護元件120dl、120gl、資料接地線CLdl及閘極接地線CLgl,其實際佈局(layout)可參考圖2。Figure 1 uses circuit symbols to represent the data line DL, the transfer line gl, the electrostatic protection components 120dl, 120gl, the data ground line CLdl, and the gate ground line CLgl. The actual layout can refer to Figure 2.
請參照圖1及圖2,畫素陣列基板100包括基板110。基板110主要是用以承載畫素陣列基板100的元件。在本實施例中,基板110的材質可以是玻璃、石英、有機聚合物、或是不透光/反射材料(例如:晶圓、陶瓷、或其它可適用的材料)、或是其它可適用的材料。1 and FIG. 2, the
畫素陣列基板100包括多條資料線DL及多條閘極線GL。多條資料線DL設置於基板110上,且在第一方向x上排列。多條閘極線GL設置於基板110上,且在第二方向y上排列。第一方向x與第二方向y交錯。舉例而言,在本實施例中,第一方向x與第二方向y實質上可垂直,但本發明不以此為限。The
舉例而言,在本實施例中,閘極線GL可選擇性地屬於第一金屬層,資料線DL可選擇性地屬於第二金屬層,但本發明不以此為限。基於導電性的考量,在本實施例中,閘極線GL與資料線DL是使用金屬材料。然而,本發明不限於此,根據其他實施例,閘極線GL與資料線DL也可以使用其他導電材料,例如:合金、金屬材料的氮化物、金屬材料的氧化物、金屬材料的氮氧化物、或是金屬材料與其它導電材料的堆疊層。For example, in this embodiment, the gate line GL can selectively belong to the first metal layer, and the data line DL can selectively belong to the second metal layer, but the invention is not limited thereto. Based on the consideration of conductivity, in this embodiment, the gate line GL and the data line DL are made of metal materials. However, the present invention is not limited to this. According to other embodiments, the gate line GL and the data line DL may also be made of other conductive materials, such as alloys, nitrides of metal materials, oxides of metal materials, and oxynitrides of metal materials. , Or stacked layers of metal materials and other conductive materials.
畫素陣列基板100還包括多個畫素結構PX。多個畫素結構PX設置於基板110上。每一畫素結構PX電性連接至對應的一
條資料線DL及對應的一條閘極線GL。具體而言,在本實施例中,每一畫素結構PX可包括薄膜電晶體(未繪示)及畫素電極(未繪示),其中薄膜電晶體的第一端電性連接至資料線DL,薄膜電晶體的控制端電性連接至閘極線GL,且薄膜電晶體的第二端電性連接至畫素電極。The
多個畫素結構PX排成多個畫素行。每一畫素行的多個畫素結構PX在資料線DL的延伸方向(例如:第二方向y)上排列。在本實施例中,同一畫素行的相鄰兩畫素結構PX可分別電性連接至位於畫素行之左右兩側的兩條資料線DL,且所述相鄰兩畫素結構PX的多個薄膜電晶體可同時被開啟。也就時說,在本實施例中,多個畫素結構PX可採2DhG(two data lines and half gate line)的架構。然而,本發明不限於此,根據其它實施例,多個畫素結構PX也可採2D1G(two data lines and one gate line)、1D1G(one data line and one gate line)或其它種類的架構。The multiple pixel structures PX are arranged in multiple pixel rows. The multiple pixel structures PX in each pixel row are arranged in the extending direction (for example, the second direction y) of the data line DL. In this embodiment, two adjacent pixel structures PX in the same pixel row can be electrically connected to the two data lines DL located on the left and right sides of the pixel row, and a plurality of the adjacent two pixel structures PX Thin film transistors can be turned on at the same time. In other words, in this embodiment, the multiple pixel structure PX may adopt a 2DhG (two data lines and half gate line) architecture. However, the present invention is not limited to this. According to other embodiments, the multiple pixel structures PX may also adopt 2D1G (two data lines and one gate line), 1D1G (one data line and one gate line) or other types of architectures.
畫素陣列基板100包括多條轉接線gl。多條轉接線gl設置於基板110上,且在第一方向x上排列。也就是說,多條轉接線gl與多條資料線DL是在同一方向上排列。多條轉接線gl分別電性連接至多條閘極線GL。舉例而言,在本實施例中,閘極線GL可屬於第一金屬層,轉接線gl可屬於第二金屬層,絕緣層(未繪示)設置於第一金屬層與第二金屬層之間,且每一轉接線gl可透過絕緣層的接觸窗(未繪示)電性連接至對應的一條閘極線GL,但本發明不以此為限。The
畫素陣列基板100還包括靜電防護電路ESDC。靜電防護電路ESDC設置於基板110的一邊緣110a與多個畫素結構PX之間。也就是說,靜電防護電路ESDC設置於基板110的一邊緣110a與畫素陣列基板100的主動區(active area;AA)之間。The
在本實施例中,畫素陣列基板100更包括接墊組G140,接墊組G140包括多個接墊140,其中多個接墊140沿著基板110的邊緣110a設置且分別電性連接至多條資料線DL及多條轉接線gl。畫素陣列基板100更包括扇出走線組G130,扇出走線組G130包括多條扇出走線130,其中多條扇出走線130分別電性連接至多條資料線DL及多條轉接線gl。In this embodiment, the
具體而言,在本實施例中,多條資料線DL及多條轉接線gl電性連接至靜電防護電路ESDC的靜電防護元件120d1、120gl,靜電防護電路ESDC的靜電防護元件120d1、120gl、多條資料線DL及多條轉接線gl電性連接至多條扇出走線130,多條扇出走線130電性連接至多個接墊140,且多個接墊140電性連接至用以驅動多個畫素結構PX的驅動元件150。Specifically, in this embodiment, a plurality of data lines DL and a plurality of transfer wires gl are electrically connected to the electrostatic protection elements 120d1, 120gl of the electrostatic protection circuit ESDC, and the electrostatic protection elements 120d1, 120gl, of the electrostatic protection circuit ESDC A plurality of data lines DL and a plurality of transfer lines gl are electrically connected to a plurality of fan-out
舉例而言,在本實施例中,驅動元件150可包括一晶片,所述晶片可藉由晶粒-軟片接合製程(Chip On Film;COF)與畫素陣列基板100接合。然而,本發明不限於此,在其它實施例中,所述晶片也可藉由晶粒-玻璃接合製程(Chip On Glass;COG)、晶粒-電路板接合製程(Chip On Board,COB)、軟片式晶粒接合(Tape Automated Bonding;TAB)或其它方式與畫素陣列基板100接合。For example, in this embodiment, the driving
靜電防護電路ESDC包括多個靜電防護元件120dl、120gl、多條資料接地線CLdl及至少一閘極接地線CLgl。多個靜電防護元件120dl、120gl包括多個靜電防護元件120dl及多個靜電防護元件120gl。靜電防護元件120dl電性連接於資料線DL與資料接地線CLdl之間。靜電防護元件120gl電性連接於轉接線gl與閘極接地線CLgl之間。The electrostatic protection circuit ESDC includes a plurality of electrostatic protection elements 120dl, 120gl, a plurality of data ground lines CLdl and at least one gate ground line CLgl. The plurality of static electricity protection elements 120dl and 120gl includes a plurality of static electricity protection elements 120dl and a plurality of static electricity protection elements 120gl. The electrostatic protection element 120dl is electrically connected between the data line DL and the data ground line CLdl. The electrostatic protection element 120gl is electrically connected between the transfer line gl and the gate ground line CLgl.
舉例而言,在本實施例中,多個畫素結構PX包括分別用以顯示第一顏色、第二顏色及第三顏色的畫素結構PXR、畫素結構PXG及畫素結構PXB,多條資料線DL包括分別電性連接至畫素結構PXR、畫素結構PXG及畫素結構PXB的資料線DLR、資料線DLG及資料線DLB,多條資料接地線CLdl包括資料接地線CLdlr、資料接地線CLdlg及資料接地線CLdlb,多個靜電防護元件120dlr電性連接於多條資料線DLR與資料接地線CLdlr之間,多個靜電防護元件120dlg電性連接於多條資料線DLG與資料接地線CLdlg之間,多個靜電防護元件120dlb電性連接於多條資料線DLB與資料接地線CLdlb之間。在本實施例中,第一顏色、第二顏色及第三顏色例如為紅色、綠色及藍色,但本發明不以此為限。For example, in this embodiment, the plurality of pixel structures PX includes a pixel structure PXR, a pixel structure PXG, and a pixel structure PXB for displaying a first color, a second color, and a third color, respectively. The data line DL includes a data line DLR, a data line DLG, and a data line DLB that are electrically connected to the pixel structure PXR, the pixel structure PXG, and the pixel structure PXB, respectively. The multiple data ground lines CLdl include a data ground line CLdlr and a data ground. Line CLdlg and data ground line CLdlb, a plurality of static electricity protection elements 120dlr are electrically connected between a plurality of data lines DLR and a data ground line CLdlr, and a plurality of static electricity protection elements 120dlg are electrically connected to a plurality of data lines DLG and a data ground line Between CLdlg, a plurality of static electricity protection elements 120dlb are electrically connected between a plurality of data lines DLB and a data ground line CLdlb. In this embodiment, the first color, the second color, and the third color are, for example, red, green, and blue, but the invention is not limited thereto.
舉例而言,在本實施例中,每一靜電防護元件120d1、120gl包括多個薄膜電晶體T1、T2,每一薄膜電晶體T1、T2具有第一端T1a、T2a、第二端T1b、T2b、控制端T1c、T2c及半導體圖案T1d、T2d,其中第一端T1a、T2a及第二端T1b、T2b分別電性連接至半導體圖案T1d、T2d的不同兩區,且第一端T1a、T2a電性連接至控制端T1c、T2c。For example, in this embodiment, each ESD protection element 120d1, 120gl includes a plurality of thin film transistors T1, T2, and each thin film transistor T1, T2 has a first terminal T1a, T2a, and a second terminal T1b, T2b. , The control terminals T1c, T2c and the semiconductor patterns T1d, T2d, wherein the first terminals T1a, T2a and the second terminals T1b, T2b are electrically connected to two different regions of the semiconductor patterns T1d, T2d, and the first terminals T1a, T2a are electrically connected Sexually connected to the control terminals T1c and T2c.
在本實施例中,每一靜電防護元件120dl、120gl的多個薄膜電晶體T1、T2包括薄膜電晶體T1及薄膜電晶體T2,其中薄膜電晶體T1的第一端T1a及控制端T1c電性連接至薄膜電晶體T2的第二端T2b,薄膜電晶體T2的第一端T2a及控制端T2c電性連接至薄膜電晶體T1的第二端T1b。簡言之,在本實施例中,每一靜電防護元件120dl、120gl 包括以背對背方式連接的一對薄膜電晶體,而每一靜電防護元件120dl、120gl 可以是二極體類型(diode type)。然而,本發明不限於此,在其它實施例中,靜電防護元件120dl、120gl 也可以是其它類型。In this embodiment, the plurality of thin film transistors T1 and T2 of each ESD protection element 120dl, 120gl includes a thin film transistor T1 and a thin film transistor T2, wherein the first terminal T1a and the control terminal T1c of the thin film transistor T1 are electrically conductive Connected to the second terminal T2b of the thin film transistor T2, and the first terminal T2a and the control terminal T2c of the thin film transistor T2 are electrically connected to the second terminal T1b of the thin film transistor T1. In short, in this embodiment, each static electricity protection element 120dl, 120gl includes a pair of thin film transistors connected in a back-to-back manner, and each static electricity protection element 120dl, 120gl may be a diode type. However, the present invention is not limited to this. In other embodiments, the electrostatic protection elements 120dl, 120gl may also be of other types.
在本實施例中,多個靜電防護元件120dl、120gl可設置於多條資料接地線CLdl及閘極接地線CLgl的相對兩側。也就是說,多個靜電防護元件120dl、120gl的一部分可設置於多個畫素結構PX與閘極接地線CLgl之間,而多個靜電防護元件120dl、120gl的另一部分可設置於閘極接地線CLgl與基板110的邊緣110a之間。但本發明不以此為限,在其它實施例中,多個靜電防護元件120dl、120gl也可設置於多條資料接地線CLdl及閘極接地線CLgl的單側。In this embodiment, a plurality of static electricity protection elements 120dl, 120gl may be disposed on opposite sides of the plurality of data ground lines CLdl and gate ground lines CLgl. That is, a part of the plurality of static electricity protection elements 120dl, 120gl may be arranged between the plurality of pixel structures PX and the gate ground line CLgl, and another part of the plurality of static electricity protection elements 120dl, 120gl may be arranged on the gate ground. Between the line CLgl and the
值得注意的是,靜電防護電路ESDC是設置於基板110的一邊緣110a與多個畫素結構PX之間。在本實施例中,靜電防護電路ESDC的閘極接地線CLgl、資料接地線CLdlr、資料接地線CLdlg及資料接地線CLdlb、扇出走線組G130及接墊組G140是在第二方向y上排列且位於多個畫素結構PX與基板110的一邊緣110a之間。也就是說,與資料線DL及閘極線GL電性連接的多條扇出走線130、多個接墊140及靜電防護電路ESDC是設置在畫素陣列基板100之主動區的單一側,使得基板110的其它邊緣110b與主動區之間的距離可縮至非常小、甚至可為零,進而能實現窄邊框的顯示器。It should be noted that the electrostatic protection circuit ESDC is disposed between an
更重要的是,靜電防護電路ESDC的至少一閘極接地線CLgl及多條資料接地線CLdl是在第二方向y上排列且互相隔開。用以承載不同訊號的閘極線GL(或者說,轉接線gl)與資料線DL是各自透過靜電保護元件120dl及閘極接地線CLgl與靜電保護元件120gl及資料接地線CLdl來達到靜電防護的目的。藉此,不但能實現窄邊框,畫素陣列基板100的抗靜電能力還能進一步提升。More importantly, at least one gate ground line CLgl and a plurality of data ground lines CLdl of the electrostatic protection circuit ESDC are arranged in the second direction y and separated from each other. The gate line GL (or transfer line gl) and the data line DL used to carry different signals are protected against static electricity through the electrostatic protection element 120dl and the gate ground line CLgl, the electrostatic protection element 120gl and the data ground line CLdl respectively. the goal of. In this way, not only a narrow frame can be realized, but also the antistatic ability of the
在此必須說明的是,下述實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重述。It must be noted here that the following embodiments use the element numbers and part of the content of the foregoing embodiments, wherein the same numbers are used to represent the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.
圖3為本發明另一實施例之畫素陣列基板100A的俯視示意圖。FIG. 3 is a schematic top view of a
圖4示出本發明另一實施例之畫素陣列基板100A的資料線DL、轉接線gl、靜電防護元件120dl、120gl、資料接地線CLdl及閘極接地線CLgl的佈局(layout)。4 shows the layout of the data line DL, the transfer line gl, the electrostatic protection elements 120dl, 120gl, the data ground line CLdl, and the gate ground line CLgl of the
圖3以電路符號代表資料線DL、轉接線gl、靜電防護元件120dl、120gl、資料接地線CLdl及閘極接地線CLgl,其實際佈局(layout)可參考圖4。FIG. 3 uses circuit symbols to represent the data line DL, the transfer line gl, the electrostatic protection components 120dl, 120gl, the data ground line CLdl and the gate ground line CLgl, and the actual layout (layout) can refer to FIG. 4.
請參照圖1及圖3,本實施例的畫素陣列基板100A與前述的畫素陣列基板100類似,兩者的差異在於:在圖3的實施例中,同一畫素列的所有畫素結構PX是與同一條資料線DL電性連接,且同一畫素列的多個畫素結構PX是分別電性連接於多條閘極線GL電性連接。也就時說,在圖3的實施例中,多個畫素結構PX是採1D1G(one data line and one gate line)的架構。1 and 3, the
請參照圖2及圖4,此外,在前述的畫素陣列基板100中,每一靜電防護元件120dl、120gl的每一薄膜電晶體T1、T2可具有相同的通道寬長比。但在本實施例的畫素陣列基板100A中,靜電防護元件120dl、120gl可具有不同的通道寬長比。2 and 4, in addition, in the aforementioned
請參照圖3及圖4,具體而言,在本實施例中,電性連接於資料線DL與資料接地線CLdl之間的靜電防護元件120dl的每一薄膜電晶體T1、T2具有一通道寬W1及一通道長L1,靜電防護元件120dl之每一薄膜電晶體T1、T2的通道寬長比為W1/L1;電性連接於轉接線gl與閘極接地線CLgl之間的靜電防護元件120gl的每一薄膜電晶體T1、T2具有一通道寬W2及一通道長L2,靜電防護元件120gl之每一薄膜電晶體T1、T2的通道寬長比為W2/L2;特別是,(W2/L2)>(W1/L1)。3 and 4, specifically, in this embodiment, each thin film transistor T1, T2 of the electrostatic protection element 120dl electrically connected between the data line DL and the data ground line CLdl has a channel width W1 and a channel length L1, the channel width-to-length ratio of each thin film transistor T1 and T2 of the electrostatic protection element 120dl is W1/L1; the electrostatic protection element is electrically connected between the patch cord gl and the gate ground line CLgl Each thin film transistor T1 and T2 of 120gl has a channel width W2 and a channel length L2. The ratio of the channel width to length of each thin film transistor T1 and T2 of the electrostatic protection element 120gl is W2/L2; in particular, (W2/ L2)>(W1/L1).
也就是說,在本實施例中,考量轉接線gl(或者說,閘極線GL)的訊號振幅與資料線DL的訊號振幅不同,可將與轉接線gl(或者說,閘極線GL)電性連接之靜電防護元件120gl的通道寬長比W2/L2設計地較小,以達到分級防護的效果。That is to say, in this embodiment, considering that the signal amplitude of the transfer line gl (or gate line GL) is different from the signal amplitude of the data line DL, it can be compared with the transfer line gl (or gate line GL). GL) The width-to-length ratio W2/L2 of the electrical connection of the electrostatic protection component 120gl is designed to be smaller to achieve the effect of grading protection.
圖5為本發明又一實施例之畫素陣列基板100B的俯視示意圖。FIG. 5 is a schematic top view of a
圖5是以電路符號代表資料線DL、轉接線gl、靜電防護元件120dl、120gl、資料接地線CLdl及閘極接地線CLgl,其實際佈局(layout)與圖4的實施例類似,於此便不再繪示之。Fig. 5 is a circuit symbol representing the data line DL, the transfer line gl, the electrostatic protection components 120dl, 120gl, the data ground line CLdl and the gate ground line CLgl. The actual layout is similar to the embodiment of Fig. 4, here It will no longer be shown.
圖5的畫素陣列基板100B與圖3的畫素陣列基板100A類似,兩者的差異在於:在圖3的實施例中,所有的第二靜電防護元件120gl是電性連接至同一條閘極接地線CLgl;但在圖5的實施例中,多個靜電防護元件120gl是電性連接至彼此隔開的多條閘極接地線CLgl。The
請參照圖5,具體而言,在本實施例中,多條閘極線GL包括多個奇數條閘極線GL1及多個偶數條閘極線GL2,多條轉接線gl包括電性連接至奇數條閘極線GL1的多條轉接線gl1及電性連接至多條偶數條閘極線GL2的多條轉接線gl2,靜電防護電路ESDC的至少一閘極接地線CLgl包括閘極接地線CLgl1及閘極接地線CLgl2,多個靜電防護元件120gl的一部分電性連接於轉接線gl1與閘極接地線CLgl1之間,多個靜電防護元件120gl的另一部分電性連接於轉接線gl2與閘極接地線CLgl2之間,且閘極接地線CLgl1、閘極接地線CLgl2、資料接地線CLdlr、資料接地線CLdlg及資料接地線CLdlb在第二方向y上排列且互相隔開。5, specifically, in this embodiment, the multiple gate lines GL include multiple odd-numbered gate lines GL1 and multiple even-numbered gate lines GL2, and the multiple transition lines gl include electrical connections Multiple patch cords gl1 to odd-numbered gate lines GL1 and multiple patch cords gl2 electrically connected to multiple even-numbered gate lines GL2, at least one gate ground line CLgl of the electrostatic protection circuit ESDC includes gate ground Line CLgl1 and gate ground line CLgl2, a part of the plurality of electrostatic protection elements 120gl is electrically connected between the transfer line gl1 and the gate ground line CLgl1, and another part of the plurality of static protection elements 120gl is electrically connected to the transfer line Between gl2 and the gate ground line CLgl2, the gate ground line CLgl1, the gate ground line CLgl2, the data ground line CLdlr, the data ground line CLdlg, and the data ground line CLdlb are arranged in the second direction y and separated from each other.
100、100A、100B:畫素陣列基板
110:基板
110a、110b:邊緣
120dl、120dlr、120dlg、120dlb、120gl:靜電防護元件
130:扇出走線
140:接墊
150:驅動元件
CLdl、CLdlr、CLdlg、CLdlb:資料接地線
CLgl、CLgl1、CLgl2:閘極接地線
DL、DLR、DLG、DLB:資料線
ESDC:靜電防護電路
GL、GL1、GL2:閘極線
G130:扇出走線組
G140:接墊組
gl、gl1、gl2:轉接線
L1、L2:通道長
PX、PXR、PXG、PXB:畫素結構
T1、T2:薄膜電晶體
T1a、T2a:第一端
T1b、T2b:第二端
T1c、T2c:控制端
T1d、T2d:半導體圖案
W1、W2:通道寬
x:第一方向
y:第二方向100, 100A, 100B: pixel array substrate
110:
圖1為本發明一實施例之畫素陣列基板100的俯視示意圖。
圖2示出本發明一實施例之畫素陣列基板100的資料線DL、轉接線gl、靜電防護元件120dl、120gl、資料接地線CLdl及閘極接地線CLgl的佈局(layout)。
圖3為本發明另一實施例之畫素陣列基板100A的俯視示意圖。
圖4示出本發明另一實施例之畫素陣列基板100A的資料線DL、轉接線gl、靜電防護元件120dl、120gl、資料接地線CLdl及閘極接地線CLgl的佈局(layout)。
圖5為本發明又一實施例之畫素陣列基板100B的俯視示意圖。FIG. 1 is a schematic top view of a
100:畫素陣列基板100: Pixel array substrate
110:基板110: substrate
110a、110b:邊緣110a, 110b: edge
120dl、120dlr、120dlg、120dlb、120gl:靜電防護元件120dl, 120dlr, 120dlg, 120dlb, 120gl: electrostatic protection components
130:扇出走線130: fan out routing
140:接墊140: pad
150:驅動元件150: drive element
CLdl、CLdlr、CLdlg、CLdlb:資料接地線CLdl, CLdlr, CLdlg, CLdlb: data ground wire
CLgl:閘極接地線CLgl: gate ground wire
DL、DLR、DLG、DLB:資料線DL, DLR, DLG, DLB: data line
ESDC:靜電防護電路ESDC: Electrostatic protection circuit
GL:閘極線GL: Gate line
G130:扇出走線組G130: Fan-out wiring group
G140:接墊組G140: Pad set
gl:轉接線gl: adapter cable
PX、PXR、PXG、PXB:畫素結構PX, PXR, PXG, PXB: pixel structure
x:第一方向x: first direction
y:第二方向y: second direction
Claims (5)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108132972A TWI729493B (en) | 2019-09-12 | 2019-09-12 | Pixel array substrate |
| CN202010265139.4A CN111341771B (en) | 2019-09-12 | 2020-04-07 | Pixel array substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108132972A TWI729493B (en) | 2019-09-12 | 2019-09-12 | Pixel array substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202111407A TW202111407A (en) | 2021-03-16 |
| TWI729493B true TWI729493B (en) | 2021-06-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108132972A TWI729493B (en) | 2019-09-12 | 2019-09-12 | Pixel array substrate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111341771B (en) |
| TW (1) | TWI729493B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111443541B (en) * | 2020-04-09 | 2022-09-23 | 昆山龙腾光电股份有限公司 | Discharge protection circuit and display panel |
| WO2022170458A1 (en) | 2021-02-09 | 2022-08-18 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN113204145B (en) * | 2021-06-09 | 2025-05-27 | 京东方科技集团股份有限公司 | Display substrate, display device |
| TWI802393B (en) * | 2022-05-03 | 2023-05-11 | 友達光電股份有限公司 | Pixel array substrate |
| TWI820876B (en) * | 2022-08-23 | 2023-11-01 | 友達光電股份有限公司 | Display device and inspection method using the same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200819825A (en) * | 2006-10-20 | 2008-05-01 | Au Optronics Corp | Electrostatic discharge protection structure and electrostatic discharge protection device for a liquid crystal display, and method of making the same |
| TW200919690A (en) * | 2007-10-23 | 2009-05-01 | Lg Display Co Ltd | Electrostatic discharge protection circuit, manufacturing method thereof and liquid crystal display device having the same |
| TW200919689A (en) * | 2007-10-30 | 2009-05-01 | Hannstar Display Corp | Display device |
| TW200942902A (en) * | 2008-04-11 | 2009-10-16 | Innolux Display Corp | Liquid crystal display panel |
| US8462473B2 (en) * | 2010-12-21 | 2013-06-11 | Microchip Technology Incorporated | Adaptive electrostatic discharge (ESD) protection circuit |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1971350A (en) * | 2006-11-02 | 2007-05-30 | 友达光电股份有限公司 | Electrostatic discharge protection structure, component and component manufacturing method |
| TWI478256B (en) * | 2012-07-06 | 2015-03-21 | Unidisplay Inc | Touch panel and manufacturing method thereof |
| CN104062823B (en) * | 2014-06-06 | 2017-01-25 | 厦门天马微电子有限公司 | Array substrate and display device |
| TWI587768B (en) * | 2014-09-12 | 2017-06-11 | 友達光電股份有限公司 | Display apparatus |
| CN105404066B (en) * | 2015-12-28 | 2018-11-23 | 深圳市华星光电技术有限公司 | array substrate and liquid crystal display |
-
2019
- 2019-09-12 TW TW108132972A patent/TWI729493B/en active
-
2020
- 2020-04-07 CN CN202010265139.4A patent/CN111341771B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200819825A (en) * | 2006-10-20 | 2008-05-01 | Au Optronics Corp | Electrostatic discharge protection structure and electrostatic discharge protection device for a liquid crystal display, and method of making the same |
| TW200919690A (en) * | 2007-10-23 | 2009-05-01 | Lg Display Co Ltd | Electrostatic discharge protection circuit, manufacturing method thereof and liquid crystal display device having the same |
| TW200919689A (en) * | 2007-10-30 | 2009-05-01 | Hannstar Display Corp | Display device |
| TW200942902A (en) * | 2008-04-11 | 2009-10-16 | Innolux Display Corp | Liquid crystal display panel |
| US8462473B2 (en) * | 2010-12-21 | 2013-06-11 | Microchip Technology Incorporated | Adaptive electrostatic discharge (ESD) protection circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111341771B (en) | 2022-09-20 |
| TW202111407A (en) | 2021-03-16 |
| CN111341771A (en) | 2020-06-26 |
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