TWI728737B - Camera module package structure - Google Patents

Abstract

A camera module package structure comprising an image sensor, a substrate and an imaging device. The image sensor has a plurality of first soldering points. The substrate has an accommodation part for receiving the image sensor and a plurality of second soldering points arranging along a periphery of the accommodation part and respectively corresponding to and connected to the first soldering points through a plurality of conducting wires. There is a gap between the image sensor and an inner surface of the periphery of the accommodation part for filling of a gum. The image sensor is disposed correspondingly to the accommodation part and is fixedly attached to the substrate. Such an arrangement reduces the total height of the camera module and enhances the imaging effect of the camera module.

Description

Camera module packaging structure

The present invention relates to a packaging structure, in particular to a camera module packaging structure.

Currently, there are three packaging processes in the field of camera module manufacturing, namely: 1. CSP (Chip Scale Package) process; 2. Flip Chip process; 3. COB (Chip On Board) process.

1. The CSP process adds a glass protective layer to the bare chip, but when light penetrates the glass protective layer, it will cause slight refraction, reflection and energy loss, resulting in poor image effects. 2. The Flip Chip process is difficult for most manufacturers to adopt this process due to the complexity of the process and the high cost. 3. The COB process has gained popularity due to the low price of photosensitive elements and the mature process. The post process of COB packaging process has two bonding processes, namely: 1. Hot Bar (hot pressing of solder paste), 2. ACF (hot pressing of anisotropic conductive adhesive)/ACP (hot pressing of anisotropic conductive paste) .

However, 1. Hot Bar has basically been adopted by no one due to its low reliability; and 2. ACF/ACP requires additional equipment to be purchased, which causes the cost to rise sharply, causing the conventional COB process to be unable to further reduce the height of the camera module.

In addition, it is known that the photosensitive element is embedded in the substrate through a tight fitting method. However, this fixing method relies on friction, and its fixing effect is not good, and it will generate debris, dust, debris and dust during the installation process. It will contaminate the surface of the photosensitive element and cause poor image effects, and may even cause a short circuit on the substrate. The solder joints of the substrate or the photosensitive element may also be damaged during the installation of the photosensitive element.

Therefore, as the current electronic equipment is becoming lighter, thinner and smaller, how to improve the current camera module packaging process to reduce the overall height of the camera module, reduce the risk of contamination of the bare chip, and facilitate process control, improve yield and at the same time Increasing the image effect of the camera module has a good fixation effect, which is the direction that researchers in this field should strive for.

One purpose of the present invention is to reduce the overall height of the camera module.

Another object of the present invention is to prevent the glue from remaining on the surface of the photosensitive element or the substrate, which can increase the image effect of the camera module.

Another object of the present invention is to improve the stability of the camera module combination.

In order to achieve the above objective, the present invention provides a camera module package structure, which includes: a photosensitive element, a substrate, and an imaging element; the photosensitive element has a plurality of first solder joints; the substrate has a accommodating portion and A plurality of second solder joints are arranged on the periphery of the accommodating part, the photosensitive element is arranged in the accommodating part, the first and second solder joints correspond to each other and are electrically connected through a plurality of wires, and the photosensitive element and the accommodating part There is a gap on the inner wall surface of the surroundings, and the gap is used for filling a rubber material; the imaging element is fixedly combined on the substrate corresponding to the accommodating part.

With this design of the present invention, the total height of the camera module can be reduced, the fixing effect is better, and the glue will not remain on the surface of the photosensitive element or the substrate, which can increase the image effect of the camera module.

1: photosensitive element

11: The first solder joint

2: substrate

21: Containment Department

211: Inner Wall

212: Gap

213: plastic inlet

214: Rubber

22: The second solder joint

4: Wire

5: filter

6: Adhesive layer

23: window area

24: Solder mask

3: Camera element

Figure 1 is a three-dimensional exploded view of one embodiment of the camera module packaging structure of the present invention; Figure 2 is a three-dimensional assembly view of one embodiment of the camera module packaging structure of the present invention; Figure 3 is a three-dimensional assembly view of one embodiment of the camera module packaging structure of the present invention A top view of the accommodating portion of an embodiment of the module packaging structure; Figure 4 is a cross-sectional view taken along line AA in Figure 2 of the camera module packaging structure of the present invention; Figure 5 is a schematic diagram of the glue filling of the camera module packaging structure of the present invention; Figure 6 is a view of the camera module packaging structure of the present invention Cross-sectional view of an alternative embodiment.

The above-mentioned objects and structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings.

Please refer to Figures 1 to 5, which are a three-dimensional exploded view, a three-dimensional assembly view of an embodiment of the camera module packaging structure of the present invention, a top view of an accommodating portion of an embodiment, a cross-sectional view of line AA in Figure 2 and a schematic diagram of glue filling. As shown in the figure, the camera module packaging structure of the present invention includes a photosensitive element 1, a substrate 2 and an imaging element 3.

The photosensitive element 1 has a plurality of first solder joints 11, and the photosensitive element 1 is selected as a charge-coupled device (CCD) and a complementary metal-oxide semiconductor active pixel sensor (Complementary Metal-Oxide-Semiconductor Active pixel sensor). , CMOS) any of them.

The substrate 2 has a accommodating portion 21, a plurality of second solder joints 22, a window area 23 and a solder resist layer 24. The substrate 2 is a printed circuit board, but it is not limited to this. In other embodiments, the substrate 2 may also be a flexible circuit board.

The photosensitive element 1 is disposed in the accommodating portion 21, and the photosensitive element 1 can be fixed in the accommodating portion 21 through glue dispensing or double-sided adhesive bonding. The accommodating portion 21 is a groove recessed from the substrate 2 but is not limited to this. In other embodiments, the accommodating portion 21 may also be a through hole penetrating the substrate 2 (as shown in Figure 6). Shown).

The second solder joints 22 are arranged on the periphery of the accommodating portion 21. The first and second solder joints 11, 22 correspond to each other and are electrically connected by a plurality of wires 4. The wires 4 are gold wires, but not Limited to this, in other embodiments, the wires 4 may also be wires made of other materials.

There is a gap 212 between the photosensitive element 1 and the inner wall surface 211 around the accommodating portion 21, and the accommodating portion 21 has a plurality of glue inlets 213 connected to the gap 212. The width of the circumference of the gap 212 is equal, and the gap 212 is filled with a rubber material 214, the rubber material 214 is epoxy resin (Epoxy) or the like, and the rubber material 214 flows from the rubber inlets 213 Fill the gap 212, and evenly fill the glue 214 into the gap 212, and then bake and cure to fix the photosensitive element 1. The glue inlets 213 are six glue inlets 213 in this embodiment. In other embodiments, there can be any two or more glue inlets 213. In addition, filling the rubber material through the plurality of rubber inlets 213 at the same time can make the rubber material 214 more evenly distributed.

The window opening area 23 is arranged around the accommodating portion 21, and the second solder joints 22 are arranged in the window opening area 23.

The solder resist layer 24 is provided on the outer surface of the substrate 2 and does not cover the area where the accommodating portion 21 and the window opening region 23 are provided. The second solder joints 22 are exposed from the window opening region 23, and the window opening region 23 The surface is lower than the surface of the solder resist layer 24, and the solder resist layer 24 is an insulating and solder resist ink.

The imaging element 3 is fixedly connected to the substrate 1 corresponding to the accommodating portion 21. In fact, the imaging element 3 can be suspended and aligned with the accommodating portion 21 and the accommodating portion 21 and the substrate 1 through an Active Alignment process. The photosensitive element 1 is glued and fixed between the substrate 2 and the imaging element 3 after alignment, and the imaging element 3 is an integrated lens.

In one implementation, the camera module packaging structure further includes a filter 5 disposed on the side of the imaging element 3 opposite to the photosensitive element 1, and the filter 5 is selected as an infrared filter and a visible light. Any one of the optical filters, and in an alternative implementation, the optical filter 5 may be omitted.

In another implementation, the camera module packaging structure further includes a back adhesive layer 6 disposed on the opposite side of the substrate 2 to the imaging element 3, and in an alternative implementation, the back adhesive layer 6 may be omitted.

With this design of the present invention, since the photosensitive element 1 is disposed in the accommodating portion 21, the overall height of the camera module can be reduced. In addition, since the gap 212 between the photosensitive element 1 and the accommodating portion 21 can make the glue 214 evenly filled to fix the photosensitive element 1 and the fixing effect is better, so that the glue 214 will not remain on the photosensitive element 1 or The surface of the substrate 2 can increase the image effect of the camera module.

The present invention has been described in detail above, but what is described above is only a preferred embodiment of the present invention, and should not limit the scope of implementation of the present invention. That is to say, all equal changes and modifications made in accordance with the scope of the application of the present invention should still be covered by the patent of the present invention.

1: photosensitive element

2: substrate

21: Containment Department

211: Inner Wall

213: plastic inlet

22: The second solder joint

23: window area

24: Solder mask

3: Camera element

5: filter

6: Adhesive layer

Claims (9)

A camera module packaging structure includes: a photosensitive element with a plurality of first solder joints; a substrate with a accommodating portion and a plurality of second solder joints arranged on the periphery of the accommodating portion, and the photosensitive element is arranged on the container In the accommodating part, the first and second solder joints correspond to each other and are electrically connected through a plurality of wires, and the photosensitive element is separated from the inner wall surface around the accommodating part by a gap, and the gap is used to fill a rubber material, the rubber material For fixing the photosensitive element, the glue is not provided on the surface of the photosensitive element or the substrate; and an imaging element corresponding to the accommodating part is fixedly combined on the substrate. According to the camera module packaging structure described in item 1 of the scope of patent application, a plurality of glue inlets are provided around the accommodating portion to communicate with the gap, and the glue is filled into the gap from the glue inlets. As for the camera module packaging structure described in item 1 of the scope of patent application, wherein the accommodating portion has a window area around the periphery, and a solder resist layer is provided on the outer surface of the substrate and does not cover the accommodating portion and the window area. In the area, the second solder joints are arranged in the window opening area. According to the camera module package structure described in item 3 of the scope of patent application, the surface of the window opening area is lower than the surface of the solder resist layer. According to the camera module packaging structure described in claim 1, wherein the accommodating portion is selected to be either a groove or a through hole, the groove is recessed from the substrate, and the through hole penetrates the substrate. In the camera module packaging structure described in the first item of the scope of patent application, the substrate is selected to be either a printed circuit board or a flexible circuit board. As described in the first item of the scope of patent application, the camera module packaging structure further includes a filter disposed on a side of the camera element opposite to the photosensitive element. In the camera module packaging structure described in item 7 of the scope of patent application, the filter is selected to be any one of an infrared filter and a visible light filter. As described in the first item of the scope of patent application, the camera module packaging structure further includes a back adhesive layer disposed on a side of the imaging element opposite to the substrate.

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