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TWI728449B - Composite material structure applied to biological test piece and manufacturing method thereof - Google Patents

Composite material structure applied to biological test piece and manufacturing method thereof Download PDF

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TWI728449B
TWI728449B TW108131477A TW108131477A TWI728449B TW I728449 B TWI728449 B TW I728449B TW 108131477 A TW108131477 A TW 108131477A TW 108131477 A TW108131477 A TW 108131477A TW I728449 B TWI728449 B TW I728449B
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conductive
conductive layer
layer
composite material
material structure
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TW108131477A
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TW202110632A (en
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方皓葦
錢明谷
吳家鈺
賴政偉
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禾達材料科技股份有限公司
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Abstract

The present invention provides a composite material structure applied to biological test piece and manufacturing method thereof. The composite material structure includes a substrate, a precious-metal-free conductive element, and a precious-metal-free adhesion layer. The precious-metal-free conductive element is disposed on the substrate. The precious-metal-free adhesion layer is disposed on the precious-metal-free conductive element. Therefore, the composite material structure applied to biological test piece and manufacturing method thereof of the present invention can improve production efficiency and reduce cost.

Description

應用於生物試片的複合式材料結構及其製作方法Composite material structure applied to biological test piece and manufacturing method thereof

本發明涉及一種複合式材料結構及其製作方法,特別是涉及一種應用於生物試片的複合式材料結構及其製作方法。 The invention relates to a composite material structure and a manufacturing method thereof, in particular to a composite material structure applied to a biological test piece and a manufacturing method thereof.

現代人因飲食習慣的改變、生活壓力大以及生活習慣的不正常,導致患有慢性疾病的人越來越有年輕化的現象。因此,生理狀況檢測有其重要性,除了有助於一般民眾確認自身健康狀況,對於患者來說,透過生理狀況檢測可提升其治療效果及掌握其病程發展。 Modern people are becoming younger and younger due to changes in dietary habits, high pressure in life, and abnormal living habits. Therefore, the detection of physiological conditions is of great importance. In addition to helping the general public to confirm their own health conditions, for patients, the detection of physiological conditions can enhance their therapeutic effects and grasp the course of their disease.

鑒於上述問題,各式各樣的檢測試片紛紛對應出現於市場上。然而,在現有的檢測試片的材料結構中,不僅採用了貴重金屬,並且,再經由一般製程後,還需透過熱處理製程進行高溫(>150℃)烘烤。 In view of the above problems, various test strips have appeared on the market. However, in the existing material structure of the test piece, not only precious metals are used, but also, after a general manufacturing process, it needs to be baked at a high temperature (>150°C) through a heat treatment process.

因此,如何提供一種應用於生物試片的複合式材料結構,能夠不使用貴重金屬,且縮短製程以提高產能、降低成本,已成為重要課題之一。 Therefore, how to provide a composite material structure for biological test strips that can eliminate the use of precious metals and shorten the manufacturing process to increase productivity and reduce costs has become one of the important issues.

本發明所要解決的技術問題在於,針對現有技術的不足提供一種應用於生物試片的複合式材料結構及其製作方法。 The technical problem to be solved by the present invention is to provide a composite material structure applied to a biological test piece and a manufacturing method thereof in view of the deficiencies of the prior art.

為了解決上述的技術問題,本發明所採用的其中一技術方案 是,提供一種應用於生物試片的複合式材料結構,其包括一基板、一不含貴金屬的導電單元以及一不含貴金屬的附著層。不含貴金屬的導電單元設置在該基板上。不含貴金屬的附著層設置在該導電單元上。 In order to solve the above technical problems, one of the technical solutions adopted by the present invention Yes, a composite material structure applied to a biological test piece is provided, which includes a substrate, a conductive unit that does not contain precious metals, and an adhesion layer that does not contain precious metals. Conductive units that do not contain precious metals are arranged on the substrate. An adhesion layer containing no precious metal is provided on the conductive unit.

為了解決上述的技術問題,本發明所採用的另外一技術方案是,提供一種應用於生物試片的複合式材料結構的製作方法,其包括:提供一基板;形成一不含貴金屬的導電單元於該基板上;以及形成一不含貴金屬的附著層於該導電單元上。 In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a method for manufacturing a composite material structure applied to biological test strips, which includes: providing a substrate; forming a conductive unit that does not contain precious metals on On the substrate; and forming a noble metal-free adhesion layer on the conductive unit.

本發明的其中一有益效果在於,本發明所提供的應用於生物試片的複合式材料結構,其能通過“一不含貴金屬的導電單元設置在該基板上”以及“不含貴金屬的附著層設置在該導電單元上”的技術方案,以提高生產效率,並降低成本。 One of the beneficial effects of the present invention is that the composite material structure applied to biological test strips provided by the present invention can be provided by "a conductive unit containing no precious metal on the substrate" and "a noble metal-free adhesion layer" Set on the conductive unit" technical solution to improve production efficiency and reduce costs.

本發明的另外一有益效果在於,本發明所提供的應用於生物試片的複合式材料結構的製作方法,其能通過“提供一基板”、“形成一不含貴金屬的導電單元於該基板上”以及“形成一不含貴金屬的附著層於該導電單元上”的技術方案,以提高生產效率,並降低成本。 Another beneficial effect of the present invention is that the method for manufacturing a composite material structure applied to biological test strips provided by the present invention can "provide a substrate" and "form a conductive unit free of precious metals on the substrate. "And the technical solution of "forming a noble metal-free adhesion layer on the conductive unit" to improve production efficiency and reduce costs.

為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。 In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings about the present invention. However, the drawings provided are only for reference and description, and are not used to limit the present invention.

Z:複合式材料結構 Z: Composite material structure

1:基板 1: substrate

2:導電單元 2: conductive unit

20:第一導電層 20: The first conductive layer

21:第二導電層 21: second conductive layer

3:附著層 3: Adhesion layer

圖1為本發明第一實施例的應用於生物試片的複合式材料結構的製作方法的流程圖。 FIG. 1 is a flowchart of a method for manufacturing a composite material structure applied to a biological test piece according to a first embodiment of the present invention.

圖2為本發明第一實施例的應用於生物試片的複合式材料結構的結構示意圖。 2 is a schematic structural diagram of a composite material structure applied to a biological test piece according to the first embodiment of the present invention.

圖3為本發明第二實施例的應用於生物試片的複合式材料結構的製作方法的流程圖。 3 is a flowchart of a method for manufacturing a composite material structure applied to a biological test piece according to a second embodiment of the present invention.

圖4為本發明第二實施例的應用於生物試片的複合式材料結構的結構示意圖。 4 is a schematic structural diagram of a composite material structure applied to a biological test piece according to a second embodiment of the present invention.

圖5為本發明的應用於生物試片的複合式材料的血糖測試的結果曲線圖。 Fig. 5 is a graph showing the results of the blood glucose test of the composite material applied to the biological test strip of the present invention.

以下是通過特定的具體實施例來說明本發明所公開有關“應用於生物試片的複合式材料結構及其製作方法”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。 The following are specific examples to illustrate the implementation of the "composite material structure applied to biological test strips and its production method" disclosed in the present invention. Those skilled in the art can understand the present invention from the content disclosed in this specification. Advantages and effects. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件,但這些元件不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。 It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

[第一實施例] [First Embodiment]

參閱圖1及圖2所示,本發明第一實施例提供一種應用於生物試片的複合式材料結構Z的製作方法,其至少包括下列幾個步驟: 首先,提供一基板1(步驟S100)。舉例來說,配合圖1及圖2所示,基板1可為聚亞醯胺(Polyimide,PI)、高密度聚乙烯(HDPE)、聚對苯二甲酸乙二酯(PET)、聚碳酸酯(PC)或者聚苯乙烯(PS)。然而,本發明不以上述所舉的例子為限。 1 and 2, the first embodiment of the present invention provides a method for manufacturing a composite material structure Z applied to a biological test strip, which at least includes the following steps: First, a substrate 1 is provided (step S100). For example, as shown in FIGS. 1 and 2, the substrate 1 can be polyimide (PI), high-density polyethylene (HDPE), polyethylene terephthalate (PET), polycarbonate (PC) or polystyrene (PS). However, the present invention is not limited to the above-mentioned examples.

接著,形成一不含貴金屬的導電單元2於基板1上(步驟S102)。舉例來說,配合圖1及圖2所示,在基板1上形成導電單元2,導電單元2包括一第一導電層20,第一導電層20的厚度可介於1~5000nm。第一導電層20可為金屬、合金、導電高分子或導電化合物;並且,本發明的第一導電層20不含貴金屬,不包含的貴金屬可為金(Au)、銀(Ag)、鉑(Pt)或其組合。其中,本發明的第一導電層20可為無孔隙或者少孔隙的高緻密結構。 Next, a conductive unit 2 containing no precious metal is formed on the substrate 1 (step S102). For example, as shown in FIG. 1 and FIG. 2, the conductive unit 2 is formed on the substrate 1. The conductive unit 2 includes a first conductive layer 20, and the thickness of the first conductive layer 20 may be between 1 nm and 5000 nm. The first conductive layer 20 can be a metal, an alloy, a conductive polymer or a conductive compound; and the first conductive layer 20 of the present invention does not contain precious metals, and the precious metals that do not contain can be gold (Au), silver (Ag), platinum ( Pt) or a combination thereof. Among them, the first conductive layer 20 of the present invention may be a highly dense structure with no or less pores.

進一步來說,金屬可為鋁(Al)、鈦(Ti)、鉬(Mo)、銅(Cu)、鎳(Ni)、錫(Sn)或者鋅(Zn)。導電高分子可為聚二氧乙基噻吩(Poly-3,4-Ethylenedioxythiophene,PEDOT)、聚吡咯(Polypyrrole,PPy)或者聚苯胺(Polyaniline,PAn)。導電化合物可為鎢、氮、碳中之至少一者或其組合的化合物。合金可為鋁(Al)、鈦(Ti)、鉬(Mo)、銅(Cu)、鎳(Ni)、錫(Sn)以及鋅(Zn)中的至少二者。然而,本發明不以上述所舉的例子為限。 Further, the metal may be aluminum (Al), titanium (Ti), molybdenum (Mo), copper (Cu), nickel (Ni), tin (Sn), or zinc (Zn). The conductive polymer can be Poly-3,4-Ethylenedioxythiophene (PEDOT), Polypyrrole (PPy) or Polyaniline (PAn). The conductive compound may be a compound of at least one of tungsten, nitrogen, and carbon, or a combination thereof. The alloy may be at least two of aluminum (Al), titanium (Ti), molybdenum (Mo), copper (Cu), nickel (Ni), tin (Sn), and zinc (Zn). However, the present invention is not limited to the above-mentioned examples.

接下來,形成一不含貴金屬的附著層3於導電單元2上(步驟S104)。舉例來說,配合圖1及圖2所示,在形成導電單元2後,接著,在導電單元2上形成附著層3,也就是在第一導電層20上形成附著層3;並且,本發明的附著層3不含貴金屬,不包含的貴金屬可為金(Au)、銀(Ag)、鉑(Pt)或其組合。附著層3的厚度可介於1~5000nm。附著層3可為碳化物、矽(Si)、矽化物或者碳(C),碳為石墨或石墨烯。 Next, an adhesion layer 3 containing no precious metal is formed on the conductive unit 2 (step S104). For example, as shown in FIGS. 1 and 2, after the conductive unit 2 is formed, then an adhesion layer 3 is formed on the conductive unit 2, that is, the adhesion layer 3 is formed on the first conductive layer 20; and, the present invention The adhesion layer 3 does not contain precious metals, and the precious metals not included can be gold (Au), silver (Ag), platinum (Pt) or a combination thereof. The thickness of the adhesion layer 3 may be between 1 nm and 5000 nm. The adhesion layer 3 can be carbide, silicon (Si), silicide or carbon (C), and the carbon is graphite or graphene.

進一步來說,導電單元2(即第一導電層20)以及附著層3可在 溫度小於150℃的環境下所形成,且不需經過熱處理加工。此外,導電單元2以及附著層3為相異的材料層。然而,本發明不以上述所舉的例子為限。 Furthermore, the conductive unit 2 (that is, the first conductive layer 20) and the adhesion layer 3 can be It is formed in an environment with a temperature of less than 150°C and does not require heat treatment. In addition, the conductive unit 2 and the adhesion layer 3 are layers of different materials. However, the present invention is not limited to the above-mentioned examples.

根據上述內容,本發明第一實施例還提供一種應用於生物試片的複合式材料結構Z,其可包括一基板1、一不含貴金屬的導電單元2以及一不含貴金屬的附著層3。不含貴金屬的導電單元2設置在基板1上。不含貴金屬的附著層3設置在導電單元2上。 Based on the above content, the first embodiment of the present invention also provides a composite material structure Z applied to a biological test strip, which may include a substrate 1, a conductive unit 2 free of precious metals, and an adhesion layer 3 free of precious metals. The conductive unit 2 containing no precious metal is provided on the substrate 1. An adhesion layer 3 that does not contain noble metals is provided on the conductive unit 2.

據此,本發明所提供的應用於生物試片的複合式材料結構Z及其製作方法通過上述的技術方案,可不使用貴重金屬;並且,所製備的膜層緻密性佳(緻密度>90%)。 Accordingly, the composite material structure Z applied to the biological test piece and the manufacturing method provided by the present invention can pass the above technical solution without using precious metals; and the prepared film has good compactness (density> 90%). ).

然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本發明。 However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present invention.

[第二實施例] [Second Embodiment]

參閱圖3及圖4所示,本發明第二實施例提供一種應用於生物試片的複合式材料結構Z的製作方法,其至少包括下列步驟:首先,提供一基板1(步驟S200);接著,形成至少一個不含貴金屬的第一導電層20於基板1上(步驟S2020);緊接著,形成至少一個不含貴金屬的第二導電層21於至少一個第一導電層20上(步驟S2021);接下來,形成一不含貴金屬的附著層3於至少一個第二導電層21上(步驟S204)。 3 and 4, the second embodiment of the present invention provides a method for manufacturing a composite material structure Z applied to a biological test strip, which at least includes the following steps: first, a substrate 1 is provided (step S200); , Forming at least one first conductive layer 20 containing no precious metal on the substrate 1 (step S2020); next, forming at least one second conductive layer 21 containing no precious metal on the at least one first conductive layer 20 (step S2021) Next, an adhesion layer 3 containing no precious metal is formed on at least one second conductive layer 21 (step S204).

舉例來說,由圖1及圖2與圖3及圖4比對可知,本發明第二實施例與第一實施例的差異在於:本發明的導電單元2可包括至少一個第一導電層20以及至少一個第二導電層21。因此,先在基板1上形成第一導電層20。接著,在第一導電層20上再形成第二導電層21。接下來,在第二導電層21上形成不含貴金屬的附著層3,且第二導電層21位於第一導電層20與附著層3之間。其中,在本實施例中以兩層導電層作為舉例,即一層第一導電層20與一層第二 導電層21,但不以此為限,本發明的複合式材料結構Z也可包括兩層或兩層以上的第一導電層20、第二導電層21或其兩者。 For example, comparing FIGS. 1 and 2 with FIGS. 3 and 4, the difference between the second embodiment of the present invention and the first embodiment is that the conductive unit 2 of the present invention may include at least one first conductive layer 20 And at least one second conductive layer 21. Therefore, the first conductive layer 20 is formed on the substrate 1 first. Next, a second conductive layer 21 is formed on the first conductive layer 20. Next, an adhesion layer 3 containing no noble metal is formed on the second conductive layer 21, and the second conductive layer 21 is located between the first conductive layer 20 and the adhesion layer 3. Among them, in this embodiment, two conductive layers are taken as an example, namely, a first conductive layer 20 and a second conductive layer 20. The conductive layer 21, but not limited thereto, the composite material structure Z of the present invention may also include two or more layers of the first conductive layer 20, the second conductive layer 21, or both.

進一步來說,第一導電層20以及第二導電層21的厚度可介於1~5000nm,且第一導電層20以及第二導電層21可為金屬、合金、導電高分子或導電化合物;並且,本發明的第一導電層20以及第二導電層21不含貴金屬,不包含的貴金屬可為金(Au)、銀(Ag)、鉑(Pt)或其組合。金屬可為鋁(Al)、鈦(Ti)、鉬(Mo)、銅(Cu)、鎳(Ni)、錫(Sn)或者鋅(Zn)。 導電高分子可為聚二氧乙基噻吩(Poly-3,4-Ethylenedioxythiophene,PEDOT)、聚吡咯(Polypyrrole,PPy)或者聚苯胺(Polyaniline,PAn)。導電化合物可為鎢、氮、碳中之至少一者或其組合的化合物。合金可為鋁(Al)、鈦(Ti)、鉬(Mo)、銅(Cu)、鎳(Ni)、錫(Sn)以及鋅(Zn)中的至少二者。然而,本發明不以上述所舉的例子為限。值得一提的是,第一導電層20與第二導電層21的材料可為部分相同或完全相異,但不以此為限,也可選擇為完全相同。 Furthermore, the thickness of the first conductive layer 20 and the second conductive layer 21 may be between 1 nm and 5000 nm, and the first conductive layer 20 and the second conductive layer 21 may be metals, alloys, conductive polymers or conductive compounds; and The first conductive layer 20 and the second conductive layer 21 of the present invention do not contain precious metals, and the precious metals not included can be gold (Au), silver (Ag), platinum (Pt) or a combination thereof. The metal may be aluminum (Al), titanium (Ti), molybdenum (Mo), copper (Cu), nickel (Ni), tin (Sn), or zinc (Zn). The conductive polymer can be Poly-3,4-Ethylenedioxythiophene (PEDOT), Polypyrrole (PPy) or Polyaniline (PAn). The conductive compound may be a compound of at least one of tungsten, nitrogen, and carbon, or a combination thereof. The alloy may be at least two of aluminum (Al), titanium (Ti), molybdenum (Mo), copper (Cu), nickel (Ni), tin (Sn), and zinc (Zn). However, the present invention is not limited to the above-mentioned examples. It is worth mentioning that the materials of the first conductive layer 20 and the second conductive layer 21 can be partially the same or completely different, but not limited to this, and can also be selected to be completely the same.

此外,本發明的第一導電層20以及第二導電層21可為無孔隙或者少孔隙的高緻密結構。 In addition, the first conductive layer 20 and the second conductive layer 21 of the present invention can be a highly dense structure with no or less pores.

然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本發明。 However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present invention.

此外,配合圖5所示,其為本發明通過上述各實施例的生物試片的複合式材料結構Z所進行的血糖檢測結果。如圖5所示,縱軸表示為標準化強度(單位為arbitrary unit,a.u.),其為血糖監測器(Blood Glucose Monitor,BGM)的數據經由標準化處理(量測數值/全距),不影響最終線性迴歸(linear regression)結果;橫軸為葡萄糖的濃度(單位為mg/dl)。通過本發明的生物試片的複合式材料結構Z進行檢測,測得出多個參數值(如下表所示)。其中, 圖5中的曲線以標準化強度值(Y)對相應葡萄糖濃度(X)做標準曲線,即Y=0.002X+0.0382,R2=09991。 In addition, as shown in FIG. 5, it is the result of the blood glucose test performed by the composite material structure Z of the biological test strip of the above embodiments of the present invention. As shown in Figure 5, the vertical axis represents the normalized intensity (unit is arbitrary unit, au), which is that the blood glucose monitor (Blood Glucose Monitor, BGM) data is standardized (measured value/full range), which does not affect the final Linear regression results; the horizontal axis is the concentration of glucose (in mg/dl). Through the detection of the composite material structure Z of the biological test piece of the present invention, multiple parameter values (as shown in the following table) are measured. Among them, the curve in Fig. 5 uses the standardized intensity value (Y) to make a standard curve of the corresponding glucose concentration (X), that is, Y=0.002X+0.0382, R 2 =09991.

Figure 108131477-A0305-02-0009-1
Figure 108131477-A0305-02-0009-1

[實施例的有益效果] [Beneficial effects of the embodiment]

本發明的其中一有益效果在於,本發明所提供的應用於生物試片的複合式材料結構Z,其能通過“不含貴金屬的導電單元2設置在基板1上”以及“不含貴金屬的附著層3設置在導電單元2上”的技術方案,以提高生產效率,並降低成本。 One of the beneficial effects of the present invention is that the composite material structure Z applied to biological test strips provided by the present invention can be provided by "precious metal-free conductive unit 2 is arranged on substrate 1" and "precious metal-free adhesion The layer 3 is arranged on the conductive unit 2" to improve production efficiency and reduce costs.

本發明的另外一有益效果在於,本發明所提供的應用於生物試片的複合式材料結構Z的製作方法,其能通過“提供一基板1”、“形成一不含貴金屬的導電單元2於基板1上”以及“形成一不含貴金屬的附著層3於導電單元2上”的技術方案,以提高生產效率,並降低成本。 Another beneficial effect of the present invention is that the method for manufacturing the composite material structure Z applied to biological test strips provided by the present invention can be achieved by "providing a substrate 1" and "forming a conductive unit 2 free of precious metals." The technical solutions of "on the substrate 1" and "form a noble metal-free adhesion layer 3 on the conductive unit 2" can improve production efficiency and reduce costs.

更進一步來說,本發明所提供的應用於生物試片的複合式材料結構Z及其製作方法通過上述的技術方案,不僅不使用貴重金屬,來降低成本;較佳地,透過真空製程技術,來縮短製程程序,並提高生產效率,且所製備的膜層緻密性佳(緻密度>90%)。 Furthermore, the composite material structure Z applied to biological test strips and the manufacturing method thereof provided by the present invention not only do not use precious metals, but also reduce the cost through the above technical solutions; preferably, through the vacuum process technology, To shorten the manufacturing process and improve production efficiency, and the prepared film has good compactness (density>90%).

以上所公開的內容僅為本發明的優選可行實施例,並非因此侷 限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。 The content disclosed above is only a preferred and feasible embodiment of the present invention, not for this reason. The scope of the patent application of the present invention is limited, so all equivalent technical changes made by using the description of the present invention and the content of the drawings are included in the scope of the present invention.

複合式材料結構 Z 基板      1 導電單元    2     第一導電層   20 附著層     3 Composite material structure Z Substrate      1 Conductive unit     2    First conductive layer   20 Adhesion layer      3

Claims (10)

一種應用於生物試片的複合式材料結構,其包括:一基板;一不含貴金屬的導電單元,其設置在該基板上;以及一不含貴金屬的附著層,其設置在該導電單元上;其中,該導電單元包括設置在該基板上的至少一第一導電層以及設置在至少一該第一導電層上的至少一第二導電層,至少一該第二導電層介於至少一該第一導電層與該附著層之間;其中,至少一該第一導電層以及至少一該第二導電層為金屬、合金、導電高分子或導電化合物,至少一該第一導電層以及至少一該第二導電層所不包含的該貴金屬為金、銀或者鉑。 A composite material structure applied to a biological test strip, comprising: a substrate; a conductive unit free of precious metals, which is arranged on the substrate; and an adhesion layer free of precious metals, which is arranged on the conductive unit; Wherein, the conductive unit includes at least one first conductive layer disposed on the substrate and at least one second conductive layer disposed on at least one of the first conductive layers, and at least one second conductive layer is interposed between at least one of the first conductive layers. Between a conductive layer and the adhesion layer; wherein at least one of the first conductive layer and at least one of the second conductive layer is a metal, an alloy, a conductive polymer or a conductive compound, at least one of the first conductive layer and at least one of the The precious metal not included in the second conductive layer is gold, silver or platinum. 如申請專利範圍第1項所述的應用於生物試片的複合式材料結構,其中,該基板為聚亞醯胺、高密度聚乙烯、聚對苯二甲酸乙二酯、聚碳酸酯或者聚苯乙烯;其中,該第一導電層的厚度介於1~5000nm。 As described in item 1 of the scope of patent application, the composite material structure applied to biological test strips, wherein the substrate is polyimide, high-density polyethylene, polyethylene terephthalate, polycarbonate or poly Styrene; wherein, the thickness of the first conductive layer is between 1 and 5000 nm. 如申請專利範圍第1項所述的應用於生物試片的複合式材料結構,其中,金屬為鋁、鈦、鉬、銅、鎳、錫或者鋅;其中,導電高分子為聚二氧乙基噻吩、聚吡咯或者聚苯胺;其中,導電化合物為鎢、氮、碳中之至少一者或其組合的化合物。 As described in item 1 of the scope of patent application, the composite material structure applied to biological test strips, wherein the metal is aluminum, titanium, molybdenum, copper, nickel, tin or zinc; wherein the conductive polymer is polydioxyl Thiophene, polypyrrole or polyaniline; wherein the conductive compound is a compound of at least one of tungsten, nitrogen, and carbon, or a combination thereof. 如申請專利範圍第1項所述的應用於生物試片的複合式材料結構,其中,該附著層為碳、碳化物、矽或矽化物,碳為石墨或石墨烯;其中,該附著層所不包含的該貴金屬為金、銀或者鉑;其中,該附著層的厚度介於1~5000nm;其中,該導電單元以及該附著層為相異的材料層。 As described in the first item of the scope of patent application, the composite material structure applied to biological test strips, wherein the adhesion layer is carbon, carbide, silicon or silicide, and the carbon is graphite or graphene; wherein, the adhesion layer is The noble metal that is not included is gold, silver or platinum; wherein, the thickness of the adhesion layer is between 1 and 5000 nm; wherein, the conductive unit and the adhesion layer are layers of different materials. 如申請專利範圍第1項所述的應用於生物試片的複合式材料結構,其中,至少一第一導電層以及至少一該第二導電層的厚度介於1~5000nm。 As described in the first item of the scope of patent application, the composite material structure applied to biological test strips, wherein the thickness of at least one first conductive layer and at least one second conductive layer is between 1 nm and 5000 nm. 一種應用於生物試片的複合式材料結構的製作方法,其包括下列步驟:提供一基板;形成一不含貴金屬的導電單元於該基板上;以及形成一不含貴金屬的附著層於該導電單元上;其中,該導電單元包括至少一第一導電層以及至少一第二導電層,且在形成不含貴金屬的該導電單元於該基板上的步驟中還進一步包括:形成至少一不含貴金屬的該第一導電層於該基板上;以及形成至少一不含貴金屬的該第二導電層於至少一該第一導電層上;其中,至少一該第二導電層介於至少一該第一導電層與該附著層之間;其中,至少一第一導電層以及至少一該第二導電層為金屬、合金、導電高分子或導電化合物,至少一第一導電層以及至少一該第二導電層所不包含的該貴金屬為金、銀或者鉑。 A method for manufacturing a composite material structure applied to a biological test piece, comprising the following steps: providing a substrate; forming a conductive unit without precious metals on the substrate; and forming an adhesion layer without precious metals on the conductive unit On; wherein, the conductive unit includes at least one first conductive layer and at least one second conductive layer, and the step of forming the conductive unit free of precious metals on the substrate further includes: forming at least one free of precious metals The first conductive layer is on the substrate; and at least one second conductive layer containing no precious metal is formed on at least one of the first conductive layers; wherein at least one of the second conductive layers is interposed between at least one of the first conductive layers Layer and the adhesion layer; wherein at least one first conductive layer and at least one second conductive layer are metal, alloy, conductive polymer or conductive compound, at least one first conductive layer and at least one second conductive layer The precious metals that are not included are gold, silver or platinum. 如申請專利範圍第6項所述的應用於生物試片的複合式材料結構的製作方法,其中,該基板為聚亞醯胺、高密度聚乙烯、聚對苯二甲酸乙二酯、聚碳酸酯或者聚苯乙烯;其中,該附著層為碳、碳化物、矽或矽化物,碳為石墨或石墨烯;其中,該附著層的厚度介於1~5000nm;其中,該第一導電層以及該附著層為相異的材料層。 As described in item 6 of the scope of patent application, the method for manufacturing a composite material structure applied to a biological test piece, wherein the substrate is polyimide, high-density polyethylene, polyethylene terephthalate, polycarbonate Ester or polystyrene; wherein the adhesion layer is carbon, carbide, silicon or silicide, and the carbon is graphite or graphene; wherein the thickness of the adhesion layer is between 1 and 5000 nm; wherein, the first conductive layer and The adhesion layer is a layer of different materials. 如申請專利範圍第7項所述的應用於生物試片的複合式材料結構的製作方法,其中,金屬為鋁、鈦、鉬、銅、鎳、錫或者鋅;其中,導電高分子為聚二氧乙基噻吩、聚吡咯或者聚苯胺;其中,導電化合物為鎢、氮、碳中之至少一者或其組合的化合物;其中,該第一導電層的厚度介於1~5000nm。 As described in item 7 of the scope of patent application, the method for manufacturing a composite material structure applied to biological test strips, wherein the metal is aluminum, titanium, molybdenum, copper, nickel, tin or zinc; wherein the conductive polymer is poly Oxyethylthiophene, polypyrrole or polyaniline; wherein the conductive compound is a compound of at least one of tungsten, nitrogen, and carbon, or a combination thereof; wherein the thickness of the first conductive layer is between 1 nm and 5000 nm. 如申請專利範圍第6項所述的應用於生物試片的複合式材料結構的製作方法,其中,至少一第一導電層以及至少一該第二導電層的厚度介於1~5000nm。 As described in item 6 of the scope of patent application, the method for manufacturing a composite material structure applied to a biological test piece, wherein the thickness of at least one first conductive layer and at least one second conductive layer is between 1 nm and 5000 nm. 如申請專利範圍第6項所述的應用於生物試片的複合式材料結構的製作方法,其中,該導電單元以及該附著層為一無孔隙或者少孔隙的高緻密結構,該高緻密結構的緻密度大於90%;其中,該導電單元以及該附著層不需經過熱處理加工。 As described in item 6 of the scope of patent application, the method for manufacturing a composite material structure applied to a biological test piece, wherein the conductive unit and the adhesion layer are a high-density structure with no or few pores, and the high-density structure is The density is greater than 90%; wherein, the conductive unit and the adhesion layer do not need to be processed by heat treatment.
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CN102459690A (en) * 2009-04-24 2012-05-16 3M创新有限公司 Electrochemical biosensor electrode strip and method for manufacturing same
CN104204274A (en) * 2012-02-24 2014-12-10 梯尔镀层有限公司 Coatings with conductive and corrosion-resistant properties

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102459690A (en) * 2009-04-24 2012-05-16 3M创新有限公司 Electrochemical biosensor electrode strip and method for manufacturing same
CN104204274A (en) * 2012-02-24 2014-12-10 梯尔镀层有限公司 Coatings with conductive and corrosion-resistant properties
CN104204274B (en) 2012-02-24 2018-02-09 梯尔镀层有限公司 Coatings with conductive and corrosion-resistant properties

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