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TWI727165B - 矽晶圓的研磨方法 - Google Patents

矽晶圓的研磨方法 Download PDF

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Publication number
TWI727165B
TWI727165B TW107113771A TW107113771A TWI727165B TW I727165 B TWI727165 B TW I727165B TW 107113771 A TW107113771 A TW 107113771A TW 107113771 A TW107113771 A TW 107113771A TW I727165 B TWI727165 B TW I727165B
Authority
TW
Taiwan
Prior art keywords
polishing
slurry
silicon wafer
polishing pad
concentration
Prior art date
Application number
TW107113771A
Other languages
English (en)
Chinese (zh)
Other versions
TW201900333A (zh
Inventor
大關正彬
佐藤三千登
石井薰
Original Assignee
日商信越半導體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商信越半導體股份有限公司 filed Critical 日商信越半導體股份有限公司
Publication of TW201900333A publication Critical patent/TW201900333A/zh
Application granted granted Critical
Publication of TWI727165B publication Critical patent/TWI727165B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H10P52/00—

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW107113771A 2017-05-15 2018-04-24 矽晶圓的研磨方法 TWI727165B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017096563A JP6747376B2 (ja) 2017-05-15 2017-05-15 シリコンウエーハの研磨方法
JPJP2017-096563 2017-05-15

Publications (2)

Publication Number Publication Date
TW201900333A TW201900333A (zh) 2019-01-01
TWI727165B true TWI727165B (zh) 2021-05-11

Family

ID=64274094

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107113771A TWI727165B (zh) 2017-05-15 2018-04-24 矽晶圓的研磨方法

Country Status (3)

Country Link
JP (1) JP6747376B2 (ja)
TW (1) TWI727165B (ja)
WO (1) WO2018211903A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240125581A (ko) * 2021-12-21 2024-08-19 신에쯔 한도타이 가부시키가이샤 양면연마장치, 반도체 실리콘 웨이퍼의 양면연마방법, 양면연마 실리콘 웨이퍼 및 그의 제조방법
JP7435634B2 (ja) * 2021-12-21 2024-02-21 信越半導体株式会社 両面研磨装置、半導体シリコンウェーハの両面研磨方法及び両面研磨シリコンウェーハの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010076075A (ja) * 2008-09-29 2010-04-08 Fujibo Holdings Inc 研磨加工用の研磨パッドに用いられる研磨シートおよび研磨パッド
TW201438087A (zh) * 2013-03-19 2014-10-01 Siltronic Ag 半導體材料晶圓的拋光方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5254727B2 (ja) * 2008-09-29 2013-08-07 富士紡ホールディングス株式会社 研磨パッド
JP5413456B2 (ja) * 2009-04-20 2014-02-12 日立化成株式会社 半導体基板用研磨液及び半導体基板の研磨方法
JP6027346B2 (ja) * 2012-06-12 2016-11-16 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハの製造方法
JP6311183B2 (ja) * 2014-03-31 2018-04-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010076075A (ja) * 2008-09-29 2010-04-08 Fujibo Holdings Inc 研磨加工用の研磨パッドに用いられる研磨シートおよび研磨パッド
TW201438087A (zh) * 2013-03-19 2014-10-01 Siltronic Ag 半導體材料晶圓的拋光方法

Also Published As

Publication number Publication date
WO2018211903A1 (ja) 2018-11-22
TW201900333A (zh) 2019-01-01
JP2018195641A (ja) 2018-12-06
JP6747376B2 (ja) 2020-08-26

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