TWI726225B - Method for manufacturing biochips - Google Patents

Abstract

A method for manufacturing biochips includes: forming a conductive layer on at least one of a plurality of boards; removing parts of the conductive layer to form a conducting circuit; and connecting the boards to form a biochip.

Description

Biomedical chip manufacturing method

The present invention relates to a method for manufacturing a wafer, in particular to a method for manufacturing a biomedical wafer.

Biomedical chips have been widely used in sampling and screening, which can easily perform large-scale disease diagnosis and experiments such as high-yield screening and enzyme determination using a small number of samples. Biomedical wafers often require multiple complicated procedures to produce, such as photomask, chemical or optical etching, and cleaning. In addition to the complicated production process, there is also the problem of waste generation.

In view of this, the present invention provides a method for manufacturing a biomedical wafer, including: forming a conductive layer on at least one of a plurality of plates; removing a part of the conductive layer to form a conductive circuit; and the plates Join together to form the biomedical chip.

In some embodiments, the removing step is to remove a part of the conductive layer by plasma etching.

In some embodiments, the removing step further includes: thinning the conductive layer with a laser.

In some embodiments, the removing step uses a deep ultraviolet laser.

In some embodiments, the laser scribing step uses a deep ultraviolet laser.

In some embodiments, the at least one recess selectively spans the conductive layer and the board, or is located only in the conductive layer.

In some embodiments, the depression across the conductive layer and the plate is a flow channel.

In some embodiments, the conductive layer is formed by electroplating.

In some embodiments, in the laser scribing step, a plurality of positioning targets corresponding to the positions are formed on the plates, so that the plates are aligned according to the positioning targets in the bonding step.

According to the method for manufacturing a biomedical wafer according to an embodiment of the present invention, a laser is used to perform multiple processing, including the steps of scribing, removing, and bonding, which can provide a simple and fast processing process. In particular, the use of deep ultraviolet lasers for processing can prevent the plate from chipping or generating thermal effects and pollutants. In addition, with plasma etching, unnecessary conductive layer regions and clean bonding regions can be removed at the same time, which facilitates subsequent bonding steps.

Referring to FIG. 1, it is a schematic flowchart of a method for manufacturing a biomedical chip according to an embodiment of the present invention. First, a plurality of plates 100 are provided. Here, three plates 100a, 100b, and 100c are taken as an example. The material of the plate 100 may be the same or different, and the embodiment of the present invention is not particularly limited. In some embodiments, the material of the plate 100 is polydimethylsiloxane (PMDS).

In step S310, a conductive layer 200 is formed on at least one of the plurality of plates (here, the plate 100c is taken as an example). Here, the conductive layer 200 may be formed by electroplating.

In step S320, a laser scribing step is performed to form at least one recess 110 on at least one of the plates 100. Here, recesses 111 and 112 are formed on the plate 100a and the plate 100b, respectively. The recess 111 on the plate 100a is a circular perforation, but the embodiment of the present invention does not limit the shape of the recess 110. The depression 112 on the plate 100b forms a channel of a corresponding shape according to the required flow guide, and the shape here is only an example, and is not limited thereto. The channel includes a lead-in area 120 and two flow paths 121 and 122 drained from the lead-in area 120.

In some embodiments, the laser scribing step is implemented using a deep ultraviolet laser.

Here, although the laser scribing step is performed on the plates 100a, 100b where the conductive layer 200 is not formed as an example, the embodiment of the present invention is not limited to this. In some embodiments, a laser scribing step can still be applied to the board 100 with the conductive layer 200 to form a recess 110 on the board 100.

In step S330, a removal step is performed to remove a part of the conductive layer 200, so that the unremoved part forms a conductive circuit. Here, the unremoved part is to form the electrode 210, but the embodiment of the present invention is not limited to this. The conductive circuit can also include other circuits that need to be conductive, such as wires. Here, the removal step is to use laser removal. In some embodiments, the removal step uses a deep ultraviolet laser.

In some embodiments, the removing step is to remove part of the conductive layer 200 area by plasma etching. In some embodiments, before the plasma etching, the conductive layer 200 may be thinned in advance by laser, which can reduce the plasma etching depth and speed up the process. In addition to removing a part of the conductive layer 200, the plasma etching can also clean the bonding area between the plates 100, and perform pretreatment before the subsequent bonding step.

Refer to FIG. 2, which is a schematic diagram of a biomedical chip according to an embodiment of the present invention. For the previously processed plates 100a, 100b, and 100c, a joining step is performed to join the plates 100a, 100b, and 100c together to form a biomedical wafer 400. The joining method can use laser welding technology. In some embodiments, the laser welding technology is implemented by using deep ultraviolet lasers. Here, a plurality of bonding areas may be provided at corresponding positions between the plates 100, so that after the plates 100 are stacked, the aforementioned bonding steps are performed for these bonding areas.

In some embodiments, the joining method can also be achieved by techniques such as bonding, welding, and welding.

In some embodiments, in the aforementioned laser scribing step, a plurality of positioning targets can also be laser scribed on the plates 100 to facilitate the alignment of the plates 100 in the joining step. The alignment uses a camera to perform visual alignment, so the position of the plate 100 can be adjusted in conjunction with a robotic arm or a motion platform.

In some embodiments, the aforementioned plate 100b can be omitted, and a conductive layer 200 is formed on the plate 100c, and the recess 112 as shown in FIG. 1 is laser scribed, and a part of the conductive layer 200 is removed to form the electrode 210 . Finally, the plate 100a and the plate 100c are joined. In other words, the recess 110 may selectively traverse the conductive layer 200 and the board 100, or only be located in the conductive layer 200. In this example, the recess 100 across the conductive layer 200 and the plate 100 forms a flow channel, and the recess 100 located only in the conductive layer 200 is the part where the conductive layer 200 is removed.

According to the method for manufacturing a biomedical wafer according to an embodiment of the present invention, a laser is used to perform multiple processing, including the steps of scribing, removing, and bonding, which can provide a simple and fast processing process. In particular, the use of deep ultraviolet lasers for processing can prevent the plate 100 from breaking or generating thermal effects and pollutants. In addition, with plasma etching, the unnecessary conductive layer 200 area and the clean bonding area can be removed at the same time, which is beneficial to the subsequent bonding step.

100, 100a, 100b, 100c‧‧‧plate 110、111、112‧‧‧Concavity 120‧‧‧Introduction area 121、122‧‧‧Flow path 200‧‧‧Conductive layer 210‧‧‧electrode S310, S320, 330‧‧‧Step 400‧‧‧Biomedical Chip 410‧‧‧Blood hole

[Figure 1] is a schematic flow diagram of a method for manufacturing a biomedical chip according to an embodiment of the present invention. [Figure 2] is a schematic diagram of a biomedical chip according to an embodiment of the present invention.

100, 100a, 100b, 100c‧‧‧plate

110、111、112‧‧‧Concavity

120‧‧‧Introduction area

121、122‧‧‧Flow path

200‧‧‧Conductive layer

210‧‧‧electrode

S310, S320, 330‧‧‧Step

Claims (5)

A method for manufacturing a biomedical wafer includes: forming a conductive layer on at least one of a plurality of plates; performing a laser scribing step to form at least one recess on at least one of the plates, and Forming a plurality of positioning targets corresponding to the positions on the plates; performing a removal step, thinning the conductive layer with a laser, and then removing part of the conductive layer by plasma etching to form a conductive circuit; and A joining step is performed, the plates are aligned according to the positioning targets, and the plates are joined together by a deep ultraviolet laser to form the biomedical chip. The method for manufacturing a biomedical wafer according to claim 1, wherein the laser scribing step uses a deep ultraviolet laser. The method for manufacturing a biomedical wafer according to claim 1, wherein the at least one recess selectively spans the conductive layer and the board, or is located only on the conductive layer. The method for manufacturing a biomedical wafer according to claim 3, wherein the recess across the conductive layer and the plate is a flow path. The method for manufacturing a biomedical wafer according to claim 1, wherein the conductive layer is formed by electroplating.

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