TWI723985B - Layered body - Google Patents
Layered body Download PDFInfo
- Publication number
- TWI723985B TWI723985B TW105110405A TW105110405A TWI723985B TW I723985 B TWI723985 B TW I723985B TW 105110405 A TW105110405 A TW 105110405A TW 105110405 A TW105110405 A TW 105110405A TW I723985 B TWI723985 B TW I723985B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- front panel
- resin
- adhesive sheet
- laminate
- Prior art date
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- 229920005989 resin Polymers 0.000 claims abstract description 88
- 239000011347 resin Substances 0.000 claims abstract description 88
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 76
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 76
- 239000000853 adhesive Substances 0.000 claims abstract description 70
- 230000001070 adhesive effect Effects 0.000 claims abstract description 70
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 28
- 239000000178 monomer Substances 0.000 claims description 95
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 54
- 229920000178 Acrylic resin Polymers 0.000 claims description 52
- 239000004925 Acrylic resin Substances 0.000 claims description 52
- 239000000463 material Substances 0.000 claims description 39
- 229920001577 copolymer Polymers 0.000 claims description 33
- 150000001875 compounds Chemical class 0.000 claims description 27
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 16
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical group COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 14
- 229920002554 vinyl polymer Polymers 0.000 claims description 14
- 125000003118 aryl group Chemical group 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 11
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 10
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 7
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 7
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 7
- 230000000284 resting effect Effects 0.000 claims description 5
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 3
- 229920006243 acrylic copolymer Polymers 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 266
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 6
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- 230000001678 irradiating effect Effects 0.000 description 5
- 229960002479 isosorbide Drugs 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 238000005809 transesterification reaction Methods 0.000 description 5
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 4
- KLDXJTOLSGUMSJ-JGWLITMVSA-N Isosorbide Chemical compound O[C@@H]1CO[C@@H]2[C@@H](O)CO[C@@H]21 KLDXJTOLSGUMSJ-JGWLITMVSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 4
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- 238000005481 NMR spectroscopy Methods 0.000 description 3
- 125000005250 alkyl acrylate group Chemical group 0.000 description 3
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- 150000004650 carbonic acid diesters Chemical class 0.000 description 3
- 239000007809 chemical reaction catalyst Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 230000005764 inhibitory process Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000005361 soda-lime glass Substances 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- KLDXJTOLSGUMSJ-UNTFVMJOSA-N (3s,3ar,6s,6ar)-2,3,3a,5,6,6a-hexahydrofuro[3,2-b]furan-3,6-diol Chemical compound O[C@H]1CO[C@@H]2[C@@H](O)CO[C@@H]21 KLDXJTOLSGUMSJ-UNTFVMJOSA-N 0.000 description 2
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- 239000004594 Masterbatch (MB) Substances 0.000 description 2
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 2
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000004103 aminoalkyl group Chemical group 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
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- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 2
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- 239000003086 colorant Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- VEIOBOXBGYWJIT-UHFFFAOYSA-N cyclohexane;methanol Chemical compound OC.OC.C1CCCCC1 VEIOBOXBGYWJIT-UHFFFAOYSA-N 0.000 description 2
- 238000006356 dehydrogenation reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
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- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000005340 laminated glass Substances 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical group N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
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- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical class C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
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- GPFJHNSSBHPYJK-UHFFFAOYSA-N (3-methylphenyl) hydrogen carbonate Chemical compound CC1=CC=CC(OC(O)=O)=C1 GPFJHNSSBHPYJK-UHFFFAOYSA-N 0.000 description 1
- 229920003122 (meth)acrylate-based copolymer Polymers 0.000 description 1
- JAKQQNJMLCVDDC-UHFFFAOYSA-N 1,1'-biphenyl;carbonic acid Chemical compound OC(O)=O.C1=CC=CC=C1C1=CC=CC=C1.C1=CC=CC=C1C1=CC=CC=C1 JAKQQNJMLCVDDC-UHFFFAOYSA-N 0.000 description 1
- OWEYKIWAZBBXJK-UHFFFAOYSA-N 1,1-Dichloro-2,2-bis(4-hydroxyphenyl)ethylene Chemical compound C1=CC(O)=CC=C1C(=C(Cl)Cl)C1=CC=C(O)C=C1 OWEYKIWAZBBXJK-UHFFFAOYSA-N 0.000 description 1
- VYKNVAHOUNIVTQ-UHFFFAOYSA-N 1,2,2,3,3-pentamethylpiperidine Chemical compound CN1CCCC(C)(C)C1(C)C VYKNVAHOUNIVTQ-UHFFFAOYSA-N 0.000 description 1
- YAXWOADCWUUUNX-UHFFFAOYSA-N 1,2,2,3-tetramethylpiperidine Chemical compound CC1CCCN(C)C1(C)C YAXWOADCWUUUNX-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 1
- SXTILEHINBCKSS-UHFFFAOYSA-N 1-chloro-3-phenylpyrrole-2,5-dione Chemical compound O=C1N(Cl)C(=O)C=C1C1=CC=CC=C1 SXTILEHINBCKSS-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- OEVVKKAVYQFQNV-UHFFFAOYSA-N 1-ethenyl-2,4-dimethylbenzene Chemical compound CC1=CC=C(C=C)C(C)=C1 OEVVKKAVYQFQNV-UHFFFAOYSA-N 0.000 description 1
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 1
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 1
- IYBPIDAYDPNCTP-UHFFFAOYSA-N 1-methyl-3-phenylpyrrole-2,5-dione Chemical compound O=C1N(C)C(=O)C=C1C1=CC=CC=C1 IYBPIDAYDPNCTP-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical group O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-Tetramethylpiperidine Substances CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 1
- GVJRTUUUJYMTNQ-UHFFFAOYSA-N 2-(2,5-dioxofuran-3-yl)acetic acid Chemical compound OC(=O)CC1=CC(=O)OC1=O GVJRTUUUJYMTNQ-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- ZWVHTXAYIKBMEE-UHFFFAOYSA-N 2-hydroxyacetophenone Chemical class OCC(=O)C1=CC=CC=C1 ZWVHTXAYIKBMEE-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- LWZNQGJGMBRAII-UHFFFAOYSA-N 2-methylhexyl prop-2-enoate Chemical compound CCCCC(C)COC(=O)C=C LWZNQGJGMBRAII-UHFFFAOYSA-N 0.000 description 1
- JWUJQDFVADABEY-UHFFFAOYSA-N 2-methyltetrahydrofuran Chemical compound CC1CCCO1 JWUJQDFVADABEY-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- TXFPEBPIARQUIG-UHFFFAOYSA-N 4'-hydroxyacetophenone Chemical compound CC(=O)C1=CC=C(O)C=C1 TXFPEBPIARQUIG-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- ORJNLUXHBUSOKL-UHFFFAOYSA-N 6,7-dihydrodibenzo[2,1-b:1',2'-d][7]annulen-5-one Chemical compound O=C1CCC2=CC=CC=C2C2=CC=CC=C12 ORJNLUXHBUSOKL-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- PGDIJTMOHORACQ-UHFFFAOYSA-N 9-prop-2-enoyloxynonyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCOC(=O)C=C PGDIJTMOHORACQ-UHFFFAOYSA-N 0.000 description 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920005497 Acrypet® Polymers 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Laminated Bodies (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Adhesive Tapes (AREA)
Abstract
本發明係關於一種具備包括聚碳酸酯系樹脂層及與該聚碳酸酯系樹脂不同之熱塑性樹脂之前面板、及黏著片材之積層體,提供一種高溫高濕之環境下之形狀穩定性優異之新穎之積層體。 The present invention relates to a laminate including a polycarbonate resin layer, a front panel of a thermoplastic resin different from the polycarbonate resin, and an adhesive sheet, and provides an excellent shape stability in a high temperature and high humidity environment Novel laminated body.
本發明提出一種積層體,其特徵在於:其係包括前面板、及黏著片材者,且上述前面板具備以聚碳酸酯系樹脂為主成分樹脂之B層、及以與該聚碳酸酯系樹脂不同之熱塑性樹脂為主成分之A層,A層之合計厚度為10μm~250μm,上述A層1層之厚度(A)相對於上述A層及上述B層之合計厚度(T)之比((A)/(T))為0.05~0.40,將前面板與黏著片材之積層體於溫度85℃、濕度85%RH之環境下暴露120小時之情形時的前面板與黏著片材之內部應力(σ)為0.47MPa以下。 The present invention proposes a laminated body characterized in that it includes a front panel and an adhesive sheet, and the front panel includes a layer B containing polycarbonate resin as the main component resin, and the polycarbonate resin A layer of thermoplastic resin with different resin as the main component, the total thickness of the A layer is 10μm~250μm, the ratio of the thickness (A) of the above layer A to the total thickness (T) of the above layer A and the above layer B ( (A)/(T)) is 0.05~0.40. When the laminate of the front panel and the adhesive sheet is exposed for 120 hours in an environment with a temperature of 85°C and a humidity of 85%RH, the inside of the front panel and the adhesive sheet The stress (σ) is 0.47 MPa or less.
Description
本發明係關於一種積層體。詳細而言,關於一種可用作基板材料或保護材料、例如可較佳地用作圖像顯示裝置之表面保護面板、或行動電話、智慧型手機、平板裝置、可佩戴式終端等之外殼材料之積層體。 The present invention relates to a laminated body. In detail, regarding a material that can be used as a substrate material or a protective material, for example, it can be preferably used as a surface protection panel of an image display device, or a housing material for mobile phones, smart phones, tablet devices, wearable terminals, etc. The multi-layered body.
自先前開始,作為圖像顯示裝置之外殼材料,主要使用玻璃。但是,玻璃容易因衝擊而破裂,且較重,故而,對利用樹脂材料代替玻璃進行有研究。 Since the beginning, glass has been mainly used as the housing material of image display devices. However, glass is easily broken by impact and is heavy. Therefore, research has been conducted on the use of resin materials instead of glass.
對於此種作為玻璃替代材料之樹脂材料,主要要求耐衝擊性、表面硬度、以及高溫高濕環境下之形狀穩定性。 For this kind of resin material as a glass substitute material, impact resistance, surface hardness, and shape stability under high temperature and high humidity environment are mainly required.
聚碳酸酯樹脂板具有透明性,且耐衝擊性或耐熱性優異,故而被用於隔音間隔壁或車棚、看板、反光材料、照明器具等。但是,由於表面硬度較低,故而存在容易損傷之缺點。 Polycarbonate resin plates have transparency and are excellent in impact resistance or heat resistance, so they are used for soundproof partitions or carports, signage, reflective materials, lighting fixtures, and the like. However, due to the low surface hardness, it has the disadvantage of being easily damaged.
為了改良該缺點,例如專利文獻1中,揭示有對共擠出聚碳酸酯樹脂與丙烯酸系樹脂而成之積層體實施硬塗處理而成之樹脂積層體。 In order to improve this disadvantage, for example, Patent Document 1 discloses a resin laminate obtained by subjecting a laminate formed by co-extruding a polycarbonate resin and an acrylic resin to a hard coating process.
又,作為抑制聚碳酸酯樹脂板之翹曲之方法,例如專利文獻2中,揭示有於聚碳酸酯樹脂上積層甲基丙烯酸甲酯-苯乙烯共聚物樹脂(MS樹脂)而成之樹脂積層體。 In addition, as a method of suppressing the warpage of a polycarbonate resin sheet, for example, Patent Document 2 discloses a resin laminate in which a methyl methacrylate-styrene copolymer resin (MS resin) is laminated on a polycarbonate resin. body.
同樣地,作為抑制聚碳酸酯樹脂板之翹曲之方法,專利文獻3中,揭示有積層聚碳酸酯系樹脂而成之規定了各層之玻璃轉移溫度差 與吸水率差之樹脂積層體。 Similarly, as a method of suppressing the warpage of the polycarbonate resin sheet, Patent Document 3 discloses a laminated polycarbonate resin that defines the glass transition temperature difference of each layer A resin laminate with poor water absorption.
[專利文獻1]日本專利特開2006-103169號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2006-103169
[專利文獻2]日本專利特開2010-167659號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2010-167659
[專利文獻3]WO2014/061817 [Patent Document 3] WO2014/061817
如上所述,具備聚碳酸酯系樹脂層及包含與該聚碳酸酯系樹脂不同之熱塑性樹脂之層之前面板例如藉由介隔黏著片材積層於基材等而用作圖像顯示裝置之表面保護面板或外殼材料。但是,該構成之前面板中,聚碳酸酯系樹脂與和該聚碳酸酯系樹脂不同之熱塑性樹脂之熱膨脹係數或吸濕性等不同,故而存在如下問題:若被置於例如高溫高濕環境下,則一樹脂層會吸濕而令尺寸發生變化等,難以維持前面板之形狀穩定性。 As described above, the front panel is provided with a polycarbonate resin layer and a layer containing a thermoplastic resin different from the polycarbonate resin, for example, by laminating an adhesive sheet on a substrate, etc., and is used as a surface protection for an image display device. Panel or housing material. However, in the front panel of this configuration, the thermal expansion coefficient or hygroscopicity of the polycarbonate resin is different from that of the thermoplastic resin that is different from the polycarbonate resin. Therefore, there are problems as follows: , A resin layer will absorb moisture and cause dimensional changes, etc., and it is difficult to maintain the shape stability of the front panel.
因此,本發明係關於一種具備包括聚碳酸酯系樹脂層及與該聚碳酸酯系樹脂不同之熱塑性樹脂層之前面板、及黏著片材之積層體,且欲提供一種高溫高濕之環境下之形狀穩定性優異之新穎之積層體。 Therefore, the present invention relates to a laminate having a front panel including a polycarbonate resin layer and a thermoplastic resin layer different from the polycarbonate resin, and an adhesive sheet, and it is intended to provide a high-temperature and high-humidity environment. A novel laminate with excellent shape stability.
本發明提出一種積層體,其特徵在於:其係包括前面板、及黏著片材者,且上述前面板具備以聚碳酸酯系樹脂為主成分之B層、及以與上述聚碳酸酯系樹脂不同之熱塑性樹脂為主成分之熱塑性樹脂A層,A層之合計厚度為10~250μm,上述A層1層之厚度(A)相對於上述A層及上述B層之合計厚度(T)之比((A)/(T))為0.05~0.40,利用下述式(1)及式(2)所求出之將上述積層體於溫度85℃、濕度85%RH之環境下暴露120小時之情形時的前面板與黏著片材之內部應力(σ)為0.47 MPa以下。 The present invention proposes a laminate characterized in that it includes a front panel and an adhesive sheet, and the front panel includes a layer B containing polycarbonate resin as the main component, and is combined with the polycarbonate resin A layer of thermoplastic resin with a different thermoplastic resin as the main component, the total thickness of the A layer is 10~250μm, the ratio of the thickness (A) of the above A layer to the total thickness (T) of the above A layer and the above B layer ((A)/(T)) is 0.05~0.40, using the following formula (1) and formula (2) to obtain the above-mentioned laminated body exposed to a temperature of 85 ℃, humidity 85% RH environment for 120 hours In this case, the internal stress (σ) of the front panel and the adhesive sheet is 0.47 Below MPa.
本發明所提出之積層體中,前面板之構成中,規定了以與聚碳酸酯系樹脂不同之熱塑性樹脂為主成分之熱塑性樹脂A層之合計厚度、及A層1層之厚度相對於A層及上述B層之合計層厚之比率((A)/(T)),並且將內部應力(σ)規定於特定範圍內,藉此可發揮高溫高濕之環境下之形狀穩定性優異之性能。 In the laminate proposed by the present invention, in the structure of the front panel, the total thickness of the A layer of the thermoplastic resin mainly composed of a thermoplastic resin different from the polycarbonate resin, and the thickness of the layer A relative to the thickness of the A layer are specified. The ratio ((A)/(T)) of the total layer thickness of the layer and the above-mentioned B layer, and the internal stress (σ) is specified in a specific range, which can exert excellent shape stability in a high temperature and high humidity environment performance.
因此,本發明所提出之積層體例如可貼合於基材等而較佳地用作各種基板材料或保護材料等。除作為例如行動電話終端、智慧型手機、攜帶型電子遊戲設備、攜帶型資訊終端、平板裝置、移動式個人電腦、可佩戴式終端等攜帶型顯示裝置之構成材料之各種基板材料或保護材料以外,還可較佳地用作作為液晶電視、液晶顯示器、桌上型個人電腦、汽車導航、汽車儀錶等設置型顯示裝置之構成材料之各種基板材料或保護材料。 Therefore, the laminate proposed by the present invention can be bonded to a base material, for example, and is preferably used as various substrate materials, protective materials, and the like. In addition to various substrate materials or protective materials that are used as constituent materials of portable display devices such as mobile phone terminals, smart phones, portable electronic game equipment, portable information terminals, tablet devices, mobile personal computers, wearable terminals, etc. It can also be preferably used as various substrate materials or protective materials as constituent materials of set-up display devices such as liquid crystal televisions, liquid crystal displays, desktop personal computers, car navigation, car meters, etc.
δ‧‧‧前面板端面自靜置面之隆起高度 δ‧‧‧The bulge height of the end surface of the front panel from the resting surface
L‧‧‧樣品長度 L‧‧‧Sample length
ρ‧‧‧前面板翹曲形狀之曲率半徑 ρ‧‧‧The curvature radius of the front panel warping shape
θ‧‧‧自前面板翹曲形狀之曲率中心落至前面板之接地點 之垂線與連結前面板翹曲形狀之曲率中心與前面板之端點之直線所成之角度 θ‧‧‧From the center of curvature of the warped shape of the front panel to the grounding point of the front panel The angle between the vertical line and the straight line connecting the center of curvature of the front panel's warped shape and the end point of the front panel
10‧‧‧前面板 10‧‧‧Front Panel
20‧‧‧黏著片材 20‧‧‧Adhesive sheet
圖1係用以算出內部應力之模型之模式圖。 Figure 1 is a schematic diagram of the model used to calculate the internal stress.
以下,詳細地對本發明之實施形態之一例進行說明。 Hereinafter, an example of the embodiment of the present invention will be described in detail.
本說明書中,所謂“關於各層之「主成分」”,意指形成各層之樹脂組合物中含有比例(質量%)最高之樹脂成分。並非規定其具體含量,但作為標準,係占形成各層之樹脂組合物中所含之樹脂之50質量%以上、尤其是80質量%以上、更尤其是90質量%以上(包括100質量%)之樹脂。再者,於主成分為2種以上之情形時,其等之合計量相當於上述含量。 In this specification, the "main component" of each layer refers to the resin component with the highest proportion (mass%) in the resin composition forming each layer. The specific content is not specified, but as a standard, it accounts for the amount of the resin composition that forms each layer. 50% by mass or more of the resin contained in the resin composition, especially 80% by mass or more, and more particularly 90% by mass or more (including 100% by mass) resin. In addition, when the main component is more than two kinds , The total amount of them is equivalent to the above content.
又,所謂“關於聚合物及其衍生物之「主成分」”,意指構成聚合物及其衍生物之單體單元中比例最高之單體。 In addition, the so-called ""principal component" of the polymer and its derivatives" means the monomer with the highest proportion among the monomer units constituting the polymer and its derivatives.
本發明之實施形態之一例之積層體(以下,稱作「本積層體」)係包括前面板與黏著片材者,且如下所述,其特徵在於:於特定之暴露試驗中,前面板與黏著片材之內部應力為特定範圍。 The laminated body (hereinafter referred to as "this laminated body") of an example of the embodiment of the present invention includes a front panel and an adhesive sheet, and as described below, is characterized in that: in a specific exposure test, the front panel and The internal stress of the adhesive sheet is within a specific range.
本積層體之前面板只要具備以聚碳酸酯系樹脂為主成分之B層、及以與該聚碳酸酯系樹脂不同之熱塑性樹脂為主成分之熱塑性樹脂A層即可。作為一例,可列舉具備以丙烯酸系樹脂為主成分樹脂之A層、及以聚碳酸酯系樹脂為主成分樹脂之B層者。 The front panel of the laminated body only needs to have a layer B containing a polycarbonate resin as a main component and a layer A thermoplastic resin containing a thermoplastic resin different from the polycarbonate resin as a main component. As an example, a layer A having an acrylic resin as a main component resin and a layer B having a polycarbonate resin as a main component resin can be cited.
又,例如可列舉於B層之單面側或兩面側形成A層而成之構成之前面板。 In addition, for example, a front panel in which the A layer is formed on one side or both sides of the B layer is exemplified.
此處,該前面板較佳為具有透明性、剛性、耐衝擊性或二次加工性及高表面硬度等特性。 Here, the front panel preferably has characteristics such as transparency, rigidity, impact resistance or secondary workability, and high surface hardness.
A層係以與上述聚碳酸酯系樹脂不同之熱塑性樹脂為主成分之層。 The A layer is a layer mainly composed of a thermoplastic resin different from the above-mentioned polycarbonate resin.
此處,所謂「不同」,意指構成聚合物之單體之種類或組成比不同之情形。 Here, the term "different" means that the types or composition ratios of the monomers constituting the polymer are different.
作為A層之主成分之熱塑性樹脂只要為與下述之成為B層之主成分之聚碳酸酯系樹脂不同者,則無特別限制,例如可列舉:以聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚對苯二甲酸丙二酯、聚對苯二甲酸丁二酯、聚對苯二甲酸-1,4-環己二甲酯等芳香族聚酯、及聚乳酸系聚合物等脂肪族聚酯為代表之聚酯系樹脂、聚乙烯、聚丙烯、環烯烴系樹脂等聚烯烴系樹脂、聚碳酸酯樹脂、丙烯酸系樹脂、聚苯乙烯系樹脂、聚醯胺系樹脂、聚醚系樹脂、聚胺基甲酸酯系樹脂、聚苯硫醚系樹脂、聚酯醯胺系樹脂、聚醚酯系樹脂、氯乙烯系樹脂、丙烯腈 -苯乙烯共聚物、丙烯腈-丁二烯-苯乙烯共聚物、改性聚苯醚系樹脂、聚芳酯系樹脂、聚碸系樹脂、聚醚醯亞胺系樹脂、聚醯胺醯亞胺系樹脂、聚醯亞胺系樹脂及以該等為主要成分之共聚物、或該等樹脂之混合物等。該等可為1種或2種以上之混合物。 The thermoplastic resin that is the main component of the A layer is not particularly limited as long as it is different from the polycarbonate resin that is the main component of the B layer described below. For example, it can be exemplified by polyethylene terephthalate, poly(ethylene terephthalate) and polycarbonate resin. Aromatic polyesters such as ethylene naphthalate, polytrimethylene terephthalate, polybutylene terephthalate, poly-1,4-cyclohexane dimethyl terephthalate, and polylactic acid series Polyester resins represented by aliphatic polyesters such as polymers, polyolefin resins such as polyethylene, polypropylene, cycloolefin resins, polycarbonate resins, acrylic resins, polystyrene resins, and polyamide resins Resin, polyether resin, polyurethane resin, polyphenylene sulfide resin, polyester amide resin, polyether ester resin, vinyl chloride resin, acrylonitrile -Styrenic copolymer, acrylonitrile-butadiene-styrene copolymer, modified polyphenylene ether resin, polyarylate resin, polysulfide resin, polyetherimide resin, polyamide resin Amine resins, polyimide resins and copolymers with these as main components, or mixtures of these resins, etc. These may be one kind or a mixture of two or more kinds.
又,作為用作A層之主成分之上述聚碳酸酯樹脂,只要為與下述之成為B層之主成分之聚碳酸酯系樹脂不同者即可,例如可列舉脂肪族聚碳酸酯或脂環族聚碳酸酯、含有雙酚C之芳香族聚碳酸酯等。 In addition, as the above-mentioned polycarbonate resin used as the main component of the A layer, it is sufficient if it is different from the polycarbonate resin used as the main component of the B layer described below. For example, aliphatic polycarbonate or grease may be mentioned. Cyclic polycarbonate, aromatic polycarbonate containing bisphenol C, etc.
此處,於本發明中並無特別限定,但於例如將A層設為表面層之情形時,較佳為選定硬度高於B層之樹脂。具體而言,可使用下述之丙烯酸系樹脂(a1)、或具有特定之結構之聚碳酸酯樹脂(a3)。 Here, in the present invention, it is not particularly limited, but when the A layer is used as a surface layer, for example, it is preferable to select a resin having a hardness higher than that of the B layer. Specifically, the following acrylic resin (a1) or polycarbonate resin (a3) having a specific structure can be used.
作為A層之較佳之一例,可列舉以丙烯酸系樹脂(a1)為主成分樹脂之層。較佳為,A層係含有丙烯酸系樹脂(a1)、及具有芳香族乙烯基單體單元、(甲基)丙烯酸酯單體單元及不飽和二羧酸酐單體單元之共聚物(a2)之層。 As a preferable example of the A layer, a layer containing an acrylic resin (a1) as a main component resin can be cited. Preferably, layer A contains acrylic resin (a1), and a copolymer (a2) having aromatic vinyl monomer units, (meth)acrylate monomer units, and unsaturated dicarboxylic anhydride monomer units Floor.
又,作為A層之較佳之另一例,亦可列舉以於結構之一部分中包含來自二羥基化合物之結構單元之聚碳酸酯樹脂(a3)為主成分樹脂之層。 In addition, as another preferable example of the A layer, a layer containing a polycarbonate resin (a3) derived from a dihydroxy compound-derived structural unit in a part of the structure as a main component resin can also be cited.
繼而,對該等各成分樹脂(a1)~(a3)進行說明。 Next, these component resins (a1) to (a3) will be described.
(丙烯酸系樹脂(a1)) (Acrylic resin (a1))
丙烯酸系樹脂(a1)係以(甲基)丙烯酸酯單體單元為主成分進行聚合而成之(共)聚合物及其衍生物。 The acrylic resin (a1) is a (co)polymer and its derivatives obtained by polymerizing (meth)acrylate monomer units as the main component.
此處,所謂「(甲基)丙烯酸酯單體單元」,意為包含丙烯酸酯單體單元或甲基丙烯酸酯單體單元。 Here, the "(meth)acrylate monomer unit" means that it contains an acrylate monomer unit or a methacrylate monomer unit.
作為上述(甲基)丙烯酸酯單體單元,例如可列舉:甲基丙烯酸甲酯、甲基丙烯酸、丙烯酸、(甲基)丙烯酸苄酯、(甲基)丙烯酸正丁 酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸2-甲氧基乙酯、(甲基)丙烯酸2-乙氧基乙酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異基酯、(甲基)丙烯酸降基酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸二環戊烯基氧基乙酯、(甲基)丙烯酸四氫呋喃甲酯、丙烯醯基(甲基)丙烯酸酯、(甲基)丙烯酸2-羥基乙酯、琥珀酸2-(甲基)丙烯醯氧基乙酯、馬來酸2-(甲基)丙烯醯氧基乙酯、鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、六氫鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、(甲基)丙烯酸五甲基哌啶酯、(甲基)丙烯酸四甲基哌啶酯、(甲基)丙烯酸二甲胺基乙酯、(甲基)丙烯酸二乙胺基乙酯等。該等可僅單獨使用1種或組合2種以上而使用。又,作為可與該等丙烯酸系單體單元聚合之其他單體單元,例如可列舉烯烴系單體單元、乙烯系單體單元等。 Examples of the (meth)acrylate monomer unit include methyl methacrylate, methacrylic acid, acrylic acid, benzyl (meth)acrylate, n-butyl (meth)acrylate, and (meth)acrylic acid. Isobutyl ester, tertiary butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate, (meth)acrylic acid Stearyl ester, glycidyl (meth)acrylate, hydroxypropyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, (meth)acrylate Base) cyclohexyl acrylate, (meth) acrylate iso Base ester, (meth)acrylic acid Base ester, dicyclopentenyl (meth)acrylate, dicyclopentyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, methyl tetrahydrofuran (meth)acrylate, acrylic acid Base (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-(meth)acryloxyethyl succinate, 2-(meth)acryloxyethyl maleate, 2-(meth)acryloyloxyethyl phthalate, 2-(meth)acryloyloxyethyl hexahydrophthalate, pentamethylpiperidine (meth)acrylate, (meth) Yl)tetramethylpiperidine acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, and the like. These can be used individually by 1 type or in combination of 2 or more types. In addition, examples of other monomer units that can be polymerized with these acrylic monomer units include olefin-based monomer units and vinyl-based monomer units.
其中,就降低內部應力之觀點而言,丙烯酸系樹脂(a1)可較佳地使用甲基丙烯酸甲酯單體與甲基丙烯酸單體、丙烯酸單體、馬來酸酐單體、芳香族乙烯基單體、丙烯腈單體中之任一種以上之共聚物。 Among them, from the viewpoint of reducing internal stress, the acrylic resin (a1) can preferably use methyl methacrylate monomers, methacrylic acid monomers, acrylic acid monomers, maleic anhydride monomers, and aromatic vinyl monomers. A copolymer of any one or more of monomers and acrylonitrile monomers.
對於丙烯酸系樹脂(a1)之立體規則性並無特別限制。但是,(甲基)丙烯酸酯單體單元之立體結構係對排結構之比例越高,玻璃轉移溫度越高,耐熱性越高,故而較佳。就該觀點而言,可較佳地使用具有三元組分率之mm、mr及rr中該rr之莫耳比率最高之立體結構者。該三元組分率可使用核磁共振測定裝置(1H-NMR)藉由公知之方法進行測定。 There is no particular restriction on the stereoregularity of the acrylic resin (a1). However, the higher the ratio of the three-dimensional structure of the (meth)acrylate monomer unit to the row structure, the higher the glass transition temperature and the higher the heat resistance, so it is preferable. From this viewpoint, the three-dimensional structure having the highest molar ratio of rr among the ternary component ratios of mm, mr, and rr can be preferably used. The ternary component ratio can be measured by a known method using a nuclear magnetic resonance measuring device (1H-NMR).
(共聚物(a2)) (Copolymer (a2))
如上所述,A層較佳為含有上述丙烯酸系樹脂(a1)與共聚物(a2)之層。其中,較佳為將丙烯酸系樹脂(a1)與共聚物(a2)混合而形成A 層。 As described above, the A layer is preferably a layer containing the above-mentioned acrylic resin (a1) and the copolymer (a2). Among them, it is preferable to mix the acrylic resin (a1) and the copolymer (a2) to form A Floor.
共聚物(a2)係具有芳香族乙烯基單體單元、(甲基)丙烯酸酯單體單元、及不飽和二羧酸酐單體單元之共聚物。 The copolymer (a2) is a copolymer having an aromatic vinyl monomer unit, a (meth)acrylate monomer unit, and an unsaturated dicarboxylic anhydride monomer unit.
作為上述「芳香族乙烯基單體單元」,例如可列舉來自苯乙烯、鄰甲基苯乙烯、間甲基苯乙烯、對甲基苯乙烯、2,4-二甲基苯乙烯、乙基苯乙烯、對第三丁基苯乙烯、α-甲基苯乙烯、α-甲基-對甲基苯乙烯等各苯乙烯系單體之單元。該等芳香族乙烯基單體單元可僅單獨使用1種或組合2種以上而使用。 Examples of the above-mentioned "aromatic vinyl monomer unit" include those derived from styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, 2,4-dimethylstyrene, and ethylbenzene. Units of styrene monomers such as ethylene, p-tert-butylstyrene, α-methylstyrene, and α-methyl-p-methylstyrene. These aromatic vinyl monomer units can be used individually by 1 type or in combination of 2 or more types.
其中,較佳為苯乙烯單元或α-甲基苯乙烯單元。苯乙烯單體單元由於工業上容易獲取,且經濟性優異,故而較佳,α-甲基苯乙烯單體單元由於可提高玻璃轉移溫度,故而較佳。 Among them, styrene units or α-methylstyrene units are preferred. The styrene monomer unit is preferred because it is easy to obtain industrially and has excellent economic efficiency, and the α-methylstyrene monomer unit is preferred because it can increase the glass transition temperature.
作為上述「(甲基)丙烯酸酯單體單元」,例如可列舉來自甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丁酯、甲基丙烯酸2-乙基己酯、甲基丙烯酸二環戊酯、甲基丙烯酸異基酯等各甲基丙烯酸酯單體、及丙烯酸甲酯、丙烯酸乙酯、丙烯酸正丁酯、丙烯酸2-甲基己酯、丙烯酸2-乙基己酯、丙烯酸癸酯等丙烯酸酯單體之單元。該等(甲基)丙烯酸酯單體單元可僅單獨使用1種或組合2種以上而使用。 Examples of the above-mentioned "(meth)acrylate monomer unit" include those derived from methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, 2-ethylhexyl methacrylate, and methacrylic acid. Dicyclopentyl ester, methacrylic acid iso Of methacrylate monomers such as methyl acrylate, ethyl acrylate, n-butyl acrylate, 2-methylhexyl acrylate, 2-ethylhexyl acrylate, decyl acrylate and other acrylate monomers unit. These (meth)acrylate monomer units can be used individually by 1 type or in combination of 2 or more types.
其中,就與丙烯酸系樹脂(a1)之相容性或外觀等方面而言,較佳為甲基丙烯酸甲酯單體單元。 Among them, in terms of compatibility with the acrylic resin (a1), appearance, and the like, a methyl methacrylate monomer unit is preferred.
作為上述「不飽和二羧酸酐單體單元」,例如可列舉來自馬來酸酐、伊康酸酐、檸康酸酐、烏頭酸酐等各酐單體之單元。該等不飽和二羧酸酐單體單元可僅單獨使用1種或組合2種以上而使用。 Examples of the "unsaturated dicarboxylic anhydride monomer unit" include units derived from each anhydride monomer such as maleic anhydride, itaconic anhydride, citraconic anhydride, and aconitic anhydride. These unsaturated dicarboxylic anhydride monomer units can be used individually by 1 type or in combination of 2 or more types.
其中,就與丙烯酸系樹脂(a1)之相容性或透明性等方面而言,較佳為馬來酸酐單體單元。 Among them, in terms of compatibility with the acrylic resin (a1), transparency, etc., a maleic anhydride monomer unit is preferred.
上述共聚物(a2)之構成單元較佳為芳香族乙烯基單體單元45~85質量%、(甲基)丙烯酸酯單體單元4~45質量%、不飽和二羧酸酐單體 單元8~20質量%,更佳為芳香族乙烯基單體單元55~85質量%、(甲基)丙烯酸酯單體單元5~30質量%、不飽和二羧酸酐單體單元10~18質量%之範圍。 The constituent units of the above-mentioned copolymer (a2) are preferably 45 to 85% by mass of aromatic vinyl monomer units, 4 to 45% by mass of (meth)acrylate monomer units, and unsaturated dicarboxylic anhydride monomers. Unit 8-20% by mass, more preferably 55-85% by mass of aromatic vinyl monomer units, 5-30% by mass of (meth)acrylate monomer units, and 10-18% by mass of unsaturated dicarboxylic anhydride monomer units % Range.
再者,共聚物(a2)之構成單元可利用周知之方法、例如核磁共振(NMR)測定裝置、其他機器分析裝置進行定性定量分析。 Furthermore, the constituent units of the copolymer (a2) can be qualitatively and quantitatively analyzed by a well-known method, such as a nuclear magnetic resonance (NMR) measuring device and other equipment analysis devices.
若共聚物(a2)之全部構成單元中芳香族乙烯基單體單元占45質量%以上、尤其是55質量%以上,則熱穩定性提高,與丙烯酸系樹脂(a1)混合時可獲得良好之外觀,進而可降低吸水性,故而較佳。 If the aromatic vinyl monomer units in all the constituent units of the copolymer (a2) account for 45% by mass or more, especially 55% by mass or more, the thermal stability is improved, and good performance can be obtained when mixed with the acrylic resin (a1) The appearance can further reduce the water absorption, so it is better.
又,若共聚物(a2)之全部構成單元中(甲基)丙烯酸酯單體單元占4質量%以上、尤其是5質量%以上,則與丙烯酸系樹脂(a1)之相容性提高從而透明性變得良好,故而較佳。 In addition, if the (meth)acrylate monomer units in all the structural units of the copolymer (a2) account for 4% by mass or more, especially 5% by mass or more, the compatibility with the acrylic resin (a1) is improved and transparency The sex becomes better, so it is better.
又,若共聚物(a2)之全部構成單元中不飽和二羧酸酐單體單元占8質量%以上、尤其是10質量%以上,則與丙烯酸系樹脂(a1)之相容性提高從而透明性或耐熱性提高,故而較佳。 In addition, if the unsaturated dicarboxylic anhydride monomer units in all the constituent units of the copolymer (a2) account for 8% by mass or more, especially 10% by mass or more, the compatibility with the acrylic resin (a1) improves and transparency Or the heat resistance is improved, so it is preferable.
另一方面,若共聚物(a2)之全部構成單元中芳香族乙烯基單體單元之比例為85質量%以下,則可保持與丙烯酸系樹脂(a1)之混合性,並且可提高耐熱性或降低吸水性等,故而較佳。 On the other hand, if the proportion of aromatic vinyl monomer units in all the constituent units of the copolymer (a2) is 85% by mass or less, the compatibility with the acrylic resin (a1) can be maintained, and the heat resistance or It is preferable to reduce water absorption, etc.
又,若共聚物(a2)之全部構成單元中(甲基)丙烯酸酯單體單元之比例為45質量%以下、尤其是30質量%以下,則可確保與丙烯酸系樹脂(a1)之相容性,並且可抑制吸水性,故而較佳。 In addition, if the ratio of (meth)acrylate monomer units in all the constituent units of the copolymer (a2) is 45% by mass or less, especially 30% by mass or less, compatibility with the acrylic resin (a1) can be ensured It is preferred because of its properties and can inhibit water absorption.
又,若共聚物(a2)之全部構成單元中不飽和二羧酸酐單元之比例為20質量%以下、尤其是18質量%以下,則可確保與丙烯酸系樹脂(a1)之相容性,並且可提高熱穩定性或抑制吸水性,故而較佳。 In addition, if the proportion of unsaturated dicarboxylic anhydride units in all the structural units of the copolymer (a2) is 20% by mass or less, especially 18% by mass or less, compatibility with the acrylic resin (a1) can be ensured, and It can improve thermal stability or inhibit water absorption, so it is preferred.
共聚物(a2)除上述3種單體單元、即芳香族乙烯基單體單元、(甲基)丙烯酸酯單體單元及不飽和二羧酸酐單體單元以外,亦可含有「其他可共聚之單元」。但是,其含有比例較佳為5質量%以下。 The copolymer (a2) may contain "other copolymerizable monomer units" in addition to the above three types of monomer units, namely, aromatic vinyl monomer units, (meth)acrylate monomer units, and unsaturated dicarboxylic anhydride monomer units. unit". However, its content is preferably 5% by mass or less.
作為該「其他可共聚之單元」,例如可列舉來自丙烯腈、甲基丙烯腈等丙烯腈單體、丙烯酸、甲基丙烯酸等乙烯基羧酸單體、N-甲基馬來醯亞胺、N-乙基馬來醯亞胺、N-丁基馬來醯亞胺、N-環己基馬來醯亞胺等N-烷基馬來醯亞胺單體、N-苯基馬來醯亞胺、N-甲基苯基馬來醯亞胺、N-氯苯基馬來醯亞胺等N-芳基馬來醯亞胺單體等各單體之單元。該等可共聚之單元可僅單獨使用1種或組合2種以上而使用。 Examples of the "other copolymerizable units" include acrylonitrile monomers such as acrylonitrile and methacrylonitrile, vinyl carboxylic acid monomers such as acrylic acid and methacrylic acid, N-methylmaleimide, N-alkylmaleimide monomers such as N-ethylmaleimide, N-butylmaleimide, N-cyclohexylmaleimide, N-phenylmaleimide Units of various monomers such as N-aryl maleimide monomers such as amine, N-methylphenyl maleimide, and N-chlorophenyl maleimide. These copolymerizable units can be used individually by 1 type or in combination of 2 or more types.
共聚物(a2)之利用凝膠滲透層析法(GPC)所測得之聚苯乙烯換算之重量平均分子量(Mw)較佳為100,000~200,000。此處,若重量平均分子量(Mw)為該範圍,則與丙烯酸系樹脂(a1)混合而獲得之A層之成形性或外觀等優異,故而較佳。就該觀點而言,更佳之重量平均分子量(Mw)之範圍為110,000~180,000。 The weight average molecular weight (Mw) of the copolymer (a2) measured by gel permeation chromatography (GPC) in terms of polystyrene is preferably 100,000 to 200,000. Here, if the weight average molecular weight (Mw) is in this range, the A layer obtained by mixing with the acrylic resin (a1) has excellent moldability, appearance, and the like, which is preferable. From this point of view, a more preferable range of the weight average molecular weight (Mw) is 110,000~180,000.
關於共聚物(a2)之製造方法,可利用公知之聚合方法進行製造,並無特別限定。例如可應用溶液聚合或塊狀聚合等,聚合製程亦可適當地採用批次式或半批次式、及連續式等。本積層體中,就副產物較少,又,容易控制分子量調整與透明性等方面而言,可較佳地採用溶液聚合下之批次式聚合製程。 The method for producing the copolymer (a2) can be produced by a known polymerization method, and it is not particularly limited. For example, solution polymerization or bulk polymerization can be applied, and the polymerization process can also adopt batch or semi-batch, continuous, etc. as appropriate. In this laminate, in terms of fewer by-products, easy control of molecular weight adjustment and transparency, etc., a batch-type polymerization process under solution polymerization can be preferably used.
((a1)/(a2)) ((a1)/(a2))
A層中,丙烯酸系樹脂(a1)與共聚物(a2)之混合質量比較佳為(a1)/(a2)=80/20~20/80。 In layer A, the mixing quality of acrylic resin (a1) and copolymer (a2) is better than (a1)/(a2)=80/20~20/80.
若丙烯酸系樹脂(a1)與共聚物(a2)之混合比例為上述範圍內,則與B層之層間密接性優異,可維持作為丙烯酸系樹脂之特徵之表面硬度或透明性,並且可提高耐熱性或抑制吸水性,故而較佳。 If the mixing ratio of the acrylic resin (a1) and the copolymer (a2) is within the above range, the interlayer adhesion to layer B is excellent, the surface hardness or transparency characteristic of acrylic resins can be maintained, and the heat resistance can be improved It is preferred because of its properties or inhibition of water absorption.
又,為了降低本積層體之高溫高濕環境下所產生之內部應力,較佳為(a1)/(a2)=70/30~40/60,更佳為70/30~60/40。 In addition, in order to reduce the internal stress generated in the high-temperature and high-humidity environment of the laminated body, (a1)/(a2)=70/30~40/60 is preferred, and 70/30~60/40 is more preferred.
(聚碳酸酯樹脂(a3)) (Polycarbonate resin (a3))
如上所述,A層亦較佳為以具有特定之結構之聚碳酸酯樹脂(a3)為主成分。藉此,可對本積層體賦予較高之表面硬度。 As described above, it is also preferable that the A layer has a polycarbonate resin (a3) having a specific structure as a main component. Thereby, high surface hardness can be imparted to the laminate.
此處,聚碳酸酯樹脂(a3)係於結構之一部分中包含來自下述(化1)所表示之二羥基化合物之結構單元之聚碳酸酯樹脂。 Here, the polycarbonate resin (a3) is a polycarbonate resin containing a structural unit derived from the dihydroxy compound represented by (Chemical 1) below in a part of the structure.
作為上述(化1)所表示之二羥基化合物,例如可列舉處於立體異構物之關係之異山梨酯、異二縮甘露醇及異艾杜糖醇。該等可單獨使用,亦可組合2種以上而使用。 As the dihydroxy compound represented by the above (Chemical Formula 1), for example, isosorbide, isomannide, and isoidide which are in the relationship of stereoisomers can be cited. These can be used individually or in combination of 2 or more types.
上述(化1)所表示之二羥基化合物係能夠以生物起源物質為原料自糖類製造之醚二醇。尤其是異山梨酯可藉由使自澱粉獲得之D-葡萄糖氫化後進行脫水而價廉地製造,可作為資源而豐富地獲取。基於該等情況,最佳為異山梨酯。 The dihydroxy compound represented by the above (Chemical Formula 1) is an ether diol that can be produced from sugars using a biologically derived material as a raw material. In particular, isosorbide can be produced inexpensively by hydrogenating D-glucose obtained from starch and then dehydrating, and can be obtained abundantly as a resource. Based on these circumstances, the best is isosorbide.
作為A層之主成分之聚碳酸酯樹脂(a3)中,來自上述(化1)所表示之二羥基化合物之結構單元之含有比例較佳為50莫耳%以上,更佳為60莫耳%以上,又,較佳為90莫耳%以下,更佳為80莫耳%以下。 In the polycarbonate resin (a3) as the main component of the A layer, the content of the structural unit derived from the dihydroxy compound represented by (Chemical 1) is preferably 50 mol% or more, more preferably 60 mol% Above, it is preferably 90 mol% or less, and more preferably 80 mol% or less.
因作為A層之主成分之聚碳酸酯樹脂(a3)中來自上述(化1)所表示之二羥基化合物之結構單元之含有比例為上述範圍,故,聚碳酸酯樹脂(a3)之硬度係取芳香族聚碳酸酯樹脂與丙烯酸系樹脂之中間值,與於表層配置有丙烯酸系樹脂層之顯示器用前面板相比,衝壓加工性飛躍性提高。 Since the polycarbonate resin (a3), which is the main component of the A layer, contains the structural unit derived from the dihydroxy compound represented by (Chemical 1) in the above range, the hardness of the polycarbonate resin (a3) is Taking the intermediate value between the aromatic polycarbonate resin and the acrylic resin, the press workability is significantly improved compared to the display front panel with the acrylic resin layer arranged on the surface layer.
更具體而言,因該結構單元之含有比例為90莫耳%以下,故而表面硬度或耐熱性優異,且可抑制耐衝擊性及與下述B層之層間密接性 之降低,故而,可防止衝壓加工時之良率之降低及對作為顯示器用前面板之製品進行處理時之破損等各種不良情況。 More specifically, since the content of the structural unit is 90 mol% or less, it has excellent surface hardness and heat resistance, and can suppress impact resistance and interlayer adhesion with the following layer B Therefore, it is possible to prevent various defects such as a decrease in yield rate during press processing and damage during processing of products used as front panels for displays.
另一方面,因上述含有比例為50莫耳%以上,故而耐衝擊性或衝壓加工性優異,且可抑制表面硬度或耐熱性之降低。又,本積層體可藉由於至少一面配置硬塗層而進而獲得充分之表面硬度,可較佳地用於顯示器用前面板及透明建築材料之任一用途。 On the other hand, since the above-mentioned content ratio is 50 mol% or more, it is excellent in impact resistance or press workability, and can suppress a decrease in surface hardness or heat resistance. In addition, the laminated body can obtain sufficient surface hardness by arranging a hard coat on at least one side, and can be preferably used for any application of a front panel for a display and a transparent building material.
上述聚碳酸酯樹脂(a3)亦可具有上述結構單元以外之結構單元,例如可列舉國際公開第2004/111106號公報中所記載之來自脂肪族二羥基化合物之結構單元、或國際公開第2007/148604號公報中所記載之來自脂環式二羥基化合物之結構單元。 The polycarbonate resin (a3) may also have structural units other than the above structural units, for example, the structural units derived from aliphatic dihydroxy compounds described in International Publication No. 2004/111106, or International Publication No. 2007/ The structural unit derived from an alicyclic dihydroxy compound described in No. 148604.
上述來自脂肪族二羥基化合物之結構單元中,較佳為具有來自選自由乙二醇、1,3-丙二醇、1,4-丁二醇、1,5-戊二醇及1,6-己二醇所組成之群中之至少1種二羥基化合物之結構單元。 Among the above-mentioned structural units derived from aliphatic dihydroxy compounds, it is preferable to have those derived from ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol and 1,6-hexanediol. The structural unit of at least one dihydroxy compound in the group consisting of diols.
上述來自脂環式二羥基化合物之結構單元中,較佳為包含5員環結構或6員環結構者。6員環結構亦可藉由共價鍵被固定為椅子形或舟形。藉由包含作為5員環結構或6員環結構之來自脂環式二羥基化合物之結構單元,可提高所獲得之聚碳酸酯之耐熱性。脂環式二羥基化合物中所含之碳原子數通常較佳為70以下,更佳為50以下,進而較佳為30以下。 Among the structural units derived from the alicyclic dihydroxy compound, those containing a 5-membered ring structure or a 6-membered ring structure are preferred. The 6-membered ring structure can also be fixed into a chair or boat shape by covalent bonds. By including a structural unit derived from an alicyclic dihydroxy compound as a 5-membered ring structure or a 6-membered ring structure, the heat resistance of the obtained polycarbonate can be improved. The number of carbon atoms contained in the alicyclic dihydroxy compound is generally preferably 70 or less, more preferably 50 or less, and still more preferably 30 or less.
作為包含上述5員環結構或6員環結構之脂環式二羥基化合物,可列舉上述國際公開第2007/148604號中所記載者。其中,可較佳地例示環己烷二甲醇、三環癸烷二甲醇、金剛烷二醇及五環十五烷二甲醇。 Examples of the alicyclic dihydroxy compound containing the above-mentioned 5-membered ring structure or 6-membered ring structure include those described in the above-mentioned International Publication No. 2007/148604. Among them, cyclohexane dimethanol, tricyclodecane dimethanol, adamantane diol, and pentacyclopentadecane dimethanol can be preferably exemplified.
再者,就工業上容易獲取之觀點而言,較佳為選擇環己烷二甲醇,其中,較佳為1,4-環己烷二甲醇。另一方面,於重視耐熱性或與下述B層之層間接著性之情形時,較佳為選擇三環癸烷二甲醇。 Furthermore, from the viewpoint of easy industrial availability, it is preferable to select cyclohexane dimethanol, and among them, 1,4-cyclohexane dimethanol is preferable. On the other hand, when attaching importance to heat resistance or indirect adhesion to the layer of the following B layer, tricyclodecane dimethanol is preferably selected.
上述A層中所使用之聚碳酸酯樹脂(a3)可利用通常所使用之聚合方法進行製造,可為光氣法或與碳酸二酯進行反應之酯交換法之任一者。其中,較佳為於存在聚合觸媒之條件下使結構之一部分中由上述(化1)所表示之二羥基化合物、脂肪族及/或脂環式羥基化合物、視需要而使用之其他二羥基化合物、及碳酸二酯進行反應之酯交換法。 The polycarbonate resin (a3) used in the A layer can be produced by a generally used polymerization method, and can be any of a phosgene method or a transesterification method that reacts with a carbonic acid diester. Among them, it is preferable to make the dihydroxy compound represented by (Chemical 1) above, aliphatic and/or alicyclic hydroxy compound, and other dihydroxy compounds as necessary in a part of the structure in the presence of a polymerization catalyst A transesterification method in which a compound and a carbonic acid diester are reacted.
酯交換法係如下之製造方法:向結構之一部分中由上述(化1)所表示之二羥基化合物、脂肪族及/或脂環式羥基化合物、視需要而使用之其他二羥基化合物、及碳酸二酯添加鹼性觸媒、以及將該鹼性觸媒中和之酸性物質,進行酯交換反應。 The transesterification method is a manufacturing method as follows: to a part of the structure represented by the above (Chemical 1) dihydroxy compound, aliphatic and/or alicyclic hydroxy compound, other dihydroxy compounds used as needed, and carbonic acid The diester adds an alkaline catalyst and an acidic substance that neutralizes the alkaline catalyst to perform a transesterification reaction.
作為碳酸二酯之代表例,可列舉碳酸二苯酯、碳酸二甲苯酯、碳酸雙(氯苯基)酯、碳酸間甲苯酯、碳酸二萘酯、碳酸雙(聯苯)酯、碳酸二乙酯、碳酸二甲酯、碳酸二丁酯及碳酸二環己酯等。該等中,尤其較佳為使用碳酸二苯酯。 Representative examples of carbonic acid diesters include diphenyl carbonate, xylene carbonate, bis(chlorophenyl) carbonate, m-tolyl carbonate, dinaphthyl carbonate, bis(biphenyl) carbonate, and diethyl carbonate. Ester, dimethyl carbonate, dibutyl carbonate and dicyclohexyl carbonate, etc. Among these, it is particularly preferable to use diphenyl carbonate.
聚碳酸酯樹脂(a3)之分子量能夠以比濃黏度表示,關於該比濃黏度之下限,較佳為0.20dl/g以上,更佳為0.30dL/g以上,進而較佳為0.35dL/g以上,關於比濃黏度之上限,較佳為1.20dL/g以下,更佳為1.00dL/g以下,進而較佳為0.80dL/g以下。 The molecular weight of the polycarbonate resin (a3) can be expressed in terms of reduced viscosity, and the lower limit of the reduced viscosity is preferably 0.20 dl/g or more, more preferably 0.30 dL/g or more, and even more preferably 0.35 dL/g As described above, the upper limit of the reduced viscosity is preferably 1.20 dL/g or less, more preferably 1.00 dL/g or less, and still more preferably 0.80 dL/g or less.
若聚碳酸酯樹脂之比濃黏度過低,則有成形品之機械強度較小之可能性,若過大,則有成形時之流動性降低,使生產性或成形性降低之傾向。 If the specific viscosity of the polycarbonate resin is too low, the mechanical strength of the molded product may be low. If it is too large, the fluidity during molding may decrease, which may reduce productivity or moldability.
(其他成分) (Other ingredients)
A層可於不損害本發明之效果之範圍內適當地含有各種添加劑或改質劑等。此處,作為添加劑,例如可列舉抗氧化劑、紫外線吸收劑、光穩定劑、潤滑劑、阻燃劑、著色劑等。又,作為改質劑,例如可列舉耐衝擊性改良劑、相容化劑、抗靜電劑等。 The A layer may appropriately contain various additives, modifiers, etc. within a range that does not impair the effects of the present invention. Here, examples of additives include antioxidants, ultraviolet absorbers, light stabilizers, lubricants, flame retardants, colorants, and the like. Moreover, as a modifier, an impact resistance modifier, a compatibilizer, an antistatic agent, etc. are mentioned, for example.
B層係具有本積層體之功能中之尤其是體現耐衝擊性或耐熱性等之功能之層。 The B layer is a layer having functions such as impact resistance or heat resistance among the functions of the laminate.
B層可單獨使用聚碳酸酯系樹脂(b1)作為主成分樹脂,又,亦可於聚碳酸酯系樹脂(b1)中混合下述各種改質劑(b2)而用作主成分樹脂。 The layer B may use the polycarbonate resin (b1) alone as the main component resin, or the polycarbonate resin (b1) may be mixed with the following various modifiers (b2) and used as the main component resin.
(聚碳酸酯系樹脂(b1)) (Polycarbonate resin (b1))
作為聚碳酸酯系樹脂(b1),可列舉芳香族聚碳酸酯系樹脂及脂肪族聚碳酸酯系樹脂。 Examples of the polycarbonate resin (b1) include aromatic polycarbonate resins and aliphatic polycarbonate resins.
聚碳酸酯系樹脂(b1)可為均聚物,又,亦可為與其他可共聚之單體之共聚物。 The polycarbonate resin (b1) may be a homopolymer or a copolymer with other copolymerizable monomers.
進而,聚碳酸酯系樹脂(b1)之結構可為支鏈結構,亦可為直鏈結構,亦可為支鏈結構與直鏈結構之混合物。 Furthermore, the structure of the polycarbonate resin (b1) may be a branched structure, a linear structure, or a mixture of a branched structure and a linear structure.
又,聚碳酸酯系樹脂(b1)可為利用光氣法或酯交換法、吡啶法等公知之任一種製造方法而獲得者。 In addition, the polycarbonate resin (b1) can be obtained by any known production method such as the phosgene method, the transesterification method, and the pyridine method.
聚碳酸酯系樹脂(b1)之重量平均分子量只要為10,000~100,000即可,其中,較佳為20,000以上或40,000以下,其中更佳為22,000以上或28,000以下。 The weight average molecular weight of the polycarbonate-based resin (b1) may be 10,000 to 100,000, and among them, it is preferably 20,000 or more or 40,000 or less, and particularly preferably 22,000 or more or 28,000 or less.
聚碳酸酯系樹脂(b1)可僅單獨使用1種,又,亦可組合重量平均分子量不同之2種以上而使用。 The polycarbonate resin (b1) may be used alone or in combination of two or more kinds of different weight average molecular weights.
若聚碳酸酯系樹脂(b1)之重量平均分子量為上述範圍,則可確保耐衝擊性,且擠出成形性亦良好,故而較佳。 If the weight average molecular weight of the polycarbonate resin (b1) is in the above range, impact resistance can be ensured and the extrusion moldability is also good, which is preferable.
(改質劑(b2)) (Modifier (b2))
為了調整熔融黏度及提高硬度等,較佳為將上述聚碳酸酯系樹脂(b1)與改質劑(b2)混合而用於B層之形成。 In order to adjust the melt viscosity and increase the hardness, it is preferable to mix the polycarbonate resin (b1) and the modifier (b2) for the formation of the B layer.
作為改質劑(b2),可例示特定之丙烯酸系樹脂(b2)。 As the modifier (b2), a specific acrylic resin (b2) can be exemplified.
(丙烯酸系樹脂(b2)) (Acrylic resin (b2))
丙烯酸系樹脂(b2)較佳為包含芳香族(甲基)丙烯酸酯單體單元5~80質量%及甲基丙烯酸甲酯單體單元95~20質量%之丙烯酸系共聚物。 The acrylic resin (b2) is preferably an acrylic copolymer containing 5 to 80% by mass of aromatic (meth)acrylate monomer units and 95 to 20% by mass of methyl methacrylate monomer units.
若丙烯酸系樹脂(b2)中芳香族(甲基)丙烯酸酯單體單元與甲基丙烯酸甲酯單體單元之含有比例為上述範圍內,則可表現出與聚碳酸酯系樹脂(b1)之相容性或表面硬度提高效果,故而較佳。 If the content ratio of the aromatic (meth)acrylate monomer unit to the methyl methacrylate monomer unit in the acrylic resin (b2) is within the above-mentioned range, it can show a difference with the polycarbonate resin (b1) Compatibility or surface hardness improvement effect, so it is better.
就該觀點而言,更佳為芳香族(甲基)丙烯酸酯單體單元10~70質量%及甲基丙烯酸甲酯單體單元90~30質量%,進而較佳為芳香族(甲基)丙烯酸酯單體單元25~60質量%及甲基丙烯酸甲酯單體單元75~40質量%。 From this viewpoint, 10 to 70% by mass of aromatic (meth)acrylate monomer units and 90 to 30% by mass of methyl methacrylate monomer units are more preferable, and aromatic (meth) acrylate monomer units are more preferable. 25-60% by mass of acrylate monomer units and 75-40% by mass of methyl methacrylate monomer units.
作為上述芳香族(甲基)丙烯酸酯單體單元,例如可例示(甲基)丙烯酸苯酯、(甲基)丙烯酸苄酯等。該等可僅單獨使用1種或組合2種以上而使用。 As said aromatic (meth)acrylate monomer unit, phenyl (meth)acrylate, benzyl (meth)acrylate, etc. are illustrated, for example. These can be used individually by 1 type or in combination of 2 or more types.
其中,就與聚碳酸酯系樹脂(b1)之相容性等方面而言,較佳為甲基丙烯酸苯酯或甲基丙烯酸苄酯,更佳為甲基丙烯酸苯酯。 Among them, in terms of compatibility with the polycarbonate resin (b1), etc., phenyl methacrylate or benzyl methacrylate is preferred, and phenyl methacrylate is more preferred.
視需要亦可使丙烯酸系樹脂(b2)含有芳香族(甲基)丙烯酸酯單體單元及甲基丙烯酸甲酯單體單元以外之可共聚之其他單體單元。 If necessary, the acrylic resin (b2) may contain other copolymerizable monomer units other than the aromatic (meth)acrylate monomer unit and the methyl methacrylate monomer unit.
於使丙烯酸系樹脂(b2)含有其他單體單元之情形時,於丙烯酸系樹脂(b2)中之其他單體單元較佳為0.1~10質量%。 When the acrylic resin (b2) contains other monomer units, the other monomer units in the acrylic resin (b2) are preferably 0.1 to 10% by mass.
丙烯酸系樹脂(b2)之利用凝膠滲透層析法(GPC)所測得之聚苯乙烯換算之重量平均分子量(Mw)較佳為5,000~30,000。 The weight average molecular weight (Mw) of the acrylic resin (b2) measured by gel permeation chromatography (GPC) in terms of polystyrene is preferably 5,000 to 30,000.
若丙烯酸系樹脂(b2)之重量平均分子量(Mw)為上述範圍,則與聚碳酸酯系樹脂(b1)之相容性良好,所獲得之B層之成形性或表面硬度提高效果及外觀等優異,故而較佳。 If the weight average molecular weight (Mw) of the acrylic resin (b2) is in the above range, the compatibility with the polycarbonate resin (b1) will be good, and the formability or surface hardness improvement effect and appearance of the B layer will be obtained. Excellent, so better.
就該觀點而言,丙烯酸系樹脂(b2)之重量平均分子量(Mw)之範圍更佳為10,000~28,000。 From this viewpoint, the range of the weight average molecular weight (Mw) of the acrylic resin (b2) is more preferably 10,000-28,000.
聚碳酸酯系樹脂(b1)與上述丙烯酸系樹脂(b2)之混合質量比並無特別限制,較佳為(b1)/(b2)=99~65/1~35。若兩者之混合比例為該範圍內,則所獲得之B層之成形性或表面硬度提高效果及外觀等優異,故而較佳。 The mixing mass ratio of the polycarbonate resin (b1) and the acrylic resin (b2) is not particularly limited, but it is preferably (b1)/(b2)=99~65/1~35. If the mixing ratio of the two is within this range, the obtained B layer has excellent moldability, surface hardness improvement effect, appearance, and the like, which is preferable.
就該觀點而言,更佳為(b1)/(b2)=95/5~70/30。 From this viewpoint, (b1)/(b2)=95/5~70/30 is more preferable.
(較佳之聚碳酸酯系樹脂) (Preferable polycarbonate resin)
以上說明中,若就降低本積層體之高溫高濕環境下所產生之內部應力之觀點而言,作為B層之主成分樹脂之聚碳酸酯系樹脂係玻璃轉移溫度越高越佳,尤佳為使用聚碳酸酯系樹脂(b1)之均聚物。另一方面,於重視積層體之表面硬度之情形時,較佳為含有上述聚碳酸酯系樹脂(b1)與上述改質劑(b2)者。 In the above description, from the viewpoint of reducing the internal stress generated in the high-temperature and high-humidity environment of the laminate, the higher the glass transition temperature of the polycarbonate-based resin, which is the main component resin of the B layer, the better. It is a homopolymer using polycarbonate resin (b1). On the other hand, when attaching importance to the surface hardness of the laminate, it is preferable to contain the polycarbonate resin (b1) and the modifier (b2).
(其他成分) (Other ingredients)
B層可於不損害本發明之效果之範圍內調配上述各種添加劑或其他樹脂。 The layer B can be blended with the above various additives or other resins within a range that does not impair the effects of the invention.
作為該添加劑,例如可列舉抗氧化劑、紫外線吸收劑、光穩定劑、潤滑劑、阻燃劑、著色劑、抗水解劑等。 Examples of the additives include antioxidants, ultraviolet absorbers, light stabilizers, lubricants, flame retardants, colorants, and anti-hydrolysis agents.
(各層之玻璃轉移溫度) (Glass transition temperature of each layer)
就抑制高溫高濕環境下所產生之內部應力之觀點而言,A層之玻璃轉移溫度與B層之玻璃轉移溫度之差越小越佳,較佳為100~140℃,其中更佳為110℃以上或140℃以下,其中進而較佳為115℃以上,進而,其中尤佳為120℃以上。 From the viewpoint of suppressing internal stress generated in a high-temperature and high-humidity environment, the smaller the difference between the glass transition temperature of layer A and the glass transition temperature of layer B, the better, preferably 100~140℃, and more preferably 110 The temperature is higher than or equal to 140°C, and among these, 115°C or higher is more preferable, and 120°C or higher is particularly preferable among them.
另一方面,就抑制高溫高濕環境下所產生之內部應力之觀點而言,B層之玻璃轉移溫度越高越佳,較佳為100℃~160℃,其中進而較佳為120℃以上或155℃以下。 On the other hand, from the viewpoint of suppressing the internal stress generated in a high-temperature and high-humidity environment, the higher the glass transition temperature of the B layer, the better, preferably 100°C to 160°C, and more preferably 120°C or higher. Below 155°C.
又,若A層之玻璃轉移溫度與B層之玻璃轉移溫度之差之絕對值為30℃以下,則可進一步抑制溫度85℃、濕度85%RH之高溫高濕環 境試驗後之前面板之翹曲,故而較佳。就該觀點而言,該差之絕對值較佳為30℃以下,其中更佳為20℃以下,其中進而較佳為10℃以下,其中進而尤其較佳為5℃以下。 In addition, if the absolute value of the difference between the glass transition temperature of the A layer and the glass transition temperature of the B layer is 30°C or less, the high-temperature and high-humidity ring with a temperature of 85°C and a humidity of 85%RH can be further suppressed The warpage of the front panel after the environmental test is better. From this point of view, the absolute value of the difference is preferably 30°C or less, particularly preferably 20°C or less, particularly preferably 10°C or less, and particularly preferably 5°C or less.
認為其原因在於:於高溫高濕環境下,A層會因吸水而軟化溫度降低,由此,容易產生各種應變之緩和現象,但若該差之絕對值為上述範圍內,則於高溫高濕環境下兩層之尺寸變化行為接近,結果,翹曲受到抑制。 It is believed that the reason is that in a high temperature and high humidity environment, the softening temperature of the A layer will be lowered due to water absorption, and therefore, various strain relaxation phenomena are likely to occur. However, if the absolute value of the difference is within the above range, it will be in high temperature and high humidity. The dimensional change behavior of the two layers under the environment is similar, and as a result, the warpage is suppressed.
再者,上述玻璃轉移溫度係使用示差掃描熱量計依照JIS K7121以加熱速度10℃/分鐘進行測定而得之值。但是,亦可利用其他公知之機器分析裝置、例如動態黏彈性裝置等測定上述玻璃轉移溫度。 In addition, the said glass transition temperature is the value measured using the differential scanning calorimeter in accordance with JIS K7121 at a heating rate of 10 degreeC/min. However, other well-known machine analysis devices, such as dynamic viscoelastic devices, etc., can also be used to measure the glass transition temperature.
前面板亦可進而具備硬塗層(C層)作為單面側或兩面側之最表面層。但是,亦可不具備硬塗層(C層)。 The front panel may further have a hard coat layer (C layer) as the outermost layer on one side or both sides. However, the hard coat layer (layer C) may not be provided.
該硬塗層(C層)係對前面板賦予優異之表面硬度或耐擦傷性之層。 The hard coat layer (C layer) is a layer that imparts excellent surface hardness or scratch resistance to the front panel.
硬塗層(C層)例如可藉由照射電子束、放射線、紫外線等能量線使C層形成用硬化性樹脂組合物硬化,或藉由加熱使C層形成用硬化性樹脂組合物硬化而形成。 The hard coat layer (C layer) can be formed by, for example, curing the curable resin composition for forming the C layer by irradiating energy rays such as electron beams, radiation, or ultraviolet rays, or curing the curable resin composition for forming the C layer by heating. .
其中,就成形時間及生產性之觀點而言,較佳為藉由照射紫外線使C層形成用硬化性樹脂組合物硬化而形成硬塗層(C層)。 Among them, from the viewpoint of molding time and productivity, it is preferable to form a hard coat layer (C layer) by curing the curable resin composition for forming the C layer by irradiating ultraviolet rays.
用以形成硬塗層(C層)之C層形成用硬化性樹脂組合物只要為含有硬化性樹脂C1之樹脂組合物即可。於如上所述般藉由照射紫外線使C層形成用硬化性樹脂組合物硬化之情形時,該C層形成用硬化性樹脂組合物較佳為除硬化性樹脂C1以外還含有光聚合起始劑之樹脂組合物。 The curable resin composition for forming a C layer for forming a hard coat layer (C layer) should just be a resin composition containing curable resin C1. When the curable resin composition for forming the C layer is cured by irradiating ultraviolet rays as described above, the curable resin composition for forming the C layer preferably contains a photopolymerization initiator in addition to the curable resin C1 The resin composition.
作為上述硬化性樹脂C1之具體例,例如可例示丙烯酸酯化合 物、丙烯酸胺基甲酸酯化合物、環氧丙烯酸酯化合物、羧基改性環氧丙烯酸酯化合物、聚酯丙烯酸酯化合物、共聚系丙烯酸酯、脂環式環氧樹脂、縮水甘油醚環氧樹脂、乙烯醚化合物、氧雜環丁烷化合物等。該等硬化性樹脂可僅單獨使用1種或組合2種以上而使用。 As a specific example of the above-mentioned curable resin C1, for example, an acrylate compound Compounds, acrylic urethane compounds, epoxy acrylate compounds, carboxyl modified epoxy acrylate compounds, polyester acrylate compounds, copolymerized acrylates, alicyclic epoxy resins, glycidyl ether epoxy resins, Vinyl ether compounds, oxetane compounds, etc. These curable resins can be used individually by 1 type or in combination of 2 or more types.
作為賦予更加優異之表面硬度之硬化性樹脂C1,可列舉多官能丙烯酸酯化合物、多官能丙烯酸胺基甲酸酯化合物、多官能環氧丙烯酸酯化合物等、自由基聚合系之硬化性化合物、或烷氧基矽烷、烷基烷氧基矽烷等、熱聚合系之硬化性化合物,進而,亦可為使上述硬化性樹脂含有無機成分而成之有機、無機複合系硬化性樹脂組合物。 As the curable resin C1 that imparts more excellent surface hardness, polyfunctional acrylate compounds, polyfunctional acrylate urethane compounds, polyfunctional epoxy acrylate compounds, etc., radical polymerization-based curable compounds, or Alkoxysilane, alkylalkoxysilane, etc., a thermally polymerized curable compound, and further, may be an organic-inorganic composite curable resin composition in which the above-mentioned curable resin contains an inorganic component.
作為賦予尤其優異之表面硬度之C層形成用硬化性樹脂組合物,可列舉有機、無機混成系硬化性樹脂組合物。作為有機、無機混成系硬化性樹脂組合物,可列舉包含使上述硬化性樹脂含有具有反應性官能基之無機成分而成之硬化性樹脂組合物者。 Examples of the curable resin composition for forming a C layer that imparts particularly excellent surface hardness include organic and inorganic hybrid curable resin compositions. As an organic-inorganic hybrid curable resin composition, the curable resin composition containing the said curable resin containing the inorganic component which has a reactive functional group is mentioned.
藉由利用此種具有反應性官能基之無機成分,例如使該無機成分與自由基聚合性單體進行共聚及交聯,而與僅使有機黏合劑含有無機成分而成之有機、無機複合系硬化性樹脂組合物相比,難以產生硬化收縮,且可表現出較高之表面硬度,故而較佳。進而,就減少硬化收縮之觀點而言,作為更佳之例,可列舉包含紫外線反應性之膠體二氧化矽作為具有反應性官能基之無機成分之有機、無機混成系硬化性樹脂組合物。 By using such an inorganic component with a reactive functional group, for example, the inorganic component is copolymerized and crosslinked with a radical polymerizable monomer, and the organic and inorganic composite system is formed by only the organic binder containing the inorganic component. Compared with the curable resin composition, it is difficult to produce curing shrinkage, and can exhibit a higher surface hardness, so it is preferable. Furthermore, from the viewpoint of reducing curing shrinkage, a more preferable example is an organic-inorganic hybrid curable resin composition containing ultraviolet-reactive colloidal silica as an inorganic component having a reactive functional group.
為了對硬塗層(C層)賦予尤其優異之表面硬度,較佳為調整硬塗層(C層)中所含之無機成分、尤其是具有反應性官能基之無機成分之濃度。 In order to impart particularly excellent surface hardness to the hard coat layer (C layer), it is preferable to adjust the concentration of the inorganic component contained in the hard coat layer (C layer), especially the inorganic component having a reactive functional group.
就該觀點而言,較佳為將硬塗層(C層)中所含之無機成分、尤其是具有反應性官能基之無機成分之濃度設為10~65質量%。若該濃度為10質量%以上,則可獲得對硬塗層(C層)賦予優異之表面硬度之效 果,故而較佳。另一方面,若該濃度為65質量%以下,則可於硬塗層(C層)中最密地填充無機成分、尤其是具有反應性官能基之無機成分,可有效地賦予優異之表面硬度,故而較佳。 From this viewpoint, it is preferable to set the concentration of the inorganic component contained in the hard coat layer (C layer), particularly the inorganic component having a reactive functional group, to 10 to 65% by mass. If the concentration is 10% by mass or more, the effect of imparting excellent surface hardness to the hard coat layer (C layer) can be obtained Fruit, therefore better. On the other hand, if the concentration is 65% by mass or less, the hard coat layer (C layer) can be most densely filled with inorganic components, especially inorganic components with reactive functional groups, and can effectively impart excellent surface hardness , Therefore better.
就該觀點而言,該濃度較佳為10~65質量%,其中更佳為20質量%以上或60質量%以下,其中進而較佳為40質量%以上或55質量%以下。 From this point of view, the concentration is preferably 10 to 65% by mass, more preferably 20% by mass or more or 60% by mass or less, and still more preferably 40% by mass or more or 55% by mass or less.
再者,就提高與下述黏著片材之接著性,並且降低本積層體之高溫高濕環境下所產生之內部應力之觀點而言,硬塗層(C層)之主成分樹脂較佳為與黏著片材之主成分樹脂相同之樹脂。例如,於黏著片材之主成分樹脂為丙烯酸系樹脂之情形時,較佳為硬塗層(C層)之主成分樹脂亦為丙烯酸系樹脂。 Furthermore, from the viewpoint of improving the adhesion with the following adhesive sheets and reducing the internal stress generated in the high-temperature and high-humidity environment of the laminate, the main component resin of the hard coat layer (C layer) is preferably The same resin as the main component resin of the adhesive sheet. For example, when the main component resin of the adhesive sheet is acrylic resin, it is preferable that the main component resin of the hard coat layer (C layer) is also acrylic resin.
C層形成用硬化性樹脂組合物較佳為含有光聚合起始劑,該光聚合起始劑藉由吸收紫外線而被激發、活化而引起聚合反應,引起紫外線硬化性樹脂之硬化反應。 The curable resin composition for forming the C layer preferably contains a photopolymerization initiator that is excited and activated by absorbing ultraviolet rays to cause a polymerization reaction and cause a curing reaction of the ultraviolet curable resin.
作為光聚合起始劑,例如可列舉苯偶醯、二苯甲酮或其衍生物、9-氧硫類、苯偶醯二甲基縮酮類、α羥基烷基苯酮類、α-羥基苯乙酮類、羥基酮類、胺基烷基苯酮類、醯基氧化膦類等。其中,α-羥基烷基苯酮類於硬化時難以引起黃變,可獲得透明之硬化物,故而較佳。又,胺基烷基苯酮類具備非常高之反應性,可獲得優異之硬度之硬化物,故而較佳。上述光聚合起始劑可僅單獨使用1種或組合2種以上而使用。 As the photopolymerization initiator, for example, benzyl, benzophenone or its derivatives, 9-oxysulfur Ketals, benzyl dimethyl ketals, α-hydroxyalkyl phenones, α-hydroxyacetophenones, hydroxy ketones, amino alkyl phenones, phosphine oxides, etc. Among them, α-hydroxyalkyl phenones are hard to cause yellowing during hardening, and a transparent hardened product can be obtained, so it is preferable. In addition, amino alkyl phenones have very high reactivity and can obtain cured products with excellent hardness, so they are preferred. The said photopolymerization initiator can be used individually by 1 type or in combination of 2 or more types.
關於光聚合起始劑之添加量,較佳為相對於硬化性樹脂100質量份添加0.1~5質量份。 Regarding the addition amount of the photopolymerization initiator, it is preferable to add 0.1 to 5 parts by mass relative to 100 parts by mass of the curable resin.
C層形成用硬化性樹脂組合物可包含調平劑作為表面調整成分。 The curable resin composition for forming a C layer may contain a leveling agent as a surface adjustment component.
作為調平劑,可列舉矽酮系調平劑、丙烯酸系調平劑等,其中,較佳為於末端具有反應性之官能基者,更佳為具有2官能以上之 反應性之官能基者。 As the leveling agent, a silicone-based leveling agent, an acrylic-based leveling agent, etc. can be cited. Among them, those having a reactive functional group at the terminal are more preferred, and those having two or more functions are more preferred. Reactive functional groups.
具體而言,可列舉:具有於兩末端具有雙鍵之丙烯酸基之聚醚改性聚二甲基矽氧烷、或具有於末端各具有2個、共計具有4個雙鍵之丙烯酸基之聚酯改性聚二甲基矽氧烷等。 Specifically, examples include: polyether-modified polydimethylsiloxane having acrylic groups having double bonds at both ends, or polyether-modified polydimethylsiloxanes having acrylic groups each having 2 at each end and 4 double bonds in total. Ester modified polydimethylsiloxane, etc.
該等中,尤佳為霧度值穩定且有助於耐擦傷性之提高的具有丙烯酸基之聚酯改性聚二甲基矽氧烷。 Among them, particularly preferred is a polyester-modified polydimethylsiloxane having an acrylic group that has a stable haze value and contributes to the improvement of scratch resistance.
C層形成用硬化性樹脂組合物除硬化性樹脂成分以外可於不損害本發明之效果之範圍內含有例如矽系化合物、氟系化合物、或該等之混合化合物等潤滑劑、或抗氧化劑、紫外線吸收劑、抗靜電劑、矽酮系化合物等阻燃劑、填料、玻璃纖維、耐衝擊性改質劑等各種添加劑。 The curable resin composition for forming the C layer may contain, in addition to the curable resin component, a lubricant such as a silicon-based compound, a fluorine-based compound, or a mixed compound thereof, or an antioxidant, within a range that does not impair the effects of the present invention Various additives such as UV absorbers, antistatic agents, flame retardants such as silicone compounds, fillers, glass fibers, and impact-resistant modifiers.
上述硬塗層(C層)之厚度並無特別限制。例如較佳為1μm~30μm,其中更佳為3μm以上或25μm以下,其中進而較佳為5μm以上或20μm以下,其中尤佳為7μm以上或15μm以下。 The thickness of the hard coat layer (C layer) is not particularly limited. For example, it is preferably 1 μm to 30 μm, more preferably 3 μm or more or 25 μm or less, and even more preferably 5 μm or more or 20 μm or less, and particularly preferably 7 μm or more or 15 μm or less.
此處,若硬塗層(C層)之厚度為上述範圍,則可賦予耐擦傷性,又,難以產生因應力而導致之龜裂,故而較佳。 Here, if the thickness of the hard coat layer (C layer) is in the above range, abrasion resistance can be imparted, and cracks due to stress are unlikely to occur, which is preferable.
又,於兩面具有硬塗層(C層)之情形時,各硬塗層之厚度可相同,亦可不同。其中,較佳為,各硬塗層之厚度均為7μm~15μm之範圍,且丙烯酸系樹脂層(A層)表面之硬塗層之厚度等於或大於聚碳酸酯系樹脂層(B層)表面之硬塗層之厚度。 Moreover, when there are hard coats (layer C) on both sides, the thickness of each hard coat may be the same or different. Among them, preferably, the thickness of each hard coat layer is in the range of 7 μm to 15 μm, and the thickness of the hard coat layer on the surface of the acrylic resin layer (layer A) is equal to or greater than the surface of the polycarbonate resin layer (layer B) The thickness of the hard coating.
前面板只要為於聚碳酸酯系樹脂層(B層)之單面側或兩面側具有與該聚碳酸酯系樹脂不同之熱塑性樹脂層(A層)之層構成即可,亦可具備其他層。例如,只要為於聚碳酸酯系樹脂層(B層)之單面側或兩面側具有丙烯酸系樹脂層(A層)之積層體即可,亦可具備其他層。 As long as the front panel has a layer structure with a thermoplastic resin layer (A layer) different from the polycarbonate resin on one side or both sides of the polycarbonate resin layer (layer B), other layers may also be provided . For example, as long as it is a laminated body which has an acrylic resin layer (A layer) on one side or both sides of a polycarbonate resin layer (B layer), it may be equipped with another layer.
又,例如,如上所述,亦可於單面側最表面或兩面側最表面具 備硬塗層(C層)。 Also, for example, as described above, the outermost surface on one side or the outermost surface on both sides may have Prepare hard coating (layer C).
作為前面板之層構成,可例示(A)/(B)、(A)/(B)/(A)、(C)/(A)/(B)、(C)/(A)/(B)/(A)、(C)/(A)/(B)/(C)、及(C)/(A)/(B)/(A)/(C)等。 As the layer structure of the front panel, (A)/(B), (A)/(B)/(A), (C)/(A)/(B), (C)/(A)/( B)/(A), (C)/(A)/(B)/(C), and (C)/(A)/(B)/(A)/(C), etc.
此處,於層構成中具有2層以上之相同分類層之情形時,該層可為相同之組成,亦可為不同之組成。 Here, when there are two or more layers of the same classification in the layer structure, the layers may have the same composition or different compositions.
以上說明中,較佳為(A)/(B)、(A)/(B)/(A)、(C)/(A)/(B)、(C)/(A)/(B)/(C)、(C)/(A)/(B)/(A)/(C)構成。 In the above description, preferably (A)/(B), (A)/(B)/(A), (C)/(A)/(B), (C)/(A)/(B) /(C), (C)/(A)/(B)/(A)/(C) composition.
又,於顯示器面板等之情形時,更佳為配置為(視認側)(C)/(A)/(B)/(C)(光源側)、或(視認側)(C)/(A)/(B)(光源側)。 Also, in the case of a display panel, etc., it is more preferable to arrange as (visual recognition side) (C)/(A)/(B)/(C) (light source side), or (visual recognition side) (C)/(A )/(B) (light source side).
前面板中,前面板之厚度(a1)並無特別限制,例如較佳為0.1mm~3.0mm,其中更佳為1.5mm以下,其中進而較佳為0.15mm以上或1.2mm以下。 In the front panel, the thickness (a 1 ) of the front panel is not particularly limited. For example, it is preferably 0.1 mm to 3.0 mm, more preferably 1.5 mm or less, and further preferably 0.15 mm or more or 1.2 mm or less.
又,前面板之厚度(a1)亦根據本積層體之應用用途而存在較佳之範圍。例如,於應用於各種圖像顯示裝置之前外殼材料之情形時,較佳為0.1~2.0mm,進而較佳為0.15mm以上或1.5mm以下、0.2mm以上或0.8mm以下、0.2mm以上或0.7mm以下。若為該範圍內,則輕量性與剛性及高溫或高濕之環境下之形狀穩定性優異,故而較佳。 In addition, the thickness (a 1 ) of the front panel also has a preferable range according to the application of the laminate. For example, when applied to the case of a housing material before various image display devices, it is preferably 0.1~2.0mm, and more preferably 0.15mm or more or 1.5mm or less, 0.2mm or more or 0.8mm or less, 0.2mm or more or 0.7 mm or less. If it is within this range, lightness, rigidity, and shape stability under a high temperature or high humidity environment are excellent, which is preferable.
又,於在前面板積層黏著層等而應用於保護玻璃等之表面不產生污漬或損傷,或防止破裂之碎片等之飛散之用途之情形時,前面板之厚度(a1)較佳為0.1mm~0.6mm,其中更佳為0.15mm以上或0.5mm以下。 In addition, when laminating an adhesive layer on the front panel to protect the surface of glass, etc. without stains or damage, or to prevent the scattering of broken fragments, the thickness (a 1 ) of the front panel is preferably 0.1 mm~0.6mm, more preferably 0.15mm or more or 0.5mm or less.
無論於哪種用途之情形,就降低本積層體之內部應力(σ)之方面而言,前面板之厚度(a1)均較佳為較薄。就該觀點而言,前面板之厚度(a1)較佳為0.7mm以下,更佳為0.6mm以下,進而較佳為0.5mm以 下。 Regardless of the application, in terms of reducing the internal stress (σ) of the laminate, the thickness (a 1 ) of the front panel is preferably thinner. From this viewpoint, the thickness (a 1 ) of the front panel is preferably 0.7 mm or less, more preferably 0.6 mm or less, and still more preferably 0.5 mm or less.
本積層體中,為了抑制本積層體之高溫高濕環境下所產生之內部應力、以及形狀穩定性,A層之合計厚度越小越佳,但另一方面,為了提高表面硬度,較佳為一定以上之厚度,且較佳為根據目標之物性調整為適當之範圍內。 In this laminate, in order to suppress the internal stress generated under the high temperature and high humidity environment of the laminate, as well as the shape stability, the total thickness of the layer A should be as small as possible. On the other hand, in order to increase the surface hardness, it is preferably The thickness is greater than a certain level, and is preferably adjusted to an appropriate range according to the target physical properties.
就該觀點而言,A層之合計厚度較佳為10μm~250μm,其中更佳為30μm以上或200μm以下,其中進而較佳為50μm以上或150μm以下。 From this viewpoint, the total thickness of the A layer is preferably 10 μm to 250 μm, more preferably 30 μm or more or 200 μm or less, and still more preferably 50 μm or more or 150 μm or less.
再者,於本積層體例如具備2層作為A層之情形時,該2層之合計厚度成為A層之合計厚度。 In addition, when the present laminated body is provided with, for example, two layers as the A layer, the total thickness of the two layers becomes the total thickness of the A layer.
又,就降低本積層體之內部應力而提高高溫高濕環境下之形狀穩定性之觀點而言,熱塑性樹脂層A層1層之厚度(A)相對於熱塑性樹脂層A層及聚碳酸酯系樹脂層B層之合計厚度(T)之比((A)/(T))較佳為0.05~0.40,其中更佳為0.07以上或0.35以下,其中進而較佳為0.10以上或0.30以下。 In addition, from the viewpoint of reducing the internal stress of the laminate and improving the shape stability in a high-temperature and high-humidity environment, the thickness (A) of one layer of the thermoplastic resin layer A is relative to that of the thermoplastic resin layer A layer and the polycarbonate system. The ratio ((A)/(T)) of the total thickness (T) of the resin layer B layer is preferably 0.05 to 0.40, more preferably 0.07 or more or 0.35 or less, and still more preferably 0.10 or more or 0.30 or less.
再者,於設置2層A層之情形時,為了可於正背面消除A層與B層之膨脹收縮行為之差,各A層之厚度較佳為設為相互相同之厚度。 Furthermore, when two A layers are provided, in order to eliminate the difference in expansion and contraction behavior between the A layer and the B layer on the front and back sides, the thickness of each A layer is preferably set to be the same thickness.
就降低本積層體之高溫高濕環境下之內部應力而提高形狀穩定性之觀點而言,前面板之彈性模數(E1)較佳為1500~4500(MPa),其中更佳為1800以上或4000(MPa)以下,其中進而較佳為2000以上或3500(MPa)以下。 From the viewpoint of reducing the internal stress of the laminate under the high temperature and high humidity environment and improving the shape stability, the elastic modulus (E 1 ) of the front panel is preferably 1500~4500 (MPa), and more preferably 1800 or more Or 4000 (MPa) or less, and among them, it is more preferably 2000 or more or 3500 (MPa) or less.
就降低本積層體之內部應力而提高高溫高濕環境下之形狀穩定性之觀點而言,將上述前面板於溫度85℃、濕度85%RH之環境下靜置120小時,繼而於溫度23℃、濕度50%RH之環境下放置4小時後之4 角之翹曲量之平均值較佳為1.5mm以下,其中更佳為1.0mm以下,其中尤佳為0.3mm以下。 From the viewpoint of reducing the internal stress of the laminate and improving the shape stability in a high-temperature and high-humidity environment, the above-mentioned front panel is allowed to stand for 120 hours in an environment with a temperature of 85°C and a humidity of 85%RH, and then at a temperature of 23°C , 4 hours after placed in an environment with a humidity of 50%RH The average amount of corner warpage is preferably 1.5 mm or less, more preferably 1.0 mm or less, and particularly preferably 0.3 mm or less.
另一方面,即便於上述翹曲量(δ)一定程度上較大之情形時,亦可藉由使前面板之厚度變薄、降低黏著片材之彈性模數等而將本積層體之內部應力(σ)調整為特定之範圍,可提高高溫高濕環境下之形狀穩定性。 On the other hand, even when the amount of warpage (δ) mentioned above is relatively large, the thickness of the front panel can be thinned, and the elastic modulus of the adhesive sheet can be reduced. Adjusting the stress (σ) to a specific range can improve the shape stability under high temperature and high humidity environments.
就前面板之工業上之生產性或良率等觀點而言,上述翹曲量(δ)之下限值較佳為0.01mm以上,進而,進而較佳為0.05mm以上。 From the viewpoint of industrial productivity and yield of the front panel, the lower limit of the amount of warpage (δ) is preferably 0.01 mm or more, and more preferably 0.05 mm or more.
為了將前面板之上述翹曲量(δ)調整為上述範圍內,較佳為採用減小A層之合計厚度、並且調整A層1層之厚度(A)相對於A層及B層之合計層厚(T)之比率((A)/(T))之方法,或取得正背面之硬塗層之彈性模數、硬化收縮量、厚度之平衡之方法。但是,不限定於該等方法。 In order to adjust the amount of warpage (δ) of the front panel in the above range, it is preferable to reduce the total thickness of the A layer and adjust the thickness (A) of the first layer of the A layer relative to the total of the A layer and the B layer. The method of the ratio of layer thickness (T) ((A)/(T)), or the method of obtaining the balance of elastic modulus, hardening shrinkage, and thickness of the hard coating on the front and back. However, it is not limited to these methods.
作為將A層與B層積層時之製膜方法,可採用公知之方法。就操作性或生產性等觀點而言,可較佳地使用具有例如單軸擠出機、多軸擠出機、班布里混合機、捏合機等熔融混合設備且使用T型模頭之擠出流延法。 As a method of forming a film when layering A and B, a known method can be used. From the viewpoint of operability or productivity, it is preferable to use an extruder with melt mixing equipment such as a single-screw extruder, a multi-screw extruder, a Banbury mixer, a kneader, and the like and a T-die head. The casting method.
作為積層方法,可較佳地使用藉由具有進料模組或多歧管之T型模頭對經熔融混練之樹脂進行共擠出成形之方法。 As a layering method, a method of co-extrusion molding the melt-kneaded resin by a T-die with a feed module or a multi-manifold can be preferably used.
為了使本積層體之外觀變得良好,較佳為使用表面經鏡面處理之成形輥(金屬彈性輥或拋光輥等)。 In order to improve the appearance of the laminate, it is preferable to use a forming roll (a metal elastic roll or a polishing roll, etc.) whose surface is mirror-finished.
使用T型模頭之擠出流延法中之成形溫度係根據所使用之樹脂組合物之流動特性或製膜性等而適當地調整,大致為300℃以下,較佳為230~260℃。成形輥溫度大致為90~160℃,較佳為95~150℃。 The molding temperature in the extrusion casting method using a T-die is appropriately adjusted according to the flow characteristics or film forming properties of the resin composition used, and is generally below 300°C, preferably 230 to 260°C. The temperature of the forming roll is approximately 90 to 160°C, preferably 95 to 150°C.
又,於擠出各層時,可較佳地使用單軸擠出機或多軸擠出機,就各層之擠出機而言,較佳為具有排氣功能與過濾功能。排氣功能可 用於各層中所使用之樹脂組合物之乾燥或微量之揮發成分之去除等,可獲得氣泡等缺陷較少之積層體,故而較佳。又,過濾功能存在各種方式,具體而言,可例示葉盤式過濾器、底盤過濾器、錐型過濾器、蠟燭式過濾器、圓筒型過濾器等。其中,較佳為容易確保有效過濾面積之葉盤式過濾器。藉由過濾功能,可將異物或微小凝膠物等去除,可獲得外觀不良較少之積層體,故而較佳。 In addition, when extruding each layer, a single-screw extruder or a multi-screw extruder can be preferably used. As for the extruder of each layer, it is preferable to have an exhaust function and a filtering function. Exhaust function can be It is preferably used for drying of the resin composition used in each layer or removal of trace amounts of volatile components, etc., since a laminate with fewer defects such as bubbles can be obtained. In addition, there are various types of filtering functions. Specifically, a leaf disc filter, a pan filter, a cone filter, a candle filter, a cylindrical filter, etc. can be exemplified. Among them, a leaf disc filter that can easily ensure an effective filtering area is preferred. With the filtering function, foreign matter or fine gel matter can be removed, and a laminate with less appearance defects can be obtained, which is preferable.
再者,用以形成各層之樹脂組合物可預先藉由滾筒混合機、V型混合機、班布里混合機、擠出機等混合機將各成分混合而使用,又,亦可將經計量之各成分直接供給至擠出機之供給口,或進而將分開計量之成分供給至具有2處以上之供給口之擠出機之各供給口。 Furthermore, the resin composition used to form each layer can be used by mixing the components in advance with a mixer such as a roller mixer, a V-type mixer, a Bamburi mixer, and an extruder. Each component is directly supplied to the supply port of the extruder, or further separately metered components are supplied to each supply port of an extruder with two or more supply ports.
進而,各種添加劑之混合方法可使用公知之方法。例如可列舉:(a)預先另外製作將各種添加劑以高濃度(作為代表性之含量,為3~60質量%左右)混合於適當之基礎樹脂中而成之母料,將該母料混合至使用之樹脂中調整濃度之方法;(b)於所使用之樹脂中直接混合各種添加劑之方法等。 Furthermore, a well-known method can be used for the mixing method of various additives. For example: (a) Prepare a masterbatch prepared by mixing various additives in a suitable base resin at a high concentration (as a representative content, about 3-60% by mass) in advance, and mix the masterbatch to The method of adjusting the concentration in the used resin; (b) The method of directly mixing various additives in the used resin, etc.
可列舉如下之方法:於如上所述般積層之A層或B層之表面(稱作「樹脂層表面」)塗佈使上述C層形成用硬化性樹脂組合物溶解或分散於有機溶劑而成之塗料後,製成硬化膜,藉此將其形成並積層於樹脂層表面。但是,不限定於該方法。 The following methods can be cited: coating the surface of the layer A or layer B (referred to as the "resin layer surface") laminated as described above to dissolve or disperse the curable resin composition for forming the C layer in an organic solvent After the paint is applied, a cured film is formed, which is formed and laminated on the surface of the resin layer. However, it is not limited to this method.
作為於樹脂層表面積層之方法,可使用公知之方法。例如可列舉:使用覆蓋膜之層壓方式、浸塗法、直接塗佈法、反向塗佈法、卡馬塗佈法、輥塗法、旋轉塗佈法、線棒塗佈法、擠壓塗佈法、淋幕式塗佈法、噴塗法、凹版塗佈法等。此外,例如亦可採用如下之方法:使用於脫模層形成硬塗層(C層)而成之轉印片,將該硬塗層(C層)積層於樹脂層表面之方法。 As a method for the surface area layer of the resin layer, a known method can be used. Examples include: lamination method using cover film, dip coating method, direct coating method, reverse coating method, kama coating method, roll coating method, spin coating method, wire bar coating method, extrusion Coating method, curtain coating method, spraying method, gravure coating method, etc. In addition, for example, a method of using a transfer sheet formed by forming a hard coat layer (C layer) on the release layer and laminating the hard coat layer (C layer) on the surface of the resin layer can also be adopted.
又,可為了提高該硬塗層(C層)與樹脂層表面之密接性而對樹脂 層表面進行電暈處理或電漿處理及底塗處理等各種表面處理。 In addition, in order to improve the adhesion between the hard coat layer (C layer) and the surface of the resin layer, the resin The surface of the layer is subjected to various surface treatments such as corona treatment, plasma treatment and primer treatment.
並且,較佳為,於樹脂層表面積層C層形成用硬化性樹脂組合物後,藉由照射例如電子束、放射線、紫外線等能量線使該硬化性樹脂組合物硬化,或藉由加熱使該硬化性樹脂組合物硬化。其中,就成形時間及生產性之觀點而言,較佳為藉由紫外線照射使其硬化。 Furthermore, it is preferable that after the curable resin composition for forming layer C of the resin layer surface area layer, the curable resin composition is cured by irradiating energy rays such as electron beams, radiation, or ultraviolet rays, or the curable resin composition is heated by heating. The curable resin composition hardens. Among them, from the viewpoint of molding time and productivity, it is preferable to cure by ultraviolet irradiation.
此處,作為發出紫外線之光源,例如可使用無電極高壓水銀燈、有電極高壓水銀燈、無電極金屬鹵素燈、有電極金屬鹵素燈、氙氣燈、超高壓水銀燈或水銀氙氣燈等。其中,無電極高壓水銀燈容易獲得高照度之紫外線,對紫外線硬化性樹脂之硬化有利,故而較佳。 Here, as a light source emitting ultraviolet rays, for example, an electrodeless high pressure mercury lamp, an electrode high pressure mercury lamp, an electrodeless metal halide lamp, an electrode metal halide lamp, a xenon lamp, an ultra-high pressure mercury lamp, or a mercury xenon lamp can be used. Among them, the electrodeless high-pressure mercury lamp can easily obtain high-illuminance ultraviolet rays, and is beneficial to the hardening of the ultraviolet-curable resin, so it is preferred.
於C層形成用硬化性樹脂組合物包含紫外線硬化性樹脂而藉由照射紫外線使其硬化之情形時,由於對於紫外線透明度較高,因此存在如下情形:硬化性樹脂組合物之內部之硬化快速地進行,但由於氧所引起之硬化阻礙作用(稱作氧阻礙),而於硬化性樹脂組合物之表面硬化緩慢。針對該氧阻礙,若藉由氮氣之供給使樹脂組合物周圍處於氮氣氛圍下,其後照射紫外線,則可使樹脂組合物之表面之硬化與其內部之硬化一併快速地進行,故而較佳。 When the curable resin composition for forming layer C contains an ultraviolet curable resin and is cured by irradiating ultraviolet rays, the transparency to ultraviolet rays is high, so there are cases where the inside of the curable resin composition hardens quickly It progresses, but due to the hardening inhibition effect of oxygen (called oxygen inhibition), the surface hardening of the curable resin composition is slow. In view of the oxygen barrier, if the surroundings of the resin composition are placed in a nitrogen atmosphere by the supply of nitrogen, and then ultraviolet rays are irradiated, the curing of the surface of the resin composition and the curing of the inside can be performed quickly, which is preferable.
亦可於在聚碳酸酯系樹脂層(B層)之單面側或兩面側積層熱塑性樹脂層(A層)而製成樹脂積層體後,對上述樹脂積層體進行熱處理。 After a thermoplastic resin layer (layer A) is laminated on one side or both sides of the polycarbonate resin layer (layer B) to form a resin laminate, the resin laminate may be heat-treated.
作為熱處理條件,較佳為於較A層之玻璃轉移溫度低5℃~30℃之溫度區域、尤其是低5℃~25℃之溫度區域、尤其是低5℃~20℃之溫度區域下對樹脂積層體進行熱處理。 As the heat treatment conditions, it is preferable to perform the treatment in a temperature range 5°C to 30°C lower than the glass transition temperature of the A layer, especially a temperature range of 5°C to 25°C lower, and especially a temperature range of 5°C to 20°C lower. The resin laminate is heat-treated.
又,前面板之單面側或兩面側之最表面可實施抗反射處理、防污處理、抗靜電處理、耐候性處理及防眩處理中之任一種以上之處理。 In addition, the outermost surface of the front panel on one side or both sides can be treated with at least one of anti-reflection treatment, anti-fouling treatment, anti-static treatment, weather resistance treatment, and anti-glare treatment.
各處理之方法並無特別限定,可使用公知之方法。例如可例示塗佈反射減少塗料之方法、蒸鍍介電體薄膜之方法、塗佈抗靜電塗料 之方法等。 The method of each treatment is not particularly limited, and a known method can be used. For example, the method of coating reflection reduction coating, the method of vapor deposition of dielectric film, and the coating of antistatic coating The method and so on.
本積層體中所使用之黏著片材之組成並無特別限定。但是,就黏著性、透明性及耐候性等觀點而言,較佳為使用使以丙烯酸系樹脂為主成分樹脂之黏著劑組合物進行交聯而成之黏著片材。 The composition of the adhesive sheet used in this laminate is not particularly limited. However, from the viewpoints of adhesiveness, transparency, weather resistance, etc., it is preferable to use an adhesive sheet obtained by crosslinking an adhesive composition containing an acrylic resin as a main component resin.
(黏著劑組合物) (Adhesive composition)
上述黏著劑組合物較佳為含有丙烯酸系樹脂、交聯單體、視需要而使用之交聯起始劑、反應觸媒等者。 The above-mentioned adhesive composition preferably contains an acrylic resin, a crosslinking monomer, a crosslinking initiator, a reaction catalyst and the like used as needed.
作為用作主成分樹脂之丙烯酸系樹脂,較佳為丙烯酸酯聚合物(包含共聚物)。 The acrylic resin used as the main component resin is preferably an acrylate polymer (including a copolymer).
丙烯酸酯聚合物(包含共聚物)可藉由用以聚合成該丙烯酸酯聚合物之丙烯酸系單體或甲基丙烯酸系單體之種類、組成比率、以及聚合條件等適當地調整玻璃轉移溫度(Tg)等特性。 Acrylate polymers (including copolymers) can appropriately adjust the glass transition temperature by the type, composition ratio, and polymerization conditions of the acrylic monomer or methacrylic monomer used to polymerize the acrylate polymer ( Tg) and other characteristics.
作為用以聚合成丙烯酸酯聚合物之丙烯酸系單體或甲基丙烯酸系單體,例如可列舉丙烯酸2-乙基己酯、丙烯酸正辛酯、丙烯酸正丁酯、丙烯酸乙酯、甲基丙烯酸甲酯等。亦可使用使該等與親水基或有機官能基等進行共聚而成之乙酸乙烯酯、丙烯酸羥基乙酯、丙烯酸、丙烯酸縮水甘油酯、丙烯醯胺、丙烯腈、甲基丙烯腈、氟丙烯酸酯、矽酮丙烯酸酯等。 Examples of acrylic monomers or methacrylic monomers used to polymerize into acrylate polymers include 2-ethylhexyl acrylate, n-octyl acrylate, n-butyl acrylate, ethyl acrylate, and methacrylic acid. Methyl ester and so on. It is also possible to use vinyl acetate, hydroxyethyl acrylate, acrylic acid, glycidyl acrylate, acrylamide, acrylonitrile, methacrylonitrile, fluoroacrylate, which are copolymerized with hydrophilic groups or organic functional groups, etc. , Silicone acrylate, etc.
丙烯酸酯聚合物中,尤佳為(甲基)丙烯酸烷基酯系共聚物。 Among acrylate polymers, alkyl (meth)acrylate copolymers are particularly preferred.
作為用以形成(甲基)丙烯酸烷基酯系共聚物之(甲基)丙烯酸酯、即丙烯酸烷基酯或甲基丙烯酸烷基酯成分,較佳為烷基為正辛基、異辛基、2-乙基己基、正丁基、異丁基、甲基、乙基、異丙基中之任一者之丙烯酸烷基酯或甲基丙烯酸烷基酯之1種或選自該等之2種以上之混合物。 As the (meth)acrylate component used to form the alkyl (meth)acrylate copolymer, that is, the alkyl acrylate or the alkyl methacrylate component, the alkyl group is preferably n-octyl or isooctyl One of alkyl acrylate or alkyl methacrylate of any one of, 2-ethylhexyl, n-butyl, isobutyl, methyl, ethyl, isopropyl or selected from these A mixture of more than 2 kinds.
作為其他成分,亦可使具有羧基、羥基、縮水甘油基等有機官 能基之丙烯酸酯或甲基丙烯酸酯共聚。具體而言,可將適當地選擇性組合上述(甲基)丙烯酸烷基酯成分與具有有機官能基之(甲基)丙烯酸酯成分而成之單體成分作為起始原料進行加熱聚合而獲得(甲基)丙烯酸酯系共聚物聚合物。 As other ingredients, organic functions such as carboxyl group, hydroxyl group, glycidyl group and the like can also be used. Copolymerization of functional acrylate or methacrylate. Specifically, a monomer component obtained by appropriately combining the above-mentioned alkyl (meth)acrylate component and a (meth)acrylate component having an organic functional group as a starting material can be obtained by heat polymerization ( Meth) acrylate-based copolymer polymer.
其中較佳的可列舉丙烯酸異辛酯、丙烯酸正辛酯、丙烯酸正丁酯、丙烯酸2-乙基己酯等丙烯酸烷基酯中之1種或選自該等之2種以上之混合物、或使丙烯酸異辛酯、丙烯酸正辛酯、丙烯酸正丁酯、丙烯酸2-乙基己酯等中之至少1種以上與丙烯酸進行共聚而成者。 Among them, one of alkyl acrylates such as isooctyl acrylate, n-octyl acrylate, n-butyl acrylate, 2-ethylhexyl acrylate, etc., or a mixture of two or more selected from these, or It is obtained by copolymerizing at least one of isooctyl acrylate, n-octyl acrylate, n-butyl acrylate, 2-ethylhexyl acrylate, and the like with acrylic acid.
作為交聯單體(亦稱作「交聯劑」),可使用具有2個以上之(甲基)丙烯醯基之多官能(甲基)丙烯酸酯、具有2個以上之異氰酸酯基、環氧基、三聚氰胺基、二醇基、矽氧烷基、胺基等有機官能基之多官能有機官能基樹脂、具有鋅、鋁、鈉、鋯、鈣等之金屬錯合物之有機金屬化合物。 As a crosslinking monomer (also called a "crosslinking agent"), polyfunctional (meth)acrylates with more than two (meth)acrylic groups, two or more isocyanate groups, epoxy resins can be used Multifunctional organofunctional resins with organic functional groups such as cyanogen, melamine, diol, siloxane, amine, etc., and organometallic compounds with metal complexes such as zinc, aluminum, sodium, zirconium, and calcium.
若列舉上述多官能(甲基)丙烯酸酯之例,則例如可列舉1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、1,9-壬二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯等。 If the example of the above-mentioned polyfunctional (meth)acrylate is cited, for example, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, and 1,9-nonanediol diacrylate can be cited. , Trimethylolpropane triacrylate, etc.
關於交聯單體之含量,只要以獲得所需之保持力之方式配合其他要素進行調整即可,通常,相對於主成分樹脂100質量份為0.01~40.0質量份,較佳為0.1~30.0質量份,尤其較佳為於0.5~30.0質量份之比例之範圍內進行調整。但是,亦可於取得與其他要素之平衡之條件下超過該範圍。 Regarding the content of the crosslinking monomer, it is only necessary to adjust it with other elements in a way to obtain the required retention force. Generally, it is 0.01-40.0 parts by mass, preferably 0.1-30.0 parts by mass relative to 100 parts by mass of the main component resin. Parts, it is particularly preferable to adjust within the range of the ratio of 0.5 to 30.0 parts by mass. However, this range can also be exceeded under the condition of achieving a balance with other factors.
於使丙烯酸酯聚合物進行交聯時,若適當地添加交聯起始劑(過氧化起始劑、光起始劑)或反應觸媒(三級胺系化合物、四級銨系化合物、月桂酸錫化合物等),則較為有效。 When crosslinking acrylate polymers, if appropriate crosslinking initiators (peroxidation initiators, photoinitiators) or reaction catalysts (tertiary amine compounds, quaternary ammonium compounds, laurel Tin acid compounds, etc.) are more effective.
於進行紫外線照射交聯(亦稱作「UV(Ultraviolet,紫外線)交聯」)之情形時,較佳為調配光起始劑。 In the case of cross-linking by ultraviolet radiation (also referred to as "UV (Ultraviolet, ultraviolet) cross-linking"), it is preferable to prepare a photoinitiator.
作為光起始劑,可使用裂解型光起始劑及奪氫型光起始劑之任一者,亦可併用兩者。 As the photoinitiator, any one of a cleavage-type photoinitiator and a hydrogen abstraction-type photoinitiator can be used, or both can be used in combination.
作為裂解型光起始劑,例如可列舉安息香丁醚、苯偶醯二甲基縮酮、羥基苯乙酮等。 Examples of the cleavage-type photoinitiator include benzoin butyl ether, benzalkonium dimethyl ketal, and hydroxyacetophenone.
另一方面,作為奪氫型光起始劑,例如可列舉二苯甲酮、米其勒酮、二苯并環庚酮、2-乙基蒽醌、異丁基9-氧硫等。 On the other hand, as a hydrogen abstraction type photoinitiator, for example, benzophenone, Michelone, dibenzocycloheptanone, 2-ethylanthraquinone, isobutyl 9-oxysulfur Wait.
但是,不限定於上述所列舉之物質。 However, it is not limited to the substances listed above.
關於光起始劑之添加量,只要適當調整即可,通常,較佳為於相對於主成分樹脂100質量份為0.05~5.0質量份之比例之範圍內進行調整,且較佳為以1:1之比例併用奪氫型與裂解型之各光起始劑。但是,亦可為了取得與其他要素之平衡而超過該範圍。 Regarding the addition amount of the photoinitiator, it can be adjusted appropriately. Generally, it is preferably adjusted within the range of 0.05 to 5.0 parts by mass relative to 100 parts by mass of the main component resin, and preferably 1: The ratio of 1 and each photoinitiator of the hydrogen abstraction type and the cleavage type are used together. However, it is also possible to exceed this range in order to balance with other elements.
(其他添加劑) (Other additives)
除上述成分以外,視需要亦可適當地調配具有近紅外線吸收特性之顏料或染料等色素、黏著賦予劑、抗氧化劑、防老化劑、吸濕劑、紫外線吸收劑、矽烷偶合劑、天然物或合成物之樹脂類、玻璃纖維或玻璃珠等各種添加劑。 In addition to the above-mentioned ingredients, pigments such as pigments or dyes with near-infrared absorption properties, adhesion imparting agents, antioxidants, anti-aging agents, moisture absorbents, ultraviolet absorbers, silane coupling agents, natural products or Various additives such as synthetic resins, glass fibers or glass beads.
關於上述黏著片材,可藉由如下方式製成黏著片材:添加作為主成分樹脂之丙烯酸系樹脂與視需要而使用之交聯劑及反應起始劑或反應觸媒等並進行攪拌混合,於脫模膜上以成為目標之厚度之方式進行製膜,並進行加熱乾燥或紫外線照射而使其等交聯。 Regarding the above-mentioned adhesive sheet, the adhesive sheet can be made by adding the acrylic resin as the main component resin, the crosslinking agent, the reaction initiator or the reaction catalyst, etc., as necessary, and stirring and mixing, A film is formed on the release film so as to have a target thickness, and it is crosslinked by heat drying or ultraviolet irradiation.
(厚度) (thickness)
就降低本積層體之內部應力而提高高溫高濕環境下之形狀穩定性之觀點而言,黏著片材之厚度(a2)較佳為10μm~300μm,尤佳為30μm以上或250μm以下,更尤佳為50μm以上或200μm以下。 From the viewpoint of reducing the internal stress of the laminate and improving the shape stability under high temperature and high humidity environments, the thickness (a 2 ) of the adhesive sheet is preferably 10 μm to 300 μm, more preferably 30 μm or more or 250 μm or less, and more More preferably, it is 50 μm or more or 200 μm or less.
(彈性模數) (Modulus of Elasticity)
就提高高溫高濕環境下之形狀穩定性等觀點而言,黏著片材之 彈性模數(E2)只要為0.001MPa以上即較佳。就該觀點而言,更佳為0.01MPa以上,進而較佳為0.1MPa以上。 From the viewpoint of improving the shape stability in a high-temperature and high-humidity environment, the elastic modulus (E 2 ) of the adhesive sheet is preferably 0.001 MPa or more. From this viewpoint, it is more preferably 0.01 MPa or more, and still more preferably 0.1 MPa or more.
又,就提高觸黏性等觀點而言,彈性模數(E2)較佳為30MPa以下,更佳為20MPa以下,進而較佳為10MPa以下。 In addition, from the viewpoint of improving tackiness and the like, the elastic modulus (E 2 ) is preferably 30 MPa or less, more preferably 20 MPa or less, and still more preferably 10 MPa or less.
所謂觸黏,被定義為“表示與被黏著體接著之瞬間之黏著力者”,“藉由手指等定性地判斷之情形較多。”(木村馨、砂川誠等人編著之「高功能接著劑、黏著劑」共立出版股份有限公司1989年2月20日發行) The so-called tactile adhesion is defined as "the one that expresses the adhesive force at the moment of adhesion to the adherend", "there are many cases where it is qualitatively judged by fingers etc." (Kinumura, Makoto Sunagawa, etc., "High-performance Adhesion" Agents and Adhesives" Kyoritsu Publishing Co., Ltd. issued on February 20, 1989)
再者,黏著片材之彈性模數(E2)可藉由使用拉伸試驗機沿所切出之黏著片材之長度方向以試驗速度300mm/min進行拉伸試驗而進行測定。 Furthermore, the elastic modulus (E 2 ) of the adhesive sheet can be measured by using a tensile tester to perform a tensile test along the length of the cut adhesive sheet at a test speed of 300 mm/min.
(Tg) (Tg)
黏著片材之Tg可使用流變計(英弘精機股份有限公司製造之「MARS」)於黏著夾具:Φ25mm平行板、應變:0.5%、頻率:1Hz、溫度:-50~200℃、升溫速度:3℃/min之條件下藉由利用剪切法進行之動態黏彈性測定之損耗正切(tanδ)進行測定。 The Tg of the adhesive sheet can be used with a rheometer (“MARS” manufactured by Yinghong Precision Machinery Co., Ltd.) in the adhesive fixture: Φ25mm parallel plate, strain: 0.5%, frequency: 1Hz, temperature: -50~200℃, heating rate: Measured by the loss tangent (tanδ) of the dynamic viscoelasticity measurement performed by the shear method under the condition of 3°C/min.
本積層體之特徵在於:利用下述式(1)及式(2)所求出之將前面板與黏著片材之積層體於溫度85℃、濕度85%RH之環境下暴露120小時之情形時的前面板與黏著片材之內部應力(σ)為0.47MPa以下。 The characteristic of the laminate is that the laminate of the front panel and the adhesive sheet, which is obtained by the following formulas (1) and (2), is exposed to an environment with a temperature of 85°C and a humidity of 85%RH for 120 hours The internal stress (σ) between the front panel and the adhesive sheet at this time is 0.47 MPa or less.
此處,上述式(1)及式(2)中之各文字之含義為如下所述。 Here, the meaning of each character in the above formula (1) and formula (2) is as follows.
δ:僅將前面板於溫度85℃、濕度85%RH之環境下暴露120小時之情形時的前面板翹曲形狀中,將前面板以向下凸出之形狀水平地靜置時之前面板端面自靜置面之隆起高度 δ: In the warped shape of the front panel only when the front panel is exposed to an environment with a temperature of 85°C and a humidity of 85%RH for 120 hours, the front panel end face when the front panel is left horizontally in a protruding shape Height of bulge from resting surface
L:樣品長度(10cm) L: sample length (10cm)
θ:僅將前面板於溫度85℃、濕度85%RH之環境下暴露120小時之情形時的前面板翹曲形狀中,將前面板以向下凸出之形狀水平地靜置時之自前面板翹曲形狀之曲率中心落至前面板之接地點之垂線與連結前面板翹曲形狀之曲率中心與前面板之端點之直線所成之角度 θ: Only in the warped shape of the front panel when the front panel is exposed to an environment with a temperature of 85°C and a humidity of 85%RH for 120 hours, from the front panel when the front panel is left horizontally in a protruding shape The angle formed by the vertical line that the center of curvature of the warped shape falls to the grounding point of the front panel and the straight line connecting the center of curvature of the warped shape of the front panel and the end point of the front panel
ρ1:僅將前面板於溫度85℃、濕度85%RH之環境下暴露120小時之情形時的前面板翹曲形狀之曲率半徑 ρ 1 :The curvature radius of the front panel warped shape only when the front panel is exposed to an environment with a temperature of 85°C and a humidity of 85%RH for 120 hours
a1:前面板之厚度 a 1 : The thickness of the front panel
a2:黏著片材之厚度 a 2 : The thickness of the adhesive sheet
b:樣品寬度(10cm) b: sample width (10cm)
E1:前面板之彈性模數 E 1 : The elastic modulus of the front panel
E2:黏著片材之彈性模數 E 2 : The elastic modulus of the adhesive sheet
I1:前面板之面積二次矩 I 1 : The second moment of the area of the front panel
I2:黏著片材之面積二次矩 I 2 : The second moment of the area of the adhesive sheet
h:a1+a2 h: a1+a2
σ:內部應力 σ: internal stress
根據本發明者所進行之試驗結果,可確認:本積層體中,若利用上述式(1)及式(2)所求出之內部應力(σ)為0.47MPa以下,則可有效地抑制高溫高濕之環境下之翹曲。 According to the test results conducted by the inventors, it can be confirmed that in this laminate, if the internal stress (σ) obtained by the above formula (1) and formula (2) is 0.47 MPa or less, the high temperature can be effectively suppressed Warpage in high humidity environment.
就該觀點而言,本積層體中之上述內部應力(σ)較佳為0.47MPa以下,尤佳為0.46MPa以下,更尤佳為0.45MPa以下。進而,較佳為0.40MPa以下,更佳為0.30MPa以下。 From this viewpoint, the internal stress (σ) in the present laminate is preferably 0.47 MPa or less, more preferably 0.46 MPa or less, and even more preferably 0.45 MPa or less. Furthermore, it is preferably 0.40 MPa or less, and more preferably 0.30 MPa or less.
本積層體中之上述內部應力(σ)主要可藉由A層之厚度、(A層)1層 之厚度(A)相對於(A)層及(B)層之合計厚度(T)之比((A)/(T))、A層及B層之材料、黏著片材之厚度與材料等進行調整。 The above-mentioned internal stress (σ) in this laminate can be mainly determined by the thickness of A layer, (A layer) 1 layer The ratio of the thickness (A) to the total thickness (T) of the (A) and (B) layers ((A)/(T)), the materials of the A and B layers, the thickness and materials of the adhesive sheet, etc. Make adjustments.
再者,於下述實施例中,作為高溫高濕環境下之翹曲評價方法,採用溫度85℃、濕度85%RH之環境作為高溫高濕環境,但亦可採用其他環境條件、例如溫度60℃、濕度90%RH、或溫度70℃、濕度90%RH等環境條件作為高溫高濕環境。 Furthermore, in the following examples, as a method for evaluating warpage in a high-temperature and high-humidity environment, an environment with a temperature of 85°C and a humidity of 85% RH is used as the high-temperature and high-humidity environment, but other environmental conditions, such as a temperature of 60 Environmental conditions such as ℃, humidity 90%RH, or temperature 70℃, humidity 90%RH are regarded as high temperature and high humidity environment.
如以上所說明般,本積層體除高溫高濕環境下之形狀穩定性優異以外,亦可提高透明性、耐衝擊性、表面硬度等。因此,本積層體可較佳地用作各種用途,例如可貼合於基材等而用作各種基板材料或保護材料等。除作為例如行動電話終端、智慧型手機、攜帶型電子遊戲設備、攜帶型資訊終端、平板裝置、移動式個人電腦、可佩戴式終端等圖像顯示裝置之構成材料之各種基板材料或保護材料以外,還可較佳地用作作為液晶電視、液晶顯示器、桌上型個人電腦、汽車導航、汽車儀錶等設置型顯示裝置之構成材料之各種基板材料或保護材料。 As explained above, the present laminate has excellent shape stability in a high-temperature and high-humidity environment, and can also improve transparency, impact resistance, surface hardness, and the like. Therefore, the laminate can be suitably used for various applications, for example, it can be bonded to a base material and used as various substrate materials, protective materials, and the like. In addition to various substrate materials or protective materials that are used as constituent materials for image display devices such as mobile phone terminals, smart phones, portable electronic game equipment, portable information terminals, tablet devices, mobile personal computers, wearable terminals, etc. It can also be preferably used as various substrate materials or protective materials as the constituent materials of set-up display devices such as LCD TVs, liquid crystal displays, desktop personal computers, car navigations, and car meters.
又,本積層體亦可藉由各種加工方法而賦予形狀。例如,除使用模具進行加熱、加壓之方法以外,還可例示壓空成型法、真空成型法、輥壓成型法等作為成形方法。藉由對本積層體賦予形狀,而可用於具有曲面之圖像顯示裝置或各種撓性機器。 In addition, the present laminate can also be shaped by various processing methods. For example, in addition to the method of heating and pressurizing using a mold, a pressure forming method, a vacuum forming method, a roll forming method, etc. can also be exemplified as the forming method. By giving the shape to the laminate, it can be used for image display devices with curved surfaces or various flexible devices.
通常,所謂「片材」,係指於JIS中之定義上較薄且其厚度與長度與寬度相比較小且平坦之製品,通常,所謂「膜」,係指厚度與長度及寬度相比極小且最大厚度被任意地限定之較薄且平坦之製品,通常係指以捲筒之形態供給者(日本工業標準JISK6900)。但是,片材與膜之邊界不明確,本發明中,無需於詞句上區別兩者,因此,本發明 中,即便於稱作「膜」之情形時,亦包含「片材」,即便於稱作「片材」之情形時,亦包含「膜」。 Generally, the so-called "sheet" refers to a product that is thinner as defined in JIS and whose thickness and length are smaller and flat compared to the width and width. Generally, the so-called "film" refers to the thickness that is extremely small compared to the length and width. The thinner and flat products whose maximum thickness is arbitrarily limited are usually supplied in the form of rolls (Japanese Industrial Standard JISK6900). However, the boundary between the sheet and the film is not clear. In the present invention, there is no need to distinguish between the two in terms of words. Therefore, the present invention In this, even in the case of "film", it also includes "sheet", and even in the case of "sheet", it also includes "membrane".
又,於如圖像顯示面板、保護面板等般表達為「面板」之情形時,包含板體、片材及膜、或該等之積層體。 In addition, when it is expressed as a "panel" such as an image display panel, a protection panel, etc., it includes a plate, a sheet, and a film, or a laminate of these.
本說明書中,於記載為「X~Y」(X,Y為任意之數字)之情形時,只要未特別說明,則不僅包含「X以上且Y以下」之含義,而且還包含「較佳為大於X」或「較佳為小於Y」之含義。 In this manual, when it is described as "X~Y" (X, Y are arbitrary numbers), unless otherwise specified, it not only includes the meaning of "more than X and less than Y", but also includes "preferably The meaning of "greater than X" or "preferably less than Y".
又,於記載為「X以上」(X為任意之數字)之情形時,只要未特別說明,則包含「較佳為大於X」之含義,於記載為「Y以下」(Y為任意之數字)之情形時,只要未特別說明,則包含「較佳為小於Y」之含義。 In addition, when it is described as "more than X" (X is an arbitrary number), unless otherwise specified, it includes the meaning of "preferably greater than X", and is described as "below Y" (Y is an arbitrary number) In the case of ), unless otherwise specified, it includes the meaning of "preferably less than Y".
以下,藉由實施例更加詳細地進行說明。但是,本發明不限定於以下所說明之實施例。 Hereinafter, a more detailed description will be given by using examples. However, the present invention is not limited to the examples described below.
再者,本說明書中所表示之各種測定值及評價係以如下方式進行。 In addition, various measurement values and evaluations shown in this specification are performed as follows.
(1)厚度 (1) Thickness
使用市售之厚度測定器(MITUTOYO製造)進行測定。 A commercially available thickness measuring device (manufactured by MITUTOYO) was used for measurement.
(2)彈性模數(E1、E2) (2) Elastic modulus (E 1 , E 2 )
對於前面板之彈性模數(E1),藉由JISK-7198A法中所記載之動態黏彈性測定法,使用IT Meter and Control(股)製造之動態黏彈性測定裝置「DVA-200」,對於膜之橫方向(TD),於振動頻率10Hz、應變0.1%之條件下以升溫速度1℃/分鐘自-100℃至200℃進行測定,自所獲得之資料求出溫度20℃下之儲存彈性模數(E'),使用該儲存彈性模數(E')作為E1。 For the elastic modulus (E1) of the front panel, use the dynamic viscoelasticity measuring method described in JISK-7198A method, using the dynamic viscoelasticity measuring device "DVA-200" manufactured by IT Meter and Control (stock). For the film The transverse direction (TD) is measured under the conditions of vibration frequency of 10Hz and strain of 0.1% at a heating rate of 1°C/min from -100°C to 200°C, and the storage elastic modulus at a temperature of 20°C is obtained from the obtained data (E'), use the storage elastic modulus (E') as E 1 .
對於黏著片材之彈性模數(E2),以試驗速度300mm/min沿使用拉 伸試驗機切出之黏著片材之長度方向進行拉伸、測定。 For the elastic modulus (E 2 ) of the adhesive sheet, the test speed is 300mm/min along the length direction of the adhesive sheet cut out with a tensile testing machine and measured.
(3)前面板單獨體之藉由濕熱暴露試驗而進行之翹曲評價 (3) The warpage evaluation of the front panel alone by the damp heat exposure test
將實施例、比較例中所獲得之樹脂積層體(前面板)切為10cm×10cm之大小,對於在設定為溫度85℃濕度85%RH之恆溫恆濕槽中放置120小時,繼而於設定為溫度23℃濕度50%RH之環境之恆溫恆濕槽中放置4小時後立即對4角之翹曲量進行評價。 The resin laminate (front panel) obtained in the Examples and Comparative Examples was cut into a size of 10cm×10cm, and placed in a constant temperature and humidity bath set at a temperature of 85°C and a humidity of 85%RH for 120 hours, and then set it to After being placed in a constant temperature and humidity bath with a temperature of 23°C and a humidity of 50%RH for 4 hours, the warpage of the four corners was evaluated immediately.
翹曲量係將試驗片即樹脂積層體(前面板)之凸面靜置於石英製壓盤上,使用高度規以目視測定4角自壓盤之隆起高度,算出4角之翹曲量δ(mm)之平均值。 The amount of warpage is that the convex surface of the resin laminate (front panel) of the test piece is statically placed on the quartz platen, and the height of the four corners from the platen is visually measured using a height gauge to calculate the warpage amount δ( mm) average value.
(4)內部應力之算出 (4) Calculation of internal stress
將實施例、比較例中所獲得之前面板切為10cm×10cm之大小,使用以下所示之式(1)、式(2)算出於設定為溫度85℃濕度85%RH之恆溫恆濕槽中暴露120小時之情形時產生之內部應力。 Cut the front panel obtained in the Examples and Comparative Examples into a size of 10cm×10cm, and use the formulas (1) and (2) shown below to calculate in a constant temperature and humidity tank set at a temperature of 85°C and a humidity of 85%RH Internal stress generated when exposed for 120 hours.
δ:僅將前面板於溫度85℃、濕度85%RH之環境下暴露120小時之情形時的前面板翹曲形狀中,將前面板以向下凸出之形狀水平地靜置時之前面板端面自靜置面之隆起高度 δ: In the warped shape of the front panel only when the front panel is exposed to an environment with a temperature of 85°C and a humidity of 85%RH for 120 hours, the front panel end face when the front panel is left horizontally in a protruding shape Height of bulge from resting surface
L:樣品長度(10cm) L: sample length (10cm)
θ:僅將前面板於溫度85℃、濕度85%RH之環境下暴露120小時之情形時的前面板翹曲形狀中,將前面板以向下凸出之形狀水平地靜置時之自前面板翹曲形狀之曲率中心落至前面板之接地點之垂線與連結前面板翹曲形狀之曲率中心與前面板之端點之直線所成之角度 θ: Only in the warped shape of the front panel when the front panel is exposed to an environment with a temperature of 85°C and a humidity of 85%RH for 120 hours, from the front panel when the front panel is left horizontally in a protruding shape The angle formed by the vertical line that the center of curvature of the warped shape falls to the grounding point of the front panel and the straight line connecting the center of curvature of the warped shape of the front panel and the end point of the front panel
ρ1:僅將前面板於溫度85℃、濕度85%RH之環境下暴露120小時之情形時的前面板翹曲形狀之曲率半徑 ρ 1 :The curvature radius of the front panel warped shape only when the front panel is exposed to an environment with a temperature of 85°C and a humidity of 85%RH for 120 hours
a1:前面板之厚度 a 1 : The thickness of the front panel
a2:黏著片材之厚度 a 2 : The thickness of the adhesive sheet
b:樣品寬度(10cm) b: sample width (10cm)
E1:前面板之彈性模數 E 1 : The elastic modulus of the front panel
E2:黏著片材之彈性模數 E 2 : The elastic modulus of the adhesive sheet
I1:前面板之面積二次矩 I 1 : The second moment of the area of the front panel
I2:黏著片材之面積二次矩 I 2 : The second moment of the area of the adhesive sheet
h:a1+a2 h: a 1 + a 2
σ:內部應力 σ: internal stress
此處,將內部應力計算模型之模式圖示於圖1。 Here, the schematic diagram of the internal stress calculation model is shown in FIG. 1.
作為計算之過程,首先,將前面板單獨體之藉由上述濕熱暴露試驗而實測之翹曲量(δ)代入至式(1)中,算出僅將前面板於溫度85℃、濕度85%RH之環境下暴露120小時之情形時的前面板翹曲形狀之曲率半徑(ρ1)。 As the calculation process, firstly, the warpage (δ) of the front panel alone measured by the above-mentioned damp heat exposure test is substituted into the formula (1), and the calculation is calculated by using only the front panel at a temperature of 85°C and a humidity of 85%RH. The radius of curvature (ρ 1 ) of the warped shape of the front panel when exposed to the environment for 120 hours.
繼而,根據下述式(3)、式(4)分別算出前面板與黏著劑之面積二次矩(I1、I2)。繼而,將所算出之ρ1、其他物性值代入至式(2),算出內部應力(σ)。 Then, according to the following formulas (3) and (4), the area second moments (I 1, I 2 ) of the front panel and the adhesive are respectively calculated. Then, the calculated ρ 1 and other physical property values are substituted into equation (2) to calculate the internal stress (σ).
(5)前面板/黏著片材/玻璃積層體之濕熱暴露試驗 (5) Humidity and heat exposure test of front panel/adhesive sheet/glass laminate
將實施例、比較例中所獲得之前面板/黏著片材/玻璃之積層體於 設定為溫度85℃、濕度85%RH之恆溫恆濕槽中放置120小時,繼而於設定為溫度23℃、濕度50%RH之環境之恆溫恆濕槽中放置4小時後,立即以目視確認試驗片之外觀。 The laminated body of the previous panel/adhesive sheet/glass obtained in the examples and comparative examples Place it in a constant temperature and humidity tank set at a temperature of 85°C and a humidity of 85%RH for 120 hours, and then place it in a constant temperature and humidity tank set at a temperature of 23°C and a humidity of 50%RH for 4 hours, then immediately confirm the test by visual inspection The appearance of the film.
此時,若前面板之因濕熱暴露所致之翹曲量較大,則會於前面板與黏著片材之界面產生剝離,會因剝離之處之氣泡(空氣)混入而產生外觀不良。藉由目視依照下述標準對外觀不良部之大小進行評價。 At this time, if the amount of warpage of the front panel caused by exposure to moisture and heat is large, peeling will occur at the interface between the front panel and the adhesive sheet, and the appearance of poor appearance will be caused by the mixing of bubbles (air) in the peeled area. The size of the defective appearance portion was evaluated by visual observation in accordance with the following criteria.
○(較佳):外觀不良部之面積比例未達10% ○ (better): The area ratio of the defective appearance part is less than 10%
×(欠佳):外觀不良部之面積比例為10%以上 ×(Unsatisfactory): The area ratio of the defective appearance part is more than 10%
對實施例、比較例中所使用之主要原料、材料進行說明。 The main raw materials and materials used in the examples and comparative examples will be described.
(熱塑性樹脂(a1-1)) (Thermoplastic resin (a1-1))
丙烯酸系樹脂(Mitsubishi Rayon(股)製造、商品名:ACRYPET VH001、密度:1.19g/cm3、甲基丙烯酸甲酯/丙烯酸甲酯=99/1質量%、立體規則性(三元組分率):mm(9.2莫耳%)、mr(41.8莫耳%)、rr(49.0莫耳%)、Tg:111℃、MFR(Melt Flow Rate,熔體流動速率)(溫度:230℃、荷重:37.3N):2.0g/10min) Acrylic resin (manufactured by Mitsubishi Rayon (stock), trade name: ACRYPET VH001, density: 1.19 g/cm 3 , methyl methacrylate/methyl acrylate = 99/1 mass%, stereoregularity (ternary component ratio) ): mm (9.2 mol%), mr (41.8 mol%), rr (49.0 mol%), Tg: 111°C, MFR (Melt Flow Rate) (temperature: 230°C, load: 37.3N): 2.0g/10min)
(熱塑性樹脂(a2-1)) (Thermoplastic resin (a2-1))
共聚物(電氣化學工業(股)製造、商品名:RESISFY R-100、密度:1.14g/cm3、苯乙烯/甲基丙烯酸甲酯/馬來酸酐=75/15/10質量%、Tg:127℃、MFR(溫度:230℃、荷重:37.3N):4.2g/10min) Copolymer (manufactured by Electric Chemical Industry Co., Ltd., trade name: RESISSFY R-100, density: 1.14 g/cm 3 , styrene/methyl methacrylate/maleic anhydride=75/15/10 mass%, Tg: 127°C, MFR (temperature: 230°C, load: 37.3N): 4.2g/10min)
(熱塑性樹脂(a3-1)) (Thermoplastic resin (a3-1))
藉由依照日本專利特開2008-024919號公報之方法而獲得之、來自作為二羥基化合物之異山梨酯之單體單元與來自三環癸烷二甲醇之單體單元之莫耳比率為異山梨酯/三環癸烷二甲醇=70/30莫耳%之聚碳酸酯共聚物(密度:1.36g/cm3、Tg:128℃、MFR(溫度:230℃、荷重:37.3N):9.6g/10min) The molar ratio of the monomer unit derived from isosorbide which is a dihydroxy compound to the monomer unit derived from tricyclodecane dimethanol obtained by the method according to Japanese Patent Laid-Open No. 2008-024919 is isosorbide Ester/tricyclodecane dimethanol=70/30 mol% polycarbonate copolymer (density: 1.36g/cm 3 , Tg: 128°C, MFR (temperature: 230°C, load: 37.3N): 9.6g /10min)
(聚碳酸酯系樹脂(b1-1)) (Polycarbonate resin (b1-1))
(Sumika Styron Polycarbonate(股)製造、商品名:CALIBRE 301-15、密度:1.20g/cm3、Tg:149℃、MFR(溫度:300℃、荷重:11.8N):15.0g/10min) (Manufactured by Sumika Styron Polycarbonate (stock), trade name: CALIBRE 301-15, density: 1.20g/cm 3 , Tg: 149°C, MFR (temperature: 300°C, load: 11.8N): 15.0g/10min)
(硬化性樹脂組合物(c)) (Curable resin composition (c))
(c-1)(MOMENTIVE公司製造、商品名「UVHC7800G」) (c-1) (manufactured by MOMENTIVE, trade name "UVHC7800G")
(c-2)(MOMENTIVE公司製造、商品名「XRC39-6210」) (c-2) (manufactured by MOMENTIVE, trade name "XRC39-6210")
(黏著片材) (Adhesive sheet)
作為黏著片材,使用將包含丙烯酸酯共聚物、交聯劑及光聚合起始劑之黏著劑樹脂組合物夾於經剝離處理之2片聚對苯二甲酸乙二酯膜間,以成為厚度150μm之方式賦形為片狀而成之彈性模數(E2):0.30MPa、Tg:-10℃者。 As the adhesive sheet, an adhesive resin composition containing an acrylate copolymer, a crosslinking agent, and a photopolymerization initiator is sandwiched between two peeled polyethylene terephthalate films to form a thickness The modulus of elasticity (E 2 ): 0.30MPa, Tg: -10°C.
(玻璃板) (glass plate)
作為玻璃板,使用市售之鈉鈣玻璃(寬度:100mm×長度:100mm×厚度:0.5mm)。 As the glass plate, a commercially available soda lime glass (width: 100 mm × length: 100 mm × thickness: 0.5 mm) was used.
分別將混合丙烯酸系樹脂(a1-1)60質量份及共聚物丙烯酸系樹脂(a2-1)40質量份而獲得之樹脂組合物100質量份、聚碳酸酯系樹脂(b1-1)100質量份供給至具有排氣功能及過濾功能之不同之擠出機,以樹脂溫度240~265℃進行熔融混練,於進料模組以成為(A層)/(B層)之積層構成之方式利用260℃之T型模頭共擠出成形後,依序通過設定為100℃之第1冷卻輥、設定為110℃之第2冷卻輥及設定為150℃之第3冷卻輥而進行冷卻,獲得總厚度為0.675mm,各層厚度為(A層)/(B層)=0.075mm/0.600mm之前面板。 100 parts by mass of a resin composition obtained by mixing 60 parts by mass of acrylic resin (a1-1) and 40 parts by mass of copolymer acrylic resin (a2-1), and 100 parts by mass of polycarbonate resin (b1-1) The parts are supplied to different extruders with exhaust function and filtering function, melted and kneaded at a resin temperature of 240~265℃, and used in the feed module as a layered structure of (A layer)/(B layer) After co-extrusion molding with a T-die at 260°C, it is cooled by the first cooling roll set at 100°C, the second cooling roll set at 110°C, and the third cooling roll set at 150°C. The total thickness is 0.675mm, and the thickness of each layer is (A layer)/(B layer)=0.075mm/0.600mm front panel.
繼而,使用棒式塗佈機將包含硬化性樹脂組合物(c-1)60質量份及硬化性樹脂組合物(c-2)40質量份之硬化性樹脂組合物(cf)塗佈於上 述前面板之丙烯酸系樹脂層(A層)之面,直接於該狀態下以90℃乾燥1分鐘後,以700mJ/cm2之曝光量曝光紫外線而使硬化性樹脂組合物(c)硬化從而形成硬塗層(Cf)。 Then, using a bar coater, a curable resin composition (cf) containing 60 parts by mass of curable resin composition (c-1) and 40 parts by mass of curable resin composition (c-2) was applied to the above The surface of the acrylic resin layer (layer A) of the front panel is directly dried in this state at 90°C for 1 minute, and then exposed to ultraviolet rays at an exposure of 700mJ/cm 2 to harden the curable resin composition (c) to form Hard coating (Cf).
繼而,使用棒式塗佈機將包含硬化性樹脂組合物(c-2)60質量份及硬化性樹脂組合物(c-3)40質量份之硬化性樹脂組合物(cb)塗佈於上述樹脂積層體之聚碳酸酯系樹脂層(B層)之面,直接於該狀態下以90℃乾燥1分鐘後,以700mJ/cm2之曝光量曝光紫外線而使硬化性樹脂組合物(c)硬化從而形成硬塗層(Cb),從而製作前面板。 Then, using a bar coater, a curable resin composition (cb) containing 60 parts by mass of curable resin composition (c-2) and 40 parts by mass of curable resin composition (c-3) was applied to the above The surface of the polycarbonate resin layer (layer B) of the resin laminate is directly dried in this state at 90°C for 1 minute, and then exposed to ultraviolet rays at an exposure amount of 700 mJ/cm 2 to make the curable resin composition (c) It is hardened to form a hard coat layer (Cb) to make a front panel.
繼而,使將黏著片材之一剝離膜剝離而露出之黏著面重疊於上述前面板之硬塗層(Cb)之表面並利用手壓輥進行貼合。繼而,將剩餘之剝離膜剝離,於露出之黏著面重疊鈉鈣玻璃(厚度:0.5mm),於減壓下(絕對壓5kPa)進行加壓貼合後,實施高壓釜處理(50℃、0.2MPa、20分鐘)進行貼合而製作積層體。進而,利用高壓水銀燈以365nm之紫外線達到2000mJ/cm2之方式隔著鈉鈣玻璃對該積層體進行紫外線照射而使黏著片材硬化,製作上述前面板/黏著片材/玻璃之貼合體。 Then, the adhesive surface exposed by peeling off the peeling film of one of the adhesive sheets was superimposed on the surface of the hard coat layer (Cb) of the front panel and pasted with a hand roller. Then, the remaining peeling film was peeled off, soda lime glass (thickness: 0.5mm) was superimposed on the exposed adhesive surface, and pressure bonding was carried out under reduced pressure (absolute pressure of 5kPa), and then subjected to autoclave treatment (50°C, 0.2 MPa, 20 minutes) bonding to produce a layered body. Furthermore, the laminate was irradiated with ultraviolet rays through soda lime glass using a high-pressure mercury lamp so that ultraviolet rays of 365 nm reached 2000 mJ/cm 2 to harden the adhesive sheet to produce the above-mentioned front panel/adhesive sheet/glass laminate.
如表1所示,於實施例1中變更前面板之A層、B層各層之厚度比率及總厚度,除此以外,以與實施例1相同之方式製作前面板、及前面板/黏著片材/玻璃之貼合體。 As shown in Table 1, in Example 1, the thickness ratio and total thickness of each layer of the A layer and B layer of the front panel were changed. Except for this, the front panel and the front panel/adhesive sheet were produced in the same manner as in Example 1. Material/glass fitting body.
分別將熱塑性樹脂(a3-1)100質量份與聚碳酸酯系樹脂(b1-1)質量份供給至具有排氣功能及過濾功能之不同之擠出機,以樹脂溫度240~265℃進行熔融混練,於具有多歧管之T型模頭以成為(Af層)/(B層)/(Ab層)之2種3層之積層構成之方式利用240℃之T型模頭共擠出成形後,依序通過設定為100℃之第1冷卻輥、設定為110℃之第2冷卻輥 及設定為120℃之第3冷卻輥而進行冷卻,獲得總厚度為0.675mm,各層厚度為(Af層)/(B層)/(Ab層)=0.075mm/0.525mm/0.075mm之前面板,其後,以與實施例1相同之方式塗佈硬塗層,製作前面板/黏著片材/玻璃之貼合體。 Supply 100 parts by mass of thermoplastic resin (a3-1) and polycarbonate resin (b1-1) by mass to different extruders with venting and filtering functions, and melt them at a resin temperature of 240~265°C Kneading and co-extrusion molding with a T-die with a multi-manifold to form a two-layer three-layer structure of (Af layer)/(B layer)/(Ab layer) using a T-die at 240°C After that, pass through the first cooling roll set at 100°C and the second cooling roll set at 110°C in sequence And set the third cooling roll at 120°C to cool it to obtain a total thickness of 0.675mm, and the thickness of each layer is (Af layer)/(B layer)/(Ab layer)=0.075mm/0.525mm/0.075mm before the panel, After that, a hard coat layer was applied in the same manner as in Example 1 to produce a bonded body of front panel/adhesive sheet/glass.
分別將熱塑性樹脂(a3-1)100質量份與聚碳酸酯系樹脂(b1-1)質量份供給至具有排氣功能及過濾功能之不同之擠出機,以樹脂溫度240~265℃進行熔融混練,於具有多歧管之T型模頭以成為(Af層)/(B層)/(Ab層)之2種3層之積層構成之方式利用240℃之T型模頭共擠出成形後,依序通過設定為100℃之第1冷卻輥、設定為110℃之第2冷卻輥及設定為120℃之第3冷卻輥而進行冷卻,獲得總厚度為0.275mm,各層厚度為(Af層)/(B層)/(Ab層)=0.075mm/0.125mm/0.075mm之前面板,其後,以與實施例1相同之方式塗佈硬塗層,製作前面板/黏著片材/玻璃之貼合體。 Supply 100 parts by mass of thermoplastic resin (a3-1) and polycarbonate resin (b1-1) by mass to different extruders with venting and filtering functions, and melt them at a resin temperature of 240~265°C Kneading and co-extrusion molding with a T-die with a multi-manifold to form a two-layer three-layer structure of (Af layer)/(B layer)/(Ab layer) using a T-die at 240°C After that, it was cooled by the first cooling roll set at 100°C, the second cooling roll set at 110°C, and the third cooling roll set at 120°C in order to obtain a total thickness of 0.275mm, and the thickness of each layer was (Af Layer)/(Layer B)/(Layer Ab)=0.075mm/0.125mm/0.075mm front panel, after that, a hard coat was applied in the same manner as in Example 1 to produce front panel/adhesive sheet/glass The fit body.
如表1所示,於實施例1中變更前面板之A層、B層之厚度比率及總厚度,除此以外,以與實施例1相同之方式獲得前面板,其後,製作前面板/黏著片材/玻璃之貼合體。 As shown in Table 1, in Example 1, the thickness ratio and total thickness of the A layer and B layer of the front panel were changed. Except for this, the front panel was obtained in the same manner as in Example 1. After that, the front panel was produced. Adhesive sheet/glass body.
如表1所示,於實施例1中變更硬塗層(Cb)之厚度,除此以外,以與實施例1相同之方式獲得前面板,其後,製作前面板/黏著片材/玻璃之貼合體。 As shown in Table 1, the thickness of the hard coat layer (Cb) was changed in Example 1. Except for this, the front panel was obtained in the same manner as in Example 1. After that, the front panel/adhesive sheet/glass was produced. Fit body.
如表1所示,於實施例1中於前面板之共擠出成形時變更第3冷卻輥溫度,除此以外,以與實施例1相同之方式獲得前面板,其後,製作前面板/黏著片材/玻璃之貼合體。 As shown in Table 1, in Example 1, the temperature of the third cooling roll was changed during the co-extrusion molding of the front panel. Except for this, the front panel was obtained in the same manner as in Example 1. Thereafter, the front panel/ Adhesive sheet/glass body.
如表1、2所示,實施例1~5之構成中,無濕熱環境試驗時之剝離而為良好之結果,相對於此,比較例1~8中,產生剝離。 As shown in Tables 1 and 2, in the constitution of Examples 1 to 5, the peeling in the non-humid heat environment test was a good result. On the other hand, in Comparative Examples 1 to 8, peeling occurred.
認為供於濕熱環境試驗時之剝離行為與利用式(1)及式(2)算出之內部應力σ之間存在相關性,可確認:若內部應力σ為一定以下,則可抑制濕熱環境試驗時之剝離。認為其原因在於:若當僅將上述前面板供於濕熱暴露試驗時產生之翹曲所致之內部應力降低至一定以下,則與黏著片材之密接力占上風,可抑制剝離。可確認內部應力:0.47MPa大致成為產生剝離之閾值。 It is believed that there is a correlation between the peeling behavior during the hot and humid environment test and the internal stress σ calculated using equations (1) and (2). It can be confirmed that if the internal stress σ is less than a certain value, it can be suppressed during the hot and humid environment test.之 stripping. It is considered that the reason is that if the internal stress due to warpage generated when only the front panel is subjected to the damp heat exposure test is reduced to a certain level or less, the adhesion force with the adhesive sheet prevails and peeling can be suppressed. It can be confirmed that the internal stress: 0.47 MPa is roughly the threshold for peeling.
作為影響內部應力之前面板之因素,根據式(1)、式(2),可列舉彈性模數、厚度、翹曲量。其中,主要可藉由使厚度變薄或使翹曲量變小而降低內部應力。即便於假設任一者較大之情形時,亦可藉由將另一參數調整為適當之範圍,而降低內部應力,從而抑制剝離。 As the factors affecting the internal stress of the front panel, according to formula (1) and formula (2), elastic modulus, thickness, and warpage can be listed. Among them, the internal stress can be reduced mainly by thinning the thickness or reducing the amount of warpage. Even if any one of them is larger, the internal stress can be reduced by adjusting the other parameter to an appropriate range, thereby suppressing peeling.
作為用以減小翹曲量之方法,可列舉調整A層與B層之層構成、A層與B層之厚度比率、正背面塗層之厚度比率、製造時之輥溫度條件等加工條件等之方法。 As a method to reduce the amount of warpage, processing conditions such as adjustment of the layer composition of the A layer and the B layer, the thickness ratio of the A layer and the B layer, the thickness ratio of the front and back coatings, and the roll temperature conditions at the time of manufacturing, etc.的方法。 The method.
其中,使A層與B層之層構成成為A層/B層/A層之2種3層對稱構成之方法較為有效。藉由設為對稱構成,可於正背面消除A層與B層之膨脹收縮行為之差,故而對於翹曲之減小較為有效。 Among them, the method of making the layer structure of the A layer and the B layer into a two-type three-layer symmetrical structure of A layer/B layer/A layer is more effective. By adopting a symmetrical structure, the difference between the expansion and contraction behavior of the A layer and the B layer can be eliminated on the front and back, so it is more effective for reducing the warpage.
自實施例4、5可確認:關於作為前面板採用2種3層之正背面對稱構成者,與採用A層/B層之2種2層構成者相比,可將前面板之翹曲量及內部應力抑制為較小。 From Examples 4 and 5, it can be confirmed that the amount of warpage of the front panel can be compared with the two types of two-layer structure of A-layer/B-layer with respect to the front panel adopting two types of three-layer symmetrical structure And the internal stress is suppressed to be small.
作為減小翹曲量之其他方法,使A層/B層之2種2層構成中(A層)1層之厚度(A)相對於(A)層及(B)層之合計厚度(T)之比((A)/(T))變小之方法較為有效。由於翹曲之原因在於2層之膨脹收縮行為之差,因此,例如,若使A層變得極薄而以接近B層之單層體之方式使厚度比率變得不均勻,則A層之影響會難以顯現,故而可抑制翹曲行為。 As another method to reduce the amount of warpage, the thickness (A) of one layer (A) in the two-layer structure of A layer/B layer is relative to the total thickness of (A) layer and (B) layer (T The method of reducing the ratio ((A)/(T)) of) is more effective. Since the warpage is caused by the difference in the expansion and contraction behavior of the two layers, for example, if the A layer is made extremely thin and the thickness ratio becomes non-uniform in a manner close to the single layer of the B layer, the A layer The effect will be difficult to show, so the warping behavior can be suppressed.
作為減小翹曲量之其他方法,使正背面之硬塗層(C層)之構成接近正背面對象之方法較為有效。硬塗層(C層)於暴露於濕熱試驗時因硬化收縮之進行而使硬塗層本身收縮而成為翹曲之原因,故而,為了抑制翹曲,較佳為取得正背面之硬塗層之構成即材料及厚度之平衡。 As another method to reduce the amount of warpage, it is more effective to make the composition of the hard coat layer (C layer) on the front and back surfaces close to the front and back objects. When the hard coat layer (C layer) is exposed to the damp heat test, the hard coat layer itself shrinks due to the progress of the hardening shrinkage and becomes the cause of warpage. Therefore, in order to suppress the warpage, it is better to obtain the hard coat layer on the front and back sides. Composition is the balance of material and thickness.
於硬塗層之材料組成於正背面相同之情形時,較佳為使兩者之厚度接近,於硬塗層之材料組成於正背面不同之情形時,較佳為考慮各硬塗層之取決於材質之彈性模數及硬化收縮量而以取得正背面之平衡之方式調整厚度。 When the material composition of the hard coat is the same on the front and back, it is better to make the thickness of the two close. When the material composition of the hard coat is different on the front and back, it is better to consider the decision of each hard coat. Adjust the thickness by balancing the elastic modulus of the material and the amount of hardening shrinkage.
作為減小翹曲量之其他方法,藉由調整共擠出時之製膜條件而於冷卻過程中使熱應變減小之方法較為有效。例如,可藉由於不會導致外觀不良之範圍內使第3冷卻輥溫度變高,而藉由退火效果使熱應變減小。 As another method to reduce the amount of warpage, it is more effective to reduce the thermal strain during the cooling process by adjusting the film forming conditions during co-extrusion. For example, by increasing the temperature of the third cooling roll within a range that does not cause poor appearance, the thermal strain can be reduced by the annealing effect.
比較例1~8中,內部應力較大,故而產生剝離。 In Comparative Examples 1 to 8, the internal stress was large, so peeling occurred.
比較例1中,總厚度較厚,為1000μm,即便於翹曲量較小之情形時,亦由於厚度之影響較大而內部應力變大。 In Comparative Example 1, the total thickness is thick, 1000 μm. Even when the amount of warpage is small, the internal stress becomes large due to the large influence of the thickness.
比較例2~4中,A層相對於B層之厚度比率較大,故而前面板之翹曲量較大,內部應力變大。 In Comparative Examples 2 to 4, the thickness ratio of the A layer to the B layer is large, so the amount of warpage of the front panel is large, and the internal stress becomes large.
比較例5~6中,背面之硬塗層(Cf)之厚度較薄,無法取得正背面之硬塗層之平衡,故而前面板之翹曲量較大,內部應力變大。 In Comparative Examples 5 to 6, the thickness of the hard coat layer (Cf) on the back side was thin, and the balance of the hard coat layer on the front and back sides could not be achieved. Therefore, the amount of warpage of the front panel was large, and the internal stress increased.
比較例7~8中,第3冷卻輥溫度未充分達到高溫,前面板之熱應變量較大,翹曲量變大,內部應力變大。 In Comparative Examples 7 to 8, the temperature of the third cooling roll did not reach a high enough temperature, the amount of thermal strain of the front panel was large, the amount of warpage became large, and the internal stress became large.
δ‧‧‧前面板端面自靜置面之隆起高度 δ‧‧‧The bulge height of the end surface of the front panel from the resting surface
L‧‧‧樣品長度 L‧‧‧Sample length
ρ‧‧‧前面板翹曲形狀之曲率半徑 ρ‧‧‧The curvature radius of the front panel warping shape
θ‧‧‧自前面板翹曲形狀之曲率中心落至前面板之接地點之垂線與連結前面板翹曲形狀之曲率中心與前面板之端點之直線所成之角度 θ‧‧‧The angle formed by the vertical line falling from the center of curvature of the front panel to the grounding point of the front panel and the straight line connecting the center of curvature of the front panel with the end point of the front panel
10‧‧‧前面板 10‧‧‧Front Panel
20‧‧‧黏著片材 20‧‧‧Adhesive sheet
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| CN109844847B (en) | 2016-09-01 | 2021-07-13 | 大日本印刷株式会社 | Optical films and image display devices |
| WO2018143194A1 (en) * | 2017-02-03 | 2018-08-09 | 帝人株式会社 | Multilayer body |
| JP2020003448A (en) * | 2018-07-02 | 2020-01-09 | 凸版印刷株式会社 | Stimulus-responsive reversible deformation structure and method for manufacturing the same |
| CN110843266A (en) * | 2018-08-20 | 2020-02-28 | 住友化学株式会社 | Composite front panel and method of making the same |
| EP3922364A4 (en) | 2019-02-07 | 2022-09-28 | Mitsubishi Gas Chemical Company, Inc. | ADHESIVE FILM AND METHOD FOR MAKING AN ADHESIVE FILM |
| BE1027888B1 (en) * | 2019-12-19 | 2021-07-27 | Unilin Bv | Use of a coating material on the edges of decorative panels and method |
| JP7751563B2 (en) * | 2020-03-31 | 2025-10-08 | リンテック株式会社 | High frequency dielectric heating adhesive sheet |
| TW202208173A (en) * | 2020-05-27 | 2022-03-01 | 日商三菱瓦斯化學股份有限公司 | Resin multilayer body |
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| KR20250058018A (en) | 2022-08-30 | 2025-04-29 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | Adhesive film, thermoformed article, and method for producing adhesive film |
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