TWI722832B - Liquid cooling system and pump thereof - Google Patents

Abstract

A liquid cooling system and a pump thereof are provided to solve the problem where it is difficult to seal the wire outlet of the pump which causes leaking of the working fluid. The pump of the invention can be used to drive different non-electrically conductive liquids to flow. The pump includes a circuit board having a circuit unit at an inner side and/or an outer side, a housing coupled with the circuit board, and a flow-guiding fan including a driving member electrically connected to the circuit board and driving an impeller to rotate. The circuit board includes an insulative board having a plurality of through-holes. The through-holes are sealed by an electrically-conductive material. The circuit board is electrically connected to the electrically-conductive material. A liquid chamber forms between the housing and the inner side of the circuit board and receive the flow-guiding fan. A liquid inlet and a liquid outlet intercommunicate with the liquid chamber.

Description

Liquid-cooled heat dissipation system and its pump

The present invention relates to a pump and liquid-cooled heat dissipation system for driving liquid flow, in particular to a pump in which non-conductive liquid can circulate inside, and a liquid-cooled heat dissipation system with the pump.

Please refer to Figure 1, which is a conventional pump 9. The conventional pump 9 has a housing 91 with a liquid injection port 911 and a liquid discharge port 912, the liquid injection port 911 and The liquid discharge port 912 communicates with a liquid flow space 913 in the housing 91, a diversion fan 92 is located in the liquid flow space 913, the diversion fan 92 has a fan frame 921, and the fan frame 921 has a liquid inlet 921a and a liquid outlet 921b, the liquid inlet 921a communicates with the liquid injection port 911, the liquid outlet 921b communicates with the liquid discharge port 912, the guide fan 92 also has a drive assembly 922 and an impeller 923, the drive The assembly 922 and the impeller 923 are located in the fan frame 921. When the conventional pump 9 is operating, the driving assembly 922 drives the impeller 923 to rotate, so that the working fluid can flow into the fan frame 921 from the liquid inlet 921a, and then flow out from the liquid outlet 921b, and finally pass through the housing The drain port 912 of 91 leaves the housing 91.

However, in the above-mentioned conventional pump 9, because the pump 9 relies on electric power to drive the impeller 923 to rotate, it is usually chosen to open an outlet hole in the housing 91 and install a plug ring in the outlet hole. To prevent liquid leakage, make a wire of the drive assembly 922 pass through the plug ring and connect to an external power source; however, the plug ring is usually difficult to form a complete seal with the outlet hole due to tolerances. Do the relevant leak-proof facilities well, it is still easy to cause the liquid to leak out of the housing 91, and the If the plug ring is not fixed and is displaced relative to the outlet hole, the wiring will be easily pulled or squeezed to cause poor contact or breakage; especially for the smaller pump 9, in a small space, It is difficult to assemble the plug ring and the wiring at the exact position of the outlet hole, resulting in inconvenient assembly operations, and the leakage-proof space is smaller, and it is difficult to perform leakage-proof work in the limited space, which affects the pump The driving efficiency of Pu9.

In view of this, the conventional pump does still have to be improved.

In order to solve the above-mentioned problems, the purpose of the present invention is to provide a liquid-cooled heat dissipation system and its pump, which can avoid the leakage of working fluid.

The second objective of the present invention is to provide a liquid-cooled heat dissipation system and its pump, which can reduce the thickness of the overall pump.

Another object of the present invention is to provide a liquid-cooled heat dissipation system and its pump, which can improve the convenience of wiring.

Another object of the present invention is to provide a liquid-cooled heat dissipation system and its pump, which can improve the ease of assembly.

The directionality described in the full text of the present invention or its similar terms, such as "front", "rear", "left", "right", "up (top)", "down (bottom)", "inner", "outer" , "Side", etc., mainly refer to the directions of the attached drawings, and the terms of directionality or similar terms are only used to help explain and understand the embodiments of the present invention, and are not used to limit the present invention.

The elements and components described in the full text of the present invention use the quantifiers "one" or "one" for convenience and to provide the general meaning of the scope of the present invention; in the present invention, it should be construed as including one or at least one, and single The concept of also includes the plural, unless it clearly implies other meanings.

Approximate terms such as "combination", "combination" or "assembly" mentioned in the full text of the present invention mainly include the types that can be separated without destroying the components after being connected, or the components cannot be separated after being connected, which are common knowledge in the field Those can be selected based on the materials of the components to be connected or assembly requirements.

The pump of the present invention is used to drive the flow of non-conductive liquid, including: a circuit board with a circuit unit located inside or/and outside, the circuit unit having an internal circuit located inside, and the circuit board has an insulating substrate , The insulating substrate has a plurality of through holes, the first ends of the plurality of through holes are electrically connected to the plurality of first contact holes of the internal circuit, each through hole is closed by a conductive material, and the circuit unit is electrically connected to the conductive material; An outer cover combined with the circuit board, a liquid flow space is formed between the inside of the outer cover and the inner side of the circuit board, a liquid injection port and a liquid discharge port communicate with the liquid flow space; and a diversion fan located in the liquid flow space Inside, the guide fan has a drive assembly, the drive assembly is electrically connected to the circuit unit, and the drive assembly drives an impeller to rotate.

The pump of the present invention is used to drive the flow of non-conductive liquid, and includes: a circuit board with a circuit unit located inside or/and outside, the circuit unit having an internal circuit located on the inside and an external circuit located on the outside, The internal circuit is electrically connected to the external circuit, the circuit board has an insulating substrate, the insulating substrate has a plurality of through holes, each of the through holes is closed by a conductive material, and the circuit unit is electrically connected to the conductive material; a cover that combines the circuit Board, there is a liquid flow space between the inside of the outer cover and the inner side of the circuit board, a liquid injection port and a liquid discharge port communicate with the liquid flow space; and a diversion fan located in the liquid flow space, the diversion fan There is a driving assembly electrically connected to the circuit unit, and the driving assembly drives an impeller to rotate.

The pump of the present invention is used to drive the flow of non-conductive liquid, including: a circuit board with a circuit unit located inside or/and outside, the circuit board has an insulating substrate, the insulating substrate has a plurality of through holes, each The through hole is closed with a conductive material, the circuit unit is electrically connected to the conductive material; an outer cover, combined with the circuit board, there is a liquid flow space between the inner side of the outer cover and the inner side of the circuit board, and an injection The liquid port communicates with a liquid discharge port in the liquid flow space; and a diversion fan located in the liquid flow space, the diversion fan has a drive assembly, the drive assembly is electrically connected to the circuit unit, and the drive assembly drives an impeller Rotating, the guide fan has a fan frame, the fan frame has a substrate coupled to the inner side of the circuit board, a shaft connection part is connected to the substrate, the drive assembly has a wiring board located on the outer periphery of the shaft connection part, and an electrical port is located The wiring board and the circuit unit are electrically connected to the electrical port.

The pump of the present invention is used to drive the flow of non-conductive liquid, including: a circuit board with a circuit unit located inside or/and outside, the circuit board has an insulating substrate, the insulating substrate has a plurality of through holes, each The through hole is closed with a conductive material, and the circuit unit is electrically connected to the conductive material; a cover, combined with the circuit board, a liquid flow space, a liquid injection port and a liquid discharge port are formed between the inside of the cover and the inner side of the circuit board Communicating with the liquid flow space; and a diversion fan located in the liquid flow space, the diversion fan has a driving assembly, the driving assembly is electrically connected to the circuit unit, the driving assembly drives an impeller to rotate, and the diversion fan has A fan frame, the fan frame has a shaft connection part located inside the circuit board, the drive assembly has a certain sub-coil group and a drive circuit arranged on the circuit board, and the stator coil group is located on the outer periphery of the shaft connection part, the circuit unit The stator coil group and the drive circuit are electrically connected.

The pump of the present invention is used to drive the flow of non-conductive liquid. It includes: a circuit board with a circuit unit located inside or/and outside, the circuit unit has an internal circuit and an external circuit, and the insulating substrate is connected to a circuit board. A copper layer and a lower copper layer, the upper copper layer and the lower copper layer each have a hollow part, the internal circuit is located in the hollow part of the upper copper layer, the external circuit is located in the hollow part of the lower copper layer, the circuit The board has an insulating substrate with a plurality of through holes, each of the through holes is closed with a conductive material, and the circuit unit is electrically connected to the conductive material; a cover is combined with the circuit board, and the inside of the cover is connected to the inside of the circuit board. There is a liquid flow space, a liquid injection port and a liquid discharge port communicate with the liquid flow space; and a diversion fan located in the liquid flow space, the diversion fan has a drive assembly, and the drive assembly is electrically connected to the The circuit unit, the drive assembly drives an impeller to rotate.

The liquid-cooled heat dissipation system of the present invention includes: a pump as described above; a heat absorption unit; A heat dissipation unit; a non-conductive liquid; and a pipe fitting group, which are connected in series with the pump, the heat absorption unit and the heat dissipation unit, so that the non-conductive liquid circulates when the pump is operating.

Accordingly, the liquid-cooled heat dissipation system and its pump of the present invention can be applied to various liquid-cooled heat dissipation systems with pressurization requirements. Each through hole of the circuit board is closed with a conductive material, and the circuit The unit is electrically connected to the conductive material, so that the outer cover does not need to open a wire hole to allow the drive assembly to receive external power, thereby avoiding the leakage of the non-conductive liquid in the liquid flow space, and reducing the manufacturing cost and Improve the overall driving efficiency and other functions. Moreover, the circuit unit can only have the internal circuit located inside the circuit board, and the structure is simple and easy to assemble, and can reduce the axial height of the guide fan, which has the advantages of reducing manufacturing costs, improving assembly convenience, and more The overall pump thickness is reduced, and the internal circuit and the external circuit can be prevented from forming a short circuit with each other.

Wherein, the circuit unit may have an external circuit located outside, the second ends of the plurality of through holes are electrically connected to the plurality of second contact holes of the external circuit, and an electrical connector may be electrically connected to the driving assembly and the external circuit The number of second holes. In this way, the circuit unit can only have the external circuit located outside the circuit board, which has the effect of reducing manufacturing costs.

Wherein, the electrical connector can be electrically connected to an electrical port of the driving assembly and penetrate the through hole. In this way, the driving component can be electrically connected to the external circuit of the circuit board, which has the effect of improving the convenience of assembly.

Wherein, the internal circuit can be electrically connected to an electrical port of the driving component by a conductive member. In this way, the driving component can be electrically connected to the internal circuit of the circuit board, which has the effect of improving the convenience of assembly.

Wherein, each of the through holes is filled with the conductive material, the first ends of the through holes can be electrically connected to the first contact holes of the internal circuit, and the second ends of the through holes can be electrically connected to the external circuit The internal circuit is electrically connected to the external circuit by the first contact holes, the through holes, and the second contact holes. In this way, the system can prevent the non-conductive liquid from passing through the several through holes The effect of leakage.

Wherein, the internal circuit can be electrically connected to the electrical port by a conductive member. In this way, the driving component can be electrically connected to the internal circuit of the circuit board, which has the effect of improving the convenience of assembly.

Wherein, the outer cover can be welded and combined with the circuit board. In this way, the outer cover and the circuit board can be firmly combined, which has the effect of improving the structural strength.

Wherein, the conductive material can be filled with electroplating or solder to close the plurality of through holes. In this way, the conductive material can be easily obtained, and has the effect of reducing the manufacturing cost.

Wherein, the circuit unit may have an external circuit, and the external circuit may have several contact ports. In this way, the plurality of contact ports can be connected to wires, power supplies, input and output signals, etc., which has the effect of improving the convenience of wiring.

Wherein, the plurality of contact ports can be located at the corners or peripheral edges of the circuit board. In this way, the plurality of contact ports can be used as solder joints for soldering connection, which has the effect of improving the convenience of manufacturing and assembly.

Among them, the several contact ports can form a golden finger type. In this way, the system has the effect of improving the convenience of use.

〔this invention〕

1: circuit board

1a: Insulating substrate

1b: Upper copper layer

1c: lower copper layer

101: inside

102: Outside

11: Internal circuit

111: first jack

12: External circuit

12a: Contact port

121: second jack

13: Through hole

131: first end

132: second end

14: hollow part

15: Conductive parts

16: positioning slot

2: outer cover

20: internal

21: Top plate

22: Ring Wall

23: Radial extension

23a: Joint surface

24: Liquid injection port

25: Discharge port

26: Catheter

3: diversion fan

31: fan frame

311: Substrate

312: Shaft joint

313: upper cover

314: Side Wall

315: Liquid Inlet

316: Liquid Outlet

317: Outgoing Channel

32: drive components

321: Wiring board

322: Stator coil group

323: drive circuit

324: Electric Port Department

33: impeller

331: Wheel Hub

332: blade

333: Magnetic parts

4: Heat absorption unit

5: Cooling unit

6: Pipe fitting group

6a: pipe fittings

6b: pipe fittings

6c: pipe fittings

C: Conductive material

H: heat source

J: conductive material

L: circuit unit

N: corner

P: Pump

S: Liquid flow space

U: conductive via

W: Wire

R: electrical connector

X: fixed parts

Y: Buffer insulation

[Traditional]

9: Pump

91: shell

911: Liquid injection port

912: Drain

913: Liquid Flow Space

92: diversion fan

921: fan frame

921a: Liquid inlet

921b: Liquid outlet

922: drive components

923: Impeller

[Figure 1] A sectional view of a conventional pump assembly.

[Figure 2] An exploded perspective view of the pump according to the first embodiment of the present invention.

[Figure 3] A partial exploded perspective view of the circuit board pumped by the first embodiment of the present invention.

[Figure 4] A top view of the pump according to the first embodiment of the present invention.

[Figure 5] A cross-sectional view along the line A-A in Figure 4.

[Figure 6a] A partial enlarged view as shown in Figure 5B.

[Figure 6b] A cross-sectional view of the pump with wires soldered to the inside of the circuit board according to the first embodiment of the present invention.

[Figure 6c] A cross-sectional view of the pump according to the first embodiment of the present invention where the radial extension and the circuit board are sandwiched by the fixing member.

[Figure 7] The present invention includes a structural diagram of the pumped liquid-cooled heat dissipation system according to the first embodiment.

[Figure 8] A sectional view of the pump assembly of the second embodiment of the present invention.

[Figure 9] A sectional view of the pump assembly of the third embodiment of the present invention.

[Figure 10] A sectional view of the pump assembly of the fourth embodiment of the present invention.

[Figure 11] An exploded perspective view of the pump of the fifth embodiment of the present invention.

In order to make the above and other objects, features and advantages of the present invention more comprehensible and understandable, the preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings: Please refer to Figure 2. This is the first embodiment of the pump P of the present invention. It includes a circuit board 1, an outer cover 2 and a guide fan 3. The outer cover 2 is combined with the circuit board 1, and the guide fan 3 is located between the outer cover 2 and the In the space formed by the circuit board 1. Wherein, the pump P can be used to drive a non-conductive liquid to flow (for example, a liquid with good fluidity but not conductive, such as an electronic engineering liquid), and the dielectric strength of the non-conductive liquid is not less than 30 kV.

Please refer to Figures 2 and 3, the circuit board 1 can be, for example, a glass fiber circuit board, an aluminum substrate circuit board, an iron substrate circuit board or a ceramic substrate circuit board, etc. The appearance of the circuit board 1 of the present invention Without limitation, in this embodiment, the circuit board 1 is an FR-4 double-sided copper-clad printed circuit board for illustration. The circuit board 1 has an insulating substrate 1a. The insulating substrate 1a can be made of epoxy resin or glass fiber. The insulating substrate 1a can be connected to an upper copper layer 1b and a lower copper layer 1c to make the circuit board 1. As shown in Figure 3, the upper copper layer 1b, the insulating substrate 1a and the lower copper layer 1c can be connected in order from top to bottom.

In detail, the circuit board 1 has a circuit unit L, and the circuit unit L can have an internal circuit 11 located on the inner side 101 and an external circuit 12 located on the outer side 102; in this embodiment, the internal circuit 11 can be located The upper copper layer 1b and the external circuit 12 may be located on the lower copper layer 1c. Wherein, the insulating substrate 1a has a plurality of through holes 13, and each through hole 13 can be filled with a conductive medium (for example, a through hole liquid or electroplated conductive film on the inner wall of each through hole 13), and then respectively filled A conductive material C closes the first end 131 and the second end 132 of the plurality of through holes 13, and the first ends 131 of the plurality of through holes 13 are electrically connected to the plurality of first contact holes 111 of the internal circuit 11. The second ends 132 of the plurality of through holes 13 are electrically connected to the plurality of second contact holes 121 of the external circuit 12, so that the through holes 13 of the insulating substrate 1a, the first contact holes 111 of the upper copper layer 1b, and the lower copper The second contact hole 121 of the layer 1c can form a conductive hole for the entire electrical connection, and the internal circuit 11 can be electrically connected to the plurality of first contact holes 111, the plurality of through holes 13 and the plurality of second contact holes 121 The external circuit 12 further electrically connects the internal circuit 11 to the external circuit 12; that is, a printed circuit board is used as the circuit board 1 of the pump P of the present invention. Preferably, the conductive material C can be filled with electroplating or the plurality of through holes 13 can be sealed with solder, for example.

Please refer to Figures 3 and 5. It is particularly noted that the external circuit 12 can be used to connect a wire W, the external circuit 12 can have several contact ports 12a, and the several contact ports 12a can be connected to wires, Power, input and output signals, etc., to provide power or signals required for the operation of the pump P; in addition, the plurality of contact ports 12a can also be formed in the form of golden fingers. In addition, the upper copper layer 1b and the lower copper layer 1c may each have a hollow part 14, the internal circuit 11 may be located in the hollow part 14 of the upper copper layer 1b, and the external circuit 12 may be located in the hollow part 14 of the lower copper layer 1c. In the hollow portion 14; in this way, it is possible to prevent the internal circuit 11 and the external circuit 12 from forming a short circuit with each other. In addition, the circuit board 1 may have a conductive member 15, and the conductive member 15 may be located on the upper copper layer 1 b and electrically connected to the internal circuit 11.

Please refer to Figures 2 and 5, the outer cover 2 can be a rectangle with an open lower end The housing, that is, the outer cover 2 may have a top plate 21, the circumferential edge of the top plate 21 is connected to a ring wall 22, a radially extending portion 23 of the outer cover 2 is connected to the ring wall 22, and the radially extending portion 23 may have a The bonding surface 23a faces the circuit board 1; in this way, the circuit board 1 can be connected to the bonding surface 23a of the radial extension 23, and the opening formed by the bottom end of the ring wall 22 can be closed, so that the inside 20 of the outer cover 2 can be closed. There is a liquid flow space S between the inner side 101 of the circuit board 1 and the circuit board 1. Wherein, the radial extension 23 and the circuit board 1 can be sandwiched by a fixing member X as shown in FIG. 6c. The fixing member X can be a C-shape formed by a plastic or metal material, so that the The fixing member X can be clamped around or on opposite sides of the junction between the radial extension 23 and the circuit board 1; preferably, when the fixing member X is made of a metal material, the radial extension 23, the A buffer insulating member Y can also be provided between the circuit board 1 and the fixing member X to improve the bonding tightness. More preferably, the outer cover 2 can be welded and combined with the circuit board 1, for example, laser welding, argon arc welding, or tin welding; in this embodiment, the coupling surface 23a of the radial extension 23 can be selected to be laser welded (for example, : Penetration welding) to combine the upper copper layer 1b of the circuit board 1 to improve the bonding adhesion and structural strength.

The outer cover 2 may have a liquid injection port 24 and a liquid discharge port 25. The liquid injection port 24 communicates with the liquid discharge port 25 between the liquid flow space S and the outside. The liquid injection port 24 is for the inflow of non-conductive liquid. The liquid port 25 is for draining the non-conductive liquid. The liquid injection port 24 and the liquid discharge port 25 can be selected at the same end of the ring wall 22; preferably, as shown in the figure, the liquid injection port 24 and the port of the two pipes 26 connecting the ring wall 22 can be formed. The liquid discharge port 25 and the two conduits 26 can be integrally formed and connected with the ring wall 22, or can be assembled and combined with the ring wall 22 in a liquid-tight manner.

Please refer to Figures 2, 4, and 5, the guide fan 3 is located in the liquid flow space S, the guide fan 3 may have a fan frame 31, and the fan frame 31 may have a base plate 311 and a shaft connection portion 312. The substrate 311 may be made of insulating material. The substrate 311 may be located on the inner side 101 of the circuit board 1 (that is, located on the upper copper layer 1b of the circuit board 1); After the upper copper layer 1b of the substrate 311 is etched and removed, the substrate 311 is then bonded to the insulating substrate 1a Above, the shaft connecting portion 312 is connected to the substrate 311. The fan frame 31 may have an upper cover 313 and a side wall 314, the side wall 314 is connected to the circumferential edge of the upper cover 313, the side wall 314 is located on the outer periphery of the shaft connection portion 312, the fan frame 31 may also have a liquid inlet The liquid inlet 315 is located on the upper cover 313 and the liquid outlet 316 is located on the side wall 314. The liquid inlet 315 and the liquid outlet 316 can communicate with the liquid flow space S, The liquid inlet 315 is for the non-conductive liquid to flow in, and the liquid outlet 316 is for the non-conductive liquid to drain out.

Please refer to FIG. 5, the guide fan 3 has a driving assembly 32, and the driving assembly 32 is located in the fan frame 31. In detail, the driving assembly 32 may have a wiring board 321 and a certain sub-coil group 322, the wiring board 321 is located on the outer periphery of the shaft connection portion 312, the wiring board 321 abuts on the substrate 311, and the stator coil group 322 Preferably, wiring is formed on the wiring board 321 to reduce the axial height. The driving assembly 32 may have a driving circuit 323 which is located on the wiring board 321; in this way, the The components can be pre-assembled. When assembling the pump P, the fan frame 31 can be assembled into the predetermined position of the circuit board 1 by alignment.

Please refer to Figures 5 and 6a, an electrical port portion 324 of the driving component 32 can be located on the wiring board 321, the electrical port portion 324 can face the circuit board 1, and the internal circuit 11 of the circuit board 1 can be The conductive member 15 is electrically connected to the electrical port portion 324, so that the internal circuit 11 is electrically connected to the electrical port portion 324, so that the driving component 32 is electrically connected to the internal circuit 11 of the circuit board 1. In this embodiment, the conductive The member 15 is illustrated by a conductive spring sheet. In other embodiments, the conductive member 15 may also be a conductive wire, a conductive pin or a socket to electrically connect the driving component 32 to the internal circuit 11. The present invention does not Be restricted. In addition, since the working liquid flowing through the liquid flow space S is non-conductive liquid when the pump P is operating, the driving component 32 can be selected without water-proof treatment, which will not only prevent short-circuit conditions, but also reduce manufacturing cost.

Please refer to Figures 4 and 5, the guide fan 3 has an impeller 33, the impeller 33 is driven by the drive assembly 32 to rotate, so that the non-conductive liquid can flow into the fan frame from the liquid inlet 315 31, and then flow out from the liquid outlet 316. The impeller 33 may have a hub 331 and a plurality of blades 332, the plurality of blades 332 are connected to the outer periphery of the hub 331, and a magnetic member 333 of the impeller 33 is connected to the hub 331 and faces the stator coil assembly 322. After the drive assembly 32 is energized, the magnetic field generated by the stator coil assembly 322 can magnetically repel the magnetic member 333, thereby pushing the hub 331 to drive the plurality of blades 332 to rotate synchronously, so that non-conductive liquid can pass through the liquid inlet 315 flows into the fan frame 31, and then flows out from the liquid outlet 316.

Please refer to Figures 5 and 6a. According to the aforementioned structure, since the pump P relies on electric power to drive the impeller 33 to rotate, the drive assembly 32 must receive an external power source or a control signal, because the internal circuit 11 can The conductive material C in each through hole 13 is electrically connected to the external circuit 12, and the external circuit 12 can be connected to the external power source or the control signal by welding the wire W. The external power source or the control signal is The driving component 32 can be powered through the external circuit 12 and the internal circuit 11 to provide power and control signals required for the operation of the pump P; among them, it can also be selected on the circuit board 1 as shown in Fig. 6b A conductive through hole U is opened, and the wire W is soldered to the inner side 101 of the circuit board 1, wherein the conductive through hole U can be filled with a conductive material J. In this way, the wire W can be electrically connected to the external circuit 12. It is possible to further prevent the wire W from being easily squeezed due to being directly connected to the lower copper layer 1c. In this way, the outer cover 2 does not need to open a wire hole for wiring to extend to the outside as in the conventional technology, and when the circuit board 1 and the outer cover 2 are assembled, the circuit board 1 and the outer cover 2 can be closely combined, which can avoid The non-conductive liquid in the liquid flow space S leaks out.

In addition, it should be noted that since the conductive material C is filled with the plurality of through holes 13, the leakage of the non-conductive liquid from the plurality of through holes 13 can be prevented.

Please refer to Figure 7, which is a preferred embodiment of the liquid-cooled heat dissipation system of the present invention, which includes the aforementioned pump P, a heat absorption unit 4, a heat dissipation unit 5, and a pipe fitting group 6. The pipe fittings The group 6 connects the pump P, the heat absorption unit 4 and the heat dissipation unit 5.

Please refer to Figures 2 and 7, in detail, the pipe fitting group 6 can penetrate the liquid injection port 24 of the outer cover 2, and the pipe fitting group 6 can connect the pump P and the heat absorption unit 4 by a pipe fitting 6a. The heat absorption unit 4 can be attached to a heat source H of an electronic device, for example; the pipe fitting group 6 can also be connected to the pump P and the heat dissipation unit 5 by a pipe 6b, and then connected to the heat absorption unit 4 and the heat dissipation unit 5 by a pipe 6c. The heat dissipation unit 5; the pump P and the pipe fitting group 6 contain non-conductive liquid. Accordingly, the non-conductive liquid in the pipe assembly 6 and located at the heat absorption unit 4 can absorb heat energy to increase the temperature, and is guided to the heat dissipation unit 5 by the operation of the pump P, so as to pass through the heat dissipation unit 5 When the temperature is lowered, the temperature is lowered, and after the temperature is lowered, it is guided to the heat absorption unit 4 again; in this way, the temperature of the heat source H can be effectively lowered.

Wherein, the present invention does not limit the types of the heat absorption unit 4 and the heat dissipation unit 5, nor does it limit the circulation direction of the non-conductive liquid; that is, the non-conductive liquid after the temperature rises can flow through the pump P and then be directed to the The heat dissipation unit 5 (circulates in a clockwise direction as shown in FIG. 7) or reverse circulation, so that the cooled non-conductive liquid flows through the pump P and then is directed to the heat absorption unit 4.

Please refer to Figures 4 and 7, according to the aforementioned structure, when the liquid-cooled heat dissipation system with the pump P of this embodiment operates, the non-conductive liquid located at the heat absorption unit 4 can absorb heat energy, so that the non-conductive liquid The temperature rises. When the pump P is operating, by discharging the non-conductive liquid originally in the liquid flow space S, the liquid flow space S can form a negative pressure to introduce the high-temperature non-conductive liquid from the heat absorption unit 4; The conductive liquid flows into the liquid injection port 24 of the outer cover 2, and can flow into the fan frame 31 through the liquid inlet 315 of the guide fan 3, pressurized by the impeller 33, and then from the liquid outlet 316 of the guide fan 3 It flows out, and finally leaves the liquid flow space S through the liquid discharge port 25 of the outer cover 2 and is guided to the heat dissipation unit 5. The high-temperature non-conducting liquid can cool down when passing through the heat dissipation unit 5, and then be guided to the heat absorption unit 4 again after cooling; in this way, the heat source H at the heat absorption unit 4 can effectively cool down.

Please refer to Figure 8, which is the second embodiment of the pump P of the present invention. The circuit The board 1 may have a positioning groove 16 facing the top plate 21 of the cover 2, and the shaft connection portion 312 may be located in the positioning groove 16, so that the shaft connection portion 312 can protrude from the inner side 101 of the circuit board 1, It can be more helpful to reduce the axial height of the guide fan 3. Wherein, when the shaft connection portion 312 is combined with the circuit board 1, if the upper copper layer 1b is laid around the shaft connection portion 312, the shaft connection portion 312 can be combined with the circuit board 1 by lightning welding, bonding or tight fitting; If the upper copper layer 1b is not laid around the shaft connection portion 312, the shaft connection portion 312 can be bonded or tightly combined with the circuit board 1. Preferably, the shaft connection portion 312 can be connected to the circuit board 1 The upper copper layer 1b or the lower copper layer 1c is combined by lightning welding to improve the bonding tightness. In addition, the driving circuit 323 is located on the circuit board 1, the driving circuit 323 can also be formed by the upper copper layer 1b, the driving circuit 323 can be electrically connected to the stator coil group 322, and the stator coil group 322 and the The internal circuit 11 of the circuit board 1 is electrically connected, so that the driving component 32 can be electrically connected to the internal circuit 11, thereby providing another configuration method. The circuit board 1 can also be used as the wiring board 321 of the driving component 32 (marked in the section 5), it has the function of both the circuit board 1 and the driving circuit 323.

Please refer to Figure 9, which is the third embodiment of the pump P of the present invention. The circuit unit L is only located on the inner side 101 of the circuit board 1, meaning that the insulating substrate 1a can only be connected to the upper copper layer 1b, the internal circuit 11 of the circuit unit L may be located on the upper copper layer 1b. In detail, conductive materials such as conductive wires, sockets or pins can be used to electrically connect the first ends 131 of the plurality of through holes 13; in this embodiment, the wires W are used to electrically connect the plurality of through holes 13 For illustration, the wire W can be electrically connected to the first contact hole 111 of the internal circuit 11, and the internal circuit 11 can be electrically connected to the electrical port 324 of the driving component 32 through the conductive member 15. The internal circuit 11 can be electrically connected to the electrical port portion 324, and the driving component 32 can be electrically connected to the internal circuit 11; in this embodiment, the conductive element 15 is illustrated by a conductive elastic sheet, and in other implementations In an example, the conductive member 15 can also be a conductive wire, a conductive pin or a socket to electrically connect the driving component 32 to the internal circuit 11, and the present invention is not limited. Next, make the wire W pass through the through holes 13 After the second end 132 passes out, it is connected to the external power source or the control signal. In this way, the circuit unit L can only have the internal circuit 11 located on the inner side 101 of the circuit board 1, which can further reduce the manufacturing cost.

Please refer to Figure 10, which is the fourth embodiment of the pump P of the present invention. The circuit unit L is only located on the outer side 102 of the circuit board 1, which means that the insulating substrate 1a can only be connected with the lower copper layer 1c, the external circuit 12 of the circuit unit L may be located on the lower copper layer 1c, and an electrical connector R is used to electrically connect the driving component 32 and the external circuit 12. In detail, the electrical connector R can be a conductive material such as a conductive wire, a socket, or a wiper. In this embodiment, the electrical connector R is illustrated by a conductive wire. The electrical connector R can be electrically connected to the electrical port portion 324 of the driving assembly 32, and after passing through an outlet channel 317 of the fan frame 31 and the through hole 13, then electrically connect to the second ends of the plurality of through holes 13 132. The electrical connector R can be electrically connected to the plurality of second contact holes 121 of the external circuit 12, so that the driving component 32 can be electrically connected to the external circuit 12; in this way, the wire W is electrically connected to the circuit unit The external circuit 12 of L can connect the wire W to the external power supply or the control signal, and in other embodiments, it can also connect the contact ports 12a of the external circuit 12 (marked in Figure 3) It forms a golden finger type and is directly electrically connected to the external power source or the control signal. In this way, the circuit unit L can only have the external circuit 12 located on the outer side 102 of the circuit board 1, which can further reduce the manufacturing cost.

Please refer to Fig. 11, which is the fifth embodiment of the pump P of the present invention. The contact ports 12a of the external circuit 12 can be located at the corners N of the circuit board 1, or can also be located at the corners N of the circuit board 1. The periphery of the circuit board 1; in this embodiment, the several contact ports 12a are respectively located at the four corners of the circuit board 1; in this way, the several contact ports can be used as solder joints for soldering and joining, The convenience of manufacturing and assembly can be improved.

In summary, the liquid-cooled heat dissipation system and its pump of the present invention can be applied to liquid-cooled heat dissipation systems with various pressure requirements. The through holes of the circuit board are sealed with conductive materials. And the circuit unit is electrically connected to the conductive material, so that the outer cover does not need to open a wire hole to allow the drive assembly to receive external power, thereby avoiding the leakage of non-conductive liquid in the liquid flow space. It has the functions of reducing manufacturing costs and improving overall driving performance.

Although the present invention has been disclosed using the above-mentioned preferred embodiments, it is not intended to limit the present invention. Anyone who is familiar with the art without departing from the spirit and scope of the present invention may make various changes and modifications relative to the above-mentioned embodiments. The technical scope of the invention is protected. Therefore, the scope of protection of the invention shall be subject to the scope of the attached patent application.

1: circuit board

1a: Insulating substrate

1b: Upper copper layer

1c: lower copper layer

101: inside

102: Outside

11: Internal circuit

111: first jack

12: External circuit

121: second jack

13: Through hole

131: first end

132: second end

15: Conductive parts

2: outer cover

21: Top plate

22: Ring Wall

23: Radial extension

23a: Joint surface

24: Liquid injection port

26: Catheter

3: diversion fan

31: fan frame

311: Substrate

312: Shaft joint

313: upper cover

314: Side Wall

315: Liquid Inlet

32: drive components

321: Wiring board

322: Stator coil group

323: drive circuit

324: Electric Port Department

33: impeller

331: Wheel Hub

332: blade

333: Magnetic parts

C: Conductive material

L: circuit unit

P: Pump

S: Liquid flow space

W: Wire

Claims (16)

A pump for driving non-conductive liquid to flow, comprising: a circuit board with a circuit unit located inside or/and outside, the circuit unit having an internal circuit located at the inside, the circuit board having an insulating substrate, the The insulating substrate has a plurality of through holes, the first ends of the plurality of through holes are electrically connected to the plurality of first contact holes of the internal circuit, each of the through holes is closed by a conductive material, and the circuit unit is electrically connected to the conductive material; a cover , Combined with the circuit board, there is a liquid flow space between the inside of the cover and the inner side of the circuit board, a liquid injection port and a liquid discharge port communicate with the liquid flow space; and a diversion fan located in the liquid flow space, The guide fan has a drive assembly which is electrically connected to the circuit unit, and the drive assembly drives an impeller to rotate. Such as the pump of claim 1, wherein the circuit unit has an external circuit located outside, the second ends of the plurality of through holes are electrically connected to the plurality of second contact holes of the external circuit, and an electrical connector is electrically connected to the A plurality of second contact holes of the driving component and the external circuit. Such as the pump of claim 2, wherein the electrical connector is electrically connected to an electrical port of the driving assembly and penetrates the through hole. Such as the pump of claim 1, wherein the conductive material is filled with electroplating or the plurality of through holes are sealed with solder. Such as the pump of claim 1, wherein the internal circuit is electrically connected to an electrical port of the driving component by a conductive member. A pump for driving non-conductive liquid to flow, comprising: a circuit board with a circuit unit located inside or/and outside, the circuit unit having an inner circuit located on the inner side and an external circuit located on the outer side, the inner The circuit is electrically connected to the external circuit, the circuit board has an insulating substrate, the insulating substrate has a plurality of through holes, each of the through holes is closed by a conductive material, and the circuit unit is electrically connected to the conductive material; An outer cover combined with the circuit board, a liquid flow space is formed between the inside of the outer cover and the inner side of the circuit board, a liquid injection port and a liquid discharge port communicate with the liquid flow space; and a diversion fan located in the liquid flow space Inside, the guide fan has a drive assembly, the drive assembly is electrically connected to the circuit unit, and the drive assembly drives an impeller to rotate. Such as the pump of claim 6, wherein each of the through holes is filled with the conductive material, the first ends of the plurality of through holes are electrically connected to the plurality of first contact holes of the internal circuit, and the second ends of the plurality of through holes are electrically connected to the first contact holes of the internal circuit. The terminal is electrically connected to a plurality of second contact holes of the external circuit, and the internal circuit is electrically connected to the external circuit through the plurality of first contact holes, the plurality of through holes, and the plurality of second contact holes. Such as the pump of claim 7, wherein the internal circuit is electrically connected to an electrical port of the driving component by a conductive member. Such as the pump of claim 1 or 6, wherein the outer cover is welded and combined with the circuit board. A pump for driving non-conductive liquid to flow, comprising: a circuit board with a circuit unit located inside or/and outside, the circuit board having an insulating substrate, the insulating substrate having a plurality of through holes, each of which penetrates The hole is closed with a conductive material, and the circuit unit is electrically connected to the conductive material; a cover is combined with the circuit board, there is a liquid flow space between the inside of the cover and the inner side of the circuit board, and a liquid injection port is connected to a liquid discharge port. A liquid flow space; and a guide fan located in the liquid flow space, the guide fan has a drive assembly that is electrically connected to the circuit unit, the drive assembly drives an impeller to rotate, and the guide fan has a fan Frame, the fan frame has a substrate coupled to the inside of the circuit board, a shaft connection portion is connected to the substrate, the drive assembly has a wiring board located on the outer periphery of the shaft connection portion, an electrical port portion located on the wiring board, and the circuit unit is electrically connected The electric port department. A pump for driving non-conductive liquid to flow, comprising: a circuit board with a circuit unit located inside or/and outside, the circuit board having an insulating base The insulating substrate has a plurality of through holes, each of the through holes is closed by a conductive material, and the circuit unit is electrically connected to the conductive material; an outer cover is combined with the circuit board, and there is a liquid between the inner side of the outer cover and the inner side of the circuit board. Flow space, a liquid injection port and a liquid discharge port are connected to the liquid flow space; and a diversion fan located in the liquid flow space, the diversion fan has a drive assembly, the drive assembly is electrically connected to the circuit unit, the The drive assembly drives an impeller to rotate, the guide fan has a fan frame, the fan frame has a shaft joint located inside the circuit board, the drive assembly has a certain sub-coil group and a drive circuit arranged on the circuit board, and the stator The coil group is located on the outer periphery of the shaft connection part, and the circuit unit is electrically connected to the stator coil group and the drive circuit. A pump for driving non-conductive liquid to flow, comprising: a circuit board with a circuit unit located inside or/and outside, the circuit unit having an internal circuit and an external circuit, and the insulating substrate is connected to an upper copper layer And a lower copper layer, the upper copper layer and the lower copper layer each have a hollow portion, the internal circuit is located in the hollow portion of the upper copper layer, the external circuit is located in the hollow portion of the lower copper layer, and the circuit board has An insulating substrate, the insulating substrate having a plurality of through holes, each of the through holes is closed with a conductive material, the circuit unit is electrically connected to the conductive material; a cover, combined with the circuit board, between the cover and the circuit board inside A liquid flow space, a liquid injection port and a liquid discharge port are connected to the liquid flow space; and a diversion fan located in the liquid flow space, the diversion fan has a drive assembly, and the drive assembly is electrically connected to the circuit unit , The drive assembly drives an impeller to rotate. Such as the pump of claim 12, wherein the external circuit has several contact ports. Such as the pump of claim 13, wherein the plurality of contact ports are located at the corners or peripheral edges of the circuit board. Such as the pump of claim 13, wherein the plurality of contact ports form a golden finger type. A liquid-cooled heat dissipation system, comprising: a pump as in any one of claims 1 to 15; a heat absorption unit; a heat dissipation unit; a non-conductive liquid; and a pipe fitting group connected in series with the pump and the heat absorption unit The unit and the heat dissipation unit are used to circulate the non-conductive liquid when the pump is operating.

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