TWI722811B - Inspection device - Google Patents

Abstract

An object of the present invention is to accurately inspect bandpass characteristics of electronic components. A first signal line pattern 210 has one end electrically connected to a first connector 212. A second signal line pattern 220 has one end electrically connected to a second connector 222. The second signal line pattern 220 has the other end facing the other end of the first signal line pattern 210. A conductive block 100 has a convex portion 106. The convex portion 106 of the conductive block 100 is electrically connected to a third part of a conductive pattern 230 positioned between the other end of the first signal line pattern 210 and the other end of the second signal line pattern 220 of a wiring board 200.

Description

Check the device

The invention relates to an inspection device.

In recent years, for example, as described in Patent Document 1, an inspection device for inspecting electronic components, for example, an inspection device for inspecting high-frequency components such as SAW (Surface Acoustic Wave) filters, has been developed. This inspection device includes a wiring board on which a transmission path is formed. The terminal of the electronic component is electrically connected to the transmission path of the wiring board.

In Patent Document 2, an example of an inspection socket used for inspecting electronic parts (for example, an integrated circuit (IC)) is described. Check that the electrical noise of the socket shields the body and multiple signal probes. Each signal probe is inserted into the hole formed in the noise shielding body. Both ends of each signal probe are exposed from the noise shielding body. Noise shielding This system has a noise blocking wall between one end of each of the adjacent signal probes.

[Prior Technical Literature]

[Patent Literature]

Patent Document 1: Japanese Patent Application Publication No. 2007-85801

Patent Document 2: Japanese Special Form No. 2018-529951

In the inspection device for inspecting electronic parts, there is a requirement to mount electronic parts on conductive or resin blocks (such as metal sockets) mounted on the wiring board, and to correctly inspect the tape of the electronic parts Pass (band pass) characteristics of the situation. For example, Patent Document 1 does not describe mounting a conductive or resin block on a wiring board. Patent Document 2 does not describe how each signal probe of the noise shielding body is connected to the wiring board.

An example of the object of the present invention is to accurately check the bandpass characteristics of electronic components. Another object of the present invention can be more clearly understood from the description of this specification.

One aspect of the present invention is an inspection device for inspecting electronic parts; the inspection device includes:

The wiring board has: a first signal line pattern, one end of which is electrically connected to a first connector; a second signal line pattern, one end of which is electrically connected to the second connector, and the other end is connected to the aforementioned first signal The other end of the line pattern is opposite; and the conductive pattern includes a first portion located on both sides of the first signal line pattern, a second portion located on both sides of the second signal line pattern, and a conductive pattern located on both sides of the first signal The third portion between the other end of the line pattern and the other end of the second signal line pattern; and

The inspection socket has: a conductive block, which is located on the wiring board, and is used for mounting the electronic components: the first signal probe is inserted into the first hole formed in the conductive block, and the wiring The first signal line pattern of the substrate is electrically connected to the first signal terminal of the electronic component; the second The signal probe is inserted into the second hole formed in the conductive block to electrically connect the second signal line pattern of the wiring substrate to the second signal terminal of the electronic component; and the ground probe is Insert into the ground hole formed in the conductive block, and electrically connect the conductive pattern of the wiring board to the ground terminal of the electronic component;

The conductive block system includes a convex portion electrically connected to the third portion of the conductive pattern.

According to one aspect of the present invention, the bandpass characteristics of electronic components can be checked correctly.

10: Check the socket

20: Check the device

100: Conductive block

102: The first side

102a: recess

104: second side

104a: The first area

104b: second area

106: Convex

110: The first signal probe

112: first hole

114: Insulator

120: second signal probe

122: second hole

124: Insulator

130: Ground Probe

132: Grounding hole

140: Dielectric component

142: Hole

150: Insulation sheet

200: Wiring board

206: holding part

210: The first signal line pattern

212: first connector

220: The second signal line pattern

222: second connector

230: Conductive pattern

240: Ground plane

250: insulating layer

252: pilot hole

300: electronic parts

302: The third side

304: The fourth side

310: The first signal terminal

320: second signal terminal

330: Ground terminal

350: Die

352: Bottom

360: package body

d: distance

g: distance

h: height

Fig. 1 is a perspective view of the inspection device of the first embodiment.

Figure 2 is an enlarged view of the inspection socket shown in Figure 1.

Figure 3 is a diagram after removing the inspection socket from Figure 2.

Fig. 4 is a diagram for explaining an example of a method of mounting electronic components on a conductive block.

Fig. 5 is a diagram showing a modification of Fig. 4.

Fig. 6 is a diagram showing a modification of Fig. 2.

Figure 7 is a graph showing the frequency characteristics of each of the inspection device of the implementation type, the inspection device of the comparison type, and the inspection device of the reference type.

Figure 8 is a graph showing the frequency characteristics of different distances d for the inspection device of the implementation type.

Fig. 9 is a graph showing the reflection loss of each of the inspection device of the implementation type, the inspection device of the comparison type, and the inspection device of the reference type.

The following figures are used to illustrate the implementation of the present invention. In addition, in all the drawings, the same reference numerals are given to the same constituent elements, and the description is appropriately omitted.

Fig. 1 is a perspective view of an inspection device 20 of an implementation type. Figure 2 is an enlarged view of the inspection socket 10 shown in Figure 1. In FIG. 2, the structure in the conductive block 100 is drawn with a broken line. Fig. 3 is a diagram after the inspection socket 10 is removed from Fig. 2. In Figures 1 to 3, the X direction indicates the longitudinal direction of the inspection device 20 (especially the wiring board 200), the Y direction indicates the width direction of the inspection device 20 (especially the wiring board 200), and the Z direction indicates the inspection The height direction of the device 20.

Hereinafter, the outline of the inspection device 20 will be described using FIGS. 1 to 3. The inspection device 20 is a device for inspecting the electronic component 300. The inspection device 20 includes an inspection socket 10, a wiring board 200, a first connector 212, and a second connector 222. The wiring substrate 200 has a first signal line pattern 210, a second signal line pattern 220, and a conductive pattern 230. One end of the first signal line pattern 210 is electrically connected to the first connector 212. One end of the second signal line pattern 220 is electrically connected to the second connector 222. The other end of the second signal line pattern 220 is opposite to the other end of the first signal line pattern 210. The conductive pattern 230 includes: a first part, which is located on both sides of the first signal line pattern 210 in the Y direction; a second part, which is located on both sides of the second signal line pattern 220 in the Y direction; and a third part, which is located Between the other end of the first signal line pattern 210 and the other end of the second signal line pattern 220. The inspection socket 10 has: a conductive block 100, a first signal probe 110, a second signal probe 120, a ground probe 130, and a dielectric member 140. The conductive block 100 is located on the wiring board 200. The conductive block 100 is for mounting electronic components 300. The first signal probe 110 is inserted into the first hole 112 formed in the conductive block 100 to electrically connect the first signal line pattern 210 of the wiring substrate 200 to the electronic zero. The first signal terminal 310 of the component 300. The second signal probe 120 is inserted into the second hole 122 formed in the conductive block 100 to electrically connect the second signal line pattern 220 of the wiring substrate 200 to the second signal terminal 320 of the electronic component 300. The ground probe 130 is inserted into the ground hole 132 formed in the conductive block 100 to electrically connect the conductive pattern 230 of the wiring substrate 200 to the ground terminal 330 of the electronic component 300. The conductive block 100 includes a convex portion 106 protruding in the Z direction. The convex portion 106 of the conductive block 100 is electrically connected to the conductive pattern 230 between the other end of the first signal line pattern 210 of the wiring substrate 200 and the other end of the second signal line pattern 220 the third part.

According to this embodiment, the bandpass characteristics of the electronic component 300 can be checked correctly. Specifically, when there is no convex portion 106 of the conductive block 100, the amount of electrical coupling between the first signal line pattern 210 and the second signal line pattern 220 of the wiring substrate 200 increases, and the inspection device 20 is affected (for example, In the inspection of the electronic component 300 performed by the inspection device 20, the signal strength of the blocking band becomes higher). In view of this point, in this embodiment, the amount of electrical coupling between the first signal line pattern 210 and the second signal line pattern 220 is suppressed by the convex portion 106 of the conductive block 100 to allow inspection of electronic components. The amount of the bandpass characteristic. Therefore, the bandpass characteristics of the electronic component 300 can be checked correctly.

Hereinafter, the details of the wiring board 200 will be described in detail using FIGS. 1 to 3.

The first signal line pattern 210, the second signal line pattern 220, and the conductive pattern 230 are physically separated from each other.

In the examples shown in FIGS. 1 to 3, the wiring board 200 extends in one direction (the X direction in FIG. 1). Each of the first signal line pattern 210 and the second signal line pattern 220 extends in the one direction and is arranged in the one direction. As described above, the conductive pattern 230 includes: portions located on both sides of the first signal line pattern 210 in the Y direction; portions located on both sides of the second signal line pattern 220 in the Y direction; and portions located on the first signal line pattern 210 The other end and the second signal line pattern 220 The part between the above-mentioned other end. However, the shapes of the first signal line pattern 210, the second signal line pattern 220, and the conductive pattern 230 are not limited to the examples shown in FIGS. 1 to 3.

The first signal line pattern 210, the second signal line pattern 220, and the conductive pattern 230 are composed of a conductive body. This conductive system is, for example, a metal (for example, copper).

At one end of the wiring board 200, a first connector 212 is mounted, and at the other end of the wiring board 200, a second connector 222 is mounted. The first connector 212 is electrically connected to the first signal line pattern 210, and the second connector 222 is electrically connected to the second signal line pattern 220. The first connector 212 and the second connector 222 are connected to a measuring device (not shown). Each of the first connector 212 and the second connector 222 is, for example, a coaxial connector.

Hereinafter, the details of the inspection socket 10 are explained using Figs. 1 to 3.

The conductive block 100 includes a first surface 102 (upper surface) and a second surface 104 (lower surface). The electronic component 300 is mounted on the first surface 102 of the conductive block 100. The second surface 104 of the conductive block 100 is located on the opposite side of the first surface 102 in the Z direction. The second surface 104 includes a first area 104a and a second area 104b. The convex portion 106 is located between the first area 104 a and the second area 104 b and protrudes toward the opposite side of the first surface 102. The width of the convex portion 106 in the X direction (Figure 1) can be widened. The wider the width of the convex portion 106 in the X direction (Figure 1), the more the convex portion 106 can reduce the amount of electrical coupling between the first signal line pattern 210 and the second signal line pattern 220 of the wiring substrate 200.

The conductive block 100 is, for example, a metal block, and more specifically, it can be, for example, a gold-plated brass block.

The first signal probe 110 is inserted into the first hole 112 formed in the conductive block 100 from the first area 104 a of the second surface 104 toward the opposite portion of the first area 104 a of the first surface 102 in the Z direction. Furthermore, the first signal probe 110 is an insulator embedded in the first hole 112 114 kept. The first signal probe 110 and the first hole 112 have a coaxial structure. One end (lower end) of the first signal probe 110 is connected to the first signal line pattern 210 of the wiring substrate 200, and the other end (upper end) of the first signal probe 110 is connected to the first signal terminal 310 of the electronic component 300 . Specifically, one end (lower end) of the first signal probe 110 can be made to contact the first signal line pattern 210 of the wiring substrate 200, and the other end (upper end) of the first signal probe 110 can be made to contact The first signal terminal 310 of the electronic component 300 is contacted. The first signal probe 110 includes an elastic body (such as a spring) for elastically moving at least one of the two ends of the first signal probe 110.

The second signal probe 120 is inserted into the second hole 122 formed in the conductive block 100 from the second area 104b of the second surface 104 toward the opposite part of the second area 104b of the first surface 102 in the Z direction. Furthermore, the second signal probe 120 is held by the insulator 124 embedded in the second hole 122. The second signal probe 120 and the second hole 122 have a coaxial structure. One end (lower end) of the second signal probe 120 is connected to the second signal line pattern 220 of the wiring substrate 200, and the other end (upper end) of the second signal probe 120 is connected to the second signal terminal 320 of the electronic component 300 . Specifically, one end (lower end) of the second signal probe 120 can be made to contact the second signal line pattern 220 of the wiring substrate 200, and the other end (upper end) of the second signal probe 120 can be made to contact The second signal terminal 320 of the electronic component 300 is contacted. The second signal probe 120 includes an elastic body (such as a spring) for elastically moving at least one of the two ends of the second signal probe 120.

On the first surface 102 (upper surface) side of the conductive block 100, two recesses 102a are formed. One end (upper end) of the first signal probe 110 protrudes from the bottom surface of one recess 102a, and one end (upper end) of the second signal probe 120 protrudes from the bottom surface of the other recess 102a. By configuring in this way, the first signal terminal 310 and the second signal terminal 320 of the electronic component 300 can be prevented from being short-circuited with the conductive block 100. The arrangement of the recesses 102a is not limited to the example shown in Fig. 2. For example, the 2nd The two recesses 102a shown in the figure can be connected to each other. Furthermore, only one end (upper end) of one of the first signal probe 110 and the second signal probe 120 may protrude from the concave portion 102a.

In the example shown in FIG. 2, each of the plurality of ground probes 130 is inserted into each of the plurality of ground holes 132 formed in the conductive block 100. Especially in the example shown in FIG. 2, two ground probes 130 are located on both sides of the first signal probe 110, and two ground probes 130 are located on both sides of the second signal probe 120. However, the arrangement of the ground probe 130 is not limited to the example shown in FIG. 2. One end of the ground probe 130 is connected to the conductive pattern 230 of the wiring board 200, and the other end of the ground probe 130 is connected to the ground terminal 330 of the electronic component 300. Specifically, one end of the ground probe 130 can be made to contact the conductive pattern 230 of the wiring substrate 200, and the other end of the ground probe 130 can be made to contact the ground terminal 330 of the electronic component 300. The outer surface of the ground probe 130 can contact the inner surface of the ground hole 132. The ground probe 130 includes an elastic body (such as a spring) for elastically moving at least one of the two ends of the ground probe 130.

In the example shown in FIG. 2, two dielectric members 140 are arranged on both sides of the convex portion 106 of the conductive block 100. Each of the first signal probe 110 and the two ground probes 130 on both sides of the first signal probe 110 is inserted into each of the three holding holes 142 of the dielectric member 140 formed on one side. The second signal probe 120 and the two ground probes 130 on both sides of the second signal probe 120 are inserted into each of the three holding holes 142 of the dielectric member 140 formed on the other side. With the dielectric member 140, the conductive block 100 can be maintained. The dielectric member 140 is made of, for example, industrial plastic.

In addition, the arrangement of the dielectric member 140 is not limited to the example shown in FIG. 2. For example, the two dielectric members 140 shown in FIG. 2 may be connected to each other. At this time, the convex portion 106 of the conductive block 100 is embedded in the single dielectric member 140 between a part separated from each other and the other part. In the gap.

FIG. 4 is a diagram for explaining an example of the method of mounting the electronic component 300 on the conductive block 100. As shown in FIG. In FIG. 4, the structure in the conductive block 100 and the structure in the electronic component 300 are drawn with broken lines.

The electronic component 300 has a third surface 302 and a fourth surface 304. In the example shown in FIG. 4, the electronic component 300 has a substantially rectangular parallelepiped shape. The fourth surface 304 is located on the opposite side of the third surface 302 in the Z direction. The electronic component 300 has a height h between the third surface 302 and the fourth surface 304.

The electronic component 300 has a die 350 and a package 360. The die 350 is located inside the package 360. The die 350 includes a bottom surface 352. The bottom surface 352 of the die 350 is opposite to the first surface 102 of the conductive block 100. The bottom surface 352 of the die 350 is away from the fourth surface 304 of the electronic component 300 (package 360) corresponding to the distance g.

The first surface 102 of the conductive block 100 is opposed to the fourth surface 304 of the electronic component 300 at a distance d. In the example shown in FIG. 4, the area between the first surface 102 of the conductive block 100 and the fourth surface 304 of the electronic component 300 has a gap.

The distance d is, for example, 0 or more, preferably more than 0, for example, (1/2)h or less, preferably (1/4)h or less. As will be described in detail later, the smaller the distance d between the first surface 102 of the conductive block 100 and the fourth surface 304 of the electronic component 300, the closer the electrons performed by the inspection device 20 can be obtained. The attenuation characteristic of the band pass characteristic of the single electronic part to be tested in the inspection of the part 300. It is speculated that the reason is that when the distance d is small, the electrical coupling between the signal lines (for example, the electrical coupling between the first signal probe 110 and the second signal probe 120) will decrease.

The distance d may be smaller than the distance g between the fourth surface 304 of the electronic component 300 (package 360) and the bottom surface 352 of the die 350, for example. In this case, it can also be performed by the inspection device 20 During the inspection of the electronic component 300, the signal strength is reduced to obtain an attenuation characteristic close to the band pass characteristic of the single electronic component to be tested.

Fig. 5 is a diagram showing a modification of Fig. 4. In Fig. 5, the structure in the conductive block 100 is drawn with a broken line.

The area between the first surface 102 of the conductive block 100 and the fourth surface 304 of the electronic component 300 may not be a gap. The inspection socket 10 may also have the first surface 102 and the electronic component located on the conductive block 100 The insulating sheet 150 between the fourth side 304 of 300. The insulating sheet 150 is, for example, a resin sheet. The insulating sheet 150 has a distance d (thickness), for example. That is, by adjusting the thickness of the insulating sheet 150, the distance d between the first surface 102 of the conductive block 100 and the fourth surface 304 of the electronic component 300 can be adjusted. Furthermore, by disposing the insulating sheet 150 between the conductive block 100 and the electronic component 300, physical damage caused by the contact between the conductive block 100 and the electronic component 300 can be prevented.

Fig. 6 is a diagram showing a modification of Fig. 2.

A holding portion 206 having a recessed shape is formed in the wiring board 200. The convex portion 106 of the conductive block 100 is embedded in the holding portion 206 of the wiring board 200. Therefore, the conductive block 100 can be held by the holding portion 206 of the wiring substrate 200. Compared with the case where the holding portion 206 is not formed in the wiring substrate 200, the wiring substrate 200 can hold the conductive block 100 more stably.

Furthermore, in the example shown in FIG. 6, the wiring board 200 has a ground surface 240, an insulating layer 250, and a via 252. The ground plane 240 is electrically connected to the conductive pattern 230 through a via 252 located inside the insulating layer 250. In addition, a part of the ground surface 240 is exposed from the holding portion 206. The convex portion 106 of the conductive block 100 is electrically connected to the ground surface 240. Specifically, the convex portion 106 is connected to a part of the ground surface 240 of the wiring substrate 200 (the portion exposed from the holding portion 206). In this way, the convex portion 106 of the conductive block 100 can also be electrically connected to the conductive pattern 230.

FIG. 7 is a graph showing the frequency characteristics of each of the inspection device 20 of the implementation type, the inspection device 20 of the comparison type, and the inspection device 20 of the reference type.

In the embodiment, the length of each of the first signal probe 110, the second signal probe 120, and the ground probe 130 is set to 4.9 mm. The distance d explained using Fig. 4 is set to zero.

In the comparison type, the convex portion 106 of the conductive block 100 is not provided. The length of each of the first signal probe 110, the second signal probe 120, and the ground probe 130 is set to 1.6 mm. The distance d described using Fig. 4 is set to 0.725h.

In the reference type, the inspection socket 10 is not provided, but the electronic component 300 is directly mounted on the wiring board 200.

As shown in Figure 7, the signal strength of the implementation mode, except for the peak at 1.60GHz, from about 1.00GHz to 3.50GHz is smaller than the signal strength of the comparison mode, which is close to the signal strength of the reference mode. This result indicates that by providing the convex portion 106 of the conductive block 100 and reducing the distance d, the inspection device 20 in the blocking zone can be reduced in the inspection of the electronic component 300 performed by the inspection device 20. The coupling strength between input and output.

FIG. 8 is a graph showing the frequency characteristics of different distances d for the inspection device 20 of the implementation type.

In the example in Figure 8, the signal strength is from about 1.00GHz to 4.00GHz except for the peak value of 1.60GHz, according to d=(1/2)h, d=(5/12)h, d=(1/3 The order of )h, d=(1/4)h, d=(1/6)h, d=(1/12)h, d=0 becomes smaller. This result indicates that the smaller the distance d, the lower the coupling strength between the output and the input of the inspection device 20 in the blocking zone during the inspection of the electronic component 300 performed by the inspection device 20.

Figure 9 shows the inspection device 20 of the implementation type and the inspection device 20 of the comparison type. And a graph of the reflection loss of each of the inspection device 20 of the reference type. The implementation, comparison, and reference patterns in Figure 9 are the same as the implementation, comparison, and reference patterns in Figure 7, respectively.

As shown in Fig. 9, the reflection loss of the implementation mode is approximately the same as the reflection loss of the comparison mode and the reflection loss of the reference mode. As described above, the lengths of the probes (the first signal probe 110, the second signal probe 120, and the ground probe 130) in the implementation type are longer than the probes in the comparison type. The result shown in Figure 9 indicates that the impedance of the transmission line is maintained by the coaxial structure of the first signal probe 110 and the first hole 112 and the coaxial structure of the second signal probe 120 and the second hole 122. It doesn't matter how long the probe is.

In summary, although the embodiments of the present invention have been described with reference to the drawings, these are examples of the present invention, and various configurations other than those described above may also be adopted.

10: Check the socket

100: Conductive block

102: The first side

102a: recess

104: second side

104a: The first area

104b: second area

106: Convex

110: The first signal probe

112: first hole

114: Insulator

120: second signal probe

122: second hole

124: Insulator

130: Ground Probe

132: Grounding hole

140: Dielectric component

142: Hole

200: Wiring board

210: The first signal line pattern

220: The second signal line pattern

230: Conductive pattern

300: electronic parts

302: The third side

304: The fourth side

310: The first signal terminal

320: second signal terminal

330: Ground terminal

Claims (8)

An inspection device for inspecting electronic parts, the inspection device is provided with: The wiring board has: a first signal line pattern, one end is electrically connected to the first connector; a second signal line pattern, one end is electrically connected to the second connector, and the other end is connected to the first signal line pattern. The other end is opposite; and the conductive pattern includes a first portion located on both sides of the first signal line pattern, a second portion located on both sides of the second signal line pattern, and a portion located on both sides of the first signal line pattern The third portion between the other end and the other end of the second signal line pattern; and The inspection socket has: a conductive block, which is located on the wiring board, and is used to mount the electronic components: a first signal probe, which is inserted into the first hole formed in the conductive block, and the wiring The first signal line pattern of the substrate is electrically connected to the first signal terminal of the electronic component; the second signal probe is inserted into the second hole formed in the conductive block to connect the first signal terminal of the wiring substrate The two signal line patterns are electrically connected to the second signal terminal of the aforementioned electronic component; and the ground probe is inserted into the ground hole formed in the aforementioned conductive block to electrically connect the aforementioned conductive pattern of the aforementioned wiring substrate to The ground terminal of the aforementioned electronic component; The conductive block system includes a convex portion electrically connected to the third portion of the conductive pattern. The inspection device described in item 1 of the scope of patent application, wherein the aforementioned conductive block system includes a first side; The electronic component includes a third surface and a fourth surface opposite to the third surface, and has a height h between the third surface and the fourth surface of the electronic component; The first surface of the conductive block is opposed to the fourth surface of the electronic component with a distance d of 0 or more and (1/2)h or less. The inspection device described in item 1 of the scope of patent application, wherein the aforementioned conductive block system includes a first side; The aforementioned electronic component has a fourth side; The aforementioned electronic component has: a package; and a die, which has a bottom surface opposite to the first surface of the conductive block and is located inside the package; The first surface of the conductive block is opposed to the fourth surface of the electronic component with a distance d smaller than the distance g, and the distance g is the fourth surface of the electronic component and the crystal grain The distance between the aforementioned bottom surfaces. The inspection device described in item 2 or item 3 of the scope of patent application, wherein the inspection socket has an insulating sheet located between the first surface of the conductive block and the fourth surface of the electronic component. The inspection device according to any one of items 1 to 3 of the scope of patent application, wherein the conductive block system has at least one recess formed on the surface on which the electronic component is mounted; One end of at least one of the first signal probe and the second signal probe protrudes from the bottom surface of the at least one recess. The inspection device according to any one of items 1 to 3 in the scope of the patent application, wherein the wiring board has a holding portion; The convex portion of the conductive block is fitted into the holding portion of the wiring board. The inspection device as described in any one of items 1 to 3 of the scope of patent application, wherein the aforementioned wiring board has a ground plane; The convex portion is electrically connected to the ground plane. According to the inspection device described in any one of items 1 to 3 in the scope of the patent application, the inspection socket has a dielectric member formed with a holding hole for the first signal probe and At least one of the aforementioned second signal probes is inserted.

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