TWI722625B - Gold finger structure and manufacturing method thereof - Google Patents

Abstract

The present invention provides a gold finger structure and a manufacturing method thereof. The method includes the steps as follows: providing a substrate, a circuit layer formed on the substrate, and an outer insulating layer covering a part of the circuit layer, wherein the circuit layer includes a plurality of metal lines, and each of the metal lines includes a circuit segment, a pad, and a first sacrificing segment; drilling the first sacrificing segment of each of the metal lines so as to remove each of the first sacrificing segments, a part of the pad adjacent to the corresponding one of the first sacrificing segments, and a part of the substrate adjacent to the corresponding one of the first sacrificing segments, further forming a first circular arc edge on a part of the pad of each of the metal lines away from the circuit segment, and forming a first circular recess at a position of the substrate corresponding to a position of each of the first circular arc edges.

Description

Gold finger structure and manufacturing method thereof

The invention relates to a gold finger and a manufacturing method thereof, in particular to a gold finger structure and a manufacturing method thereof.

In the existing manufacturing method of the gold finger structure, the semi-finished product of the existing gold finger structure is modified by etching. However, the above-mentioned etching method actually causes many problems. For example, the etching solution required by the etching method will cause considerable pollution to the environment; the etching method will take a long time, which will cause the problems of low production efficiency and high production cost; and, the existing gold finger structure It is difficult to modify the length of the gold finger after the gold plating is completed. Therefore, how to provide a low-pollution, time-saving, gold-finger structure manufacturing method that can modify the length of the gold-finger structure after gold plating, so as to improve the defects of the existing gold-finger structure manufacturing method, has become a solution for this business. One of the important topics.

Therefore, the inventor believes that the above-mentioned shortcomings can be improved, and with great concentration of research and the application of scientific principles, we finally propose an invention with reasonable design and effective improvement of the above-mentioned defects.

The embodiment of the present invention is to provide a gold finger structure and a manufacturing method thereof, which can effectively improve the defects that may occur in the existing gold finger structure and the manufacturing method thereof.

The embodiment of the present invention provides a method for manufacturing a gold finger structure, including: a pre-step: providing a board, a circuit layer formed on the board, and an insulating outer layer covering a part of the circuit layer; wherein , The circuit layer includes a plurality of metal circuits arranged in a lateral direction, and each of the metal circuits includes: a circuit section partially buried in the insulating outer layer; and a pad including a connection to the wire An inner circuit of the road section and a gold-plated film plated on the inner circuit; and a first sacrificial section connected to a part of the inner circuit far away from the circuit section; wherein, the metal circuit The first sacrificial section is exposed outside the corresponding gold-plated film; and a blind drilling step: drilling the first sacrificial section of each of the metal lines to remove each of the first sacrificial sections , The adjacent pad portion and the adjacent board portion, so that the pads of each of the metal circuits form a first arc at a portion away from the circuit section A first circular groove is formed on the side of the board, and a first circular groove is formed at a position corresponding to each of the first circular arc sides.

The embodiment of the present invention further discloses a gold finger structure, including: a plate body formed with a plurality of first circular grooves; an insulating outer layer formed on the plate body; and a circuit layer formed on the plate body and It includes a plurality of metal circuits arranged in a lateral direction, and each of the metal circuits includes: a circuit segment partially buried in the insulating outer layer; and a pad including an inner portion connected to the circuit segment Circuit and a gold-plated film plated on the inner circuit; wherein, in each of the metal circuits, the pads form a first arc edge at a position far from the circuit section; a plurality of the first The positions of a circular groove respectively correspond to the positions of the first arc edges.

In summary, the gold finger structure and its manufacturing method disclosed in the embodiments of the present invention, compared with the existing gold finger structure manufacturing method, through the improvement of the manufacturing method, the etching solution is greatly reduced or completely eliminated. It is used to provide a gold finger structure with low environmental pollution, a shorter manufacturing time, and a gold finger structure that can be modified after gold plating, and a manufacturing method thereof.

In order to further understand the features and technical content of the present invention, please refer to the following detailed descriptions and drawings about the present invention, but these descriptions and drawings are only used to illustrate the present invention, and do not make any claims about the protection scope of the present invention. limit.

Please refer to Figures 1 to 8, which are embodiments of the present invention. It should be noted that the relevant numbers and appearances mentioned in the corresponding drawings in this embodiment are only used to specifically illustrate the embodiments of the present invention. , In order to understand the content of the present invention, but not to limit the protection scope of the present invention.

[Manufacturing method of gold finger structure]

Please refer to FIG. 1 and FIG. 2. This embodiment discloses a method for manufacturing a gold finger structure. Compared with the existing method of manufacturing a gold finger structure, the manufacturing method of the gold finger structure of this embodiment causes less environmental pollution, takes less time, and can modify the length of the gold finger after gold plating. The manufacturing method of the golden finger structure includes a pre-step S110 and a blind drilling step S120. Hereinafter, each step of the manufacturing method of the gold finger structure of this embodiment will be described. It should be noted that the present invention is not limited to the content and sequence of the above-mentioned steps when implementing the above-mentioned method for manufacturing the golden finger structure.

The pre-step S110 is shown in FIG. 1: providing a board 1, an insulating outer layer 2, and a circuit layer 3 formed on the board 1. The insulating outer layer 2 covers a part of the circuit layer 3. The circuit layer 3 includes a plurality of metal circuits 31 arranged along a lateral direction W, and each of the metal circuits 31 includes a circuit section 311 partially embedded in the insulating outer layer 2, a pad 312, and A first sacrifice section 313. The pad 312 includes an inner circuit 3121 connected to the circuit section 311 and a gold-plated film 3122 plated with the inner circuit 3121; the first sacrificial section 313 is connected to the inner circuit 3121 away from The portion of the circuit section 311; and the first sacrificial section 313 of each metal circuit 31 is exposed outside the corresponding gold-plated film 3122.

In this embodiment, the board body 1 is substantially rectangular, the short sides of the rectangle (or the board body 1) are substantially parallel to the lateral direction W, and the lateral direction W is perpendicular to a longitudinal direction. L. The board body 1 is mainly used to carry other components, and this embodiment does not limit the shape, size, material, and other properties of the board body 1 here.

The insulating outer layer 2 covers a part of the circuit layer 3 and is formed at an end of the board body 1 adjacent to the upper side in FIG. 1. In this embodiment, the insulating outer layer 2 is substantially rectangular, and the short sides of the rectangle (or the insulating outer layer 2) are substantially parallel to the longitudinal direction L. The insulating outer layer 2 may be a resin material, such as polyimide, polyester, polyethylene dicarboxylate, polytetrafluoroethylene, epoxy resin, or aramid. However, the shape, size, material, and other related properties of the insulating outer layer 2 can be changed according to requirements, and this embodiment is not limited herein.

In this embodiment, the circuit layer 3 may be formed of a conductive material, such as copper or silver, and the material of the circuit layer 3 can be changed according to requirements. As mentioned in the pre-step S110, the circuit layer 3 includes a plurality of metal circuits 31, and each metal circuit 31 includes the circuit segment 311, the pad 312, and the first sacrifice Section 313. In addition, each of the pads 312 has a first length L1 in the longitudinal direction L. In the longitudinal direction L, each of the sub-pads 312' has a second length L2, and the first length L1 of each of the pads 312 is greater than that of any one of the sub-pads 312' The second length L2.

In this embodiment, the number of the metal circuits 31 included in the circuit layer 3 is nine, and two of the metal circuits 31 are each defined as a sub-metal circuit 31' (e.g., from FIG. 1 Counted to the left of the third and fourth metal lines 31). In each of the sub-metal lines 31', the pads 312 include two sub-pads 312' arranged at intervals along the longitudinal direction L.

In detail, each of the sub-pads 312' includes a sub-inner circuit 3121' and a sub-gold-plated film 3122' plated on the sub-inner circuit 3121'. Among the two sub-pads 312' of each sub-metal circuit 31', the sub-inner circuit 3121' of the sub-pad 312' located on the upper side of FIG. 1 is connected to the circuit section 311; The sub-inner circuit 3121 ′ of the sub-pad 312 ′ located at the bottom of FIG. 1 is connected to the first sacrificial section 313. In addition, the two sub-inner circuits 3121' of the two sub-pads 312' are connected by a second sacrificial section 314, and the second sacrificial section 314 is located between the two sub-pads 312' . It should be noted that in each of the metal lines 31 and the sub-metal lines 31', the first sacrificial section 313 and the second sacrificial section 314 are exposed outside the corresponding gold-plated film 3122 .

It should be noted that the multiple metal lines 31 are not limited to include the sub metal lines 31'. Moreover, in each of the sub-metal lines 31', the number of the sub-pads 312' included in the pads 312 is not limited to two. That is, when the number of sub-pads 312' included in the pad 312 is greater than or equal to two, the metal circuit 31 including the pad 312 may be defined as the sub-metal circuit 31' And any two adjacent sub-pads 312 ′ are connected by the second sacrificial section 314. In addition, the arrangement sequence of the metal lines 31 and the sub-metal lines 31' along the lateral direction W can also be changed according to requirements, which is not limited in this embodiment.

The blind drilling step S120 is shown in FIG. 2: drilling the first sacrificial section 313 of each of the metal lines 31 to remove each first sacrificial section 313 and its adjacent The part of the contact pad 312 and the adjacent part of the board 1 make the contact pad 312 of each of the metal circuits 31 form a first arc edge at a position away from the circuit section 311 312a, and the plate body 1 is formed with a first circular groove 1a at a position corresponding to each of the first circular arc edges 312a.

In the blind drilling step S120, the second sacrificial section 314 of each sub-metal line 31' may be drilled to remove the second sacrificial section 314 and the two adjacent ones. The part of the sub-pad 312' and the adjacent part 1 of the board, so that the two sub-pads 312' are formed with two adjacent second arc edges 312'a, and the The plate body 1 forms a second circular groove 1b at a position corresponding to the two second circular arc edges 312'a.

Please refer to FIGS. 3 to 6, in detail, the first arc side 312a and the second arc side 312'a formed by the blind drilling step S120 are respectively aligned with a part of all The first circular groove 1a and a part of the second circular groove 1b. In addition, for the convenience of description, the manufacturing method of the golden finger structure further defines a depth direction D perpendicular to the longitudinal direction L and the transverse direction W. Wherein, the first circular groove 1a has a first depth D1, and the first depth D1 is between 25um and 75um; the second circular groove 1b has a second depth D2, and the first depth D1 The second depth D2 is between 25um and 75um. The first depth D1 and the second depth D2 are both substantially parallel to the depth direction D.

In the blind drilling step S120 of this embodiment, a drill (not shown) is rotated to drill holes in each corresponding part. The drill is generally elongated and has a long axis direction. In addition, the drill rotates with the long axis as the axis when drilling, so the first arc edge 312a and the first arc edge 312a and the first arc edge 312a and the first arc edge 312a are formed at the position adjacent to the drill to drill the hole. A circular groove 1a, or the second circular arc side 312'a and the second circular groove 1b. It should be noted that in the blind drilling step S120, the tools required for drilling, the method for drilling, and the shape and size of the drill can be changed according to requirements, and this embodiment is not used as limit.

In the blind drilling step S120 of this embodiment, the drilling sequence of the plurality of first sacrificial segments 313 and the plurality of second sacrificial segments 314 is not limited. In other words, according to actual requirements, the plurality of second sacrificial sections 314 may be drilled first, and then the plurality of first sacrificial sections 313 may be drilled. Alternatively, the plurality of first sacrificial sections 313 and the plurality of second sacrificial sections 314 may be drilled alternately.

It should be noted that the plurality of first sacrificial segments 313 and the plurality of second sacrificial segments 314 are not limited to all being removed through the blind drilling step S120. For example, in a special application, a plurality of the first sacrificial sections 313 may be removed by the blind drilling step S120, and a plurality of the second sacrificial sections 314 may be removed by an etching method; or, more One of the first sacrificial sections 313 may be removed by the etching method, and a plurality of the second sacrificial sections 314 may be removed by the blind drilling step S120. However, except for the blind drilling step S120, this embodiment does not limit the manner of removing the plurality of first sacrificial segments 313 or the plurality of second sacrificial segments 314.

It should be additionally noted that, before the pre-step S110, the manufacturing method of the golden finger structure may further include a filming step, an electroplating step, and a removing step in sequence. However, the manufacturing method of the gold finger structure is not limited to include the filming step, the electroplating step, and the removing step.

In the filming step, a shield (not shown) is covered on the insulating outer layer 2. The shield may have anti-plating properties (that is, gold is not easy to be plated on the shield), so as to avoid gold plating on the outer surface of the shield and cause a waste of gold plating solution. It should be noted that the shape, quantity, material, and other properties of the shielding objects can be changed according to requirements, and this embodiment is not limited herein.

In the electroplating step, a plurality of the first sacrificial sections 313 are connected to an electroplating equipment (not shown), according to each metal circuit 31 and each sub-metal circuit 31', the inner circuit 3121 The outer surface and the outer surfaces of the two sub-inner circuits 3121' are respectively plated with the gold-plated film 3122 and the two sub-gold-plated films 3122', and after the electroplating is completed, the first sacrificial section 313 is not The electroplating equipment is connected. Since the plurality of first sacrificial sections 313 contact the electroplating equipment during the electroplating, the plurality of first sacrificial sections 313 are not plated with the gold plating film 3122 or the sub-gold plating film 3122'.

In the removing step, the shield is removed, thereby forming the board 1, the insulating outer layer 2 and the circuit layer 3 as provided in the pre-step.

In different embodiments, in the method of manufacturing the golden finger structure, the sequence of the above steps can be adjusted as follows: the filming step, the electroplating step, the pre-step S110, the blind drilling step S120, and the removing step. That is, the removing step can be adjusted to after the blind drilling step S120, and in the pre-step S110, the insulating outer layer 2 is covered by the shield that has not been removed.

[Gold Finger Structure]

Please refer to Figures 7 and 8, this embodiment also discloses a gold finger structure 100, which includes a plate body 1, an insulating outer layer 2 formed on the plate body 1, and formed on the plate body 1. A circuit layer 3. It should be noted that the gold finger structure 100 of this embodiment can be manufactured by the above-mentioned manufacturing method of the gold finger structure, but this embodiment does not limit the manufacturing method of the gold finger structure 100. The structure of each element of the golden finger structure 100 will be introduced below, and the connection relationship between the elements of the golden finger structure 100 will be described in a timely manner.

In this embodiment, the board 1 is substantially rectangular, the short sides of the rectangle (or the board) are substantially parallel to a transverse direction W, and the transverse direction W is perpendicular to a longitudinal direction L. The board body 1 is mainly used to carry other components, and this embodiment does not limit the shape, size, material, and other properties of the board body 1 here.

The plate body 1 is formed with a plurality of first circular grooves 1a at one end adjacent to the lower part in FIG. 7. In this embodiment, the plate body 1 is formed with nine first circular grooves 1a, none of the first circular grooves 1a penetrates the plate body 1, and any two of the first circular grooves 1a The dimensions of the grooves 1a are equal. The first circular groove 1a has a first depth D1, and the first depth D1 is between 25um and 75um. It should be noted that the shape, size, and formation position of the first circular groove 1a can be changed according to requirements, and is not limited to this embodiment.

Please refer to Figure 7 and Figure 8. In this embodiment, the plate body 1 is formed with two second circular grooves 1b, none of the second circular grooves 1b penetrates the plate body 1, and the two second circular grooves The dimensions of 1b are equal. The second circular groove 1b has a second depth D2, and the second depth D2 is between 25um and 75um. In other embodiments not shown in the present invention, the number of the second circular groove 1b formed by the plate body 1 may be one. In other words, the number of the second circular grooves 1b formed by the plate body 1 is at least one. It should be noted that the shape, size, and formation position of the second circular groove 1b can be changed according to requirements, and is not limited to this embodiment.

The insulating outer layer 2 covers a part of the circuit layer 3 and is formed at an end of the board body 1 adjacent to the upper side in FIG. 7. In this embodiment, the insulating outer layer 2 is substantially rectangular, and the short sides of the rectangle (or the insulating outer layer) are substantially parallel to the longitudinal direction. The insulating outer layer 2 may be a resin material, such as polyimide, polyester, polyethylene dicarboxylate, polytetrafluoroethylene, epoxy resin, or aramid. However, the shape, size, material, and other related properties of the insulating outer layer can be changed according to requirements, and this embodiment is not limited herein.

In this embodiment, the circuit layer 3 may be formed of a conductive material, such as copper or silver, and the material of the circuit layer 3 can be changed according to requirements. The circuit layer 3 includes a plurality of metal circuits 31 arranged along a lateral direction W, and each of the metal circuits 31 includes a circuit segment 311 and a pad 312. The line section 311 is partially buried in the insulating outer layer 2.

The pad 312 includes an inner circuit 3121 connected to the circuit section 311 and a gold-plated film 3122 plated on the inner circuit 3121, and the pad 312 has a first in the longitudinal direction L A length L1. In this embodiment, the number of the metal circuits 31 included in the circuit layer 3 is nine, and two of the metal circuits 31 are each defined as a sub-metal circuit 31' (for example, from FIG. 7 Counted to the left of the third and fourth metal lines 31). In each of the sub-metal lines 31', the pads 312 include two sub-pads 312' arranged at intervals along the longitudinal direction L. Each of the sub pads 312' has a second length L2 in the longitudinal direction L, and the first length L1 of each of the pads 312 is greater than the first length L1 of any one of the sub pads 312' Two length L2.

In each of the metal circuits 31, the pad 312 forms a first arc edge 312 a at a position away from the circuit segment 311. That is, in this embodiment, the nine metal lines 31 include a total of nine first arc edges 312a, and a plurality of the first arc edges 312a are formed on a plurality of the metal lines 31 It is adjacent to the lower end in Figure 7. In addition, the positions of the plurality of first circular arc edges 312a correspond to the positions of the plurality of first circular grooves 1a, and the first circular arc sides 312a are in line with a part of the first circular groove 1a. .

In each of the sub metal lines 31', each of the sub pads 312' includes a sub inner circuit 3121' and a sub gold plating film 3122' plated on the sub inner circuit 3121'. In detail, among the two sub-pads 312' of each sub-metal circuit 31', the sub-inner circuit 3121' of the sub-pad 312' located at the upper part of FIG. 7 is connected to the Line section 311; the two sub-pads 312' are formed with two adjacent second arc edges 312'a, and the positions of the two second arc edges 312'a correspond to the first The position of the two circular grooves 1b, and the second circular arc side 312'a is in line with a part of the second circular groove 1b.

It should be noted that the multiple metal lines 31 are not limited to include the sub metal lines 31'. Moreover, in each of the sub-metal lines 31', the number of the sub-pads 312' included in the pads 312 is not limited to two. That is, when the number of the sub-pads 312' included in the pad 312 is greater than or equal to two, the metal circuit 31 including the pad 312 may be defined as the sub-metal circuit 31', and any two adjacent sub-pads 312' are formed with two adjacent second arc edges 312'a. In addition, the arrangement sequence of the metal circuit 31 and the sub-metal circuit 31' can also be changed according to requirements, which is not limited in this embodiment.

[Technical effects of the embodiment of the present invention]

In summary, the gold finger structure and its manufacturing method disclosed in the embodiments of the present invention, compared with the existing gold finger structure and its manufacturing method, through the improvement of the manufacturing method, greatly reducing or completely eliminating the etching solution use. In detail, most of the existing manufacturing methods of the gold finger structure are to remove the first sacrificial section and the second sacrificial section by etching. The above-mentioned etching method actually causes many problems. For example, the etching solution required by the etching method will cause considerable pollution to the environment; the etching method will take a long time, which will cause the problems of low production efficiency and high production cost; and, the existing gold finger structure It is difficult to modify the length of the gold finger after the gold plating is completed.

The blind drilling step of the method of manufacturing the gold finger structure of the embodiment of the present invention may be to remove the first sacrificial section or the second sacrificial section by drilling. Therefore, compared with the existing manufacturing method of the gold finger structure, the manufacturing method of the gold finger structure saves the etching solution that pollutes the environment and saves the time spent in the etching method (the etching method is more expensive than the drilling method. More time), and the length of the pad can be modified after electroplating. In addition, the blind drilling step of the method of manufacturing the gold finger structure of the embodiment of the present invention can provide single-point rapid drilling processing, so that the method of manufacturing the gold finger structure of the present embodiment Can be applied to many different applications.

Furthermore, the gold finger structure and the manufacturing method thereof disclosed in the embodiments of the present invention also have higher accuracy. For example: the first circular groove has a first depth, and the first depth is between 25um and 75um, and the second circular groove has a second depth, and the second depth is between 25um Between 75um.

The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

100: gold finger structure

1: Board body

1a: The first circular groove

1b: Second round groove

2: Insulation outer layer

3: Line layer

31: Metal circuit

31’: Sub-metal circuit

311: line segment

312: Pad

3121: internal line

3122: gold-plated film

312a: the first arc edge

312’: Sub-pad

3121’: Inner line

3122’: Sub-gold-plated film

312’a: second arc edge

313: First Sacrifice Section

314: Second Sacrifice Section

L: longitudinal direction

L1: first length

L2: second length

W: horizontal direction

D: depth direction

D1: first depth

D2: second depth

S110: Preliminary steps

S120: Blind drilling steps

FIG. 1 is a schematic diagram of the pre-steps of the method for fabricating a gold finger structure according to an embodiment of the present invention. .

2 is a schematic diagram of blind drilling steps in the method of manufacturing a gold finger structure according to an embodiment of the present invention.

Fig. 3 is an enlarged schematic diagram of area III in Fig. 2.

4 is a schematic cross-sectional view of FIG. 2 along section line IV.

FIG. 5 is an enlarged schematic diagram of area V in FIG. 2.

FIG. 6 is a schematic cross-sectional view of FIG. 2 along the section line VI.

Fig. 7 is a schematic diagram of a gold finger structure according to an embodiment of the present invention.

FIG. 8 is a schematic diagram of FIG. 7 omitting multiple gold-plated films and multiple sub-gold-plated films.

100: gold finger structure

1: Board body

1a: The first circular groove

1b: Second round groove

2: Insulation outer layer

3: Line layer

31: Metal circuit

31’: Sub-metal circuit

311: line segment

312: Pad

3121: internal line

3122: gold-plated film

312a: the first arc edge

312’: Sub-pad

3121’: Inner line

3122’: Sub-gold-plated film

312’a: second arc edge

L: longitudinal direction

L1: first length

L2: second length

W: horizontal direction

D: depth direction

Claims (6)

A method for manufacturing a gold finger structure includes: a pre-step: providing a board, a circuit layer formed on the board, and an insulating outer layer covering a part of the circuit layer; wherein the circuit layer includes There are a plurality of metal circuits arranged in a transverse direction, and each of the metal circuits includes: a circuit section partially buried in the insulating outer layer; a pad including an inner circuit connected to the circuit section and Plating a gold-plated film of the inner circuit; and a first sacrificial section connected to a part of the inner circuit far away from the circuit section; wherein the first sacrificial section of each metal circuit is exposed to the phase Corresponding to the gold-plated film; wherein, in the pre-step, the pad of at least one of the metal circuit includes two sub-contacts arranged at intervals along a longitudinal direction perpendicular to the transverse direction Pad, the inner circuit parts in the two sub-pads are connected by a second sacrificial section, and the second sacrificial section is located between the two sub-pads; and a blind drilling step: Drilling the first sacrificial section of the metal circuit to remove each of the first sacrificial section, the adjacent pad portion, and the adjacent board portion, The pads of each of the metal circuits are formed with a first arc edge at a position away from the circuit section, and the plate body is formed with a first arc edge at a position corresponding to each of the first arc edges. Circular groove; wherein, in the blind drilling step, the second sacrificial section is drilled to remove the second sacrificial section, the two adjacent sub-pad parts, and In the adjacent part of the board body, the two sub-pads are formed with two adjacent second arc edges, and the board body is arranged to correspond to the two second arc edges. A second circular groove is formed at the position; wherein, in the blind drilling step, the second circular arc edges of the two sub-pads are in line with a part of the second circular groove; the second circular The groove has a second depth, and the second depth is between 25um and 75um. The method for manufacturing a golden finger structure according to claim 1, wherein in the pre-step, each of the pads has a first length in the longitudinal direction, and any one of the sub pads is in the The longitudinal direction has a second length smaller than the first length. The method for manufacturing a gold finger structure according to claim 1, wherein, in the blind drilling step, the first arc side of each of the metal lines is aligned with a part of the first circular groove; The first circular groove has a first depth, and the first depth is between 25um and 75um. A gold finger structure includes: a plate body formed with a plurality of first circular grooves; an insulating outer layer formed on the plate body; and a circuit layer formed on the plate body and including a Arranged a plurality of metal circuits, and each of the metal circuits includes: a circuit section partially buried in the insulating outer layer; and a pad including an inner circuit connected to the circuit section and plating the A gold-plated film of the inner circuit; wherein, in at least one of the metal circuit, the pad includes two sub-pads spaced apart along a longitudinal direction perpendicular to the transverse direction; wherein, in each of the In the metal circuit, the pad is formed with a first arc edge at a position away from the circuit section; the positions of the plurality of first circular grooves respectively correspond to the positions of the plurality of first arc edges; Wherein, the plate body is formed with a second circular groove, the two sub-pads are formed with two adjacent second circular arc edges, and the position of the second circular groove corresponds to the two adjacent ones. The position of the second circular arc side, and the two second circular arc sides are in line with a part of the second circular groove; wherein, the second circular groove has a second depth, and the second depth Between 25um and 75um. The golden finger structure according to claim 4, wherein each of the pads has a first length in the longitudinal direction, and any one of the sub pads has a smaller length than the first length in the longitudinal direction. The second length. The golden finger structure according to claim 4, wherein, in each of the metal lines, the first arc edge is in line with a part of the first circular groove, and the first circular groove has a The first depth, and the first depth is between 25um and 75um.

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