TWI722682B - Electronic component transport method and equipment - Google Patents
Electronic component transport method and equipment Download PDFInfo
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- TWI722682B TWI722682B TW108143223A TW108143223A TWI722682B TW I722682 B TWI722682 B TW I722682B TW 108143223 A TW108143223 A TW 108143223A TW 108143223 A TW108143223 A TW 108143223A TW I722682 B TWI722682 B TW I722682B
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims abstract description 44
- 238000012546 transfer Methods 0.000 claims abstract description 11
- 238000007664 blowing Methods 0.000 claims description 18
- 238000001514 detection method Methods 0.000 claims description 15
- 230000002950 deficient Effects 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 6
- 230000007723 transport mechanism Effects 0.000 claims description 5
- 230000009471 action Effects 0.000 claims description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 12
- 238000006073 displacement reaction Methods 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 7
- 238000013461 design Methods 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 238000004804 winding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/82—Rotary or reciprocating members for direct action on articles or materials, e.g. pushers, rakes, shovels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/26—Devices influencing the relative position or the attitude of articles during transit by conveyors arranging the articles, e.g. varying spacing between individual articles
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Specific Conveyance Elements (AREA)
Abstract
一種電子元件搬送方法與設備,所述電子元件搬送方法包含:提供一旋轉搬送流路間歇地將多個電子元件依序搬送通過一檢測器,然後再搬送到一出料位置,使得電子元件可被驅動進入一輸出槽道;提供一逐件間歇遞送電子元件的排列搬送流路承接該輸出槽道送出的電子元件;提供一供留置該電子元件的載盤,該載盤上設有置槽,該置槽提供一承載搬送流路;該排列搬送流路累積多個電子元件後,使該撥推機構自該排列搬送流路移入該承載搬送流路中,將該等電子元件自該排列搬送流路撥移至該承載搬送流路。 An electronic component transport method and equipment. The electronic component transport method includes: providing a rotating transport flow path to intermittently transport a plurality of electronic components through a detector, and then transport them to a discharge position, so that the electronic components can be transported. Driven into an output channel; provide an arrangement and transport flow path for intermittently delivering electronic components one by one to accept the electronic components sent from the output channel; provide a tray for holding the electronic components, the tray is provided with a slot , The slot provides a carrying and conveying flow path; after the arranging and conveying flow path accumulates a plurality of electronic components, the push mechanism is moved from the arranging and conveying flow path into the carrying and conveying flow path, and the electronic components are moved from the arranging and conveying flow path. The transfer flow path is shifted to the load transfer flow path.
Description
本發明是有關於一種搬送方法與設備,特別是指一種電子元件的搬送方法與設備。 The present invention relates to a transportation method and equipment, and in particular to a transportation method and equipment for electronic components.
按,一般的電子元件在進行檢測時,通常係將電子元件倒入振動送料機,使電子元件可被整列搬送至檢測流路;且檢測後之電子元件在進行分類時,通常係直接自檢測流路排出至預設之收集盒中,眾多電子元件堆疊在收集盒中,元件與元件間會因碰撞而造成損傷;在一般的電子元件例如LED發光二極體或屬於低電壓需求的電子元件,其損傷通常皆在可以允許的範圍。 According to the general electronic components, when testing, usually the electronic components are poured into the vibrating feeder so that the electronic components can be transported to the testing flow path in a row; and the electronic components after testing are usually directly self-tested when they are classified The flow path is discharged into the preset collection box. Many electronic components are stacked in the collection box. The collision between the components will cause damage; in general electronic components such as LED light-emitting diodes or electronic components with low voltage requirements , The damage is usually within the allowable range.
但是若該電子元件必需承受高電壓,例如超過1500伏特的需求,該碰撞所造成的損傷將會造成問題,此發生在一鐵芯上進行繞線的產品最有影響,因繞線的線材設有一層極薄的漆包膜,該層漆包膜若造成損傷破皮,在1500伏特的高電壓進行檢測時,會發生漏電,故在因應此種必需承受高電壓的電子元件搬送上,必 需重新思考因應的搬送方式。 However, if the electronic component must withstand high voltage, such as the demand of more than 1500 volts, the damage caused by the collision will cause problems. This happens to products that are wound on an iron core. The most impact is due to the design of the winding wire. There is a very thin enameled film. If the enameled film causes damage and breakage, it will leak when tested at a high voltage of 1500 volts. Therefore, it is necessary to deal with the transportation of electronic components that must withstand high voltage. Need to rethink the corresponding transportation method.
因此,本發明的目的,即在提供一種可改善先前技術的至少一個缺點的電子元件搬送方法。 Therefore, the object of the present invention is to provide an electronic component transport method that can improve at least one of the disadvantages of the prior art.
於是,本發明電子元件搬送方法,包含:以一個旋轉搬送流路間歇地將多個電子元件逐一遞送輸入一個輸送機構的一個排列搬送流路並排列電子元件;於該排列搬送流路排列累積預定數量的電子元件後,以一撥推機構撥移該排列搬送流路中的電子元件;及以一個承載搬送機構的一個承載搬送流路承接該撥推機構撥移的電子元件;使該撥推機構自該排列搬送流路移入該承載搬送流路中,將該等電子元件自該承載搬送流路的一端往另一端推送。 Therefore, the electronic component transport method of the present invention includes: intermittently delivering a plurality of electronic components one by one through a rotating transport flow path into an array transport flow path of a transport mechanism and arranging the electronic components; accumulating a predetermined arrangement in the array transport flow path After a large number of electronic components, a push mechanism is used to shift the electronic components in the arrangement and transport flow path; and a carrier transport flow path of a carrier transport mechanism is used to accept the electronic components shifted by the push and push mechanism; The mechanism moves from the arranging and conveying flow path into the carrying and conveying flow path, and pushing the electronic components from one end to the other end of the carrying and conveying flow path.
於是,本發明電子元件搬送方法,包含:提供一旋轉搬送流路間歇地將多個電子元件依序搬送通過一檢測器,然後再搬送到一出料位置,使得電子元件可被驅動進入一輸出槽道;提供一逐件間歇遞送電子元件的排列搬送流路承接該輸出槽道送出的電子元件;提供一供留置該電子元件的載盤,該載盤上設有置槽,該置槽提供一承載搬送流路;該排列搬送流路累積多個電子元件後,使該撥推機構自該排列搬送流路移入該承載搬送流路中,將該等電子元件自該排列搬送流路撥移至該承載搬送流路。 Therefore, the electronic component transport method of the present invention includes: providing a rotating transport flow path to intermittently transport a plurality of electronic components through a detector in sequence, and then transport them to a discharge position, so that the electronic components can be driven into an output Slots; provide an arrangement and transport flow path for intermittently delivering electronic components piece by piece to accept the electronic components sent from the output channel; provide a tray for holding the electronic components, the tray is provided with a slot, and the slot provides A carrying and conveying flow path; after the arranging and conveying flow path accumulates a plurality of electronic components, the push mechanism is moved from the arranging and conveying flow path into the carrying and conveying flow path, and the electronic components are shifted from the arranging and conveying flow path To the carrying and conveying flow path.
本發明之另一目的,在於提供一種可改善先前技術的至少一個缺點的電子元件搬送設備。 Another object of the present invention is to provide an electronic component conveying equipment that can improve at least one of the disadvantages of the prior art.
於是,本發明電子元件搬送設備,適用於搬送電子元件,並包含:一個轉盤,設有多個間隔凹設於其周緣的容槽,每一容槽用以容裝一個電子元件;該轉盤可被間歇旋轉,而界定出一個用以旋轉搬送電子元件的旋轉搬送流路,該旋轉搬送流路設有一個用以承接電子元件的入料位置,及一個連通一輸出槽道的出料位置;該容槽容裝的電子元件可被驅動進入該輸出槽道;一個輸送機構,具有一個用以承接待搬送之電子元件的排列搬送流路,該排列搬送流路可承接該輸出槽道送出之電子元件;一個承載搬送機構,包括一個載盤,該載盤具有一個用以承接電子元件的承載搬送流路,該承載搬送流路可承接來自該排列搬送流路之電子元件;及一個撥推機構,可被驅動以一撥推件自該排列搬送流路位移進入該承載搬送流路以推送電子元件。 Therefore, the electronic component conveying device of the present invention is suitable for conveying electronic components, and includes: a turntable with a plurality of compartments recessed on the periphery of the turntable, and each compartment is used to accommodate an electronic component; the turntable can be It is intermittently rotated to define a rotary conveying flow path for rotating and conveying electronic components. The rotary conveying flow path is provided with a feeding position for receiving the electronic components and a discharging position connected with an output channel; The electronic components contained in the container can be driven into the output channel; a conveying mechanism has an array conveying flow path for receiving and receiving the conveyed electronic components, and the array conveying flow path can accept the output channels to send out Electronic components; a carrying and conveying mechanism, including a carrier plate, the carrier plate has a carrying and conveying flow path for receiving electronic components, the carrying and transporting flow path can receive the electronic components from the arrangement of the transporting flow path; and a push The mechanism can be driven to displace a pusher from the arrangement conveying flow path into the carrying and conveying flow path to push the electronic components.
於是,本發明電子元件搬送設備,包含用以執行上述電子元件搬送方法的裝置。 Therefore, the electronic component transport equipment of the present invention includes a device for performing the above-mentioned electronic component transport method.
本發明的功效在於:透過該撥推機構可以一個撥推件將該輸送機構集中的該等電子元件整齊撥移進入該承載搬送機構的該載盤的設計,可大幅將低被搬送之電子元件的碰撞損壞率。 The effect of the present invention is that the push-push mechanism allows a push-push piece to neatly shift the electronic components of the conveying mechanism into the carrier plate design of the carrying and conveying mechanism, which can greatly reduce the electronic components to be conveyed. The collision damage rate.
200:電子元件搬送設備 200: Electronic component handling equipment
3:檢測裝置 3: Detection device
30:旋轉搬送流路 30: Rotary conveying flow path
301:入料位置 301: Feeding position
302:出料位置 302: discharge position
31:台座 31: Pedestal
32:第一環形限制片 32: The first ring restrictor
320:圓形區間 320: circular interval
321:輸出槽道 321: output channel
33:轉盤 33: turntable
330:容槽 330: Conveyor
34:第二環形限制片 34: The second ring restrictor
35:檢測器 35: Detector
36:第一吹氣單元 36: The first blowing unit
361:第一吹氣孔道 361: The First Blow Hole
37:第二吹氣單元 37: The second blowing unit
371:第二吹氣孔道 371: Second Blow Hole
38:感測計數器 38: Sense counter
4:電子元件搬送裝置 4: Electronic component conveying device
5:輸送機構 5: Conveying mechanism
51:輸送槽體 51: Conveying trough
510:排列搬送流路 510: Arrange and convey the flow path
511:頂側開口 511: Top side opening
512:第一端 512: first end
513:第二端 513: second end
52:固定擋件 52: fixed stop
53:第一止擋單元 53: The first stop unit
531:固定件 531: fixed parts
532:第一氣孔 532: First Stoma
533:抽氣接頭 533: suction connector
54:第二止擋單元 54: second stop unit
541:第二氣孔 541: Second Stoma
6:承載搬送機構 6: Carrying and conveying mechanism
61:軌座 61: Rail seat
62:軌道單元 62: track unit
621:軌道 621: track
63:載盤 63: Disk
630:置槽 630: slot
631:承載搬送流路 631: Carrying and transporting flow path
64:傳動單元 64: drive unit
641:傳動皮帶 641: drive belt
7:撥推機構 7: Pushing agency
71:龍門單元 71: Longmen Unit
711:支架 711: Bracket
712:滑軌 712: Slide
713:滑座 713: Slide
714:伸縮座模組 714: Telescopic seat module
72:撥推單元 72: push unit
721:撥推件 721: push piece
722:移動擋件 722: Moving Block
723:彈性件 723: Elastic
73:擺動感測單元 73: Swing sensing unit
731:第一感測件 731: The first sensor
732:第二感測件 732: second sensor
800:給料設備 800: feeding equipment
900:電子元件 900: electronic components
910:鐵芯 910: iron core
911:第一凸緣部 911: First flange
912:第二凸緣部 912: second flange
913:捲芯部 913: Roll Core
920:蓋板 920: cover
930:線材 930: Wire
本發明的其他的特徵及功效,將於參照圖式的實施方式 中清楚地呈現,其中:圖1是本發明電子元件搬送設備的一個實施例用以搬送的一個電子元件的立體圖;圖2是該實施例的立體圖;圖3是該實施例的一個檢測裝置的不完整的立體分解圖;圖4是該實施例之該檢測裝置的不完整的平面分解圖;圖5該實施例之不完整的立體圖;圖6是該實施例的一個輸送機構的立體分解圖;圖7是該實施例的該輸送機構沿一個X軸向觀視的視圖;圖8是該實施例之不完整的側剖圖,示意說明一個電子元件自一個輸出槽道位移進入一個排列搬送流路的情況;圖9是該實施例的一個不完整的側剖圖,說明一個撥推件插入該排列搬送流路準備推移電子元件的情況;圖10是類似圖9之視圖,說明該撥推件於被推動之電子元件卡料阻塞時擺離一個移動擋件的情況;圖11是該實施例沿該X軸向觀視的不完整視圖,說明該撥推件插入該排列搬送流路準備推移電子元件的情況;及圖12是該實施例沿該X軸向觀視的不完整視圖,說明該撥推件將電子元件推移至一個承載搬送流路的情況。 The other features and effects of the present invention will be described in the embodiment with reference to the drawings Figure 1 is a perspective view of an electronic component used to transport an embodiment of the electronic component transport device of the present invention; Figure 2 is a perspective view of this embodiment; Figure 3 is a perspective view of an inspection device of this embodiment Incomplete three-dimensional exploded view; Figure 4 is an incomplete plan exploded view of the detection device of this embodiment; Figure 5 is an incomplete three-dimensional view of this embodiment; Figure 6 is a three-dimensional exploded view of a conveying mechanism of this embodiment Figure 7 is a view of the transport mechanism of this embodiment viewed along an X axis; Figure 8 is an incomplete side cross-sectional view of this embodiment, schematically illustrating an electronic component from an output channel displacement into an array of transport Fig. 9 is an incomplete side sectional view of this embodiment, illustrating a situation where a pusher is inserted into the arrangement and conveying flow path to prepare electronic components; Fig. 10 is a view similar to Fig. 9 illustrating the switch The pusher swings away from a moving stopper when it is blocked by the pushed electronic component jam; Figure 11 is an incomplete view of the embodiment viewed along the X-axis, illustrating that the pusher is inserted into the array conveying flow path The situation of preparing to push the electronic component; and FIG. 12 is an incomplete view of the embodiment viewed along the X-axis, illustrating the situation that the push member pushes the electronic component to a carrying and conveying flow path.
在本發明被詳細描述前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。 Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.
參閱圖1,本發明實施例可使用如圖所示之電子元件900為例作說明,該電子元件900為一線圈,設有一鐵芯910及一蓋板920,該鐵芯910設有一第一凸緣部911及一第二凸緣部912,該第一凸緣部911與該第二凸緣部912間相隔間距並設一X軸向的捲芯部913;其中,該捲芯部913捲繞有線材930(一般為漆包線),該蓋板920覆蓋固設於該已捲繞有線材930的鐵芯910的該第一凸緣部911與該第二凸緣部912上。
1, the embodiment of the present invention can use the
參閱圖2、3、8,本發明電子元件搬送設備200的實施例,適用於進行多個電子元件900的檢測與搬送。該電子元件搬送設備200設有一個用以檢測電子元件900的檢測裝置3,及一個用以承載並搬送該檢測裝置3檢測後之電子元件900的電子元件搬送裝置4。
Referring to FIGS. 2, 3 and 8, the embodiment of the electronic
該檢測裝置3會用以連結一個給料設備800,可承接該給料設備800逐一釋出的電子元件900。該檢測裝置3設有一個台座31、一個設於該台座31上且設有一個圓形區間320的第一環形限制片32、一個可被驅轉地設置在該圓形區間320中的轉盤33、一個局部遮蓋該轉盤33周緣地疊設在該第一環形限制片32上的第二環形限制片34、多個沿該圓形區間320周緣間隔分布設置於該台座31而
外露於該台座31頂部的檢測器35、分別安裝在該台座31與該第二環形限制片34的一個第一吹氣單元36與一個第二吹氣單元37,及一個設置在該第二吹氣單元37的感測計數器38。該第一環形限制片32還設置有一個徑向延伸且些微弧彎貫穿連通該圓形區間320與該電子元件搬送裝置4的輸出槽道321。
The
該轉盤33設有多個間隔凹設於其周緣且上下貫穿的容槽330,每一容槽330可用以容裝一個電子元件900。該轉盤33可被間歇旋轉,而以該等容槽330相配合界定出一個用以旋轉搬送電子元件900的旋轉搬送流路30(示於圖4),該旋轉搬送流路30設有一個用以承接該給料設備800釋出的電子元件900的入料位置301,及一個連通該輸出槽道321的出料位置302。該轉盤33會以旋轉位移至該入料位置301的每一容槽330承接搬送一個電子元件900,並接續將所容裝的每一個電子元件900依序搬送通過該等檢測器35,然後再搬送到該出料位置302,使得該容槽330容裝的該電子元件900可被驅動進入該輸出槽道321。
The
每一檢測器35可對位移通過的每一個電子元件900之結構或特定功能進行檢測,並將被檢測的該電子元件900識別為良品或不良品。由於可用以檢測電子元件900之結構或特定功能的檢測器35類型眾多,且非本發明之創作重點,因此不再詳述。
Each
該第一吹氣單元36是安裝在該台座31底部,可用以連通
組接於一個正壓氣源(圖未示),且設有一個斜上延伸穿設於該台座31並連通該出料位置302的第一吹氣孔道361,該第一吹氣單元36可被控制啟動,而經由該第一吹氣孔道361斜上朝位於該出料位置302的該容槽330噴出正壓氣體,藉以將該容槽330中的該電子元件900吹移進入相連通的該輸出槽道321。
The
該第二吹氣單元37是安裝在該第二環形限制片34頂側,且位於該輸出槽道321上方,可用以連通組接於一個正壓氣源(圖未示)。該第二吹氣單元37設有一個斜下延伸的第二吹氣孔道371,可被控制啟動而斜下朝該電子元件搬送裝置4方向噴出正壓氣體,藉以吹動經由該輸出槽道321進入該電子元件搬送裝置4的電子元件900。該感測計數器38可透過光學檢測技術感測並計數移出該輸出槽道321的電子元件900數量,由於感測並計數一物件的通過數量的方式眾多,因此實施時,該感測計數器38感測電子元件900的方式不以此為限。
The
參閱圖2、5,該電子元件搬送裝置4設有一個安裝在該台座31旁側的輸送機構5、一個連結於該輸送機構5的承載搬送機構6,及一個安裝在該承載搬送機構6的撥推機構7。
Referring to Figures 2 and 5, the electronic
參閱圖5、6、7、8,該輸送機構5設有一個連結該台座31且沿一個X軸向水平延伸的輸送槽體51、一個設置在該輸送槽體51頂側的固定擋件52,及安裝在該輸送槽體51且鄰近該承載搬送
機構6的一個第一止擋單元53與一個第二止擋單元54。
Referring to Figures 5, 6, 7, and 8, the conveying
該輸送槽體51設有一個連接該台座31的第一端部512,及一個連接該承載搬送機構6的第二端部513,且頂面凹設有一個沿該X軸向延伸貫穿並連通該輸出槽道321的排列搬送流路510,該排列搬送流路510可承接該輸出槽道321送出的電子元件900。該固定擋件52是沿該排列搬送流路510長向延伸,並局部遮蔽該排列搬送流路510的頂側開口511,可用以將電子元件900限位於該排列搬送流路510中,使電子元件900無法從該頂側開口511脫離。該第二吹氣單元37是朝該頂側開口511鄰近該第一端部512區域的噴出正壓氣體,藉以推動電子元件900往該承載搬送機構6方向位移。
The conveying
該第一止擋單元53設有一個可脫離地安裝在該輸送槽體51的該第二端部513而位於該排列搬送流路510旁側的固定件531,及一個安裝在該固定件531且用以和一個抽氣設備(圖未示)連通組接的抽氣接頭533。該固定件531穿設有一個連通該抽氣接頭533且側向連通該排列搬送流路510的第一氣孔532。該第二止擋單元54是安裝在該輸送槽體51底部,且設有一個連通該排列搬送流路510底緣的第二氣孔541。
The
該第一止擋單元53可被控制啟動,而經由該第一氣孔532對該排列搬送流路510側向施加一個負壓吸力,該第二止擋單元54可被控制啟動,而經由該第二氣孔541對該排列搬送流路510
底側施加一個負壓吸力,可藉由該第一氣孔532與該第二氣孔541於該排列搬送流路510中產生的負壓吸力作用,將位移至該輸送槽體51的該第二端部513的一個電子元件900擋止定位。實施時,在本發明之另一實施態樣中,可選擇僅設置該第一止擋單元53或該第二止擋單元54。
The
參閱圖2,該承載搬送機構6設有一個軌座61、一個沿一個正交於該X軸向之Y軸向水平延伸設置於該軌座61上的軌道單元62、一個安裝在該軌道單元62上的載盤63,及一個安裝在該軌座61且連結該載盤63的傳動單元64。
Referring to FIG. 2, the carrying and conveying
該軌道單元62設有兩個沿該Y軸向延伸且沿該X軸向間隔平行的軌道621。該載盤63是可沿該Y軸向位移地跨設在該等軌道621上,該載盤63頂面凹設有多個沿該X軸向延伸,且沿該Y軸向間隔平行排列之直線狀的置槽630,每一置槽630提供一承載搬送流路631,每一承載搬送流路631可用以排列設置多個電子元件900。
The
該傳動單元64是透過傳動皮帶641連結並傳動該載盤63沿該等軌道621位移定位,可傳動該載盤63位移到以其中一個承載搬送流路631沿X軸向直線延伸對接該排列搬送流路510,使該承載搬送流路631可承接來自該排列搬送流路510的電子元件900。實施時,在本發明之另一個實施態樣中,該傳動單元64也可透過螺桿來
傳動該載盤63沿該等軌道621位移定位,但因為傳動該載盤63沿該等軌道621位移定位的傳動單元64類型眾多,且非本發明創作重點,因此不再詳述,實施時也不以上述態樣為限。
The
參閱圖2、5,該撥推機構7設有一個跨設在該軌座61上方的龍門單元71、一個安裝在該龍門單元71的撥推單元72,及一個擺動感測單元73。該龍門單元71設有一個沿該X軸向跨設在該軌座61上方的支架711、一個沿該X軸向延伸設置在該支架711的滑軌712、一個安裝在該滑軌712且可被控制沿該滑軌712長向滑移定位的滑座713,及一個安裝在該滑座713且可被控制上下伸縮位移的伸縮座模組714。
Referring to FIGS. 2 and 5, the
該撥推單元72設有一個以其頂端部沿該Y軸向樞設於該伸縮座模組714的撥推件721、一個安裝在該伸縮座模組714底端旁側的移動擋件722,及一個以其兩端分別連結於該伸縮座模組714與該撥推件721的彈性件723。該撥推件721可以其樞接點為支點相對該伸縮座模組714擺動,該彈性件723為彈簧,恆設有將該撥推件721彈性拉引擺靠向該移動擋件722的彈力。
The
參閱圖5、9,該撥推件721可被該龍門單元71傳動上下位移,可以其底端部往下插入該輸送槽體51之該排列搬送流路510中,並被該龍門單元71傳動沿該X軸向位移,將該排列搬送流路510中的電子元件900推移進入對應連通的一個承載搬送流路631中,
並自該承載搬送流路631的一端往另一端推移電子元件900。
Referring to Figures 5 and 9, the
此外,在該伸縮座模組714帶動該撥推件721撥移電子元件900過程中,當被撥移的電子元件900與槽道間產生卡料阻塞情況時,該撥推件721會被阻塞於槽道中的該等電子元件900擋阻停止位移,進而往背離該伸縮座模組714位移方向樞擺並彈性拉伸該彈性件723。
In addition, when the
參閱圖11、12,該移動擋件722會於該撥推件721被該伸縮座模組714傳動往下插入該排列搬送流路510時,同時被伸縮座模組714傳動下移遮擋於該排列搬送流路510之該頂側開口511,且會於該撥推件721被傳動位移進入一個承載搬送流路631時,也被傳動位移至該承載搬送流路631上方,而局部遮擋在被推送之該等電子元件900上方,可避免被推送的電子元件900往上脫離該承載搬送流路631。
11, 12, the moving
參閱圖9、10,該擺動感測單元73設有一個可被連動位移地安裝在該撥推件721的第一感測件731,及一個安裝在該伸縮座模組714的第二感測件732。該第二感測件732可感測該第一感測件731是否擺離,並對應感測結果產生一個感測訊號。藉此設計,可利用該擺動感測單元73感測該撥推件721是否相對該伸縮座模組714樞擺,來供判斷被撥移的電子元件900是否產生卡料阻塞現象。在本實施例中,該第一感測件731與該第二感測件732是透過
光學感應技術來感測彼此的相對位移,但因為感應該撥推件721是否相對該伸縮座模組714偏擺的該擺動感測單元73類型眾多,例如可採用磁感應方式,將該第一感測件731設計為可產生磁場的磁性件,該第二感測件732設計為可感應該第一感測件731產生之磁場變化的霍爾元件,同樣可用以感測撥推件721是否相對該伸縮座模組714偏擺,所以實施時,該該擺動感測單元73不以上述實施態樣為限。
9 and 10, the
參閱圖2、8、10,本發明電子元件搬送設備200用以搬送電子元件900的搬送方法說明如下:使該檢測裝置3之該轉盤33間歇旋轉,使構成該旋轉搬送流路30(示於圖4)的該等容槽330依序承接該給料設備800釋出的電子元件900。使該轉盤33將每一容槽330容置的該電子元件900依序移送通過該等檢測器35,藉以將被移送通過之每一電子元件900識別為良品與不良品。然後,將檢測後的每一電子元件900依序輸送至該旋轉搬送流路30的該出料位置302。
2, 8 and 10, the conveying method of the electronic
接著,使該第一吹氣單元36將位於該出料位置302的該容槽330內的該電子元件900吹離,將該電子元件900吹入該輸出槽道321而進入該排列搬送流路510,並使該第二吹氣單元37對該排列搬送流路510吹氣,接續將該電子元件900往該承載搬送機構6方向推移。於此同時,使該感測計數器38感測並計數移出該輸出槽道
321的電子元件900數量。
Then, the
實施時,可使該等檢測器35與該感測計數器38分別將檢測結果與感測計數結果輸送至一個後端監控系統(圖未示),使該後端監控系統可根據該等電子元件900檢測結果與電子元件900數量資料,對應管控的該檢測裝置3與該電子元件搬送裝置4的後續動作。
In implementation, the
當已排空的該排列搬送流路510進入第一個電子元件900時,使該第一止擋單元53與該第二止擋單元54對該排列搬送流路510施加負壓吸力形式的非接觸式止擋作用,將位移至該輸送槽體51之該第二端部513的該電子元件900吸住而止擋定位,藉以將後續進入該排列搬送流路510的其它電子元件900擋阻排列於該電子元件900後方。
When the evacuated arrangement
當該排列搬送流路510中排列累積預定數量的電子元件900時,使該龍門單元71傳動該撥推件721沿該X軸向懸空位移至該輸送槽體51的該第一端部512,並往下插入該排列搬送流路510,再傳動該撥推件721沿該X軸向往該載盤63方向位移,將該排列搬送流路510中的該等電子元件900推移至該載盤63的一個承載搬送流路631的預定位置。然後,使該龍門單元71傳動該撥推件721往上移離該承載搬送流路631,並後移靠向該輸送槽體51,等待下一次再被控制作動。
When a predetermined number of
當該載盤63目前用以對準該排列搬送流路510的該承載搬送流路631已累積預定數量的電子元件900時,使該傳動單元64傳動該載盤63沿該Y軸向位移,使另一個承載搬送流路631對應該排列搬送流路510,以便繼續承接其它電子元件900。
When the
必須說明的是,在本發明之另一實施態樣中,並不以該排列搬送流路510中累積預定數量的電子元件900後,才使該撥推件721將該等電子元件900進入該載盤63為限。實施時,也可根據每一電子元件900被檢測為良品或不良品的結果,選擇性控制該撥推件721推移該排列搬送流路510中的電子元件900。例如當目前該排列搬送流路510中的電子元件900為良品,而位於該旋轉搬送流路30的該出料位置302的另一個電子元件900為不良品時,可先使該撥推件721將該排列搬送流路510中的該等電子元件900先撥移進入該載排的一個承載搬送流路631,然後再驅使位於該出料位置302且為不良品的該電子元件900進入該排列搬送流路510,並使該傳動單元64傳動該載盤63位移,使一個預定用以承載不良品的電子元件900的承載搬送流路631對準該排列搬送流路510。如果接續要再進入該排列搬送流路510的另一個電子元件900被檢測識別為良品,則先並使該撥推件721將當前停留在該排列搬送流路510中且為不良品的該電子元件900推移入該承載搬送流路631,以便繼續承接被識別為良品的電子元件900。藉此設計,可以該載盤63之
不同的承載搬送流路631來分別承載良品與不良品的電子元件900。
It must be noted that, in another embodiment of the present invention, the arrangement does not transport the
綜上所述,透過該電子元件搬送裝置4之該輸送機構5、該承載搬送機構6與該撥推機構7的結構設計,該輸送機構5可以非振動方式整列集中多個電子元件900,該撥推機構7可以一個撥推件721將該輸送機構5集中的該等電子元件900整齊撥移進入該承載搬送機構6的該載盤63,且可在該撥推件721推移電子元件900的過程中,以一個移動擋件722遮擋於該載盤63的承載搬送流路631頂側,避免被推移的電子元件900被擠推彈出該載盤63,所以可大幅將低被搬送之電子元件900的碰撞損壞率。此外,在該撥推機構7以該撥推件721整齊撥移一個置槽630中的電子元件900時,同時以一個移動擋件722擋阻在電子元件900上方的設計,可防止電子元件900在推送過程中被擠壓往上脫離置槽630。因此,本發明確實是一種相當創新且方便實用的設計,而確實能達成本發明的目的。
In summary, through the structural design of the conveying
惟以上所述者,僅為本發明的實施例而已,當不能以此限定本發明實施的範圍,凡是依本發明申請專利範圍及專利說明書內容所作的簡單的等效變化與修飾,皆仍屬本發明專利涵蓋的範圍內。 However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to Within the scope of the patent of the present invention.
200:電子元件搬送設備 200: Electronic component handling equipment
3:檢測裝置 3: Detection device
31:台座 31: Pedestal
33:轉盤 33: turntable
34:第二環形限制片 34: The second ring restrictor
37:第二吹氣單元 37: The second blowing unit
4:電子元件搬送裝置 4: Electronic component conveying device
5:輸送機構 5: Conveying mechanism
6:承載搬送機構 6: Carrying and conveying mechanism
61:軌座 61: Rail seat
62:軌道單元 62: track unit
621:軌道 621: track
63:載盤 63: Disk
630:置槽 630: slot
631:承載搬送流路 631: Carrying and transporting flow path
64:傳動單元 64: drive unit
641:傳動皮帶 641: drive belt
7:撥推機構 7: Pushing agency
71:龍門單元 71: Longmen Unit
711:支架 711: Bracket
712:滑軌 712: Slide
713:滑座 713: Slide
714:伸縮座模組 714: Telescopic seat module
72:撥推單元 72: push unit
800:給料設備 800: feeding equipment
900:電子元件 900: electronic components
Claims (11)
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| TW108143223A TWI722682B (en) | 2019-11-27 | 2019-11-27 | Electronic component transport method and equipment |
| CN202010498295.5A CN112850099A (en) | 2019-11-27 | 2020-06-04 | Electronic component conveying method, electronic component conveying device and conveying equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108143223A TWI722682B (en) | 2019-11-27 | 2019-11-27 | Electronic component transport method and equipment |
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| CN208814080U (en) * | 2018-08-31 | 2019-05-03 | 深圳市创金激光科技有限公司 | A magnetic core automatic feeding assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN205927747U (en) * | 2016-06-28 | 2017-02-08 | 深圳市奥海纳光电有限公司 | Automatic assembling machine |
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| JP2000074639A (en) * | 1998-09-03 | 2000-03-14 | Mitsubishi Materials Corp | Automatic visual inspection machine |
| JP2006273579A (en) * | 2005-03-04 | 2006-10-12 | Murata Mfg Co Ltd | Work feeding method and work feeding device |
| CN102595869A (en) * | 2012-02-15 | 2012-07-18 | 庄铭阳 | Multi-head full-automatic bulk LED board plugging machine |
| TW201637973A (en) * | 2015-01-07 | 2016-11-01 | Tokyo Weld Co Ltd | Work characteristic measuring device and work characteristic measuring method |
| CN208814080U (en) * | 2018-08-31 | 2019-05-03 | 深圳市创金激光科技有限公司 | A magnetic core automatic feeding assembly |
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| CN112850099A (en) | 2021-05-28 |
| TW202120408A (en) | 2021-06-01 |
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